Processing method and processing system
The integrated processing system addresses the issue of misdiagnosing abnormalities in wafer processing by using an inspection device to differentiate between camera issues and wafer defects, enhancing processing accuracy and reducing defective chip production.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-09
Smart Images
Figure 2026115257000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for processing a workpiece and a processing system.
Background Art
[0002] When a plurality of devices are formed on the surface of a thin plate-like wafer and the wafer is divided for each device, device chips to be mounted on an electronic device can be formed. For such division of a wafer, a cutting device having a cutting blade is used.
[0003] However, in the cutting of a wafer, the wafer may not be properly processed due to a defect of the cutting device or the like. If manufacturing is performed in a state where abnormalities such as contamination and dirt occur in the wafer or the device chip, the obtained device chip may be a defective product. Therefore, in order to confirm that the processing of the wafer has been appropriately performed, the wafer processed by the cutting device is imaged by a camera and inspected (for example, Patent Document 1).
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] In the inspection of imaging the wafer described in Patent Document 1, when an abnormality occurs in the wafer, the possibility that the cause is the camera is not considered. For example, when the imaging element or the like deteriorates due to long-term use of the camera, the abnormality of the wafer may be caused by the camera. Therefore, there is a problem that it should be possible to grasp that an abnormality has occurred in a detection unit such as a camera in the processing of a workpiece such as a wafer.
[0006] The present invention provides a processing method and a processing system that can detect when an abnormality has occurred in the detection unit during the processing of a workpiece. [Means for solving the problem]
[0007] One aspect of the present invention is, A processing method for processing an object to be processed, A first information acquisition step involves acquiring first information of a first object to be processed by a first detection unit, After the first information acquisition step, a determination step is performed to determine an abnormality in the first detection unit based on the first information, The process includes, after the determination step, a processing step of processing the first object to be processed based on the determination result.
[0008] Furthermore, other embodiments of the present invention include: A processing system for processing objects to be processed, The system comprises a first processing apparatus equipped with a first detection unit for acquiring first information of a first object to be processed, and an inspection apparatus for determining an abnormality of the first detection unit based on the first information, The first processing apparatus is The system includes a first control unit that acquires the first information, transmits the first information to the inspection device, and receives the abnormality determination result from the first detection unit of the inspection device. The inspection device, The device includes a second control unit that determines whether the first detection unit is abnormal based on the first information received from the first processing unit, and transmits the determination result to the first processing unit. [Effects of the Invention]
[0009] According to the present invention, it is possible to detect when an abnormality occurs in the detection unit during the processing of the object to be processed. [Brief explanation of the drawing]
[0010] [Figure 1] Figure 1 is a perspective view showing an example of a cutting device 200. [Figure 2]Figure 2 is a perspective view showing an example of the object to be processed 10. [Figure 3] Figure 3 is an image showing an example of the first information 320a of the object to be processed 10. [Figure 4] Figure 4 is an image showing an example of reference information 120a. [Figure 5] Figure 5 is a sequence chart showing an example of the processing method. [Figure 6] Figure 6 shows an example of a subroutine in step S5 of the processing method shown in Figure 5. [Figure 7] Figure 7 shows an example of a subroutine in step S8 of the processing method shown in Figure 5. [Modes for carrying out the invention]
[0011] The following describes a processing method of one embodiment of the present invention with reference to the drawings.
[0012] The processing method in this embodiment determines (or estimates) the cause of an abnormality that occurred in the object to be processed 10 during the processing of the object to be processed 10. In particular, in the embodiment described below, based on information about the object to be processed 10, it is determined whether there is an abnormality in the detection unit (e.g., camera 230). If there is an abnormality in the detection unit, it is determined to be an abnormality in the detection unit, and if there is no abnormality in the detection unit, it is determined to be an abnormality in the object to be processed 10.
[0013] In this embodiment, the workpiece 10 is processed by a processing device (e.g., a cutting device 200), and the detection unit, including the determination of abnormalities in the workpiece 10, is performed by an inspection device 100. That is, the cutting device 200 and the inspection device 100 work together, and these two devices constitute the processing system for the workpiece 10. Before describing the processing method, the cutting device 200 and the inspection device 100 will be described. In the following description, the X-axis direction is a single direction in the horizontal plane. The Y-axis direction is a direction perpendicular to the X-axis direction in the horizontal plane. The Z-axis direction is a direction perpendicular to both the X-axis and Y-axis directions.
[0014] Cutting Device In the embodiment, the processing device is a cutting device 200 that cuts the workpiece 10. FIG. 1 is a perspective view showing the cutting device 200. The workpiece 10 is, for example, a substantially disc-shaped wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors, or a wafer made of an optical device wafer.
[0015] FIG. 2 is a wafer showing an example of the workpiece 10. On the surface 10a of the workpiece 10, a plurality of streets 14 intersecting each other are used as division planned lines, and a plurality of regions partitioned by the division planned lines are formed in a lattice pattern. Devices 15 such as ICs (Integrated Circuits), LSIs (Large Scale Integrated circuits), and MEMS (Micro Electro Mechanical Systems) are formed in each of the partitioned regions. When the workpiece 10 is divided along the division planned line by the cutting device 200, individual device chips are formed.
[0016] Note that the workpiece 10 is conveyed and processed in a state integrated with an annular frame 11 and a tape 12 adhered so as to close the opening of the annular frame 11. The frame 11 is, for example, formed of metal or resin and is an annular plate member having an opening larger than the outer diameter of the workpiece 10. The tape 12 has expandability and is a sheet member having an outer diameter larger than the opening of the frame 11. The tape 12 is adhered to the back surface side of the frame 11 so as to cover the opening of the frame 11. The workpiece 10 is positioned at a predetermined position of the opening of the frame 11, and the back surface 10b side of the workpiece 10 is adhered to the tape 12, whereby the workpiece 10 is fixed to the frame 11 and the tape 12.
[0017] Note that in the embodiment, the cutting device 200 is an example of the "first processing device", and the workpiece 10 is an example of the "first workpiece".
[0018] Returning to Figure 1, the configuration of the cutting device 200 will be described. The cutting device 200 includes a holding table 210 that holds the workpiece 10 by suction on a holding surface 211, a cutting unit 220 that cuts the workpiece 10 held by the holding table 210 with a cutting blade, a camera 230 capable of detecting abnormalities in the workpiece 10, an alignment camera 240 that images the workpiece 10 held on the holding table 210, and a control unit 300.
[0019] The cutting device 200 also includes a moving unit (not shown) for moving the cutting unit 220 relative to the workpiece 10 held by the holding table 210. The moving unit includes a Y-axis moving unit for moving the holding table 210 in the Y-axis direction, an X-axis moving unit for moving the cutting unit 220 in the X-axis direction, a Z-axis moving unit for moving the cutting unit 220 in the Z-axis direction, and a rotational moving unit for rotating the holding table 210 around an axis parallel to the Z-axis direction.
[0020] The X-axis movement unit, Y-axis movement unit, and Z-axis movement unit may be composed of, for example, known ball screw type movement units. The rotational movement unit may be configured to be rotated by, for example, a motor that rotates the holding table 210 around its axis.
[0021] The holding table 210 has a holding surface 211 for holding the workpiece 10, which is made of porous ceramic or the like. The holding table 210 is provided to be movable in the Y-axis direction by a Y-axis moving unit, spanning between the machining area below the cutting unit 220 and the loading / unloading area where the workpiece 10 is loaded and unloaded, separated from below the cutting unit 220, and is also provided to be rotatable around an axis parallel to the Z-axis direction by a rotational moving unit.
[0022] The holding table 210 has a holding surface 211 connected to a suction source (not shown), and the holding surface 211 is sucked by the suction source, thereby sucking up the workpiece 10 placed on the holding surface 211.
[0023] The cutting unit 220 is a processing unit that performs cutting on a workpiece 10 held by a holding table 210. It comprises a cutting blade for cutting the workpiece 10, a spindle housing (not shown), a spindle (not shown) rotatably mounted on the spindle housing around its axis, and a spindle motor (not shown) for rotating the spindle around its axis. The cutting blade is an extremely thin cutting wheel with a substantially ring shape, and cuts the workpiece 10 along the planned division line of the workpiece 10 held by the holding table 210. The cutting unit 220 can position the cutting blade at any position on the holding surface 211 of the holding table 210, for example, by using an X-axis movement unit and a Z-axis movement unit.
[0024] The alignment camera 240 is fixed to a fixed frame 202 provided on the main body 201 of the apparatus and is positioned between the loading / unloading area and the processing area. The alignment camera 240 is equipped with an image sensor that images a portion of the area to be divided of the workpiece 10 before cutting, which is held on the holding table 210, i.e., a portion of the surface 10a of the workpiece 10. The image sensor is, for example, a CCD image sensor or a CMOS image sensor. The alignment camera 240 images the workpiece 10 held on the holding table 210 to obtain an image for performing alignment, such as aligning the workpiece 10 with the cutting blade, and outputs the obtained image to the control unit 300.
[0025] The cutting device 200 also includes a cassette table 203 on which a cassette C containing the workpieces 10 before and after cutting is placed and which moves the cassette C in the Z-axis direction, a transport unit 250 for transporting the workpieces 10 between the cassette C and the holding table 210, and a cleaning unit 260 for cleaning the workpieces 10 after cutting.
[0026] The transport unit 250 transports the workpiece 10 sequentially from the cassette C placed on the cassette table 203 to the holding table 210 and then to the washing unit 260. The transport unit 250 includes a pair of guide rails 251 on which the workpiece 10 before cutting, removed from cassette C, and the workpiece 10 after cutting, to be stored in cassette C are placed; an loading / unloading unit 252 that removes the workpiece 10 before cutting from cassette C and places it on the guide rails 251, and stores the workpiece 10 after cutting on the guide rails 251 in cassette C; a first transport unit 253 that transports the workpiece 10 before cutting on the guide rails 251 to the holding table 210 in the loading / unloading area, and transports the workpiece 10 after washing from the washing unit 260 onto the guide rails 251; and a second transport unit 254 that transports the workpiece 10 after cutting from the holding table 210 in the loading / unloading area to the washing unit 260.
[0027] The guide rail 251 and the holding table 210 in the loading / unloading area constitute a transport path for the workpiece 10 that is transported from cassette C to the holding table 210 by the transport unit 250.
[0028] Camera 230 images the workpiece 10 to acquire information about the workpiece 10 before cutting. The image captured by camera 230 becomes a comparison image with reference images stored in the inspection device 100 (for example, an image based on reference information 120a, an image based on second information 120b, and an image based on third information 120c), which will be described later. In this embodiment, camera 230 is positioned above the guide rail 251 in the Z-axis direction and is provided on the transport path of the workpiece 10. Camera 230 is equipped with an image sensor that images the entire surface 10a of the workpiece 10 placed on the guide rail 251. The image sensor is, for example, a CCD image sensor or a CMOS image sensor. Camera 230 outputs the image obtained by imaging the workpiece 10 placed on the guide rail 251 to the control unit 300. The image output to the control unit 300 is recorded in the storage unit 320. The camera 230 is an example of the "first detection unit," and the information of the object to be processed 10 is an example of the "first information." In the following explanation, the information of the object to be processed 10 will also be referred to as the first information 320a.
[0029] The control unit 300 controls each component of the cutting device 200 to cause the cutting device 200 to perform various operations on the workpiece 10. Specifically, the control unit 300 controls the holding table 210, the cutting unit 220, the camera 230, the cleaning unit 260, and so on.
[0030] The control unit 300 is a known computer that includes a control unit 310 that performs various calculations, a storage unit 320 having a storage medium, and an input / output interface (not shown) that controls the input and output of data to and from the inside and outside of the control unit 300. Note that the control unit 310 is an example of a "first control unit".
[0031] The memory unit 320 stores, for example, first information 320a, which is information about the workpiece 10 captured by the camera 230. Figure 3 shows an example of the first information 320a, which is an image obtained by capturing the entire surface of the workpiece 10 before cutting in the cutting device 200 with the camera 230. As described above, the image in this first information 320a is a comparison image that is compared with a reference image stored in the inspection device 100, and the example shown here includes abnormal areas P such as contamination and dirt.
[0032] The control unit 310 performs various calculations based on a predetermined program stored in the memory unit 320. According to the calculation results, the control unit 310 outputs various control signals to the aforementioned components via the input / output interface, thereby controlling the cutting device 200. The specific processing of the control unit 310 will be described in the processing method section below.
[0033] Furthermore, the cutting device 200 is connected to a display unit (not shown) that can receive input such as machining conditions from the operator via a touch panel and display the status of the machining operation and images, and to a notification unit 270. The display unit and the notification unit 270 are each connected to a control unit 300. The notification unit 270 notifies the operator by emitting at least one of sound and light. In this embodiment, the functions of the notification unit 270 are realized by screen display on the display unit, warning lights that emit light and sound, or transmission of information to a portable terminal held by the operator.
[0034] [Inspection equipment] The inspection device 100 is a device that inspects for abnormalities in the camera 230, including abnormalities in the workpiece 10, based on an image of the workpiece 10 captured by the cutting device 200. The inspection device 100 may be any device (e.g., an information processing device) that has the function of determining abnormalities in the workpiece 10 and abnormalities in the camera 230 based on at least the image information of the workpiece 10. For example, the inspection device 100 may be composed of a server or a computer with high processing capabilities, or it may be a conventionally known inspection device (e.g., AOI: Automated Optical Inspection) that has the function of capturing an image of the workpiece 10 and the function of determining abnormalities in the workpiece 10.
[0035] In this embodiment, the inspection device 100 includes a control unit 110 that performs various calculations and a storage unit 120 that has a storage medium. The control unit 110 is an example of a "second control unit".
[0036] The memory unit 120 stores information that can serve as a reference when comparing it with information of the object to be processed 10 captured by the camera 230. For example, in the example shown in Figure 1, reference information 120a, second information 120b, and third information 120c are stored as reference information. Note that it is sufficient for at least one of the reference information 120a, second information 120b, and third information 120c to be stored as reference information. Furthermore, reference information 120a, second information 120b, and third information 120c are all registered as images of the object to be processed 10 in a normal state (in other words, a state without abnormalities).
[0037] Here, we will explain each piece of information. The reference information 120a is information about the workpiece 10 that has been registered in the storage unit 120 in advance. Similar to the first information 320a described above, it stores an image obtained by imaging the entire surface of the workpiece 10 before it is cut. The camera 230 used at this time stores an image obtained by imaging the camera 230 when the camera 230 is functioning correctly (for example, the camera 230 immediately after maintenance). Figure 4 shows an example of the reference information 120a of the workpiece 10. As shown here, there is no contamination or dirt on the surface 10a, and the workpiece 10 is in a state where no abnormality has occurred.
[0038] Furthermore, the reference information 120a may include not only information about the registered workpiece 10, but also, for example, information based on an image taken when the workpiece 10 is not positioned below the camera 230. That is, in the embodiment, an image of the guide rail 251 or other holding table on which the workpiece 10 can be placed, when the workpiece 10 is not placed, may be stored as the reference information 120a. In that case, for example, when the workpiece 10 has been loaded into the cutting device 200, the guide rail 251 on which the workpiece 10 can be placed will be imaged. Since it can be assumed that the workpiece 10 will be imaged by the camera 230 after the workpiece 10 has been loaded into the cutting device 200, the workpiece 10 can be imaged without significantly changing the state of the camera 230, and as a result, an accurate comparison between the reference information 120a and the first information 320a can be performed. The information obtained from the image is then transmitted from the cutting device 200 to the inspection device 100 and stored as reference information 120a in the storage unit 120 of the inspection device 100.
[0039] Such an image of reference information 120a in a state where the object to be processed 10 is not placed will be used in the processing method described later when comparing it with the first information 320a. For example, if there is no abnormality when the object to be processed 10 is not placed, but there is an abnormality when the object to be processed 10 is placed, it can be determined that there is no abnormality in the camera 230, and in that case, it can be determined that there is an abnormality in the object to be processed 10. The specific processing method will be described later.
[0040] The second information 120b is information about the object to be processed 10 acquired before the first information 320a by a camera of the same type as camera 230, that is, an image based on information prior to the first information 320a. Furthermore, the image may include the entire surface of the object to be processed 10, but it is preferable that it is an image in which information about parts other than the areas where processing is performed, such as the division lines, can be acquired. This is because by comparing the areas in the first information 320a where processing has not been performed with the areas in the second information 120b, which is this past information, it is possible to grasp the changes in the object to be processed 10 over time and estimate any abnormalities in camera 230.
[0041] Furthermore, "a camera of the same type as camera 230" means the camera 230 itself in the cutting device 200, or a camera of the same type as camera 230 installed in another processing device. In other words, the second information 120b may be information about the workpiece 10 acquired by camera 230 in the cutting device 200 before the first information 320a during a predetermined processing step such as loading / unloading or alignment, or information about the workpiece 10 acquired before the first information 320a by a camera of the same type as camera 230 installed in another processing device other than the cutting device 200. It is preferable that the detection conditions (i.e., imaging conditions) when acquiring the second information 120b are the same as the detection conditions when acquiring the first information 320a. This is because, since the second information 120b can be compared with the first information 320a, using the same conditions allows for a more accurate comparison. Examples of detection conditions include imaging distance (focal length), illumination intensity, and the position and angle of the workpiece 10.
[0042] The third piece of information 120c represents information about a second workpiece of the same type as the workpiece 10, acquired by a second processing device having a second detection unit of the same type as the camera 230. Specifically, the third piece of information 120c is information about a second workpiece (not shown) acquired by a camera (not shown) of another cutting device different from the cutting device 200. Furthermore, it is preferable that the processing device and camera used to acquire this third piece of information 120c are of the same type as the cutting device 200 that acquires the first piece of information 320a (for example, a cutting device with only a different identification number), and are the same type as the camera 230. This is because the third piece of information 120c can be compared with the first piece of information 320a, and by configuring them under the same conditions, a more accurate comparison becomes possible. Also, for the same reason, it is preferable that the detection conditions when acquiring the third piece of information 120c, such as the imaging distance (focal length), illumination intensity, and the position and angle of the workpiece 10, are the same as the detection conditions when acquiring the first piece of information 320a.
[0043] Such third information 120c is acquired, for example, by a cutting device of the same type as the cutting device 200 described above, and then transmitted to the inspection device 100 at a predetermined timing and stored in the storage unit 120.
[0044] Furthermore, the images based on the second information 120b and third information 120c described above may be the same as the images based on the reference information 120a explained using Figure 4. That is, the second information 120b and third information 120c indicate a normal state in which no foreign matter such as contamination or dirt is attached to the surface 10a.
[0045] The control unit 110 performs various calculations based on a predetermined program stored in the memory unit 120. The control unit 110 outputs various control signals to each component via the input / output interface according to the calculation results, thereby controlling the inspection device 100. For example, the control unit 110 determines an abnormality in the workpiece 10 based on at least one of the reference information 120a, second information 120b, and third information 120c that can serve as a reference, and the first information 320a in the cutting device 200, and determines whether the abnormality is caused by the camera 230. Specific processing will be explained in the processing method described later.
[0046] [Processing method] Next, the processing method for the workpiece 10 in the embodiment will be described. Figure 5 is a sequence chart showing an example of the processing method. In the embodiment, the cutting device 200 and the inspection device 100 work together to perform the processing. For example, the cutting device 200 acquires information about the workpiece 10 with a camera 230, and the inspection device 100 determines an abnormality in the workpiece 10 based on the information acquired by the camera 230 of the cutting device 200, and also determines whether the cause of the abnormality in the workpiece 10 is due to the camera 230. Then, the cutting device 200 performs predetermined processing based on the determination result in the inspection device 100.
[0047] In this embodiment, the steps for performing such a series of processing include a loading step S1, a first information acquisition step S2, a first information transmission step S3, a first information reception step S4, an abnormality determination step S5, a determination result transmission step S6, a determination result reception step S7, and a processing step S8. The loading step S1, the first information acquisition step S2, the first information transmission step S3, the determination result reception step S7, and the processing step S8 are performed by the control unit 310 in the cutting device 200. The first information reception step S4, the abnormality determination step S5, and the determination result transmission step S6 are performed by the control unit 110 in the inspection device 100. Each process will be described in detail below.
[0048] In the loading step S1, the control unit 310 loads the cassette C containing the workpiece 10 into the cutting machine 200 using, for example, a transport device (not shown). The loaded cassette C is placed on the cassette table 203 in the cutting machine 200. The transport device consists of, for example, an OHT (Overhead Hoist Transport) or an AGV (Automated Guided Vehicle) located above the cutting machine 200.
[0049] In the first information acquisition step S2, the control unit 310 images the surface 10a of the workpiece 10 that was brought in in the loading step S1 and acquires first information 320a, which is information about the workpiece 10 before cutting. Specifically, the control unit 310 takes the workpiece 10 before cutting from the cassette C placed on the cassette table 203 and places it on the guide rail 251. The control unit 310 also controls the camera 230 to image the workpiece 10 placed on the guide rail 251 and acquires an image of the workpiece 10 as shown in Figure 3 above as an example. The acquired image is stored in the storage unit 320.
[0050] In the first information transmission step S3, the control unit 310 transmits the first information 320a acquired in the first information acquisition step S2 to the inspection device 100 which determines abnormalities in the workpiece 10. Specifically, the control unit 310 refers to the storage unit 320 to identify the first information 320a of the workpiece 10 captured by the camera 230, and transmits the identified first information 320a to the inspection device 100 via communication or the like. As a means of communication, for example, it may be transmitted directly from the cutting device 200 to the inspection device 100, or it may be transmitted via a server or the like, or via peer-to-peer communication.
[0051] In the first information reception step S4, the control unit 110 receives information about the workpiece 10 from the cutting device 200. The control unit 110 stores the received information about the workpiece 10 in the storage unit 120.
[0052] In the abnormality determination step S5, the control unit 110 determines whether there is an abnormality in the workpiece 10 and an abnormality in the camera 230 based on the first information 320a of the workpiece 10. In this embodiment, based on the abnormality determination of the workpiece 10, it is determined whether the abnormality is in the camera 230.
[0053] Figure 6 shows the subroutine for the abnormality determination step S5, in which the control unit 110 determines if there is an abnormality in the object to be processed 10, and if there is an abnormality in the object to be processed 10, it determines whether the abnormality is caused by the camera 230.
[0054] First, in step S50, a determination is made as to whether there is an abnormality in the object to be processed 10. Specifically, the control unit 110 determines whether an abnormality has occurred in the object to be processed 10 based on the image in at least one of the above-mentioned reference information 120a, second information 120b, and third information 120c, and the image in the first information 320a of the object to be processed 10 received in the first information reception step S4. That is, the control unit 110 refers to the storage unit 120 to identify the image that can serve as reference information and the image in the information of the object to be processed 10 received in the first information reception step S4, and performs an abnormality determination by comparing the images of each other. Here, reference information 120a will be explained as an example of information that can serve as reference information.
[0055] Anomaly detection is performed using, for example, template matching (pattern matching). As template matching, for example, known methods such as SAD (Sum of Absolute Difference), SSD (Sum of Squared Difference), NCC (Normalized Cross-Correlation), and ZNCC (Zero-mean Normalized Cross-Correlation) can be used. These are algorithms that determine anomalies by looking at the difference in pixel values in various ways. In this way, the control unit 110 compares the image of the reference information 120a with the image of the first information 320a received in the first information reception step S4 using template matching, and determines that the images are similar if the similarity between them is greater than or equal to a predetermined value, and determines that they are dissimilar if the similarity between them is less than a predetermined value. The similarity of images in this embodiment is defined, for example, by contamination or dirt attached to the object to be processed 10.
[0056] Based on this abnormality determination, if the images are similar, the control unit 110 determines that there is no abnormality in the workpiece 10 (No in step S50), and in that case, the control unit 110 proceeds to the determination result transmission step S6. Conversely, if the images are not similar, it determines that there is an abnormality in the workpiece 10 (Yes in step S50), and the control unit 110 proceeds to the step S51. In this embodiment, as described above, the reference information 120a shown in Figure 4 shows no contamination or dirt, whereas the information of the workpiece 10 in Figure 3 includes abnormal areas P such as contamination or dirt. Therefore, the images are not similar, and it is determined that an abnormality has occurred in the workpiece 10 that has been transported to the cutting device 200.
[0057] If the control unit 110 determines that an abnormality has occurred in the object to be processed 10, it determines whether the abnormality in the object to be processed 10 is caused by the camera 230 (step S51). When the camera 230 is used for a long period of time, the image obtained may deteriorate, for example, due to deterioration of the image sensor. Therefore, the control unit 110 compares the image in the reference information 120a with the image in the first information 320a to determine whether there is an abnormality caused by the deterioration of the camera 230 over time, such as the image being dull or faded. As mentioned above, the reference information 120a is registered as an image taken immediately after maintenance of the camera 230, so by comparing it with the first information 320a, it is possible to determine whether the image in the first information 320a has deteriorated over time.
[0058] If it is determined that the abnormality in the object to be processed 10 is caused by the camera 230 due to deterioration over time (Yes in step S51), the control unit 110 determines that there is an abnormality in the camera 230 (step S52). Conversely, if it is determined that the abnormality in the object to be processed 10 is not caused by the camera 230 due to no deterioration over time (No in step S51), the control unit 110 determines that there is no abnormality in the camera 230 and that the abnormality in the object to be processed 10 is caused by the object to be processed 10 (step S53).
[0059] The method for determining whether deterioration over time has occurred may, for example, be determined by the similarity between the images. If the similarity is above a predetermined value, it is determined that the camera 230 has not deteriorated because it is close to the normal reference information 120a. If the similarity is below the predetermined value, it is determined that the camera 230 has deteriorated. The similarity of the images may be defined, for example, by the gradation that indicates the intensity of light received by each pixel of the image sensor.
[0060] Furthermore, as described above, the reference information 120a may include an image of the object to be processed 10 when it is not placed on the guide rail 251 or the holding table, etc. For example, it may be assumed that no contamination or dirt is detected when the object to be processed 10 is not placed on anything. In this case, if an abnormality occurs in the object to be processed 10, the control unit 110 will determine that there is no abnormality in the camera 230 and that there is an abnormality in the object to be processed 10, since the abnormality occurred when the object to be processed 10 was placed on something.
[0061] Furthermore, when referring to the image in the first information 320a, it may be clear that foreign matter is attached to the camera 230, or that the image is overexposed or underexposed. In such cases, the abnormality of the object to be processed 10 can be determined to be an abnormality of the camera 230 without needing to compare it with the reference information 120a. Therefore, in such cases, the control unit 110 may determine the abnormality of the camera 230 based solely on the first information 320a without comparing it with the reference information 120a.
[0062] This method allows for the detection of abnormalities in the camera 230, including the detection of abnormalities in the object 10 being processed.
[0063] In the judgment result transmission step S6, the control unit 110 transmits a judgment result indicating an abnormality in the workpiece 10 based on the abnormality determination step S5 to the cutting device 200 via communication or the like.
[0064] In the judgment result receiving step S7, the control unit 310 receives a judgment result indicating an abnormality in the workpiece 10 from the inspection device 100. Specifically, the control unit 310 receives a judgment result from the inspection device 100 that compares the first information 320a of the workpiece 10 transmitted in the first information transmission step S3 with the reference information 120a of the workpiece 10. The control unit 310 then stores the received judgment result indicating an abnormality in the workpiece 10 in the storage unit 320.
[0065] In processing step S8, the control unit 310 performs predetermined processing based on the determination result received in the determination result reception step S7.
[0066] Figure 7 shows a subroutine for processing step S8, in which the control unit 310 performs predetermined processing according to the received determination result. First, the control unit 310 refers to the determination result received in the determination result receiving step S7 and determines whether there is an abnormality in the camera 230 (step S80).
[0067] If, based on the judgment result, it is determined that an abnormality has occurred in the camera 230 (Yes in step S80), the control unit 310 proceeds to the first notification step S81.
[0068] In the first notification step S81, the control unit 310 notifies the operator that an abnormality has occurred in the camera 230. For example, the control unit 310 activates a notification unit 270, such as a display unit or a warning light, to notify the operator that an abnormality has occurred in the camera 230. This allows the operator to understand that an abnormality has occurred in the camera 230 and to avoid performing cutting operations on the workpiece 10 while the camera 230 is malfunctioning. After notifying the operator of the abnormality in the first notification step S81, the control unit 310 terminates the series of processes.
[0069] On the other hand, if it is determined that no abnormality has occurred in the camera 230 based on the above determination result (No in step S80), the control unit 310 proceeds to step S82.
[0070] In step S82, the control unit 110 determines whether there is an abnormality in the object to be processed 10. Here, an abnormality in the object to be processed 10 includes both the meaning of whether an abnormality has occurred in the object to be processed 10 and the meaning of whether the abnormality in the object to be processed 10 is caused by the object to be processed 10. However, if there is an abnormality in the object to be processed 10, since it has been determined in step S80 above that there is no abnormality in the camera 230, it is determined that the abnormality in the object to be processed 10 is caused by the object to be processed 10.
[0071] If, based on the judgment result, it is determined that no abnormality has occurred in the workpiece 10 (No in step S82), the control unit 310 proceeds to the processing step S83. Conversely, if, based on the judgment result, it is determined that an abnormality has occurred in the workpiece 10 (Yes in step S82), the process proceeds to the second notification step S85. First, the processing step S83 will be explained.
[0072] In processing step S83, the control unit 310 performs cutting on the workpiece 10 using the cutting device 200. That is, since no abnormalities have occurred in the workpiece 10, cutting is performed on the workpiece 10. Specifically, the workpiece 10 is placed on the holding surface of the holding table 210 and held in place by suction. Then, the workpiece 10 is imaged with the alignment camera 240, and alignment is performed based on the image captured. Furthermore, the cutting unit 220 is controlled to move the cutting blade and the holding table 210 relative to each other, and cutting is performed along the planned division line. After cutting is performed in processing step S83, the control unit 310 proceeds to the cleaning step S84.
[0073] In the cleaning step S84, the control unit 310 cleans the workpiece 10 that has been cut in the machining step S83. This is to clean off any cutting debris that has adhered to the workpiece 10. Specifically, the control unit 310 uses the transport unit 250 to transport the workpiece 10 from the holding table 210 to the cleaning unit 260, and the cleaning unit 260 cleans the workpiece 10 after machining.
[0074] On the other hand, as described above, if it is determined that an abnormality has occurred in the object to be processed 10 based on the judgment result (Yes in step S82), the control unit 310 proceeds to the second notification step S85.
[0075] In the second notification step S85, the control unit 310 notifies the operator that an abnormality has occurred in the workpiece 10 to be cut. For example, the control unit 310 activates a notification unit 270, such as a display unit or a warning light, to notify the operator that an abnormality has occurred in the workpiece 10. This allows the operator to understand that an abnormality has occurred in the workpiece 10 and to avoid performing cutting on the workpiece 10 while the abnormality is present. After notifying of the occurrence of an abnormality in the second notification step S85, the control unit 310 proceeds to the abnormality resolution determination step S86.
[0076] In the abnormality resolution determination step S86, the control unit 310 determines whether the abnormality of the workpiece 10 can be resolved by executing the abnormality resolution step S87 described later. After the abnormality resolution process in the abnormality resolution step S87 is performed, the process returns to the first information acquisition step S2 to acquire (i.e., image) the first information 320a of the workpiece 10 that has undergone the abnormality resolution process, and then the images are compared by the abnormality determination step S5 in the inspection device 100. In the initial routine, the abnormality resolution step S87 has not yet been executed, so in that case, the abnormality resolution determination step S86 may be configured to be positively determined (Yes in the abnormality resolution determination step S86).
[0077] On the other hand, if, after returning to the first information acquisition step S2 and acquiring the first information 320a of the workpiece 10 that has undergone abnormality resolution processing, it is determined that an abnormality still exists (Yes in step S82), and it is determined that the abnormality cannot be resolved even if the abnormality resolution step S87 is executed (No in abnormality resolution determination step S86), the control unit 310 terminates the process. In other words, if the dirt or other substances attached to the workpiece 10 cannot be removed even after executing the abnormality resolution step S87, the process is terminated without performing cutting. To put it another way, if the similarity between the image of the first information 320a of the workpiece 10 and the image of the reference information does not reach a predetermined value even after executing the abnormality resolution step S87, the process is terminated.
[0078] Furthermore, the cases in which the abnormality resolution determination step S86 is determined negatively may be defined, for example, by the number of times. For example, if there is a possibility that the abnormality of the workpiece 10 can be resolved by the abnormality resolution step S87 up to two times, including the first time, the abnormality resolution determination step S86 may be determined positively (Yes in the abnormality resolution determination step S86), and the determination may be determined negatively (No in the abnormality resolution determination step S86) from the third time onward.
[0079] In the abnormality resolution step S87, the control unit 310 performs processing to resolve the abnormality in the workpiece 10 that has been determined to be abnormal. As processing to resolve the abnormality, for example, a cleaning process is performed to clean off any contamination or dirt adhering to the workpiece 10. Specifically, the control unit 310 transports the workpiece 10 to the cleaning unit 260 using the transport unit 250 and cleans the workpiece 10. Note that the cleaning in the abnormality resolution step S87 may be changed to cleaning conditions that have a stronger cleaning force compared to, for example, the cleaning conditions in the cleaning step S84 after the cutting of the workpiece 10. For example, in the cleaning unit 260 that supplies pure water for cleaning, the cleaning conditions in the abnormality resolution step S87 may be changed to cleaning conditions where the cleaning time is longer than the cleaning conditions in the cleaning step S84 after cutting (for example, twice the cleaning time). Alternatively, the supply pressure of the pure water may be changed to a higher pressure than the cleaning conditions in the cleaning step S84 after cutting.
[0080] Furthermore, in addition to the cleaning process, the abnormality resolution step S87 may also include a suction process to remove contaminants and dirt attached to the object to be processed 10, or a blower process to blow away contaminants and dirt attached to the object to be processed 10.
[0081] As described above, in this embodiment, the cutting device 200 compares first information 320a of the workpiece 10 before processing with reference information 120a indicating no abnormality, and determines whether an abnormality has occurred in the workpiece 10 based on the comparison result. If it is determined that an abnormality has occurred, it is determined whether the abnormality is caused by the camera 230. If it is determined that there is an abnormality in the camera 230, it can be determined that the abnormality in the workpiece 10 is caused by the camera 230, and as a result, the operator can avoid processing using the camera 230 in which the abnormality occurred. If it is determined that there is no abnormality in the camera 230, it can be determined that the abnormality in the workpiece 10 is caused by the workpiece 10 itself, and as a result, the operator can avoid processing using the workpiece 10 in which the abnormality occurred.
[0082] Furthermore, in this embodiment, abnormality detection of the workpiece 10 and abnormality detection of the camera 230 are performed by an inspection device 100, which is a separate device from the cutting device 200. By performing abnormality detection of the workpiece 10 and the camera 230 in an inspection device 100 independent of the cutting device 200, the cutting device 200 does not need to spend time performing these abnormality detections. Therefore, for example, compared to a configuration in which the cutting device 200 performs the abnormality detection, a decrease in the productivity of processing such as cutting can be suppressed. For example, while the inspection device 100 is performing abnormality detection of the workpiece 10 and the camera 230, the cutting device 200 can perform processing such as cutting on other normal workpieces 10, thereby suppressing a decrease in the productivity of processing such as cutting.
[0083] [Other embodiments] Next, other embodiments will be described. In the embodiments described above, in determining whether the abnormality in the object to be processed 10 in step S51 is in the camera 230, an example was described in which the first information 320a of the object to be processed 10 and the reference information 120a are compared to determine if the camera 230 is abnormal. On the other hand, as the reference information in this case, in addition to the reference information 120a as described above, the second information 120b and the third information 120c may also be used. That is, if the image in the first information 320a deteriorates over time compared to the image in the second information 120b or the third information 120c, it may be determined that there is an abnormality in the camera 230.
[0084] Specifically, the control unit 110 compares the first information 320a of the object to be processed 10 with the second information 120b, which is past information of the object to be processed 10, and determines whether there is an abnormality in the first information 320a that is caused by the deterioration of the camera 230 over time, such as the image being dull or faded. If it is determined that deterioration over time has occurred, the control unit 110 determines that the abnormality in the object to be processed 10 is caused by the camera 230, that is, it determines that there is an abnormality in the camera 230. Conversely, if it is determined that deterioration over time has not occurred, the control unit 110 determines that there is no abnormality in the camera 230, and that the abnormality in the object to be processed 10 is caused by the object to be processed 10, not the camera 230.
[0085] Similarly, the control unit 110 compares the first information 320a of the workpiece 10 with the third information 120c acquired by another cutting device 200 of the same type as the cutting device 200, and determines whether there is an abnormality in the image in the first information 320a that is caused by the deterioration of the camera 230 over time, such as the image being dull or faded. If it is determined that deterioration over time has occurred, the control unit 110 determines that the abnormality in the workpiece 10 is caused by the camera 230, that is, it determines that there is an abnormality in the camera 230. Conversely, if it is determined that deterioration over time has not occurred, the control unit 110 determines that there is no abnormality in the camera 230, and that the abnormality in the workpiece 10 is caused by the workpiece 10, not the camera 230.
[0086] Furthermore, the information compared with the first information 320a of the object to be processed 10 may be a combination of the reference information 120a, the second information 120b, and the third information 120c. That is, the information compared with the first information 320a may be the reference information 120a and the second information 120b. Alternatively, it may be the reference information 120a and the third information 120c. Alternatively, it may be the second information 120b and the third information 120c. Moreover, it may be the reference information 120a, the second information 120b, and the third information 120c. In this way, the more information compared with the first information 320a, the higher the accuracy of determining whether there is an abnormality in the camera 230.
[0087] Furthermore, as another means of determining abnormalities in the camera 230, for example, the camera may be configured to continuously image the object to be processed 10 while slightly shifting its position on the guide rail 251, and then compare the captured information. Specifically, the control unit 310 images the object to be processed 10 placed on the guide rail 251, and then continuously images the object to be processed 10 while slightly shifting its position. This information is then transmitted to the inspection device 100. Assuming that an abnormality has occurred in the object to be processed 10, if the location where the abnormality occurred does not correspond to a slight movement of the object to be processed 10, the control unit 110 can determine that there is an abnormality in the camera 230. Conversely, if the location where the abnormality occurred corresponds to a slight movement of the object to be processed 10, the control unit 110 can determine that there is an abnormality in the object to be processed 10.
[0088] Although each embodiment has been described above with reference to the drawings, it goes without saying that the present invention is not limited to these embodiments. It is clear to those skilled in the art that various modifications and alterations can be conceived within the scope of the claims, and these are also understood to naturally fall within the technical scope of the present invention. Furthermore, the components of the above embodiments may be combined arbitrarily without departing from the spirit of the invention.
[0089] For example, in the above-described embodiment, the inspection device 100 was configured to determine abnormalities in the workpiece 10 and the camera 230, but these abnormality determination processes may be performed by the cutting device 200. In other words, the processing and inspection (determination) processes may be performed by a single processing device.
[0090] Furthermore, for example, the cutting device 200 and the inspection device 100 may be configured to cooperate depending on the determination content of the abnormality determination step S5. For example, when abnormality determination of the workpiece 10 and the camera 230 is performed using the third information 120c, since the third information 120c is information based on another cutting device, the cutting device 200 may be configured to perform the machining process and the inspection device 100 may perform the inspection process. In addition, when abnormality determination of the workpiece 10 and the camera 230 is performed using the reference information 120a and the second information 120b, since the reference information 120a and the second information 120b are information based on the cutting device 200, the cutting device 200 may be configured to perform the machining process and the inspection process.
[0091] Furthermore, in the above-described embodiment, for example, an image of the object to be processed 10 in a normal state was described as an example of reference information 120a. However, reference information 120a may also include images of the object to be processed 10 in an abnormal state. In that case, the abnormality determination in abnormality determination step S5 may be configured to determine that the object is normal if the reference information 120a and the first information 320a of the object to be processed 10 are not similar, and to determine that an abnormality has occurred if they are similar.
[0092] Furthermore, while the image in the first information 320a of the workpiece 10 was an image captured by the camera 230 in the above embodiment, it may also consist of an image captured by the alignment camera 240. For example, the alignment camera 240 may capture images of multiple locations on the surface 10a of the workpiece 10 held on the holding surface 211 of the holding table 210 to generate an image of the entire surface 10a of the workpiece 10.
[0093] Furthermore, as explained with reference to Figure 1, the camera 230 may be positioned above the guide rail 251 in the Z-axis direction, or it may be positioned above the holding surface 211 of the holding table 210 in the Z-axis direction and provided on the transport path of the workpiece 10.
[0094] Furthermore, the means for detecting the information of the object to be processed 10 may be a particle counter for detecting particles in the object to be processed 10, or a thickness detection sensor for measuring the thickness of the object to be processed 10, in addition to the camera 230. In this case, the reference information will be a reference threshold (number) or a reference thickness.
[0095] Furthermore, if the means for detecting information about the object to be processed 10 is a camera 230, imaging may be performed while illuminating the object to be processed 10 with oblique light focused at the UV wavelength of an LED light source. Focusing the light means generating a strong light in one direction, like a Polarion light, to make it easier to find small objects. This is because using UV wavelengths leads to the emission of fluorescent materials, and using an LED light source results in a narrow spectral output (short wavelength) of UV wavelengths, which makes the light more easily scattered. Short wavelengths are suitable for illuminating and reflecting light from minute objects such as dust and foreign matter.
[0096] Furthermore, in the above-described embodiment, the inspection device 100 that performs abnormality determination of the workpiece 10 is not limited to one unit, but may be composed of multiple units. By performing abnormality determination of the workpiece 10 with multiple inspection devices 100, the abnormality determination process can be made more efficient, and the productivity of each process of the cutting device 200 based on the determination results can be further improved.
[0097] Furthermore, in the above-described embodiment, an example was explained in which the initial routine is determined positively in the abnormality resolution determination step S86. However, in the abnormality determination step S5, if the similarity between the image of the first information 320a of the object to be processed 10 and the image of the reference information 120a is significantly lower than a predetermined value, such as being below a second predetermined value, it may be determined that the abnormality cannot be resolved even if the abnormality resolution step S87 is executed, and the initial routine may be determined negatively.
[0098] Furthermore, in the above-described embodiment, for example, when transmitting information about the object to be processed 10 to the inspection device 100 in the first information transmission step S3, an example was described in which the information about the object to be processed 10 acquired in the first information acquisition step S2 is first stored in the storage unit 320 before transmission. However, it is also possible to configure the system to transmit the information about the object to be processed 10 acquired in the first information acquisition step S2 to the inspection device 100 without storing it in the storage unit 320. The same applies to the judgment result transmission step S6 and other steps.
[0099] Furthermore, the applicable apparatus is not limited to the cutting apparatus 200, as long as it is a device on which the workpiece 10 can be placed. For example, it may be applied to various processing apparatuses such as a laser processing apparatus that performs laser processing on the workpiece 10, a grinding apparatus that performs grinding on the workpiece 10, or a polishing apparatus that performs polishing on the workpiece 10.
[0100] Furthermore, the processing method described in the above-described embodiment can be realized by executing a pre-prepared control program on a computer. This control program is recorded on a computer-readable storage medium and executed when read from the storage medium. This control program may also be provided in the form of a non-transient storage medium such as flash memory, or it may be provided via a network such as the Internet. The computer that executes this control program may be included in the processing unit, or it may be included in an electronic device such as a smartphone, tablet terminal, or personal computer that can communicate with the processing unit, or it may be included in a server device that can communicate with these processing units and electronic devices.
[0101] This specification contains at least the following information. Note that the components etc. in parentheses indicate those corresponding to the embodiments described above, but are not limited thereto.
[0102] (1) A processing method for processing an object to be processed, A first information acquisition step in which the first detection unit (camera 230) acquires first information (first information 320a) of the first object to be processed (object to be processed 10), After the first information acquisition step, a determination step (abnormality determination step S5) is performed to determine an abnormality in the first detection unit based on the first information, The process includes, after the determination step, a processing step (processing step S8) in which the first object to be processed is processed based on the determination result. Processing method.
[0103] According to (1), the first detection unit makes an abnormality determination based on the first information of the workpiece. This makes it possible to identify abnormalities in the first detection unit and to perform appropriate processing in the processing step based on the abnormality determination of the first detection unit. In other words, in conventional processing devices, if an abnormality occurs in the workpiece, it is determined that there is an abnormality in the workpiece itself without considering the abnormality in the first detection unit. However, in the configuration of (1), the abnormality of the abnormality in the first detection unit is taken into consideration, so for example, it is possible to avoid processing such as machining when there is an abnormality in the first detection unit.
[0104] (2) The processing method described in (1), The first information is the information before processing in the processing step. Processing method.
[0105] According to (2), by using the information before processing, it is possible to prevent the processing of the first workpiece with the processing device when there is an abnormality in the first detection unit.
[0106] (3) The processing method described in (1) or (2), The determination step determines whether the first detection unit is abnormal based on the registered reference information (reference information 120a) and the first information. Processing method.
[0107] According to (3), if there is no abnormality in the reference information, it becomes easier to determine an abnormality in the first detection unit by comparing it with that reference information.
[0108] (4) The processing method described in (1) or (2), The aforementioned determination step is, Based on the first information and the second information (second information 120b) of the first object to be processed, which is information acquired before the first information by a detection unit of the same type as the first detection unit, the first detection unit is used to determine if there is an abnormality. Processing method.
[0109] According to (4), by comparing it with second information, which is past information detected by the same type of first detection unit, an abnormality in the first detection unit can be determined based on changes over time.
[0110] (5) The processing method described in (1) or (2), The system comprises a first processing apparatus (cutting apparatus 200) having the first detection unit, and a second processing apparatus having a second detection unit of the same type as the first detection unit, The aforementioned determination step is, Based on the first information acquired by the first detection unit and the third information (third information 120c) of a second object of the same type as the first object acquired by the second detection unit, the first detection unit makes a determination of abnormality. Processing method.
[0111] According to (5), by comparing the first information and the third information obtained by the detection units of the first and second processing units, which are equipped with the same type of detection unit, it is possible to determine an abnormality in the first detection unit based on the information of the other processing unit equipped with the same type of detection unit.
[0112] (6) The processing method described in (5), The detection conditions for acquiring the first information by the first detection unit and the detection conditions for acquiring the third information by the second detection unit are the same detection conditions. Processing method.
[0113] According to (6), by having the same detection conditions (i.e., imaging conditions) for the first detection unit and the second detection unit, the accuracy of the first detection unit's abnormality detection can be improved compared to when the detection conditions are different.
[0114] (7) The processing method described in (5), The first and second processing units are of the same type. Processing method.
[0115] According to (7), by having the first processing unit and the second processing unit be of the same type, the accuracy of the abnormality detection by the first detection unit can be improved compared to the case where the first processing unit and the second processing unit are of different types.
[0116] (8) The processing method described in (1) or (2), The processing step includes a processing step (processing step S83) for processing the first workpiece, The aforementioned processing step is If the first detection unit determines that there is no abnormality based on the above determination result, the first workpiece to be processed is processed. Processing method.
[0117] According to (8), if there is no abnormality in the first detection unit, the first workpiece can be processed appropriately.
[0118] (9) The processing method described in (1) or (2), The processing step includes a notification step (first notification step S81) for notifying the occurrence of an abnormality in the first detection unit. The aforementioned notification step is, If it is determined that there is an abnormality in the first detection unit based on the above determination result, the occurrence of an abnormality in the first detection unit is notified. Processing method.
[0119] According to (9), if there is an abnormality in the first detection unit, the first detection unit will notify that there is an abnormality, thereby preventing operators from performing processing or other operations on the first workpiece while there is an abnormality in the first detection unit.
[0120] (10) A processing system for processing an object to be processed, The system comprises a first processing device (cutting device 200) equipped with a first detection unit (camera 230) for acquiring first information (first information 320a) of a first workpiece (workpiece 10), and an inspection device (inspection device 100) for determining an abnormality of the first detection unit based on the first information. The first processing apparatus is The system includes a first control unit (control unit 310) that acquires the first information, transmits the first information to the inspection device, and receives the abnormality determination result from the first detection unit of the inspection device. The inspection device, The system includes a second control unit (control unit 110) that determines whether the first detection unit is abnormal based on the first information received from the first processing unit and transmits the determination result to the first processing unit. Processing system.
[0121] According to (10), the processing system comprises a first processing device for processing the first workpiece and an inspection device for determining abnormalities in the first detection unit of the first workpiece. The abnormality determination of the first detection unit is performed by the inspection device outside the first processing device. This improves the productivity of processing according to the abnormality determination result, compared to, for example, the first processing device performing the abnormality determination of the first detection unit. In other words, the first processing device and the inspection device work together, with the first processing device performing its intended predetermined processing and the inspection device determining abnormalities in the first detection unit. This makes it possible to determine abnormalities in the first detection unit of the first workpiece while suppressing a decrease in the productivity and efficiency of the processing of the first processing device.
[0122] (11) The processing system described in (10), The second control unit is: An abnormality in the first detection unit is determined based on the first information, registered reference information (reference information 120a), second information of the first object to be processed (second information 120b) which is information acquired by the first detection unit before the first information, and third information (third information 120c) which is acquired by a second detection unit of the same type as the first detection unit provided in the second processing unit. Processing system.
[0123] According to (11), the first detection unit can make an abnormality determination based on the first information of the first object to be processed and at least one of the reference information, the second information, and the third information. Furthermore, if, for example, multiple pieces of this reference information, the second information, and the third information are used as parameters to compare with the first information, the accuracy of the abnormality determination by the first detection unit can be further improved. [Explanation of Symbols]
[0124] 10. Object to be processed (First object to be processed) 100 Inspection device 110 Control Unit (Second Control Unit) 120a Standard Information 120b 2nd information 120c 3rd information 200 Cutting device (first processing unit) 230 Camera (First detection unit) 310 Control Unit (First Control Unit) 320a Information 1 S5 Anomaly detection step (determination step) S8 Processing Step S81 First Notification Step (Notification Step) S83 Machining Steps
Claims
1. A processing method for processing an object to be processed, A first information acquisition step involves acquiring first information of a first object to be processed by a first detection unit, After the first information acquisition step, a determination step is performed to determine an abnormality in the first detection unit based on the first information. The process includes, after the determination step, a processing step of processing the first object to be processed based on the determination result. Processing method.
2. The processing method according to claim 1, The first information is the information before processing in the processing step. Processing method.
3. A processing method according to claim 1 or 2, The determination step determines whether the first detection unit is abnormal based on the registered reference information and the first information. Processing method.
4. A processing method according to claim 1 or 2, The aforementioned determination step is, Based on the first information and the second information of the first object to be processed, which is information acquired before the first information by a detection unit of the same type as the first detection unit, the system determines whether there is an abnormality in the first detection unit. Processing method.
5. A processing method according to claim 1 or 2, The apparatus comprises a first processing unit having the first detection unit, and a second processing unit having a second detection unit of the same type as the first detection unit, The aforementioned determination step is, Based on the first information obtained by the first detection unit and the third information of a second object of the same type as the first object to be processed obtained by the second detection unit, the first detection unit determines whether there is an abnormality. Processing method.
6. The processing method according to claim 5, The detection conditions for acquiring the first information by the first detection unit and the detection conditions for acquiring the third information by the second detection unit are the same detection conditions. Processing method.
7. The processing method according to claim 5, The first processing apparatus and the second processing apparatus are of the same type. Processing method.
8. A processing method according to claim 1 or 2, The processing step includes a processing step for processing the first workpiece, The aforementioned processing step is If the first detection unit determines that there is no abnormality based on the above determination result, the first workpiece to be processed is processed. Processing method.
9. A processing method according to claim 1 or 2, The processing step includes a notification step for notifying the occurrence of an abnormality in the first detection unit, The aforementioned notification step is, If it is determined that there is an abnormality in the first detection unit based on the judgment result, the occurrence of the abnormality in the first detection unit is notified. Processing method.
10. A processing system for processing objects to be processed, The system comprises a first processing apparatus equipped with a first detection unit for acquiring first information of a first object to be processed, and an inspection apparatus for determining an abnormality of the first detection unit based on the first information, The first processing apparatus is The system includes a first control unit that acquires the first information, transmits the first information to the inspection device, and receives the abnormality determination result from the first detection unit of the inspection device. The inspection device, The device includes a second control unit that, based on the first information received from the first processing unit, determines whether the first detection unit is abnormal and transmits the determination result to the first processing unit. Processing system.
11. A processing system according to claim 10, The second control unit is, An abnormality in the first detection unit is determined based on the first information, registered reference information, second information of the first object to be processed which is information acquired by the first detection unit before the first information, and third information acquired by a second detection unit of the same type as the first detection unit provided in the second processing unit. Processing system.