Multilayer electronic components

The laminated electronic component with glass layers on internal electrode ends addresses delamination and moisture issues, enhancing reliability and capacitance, and reducing resistance.

JP2026116149APending Publication Date: 2026-07-09SAMSUNG ELECTRO MECHANICS CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Filing Date
2025-11-04
Publication Date
2026-07-09

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Abstract

This invention provides a multilayer electronic component with excellent moisture resistance and reliability, as delamination and cracking in the side margins are suppressed. [Solution] The stacked electronic component includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in the thickness direction, and comprises a body including a first and second surface facing each other in the thickness direction, a third surface 3 and a fourth surface 4 facing each other in the length direction, and a fifth surface 5 and a sixth surface 6 facing each other in the width direction, a first side margin portion 141 and a second side margin portion 142 arranged on the fifth surface and the sixth surface respectively, a first glass layer GL1 and a second glass layer GL2 arranged on the first side margin portion and the second side margin portion and extending to the third surface and the fourth surface respectively, and a first external electrode 131 and a second external electrode 132 arranged on the third surface and the fourth surface respectively, the internal electrode includes a first internal electrode 121 on the third surface whose widthwise ends are covered by the first glass layer, and a second internal electrode 122 on the fourth surface whose widthwise ends are covered by the second glass layer.
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