Display device

Abstract

The present invention provides a display device that can expand the size (or area) of the light-emitting region. [Solution] A display device according to one embodiment includes a substrate containing a plurality of pixels including a plurality of subpixels, a first non-emitting region provided on the substrate and arranged inside each of the plurality of subpixels, a second non-emitting region connected to the first non-emitting region and arranged between the plurality of subpixels, an emitting region adjacent to each of the first non-emitting region and the second non-emitting region, and a repair portion arranged in the first non-emitting region.

Description

Technical Field

[0001] This specification relates to a display device for displaying images.

Background Art

[0002] Organic light-emitting display devices have a high response speed, low power consumption, and are self-emitting without the need for a separate light source unlike liquid crystal display devices, so there are no problems with the viewing angle and they are attracting attention as next-generation flat panel display devices.

[0003] Such a display device includes a plurality of sub-pixels, and the plurality of sub-pixels include a light-emitting element layer provided in a light-emitting region. The display device displays an image by the light emission of the light-emitting element layer.

[0004] On the other hand, in order to prevent the entire light-emitting region of each of the plurality of sub-pixels from becoming a dark spot due to a short circuit between wirings (or electrodes), a repair wiring is provided between the light-emitting region and the circuit region. If the repair wiring is provided in the light-emitting region, the size (or area) of the light-emitting region becomes small, so the light efficiency decreases. Therefore, the display device has a limit in expanding the size (or area) of the light-emitting region by the repair wiring, and thus has a limit in improving the light efficiency.

Summary of the Invention

Problems to be Solved by the Invention

[0005] This specification makes it a technical problem to provide a display device capable of expanding the size (or area) of the light-emitting region.

[0006] This specification makes it a technical problem to provide a display device capable of improving the light efficiency.

[0007] This specification makes it a technical problem to provide a display device capable of improving the light extraction efficiency of the light emitted from the light-emitting element layer.

[0008] Furthermore, this specification aims to provide a display device that can maximize the light extraction efficiency of light emitted from a light-emitting element layer.

[0009] Furthermore, this specification aims to provide a display device that can reduce overall power consumption by extracting light from non-emissive regions.

[0010] The problems that the examples in this specification aim to solve are not limited to those mentioned above, and other problems not mentioned should be clearly understandable to a person with ordinary skill in the art to which the technical concept of this specification belongs, based on the following description. [Means for solving the problem]

[0011] A display device according to one embodiment of this specification includes a substrate including a plurality of pixels including a plurality of subpixels, a first non-emitting region provided on the substrate and arranged inside each of the plurality of subpixels, a second non-emitting region connected to the first non-emitting region and arranged between the plurality of subpixels, an emitting region adjacent to each of the first non-emitting region and the second non-emitting region, and a repair portion arranged in the first non-emitting region.

[0012] The display device according to this specification can expand the size (or area) of the light-emitting region by arranging the repair section in a non-light-emitting region (or first non-light-emitting region) located inside each of the multiple subpixels.

[0013] The display device according to this specification can improve light efficiency by expanding the size (or area) of the light-emitting region.

[0014] The display device according to this specification can improve the light extraction efficiency of light emitted by a light-emitting element by arranging a reflector (or first reflector) in a non-emitting region (or first non-emitting region) provided inside each of a plurality of subpixels.

[0015] The display device according to this specification, by arranging a reflector (or second reflector) in a non-emitting region (or second non-emitting region) provided outside a plurality of subpixels, allows the reflector (or second reflector) to reflect light directed toward adjacent subpixels, thereby maximizing light extraction efficiency while preventing color mixing.

[0016] The display device according to this specification can extract light even in non-emitting regions by reflective sections (or first and second reflective sections) provided inside and outside each of the multiple subpixels. Therefore, compared to a display device that does not have reflective sections inside and outside each of the multiple subpixels, it can have equivalent or even better luminous efficiency at lower power consumption, thus reducing overall power consumption.

[0017] The effects described herein are not limited to those mentioned above, and any other effects not mentioned here will be readily apparent to a person with ordinary skill in the art to which this specification pertains, based on the following description. [Brief explanation of the drawing]

[0018] [Figure 1] This is a schematic plan view of a display device according to one embodiment of this specification. [Figure 2] Figure 1 is a schematic plan view showing a single pixel. [Figure 3] Figure 2 is a schematic plan view showing the repair section and branch wiring. [Figure 4] This is a schematic plan view showing a sub-pixel of a display device according to one embodiment of this specification and a sub-pixel of a display device according to a comparative example. [Figure 5] Figure 3 is a schematic cross-sectional view of the line I-I'. [Figure 6] Figure 3 is a schematic cross-sectional view of the line II-II' shown. [Figure 7] Figure 3 is a schematic cross-sectional view of the line III-III' shown. [Figure 8] Figure 3 is a schematic cross-sectional view of the IV-IV' line. [Figure 9] It is a schematic cross-sectional view of the V-V' line shown in FIG. 3. [Figure 10] It is a schematic plan view showing two pixels of a display device according to an embodiment of the present specification.

Mode for Carrying Out the Invention

[0019] The advantages and features of the present specification, and the methods for achieving them, will become clear by referring to various examples described in detail hereinafter based on the accompanying drawings. However, the present specification is not limited to an example disclosed below, and can be embodied in various different forms. The embodiments of the present specification complete the disclosure of the present specification, and are provided to fully inform those having ordinary knowledge in the technical field to which the technical idea of the present specification belongs of the scope of the technical idea.

[0020] The shapes, sizes, dimensions (e.g., length, width, height, thickness, radius, diameter, area, etc.), ratios, angles, numbers, etc., disclosed in the drawings for explaining the embodiments of the present specification are exemplary, and the present specification is not limited to the matters shown in the drawings.

[0021] The dimensions including the sizes and thicknesses of each component shown in the drawings are shown for convenience of explanation, and the present specification is not limited to the sizes and thicknesses of the components shown in the drawings. It should be noted that the relative dimensions including the relative sizes, positions, and thicknesses of the components shown in various drawings submitted to the present specification are also part of the present specification.

[0022] The same reference numerals indicate the same components throughout the specification. Also, in the description of the present specification, when it is determined that a specific description of related known technologies may unnecessarily obscure the gist of the present specification, the detailed description thereof is omitted.

[0023] When using words such as "includes," "possesses," and "becomes" as used herein, other parts may be added unless "only" is used. When a component is expressed singularly, it includes cases where it includes multiple components unless otherwise explicitly stated.

[0024] In interpreting the constituent elements, even if there is no separate explicit description, it should be interpreted as including a margin of error.

[0025] When describing the relative positions of two parts, for example, using phrases like "on top of," "above," "below," or "next to," one or more other parts can be located between the two parts, unless "immediately" or "directly" is used.

[0026] When describing temporal relationships, for example, when describing sequential relationships using phrases like "after," "following," "next," or "before," it can include non-continuous events unless "immediately" or "directly" is used.

[0027] As used herein, the term “connected” is intended to have the broadest possible meaning. Specifically, the phrase “A is connected to B” includes both direct connection (where no intermediate components or elements exist) and indirect connection (where one or more intermediate components or elements exist between A and B). In other words, “A is connected to B” includes both direct physical or electrical connection and indirect connection via one or more intermediate components. Unless otherwise explicitly stated, such terminology does not require direct physical or electrical contact. The terms “connected” and “in contact” should be interpreted in the same manner.

[0028] The terms "first," "second," etc., are used to describe various components, but these components are not limited to these terms. These terms are used simply to distinguish one component from others. Therefore, the first component mentioned below may also be the second component within the technical concepts of this specification.

[0029] The terms "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be interpreted solely as geometric relationships where the relationships between them are perpendicular, but may mean that they have a broader range of directions within which the configuration described herein can function.

[0030] The term "at least one" must be understood to include all possible combinations of one or more related items. For example, "at least one of items 1, 2, and 3" could mean not just each of items 1, 2, or 3 individually, but all possible combinations of items 1, 2, and 3 that can be presented from two or more of them.

[0031] Many of the features of the embodiments described herein can be combined or combined in part or in whole, enabling a variety of technical interdependencies and drives, and each embodiment can be implemented independently of the others or together in a related manner.

[0032] Preferred embodiments of this specification will be described in detail below with reference to the attached drawings.

[0033] Figure 1 is a schematic plan view of a display device according to one embodiment of this specification, Figure 2 is a schematic plan view showing one pixel shown in Figure 1, Figure 3 is a schematic plan view showing the repair section and branch wiring of Figure 2, and Figure 4 is a schematic plan view showing a sub-pixel of a display device according to one embodiment of this specification and a sub-pixel of a display device according to a comparative example.

[0034] In the following, the first direction (Y-axis direction) refers to the vertical direction relative to Figure 1, the second direction (X-axis direction) refers to the horizontal direction relative to Figure 1, and the third direction (Z-axis direction) refers to the thickness direction of the display device 100. The first direction (Y-axis direction) may be the direction aligned with the data wiring DL (see Figure 2). The second direction (X-axis direction) may be the direction aligned with the gate wiring GL (see Figure 2).

[0035] Referring to Figure 1, a display device 100 according to one embodiment of this specification may include a display panel including a gate drive unit GD. The display panel may include a substrate 110 and a counter substrate 200 (see Figure 3) bonded together.

[0036] An example substrate 110 may include a display area DA on which a plurality of pixels P having a plurality of subpixels SP are arranged, and a non-display area NDA arranged around the display area DA. The substrate 110 may further include a first non-emitting area NEA1, a second non-emitting area NEA2, an emitting area EA, and a repair area RPP (or repair structure). The first non-emitting area NEA1, the second non-emitting area NEA2, the emitting area EA, and the repair area RPP may be provided in the display area DA of the substrate 110.

[0037] The first non-emitting region NEA1 and the second non-emitting region NEA2 may each be regions that do not emit light. In contrast, the emitting region EA may be a region that emits light.

[0038] In one example, the first non-emitting region NEA1 is provided on the upper side of the substrate 110 and may be provided inside each of the multiple sub-pixels SP. For example, as shown in Figure 2, the first non-emitting region NEA1 may be provided inside (or between) the emitting regions EA of each of the multiple sub-pixels SP (or the first sub-pixel SP1).

[0039] In one example, each light-emitting region EA of multiple subpixels SP may include a first light-emitting region EA1, a second light-emitting region EA2, and a third light-emitting region EA3. The first light-emitting region EA1 may be connected to the second light-emitting region EA2 via a first connecting portion CP1. The second light-emitting region EA2 may be connected to the third light-emitting region EA3 via a second connecting portion CP2. The first connecting portion CP1 and the second connecting portion CP2 may each be a light-emitting region EA. As shown in Figure 2, in one example, a first non-light-emitting region NEA1 may be located between the first light-emitting region EA1 and the second light-emitting region EA2, and between the second light-emitting region EA2 and the third light-emitting region EA3.

[0040] In one example, the second non-emitting region NEA2 may be connected to the first non-emitting region NEA1. The second non-emitting region NEA2 may be a region located between a plurality of subpixels SP. Thus, the first non-emitting region NEA1 and the second non-emitting region NEA2 may be configured to surround the emitting region EA. Consequently, the emitting region EA may be provided adjacent to each of the first non-emitting region NEA1 and the second non-emitting region NEA2.

[0041] The repair section RPP is designed to prevent the entire light-emitting region EA of each sub-pixel SP from becoming dark due to a short circuit occurring between the wiring (or electrodes) included in the substrate 110.

[0042] For example, the repair section RPP can transmit the laser shock LS (see Figure 6) transmitted from the laser device to the wiring (e.g., data branch wiring BRL1 (see Figure 6)), and thus can cut the wiring (e.g., data branch wiring BRL1 (see Figure 6)) placed on the repair section RPP. Thus, the display device 100 according to one embodiment of this specification can prevent the entire light-emitting area EA of each subpixel SP from becoming dark (or unable to drive or emit light) due to a short circuit between the wiring (e.g., data wiring and scan wiring) (or electrodes).

[0043] In a display device 100 according to one embodiment of this specification, the repair section RPP may be provided in the first non-emitting region NEA1.

[0044] In typical display devices, repair wiring (or repair sections) are not provided inside each of the multiple subpixels (or inside the light-emitting area). This is because providing repair wiring (or repair sections) inside each of the multiple subpixels (or inside the light-emitting area) would reduce the size (or area) of the light-emitting area, thus decreasing the light efficiency. Therefore, in typical display devices, repair wiring (or repair sections) are located outside the light-emitting area.

[0045] In contrast, the display device 100 according to one embodiment of this specification may be equipped with a repair section RPP in the first non-emitting region NEA1 located inside each of the multiple subpixels SP.

[0046] For example, as shown in Figure 4, in the case of a typical display device CDP, the repair section RPP included in a sub-pixel SP is positioned between the light-emitting region EA and the circuit region CA. Therefore, in the case of a typical display device CDP, the circuit region CA is provided with a light-emitting region EA having a first length W1 (or first width W1) and a repair section RPP having a second length W2 (or second width W2).

[0047] In contrast, the display device 100 according to one embodiment of this specification may be configured such that the light-emitting region EA has a third length W3 (or third width W3) by providing a repair section RPP in the first non-light-emitting region NEA1 located inside each of the plurality of sub-pixels SP. The third length W3 (or third width W3) may be the sum of the first length W1 (or first width W1) and the second length W2 (or second width W2).

[0048] Therefore, the display device 100 according to one embodiment of this specification can expand the size (or area) of the light-emitting region EA compared to the display device CDP according to the comparative example, thereby further improving the light efficiency.

[0049] On the other hand, in the case of typical display devices, if non-emitting regions are provided inside each of the multiple subpixels, the light efficiency may decrease.

[0050] However, in the display device 100 according to one embodiment of this specification, by providing a first reflector 121 (see Figure 6) in the first non-emitting region NEA1, light extraction can be performed via the first reflector 121, thus preventing a decrease in light efficiency.

[0051] As a result, even if the first non-emitting region NEA1 is arranged inside each of the multiple subpixels SP, the first reflective portion 121 arranged in the first non-emitting region NEA1 prevents a decrease in light efficiency, and by providing the repair portion RPP in the first non-emitting region NEA1, the size (or area) of the light-emitting region EA can be expanded, thereby improving light efficiency.

[0052] Referring to Figure 1, the display device 100 according to one embodiment of this specification may further include a source drive integrated circuit (IC) 130, a flexible film 140, a circuit board 150, and a timing control unit 160.

[0053] The substrate 110 contains thin-film transistors and may be a transistor array substrate, a lower substrate, a base substrate, or a first substrate. The substrate 110 may be a transparent glass substrate or a transparent plastic substrate.

[0054] The opposing substrate 200 can be bonded to the substrate 110 by an adhesive member. For example, the opposing substrate 200 is smaller in size than the substrate 110 and can be bonded to the remaining portion of the substrate 110 excluding the pad portion. The opposing substrate 200 may be an upper substrate, a second substrate, or a sealing substrate.

[0055] The gate drive unit GD can supply gate signals to the gate wiring in accordance with the gate control signal input from the timing control unit 160. When the source drive IC 130 is manufactured as a drive chip, the source drive IC 130 can be mounted on the flexible film 140 using the COF (chip on film) or COP (chip on panel) method.

[0056] Pads such as power pads and data pads may be formed in the non-display areas of the display panel. Wiring connecting the pads to the source drive IC 130 and wiring connecting the pads to the circuit board 150 may be formed on the flexible film 140. The flexible film 140 is attached to the pads using an anisotropic conducting film, thereby enabling the wiring of the pads to be connected to the flexible film 140.

[0057] Referring to Figure 1, an example substrate 110 may include a display area DA and a non-display area NDA.

[0058] The display area DA is the area where the image is displayed, and may be a pixel array area, an active area, a pixel array section, a display section, or a screen. For example, the display area DA may be located in the central part of the display panel.

[0059] An example display area DA may include gate wiring, data wiring, pixel power wiring, and multiple pixels P. Each of the multiple pixels P may include multiple sub-pixels SP defined by gate wiring and data wiring. Each of the multiple sub-pixels SP can be defined as the smallest unit area from which light is actually emitted.

[0060] For example, at least four subpixels SP, configured to emit different colors from each other and arranged adjacently, constitute a single unit pixel P. A single unit pixel may, but is not limited to, include a red subpixel, a white subpixel, a blue subpixel, and a green subpixel.

[0061] Each of the multiple sub-pixels SP may include a thin-film transistor and an organic light-emitting element connected to the thin-film transistor. The sub-pixel may include an organic light-emitting layer (or light-emitting layer) interposed between the first electrode and the second electrode.

[0062] The organic light-emitting layers arranged in each of the multiple subpixels SP can individually emit different colored light or emit white light in common. For example, if the organic light-emitting layers of each of the multiple subpixels SP emit white light in common, each of the red subpixel, green subpixel, and blue subpixel can include a color filter CF (or wavelength conversion member CF) that converts the white light into different colored light. In this case, the white subpixel in this example does not need to have a color filter. The color filter CF in this example can include a red color filter CF1 (see Figure 2), a blue color filter CF2 (see Figure 2), and a green color filter CF3 (see Figure 2).

[0063] In a display device 100 according to one embodiment of this specification, the area equipped with a red color filter CF1 may be a red sub-pixel SP1, the area equipped with a blue color filter CF2 may be a blue sub-pixel SP3, the area equipped with a green color filter CF3 may be a green sub-pixel SP4, and the area without a color filter may be a white sub-pixel SP2. In this specification, the red sub-pixel SP1 can be expressed as a first sub-pixel configured to emit red light, the blue sub-pixel SP3 can be expressed as a third sub-pixel configured to emit blue light, the green sub-pixel SP4 can be expressed as a fourth sub-pixel configured to emit green light, and the white sub-pixel SP2 can be expressed as a second sub-pixel configured to emit white light.

[0064] Each sub-pixel SP uses a thin-film transistor to supply a predetermined current to the organic light-emitting element based on the data voltage of the data wiring when a gate signal is input from the gate wiring. As a result, the light-emitting layer of each sub-pixel can emit light at a predetermined brightness due to the predetermined current.

[0065] The display area DA may include an emitting area EA and a non-emitting area NEA. The emitting area EA is the area that emits light due to the organic light-emitting element layer E. The non-emitting area NEA is the area that does not transmit most of the light incident from the outside.

[0066] For example, the non-emitting region NEA may be the region excluding the light-emitting region EA. In one example, the non-emitting region NEA may include a circuit region CA (see Figure 2). The circuit region CA may include thin-film transistors 112 for driving each of the multiple subpixels SP (or each of the organic light-emitting layers E of the multiple subpixels SP).

[0067] In a display device 100 according to one embodiment of this specification, the non-emitting region NEA may include a first non-emitting region NEA1 and a second non-emitting region NEA2.

[0068] In one example, the first non-emitting region NEA1 may be located inside each of a plurality of sub-pixels SP. For example, as shown in Figure 2, the inside of each of a plurality of sub-pixels SP may mean the inside of the emission region EA contained within one sub-pixel SP. The first non-emitting region NEA1 does not necessarily have to contain an organic light-emitting element layer E (see Figure 5).

[0069] For example, the second non-emitting region NEA2 may be located outside each of the multiple subpixels SP. For instance, as shown in Figure 2, the outside of each of the multiple subpixels SP may mean the area between the multiple subpixels SP. Thus, the second non-emitting region NEA2 can be distinguished from the first non-emitting region NEA1, which is located between the light-emitting regions EA (e.g., the first light-emitting region EA1 and the second light-emitting region EA2) contained within a single subpixel SP. The outside of each of the multiple subpixels SP, i.e., the second non-emitting region NEA2, may include a circuit region CA adjacent to the light-emitting region EA. Furthermore, the outside of each of the multiple subpixels SP may include a region located between multiple subpixels SP that emit light of different colors (e.g., the respective pixel electrodes 114 of the first subpixel SP1 and the second subpixel SP2 (see Figure 5)).

[0070] Additionally, the non-emitting area (NEA) may contain multiple pixels P and multiple wirings for driving each of the multiple pixels P. For example, the multiple wirings may include multiple first signal lines and multiple second signal lines.

[0071] Multiple first signal lines can extend in a second direction (X-axis direction). Each of the multiple first signal lines can include at least one gate trace GL (or scan trace).

[0072] Multiple second signal lines can extend in the first direction (Y-axis direction). Multiple second signal lines can intersect with multiple first signal lines. Each of the multiple second signal lines may include a pixel power supply line EVDD, multiple data lines DL, and a reference line RL. Multiple data lines DL may include a first data line DL1 for driving a first sub-pixel SP1, a second data line DL2 for driving a second sub-pixel SP2, a third data line DL3 for driving a third sub-pixel SP3, and a fourth data line DL4 for driving a fourth sub-pixel SP4.

[0073] Referring to Figure 1, the non-display area (NDA) is an area where no image is displayed, and may be a peripheral circuit area, a signal supply area, an inactive area, or a bezel area. The non-display area (NDA) may be configured to be located around the display area (DA). That is, the non-display area (NDA) may be positioned to surround the display area (DA).

[0074] A display device 100 according to one embodiment of this specification may include a pad unit PA located in a non-display area NDA. The pad unit PA is for driving a plurality of pixels P. For example, the pad unit PA can supply power and / or signals for the plurality of pixels P provided in the display area DA to output video.

[0075] In one example, the pad section PA may be placed in the non-display area NDA (or first non-display area) above the display area DA, based on Figure 1.

[0076] The gate driver unit GD supplies a gate signal to the gate wiring in accordance with the gate control signal input from the timing control unit 160. The gate driver unit GD may be formed in a GIP (gate driver in panel) manner in one side of the display area DA of the display panel, or in the non-display area NDA on both sides of the display area DA, as shown in Figure 1.

[0077] Multiple gate drive units GD can be arranged separately on the left side of the display area DA, i.e., the second non-display area, and on the right side of the display area DA, i.e., the third non-display area.

[0078] For example, multiple gate drive units GD may be connected to multiple pixels P and multiple first signal lines for supplying signals to each of the multiple pixels P. The multiple first signal lines may include at least one signal line for supplying signals to drive the pixels P.

[0079] Multiple second signal lines may extend in a first direction (Y-axis direction). Multiple second signal lines may include pixel power supply wiring and at least one data wiring DL for supplying data voltage to a pixel P. Each of the multiple second signal lines may be connected to at least one of multiple pads, pixel power supply shorting bars, and common power supply shorting bars. Pixel power supply shorting bars and common power supply shorting bars may be located in a fourth non-display area positioned facing the pad area PA with respect to the display area DA.

[0080] Pixel P is provided so as to overlap with at least one of the first signal line and the second signal line, and emits a predetermined light to display an image. The light-emitting region EA may correspond to the region in pixel P that emits light.

[0081] The non-emitting area (NEA) is a region within the display area (DA) that does not emit light, and can therefore be referred to as a dead zone. A dead zone, for example, may be a region containing a black matrix and / or bank, but is not limited to this; it can also refer to any region that does not emit light.

[0082] In one embodiment of this specification, the display device 100 has a repair section RPP positioned in the first non-emitting region NEA1, which is a dead zone. This expands (or enlarges) the size (or area) of the light-emitting region EA, thereby improving light efficiency and allowing a repair process to be performed via the repair section RPP.

[0083] In a display device 100 according to one embodiment of this specification, the repair portion RPP may be located in the first non-emitting region NEA1. For example, as shown in Figure 3, the light-emitting region EA included in a sub-pixel SP may include a first light-emitting region EA1, a second light-emitting region EA2, and a third light-emitting region EA3 that are sequentially connected in a first direction (Y-axis direction) (or downward direction with respect to Figure 3) via a first connecting portion CP1 and a second connecting portion CP2. Since the organic light-emitting element layer E is also located in each of the first connecting portion CP1 and the second connecting portion CP2, light can be emitted from each of the first connecting portion CP1 and the second connecting portion CP2. Therefore, the light-emitting region EA included in a sub-pixel SP may be a first light-emitting region EA1, a first connecting portion CP1, a second light-emitting region EA2, a second connecting portion CP2, and a third light-emitting region EA3 that are sequentially connected in a first direction (Y-axis direction) (or downward direction with respect to Figure 3).

[0084] On the other hand, the display device 100 according to one embodiment of this specification can prevent the entire light-emitting region EA of each subpixel SP from becoming dark due to foreign matter generated during the manufacturing process. For example, if foreign matter adheres to one or two of the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3, the first connecting portion CP1 (or the second connecting portion CP2) is cut by the laser device, causing the light-emitting region to become dark (e.g., the first light-emitting region EA1), while the remaining light-emitting regions (e.g., the second light-emitting region EA2 and the third light-emitting region EA3) can operate normally (or dimly lit).

[0085] For this reason, in one embodiment of this specification, the width CW (see Figure 2) of the first connecting portion CP1 may be configured to be narrower (or smaller) than the width EW of the first light-emitting region EA1. If the width CW of the first connecting portion CP1 is the same as or larger than the width EW of the first light-emitting region EA1, the wiring connected to the organic light-emitting layer E or the circuit region CA may be damaged during the cutting process in which the laser device cuts the first connecting portion CP1. Therefore, in one embodiment of this specification, the width CW (see Figure 2) of the first connecting portion CP1 of the display device 100 is configured to be smaller than the width EW of the first light-emitting region EA1, thereby preventing damage to the wiring connected to the organic light-emitting layer E or the circuit region CA during the cutting process of the first connecting portion CP1. For this reason, the width of the second connecting portion CP2 may be configured to be the same as the width of the first connecting portion CP1.

[0086] Referring to Figure 3, in one example, the repair section RPP may be located in the first non-emitting region NEA1 provided between the second light-emitting region EA2 and the third light-emitting region EA3. The repair section RPP is intended to prevent the entire light-emitting region EA from becoming dark (or unable to drive or emit light) due to a short circuit between the wiring (or electrodes). Therefore, the repair section RPP may be located near the circuit region CA to cut the wiring connected to the circuit region CA (or the thin-film transistor 112 in the circuit region CA). Thus, the repair section RPP may be provided in the first non-emitting region NEA1 located close to the circuit region CA. For example, as shown in Figure 3, the repair section RPP may be located in the first non-emitting region NEA1 provided between the second light-emitting region EA2 and the third light-emitting region EA3. However, it is not limited to this, and depending on the circuit design, the repair section RPP may be located in the first non-emitting region NEA1 provided between the first light-emitting region EA1 and the second light-emitting region EA2.

[0087] In a display device 100 according to one embodiment of this specification, the substrate 110 may further include data branch wiring BRL1 and reference branch wiring BRL2.

[0088] The data branch wiring BRL1 can be connected to each of the multiple sub-pixels SP. For example, as shown in Figure 3, the data branch wiring BRL1 placed on the first sub-pixel SP can be electrically connected to the circuit region CA (or thin-film transistor 112) and data wiring DL (or first data wiring DL1) of the first sub-pixel SP. Thus, the data branch wiring BRL1 can transmit the data signal (or data voltage) applied from the data wiring DL to the circuit region CA (or thin-film transistor 112).

[0089] The reference branch wiring BRL2 can be separated from the data branch wiring BRL1 and connected to each of the multiple sub-pixels SP. For example, as shown in Figure 3, the reference branch wiring BRL2 located on the first sub-pixel SP can be electrically connected to the circuit region CA (or thin-film transistor 112) and the reference wiring RL of the first sub-pixel SP. Therefore, when the pixel P is in sensing drive mode, the reference branch wiring BRL2 can sense the characteristic change of the thin-film transistor 112 located on the circuit region CA and transmit it to the reference wiring RL.

[0090] On the other hand, in the display device 100 according to one embodiment of this specification, the repair section RPP may include a first repair section RPP1 and a second repair section RPP2.

[0091] In one example, the first repair section RPP1 can be partially superimposed on the data branch wiring BRL1. The first repair section RPP1 is designed to disconnect the data branch wiring BRL1 when a short circuit occurs in the data wiring DL. For example, the first repair section RPP1 can disconnect the data branch wiring BRL1 by transmitting a laser shock LS (see Figure 6) received from a laser device to the data branch wiring BRL1.

[0092] In one embodiment of this specification, the display device 100, after the data branch wiring BRL1 is cut by the first repair section RPP1, connects the pixel electrode 114 located on the sub-pixel SP where the short circuit occurred with the circuit region CA located on another sub-pixel SP (for example, an adjacent sub-pixel SP above, with reference to Figure 3) using welding wiring WDL (see Figure 10) (or welding process), thereby driving the light-emitting region EA of the short-circuited sub-pixel SP together with the light-emitting region EA of the other sub-pixel SP. This will be described later with reference to Figure 10.

[0093] In one example, the second repair section RPP2 can partially overlap the reference branch wiring BRL2. The second repair section RPP2 is designed to cut the reference branch wiring BRL2 when a short circuit occurs in the reference wiring RL. For example, the second repair section RPP2 can cut the reference branch wiring BRL2 by transmitting the laser shock LS received from the laser device to the reference branch wiring BRL2.

[0094] In one embodiment of this specification, the display device 100, after the reference branch wiring BRL2 is cut by the second repair section RPP2, connects the pixel electrode 114 located on the sub-pixel SP where the short circuit occurred with the circuit region CA located on another sub-pixel SP (for example, an adjacent sub-pixel SP above, with reference to Figure 3) by welding wiring WDL (see Figure 10) (or welding process), thereby driving the light-emitting region EA of the short-circuited sub-pixel SP together with the light-emitting region EA of the other sub-pixel SP. This will be described later with reference to Figure 10.

[0095] Therefore, the display device 100 according to one embodiment of this specification can prevent the entire light-emitting area EA of each sub-pixel SP from becoming dark due to a short circuit in the data wiring DL or the reference wiring RL.

[0096] As shown in Figure 3, the first repair section RPP1 and the second repair section RPP2 can each be configured in an island shape. Since the first repair section RPP1 and the second repair section RPP2 each receive laser shock from the laser device, if the first repair section RPP1 and the second repair section RPP2 are connected to other wiring or electrodes, the laser shock may be transmitted to the other wiring or electrodes and cause damage. Therefore, the display device 100 according to one embodiment of this specification can have a structural feature in which the first repair section RPP1 and the second repair section RPP2 each are configured in an island shape.

[0097] On the other hand, referring to Figure 3, each of the data branch wiring BRL1 and the reference branch wiring BRL2 can partially overlap with the light-emitting region EA. Therefore, each of the data branch wiring BRL1 and the reference branch wiring BRL2 can be composed of a transparent conductive material (or transparent wiring). In the bottom light-emitting method, if the data branch wiring BRL1 and the reference branch wiring BRL2 are made of opaque wiring, the light efficiency will decrease because the data branch wiring BRL1 and the reference branch wiring BRL2 emit light in the organic light-emitting layer 116 and block the light emitted towards the substrate 110. Therefore, the display device 100 according to one embodiment of this specification can be equipped with a repair structure that prevents a decrease in light efficiency by having each of the data branch wiring BRL1 and the reference branch wiring BRL2 composed of a transparent conductive material (or transparent wiring).

[0098] In the following sections, the structure of each of the multiple subpixels SP will be specifically described with reference to Figures 5 to 8.

[0099] Figure 5 is a schematic cross-sectional view of the line I-I' shown in Figure 3, Figure 6 is a schematic cross-sectional view of the line II-II' shown in Figure 3, Figure 7 is a schematic cross-sectional view of the line III-III' shown in Figure 3, and Figure 8 is a schematic cross-sectional view of the line IV-IV' shown in Figure 3.

[0100] Referring to Figure 5, a display device 100 according to one embodiment of this specification may include a buffer layer BL, a plurality of inorganic films 111, thin-film transistors 112, a color filter CF (see Figure 8), a planarization layer 113, a pixel electrode 114, a bank 115, an organic light-emitting layer 116, a cathode electrode 117, and a sealing layer 118.

[0101] Each of the subpixels SP in one embodiment may be provided on the upper surface of the buffer layer BL and may include a plurality of inorganic films 111, including a gate insulating layer 111a, an interlayer insulating layer 111b, and a passivation layer 111c.

[0102] Furthermore, each sub-pixel SP may further include a color filter CF (see Figure 8) arranged on a plurality of inorganic films 111, and a planarization layer 113 provided on the color filter CF. The planarization layer 113 may include a first planarization layer 1131 and a second planarization layer 1132. The second planarization layer 1132 may be arranged on the first planarization layer 1131. Pixel electrodes 114 may be arranged on the second planarization layer 1132.

[0103] Each sub-pixel SP may further include a bank 115 covering one end of the pixel electrode 114, an organic light-emitting layer 116 disposed on the pixel electrode 114 and the bank 115, and a cathode electrode 117 disposed on the organic light-emitting layer 116. A sealing layer 118 may be disposed on the reflective electrode 117.

[0104] Multiple inorganic films 111 may have thin-film transistors 112 for driving sub-pixels SP. These multiple inorganic films 111 can also be referred to as circuit element layers.

[0105] The buffer layer BL may be included in multiple inorganic films 111 together with the gate insulating layer 111a, the interlayer insulating layer 111b, and the passivation layer 111c. The pixel electrode 114, the organic light-emitting layer 116, and the reflective electrode 117 may be included in the organic light-emitting layer E.

[0106] A buffer layer BL may be formed between the substrate 110 and the gate insulating layer 111a to protect the thin-film transistor 112. The buffer layer BL may be placed across the entire surface (or front surface) of the substrate 110. The buffer layer BL can also serve to prevent substances contained in the substrate 110 from diffusing into the transistor layer during high-temperature processes in the manufacturing of the thin-film transistor.

[0107] An example thin-film transistor (or driving transistor) 112 may include an active layer 112a, a gate electrode 112b, a source electrode 112c, and a drain electrode 112d.

[0108] The active layer 112a may include a channel region, a drain region, and a source region formed in the thin-film transistor region of the circuit region CA of the subpixel SP. The drain region and the source region may be adjacent to each other and separated by the channel region.

[0109] The active layer 112a may be composed of a semiconductor material based on one of the following: amorphous silicon, polycrystalline silicon, oxide, or organic material.

[0110] The gate insulating layer 111a may be formed on the channel region of the active layer 112a. For example, the gate insulating layer 111a may be formed in an island-like manner only on the channel region of the active layer 112a, or it may be formed on the entire front surface of the substrate 110 containing the active layer 112a or the buffer layer BL.

[0111] The gate electrode 112b may be formed on the gate insulating layer 111a so as to overlap with the channel region of the active layer 112a.

[0112] The interlayer insulating layer 111b may be formed partially superimposed on the drain region and source region of the gate electrode 112b and the active layer 112a. The interlayer insulating layer 111b may also be formed over the entire light-emitting region in the circuit region CA and sub-pixel SP, as shown in Figure 3.

[0113] The source electrode 112c can be electrically connected to the source region of the active layer 112a via a source contact hole provided in the interlayer insulating layer 111b that overlaps with the source region of the active layer 112a.

[0114] The drain electrode 112d can be electrically connected to the drain region of the active layer 112a via a drain contact hole provided in the interlayer insulating layer 111b that superimposes the drain region of the active layer 112a.

[0115] The drain electrode 112d and the source electrode 112c may each be made of the same metallic material. For example, the drain electrode 112d and the source electrode 112c may each be made of the same or different single metallic layer, single alloy layer, or multiple layers of two or more layers as the gate electrode.

[0116] Additionally, thin-film transistors provided in the pixel region may have a characteristic where the threshold voltage shifts due to light. To prevent this, the display panel or substrate 110 may further include a light-shielding layer (not shown) provided beneath at least one active layer 112a of the thin-film transistor 112, the first switching thin-film transistor, and the second switching thin-film transistor.

[0117] The light-shielding layer is provided between the substrate 110 and the active layer 112a, and by blocking light incident on the active layer 112a side through the substrate 110, the threshold voltage change of the transistor due to external light can be minimized. In addition, by providing the light-shielding layer between the substrate 110 and the active layer 112a, the thin-film transistor can also be prevented from being seen by the user.

[0118] The passivation layer 111c may be provided on the substrate 110 so as to cover the pixel area. The passivation layer 111c covers the drain electrode 112d and source electrode 112c, gate electrode 112b, and buffer layer BL of the thin-film transistor 112.

[0119] A color filter CF (see Figure 8) may be placed on the passivation layer 111c. For example, the color filter CF may be placed between a plurality of inorganic films 111 and the first planarization layer 131. The color filter CF may include a red color filter CF1 placed on a red subpixel SP1, a blue color filter CF2 placed on a blue subpixel SP3, and a green color filter CF3 placed on a green subpixel SP4. A white subpixel SP2 is configured to emit white light and therefore does not need to include a color filter.

[0120] The planarization layer 113 may be provided on the substrate 110 so as to cover the passivation layer 111c and the color filter CF. In one example, the planarization layer 113 may be placed between the substrate 110 and the pixel electrode 114. The planarization layer 113 may be formed over the circuit region CA where the thin-film transistor 112 is located, and over the light-emitting region EA. Alternatively, the planarization layer 113 may be formed over the non-display region NDA excluding the pad portion PA, and over the display region DA. For example, the planarization layer 113 may include an extension (or expansion) that extends or expands from the display region DA towards the non-display region NDA excluding the pad portion PA. Therefore, the planarization layer 113 can have a size that is relatively larger than the display region DA.

[0121] In one example, the planarization layer 113 is formed to have a relatively thick surface, and can provide a flat surface on the display area DA and the non-display area NDA. For example, the planarization layer 113 may be made of an organic material such as photoacrylic, benzocyclobutene, polyimide, or fluororesin.

[0122] The planarization layer 113 may include a first planarization layer 1131 and a second planarization layer 1132 disposed on the first planarization layer 1131. The first planarization layer 1131 may be disposed on the substrate 110. The second planarization layer 1132 may be disposed on the first planarization layer 1131. In one example, the second planarization layer 1132 may be partially disposed between the first planarization layer 1131 and the pixel electrode 114.

[0123] The first planarization layer 1131 is configured to cover the passivation layer 111c and the color filter CF, and can therefore be formed continuously across multiple subpixels SP. In contrast, the second planarization layer 1132 can be formed discontinuously. For example, the second planarization layer 1132 can be formed discontinuously by creating a patterned portion (or first patterned portion) in which the second planarization layer 1132 of the first non-emitting region NEA1 is partially removed. Therefore, as shown in Figure 6, multiple second planarization layers 1132 can be configured in an island-like manner on the first planarization layer 1131. However, it is not limited to this, and the second planarization layer 1132 may be formed continuously.

[0124] Referring to Figure 6, the upper surface 1132a of the second planarization layer 1132 can be configured to be flat. Therefore, the pixel electrode 114 on the second planarization layer 1132 can also be configured to be flat, and the organic light-emitting layer 116 and reflective electrode 117 formed thereon can also be configured to be flat. By providing the pixel electrode 114, the organic light-emitting layer 116, and the reflective electrode 117, i.e., the organic light-emitting layer E, flatly in the light-emitting region EA, the thickness of each of the pixel electrode 114, the organic light-emitting layer 116, and the reflective electrode 117 can be formed uniformly within the light-emitting region EA. Therefore, the organic light-emitting layer 116 can emit light uniformly without deviation within the light-emitting region EA.

[0125] The pixel electrode 114 may be formed on the second planarization layer 1132. As shown in Figure 5, the pixel electrode 114 can be connected to the drain or source electrode of a thin-film transistor via a contact hole that penetrates the first planarization layer 1131 and the passivation layer 111c. Both side edges of the pixel electrode 114 may be covered by a bank 115. Since Figure 5 is a cross-sectional view in the first direction (Y-axis direction), with respect to a plane (e.g., Figure 3), the bank 115 may be configured to cover the upper and lower edges of the pixel electrode 114, respectively. On the other hand, the bank 115 does not have to be positioned between a plurality of sub-pixels SP. Thus, the display device 100 according to one embodiment of this specification may be configured as a bankless structure in which the bank 115 is not positioned between a plurality of sub-pixels SP arranged in the second direction (X-axis direction).

[0126] The pixel electrode 114 may consist of at least one of a transparent metallic material and a semi-transparent metallic material.

[0127] Since the display device 100 according to one embodiment of this specification is configured as a bottom-emitting type, the pixel electrodes 114 may be formed of a transparent conductive material (TCO) such as ITO or IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0128] On the other hand, the material forming the pixel electrode 114 may include MoTi. Such a pixel electrode 114 can be referred to as the first electrode or anode electrode.

[0129] Bank 115 is a non-emitting region and can be located adjacent to the light-emitting region EA of each of the multiple subpixels SP. For example, Bank 115 can be located in the non-light-emitting region NEA (or a second non-light-emitting region NEA2 located above or below the pixel electrode 114). Bank 115 can cover the edge of the pixel electrode 114. Thus, Bank 115 can prevent the pixel electrode 114 and the reflective electrode 117 from contacting each other at the edge of the pixel electrode 114. The exposed portion of the pixel electrode 114 that is not obscured by Bank 115 may be included in the light-emitting portion (or light-emitting region EA).

[0130] After the bank 115 is formed, the organic light-emitting layer 116 may be formed to cover the pixel electrode 114 and the bank 115. Thus, the bank 115 may be partially located between the pixel electrode 114 and the organic light-emitting layer 116. Such a bank 115 can be referred to as a pixel-defining film. An example bank 115 may contain organic and / or inorganic materials.

[0131] The organic light-emitting layer 116 may be formed on the pixel electrodes 114 and the bank 115. The organic light-emitting layer 116 may be located beneath the reflective electrode 117. In one example, the organic light-emitting layer 116 may be located in the light-emitting region EA and the non-light-emitting region NEA (or the first non-light-emitting region NEA1 and the second non-light-emitting region NEA2). Since the organic light-emitting layer 116 is provided between the pixel electrode 114 and the reflective electrode 117, when a voltage is applied to the pixel electrode 114 and the reflective electrode 117, an electric field is formed between the pixel electrode 114 and the reflective electrode 117, allowing the organic light-emitting layer 116 to emit light. The organic light-emitting layer 116 may be formed as a common layer provided on a plurality of sub-pixels SP and the bank 115.

[0132] An example of an organic light-emitting layer 116 may be configured to emit white light. The organic light-emitting layer 116 may include multiple stacks that emit light of different hues. For example, the organic light-emitting layer 116 may include a first stack, a second stack, and a charge generation layer (CGL) provided between the first and second stacks. By being configured to emit white light, each of the multiple subpixels SP may include a color filter CF corresponding to that color.

[0133] The first stack may be provided on the pixel electrode 114 and may have a structure in which a hole injection layer (HIL), a hole transport layer (HTL), a blue light emission layer (EML(B)), and an electron transport layer (ETL) are stacked in that order.

[0134] The charge generation layer plays the role of supplying charge to the first and second stacks. The charge generation layer may include an N-type charge generation layer for supplying electrons to the first stack and a P-type charge generation layer for supplying holes to the second stack. The N-type charge generation layer may contain a metallic material as a dopant.

[0135] The second stack may be provided on top of the first stack and may have a structure in which a hole transport layer (HTL), a yellow-green (YG) emitting layer (EML(YG)), an electron transport layer (ETL), and an electron injection layer (EIL) are stacked in that order.

[0136] In one embodiment of this specification, the display device 100 includes an organic light-emitting layer 116 as a common layer, so that the first stack, charge generation layer, and second stack can be arranged across the entirety of a plurality of subpixels SP. In other examples, the organic light-emitting layer 116 may be configured as a 3-stack or 4-stack structure depending on the number of stacks that are stacked.

[0137] The reflective electrode 117 may be formed on the organic light-emitting layer 116. The reflective electrode 117 may be placed in the non-display area NDA (or a part of the non-display area NDA) and the display area DA. In the display area DA, the reflective electrode 117 may be placed in the light-emitting area EA and the non-light-emitting area NEA (or the first non-light-emitting area NEA1 and the second non-light-emitting area NEA2). That is, the reflective electrode 117 may be configured to cover the entire display area DA. Consequently, the reflective electrode 117 may be configured to be larger than the display area DA and smaller than the substrate 110, thereby being placed in the non-display area NDA (or a part of the non-display area NDA) and the display area DA.

[0138] The reflective electrode 117 in one example may include a metallic material. The cathode electrode 117 can reflect light emitted from the organic light-emitting layer 116, which is arranged in a plurality of subpixels SP, to the lower surface of the substrate 110. Thus, the display device 100 according to one embodiment of this specification can be realized as a bottom-emitting type display device.

[0139] The display device 100 according to one embodiment of this specification is a bottom-emitting type, and since the light emitted from the organic light-emitting layer 116 must be reflected towards the substrate 110, the reflective electrode 117 may be made of a highly reflective metallic material. In one example, the reflective electrode 117 may be formed of a highly reflective metallic material such as silver (Ag), aluminum (Al), a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an Ag alloy, and a laminated structure of Ag alloy and ITO (ITO / Ag alloy / ITO). The Ag alloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu). Such a reflective electrode 117 can be referred to as a second electrode, a counter electrode, or a cathode electrode.

[0140] A sealing layer 118 is formed on the reflective electrode 117. The sealing layer 118 prevents oxygen or moisture from penetrating the organic light-emitting layer 116 and the reflective electrode 117. The sealing layer 118 may consist of multiple layers, each containing at least one inorganic film and at least one organic film. To enhance the moisture-preventing effect, the sealing layer 118 may further contain an absorbent material for absorbing moisture and oxygen. For example, the absorbent material may be a getter.

[0141] On the other hand, as shown in Figure 5, the sealing layer 118 can be placed not only in the light-emitting region EA but also in the non-light-emitting region NEA. The sealing layer 118 can be placed between the reflective electrode 117 and the opposing substrate 200.

[0142] In a display device 100 according to one embodiment of this specification, the second planarization layer 1132 may be configured to have the same refractive index as the first planarization layer 1131. In this case, the light emitted by the organic light-emitting layer 116 toward the substrate 110 does not refract at the interface between the first planarization layer 1131 and the second planarization layer 1132 and can be emitted to the outside of the substrate 110. However, the invention is not limited to this, and the first planarization layer 1131 may be configured to have a different refractive index than the second planarization layer 1132. In this case, the light emitted by the organic light-emitting layer 116 toward the substrate 110 can be refracted at the interface between the second planarization layer 1132 and the first planarization layer 1131 and emitted to the outside of the substrate 110. Hereinafter, the case in which the second planarization layer 1132 has the same refractive index as the first planarization layer 1131 will be described as an example.

[0143] Referring to Figures 6 and 7, the display device 100 according to one embodiment of this specification may further include a first reflective section 121 and a second reflective section 122.

[0144] Referring to Figure 6, the first reflector 121 may be positioned diagonally in the first non-emitting region NEA1. In one example, the first reflector 121 may be positioned on the second planarization layer 1132 (or the inclined surface 1132b of the second planarization layer 1132) located in the first non-emitting region NEA1. As shown in Figure 6, since the inclined surface 1132b of the second planarization layer 1132 is configured diagonally, the first reflector 121 positioned on the inclined surface 1132b of the second planarization layer 1132 may be positioned diagonally.

[0145] The first reflective portion 121 is made of a material that can reflect light, so that the light emitted in the light-emitting region EA and waveguided can be reflected to the light-emitting sub-pixel SP. The first reflective portion 121 may be formed in accordance with the profile of the first pattern portion formed in a concave shape in the first non-light-emitting region NEA1. As shown in Figure 6, the first reflective portion 121 is part of the reflective electrode 117 located in the first non-light-emitting region NEA1, and can therefore be denoted by the drawing reference numeral 117'.

[0146] As shown in Figure 6, the first reflector 121 may be positioned diagonally in the first non-emitting region NEA1. Therefore, the first reflector 121 can be described as an inner reflector or an inner inclined reflector, which is positioned inside each of the multiple subpixels SP.

[0147] Therefore, the display device 100 according to one embodiment of this specification is configured such that a reflector (or first reflector 121) is placed in a non-emitting region NEA (or first non-emitting region NEA1) provided inside each of a plurality of subpixels SP, thereby enabling light extraction even in the non-emitting region NEA (or first non-emitting region NEA1), and thus improving light efficiency.

[0148] Referring to Figure 7, in one example, the second reflector 122 may be positioned diagonally in the second non-emitting region NEA2. The second reflector 122 can be positioned diagonally by being placed on the inclined surface 1132b of the second planarization layer 1132 of the second non-emitting region NEA2. The second reflector 122 is made of a material that can reflect light, so that it can reflect the light emitted in the emission region EA and waveguided towards the emission region EA side of the subpixel SP that emits light. The second reflector 122 may be formed in correspondence with the profile of a concave pattern portion (or second pattern portion) formed in the second non-emitting region NEA2. As shown in Figure 7, the second reflector 122 is part of the reflective electrode 117 positioned in the second non-emitting region NEA2, and can therefore be denoted by the drawing reference numeral 117''.

[0149] Since the second reflector 122 is positioned diagonally in the second non-emitting region NEA2, it can be described as an outer reflector or an outer oblique reflector, positioned outside each of the multiple subpixels SP.

[0150] Therefore, the display device 100 according to one embodiment of this specification is configured such that a reflective section (or second reflective section 122) is placed in a non-emitting region NEA (or second non-emitting region NEA2) provided outside a plurality of sub-pixels SP. This allows the reflective section (or second reflective section 122) to reflect light directed toward adjacent sub-pixels SP, thereby maximizing light extraction efficiency while preventing color mixing.

[0151] As a result, the display device 100 according to one embodiment of this specification can extract light even in the non-emitting area (NEA) by the reflective parts (or first reflective part 121 and second reflective part 122) provided on the inside and outside of each of the multiple subpixels SP. Therefore, compared to a display device that does not have reflective parts on the inside and outside of each of the multiple subpixels, it can have the same luminous efficiency at low power or even an improved luminous efficiency, thereby reducing overall power consumption.

[0152] On the other hand, in the display device 100 according to one embodiment of this specification, a portion of the light emitted by the organic light-emitting layer 116 can be emitted to the outside of the substrate 110 by the first reflector 121 and the second reflector 122. Therefore, the light reflected by the first reflector 121 and the second reflector 122 and emitted towards the substrate 110 can be defined as reflected light EL.

[0153] For example, as shown in Figure 6, a portion of the light emitted by the organic light-emitting layer 116 can be reflected by the first reflector 121 provided in the first non-light-emitting region NEA1 and emitted outside the substrate 110. Therefore, the reflected light EL that is reflected and emitted by the first reflector 121 of the first non-light-emitting region NEA1 can be defined as the first reflected light EL1.

[0154] In contrast, as shown in Figure 7, a portion of the light emitted by the organic light-emitting layer 116 can be reflected by the second reflector 122 provided in the second non-light-emitting region NEA2 and emitted outside the substrate 110. Therefore, the reflected light EL that is reflected and emitted by the second reflector 122 of the second non-light-emitting region NEA2 can be defined as the second reflected light EL2.

[0155] As a result, the display device 100 according to one embodiment of this specification can improve light efficiency because the light that would otherwise be extinguished by the waveguide can be reflected by the first reflector 121 of the first non-emitting region NEA1 and emitted as first reflected light EL1, and the light that would otherwise be extinguished by the waveguide can be reflected by the second reflector 122 of the second non-emitting region NEA2 and emitted as second reflected light EL2.

[0156] Referring also to Figure 6, in a display device 100 according to one embodiment of this specification, the data branch wiring BRL1 may be arranged on the first repair section RPP1.

[0157] During the repair process, the laser device can apply a laser shock LS from the bottom of the substrate 110 towards the inside of the substrate 110, for example, to the first repair section RPP1 (or data branch wiring BRL1). However, if the first repair section RPP1 is not present, the laser shock LS may affect not only the data branch wiring BRL1 but also the reflective electrode 117 located on the data branch wiring BRL1, potentially damaging (or cracking) the reflective electrode 117. Therefore, in one embodiment of this specification, the display device 100 is configured such that the data branch wiring BRL1 is located on the first repair section RPP1, allowing the laser device to cut only the data branch wiring BRL1 while preventing damage (or cracking) to the reflective electrode 117 during the repair process.

[0158] For these reasons, the display device 100 according to one embodiment of this specification may be configured such that the reference branch wiring BRL2 is located on the second repair section RPP2.

[0159] On the other hand, the data branch wiring BRL1 and the reference branch wiring BRL2 can each be positioned closer to the substrate 110 than the reflective electrode 117. Therefore, during the repair process, the laser impact LS from the laser device can have a long wavelength. If the laser impact LS has a short wavelength, it may penetrate deeply into the substrate 110 and damage the organic light-emitting element layer E (e.g., the pixel electrode 114). Therefore, the display device 100 according to one embodiment of this specification can cut the data branch wiring BRL1 and the reference branch wiring BRL2, respectively, and prevent damage to the organic light-emitting element layer E by using a long-wavelength laser impact LS in the repair process for each of the data branch wiring BRL1 and the reference branch wiring BRL2. In this specification, the laser impact LS using a long wavelength can be defined as the first laser impact LS1 (see Figure 6).

[0160] On the other hand, the width RW of the repair section RPP (e.g., the first repair section RPP1) can be configured to be narrower than the width NW of the first non-emitting region NEA1. If the width RW of the repair section RPP (e.g., the first repair section RPP1) is the same as or greater than the width NW of the first non-emitting region NEA1, the light reflected by the first reflecting section 121 will be blocked by the repair section RPP (e.g., the first repair section RPP1) and will not be able to exit to the outside of the substrate 110. Therefore, the display device 100 according to one embodiment of this specification can have a repair structure while preventing a decrease in light extraction efficiency by configuring the width RW of the repair section RPP (e.g., the first repair section RPP1) to be narrower than the width NW of the first non-emitting region NEA1.

[0161] A display device 100 according to one embodiment of this specification may include a color filter CF provided between the repair section RPP and the reflective electrode 117. For example, as shown in Figure 6, a blue color filter CF2 may be placed between the repair section RPP and the reflective electrode 117. Thus, the blue color filter CF2 can prevent the laser shock LS from reaching the reflective electrode 117 during the repair process. In other words, the blue color filter CF2 can have a barrier function that reduces the laser shock LS.

[0162] As shown in Figure 3, the blue subpixel SP3 on which the blue color filter CF2 is located may be located adjacent to the white subpixel SP2. Therefore, when forming the blue color filter CF2 on the blue subpixel SP3, the blue color filter CF2 can be easily formed between the repair portion RPP and the reflective electrode 117 without any additional steps by also forming the blue color filter CF on the first non-emitting region NEA1 of the white subpixel SP2. Thus, the display device 100 according to one embodiment of this specification may have a structural feature in which the blue color filter CF2 is located not only on the blue subpixel SP3 but also on the first non-emitting region NEA1 of the white subpixel SP2 (or the first non-emitting region NEA1 of the white subpixel SP2 with the repair portion RPP).

[0163] Although the blue color filter CF2 has been described above as reducing the laser impact LS, the invention is not limited to this. Any other color filter or material that can reduce (or absorb) the laser impact LS may be placed between the repair section RPP and the reflective electrode 117. For example, a red color filter CF1 or a green color filter CF3 may be placed between the repair section RPP and the reflective electrode 117. Alternatively, a material forming a bank 115 may be placed between the repair section RPP and the reflective electrode 117.

[0164] Referring to Figure 6, in the display device 100 according to one embodiment of this specification, the width CFW of the color filter CF (or blue color filter CF2) provided between the repair section RPP and the reflective electrode 117 may be wider (or larger) than the width RW of the repair section RPP. As mentioned above, the color filter CF (or blue color filter CF2) is for reducing (or absorbing) the laser shock LS. Therefore, if the width CFW of the color filter CF (or blue color filter CF2) provided between the repair section RPP and the reflective electrode 117 is the same as or narrower than the width RW of the repair section RPP, the laser shock LS may affect the reflective electrode 117 and damage it. Accordingly, in the display device 100 according to one embodiment of this specification, by configuring the width CFW of the color filter CF (or blue color filter CF2) provided between the repair section RPP and the reflective electrode 117 to be wider than the width RW of the repair section RPP, damage to the reflective electrode 117 can be prevented during the repair process.

[0165] Furthermore, as shown in Figure 6, if the width CFW of the color filter CF (or blue color filter CF2) provided between the repair section RPP and the reflective electrode 117 is wider (or larger) than the width RW of the repair section RPP, the light reflected by the first reflective section 121 can pass through the blue color filter CF2 and be emitted to the outside of the substrate 110. Therefore, in the display device 100 according to one embodiment of this specification, blue light can be emitted in the first non-emitting region NEA1 of the white sub-pixel SP2, so the image output from the substrate 110 can have a bluish color feel. Thus, the display device 100 according to one embodiment of this specification can satisfy the demands of users who desire a bluish color feel (or a cool color feel).

[0166] In one embodiment of this specification, the display device 100 is provided with a red color filter CF1 between the repair section RPP and the reflective electrode 117, so that red light can be emitted in the first non-emitting region NEA1 of the white sub-pixel SP2. As a result, the image output via the substrate 110 can have a yellowish color (or warm color) appearance. In this case, the user's requirement for a yellowish color (or warm color) appearance can be met.

[0167] As a result, the display device 100 according to one embodiment of this specification can realize a color perception that matches the color coordinates requested by the user by providing one of the various color filters CF in the first non-emitting region NEA1 of the white sub-pixel SP2.

[0168] Figure 8 is a schematic cross-sectional view of the IV-IV' line shown in Figure 3, and shows the cross-sectional view of the red subpixel SP1 in the first direction (Y-axis direction).

[0169] The cross-sectional view of the red sub-pixel SP1 in the first direction (Y-axis direction) is the same as the cross-sectional view of the white sub-pixel SP2 in the first direction (Y-axis direction) shown in Figure 6 above, except that the red color filter CF1 is arranged throughout the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3, and the reference branch wiring BRL2 is arranged on the second repair section RPP2.

[0170] Referring to Figure 8, in the red sub-pixel SP1, the red color filter CF1 is positioned between the repair section RPP and the reflective electrode 117, so that red light can be emitted in the first non-emitting region NEA1 of the red sub-pixel SP1. Therefore, in the display device 100 according to one embodiment of this specification, red light can be emitted even in the first non-emitting region NEA1 of the red sub-pixel SP1 by the first reflective section 121 and the red color filter CF1, so that even if the first non-emitting region NEA1 is provided inside the red sub-pixel SP1, the light extraction efficiency of red light can not be reduced.

[0171] On the other hand, in the red sub-pixel SP1, a red color filter CF1 is placed between the second repair section RPP2 and the reflective electrode 117. Therefore, during the repair process that cuts the reference branch wiring BRL2, the red color filter CF1 can have a barrier function that reduces the laser shock LS.

[0172] Figure 9 is a schematic cross-sectional view of the line V-V' shown in Figure 3.

[0173] Referring to Figure 9, in one embodiment of this specification, the display device 100 may be configured such that the width RW of the first repair section RPP1 is wider than the width BW of the data branch wiring BRL1. If the width RW of the first repair section RPP1 is the same as or narrower than the width BW of the data branch wiring BRL1, the first repair section RPP1 may not be able to receive sufficient laser impact from the laser device, and the data branch wiring BRL1 may not be cut. Therefore, in one embodiment of this specification, the display device 100 is configured such that the width RW of the first repair section RPP1 is wider than the width BW of the data branch wiring BRL1, so that the first repair section RPP1 can sufficiently deliver laser impact to the data branch wiring BRL1 during the repair process, and the data branch wiring BRL1 can be easily cut. For this reason, the display device 100 in one embodiment of this specification may have a structural feature in which the width RW' of the second repair section RPP2 is wider than the width BW' of the reference branch wiring BRL2.

[0174] Referring to Figure 9, the second connecting portion CP2 may be positioned between the first repair portion RPP1 and the second repair portion RPP2.

[0175] In one embodiment of the display device 100 described herein, if foreign matter adheres to one or two of the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3, the first connecting portion CP1 or the second connecting portion CP2 is cut by a laser device, causing the light-emitting region to become dark (e.g., the first light-emitting region EA1), while the remaining light-emitting regions (e.g., the second light-emitting region EA2 and the third light-emitting region EA3) can operate normally (or dimly lit). Therefore, in order to prevent damage to the wiring arranged around the second connecting portion CP2 (or first connecting portion CP1) during the repair process of cutting the second connecting portion CP2 (or first connecting portion CP1), the width CW of the second connecting portion CP2 (or first connecting portion CP1) may be configured to be narrower than the width EW of the light-emitting region EA. Therefore, as shown in Figure 9, the display device 100 according to one embodiment of this specification may have a structural feature in which the second connecting portion CP2 is positioned between the first repair portion RPP1 and the second repair portion RPP2.

[0176] Since the second connecting portion CP2 connects the second light-emitting region EA2 and the third light-emitting region EA3, it can have the same structure as the second light-emitting region EA2 and the third light-emitting region EA3, respectively. Therefore, as shown in Figure 9, the second connecting portion CP2 can include an organic light-emitting layer E comprising a pixel electrode 114, an organic light-emitting layer 116, and a reflective electrode 117. Accordingly, the pixel electrode 114 included in the second connecting portion CP2 can be denoted by the drawing reference numeral 114'. Similarly, the pixel electrode 114 included in the first connecting portion CP1 can also be denoted by the drawing reference numeral 114'.

[0177] On the other hand, as shown in Figure 3, the first connecting portion CP1 may be positioned further away from the circuit region CA than the second connecting portion CP2. This is because the first connecting portion CP1 is for connecting the first light-emitting region EA1 and the second light-emitting region EA2, which are positioned further away from the circuit region CA than the third light-emitting region EA3. Therefore, the first connecting portion CP1 does not need to be positioned between the first repair portion RPP1 and the second repair portion RPP2.

[0178] Referring also to Figure 9, in a display device 100 according to one embodiment of this specification, the first repair section RPP1 or the second repair section RPP2 may be arranged at a distance of a first distance from the second connecting section CP2. For example, the first repair section RPP1 may be arranged at a distance of a first distance D1 from the second connecting section CP2. The second repair section RPP2 may be arranged at a distance of a first distance D1' from the second connecting section CP2. The first distance D1 (or first distance D1') may be the minimum distance that does not affect the first repair section RPP1 (or second repair section RPP2) during the cutting process of the second connecting section CP2. As shown in Figure 9, a data branch wiring BRL1 may be arranged on the first repair section RPP1, and a reference branch wiring BRL2 may be arranged on the second repair section RPP2. Therefore, if the first repair section RPP1 or the second repair section RPP2 is positioned at a distance less than the first distance from the second connecting section CP2, the laser shock may be transmitted to the first repair section RPP1 or the second repair section RPP2, potentially damaging the data branch wiring BRL1 or the reference branch wiring BRL2. Thus, the display device 100 according to one embodiment of this specification may have a structural feature in which the first repair section RPP1 or the second repair section RPP2 is positioned at a distance of the first distance from the second connecting section CP2.

[0179] The second connection section CP2 can be cut by the laser impact LS of the laser device. Therefore, if the first repair section RPP1 (or the second repair section RPP2) is positioned closer to the second connection section CP2 than the first distance D1 (or the first distance D1'), the data branch wiring BRL1 and / or the reference branch wiring BRL2 may be cut by the laser impact LS. If the data branch wiring BRL1 and / or the reference branch wiring BRL2 are cut, the entire light-emitting region EA connected to the data branch wiring BRL1 and / or the reference branch wiring BRL2 cannot be driven.

[0180] Therefore, in the display device 100 according to one embodiment of this specification, the first repair section RPP1 or the second repair section RPP2 is positioned at a distance of a first distance from the second connecting section CP2 in a second direction (X-axis direction), thereby preventing damage to the data branch wiring BRL1 and / or reference branch wiring BRL2 during the repair process (or cutting process) of the second connecting section CP2.

[0181] On the other hand, as shown in Figure 9, the second connecting portion CP2 may be positioned further away from the substrate 110 than the first repair portion RPP1 (or second repair portion RPP2) in the third direction (Z-axis direction). Therefore, during the repair process, the laser impact LS from the laser device can have a short wavelength. This is because if the laser impact LS has a short wavelength, it can penetrate deeply into the inside of the substrate 110. Therefore, in one embodiment of this specification, the display device 100 can cut the second connecting portion CP2 by using a short-wavelength laser impact LS in the repair process (or cutting process) of the second connecting portion CP2. In this specification, a laser impact LS using a short wavelength can be defined as the second laser impact LS2 (see Figure 9).

[0182] Referring to Figure 9, the data wiring DL (e.g., the second data wiring DL2) can be positioned in the first non-emitting region NEA1 at a distance of a second distance D2 from the first repair section RPP1. The second distance D2 may be the minimum distance that does not affect the data wiring DL during the cutting process of the data branch wiring BRL1 using the first repair section RPP1.

[0183] The data branch wiring BRL1 can be cut by the laser impact LS of the laser device from the first repair unit RPP1. Therefore, if the data wiring DL (for example, the second data wiring DL2) is positioned closer to the first repair unit RPP1 than the second distance D2, the data wiring DL may be cut by the laser impact LS. If the data wiring DL is cut, the entire light-emitting region EA connected to the cut data wiring DL cannot be driven.

[0184] Therefore, in the display device 100 according to one embodiment of this specification, the data wiring DL (for example, the second data wiring DL2) is arranged in the first non-emitting region NEA1 at a distance of a second distance D2 from the first repair section RPP1, thereby preventing damage to the data wiring DL during the repair process (or cutting process) of the data branch wiring BRL1 using the first repair section RPP1.

[0185] For these reasons, the display device 100 according to one embodiment of this specification may be configured such that the reference wiring RL is located in the first non-emitting region NEA1 at a distance of a second distance D2' from the second repair portion RPP2.

[0186] Referring to Figure 9, a display device 100 according to one embodiment of this specification may be configured such that a color filter CF (e.g., a blue color filter CF2) is superimposed on the second connecting portion CP2, the first repair portion RPP1, and the second repair portion RPP2. For example, as shown in Figure 9, the color filter CF (e.g., a blue color filter CF2) may be configured to cover the first repair portion RPP1 and the second repair portion RPP2 between the second connecting portion CP2 and the substrate 110.

[0187] As described above, the display device 100 according to one embodiment of this specification can prevent the entire light-emitting area EA of each sub-pixel SP from becoming dark due to a short circuit occurring between the wirings included in the substrate 110. For example, when a short circuit occurs between the wirings, the data branch wiring BRL1 or the reference branch wiring BRL2 can be cut by the laser impact LS (or first laser impact LS1) transmitted to the repair unit RPP, thereby preventing the entire light-emitting area EA from becoming dark. Furthermore, the display device 100 according to one embodiment of this specification can prevent the entire light-emitting area EA of each sub-pixel SP from becoming dark due to foreign matter generated during the manufacturing process. For example, the first connecting part CP1 (or second connecting part CP2) can be cut by the laser impact LS (or second laser impact LS2) of the laser device, thereby preventing the entire light-emitting area EA from becoming dark.

[0188] Therefore, in the display device 100 according to one embodiment of this specification, the color filter CF (e.g., blue color filter CF2) is configured to overlap the second connecting portion CP2, the first repair portion RPP1, and the second repair portion RPP2, so that the color filter CF (e.g., blue color filter CF2) acts as a barrier to reduce the laser impact LS, and prevents the reflective electrode 117 from being damaged (or cut) by the laser impact LS.

[0189] Figure 10 is a schematic plan view showing two pixels of a display device according to one embodiment of this specification.

[0190] Referring to Figure 10, the multiple pixels P may include a first pixel P1 and a second pixel P2. For example, the second pixel P2 may be located above the first pixel P1 in the first direction (Y-axis direction).

[0191] The first pixel P1 may include a first sub-pixel SP1, a second sub-pixel SP2, a third sub-pixel SP3, and a fourth sub-pixel SP4 arranged sequentially in the second direction (X-axis direction). For example, the first sub-pixel SP1 may be a red sub-pixel, the second sub-pixel SP2 may be a white sub-pixel, the third sub-pixel SP3 may be a blue sub-pixel, and the fourth sub-pixel SP4 may be a green sub-pixel.

[0192] The second pixel P2 may contain other first subpixels SP1', other second subpixels SP2', other third subpixels SP3', and other fourth subpixels SP4' arranged sequentially in the second direction (X-axis direction). For example, the other first subpixel SP1' may be a red subpixel, the other second subpixel SP2' may be a white subpixel, the other third subpixel SP3' may be a blue subpixel, and the other fourth subpixel SP4' may be a green subpixel.

[0193] Therefore, the other first sub-pixel SP1' of the second pixel P2 may be located above the first sub-pixel SP1 of the first pixel P1 in the first direction (Y-axis direction). The other second sub-pixel SP2' of the second pixel P2 may be located above the second sub-pixel SP2 of the first pixel P1 in the first direction (Y-axis direction). The other third sub-pixel SP3' of the second pixel P2 may be located above the third sub-pixel SP3 of the first pixel P1 in the first direction (Y-axis direction). The other fourth sub-pixel SP4' of the second pixel P2 may be located above the fourth sub-pixel SP4 of the first pixel P1 in the first direction (Y-axis direction).

[0194] As shown in Figure 10, each of the first to fourth sub-pixels SP1, SP2, SP3, and SP4 of the first pixel P1 may include a first light-emitting region EA1, a first connecting portion CP1, a second light-emitting region EA2, a second connecting portion CP2, and a third light-emitting region EA3. Each of the other first to fourth sub-pixels SP1', SP2', SP3', and SP4' of the second pixel P2 may be configured to have the same structure as each of the first to fourth sub-pixels SP1, SP2, SP3, and SP4 of the first pixel P1.

[0195] The first sub-pixel SP1 of the first pixel P1 may include a pixel electrode 114 partially positioned in the first light-emitting region EA1. Another first sub-pixel SP1' of the second pixel P2 may include a circuit region CA. As shown in Figure 10, the circuit region CA of another first sub-pixel SP1' may be provided between the third light-emitting region EA3 of the other first sub-pixel SP1' and the first light-emitting region EA1 of the first sub-pixel SP1.

[0196] In a display device 100 according to one embodiment of this specification, the substrate 110 may further include welding wiring WDL. The welding wiring WDL is for driving the light-emitting region EA of a sub-pixel SP where a wiring short circuit (e.g., a data wiring short circuit or a reference wiring short circuit) occurs together with the light-emitting region EA of other sub-pixels SP'.

[0197] For example, if a short circuit occurs in the data wiring DL, after the data branch wiring BRL1 is cut by the first repair section RPP1, the pixel electrode 114 located on the sub-pixel SP where the short circuit occurred and the circuit region CA (or thin-film transistor 112) located on another sub-pixel SP (for example, an adjacent sub-pixel SP above, relative to Figure 10) can be connected to each other via the welding wiring WDL. For example, the pixel electrode 114 located on the sub-pixel SP where the short circuit occurred can be connected to the circuit region CA (or thin-film transistor 112) of another sub-pixel SP' (or another normally operating sub-pixel SP') by a laser shock applied to the welding point WDP located on the welding wiring WDL. Thus, the welding wiring WDL can be connected to the pixel electrode 114 of the sub-pixel SP and the circuit region CA of the other sub-pixel SP'.

[0198] For example, as shown in Figure 10, a welding trace WDL placed between a first sub-pixel SP1 and another first sub-pixel SP1' can be connected to the pixel electrode 114 of the first sub-pixel SP1 and the circuit region CA of the other first sub-pixel SP1'. A welding trace WDL placed between a second sub-pixel SP2 and another second sub-pixel SP2' can be connected to the pixel electrode 114 of the second sub-pixel SP2 and the circuit region CA of the other second sub-pixel SP2'. A welding trace WDL placed between a third sub-pixel SP3 and another third sub-pixel SP3' can be connected to the pixel electrode 114 of the third sub-pixel SP3 and the circuit region CA of the other third sub-pixel SP3'. A welding trace WDL placed between a fourth sub-pixel SP4 and another fourth sub-pixel SP4' can be connected to the pixel electrode 114 of the fourth sub-pixel SP4 and the circuit region CA of the other fourth sub-pixel SP4'.

[0199] On the other hand, as shown in Figure 10, each of the multiple welding lines (WDLs) can include a welding point (WDP) superimposed on the circuit region (CA) of another sub-pixel (SP'). For example, a welding line (WDL) placed between a first sub-pixel (SP1) and another first sub-pixel (SP1') can include a welding point (WDP) superimposed on the circuit region (CA) of the other first sub-pixel (SP1'). A welding line (WDL) placed between a second sub-pixel (SP2) and another second sub-pixel (SP2') can include a welding point (WDP) superimposed on the circuit region (CA) of the other second sub-pixel (SP2'). A welding line (WDL) placed between a third sub-pixel (SP3) and another third sub-pixel (SP3') can include a welding point (WDP) superimposed on the circuit region (CA) of the other third sub-pixel (SP3'). A welding line (WDL) placed between a fourth sub-pixel (SP4) and another fourth sub-pixel (SP4') can include a welding point (WDP) superimposed on the circuit region (CA) of the other fourth sub-pixel (SP4').

[0200] Therefore, in the display device 100 according to one embodiment of this specification, after the data branch wiring BRL1 or reference branch wiring BRL2 of a sub-pixel SP where a wiring short circuit (for example, a data wiring short circuit or a reference wiring short circuit) has occurred is cut by a laser device, a laser shock is applied to the welding point WDP, thereby connecting the pixel electrode 114 of the sub-pixel SP where the short circuit occurred with the thin-film transistor 112 of other sub-pixel SP' that are operating normally. Thus, in the display device 100 according to one embodiment of this specification, the light-emitting region EA of the sub-pixel SP where the short circuit occurred can be driven together with the light-emitting region EA of other sub-pixel SPs.

[0201] The following describes a repair process for a display device 100 according to one embodiment of this specification, with reference to Figure 10. The repair process for a display device 100 according to one embodiment of this specification may include a first repair process by cutting the connecting portion (for example, the first connecting portion CP1 and / or the second connecting portion CP2) and a second repair process using the repair portion RPP.

[0202] Referring to Figure 10, the first repair process can be performed in a variety of cases, such as the following:

[0203] First, in the first case, for example, when foreign matter is generated (or attached) to position a of the first sub-pixel SP1 (e.g., the first light-emitting region EA1), a laser shock LS is applied to the first connecting portion CP1 to cut it. This can be done by the laser device applying a second laser shock LS2 to the first connecting portion CP1. As a result, the second light-emitting region EA2, the second connecting portion CP2, and the third light-emitting region EA3 of the first sub-pixel SP1 can be driven (or dimmed) normally.

[0204] Next, in the second case, for example, when foreign matter is generated (or adheres) to position b of the first sub-pixel SP1 (for example, the second light-emitting region EA2), a laser shock LS is applied to the first connecting portion CP1 and the second connecting portion CP2 respectively to cut them. This can be done by having the laser device apply a second laser shock LS2 to the first connecting portion CP1 and the second connecting portion CP2 respectively.

[0205] Next, by applying a laser shock to the welding point WDP superimposed with the circuit region CA of the other first subpixel SP1', the pixel electrode 114 located in the first light-emitting region EA1 of the first subpixel SP1 and the thin-film transistor 112 located in the circuit region CA of the other first subpixel SP1' are connected. Therefore, the first light-emitting region EA1 of the first subpixel SP1 can be driven together with the light-emitting region EA of the other first subpixel SP1'. Thus, the first light-emitting region EA1 of the first subpixel SP1 can be driven (or dimmed) normally.

[0206] Next, in the third case, for example, when foreign matter is generated (or attached) to position c of the first sub-pixel SP1 (for example, the third light-emitting region EA3), a laser shock LS is applied to the second connecting portion CP2 to cut the second connecting portion CP2. This can be done by applying a second laser shock LS2 to the second connecting portion CP2 using a laser device.

[0207] Next, by applying a laser shock to the welding point WDP superimposed with the circuit region CA of the other first subpixel SP1', the pixel electrode 114 located in the first light-emitting region EA1 of the first subpixel SP1 and the thin-film transistor 112 located in the circuit region CA of the other first subpixel SP1' are connected. The pixel electrode 114 located in the second light-emitting region EA2 of the first subpixel SP1 can be connected to the pixel electrode 114 located in the first light-emitting region EA1 of the first subpixel SP1 via the pixel electrode 114 located in the first connecting portion CP1 of the first subpixel SP1. Thus, the first light-emitting region EA1, the first connecting portion CP1, and the second light-emitting region EA2 of the first subpixel SP1 can be driven together with the light-emitting region EA of the other first subpixel SP1'.

[0208] Therefore, the display device 100 according to one embodiment of this specification can prevent the entire light-emitting area EA of each sub-pixel SP from becoming dark due to foreign matter generated during the manufacturing process by performing the first repair step in the first to third cases described above.

[0209] Referring also to Figure 10, the second repair process can be performed in a variety of cases, such as the following:

[0210] First, in the fourth case, for example, if a short circuit occurs in the data wiring DL of the second sub-pixel SP2 (e.g., the second data wiring DL2), a laser shock LS is applied to position d (e.g., the first repair section RPP1) to cut the data branch wiring BRL1. This can be done by having the laser device apply the first laser shock LS1 to the first repair section RPP1.

[0211] Next, by applying a laser shock to the welding point WDP superimposed with the circuit region CA of the other second subpixel SP2', the pixel electrode 114 located in the first light-emitting region EA1 of the second subpixel SP2 and the thin-film transistor 112 located in the circuit region CA of the other second subpixel SP2' are connected. The pixel electrode 114 located in the second light-emitting region EA2 of the second subpixel SP2 is connected to the pixel electrode 114 located in the first light-emitting region EA1 of the second subpixel SP2 via the pixel electrode 114 located in the first connecting portion CP1 of the second subpixel SP2, and the pixel electrode 114 located in the third light-emitting region EA3 of the second subpixel SP2 can be connected to the pixel electrode 114 located in the second light-emitting region EA2 of the second subpixel SP2 via the pixel electrode 114 located in the second connecting portion CP2 of the second subpixel SP2. Therefore, the first light-emitting region EA1, the first connecting portion CP1, the second light-emitting region EA2, the second connecting portion CP2, and the third light-emitting region EA3 of the second sub-pixel SP2 can be driven together with the light-emitting regions EA of the other second sub-pixel SP2'.

[0212] Next, in the fifth case, for example, if a short circuit occurs in the reference wiring RL, a laser shock LS is applied to position e (e.g., the second repair section RPP2) to cut the reference branch wiring BRL2. This can be done by applying a first laser shock LS1 to the second repair section RPP2 using a laser device.

[0213] Next, by applying a laser shock to the welding point WDP superimposed with the circuit region CA of the other second subpixel SP2', the pixel electrode 114 located in the first light-emitting region EA1 of the second subpixel SP2 and the thin-film transistor 112 located in the circuit region CA of the other second subpixel SP2' are connected. The pixel electrode 114 located in the second light-emitting region EA2 of the second subpixel SP2 is connected to the pixel electrode 114 located in the first light-emitting region EA1 of the second subpixel SP2 via the pixel electrode 114 located in the first connecting portion CP1 of the second subpixel SP2, and the pixel electrode 114 located in the third light-emitting region EA3 of the second subpixel SP2 can be connected to the pixel electrode 114 located in the second light-emitting region EA2 of the second subpixel SP2 via the pixel electrode 114 located in the second connecting portion CP2 of the second subpixel SP2. Therefore, the first light-emitting region EA1, the first connecting portion CP1, the second light-emitting region EA2, the second connecting portion CP2, and the third light-emitting region EA3 of the second sub-pixel SP2 can be driven together with the light-emitting regions EA of the other second sub-pixel SP2'.

[0214] Therefore, the display device 100 according to one embodiment of this specification can prevent the entire light-emitting region EA of each subpixel SP from becoming dark due to a short circuit between electrodes (or wiring) by performing the second repair step in the fourth and fifth cases as described above.

[0215] On the other hand, the above description assumes that a welding process is performed in which a laser impact is applied to the welding point WDP in the second repair process to connect the pixel electrode 114 located in the first light-emitting region EA1 of the second sub-pixel SP2 where foreign matter has been generated (or adhered) with the thin-film transistor 112 located in the circuit region CA of the other second sub-pixel SP2'. However, the method is not necessarily limited to this.

[0216] The display device 100 according to one embodiment of this specification does not need to include welding wiring WDL including welding point WDP for expanding the light-emitting area EA (or aperture ratio) of each of the multiple subpixels SP. In this case, a darkening process can be performed by cutting the first connection part CP1 or the second connection part CP2, causing only the light-emitting area where foreign matter has occurred to become dark, while the remaining light-emitting area is driven normally. When the darkening process is performed, a portion of the light-emitting area of ​​a subpixel cannot be driven, so the current density of the remaining light-emitting area that is driven normally can be increased. Therefore, a compensation process can be additionally performed on the subpixel SP on which the darkening process has been performed, supplying a data voltage lower than that of a subpixel SP that is driven normally.

[0217] In one embodiment of this specification, the display device 100 allows each subpixel in the display area DA to include multiple light-emitting areas. For example, a first light-emitting area EA1 and a second light-emitting area EA2 may be arranged adjacent to each other within a single subpixel. Connecting sections (e.g., CP1, CP2) are positioned between the first and second light-emitting areas to electrically or structurally connect the two areas. In a plan view, the connecting section appears as a narrower area connecting a wider light-emitting area. A first non-light-emitting area NEA1 may extend into the space between the first and second light-emitting areas EA1 and EA2 and may be recessed compared to the periphery of the light-emitting areas when viewed from above (e.g., in a plan view). In such a layout, the first non-light-emitting area NEA1 may be at least partially surrounded by the first and second light-emitting areas and the connecting section in the same plan view. A repair section RPP may be positioned within the first non-light-emitting area NEA1 to facilitate electrical insulation or repair.

[0218] Furthermore, each subpixel may include a laminated structure formed on the substrate, which includes a planarization layer, a pixel electrode disposed on the planarization layer, an organic light-emitting layer disposed on the pixel electrode, and a reflective electrode disposed on the organic light-emitting layer. In some embodiments, the reflective electrode may extend continuously (e.g., continuously adjacent) across the light-emitting and non-light-emitting regions. The first reflective portion 121 of the reflective electrode may be positioned on the inclined surface of the planarization layer in the first non-light-emitting region. This inclined surface may be configured to increase the light extraction efficiency by redirecting (or re-reflecting) light emitted from an adjacent light-emitting region toward the substrate. The second non-light-emitting region may be positioned between adjacent subpixels and connected to the first non-light-emitting region. The second reflective portion 122 of the reflective electrode may be positioned on the inclined surface of the second non-light-emitting region and similarly positioned so that light is directed toward the substrate.

[0219] In certain embodiments, the reflective electrode may be formed as a continuously adjacent film extending across the first and second light-emitting regions, the first non-light-emitting region, and the second non-light-emitting region. Such a continuous structure can simplify manufacturing and improve optical uniformity. A color filter CF may be positioned on the repair area and between the repair area and the reflective electrode. The color filter CF may extend laterally beyond the boundary of the repair area and can provide thermal or optical shielding during laser repair. For example, the color filter CF may be configured to absorb the laser energy used to isolate short circuits between data branch lines (or data branch wiring) and reference branch lines (or reference branch wiring). The data branch lines and reference branch lines may be wired to each sub-pixel spaced apart from each other, where they may overlap with the respective first and second repair areas located in the first non-light-emitting region.

[0220] In some configurations, when viewed in a plan view, the first repair area RPP1 may at least partially overlap with the data branch line, and the second repair area RPP2 may at least partially overlap with the reference branch line. Such overlapping regions can be designed to act as laser approach points for separating short circuits. After separation, a welding trace WDL can be formed between the pixel electrode of the first sub-pixel and the circuit region of the second sub-pixel to maintain electrical continuity. The circuit region may include thin-film transistors or similar drive components. The welding trace may be located near the circuit region and may include welding points that can overlap with the boundary of the circuit region in a plan view (see Figure 10). After manufacturing, the welding points can act as locations for forming electrical bridges between sub-pixels during repair.

[0221] Although embodiments of this specification have been described in more detail above with reference to the attached drawings, this specification is not necessarily limited to these embodiments, and can be modified and implemented in various ways without departing from the technical concept of this specification. Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of this specification, and the scope of the technical concept of this specification is not limited by such embodiments. Accordingly, the embodiments described above should be understood to be illustrative in all respects and not limiting. All technical concepts within the scope of protection of this specification should be interpreted as being included within the scope of rights of this specification.

[0222] The various embodiments described above can be combined to provide additional embodiments. Such embodiments and other modifications can be added to the embodiments in light of the above detailed description. In general, the terms used in the following claims should not be construed as limiting the scope of this specification by any particular embodiment disclosed herein or herein, but rather as encompassing all possible embodiments along with the entire range of equivalents that such claims may have. Accordingly, the claims are not limited by this disclosure. [Explanation of Symbols]

[0223] 100 Display devices 110 circuit boards P pixels 111 Multiple inorganic films 112 Thin-film transistors 113 Planarization layer 114 Pixel Electrodes 115 Bank 116 Organic light-emitting layer 117 Reflecting electrode 118 Sealing layer 121 1st reflection section 122 2nd reflection section CP1 1st connection part CP2 2nd connection part RPP Repair Department RPP1 1st Repair Section RPP2 2nd Repair Section BRL1 Data Branch Wiring BRL2 Reference Branch Wiring WDL Welding Wiring WDP Welding Point

Claims

1. A substrate containing multiple pixels, including multiple subpixels, A first non-emitting region is provided on the substrate and is located inside each of the plurality of subpixels, A second non-emitting region is connected to the first non-emitting region and is positioned between the plurality of sub-pixels, A light-emitting region adjacent to the first non-light-emitting region and the second non-light-emitting region, A display device including a repair section arranged in the first non-emitting region.

2. Each of the light-emitting regions of the plurality of subpixels is The first light-emitting region and The first connecting section and A second light-emitting region is separated from the first light-emitting region and connected to the first light-emitting region via the first connecting portion, The second connecting section and A third light-emitting region is separated from the second light-emitting region and connected to the second light-emitting region via the second connecting portion, The display device according to claim 1, wherein the first non-emitting region is arranged between the first emitting region and the second emitting region, and between the second emitting region and the third emitting region.

3. The display device according to claim 2, wherein the repair portion is located in the first non-emitting region provided between the second light-emitting region and the third light-emitting region.

4. The display device according to claim 2, wherein the width of the first connecting portion is narrower than the width of the first light-emitting region in a plan view.

5. The aforementioned substrate is Data branch wiring connected to each of the aforementioned subpixels, Includes a reference branch wiring that is separated from the data branch wiring and connected to each of the plurality of subpixels, The aforementioned repair section is The first repair section partially overlaps the aforementioned data branch wiring, The display device according to claim 2, comprising a second repair section partially superimposed on the reference branch wiring.

6. Each of the aforementioned data branch wiring and the aforementioned reference branch wiring partially overlaps with the light-emitting region. The display device according to claim 5, wherein each of the data branch wiring and the reference branch wiring is made of a transparent conductive material.

7. The data branch wiring is arranged on the first repair section, The display device according to claim 5, wherein the reference branch wiring is arranged on the second repair section.

8. The width of the first repair section is wider than the width of the data branch wiring. The display device according to claim 7, wherein the width of the second repair section is wider than the width of the reference branch wiring.

9. A first planarization layer disposed on the substrate, A second flattening layer is disposed on the first flattening layer and has the same refractive index as the first flattening layer, A first reflective portion is disposed on the second planarization layer and is positioned diagonally in the first non-luminescent region, The display device according to claim 1, further comprising a second reflective portion arranged diagonally in the second non-emitting region.

10. Each of the aforementioned subpixels is, A pixel electrode arranged on the second planarization layer, The organic light-emitting layer on the aforementioned pixel electrode, The reflective electrode on the organic light-emitting layer includes, The display device according to claim 9, wherein the first reflective portion and the second reflective portion are part of the reflective electrode.

11. The display device according to claim 1, wherein the width of the repair portion is narrower than the width of the first non-emitting region.

12. The display device according to claim 10, further comprising a color filter provided between the repair section and the reflective electrode.

13. The display device according to claim 12, wherein the width of the color filter is greater than the width of the repair section.

14. The display device according to claim 5, wherein the second connecting portion is disposed between the first repair portion and the second repair portion.

15. The display device according to claim 5, wherein the first repair section or the second repair section is arranged at a distance of a first distance from the second connecting section.

16. The substrate further includes data wiring to which the data branch wiring is electrically connected. The display device according to claim 5, wherein the data wiring is arranged in the first non-emitting region at a distance of a second distance from the first repair portion.

17. The display device according to claim 5, further comprising the second connecting portion, the first repair portion, and a color filter superimposed on the second repair portion.

18. The display device according to claim 17, wherein the color filter covers the first repair portion and the second repair portion between the second connecting portion and the substrate.

19. The plurality of pixels include a first pixel and a second pixel positioned above the first pixel in a first direction. The first pixel includes a first sub-pixel, The second pixel includes another first sub-pixel located above the first sub-pixel of the first pixel in the first direction, The first sub-pixel includes a pixel electrode partially arranged in the first light-emitting region, The other first sub-pixel includes a circuit region provided between the third light-emitting region and the first light-emitting region of the first sub-pixel. The display apparatus according to claim 2, wherein the substrate further includes welding wiring connected to the pixel electrode of the first sub-pixel and the circuit region of the other first sub-pixel.

20. The display device according to claim 19, wherein the welding wiring includes a welding point superimposed on the circuit region of the other first subpixel.

Images