Manufacturing method for processing apparatus and mobile body

Abstract

To provide a processing apparatus capable of appropriately forming structures on objects. [Means] The processing apparatus (1) comprises a light irradiation device (11) that irradiates the surface of an object (S, SF) with multiple processing lights (EL), and a first modification device (41e) that changes the intensity distribution of the multiple processing lights from the light irradiation device on the surface of the object. By irradiating the surface of the object with multiple processing lights, the thickness of a part of the object is changed.

Description

Technical Field

[0001] The present invention relates to the technical field of a processing apparatus capable of irradiating processing light to process an object, and a manufacturing method for manufacturing a moving body.

Background Art

[0002] As a processing apparatus capable of processing an object, Patent Document 1 describes a processing apparatus that irradiates a laser beam onto the surface of an object to form a structure and reduces the resistance related to the surface. In this type of processing apparatus, it is required to appropriately form a structure on the object.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] According to a first aspect, there is provided a processing apparatus including a light irradiation device that irradiates a plurality of processing lights onto the surface of an object, and a first changing device that changes the intensity distribution of the plurality of processing lights from the light irradiation device on the surface of the object, and by irradiating the plurality of processing lights onto the surface of the object, a thickness of a part of the object is changed.

[0005] According to a second aspect, there is provided a processing apparatus including a light irradiation device that irradiates a plurality of processing lights onto the surface of an object, and a first changing device that changes the intensity distribution of the plurality of processing lights from the light irradiation device on the surface of the object, and by irradiating the plurality of processing lights onto the surface of the object, a part of the object is removed.

[0006] According to a third embodiment, a processing apparatus is provided that includes a light irradiation device for irradiating the surface of an object with a plurality of processing lights, and a first modification device for changing the shape of an irradiation area formed on the surface of the object by the plurality of processing lights from the light irradiation device, wherein the thickness of a part of the object is changed by irradiating the surface of the object with the plurality of processing lights.

[0007] According to a fourth aspect, a processing apparatus is provided that removes a part of an object by irradiating the surface of an object with a plurality of processing lights, and a first modifying device that changes the shape of an irradiation area formed on the surface of the object by the plurality of processing lights from the light irradiation apparatus.

[0008] According to a fifth aspect, a processing apparatus is provided that includes a light irradiation device for irradiating the surface of an object with a plurality of processing lights, and a first modification device for changing the size of an irradiation area formed on the surface of the object by the plurality of processing lights from the light irradiation device, wherein the thickness of a part of the object is changed by irradiating the surface of the object with the plurality of processing lights.

[0009] According to a sixth aspect, a processing apparatus is provided that removes a part of an object by irradiating the surface of an object with a plurality of processing lights, and a first changing device that changes the size of an irradiation area formed on the surface of the object by the plurality of processing lights from the light irradiation apparatus.

[0010] According to a seventh aspect, a processing apparatus is provided that includes a light irradiation device for irradiating the surface of an object with a plurality of processing lights, and a first changing device for changing the intensity of the plurality of processing lights from the light irradiation device, thereby changing the thickness of a part of the object by irradiating the surface of the object with the plurality of processing lights.

[0011] According to the eighth aspect, a processing apparatus is provided that removes a part of an object by irradiating the surface of an object with a plurality of processing lights, and a first changing device that changes the intensity of the plurality of processing lights from the light irradiation apparatus.

[0012] According to the ninth aspect, a processing apparatus is provided that includes a light irradiation device for irradiating the surface of an object with a plurality of processing lights, and a first changing device for changing the polarization state of the plurality of processing lights from the light irradiation device, wherein the thickness of a part of the object is changed by irradiating the surface of the object with the plurality of processing lights.

[0013] According to a tenth embodiment, a processing apparatus is provided that includes a light irradiation device for irradiating the surface of an object with a plurality of processing lights, and a first changing device for changing the polarization state of the plurality of processing lights from the light irradiation device, wherein a part of the object is removed by irradiating the surface of the object with the plurality of processing lights.

[0014] According to the eleventh embodiment, a processing apparatus is provided that includes a light irradiation device for irradiating the surface of an object with a plurality of processing lights, and a first changing device for changing at least one of the relative position and relative angle of the plurality of processing lights from the light irradiation device, thereby changing the thickness of a part of the object by irradiating the surface of the object with the plurality of processing lights.

[0015] According to the twelfth aspect, a processing apparatus is provided that removes a part of an object by irradiating the surface of the object with the plurality of processing lights, comprising a light irradiation device that irradiates the surface of an object with a plurality of processing lights, and a first changing device that changes at least one of the relative position and relative angle of the plurality of processing lights from the light irradiation device.

[0016] According to the 13th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the intensity distribution of the plurality of processing lights on the surface of the object, thereby changing the thickness of a part of the object by irradiating the surface of the object with the plurality of processing lights and forming a structure on the surface of the object.

[0017] According to the 14th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the intensity distribution of the plurality of processing lights on the surface of the object, thereby removing a part of the object by irradiating the surface of the object with the plurality of processing lights to form a structure on the surface of the object.

[0018] According to the 15th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the shape of an irradiated area formed on the surface of the object by the plurality of processing lights, thereby changing the thickness of a part of the object and forming a structure on the surface of the object by irradiating the surface of the object with a plurality of processing lights.

[0019] According to the 16th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the shape of the irradiation area formed on the surface of the object by the plurality of processing lights, wherein by irradiating the surface of the object with the plurality of processing lights, a part of the object is removed and a structure is formed on the surface of the object.

[0020] According to the 17th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the size of the irradiation area formed on the surface of the object by the plurality of processing lights, thereby changing the thickness of a part of the object and forming a structure on the surface of the object by irradiating the surface of the object with a plurality of processing lights.

[0021] According to the 18th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the size of the irradiation area formed on the surface of the object by the plurality of processing lights, wherein by irradiating the surface of the object with the plurality of processing lights, a part of the object is removed and a structure is formed on the surface of the object.

[0022] According to the 19th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the intensity of the plurality of processing lights, thereby changing the thickness of a part of the object and forming a structure on the surface of the object by irradiating the surface of the object with the plurality of processing lights.

[0023] According to the 20th aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the intensity of the plurality of processing lights, wherein by irradiating the surface of the object with the plurality of processing lights, a part of the object is removed and a structure is formed on the surface.

[0024] According to the 21st aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the polarization state of the plurality of processing lights, wherein by irradiating the surface of the object with the plurality of processing lights, the thickness of a part of the object is changed and a structure is formed on the surface of the object.

[0025] According to the 22nd aspect, a method for manufacturing a mobile body that moves in a fluid is provided, which includes irradiating the surface of an object with a plurality of processing lights and changing the polarization state of the plurality of processing lights, wherein by irradiating the surface of the object with the plurality of processing lights, a part of the object is removed and a structure is formed on the surface.

[0026] According to the 23rd aspect, it includes irradiating a plurality of processing lights on the surface of an object and changing at least one of the relative positions and relative angles of the plurality of processing lights. By irradiating the plurality of processing lights on the surface of the object, a method for manufacturing a moving body that moves in a fluid is provided, in which the thickness of a part of the object is changed to form a structure on the surface.

[0027] According to the 24th aspect, it includes irradiating a plurality of processing lights on the surface of an object and changing at least one of the relative positions and relative angles of the plurality of processing lights. By irradiating the plurality of processing lights on the surface of the object, a method for manufacturing a moving body that moves in a fluid is provided, in which a part of the object is removed to form a structure on the surface.

Brief Description of Drawings

[0028] [Figure 1] FIG. 1 is a cross-sectional view schematically showing the overall structure of the processing apparatus of the present embodiment. [Figure 2] Each of FIGS. 2(a) and 2(b) is a cross-sectional view schematically showing the state of processing of the coating film formed on the surface of the processing object. [Figure 3] FIG. 3(a) is a cross-sectional view schematically showing the light irradiation device included in the processing apparatus of the present embodiment. Each of FIGS. 3(b) and 3(c) is a cross-sectional view showing the configuration of the light source system included in the light irradiation device. FIG. 3(d) is a perspective view schematically showing another example of the optical system of the light irradiation device. [Figure 4] FIG. 4 is a side view showing the housing device. [Figure 5] FIG. 5(a) is a cross-sectional view showing the cross-section of the riblet structure formed by the processing apparatus of the present embodiment. FIG. 5(b) is a perspective view showing the riblet structure formed by the processing apparatus of the present embodiment. [Figure 6] Each of FIGS. 6(a) and 6(b) is a front view showing an aircraft, which is an example of a processing object on which a riblet structure is formed. FIG. 6(c) is a side view showing an aircraft, which is an example of a processing object on which a riblet structure is formed. [Figure 7]Figure 7 is a plan view showing multiple unit processing regions set on the surface of the coating film SF. [Figure 8] Figure 8 is a cross-sectional view showing a processing apparatus that performs one step of the processing operation for forming a riblet structure. [Figure 9] Figure 9(a) is a cross-sectional view showing a processing apparatus that performs one step of the processing operation to form a riblet structure, and Figure 9(b) is a plan view showing the surface of the coating film on which the processing operation shown in Figure 9(a) is being performed. [Figure 10] Figure 10 is a cross-sectional view showing a processing apparatus that performs one step of a machining operation to form a riblet structure. [Figure 11] Figure 11(a) is a cross-sectional view showing a processing apparatus that performs one step of the processing operation to form a riblet structure, and Figure 11(b) is a plan view showing the surface of the coating film on which the processing operation shown in Figure 11(a) is being performed. [Figure 12] Figure 12 is a cross-sectional view showing a processing apparatus that performs one step of a processing operation for forming a riblet structure. [Figure 13] Figure 13 is a cross-sectional view showing a processing apparatus that performs one step of the processing operation for forming a riblet structure. [Figure 14] Figure 14 is a cross-sectional view showing a processing apparatus performing one step of a machining operation to form a riblet structure. [Figure 15] Figure 15 is a cross-sectional view showing a processing apparatus that performs one step of the processing operation for forming a riblet structure. [Figure 16] Figure 16 is a cross-sectional view showing a processing apparatus that performs one step of a machining operation to form a riblet structure. [Figure 17] Figure 17 is a cross-sectional view showing a processing apparatus performing one step of a machining operation to form a riblet structure. [Figure 18] Figure 18 is a schematic cross-sectional view showing another example of a light irradiation device. [Figure 19] Figure 19 is a schematic cross-sectional view showing another example of a light irradiation device. [Figure 20]Figure 20 is a schematic cross-sectional view showing another example of a light irradiation device. [Figure 21] Figure 21 is a schematic cross-sectional view showing another example of a light irradiation device. [Figure 22] Figure 22 is a schematic cross-sectional view showing another example of a light irradiation device. [Figure 23] Figure 23 is a schematic cross-sectional view showing another example of a light irradiation device. [Figure 24] Figure 24 is a schematic cross-sectional view showing another example of a light irradiation device. [Figure 25] Figure 25 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the second modified example. [Figure 26] Figure 26(a) is a cross-sectional view showing how the surface of the coating film is located within the depth of focus of the optical system when the surface of the coating film is flat; Figure 26(b) is a cross-sectional view showing how the surface of the coating film is located within the depth of focus of the optical system when the surface of the coating film is curved; Figure 26(c) is a cross-sectional view showing how the surface of the coating film is located within the depth of focus of the optical system when there are irregularities on the surface of the coating film; and Figure 26(d) is a cross-sectional view showing how the surface of the coating film is located within the depth of focus of the optical system when the surface of the coating film is inclined with respect to the optical axis of the optical system. [Figure 27] Figure 27 is a schematic cross-sectional view showing a light irradiation device in which the focusing positions of multiple processing beams can be individually adjusted. [Figure 28] Figure 28 is a cross-sectional view showing the irradiation of multiple processing lights when the optical system is a non-telecentric optical system on the painted film side. [Figure 29]Figure 29(a) is a cross-sectional view showing how the focal points of multiple processing beams are located on the surface of the coating film when the surface of the coating film is flat; Figure 29(b) is a cross-sectional view showing how the focal points of multiple processing beams are located on the surface of the coating film when the surface of the coating film is curved; Figure 29(c) is a cross-sectional view showing how the focal points of multiple processing beams are located on the surface of the coating film when there are irregularities on the surface of the coating film; and Figure 29(d) is a cross-sectional view showing how the focal points of multiple processing beams are located on the surface of the coating film when the surface of the coating film is inclined with respect to the optical axis of the optical system. [Figure 30] Figure 30(a) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a painted film when the surface of the painted film is flat; Figure 30(b) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a painted film when the surface of the painted film is curved; Figure 30(c) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a painted film when there are irregularities on the surface of the painted film; and Figure 30(d) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a painted film when the surface of the painted film is inclined with respect to the optical axis of the optical system. [Figure 31] Figure 31(a) is a cross-sectional view showing the image plane set to coincide with the surface of the coating film SF when the surface of the coating film is flat; Figure 31(b) is a cross-sectional view showing the image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is curved; Figure 31(c) is a cross-sectional view showing the image plane set to coincide with the surface of the coating film SF when there are irregularities on the surface of the coating film; and Figure 31(d) is a cross-sectional view showing the image plane set to coincide with the surface of the coating film SF when the surface of the coating film is inclined with respect to the optical axis of the optical system. [Figure 32] Figure 32(a) is a cross-sectional view showing the unprocessed area, and Figure 32(b) is a plan view showing the unprocessed area. [Figure 33]Figures 33(a) to 33(c) are graphs showing the relationship between the reflectance of the coating film to the processing light and the intensity of the processing light set by the control device. [Figure 34] Figures 34(a) to 34(c) are graphs showing the relationship between the reflectance of the coating film to the processing light and the irradiation time of the processing light set by the control device. [Figure 35] Figure 35 is a graph showing the reflectance of the coating film for multiple measurement light sources with different wavelengths. [Figure 36] Figure 36 is a schematic cross-sectional view showing a light irradiation device equipped with multiple light source systems. [Figure 37] Figure 37 is a cross-sectional view showing the range over which the surface property measuring device measures the surface shape of the coating film when the light irradiation device moves over the coating film SF. [Figure 38] Figure 38 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the third modified example. [Figure 39] Figure 39 is a plan view showing the positional relationship between the light projection device and the detection device of the structural measurement device. [Figure 40] Figure 40 is a plan view showing the sample area where the structural measurement device measures the characteristics of the riblet structure. [Figure 41] Figure 41(a) is a cross-sectional view showing an ideal riblet structure to be formed by the processing apparatus; Figure 41(b) is a cross-sectional view showing a riblet structure of the same size as the ideal riblet structure; Figure 41(c) is a cross-sectional view showing a riblet structure smaller than the ideal riblet structure; and Figure 41(d) is a cross-sectional view showing a riblet structure larger than the ideal riblet structure. [Figure 42] Figure 42(a) is a cross-sectional view showing a riblet structure with the same shape as an ideal riblet structure, and Figure 42(b) is a cross-sectional view showing a riblet structure with a shape different from that of an ideal riblet structure. [Figure 43]Figure 43 is a cross-sectional view showing a riblet structure that includes concave structures in the same positions as the concave structures that constitute an ideal riblet structure, and a riblet structure that includes concave structures in positions different from those that constitute an ideal riblet structure. [Figure 44] Figure 44(a) is a cross-sectional view showing a sample region where a riblet structure is formed, and Figure 44(b) is a cross-sectional view showing a sample region where a riblet structure is not formed. [Figure 45] Figure 45(a) is a cross-sectional view showing the process of irradiating a riblet structure smaller than the ideal size with processing light to modify the riblet structure, and Figure 45(b) is a cross-sectional view showing the modified riblet structure. [Figure 46] Figure 46 is a schematic cross-sectional view showing the structure of the light irradiation device included in the processing apparatus of the fourth modified example. [Figure 47] Figures 47(a) and 47(b) are plan views showing multiple irradiation regions with different array pitches, while Figures 47(c) and 47(d) are cross-sectional views showing the riblet structure formed by irradiating the multiple irradiation regions shown in Figures 47(a) and 47(b) with multiple processing lights, respectively. [Figure 48] Figures 48(a) and 48(b) are plan views showing multiple processing beams with different relative angles, while Figures 48(c) and 48(d) are plan views showing multiple irradiation areas to which the multiple processing beams shown in Figures 48(a) and 48(b) are irradiated, respectively. [Figure 49] Figures 49(a) and 49(b) are plan views showing multiple processing beams irradiated from light irradiation devices at different distances from the coating film SF, while Figures 49(c) and 49(d) are plan views showing multiple irradiation areas irradiated by the multiple processing beams shown in Figures 49(a) and 49(b), respectively. [Figure 50] Figures 50(a) and 50(c) are plan views showing multiple processing lights emitted from light irradiation devices with different numbers of light sources, while Figures 50(b) and 50(d) are plan views showing multiple irradiation areas irradiated by the multiple processing lights shown in Figures 50(a) and 50(c), respectively. [Figure 51] Figures 51(a) and 51(c) are plan views showing the first and second branched light beams with different intersecting angles, while Figures 51(b) and 51(d) are plan views showing the interference fringes formed on the surface of the coating film due to the interference of the first and second branched light beams shown in Figures 51(a) and 51(c), respectively. [Figure 52] Figure 52 is a schematic cross-sectional view showing a light irradiation device in which the angle at which the first and second branched light beams intersect can be adjusted. [Figure 53] Figure 53 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the fifth modified example. [Figure 54] Figures 54(a) and 54(c) are cross-sectional views showing the intensity distribution on the surface of the coating film, respectively, while Figures 54(b) and 54(d) are cross-sectional views showing the riblet structure formed by irradiation with multiple processing lights having the intensity distributions shown in Figures 54(a) and 54(c), respectively. [Figure 55] Figures 55(a) and 55(c) are cross-sectional views showing multiple irradiation regions with different shapes, while Figures 55(b) and 55(d) are cross-sectional views showing a riblet structure formed by irradiating multiple irradiation regions having the shapes shown in Figures 55(a) and 55(c) with multiple processing lights. [Figure 56] Figures 56(a) and 56(c) are cross-sectional views showing multiple irradiation areas of different sizes, and Figures 56(b) and 56(d) are cross-sectional views showing a riblet structure formed by irradiating multiple irradiation areas of the sizes shown in Figures 56(a) and 56(c) with multiple processing lights. [Figure 57] Figures 57(a) and 57(c) are cross-sectional views showing multiple processing lights of different intensities, and Figures 57(b) and 57(d) are cross-sectional views showing the riblet structure formed by irradiation with multiple processing lights of the intensities shown in Figures 57(a) and 57(c), respectively. [Figure 58] Figure 58(a) is a perspective view showing a riblet structure in which the cross-sectional shape of the concave structure changes along the direction of extension, Figure 58(b) is a cross-sectional view taken along line I-I' of Figure 58(a), and Figure 58(c) is a cross-sectional view taken along line II-II' of Figure 58(a). [Figure 59] Figure 59(a) is a perspective view showing a riblet structure in which the width of the concave structure changes along the direction of extension, Figure 59(b) is a cross-sectional view taken along line I-I' of Figure 59(a), and Figure 59(c) is a cross-sectional view taken along line II-II' of Figure 59(a). [Figure 60] Figure 60 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the sixth modified example. [Figure 61] Figure 61 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the seventh modified example. [Figure 62] Figure 62 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the eighth modified example. [Figure 63] Figure 63 is a cross-sectional view showing an example of the configuration of the adsorption unit that positions the light irradiation device on the painted film. [Figure 64] Figure 64 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the ninth modified example. [Figure 65] Figure 65 is a schematic cross-sectional view showing the overall structure of the processing apparatus of the 10th modified example. [Figure 66] Figures 66(a) and (b) are plan views showing unit machining regions that partially overlap with other adjacent unit machining regions. [Figure 67] Figure 67 is a cross-sectional view showing the irradiation of processing light onto two adjacent unit processing regions. [Figure 68] Figure 68 is a cross-sectional view showing the irradiation of processing light onto two adjacent unit processing regions. [Figure 69] Figure 69 is a cross-sectional view showing the intensity of processing light irradiated onto two adjacent unit processing regions. [Figure 70] Figure 70 is a cross-sectional view showing the intensity of processing light irradiated onto two adjacent unit processing regions. [Figure 71] Figures 71(a) to 71(c) are plan views showing the regions where multiple irradiation areas move during a single scan operation. [Figure 72] Figures 72(a) and 72(b) are cross-sectional views showing structures made up of multiple layers stacked on top of each other. [Modes for carrying out the invention]

[0029] Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the embodiments described below.

[0030] (1) Structure of processing apparatus 1 The structure of the processing apparatus 1 of this embodiment will be described with reference to Figure 1. Figure 1 is a schematic cross-sectional view showing the structure of the processing apparatus 1 of this embodiment. In the following, the structure of the processing apparatus 1 will be described in a three-dimensional coordinate space defined by mutually orthogonal X, Y, and Z axes. The X and Y axes are directions along the horizontal plane, and the Z axis is a direction perpendicular to the X and Y axes. However, although the processing apparatus 1 is positioned on a workpiece S having a surface along the horizontal plane in Figure 1, the processing apparatus 1 is not necessarily positioned on a workpiece S having a surface along the horizontal plane. For example, as will be described in detail later with reference to Figure 6, the processing apparatus 1 may be positioned on a workpiece S having a surface intersecting the horizontal plane, or it may be suspended from the workpiece S. In this case, for convenience, the X and Y axes may be defined as directions along the surface of the workpiece S.

[0031] As shown in Figure 1, the processing apparatus 1 processes a coating film SF formed on the surface of a workpiece S. The workpiece S may be, for example, a metal, an alloy (e.g., duralumin), a resin (e.g., CFRP (Carbon Fiber Reinforced Plastic)), glass, or an object made of any other material. The coating film SF is a film of paint covering the surface of the workpiece S. The thickness of the coating film SF may be, for example, several tens of micrometers to several hundred micrometers, but may be any other size. The paint constituting the coating film SF may include, for example, a resin-based paint (e.g., at least one of polyurethane-based paints, vinyl-based paints, silicone-based paints, and epoxy-based paints), or it may include other types of paints.

[0032] The processing apparatus 1 irradiates the coating film SF with processing light EL in order to process the coating film SF. The processing light EL can be any type of light, as long as it can process the coating film SF when irradiated onto it. For example, the processing light EL may be laser light. Furthermore, the processing light EL may be light of any wavelength, as long as it can process the coating film SF when irradiated onto it. In this embodiment, the explanation will proceed using an example where the processing light EL is invisible light (for example, at least one of infrared light and ultraviolet light). However, the processing light EL may also be visible light.

[0033] The processing apparatus 1 irradiates the irradiation area EA, which is set (in other words, formed) on the surface of the coating film SF, with processing light EL. As shown in Figure 2(a), when the processing light EL is irradiated onto the irradiation area EA, a portion of the coating film SF that overlaps with the irradiation area EA (i.e., the coating film located on the -Z side of the irradiation area EA) is evaporated by the processing light EL. At this time, not all of the coating film SF that overlaps with the irradiation area EA in the thickness direction of the coating film SF is evaporated. In other words, in the thickness direction of the coating film SF, a portion of the coating film SF that overlaps with the irradiation area EA (specifically, the portion of the coating film SF that is relatively close to the irradiation area EA) is evaporated, while another portion of the coating film SF that overlaps with the irradiation area EA (specifically, the portion of the coating film SF that is relatively far from the irradiation area EA) is not evaporated. In other words, the coating film SF is evaporated only to the extent that the workpiece S is not exposed from behind the coating film SF. As a result, the coating film SF is removed in the areas where it has evaporated. On the other hand, the coating film SF remains in the areas where it has not evaporated. In other words, as shown in Figure 2(b), the coating film SF is partially removed in the area irradiated with the processing light EL. As a result, as shown in Figure 2(b), the thickness of the coating film SF becomes thinner in the area irradiated with the processing light EL compared to the area irradiated with the processing light EL. To put it another way, as shown in Figure 2(b), on the surface of the workpiece S, there are coating films SF that remain relatively thick because they are not irradiated with the processing light EL, and coating films SF that have become relatively thinner because they have been irradiated with the processing light EL. In other words, the thickness of the coating film SF is adjusted, at least partially, by irradiation with the processing light EL. As a result, recesses (in other words, grooves) C are formed on the surface of the coating film SF corresponding to the areas where the coating film SF is relatively thin. Therefore, the "operation of processing the coating film SF" in this embodiment includes the operation of adjusting the thickness of the coating film SF, the operation of removing a part of the coating film SF, and the operation of forming recesses C in the coating film SF. Furthermore, the energy of the processing light EL irradiated onto the coating film SF is determined so as not to affect the workpiece S by the irradiation of the processing light EL. In other words, the energy of the processing light EL is determined so that the irradiation of the processing light EL affects only the coating film SF.

[0034] The coating film SF evaporates by absorbing the processing light EL. In other words, the coating film SF is removed by photochemical decomposition, for example, when the energy of the processing light EL is transferred to the coating film SF. When the processing light EL is laser light, the phenomenon in which the coating film SF is photochemically decomposed and removed when the energy of the processing light EL is transferred to the coating film SF is sometimes called laser ablation. For this reason, the coating film SF contains a material that can absorb the processing light EL. Specifically, for example, the coating film SF may contain a material whose absorption rate with respect to the processing light EL (i.e., the absorption rate with respect to light of wavelengths other than the visible light wavelength range) is above a predetermined first absorption threshold. Such a material may be a dye.

[0035] If the coating film SF contains a dye, the dye may be a dye that exhibits a desired color when irradiated with visible light. As a result, the coating film SF containing such a dye will exhibit a desired color. In this case, the dye may have the characteristic that the absorption rate of the first light component, which is reflected by the coating film SF and perceived by humans as light of the desired color, is different from the absorption rate of the second light component, which is other than the first light component, in the visible light wavelength range, so that the coating film SF exhibits a desired color. For example, the dye may have the characteristic that the absorption rate of the first light component is smaller than the absorption rate of the second light component. For example, the dye may have the characteristic that the absorption rate of the first light component is less than or equal to a predetermined second absorption threshold (where the second absorption threshold is smaller than the first absorption threshold), and the absorption rate of the second light component is greater than or equal to a predetermined third absorption threshold (where the third absorption threshold is larger than the second absorption threshold). As an example of a dye that can adequately absorb processing light EL, which is invisible light, while exhibiting a desired color, one example is the near-infrared absorbing dye manufactured by Spectrum Info GmbH in Kyiv, Ukraine (for example, tetrafluoroborated 4-((E)-2-{(3E)-2-chloro-3-[2-(2,6-diphenyl-4H-thiopyran-4-ylidene)ethylidene]cyclohexa-1-en-1-yl}vinyl)-2,6-diphenylthiopyrillium).

[0036] Alternatively, if the coating film SF contains a dye, the dye may be transparent to visible light. As a result, the coating film SF containing such a dye becomes a transparent film (a so-called clear coat). In this case, the dye may have the characteristic of not absorbing much visible light (i.e., reflecting a reasonable amount) so that the coating film SF becomes transparent. For example, the dye may have the characteristic of having a visible light absorption rate lower than a predetermined fourth absorption threshold. An example of a dye that can reasonably absorb invisible processing light EL while being transparent to visible light is, for example, the near-infrared absorbing dye manufactured by Spectrum Info Inc. (one example being tetrafluoroborated 6-chloro-2-[(E)-2-(3-{(E)-2-[6-chloro-1-ethylbenzo[cd]indole-2(1H)-ylidene]ethylidene}-2-phenyl-1-cyclopenten-1-yl)ethenyl]-1-ethylbenzo[cd]indolium).

[0037] Again in Figure 1, the processing apparatus 1 for processing the coating film SF comprises a light irradiation device 11, a drive system 12, a housing device 13, a support device 14, a drive system 15, an exhaust device 16, a gas supply device 17, and a control device 18.

[0038] The light irradiation device 11 can irradiate the painted film SF with processing light EL under the control of the control device 18. To irradiate with processing light EL, the light irradiation device 11 includes a light source system 111 capable of emitting processing light EL and an optical system 112 that guides the processing light EL emitted from the light source system 111 to the painted film SF, as shown in Figure 3(a).

[0039] The light source system 111 emits, for example, multiple processing light ELs simultaneously. For this reason, the light source system 111 is equipped with multiple light sources 1111, as shown in Figure 3(b). The multiple light sources 1111 are arranged in a line at equal intervals. Each light source 1111 emits pulsed light as processing light EL. When the emission time width of the pulsed light (hereinafter referred to as "pulse width") is shortened, the processing accuracy (for example, the formation accuracy of the riblet structure described later) is improved. Therefore, each light source 1111 may emit pulsed light with a relatively short pulse width as processing light EL. For example, each light source 1111 may emit pulsed light with a pulse width of 1000 nanoseconds or less as processing light EL. Alternatively, as shown in Figure 3(c), the light source system 111 may be equipped with a single light source 1111 and a brancher 1112 that branches the light from the single light source 1111 into multiple processing light ELs. Multiple output ports from which multiple processed ELs, each branched by the splitter 1112, are emitted are arranged in a line at equal intervals. Examples of the splitter 1112 include at least one of the following: an optical fiber coupler and a waveguide-type splitter. As will be described later, at least one of the following may be used as the splitter 1112: a lens array, a diffractive optical element, and a spatial light modulator.

[0040] The optical system 112 comprises a focus lens 1121, a galvanometer mirror 1122, and an fθ lens 1123. Multiple processing light ELs are irradiated onto the coating film SF via the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123.

[0041] The focus lens 1121 is an optical element composed of one or more lenses, which adjusts the focusing position of multiple processing light ELs (i.e., the focal position of the optical system 112) by adjusting the position of at least some of the lenses along the optical axis. The galvanometer mirror 1122 deflects the multiple processing light ELs so that they scan the surface of the coating film SF (i.e., multiple illumination areas EA, each illuminated by the multiple processing light ELs, move across the surface of the coating film SF). The galvanometer mirror 112 comprises an X-scanning mirror 1122X and a Y-scanning mirror 1122Y. The X-scanning mirror 1122X reflects the multiple processing light ELs toward the Y-scanning mirror 1122Y. The X-scanning mirror 1122X is oscillating or rotating in the θY direction (i.e., the rotational direction around the Y axis). The oscillating or rotating of the X-scanning mirror 1122X causes the multiple processing light ELs to scan the surface of the coating film SF along the X-axis. The oscillation or rotation of the X-scanning mirror 1122X causes multiple illumination areas EA to move along the X-axis direction on the coating film SF. The X-scanning mirror 1122X changes the relative positional relationship between the multiple illumination areas EA and the coating film SF along the X-axis direction. The Y-scanning mirror 1122Y reflects multiple processing light EL toward the fθ lens 1123. The Y-scanning mirror 1122Y is oscillating or rotating in the θX direction (i.e., the direction of rotation around the X-axis). The oscillation or rotation of the Y-scanning mirror 1122Y causes multiple processing light EL to scan the surface of the coating film SF along the Y-axis direction. The oscillation or rotation of the Y-scanning mirror 1122Y causes multiple illumination areas EA to move along the Y-axis direction on the coating film SF. The Y-scanning mirror 1122Y changes the relative positional relationship between the multiple illumination areas EA and the coating film SF along the Y-axis direction. The fθ lens 1123 is an optical element for focusing multiple processing light EL from the galvanometer mirror 1122 onto the coating film SF.

[0042] The fθ lens 1123 is the terminal optical element of the optical system 112, located on the light-emitting side of the optical system 112 (in other words, the closest to the coating film SF, or located at the end of the optical path of multiple processed light ELs). The fθ lens 1123 is configured to be detachable from the optical system 112. As a result, it is possible to remove the old fθ lens 1123 from the optical system 112 and then attach a new fθ lens 1123 to the optical system 112. However, if the optical system 112 is equipped with an optical element located on the emission side of the fθ lens 1123 (for example, a cover lens), that optical element becomes the terminal optical element, and that optical element is configured to be detachable from the optical system 112.

[0043] The directions of propagation of multiple processing light ELs from the optical system 112 are, for example, parallel to each other. As a result, in this embodiment, multiple processing light ELs with directions of propagation parallel to each other are simultaneously irradiated onto the coating film SF. In other words, multiple irradiation areas EA are simultaneously set on the coating film SF. Therefore, compared to the case where a single processing light EL is irradiated onto the coating film SF, the throughput for processing the coating film SF is improved. Note that the optical system 112 may be configured such that all optical components (e.g., the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123) are not located on the same plane, as shown in Figure 3(d).

[0044] In Figure 1 again, the drive system 12 moves the light irradiation device 11 relative to the coating film SF (i.e., relative to the workpiece S on which the coating film SF is formed) under the control of the control device 18. In other words, the drive system 12 moves the light irradiation device 11 relative to the coating film SF in such a way that the relative positional relationship between the light irradiation device 11 and the coating film SF is changed. When the relative positional relationship between the light irradiation device 11 and the coating film SF is changed, the relative positional relationship between the multiple irradiation areas EA, each irradiated by multiple processing light ELs, and the coating film SF is also changed. For this reason, it can also be said that the drive system 12 moves the light irradiation device 11 relative to the coating film SF in such a way that the relative positional relationship between the multiple irradiation areas EA and the coating film SF is changed. The drive system 12 may also move the light irradiation device 11 along the surface of the coating film SF. In the example shown in Figure 1, the surface of the coating film SF is a plane parallel to at least one of the X-axis and Y-axis, so the drive system 12 may move the light irradiation device 11 along at least one of the X-axis and Y-axis. As a result, the irradiation area EA moves along at least one of the X-axis and Y-axis on the coating film SF. The drive system 12 may move the light irradiation device 11 along the thickness direction of the coating film SF (i.e., the direction intersecting the surface of the coating film SF). In the example shown in Figure 1, the thickness direction of the coating film SF is along the Z-axis, so the drive system 12 may move the light irradiation device 11 along the Z-axis. In addition to at least one of the X-axis, Y-axis and Z-axis, the drive system 12 may also move the light irradiation device 11 along at least one of the θX direction, θY direction and θZ direction (i.e., the rotational direction around the Z-axis).

[0045] The drive system 12 supports the light irradiation device 11 and moves the supported light irradiation device 11. In this case, the drive system 12 includes, for example, a first support member that supports the light irradiation device 11 and a first moving mechanism that moves the first support member.

[0046] The housing device 13 comprises a ceiling member 131 and a partition member 132. The ceiling member 131 is positioned on the +Z side of the light irradiation device 11. The ceiling member 131 is a plate-shaped member aligned with the XY plane. The ceiling member 131 supports the drive system 12 via a support member 133. The partition member 132 is positioned on the outer edge (or near thereof) of the -Z side surface of the ceiling member 131. The partition member 132 is a cylindrical (e.g., cylindrical or rectangular) member extending from the ceiling member 131 toward the -Z side. The space enclosed by the ceiling member 131 and the partition member 132 becomes a housing space SP for housing the light irradiation device 11 and the drive system 12. Therefore, the drive system 12 described above moves the light irradiation device 11 within the housing space SP. Furthermore, the housing space SP includes the space between the light irradiation device 11 and the coating film SF (in particular, the space including the optical path of the processing light EL). More specifically, the containment space SP includes the space between the terminal optical element (e.g., fθ lens 1123) of the light irradiation device 11 and the coating film SF (in particular, the space including the optical path of the processed light EL).

[0047] Each of the ceiling member 131 and partition member 132 is a material capable of shielding the processing light EL. In other words, each of the ceiling member 131 and partition member 132 is opaque with respect to the wavelength of the processing light EL. As a result, the processing light EL propagating within the containment space SP does not leak out to the outside of the containment space SP (i.e., to the outside of the containment device 13). Furthermore, each of the ceiling member 131 and partition member 132 may be a material capable of dimming the processing light EL. In other words, each of the ceiling member 131 and partition member 132 may be semi-transparent with respect to the wavelength of the processing light EL. Moreover, each of the ceiling member 131 and partition member 132 is a material that does not transmit (i.e., can shield) unwanted substances generated by irradiation with processing light EL. An example of unwanted substances is vapor from the coating film SF. As a result, unwanted substances generated within the containment space SP do not leak out to the outside of the containment space SP (i.e., to the outside of the containment device 13).

[0048] The end portion 134 of the partition wall member 132 (specifically, the end portion on the painted film SF side, and in the example shown in Figure 1, the -Z side end portion) is capable of contacting the surface of the painted film SF. When the end portion 134 is in contact with the painted film SF, the housing device 13 (i.e., the ceiling member 131 and the partition wall member 132) works in cooperation with the painted film SF to maintain the airtightness of the housing space SP. When the end portion 134 is in contact with the painted film SF, it is possible to change its shape (in particular, the shape of the contact surface of the end portion 134 that is in contact with the painted film SF (in the example shown in Figure 1, the -Z side surface), the same applies hereinafter) according to the shape of the surface of the painted film SF. For example, when the end portion 134 is in contact with a painted film SF with a planar surface, the shape of the end portion 134 becomes planar, similar to the painted film SF. For example, when the end portion 134 is in contact with a painted film SF with a curved surface, the shape of the end portion 134 becomes curved, similar to the painted film SF. As a result, the airtightness of the containment space SP is improved compared to the case where the end portion 134 cannot change its shape according to the surface shape of the coating film SF. An example of an end portion 134 that can change its shape is an end portion 134 formed from an elastic material such as rubber (in other words, a flexible material). Furthermore, as an end portion 134 that can change its shape, a bellows-shaped end portion 134a with an elastic structure, such as that shown in Figure 4, may be used.

[0049] Returning to Figure 1, the end portion 134 can adhere to the coating film SF while in contact with it. For example, the end portion 134 may be equipped with an adsorption mechanism capable of adsorbing onto the coating film SF. When the end portion 134 adheres to the coating film SF, the airtightness of the containment space SP is further improved compared to the case where the end portion 134 does not adhere to the coating film SF. However, the end portion 134 does not necessarily have to be able to adhere to the coating film SF. Even in this case, as long as the end portion 134 is in contact with the coating film SF, the airtightness of the containment space SP will still be maintained to a reasonable extent.

[0050] The partition member 132 is a member that can extend and retract along the Z-axis by a drive system (e.g., an actuator) not shown, which operates under the control of the control device 18. For example, the partition member 132 may be a bellows-shaped member (so-called bellows). In this case, the partition member 132 can extend and retract by the extension and retraction of the bellows portion. Alternatively, for example, the partition member 132 may comprise a telescopic pipe made up of a plurality of hollow cylindrical members having different diameters. In this case, the partition member 132 can extend and retract by the relative movement of the plurality of cylindrical members. The state of the partition member 132 can be set to at least a first extended state in which the length in the Z-axis direction is relatively long as the partition member 132 extends along the Z-axis, and a first contracted state in which the length in the Z-axis direction is relatively short as the partition member 132 contracts along the Z-axis. When the partition member 132 is in the first extended state, the end portion 134 can contact the paint film SF. On the other hand, when the partition member 132 is in the first contracted state, the end portion 134 does not come into contact with the paint film SF. In other words, when the partition member 132 is in the first contracted state, the end portion 134 is away from the paint film SF on the +Z side. Note that the configuration for switching the state of the partition member 132 between a first extended state in which the end portion 134 of the partition member 132 can come into contact with the paint film SF and a first contracted state in which the end portion 134 is away from the paint film SF is not limited to a configuration in which the partition member 132 expands and contracts. For example, the state of the partition member 132 may be switched between the first extended state and the first contracted state by configuring the housing device 13 itself to be movable along the ±Z direction.

[0051] The containment device 13 is further equipped with a detection device 135. The detection device 135 detects unwanted substances in the containment space SP (i.e., substances generated by irradiation with processing light EL). The detection results of the detection device 135 are referenced by the control device 18 when changing the state of the partition wall member 132 from the first extended state to the first retracted state, as will be described in detail later.

[0052] The support device 14 supports the housing device 13. Since the housing device 13 supports the drive system 12 and the light irradiation device 11, the support device 14 substantially supports the drive system 12 and the light irradiation device 11 via the housing device 13. To support the housing device 13, the support device 14 comprises a beam member 141 and a plurality of leg members 142. The beam member 141 is positioned on the +Z side of the housing device 13. The beam member 141 is a beam-shaped member extending along the XY plane. The beam member 141 supports the housing device 13 via the support device 143. A plurality of leg members 142 are positioned on the beam member 141. The leg members 142 are rod-shaped members extending from the beam member 141 toward the -Z side.

[0053] The end portion 144 of the leg member 142 (specifically, the end portion on the side of the coating film SF, and in the example shown in Figure 1, the -Z end portion) is capable of contacting the surface of the coating film SF. As a result, the support device 14 is supported by the coating film SF (i.e., by the workpiece S). In other words, the support device 14 supports the housing device 13 with its end portion 144 in contact with the coating film SF (in other words, with the support device 14 supported by the coating film S). The end portion 144, like the end portion 134 of the housing device 13, can change its shape (in particular, the shape of the contact surface of the end portion 144 that contacts the coating film SF (in the example shown in Figure 1, the -Z side surface), hereinafter the same) according to the shape of the surface of the coating film SF when it comes into contact with the coating film SF. The end portion 144 can adhere to the coating film SF while in contact with it. For example, the end portion 144 may be equipped with an adsorption mechanism capable of adsorbing onto the coating film SF. When the end portion 144 adheres to the paint film SF, the stability of the support device 14 is improved compared to when the end portion 144 does not adhere to the paint film SF. However, it is not necessary for the end portion 144 to be able to adhere to the paint film SF.

[0054] The beam member 141 is a member that can extend and retract along at least one of the X-axis and Y-axis (or along any direction along the XY plane) by a drive system 15 that operates under the control of a control device 18. For example, the beam member 141 may comprise a telescopic pipe made up of multiple cylindrical members having different diameters. In this case, the beam member 141 can extend and retract by the relative movement of the multiple cylindrical members.

[0055] The leg member 142 is a member that can extend and retract along the Z-axis by a drive system 15 that operates under the control of a control device 18. For example, the leg member 142 may include a telescopic pipe made up of multiple cylindrical members of different diameters. In this case, the leg member 142 can extend and retract by the relative movement of the multiple cylindrical members. The state of the leg member 142 can be set to at least a second extended state in which the length in the Z-axis direction is relatively long because the leg member 142 extends along the Z-axis, and a second retracted state in which the length in the Z-axis direction is relatively short because the leg member 142 retracts along the Z-axis. When the leg member 142 is in the second extended state, the end 144 can contact the paint film SF. On the other hand, when the leg member 142 is in the second retracted state, the end 144 does not contact the paint film SF. In other words, when the leg member 142 is in the second retracted state, the end 144 is away from the paint film SF on the +Z side.

[0056] The drive system 15 moves the support device 14 relative to the coating film SF (i.e., relative to the workpiece S on which the coating film SF is formed) under the control of the control device 18. In other words, the drive system 15 moves the support device 14 relative to the coating film SF in such a way that it changes the relative positional relationship between the support device 14 and the coating film SF. Since the support device 14 supports the housing device 13, the drive system 15 essentially moves the housing device 13 relative to the coating film SF by moving the support device 14. In other words, the drive system 15 essentially moves the support device 14 relative to the coating film SF in such a way that it changes the relative positional relationship between the housing device 13 and the coating film SF. Furthermore, the housing device 13 supports the light irradiation device 11 via the drive system 12. Therefore, the drive system 15 essentially moves the light irradiation device 11 relative to the coating film SF by moving the support device 14. In other words, the drive system 15 can move the support device 14 relative to the coating film SF in a manner that substantially changes the relative positional relationship between the light irradiation device 11 and the coating film SF. To put it another way, the drive system 15 can move the support device 14 relative to the coating film SF in a manner that substantially changes the relative positional relationship between multiple irradiation areas EA and the coating film SF.

[0057] The drive system 15 extends and retracts the beam member 141 under the control of the control device 18 in order to move the support device 14. Furthermore, the drive system 15 extends and retracts multiple leg members 142 under the control of the control device 18 in order to move the support device 14. The manner in which the support device 14 is moved by the drive system 15 will be described in detail later with reference to Figures 7 to 17.

[0058] The exhaust device 16 is connected to the containment space SP via an exhaust pipe 161. The exhaust device 16 is capable of exhausting gas from the containment space SP. In particular, by exhausting gas from the containment space SP, the exhaust device 16 can draw unwanted substances generated by the irradiation of the processing light EL from the containment space SP to the outside of the containment space SP. In particular, if these unwanted substances are present in the optical path of the processing light EL, they may affect the irradiation of the processing light EL to the coating film SF. For this reason, the exhaust device 16 particularly draws in unwanted substances along with the gas in the space from the space including the optical path of the processing light EL between the terminal optical element of the optical system 112 and the coating film SF. The unwanted substances drawn in by the exhaust device 16 from the containment space SP are discharged to the outside of the processing apparatus 1 via a filter 162. The filter 162 adsorbs the unwanted substances. The filter 162 may be detachable or replaceable.

[0059] The gas supply device 17 is connected to the containment space SP via an intake pipe 171. The gas supply device 17 can supply gas to the containment space SP. The gas supplied to the containment space SP may be at least one of the following: air, CDA (clean dry air), or an inert gas. Nitrogen gas is an example of an inert gas. In this example, the gas supply device 17 supplies CDA. Therefore, the containment space SP becomes a space purged by CDA. At least a portion of the CDA supplied to the containment space SP is drawn in by the exhaust device 16. The CDA drawn in by the exhaust device 16 from the containment space SP passes through the filter 162 and is discharged to the outside of the processing device 1.

[0060] The gas supply device 17 specifically supplies a gas such as CDA to the optical surface 1124 on the housing space SP side of the fθ lens 1123 shown in Figure 3 (i.e., the optical surface on the housing space SP side of the terminal optical element of the optical system 112). Because the optical surface 1124 faces the housing space SP, it may be exposed to unwanted substances generated by the irradiation of the processing light EL. As a result, unwanted substances may adhere to the optical surface 1124. Furthermore, because the processing light EL passes through the optical surface 1124, there is a possibility that the unwanted substances adhering to the optical surface 1124 may be baked on (i.e., fixed) by the processing light EL passing through the optical surface 1124. Unwanted substances adhering to (and even fixed to) the optical surface 1124 may become dirt on the optical surface 1124 and may affect the characteristics of the processing light EL. However, when a gas such as CDA is supplied to the optical surface 1124, contact between the optical surface 1124 and unwanted substances is prevented. Therefore, the adhesion of dirt to the optical surface 1124 is prevented. Accordingly, the gas supply device 17 also functions as an adhesion prevention device that prevents dirt from adhering to the optical surface 1124. Furthermore, even if dirt does adhere to (and even become fixed to) the optical surface 1124, the dirt may be removed (for example, blown off) by the CDA supplied to the optical surface 1124. Accordingly, the gas supply device 17 can also function as an adhesion prevention device that removes dirt that has adhered to the optical surface 1124.

[0061] The control device 18 controls the overall operation of the processing apparatus 1. In particular, the control device 18 controls the light irradiation device 11, the drive system 12, the housing device 13, and the drive system 15 so that recesses C of the desired shape are formed at the desired positions, as will be described in detail later.

[0062] (2) Specific examples of processing operations by processing device 1 (2-1) Specific examples of structures formed by machining operations As described above with reference to Figure 2, in this embodiment, the processing apparatus 1 forms recesses C in the coating film SF. The recesses C are formed in the portion of the coating film SF that is actually irradiated with processing light EL (i.e., the portion where the irradiation area EA, where the processing light EL is actually irradiated, is set). Therefore, by appropriately setting the position on the coating film SF where the processing light EL is actually irradiated (i.e., the position where the irradiation area EA, where the processing light EL is actually irradiated, is set), recesses C can be formed at desired positions on the coating film SF. In other words, it becomes possible to form a structure made of the coating film SF on the workpiece S.

[0063] In this embodiment, the processing apparatus 1 forms a riblet structure, which is an example of such a structure made of a coating film SF, on the workpiece S under the control of the control device 18. The riblet structure is a structure that can reduce the fluid resistance (particularly frictional resistance and turbulent frictional resistance) of the surface of the coating film SF. The fluid resistance of the workpiece S on which the riblet structure is formed is smaller than the fluid resistance of the workpiece S on which the riblet structure is not formed. For this reason, the riblet structure can also be said to be a structure that can reduce the fluid resistance of the surface of the workpiece S. The term "fluid" here refers to any medium (gas, liquid) flowing on the surface of the coating film SF. For example, even if the medium itself is stationary, if the surface of the coating film SF is moving, this medium may also be referred to as a fluid.

[0064] An example of a riblet structure is shown in Figures 5(a) and 5(b). As shown in Figures 5(a) and 5(b), the riblet structure is a structure in which a plurality of concave structures CP1 (i.e., concave structures CP1 formed linearly so as to extend along the first direction) are arranged along a second direction intersecting the first direction (in the example shown in Figures 5(a) and 5(b), the X-axis direction), which are formed by continuously forming recesses C along a first direction (i.e., the Y-axis direction). A convex structure CP2 protruding from the surroundings substantially exists between two adjacent concave structures CP1. Therefore, the riblet structure can also be said to be a structure in which a plurality of convex structures CP2 extending linearly along a first direction (e.g., the Y-axis direction) are arranged along a second direction intersecting the first direction (e.g., the X-axis direction). The riblet structure shown in Figures 5(a) and 5(b) is a periodic structure.

[0065] The spacing between two adjacent concave structures CP1 (i.e., the array pitch P1 of the concave structures CP1) is, for example, a few microns to several hundred microns, but may be of other sizes. Furthermore, the depth D of each concave structure CP1 (i.e., the depth in the Z-axis direction) is, for example, a few microns to several hundred microns, but may be of other sizes. The depth D of each concave structure CP1 may be less than or equal to the array pitch P1 of the concave structures CP1. The depth D of each concave structure CP1 may be less than or equal to half the array pitch P1 of the concave structures CP1. The shape of the cross-section of each concave structure CP1 including the Z-axis (specifically, the cross-section along the XZ plane) is a bowl-shaped curve, but may be a triangle, a quadrilateral, or a polygon with pentagons or more. Similarly, the spacing between two adjacent convex structures CP2 (i.e., the array pitch P2 of the convex structures CP2) is, for example, a few microns to several hundred microns, but may be of other sizes. Furthermore, the height H of each convex structure CP2 (i.e., the height in the Z-axis direction) is, for example, several microns to several hundred microns, but may be of other sizes. The height H of each convex structure CP2 may be less than or equal to the arrangement pitch P2 of the convex structures CP2. The height H of each convex structure CP2 may be less than or equal to half the arrangement pitch P2 of the convex structures CP2. The shape of the cross-section of each convex structure CP2 including the Z-axis (specifically, the cross-section along the XZ plane) is a mountain shape with a curved slope, but may be a triangle, a quadrilateral, or a polygon with pentagons or more. Note that the riblet structure formed by the processing apparatus 1 may be an existing riblet structure, such as the one described in Chapter 5 of the "Handbook of Mechanical Engineering, Basic Edition, α4 ​​Fluid Engineering" edited by the Japan Society of Mechanical Engineers, so a detailed explanation of the riblet structure itself will be omitted.

[0066] As described above, such a riblet structure can reduce the fluid resistance of the surface of the workpiece S on which the riblet structure is formed. For this reason, the workpiece S may be an object (e.g., a structure) for which it is desirable to reduce fluid resistance. For example, the workpiece S may include an object (i.e., a moving body) that is movable so as to move through a fluid (e.g., at least one of gas and liquid). Specifically, for example, the workpiece S may include the airframe of an aircraft PL (e.g., at least one of the fuselage PL1, main wing PL2, vertical stabilizer PL3, and horizontal stabilizer PL4), as shown in Figures 6(a) to 6(c). In this case, as shown in Figures 6(a) and 6(c), the processing apparatus 1 may be self-supporting on the airframe of the aircraft PL by a support device 14. Alternatively, because the end portion 144 of the leg member 142 of the support device 14 can adhere to the paint film SF, the processing device 1 may be attached to the aircraft PL so as to be suspended (i.e., hanging) from the aircraft PL by the support device 14, as shown in Figure 6(b). Furthermore, because the end portion 144 of the leg member 142 of the support device 14 can adhere to the paint film SF and the end portion 134 of the bulkhead member 132 of the housing device 13 can adhere to the paint film SF, the processing device 1 can stand on its own on the paint film SF even when the surface of the paint film SF is facing upward and inclined with respect to the horizontal plane. Furthermore, the processing device 1 can be attached to the paint film SF so as to be suspended from the paint film SF even when the surface of the paint film SF is facing downward and inclined with respect to the horizontal plane. In any case, the light irradiation device 11 can move along the surface of the aircraft by the drive system 12 and / or by the movement of the support device 14. Therefore, the processing apparatus 1 can form a riblet structure using the coating film SF even on workpieces S such as aircraft fuselages (i.e., workpieces S whose surfaces are curved, whose surfaces are inclined with respect to the horizontal plane, or whose surfaces face downwards).

[0067] In addition, for example, the workpiece S may include the body of an automobile. For example, the workpiece S may include the hull of a ship. For example, the workpiece S may include the body of a rocket. For example, the workpiece S may include a turbine (for example, at least one of a hydraulic turbine and a wind turbine, and in particular its turbine blades). Alternatively, for example, the workpiece S may include a component that constitutes an object that is movable so as to move through a fluid. Alternatively, for example, the workpiece S may include an object that is fixed in a flowing fluid, at least in part. Specifically, for example, the workpiece S may include a bridge girder installed in a river or the sea.

[0068] The example of the workpiece S given here is a relatively large object (for example, an object on the order of several meters to several hundred meters in size). In this case, as shown in Figures 6(a) to 6(c), the size of the light irradiation device 11 is smaller than the size of the workpiece S. However, the workpiece S can be an object of any size. For example, the workpiece S may be an object on the order of kilometers, centimeters, millimeters, or micrometers in size.

[0069] The size of the riblet structure described above (for example, at least one of the following: the arrangement pitch P1 of the concave structure CP1, the depth D of each concave structure CP1, the arrangement pitch P2 of the convex structure CP2, the height H of each convex structure CP2, etc.) may be set to an appropriate size that adequately reduces friction, depending on what kind of object the workpiece S is. More specifically, the size of the riblet structure may be set to an appropriate size that adequately reduces friction, depending on at least one of the following: the type of fluid distributed around the workpiece S during use (i.e., operation), the relative velocity of the workpiece S with respect to the fluid, and the shape of the workpiece S. For example, if the workpiece S is the fuselage of an aircraft flying at an altitude of 10 km and a speed of 1000 km / h during cruising, the arrangement pitch P1 of the concave structure CP1 (i.e., the arrangement pitch P2 of the convex structure CP2) may be set to, for example, about 78 micrometers.

[0070] Furthermore, the size of the riblet structure described above may be set to an appropriate size that adequately reduces friction, depending on what kind of object the workpiece S is and on which part of that object the riblet structure is formed. For example, if the workpiece S is the fuselage of an aircraft PL, the size of the riblet structure formed on the fuselage PL1 may be different from the size of the riblet structure formed on the main wing PL2.

[0071] (2-2) Flow of machining operations Next, referring to Figures 7 through 17, we will explain the flow of the machining operations for forming the riblet structure.

[0072] First, as described above, multiple processing light ELs are deflected by the galvanometer mirror 1122. In order to form a riblet structure, the galvanometer mirror 1122 deflects the multiple processing light ELs in such a way that it alternately repeats a scanning operation in which the multiple processing light ELs scan the surface of the painted film SF along the Y axis (i.e., moves multiple irradiation areas EA along the Y axis on the surface of the painted film SF) and a stepping operation in which it moves multiple irradiation areas EA along the X axis by a predetermined amount on the surface of the painted film SF. At this time, there is a limit to the size of the area on the surface of the painted film SF in which multiple processing light ELs can be scanned by controlling the galvanometer mirror 1122 while the light irradiation device 11 remains stationary relative to the painted film SF. Therefore, in this embodiment, as shown in Figure 7, the control device 18 sets multiple unit processing areas SA on the surface of the painted film SF (in particular, the area of ​​the painted film SF in which the riblet structure should be formed). Each unit processing area SA corresponds to an area on the painted film SF in which multiple processing light ELs can be scanned by controlling the galvanometer mirror 1122 while the light irradiation device 11 remains stationary relative to the painted film SF. Each unit machining area SA has a rectangular shape, but its shape is arbitrary.

[0073] The control device 18 controls the light irradiation device 11 to irradiate a single unit processing area SA (e.g., SA1) with multiple processing light ELs deflected by the galvanometer mirror 1122, thereby forming a riblet structure in that unit processing area SA (SA1). Subsequently, the control device 18 controls at least one of the drive systems 12 and 15 to move the light irradiation device 11 relative to the coating film SF, thereby positioning the light irradiation device 11 in a location where multiple processing light ELs can be irradiated to another unit processing area SA (e.g., SA2). Subsequently, the control device 18 controls the light irradiation device 11 to irradiate the other unit processing area SA (SA2) with multiple processing light ELs deflected by the galvanometer mirror 1122, thereby forming a riblet structure in that other unit processing area SA. The control device 18 repeats the following operations for all unit processing areas SA1 to SA16 to form the riblet structure.

[0074] The following explanation will continue using the example of forming a riblet structure in unit machining regions SA1 to SA4, as shown in Figure 7. Note that the following explanation will use an example where two adjacent unit machining regions SA are located within the containment space SP along the X-axis. However, the same operation will occur even when any number of unit machining regions SA are located within the containment space SP.

[0075] As shown in Figure 8, first, the control device 18 controls the drive system 15 to move the support device 14 relative to the painted film SF so that the housing device 13 is positioned in a first housing position where the unit processing areas SA1 and SA2 are located within the housing space SP. In other words, the control device 18 moves the housing device 13, supported by the support device 14, so that the unit processing areas SA1 and SA2 are covered by the housing device 13. Furthermore, the control device 18 controls the drive system 12 to move the light irradiation device 11 relative to the painted film SF so that the light irradiation device 11 is positioned in a first irradiation position where multiple processing light ELs can be irradiated onto the unit processing area SA1. After the housing device 13 is positioned in the first housing position and the light irradiation device 11 is positioned in the first irradiation position, the partition wall member 132 enters a first extended state. Consequently, the end portion 134 of the partition wall member 132 comes into contact with and adheres to the painted film SF. Similarly, the multiple leg members 142 enter a second extended state. Therefore, the ends 144 of the multiple leg members 142 come into contact with and adhere to the paint film SF.

[0076] Subsequently, as shown in Figures 9(a) and 9(b), the control device 18 controls the light irradiation device 11 (particularly the galvanometer mirror 1122) so that multiple processing light ELs scan the unit processing area SA1. Specifically, in order to perform the scanning operation described above, the control device 18 controls the Y scanning mirror 1122Y of the galvanometer mirror 1122 so that multiple processing light ELs scan a certain area within the unit processing area SA1 along the Y axis. While the scanning operation is being performed, the light source system 111 irradiates with multiple processing light ELs. Subsequently, in order to perform the step operation described above, the control device 18 rotates the X scanning mirror 1122X of the galvanometer mirror 1122 by a unit step amount. While the step operation is being performed, the light source system 111 does not irradiate with multiple processing light ELs. Subsequently, in order to perform the scanning operation described above, the control device 18 controls the Y scanning mirror 1122Y of the galvanometer mirror 1122 so that multiple processing light ELs scan a certain area within the unit processing area SA1 along the Y axis. In this manner, the control device 18 controls the galvano mirror 1122 so that multiple processing light ELs scan the entire unit processing area SA1 (or a portion of the unit processing area SA1 in which the riblet structure is to be formed) by alternately repeating scanning and stepping operations. As a result, a riblet structure is formed in the unit processing area SA1. Note that, as shown in Figures 9(a) and 9(b), the width of the area scanned by the processing light ELs (i.e., the width of the unit processing area SA, especially the width in the X-axis direction) is greater than the width of the light irradiation device 11 (especially the width in the X-axis direction).

[0077] The control device 18 controls the drive system 15 so that the multiple leg members 142 remain in the second extended state while the light irradiation device 11 is irradiating with processing light EL. As a result, the ends 144 of the multiple leg members 142 continue to adhere to the coating film SF. Consequently, the stability of the support device 14 is improved, reducing the possibility that the irradiation area EA of the processing light EL may unintentionally shift on the coating film SF due to the instability of the support device 14. However, for at least part of the period while the light irradiation device 11 is irradiating with processing light EL, some of the multiple leg members 142 may be in the second contracted state, as long as the support device 14 can stand on its own on the coating film SF (or can adhere to the coating film SF in a way that it is suspended from the coating film SF).

[0078] The control device 18 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 remains in the first extended state while the light irradiation device 11 is irradiating with processing light EL. As a result, the end portion 134 of the partition member 132 remains attached to the coating film SF. Consequently, the airtightness of the containment space SP is maintained, and the processing light EL propagating within the containment space SP does not leak out to the outside of the containment space SP (i.e., to the outside of the containment device 13). Furthermore, unwanted substances generated within the containment space SP do not leak out to the outside of the containment space SP (i.e., to the outside of the containment device 13).

[0079] Furthermore, there is a possibility that at least a portion of the end portion 134, which should be attached to the coating film SF, may detach from the coating film SF due to some factor. In this case, if the light irradiation device 11 continues to irradiate with processing light EL, at least one of the processing light EL and unwanted substances may leak out of the containment device 13. Therefore, if the control device 18 detects that at least a portion of the end portion 134 has detached from the coating film SF during the period in which the light irradiation device 11 is irradiating with processing light EL, it may control the light irradiation device 11 to stop irradiating with processing light EL.

[0080] Subsequently, as shown in Figure 10, the control device 18 controls the drive system 12 so that the light irradiation device 11 moves from the first irradiation position to the second irradiation position, which allows the light irradiation device 11 to irradiate the unit processing area SA2 with multiple processing light ELs. While the light irradiation device 11 is moving, the control device 18 controls the light irradiation device 11 so that it does not irradiate the processing light ELs.

[0081] Subsequently, as shown in Figures 11(a) and 11(b), the control device 18 controls the light irradiation device 11 (particularly the galvanometer mirror 1122) so that multiple processing light ELs scan the unit processing area SA2. Specifically, the control device 18 alternately repeats the scanning operation and the stepping operation described above to control the light irradiation device 11 (particularly the galvanometer mirror 1122) so that multiple processing light ELs scan the entire unit processing area SA2 (or a portion of the unit processing area SA2 in which the riblet structure is to be formed). As a result, a riblet structure is formed in the unit processing area SA2. Note that each individual recess CP1 constituting the riblet structure in the unit processing area SA1 may or may not be continuously connected to each individual recess CP1 constituting the riblet structure in the unit processing area SA2 (or other unit processing area SA) adjacent to the unit processing area SA1. This is because the size of the unit processing area SA can be secured to be at least 10 cm, and therefore the continuous length of a single recess CP1 formed as a result of scanning the processing light EL within the unit processing area SA will be at least 10 cm, which is sufficiently longer than the continuous length (approximately a few millimeters) at which the riblet structure can function, calculated from the airspeed and turbulence frequency during aircraft operation (i.e., cruising).

[0082] When a riblet structure is formed in a unit processing area SA2, there are no unit processing areas SA in the containment space SP where a riblet structure has not yet been formed. Therefore, simply moving the light irradiation device 11 within the containment space SP using the drive system 12 is not enough for the light irradiation device 11 to irradiate multiple processing light ELs into the unit processing areas SA where a riblet structure has not yet been formed to form a riblet structure. So, when there are no unit processing areas SA in the containment space SP where a riblet structure has not yet been formed, the control device 18 controls the drive system 15 by moving the support device 14 (i.e., by moving the containment device 13) so that a unit processing area SA where a riblet structure has not yet been formed is newly positioned within the containment space SP.

[0083] Specifically, as shown in Figure 12, the control device 18 controls a drive system (not shown) that extends and retracts the partition wall member 132 so that the state of the partition wall member 132 switches from the first extended state to the first retracted state. As a result, the end portion 134 of the partition wall member 132 separates from the coating film SF. Furthermore, during the period when the support device 14 is moving, the control device 18 controls the light irradiation device 11 so that it does not irradiate the processing light EL. Therefore, even if the end portion 134 separates from the coating film SF, there is no possibility that at least one of the processing light EL or unwanted substances will leak out of the containment device 13.

[0084] However, although unwanted substances present in the containment space SP are sucked out to the outside of the containment space SP by the exhaust device 16 described above, there is a possibility that, due to some factor, not all of the unwanted substances present in the containment space SP are sucked out by the exhaust device 16 (i.e., some unwanted substances remain in the containment space SP). In this case, when the end portion 134 separates from the paint film SF, the unwanted substances may leak out to the outside of the containment device 13. For this reason, the control device 18 determines whether or not to switch the partition member 132 from the first extended state to the first retracted state based on the detection result of the detection device 135 that detects unwanted substances in the containment space SP. If unwanted substances remain in the containment space SP, the control device 18 does not switch the partition member 132 from the first extended state to the first retracted state. In this case, the exhaust device 16 continues to suck out the unwanted substances remaining in the containment space SP. On the other hand, if no unwanted substances remain in the containment space SP, the control device 18 switches the partition member 132 from the first extended state to the first retracted state.

[0085] Furthermore, the control device 18 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the paint film SF in conjunction with the movement of the support device 14 (in particular, the extension of the beam member 141 which had been contracted, as will be described later) switches from the second extended state to the second contracted state. The leg member 142 that moves relative to the paint film SF in conjunction with the extension of the beam member 141 which had been contracted is typically the leg member 142 located on the front side in the direction of movement of the support device 14 (i.e., the direction of movement of the housing device 13) among the multiple leg members 142. In the example shown in Figure 12, the support device 14 moves toward the +X side, and the leg member 142 located on the front side in the direction of movement of the support device 14 is the leg member 142 located on the +X side. Hereinafter, the leg member 142 located on the front side in the direction of movement of the support device 14 will be referred to as the "front leg member 142". As a result, the end 144 of the front leg member 142 moves away from the paint film SF.

[0086] Subsequently, as shown in Figure 13, the control device 18 controls the drive system 15 so that the housing device 13 moves from the first housing position to the second housing position where the unit processing areas SA3 and SA4 are located within the housing space SP. Specifically, the control device 18 controls the drive system 15 so that the beam member 141 extends along the direction of movement of the support device 14. As a result, the beam member 141 extends while supporting the housing device 13 (and further, while supporting the light irradiation device 11 supported by the housing device 13). Furthermore, in parallel with the movement of the support device 14, the control device 18 controls the drive system 12 so that the light irradiation device 11 moves from the second irradiation position to the third irradiation position where the light irradiation device 11 can irradiate the unit processing area SA3 with multiple processing light ELs.

[0087] During the period when the support device 14 is moving (i.e., when the retracted beam member 141 is extending), the control device 18 controls a drive system (not shown) that extends and retracts the partition wall member 132 so that the partition wall member 132 remains in the first retracted state. As a result, the movement of the support device 14 (i.e., the movement of the housing device 13) is not hindered by contact between the end 134 of the partition wall member 132 and the paint film SF. Furthermore, the paint film SF is not damaged by contact between the end 134 and the paint film SF during the movement of the support device 14. However, if the movement of the support device 14 is not hindered by contact between the end 134 and the paint film SF, then at least a portion of the end 134 may be in contact with the paint film SF for at least a portion of the period during which the support device 14 is moving. If the paint film SF is not damaged by contact between the end portion 134 and the paint film SF during the movement of the support device 14, then at least a portion of the end portion 134 may be in contact with the paint film SF for at least a portion of the time while the support device 14 is moving.

[0088] Furthermore, while the support device 14 is moving, the control device 18 controls the drive system 15 so that the front leg member 142 remains in the second retracted state. As a result, the movement of the support device 14 (i.e., the movement of the housing device 13) is not hindered by contact between the end 144 of the front leg member 142 and the paint film SF. Furthermore, the paint film SF is not damaged by contact between the end 144 and the paint film SF while the support device 14 is moving. However, if the movement of the support device 14 is not hindered by contact between the end 144 and the paint film SF, then at least a portion of the end 144 may be in contact with the paint film SF for at least a portion of the period while the support device 14 is moving. If the paint film SF is not damaged by contact between the end 144 and the paint film SF while the support device 14 is moving, then at least a portion of the end 144 may be in contact with the paint film SF for at least a portion of the period while the support device 14 is moving.

[0089] Furthermore, while the support device 14 is moving, the control device 18 controls the drive system 15 so that the leg members 142 other than the front leg member 142 among the multiple leg members 142 remain in the second extended state. As a result, the movement of the support device 14 (i.e., the movement of the housing device 13) is not hindered by contact between the end 144 of the front leg member 142 and the paint film SF. Moreover, the paint film SF is not damaged by contact between the end 144 and the paint film SF while the support device 14 is moving. Even if the end 144 of the front leg member 142 is separated from the paint film SF, the end 144 of the other leg members 142 are still in contact with the paint film SF. Therefore, the support device 14 remains capable of standing on the paint film SF (or being able to attach to the paint film SF so as to be suspended from it), just as if all the end 144 of the multiple leg members 142 were in contact with the paint film SF.

[0090] Furthermore, while the support device 14 is moving, the control device 18 controls the light irradiation device 11 so that it does not irradiate the processing light EL.

[0091] After the housing device 13 is positioned in the second housing position, as shown in Figure 14, the control device 18 controls a drive system (not shown) that extends and retracts the bulkhead member 132 so that the bulkhead member 132 switches from a first retracted state to a first extended state. As a result, the end portion 134 of the bulkhead member 132 comes into contact with and adheres to the paint film SF. Furthermore, the control device 18 controls the drive system 15 so that the front leg member 142 switches from a second retracted state to a second extended state. As a result, the end portion 144 of the front leg member 142 comes into contact with and adheres to the paint film SF. Here, the extension operation of the bulkhead member 132 and the extension operation of the front leg member 142 may be performed simultaneously or with a time difference.

[0092] Subsequently, as shown in Figure 15, the control device 18 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the paint film SF in conjunction with the movement of the support device 14 (in particular, the contraction of the extended beam member 141, as will be described later) switches from the second extended state to the second contracted state. The leg member 142 that moves relative to the paint film SF in conjunction with the contraction of the extended beam member 141 is typically the leg member 142 located on the rear side in the direction of movement of the support device 14. In the example shown in Figure 15, the leg member 142 located on the rear side in the direction of movement of the support device 14 is the leg member 142 located on the -X side. Hereinafter, the leg member 142 located on the rear side in the direction of movement of the support device 14 will be referred to as the "rear leg member 142". As a result, the end 144 of the rear leg member 142 moves away from the paint film SF.

[0093] Subsequently, as shown in Figure 16, the control device 18 controls the drive system 15 so that the beam member 141, which was extending along the direction of movement of the support device 14, is retracted.

[0094] After the reduction of the beam member 141 is complete, as shown in Figure 17, the control device 18 controls the drive system 15 so that the rear leg member 142 switches from the second reduced state to the second extended state. As a result, the end portion 144 of the rear leg member 142 comes into contact with and adheres to the paint film SF.

[0095] Subsequently, the control device 18 controls the light irradiation device 11 so that multiple processing light ELs scan unit processing areas SA3 and SA4, similar to how multiple processing light ELs scan unit processing areas SA1 and SA2. This operation is repeated, so that multiple processing light ELs are irradiated onto the surface of the coating film SF (especially the areas of the coating film SF where the riblet structure should be formed). As a result, a riblet structure is formed on the workpiece S by the coating film SF.

[0096] (3) Technical effects of processing apparatus 1 As described above, the processing apparatus 1 of this embodiment can form a riblet structure on the surface of a workpiece S (particularly the coating film SF formed on its surface) by irradiating the workpiece S with processing light EL. For this reason, the processing apparatus 1 can form a riblet structure relatively easily and in a relatively short time compared to a processing apparatus that forms a riblet structure by grinding off the surface of the workpiece S with a cutting tool such as an end mill.

[0097] Furthermore, the processing apparatus 1 can simultaneously irradiate multiple processing light ELs to form multiple concave structures CP1 at the same time. Therefore, compared to a processing apparatus that can only form one concave structure CP1 at a time by irradiating with a single processing light EL, the throughput for forming riblet structures is improved.

[0098] Furthermore, the processing apparatus 1 can deflect multiple processing light ELs with the galvanometer mirror 1122, enabling relatively high-speed scanning of the coating film SF. This improves the throughput for forming the riblet structure.

[0099] Furthermore, instead of directly processing the workpiece S, the processing apparatus 1 can form a riblet structure on the surface of the workpiece S by processing the coating film SF formed on the surface of the workpiece S. Therefore, compared to processing apparatuses that form a riblet structure by newly adding (for example, attaching) a special material to the surface of the workpiece S (i.e., the surface of the coating film SF), it is possible to avoid an increase in the weight of the workpiece S caused by the formation of the riblet structure.

[0100] Furthermore, because the processing device 1 does not directly process the workpiece S, it can relatively easily reshape the riblet structure. Specifically, when reshaping the riblet structure, the riblet structure made of the coating film SF is first peeled off, and then a new coating film SF is applied. Subsequently, the processing device 1 can form a new riblet structure by processing the newly applied coating film SF. Therefore, deterioration of the riblet structure (e.g., damage) can be dealt with relatively easily by reshaping the riblet structure.

[0101] Furthermore, because the processing device 1 does not directly process the workpiece S, it can form a riblet structure on the surface of the workpiece S that is difficult to process directly or that does not originally have a riblet structure. In other words, if the processing device 1 processes the coating film SF after it has been applied to the surface of the workpiece S, a riblet structure can be formed relatively easily.

[0102] Furthermore, the processing apparatus 1 can form a riblet structure using a coating film SF. The coating film SF typically has relatively high durability against the external environment (for example, heat, light, and at least one of wind). Therefore, the processing apparatus 1 can relatively easily form a riblet structure with relatively high durability.

[0103] Furthermore, in this embodiment, the optical path of the processing light EL between the terminal optical element of the optical system 112 and the coating film SF is contained within the containment space SP. Therefore, compared to a processing apparatus in which the optical path of the processing light EL is not contained within the containment space SP (i.e., it is open to an open space), it is possible to appropriately prevent the processing light EL irradiated onto the coating film SF (or the scattered or reflected light of the processing light EL from the coating film SF, etc.) from propagating to the surroundings of the processing apparatus 1 (in other words, from scattering). Furthermore, it is possible to appropriately prevent unwanted substances generated by the irradiation of the processing light EL from propagating to the surroundings of the processing apparatus 1 (in other words, from scattering).

[0104] Furthermore, in this embodiment, the light irradiation device 11 is supported by a support device 14 that can move on the coating film SF. Therefore, the processing device 1 can process the coating film SF, which is spread over a relatively wide area, with relative ease. In other words, the processing device 1 can form a riblet structure with the coating film SF over a relatively wide area of ​​the surface of the workpiece S. Moreover, since the processing device 1 does not need to move the workpiece S, it can form a riblet structure relatively easily even on the surface of a relatively large or heavy workpiece S.

[0105] Furthermore, the processing apparatus 1 can use an exhaust device 16 to suck out unwanted substances generated by the irradiation of the processing light EL to the outside of the containment space SP. Therefore, the irradiation of the processing light EL onto the coating film SF is hardly hindered by unwanted substances. As a result, the irradiation accuracy of the processing light EL is improved compared to a processing apparatus that does not have an exhaust device 16 (i.e., the irradiation of the processing light EL onto the coating film SF may be hindered by unwanted substances). Consequently, the formation accuracy of the riblet structure is improved.

[0106] Furthermore, the processing apparatus 1 can prevent dirt from adhering to the optical surface 1124 (i.e., the optical surface on the SP side of the accommodating space for the terminal optical elements of the optical system 112) by using the gas supply device 17. Therefore, compared to a processing apparatus without the gas supply device 17, the possibility of the irradiation of the processing light EL onto the coating film SF being hindered by dirt adhering to the optical surface 1124 is reduced. As a result, the irradiation accuracy of the processing light EL is improved. Consequently, the formation accuracy of the riblet structure is improved.

[0107] (4) Variations Next, we will describe a modified example of the processing apparatus 1.

[0108] (4-1) First variation The structure of the light irradiation device 11 shown in Figure 3 above is just one example, and the processing apparatus 1 may be equipped with other light irradiation devices having a different structure from the light irradiation device 11 shown in Figure 3. Below, light irradiation devices 21a, 22a, 23a, 24a, 25a, 26a, and 27a will be described as examples of other light irradiation devices having a different structure from the light irradiation device 11.

[0109] (4-1-1) Structure of the light irradiation device 21a To irradiate the painted film SF with processing light EL, the light irradiation device 21a, as shown in Figure 18, comprises a light source system 211a capable of emitting processing light EL and an optical system 212a that guides the processing light EL emitted from the light source system 211a to the painted film SF.

[0110] The light source system 211a comprises a single light source 2111a. Since the light source 2111a may be the same as the light source 1111 described above, a detailed explanation thereof is omitted.

[0111] The optical system 212a splits the processing light EL emitted from the light source 2111a into multiple (typically two) branches, and then forms interference fringes on the surface of the coating film SF by interfering the two branched processing light ELs. To form the interference fringes, the optical system 212a comprises an optical splitter 2121a, an optical outlet 2123a, an optical outlet 2124a, a focusing optical system 2125a, and a focusing optical system 2126a. The optical splitter 2121a splits the processing light EL emitted from the light source 2111a into a first branched light EL1 and a second branched light EL2. The first branched light EL1 is emitted from the optical outlet 2123a via an optical guide (not shown, e.g., optical fiber). The second branched light EL2 is emitted from the optical outlet 2124a via an optical guide (not shown, e.g., optical fiber). The first branched light EL1 emitted from the light outlet 2123a is converted into parallel light by the focusing optical system 2125a and then irradiated onto the surface of the coating film SF. The second branched light EL2 emitted from the light outlet 2124a is converted into parallel light by the focusing optical system 2126a and then irradiated onto the surface of the coating film SF. The first branched light EL1 irradiated from the focusing optical system 2125a and the second branched light EL2 irradiated from the focusing optical system 2126a interfere with each other, forming interference fringes on the surface of the coating film SF that have an interference pattern, which is a periodic fringe pattern along the X direction in the figure, corresponding to the riblet structure (or concave structure CP1) described above. In other words, the coating film SF is irradiated with interference light that has an intensity distribution on the surface of the coating film SF as processing light for forming the riblet structure. As a result, a portion of the coating film SF evaporates according to the interference fringes, and a riblet structure is formed on the surface of the workpiece S by the coating film SF.

[0112] The irradiation area EA (i.e., the irradiation area EA that forms interference fringes) irradiated by the light irradiation device 21a with the first branched light EL1 and the second branched light EL2 is a region that extends two-dimensionally along the surface of the painted film SF. Therefore, the processing apparatus 1a equipped with the light irradiation device 21a forms a riblet structure with the painted film SF by alternately repeating the operation of forming interference fringes on the surface of the painted film SF and the step operation of moving the irradiation area EA that forms the interference fringes by a predetermined amount along at least one of the X axis and Y axis on the surface of the painted film SF. In other words, the processing apparatus 1a equipped with the light irradiation device 21a forms interference fringes in a certain area on the surface of the painted film SF, then moves the light irradiation device 21a relative to the painted film SF and repeats the operation of forming interference fringes in a different area on the surface of the painted film SF. Note that the light irradiation device 21a cannot deflect the first branched light EL1 and the second branched light EL2 to move the irradiation area EA. Therefore, the processing apparatus 1a equipped with the light irradiation device 21a moves the irradiation area EA relative to the painted film SF by moving the light irradiation device 21a with the drive system 12. Alternatively, in the light irradiation device 21a, a galvanometer mirror may be placed between the focusing optical systems 2125a and 2126a and the painted film SF to move the irradiation area EA. Furthermore, the pitch of the interference fringe pattern may be changed by changing the intersection angle between the first branched light EL1 from the focusing optical system 2125a and the second branched light EL2 from the focusing optical system 2126a. In this case, the light output port 2123a and the focusing optical system 2125a may be provided as a single movable unit, and the light output port 2123b and the focusing optical system 2125b may be provided as a single movable unit to change the intersection angle between the first branched light EL1 and the second branched light EL2 that reach the irradiation area EA.

[0113] (4-1-2) Structure of the light irradiation device 22a To irradiate the painted film SF with processing light EL, the light irradiation device 22a, as shown in Figure 19, comprises a light source system 221a capable of emitting processing light EL and an optical system 222a that guides the processing light EL emitted from the light source system 221a to the painted film SF.

[0114] The light source system 221a comprises a single light source 2211a. Since the light source 2211a may be the same as the light source 1111 described above, a detailed explanation thereof is omitted.

[0115] The optical system 222a converts the processing light EL emitted from the light source 2211a into multiple processing light EL0, and then projects these multiple processing light EL0 onto the coating film SF. The optical system 222a includes a mirror array 2221a. The mirror array 2221a includes multiple mirrors M arranged in a matrix. Each mirror M is configured to have a variable tilt angle. As an example of operation, it is possible to switch between a state in which the processing light EL incident on each mirror M is reflected toward the coating film SF and a state in which the processing light EL incident on each mirror M is not reflected toward the coating film SF. The tilt angle of each mirror M may be controlled to change the position of the processing light EL0 from each mirror M on the coating film SF. The control device 18 controls the mirror array 2221a so that multiple processing light EL0 capable of forming the above-described riblet structure (in particular, the multiple concave structures CP1 which are part thereof) are emitted from the mirror array 2221a. As a result, the light irradiation device 22a, like the light irradiation device 11 described above, can simultaneously irradiate the surface of the coating film SF with multiple processing light ELs. In other words, multiple irradiation areas EA, each irradiated with multiple processing light EL0s, are simultaneously set on the surface of the coating film SF. As a result, the light irradiation device 22a, like the light irradiation device 11 described above, can form a riblet structure on the surface of the workpiece S using the coating film SF.

[0116] The optical system 222a of the light irradiation device 22a may include a galvanometer mirror 1122 and an fθ lens 1123, similar to the light irradiation device 11. In this case, the light irradiation device 22a can control the galvanometer mirror 1122 to cause multiple processing light ELs to scan the surface of the painted film SF. Alternatively, even if the optical system 222a does not include a galvanometer mirror 1122 and an fθ lens 1123, the light irradiation device 22a may be moved by the drive system 12 to cause multiple processing light ELs to scan the surface of the painted film SF. Furthermore, the surface of the painted film SF may be scanned by multiple processing light ELs by controlling the tilt angle of each mirror M in the mirror array 2221a to change the position of the reflective surface of each mirror M.

[0117] (4-1-3) Structure of the light irradiation device 23a To irradiate the painted film SF with processing light EL, the light irradiation device 23a, as shown in Figure 20, comprises a light source system 231a capable of emitting processing light EL and an optical system 232a that guides the processing light EL emitted from the light source system 231a to the painted film SF.

[0118] Since the light source system 231a may be identical to the light source system 111 described above, a detailed explanation of it will be omitted. In Figure 20, the explanation will proceed using a light source system 231a equipped with multiple light sources 1111 (i.e., a light source system 231a having the configuration shown in Figure 3(b)).

[0119] The optical system 232a reduces multiple processing light ELs emitted from multiple light sources 1111 and projects them onto the painted film SF. The optical system 232a comprises multiple collimator lenses 2321a and a projection optical system 2322a. Each of the multiple collimator lenses 2321a converts the multiple processing light ELs emitted from each of the multiple light sources 1111 into parallel light. The projection optical system 2322a projects the multiple processing light ELs, each converted into parallel light, onto the painted film SF at a predetermined reduction ratio (for example, a projection ratio of 1 / 10). The projection optical system 2322a may be configured to form a light source image on the painted film SF, or it may be configured to form a light source image at a position away from the painted film SF in the optical axis direction. As a result, the light irradiation device 23a can irradiate the painted film SF with multiple processing light ELs simultaneously, similar to the light irradiation device 11 described above. In other words, multiple irradiation areas EA, each irradiated by multiple processing light ELs, are simultaneously set on the surface of the painted film SF. As a result, the light irradiation device 23a, like the light irradiation device 11 described above, can form a riblet structure on the surface of the workpiece S using a coating film SF. Here, the projection magnification of the projection optical system 2322a is not limited to a reduction magnification, but may be equal to or greater than the projection magnification. Furthermore, one or more optical members constituting the projection optical system 2322a may be provided to be movable (typically movable along the optical axis) to change the projection magnification. In this case, the spacing between the multiple irradiation areas EA can be changed, and consequently, the pitch of the riblet structure can be changed. Note that each of the multiple collimator lenses 2321a may be provided on the light source 1111. Furthermore, the configuration is not limited to the direction of propagation of the multiple processing light ELs emitted from the projection optical system 2322a being parallel to each other, but may be configured so that the spacing between the multiple processing light ELs widens or narrows as they propagate.

[0120] The optical system 232a of the light irradiation device 23a may also include a galvanometer mirror 1122, similar to the light irradiation device 11. In this case, the light irradiation device 23a can control the galvanometer mirror 1122 to cause multiple processing light ELs to scan the surface of the painted film SF. Alternatively, even if the optical system 232a does not include a galvanometer mirror 1122, the light irradiation device 23a may be moved by the drive system 12 to allow multiple processing light ELs to scan the surface of the painted film SF. Furthermore, the light source 1111 may be moved to allow multiple processing light ELs to scan the surface of the painted film SF.

[0121] (4-1-4) Structure of the light irradiation device 24a To irradiate the painted film SF with processing light EL, the light irradiation device 24a, as shown in Figure 21, comprises a light source system 241a capable of emitting processing light EL and an optical system 242a that guides the processing light EL emitted from the light source system 241a to the painted film SF.

[0122] The light source system 241a comprises a single light source 2411a and an illumination optical system 2412a. The light source 2411a may be the same as the light source 1111 described above, so a detailed explanation of it is omitted. The illumination optical system 2412a makes the amount of processing light EL from the light source 2411a uniform within the cross-section of the processing light EL beam.

[0123] The optical system 242a comprises a mask 2421a and a projection optical system 2422a. The mask 2421a is a photomask (in other words, a reticle) on which a mask pattern has been formed that has a light transmittance distribution corresponding to the riblet structure (or the structure to be formed) (for example, a pattern in which a transmission pattern through which the processing light EL can pass and a light-blocking pattern that blocks the processing light EL are arranged periodically in the X direction). The processing light EL that has passed through the illumination optical system 2412a passes through the mask 2421a and becomes processing light EL having a periodically changing intensity distribution corresponding to the riblet structure. The projection optical system 2422a projects the processing light EL that has passed through the mask 2421a onto the painted film SF at a predetermined reduction ratio (for example, a projection ratio of 1 / 10). In other words, the projection optical system forms a reduced image of the mask 2421a on the painted film SF. As a result, the light irradiation device 24a irradiates the surface of the painted film SF with processing light EL having an intensity distribution corresponding to the riblet structure (or concave structure CP1) described above. In other words, the surface of the coating film SF is irradiated with processing light EL having an intensity distribution corresponding to the riblet structure on the surface of the coating film SF. As a result, a portion of the coating film SF evaporates according to the intensity distribution of the processing light EL, forming a riblet structure on the surface of the workpiece S made of the coating film SF. Here, the projection magnification of the projection optical system 2422a is not limited to a reduction magnification, but may be equal to 1x or a magnification magnification. Furthermore, one or more optical members constituting the projection optical system 2422a may be provided to be movable (typically movable along the optical axis) to change the projection magnification. In this case, the period of the periodically changing intensity distribution can be changed, and consequently, the pitch of the riblet structure can be changed.

[0124] The irradiation area EA, onto which the light irradiation device 24a irradiates the processing light EL, is a two-dimensional region that extends along the surface of the coating film SF. Therefore, in the processing apparatus 1a equipped with the light irradiation device 24a, the riblet structure of the coating film SF is formed by alternately repeating the operation of irradiating the surface of the coating film SF with the processing light EL via the mask 2421a and the step operation of moving the irradiation area EA by a predetermined amount along at least one of the X and Y axes on the surface of the coating film SF. However, the light irradiation device 24a cannot deflect the processing light EL to move the irradiation area EA. For this reason, in the processing apparatus 1a equipped with the light irradiation device 24a, the irradiation area EA is moved relative to the coating film SF by moving the light irradiation device 24a using the drive system 12.

[0125] The optical system 242a of the light irradiation device 24a may also include a galvanometer mirror 1122, similar to that of the light irradiation device 11. In this case, the light irradiation device 24a can control the galvanometer mirror 1122 to scan the surface of the coating film SF with multiple processing light ELs. Alternatively, the mask 2421a and the light source system 241a may be moved relative to the projection optical system 2422a.

[0126] Furthermore, the light irradiation device 24a may be equipped with a spatial light modulator capable of spatially modulating the processed light EL with a modulation pattern corresponding to the riblet structure, instead of the mask 2421a. "Spatially modulating the processed light EL" means changing the distribution of at least one of the optical properties of the processed light EL, which is the amplitude (intensity), phase of the light, polarization state of the light, wavelength of the light, and direction of propagation of the light (in other words, deflection state), in a cross section that crosses the direction of propagation of the processed light EL. The spatial light modulator may be a transmission type spatial light modulator that transmits the processed light EL and performs spatial modulation, or a reflection type spatial light modulator that reflects the processed light EL and performs spatial modulation.

[0127] (4-1-5) Structure of the light irradiation device 25a To irradiate the painted film SF with processing light EL, the light irradiation device 25a, as shown in Figure 22, comprises a light source system 251a capable of emitting processing light EL, a lens array 2513a that splits the processing light EL emitted from the light source system 251a into multiple beams, and an optical system 252a that guides the multiple beams from the lens array 2513a to the painted film SF.

[0128] The light source system 251a comprises a single light source 2511a and a beam expander 2512a that shapes, typically expands, and emits the incident beam from the light source 2511a. The beam expander 2512a may have optical members for making the intensity distribution within the beam cross-section of the incident beam from the light source 2511a uniform.

[0129] The lens array 2513a comprises multiple lens elements arranged in a direction transverse to the incident beam, typically in the YZ plane in the figure, each focusing the incident beam. A two-dimensionally arranged light source image is formed on the exit side of this lens array 2513a.

[0130] The optical system 252a includes an afocal zoom lens 2522a for setting the intervals between multiple incident beams to a predetermined interval, a focusing optical system 2523a for focusing the multiple beams from the afocal zoom lens 2522a to a predetermined position, and an fθ lens 2524a for focusing the multiple beams from the focusing optical system 2523a onto the painted film SF as multiple processing light EL0s.

[0131] Multiple processing light beams EL0 from the optical system 252a (multiple processing light beams EL0 from the fθ lens 2524a) form multiple irradiation areas EA on the coating film SF. In other words, multiple processing light beams EL0 are irradiated onto the coating film SF.

[0132] Here, the afocal zoom lens 2522a can also be considered as a bilaterally telecentric zoom lens. In this case, the multiple light source image formation positions by the lens array 2513a, the optical path between the afocal zoom lens 2522a and the focusing optical system 2523a, and the coating film SF may be optically conjugate to each other. Since the optical path between the afocal zoom lens 2522a and the focusing optical system 2523a, i.e., the optical path on the emission side of the afocal zoom lens 2522a, and the coating film SF are conjugate to each other, it is clear that changing the spacing between the multiple beams emitted from the afocal zoom lens 2522a will also change the spacing of the processing light EL0 reaching the coating film SF. Therefore, the magnification (angular magnification) of the afocal zoom lens 2522a may be changed by a drive unit (not shown) to change the spacing of the processing light EL0 reaching the coating film SF.

[0133] Alternatively, some of the multiple lenses constituting the condensing optical system 2523a may be made movable in the optical axis direction and used as a focusing lens.

[0134] Furthermore, in the above description, the lens array 2513a can be referred to as an optical branching element. A reflective mirror array may be used instead of the lens array 2513a.

[0135] (4-1-6) Structure of the light irradiation device 26a To irradiate the painted film SF with processing light EL, the light irradiation device 26a, as shown in Figure 23, comprises a light source system 261a capable of emitting processing light EL, a lens array 2613a that divides the processing light EL emitted from the light source system 261a into multiple beams, and an optical system 262a that guides the multiple beams from the lens array 2613a to the painted film SF.

[0136] The light irradiation device 26a shown in Figure 23 differs from the light irradiation device 25a shown in Figure 22 in that the galvanometer mirror 2624a is positioned between the condensing optical system 2623a (focusing lens) and the fθ lens 2625a. The other components of the light irradiation device 26a may be the same as those of the light irradiation device 25a. Even with this difference in the arrangement of the galvanometer mirror 2624a, the light irradiation device 26a shown in Figure 23 can achieve the same effects as the light irradiation device 25a shown in Figure 22.

[0137] Furthermore, in the light irradiation device 26a shown in Figure 23, the fθ lens 2625a may have a telecentric optical system on the painted film SF side, or the painted film SF side may have a non-telecentric optical system. If the fθ lens 2625a has a non-telecentric optical system on the painted film SF side, the processing light EL can be irradiated over an area larger than the size of the fθ lens 2625a.

[0138] Furthermore, in the light irradiation devices 25a and 26a shown in Figures 22 and 23, respectively, if some of the lenses in the condensing optical system 2523a or 2623a are moved in the optical axis direction to act as focusing lenses, there is a risk that the magnification of the optical systems 252a and 262a will change as the focusing lenses move. In this case, the magnification fluctuation caused by the movement of the focusing lenses can be corrected by changing the magnification of the afocal zoom lenses 2522a or 2622a.

[0139] In this example, the galvanometer mirror 2624a may be a two-axis galvanometer mirror that can move around two mutually orthogonal axes, but it is not limited to that, and as shown in Figure 3, a combination of two single-axis galvanometer mirrors may also be used.

[0140] (4-1-7) Structure of the light irradiation device 27a To irradiate the painted film SF with processing light EL, the light irradiation device 27a, as shown in Figure 24, includes a light source system 271a capable of emitting processing light EL, a light branching section equipped with a light branching member 2713a that branches the processing light emitted from the light source 271a into multiple beams, and an optical system 272a that guides the multiple beams from the light branching section to the painted film SF. Here, the configuration of the light source system 271a and the optical system 272a is the same as that of the light source system 251a and the optical system 252a shown in Figure 22, so it is omitted here.

[0141] A reflective diffractive optical element can be used as the optical branching member 2713a. The incident beam incident on the optical branching member 2713a is split into multiple diffractive beams that propagate in different directions, for example, by diffraction. On the exit side of the optical branching member 2713a, a collimating optical system 2714a is provided, with its front focal point located at the position of the optical branching member 2713a. The multiple beams that propagate in different directions are reoriented by the collimating optical system 2714a so that they become parallel to each other, and these parallel beams then head towards the optical system 272a.

[0142] Furthermore, the optical branching member 2713a is not limited to a reflective diffractive optical element, and a reflective spatial light modulator may also be used. Various spatial light modulators can be used as reflective spatial light modulators, such as a mirror array having multiple mirrors whose positions and / or orientations can be changed relative to each other, or an LCOS (Liquid Crystal On Silicon) type spatial light modulator. If a spatial light modulator that can actively change the state of reflected light is used as the optical branching member 2713a, the state of the light from this spatial light modulator (intensity distribution, propagation direction, etc.) can be changed to adjust at least one of the positions, shapes, and distributions of the irradiation area EA on the painted film SF. Alternatively, at least one of a transmissive diffractive optical element and a transmissive spatial light modulator may be used as the optical branching member 2713a.

[0143] Furthermore, the optical system 262a shown in Figure 25 may be used instead of the optical system 272a shown in Figure 24.

[0144] (4-1-8) Modified example of the light irradiation device 11 shown in Figure 3 In the light source system 111 shown in Figure 3(b), the multiple light sources 1111 are arranged in a line at equal intervals. However, the multiple light sources 111 do not have to be arranged at equal intervals, nor do they have to be arranged in a line. In other words, the multiple light sources 1111 may be arranged in a pattern other than the arrangement pattern shown in Figure 3(b). For example, the multiple light sources 1111 may be arranged in a matrix at equal intervals. For example, the multiple light sources 1111 may be arranged in a staggered arrangement pattern. For example, the multiple light sources 1111 may be arranged in one or more lines at random intervals.

[0145] In the light source system 111 shown in Figure 3(c), the multiple emission ports from which each of the multiple processing light ELs branched by the brancher 1112 is emitted are arranged in a line at equal intervals. However, the multiple emission ports do not have to be arranged at equal intervals or in a line. In other words, the multiple emission ports may be arranged in a pattern other than the arrangement pattern shown in Figure 3(c). For example, the multiple emission ports may be arranged in a matrix at equal intervals. For example, the multiple emission ports may be arranged in a staggered arrangement pattern. For example, the multiple emission ports may be arranged in a line or multiple lines at random intervals. Alternatively, the light source system 111 may have a single emission port. In other words, the light source system 111 may emit a single processing light EL. In this case, the light source system 111 does not have a brancher 1112.

[0146] According to the light irradiation device 11 shown in Figure 3, multiple processing light ELs are simultaneously irradiated onto the coating film SF. However, it is not necessary for multiple processing light ELs to irradiate the coating film SF simultaneously. For example, during the period when some of the multiple processing light ELs are irradiating the coating film SF, other parts of the multiple processing light ELs do not need to be irradiating the coating film SF. For example, some of the multiple processing light ELs may irradiate the coating film SF at a first timing, and then other parts of the multiple processing light ELs may irradiate the coating film SF at a second timing different from the first timing. For example, multiple processing light ELs may be irradiated onto the coating film SF sequentially.

[0147] In the light irradiation device 11 shown in Figure 3, the galvanometer mirror 1122 is a two-axis galvanometer mirror equipped with both an X-scanning mirror 1122X and a Y-scanning mirror 1122Y. However, the galvanometer mirror 1122 may also be a one-axis galvanometer mirror equipped with either the X-scanning mirror 1122X or the Y-scanning mirror 1122Y. In a processing device equipped with such a one-axis galvanometer mirror, the galvanometer mirror may be controlled to scan the surface of the painted film SF along either the X-axis or Y-axis with multiple processing light ELs, and the light irradiation device equipped with the one-axis galvanometer mirror may be moved along either the X-axis or Y-axis using the drive system 12, thereby scanning the surface of the painted film SF along either the X-axis or Y-axis with multiple processing light ELs. Note that the galvanometer mirror 1122 may be a single mirror rotatable around two orthogonal axes.

[0148] (4-2) Second variation Next, a second modified processing apparatus 1b will be described with reference to Figure 25. As shown in Figure 25, the second modified processing apparatus 1b differs from the processing apparatus 1 described above in that it further includes a surface characteristic measuring device 19b. The surface characteristic measuring device 19b measures the characteristics of the surface of the coating film SF (in particular, a portion of the surface of the coating film SF that the light irradiation device 11 intends to irradiate with multiple processing light ELs) before the light irradiation device 11 irradiates the surface of the coating film SF with multiple processing light ELs. The surface characteristic measuring device 19b is supported by the housing device 13 via a support member 136b. Therefore, the relative positional relationship between the light irradiation device 11 and the surface characteristic measuring device 19b is fixed within the housing space SP. Furthermore, the second modified processing apparatus 1b differs from the processing apparatus 1 described above in that it controls the light irradiation device 11 based on the measurement results of the surface characteristic measuring device 19b. Other features of the processing apparatus 1b may be the same as other features of the processing apparatus 1.

[0149] The following describes a specific example of a pre-measurement control operation that controls the light irradiation device 11 based on the measurement results of the surface property measurement device 19b.

[0150] (4-2-1) First specific example of pre-measurement and control operation In the first specific example, the surface property measuring device 19b measures the shape of the surface of the painted film SF as a surface property of the painted film SF. The surface property measuring device 19b irradiates the painted film SF with measurement light MLb (hereinafter, the measurement light MLb used in the first specific example will be referred to as "measurement light MLb1"). For this reason, the surface property measuring device 19b is equipped with a light projection device 191b that irradiates the measurement light MLb1. Furthermore, the surface property measuring device 19b measures the reflected light of measurement light MLb1 from the painted film SF. For this reason, the surface property measuring device 19b is equipped with a detection device 192b that detects the reflected light of measurement light MLb1. Since the reflected light is measurement light MLb1 reflected from the surface of the painted film SF, the measurement result of the reflected light (i.e., the output of the surface property measuring device 19b) contains information about the shape of the surface of the painted film SF. For this reason, the control device 18 can determine the shape of the surface of the painted film SF based on the measurement result of the surface property measuring device 19b. Furthermore, as an example of a surface property measurement device 19b for measuring the surface shape of the painted film SF, a measurement device (for example, a measurement device using the light section method) capable of measuring the surface shape by irradiating the surface of the painted film SF with measurement light MLb1 having a predetermined light emission pattern (for example, a linear light emission pattern or a grid-like light emission pattern) and measuring the pattern image from a direction different from the irradiation direction of the measurement light MLb1. In addition, as an example of a surface property measurement device 19b, optical measurement devices using various methods such as moiré topography using the grid irradiation method or grid projection method, holographic interferometry, autocollimation method, stereo method, astigmatism method, critical angle method, or knife-edge method can be used.

[0151] In the first specific example, the control device 18 sets the irradiation conditions (i.e., irradiation state) of multiple processing light ELs based on the surface shape of the coating film SF. In the first specific example, the irradiation conditions of the multiple processing light ELs are the focusing positions FP of the multiple processing light ELs. Specifically, the control device 18 sets, for example, the focusing positions FP of the multiple processing light ELs to a position where the coating film SF can be processed by irradiation with the multiple processing light ELs. Here, as described above, the coating film SF is processed so that a part of the coating film SF evaporates due to irradiation with the processing light ELs. The coating film SF evaporates due to the energy added to the coating film SF from the processing light ELs by irradiation with the processing light ELs (i.e., the energy of the processing light ELs absorbed by the coating film SF). The energy added to the coating film SF from the processing light ELs increases as the intensity of the processing light ELs on the surface of the coating film SF increases. Therefore, if the intensity of the processing light ELs on the surface of the coating film SF is greater than or equal to the intensity that can evaporate the coating film SF, the coating film SF evaporates due to irradiation with the processing light ELs. Therefore, the control device 18 considers the relationship between the relative position FP of the processing light EL with respect to the surface of the painted film SF and the intensity of the processing light EL on the surface of the painted film SF, and sets the focus positions FP of multiple processing light ELs to a position where the painted film SF can be processed by irradiation with multiple processing light ELs. Furthermore, since the painted film SF is processed so that a portion of it within the irradiation area EA irradiated by the processing light EL evaporates, if the focus position of the processing light EL diverges significantly from the surface of the painted film SF (i.e., diverges along the Z-axis), the irradiation area EA irradiated by the processing light EL becomes larger, and there is a risk that the required riblets cannot be obtained. Therefore, the control device 18 sets the focus positions FP of multiple processing light ELs so that the size of the irradiation area EA on the surface of the painted film SF is the required size.

[0152] Based on these premises, if the surface of the coating film SF is located within the depth of focus of the optical system 112 (i.e., DOF: Depth of Focus, which is the region extending from the focal point FP of the multiple processing light ELs towards the object plane and the image plane), the intensity of the processing light ELs on the surface of the coating film SF will be correspondingly large (i.e., it will be greater than or equal to the intensity required to evaporate the coating film SF). Also, if the surface of the coating film SF is located within the depth of focus of the optical system 112, the size of the irradiation area EA of the processing light ELs on the surface of the coating film SF will be the required size. The statement that the surface of the coating film SF is located within the depth of focus of the optical system 112 may also mean that the size of the irradiation area EA of the processing light ELs formed on the surface of the coating film SF is within the required range. Therefore, as shown in Figures 26(a) to 26(d), the control device 18 may, for example, set the focal point FP of the multiple processing light ELs so that the surface of the coating film SF (in particular, a portion of the surface of the coating film SF that is irradiated by multiple processing light ELs) is located within the depth of focus of the optical system 112. Figure 26(a) is a cross-sectional view showing how the surface of the coating film SF is located within the depth of focus of the optical system 112 when the surface of the coating film SF is flat. Figure 26(b) is a cross-sectional view showing how the surface of the coating film SF is located within the depth of focus of the optical system 112 when the surface of the coating film SF is curved. Figure 26(c) is a cross-sectional view showing how the surface of the coating film SF is located within the depth of focus of the optical system 112 when the surface of the coating film SF has irregularities. Figure 26(d) is a cross-sectional view showing how the surface of the coating film SF is located within the depth of focus of the optical system 112 when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112 (i.e., the optical axis AX along the Z axis).

[0153] When the focusing positions FP of multiple processing light ELs move along the Z-axis relative to the coating film SF, the relative positional relationship between the coating film SF and the depth of focus range of the optical system 112 (particularly the positional relationship in the Z-axis direction) changes. Therefore, by setting the focusing positions FP of multiple processing light ELs, the control device 18 can be said to be effectively setting the relative positional relationship between the coating film SF and the depth of focus range of the optical system 112.

[0154] After setting the focusing position FP in this manner, the control device 18 controls the focus lens 1121 of the light irradiation device 11 so that multiple processing light ELs are focused at the set focusing position FP. In other words, the control device 18 controls the focus lens 1121 so that multiple processing light ELs are focused at the set focusing position FP, thereby controlling (i.e., adjusting) the focusing positions FP of multiple processing light ELs together. To put it another way, the control device 18 controls the focus lens 1121 so that multiple processing light ELs are focused at the set focusing position FP, thereby simultaneously controlling (changing) the focusing positions FP of multiple processing light ELs. Furthermore, in the light irradiation devices 21a to 24a described in the first modified example, if the optical systems 212a to 242a are equipped with a focus lens 1121, the control device 18 can control the light irradiation devices 21a to 24a so that multiple processing light ELs are focused at the set focusing position FP. As a result, the surface of the coating film SF will be located within the depth of focus range of the optical system 112. Therefore, the surface of the coating film SF is irradiated with processing light EL at an intensity sufficient to evaporate the coating film SF. As a result, the coating film SF is properly processed by multiple processing light ELs.

[0155] According to this first specific example of pre-measurement and control operation, the processing apparatus 1b can process the coating film SF without being restricted by the surface shape of the coating film SF, while enjoying the same effects as the processing apparatus 1 described above.

[0156] Furthermore, as multiple processing light ELs are scanned, the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF, each irradiated by the multiple processing light ELs, change (especially their positions in the direction along the surface of the coating film SF). In other words, the multiple processing light ELs move relative to the coating film SF along its surface. When the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF change, the shape of the portion of the coating film SF surface where the multiple irradiation areas EAs are formed may also change while the multiple processing light ELs are irradiating it. For this reason, the control device 18 may appropriately set the focusing position FP based on the shape of the portion of the coating film SF surface where the multiple irradiation areas EAs are formed when the multiple processing light ELs are irradiating the coating film SF (i.e., when the multiple processing light ELs are moving relative to the coating film SF), and control the focus lens 1121 so that the multiple processing light ELs are focused at the set focusing position FP.

[0157] Furthermore, depending on the shape of the surface of the coating film SF, even if the focusing position FP of multiple processing light ELs is set, a portion of the surface of the coating film SF (particularly a portion of the surface of the coating film SF that is irradiated by multiple processing light ELs) may not be located within the depth of focus range of the optical system 112. In other words, a portion of the surface of the coating film SF may be located within the depth of focus range of the optical system 112, while another portion of the surface of the coating film SF may not be located within the depth of focus range of the optical system 112. In this case, the processing apparatus 1b may selectively irradiate only a portion of the multiple processing light ELs onto the coating film SF so that the processing light ELs are irradiated onto the portion of the coating film SF whose surface is located within the depth of focus range of the optical system 112, while the processing light ELs are not irradiated onto the other portion of the coating film SF whose surface is not located within the depth of focus range of the optical system 112.

[0158] Furthermore, controlling the focusing position FP of the multiple processing light ELs by the focusing lens 1121 is equivalent to controlling the relative positional relationship between the surface of the coating film SF and the focusing position FP of the multiple processing light ELs in the Z-axis direction. For this reason, in addition to controlling the focusing position FP of the multiple processing light ELs by controlling the focusing lens 1121, or alternatively, the control device 18 may control the relative position of the light irradiation device 11 in the Z-axis direction with respect to the coating film SF by controlling the drive system 12. Even in this case, the processing device 1b can process the coating film SF without being constrained by the shape of the surface of the coating film SF.

[0159] Furthermore, when the focusing position FP changes, the intensity distribution of the multiple processing light ELs changes in a plane containing the axis intersecting the surface of the painted film SF (for example, the XZ plane in the example shown in Figures 26(a) to 26(d)). For this reason, controlling the focusing position FP of the multiple processing light ELs by the focusing lens 1121 is equivalent to controlling the intensity distribution of the multiple processing light ELs in a plane containing the axis intersecting the surface of the painted film SF. Conversely, the control device 18 may control the intensity distribution of the multiple processing light ELs in a plane containing the axis intersecting the surface of the painted film SF so that the painted film SF can be processed by irradiation with multiple processing light ELs. In this case, the optical system 112 may be equipped with an intensity distribution adjustment element for adjusting the intensity distribution of the multiple processing light ELs under the control of the control device 18. Examples of intensity distribution adjustment elements include a filter having a required density distribution in a plane crossing the optical path, an aspherical (refracting or reflecting) optical element having a required surface shape in a plane crossing the optical path, a diffractive optical element, a spatial light modulator, etc. Alternatively, if the shape of multiple processing light ELs changes in a plane including an axis intersecting the surface of the coating film SF, the intensity distribution of the multiple processing light ELs may also change. For this reason, the control device 18 may control the shape of the multiple processing light ELs in a plane including an axis intersecting the surface of the coating film SF so that the coating film SF can be processed by irradiation with multiple processing light ELs. In this case, the optical system 112 may be equipped with an optical shape adjustment element for adjusting the shape of the multiple processing light ELs under the control of the control device 18. Examples of optical shape adjustment elements include an aperture having a predetermined aperture shape, a filter having a required density distribution in a plane crossing the optical path, an aspherical (refracting or reflecting) optical element having a required surface shape in a plane crossing the optical path, a diffractive optical element, a spatial light modulator, etc. When the control device 18 controls at least one of the intensity distribution and shape of the multiple processing light ELs, it may or may not control the focusing position FP of the multiple processing light ELs.

[0160] Furthermore, when the focusing position FP changes, the size of the irradiation area EA on the surface of the painted film SF changes. Specifically, the closer the focusing position FP is to the surface of the painted film SF in the direction along the surface of the painted film SF, the smaller the size of the irradiation area EA becomes. The further the focusing position FP is from the surface of the painted film SF in the direction along the surface of the painted film SF, the larger the size of the irradiation area EA becomes. For this reason, controlling the focusing position FP of multiple processing light ELs by the focus lens 1121 is equivalent to controlling the size of multiple irradiation areas EA on the painted film SF. Therefore, it can be said that the control device 18 is essentially controlling the size of multiple irradiation areas EA on the surface of the painted film SF based on the positional relationship between the painted film SF and the multiple irradiation areas EA. For example, in the example shown in Figure 26(c), the control device 18 can be said to control the sizes of multiple irradiation areas EA such that (i) the size of the irradiation area EA formed in the first part of the coating film SF (the part located on the left side as shown in Figure 26(c)) is relatively reduced, and (i) the size of the irradiation areas EA formed in the second part (the part located in the center as shown in Figure 26(c)) and the third part (the part located on the right side as shown in Figure 26(c)) is relatively increased. In other words, the control device 18 can be said to set the size of the irradiation area EA formed in the first part of the coating film SF to a desired first size, the size of the irradiation area EA formed in the second part of the coating film SF to a desired second size, and the size of the irradiation area EA formed in the third part of the coating film SF to a desired third size.

[0161] Furthermore, as described above, the control device 18 can control the focusing positions FP of multiple processing light ELs together (simultaneously) by controlling the focusing lens 1121. However, the control device 18 may also control the focusing positions FP of multiple processing light ELs individually or separately. However, if the focusing positions FP of multiple processing light ELs are controlled individually or separately, the processing apparatus 1b shall be equipped with a light irradiation device 11b-1 instead of the light irradiation device 11, which is equipped with multiple focusing lenses 1121 for adjusting the focusing positions FP of multiple processing light ELs. An example of a light irradiation device 11b-1 equipped with multiple focusing lenses 1121 is shown in Figure 27. As shown in Figure 27, the light irradiation device 11b-1 is equipped with multiple irradiation units 110b-1. Each irradiation unit 110b-1 is equipped with a light source system 111b-1 and the optical system 112 described above. The light source system 111b-1 is equipped with a single light source 1111. In such a light irradiation device 11b-1, each of the multiple irradiation units 110b-1 that irradiate with multiple processing light ELs is equipped with multiple focus lenses 1121, so that the focusing positions FP of the multiple processing light ELs can be controlled individually or independently. Note that each irradiation unit 110b-1 is not limited to irradiating the coating film SF with multiple processing light ELs, but may also irradiate the coating film SF with a single processing light EL.

[0162] Furthermore, when each irradiation unit 110b-1 irradiates with a single processing light EL, as shown in Figure 28, if the optical system 112 of each irradiation unit 110b-1 is a non-telecentric optical system on the side of the coating film SF, the distance from the optical system 112 to the focusing position FP changes depending on the position on the coating film SF, even if the surface of the coating film SF is flat. In this case, the focusing lens 1121 should be controlled according to the irradiation position of the processing light EL on the coating film SF.

[0163] Even when the focusing positions FP of multiple processing light ELs are controlled individually or independently, the control device 18 may set the focusing positions FP of the multiple processing light ELs so that the surface of the coating film SF is located within the depth of focus range of the optical system 112. Alternatively, as shown in Figures 29(a) to 29(d), the control device 18 may set the focusing positions FP of the multiple processing light ELs so that each of the focusing positions FP of the multiple processing light ELs is located on the surface of the coating film SF. Figure 29(a) is a cross-sectional view showing how the focusing positions FP of the multiple processing light ELs are located on the surface of the coating film SF when the surface of the coating film SF is flat. Figure 29(b) is a cross-sectional view showing how the focusing positions FP of the multiple processing light ELs are located on the surface of the coating film SF when the surface of the coating film SF is curved. Figure 29(c) is a cross-sectional view showing how the focusing positions FP of the multiple processing light ELs are located on the surface of the coating film SF when there are irregularities on the surface of the coating film SF. Figure 29(d) is a cross-sectional view showing how the focusing positions FP of multiple processing light ELs are located on the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112.

[0164] Furthermore, even when the focusing positions FP of multiple processing light ELs are controlled individually or independently, depending on the shape of the surface of the coating film SF, some of the focusing positions FP of the multiple processing light ELs may not be able to be located on the surface of the coating film SF. In other words, some of the focusing positions FP of the multiple processing light ELs may be located on the surface of the coating film SF, while other parts of the focusing positions FP of the multiple processing light ELs may not be able to be located on the surface of the coating film SF. In this case, the processing apparatus 1b may selectively irradiate the coating film SF with only some of the multiple processing light ELs so that the processing light ELs whose focusing positions FP are located on the surface of the coating film SF are irradiated, while the processing light ELs whose focusing positions FP are not located on the surface of the coating film SF are not irradiated. Alternatively, even when the focusing positions FP of multiple processing light ELs are controlled individually or independently, the surface of the coating film SF may not be able to be located within the depth of focus range of the optical system 112 for irradiating some of the multiple processing light ELs. In other words, the surface of the coating film SF may be located within the depth of focus range of one optical system 112 for irradiating with one of the multiple processing light ELs, while the surface of the coating film SF may not be located within the depth of focus range of another optical system 112 for irradiating with another of the multiple processing light ELs. In this case as well, the processing apparatus 1b may selectively irradiate only a portion of the multiple processing light ELs onto the coating film SF so that the surface of the coating film SF is irradiated with processing light ELs through the optical system 112 whose depth of focus range includes the coating film SF, while the surface of the coating film SF is not irradiated with processing light ELs through the optical system 112 whose depth of focus range does not include the coating film SF.

[0165] Furthermore, as shown in Figures 29(a) to 29(d), individual control of the focusing positions FP of the multiple processing light ELs is substantially equivalent to changing the relative positional relationship of the focusing positions FP of the multiple processing light ELs with respect to the coating film SF in the Z-axis direction (or the direction intersecting the surface of the coating film SF). For this reason, in addition to or instead of controlling the focusing positions FP of the multiple processing light ELs by controlling the multiple focus lenses 1121, the control device 18 may also control the relative positions of the multiple irradiation units 110b-1 in the Z-axis direction with respect to the coating film SF by controlling a drive system (not shown) that allows the multiple irradiation units 110b-1 to move individually. By controlling the relative positions of the multiple irradiation units 110b-1 in the Z-axis direction, the relative positional relationship between the surface of the coating film SF and the focusing positions FP of the multiple processing light ELs in the Z-axis direction changes. For this reason, even if the relative positions of the multiple irradiation units 110b-1 in the Z-axis direction are controlled, the processing device 1b can process the coating film SF without being constrained by the shape of the surface of the coating film SF.

[0166] Alternatively, even if the orientation of each of the multiple irradiation units 110b-1 relative to the coating film SF changes (for example, the tilt amount, which is the relative position in at least one of the θX and θY directions), the relative positional relationship of the focusing positions FP of the multiple processing light ELs emitted by each of the multiple irradiation units 110b-1 changes. For this reason, the control device 18 may control the orientation of each of the multiple irradiation units 110b-1 relative to the coating film SF by controlling a drive system (not shown) that allows the multiple irradiation units 110b-1 to move individually. Even in this case, the processing apparatus 1b can process the coating film SF without being constrained by the shape of the surface of the coating film SF. Furthermore, even if the processing apparatus 1b is equipped with a light irradiation device 11 that does not have multiple irradiation units 110b-1, the control device 18 may control the orientation of the light irradiation device 11 relative to the coating film SF. Even in this case, the relative positions of the focusing positions FP of the multiple processing light ELs relative to the coating film SF can be controlled.

[0167] (4-2-2) Second specific example of pre-measurement and control operation The second specific example of the pre-measurement and control operation differs from the first specific example of the pre-measurement and control operation described above in that, instead of the focusing position FP of the multiple processing light ELs, conditions relating to the depth of focus of the optical system 112 (in the following description, the range of the depth of focus will be used) are used as the irradiation conditions for the multiple processing light ELs. Other features of the second specific example of the pre-measurement and control operation may be the same as those of the first specific example of the pre-measurement and control operation.

[0168] In the second specific example, as in the first specific example, the control device 18 sets the focusing position FP of the multiple processing light ELs to a position where the coating film SF can be processed by the multiple processing light ELs. For example, as shown in Figures 30(a) to 30(d), the control device 18 may set the depth of focus range of the optical system 112 such that the surface of the coating film SF (in particular, a portion of the surface of the coating film SF that is irradiated by the multiple processing light ELs) is located within the depth of focus range of the optical system 112. In other words, the control device 18 may set the depth of focus range of the optical system 112 such that the size of the irradiation area EA of the processing light EL formed on the surface of the coating film SF is within the required range. Figure 30(a) is a cross-sectional view showing the depth of focus range of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is planar. Figure 30(b) is a cross-sectional view showing the depth of focus range of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is curved. Figure 30(c) is a cross-sectional view showing the depth of focus range of the optical system 112, which is set to include the surface of the coating film SF, when the surface of the coating film SF has irregularities. Figure 30(d) is a cross-sectional view showing the depth of focus range of the optical system 112, which is set to include the surface of the coating film SF, when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112.

[0169] In the second specific example, the optical system 112 is equipped with an optical element (hereinafter referred to as the "depth of focus adjustment element") for adjusting the depth of focus range of the optical system 112. The depth of focus adjustment element can be, for example, a focus lens 1121. The depth of focus range can be defined as the lower and upper limits of the depth of focus range in the direction of light propagation. The control device 18 controls the depth of focus adjustment element so that the depth of focus range of the optical system 112 becomes the set depth of focus range. As a result, the surface of the coating film SF is located within the depth of focus range of the optical system 112. Therefore, the surface of the coating film SF is irradiated with processing light EL of an intensity sufficient to evaporate the coating film SF, and the coating film SF is removed within the required range. For this reason, the coating film SF is appropriately processed by multiple processing light ELs. In the second specific example, the size of the depth of focus range is kept constant, but the size of the depth of focus range may be changed. When changing the size of the depth of focus range, the numerical aperture on the coating film SF side of the optical system 112 may be changed.

[0170] According to this second specific example of pre-measurement and control operation, the processing apparatus 1b can enjoy the same effects as those that can be enjoyed by the first specific example of the pre-measurement and control operation described above.

[0171] In addition, in the second specific example, as in the first specific example, depending on the shape of the surface of the coating film SF, even if the depth of focus range of the optical system 112 is set, a portion of the surface of the coating film SF (particularly a portion of the surface of the coating film SF that is irradiated with multiple processing light ELs) may not be located within the depth of focus range of the optical system 112. In this case, the processing apparatus 1b may selectively irradiate only a portion of the multiple processing light ELs onto the coating film SF so that the processing light ELs are irradiated onto the portion of the coating film SF whose surface is located within the depth of focus range of the optical system 112, while the processing light ELs are not irradiated onto other portions of the coating film SF whose surface is not located within the depth of focus range of the optical system 112.

[0172] (4-2-3) Third specific example of pre-measurement and control operation The third specific example of the pre-measurement control operation differs from the first specific example of the pre-measurement control operation described above in that the control device 18 sets the state of the image plane of the optical system 112 (i.e., the optical surface on which the processed light EL is imaged via the optical system 112) based on the shape of the surface of the coating film SF. Furthermore, the third specific example of the pre-measurement control operation differs from the first specific example of the pre-measurement control operation described above in that the control device 18 controls the optical system 112 so that the state of the image plane of the optical system 112 becomes the set state. Other features of the third specific example of the pre-measurement control operation may be the same as those of the first specific example of the pre-measurement control operation. Here, the image plane of the optical system 112 may be a virtual plane formed by fitting multiple focusing positions FP. Also, in the case of the modification example in Figure 21, it may be the plane on which the image of the mask 2421a is formed.

[0173] The control device 18 may set the size of the image plane based on the shape of the surface of the coating film SF. For example, the control device 18 may set the size of the image plane to a predetermined size corresponding to the shape of the surface of the coating film SF. The control device 18 may set the relative position of the image plane with respect to the coating film SF (particularly the surface of the coating film SF) (for example, a relative position along at least one of the X-axis, Y-axis, and Z-axis directions) based on the shape of the surface of the coating film SF. For example, the control device 18 may set the position of the image plane to a predetermined position corresponding to the shape of the surface of the coating film SF. The control device 18 may set the shape of the image plane based on the shape of the surface of the coating film SF. For example, the control device 18 may set the shape of the image plane to a predetermined shape corresponding to the shape of the surface of the coating film SF.

[0174] When setting the state of the image plane, the control device 18 may set the state of the image plane so that the image plane and the surface of the coating film SF coincide, as shown in Figures 31(a) to 31(d). Figure 31(a) is a cross-sectional view showing the image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is flat. Figure 31(b) is a cross-sectional view showing the image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is curved. As shown in Figure 31(b), when the surface of the coating film SF is curved (i.e., curved), the state of the image plane is set so that the set image plane is also curved (i.e., curved). Figure 31(c) is a cross-sectional view showing the image plane set to coincide with the surface of the coating film SF when there are irregularities on the surface of the coating film SF. As shown in Figure 31(c), depending on the shape of the surface of the coating film SF, it may be difficult to make a single image plane coincide with the surface of the coating film SF. In this case, the surface of the coating film SF may be divided into multiple divided regions (in the example shown in Figure 31(c), three divided regions #1 to #3), and the state of the image planes (in particular, at least one of the size and position) may be set so that image planes (in the example shown in Figure 31(c), three image planes #1 to #3) that coincide with the surface of each divided region are obtained. Furthermore, in this case, the processing light EL is irradiated sequentially to the multiple divided regions. That is, the processing apparatus 1b processes divided region #1 by irradiating it with the processing light EL with the image plane of the optical system 112 set to image plane #1, then processes divided region #2 by irradiating it with the processing light EL with the image plane of the optical system 112 set to image plane #2, and then processes divided region #3 by irradiating it with the processing light EL with the image plane of the optical system 112 set to image plane #3. Figure 31(d) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112. As shown in Figure 31(d), if the surface of the coating film SF is inclined, the image plane is also set to be inclined.

[0175] In the third specific example, the optical system 112 that guides the processing light EL to the coating film SF is equipped with an optical element for adjusting the state of the image plane (hereinafter, this optical element is referred to as the "image plane adjustment element"). The control device 18 controls the image plane adjustment element so that the image plane on which the processing light EL actually forms an image becomes the set image plane. Alternatively, the control device 18 may control at least one of the relative position and orientation of the light irradiation device 11 with respect to the coating film SF so that the image plane on which the processing light EL actually forms an image becomes the set image plane. As a result, the image plane on which the processing light EL forms an image coincides with the surface of the coating film SF. Therefore, the coating film SF is appropriately processed by multiple processing light ELs. For example, among the optical components constituting the optical system 112, a movable or deformable optical component may be used as the image plane adjustment element. For example, a pair of wedge prisms that can rotate around the optical axis may be provided, and the apex angle of the entire pair of wedge prisms may be changed to tilt the image plane. Furthermore, as an image plane adjustment element, at least one of the optical components constituting the optical system 112 may be eccentric with respect to the optical axis or tilted with respect to the optical axis to tilt the image plane. Alternatively, as an image plane adjustment element, a pair of cylindrical lenses rotatable around the optical axis may be provided, and the degree of image plane curvature may be adjusted by changing the relative angle of these lenses around the optical axis. Alternatively, as an image plane adjustment element, a deformable optical component may be provided, and the degree of image plane curvature of the optical system 112 may be adjusted by deforming this optical component. Note that if the processing light EL is a single processing light, the focus lens 1121 may be used as the image plane adjustment element.

[0176] According to this third specific example of pre-measurement and control operation, the processing apparatus 1b can enjoy the same effects as those that can be enjoyed by the first specific example of pre-measurement and control operation described above.

[0177] (4-2-4) Fourth specific example of pre-measurement and control operation The fourth specific example of the pre-measurement control operation differs from the first specific example of the pre-measurement control operation described above in that the control device 18 sets non-processing areas on the surface of the coating film SF that should not be processed by irradiation with processing light EL, based on the shape of the surface of the coating film SF. Furthermore, the fourth specific example of the pre-measurement control operation differs from the first specific example of the pre-measurement control operation described above in that the control device 18 controls the light irradiation device 11 so as not to irradiate the non-processing areas with processing light EL. Other features of the fourth specific example of the pre-measurement control operation may be the same as those of the first specific example of the pre-measurement control operation.

[0178] As shown in Figure 32(a), the control device 18 sets areas on the surface of the painted film SF where structures exceeding a permissible size exist as non-processing areas. Specifically, for example, the control device 18 sets areas on the surface of the painted film SF where convex structures protrude compared to their surroundings, and where the amount of protrusion T1 from the surroundings is greater than a predetermined protrusion threshold (e.g., several millimeters, several centimeters, etc.) corresponding to the permissible size exist as non-processing areas. For example, in addition to or instead of areas where convex structures exist, the control device 18 sets areas on the surface of the painted film SF where concave structures are recessed compared to their surroundings, and where the amount of recess T2 from the surroundings is greater than a predetermined recess threshold (e.g., several millimeters, several centimeters, etc.) corresponding to the permissible size exist as non-processing areas. Such convex or concave structures typically exist in parts where the workpiece S itself protrudes or is recessed, as shown in Figure 32(a).

[0179] As mentioned above, an example of the object to be processed S is the airframe of an aircraft PL. In this case, structures exceeding the permissible size include, for example, operational structures formed on the surface of the airframe for the operation of the aircraft PL. An example of an operational structure is an antenna structure relating to an antenna. An antenna structure includes, for example, at least one of the antenna itself and accessories installed in conjunction with the antenna. An example of an antenna is at least one of the following: an ELT (Emergency Locator Transmitter) antenna, a VHF (Very High Frequency) antenna, an ADF (Automatic Direction Finder) antenna, an ATC (Air Traffic Control) transponder antenna, a TCAS (Traffic alert and Collision Avoidance System) antenna, and a weather radar antenna. An example of an operational structure is a sensor structure relating to a sensor. A sensor structure includes, for example, at least one of the sensor itself and accessories installed in conjunction with the sensor. An example of a sensor is at least one of the following: a freeze-sensing sensor, a pitot tube, an AOA (Angle of Attack) sensor, and an altitude sensor. Examples of operational structures include flow structures related to the inflow and outflow of fluids (typically gases). Examples of flow structures include at least one inlet (e.g., at least one air intake and cooling port) into which fluid flows, and at least one outlet (e.g., at least one drain outlet and exhaust port) into which fluid flows. Other examples of operational structures include at least one window, wiper, and storage door for surveillance cameras.

[0180] After setting the non-processing area, the control device 18 controls the light irradiation device 11 so that multiple processing light ELs scan the surface of the coated film SF. During this time, as shown in Figures 32(a) and 32(b), the control device 18 controls the light irradiation device 11 so as not to irradiate the non-processing area with processing light ELs. In other words, the control device 18 may turn off the processing light EL irradiated to a certain irradiation area EA if that irradiation area EA overlaps with the non-processing area. Turning off the processing light EL can be achieved by at least one of the following, for example, turning off the light source 1111 and inserting a light-shielding member into the optical path of the processing light EL. On the other hand, the control device 18 controls the light irradiation device 11 so as to irradiate the area that is not set as a non-processing area with processing light ELs. If there is only one processing light EL, the scanning range of the processing light EL may be controlled to be limited to processing areas other than the non-processing area.

[0181] According to this fourth specific example of pre-measurement and control operation, the processing device 1b can enjoy the same effects as the processing device 1 described above. Furthermore, in the fourth specific example, the processing device 1b does not irradiate parts of the coating film SF that should not be processed with processing light EL. Therefore, the processing device 1b can process the coating film SF while preventing adverse effects from the irradiation of processing light EL from affecting any structures such as operational structures.

[0182] In the above explanation, areas on the surface of the coating film SF where structures exceeding the allowable size exist are set as non-processing areas. However, in some cases, it may be desirable to form a riblet structure even in areas where structures exceeding the allowable size exist. For example, even if the above-mentioned operational structures do not exist, areas where structures exceeding the allowable size exist may occur on the surface of the coating film SF due to at least one of the following: distortion of the workpiece S or unevenness in the thickness of the coating film SF. In this case, the areas where structures exceeding the allowable size exist may be areas where a riblet structure should be formed precisely because they do not contain operational structures. Therefore, the control device 18 may irradiate the areas where a riblet structure is desired (hereinafter, for convenience, referred to as "desired processing areas") with processing light EL without setting the areas where structures exceeding the allowable size exist but where a riblet structure is desired (hereinafter, for convenience, referred to as "desired processing areas") as non-processing areas. Alternatively, the control device 18 may first set the desired processing areas as non-processing areas, and then irradiate the desired processing areas with processing light EL before or after irradiating areas on the surface of the coating film SF other than the desired processing areas with processing light EL. However, regions containing structures larger than the permissible size correspond to regions that protrude compared to regions where structures larger than the permissible size do not exist (i.e., regions with irregularities as shown in Figure 26(c) above). For this reason, in order to irradiate regions containing structures larger than the permissible size with processing light EL, the control device 18 may adjust the focusing position FP of multiple processing light ELs (see the first specific example above), control the drive system 12 to move the light irradiation device 11 along the Z axis (see the first specific example above), or adjust the depth of focus of the optical system 112 (see the second specific example above).

[0183] Furthermore, the control device 18 may set, in addition to or instead of regions on the surface of the painted film SF where structures exceeding the permissible size exist, regions where riblet structures have already been formed (i.e., regions where concave structures CP1 and / or convex structures CP2 have been formed) as non-processing regions. In this case, the already formed riblet structures will not be processed in such a way that their properties deteriorate (for example, their shape becomes undesirable) due to repeated irradiation with processing light EL.

[0184] Furthermore, the control device 18 may control the light irradiation device 11 so that the irradiation area EA does not overlap with the non-processing area (i.e., the irradiation area EA moves on the surface of the painted film SF while avoiding the non-processing area). For example, while the light irradiation device 11 is irradiating with processing light EL, the control device 18 may control the drive system 12 to move the light irradiation device 11 relative to the painted film SF so that the irradiation area EA does not overlap with the non-processing area. Even in this case, the processing device 1b will not irradiate parts of the painted film SF that should not be processed with processing light EL, so the painted film SF can be processed while preventing adverse effects from the irradiation of processing light EL from affecting any structures such as operational structures.

[0185] (4-2-5) Fifth specific example of pre-measurement and control operation In the fifth specific example, the surface property measuring device 19b measures the reflectance R of the painted film SF to the processing light EL as a surface property of the painted film SF. To measure the reflectance R, the light projection device 191b of the surface property measuring device 19b irradiates the painted film SF with measurement light MLb (hereinafter, the measurement light MLb used in the fifth specific example will be referred to as "measurement light MLb2"). Measurement light MLb2 is light with the same wavelength as the processing light EL. Alternatively, measurement light MLb2 may be light that contains light components with the same wavelength as the processing light EL. In this case, if the intensity of measurement light MLb2 is greater than or equal to the intensity that can evaporate the painted film SF, there is a possibility that the painted film SF will evaporate due to irradiation with measurement light MLb2. For this reason, the light projection device 191b irradiates measurement light MLb2 with an intensity less than the intensity that can evaporate the painted film SF. In other words, the light projection device 191b irradiates measurement light MLb with an intensity that is low enough not to evaporate the painted film SF.

[0186] The detection device 192b of the surface property measurement device 19b measures the reflected light (particularly its intensity) of the measurement light MLb2 from the coating film SF. Since the measurement light MLb2 is light with the same wavelength as the processing light EL, the intensity of the reflected light of the measurement light MLb2 increases as the reflectance R of the coating film SF with respect to the processing light EL increases. Therefore, the measurement result of the reflected light (i.e., the output of the surface property measurement device 19b) contains information about the reflectance R. For this reason, the control device 18 can determine the reflectance R based on the measurement result of the surface property measurement device 19b.

[0187] In the fifth specific example, the control device 18 sets the intensity of multiple processing light ELs based on the reflectance R. Specifically, as shown in Figure 33(a), the control device 18 sets the intensity of multiple processing light ELs such that the intensity of each processing light EL increases as the reflectance R increases. After setting the intensity of multiple processing light ELs in this way, the control device 18 controls the light irradiation device 11 to irradiate with multiple processing light ELs having the set intensity. Note that the relationship between the reflectance R and the intensity of the processing light ELs is not limited to a linear relationship as shown in Figure 33(a), but may be nonlinear, for example, as shown in Figures 33(b) and 33(c).

[0188] According to this fifth specific example of pre-measurement and control operation, the processing apparatus 1b can enjoy the same effects as the processing apparatus 1 described above. Furthermore, in the fifth specific example, the processing apparatus 1b irradiates the coating film SF with processing light EL of increasing intensity as the reflectance R of the coating film SF to the processing light EL increases. Therefore, the processing apparatus 1b can process the coating film SF appropriately without being affected by the difference in reflectance R of the coating film SF. In other words, the processing apparatus 1b can process coating films SF with relatively high reflectance R and coating films SF with relatively low reflectance R in the same way to form the same riblet structure. The reason for this will be explained below.

[0189] First, as mentioned above, the coating film SF evaporates due to the energy transferred from the processing light EL to the coating film SF upon irradiation with the processing light EL. Therefore, assuming that the intensity of the processing light EL irradiated onto a coating film SF with a relatively high reflectance R is the same as the intensity of the processing light EL irradiated onto a coating film SF with a relatively low reflectance R, the energy from the processing light EL transferred to the coating film SF with a relatively high reflectance R will be less than the energy from the processing light EL transferred to the coating film SF with a relatively low reflectance R. This is because the coating film SF with a relatively high reflectance R reflects more processing light EL compared to the coating film SF with a relatively low reflectance R, resulting in a smaller proportion of the processing light EL being absorbed as energy by the coating film SF. In other words, the degree to which the coating film SF with a relatively high reflectance R absorbs the processing light EL (i.e., the absorption rate of the coating film SF with respect to the processing light EL) is smaller than the degree to which the coating film SF with a relatively low reflectance R absorbs the processing light EL (i.e., the absorption rate of the coating film SF with respect to the processing light EL). As a result, there is a possibility that coating films SF with relatively high reflectance R and coating films SF with relatively low reflectance R may not be processed in the same way. In other words, the riblet structure formed by processing a coating film SF with relatively high reflectance R may not be the same as the riblet structure formed by processing a coating film SF with relatively low reflectance R.

[0190] However, in the fifth specific example, the intensity of the processing light EL irradiated onto the coating film SF with a relatively high reflectance R is greater than the intensity of the processing light EL irradiated onto the coating film SF with a relatively low reflectance R. Therefore, the energy added to the coating film SF with a relatively high reflectance R from the processing light EL may be equal to the energy added to the coating film SF with a relatively low reflectance R from the processing light EL. Conversely, the control device 18 sets the intensities of multiple processing light ELs based on the reflectance R so that the energy added to the coating film SF with a relatively high reflectance R from the processing light EL is equal to the energy added to the coating film SF with a relatively low reflectance R from the processing light EL. As a result, the coating film SF with a relatively high reflectance R and the coating film SF with a relatively low reflectance R are processed in the same way. In other words, the riblet structure formed by processing the coating film SF with a relatively high reflectance R is the same as the riblet structure formed by processing the coating film SF with a relatively low reflectance R. Therefore, the processing apparatus 1b can prevent variations in the accuracy of riblet structure formation due to differences in the reflectance R of the coating film SF. However, if a coating film SF with a relatively low reflectance R is irradiated with processing light EL of high intensity, the processing range of the riblets may extend beyond the coating film SF, potentially affecting the workpiece S. In this example, since the intensities of multiple processing light ELs are set based on the reflectance R, there is little risk of adverse effects on the workpiece S.

[0191] As described above, as multiple processing light ELs are scanned, the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF, each irradiated by the multiple processing light ELs, change (particularly their positions along the surface of the coating film SF). When the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF change, the reflectance R of the portion of the coating film SF surface where the multiple irradiation areas EAs are set may also change while the multiple processing light ELs are irradiating it. For this reason, the control device 18 may set the intensity of the multiple processing light ELs based on the reflectance R of the portion of the coating film SF surface where the multiple irradiation areas EAs are set, and control the light irradiation device 11 to irradiate the coating film SF with the set intensity when the multiple processing light ELs are irradiating it (i.e., when the multiple processing light ELs are moving relative to the coating film SF). Depending on the shape of the surface of the coating film SF, when the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF change, the angle of incidence of the processing light ELs on the coating film SF may change. Alternatively, even if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF do not change, the incident angle of the processing light EL on the coating film SF may change due to some factor. If the incident angle of the processing light EL on the coating film SF changes, the reflectance R may change. In this case as well, the control device 18 can set the intensity of the processing light EL to an appropriate intensity using the measured or pre-prepared information on the surface shape of the coating film SF.

[0192] Furthermore, the energy transferred from the processing light EL to the coating film SF can vary depending not only on the intensity of the processing light EL but also on the irradiation time of the processing light EL. Specifically, the energy transferred from the processing light EL to the coating film SF increases as the irradiation time of the processing light EL increases. Here, "irradiation time of processing light EL" refers to the time during which the processing light EL is irradiated onto the same area on the surface of the painted film SF. For this reason, the control device 18 may set the irradiation time of the multiple processing light ELs based on the reflectance R, in addition to or instead of the intensity of the multiple processing light ELs. Specifically, as shown in Figures 34(a) to 34(c), the control device 18 sets the irradiation time of the multiple processing light ELs such that the irradiation time of the multiple processing light ELs increases as the reflectance R increases. Note that Figure 34(a) shows the case where the relationship between the irradiation time of the processing light ELs and the reflectance R changes linearly, while Figures 34(b) and 34(c) show the case where the relationship between the irradiation time of the processing light ELs and the reflectance R changes nonlinearly. After setting the irradiation times of the multiple processing light ELs in this way, the control device 18 controls the light irradiation device 11 to irradiate the multiple processing light ELs based on the set irradiation times. Specifically, the control device 18 controls the scanning speed of the multiple processing light ELs (i.e., the relative movement speed of the multiple irradiation areas EA relative to the painted film SF) based on the set irradiation times. More specifically, the control device 18 controls the scanning speed of the processing light EL such that the scanning speed of the processing light EL decreases as the irradiation time increases. To control the scanning speed, the control device 18 may control the rotation frequency or oscillation frequency of the galvanometer mirror 1122. Specifically, the control device 18 may control the rotation frequency or oscillation frequency of the galvanometer mirror 1122 such that the rotation frequency or oscillation frequency of the galvanometer mirror 1122 decreases as the irradiation time increases. As a result, the scanning speed of the processing light EL decreases as the irradiation time increases. In this way, even when the irradiation time of multiple processing light ELs is set based on the reflectance R, the same effects as those that can be enjoyed when the intensity of multiple processing light ELs is set based on the reflectance R can be enjoyed. Note that depending on the shape of the surface of the coating film SF, if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the incident angle of the processing light EL on the coating film SF may change. Alternatively, even if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF do not change, the incident angle of the processing light EL on the coating film SF may change due to some factor. If the angle of incidence of the processed light EL on the coating film SF changes, the reflectance R may change.In this case as well, the control device 18 can use the measured or pre-prepared surface shape information of the coating film SF to set the irradiation time of the processing light EL to an appropriate time.

[0193] Furthermore, if the processing apparatus 1b performs at least one of the first to fourth specific examples of the pre-measurement operation in addition to the fifth specific example of the pre-measurement operation, the processing apparatus 1b is separately equipped with a surface characteristic measuring device 19b-1 for measuring the surface shape of the coating film SF and a surface and structure measuring device 19b-2 for measuring the reflectance of the coating film SF. In this case, the surface characteristic measuring devices 19b-1 and 19b-2 irradiate with measurement light MLb1 and ML2, respectively, but the light sources for measurement light MLb1 and ML2 may be shared. In other words, the surface characteristic measuring devices 19b-1 and 19b-2 may share a single light source that emits measurement light MLb, which can be used as measurement light MLb1 and ML2.

[0194] In the above explanation, the measurement light MLb2 for measuring the reflectance R is light with the same wavelength as the processing light EL (or light containing a light component with the same wavelength as the processing light EL). However, the measurement light MLb2 may be light with a different wavelength than the processing light EL (or light that does not contain a light component with the same wavelength as the processing light EL). Even in this case, as long as the measurement light MLb2 used has some correlation between the reflectance of the coating film SF with respect to the measurement light MLb2 and the reflectance R of the coating film SF with respect to the processing light EL, the control device 18 can determine the reflectance R from the measurement results of the surface characteristic measurement device 19b.

[0195] In the above explanation, the surface property measurement device 19b measures the reflectance R of the coating film SF to the processing light EL. However, as the reflectance R of the coating film SF to the processing light EL increases, the absorption rate of the coating film SF to the processing light EL decreases. For this reason, it can be said that the surface property measurement device 19b is, in effect, measuring the absorption rate of the coating film SF to the processing light EL. In this case, it can be said that the control device 18 is, in effect, setting the intensity of the multiple processing light ELs such that the intensity of the multiple processing light ELs decreases as the absorption rate of the coating film SF to the processing light EL increases. Furthermore, it can be said that the control device 18 is, in effect, setting the irradiation time of the multiple processing light ELs such that the irradiation time of the multiple processing light ELs decreases as the absorption rate of the coating film SF to the processing light EL increases.

[0196] (4-2-6) Sixth specific example of pre-measurement and control operation In the sixth specific example, the surface property measuring device 19b measures the reflectance Ra of the painted film SF with respect to multiple measurement light MLb with different wavelengths (hereinafter, the measurement light MLb used in the sixth specific example will be referred to as "measurement light MLb3") as a surface property of the painted film SF. To measure the reflectance Ra, the light projection device 191b of the surface property measuring device 19b irradiates the painted film SF with multiple measurement light MLb3 with different wavelengths. The multiple measurement light MLb3 may or may not contain light with the same wavelength as the processing light EL. The multiple measurement light MLb3 may or may not contain light with the same wavelength component as the processing light EL. The intensity of the multiple measurement light MLb3 is set to an intensity less than the intensity that can evaporate the painted film SF, similar to the fifth specific example. Furthermore, the detection device 192b of the surface property measuring device 19b further measures the reflected light (in particular, its intensity) of each of the multiple measurement light MLb3 from the painted film SF. Therefore, the control device 18 can determine the reflectance Ra of the coating film for each of the multiple measurement light MLb3 based on the measurement results of the surface characteristic measuring device 19b. Figure 35 is a graph showing an example of the multiple reflectances Ra that have been determined.

[0197] Subsequently, the control device 18 sets the wavelength of one of the multiple measurement light MLb3 to the wavelength of the processing light EL. Specifically, the control device 18 sets the wavelength of the measurement light MLb3 with the smallest reflectance Ra among the multiple measurement light MLb3 to the wavelength of the processing light EL. In other words, the control device 18 sets the wavelength of the measurement light MLb3 with the largest absorption rate of the coating film SF among the multiple measurement light MLb3 to the wavelength of the processing light EL. In the example shown in Figure 35, among the five measurement light MLb3 (i.e., measurement light MLb3(#1) to measurement light MLb3(#5)), the reflectance Ra corresponding to measurement light MLb3(#3) is the smallest. Therefore, the control device 18 sets the wavelength of measurement light MLb3(#3) to the wavelength of the processing light EL.

[0198] Subsequently, the control device 18 controls the light irradiation device 11 to irradiate the painted film SF with processing light EL of a set wavelength. Specifically, the processing device 1b that performs the sixth specific example of the pre-measurement control operation is equipped with a light irradiation device 11b-6, which has multiple light source systems 111 with different wavelengths of processing light EL emitted, instead of the light irradiation device 11 described above, as shown in Figure 36. The wavelengths of the multiple processing light ELs emitted by each of the multiple light source systems 111 are the same as the wavelengths of the multiple measurement light MLb3s. The control device 18 controls one of the multiple light source systems 111 so that the one light source system 111 capable of emitting processing light EL of a set wavelength emits multiple processing light ELs of the set wavelength. On the other hand, the control device 18 controls the other light source systems 111 so that the other light source systems 111 do not emit processing light EL. As a result, the light irradiation device 11b-6 can irradiate the painted film SF with processing light EL of a set wavelength.

[0199] In the above example, the light irradiation device 11b-6 had multiple light source systems 111, each emitting multiple processing light ELs having different wavelengths. However, instead of this, or in addition, the device may also include a light source system 111 that includes a tunable light source capable of continuously changing the emitted wavelength.

[0200] According to this sixth specific example of pre-measurement and control operation, the processing apparatus 1b can enjoy the same effects as the processing apparatus 1 described above. Furthermore, in the sixth specific example, the processing apparatus 1b can irradiate the coating film SF with a processing light EL of the same wavelength as the measurement light MLb3 of which has the smallest reflectance Ra of the coating film SF among multiple measurement light MLb3s. As a result, the processing apparatus 1b can irradiate the coating film SF with a processing light EL that has a relatively small reflectance R of the coating film (i.e., a relatively large absorption rate of the coating film SF). Therefore, the processing apparatus 1b can process the coating film SF appropriately without being affected by differences in the characteristics of the coating film SF.

[0201] As explained in the fifth specific example, the reflectance Ra of the portion of the surface of the coating film SF where multiple irradiation areas EA are set may also change while multiple processing light ELs are irradiated. For this reason, the control device 18 may set the wavelength of the processing light ELs based on the reflectance Ra of the portion of the surface of the coating film SF where multiple irradiation areas EA are set, when multiple processing light ELs are irradiated onto the coating film SF (i.e., when multiple processing light ELs are moving relative to the coating film SF), and control the light irradiation device 11 to irradiate with multiple processing light ELs of the set wavelength. As explained in the fifth specific example, the reflectance R may change if the angle of incidence of the processing light ELs on the coating film SF changes. In this case, the control device 18 may set the wavelength of the processing light ELs to an appropriate wavelength using measured or pre-prepared information on the surface shape of the coating film SF.

[0202] Furthermore, the control device 18 may set the wavelength of one of the multiple measurement light MLb3s, whose reflectance Ra is below a predetermined reflection threshold (i.e., the absorption rate of the coating film SF is above a predetermined absorption threshold), to the wavelength of the processing light EL. The reflection threshold is set to satisfy the condition that even if a portion of the processing light EL irradiated onto the coating film SF is reflected by the coating film SF with a reflectance R above the reflection threshold, the coating film SF can still be evaporated by the processing light EL. The absorption threshold is set from the same perspective. Even in this case, the processing apparatus 1b can process the coating film SF appropriately without being affected by differences in the characteristics of the coating film SF.

[0203] (4-2-7) Seventh specific example of pre-measurement and control operation The seventh specific example of the pre-measurement control operation differs from the first specific example of the pre-measurement control operation described above in that the control device 18 controls the relative positional relationship between the coating film SF and the multiple irradiation areas EA based on the surface shape of the coating film SF. Other features of the seventh specific example of the pre-measurement control operation may be the same as those of the first specific example of the pre-measurement control operation.

[0204] Specifically, in the seventh specific example, when the light irradiation device 11 moves relative to the coating film SF (and the surface characteristic measuring device 19b, whose relative position to the light irradiation device 11 is fixed, also moves relative to the coating film SF), the surface characteristic measuring device 19b measures the shape of the surface of the coating film SF before the light irradiation device 11 moves, and measures the shape of the surface of the coating film SF after the light irradiation device 11 moves (or while the light irradiation device 11 is moving, the same applies hereafter). At this time, as shown in Figure 37, the surface characteristic measuring device 19b measures the shape of the surface of the coating film SF such that the region 31b on the surface of the coating film SF that was measured by the surface characteristic measuring device 19b before the light irradiation device 11 moved and the region 32b on the surface of the coating film SF that was measured by the surface characteristic measuring device 19b after the light irradiation device 11 moved partially overlap. In other words, the surface characteristic measuring device 19b performs measurements in accordance with the movement of the light irradiation device 11 so as to measure the shape of the surface of the overlapping region 33b which is included in both regions 31b and 32b. As a result, both the measurement results for region 31b and region 32b include the measurement results for the overlapping region 33b, which is included in both region 31b and region 32b.

[0205] The control device 18 identifies how the overlapping region 33b has moved based on the measurement results of region 31b and region 32b. Specifically, the control device 18 identifies a specific region within region 31b that has a uniquely distinguishable surface shape based on the measurement results of region 31b. Furthermore, the control device 18 determines whether or not the specific region exists within region 32b based on the measurement results of region 32b by pattern matching using the surface shape of the specific region as a template. If the specific region does not exist within region 32b, the control device 18 identifies a new specific region within region 31b and determines whether the new specific region exists within region 32b. If the specific region exists within region 32b, that specific region corresponds to the overlapping region 33b. The control device 18 compares the position of the overlapping region 33b within region 31b with the position of the overlapping region 33b within region 32b to determine how the relative position of the surface characteristic measuring device 19b with respect to the overlapping region 33b has changed as the light irradiation device 11 moves. Specifically, the control device 18 determines how much the surface characteristic measuring device 19b has moved with respect to the overlapping region 33b along the X-axis and Y-axis directions, respectively. The light irradiation device 11 may also irradiate the surface of the coating film SF with processing light EL so as to form a specific region within region 31b in which the surface shape is some shape that can be uniquely distinguished. For example, the riblet structure may be processed so that a part of a convex or concave structure extending linearly along a predetermined direction is cut out, or, as shown in Figures 58 and 59 below, the riblet structure may have different cross-sectional shapes in the direction of extension of the riblet.

[0206] The relative movement of the surface property measuring device 19b with respect to the overlapping region 33b is the same as the relative movement of the light irradiation device 11 with respect to the coating film SF. The relative direction of movement of the surface property measuring device 19b with respect to the overlapping region 33b is the same as the relative direction of movement of the light irradiation device 11 with respect to the coating film SF. Therefore, the control device 18 can determine how much the light irradiation device 11 has moved along the X-axis and Y-axis directions with respect to the coating film SF. In other words, by determining the relative position of the surface property measuring device 19b with respect to the overlapping region 33b, the control device 18 can determine the relative position of the light irradiation device 11 with respect to the coating film SF.

[0207] Since the light irradiation device 11 irradiates the painted film SF with processing light EL, determining the relative position of the light irradiation device 11 with respect to the painted film SF is substantially equivalent to determining the relative positions of multiple irradiation areas EA with respect to the painted film SF. Therefore, the control device 18 can determine the relative positions of multiple irradiation areas EA with respect to the painted film SF (particularly along the X-axis and Y-axis directions, respectively) based on the surface shape of the painted film SF. Subsequently, if the determined positions of the multiple irradiation areas EA deviate from the positions of the multiple irradiation areas EA required to form a riblet structure (or a structure to be formed by processing the painted film SF), the control device 18 controls the light irradiation device 11 so that the multiple irradiation areas EA move relative to the painted film SF. In other words, the control device 18 controls the relative positional relationship between the painted film SF and the multiple irradiation areas EA. For example, the control device 18 may move the multiple irradiation areas EA relative to the painted film SF by controlling the drive system 12 to move the light irradiation device 11 with respect to the painted film SF.

[0208] According to this seventh specific example of pre-measurement and control operation, the processing apparatus 1b can enjoy the same effects as the processing apparatus 1 described above. Furthermore, in the seventh specific example, the processing apparatus 1b can appropriately adjust the relative positions of multiple irradiation areas EA on the surface of the coating film SF, thereby enabling the riblet structure to be formed more appropriately (for example, with greater precision).

[0209] (4-2-8) Other examples of pre-measurement and control operations In the above description, the processing apparatus 1b is equipped with a surface property measuring device 19b. However, the processing apparatus 1b does not need to be equipped with a surface property measuring device 19b. In this case, as long as the control device 18 can acquire information regarding the surface of the coating film SF, the processing apparatus 1b can perform the above-described pre-measurement control operation. For example, the shape of the surface of the coating film SF can be estimated from design data such as a three-dimensional model of the workpiece S. For this reason, the control device 18 may acquire design data of the workpiece S, estimate the shape of the surface of the coating film SF from the design data, and perform the first to fourth specific examples of the above-described pre-measurement control operation based on the estimated shape of the surface of the coating film SF. Alternatively, the control device 18 may acquire data in which information on the processing area and the non-processing area has been added to the design data in advance. Or, for example, the reflectance R of the coating film SF can be estimated from the specifications of the coating film SF. For this reason, the control device 18 may acquire information regarding the specifications of the coating film SF, estimate the reflectance R of the coating film SF from the information regarding the specifications, and perform the fifth to sixth specific examples of the above-described pre-measurement control operation based on the estimated reflectance R. Alternatively, the control device 18 may acquire data in which paint reflectance information (generally color information) has been added in advance to the design data. As a result, measurement by the surface property measuring device 19b becomes unnecessary, and the time required for processing the paint film SF can be shortened. In this case, the operation performed does not require measurement by the surface property measuring device 19b, and therefore does not need to be called a pre-measurement control operation. In addition, the non-processing area may be masked with masking tape or the like.

[0210] In the above description, the control device 18 controls at least one of the focusing position FP of the processing light EL, the intensity distribution of the processing light EL, the shape of the processing light EL, and the depth of focus of the optical system 112, based on the surface shape of the coating film SF. The control device 18 controls at least one of the intensity of the multiple processing light ELs, the irradiation time of the multiple processing light ELs, and the wavelength of the multiple processing light ELs, based on the reflectance of the coating film SF. However, the control device 18 may also control any characteristic of the processing light ELs based on any characteristic of the coating film SF, so that the coating film SF can be processed by irradiation with multiple processing light ELs. Examples of any characteristic of the processing light ELs include at least one of the shape of the multiple irradiation areas EA, the size of the multiple irradiation areas EA, the position of the multiple irradiation areas EA, the relative position between the multiple processing light ELs, the relative angle between the multiple processing light ELs, the polarization state of the multiple processing light ELs, the intensity of the multiple processing light ELs, the irradiation time of the multiple processing light ELs, and the wavelength of the multiple processing light ELs.

[0211] In the above description, the surface property measuring device 19b measures the surface properties of the coating film SF before the light irradiation device 11 irradiates the surface of the coating film SF with multiple processing light ELs. In other words, during the period when the surface property measuring device 19b is measuring the surface properties of the coating film SF, the light irradiation device 11 does not irradiate with multiple processing light ELs, and during the period when the light irradiation device 11 is irradiating with multiple processing light ELs, the surface property measuring device 19b does not measure the surface properties of the coating film SF. However, the surface property measuring device 19b may measure the surface properties of the coating film SF for at least a portion of the period during which the light irradiation device 11 irradiates the surface of the coating film SF with multiple processing light ELs. The light irradiation device 11 may irradiate the surface of the coating film SF with multiple processing light ELs for at least a portion of the period during which the surface property measuring device 19b is measuring the surface properties of the coating film SF. In other words, the measurement operation of the surface properties of the coated film SF by the surface property measuring device 19b and the irradiation operation of multiple processing light ELs onto the coated film SF by the light irradiation device 11 (i.e., the processing operation of the coated film SF) may be performed in parallel. For example, the surface property measuring device 19b may measure the properties of a region of the coated film SF different from the region of the coated film SF whose properties have already been measured by the surface property measuring device 19b for at least a portion of the time during which the light irradiation device 11 is irradiating. In this case, an improvement in throughput for the formation of the riblet structure can be expected.

[0212] (4-3) Third variation Next, with reference to Figure 38, a third modified processing apparatus 1c will be described. As shown in Figure 38, the third modified processing apparatus 1c differs from the processing apparatus 1 described above in that it further includes a structural measuring device 19c. Other features of the processing apparatus 1c may be the same as other features of the processing apparatus 1.

[0213] The structural measurement device 19c measures the characteristics of the riblet structure (or any other arbitrary structure; the same applies hereinafter in this modified example) formed by irradiation with processing light EL from the light irradiation device 11. Examples of characteristics of the riblet structure include the presence or absence of the riblet structure, the shape of the riblet structure (for example, at least one of the cross-sectional shapes of the concave structure CP1 and the cross-sectional shapes of the concave structure CP1), the size of the riblet structure (for example, at least one of the depth D of the concave structure CP1, the width of the concave structure CP1, the arrangement pitch P1 of the concave structure CP1, the height H of the convex structure CP2, the width of the convex structure CP2, and the arrangement pitch P2 of the convex structure CP2), and the position of the riblet structure (for example, the position of at least one of the concave structure CP1 and the convex structure CP2).

[0214] To measure the characteristics of the riblet structure, the structural measurement device 19c comprises a light emitter 191c and a detection device 192c. The light emitter 191c and the detection device 192c are supported by the housing device 13 via a support member 136c. The light emitter 191c irradiates the riblet structure (i.e., the coating film SF) with measurement light MLc1. When the measurement light MLc1 is irradiated onto the riblet structure, the measurement light MLc1 is reflected or scattered by the riblet structure. As a result, measurement light MLc2, which includes at least one of the reflected and scattered light of measurement light MLc1, is emitted from the riblet structure. The detection device 192c detects this measurement light MLc2.

[0215] When measurement light MLc1 is irradiated onto a portion where a riblet structure is formed, measurement light MLc2 includes at least one of reflected light and scattered light propagating in a direction intersecting the direction of propagation of measurement light MLc1. On the other hand, when measurement light MLc1 is irradiated onto a portion where a riblet structure is not formed, measurement light MLc2 does not include at least one of reflected light and scattered light propagating in a direction intersecting the direction of propagation of measurement light MLc1. In other words, the direction of propagation of measurement light MLc2 is generally parallel to the direction of propagation of measurement light MLc1. Therefore, as shown in Figure 39, when the light emitter 191c and the detection device 192c are arranged to detect measurement light MLc2 propagating in a direction intersecting the direction of propagation of measurement light MLc1, the control device 18 can determine the presence or absence of a riblet structure in the portion irradiated by measurement light MLc1 based on the detection result of the detection device 192c. Furthermore, the characteristics of measurement light MLc2 (e.g., intensity) vary depending on at least one of the shape and size of the riblet structure. Therefore, based on the detection results of the detection device 192c, the control device 18 can also identify at least one of the following: the shape of the riblet structure, the size of the riblet structure, the position of the concave structure CP1 constituting the riblet structure, and the position of the convex structure CP2 constituting the riblet structure.

[0216] The structural measurement device 19c is further configured to change the direction of travel of the measurement light MLc1. For example, if the light projector 191c is equipped with an optical element that optically changes the direction of travel of the measurement light MLc1, the direction of travel of the measurement light MLc1 may be changed by the optical element. For example, if the light projector 191c is movable relative to the coating film SF, the direction of travel of the measurement light MLc1 may be changed by the relative movement of the light projector 191c. Here, if the measurement light MLc1 can only be irradiated onto the riblet structure from one direction, depending on the direction of extension of the riblet structure, there is a possibility that measurement light MLc2 will not be generated even if the measurement light MLc1 is irradiated onto the riblet structure. However, if the direction of travel of the measurement light MLc1 is changeable, the light projector 191c can irradiate a riblet structure extending in a certain direction with measurement light MLc1 from various directions. For this reason, the structural measurement device 19c can measure the characteristics of the riblet structure without being affected by differences in the direction of extension of the riblet structure. Furthermore, the structural measurement device 19c itself may be rotated around the Z-axis to change the direction of the measuring light MLc1. Alternatively, multiple structural measurement devices 19c may be provided, each with a different direction of propagation for the measuring light MLc1.

[0217] In addition to changing the direction of travel of the measurement light MLc1, the structural measurement device 19c may be configured to change the direction of travel of the measurement light MLc2 that can be detected by the detection device 192c. For example, if the detection device 192c is movable relative to the coating film SF, the relative movement of the detection device 192c may change the direction of travel of the measurement light MLc2 that can be detected by the detection device 192c. Here, if the detection device 192c can only detect measurement light MLc2 traveling in one direction, depending on the direction of extension of the riblet structure, the measurement light MLc2 may not travel toward the detection device 192c, and the detection device 192c may not be able to detect the measurement light MLc2. However, if the direction of travel of the measurement light MLc2 that can be detected by the detection device 192c is changeable, the detection device 192c can detect measurement light MLc2 traveling in various directions from a riblet structure extending in one direction. Therefore, the structural measurement device 19c can measure the characteristics of the riblet structure without being affected by differences in the extension direction of the riblet structure.

[0218] The structural measurement device 19c may measure the characteristics of all riblet structures formed by the processing device 1c. However, measuring the characteristics of all riblet structures formed by the processing device 1c would require an enormous amount of time to measure the characteristics of the riblet structures. Therefore, in the third modified example, the structural measurement device 19c selectively measures the characteristics of riblet structures formed in a sample region DAc corresponding to a part of the processed area where the processing device 1c formed the riblet structures, as shown in Figure 40. The structural measurement device 19c selectively measures the characteristics of riblet structures formed in multiple sample regions DAc that are evenly distributed within the processed area. However, the structural measurement device 19c may selectively measure the characteristics of riblet structures formed in multiple (or one) sample regions DAc that are randomly distributed within the processed area.

[0219] The structural measurement device 19c may selectively measure the characteristics of the riblet structure formed in a sample area DAc within a certain region after the processing device 1c has formed a riblet structure in that region. For example, after the processing device 1c has formed a riblet structure in a certain unit processing region SA, the structural measurement device 19c may set a sample area DAc within that unit processing region SA and selectively measure the characteristics of the riblet structure formed in the set sample area DAc. Subsequently, if the processing device 1c forms a riblet structure in another unit processing region SA, the structural measurement device 19c may set a sample area DAc within that other unit processing region SA and selectively measure the characteristics of the riblet structure formed in the set sample area DAc. In other words, the formation of the riblet structure by the processing device 1c and the measurement of the characteristics of the riblet structure by the structural measurement device 19c may be repeated alternately.

[0220] Alternatively, the structural measurement device 19c may measure the characteristics of a riblet structure already formed by the processing device 1c in a region different from the one in question, at least for a portion of the period during which the processing device 1c is irradiating a region of the surface of the coating film SF with multiple processing light ELs (i.e., forming a riblet structure in a region). For example, the structural measurement device 19c may selectively measure the characteristics of a riblet structure formed in a sample region DAc within another unit processing region SA, which is different from the said unit processing region SA and in which the processing device 1c has already formed a riblet structure, at least for a portion of the period during which the processing device 1c is forming a riblet structure in a unit processing region SA. In other words, the formation of the riblet structure by the processing device 1c and the measurement of the characteristics of the riblet structure by the structural measurement device 19c may be performed in parallel. In this case, an improvement in throughput can be expected.

[0221] When the measurement by the structural measurement device 19c is completed, the measurement results from the structural measurement device 19c are output to the control device 18. As described above, the control device 18 identifies the characteristics of the riblet structure based on the measurement results from the structural measurement device 19c. Based on the identified characteristics of the riblet structure, the control device 18 determines whether the characteristics of the riblet structure are good or bad. Furthermore, the control device 18 notifies the operator of the processing device 1c of the result of the quality determination of the characteristics of the riblet structure via an output device including at least one such device, such as a display and a speaker.

[0222] For example, the control device 18 may determine the quality of the size of the riblet structure in a direction intersecting the surface of the coating film SF (i.e., the depth D of the concave structure CP1 or the height H of the convex structure CP2). Figure 41(a) is a cross-sectional view showing the ideal riblet structure that the processing device 1c should form. If the size of the identified riblet structure is the same as the size of the ideal riblet structure as shown in Figure 41(b), the control device 18 determines that the size of the riblet structure is normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies that the size of the riblet structure is normal. On the other hand, if the size of the identified riblet structure is smaller than the size of the ideal riblet structure as shown in Figure 41(c), the control device 18 determines that the size of the riblet structure is abnormal (i.e., the riblet structure is a defective product). In this case, the control device 18 notifies that the size of the riblet structure is abnormal (in particular, that the size is too small). On the other hand, if the size of the identified riblet structure is larger than the ideal size of the riblet structure, as shown in Figure 41(d), the control device 18 determines that the size of the riblet structure is abnormal (i.e., the riblet structure is defective). In this case, the control device 18 notifies that the size of the riblet structure is abnormal (in particular, that the size is large).

[0223] For example, the control device 18 may also determine whether the shape of the riblet structure is good or bad. If the shape of the identified riblet structure is the same as the shape of the ideal riblet structure as shown in Figure 42(a), the control device 18 determines that the shape of the riblet structure is normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies that the shape of the riblet structure is normal. On the other hand, if the shape of the identified riblet structure is different from the shape of the ideal riblet structure as shown in Figure 42(b), the control device 18 determines that the shape of the riblet structure is abnormal (i.e., the riblet structure is a defective product). In this case, the control device 18 notifies that the shape of the riblet structure is abnormal.

[0224] For example, the control device 18 may also determine the quality of the position of the concave structure CP1 (and convex structure CP2, hereinafter the same) that constitutes the riblet structure. If the position of the identified concave structure CP1 is the same as the position of the concave structure CP1 that constitutes an ideal riblet structure as shown in the upper part of Figure 43, the control device 18 determines that the position of the concave structure CP1 that constitutes the riblet structure is normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies that the position of the concave structure CP1 that constitutes the riblet structure is normal. On the other hand, if the position of the identified concave structure CP1 is different from the position of the concave structure CP1 that constitutes an ideal riblet structure as shown in the lower part of Figure 43, the control device 18 determines that the position of the concave structure CP1 that constitutes the riblet structure is abnormal (i.e., the riblet structure is a defective product). In this case, the control device 18 notifies that the position of the concave structure CP1 that constitutes the riblet structure is abnormal.

[0225] For example, the control device 18 may also perform a quality determination based on the presence or absence of a riblet structure. As shown in Figure 44(a), if a riblet structure is present within the sample region DA, the control device 18 determines that a riblet structure has been formed (i.e., the riblet structure is of good quality). In this case, the control device 18 notifies that a riblet structure has been formed. On the other hand, as shown in Figure 44(b), if a riblet structure is not present within the sample region DA, the control device 18 determines that a riblet structure has not been formed (i.e., the riblet structure is of poor quality). In this case, the control device 18 notifies that a riblet structure has not been formed.

[0226] If the control device 18 determines that a riblet structure is defective, it may control the light irradiation device 11 to correct the already formed riblet structure. Specifically, if a riblet structure is determined to be defective, it is possible that not only the riblet structure in the sample region DA where the defective riblet structure exists is defective, but also the riblet structure in a wider area on the coating film SF encompassing the sample region DA is defective. Therefore, the control device 18 controls the light irradiation device 11 to irradiate a wider area on the coating film SF encompassing the sample region DA (hereinafter referred to as the "area to be corrected") with processing light EL to correct the riblet structure in the area to be corrected. For example, as shown in Figure 45(a), if the size (here, depth D) of the concave structure CP1 constituting the riblet structure becomes smaller than the size of the concave structure CP1 constituting the ideal riblet structure, the control device 18 may control the light irradiation device 11 to enlarge the concave structure CP1 by irradiating the concave structure CP1 with processing light EL to further remove the coating film SF (i.e., to make the coating film SP1 even thinner). As a result, as shown in Figure 45(b), the size of the riblet structure in the area to be modified is corrected to match the size of the ideal riblet structure. Furthermore, the processing conditions of the processing device 1c may be changed using the measurement results of the characteristics of the riblet structure by the structural measurement device 19c. For example, if it is measured that the shape, formation position, and size of the riblet structure are about to fall outside the upper and lower limits of a predetermined range (standard), the processing conditions of the processing device 1c may be changed to bring the shape, formation position, and size of the riblet structure closer to the center value of the standard.

[0227] This third modified processing apparatus 1c can enjoy the same effects as the processing apparatus 1 described above. Furthermore, the processing apparatus 1c can appropriately evaluate the quality of the riblet structure actually formed.

[0228] (4-4) Fourth variation Next, the processing apparatus 1d of the fourth modification will be described. The processing apparatus 1d of the fourth modification can change the arrangement pitch P1 of the concave structure CP1. When the arrangement pitch P1 of the concave structure CP1 changes, the arrangement pitch P2 of the convex structure CP2 also changes. Therefore, it can be said that the processing apparatus 1d can change the arrangement pitch P2 of the convex structure CP2.

[0229] To change the arrangement pitch P1, the processing apparatus 1d includes an optical irradiation device 11d instead of the optical irradiation device 11 described above. The optical irradiation device 11d is different from the optical irradiation device 11 in that it includes an optical system 112d having a zoom lens 1124d as shown in FIG. 46. Other features of the optical irradiation device 11d may be the same as those of the optical irradiation device 11. The zoom lens 1124d can change the projection magnification of the optical system 112d under the control of the control device 18. The zoom lens 1124d can change the interval between a plurality of processing lights EL to be emitted under the control of the control device 18.

[0230] When the projection magnification of the optical system 112d changes, the relative positional relationship of a plurality of irradiation regions EA in the direction along the surface of the coating film SF changes. Specifically, as shown in FIG. 47(a), when the projection magnification of the optical system 112d is the first magnification (that is, the interval between a plurality of processing lights EL to be emitted is the first interval), the arrangement pitch of the plurality of irradiation regions EA is the first pitch Pe1. Note that the arrangement pitch of the plurality of irradiation regions EA means the arrangement pitch along the direction in which the plurality of irradiation regions EA move on the surface of the coating film EA during the step operation (in the example shown in FIG. 47(a), the X-axis direction). On the other hand, as shown in FIG. 47(b), when the projection magnification of the optical system 112d is the second magnification larger than the first magnification (that is, the interval between a plurality of processing lights EL to be emitted is the second interval larger than the first interval), the arrangement pitch of the plurality of irradiation regions EA is the second pitch Pe2 larger than the first pitch Pe1. That is, the control device 18 can change the relative positional relationship (particularly, the arrangement pitch of the plurality of irradiation regions EA) of the plurality of irradiation regions EA in the direction along the surface of the coating film SF by changing the projection magnification of the optical system 112d.

[0231] When the array pitch of the plurality of irradiation regions EA changes, the array pitch P1 of the plurality of concave structures CP1 formed by the plurality of processing lights EL respectively irradiated to the plurality of irradiation regions EA also changes. Specifically, as shown in FIG. 47(c), the array pitch P1 of the plurality of concave structures CP1 formed by the processing light EL irradiated to the plurality of irradiation regions EA having the array pitch of the first pitch Pe1 is the first pitch Pp1 corresponding to the first pitch Pe1. On the other hand, as shown in FIG. 47(d), the array pitch P1 of the plurality of concave structures CP1 formed by the processing light EL irradiated to the plurality of irradiation regions EA having the array pitch of the second pitch Pe2 is the second pitch Pp2 corresponding to the second pitch Pe2. Since the second pitch Pe2 is larger than the first pitch Pe1, the second pitch Pp2 is also larger than the first pitch Pp1.

[0232] Since the light irradiation device 11d irradiates a plurality of processing lights EL parallel to each other, when the array pitch of the plurality of irradiation regions EA changes, the relative positional relationship of the plurality of processing lights EL changes. That is, as shown in FIGS. 47(c) and 47(d), the relative positional relationship of the plurality of processing lights EL changes such that the interval between the plurality of processing lights EL (particularly, the interval in the direction along the surface of the coating film SF) increases as the array pitch of the plurality of irradiation regions EA increases. For this reason, the control of the array pitch of the plurality of irradiation regions EA is equivalent to the control of the relative positional relationship of the plurality of processing lights EL. Therefore, it can be said that the control device 18 substantially changes the array pitch of the concave structure CP1 by changing the relative positional relationship of the plurality of processing lights EL.

[0233] The control device 18 may change the arrangement pitch P1 of the concave structures CP1 depending on which part of the workpiece S corresponds to the area in which the riblet structure is to be formed. For example, as described above, if the workpiece S is an aircraft, the arrangement pitch P1 of the concave structures CP1 that can efficiently exert the friction reduction effect on the fuselage PL1 and the arrangement pitch P1 of the concave structures CP1 that can efficiently exert the friction reduction effect on the main wing PL2 may not be the same. For this reason, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 so that the arrangement pitch P1 of the concave structures CP1 formed by processing the paint film SF on the fuselage PL1 is different from the arrangement pitch P1 of the concave structures CP1 formed by processing the paint film SF on the main wing PL2.

[0234] The control device 18 may change the arrangement pitch P1 of the concave structures CP1 based on the surface shape of the coating film SF. Specifically, as described above, the surface shape of the coating film SF is likely to depend on the surface shape of the workpiece S beneath the coating film SF. In other words, the surface of the coating film SF applied to a workpiece S with a flat surface is likely to be flat, and the surface of the coating film SF applied to a workpiece S with a curved surface is likely to be curved. In this case, the arrangement pitch P1 of the concave structures CP1 that can efficiently exert the friction reduction effect on the surface of the workpiece S with a first shape is not necessarily the same as the arrangement pitch P1 of the concave structures CP1 that can efficiently exert the friction reduction effect on the surface of the workpiece S with a second shape different from the first shape. Therefore, the control device 18 may change the array pitch P1 of the concave structures CP1 so that the array pitch P1 of the concave structures CP1 formed by processing a coating film SF having a first surface shape is different from the array pitch P1 of the concave structures CP1 formed by processing a coating film SF having a second surface shape. In this case, the processing device 1d may be equipped with a surface characteristic measuring device 19b capable of measuring the surface shape of the coating film SF, similar to the processing device 1b, in order to change the array pitch P1 of the concave structures CP1 based on the surface shape of the coating film SF, or it may acquire information regarding the surface shape of the coating film SF (for example, the design data described above). Furthermore, when the light irradiation device 11d irradiates the coating film SF with a plurality of processing light ELs parallel to each other, the spacing (pitch) of the plurality of processing light ELs and the array pitch P1 of the formed concave structures CP1 are not necessarily the same when the shape of the workpiece S is not planar. In this case, the spacing of the plurality of processing light ELs may be changed so that the array pitch P1 of the concave structures CP1 is a predetermined pitch. Furthermore, even when the light irradiation device 11d irradiates the painted film SF with multiple processing light beams EL that are not parallel to each other, if the shape of the workpiece S is not planar, the spacing (pitch) between the multiple processing light beams EL and the arrangement pitch P1 of the concave structure CP1 that is formed may not be the same, so the spacing between the multiple processing light beams EL may be changed.

[0235] As multiple processing light ELs are scanned, the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF, each irradiated by the multiple processing light ELs, change (particularly, their positions along the surface of the coating film SF). When the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF change, the area where the multiple irradiation areas EAs are formed may change from an area corresponding to a certain part of the workpiece S (for example, an area corresponding to the fuselage PL1) to an area corresponding to a different part of the workpiece S (for example, an area corresponding to the main wing PL2) while the multiple processing light ELs are irradiating the coating film SF. Alternatively, when the relative positions of the multiple irradiation areas EAs on the surface of the coating film SF change, the shape of the portion of the surface of the coating film SF where the multiple irradiation areas EAs are formed may also change while the multiple processing light ELs are irradiating the coating film SF. For this reason, the control device 18 may change the arrangement pitch P1 of the concave structure CP1 when multiple processing light ELs are irradiating the coating film SF (i.e., when multiple processing light ELs are moving relative to the coating film SF). As described above, if the shape of the workpiece S is different, the arrangement pitch of the concave structure CP1 that is formed may differ even if the spacing between the multiple processing light ELs is constant. In this case, the spacing (pitch) between the multiple processing light ELs may be changed according to the shape of the coating film SF.

[0236] This fourth modified processing apparatus 1d can change the arrangement pitch of the concave structure CP1 and convex structure CP2 that constitute the riblet structure while enjoying the same effects as the processing apparatus 1 described above. Therefore, it is possible to form a more appropriate riblet structure compared to the case where the arrangement pitch of the concave structure CP1 and convex structure CP2 cannot be changed. Specifically, for example, it is possible to form a riblet structure with an appropriate arrangement pitch that appropriately reduces friction.

[0237] Furthermore, at least one of the above-described light irradiation devices 21a to 27a, as explained with reference to Figures 18 to 24, may also be equipped with a zoom lens 1124d. In this case as well, the arrangement pitch of the concave structure CP1 and convex structure CP2 constituting the riblet structure can be changed.

[0238] Furthermore, in the above description, the control device 18 changes the array pitch P1 of the concave structure CP1 (i.e., the array pitch of the multiple irradiation areas EA) and / or the spacing of the multiple processing light ELs by changing the projection magnification of the optical system 112d using the zoom lens 1124d. However, the control device 18 may change the array pitch P1 of the concave structure CP1 (i.e., the array pitch of the multiple irradiation areas EA) and / or the spacing of the multiple processing light ELs by other means. Even when the processing apparatus 1d is equipped with one of the above-described light irradiation devices 21a to 27a instead of the light irradiation device 11d, the control device 18 may change the array pitch P1 of the concave structure CP1 (i.e., the array pitch of the multiple irradiation areas EA) and / or the spacing of the multiple processing light ELs by other means.

[0239] For example, parallel planar plates whose inclination angle with respect to the optical axis can be changed may be provided in the optical path of each of the multiple processing light ELs emitted from the light source system 111, and the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing light ELs may be changed by setting the angles of these parallel planar plates to predetermined angles. At least one of the above-described light irradiation devices 22a to 23a and 25a to 27a that irradiate with multiple processing light ELs may also be equipped with parallel planar plates.

[0240] For example, if the processing apparatus 1d is equipped with a plurality of irradiation units 110b-1 as shown in Figure 27 above, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light ELs by moving the plurality of irradiation units 110b-1 along the direction along the surface of the coating film SF. Specifically, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light ELs by moving the plurality of irradiation units 110b-1 to change the arrangement spacing of the plurality of irradiation units 110b-1. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. The same applies when the processing apparatus 1d is equipped with any of the above-described light irradiation devices 22a to 23a and 25a to 27a capable of irradiating a plurality of processing light ELs, and any of the light irradiation devices 22a to 23a and 25a to 27a are equipped with a plurality of irradiation units 110b-1 for irradiating a plurality of processing light ELs.

[0241] For example, if the processing apparatus 1d is equipped with a plurality of light sources 1111 as shown in Figure 3(b) above, the control device 18 may change the array pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light ELs by moving the plurality of light sources 1111 along the direction along the surface of the coating film SF. Specifically, the control device 18 may change the array pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light ELs by moving the plurality of light sources 1111 to change the array spacing of the plurality of light sources 1111. As a result, the array pitch P1 of the concave structure CP1 is changed. The same applies when the processing apparatus 1d is equipped with any of the above-described light irradiation devices 22a to 23a and 25a to 27a capable of irradiating a plurality of processing light ELs, and any of the light irradiation devices 22a to 23a and 25a to 27a are equipped with a plurality of light sources 1111 for irradiating a plurality of processing light ELs.

[0242] For example, if the processing apparatus 1d branches the processing light EL from a single light source 1111 as shown in Figure 3(c) above using a brancher 1112 and emits it from multiple outlets, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing light ELs by changing the positions of the multiple outlets. Specifically, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing light ELs by changing the arrangement spacing of the multiple outlets. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. The same applies when the processing apparatus 1d is equipped with any of the above-described light irradiation devices 22a to 23a and 25a to 27a capable of irradiating multiple processing light ELs, and any of the light irradiation devices 22a to 23a and 25a to 27a branches the processing light EL from a single light source 1111 using a brancher 1112 in order to irradiate multiple processing light ELs.

[0243] For example, if the processing apparatus 1d includes a light irradiation apparatus 22a equipped with a mirror array 222a, the control device 18 may change the arrangement pitch of multiple irradiation areas EA and / or the spacing between multiple processing light ELs by controlling the tilt angle of each mirror M in the mirror array 2221a to change the position of the reflective surface of each mirror M (particularly the position around the Y axis). For example, if the mirror array 2221a includes multiple mirrors M arranged in a matrix on the XY plane, the control device 18 may change the arrangement pitch of multiple irradiation areas EA and / or the spacing between multiple processing light ELs arranged along the X axis by controlling the tilt angle of each mirror M in units of a group of mirrors M arranged along the Y axis.

[0244] For example, if the processing apparatus 1d is equipped with a light irradiation device 11d-1 that can change the relative angles of multiple processing light ELs, the control device 18 may change the array pitch of multiple irradiation areas EA and / or the spacing between multiple processing light ELs by changing the relative angles of the multiple processing light ELs. Specifically, Figure 48(a) shows the relative angles of the multiple processing light ELs in a first angular state, and Figure 48(b) shows the relative angles of the multiple processing light ELs in a second angular state different from the first angular state. As shown in Figures 48(a) and 48(b), when the relative angles of the multiple processing light ELs change, the angle at which the multiple processing light ELs are incident on the coating film SF changes. On the other hand, even if the relative angles of the multiple processing light ELs change, the emission points of the multiple processing light ELs remain unchanged in the light source system of the light emission device 11d-1. As a result, as shown in Figures 48(c) and 48(d), when the relative angles of the multiple processing light ELs change, the array pitch of the multiple irradiation areas EA changes. Specifically, as shown in Figure 48(c), when the relative angle of the multiple processing light ELs is in the first angular state, the array pitch of the multiple irradiation regions EA is the third pitch Pe3. On the other hand, as shown in Figure 48(d), when the relative angle of the multiple processing light ELs is in the second angular state, the array pitch of the multiple irradiation regions EA is the fourth pitch Pe4, which is larger than the third pitch Pe3. As a result, the array pitch P1 of the concave structure CP1 is changed. Note that the light irradiation device 11d-1 may be a light irradiation device equipped with an optical member for changing the relative angle of the multiple processing light ELs, in addition to one of the above-described light irradiation devices 11 and light irradiation devices 22a to 23a and 25a to 27a, which are capable of irradiating multiple processing light ELs.

[0245] For example, if the processing apparatus 1d includes a light irradiation apparatus 11d-2 capable of irradiating a plurality of processing lights EL that are non-parallel to each other onto the coating film SF, the control apparatus 18 may change the array pitch of the plurality of irradiation regions EA and / or the interval between the plurality of processing lights EL by changing the relative positional relationship (distance between the light irradiation apparatus 11d-2 and the coating film SF) in the direction intersecting the surface of the coating film SF (in the example shown in FIGS. 49(a) to 49(b), the Z-axis direction). Specifically, as shown in FIG. 49(a), when the distance between the light irradiation apparatus 11d-2 and the coating film SF in the Z-axis direction is D5, the array pitch of the plurality of irradiation regions EA is the fifth pitch Pe5. Thereafter, as shown in FIG. 49(b), as a result of the light irradiation apparatus 11d-2 moving along the Z-axis away from the coating film SF by the drive system 12, when the distance between the light irradiation apparatus 11d-2 and the coating film SF in the Z-axis direction becomes D6 (where D5 < D6), the array pitch of the plurality of irradiation regions EA is the sixth pitch Pe6, which is larger than the fifth pitch Pe5. As a result, the array pitch P1 of the concave structure CP1 is changed. Incidentally, the light irradiation apparatus 11d-2 may be a light irradiation apparatus provided with an optical member for irradiating a plurality of processing lights EL that are non-parallel to each other with respect to any one of the above-described light irradiation apparatuses 11 and 22a to 23a and 25a to 27a capable of irradiating a plurality of processing lights EL.

[0246] For example, if the processing apparatus 1d is equipped with multiple light sources 1111, each capable of emitting processing light EL, the control device 18 may change the array pitch of multiple irradiation areas EA and / or the spacing between multiple processing light ELs by changing the number of light sources 111 that actually emit processing light EL from among the multiple light sources 1111. Specifically, in the example shown in Figure 50(a), six of the multiple light sources 1111 are selected as light sources 111 that emit processing light EL. In this case, six light sources 1111 emit processing light EL, and the other light sources 1111 do not emit processing light EL. Alternatively, the other light sources 1111 may also emit processing light EL, but the emitted processing light EL is shielded and does not irradiate the coating film SF. In this case, as shown in Figure 50(b), the array pitch of the multiple irradiation areas EA is the seventh pitch Pe7. On the other hand, in the example shown in Figure 50(c), three of the multiple light sources 1111 (in particular, three light sources 1111 selected every other from the six light sources 1111 selected in the example shown in Figure 50(a)) are selected as light sources 111 that emit processing light EL. In this case, as shown in Figure 50(d), the array pitch of the multiple irradiation regions EA is the eighth pitch Pe8, which is larger (for example, twice as large) than the seventh pitch Pe7. As a result, the array pitch P1 of the concave structure CP1 is changed. The same applies when the processing apparatus 1d is equipped with any of the above-described light irradiation devices 22a to 23a and 25a to 27a that can irradiate multiple processing light ELs, and any of the light irradiation devices 22a to 23a and 25a to 27a are equipped with multiple light sources 1111 to irradiate multiple processing light ELs.

[0247] Alternatively, the control device 18 may change the arrangement pitch of the concave structure CP1 and / or the spacing between the multiple processing light ELs in other ways, in addition to changing the arrangement pitch of the multiple irradiation areas EA (i.e., changing the relative positional relationship of the multiple irradiation areas EA). For example, a shutter may be provided in the optical path of each of the multiple processing light ELs emitted from the light source system 111.

[0248] For example, if the processing apparatus 1d is equipped with a light irradiation device 21a that forms interference fringes on the surface of the coating film SF by interfering the first branched light EL1 and the second branched light EL2 shown in Figure 18, the control device 18 may change the arrangement pitch P1 of the concave structure CP1 by changing the angle at which the first branched light EL1 and the second branched light EL intersect (i.e., the relative angle between the first branched light EL1 and the second branched light). Specifically, in the example shown in Figure 51(a), the angle at which the first branched light EL1 and the second branched light EL intersect is the first angle θ1. In this case, as shown in Figure 51(b), the pitch of the interference fringes formed on the surface of the coating film SF is the ninth pitch Pe9. On the other hand, in the example shown in Figure 51(c), the angle at which the first branched light EL1 and the second branched light EL intersect is the second angle θ2, which is different from the first angle θ1. In this case, as shown in Figure 51(d), the pitch of the interference fringes formed on the surface of the coating film SF is the 10th pitch Pe10, which is different from the 9th pitch Pe9. As a result, the arrangement pitch P1 of the concave structure CP1 is changed.

[0249] However, in order to change the angle at which the first branched light EL1 and the second branched light EL intersect, the processing apparatus 1d is equipped with a light irradiation device 11d-3, which includes an angle adjustment element 2127d for adjusting the angle at which the first branched light EL1 and the second branched light EL intersect, as shown in Figure 52, instead of the light irradiation device 21a. The angle adjustment element 2127d can adjust the relative angle of the first branched light EL1 with respect to the second branched light EL2 by synchronously moving the light output port 2123a and the focusing optical system 2125a. Furthermore, the angle adjustment element 2127d may also adjust the relative angle of the second branched light EL2 with respect to the first branched light EL1 by synchronously moving the light output port 2124a and the focusing optical system 2126a, in addition to or instead of synchronously moving the light output port 2123a and the focusing optical system 2125a. Therefore, the angle adjustment element 2127d can change the angle at which the first branched light EL1 and the second branched light EL intersect.

[0250] For example, if the array pitch of the multiple irradiation regions EA and / or the spacing between the multiple processing light ELs described above is changed, the intensity distribution of the multiple processing light ELs on the surface of the painted film SF is changed. Therefore, changing the array pitch of the multiple irradiation regions EA and / or the spacing between the multiple processing light ELs is equivalent to controlling the intensity distribution of the multiple processing light ELs on the surface of the painted film SF. Similarly, if the pitch of the interference fringes formed on the surface of the painted film SF by the interference of the first branched light EL1 and the second branched light EL2 described above is changed, the intensity distribution of the multiple processing light ELs on the surface of the painted film SF is changed. Therefore, changing the angle at which the first branched light EL1 and the second branched light EL2 intersect is equivalent to controlling the intensity distribution of the multiple processing light ELs on the surface of the painted film SF. For this reason, the control device 18 may control the intensity distribution of the multiple processing light ELs on the surface of the painted film SF (or the in-plane intensity distribution of the multiple processing light ELs along the surface of the painted film SF) in addition to or instead of changing the array pitch P1 of the concave structure CP1 and / or the spacing between the multiple processing light ELs. In this case, the optical system 112 may include an intensity distribution adjustment element for adjusting the intensity distribution of multiple processing light ELs under the control of the control device 18. The intensity distribution adjustment element may be, for example, a spatial light modulator capable of spatially modulating the processing light ELs. Therefore, if the processing apparatus 1d includes a light irradiation apparatus 24a (see Figure 21) that includes a spatial light modulator, the control device 18 may control the spatial light modulator to change the intensity distribution of multiple processing light ELs.

[0251] Furthermore, in the above description, the control device 18 performs at least one of the following actions for the purpose of changing the array pitch P1 of the concave structure CP1: changing the array pitch of the irradiation area EA and / or the spacing between the multiple processing light ELs, changing the angle at which the first branched light EL1 and the second branched light EL intersect, and changing the intensity distribution of the multiple processing light ELs on the surface of the coated film SF. However, the control device 18 may also perform at least one of the following actions for the purpose of maintaining the array pitch P1 of the concave structure CP1 (i.e., preventing fluctuations in the array pitch P1): changing the array pitch of the irradiation area EA and / or the spacing between the multiple processing light ELs, changing the angle at which the first branched light EL1 and the second branched light EL intersect, and changing the intensity distribution of the multiple processing light ELs on the surface of the coated film SF. Specifically, as described above, the processing apparatus 1d scans the unit processing area SA with multiple processing light ELs via the galvanometer mirror 1122. Here, strictly speaking, the length of the optical path of the processing light EL from the galvanometer mirror 1122 to the center of the unit processing area SA is different from the length of the optical path of the processing light EL from the galvanometer mirror 1122 to the edge of the unit processing area SA. For this reason, the arrangement pitch of the multiple irradiation areas EA in the center of the unit processing area SA may not match the arrangement pitch of the multiple irradiation areas EA at the edge of the unit processing area SA. Alternatively, as mentioned above, because the workpiece S is an aircraft fuselage or the like, the surface of the paint film SF is likely to be curved, uneven, or inclined. In this case as well, strictly speaking, the length of the optical path of the processing light EL from the galvanometer mirror 1122 to a certain part of the unit processing area SA is different from the length of the optical path of the processing light EL from the galvanometer mirror 1122 to another part of the unit processing area SA. For this reason, the arrangement pitch of the multiple irradiation areas EA in a certain part of the unit processing area SA may not match the arrangement pitch of the multiple irradiation areas EA in another part of the unit processing area SA. As a result, in situations where it is desired to form a concave structure CP1 with the same arrangement pitch P1 in a unit machining region SA, the arrangement pitch P1 of the concave structure CP1 formed in one part of the unit machining region SA may unintentionally become mismatched with the arrangement pitch P1 of the concave structure CP1 formed in another part of the unit machining region SA.Therefore, the control device 18 may perform at least one of changing the arrangement pitch of the irradiation region EA, changing the angle at which the first branched light EL1 and the second branched light EL intersect, and changing the intensity distribution of the plurality of processing lights EL on the surface of the coating film SF, so as to cancel out the unintended variation in the arrangement pitch P1 of the concave structure CP1. As a result, the unintended variation in the arrangement pitch P1 of the concave structure CP1 is canceled out, and the concave structure CP1 with the same arrangement pitch P1 can be appropriately formed.

[0252] (4-5) Fifth variation The processing device 1d of the fourth modification example described above changes the characteristics of the processing light EL (for example, at least one of the relative positional relationship between a plurality of irradiation regions EA, the angle at which the first branched light EL1 and the second branched light EL2 intersect, and the intensity distribution of the plurality of processing lights EL on the coating film SF) for the purpose of changing the arrangement pitch P1 of the concave structure CP1 that constitutes the re-bleb structure. On the other hand, the processing device e of the fifth modification example changes an arbitrary characteristic of the processing light EL for the purpose of changing an arbitrary characteristic of the re-bleb structure. As an example of the "arbitrary characteristic of the re-bleb structure" in the fifth modification example, as described in the third modification example, the presence or absence of the re-bleb structure, the shape of the re-bleb structure (for example, at least one of the cross-sectional shape of the concave structure CP1 and the cross-sectional shape of the concave structure CP1, etc.), the size of the re-bleb structure (for example, at least one of the depth D of the concave structure CP1, the width of the concave structure CP1, the arrangement pitch P1 of the concave structure CP1, the height H of the convex structure CP2, the width of the convex structure CP2, and the arrangement pitch P2 of the convex structure CP2, etc.), and at least one of the positions of the re-bleb structure (for example, the position of at least one of the concave structure CP1 and the convex structure CP2) can be mentioned. For this reason, the processing device 1e is different from the above-described processing device 1 in that, as shown in FIG. 53, it includes a characteristic adjustment device 41e for adjusting the characteristics of the processing light EL. The processing device 1e may include the characteristic adjustment device 41e separately from the light irradiation device

[11] , or may include the characteristic adjustment device 41e incorporated in the light irradiation device 11 (that is, constituting a part of the light irradiation device 11). Other features of the processing device 1e may be the same as other features of the processing device 1.

[0253] The control device 18 may change any characteristics of the processing light EL to change any characteristics of the riblet structure and form a more appropriate riblet structure. For example, the control device 18 may change any characteristics of the processing light EL to change any characteristics of the riblet structure and form a suitable riblet structure that appropriately obtains a friction reduction effect.

[0254] The characteristics of the multiple processing light ELs may include the intensity distribution of the multiple processing light ELs on the surface of the coated film SF. In other words, the control device 18 may control the characteristic adjustment device 41e to change the intensity distribution of the multiple processing light ELs on the surface of the coated film SF. When the intensity distribution of the multiple processing light ELs on the surface of the coated film SF changes, the characteristics of the concave structure CP1 (in particular, at least one of the shape and position) change. As a result, the characteristics of the riblet structure formed from such a concave structure CP1 (in particular, at least one of the shape and position) change. For example, when multiple processing light ELs having the first intensity distribution shown in Figure 54(a) are irradiated onto the surface of the coated film SF, the concave structure CP1 shown in Figure 54(b) is formed. On the other hand, for example, when multiple processing light ELs having a second intensity distribution different from the first intensity distribution shown in Figure 54(c) are irradiated onto the surface of the coated film SF, a concave structure CP1 with different characteristics from the concave structure CP1 shown in Figure 54(b) is formed, as shown in Figure 54(d).

[0255] The characteristics of multiple processing light ELs may include the shapes of multiple irradiation regions EAs. In other words, the control device 18 may change the shapes of the multiple irradiation regions EAs by controlling the characteristic adjustment device 41e. When the shapes of the multiple irradiation regions EAs change, the characteristics of the concave structure CP1 (in particular, at least one of the shape and position) change. As a result, the characteristics of the riblet structure formed from such a concave structure CP1 (in particular, at least one of the shape and position) change. For example, when multiple processing light ELs are irradiated onto multiple irradiation regions EAs of the first shape shown in Figure 55(a), the concave structure CP1 shown in Figure 55(b) is formed. On the other hand, for example, when multiple processing light ELs are irradiated onto multiple irradiation regions EAs of a second shape different from the first shape shown in Figure 55(c), the concave structure CP1 shown in Figure 55(d) is formed, which has different characteristics from the concave structure CP1 shown in Figure 55(b).

[0256] The characteristics of multiple processing light ELs may include the sizes of multiple irradiation areas EAs. In other words, the control device 18 may change the size of the multiple irradiation areas EAs by controlling the characteristic adjustment device 41e. When the size of the multiple irradiation areas EAs changes, the characteristics of the concave structure CP1 (in particular, at least one of the shape and position) changes. As a result, the characteristics of the riblet structure formed from such a concave structure CP1 (in particular, at least one of the shape and position) changes. For example, when multiple processing light ELs are irradiated onto multiple irradiation areas EAs of a first size shown in Figure 56(a), the concave structure CP1 shown in Figure 51(b) is formed. On the other hand, for example, when multiple processing light ELs are irradiated onto multiple irradiation areas EAs of a second size smaller than the first size shown in Figure 56(c), the concave structure CP1 shown in Figure 56(d) is formed, which is narrower than the concave structure CP1 shown in Figure 56(b).

[0257] The characteristics of the multiple processing light ELs may include the intensities of the multiple processing light ELs. In other words, the control device 18 may change the intensities of the multiple processing light ELs by controlling the characteristic adjustment device 41e. When the intensities of the multiple processing light ELs change, the characteristics (especially the shape, etc.) of the concave structure CP1 change. Specifically, the greater the intensities of the multiple processing light ELs, the greater the energy applied to the coating film SF by irradiation with the multiple processing light ELs, and therefore more of the coating film SF is removed. Consequently, the greater the intensities of the multiple processing light ELs, the greater the depth of the concave structure CP1 that is formed. As a result, the characteristics (especially the shape, etc.) of the riblet structure formed from such a concave structure CP1 change. For example, when multiple processing light ELs having the first intensity shown in Figure 57(a) are irradiated, the concave structure CP1 shown in Figure 57(b) is formed. On the other hand, if, for example, multiple processing light ELs having a second intensity greater than the first intensity shown in Figure 57(c) are irradiated, a concave structure CP1 shown in Figure 57(d) is formed that is deeper than the concave structure CP1 shown in Figure 57(b).

[0258] The characteristics of the multiple processing light ELs may include the irradiation time of the multiple processing light ELs. In other words, the control device 18 may change the irradiation time of the multiple processing light ELs by controlling the characteristic adjustment device 41e. When the irradiation time of the multiple processing light ELs changes, the characteristics (especially the shape, etc.) of the concave structure CP1 change. Specifically, the longer the irradiation time of the multiple processing light ELs, the greater the energy applied to the coating film SF by the irradiation of the multiple processing light ELs, and therefore more of the coating film SF is removed. Consequently, the longer the irradiation time of the multiple processing light ELs, the greater the depth of the concave structure CP1 that is formed. As a result, the characteristics (especially the shape, etc.) of the riblet structure formed from such a concave structure CP1 change.

[0259] The characteristics of the multiple processing light ELs may include the polarization states of the multiple processing light ELs (for example, at least one of the differences between s-polarization and p-polarization, and the differences between circular polarization, linear polarization and elliptical polarization). In other words, the control device 18 may control the characteristic adjustment device 41e to change the polarization states of the multiple processing light ELs. When the polarization states of the multiple processing light ELs change, the degree of absorption of the multiple processing light ELs by the coating film SF may change. As a result, the energy applied to the coating film SF by irradiation with the multiple processing light ELs may change, and thus the characteristics (especially the shape, etc.) of the multiple concave structures CP1 may change. As a result, the characteristics (especially the shape, etc.) of the riblet structure formed from such concave structures CP1 may change.

[0260] The characteristics of the multiple processing light ELs may include the wavelengths of the multiple processing light ELs. In other words, the control device 18 may change the wavelengths of the multiple processing light ELs by controlling the characteristic adjustment device 41e. When the wavelengths of the multiple processing light ELs change, the degree of absorption of the multiple processing light ELs by the coating film SF may change. As a result, the energy applied to the coating film SF by irradiation with the multiple processing light ELs may change, and thus the characteristics (especially the shape, etc.) of the multiple concave structures CP1 may change. As a result, the characteristics (especially the shape, etc.) of the riblet structure formed from such concave structures CP1 may change.

[0261] The control device 18 may change the characteristics of the multiple processing light ELs when multiple processing light ELs are irradiating the coating film SF (i.e., when multiple processing light ELs are moving relative to the coating film SF). As a result, a series of concave structures CP1 extending in a certain direction will have a portion having a first characteristic and a portion having a second characteristic different from the first characteristic. For example, as shown in Figures 58(a) to 58(c), a series of concave structures CP1 extending in a certain direction will have a portion having a first shape (see Figure 58(b) which is a cross-sectional view taken along line I-I' in Figure 58(a)) and a portion having a second shape different from the first shape (see Figure 58(c) which is a cross-sectional view taken along line II-II' in Figure 58(a). In other words, the cross-sectional shape of the concave structure CP1 changes along the direction of extension of the concave structure CP1. Alternatively, for example, as shown in Figures 59(a) to 59(c), a series of concave structures CP1 extending in a certain direction will have a portion having a first width (see Figure 59(b), which is a cross-sectional view taken along line I-I' in Figure 59(a)) and a portion having a second width different from the first width (see Figure 59(c), which is a cross-sectional view taken along line II-II' in Figure 59(a)). In other words, the width of the concave structure CP1 changes along the direction in which it extends.

[0262] This fifth modified processing apparatus 1e can modify the characteristics of the riblet structure while enjoying similar effects to those enjoyed by the processing apparatus 1 described above. Therefore, it becomes possible to form a more appropriate riblet structure compared to the case where the characteristics of the riblet structure cannot be modified. Specifically, for example, it becomes possible to form a riblet structure with appropriate characteristics that appropriately reduce friction.

[0263] (4-6) Sixth Variation Next, the processing apparatus 1f of the sixth modification will be described with reference to Figure 60. In the description above, the end portion 144 of the support device 14 is capable of contacting the surface of the coating film SF. That is, the support device 14 supports the housing device 13 (and furthermore, the light irradiation device 11 supported by the housing device 13) while in contact with the coating film SF. On the other hand, the processing apparatus 1f of the sixth modification differs from the processing apparatus 1 described above in that, as shown in Figure 60, it is equipped with a support device 14f that does not contact the surface of the coating film SF instead of such a support device 14. Other features of the processing apparatus 1f may be the same as other features of the processing apparatus 1.

[0264] Because the support device 14f is not in contact with the surface of the coating film SF, the support device 14 supports the housing device 13 (and furthermore, the light irradiation device 11 supported by the housing device 13, the same applies in the 6th modification below) without contacting the coating film SF. The support device 14f is supported by a support frame (or any support member, etc.) Ff that is separated from the coating film SF (and furthermore, the workpiece S). The support device 14f supports the housing device 13 while in contact with the support frame Ff.

[0265] The support device 14f, like the support device 14, is equipped with a beam member 141. Furthermore, instead of the multiple leg members 142 provided by the support device 14, the support device 14f is equipped with multiple column members 142f positioned on the beam member 141. The column members 142f are rod-shaped members extending from the beam member 141 toward the +Z side. The end 144f of the leg member 142f (the +Z side end in the example shown in Figure 60) is capable of contacting the support frame Ff. The end 144f, like the end 144 of the leg member 142, is capable of adhering to the support frame Ff while in contact with it.

[0266] The column member 142f, like the leg member 142, is a member that can extend and retract along the Z-axis by the drive system 15. In other words, the state of the column member 142f can be switched between a third extended state, in which the length in the Z-axis direction is relatively long due to the column member 142f extending along the Z-axis, and a third contracted state, in which the length in the Z-axis direction is relatively short due to the column member 142f contracting along the Z-axis. The state of the column member 142f, like the leg member 142, is switched between the third extended state and the third contracted state when the support device 14f moves. When the column member 142f is in the third extended state, the end 144f of the column member 142f can contact the support frame Ff. On the other hand, when the column member 142f is in the third contracted state, the end 144f does not contact the support frame Ff. In other words, when the column member 142f is in the third contracted state, the end 144f is away from the support frame Ff on the -Z side. Therefore, the movement of the support device 14f is not hindered by contact between the end portion 144f of the column member 142f and the support frame Ff. The column member 142f may be attached to an overhead crane that is movable along at least one of the X-axis and Y-axis. The support device 14f may be at least one of the crane and the robot arm.

[0267] This sixth modified processing apparatus 1f can enjoy the same effects as the processing apparatus 1 described above.

[0268] However, in the processing device 1f, the support device 14f and the coating film SF are not in contact, so the support device 14f and the coating film SF are vibratoryly separated. Since the support device 14f supports the light irradiation device 11, the light irradiation device 11 and the coating film SF are vibratoryly separated. Therefore, if the coating film SF moves relative to the light irradiation device 11 due to vibration or the like, the irradiation position of the processing light EL from the light irradiation device 11 on the surface of the coating film SF (i.e., the position of the irradiation area EA) may shift from its original irradiation position. In other words, the relative positional relationship between the coating film SF and the irradiation area EA may change. Therefore, in the sixth modification, the control device 18 moves the irradiation area EA relative to the support device 14f based on at least one of the vibration state of the coating film SF relative to the support device 14f and the relative positional relationship of the coating film SF relative to the support device 14f, so that the relative position of the irradiation area EA relative to the coating film SF does not change. When the coating film SF vibrates (or moves) relative to the support device 14f, the relative positional relationship between the coating film SF and the irradiation area EA changes. Therefore, the control device 18 changes the relative position of the irradiation area EA relative to the coating film SF based on the relative positional relationship between the coating film SF and the irradiation area EA, so that the relative positional relationship of the irradiation area EA relative to the coating film SF remains constant.

[0269] Therefore, the processing apparatus 1f is equipped with a vibration measuring device 51f that measures the relative vibration state of the coating film SF with respect to the support device 14f. As the vibration measuring device, optical measuring devices with various measurement principles can be used, such as moiré topography using the grating irradiation method or grating projection method, holographic interferometry, autocollimation method, stereo method, astigmatism method, critical angle method, or knife-edge method. The processing apparatus 1f may also be equipped with a vibration measuring device that measures its own vibration state, which includes a displacement meter, a velocity meter, or an accelerometer. Based on the measurement results of the vibration measuring device 51f, the control device 18 changes the position of the irradiation area EA relative to the support device 14f so that the position of the irradiation area EA relative to the coating film SF does not change even if the coating film SF vibrates relative to the support device 14f. Here, if the coating film SF moves by a unit of movement in one direction relative to the support device 14f due to vibration, while the irradiation area EA is stationary relative to the support device 14f, the coating film SF will move by a unit of movement in one direction relative to the irradiation area EA. In other words, on the surface of the coating film SF, the irradiation area EA moves by an amount equal to one unit in a direction of movement opposite to one direction of movement relative to the coating film SF. Therefore, in order to maintain the relative position of the irradiation area EA with respect to the coating film SF, it is necessary to move the irradiation area EA in the same way as the coating film SF. That is, if the irradiation area EA moves by an amount equal to one unit in one direction of movement in accordance with the movement of the coating film SF, the position of the irradiation area EA with respect to the coating film SF will not change. More specifically, if the irradiation area EA moves by an amount equal to one unit in one direction of movement relative to the support device 14f, the position of the irradiation area EA with respect to the coating film SF will not change. For this reason, the control device 18 moves the irradiation area EA relative to the support device 14f by the same amount of movement as the coating film SF with respect to the support device 14f, in the same direction as the direction of movement of the coating film SF with respect to the support device 14f. Furthermore, the movement of the irradiation area EA may be achieved by moving the light irradiation device 11 by the drive system 12, by moving and / or controlling the attitude of at least one of the optical components of the light irradiation device 11 (for example, by controlling the rotation state of the galvanometer mirror 1122), or by other methods.

[0270] Furthermore, even in the aforementioned processing apparatus 1, etc., in which the support device 14 and the coating film SF can come into contact, there is a possibility that the vibration state of the support device 14 and the vibration state of the coating film SF may not coincide. For this reason, even in the aforementioned processing apparatus 1, etc., the control device 18 may move the irradiation area EA relative to the support device 14f based on the vibration state of the coating film SF relative to the support device 14f (i.e., the relative position of the coating film SF relative to the support device 14f), so as to whether the relative position of the irradiation area EA relative to the coating film SF remains unchanged.

[0271] (4-7) Seventh variation Next, with reference to Figure 61, the seventh modified processing apparatus 1g will be described. The processing apparatus 1 described above can move the light irradiation device 11 relative to the coating film SF by the drive systems 12 and 15 without moving the workpiece SF. On the other hand, the processing apparatus 1g of the seventh modified example differs from the processing apparatus 1 described above in that it can move the coating film SF (i.e., the workpiece SF) relative to the light irradiation device 11 without moving the light irradiation device 11. Other features of the processing apparatus 1g may be the same as other features of the processing apparatus 1.

[0272] To move the workpiece SF, the processing apparatus 1g is equipped with a stage 61g. The stage 61g is supported from the -Z side by a base plate 62g. The stage 61g is housed in a storage space SP. The stage 61g is positioned facing the light irradiation device 11. The stage 61g is capable of holding the workpiece S such that the coating film SF and the light irradiation device 11 face each other. The stage 61g is capable of holding the workpiece S such that multiple processing lights EL from the light irradiation device 11 irradiate the coating film SF. The stage 61g is capable of releasing the held workpiece S.

[0273] The stage 61g is movable by the drive system 63g. The stage 61g is movable while holding the workpiece S. The stage 61g is movable relative to the light irradiation device 11. The stage 61g is movable relative to the irradiation area EA to which multiple processing light ELs from the light irradiation device 11 are irradiated. The drive system 63g moves the stage 61g under the control of the control device 18 to change the relative positional relationship between the light irradiation device 11 and the coating film SF (i.e., the relative positional relationship between the irradiation area EA and the coating film SF). The drive system 63g may move the stage 61g along at least one of the X and Y axes. As a result, the irradiation area EA moves along at least one of the X and Y axes on the coating film SF. The drive system 63g may move the stage 61g along the Z axis. The drive system 63g may move the stage 61g along at least one of the θX, θY, and θZ directions, in addition to at least one of the X, Y, and Z axes.

[0274] As the workpiece S moves relative to the light irradiation device 11 due to the movement of the stage 61g, the coating film SF moves relative to the housing device 13 (particularly the end 134 of the partition member 132) and the support device 14 (particularly the end 144 of the leg member 142). Therefore, if the stage 61g moves while at least one of the ends 134 and 144 is in contact with the coating film SF, the movement of the stage 61g (i.e., the movement of the workpiece S) may be hindered by the contact between at least one of the ends 134 and 144 and the coating film SF. For this reason, in the seventh modification, the ends 134 and 144 do not come into contact with the coating film SF. In this case, the end 134 comes into contact with, for example, the surface plate 62g. As a result, the housing device 13 works in cooperation with the surface plate 62g to maintain the airtightness of the housing space SP. Furthermore, the end 144 also comes into contact with, for example, the surface plate 62g. As a result, the support device 14 can stand on its own on the surface plate 62g. In other words, the support device 14 supports the housing device 13 with its end portion 144 in contact with the surface plate 62g.

[0275] In the seventh modified example, the light irradiation device 11 does not need to be moved, so the processing apparatus 1g does not need to be equipped with a drive system 12 for moving the light irradiation device 11 and a drive system 15 for moving the support device 15. However, the processing apparatus 1g may move the light irradiation device 11 in the same way as the processing apparatus 1 described above, in which case it may be equipped with at least one of the drive systems 12 and 15.

[0276] In this seventh modified processing apparatus 1g, the relative position change between the coating film SF and the irradiation area EA, which was achieved by moving the light irradiation device 11 in the processing apparatus 1 described above, can be achieved by moving the stage 61g (i.e., by moving the workpiece S). Furthermore, the processing apparatus 1g can also achieve the change in the relative position between the coating film SF and the irradiation area EA, which was achieved by rotating the galvanometer mirror 1122 in the processing apparatus 1 described above, by moving the stage 61g (i.e., by moving the workpiece S). Therefore, the processing apparatus 1g can also enjoy the same effects as the processing apparatus 1. In other words, by moving the workpiece S by moving the stage 61g, the processing apparatus 1g can alternately repeat a scanning operation in which multiple processing light ELs scan the surface of the coating film SF along the Y axis (i.e., move multiple irradiation areas EA along the Y axis) and a stepping operation in which multiple irradiation areas EA are moved by a predetermined amount along the X axis. As a result, the processing device 1g can scan multiple unit processing regions SA with multiple processing light ELs, thereby forming the riblet structure described above.

[0277] (4-8) Variation 8 Next, with reference to Figure 62, the eighth modified processing apparatus 1h will be described. In the processing apparatus 1 described above, the light irradiation device 11 is supported by the housing device 13, and the light irradiation device 11 is moved by the drive system 12. In other words, the processing apparatus 1 moves the light irradiation device 11 in a non-contact state with the coating film SF. On the other hand, the eighth modified processing apparatus 1h differs from the processing apparatus 1 described above in that the light irradiation device 11h is moved when the light irradiation device 11h is not supported by the housing device 13. For this reason, the processing apparatus 1h differs from the processing apparatus 1 described above in that the housing device 13 does not need to support the light irradiation device 11. In other words, the processing apparatus 1h differs from the processing apparatus 1 described above in that it has a light irradiation device 11h that is not supported by the housing device 13. Furthermore, the processing apparatus 1h differs from the processing apparatus 1 described above in that it has a drive system 12h for moving the light irradiation device 11h that is not supported by the housing device 13, instead of the drive system 12 described above. Other features of processing apparatus 1h may be the same as other features of processing apparatus 1.

[0278] Since the housing device 13 does not support the light irradiation device 11h, the light irradiation device 11h rests on the surface of the coating film SF. The light irradiation device 11h differs from the light irradiation device 11 described above in that it has a contact portion 113h that can contact the surface of the coating film SF. Other features of the light irradiation device 11h may be the same as other features of the light irradiation device 11. The light irradiation device 11h rests on the surface of the coating film SF in contact with the surface of the coating film SF via the contact portion 113h. Therefore, the light irradiation device 11h is supported by the coating film SF.

[0279] The drive system 12h moves the light irradiation device 11h relative to the painted film SF (i.e., relative to the workpiece S) under the control of the control device 18. More specifically, the drive system 12h moves the light irradiation device 11h along the surface of the painted film SF. In this process, the drive system 12h moves the light irradiation device 11h while it is in contact with the painted film SF via the contact portion 113h. For this reason, the contact portion 113h is a material with relatively low frictional resistance between it and the painted film SF. Alternatively, the contact portion 113 is a material with relatively low rolling resistance (for example, at least one of a tire and a ball). As a result, the light irradiation device 11h can move along the surface of the painted film SF, as if it were self-propelled on the surface of the painted film SF.

[0280] The light irradiation device 11h irradiates the coating film SF with processing light EL while the light irradiation device 11h is in contact with the coating film SF via the contact portion 113h. The light irradiation device 11 may irradiate the coating film SF with processing light EL while the light irradiation device 11h is moving along the surface of the coating film SF. As a result, the irradiation area EA moves relative to the coating film SF, so that multiple processing light ELs can scan the surface of the coating film SF along the Y axis (i.e., multiple irradiation areas EA move along the Y axis) and perform a scanning operation. In other words, the processing device 1h can form a riblet structure by alternately repeating the scanning operation and the stepping operation described above, without rotating the galvanometer mirror 1122, by moving the light irradiation device 11h. However, the processing device 1h may alternately repeat the scanning operation and the stepping operation by rotating the galvanometer mirror 1122. ...

Claims

1. A processing method for processing the surface of an object, Irradiating the surface of the object with multiple processing lights from a light irradiation device, Moving the light irradiation device relative to the object, By irradiating the surface of the object with the aforementioned multiple processing lights and removing multiple parts of the object, a plurality of convex structures are formed on the surface of the object. Equipped with, The formation process includes irradiating a first region of the surface of the object with the plurality of processing lights to form a plurality of convex structures on the first region of the surface of the object, and then irradiating a second region of the surface of the object, which is different from the first region, with the plurality of processing lights to form a plurality of convex structures on the second region of the surface of the object. The first and second regions are arranged along directions that intersect the pitch direction of the plurality of convex structures formed in the first region. Processing method.

2. The process described above includes scanning the surface of the object with the plurality of processing lights. The processing method according to claim 1.

3. The system further comprises changing the relative angle between the plurality of processing lights. The processing method according to claim 1 or 2.

4. The irradiation includes forming interference fringes on the surface of the object. The processing method according to any one of claims 1 to 3.

5. The method further comprises changing the relative positional relationship between the interference fringes and the object so that the interference fringes move. The processing method according to claim 4.

6. The plurality of convex structures extending in one direction on the surface of the object are formed by irradiation and by changing the relative positional relationship. The processing method according to claim 5.

7. The scanning process includes changing the direction of the multiple processed light beams using a galvanometer optical system. The processing method according to claim 2.

8. The illumination described above includes irradiating the surface of the object with a plurality of processing beams from the galvanometer optical system via the objective optical system. The processing method according to claim 7.

9. Changing the relative positional relationship between the interference fringes and the object includes changing the relative positional relationship between the interference fringes and the object using a galvanometer optical system. The processing method according to claim 5 or 6.

10. Changing the relative positional relationship between the interference fringe and the object includes moving the interference fringe along a direction that intersects the periodic direction of the interference pattern of the interference fringe. The processing method according to claim 5, 6, or 9.

11. The plurality of convex structures include structures that extend along one direction on the surface of the object. The processing method according to any one of claims 1 to 10.

12. The method further includes changing the relative positions of the plurality of processing lights in a direction that intersects the direction in which the plurality of convex structures extend. The processing method according to claim 11.

13. The position on the surface of the object is changed by changing the relative position between the plurality of processing lights, and as a result, the pitch of the plurality of convex structures formed on the surface of the object is changed. The processing method according to any one of claims 1 to 12.

14. Irradiating the plurality of processing lights includes branching light from a light source to generate the plurality of processing lights. The processing method according to any one of claims 1 to 13.

15. Irradiating the plurality of processing lights includes generating the plurality of processing lights using light from the plurality of light sources. The processing method according to any one of claims 1 to 14.

16. Moving the light irradiation device includes moving the light irradiation device using a robot. The processing method according to any one of claims 1 to 15.

17. The method further comprises measuring the shape of the surface of the object. The processing method according to any one of claims 1 to 16.

18. The system further comprises changing the relative positions of the plurality of processing lights based on information regarding the measurement results of the shape of the surface of the object. The processing method according to claim 17.

19. The plurality of concave structures formed on the surface of the object are frictional against fluids on the surface of the object. Includes a riblet structure to reduce friction. The processing method according to any one of claims 1 to 18.

20. A processing device for processing the surface of an object, A light irradiation device comprising a light source and an optical system, capable of irradiating the surface of an object with multiple processing lights, A drive system for moving the light irradiation device relative to the object, at least along a direction along the surface of the object, A control device controls the light irradiation device and the drive system so as to irradiate the surface of the object with the plurality of processing lights to remove a plurality of parts of the object, thereby forming a plurality of convex structures on the surface of the object. Equipped with, The control device is The drive system is controlled so that the light irradiation device is positioned near the first region of the surface of the object, and the light irradiation device is controlled so that a plurality of convex structures are formed on the first region of the surface of the object by irradiating the first region of the surface of the object with the plurality of processing lights. After irradiating the first region of the surface, the drive system is controlled so that the light irradiation device is positioned near a second region of the surface of the object that is different from the first region, and the light irradiation device is controlled so that the multiple processing lights are irradiated onto the second region of the surface of the object to form multiple convex structures on the second region of the surface of the object. Processing equipment.

21. The control device controls at least one of the light irradiation device and the drive system so as to scan the surface of the object with the plurality of processing lights to form the plurality of convex structures. The processing apparatus according to claim 20.

22. The control device controls at least one of the light irradiation device and the drive system to change the relative angle between the plurality of processing lights. The processing apparatus according to claim 20 or 21.

23. The control device controls at least one of the light irradiation device and the drive system to form the plurality of convex structures by forming interference fringes on the surface of the object. including The processing apparatus according to any one of claims 20 to 22.

24. The control device further comprises controlling at least one of the light irradiation device and the drive system to move the interference fringes by changing the relative positional relationship between the interference fringes and the object. The processing apparatus according to claim 23.

25. The control device controls at least one of the light irradiation device and the drive system to irradiate the surface of the object with the plurality of processing lights and change the relative positional relationship to form the plurality of convex structures extending in one direction on the surface of the object. The processing apparatus according to claim 24.

26. The aforementioned light irradiation device includes a galvanometer optical system, The control device controls the galvanometer optical system so that the surface of the object is scanned with the multiple processing lights by changing the direction of the multiple processing lights. The processing apparatus according to claim 21.

27. The light irradiation device includes an objective optical system, The light irradiation device irradiates the surface of the object with a plurality of processing lights from the galvanometer optical system via the objective optical system. The processing apparatus according to claim 26.

28. The aforementioned light irradiation device includes a galvanometer optical system, The control device controls the galvanometer optical system to change the relative positional relationship between the interference fringes and the object. The processing apparatus according to claim 24 or 25.

29. The control device controls at least one of the light irradiation device and the drive system to change the relative positional relationship between the interference fringes and the object by moving the interference fringes along a direction intersecting the periodic direction of the interference pattern of the interference fringes. The processing apparatus according to claim 24, 25, or 28.

30. The plurality of convex structures include structures that extend along one direction on the surface of the object. The processing apparatus according to any one of claims 20 to 29.

31. The control device controls at least one of the light irradiation device and the drive system to change the relative positions of the plurality of processing lights in a direction intersecting the direction in which the plurality of convex structures extend. The processing apparatus according to claim 30.

32. The control device controls at least one of the light irradiation device and the drive system to change the pitch of the multiple convex structures formed on the surface of the object by changing the relative position between the multiple processing lights. The processing apparatus according to any one of claims 20 to 31.

33. The light irradiation device generates the plurality of processing lights by branching the light from the light source. The processing apparatus according to any one of claims 20 to 32.

34. The aforementioned multiple processing lights are generated by light from multiple light sources. The processing apparatus according to any one of claims 20 to 33.

35. The aforementioned drive system includes a robot. The processing apparatus according to any one of claims 20 to 34.

36. The device further comprises a measuring device capable of measuring the shape of the surface of the object. The processing apparatus according to any one of claims 20 to 35.

37. The control device controls at least one of the light irradiation device and the drive system to change the relative positions of the plurality of processing lights based on information regarding the measurement results of the shape of the surface of the object. The processing apparatus according to claim 17.

38. The plurality of concave structures formed on the surface of the object are frictional against fluids on the surface of the object. Includes a riblet structure to reduce friction. The processing apparatus according to any one of claims 20 to 37.

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