Light-emitting device

Abstract

To provide a light-emitting device with excellent portability. To provide a light-emitting device with excellent visibility. [Solution] Alternate between a strip-shaped region with high flexibility and a strip-shaped region with low flexibility in the first direction. The light-emitting device has a flexible region, and the flexible region has a flexible light-emitting panel. In the low region, a support panel with less flexibility than the light-emitting panel and the light-emitting panel are stacked together. It is a light-emitting device. The light-emitting panel includes an external connection electrode and is flexible and overlaps the external connection electrode. The length in the first direction of region A with low flexibility is the same as the length in the first direction of region B with low flexibility that is closest to region A. It is preferable that it be longer than the length in the direction.

Description

[Technical Field]

[0001] The present invention relates to a light-emitting device, a display device, an electronic device, a lighting device, or a method for manufacturing the same. In particular, electroluminescence (EL) Light-emitting devices, display devices, electronic devices, lighting devices, or their manufacture, which utilize the phenomenon (also written as) Regarding the method. [Background technology]

[0002] In recent years, light-emitting devices and display devices are expected to have applications in a variety of uses, and diversification is required. Yes, they are.

[0003] For example, light-emitting devices and display devices for portable devices and the like require to be thin and lightweight. Alternatively, it is required to be resistant to damage, etc.

[0004] Light-emitting elements (also written as EL elements) that utilize the EL phenomenon are easy to make thin and light, input signal It has features such as being able to respond quickly to signals and being able to be driven using a DC low-voltage power supply. Applications in light-emitting devices and display devices are being considered.

[0005] For example, Patent Document 1 describes a film substrate on which a switching element such as a transistor or organic A flexible active-matrix light-emitting device equipped with an EL element is disclosed. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2003-174153 [Overview of the project] [Problems that the invention aims to solve]

[0007] For example, if the display area becomes smaller by miniaturizing the display device to improve portability, once The amount of information that can be displayed decreases, and the ability to see everything at a glance is reduced.

[0008] One aspect of the present invention relates to a highly portable light-emitting device, display device, electronic device, or lighting device. One objective is to provide a light-emitting device with excellent visibility. One objective of the present invention is to provide a display device or electronic device. One aspect of the present invention is a portable The objective is to provide a light-emitting device, display device, or electronic device with excellent visibility and readability. Let's assume that.

[0009] One aspect of the present invention provides a novel light-emitting device, display device, electronic device, or lighting device. One of the objectives is to provide a lightweight light-emitting device, display device, electronic device. Alternatively, one aspect of the present invention provides a lightweight light-emitting device, display device, electronic device. One objective is to provide a device or lighting apparatus. Alternatively, one aspect of the present invention is to provide a device or lighting apparatus. The objective is to provide highly reliable light-emitting devices, display devices, electronic devices, or lighting devices. Alternatively, one aspect of the present invention is a light-emitting device, display device, electronic device that is less prone to damage, if One objective is to provide a lighting device. Alternatively, one aspect of the present invention is to provide a thin device. One of the objectives is to provide light-emitting devices, display devices, electronic devices, or lighting devices. Alternatively, one aspect of the present invention relates to a flexible light-emitting device, display device, electronic device, or lighting device. One objective of the present invention is to provide an apparatus. Alternatively, one aspect of the present invention is to provide a seamless wide device. A light-emitting device or illumination device having a light field, or a display having a seamless, wide display area. One objective of this invention is to provide a device or electronic equipment. Alternatively, one aspect of this invention is to provide a device or electronic equipment. An object is to provide a light-emitting device, a display device, an electronic device, or a lighting device with low power consumption. This is the first.

[0010] Note that one aspect of the present invention does not need to solve all of these problems.

Means for Solving the Problems

[0011] A light-emitting device according to one aspect of the present invention has a strip-shaped region with high flexibility and a strip-shaped region with low flexibility alternately. The light-emitting device can be folded by bending in the region with high flexibility. The light-emitting device according to one aspect of the present invention has excellent portability in the folded state and excellent一览性 (it seems there is a typo here, maybe "legibility"?) in the unfolded state due to a wide light-emitting region without seams. By applying one aspect of the present invention, the portability of the device can be improved without reducing the size of the light-emitting region or the display region. Specifically, one aspect of the present invention has a flexible light-emitting panel and a plurality of support panels that support the light-emitting panel and are spaced apart from each other. The support panels have lower flexibility than the light-emitting panel, and it is a light-emitting device. Also, one aspect of the present invention is a light-emitting device that alternately has a strip-shaped region with high flexibility and a strip-shaped region with low flexibility in a first direction. The region with high flexibility has a flexible light-emitting panel, and the region with low flexibility has a support panel with lower flexibility than the light-emitting panel and the light-emitting panel stacked together. In the light-emitting device having the above configuration, it preferably has a protective layer with higher flexibility than the support panel, and the region with high flexibility and the region with low flexibility have the light-emitting panel and the protective layer stacked together. The light-emitting device can be folded by bending in the region with high flexibility. The light-emitting device has excellent portability in the folded state and excellent legibility in the unfolded state due to a wide light-emitting region without seams. By applying one aspect of the present invention, the portability of the device can be improved without reducing the size of the light-emitting region or the display region.

[0012] Specifically, one aspect of the present invention has a flexible light-emitting panel and a plurality of support panels that support the light-emitting panel and are spaced apart from each other. The support panels have lower flexibility than the light-emitting panel, and it is a light-emitting device. Also, one aspect of the present invention is a light-emitting device that alternately has a strip-shaped region with high flexibility and a strip-shaped region with low flexibility in a first direction. The region with high flexibility has a flexible light-emitting panel, and the region with low flexibility has a support panel with lower flexibility than the light-emitting panel and the light-emitting panel stacked together. In the light-emitting device having the above configuration, it preferably has a protective layer with higher flexibility than the support panel, and the region with high flexibility and the region with low flexibility have the light-emitting panel and the protective layer stacked together.

[0013] Also, one aspect of the present invention is a light-emitting device that alternately has a strip-shaped region with high flexibility and a strip-shaped region with low flexibility in a first direction. The region with high flexibility has a flexible light-emitting panel, and the region with low flexibility has a support panel with lower flexibility than the light-emitting panel and the light-emitting panel stacked together. In the light-emitting device having the above configuration, it preferably has a protective layer with higher flexibility than the support panel, and the region with high flexibility and the region with low flexibility have the light-emitting panel and the protective layer stacked together. In the light-emitting device having the above configuration, it preferably has a protective layer with higher flexibility than the support panel, and the region with high flexibility and the region with low flexibility have the light-emitting panel and the protective layer stacked together. In the light-emitting device having the above configuration, it preferably has a protective layer with higher flexibility than the support panel, and the region with high flexibility and the region with low flexibility have the light-emitting panel and the protective layer stacked together.

[0014] In the light-emitting device having the above configuration, it has a protective layer with higher flexibility than the support panel, and the region with high flexibility and the region with low flexibility preferably have the light-emitting panel and the protective layer stacked together. Preferably. Yes. It should be noted that there seems to be a typo in the original text at "一覧性に優れる", which might be "legibility" or some other intended word. The translation is adjusted as best as possible based on the context.

[0015] Furthermore, in one aspect of the present invention, a strip-shaped region with high flexibility and a strip-shaped region with low flexibility are provided in the first direction. This light-emitting device has alternating regions, and the highly flexible region is a flexible light-emitting panel. The region with low flexibility is a support panel that is less flexible than the light-emitting panel, and the support panel It is a light-emitting device having a light-emitting panel between and

[0016] In the light-emitting device having the above configuration, there is a pair of protective layers, the protective layers being more flexible than the support panel. In areas with high rigidity and low flexibility, a pair of protective layers are located between the support panels, and the light-emitting panel It is preferable that it is located between a pair of protective layers.

[0017] Furthermore, in one aspect of the present invention, a strip-shaped region with high flexibility and a strip-shaped region with low flexibility are provided in the first direction. This light-emitting device has alternating regions, and the highly flexible region is a flexible light-emitting panel. The region with low flexibility is the pair of support panels and the light-emitting panel between the pair of support panels. The support panel is a light-emitting device with lower flexibility compared to the light-emitting panel.

[0018] In the light-emitting device having the above configuration, there is a pair of protective layers, the protective layers being more flexible than the support panel. In areas with high rigidity and low flexibility, a pair of protective layers are located between a pair of support panels, and light emission It is preferable that the panel be positioned between a pair of protective layers.

[0019] Furthermore, in the light-emitting devices of the above configurations, one of the two consecutive highly flexible regions is bent inward. And when the other is bent outward, the radius of curvature of the light-emitting panel within the highly flexible region of one side is The radius is defined as the circle, and the radius is defined as the radius of curvature of the light-emitting panel within the other highly flexible region. Preferably, the circle overlaps with the plane supporting the light-emitting device by moving parallel to it.

[0020] In this specification, the term "inward bending" refers to the case where the light-emitting surface of a light-emitting panel is bent inward. When a light-emitting panel is bent so that the light-emitting surface faces outwards, this is referred to as "outward bending." In light-emitting devices, the light-emitting surface refers to the surface from which light is extracted from the light-emitting element.

[0021] Furthermore, in the light-emitting device with the above configuration, inward bending and outward bending are alternately performed in multiple highly flexible regions. When repeated, the surface of the light-emitting panel closest to the plane supporting the light-emitting device and the surface furthest from it The shortest distance L between is the sum of the radii of curvature of the light-emitting panel within multiple highly flexible regions D It is preferable that the formula L < 2(D + T) is expressed using the thickness T of the light-emitting panel.

[0022] Furthermore, in the light-emitting device of each of the above configurations, the light-emitting panel includes an external connection electrode, and the external connection The length in the first direction of the less flexible region A that overlaps with the pole is equal to the length of the least flexible region closest to region A. It is preferable that the length is longer than the length of the first direction of region B.

[0023] Furthermore, in each of the above-mentioned light-emitting devices, region A, region B, and the region furthest from region A with low flexibility Within region C, the region with the longest length in the first direction is region A, and the next longest region is region C. It is preferable to have one.

[0024] In each of the above-described light-emitting devices, among the multiple regions with low flexibility, the length in the first direction is the longest. The region is preferably region A.

[0025] Furthermore, electronic devices and lighting devices using the light-emitting devices of the above configurations are also embodiments of the present invention. In some cases, the light-emitting devices in each of the above configurations may themselves function as electronic devices or lighting devices.

[0026] In this specification, the term "light-emitting device" includes a display device using a light-emitting element. The element has a connector, for example, an anisotropic conductive film, or TCP (Tape Carrier). A module with an er Package attached, and a printed circuit board is installed at the end of the TCP. The module or light-emitting element is equipped with a COG (Chip On Glass) system. Modules with directly mounted ICs (integrated circuits) are also included in the definition of light-emitting devices. This also includes light-emitting devices used in lighting fixtures and the like. [Effects of the Invention]

[0027] In one aspect of the present invention, a highly portable light-emitting device, display device, electronic device, or lighting device is provided. This invention can provide a light-emitting device, display device, or electronic device with excellent visibility. We can provide equipment. In one aspect of the present invention, a light-emitting device and display device that are highly portable and easy to view are provided. Alternatively, we can provide electronic devices.

[0028] One aspect of the present invention provides a novel light-emitting device, display device, electronic device, or lighting device. It is possible to make a lightweight light-emitting device, display device, electronic device, Alternatively, a lighting device can be provided. Or, one aspect of the present invention provides a highly reliable light We can provide optical devices, display devices, electronic devices, or lighting devices. In one aspect of the present invention, one aspect of the present invention relates to a light-emitting device, display device, electronic device, which is less susceptible to damage, Alternatively, a lighting device can be provided. Or, in one aspect of the present invention, a thin light-emitting device A display device, electronic device, or lighting device can be provided. Alternatively, the present invention can be provided. In one embodiment, a flexible light-emitting device, display device, electronic device, or lighting device is provided. This is possible. Alternatively, in one aspect of the present invention, a light-emitting region having a seamless and wide light-emitting area is provided. Devices or lighting devices, or display devices or electronic devices having a seamless, wide display area A device can be provided. Alternatively, in one aspect of the present invention, a light-emitting device, display device, and electric device with low power consumption can be provided. Sub-devices or lighting devices can be provided. [Brief explanation of the drawing]

[0029] [Figure 1] A diagram illustrating a light-emitting device. [Figure 2] A diagram illustrating a light-emitting device. [Figure 3] A diagram illustrating a light-emitting device. [Figure 4] A diagram illustrating a light-emitting device. [Figure 5] A diagram illustrating a light-emitting device. [Figure 6] A diagram illustrating a light-emitting device. [Figure 7] A diagram illustrating a light-emitting panel. [Figure 8] A diagram illustrating a light-emitting panel. [Figure 9] A diagram illustrating a light-emitting panel. [Figure 10] A diagram illustrating a light-emitting panel. [Figure 11] A diagram illustrating the method for manufacturing a light-emitting panel. [Figure 12] A diagram illustrating the method for manufacturing a light-emitting panel. [Figure 13] A diagram illustrating a light-emitting panel. [Figure 14] A diagram illustrating a light-emitting device. [Figure 15] A diagram illustrating a light-emitting device. [Figure 16] A diagram illustrating a light-emitting device. [Figure 17] A diagram illustrating a light-emitting device. [Figure 18] A diagram illustrating a light-emitting panel. [Figure 19] A diagram illustrating a light-emitting device. [Figure 20] A diagram illustrating a light-emitting device. [Figure 21] A diagram illustrating a light-emitting device. [Figure 22] A diagram illustrating a light-emitting device. [Modes for carrying out the invention]

[0030] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The interpretation is not limited to the content stated herein.

[0031] In the configuration of the invention described below, the same part or part having a similar function is used. The same symbol is used consistently across different drawings, and explanations of its repetition are omitted. When referring to a function, the same hatch pattern may be used, and a specific symbol may not be assigned.

[0032] Furthermore, the position, size, and scope of each component shown in the drawings, etc., are for ease of understanding. The position, size, and range of the edges may not be shown. Therefore, the disclosed invention is not necessarily However, this is not limited to the location, size, scope, etc., disclosed in drawings, etc.

[0033] (Embodiment 1) This embodiment describes a light-emitting device according to one aspect of the present invention.

[0034] A light-emitting device according to one aspect of the present invention involves an alternating strip-shaped region of high flexibility and a strip-shaped region of low flexibility. They possess each other. The light-emitting device can be folded by bending it in a highly flexible region. One embodiment of the present invention is a light-emitting device that is highly portable when folded and when unfolded. Furthermore, its seamless, wide light-emitting area provides excellent visibility.

[0035] In a light-emitting device according to one aspect of the present invention, the highly flexible region is folded either inward or outward. It can also be folded.

[0036] When not using the light-emitting device according to one embodiment of the present invention, the light-emitting surface of the light-emitting panel is bent inward. This helps to prevent scratches and dirt from getting on the light-emitting surface.

[0037] When using a light-emitting device according to one aspect of the present invention, by unfolding it, a seamless, wide light-emitting area is formed. The entire area can be used, or the light-emitting surface of the light-emitting panel can be bent outwards to create a light-emitting area. A portion of the area may be used. The luminescent area, which is folded and invisible to the user, is designated as the non-luminescent area. This reduces the power consumption of the light-emitting device.

[0038] In the following, we will describe a structure having two band-shaped, highly flexible regions and three band-shaped, less flexible regions. Let's explain using a tri-foldable light-emitting device as an example.

[0039] Figure 1(A) shows the light-emitting device in its unfolded state. Figure 1(B) shows the device in its unfolded or folded state. This shows a light-emitting device in an intermediate state, transitioning from one state to the other. (See Figure 1(C) for details.) Figure 2 shows the light-emitting device in its current state. Figure 3(A) is a perspective view showing the various components of the light-emitting device. Figure 3(B) is a plan view of the light-emitting surface of the light-emitting device, and Figure 3(B) is a plan view of the surface of the light-emitting device facing the light-emitting surface. This is a view drawing. Figures 3(C), (D), and (F) show the light-emitting device in Figure 3(A) in the direction of the arrows, respectively. This is an example of a side view seen from the front. Figure 3(E) shows the section between A and B indicated by the dashed line in Figure 3(A). This is a cross-sectional view. Figures 4(A), (C), and (D) show the light-emitting device of Figure 1(C) from the direction of the arrow. This is an example of a side view.

[0040] Furthermore, Figures 14(A) to (C) show modified examples of Figures 1(A) to (C), respectively. Figure A shows the light-emitting device in its unfolded state. Figure 14(B) shows the device in its unfolded or folded state. This shows a light-emitting device in an intermediate state, transitioning from one state to the other. (Folded in Figure 14(C)) Figure 15 shows the state of the light-emitting device. Figure 16(A) is a perspective view showing the various components of the light-emitting device. Figure 16(B) is a plan view of the light-emitting surface side of the light-emitting device, while Figure 16(B) is a plan view of the side of the light-emitting device facing the light-emitting surface. This is a plan view. Figures 16(C) and (D) show the light-emitting device in Figure 16(A) in the direction of the arrows, respectively. This is an example of a side view seen from the front. Figure 16(E) shows the dashed line AB in Figure 16(A). This is a cross-sectional view. Figure 16(F) is a modified example of the light-emitting device shown in Figure 16(C), etc.

[0041] The light-emitting devices shown in Figures 1(A)-(C) and 14(A)-(C) are made of flexible light-emitting panels. The light-emitting device has a plurality of support panels 15a and a plurality of support panels 15 It has b. Each support panel 15a, 15b has lower flexibility than the light-emitting panel 11. The support panels 15a are spaced apart from each other. The support panels 15b are spaced apart from each other. Yes, they are.

[0042] As shown in Figure 3(A), the light-emitting device has a highly flexible region E1 and a less flexible region E2 It has alternating sections. The highly flexible and less flexible regions are each formed in a striped (striped) pattern. In this embodiment, multiple highly flexible regions and multiple less flexible regions are laid flat against each other. The example shown is a row, but the regions do not necessarily have to be arranged parallel to each other.

[0043] The highly flexible region E1 in the light-emitting device has at least a flexible light-emitting panel. It is sufficient if it is. In particular, light-emitting panels using organic EL elements have high flexibility and impact resistance. Yes, it is preferable because it allows for thinning and weight reduction. For an example of the configuration of the light-emitting panel, see Embodiment 2. This will be explained in detail in section 3.

[0044] The region E2 with low flexibility in the light-emitting device is at least a flexible light-emitting panel, and It is sufficient to have a support panel that is less flexible than the light-emitting panel, stacked on top of each other.

[0045] As shown in Figure 16(A), the light-emitting device has a region with high flexibility in one direction and a region with low flexibility. It has alternating regions.

[0046] Figure 16(A) shows the region with low flexibility, the region with high flexibility, and the region with low flexibility. The lengths in the direction in which they are aligned are indicated by lengths W1 to W3.

[0047] Furthermore, it is preferable to include external connection electrodes of the light-emitting panel in the region with low flexibility. Here, the external connection electrode corresponds to, for example, the conductive layer 157 shown in Figure 7(B).

[0048] In Figure 16(A), the external connection electrode is included in the less flexible region of length W1. In the light-emitting device, The length W1 of the low-flexibility region A that overlaps with the external connection electrode is the same as the lowest flexibility region closest to region A. It is longer than the length W3 of region B.

[0049] Here, when the light-emitting device is folded, the end of the light-emitting panel 11 (the folded part, the bend) The end portion in the girder position (or other similar position) is located outside the end portions of support panels 15a and 15b. If positioned in this way, the light-emitting panel 11 may be damaged, or the elements contained in the light-emitting panel 11 may be destroyed. There are cases where this can happen.

[0050] On the other hand, the folded light-emitting device shown in Figure 1(C) has the end of the light-emitting panel 11 and the light-emitting The ends of the support panels 15a and 15b, located above and below panel 11, are aligned. This prevents damage to the light-emitting panel 11, and prevents the destruction of elements contained in the light-emitting panel 11. It can be controlled.

[0051] Furthermore, in the folded state of the light-emitting device shown in Figure 14(C), the edges of the light-emitting panel 11 are It is located inside the edges of the support panels 15a and 15b. This further enhances the light-emitting panel This can prevent damage to component 11, and prevent destruction of elements contained in the light-emitting panel 11.

[0052] From the above, in the light-emitting device, the length W1 of the less flexible region A that overlaps with the external connection electrode is It is preferable that the length of the region B, which is the closest to region A and has low flexibility, is longer than the length W3 of region A. The length of region A is W1, the length of region B is W3, and the length of region C, which is the least flexible and furthest from region A, is W. Of the two lengths, it is preferable that length W1 is the longest, followed by length W2.

[0053] The support panel is provided on at least one of the light-emitting surface side of the light-emitting panel or the side facing the light-emitting surface. It would be fine if it were done that way.

[0054] As shown in Figure 3(C) or Figure 16(C), the support panels 15a and 15b are used to emit light from the light-emitting panel. If there are support panels on both the light-emitting surface side and the surface side facing the light-emitting surface, then the pair of support panels This allows the light-emitting panel to be held in place, increasing the mechanical strength of areas with low flexibility, and making the light-emitting device more flexible. This makes it less prone to damage, which is desirable.

[0055] In addition, instead of support panels 15a and 15b, the support panel shown in Figure 3(D) or Figure 16(D) The light-emitting panel 11 may be placed between the support panels 15 using the 15.

[0056] Furthermore, in Figures 1(A), 2, and 3(C), etc., in the region E2 with low flexibility, the protective layer and Although an example in which the side surface of the light-emitting panel is exposed is shown, the present invention is not limited to this. Figure 3( As shown in F), in the region E2 with low flexibility, the protective layer and the sides of the light-emitting panel support Even if covered with flannel 15 (or one or both of the pair of support panels 15a, 15b) Good. Figure 21 shows a light-emitting device in which the protective layer and the sides of the light-emitting panel are covered by the support panel 15b. The basic configuration is shown. Figure 21(A) shows the light-emitting device in its deployed state. Also, Figure 21( The light emission in a state in the process of changing from the unfolded state or the folded state to the other state as in B) The device is shown. Figure 21(C) also shows the light-emitting device in a folded state. Also, Figure 22 This is a perspective view showing the various components of the light-emitting device.

[0057] If the light-emitting panel has support panels only on the light-emitting surface side or the side facing the light-emitting surface, the light-emitting device It is preferable to make it thinner or lighter. For example, as shown in Figure 16(F) The light-emitting device does not use multiple support panels 15a, but only has multiple support panels 15b. That's fine.

[0058] The highly flexible region E1 and the less flexible region E2 are compared to the light-emitting panel and the support panel. It is preferable to have a highly flexible protective layer layered on top of it. This improves the flexibility of the light-emitting device. The region E1, which has high flexibility and mechanical strength, becomes a region that is less prone to breaking the light-emitting device. This makes it less likely to lose value. Therefore, not only in areas with low flexibility, but also in areas with high flexibility. In this domain, the light-emitting device can be designed to be less susceptible to damage from deformation caused by external forces.

[0059] For example, the thickness of the light-emitting panel, support panel, and protective layer is such that the support panel is the thickest. A configuration with the thinnest possible light-emitting panel is preferred. Alternatively, for example, a light-emitting panel, a support panel, and a protective panel. The flexibility of each layer is such that the support panel has the lowest flexibility, and the light-emitting panel has the highest flexibility. A configuration is preferred. With such a configuration, a region with high flexibility and a region with low flexibility are formed. The difference in flexibility becomes large. The structure must be designed to allow bending in a region of high flexibility. This suppresses bending in areas with low flexibility, thereby improving the reliability of the light-emitting device. Yes, it's possible. Furthermore, it can prevent the light-emitting device from bending unintentionally.

[0060] If a protective layer is provided on both the light-emitting surface side and the surface opposite the light-emitting surface of the light-emitting panel, a pair of protective layers will be provided. Because the light-emitting panel can be sandwiched between layers, the mechanical strength of the light-emitting device is increased, and the light-emitting device is more This makes it less prone to damage, which is desirable.

[0061] For example, as shown in Figure 3(C) or Figure 16(C), in the less flexible region E2, a pair The protective layers 13a and 13b are located between a pair of support panels 15a and 15b, and the light-emitting panel (Figure) Preferably, the (not shown) is located between the pair of protective layers 13a and 13b.

[0062] Alternatively, as shown in Figure 3(D) or Figure 16(D), in the less flexible region E2, a pair Protective layers 13a and 13b are located between the support panels 15, and a pair of light-emitting panels (not shown) are located between them. It is preferable that it be located between the protective layers 13a and 13b.

[0063] If the light-emitting panel has a protective layer only on the light-emitting surface side or the side facing the light-emitting surface, the light-emitting device will be It is preferable to make it thinner or lighter. For example, without using protective layer 13a, protective layer A light-emitting device having only 13b may also be used.

[0064] Furthermore, if the protective layer 13a on the light-emitting surface side of the light-emitting panel is a light-shielding film, the non-light-emitting region of the light-emitting panel This suppresses the exposure of the area to ambient light. As a result, the drive circuit included in the non-emitting region is This is preferable because it can suppress photodegradation of transistors and other components.

[0065] As shown in Figures 2, 3(E), 15, or 16(E), the light-emitting side of the light-emitting panel 11 The opening in the provided protective layer 13a overlaps with the light-emitting region 11a of the light-emitting panel. The non-emitting region 11b surrounding a in a frame shape and the protective layer 13a are arranged to overlap. The protective layer 13b provided on the side of the panel 11 facing the light-emitting surface is located in the light-emitting region 11a and the non- It overlaps with the light-emitting region 11b. The protective layer 13b covers a wider area on the side facing the light-emitting surface. Therefore, by providing it over the entire surface, the light-emitting panel can be better protected. This can improve the reliability of the light-emitting device.

[0066] In one embodiment of the present invention, a light-emitting device is used, in which multiple highly flexible regions are alternately bent inward and outward. When repeated, the surface of the light-emitting panel closest to the plane supporting the light-emitting device and the surface furthest from it The shortest distance L between is the sum of the radii of curvature of the light-emitting panel within multiple highly flexible regions D It is preferable that the expression L < 2(D + T) is expressed using the thickness T of the light-emitting panel. This allows for a thinner light-emitting device.

[0067] The light-emitting device shown in Figure 4(A) has one highly flexible region bent inward, and one highly flexible region The region is bent outwards. At the boundary between protective layer 13a and protective layer 13b in Figure 4(A) The light-emitting panel is located in this position. Diameters D1 and D2 in Figure 4(A) are explained in detail. The diagram is shown in Figure 4(B). The diameter D1 is the diameter of the light-emitting panel in the highly flexible region that is bent inward. This indicates the diameter of the circle whose radius is the radius of curvature of the curve. Diameter D2 is the diameter of the highly flexible region when bent outwards. This indicates the diameter of a circle whose radius is the radius of curvature of the light-emitting panel. The thickness of the light-emitting panel 11 is the thickness Denoted as T. The sum of diameters D1 and D2 is within multiple highly flexible regions of the light-emitting panel. Since it corresponds to twice the sum of the radii of curvature D, L < 2(D+T) is L <D1+D2+2Tと In other words, the plane supporting the light-emitting device of the light-emitting panel in Figure 4(A) The shortest distance L1 between the closest and furthest faces is D1 + D2 + 3T.

[0068] The thickness of the support panels 15a and 15b and the protective layers 13a and 13b is reduced, and they are bent inward. Narrow the width of the less flexible region between the highly flexible region and the highly flexible region that bends outward. By doing so, the surface of the light-emitting panel shown in Figure 4(C) that is closest to the plane supporting the light-emitting device is Like the shortest distance L2 between the farthest face, L2 <D1+D2+3T、さらにはL2<D 1 + D2 + 2T, or in other words, L2 < 2(D+T), can be satisfied.

[0069] Here, in the light-emitting device, among the regions with low flexibility that overlap due to bending, the outer region The pair of regions located there are preferably parallel to the plane supporting the light-emitting device, and are located on the inside. It is preferable that the other areas on which it is placed are not parallel to the plane.

[0070] In a light-emitting device according to one aspect of the present invention, one of two consecutive highly flexible regions is bent inward. When the other side is bent outward, the radius of curvature of the light-emitting panel within the highly flexible region of one side is halved. A circle whose radius is the radius of the light-emitting panel within the other highly flexible region, and a circle whose radius is the radius of curvature of the light-emitting panel within that region. Preferably, this coincides with the plane supporting the light-emitting device, which moves parallel to it. This makes it possible to make the light-emitting device thinner.

[0071] As shown in Figure 4(D), the circle with diameter D1 and the circle with diameter D2 are the plane supporting the light-emitting device. They overlap by moving parallel to each other (which in this case corresponds to moving left to right across the paper). Inward curve The radius of curvature of the light-emitting panel in the highly flexible region and the radius of curvature of the outwardly bent highly flexible region The radius of curvature of the light-emitting panel corresponds to the radius of the two circles, as shown in Figure 4(D). It can be said that the light-emitting device has been made thinner.

[0072] Furthermore, the plane closest to the plane supporting the light-emitting device of the light-emitting panel shown in Figure 4(D) and the plane furthest away from it. The shortest distance L3 between the planes is L3 <D1+D2+3T、さらにはL3<D1+D2+2 T, in other words, L3 < 2(D + T) can be satisfied. Note that in Figure 4(D), The protective layer 13a and protective layer 13b are collectively shown as protective layer 13.

[0073] The protective layer and support panel can be formed using plastic, metal, alloy, rubber, etc. By using materials such as plastic or rubber, it is possible to obtain lightweight and damage-resistant protective layers and support panels. Therefore, it is preferable. For example, silicone rubber as the protective layer and stainless steel as the support panel. Aluminum can be used instead.

[0074] Furthermore, it is preferable to use materials with high toughness for the protective layer and support panels. This improves durability. This enables the creation of light-emitting devices that are highly impact-resistant and less prone to damage. For example, organic resins and thin gold By using alloy materials, it is possible to create a lightweight and durable light-emitting device. For similar reasons, it is preferable to use a highly tough material for the substrate that makes up the light-emitting panel. It seems so.

[0075] If the protective layer or support panel located on the light-emitting surface side does not overlap with the light-emitting area of ​​the light-emitting panel, Transparency is not a requirement. The protective layer or support panel located on the light-emitting surface side must be at least partially transparent. If the area overlaps with the light-emitting panel, it is preferable to use a material that transmits light emitted from the light-emitting panel. The light transmittance of the protective layer and support panel located on the side facing the light surface is not a requirement.

[0076] When bonding any two of the protective layer, support panel, or light-emitting panel, various adhesives can be used. It is possible to do this, for example, with two-component resins that harden at room temperature, photocurable resins, A resin such as a thermosetting resin can be used. Alternatively, a sheet-type adhesive can be used. Also, screws that penetrate two or more of the protective layer, support panel, or light-emitting panel, or clamps The components of the light-emitting device may be fixed in place using pins, clips, etc.

[0077] A light-emitting device according to one aspect of the present invention comprises a single light-emitting panel (single light-emitting region) that is bent It can be used by dividing it into two or more parts. For example, by folding it, the hidden area can be made non-luminescent. Therefore, only the exposed area may emit light. This prevents the area not used by the user from consuming energy. This can reduce the amount of electricity used.

[0078] A light-emitting device according to one aspect of the present invention determines whether each highly flexible region is bent or not. It may have a sensor for this purpose. For example, a switch, a MEMS pressure sensor or a pressure sensor. It can be constructed using sensors, etc.

[0079] The above description uses a light-emitting device having two highly flexible regions as an example, but the present invention is not limited to this. It is not possible. For example, as shown in Figure 5(A), there is at least one highly flexible region E1. It is sufficient if it has three highly flexible regions E1 as shown in Figure 5(B) or Figure 17(A). A light-emitting device that can be folded into four, and a highly flexible region E1 as shown in Figure 5(C) or Figure 17(B). Each of these is also an embodiment of the present invention, including a five-fold light-emitting device having four of these components.

[0080] For example, in the light-emitting device shown in Figure 17(A), of lengths W1 to W4, length W1 is the longest. Length W2 is the next longest, and lengths W3 and W4 are the shortest. Lengths W3 and W4 are different. It may be any value.

[0081] Furthermore, in the light-emitting device shown in Figure 17(B), of the lengths W1 to W5, length W1 is the longest. W2 is the next longest, and W3, W4, and W5 are the shortest. The values ​​of W4 and W5 may be different.

[0082] Figures 6(A) and (B) show examples of the light-emitting device shown in Figure 5(C) when folded into five sections. show.

[0083] In FIG. 6(A), the shortest distance L4 between the surface closest to the plane supporting the light-emitting device of the light-emitting panel and the surface farthest therefrom is expressed as L4 = 2D + 5T using the sum D of the radii of curvature of the light-emitting panel within a plurality of highly flexible regions and the thickness T of the light-emitting panel. Here, 2D = D1 + D2 + D3 + D4.

[0084] By making the thicknesses of the support panels 15a and 15b and the thicknesses of the protective layers 13a and 13b thinner, by making the width of the low-flexibility region between the highly flexible region that is bent inward and the highly flexible region that is bent outward narrower and the like, the shortest distance L5 between the surface closest to the plane supporting the light-emitting device of the light-emitting panel shown in FIG. 6(B) and the surface farthest therefrom satisfies L5 < D1 + D2 + D3 + D4 + 5T using the sum D of the radii of curvature of the light-emitting panel within a plurality of highly flexible regions and the thickness T of the light-emitting panel, and further satisfies L5 < D1 + D2 + D3 + D4 + 2T, or in other words, L5 < 2D + 2T.

[0085] Also, the circle with diameter D1 and the circle with diameter D2 shown in FIG. 6(B) overlap when they are moved parallel to the plane supporting the light-emitting device (which corresponds to moving in the left-right direction of the paper surface here). Also, the circle with diameter D3 and the circle with diameter D4 also overlap when they are moved parallel to the plane supporting the light-emitting device. Since the radius of the circle with diameter D1 and the radius of the circle with diameter D2 correspond to the radius of curvature of the light-emitting panel in the highly flexible region that is bent inward and the radius of curvature of the light-emitting panel in the highly flexible region that is bent outward when one of two consecutive highly flexible regions is bent inward and the other is bent outward, it can be said that the light-emitting device shown in FIG. 6(B) has also been made thinner. The same can be said for the radius of the circle with diameter D3 and the radius of the circle with diameter D4.

[0086] Furthermore, as shown in Figure 6(B), a pair of less flexible regions are located on the outermost side of the light-emitting device. By narrowing the width of other less flexible areas, the light-emitting device can be made thinner. It is possible.

[0087] Furthermore, when folding the light-emitting device, the highly flexible areas do not necessarily alternate between inward and outward bending. It is not necessary to do this, for example, as shown in Figure 5(D), by bending each highly flexible region inward. This is also good. By keeping it in this state, scratches and other damage can occur to the light-emitting surface of the light-emitting device when it is carried around. It can prevent dirt from accumulating.

[0088] In the light-emitting device of this embodiment, one light-emitting panel can be folded one or more times. In this case, the radius of curvature can be, for example, between 1 mm and 150 mm.

[0089] This embodiment can be combined with other embodiments as appropriate.

[0090] (Embodiment 2) In this embodiment, the light-emitting panel will be described using Figures 7 to 12. When the example light-emitting panel is bent, the minimum radius of curvature of the light-emitting panel is 1 mm or more. 50mm or less, 1mm to 100mm, 1mm to 50mm, 1mm to 10m The diameter can be less than or equal to m, or between 2 mm and 5 mm. The light-emitting panel of this embodiment is The element will not break even when bent with a small radius of curvature (for example, between 2mm and 5mm). , highly reliable. By bending the light-emitting panel with a small radius of curvature, one aspect of the present invention The optical device can be made thinner. The direction in which the light-emitting panel is bent in this embodiment is irrelevant. Furthermore, there may be one or more points where the material is bent.

[0091] <Specific Example 1> Figure 7(A) shows a plan view of the light-emitting panel 11 illustrated in Embodiment 1, and in Figure 7(A) An example of a cross-sectional view between the dashed line A1 and A2 is shown in Figure 7(B).

[0092] The light-emitting panel shown in Figure 7(B) has an element layer 101, an adhesive layer 105, and a substrate 103. The sublayer 101 consists of the substrate 201, adhesive layer 203, insulating layer 205, multiple transistors, and conductive layer. 157, insulating layer 207, insulating layer 209, multiple light-emitting elements, insulating layer 211, sealing layer 213, It has an insulating layer 261, a colored layer 259, a light-shielding layer 257, and an insulating layer 255.

[0093] The conductive layer 157 is electrically connected to the FPC 108 via the connector 215.

[0094] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. Electrode 231 is electrically connected to the source electrode or drain electrode of transistor 240. The end of the lower electrode 231 is covered with an insulating layer 211. The light-emitting element 230 is a top emitter. It has a symmetrical structure. The upper electrode 235 is translucent and transmits light emitted by the EL layer 233. .

[0095] A colored layer 259 is provided in a position that overlaps with the light-emitting element 230, and in a position that overlaps with the insulating layer 211. A light-shielding layer 257 is provided. The colored layer 259 and the light-shielding layer 257 are covered with an insulating layer 261. The space between the light-emitting element 230 and the insulating layer 261 is filled with a sealing layer 213.

[0096] The light-emitting panel has a light extraction section 104 and a drive circuit section 106, and multiple transistors 240 and the like. It has several transistors. Transistor 240 is provided on the insulating layer 205. The insulating layer 205 and the substrate 201 are bonded together by the adhesive layer 203. 55 and substrate 103 are bonded together by adhesive layer 105. Insulating layer 205 and insulating layer 2 If a film with low water permeability is used for 55, impurities such as water will enter the light-emitting element 230 and the transistor 240. This is preferable because it can suppress the intrusion of particles and improve the reliability of the light-emitting panel. Adhesive layer 203 The same material as that used for the adhesive layer 105 can be used.

[0097] In specific example 1, an insulating layer 205, a transistor 240, and a light-emitting element are fabricated on a heat-resistant substrate. A 230 is fabricated, the fabricated substrate is peeled off, and an insulating layer 20 is applied to the substrate 201 using the adhesive layer 203. This shows a light-emitting panel that can be fabricated by transposing elements 5, transistor 240, and light-emitting element 230. In addition, in specific example 1, an insulating layer 255 and a colored layer 259 are formed on a heat-resistant fabricated substrate. A light-shielding layer 257 is prepared, the prepared substrate is peeled off, and an adhesive layer 105 is used to create an insulating layer on the substrate 103. This shows a light-emitting panel that can be fabricated by transposing the edge layer 255, the colored layer 259, and the light-shielding layer 257. They are doing it.

[0098] When using materials with low heat resistance (such as resin) for the substrate, applying high temperatures to the substrate during the manufacturing process can be dangerous. Because this is difficult, there are limitations on the conditions under which transistors and insulating films can be fabricated on the substrate. When using a highly water-permeable material (such as resin) for the substrate of a light-emitting device, between the substrate and the light-emitting element, It is preferable to apply high temperature to form a film with low water permeability. Furthermore, because transistors and other components can be fabricated on a highly heat-resistant substrate, high temperatures can be applied, ensuring reliability. It is possible to form transistors with high permeability and insulating films with sufficiently low water permeability. By transferring these to a substrate with low heat resistance, a highly reliable light-emitting panel can be manufactured. Therefore, in one aspect of the present invention, a lightweight or thin and highly reliable light-emitting device can be realized. To make it. Details of the manufacturing method will be described later.

[0099] It is preferable to use materials with high toughness for substrate 103 and substrate 201, respectively. This makes it possible to realize a light-emitting panel that is highly impact-resistant and less prone to damage. For example, substrate 103 The substrate 201 is made of an organic resin substrate, and the substrate 201 is made of a thin metal material or alloy material. Therefore, compared to cases where a glass substrate is used, the resulting light-emitting panel is lighter and less prone to damage. It can be achieved.

[0100] Metal and alloy materials have high thermal conductivity and can easily conduct heat throughout the substrate, so light-emitting panels This is preferable as it can suppress the localized temperature rise of the material. The thickness of the plate is preferably 10 μm to 200 μm, and 20 μm to 50 μm. It is preferable to do so.

[0101] Furthermore, if a material with high thermal emissivity is used for the substrate 201, the surface temperature of the light-emitting panel will increase. This can suppress damage and reduce the reliability of the light-emitting panel. For example, if the substrate 201 is made of gold A substrate and a layer with high thermal emissivity (for example, metal oxides or ceramic materials can be used) can be used. ) may also be used as a laminated structure.

[0102] <Specific Example 2> Figure 8(A) shows another example of the light extraction section 104 in the light-emitting panel. Light emission in Figure 8(A) The panel is a touch-enabled light-emitting panel. Note that in each of the following specific examples, Specific Example 1 We will omit the explanation of similar configurations.

[0103] The light-emitting panel shown in Figure 8(A) has an element layer 101, an adhesive layer 105, and a substrate 103. The sublayer 101 consists of a substrate 201, an adhesive layer 203, an insulating layer 205, multiple transistors, and an insulating layer. 207, insulating layer 209, multiple light-emitting elements, insulating layer 211, insulating layer 217, sealing layer 213, Insulating layer 261, colored layer 259, light-shielding layer 257, multiple light-receiving elements, conductive layer 281, conductive layer 2 It has 83, an insulating layer 291, an insulating layer 293, an insulating layer 295, and an insulating layer 255.

[0104] In specific example 2, an insulating layer 217 is provided on the insulating layer 211. By providing the insulating layer 217, The distance between board 103 and board 201 can be adjusted.

[0105] Figure 8(A) shows an example in which a light-receiving element is located between the insulating layer 255 and the sealing layer 213. Non-light-emitting areas of the panel (for example, areas where transistors or wiring are installed, or areas where light-emitting elements are installed) Because light-receiving elements can be placed on top of areas that are not currently being treated, the pixels (light-emitting elements) A touch sensor can be installed on the light-emitting panel without reducing the aperture ratio.

[0106] The light-receiving element of the light-emitting panel may be, for example, a pn-type or pin-type photodiode. It is possible. In this embodiment, the photodetector is a p-type semiconductor layer 271 and an i-type semiconductor layer. A pin-type photodiode having a body layer 273 and an n-type semiconductor layer 275 is used.

[0107] Furthermore, the i-type semiconductor layer 273 contains impurities that impart p-type properties and impurities that impart n-type properties. Each is 1 x 1020 cm -3 The following concentrations are observed, where the photoconductivity is 100 relative to the dark conductivity. It is more than double. The i-type semiconductor layer 273 contains impurity elements from Group 13 or Group 15 of the periodic table. This category also includes those that possess the following characteristics. In other words, type i semiconductors are designed for the purpose of controlling valence electrons. Because it exhibits weak n-type electrical conductivity when pure elements are not intentionally added, i-type semiconductor layer 2 73 imparts p-type impurity elements during or after film formation, either intentionally or unintentionally. This category includes those that have been added to it.

[0108] The light-shielding layer 257 is located on the substrate 201 side of the light-receiving element and overlaps with the light-receiving element. The light-shielding layer 257 located between the element and the sealing layer 213 blocks the light emitted by the light-emitting element 230. This can suppress the light from being irradiated onto the light-receiving element.

[0109] Conductive layer 281 and conductive layer 283 are electrically connected to the light-receiving element, respectively. Conductive layer 281 It is preferable to use a conductive layer that transmits light incident on the light-receiving element. The conductive layer 283 is It is preferable to use a conductive layer that blocks the light incident on the light-receiving element.

[0110] When an optical touch sensor is placed between the substrate 103 and the sealing layer 213, the light-emitting element 230 emits light. It is preferable because it is less susceptible to external influences and can improve the signal-to-noise ratio.

[0111] <Specific Example 3> Figure 8(B) shows another example of the light extraction section 104 in the light-emitting panel. Light emission in Figure 8(B) The panel is a touch-enabled light-emitting panel.

[0112] The light-emitting panel shown in Figure 8(B) has an element layer 101, an adhesive layer 105, and a substrate 103. The sublayer 101 consists of a substrate 201, an adhesive layer 203, an insulating layer 205, multiple transistors, and an insulating layer. 207, insulating layer 209a, insulating layer 209b, multiple light-emitting elements, insulating layer 211, insulating layer 21 7, sealing layer 213, coloring layer 259, light-shielding layer 257, multiple light-receiving elements, conductive layer 280, conductive It has a layer 281 and an insulating layer 255.

[0113] Figure 8(B) shows an example in which a light-receiving element is located between the insulating layer 205 and the sealing layer 213. By placing the element between the insulating layer 205 and the sealing layer 213, the transistor 240 is formed. Using the same materials and processes as the conductive layer and semiconductor layer, the conductive layer and the photodetector are electrically connected to the photodetector. The photoelectric conversion layer that constitutes the light-receiving element can be fabricated. Therefore, the fabrication process is greatly increased. It is possible to create a light-emitting panel that can be operated by touch without any additional steps.

[0114] <Specific Example 4> Figure 9(A) shows another example of a light-emitting panel. The light-emitting panel in Figure 9(A) is touch-operable. It is a light-emitting panel.

[0115] The light-emitting panel shown in Figure 9(A) has an element layer 101, an adhesive layer 105, and a substrate 103. The sublayer 101 consists of the substrate 201, adhesive layer 203, insulating layer 205, multiple transistors, and conductive layer. 156, conductive layer 157, insulating layer 207, insulating layer 209, multiple light-emitting elements, insulating layer 211, Insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 27 2. Having a conductive layer 274, an insulating layer 276, an insulating layer 278, a conductive layer 294, and a conductive layer 296. do.

[0116] Figure 9(A) shows a capacitive touch sensor between the insulating layer 255 and the sealing layer 213. An example is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274.

[0117] The conductive layers 156 and 157 are electrically connected to the FPC 108 via the connector 215. The conductive layers 294 and 296 are electrically connected to the conductive layer 274 via the conductive particles 292. It connects to the FPC108. Therefore, it drives the capacitive touch sensor via the FPC108. It is possible.

[0118] <Specific Example 5> Figure 9(B) shows another example of a light-emitting panel. The light-emitting panel in Figure 9(B) is touch-operable. It is a light-emitting panel.

[0119] The light-emitting panel shown in Figure 9(B) has an element layer 101, an adhesive layer 105, and a substrate 103. The sublayer 101 consists of the substrate 201, adhesive layer 203, insulating layer 205, multiple transistors, and conductive layer. 156, conductive layer 157, insulating layer 207, insulating layer 209, multiple light-emitting elements, insulating layer 211, Insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 27 It has a conductive layer 272, a conductive layer 274, an insulating layer 276, and an insulating layer 278.

[0120] Figure 9(B) shows a capacitive touch sensor between the insulating layer 255 and the sealing layer 213. An example is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274.

[0121] The conductive layer 156 and the conductive layer 157 are electrically connected to the FPC 108a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 108b via the connector 215b. Therefore, the light-emitting element 230 and the transistor 240 are driven via the FPC108a, F Capacitive touch sensors can be driven via the PC108b.

[0122] <Specific Example 6> Figure 10(A) shows another example of the light extraction section 104 in the light-emitting panel.

[0123] The light-emitting panel shown in Figure 10(A) has an element layer 101, a substrate 103, and an adhesive layer 105. The element layer 101 consists of a substrate 202, an insulating layer 205, multiple transistors, an insulating layer 207, and a conductive layer. Layer 208, insulating layer 209a, insulating layer 209b, multiple light-emitting elements, insulating layer 211, sealing layer 2 It has 13 and a colored layer 259.

[0124] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. Electrode 231 is connected to the source or drain electrode of transistor 240 via the conductive layer 208. It is electrically connected to the lower electrode 231. The end of the lower electrode 231 is covered with an insulating layer 211. 230 is a bottom emission structure. The lower electrode 231 is translucent, and the EL layer 233 It transmits the light it emits.

[0125] A colored layer 259 is provided in a position that overlaps with the light-emitting element 230, and the light emitted by the light-emitting element 230 The light is then extracted to the substrate 103 side via the colored layer 259. Between the light-emitting element 230 and the substrate 202 It is filled with a sealing layer 213. The substrate 202 uses the same material as the substrate 201 described above. It can be made.

[0126] <Specific Example 7> Figure 10(B) shows another example of a light-emitting panel.

[0127] The light-emitting panel shown in Figure 10(B) has an element layer 101, an adhesive layer 105, and a substrate 103. The element layer 101 consists of a substrate 202, an insulating layer 205, a conductive layer 310a, a conductive layer 310b, and multiple It has a light-emitting element, an insulating layer 211, a conductive layer 212, and a sealing layer 213.

[0128] The conductive layers 310a and 310b are external connection electrodes of the light-emitting panel, and are electrically connected to FPC and the like. It can be connected via a thermal connection.

[0129] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The ends of the electrode 231 are covered with an insulating layer 211. The light-emitting element 230 is bottom emission It has a conductor structure. The lower electrode 231 is translucent and transmits the light emitted by the EL layer 233. The electrode layer 212 is electrically connected to the lower electrode 231.

[0130] The substrate 103 has a light extraction structure consisting of a hemispherical lens, a microlens array, and a bumpy structure. The resin substrate may have the above-mentioned film, light-diffusing film, etc. The lens or film is bonded to the substrate or to a material with a refractive index similar to that of the lens or film. By bonding with an adhesive, a substrate 103 having a light extraction structure can be formed. ru.

[0131] The conductive layer 212 is not necessarily required, but it does not cause a voltage drop due to the resistance of the lower electrode 231. It is preferable to provide it because it can suppress the electrical effect. Also, for the same purpose, the upper electrode 235 and electrical effect A conductive layer for direct connection is provided on the insulating layer 211, the EL layer 233, or the upper electrode 235, etc. You may leave it.

[0132] The conductive layer 212 is made of copper, titanium, tantalum, tungsten, molybdenum, chromium, and neodymium. Materials selected from scandium, nickel, and aluminum, or compounds mainly composed of these materials. It can be formed using gold material, etc., as a single layer or in layers. The thickness of the conductive layer 212 is For example, it can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0. It is 5 μm or less.

[0133] A paste (such as silver paste) is used as the material for the conductive layer that electrically connects to the upper electrode 235. As a result, the metal constituting the conductive layer aggregates into granular form. Therefore, the surface of the conductive layer becomes rough. This configuration has many gaps, and for example, even if the conductive layer is formed on the insulating layer 211, the EL layer 233 However, it is difficult to completely cover the conductive layer, and to make an electrical connection between the upper electrode and the conductive layer. This makes it easier and preferable.

[0134] <Example of materials> Next, we will describe the materials that can be used for the light-emitting panel. I will omit further explanation of the configuration described.

[0135] The element layer 101 has at least an element that emits light. The element that emits light is a self-illuminating element. This category includes elements whose brightness is controlled by current or voltage, which can be used. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. can be used. can.

[0136] The element layer 101 further includes transistors for driving the light-emitting element, touch sensors, etc. It's okay to do so.

[0137] The structure of the transistors in the light-emitting panel is not particularly limited. For example, staggered transistors It can be a zista, or an inverse staggered transistor. It can also be a top-gate type. It may be any transistor structure of the top-gate type or the bottom-gate type. The semiconductor material used for the transistor is not particularly limited, and examples thereof include silicon, germanium, etc. Or, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In-Ga-Zn-based metal oxide, may be used.

[0138] The crystallinity of the semiconductor material used for the transistor is also not particularly limited, and any of an amorphous semiconductor, a semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single-crystalline semiconductor, or a semiconductor having a crystal region in part) may be used. Using a semiconductor having crystallinity is preferable because deterioration of transistor characteristics can be suppressed.

[0139] The light-emitting element included in the light-emitting panel has a pair of electrodes (lower electrode 231 and upper electrode 235) and an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes functions as an anode, and the other functions as a cathode.

[0140] The light-emitting element may be any of a top-emission structure, a bottom-emission structure, and a dual-emission structure. A conductive film that transmits visible light is used for the electrode on the side where light is extracted. Also, it is preferable to use a conductive film that reflects visible light for the electrode on the side where light is not extracted.

[0141] The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO: Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, etc. Also, gold, silver, platinum, magnesium, ​​​​​​​​​​​Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or This refers to metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (for example) For example, titanium nitride and the like can also be used by forming them thinly enough to be translucent. Furthermore, the laminated film of the above materials can be used as a conductive film. For example, silver and magnesium. Using a laminated film of this alloy and ITO is preferable because it can improve conductivity. Alternatively, graphene or the like may be used.

[0142] Examples of conductive films that reflect visible light include aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as tetracellulose, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, Lantha It may also contain added elements such as cellulose, neodymium, or germanium. Aluminum alloys such as aluminum alloys, aluminum-nickel alloys, aluminum-neodymium alloys, etc. Alloys containing um (aluminum alloys), alloys of silver and copper, alloys of silver, palladium and copper, silver It can be formed using an alloy containing silver, such as a magnesium alloy. Gold is preferred because of its high heat resistance. Furthermore, the metal film or metal in contact with the aluminum alloy film. By laminating an oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for films and metal oxide films include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO Multilayer films, such as a silver-magnesium alloy and an ITO-based multilayer film, can be used.

[0143] The electrodes can be formed using methods such as vapor deposition or sputtering. Formed using extrusion methods such as the cuteting method, printing methods such as screen printing, or plating methods. It is possible.

[0144] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 231 and the upper electrode 235. Then, holes are injected into the EL layer 233 from the anode side, and electrons are injected from the cathode side. The electrons and holes recombine in the EL layer 233, causing the light-emitting material in the EL layer 233 to emit light. do.

[0145] The EL layer 233 has at least an emissive layer. The EL layer 233 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential , substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have layers containing (quality, etc.).

[0146] The EL layer 233 can use either low-molecular-weight compounds or high-molecular-weight compounds, and inorganic It may contain compounds. Each layer constituting the EL layer 233 is deposited by a vapor deposition method (vacuum deposition). It can be formed by methods such as (including) transfer, printing, inkjet, and coating. ru.

[0147] In the element layer 101, the light-emitting element is provided between a pair of insulating films with low water permeability. This is preferable. This prevents impurities such as water from entering the light-emitting element, and the light-emitting element This can suppress the decline in reliability of the device.

[0148] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include a film, a film containing nitrogen and aluminum such as an aluminum nitride film, etc. Further, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, etc. may be used.

[0149] For example, the water vapor transmission rate of an insulating film with low water permeability is 1×10 -5 [g / m 2 ·day] or less, preferably 1×10 -6 [g / m 2 ·day] or less, more preferably 1×10 -7 [g / m 2 ·day] or less, still more preferably 1×10 -8 [g / m 2 ·day] or less. .

[0150] The substrate 103 has light transmissivity and transmits at least the light emitted by the light-emitting element included in the element layer 101. The substrate 103 may have flexibility. Further, the refractive index of the substrate 103 is higher than the refractive index of the atmosphere.

[0151] Since an organic resin is lighter in weight than glass, using an organic resin as the substrate 103 can reduce the weight of the light-emitting device compared to using glass, which is preferable.

[0152] Examples of materials having flexibility and light transmissivity for visible light include, for example, glass having a thickness with a certain degree of flexibility, polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate ( PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES ) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, etc. In particular, it is preferable to use a material with a low coefficient of thermal expansion. Preferably, for example, polyamide-imide resin, polyimide resin, PET, etc. are used. This can be done. In addition, substrates made by impregnating glass fibers with organic resin, or by impregnating inorganic fillers with organic resin. It is also possible to use substrates that have been mixed to lower the coefficient of thermal expansion.

[0153] The substrate 103 has a layer made of the above material that protects the surface of the light-emitting device from scratches and other damage. A coating layer (for example, a silicon nitride layer) or a layer of material capable of distributing pressure (for example, A It may also be constructed by laminating with a laminate (such as a laminate resin layer). To suppress a decrease in the lifespan of the device, it may have the aforementioned insulating film with low water permeability.

[0154] The adhesive layer 105 is light-transmitting and allows at least the light emitted by the light-emitting element of the element layer 101 to pass through. It is permeable. Furthermore, the refractive index of the adhesive layer 105 is higher than that of the atmosphere.

[0155] The adhesive layer 105 contains resins that cure at room temperature, such as two-component mixed resins, photocurable resins, and thermocurable resins. Resins such as chemical resins can be used. For example, epoxy resin, acrylic resin, etc. Examples include ricone resin and phenolic resin. In particular, materials with low moisture permeability such as epoxy resin. The material is preferable.

[0156] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (oxidation This method uses substances that adsorb moisture through chemical adsorption, such as calcium or barium oxide. It is possible to absorb moisture through physical adsorption, such as with zeolite or silica gel. A desiccant may be used. If a desiccant is included, impurities such as moisture may invade the light-emitting element. This is preferable because it can suppress the ingress of harmful substances and improve the reliability of the light-emitting device.

[0157] Furthermore, by mixing a filler with a high refractive index (such as titanium dioxide) into the above resin, a light-emitting element is produced. This is preferable because it can improve the efficiency of light extraction from the child.

[0158] Furthermore, the adhesive layer 105 may have a scattering member that scatters light. For example, the adhesive layer For 105, a mixture of the above-mentioned resin and particles with a different refractive index from the above-mentioned resin can also be used. The particles function as light scattering members.

[0159] Preferably, the difference in refractive index between the resin and the particles with different refractive indices is 0.1 or more. A value of 0.3 or higher is more preferable. Specifically, the resins include epoxy resin and acrylic resin. Resins, imide resins, silicones, etc. can be used. Titanium dioxide can also be used as particles. Barium oxide, zeolite, etc., can be used.

[0160] Titanium dioxide and barium oxide particles are preferred because they have a strong light-scattering property. Using light, it is possible to adsorb water contained in resins, etc., thereby improving the reliability of the light-emitting element. It can be done.

[0161] In particular, inorganic insulating materials can be used for insulating layer 205 and insulating layer 255. Using a low-water-based insulating film is preferable because it allows for the realization of a highly reliable light-emitting panel.

[0162] The insulating layer 207 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 207 can be a silicon oxide film, a silicon oxide nitride film, a silicon nitride film, or a silicon film. Inorganic insulating films such as silicon oxide films and aluminum oxide films can be used.

[0163] The insulating layer 209, insulating layer 209a, and insulating layer 209b are, respectively, transistors. To reduce surface irregularities caused by various factors, it is preferable to select an insulating film that has a planarization function. For example, using organic materials such as polyimide, acrylic, and benzocyclobutene resins. This is possible. In addition to the above organic materials, low dielectric constant materials (low-k materials), etc., can also be used. This can be achieved. Furthermore, laminated structures using insulating films and inorganic insulating films formed from these materials can be created. That's good too.

[0164] The insulating layer 211 is provided covering the end of the lower electrode 231. In order to ensure good coverage of the formed EL layer 233 and upper electrode 235, an insulating layer 21 It is preferable that the side wall of 1 is an inclined surface formed with a continuous curvature.

[0165] As the material for the insulating layer 211, a resin or an inorganic insulating material can be used. Examples include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. A resin such as silicic acid or phenolic resin can be used. In particular, the insulating layer 211 is easy to produce. Therefore, it is preferable to use a negative-type or positive-type photosensitive resin. .

[0166] The method for forming the insulating layer 211 is not particularly limited, but may include photolithography, sputtering, Vapor deposition, droplet ejection (inkjet, etc.), printing methods (screen printing, offset printing) You can use (etc.) etc.

[0167] The insulating layer 217 can be formed using an inorganic insulating material or an organic insulating material, for example. For organic insulating materials, negative-type and positive-type photosensitive resins, non-photosensitive resins, etc., can be used. This can be done. Alternatively, a conductive layer may be formed instead of the insulating layer 217. For example, a metal material It can be formed using [a specific method]. Examples of metallic materials include titanium and aluminum. This is possible. A conductive layer is used instead of the insulating layer 217, and the conductive layer and the upper electrode 235 are electrically connected. By using a configuration that connects via air, the potential drop caused by the resistance of the upper electrode 235 can be suppressed. Furthermore, the insulating layer 217 may have a forward taper shape or a reverse taper shape.

[0168] Insulating layer 276, insulating layer 278, insulating layer 291, insulating layer 293, insulating layer 295 are, respectively They can be formed using inorganic or organic insulating materials. In particular, insulating layer 278 and insulating layer 295 This involves using an insulating layer with a planarization function to reduce surface irregularities caused by the sensor element. It is preferable.

[0169] The sealing layer 213 contains a resin that hardens at room temperature, such as a two-component mixed resin, a photocurable resin, and a thermocurable resin. Resins such as chemical resins can be used. For example, PVC (polyvinyl chloride). Resins, acrylic resins, polyimide resins, epoxy resins, silicone resins, PVB (polyimide resins) Nilbutyral resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 213 may contain a desiccant. Also, the light-emitting element may pass through the sealing layer 213. When light 230 is taken out of the light-emitting panel, a high refractive index filler is added to the sealing layer 213. - Preferably includes a desiccant or a scattering member. Examples include materials similar to those used in the adhesive layer 105.

[0170] Conductive layer 156, conductive layer 157, conductive layer 294, and conductive layer 296 are each transient It can be formed using the same material and process as the conductive layer constituting the star or light-emitting element. Layer 280 can be formed using the same material and process as the conductive layers that make up the transistor.

[0171] For example, the conductive layers mentioned above are molybdenum, titanium, chromium, tantalum, and tungsten, respectively. Metal materials such as aluminum, copper, neodymium, scandium, or compounds containing these elements. It can be formed using gold material, either as a single layer or in layers. Furthermore, the conductive layer is These may be formed using conductive metal oxides. Examples of conductive metal oxides include a(I) oxide. Dium (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, Zinc oxide (In2O3-ZnO, etc.) or these metal oxide materials with silicon oxide A product containing n can be used.

[0172] Furthermore, conductive layer 208, conductive layer 212, conductive layer 310a, and conductive layer 310b are also, respectively, It can be formed using the above-mentioned metal material, alloy material, or conductive metal oxide, etc.

[0173] The conductive layers 272 and 274, and the conductive layers 281 and 283 are light-transmitting. It is a conductive layer. For example, indium oxide, ITO, indium zinc oxide, zinc oxide. , zinc oxide with gallium added can be used. Also, conductive layer 270 is conductive layer 2 It can be formed using the same materials and process as 72.

[0174] The conductive particles 292 are particles such as organic resin or silica whose surface is coated with a metallic material. Use the following. Using nickel or gold as the metallic material is preferable because it can reduce contact resistance. Furthermore, particles coated with two or more metal materials in layers, such as nickel coated with gold. It is preferable to use [this].

[0175] The connector 215 is a paste or sheet made by mixing metal particles with a thermosetting resin. Materials exhibiting anisotropic conductivity through thermocompression bonding can be used. These are particles made of two or more metals in a layered structure, such as nickel particles coated with gold. It is preferable to use [this].

[0176] The colored layer 259 is a colored layer that transmits light in a specific wavelength band. For example, the red wavelength band A red (R) color filter that transmits light, and a green (G) filter that transmits light in the green wavelength range. Using color filters, such as a blue (B) color filter that transmits light in the blue wavelength range. Each colored layer can be created using various materials, printing methods, inkjet methods, and photo They are formed at the desired locations using etching methods such as lithography.

[0177] Furthermore, a light-shielding layer 257 is provided between adjacent colored layers 259. This blocks light from diffracting around adjacent light-emitting elements, suppressing color mixing between adjacent pixels. By positioning the edge of the colored layer 259 so as to overlap with the light-shielding layer 257, light leakage is suppressed. The light-shielding layer 257 can be made of a material that shields the light emitted from the light-emitting element. It can be formed using metal materials, resin materials containing pigments or dyes, etc. (See Figure 7) As shown in B), the light-shielding layer 257 is located in areas other than the light extraction section 104, such as the drive circuit section 106. Placing it in the region is preferable because it can suppress unintended light leakage caused by guided light, etc.

[0178] Furthermore, if an insulating layer 261 is provided to cover the colored layer 259 and the light-shielding layer 257, the colored layer 259 and the light-shielding layer will be provided. This is preferable because it suppresses the diffusion of impurities such as pigments contained in layer 257 into the light-emitting element, etc. The insulating layer 261 uses a light-transmitting material, and inorganic insulating materials or organic insulating materials can be used. Yes, it is possible. The aforementioned insulating film with low water permeability may be used for the insulating layer 261. If it is not needed, it does not need to be included.

[0179] <Example of manufacturing method> Next, we will illustrate the method for manufacturing a light-emitting panel using Figures 11 and 12. Here, we will present Specific Example 1. We will explain using the light-emitting panel with the configuration shown in (Figure 7(B)) as an example.

[0180] First, a release layer 303 is formed on the fabricated substrate 301, and an insulating layer 205 is formed on the release layer 303. Next, multiple transistors, conductive layer 157, insulating layer 207, insulating layer 205 are placed on the insulating layer 205. A layer 209, multiple light-emitting elements, and an insulating layer 211 are formed. Note that the conductive layer 157 is exposed. In this manner, insulating layers 211, 209, and 207 are open (Figure 11(A)). .

[0181] Furthermore, a release layer 307 is formed on the fabricated substrate 305, and an insulating layer 255 is formed on the release layer 307. Next, a light-shielding layer 257, a colored layer 259, and an insulating layer 261 are formed on the insulating layer 255. (Figure 11(B)).

[0182] The fabricated substrates 301 and 305 are a glass substrate, a quartz substrate, and a sapphire substrate, respectively. A substrate such as an earpiece, ceramic substrate, or metal substrate can be used.

[0183] Furthermore, the glass substrate can be, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as barium borosilicate glass can be used. The temperature of the subsequent heat treatment. If the temperature is high, it is advisable to use a material with a strain point of 730°C or higher. Note that barium oxide (B) By including a large amount of aO, more practical heat-resistant glass can be obtained. You can use things like S.

[0184] When a glass substrate is used for fabrication, a silicon oxide film and an oxide film are placed between the fabricated substrate and the release layer. When insulating films such as silicon nitride films, silicon nitride films, and silicon oxide nitride films are formed, glass This is preferable because it prevents contamination from the substrate.

[0185] The release layer 303 and the release layer 307 are tungsten, molybdenum, and titanium, respectively. Tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium , elements selected from palladium, osmium, iridium, and silicon, and compounds containing said elements It consists of a gold material or a compound material containing the element, and is a single layer or a laminated layer. The crystalline structure of the layer containing this material may be amorphous, microcrystalline, or polycrystalline.

[0186] The release layer can be formed by sputtering, plasma CVD, coating, printing, or other methods. The coating method includes spin coating, droplet dispensing, and dispensing.

[0187] If the delamination layer has a single-layer structure, it may consist of a tungsten layer, a molybdenum layer, or a mixture of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten oxide or acid. A layer containing nitride, a layer containing molybdenum oxide or nitride, or tungsten A layer containing an oxide or oxidized nitride of a mixture of molybdenum may be formed. A mixture of tungsten and molybdenum is equivalent to, for example, an alloy of tungsten and molybdenum. do.

[0188] Furthermore, the release layer has a laminated structure consisting of a tungsten-containing layer and a tungsten oxide-containing layer. When forming it, a layer containing tungsten is formed, and an insulating film made of oxide is formed on top of it. By forming this, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating film. The formation of this can be utilized. Alternatively, the surface of the tungsten-containing layer can be subjected to thermal oxidation treatment. , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, ozonated water and other highly oxidizing solvents A layer containing tungsten oxide may be formed by liquid treatment or other methods. Plasma treatment may also be performed. The processing and heat treatment can be performed using oxygen, nitrogen, nitrous oxide alone, or a mixture of these gases with other gases. This may be carried out under a gaseous atmosphere. The surface condition of the peeled layer is obtained by the plasma treatment or heat treatment described above. By changing this, it is possible to control the adhesion between the delamination layer and the insulating layer that is formed later. ru.

[0189] Each insulating layer is formed using methods such as sputtering, plasma CVD, coating, or printing. It is possible to achieve, for example, by plasma CVD, a film deposition temperature of 250°C to 400°C. By forming it as described below, a dense and extremely low-permeability membrane can be created.

[0190] Subsequently, the surface of the fabricated substrate 305 on which the colored layer 259 etc. is provided, or the light-emitting element of the fabricated substrate 301 A material that will form a sealing layer 213 is applied to the surface on which 230 etc. are provided, and the sealing layer 213 is used to seal the surface The fabricated substrates 301 and 305 are bonded together so that they face each other (Figure 11(C ))

[0191] Then, the fabricated substrate 301 is peeled off, and the exposed insulating layer 205 and the substrate 201 are bonded together with adhesive layer 203 They are bonded together using [a specific method]. Furthermore, the fabricated substrate 305 is peeled off, and the exposed insulating layer 255 and substrate 1 are bonded together. 03 is bonded using the adhesive layer 105. In Figure 12(A), the substrate 103 is bonded to the conductive layer 1 Although the configuration is designed so that it does not overlap with layer 57, the conductive layer 157 and the substrate 103 may overlap.

[0192] Furthermore, various methods can be used as appropriate for the peeling process. For example, as the peeling layer, If a layer containing a metal oxide film is formed on the side in contact with the abscission layer, the metal oxide film is crystallized. It weakens the material, allowing the peelable layer to be removed from the fabricated substrate. Furthermore, it provides a highly heat-resistant fabricated substrate. When an amorphous silicon film containing hydrogen is formed as a release layer between the plate and the layer to be released, the laser light By removing the amorphous silicon film by irradiation or etching, the peeled layer is removed from the fabricated substrate. It can be peeled off. Furthermore, the peeling layer includes a metal oxide film on the side in contact with the layer to be peeled off. This forms a metal oxide film, weakens it through crystallization, and further weakens a portion of the peeled layer with a solution or NF3 After being removed by etching with fluoride gases such as BrF3 and ClF3, the weakened gold It can be exfoliated in the oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as the exfoliation layer. Using a film containing hydrogen (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) The delamination layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained within the delamination layer as gases. A method may be used to promote the separation of the layer to be peeled from the substrate. The fabricated substrate is mechanically removed or removed using a solution or fluorine gas such as NF3, BrF3, or ClF3. Methods such as etching can be used for removal. In this case, it is not necessary to provide a stripping layer. stomach.

[0193] Furthermore, by combining multiple of the above peeling methods, the peeling process can be carried out more easily. In other words, irradiation with laser light, etching of the stripping layer with gas or solution, sharp knife or metal After mechanical removal using tools such as a squeegee to make the peeled layer and the layer to be peeled easier to separate, Detachment can also be performed using physical force (such as machinery).

[0194] Furthermore, even if the layer to be peeled off is removed from the fabricated substrate by permeating a liquid into the interface between the peeling layer and the layer to be peeled, That's fine. Additionally, you can apply a liquid such as water while peeling.

[0195] Other peeling methods include, if the peeling layer is formed with tungsten, using ammonia water and peroxide. It is preferable to perform the stripping process while etching the stripping layer with a mixed solution of hydrogen oxide water.

[0196] Furthermore, if peeling is possible at the interface between the fabricated substrate and the peel-off layer, a peel-off layer may not be necessary. For example, glass is used as the fabrication substrate, and polyimide, polyester, and poly are placed in contact with the glass. Forming organic resins such as olefins, polyamides, polycarbonates, and acrylics, and organic resins An insulating film or transistor is formed on top. In this case, by heating the organic resin, It can be peeled off at the interface between the manufactured substrate and the organic resin. Alternatively, a metal can be placed between the manufactured substrate and the organic resin. A layer is created, and by passing an electric current through the metal layer, the metal layer is heated, and the layer peels off at the interface between the metal layer and the organic resin. Detachment may be performed. The organic resin detached from the fabricated substrate may be used as the substrate for the light-emitting panel. This can be done. Alternatively, the organic resin and other substrates may be bonded together with an adhesive.

[0197] Finally, the insulating layer 255 and the sealing layer 213 are opened to expose the conductive layer 157. Figure 12(B)). Note that if the substrate 103 overlaps with the conductive layer 157, the conductive layer 157 To expose the substrate 103 and the adhesive layer 105 are also opened (Figure 12(C)). The methods are not particularly limited, for example, laser ablation, etching, ion beams A puttering method or similar can be used. Alternatively, a sharp blade or the like can be used on the film on the conductive layer 157. You can also make an incision and physically peel off a portion of the membrane.

[0198] Based on the above, a light-emitting panel can be manufactured.

[0199] As described above, the light-emitting panel of this embodiment comprises a substrate 103 and a substrate 201 or a substrate It consists of two circuit boards, 202 and . Furthermore, even in configurations that include a touch sensor, it is still 2 boards. It can be constructed using the following substrates. By minimizing the number of substrates, the light extraction efficiency can be improved. This makes it easier to improve the clarity of the top and display.

[0200] This embodiment can be combined with other embodiments as appropriate.

[0201] (Embodiment 3) In this embodiment, the light-emitting panel will be described using Figure 13.

[0202] The light-emitting panel shown in Figure 13 consists of a substrate 401, a transistor 240, a light-emitting element 230, and an insulating layer. 207, insulating layer 209, insulating layer 211, insulating layer 217, space 405, insulating layer 261, light shielding Layer 257, colored layer 259, photodetector (p-type semiconductor layer 271, i-type semiconductor layer 273, and n (Having a semiconductor layer 275), conductive layer 281, conductive layer 283, insulating layer 291, insulating layer 29 3. It has an insulating layer 295 and a substrate 403.

[0203] The light-emitting panel surrounds the light-emitting element 230 and the light-receiving element between substrates 401 and 403. It has an adhesive layer (not shown) arranged in a frame shape. The adhesive layer, substrate 401 and substrate The light-emitting element 230 is sealed by 403.

[0204] In the light-emitting panel of this embodiment, the substrate 403 is translucent. The light-emitting element 230 emits Light is released into the atmosphere via the colored layer 259, the substrate 403, etc.

[0205] The light-emitting panel of this embodiment is a touch-operable light-emitting panel. Specifically, it is a light-receiving panel. The element can be used to detect the proximity or contact of an object to be detected with the surface of the substrate 403.

[0206] Optical touch sensors are unaffected by scratches or other damage to the surface that the object being detected comes into contact with. Therefore, it is highly durable and desirable. In addition, optical touch sensors allow for non-contact sensing. It is possible, and even when applied to a display device, the image clarity will not be reduced, and it can be used on large light-emitting panels and displays. It also has advantages such as being applicable to devices.

[0207] When the optical touch sensor is located between the substrate 403 and the space 405, the light emission of the light-emitting element 230 It is preferable because it is less susceptible to interference and can improve the signal-to-noise ratio.

[0208] The light-shielding layer 257 is located on the substrate 401 side of the light-receiving element and overlaps with the light-receiving element. The layer 257 can suppress the light emitted by the light-emitting element 230 from irradiating the light-receiving element. .

[0209] There are no particular limitations on the materials used for substrates 401 and 403. Light is extracted from the light-emitting element. The substrate on the side is made of a material that transmits the light. For example, glass, quartz, ceramic, sapphire. Materials such as acrylic and organic resin can be used. The substrate on the side from which light is not extracted is light-transmitting. Since it does not need to have properties, in addition to the substrates listed above, metal materials and alloy materials can be used. Metal substrates can also be used. Furthermore, substrates 401 and 403 can be configured as described above. The substrate materials exemplified in the example can also be used.

[0210] The sealing method for the light-emitting panel is not limited; for example, it may be solid sealing or hollow sealing. For example, as a sealing material, glass materials such as glass frit, or two-component resins, etc. Resins such as room-temperature curing resins, photocurable resins, and thermosetting resins can be used. The space 405 may be filled with an inert gas such as nitrogen or argon, and the sealing layer It may also be filled with a resin similar to that of 213. In addition, the resin may contain the aforementioned desiccant and refractive index It may contain high levels of filler or scattering material.

[0211] This embodiment can be combined with other embodiments as appropriate. [Examples]

[0212] In this embodiment, a light-emitting device according to one aspect of the present invention was fabricated. The light-emitting device in this embodiment is folded into three parts. Tri-fold folding screen It could also be described as a display of type (Type).

[0213] The light-emitting panel of the light-emitting device fabricated in this embodiment is shown in Figures 18(A) and (B). The example light-emitting device has two differences in the size of substrates 103 and 201, and the colors of the images are different. This differs from Specific Example 1 (Figure 7(B)) described in Embodiment 2 in that it has an insulating layer 217 between the elements. Yes. For other details, please refer to the explanation in Specific Example 1, etc. The insulating layer 217 is explained in Specific Example 2, etc. You can refer to this.

[0214] The light-emitting panel was manufactured using the manufacturing method shown in Embodiment 2.

[0215] First, a release layer 303 is formed on the glass substrate 301, which is the fabrication substrate, and then a coating is applied to the release layer 303. A release layer was formed. Furthermore, a release layer 307 was formed on the glass substrate 305, which was the fabricated substrate. A layer to be peeled was formed on the peeling layer 307. Next, the fabricated substrate 301 and the fabricated substrate 305 were separated. The two fabricated substrates were bonded together so that the surfaces on which the respective peelable layers were formed faced each other. Each plate was peeled from its respective peelable layer, and a flexible substrate was bonded to each peelable layer. The materials for each layer are shown below.

[0216] The release layer 303 and the release layer 307 consist of a tungsten film and an oxidation on the tungsten film. A layered structure of tungsten films was formed.

[0217] The laminated structure that constitutes the release layer has low release properties immediately after film formation, but when heated, it releases the inorganic insulating film. The reaction occurs, changing the state of the interface between the exfoliation layer and the inorganic insulating film, which then leads to brittleness. By creating a starting point for delamination, it becomes possible to physically separate the material.

[0218] The layers to be peeled on the peeling layer 303 are the insulating layer 205, the transistor, and the light-emitting element 230. An organic EL element was formed. The layer to be peeled on the peeling layer 307 was an insulating layer 255. We also fabricated color filters (corresponding to colored layer 259), etc.

[0219] The insulating layer 205 and the insulating layer 255 are, respectively, silicon oxide nitride film and silicon nitride film. A layered structure including a film was used.

[0220] Transistors include CAAC-OS (C Axis Aligned Crystallographic). A transistor using ine oxide semiconductor was applied. Because CAAC-OS is not amorphous, it has fewer defect levels, improving transistor reliability. Furthermore, since CAAC-OS does not have grain boundaries, it can be used in flexible devices. The CAAC-OS film is less prone to cracking due to the stress caused when it is bent.

[0221] CAAC-OS refers to an oxide semiconductor with c-axis orientation approximately perpendicular to the film surface. Another crystalline structure for conductors is a nanoscale aggregate of microcrystals. It has been confirmed that a variety of structures exist, such as l(nc), which differ from amorphous and single crystal structures. CAAC has lower crystallinity than single crystals, but is more crystalline than amorphous or nc. It's expensive.

[0222] In this example, a channel etch type transistor using an In-Ga-Zn oxide is used. The transistor can be fabricated on a glass substrate using a process at temperatures below 500°C.

[0223] In methods of directly fabricating elements such as transistors on organic resins such as plastic substrates, The temperature during the manufacturing process must be lower than the heat resistance temperature of the organic resin. In this embodiment, Furthermore, the fabricated substrate is a glass substrate, and the release layer, which is an inorganic film, has high heat resistance, so glass It is possible to fabricate transistors at the same temperature as when fabricating transistors on a substrate. Therefore, the performance and reliability of the transistor can be easily ensured.

[0224] The light-emitting element 230 includes a fluorescent light-emitting unit having a light-emitting layer that emits blue light, and a green light-emitting unit. A phosphorescent light-emitting unit having a light-emitting layer that emits red light and a light-emitting layer that emits red light, and a tandem A type M organic EL element was used. The light-emitting element 230 has a top emission structure. As the lower electrode 231 of element 230, a titanium film is laminated on an aluminum film, and the titanium film An ITO film, which functions as an optical adjustment layer, was laminated on top. The thickness of the optical adjustment layer is determined by the color of each pixel. It was changed accordingly. By combining the color filter and the microcavity structure, this The light-emitting panel fabricated in this example can produce light with high color purity. Substrate 10 3 and the substrate 201 were made of a flexible organic resin film with a thickness of 20 μm.

[0225] The fabricated light-emitting panel has a diagonal size of 5.9 inches for the light-emitting area (pixel area) and 720 pixels. 1280x3 (RGB), pixel pitch 0.102mm x 0.102mm, resolution 2 The image quality was set to 49 ppi and the aperture ratio to 45.2%. The scan driver is built-in, and the source driver is also built-in. The battery was attached externally using COF (Chip On Film).

[0226] Figure 19 shows a display photograph of the light-emitting device fabricated in this embodiment. Figure 19(A) shows the light-emitting device in a deployed state. In the open state, Figures 19(B) and (C) show the transformation from the unfolded state to the folded state of the light-emitting device. Figure 19(D) shows the state during the transformation process, with the light-emitting device folded. This is a photograph. The radius of curvature of the bent part was set to 4 mm. The light-emitting device in this embodiment is shown in the picture. Even when folded while displaying an image, no problems occurred with the display or operation. The device uses sensors to detect whether it is unfolded or folded, and displays different images depending on the state. It has the function of displaying the area of ​​the light-emitting panel that becomes invisible when folded. It also has a function to conserve power by temporarily suspending operation.

[0227] Here, if the light-emitting panel is completely fixed by a pair of protective layers or a pair of support panels, When bending the light device, the light-emitting panel may be pulled and damaged. When deploying the light-emitting device, a force is applied in the direction that causes the light-emitting panel to contract, which can damage the panel. There is a risk. The light-emitting device fabricated in this embodiment uses a pair of protective layers and a pair of support panels to emit light. The panel is not completely fixed. Therefore, when folding or unfolding the light-emitting device... As the light-emitting panel slides, the light-emitting panel is directed towards a pair of protective layers and a pair of support panels. The position of the panel changes. As a result, force is applied to the light-emitting panel, which can cause it to break. This can suppress it.

[0228] Figures 20(A) to (C) show a light-emitting device according to one embodiment of the present invention. Here, the light-emitting panel 11 If it is not fixed by a pair of support panels 15a(1) and support panel 15b(1) As shown, the light-emitting panel 11 is supported by a pair of support panels 15a(2) and support panel 15b(2). It is fixed or fixed by a pair of support panels 15a(3) and support panel 15b(3) They are either attached or fixed together. One embodiment of the present invention is a light-emitting device comprising a plurality of pairs of support panels It has a support panel, but it is sufficient if at least one pair of support panels fixes the light-emitting panel in place.

[0229] In the unfolded light-emitting device shown in Figure 20(A), the light-emitting panel on the dashed line M1-N1 The display of Ru11 shows the transition from the unfolded state to the folded state as shown in Figure 20(B). In the state of the light-emitting device, it moves along the dashed line M2-N2. Furthermore, as shown in Figure 20(C) In the folded state of the light-emitting device, the display moves along the dashed line M3-N3. In one embodiment of the present invention, a light-emitting device is provided with a pair of protective layers and a pair of support panels, and the light-emitting panel Because it is not completely fixed, when folding or unfolding the light-emitting device, the light-emitting panel It slides. This causes the position of the light-emitting panel relative to a pair of protective layers and a pair of support panels. The position changes. Therefore, force is applied to the light-emitting panel, and damage to the light-emitting panel is suppressed. Cut. [Explanation of Symbols]

[0230] 11 Light-emitting panels 11a Emitting region 11b Non-emitting region 13 Protective layer 13a Protective layer 13b Protective layer 15 Support Panel 15a Support panel 15b Support Panel 101 Element Layer 103 circuit board 104 Light extraction section 105 Adhesive layer 106 Drive circuit section 108 FPC 108a FPC 108b FPC 156 Conductive layer 157 Conductive layer 201 circuit board 202 circuit boards 203 Adhesive layer 205 Insulating layer 207 Insulating layer 208 Conductive layer 209 Insulating layer 209a Insulating layer 209b Insulating layer 211 Insulating layer 212 Conductive layer 213 Sealing layer 215 Connectors 215a Connector 215b Connector 217 Insulating layer 230 light-emitting elements 231 Lower electrode 233 EL layer 235 Upper electrode 240 transistors 255 Insulating layer 257 Light blocking layer 259 Colored layer 261 Insulating layer 270 Conductive layer 271 p-type semiconductor layer 272 Conductive layer 273 i-type semiconductor layer 274 Conductive layer 275 n-type semiconductor layer 276 Insulating layer 278 Insulating layer 280 Conductive layer 281 Conductive layer 283 Conductive layer 291 Insulating layer 292 Conductive particles 293 Insulating layer 294 Conductive layer 295 Insulating layer 296 Conductive layer 301 Fabricated substrate 303 Exfoliation layer 305 Fabricated substrate 307 Delamination layer 310a conductive layer 310b conductive layer 401 circuit board 403 circuit board 405 Space

Claims

[Claim 1] A light-emitting device having alternating strip-shaped highly flexible regions and strip-shaped less flexible regions in a first direction, The aforementioned highly flexible region has a flexible light-emitting panel. The light-emitting device comprises a support panel having less flexibility than the light-emitting panel, and the light-emitting panel, stacked together in the region with low flexibility.

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