Monitoring design support device, monitoring design support method, and program

Abstract

This invention provides a monitoring design support device, a monitoring design support method, and a program that enable efficient monitoring of structures. [Solution] A monitoring design support device equipped with a processor that supports the monitoring design of a structure, wherein the processor performs a structural information acquisition process to acquire structural information of a target structure; a monitoring candidate location determination process to determine monitoring candidate locations where damage is likely to occur based on the structural information of the target structure; a damage information acquisition process to acquire damage information of the target structure, including information on the location and extent of damage in the target structure; a monitoring location determination process to determine a monitoring location from among the monitoring candidate locations based on the extent of damage included in the damage information of the target structure corresponding to the monitoring candidate locations; and an output process to output the monitoring locations.

Description

Technical Field

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[0001] The present invention relates to a monitoring design support device, a monitoring design support method, and a program.

Background Art

[0002] As social infrastructure, there are structures such as bridges and tunnels. Since damage occurs to these structures and the damage has the property of progressing, it is required to regularly inspect them.

[0003] Therefore, Patent Document 1 discloses creating a first inspection plan for a structure based on deterioration estimation, and after performing an inspection based on the first inspection plan, implementing a more detailed second inspection plan based on the results of the inspection items and inspection criteria of the first inspection plan.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in the inspection of structures such as bridges, monitoring technology for monitoring the progress of deterioration by sensors or the like is applied. By installing a large number of various sensors and acquiring all data, the progress of deterioration can be surely grasped. On the other hand, in monitoring, there has been a problem that a great deal of cost is required for the installation and operation of a large number of sensors, as well as the accumulation and analysis of data.

[0006] <00​​​

[0007] The first embodiment of the monitoring design support device is a monitoring design support device equipped with a processor that supports the monitoring design of a structure, wherein the processor performs a structural information acquisition process to acquire structural information of a target structure; a monitoring candidate location determination process to determine monitoring candidate locations where damage is likely to occur based on the structural information of the target structure; a damage information acquisition process to acquire damage information of the target structure, including information on the location and extent of damage in the target structure; a monitoring location determination process to determine a monitoring location from among the monitoring candidate locations based on the extent of damage included in the damage information of the target structure corresponding to the monitoring candidate locations; and an output process to output the monitoring locations.

[0008] In the second form of the monitoring design support device, a first database is further provided which maintains the correspondence between structural information of a representative structure and representative monitoring candidate locations. The monitoring candidate location determination process obtains information from the first database on representative monitoring candidate locations that have a correspondence with a representative structure identical or similar to the target structure, based on the structural information of the target structure and the structural information of the representative structure, and determines the monitoring candidate locations.

[0009] In the third embodiment of the monitoring design support device, a second database is further provided which maintains the correspondence between structural information of a reference structure and damage information of the reference structure. The processor performs a similar structure extraction process to extract reference structures similar to the target structure from the second database based on the structural information of the target structure and the structural information of the reference structure. The monitoring candidate location determination process determines the monitoring candidate locations based on the extracted structural information of the reference structure and the corresponding damage information.

[0010] In the fourth form of the monitoring design support device, the second database holds other information about the reference structure, and the similar structure extraction process extracts reference structures similar to the target structure from the second database based on the structural information of the target structure, the structural information of the reference structure, other information about the target structure, and other information about the reference structure.

[0011] In the fifth form of the monitoring design support device, the processor performs a simulation process to simulate deterioration factors based on the structural information of the target structure, and performs a monitoring candidate location determination process based on the simulation results.

[0012] In the sixth embodiment of the monitoring design support device, the damage information acquisition process acquires information regarding the degree of damage based on an image associated with a location on the target structure and the degree of damage determined from the image.

[0013] In the seventh embodiment of the monitoring design support device, the damage information acquisition process acquires information regarding the degree of damage based on the degree of damage determined from images of at least two different time periods associated with the location on the target structure.

[0014] In the eighth form of the monitoring design support device, the monitoring location determination process determines a monitoring location as a monitoring location if the damaged location is within a predetermined distance from the candidate monitoring location and the degree of damage is included in the settings.

[0015] In the ninth form of the monitoring design support device, the monitoring location determination process determines a monitoring candidate location located on the same component as the monitoring candidate location as the monitoring location.

[0016] In the tenth form of the monitoring design support device, the processor accepts edits to the monitoring location and executes an editing process to change the monitoring location.

[0017] In the 11th form of the monitoring and design support device, the editing process accepts edits on a 3D model, 2D drawing, or list displayed on a display device.

[0018] In the twelfth embodiment of the monitoring design support device, a third database is further provided which holds information related to sensors that can monitor a monitoring location, and the processor performs a sensor determination process which determines which sensor to apply from the third database based on damage information of the monitoring location.

[0019] The 13th form of the monitoring design support method is a monitoring design support method in which a computer supports the monitoring design of a structure, and the processor performs the following steps: a structural information acquisition step of acquiring structural information of a target structure; a monitoring candidate location determination step of determining monitoring candidate locations where damage is likely to occur based on the structural information of the target structure; a damage information acquisition step of acquiring damage information of the target structure, including information on the location and extent of damage in the target structure; a monitoring location determination step of determining monitoring locations from among the monitoring candidate locations based on the extent of damage included in the damage information of the target structure corresponding to the monitoring candidate locations; and an output step of outputting the monitoring locations.

[0020] The 14th form of the program is a program that supports the monitoring design of a structure, and enables the computer to implement the following functions: a function to acquire structural information of the target structure; a function to determine potential monitoring locations where damage is likely to occur based on the structural information of the target structure; a function to acquire damage information of the target structure, including information on the location and extent of damage in the target structure; a function to determine monitoring locations from among the potential monitoring locations based on the extent of damage included in the damage information of the target structure corresponding to the potential monitoring locations; and a function to output the monitoring locations. [Effects of the Invention]

[0021] According to the monitoring design support device, monitoring design support method, and program for a structure of the present invention, efficient monitoring of a structure is enabled.

Brief Description of the Drawings

[0022] [Figure 1] FIG. 1 is a block diagram showing an example of the hardware configuration of a monitoring design support device for a structure. [Figure 2] FIG. 2 is a block diagram showing the processing functions realized by a CPU. [Figure 3] FIG. 3 is a diagram showing information stored in a storage unit and the like. [Figure 4] FIG. 4 is a flowchart showing a monitoring design support method using a monitoring design support device for a structure. [Figure 5] FIG. 5 is a diagram showing an example of the structural information of a target structure. [Figure 6] FIG. 6 is a block diagram for explaining a first aspect of a monitoring candidate location determination step. [Figure 7] FIG. 7 is a block diagram for explaining a second aspect of a monitoring candidate location determination step. [Figure 8] FIG. 8 is a diagram showing an example of a method for extracting similar structures. [Figure 9] FIG. 9 is a diagram showing an example of the damage information of a target structure. [Figure 10] FIG. 10 is a diagram for explaining the association between the structural information and damage information of a target structure. [Figure 11] FIG. 11 is a flowchart showing a monitoring location determination step. [Figure 12] FIG. 12 is a diagram showing an example of an output to a display device. [Figure 13] FIG. 13 is a block diagram showing additional processing functions realized by a CPU. [Figure 14] FIG. 14 is a diagram showing an example of an editing process. [Figure 15]Figure 15 is a block diagram for executing the sensor determination process. [Modes for carrying out the invention]

[0023] Preferred embodiments of the structural monitoring and design support device, structural monitoring and design support method, and program according to the present invention will be described below with reference to the attached drawings. Here, "structure" includes buildings, such as civil engineering structures like bridges, tunnels, and dams, and also encompasses other building structures such as buildings, houses, and building walls, columns, and beams.

[0024] [Hardware configuration of a structural monitoring and design support system] Figure 1 is a block diagram showing an example of the hardware configuration of a structural monitoring and design support device according to the present invention.

[0025] As shown in Figure 1, a computer or workstation can be used as the structural monitoring and design support device 10. In this example, the structural monitoring and design support device 10 mainly consists of an input / output interface 12, a storage unit 16, an operation unit 18, a CPU (Central Processing Unit) 20, a RAM (Random Access Memory) 22, a ROM (Read Only Memory) 24, and a display control unit 26. A display device 30, which constitutes a display, is connected to the structural monitoring and design support device 10, and under the command of the CPU 20, the display control unit 26 controls the display on the display device 30. The display device 30 is, for example, a monitor.

[0026] The input / output interface 12 can input various types of data (information) to the structural monitoring and design support device 10. For example, data stored in the memory unit 16 is input via the input / output interface 12.

[0027] The CPU (processor) 20 reads various programs, including the structural inspection support program of the embodiment, stored in the memory unit 16 or ROM 24, and loads them into the RAM 22 to perform calculations, thereby providing overall control of each unit. The CPU 20 also reads programs stored in the memory unit 16 or ROM 24, uses the RAM 22 to perform calculations, and performs various processes for the structural monitoring and design support device 10.

[0028] Figure 2 is a block diagram showing the processing functions implemented by the CPU. As shown in Figure 2, the CPU 20 includes a structural information acquisition processing unit 51, a monitoring candidate location determination processing unit 53, a damage information acquisition processing unit 55, a monitoring location determination processing unit 57, an output processing unit 59, and the like. The specific processing functions of each part will be explained later. The structural information acquisition processing unit 51, the monitoring candidate location determination processing unit 53, the damage information acquisition processing unit 55, the monitoring location determination processing unit 57, and the output processing unit 59 are all parts of the CPU 20, and the CPU 20 can execute the processing of each part.

[0029] Returning to Figure 1, the memory unit 16 is a memory composed of a hard disk drive, flash memory, etc. The memory unit 16 stores data and programs that operate the structural monitoring and design support device 10, such as the operating system and programs that execute the structural monitoring and design support method. The memory unit 16 also stores information used in the embodiments described below.

[0030] Figure 3 shows the information stored in the storage unit 16. The storage unit 16 consists of a non-temporary recording medium such as a CD (Compact Disk), DVD (Digital Versatile Disk), hard disk (Hard Disk), and various semiconductor memories, as well as a control unit for the recording medium.

[0031] The memory unit 16 primarily stores structural information 101 of the target structure, corresponding images 103 associated with the location on the structure, and so on.

[0032] The structural information 101 of the target structure includes a 3D model of the target structure (including information such as member area, member name, and material), a 2D drawing, a panoramic composite image, or information such as the structural type name, member name, and material name. The 3D model can be created, for example, based on multiple captured images. It can also be used in conjunction with the corresponding image 103 described later. Information such as member area, member name, and material may be specified for each member area, member name, and material on the 3D model. The member area and member name may be automatically specified for the 3D model based on information such as the shape and dimensions of the member. Alternatively, the member area and member name may be specified for the 3D model based on user operation. The 2D drawing includes, for example, an overall view, a general view, a structural view, and a damage view (per member unit such as a deck slab or bridge pier). The panoramic composite image is an image (per member unit such as a deck slab or bridge pier) synthesized from captured images. The structural information 101 of the target structure may consist of only one of these pieces of information, or it may contain multiple pieces of information.

[0033] The corresponding image 103 is an image of the target structure, which is, for example, an image associated with a location on the target structure based on the structural information 101 of the target structure. The corresponding image 103 may include images from at least two different time periods associated with a location on the target structure.

[0034] The control unit 18 shown in Figure 1 includes a keyboard and mouse, allowing the user to perform necessary processing on the monitoring design support device 10 via these devices. By using a touch panel type device, the display device 30 and the control unit 18 can be combined.

[0035] The display device 30, in accordance with the instructions of the CUP 20, is, for example, a liquid crystal display and can output structural information 101 of the target structure, corresponding images 103, and monitoring locations.

[0036] Figure 4 is a flowchart illustrating a method for supporting the monitoring design of a structure using a structural monitoring design support device.

[0037] <Steps to obtain structural information> The structural information acquisition step (step S1) acquires structural information 101 of the target structure to be monitored and designed. The structural information acquisition processing unit 51 of the CPU 20 acquires the structural information 101 of the target structure stored in the storage unit 16. The structural information 101 of the target structure includes, as described above, a 3D model of the target structure (including information such as member area, member name, and material), a 2D drawing, a panoramic composite image, or information such as structural type name, member name, and material name.

[0038] If the structural information 101 of the target structure is not stored in the storage unit 16, the structural information 101 of the target structure may be obtained from another storage unit via the network through the input / output interface 12. As described above, the CPU 20 functions as the structural information acquisition processing unit 51.

[0039] Figure 5 shows a 3D model 101A and a 2D drawing 101B, which are examples of structural information 101 for a target structure. The 3D model 101A included in the structural information 101 for the target structure can be displayed as a point cloud, polygon (mesh), or solid model. The 3D model 101A in Figure 5 is a figure in which a captured image (texture) of the structure has been texture-mapped onto a polygonal polygon.

[0040] In the example shown in Figure 5, the 3D model 101A may include member names and member regions. The 3D model 101A is composed of, for example, a deck slab 131, a pier 133, and an abutment 135.

[0041] The method for creating the 3D model 101A is not limited. Various models exist, and for example, the 3D model 101A can be created using the Structure from Motion (SfM) method. SfM is a method for reconstructing 3D shapes from multi-view images. For example, feature points are calculated using algorithms such as Scale-Invariant Feature Transform (SIFT), and the 3D position of the point cloud is calculated using the principle of triangulation, with these feature points as clues. Specifically, straight lines are drawn from the camera to the feature points using the principle of triangulation, and the intersection of the two lines passing through the corresponding feature points becomes the reconstructed 3D point. By performing this operation for each detected feature point, the 3D position of the point cloud can be obtained.

[0042] Although SfM does not calculate size, it is possible to establish a correspondence with the actual scale by, for example, placing a scaler with known dimensions on the subject and taking a photograph.

[0043] Two-dimensional drawing 101B is a two-dimensional representation of information including a schematic diagram of the entire bridge, general drawings such as plan views, side views, and cross-sectional views, and structural drawings. Basic specifications are also included. Two-dimensional drawing 101B may utilize drawings that have already been created (such as CAD data).

[0044] The structural information 101 of the target structure may include the type of structure (in the case of a bridge: girder bridge, rigid frame bridge, truss bridge, arch bridge, cable-stayed bridge, suspension bridge), materials (steel, weathering steel, reinforced concrete, PC (prestressed concrete)), size (length, width, height, etc.), etc.

[0045] Furthermore, the structural information 101 of the target structure may also include other information, including environmental information, which will be described later.

[0046] <Steps for determining potential monitoring locations> As shown in Figure 4, the monitoring candidate location determination step (step S2) determines monitoring candidate locations that are prone to damage based on the structural information of the target structure. The monitoring candidate location determination processing unit 53 of the CPU 20 determines monitoring candidate locations that are prone to damage based on the structural information of the target structure.

[0047] Next, we will show some examples of preferred processing in the monitoring candidate location determination step (step S2).

[0048] (First aspect) In the first aspect of the monitoring candidate location determination step (step S2), data of monitoring candidate locations that have the same or similar structure as the structure to be monitored and have a corresponding relationship with the structure to be monitored and designed is obtained from a first database that maintains the correspondence between the structure and members and the monitoring candidate locations (locations where damage is likely to occur), and the monitoring candidate location determination process is executed.

[0049] Figure 6 is a block diagram illustrating the first aspect of the monitoring candidate location determination step (step S2).

[0050] As shown in Figure 6, the first database 60 stores the correspondence between structural information 140 of a representative structure and representative monitoring candidate locations 142.

[0051] The structural information 140 for the representative structure is, for example, a concrete bridge described in the Ministry of Land, Infrastructure, Transport and Tourism's "Guidelines for Periodic Inspection of Bridges" (March 2019). Examples of points of focus that need to be paid particular attention to when conducting periodic inspections of concrete bridges are described. These points of focus correspond to the representative monitoring candidate points 142. Examples of points of focus that become representative monitoring candidate points 142 include (1) end supports, (2) intermediate supports, (3) the center of the span, (4) the quarter of the span, (5) construction joints, (6) segment joints, (7) anchorage points, and (8) notches. The first database 60 maintains the correspondence between the concrete bridge, which is the structural information 140 for the representative structure, and the points of focus that are the representative monitoring candidate points 142.

[0052] Furthermore, structural information 140 for another representative structure is, for example, a road tunnel in the Ministry of Land, Infrastructure, Transport and Tourism's "Guidelines for Periodic Inspection of Road Tunnels" (March 2019). Examples of points of interest where similar deformations occur depending on the construction method of the road tunnel are described. The points of interest correspond to representative monitoring candidate points 142. Examples of points of interest that become representative monitoring candidate points 142 include (1) joints and construction joints of the lining, (2) the vicinity of the top of the lining, and (3) the vicinity of the middle of the lining span. In the first database 60, the correspondence between the road tunnel, which is the structural information 140 for the representative structure, and the points of interest that are representative monitoring candidate points 142 is maintained.

[0053] The monitoring candidate location determination processing unit 53 detects representative structures that are identical or similar to the target structure based on the structural information 101 of the target structure and the structural information 140 of the representative structure. Then, the monitoring candidate location determination processing unit 53 obtains information on representative monitoring candidate locations 142 that have a corresponding relationship with the structural information 140 of the representative structure from the first database 60 and determines the representative monitoring candidate locations 142 as monitoring candidate locations for the target structure. The monitoring candidate location determination processing unit 53 can determine multiple monitoring candidate locations.

[0054] (Second aspect) In the second aspect of the monitoring candidate location determination step (step S2), similar structures with structures similar to the structure to be monitored are extracted from a second database that maintains the correspondence between the structures of various reference structures and damage information (location, area, size, degree, progression, etc.), and the monitoring candidate location determination process is executed based on the data of the correspondence between the structures and damage information of the similar structures.

[0055] Figure 7 is a block diagram illustrating the second aspect of the monitoring candidate location determination step (step S2).

[0056] As shown in Figure 7, the second database 61 stores the correspondence between the structural information 144 of the reference structure and the damage information 146 of the reference structure.

[0057] The monitoring candidate location determination processing unit 53 further includes a similar structure extraction processing unit 53A. Based on the structural information 101 of the target structure and the structural information 144 of the reference structure, the similar structure extraction processing unit 53A extracts reference structures similar to the target structure from the second database 61.

[0058] The monitoring candidate location determination processing unit 53 determines monitoring locations based on the structural information 144 of the extracted reference structure and the corresponding damage information 146. For example, the monitoring candidate location determination processing unit 53 can determine predetermined locations where damage has actually progressed in similar structures as monitoring candidate locations. When determining predetermined locations, the number may be limited, for example, to 10 locations.

[0059] The similar structure extraction processing unit 53A can determine the degree of similarity between the structural information 101 of the target structure and the structural information 144 of the reference structure based on the structural information and extract them. The monitoring candidate location determination processing unit 53 can determine multiple monitoring candidate locations.

[0060] Structural information includes, for example, the type of structure (for bridges: girder bridge, rigid frame bridge, truss bridge, arch bridge, cable-stayed bridge, suspension bridge), the type of member (for bridges: deck, pier, abutment, girder, etc.), the material (steel, reinforced concrete, PC (Prestressed Concrete), etc.), and the size (length, width, height, etc.).

[0061] In addition to the structural information mentioned above, similarity can be determined and extracted based on one or more of the following other pieces of information.

[0062] (Other information) Environmental information may include traffic volume (per day, per month, per year, cumulative, etc.), location (distance from the sea, river bridges / overpasses / railway bridges, etc.), climate (average temperature, average humidity, rainfall, snowfall, etc.), construction conditions, age (years elapsed since completion date / commencement date, etc.), repair history, disaster history (earthquakes, typhoons, floods, etc.).

[0063] Figure 8 shows an example of a method for extracting similar structures by the similar structure extraction processing unit 53A.

[0064] In Figure 8, the structural information 144 of the reference structure stored in the second database 61 and the structural information 101 of the target structure are plotted in the feature space defined by feature vector A and feature vector B.

[0065] In Figure 8, the structural information 144 of the reference structure stored in the second database 61 is indicated by an "x," and the structural information 101 of the target structure is indicated by a "●." Feature vector A represents the bridge length (m), and feature vector B represents the number of years since the structure entered service. While the feature space represented by the feature vectors can be a multidimensional space consisting of three or more feature vectors, Figure 8 shows it as a two-dimensional space consisting of two feature vectors for simplicity.

[0066] The similar structure extraction processing unit 53A calculates the distance between the feature vector of the structure being monitored and designed (first feature vector), indicated by a ●, and the feature vector of the structure information in the second database 61 (second feature vector), indicated by an ×, in the feature space shown in Figure 8. Structures indicated by an × where this distance is below a threshold (within the dotted circle in Figure 8) are extracted as similar structures. This threshold can be optimized using statistical methods.

[0067] Furthermore, the distance may be either the distance between the first and second feature vectors without weighting (Euclidean distance) or the distance between them with weighting (Mahalanobis distance). The assignment of weights to each parameter may be determined using statistical methods such as principal component analysis.

[0068] In addition to the above criteria, you can also specify additional search conditions as points or ranges in the feature space. For example, if you specify bridges completed on or after January 1, 1990, or girder bridges as the basic structure, you can extract similar structures within the specified range.

[0069] In addition to the above, information contained in environmental data can be set as axes in the feature space to extract similar structures.

[0070] Furthermore, methods other than those that determine similarity based on distance in the feature space may be used for extracting similar structures. For example, AI (Artificial Intelligence) that determines similarity from images, or AI that determines similarity by combining images with the various types of information mentioned above, may be used for extraction.

[0071] (Third aspect) In the third aspect of the monitoring candidate location determination step (step S2), deterioration factors are simulated based on the structural information 101 of the target structure to be monitored, and predetermined locations are determined as monitoring candidate locations, starting with those with the greatest impact from the deterioration factors. When determining the predetermined locations, the number may be limited, for example, to 10 locations.

[0072] The monitoring candidate location determination processing unit 53 may include a simulation processing unit (not shown) that performs simulations of stress distribution using methods such as the finite element method, and simulations of airborne salt deposition using fluid analysis that takes into account the effects of wind, etc.

[0073] <Steps to acquire damage information> As shown in Figure 4, the damage information acquisition step (step S3) acquires damage information of the target structure, including information on the location and extent of damage to the target structure.

[0074] The damage information acquisition processing unit 55 of the CPU 20 acquires damage information of the target structure, including information on the location and extent of damage to the target structure.

[0075] The damage information acquisition processing unit 55 acquires the corresponding image 103 from the storage unit 16. The damage information acquisition processing unit 55 has a determination processing unit (not shown) that determines the degree of damage (for example, damage size (width, length, area, depth, etc.), damage rank, countermeasure classification, soundness, etc.) from the corresponding image 103, and can acquire damage information of the target structure, including information on the degree of damage, from the corresponding image 103 and the determination processing unit.

[0076] The damage information acquisition processing unit 55 of the CPU 20 acquires corresponding images 103 from the storage unit 16 for at least two different time periods. The damage information acquisition processing unit 55 has a determination processing unit (not shown) that determines the progression of damage (such as the progression of damage size and the progression of damage rank) from the corresponding images 103 from at least two different time periods, and can acquire damage information of the target structure, including information on the degree of damage, from the corresponding images 103 and the determination processing unit. Since the corresponding images 103 are from at least two different time periods, it is possible to acquire corresponding images 103 from three or more time periods (for example, time period 1, time period 2, time period 3, etc.). For example, it is possible to calculate the average of the progression between time period 1 and time period 2 and the progression between time period 2 and time period 3 from the corresponding images 103.

[0077] The damage information acquisition processing unit 55 can automatically acquire damage information of the target structure by using image analysis, etc. The user can edit the acquired damage information of the target structure.

[0078] Figure 9 shows an example of damage information for a target structure. The damage information 105 for the target structure shown in Figure 9 includes the member (location of damage), type of damage, dimensions of damage, extent of damage, and changes over time. The damage information 105 only needs to include at least one of the following: location of damage, type of damage, and extent of damage to the target structure. In addition to the damage information shown in Figure 9, the damage information 105 may also include, for example, the cause of damage.

[0079] Figure 10 is a diagram illustrating the correspondence between structural information and damage information of the target structure. Figure 10 shows a 3D model 101A, which is one of the structural information 101 of the target structure. Any part of the 3D model 101A can be partially enlarged as shown by the arrows. The enlarged 3D model 101A is associated with each piece of information. The enlarged 3D model 101A is associated with the 2D drawing 101B. The 3D model 101A and the 2D drawing 101B are also associated with a panoramic composite image. The 3D model 101A is associated with the corresponding image 103A that was actually taken. Images corresponding to any part can be referenced, not just images of damaged areas. The 3D model 101A is associated with the corresponding image 103B, which also holds damage information 105 (not shown). Damage information 105 may include the type, extent, size, progression, and cause of damage. The 2D drawing 101B is associated with the corresponding image 103B. The user can display the aforementioned correspondence on the display device 30 or the like. Furthermore, the user can edit this information as needed.

[0080] <Steps to determine monitoring locations> As shown in Figure 4, the monitoring location determination step (step S4) determines the monitoring locations from among the candidate monitoring locations based on the degree of damage included in the damage information of the target structure corresponding to the candidate monitoring locations.

[0081] The monitoring location determination processing unit 57 of the CPU 20 determines a monitoring location from among the candidate monitoring locations based on the degree of damage included in the damage information of the target structure corresponding to the candidate monitoring location.

[0082] Next, we will explain the preferred processing in the monitoring location determination step (step S4).

[0083] In the monitoring location determination step (step S4), a monitoring location determination process is executed to determine a monitoring location if the damage location is within a predetermined distance from the candidate monitoring location and the degree of damage falls within the specified range.

[0084] Figure 11 is a flowchart illustrating the monitoring location determination step. As shown in Figure 11, the monitoring location determination processing unit 57 acquires the monitoring candidate locations determined in the monitoring candidate location determination step (step S2) (step S41).

[0085] Next, the monitoring location determination processing unit 57 acquires the damage information of the target structure obtained in the damage information acquisition step (step S3) (step S42).

[0086] Next, the monitoring location determination processing unit 57 determines whether the damage to the target structure is within a predetermined distance from the candidate monitoring location (step S43). In step S43, the conditions for determination may be that the damage to the target structure is within a predetermined distance from the candidate monitoring location and is on the same member as the candidate monitoring location.

[0087] If the damage is within a predetermined distance from the candidate monitoring location (if YES in step S43), the monitoring location determination processing unit 57 determines whether the extent of the damage to the target structure is included in the setting.

[0088] Here, "settings" refer to criteria that the user can freely define. For example, settings could include selecting a few locations (e.g., 10 locations, 20 locations, etc.) that are most severely damaged or have the fastest progression. Alternatively, settings could include a threshold for the degree of damage (e.g., damage rank is on a five-point scale a, b, c, d, e, where d or higher, a being no damage, and e being the most severely damaged). The progression rate may be determined from the change in damage length per year, the change in damage width per year, or the change in damage area per year, etc. It is also possible to set criteria that comprehensively determine the severity of damage and the progression of damage.

[0089] Furthermore, if a third database 63 (see Figure 15) is provided that holds information related to sensors capable of monitoring the monitoring locations described later, the settings can be configured to prioritize those with the most severe damage (or those with the fastest progression) within the budget.

[0090] If the degree of damage is included in the setting (if YES in step S44), the monitoring location determination processing unit 57 determines the monitoring candidate location as a monitoring location (step S45).

[0091] Next, the process proceeds to determine if all potential monitoring locations have been checked (step S46). Similarly, if the answer is NO in steps S43 and S44, the process also proceeds to determine if all potential monitoring locations have been checked (step S46).

[0092] If the answer in step S46 is NO, the process proceeds to obtain the next candidate monitoring location information (step S47), then returns to step S43, and steps S43 through S46 are repeated until the answer in step S46 is YES. If the answer in step S46 is YES, the monitoring location determination step (step S4) is terminated.

[0093] <Monitoring Location Output Step> As shown in Figure 4, the monitoring location output step (step S5) outputs the determined monitoring locations.

[0094] The output processing unit 59 of the CPU 20 outputs the determined monitoring locations in various formats, such as a 3D model, a 2D drawing, or a list. The output processing unit 59 can also output the monitoring locations created in these formats to the display device 30 or as a data file.

[0095] Figure 12 shows an example of output to the display device 30. As shown in Figure 12, the 3D model 101A is displayed on the display device 30. Furthermore, the determined monitoring locations are enclosed by solid circles. In Figure 10, three monitoring locations are shown. By using the monitoring design support device 10, the user can perform efficient monitoring of the structure. In addition, the user can easily determine the monitoring locations.

[0096] Next, preferred embodiments of the monitoring design support device and monitoring design support method will be described. Figure 13 is a block diagram showing additional processing functions implemented by the CPU. As shown in Figure 13, the CPU 20 may further include an editing processing unit 65 and a sensor determination processing unit 67. The editing processing unit 65 and the sensor determination processing unit 67 will be described below.

[0097] <Editing process> The editing processing unit 65 of the CPU 20 accepts edits to the monitoring location and executes editing processing to change the monitoring location.

[0098] Figure 14 shows an example of the editing process. Figure 14(A) displays the monitoring area (circled area) determined in step S4 on the 3D model 101A. Figure 14(A) shows the same result as Figure 12.

[0099] Next, when the user performs the editing process, as shown in Figure 14(B), the candidate monitoring locations determined in step S2 are displayed on the 3D model 101A surrounded by dashed circles, instead of the determined monitoring locations. Furthermore, the location of the damage information acquired in step S3 is displayed on the 3D model 101A with an arrow.

[0100] The user can simultaneously view the candidate monitoring locations and the actual damage locations on the display device 30. By further specifying the damage location, the user can view the corresponding image 103 (not shown) and damage information 105 as shown in Figure 10. The user can then manually determine the monitoring locations based on this information.

[0101] Figure 14(C) shows the edited monitoring locations displayed on the 3D model 101A. In Figure 14(C), the monitoring locations added by the user are surrounded by a thicker solid line and are displayed with an asterisk (*). This makes it easy to confirm that the user added these locations through editing.

[0102] Figure 14 shows an example of the editing process, but it is not limited to this. Users can, for example, edit monitoring locations on a 2D drawing or a list.

[0103] <Sensor determination process> The sensor determination processing unit 67 of the CPU 20 executes a sensor determination process to determine the applicable sensor from a third database that holds information related to sensors capable of monitoring the monitoring location, based on damage information of the monitoring location.

[0104] Figure 15 is a block diagram for executing the sensor determination process. As shown in Figure 15, the monitoring design support device 10 includes a third database 63. The third database 63 holds information related to the sensor. The third database 63 may be configured to allow the user to add information.

[0105] Database 63 can include information such as manufacturer, product name, sensor type, measurement items, detectable events (damage), applicable locations, cost, and detailed specifications. The correspondence between sensor type and measurement items can be found in the RAIMS (Monitoring System Technology Research Association) document "Key Points Explanation of Guidelines for the Use of Monitoring Systems for Civil Engineering Structures" (http: / / raims.or.jp / release / pdf / 201905_raims_6.pdf). The correspondence between measurement items and detectable events can be found in the Ministry of Land, Infrastructure, Transport and Tourism document "Current Status and Challenges of Monitoring Technology" (https: / / www.mlit.go.jp / common / 001016261.pdf).

[0106] Applicable locations include reinforced concrete (RC) slabs, concrete girders, steel girders, bridge piers and foundations, etc. Cost information can include installation costs, operating costs (per year, etc.), and removal costs. Detailed specifications can include information such as sensing frequency, sensing accuracy, operating guarantee conditions (temperature, humidity, etc.), and operating guarantee period.

[0107] The sensor selection processing unit 67 can determine the applicable location and the sensor corresponding to the event (damage) to be monitored, based on the third database 63 and damage information of the monitoring location. It can also determine the sensor according to the operating guarantee conditions, required accuracy, etc. The selection may also be made in order to minimize the total cost, taking into account the expected operating period. For example, if the expected operating period is 10 years, the sensor that minimizes the cost (installation cost + operating cost) over 10 years may be selected.

[0108] <Other> In the above embodiment, the hardware structure of the processing unit that performs various processes is a variety of processors as shown below. These various processors include a CPU (Central Processing Unit), which is a general-purpose processor that executes software (programs) and functions as a processing unit; a Programmable Logic Device (PLD), such as an FPGA (Field Programmable Gate Array), which is a processor whose circuit configuration can be changed after manufacturing; and a dedicated electrical circuit, such as an ASIC (Application Specific Integrated Circuit), which has a circuit configuration specifically designed to perform a particular process.

[0109] A single processing unit may be composed of one of these various processors, or it may be composed of two or more processors of the same or different type (for example, multiple FPGAs, or a combination of a CPU and an FPGA). Furthermore, multiple processing units can be composed of a single processor. Examples of composing multiple processing units with a single processor include, firstly, a configuration in which one or more CPUs and software are combined to form a single processor, and this processor functions as multiple processing units, as is typical of computers such as client and server systems. Secondly, a configuration using a processor that realizes the functions of the entire system, including multiple processing units, on a single IC (Integrated Circuit) chip, as is typical of System-on-a-Chip (SoC) systems. Thus, various processing units are configured, in terms of hardware structure, using one or more of the above-mentioned various processors.

[0110] Furthermore, the hardware structure of these various processors is, more specifically, an electrical circuit composed of circuit elements such as semiconductor devices.

[0111] Each of the above-described configurations and functions can be appropriately implemented using any hardware, software, or a combination thereof. For example, the present invention can also be applied to a program that causes a computer to execute the above-described processing steps (processing procedures), a computer-readable recording medium (non-temporary recording medium) that records such a program, or a computer on which such a program can be installed.

[0112] Although examples of the present invention have been described above, it goes without saying that the present invention is not limited to the embodiments described above, and various modifications are possible without departing from the spirit of the invention. [Explanation of Symbols]

[0113] 10. Monitoring Design Support Device 12 Input / Output Interfaces 16 Memory section 18 Control section 20 CPU 22 RAM 24 ROM 26 Display Control Unit 30 Display device 51 Structural Information Acquisition Processing Unit 53. Processing unit for determining monitoring candidate locations 53A Similar Structure Extraction Processing Unit 55 Damage Information Acquisition Processing Unit 57. Monitoring location determination processing unit 59 Output Processing Unit 60 First Database 61 Second Database 63 Third Database 65 Editing Processing Unit 67 Sensor determination processing unit 101 Structural information 101A 3D Model 101B 2D drawing 103 Compatible Images 103A Compatible Images 103B compatible image 105 Damage information 131 Floor slab 133 Bridge piers 135 Abutment 140 Structural information 142 Representative monitoring candidate locations 144 Structural information of reference structures 146 Damage information for reference structures

Claims

1. A monitoring design support device that assists in the monitoring design of structures, Equipped with a processor, The aforementioned processor, Obtain structural information of the target structure, Based on the structural information of the aforementioned target structure, potential monitoring locations prone to damage are determined. Damage information of the target structure is obtained, including information regarding the location and extent of damage to the target structure. Based on the degree of damage included in the damage information of the target structure corresponding to the candidate monitoring locations, a monitoring location is determined from among the candidate monitoring locations. Output the aforementioned monitoring location. Monitoring and design support device.

2. The processor determines the candidate monitoring location, in which the degree of damage is included in the setting, as the monitoring location. The monitoring design support device according to claim 1.

3. Furthermore, it includes a first database that maintains the correspondence between structural information of representative structures and representative monitoring candidate locations. The processor obtains information from the first database regarding representative monitoring candidate locations that correspond to the representative structure which is identical or similar to the target structure, based on the structural information of the target structure and the structural information of the representative structure, and determines the monitoring candidate locations. The monitoring design support device according to claim 1 or 2.

4. The system further includes a second database that maintains the correspondence between structural information of a reference structure and damage information of the said reference structure. The processor extracts from the second database reference structures that are similar to the target structure, based on the structural information of the target structure and the structural information of the reference structure. Based on the structural information of the extracted reference structure and the corresponding damage information, candidate monitoring locations are determined. The monitoring design support device according to claim 1 or 2.

5. The second database holds other information relating to the reference structure, The processor extracts reference structures similar to the target structure from the second database based on the structural information of the target structure, the structural information of the reference structure, other information about the target structure, and other information about the reference structure. The monitoring design support device according to claim 4.

6. The processor simulates deterioration factors based on the structural information of the target structure, Based on the results of the simulation, the candidate monitoring locations are determined. The monitoring design support device according to claim 1 or 2.

7. The processor acquires information regarding the degree of damage based on an image associated with the location on the target structure and the degree of damage determined from the image. A monitoring design support device according to any one of claims 1 to 6.

8. The processor acquires information regarding the degree of damage based on the degree of damage determined from images of at least two different time periods associated with the location on the target structure. A monitoring design support device according to any one of claims 1 to 6.

9. The processor accepts an edit to the monitoring location and performs an edit to modify the monitoring location. A monitoring design support device according to any one of claims 1 to 7.

10. The processor accepts editing on a three-dimensional model, two-dimensional drawing, or list displayed on a display device. The monitoring design support device according to claim 9.

11. The system further includes a third database that holds information related to sensors capable of monitoring the aforementioned monitoring location. The processor determines the sensor to be applied from the third database based on the damage information of the monitoring location. A monitoring design support device according to any one of claims 1 to 10.

12. A monitoring design support method in which a computer assists in the monitoring design of a structure, Obtain structural information of the target structure, Based on the structural information of the aforementioned target structure, potential monitoring locations prone to damage are determined. Damage information of the target structure is obtained, including information regarding the location and extent of damage to the target structure. Based on the degree of damage included in the damage information of the target structure corresponding to the candidate monitoring locations, a monitoring location is determined from among the candidate monitoring locations. Output the aforementioned monitoring location. Monitoring design support method.

13. A program that supports the monitoring design of structures, A function to acquire structural information of the target structure, A function to determine potential monitoring locations prone to damage based on the structural information of the target structure, A function to acquire damage information of the target structure, including information regarding the location and extent of damage to the target structure, A function to determine a monitoring location from among the candidate monitoring locations based on the degree of damage included in the damage information of the target structure corresponding to the candidate monitoring location, The function to output the aforementioned monitoring location, A program that enables a computer to realize this.

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