Active heat dissipation appliances

Abstract

To provide an active heat dissipation device capable of greatly improving heat dissipation performance. [Solution] The active heat dissipation device comprises a heat conduction panel body made of a thermally conductive material, which forms a refrigerant flow space of a predetermined thickness inside which the refrigerant is filled and flows, and which includes a one-side heat conduction panel and an other-side heat conduction panel forming one side and the other side of the thickness portion, respectively; a plurality of joints formed on the one-side heat conduction panel and the other-side heat conduction panel, respectively, to join the one-side heat conduction panel and the other-side heat conduction panel within the refrigerant flow space; and an absorber disposed in the refrigerant flow space and absorbing the liquid phase refrigerant among the refrigerant, the plurality of joints being joined to each other by penetrating the absorber in the thickness direction.

Description

[Technical Field]

[0001] The present invention relates to an active heat dissipation apparatus, and more particularly to an active heat dissipation apparatus that can improve heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., electronic device) through a phase change of a refrigerant that is more effective than the properties of a heat-conducting material itself. [Background technology]

[0002] Wireless communication technology, for example, MIMO (Multiple-Input Multiple-Output) technology, is a technology that dramatically increases data transmission capacity by using multiple antennas. It is a spatial multiplexing technique in which a transmitter transmits different data through each transmitting antenna, and a receiver separates the transmitted data through appropriate signal processing.

[0003] Therefore, by simultaneously increasing the number of transmitting and receiving antennas, channel capacity increases, allowing for more data to be transmitted. For example, increasing the number of antennas to 10 secures approximately 10 times the channel capacity using the same frequency band compared to the current single antenna system. In the case of a transmitting / receiving device that applies such MIMO technology, as the number of antennas increases, the number of transmitters and filters also increases.

[0004] As the number of transmitters and filters increases, the number of heat-generating elements also increases. Therefore, in order to prevent a decline in the performance of the antenna device, MIMO technology is being researched to develop a heat dissipation structure that can effectively dissipate the heat generated by multiple heat-generating elements.

[0005] In particular, in recent years, research has been actively conducted into how to efficiently cool the heat of operating systems, not only for antenna devices but also for electrically driven electronic devices, in order to optimize their performance while preventing explosions due to overheating.

[0006] However, in order to facilitate heat exchange with the outside air, the operating system employs a structure in which heat is transferred from the internal heating element (heat generating element) to the outside using a material with high thermal conductivity, and then dissipated by exchanging heat with the outside air. However, there is a problem in that the thermal conductivity of the cooling medium material itself is limited. Summary of the Invention [Problem to be solved by the invention]

[0007] In order to solve the above technical problems, an object of the present invention is to provide an active heat dissipation device that can improve the heat dissipation performance of a heat-generating device (electronic device).

[0008] Another object of the present invention is to provide a heat dissipating device that is easy to manufacture.

[0009] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0010] One embodiment of the active heat dissipation device according to the present invention includes a heat conduction panel body made of a thermally conductive material, which forms a refrigerant flow space of a predetermined thickness within which a refrigerant is filled and flows, and which includes one heat conduction panel and an other heat conduction panel forming one side and the other side of a thickness portion, respectively; a plurality of joints formed on the one heat conduction panel and the other heat conduction panel, respectively, to join the one heat conduction panel and the other heat conduction panel within the refrigerant flow space; and an absorber disposed in the refrigerant flow space and absorbing liquid-phase refrigerant from the refrigerant, the plurality of joints being joined to each other while penetrating the absorber in the thickness direction.

[0011] The heat transfer device may further include a plurality of absorber fixing portions provided on at least one of the one-side heat conduction panel and the other-side heat conduction panel to fix the absorber.

[0012] The plurality of absorber fixing parts may be arranged to support at least one outer surface of one side surface and the other side surface of the absorber.

[0013] The absorber may be disposed parallel to and spaced apart from the one-side heat conduction panel and the other-side heat conduction panel at the middle of the thickness of the refrigerant flow space.

[0014] In addition, the absorber fixing portion formed on the one-side heat conduction panel among the plurality of absorber fixing portions may support one side of the absorber that faces the one-side heat conduction panel among the one and other sides of the absorber, and the absorber fixing portion formed on the other-side heat conduction panel may support the other side of the absorber that faces the other-side heat conduction panel among the one and other sides of the absorber.

[0015] In addition, the plurality of absorber fixing portions may be supported at the same point by a one-side absorber fixing portion protruding from the one-side thermal conduction panel toward the other-side thermal conduction panel and a second-side absorber fixing portion protruding from the other-side thermal conduction panel toward the one-side thermal conduction panel.

[0016] Furthermore, the plurality of absorber fixing parts can support one surface of the absorber without penetrating the surface.

[0017] The absorber may include a first absorbing member disposed in close contact with an inner surface of the first heat conduction panel in the refrigerant flow space, and a second absorbing member disposed in close contact with an inner surface of the second heat conduction panel in the refrigerant flow space.

[0018] In addition, the plurality of absorbent body fixing portions include a one-side absorbent body fixing portion protruding from the one-side thermal conduction panel toward the other-side thermal conduction panel and an other-side absorbent body fixing portion protruding from the other-side thermal conduction panel toward the one-side thermal conduction panel, and the one-side absorbent body fixing portion can penetrate the one-side absorbent member to support the other-side absorbent member, and the other-side absorbent body fixing portion can penetrate the other-side absorbent member to support the one-side absorbent member.

[0019] The absorbent body may have a plurality of joint through-holes formed therein so that the joints interpenetrate and meet each other.

[0020] The plurality of joints and the plurality of absorber fixing portions may be arranged alternately and spaced apart in a certain linear direction of the heat conduction panel body.

[0021] Furthermore, when at least one end of the heat conduction panel body, in a state where the one-side heat conduction panel and the other-side heat conduction panel are joined together, forms a press-fit end that is positioned adjacent to a heat-generating element that is a heat dissipation target, at least a portion of the absorber may be arranged in a straight line along the press-fit end.

[0022] In addition, when the portions of the one-side thermal conduction panel and the other-side thermal conduction panel excluding the press-fit ends are defined as a heat dissipation plate portion, the remaining portion of the absorber may be bent to a portion of the heat dissipation plate portion that is relatively lower in the direction of gravity and extended in a straight line.

[0023] The one-side heat conduction panel and the other-side heat conduction panel may be provided with at least one chamber partition portion that divides the refrigerant flow space into at least two or more chamber partition portions after being joined together and that are joined together when being joined.

[0024] Furthermore, the absorbers may be arranged in the at least two or more refrigerant flow spaces partitioned by the chamber partition section, the number of absorbers corresponding to the number of the refrigerant flow spaces.

[0025] The press-fitting end may be provided with a refrigerant filling port that communicates with the refrigerant flow space so as to fill the refrigerant.

[0026] The compressor may further include a caulking member that is inserted into the refrigerant filling port after the refrigerant is filled, and then presses the refrigerant filling port to seal the refrigerant flow space.

[0027] After the caulking member is inserted into the refrigerant fill port, the refrigerant fill port including the caulking member can be cut open so as to match the outer end of the press-fit end.

[0028] Also, when the end opposite to the press-fit end is defined as a heat-radiating end, a rigidity rib for increasing rigidity may be formed along the heat-radiating end.

[0029] The rigidity rib may include a one-side rigidity rib groove recessed from the one-side heat conduction panel toward an outer side of the refrigerant flow space, and a second-side rigidity rib groove recessed from the other-side heat conduction panel toward an outer side of the refrigerant flow space. [Effects of the Invention]

[0030] According to one embodiment of the active heat dissipation device of the present invention, active heat transfer is enabled by the phase change of the refrigerant, thereby significantly improving the overall heat dissipation performance. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a perspective view showing an example of an active heat sink coupled to an antenna device of an electronic device. [Figure 2] FIG. 2 is an exploded perspective view showing the configuration of FIG. 1 in a state where the active heat dissipation device is separated. [Figure 3] 1 is a perspective view of an active heat dissipation device according to an embodiment of the present invention; [Figure 4] FIG. 4 is an exploded perspective view of FIG. 3. [Figure 5] FIG. 4 is a development view of the state before joining in FIG. 3. [Figure 6] 5A is a front view of FIG. 4, and cross-sectional views ((b) and (c)) taken along lines AA and BB, respectively, and enlarged views of the cross-sectional views. [Figure 7] 7A and 7B are perspective cutaway views taken along line AA in FIG. 6 and partially enlarged views thereof. [Figure 8]20A, 20B, 200C, and 200D are perspective views showing active heat dissipation devices according to other embodiments of the present invention. [Figure 9] FIG. 9 is an exploded perspective view of another embodiment (200B) shown in FIG. 8(a). [Figure 10] FIG. 9 is a development view of the other embodiment (200B) shown in FIG. 8(a) in a state before joining. [Figure 11A] 8A is a front view of another embodiment (200B) shown in FIG. 8A, a cross-sectional view (b) along line CC, a cutaway perspective view (c) thereof, and a partially enlarged view (d) thereof. [Figure 11B] 8A is a front view of another embodiment (200B) shown in FIG. 8A, a cross-sectional view (b) along line DD, a cutaway perspective view (c) thereof, and a partially enlarged view (d) thereof. DETAILED DESCRIPTION OF THE INVENTION

[0032] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an active heat dissipation device according to the present invention will be described in detail with reference to the accompanying drawings.

[0033] When assigning reference numerals to components in each drawing, it should be noted that the same components are assigned the same numerals as much as possible even if they are displayed in different drawings. Furthermore, when describing the embodiments of the present invention, if it is determined that a detailed description of such well-known configurations or functions would hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0034] When describing components of embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. These terms are merely used to distinguish the component from other components and do not limit the nature, order, or procedure of the components. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted to have a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

[0035] FIG. 1 is a perspective view showing an example of an active heat dissipation device coupled to an antenna device in an electronic device, and FIG. 2 is an exploded perspective view showing the active heat dissipation device in the configuration of FIG. 1 in a separated state.

[0036] Generally, electronic devices dissipate heat during electrical operation, and their performance depends on the ability to quickly dissipate the generated heat. Among electronic devices, semiconductors are representative examples of devices whose performance depends on the cooling rate, including antenna devices for communications, displays, batteries for electric vehicles, energy storage devices (ESS), artificial intelligence (AI), and other electric and electronic devices.

[0037] For ease of understanding, the following description will be given by applying an antenna device, among the electronic devices, to a specific embodiment.

[0038] As shown in FIG. 1, an antenna device 100 to which an active heat dissipation device 200 according to one embodiment of the present invention is applied includes a heat dissipation housing main body 110 formed in a rectangular parallelepiped shape, which forms a storage space that is open to the front and has a long and thin storage width in the vertical direction.

[0039] Inside the storage space of the heat dissipation housing main body 110, although not shown, a main board can be stacked, with multiple MBF (Micro Bellows Filter) elements mounted on the front side via a clamshell as a substrate for a PAU (Power Amplifier Unit) and a DTU (Digital Transceiving Unit), and a type of heat generating element mounted on the back side.

[0040] Here, the RFIC element or PA element mounted on the main board can be defined as a heat-generating element that generates a large amount of heat during operation. However, it should be noted that the embodiments of the present invention are merely described using an electronic device as an antenna device, and the heat-generating element is not limited to the above configuration.

[0041] A radome panel 50 is installed on the front surface of the receiving space of the heat dissipating housing body 110 to protect the radiating element realized by the antenna element from the outside and also to facilitate smooth radiation from the radiating element.

[0042] Meanwhile, an active heat dissipation device 200 according to an embodiment of the present invention may be provided on the rear surface of the heat dissipation housing body 110 .

[0043] The active heat dissipation device 200 according to an embodiment of the present invention is provided in the form of a heat dissipation fin, and strictly speaking, unlike the fixed type heat dissipation fins 200C-1 and 200C-2 described later, it is characterized in that it is provided as a thin vapor chamber type that essentially includes an absorber inside that absorbs the liquid phase refrigerant among the refrigerants.

[0044] Generally, a wick member having a wick structure with a large number of pores formed therein is provided inside the vapor chamber, but the active heat dissipation device 200 according to an embodiment of the present invention is not limited to a wick member, and in particular, as long as it is capable of absorbing liquid-phase refrigerant, it can be a concept that includes all absorption members that are very light, such as nonwoven fabric materials that are easier to install, and that can raise the liquid (liquid-phase refrigerant) in a direction against gravity through a predetermined capillary phenomenon.

[0045] More specifically, a trench structure 170 is provided on the rear surface of the heat dissipation housing main body 110, with an open area separating the central portion between the left and right ends into upper and lower portions, and active heat dissipation devices 200 according to an embodiment of the present invention may be arranged on both the left and right sides of the trench structure 170, inclined upward toward the left and right ends, respectively.

[0046] Meanwhile, the active heat dissipation device 200 according to an embodiment of the present invention may be provided in multiple units, all of which are formed in the same rectangular shape extending in the same longitudinal direction, and the fixed heat dissipation fins 200C-1 and 200C-2 may be arranged on the rear portion of the heat dissipation housing main body 110 that is not occupied thereby.

[0047] Here, the fixed heat dissipation fins 200C-1 and 200C-2 may include, as shown in Figures 1 and 2, upper fixed heat dissipation fins 200C-1 arranged on the upper side of the rear portion of the heat dissipation housing main body 110 that is not occupied by the active heat dissipation device 200 according to an embodiment of the present invention, and lower fixed heat dissipation fins 200C-2 arranged on the lower left and right sides of the rear portion of the heat dissipation housing main body 110 that is not occupied by the active heat dissipation device 200 according to an embodiment of the present invention.

[0048] A refrigerant can be filled in the area where trench structure 170 is formed on the rear surface of heat dissipation housing main body 110 and the area (inverted triangular area 130) where upper fixed heat dissipation fin 200C-1 of fixed type heat dissipation fins 200C-1 and 200C-2 is provided. That is, a refrigerant flow space (not shown) may be embedded in the rear surface of heat dissipation housing main body 110 so that the refrigerant can be filled.

[0049] In this case, the area corresponding to the trench structure 170 may be provided with an absorbent material made of either a nonwoven fabric or a nonwoven fabric bonded to a braided body made of copper wire material, so that the liquid refrigerant filled therein can be more easily evaporated by the heat transferred from the heating element 140.

[0050] The refrigerant filled in the refrigerant flow space at the rear of the heat dissipating housing main body 110 undergoes a phase change in which it evaporates into a gaseous state in a relatively lower evaporation zone defined as a trench structure 170 due to a temperature change caused by heat transferred from the heat generating element, then moves to the relatively upper condensation zone, the inverted triangular region 130 where the upper fixed heat dissipation fins 200C-1 are provided, where it condenses and then undergoes a phase change in which it liquefies into a liquid state again, and then moves downward due to gravity and capillary action, thereby performing a heat dissipation function.

[0051] For reference, the refrigerant filled inside the active heat dissipation device 200 according to the embodiment of the present invention described below and the refrigerant filled into the refrigerant flow space corresponding to the inverted triangular region 130 and trench structure 170 described above are independent of each other, and refrigerants of the same specifications or different specifications can be filled depending on the heat generation amount and mounting position of the heat generating element.

[0052] Meanwhile, as shown in Figures 1 and 2, a press-fit portion 150 may be formed on the rear surface of the heat dissipation housing body 110 for press-fitting a plurality of active heat dissipation devices 200 according to an embodiment of the present invention.

[0053] As described above, the active heat dissipation device 200 according to an embodiment of the present invention may have multiple press-fit portions 150, each of which may be arranged to form a "V" shape based on the trench structure 170, in that the press-fit portions 150 are arranged at an upward inclination toward the left and right ends of the trench structure 170.

[0054] However, the press-fit mounting of the active heat dissipation device 200 according to an embodiment of the present invention to the rear surface of the heat dissipation housing main body 110 is not necessarily limited to the form of a press-fit portion 150. The inside of the press-fit portion 150 may be formed in the form of a mounting hole penetrating the rear surface of the heat dissipation housing main body 110 from front to back, so that the press-fit end 201 of the active heat dissipation device 200 is in direct surface thermal contact with the heat-generating surface of the heat-generating element.

[0055] FIG. 3 is an oblique view showing an active heat dissipation device according to one embodiment of the present invention, FIG. 4 is an exploded oblique view of FIG. 3, FIG. 5 is an expanded view of the state before joining of FIG. 3, FIG. 6 is a front view (a) of FIG. 4 and cross-sectional views (b and c) along lines AA and BB, and a partially enlarged view thereof, and FIG. 7 is a cut-away oblique view along line AA of FIG. 6 and a partially enlarged view thereof.

[0056] 3 to 7, an active heat dissipation device 200A according to one embodiment of the present invention has common features with an active heat dissipation device 200B according to another embodiment of the present invention, which will be described later with reference to Figures 8 to 11B, including thermal conduction panel bodies 200A-1, 200A-2 and 200B-1, 200B-2, a plurality of joining portions 241a, etc. for joining the panels together, an absorber 260, and a plurality of absorber fixing portions 251a, etc. In the following, to avoid confusion, common features between the one embodiment (200A) and the other embodiment (200B) will be described by referring to the reference numerals for "one embodiment (200A)."

[0057] As shown in FIG. 5, the thermal conduction panel bodies 200A-1 and 200A-2 may be made of a single member of a thermally conductive material (e.g., a metal material) and may integrally include one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2 that are bent to form a refrigerant flow space (not shown in the drawing) of a predetermined thickness in which the refrigerant is filled and flows. The one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2 form one side and the other side of the thickness portion, respectively.

[0058] However, the heat conduction panel bodies 200A-1 and 200A-2 do not necessarily have to be made of a single metal panel member and then bent as described above to form the refrigerant flow space. That is, the refrigerant flow space can also be formed by joining the frame edges of the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2, which are made of two metal panel members.

[0059] Here, when the refrigerant flow space is manufactured using the above-mentioned bending method, the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2, each made of a single metal panel member, may be bent (folded) around an arbitrary reference line T separating the panels at their centers, such that one widthwise end of the one-side thermal conduction panel 200A-1 and the other widthwise end of the other-side thermal conduction panel 200A-2 are joined to each other.

[0060] When manufactured using the above-mentioned joining method, it can be understood that the refrigerant flow space is formed by directly joining one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2, which are made of two metal panel members, without any bending process.

[0061] In this case, the refrigerant flow space may have a thickness portion with a predetermined thickness on one side formed by the one-side heat conduction panel 200A-1 and on the other side formed by the other-side heat conduction panel 200A-2.

[0062] The refrigerant flow space can be defined as a space where refrigerant is filled and flows through refrigerant filling ports 205A and 205B (described later). In the refrigerant flow space, when the liquid refrigerant receives a predetermined amount of heat from the heat generating element (heat generating element), it changes phase to gaseous refrigerant and flows, exchanging heat with the outside air through the outer surfaces of the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2, then changes phase to liquid refrigerant again and flows down toward the heat generating element in the direction of gravity, repeating this process.

[0063] Meanwhile, as shown in Figures 3 to 7, a plurality of joining portions 241a, etc. are formed on the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2, respectively, and serve to join the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2 within the refrigerant flow space when joined.

[0064] Here, multiple joints 241a, etc. may be formed together when manufacturing the thermal conduction panel bodies 200A-1, 200A-2 by a press process using a press mold on a base panel made of a single metal panel member or a base panel made of two metal panel members.

[0065] The absorber 260A is disposed at an appropriate position within the refrigerant flow space, and has a large number of pores to absorb the liquid-phase refrigerant that has changed into a liquid state through heat exchange with the outside air and to allow the refrigerant to easily evaporate by heat transferred from a predetermined heating element, or it can function to cause the liquid-phase refrigerant to flow in the direction opposite to the direction of gravity through a predetermined capillary phenomenon, as described below.

[0066] Here, the absorber 260A can be a thin nonwoven fabric, but is not necessarily limited to this, and any material may be used as long as it satisfies the above-mentioned liquid phase refrigerant absorption rate and flow force due to capillary force.

[0067] Meanwhile, in the active heat dissipation device 200A according to one embodiment of the present invention, when the refrigerant flow space is divided into upper and lower parts on the drawing by the chamber partition portion 204-1, as described below, the absorber 260A may be arranged in an "inverted L" or "L" shape in each refrigerant flow space.

[0068] Such absorbers 260A-U, 260A-D are each arranged in a portion of the refrigerant flow space, and by using capillary force, transport the liquid refrigerant located relatively lower in the direction of gravity to a relatively higher position in the direction of gravity, thereby dispersing the liquid refrigerant uniformly throughout the press-fit end 201 near the heat-generating portion of the heating element and activating refrigerant evaporation.

[0069] Meanwhile, the plurality of absorber fixing portions 251a, etc. provided inside the refrigerant flow space can be provided on at least one of the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2, as shown in Figures 6 and 7, and can serve to fix the absorber 260A.

[0070] Like the multiple joints 241a, etc. described above, the multiple absorber fixing portions 251a, etc. may be formed together when manufacturing the heat conduction panel bodies 200A-1, 200A-2 by pressing a single metal panel member or a base panel which is two metal panel members using a press mold.

[0071] As shown in Figures 3 to 7, the multiple joints 241a etc. may be provided so as to protrude from each other at locations corresponding to the refrigerant flow spaces when the refrigerant flow spaces are formed by bending the surfaces of the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2.

[0072] The plurality of joints 241a are formed so that the protruding portions of the joints face each other at approximately the middle of the thickness of the refrigerant flow space, and the contacting portions can be joined to each other by various joining methods such as welding. The joining method here is not limited to welding, but if welding is used, laser welding is preferred.

[0073] Meanwhile, as described above, the plurality of connecting portions 241a, etc. can be connected to each other by penetrating the absorber 260A provided in the refrigerant flow space in the thickness direction so that each tip surface is connected to each other in a predetermined connecting manner, and for this purpose, the absorber 260A may be formed with a plurality of connecting portion through holes 261b so that the plurality of connecting portions 241a, etc. can penetrate each other and be connected to each other.

[0074] In this case, the size of the plurality of joint through holes 261b is preferably larger than at least the diameter of the tip surfaces of the plurality of joints 241a, etc., so as not to be affected by the welding heat that is generated when the plurality of joints 241a, etc. are welded together to join the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2 to each other.

[0075] Conversely, in some embodiments, the plurality of absorber fixing portions 251a, etc. may be provided so as to be supported without penetrating one surface of the absorber 260A, and therefore the absorber 260A does not need to have a hole configuration for penetrating the plurality of absorber fixing portions 251a, etc.

[0076] However, in the case of other embodiments of the present invention (such as 200B) described later, when two absorbers 260B-a and 260B-b are provided and one of the absorber fixing portions 251-1 and 251-2 penetrates a nearby absorber, it goes without saying that a different hole configuration may be provided to penetrate it. This will be described in more detail later.

[0077] Such a plurality of joining portions 241a, etc. and a plurality of absorber fixing portions 251a, etc. may be arranged alternately and spaced apart in a straight line in the heat conduction panel bodies 200A-1 and 200A-2, as shown in Figures 3 to 5.

[0078] More specifically, focusing on the portion where the absorber 260A is installed through the active heat dissipation device 200A according to one embodiment of the present invention, as shown in FIG. 3, the heat conduction panel bodies 200A-1 and 200A-2 are configured so that both surfaces of the predetermined thickness portion form the heat dissipation surfaces of the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2, respectively.

[0079] Here, in the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2, a plurality of joints 241a to 241c may be arranged at a predetermined distance apart in a "column" direction, which is the left-right direction in the drawing, and similarly, a plurality of joints 243a to 243e may be arranged at a predetermined distance apart in a "row" direction, which is the up-down direction in the drawing.

[0080] In addition, in the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2, the plurality of absorber fixing portions 251a-251d may be arranged at a predetermined distance apart in a "column" direction, which is the left-right direction in the drawing, and may be arranged alternately between each of the joints 241a-241c arranged in the "column" direction (or in the last column) among the plurality of joints 241a, etc. described above. Similarly, the plurality of absorber fixing portions 253a-253e may be arranged at a predetermined distance apart in a "row" direction, which is the up-down direction in the drawing, and may be arranged alternately between each of the joints 243a-243e arranged in the "row" direction (or in the last column) among the plurality of joints 241, etc. described above.

[0081] In particular, in the active heat dissipation device 200A according to one embodiment of the present invention, the plurality of absorber fixing portions 251a, etc., apart from the plurality of joint portions 241a, etc., do not need to be provided over the entire area of ​​the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2.

[0082] 4, at least one end of the thermal conduction panel bodies 200A-1 and 200A-2, when the first and second thermal conduction panels 200A-1 and 200A-2 are joined together, may form a press-fit end 201 adjacent to a heat-generating element that is a heat dissipation target. The press-fit end 201 may be defined as an end that is positioned relatively low relative to the direction of gravity. At this time, it is preferable that at least a portion of the absorber 260A be aligned in a straight line along the press-fit end 201.

[0083] Therefore, it is preferable that the absorber fixing portions 251a and the like for fixing the absorber 260A in the refrigerant flow space are formed only in the area where the absorber 260A is disposed.

[0084] That is, as shown in FIG. 4, when the absorbent body 260A is arranged adjacent to the press-fit end 201 side and arranged long in the "row" direction, and is formed so as to extend long in the "column" direction from the lower end or upper end, multiple absorbent body fixing portions 251a, etc. can be formed only in the area where the absorbent body 260A is arranged.

[0085] In addition, the active heat dissipation device 200A according to one embodiment of the present invention has a plurality of joints 241a, etc., evenly distributed on the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2, respectively, and by uniformly joining them after bending (folding), deformation due to internal pressure in the refrigerant flow space can be prevented.

[0086] Here, when the portion excluding the press-fit end 201 of the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2 is defined as a heat dissipation plate portion (not shown in the drawing), the remaining portion of the absorber 260A can be bent to a portion of the heat dissipation plate portion that is located relatively lower based on the direction of gravity and extended in a straight line.

[0087] For example, when the active heat dissipation device 200A according to one embodiment of the present invention is rectangular in shape with its vertical length longer than its front-to-back width, the absorber 260A may be formed long along the press-fit end 201, which is one of the widthwise ends, and bent horizontally in the front-to-back direction from the lower end of the longitudinal direction that is located relatively lower in the vertical longitudinal direction based on the direction of gravity, and extend a predetermined length backward, and may be arranged in an approximately ``inverted L'' shape or an ``L'' shape.

[0088] On the other hand, the active heat dissipation device 200A according to one embodiment of the present invention may differ from other embodiments (200B, etc.) described later in that the absorber 260A is arranged parallel to and spaced apart from the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2 in the middle of the thickness of the refrigerant flow space.

[0089] That is, the active heat dissipation device 200B according to another embodiment of the present invention is provided with two separate absorbing members, one absorbing member 260B-a and the other absorbing member 260B-b (see FIG. 9), and is distinguished from the active heat dissipation device 200A according to another embodiment of the present invention in that the one absorbing member 260B-a is disposed in close contact with the inner surface of the one heat conduction panel 200B-1 within the refrigerant flow space, and the other absorbing member 260B-b is disposed in close contact with the inner surface of the other heat conduction panel 200B-2 within the refrigerant flow space. The active heat dissipation device 200B according to another embodiment of the present invention will be described in more detail later.

[0090] In the case of an active heat dissipation device 200A according to one embodiment of the present invention in which the absorber 260A is arranged in the middle of the thickness of the refrigerant flow space, when system heat is provided from the heating element adjacent to the press-in end 201, the portion of the absorber 260A arranged near the press-in end 201 absorbs and stores the maximum amount of liquid refrigerant and promotes the phase change to gas refrigerant.

[0091] In addition, the absorber 260A portion, which is located away from the press-in end 201 and relatively close to the heat dissipation end 203, provides a position where the gas-phase refrigerant can be quickly condensed and absorbed when it changes phase to liquid-phase refrigerant after heat exchange through the inner surfaces of the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2, thereby maximizing the heat transport capacity.

[0092] Here, when the liquid-phase refrigerant that has undergone a phase change due to condensation of the gas-phase refrigerant is absorbed by the absorber 260A, it flows down again in the direction of gravity and is transported back to the pressure-insertion end 201 side, thereby significantly improving the overall heat transport capacity of the refrigerant.

[0093] In addition, when the refrigerant flow space is divided into a predetermined number of spaces by the chamber partition 204-1 described later and absorbers 260A-U and 260A-D are placed in each refrigerant flow space, the limitations of the refrigerant's heat transport capacity and boiling capacity can be overcome, shortening the evaporation time in the evaporation region and the condensation time in the condensation region, thereby increasing the overall number of refrigerant phase change cycles and accelerating heat dissipation.

[0094] In an active heat dissipation device 200A according to one embodiment of the present invention, as shown in Figures 6 and 7, when the end opposite the above-mentioned press-fit end 201 is defined as the heat dissipation end 203, the heat dissipation end 203 may have rigidity ribs 270 machined and formed along the end to increase rigidity.

[0095] The rigid rib 270 here may also be formed together with the heat conduction panel bodies 200A-1 and 200A-2 when a single metal panel-shaped base material panel is manufactured by a pressing process using a press mold, similar to the process of forming the above-mentioned multiple joints 241a, etc. and multiple absorber fixing portions 251a, etc.

[0096] The rigidity rib 270 serves to improve rigidity and prevent warping due to external pressure, which may occur when the active heat dissipation device 200A according to an embodiment of the present invention is attached to the rear surface of the heat dissipation housing body 110 in the form of heat dissipation fins.

[0097] Here, as shown in FIG. 6, the rigidity rib 270 may include a one-side rigidity rib groove 270-1 formed by recessing from one side heat conduction panel 200A-1 toward the outside of the refrigerant flow space, and an other-side rigidity rib groove 270-2 formed by recessing from the other side heat conduction panel 200A-2 toward the outside of the refrigerant flow space.

[0098] The one-side rigid rib groove 270-1 and the other-side rigid rib groove 270-2 are formed symmetrically to each other, so that when the one-side thermal conduction panel 200A-1 and the other-side thermal conduction panel 200A-2 are joined and stacked, a predetermined closed loop cross section can be formed.

[0099] Meanwhile, the active heat dissipation device 200A according to an embodiment of the present invention may further include at least one chamber section 204-1, as shown in FIG.

[0100] The chamber partition 204-1 is provided on the one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2, and can serve to divide the refrigerant flow space into at least two or more when the one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2 are joined together.

[0101] In the case of an active heat dissipation device 200A etc. according to the present invention, in which a refrigerant is filled inside and heat is dissipated by heat transfer (thermal flow) due to the phase change of the refrigerant, it goes without saying that the slimmer the thickness and the larger the heat dissipation area, the better the performance. However, due to the limit of the heat transport capacity of the refrigerant itself, there is no way to increase the heat dissipation area, i.e., to make the area larger.

[0102] Here, the above-mentioned chamber partition 204-1 maximizes the heat dissipation area, and by separating the refrigerant flow space into which each refrigerant is filled and dividing it into several chambers in consideration of the heat transport capacity of the refrigerant, it is possible to realize a large heat dissipation area while maintaining the overall heat dissipation performance under the original heat transport capacity of the refrigerant.

[0103] As shown in Figures 3 to 7, such chamber partition section 204-1 may be provided as a single section extending in the left-right direction on the drawing, so that the refrigerant flow space filled with refrigerant is divided into two sections, one at the top and one at the bottom of the drawing, or it may be provided as two (204-1, 204-2), three (204-1 to 204-3), or four (204-1 to 204-4), as in other embodiments (200B, 200C, 200D) described later.

[0104] In this case, it goes without saying that the number of refrigerant filling ports 205A and the like that can fill the refrigerant into each refrigerant flow space can be formed to correspond to the number of each chamber.

[0105] The chamber partition 204-1 includes a one-side chamber partition rib 204-1a formed on one heat conduction panel 200A-1 and an other-side chamber partition rib 204-1b formed on the other heat conduction panel 200A-2. When the heat conduction panel bodies 200A-1 and 200A-2 are joined, they come into contact with each other, thereby completely separating the adjacent refrigerant flow space.

[0106] In addition, as shown in FIG. 4, when the refrigerant flow space is divided into two by the chamber partition portion 204-1, the absorber 260A may also be provided in two pieces (see reference numerals 260A-U and 260A-D in FIG. 4), which corresponds to the number of refrigerant flow spaces formed by the chamber partition portion 204-1.

[0107] This is the same as in another embodiment (200B) of the present invention (see Figure 9) described below, where the refrigerant flow space is divided into three by two chamber partitions 204-1 and 204-2, and three absorbers 260B-1 to 260B-3 are provided, so the same principle is applied.

[0108] Furthermore, as shown in Figure 8(b) described below, the refrigerant flow space can be divided into four sections by three chamber partitions 204-1, 204-2, and 204-3, and as shown in Figure 8(c), the refrigerant flow space can be divided into five sections by four chamber partitions 204-1 to 204-4. In this case, it goes without saying that one absorber can be placed in each refrigerant flow space.

[0109] Here, the number of chamber partitions 204-1, etc. and the number of refrigerant flow spaces can be designed taking into account the heat transport capacity of the refrigerant used, as described above, and can act as a decisive factor in reducing the amount of protrusion of the heat dissipation housing main body 110 toward the rear side.

[0110] Furthermore, as explained above, when a plurality of refrigerant flow spaces are partitioned and formed by the chamber partition portion 204-1, etc., refrigerant filling ports 205A, etc. for filling the refrigerant may also be formed in the same number as the refrigerant flow spaces.

[0111] Here, the active heat dissipation device 200A according to one embodiment of the present invention and the active heat dissipation device 200B according to another embodiment of the present invention described later may further include a caulking member (not shown) that is inserted into the refrigerant filling port 205A, etc. after the refrigerant is filled into each refrigerant flow space, and then sealed by crimping the refrigerant filling port 205A, etc.

[0112] The caulking member is made of a material whose shape is deformed by external force, and functions to prevent the internal refrigerant from leaking out by being crimped through a caulking process that crimps the inlet parts such as the refrigerant filling port 205A from the outside.

[0113] Before the caulking step of sealing the inlet portion such as the refrigerant filling port 205A with the caulking member, an evacuation step of reducing the pressure in the refrigerant flow space to create a vacuum may be carried out.

[0114] Here, after the caulking member is inserted into the refrigerant filling port 205A, etc., the refrigerant filling port 205A, etc. including the caulking member can be cut to match the outer end of the press-in end 201, so as to facilitate smooth press-in using a tight fit method into the above-mentioned press-in portion 150.

[0115] Figure 8 is an oblique view showing an active heat dissipation device according to another embodiment (200B, 200C, 200D) of the present invention, Figure 9 is an exploded oblique view of the other embodiment (200B) shown in Figure 8(a), Figure 10 is an expanded view of the other embodiment (200B) shown in Figure 8(a) in a state before joining, Figure 11A is a front view (a) of the other embodiment (200B) shown in Figure 8(a), a cross-sectional view (b) along line CC, a cut-away perspective view (c) thereof, and a partially enlarged view (d) thereof, and Figure 11B is a front view (a) of the other embodiment (200B) shown in Figure 8(a), a cross-sectional view (b) along line DD, a cut-away perspective view (c) thereof, and a partially enlarged view (d) thereof.

[0116] Other embodiments (200B, 200C, 200D) of the present invention are realized differently depending on the number of refrigerant flow spaces partitioned by chamber partitions 204-1, etc., as shown in FIG. 8. Hereinafter, detailed descriptions of technical features common to the previously described embodiment (200A) of the present invention will be omitted, and the following description will focus on the technical features that are different.

[0117] Furthermore, among the other embodiments of the present invention, the embodiment designated by drawing reference numeral 200B and the embodiments designated by drawing reference numerals 200C and 200D differ only in the number of refrigerant flow spaces, and the remaining configurations are all identical. Therefore, hereinafter, only the other embodiment of the present invention designated by drawing reference numeral 200B will be specifically described with reference to the drawings.

[0118] As shown in FIGS. 8 to 11, an active heat dissipation device 200B according to another embodiment of the present invention can be realized by an absorber 260B including two absorbent members, one-side absorbent member 260B-a and the other-side absorbent member 260B-b.

[0119] More specifically, the absorber 260B may include a one-side absorbing member 260B-a arranged in close contact with the inner surface of the one-side heat conduction panel 200B-1 in the refrigerant flow space, and a second-side absorbing member 260B-b arranged in close contact with the inner surface of the other-side heat conduction panel 200B-2 in the refrigerant flow space.

[0120] In this way, the active heat dissipation device 200B according to another embodiment of the present invention has the advantage of being able to maximize the return transport capacity of the refrigerant by separating the absorber 260B, which exhibits heat transport capacity through capillary force, into two heat conduction panels, 200B-1 on one side and 200B-2 on the other side, and arranging them separately.

[0121] Here, the return transport force of the refrigerant may refer to the rate at which the liquid-phase refrigerant returns to the pressure-insertion end 201 due to a phase change. Such an improvement in the return transport force of the refrigerant leads to the advantage of preventing the dry-out phenomenon of the absorber 260B.

[0122] In the active heat dissipation device 200A according to one embodiment of the present invention, the absorber 260A is a single member arranged parallel to and spaced apart from the inner surfaces of the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2 in the middle (center) that forms the thickness portion of the refrigerant flow space, whereas the active heat dissipation device 200B according to another embodiment of the present invention differs in that two absorbers 260B-a, 260B-b are arranged in close contact with the inner surfaces of the one-side heat conduction panel 200B-1 and the other-side heat conduction panel 200B-2, respectively.

[0123] In addition, in an active heat dissipation device 200B according to another embodiment of the present invention, as shown in Figures 11A and 11B, the multiple absorber fixing portions 251-1, 251-2 may include a one-side absorber fixing portion 251-1 protruding from one-side thermal conduction panel 200B-1 toward the other-side thermal conduction panel 200B-2, and an other-side absorber fixing portion 251-2 protruding from the other-side thermal conduction panel 200B-2 toward the one-side thermal conduction panel 200B-1.

[0124] Here, the one-side absorbent body fixing portion 251-1 can protrude through the one-side absorbent member 260B-a to support the other-side absorbent member 260B-b, and the other-side absorbent body fixing portion 251-2 can protrude through the other-side absorbent member 260B-b to support the one-side absorbent member 260B-a.

[0125] Therefore, the one-side absorbent member 260B-a and the other-side absorbent member 260B-b may be formed with fixing part through-holes (reference numeral not shown) through which the other-side absorbent body fixing part 251-2 and the one-side absorbent body fixing part 251-1 pass, respectively.

[0126] On the other hand, in one embodiment (200A) of the present invention, multiple joints 241a etc. and multiple absorber fixing parts 251a etc. are arranged alternately and repeatedly in multiple matrices (rows and columns) on both sides of the heat conduction panel bodies 200A-1 and 200A-2, but in active heat dissipation devices 200B etc. according to other embodiments of the present invention, the multiple joints 241 and multiple absorber fixing parts 251 can be arranged alternately and repeatedly in a diagonal left-right direction in the drawing of Figure 11A, rather than in a vertical direction (rows) or a horizontal direction (columns).

[0127] In addition, the one-side absorbing member 260B-a and the other-side absorbing member 260B-b may have a plurality of joint through-holes (reference numeral not shown, see reference numeral 261b in FIG. 6) formed therein to prevent damage caused by heat when the plurality of joints 241 are joined together.

[0128] Meanwhile, in the active heat dissipation device 200B according to another embodiment of the present invention, unlike the first embodiment (200A) in which the absorber 260A is only partially arranged adjacent to the press-in end 201 side, the one-side absorbing member 260B-a and the other-side absorbing member 260B-b may be arranged over the entire refrigerant flow space corresponding to the heat dissipation plate portion, which is the remaining portion excluding the press-in end 201.

[0129] Such absorber 260B is uniformly supported using a plurality of joints 241 evenly distributed on one heat conduction panel 200B-1 and the other heat conduction panel 200B-2 and a plurality of absorber fixing portions 251a that are simultaneously generated during the pressing process, thereby providing the advantage that the absorber 260B can be stably fixed in the refrigerant flow space without the need for additional fixing elements.

[0130] For example, if a separate spacer, pillar, wire, powder, or screen mesh is used to fix the absorber (260B, including the absorber 260A in one embodiment), an additional joining process, sintering process, bonding process, or flattening process is required. However, stable fixation is possible using multiple joints 241 and multiple absorber fixing parts 251 that are generated together during the pressing process of the thermal conduction panel body, which has the advantage of relatively reducing the number of parts and labor, and enabling the active heat dissipation devices 200A and 200B themselves to have a larger area.

[0131] As shown in Figures 1 and 2, the active heat dissipation devices 200A, 200B, etc. according to embodiments of the present invention can be press-fitted into a plurality of press-fit portions 150 formed on the rear surface of the heat dissipation housing body 110 by press-fitting the press-fit end portion 201.

[0132] At this time, although not shown, it is preferable to perform thermal epoxy treatment on the press-fit portion 150 to improve heat transfer efficiency before press-fitting. At this time, even if the press-fit portion 150 is provided in the form of a hole, which is the above-mentioned mounting hole, instead of the press-fit portion 150, it goes without saying that a thermal epoxy treatment process can be added to the surface of the heating element.

[0133] In this way, the active heat dissipation devices 200A, 2000B, etc. according to embodiments of the present invention are configured such that the refrigerant is filled in the refrigerant flow space through which the refrigerant flows, and an absorber similar to the wick member provided inside a vapor chamber, which is a known heat dissipation component, is installed inside the device. This not only serves as a known heat dissipation fin, but also constitutes an active heat transfer system based on the phase change of the refrigerant, thereby providing the advantage of maximizing heat dissipation performance by raising the thermal conductivity material limit of existing heat dissipation fins.

[0134] Here, the closer to the press-in end 201, the more easily the liquid-phase refrigerant is transformed into a gas-phase refrigerant by the heat transferred from the heating element, and therefore it is preferable to install the absorber as close to the press-in end 201 as possible.

[0135] However, it goes without saying that the absorber does not necessarily have to be provided so as to be only close to the press-fit end 201 side, but can also be provided so as to be evenly distributed over the entire evaporation area where the refrigerant can evaporate.

[0136] 1 and 2, the press-fit portion 150 formed on the rear surface of the heat dissipating housing main body 110 is formed in a "V" shape, inclining upward toward one end in the left-right width direction based on the trench structure 170. Therefore, active heat dissipation devices 200A, 200B, etc. according to embodiments of the present invention can also be divided into "upper" and "lower" regions when the press-fit end portion 201 is fixed to the press-fit portion 150. The upper side means the upper side relative to the direction of gravity, and the lower side means the lower side relative to the direction of gravity.

[0137] The heat generated from the heating element is preferentially transferred to the press-in end 201 side, and the liquid-phase refrigerant absorbed by the absorbers 260A and 260B changes phase to gas-phase refrigerant due to the transferred heat. The gas-phase refrigerant flows actively throughout the refrigerant flow space, exchanging heat with the outside air through the outer surfaces of the one-side heat conduction panels 200A-1 and 200B-1 and the other-side heat conduction panels 200A-2 and 200B-2 including the heat-dissipating end 203, and is then condensed again to change phase to liquid-phase refrigerant.

[0138] The refrigerant that has changed phase to liquid phase refrigerant is absorbed by absorbers 260A and 260B and moves downward in the direction of gravity, and then moves again to the pressure-insertion end 201 side, which is a type of evaporation region, and by repeating the phase change described above, a system is constructed that dissipates the heat generated by the heat-generating element.

[0139] Meanwhile, in the active heat dissipation devices 200A, 200B, etc. according to the embodiments of the present invention, the material of the base panel constituting the heat conduction panel body can be SUS material.

[0140] When the base panel is made of SUS material, distilled water can also be used as the refrigerant filled inside. This has the advantage of increasing the variety of material choices for the absorbers 260A and 260B, as it allows for the use of a refrigerant with high latent heat and sensible heat, such as distilled water, which has excellent surface tension.

[0141] For reference, among refrigerants, H2O (distilled water) has advantages over other refrigerants in terms of price, heat of vaporization, and surface tension. However, in the case of aluminum, which is the material of general heat dissipation fins, distilled water causes a chemical reaction, making it difficult to use.

[0142] Up to now, the active heat sinks 200A, 200B, etc. according to the embodiments of the present invention have been described as being applied to the heat dissipation housing main body 110 of an antenna device as a representative device of electronic equipment.

[0143] However, the active heat dissipation devices 200A, 200B, etc. according to embodiments of the present invention are not necessarily applicable only to antenna devices. Although not shown, they can also be used as a medium for physically connecting an electric vehicle battery to a coolant module that cools it, and can be used as a heat dissipation fin for display devices or TVs that generate a lot of heat, as well as a cooling element for energy storage devices (ESS), semiconductors, and AI devices, thereby ensuring great versatility.

[0144] In particular, since the one-side thermal conduction panels 200A-1, 200B-1 and the other-side thermal conduction panels 200A-2, 200B-2, which have heat dissipation surfaces that can directly contact each other over a wide area to solve the heat generation problem of semiconductor devices that are becoming high-density, highly integrated, high-performance, and cutting-edge, can be actively used, there is an advantage that a natural cooling system can be easily constructed without using other electrical components such as a compressor.

[0145] This can be used to reduce heat generation in various system chips such as IGBT, FPGA, Power IC, Drive IC, CPU, and GPU, and has the effect of reducing the weight and volume of the entire product.

[0146]

[0033] The present invention has been described above in detail with reference to the accompanying drawings. However, the present invention is not limited to the above-described embodiment, and various modifications and equivalents may be made by those skilled in the art. Therefore, the true scope of the present invention is defined by the following claims. [Industrial Applicability]

[0147] The present invention provides an active heat dissipation device that can improve heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., electronic device) through the phase change of a refrigerant, which is more effective than the properties of the heat-conducting material itself. [Explanation of symbols]

[0148] 100: Antenna device, 110: Heat dissipation housing body 200A, 200B, etc.: Active heat dissipation device, 200A-1: One-sided heat conduction panel 200A-2: other side heat conduction panel, 201: press-fit end 203: heat dissipation end, 241a etc.: multiple joints 251a etc.: multiple absorber fixing parts, 260A, 260B: absorber T:Reference line

Claims

1. a heat conduction panel body made of a heat conductive material, forming a refrigerant flow space of a predetermined thickness in which a refrigerant is filled and flows, and including one heat conduction panel and an other heat conduction panel forming one surface and the other surface of a thickness portion side, respectively; a plurality of joints formed on the one-side heat conduction panel and the other-side heat conduction panel, respectively, for joining the one-side heat conduction panel and the other-side heat conduction panel together within the refrigerant flow space; an absorber disposed in the refrigerant flow space and configured to absorb a liquid phase refrigerant from the refrigerant; The active heat dissipation device, wherein the plurality of joints are joined to each other through the thickness of the absorber.

2. The active heat dissipation device according to claim 1 , further comprising a plurality of absorber fixing portions provided on at least one of the one-side heat conduction panel and the other-side heat conduction panel for fixing the absorber.

3. The active heat dissipation device according to claim 2 , wherein the plurality of absorber fixing portions are arranged to support at least one outer surface of one side surface and the other side surface of the absorber.

4. 3. The active heat dissipation device according to claim 2, wherein the absorber is disposed parallel to and spaced apart from the one-side heat conduction panel and the other-side heat conduction panel at the middle of the thickness of the refrigerant flow space.

5. The absorber fixing portion formed on the one-side heat conduction panel among the plurality of absorber fixing portions supports one side surface of the absorber that faces the one-side heat conduction panel among the one side surface and the other side surface, 5. The active heat dissipation device according to claim 4, wherein the absorber fixing portion formed on the other-side heat conduction panel among the plurality of absorber fixing portions supports the other side of the absorber that faces the other-side heat conduction panel among the one side and the other side of the absorber.

6. 5. The active heat dissipation device of claim 4, wherein the plurality of absorber fixing portions are supported at the same point by a one-side absorber fixing portion protruding from the one-side thermal conduction panel toward the other-side thermal conduction panel and a second-side absorber fixing portion protruding from the other-side thermal conduction panel toward the one-side thermal conduction panel.

7. The active heat dissipation device according to claim 2 , wherein the plurality of absorber fixing portions support one surface of the absorber without penetrating the surface.

8. The absorbent body is a first absorbing member disposed in the refrigerant flow space in close contact with an inner surface of the first heat conduction panel; The active heat dissipation device according to claim 2 , further comprising: a second absorbing member disposed in the refrigerant flow space in close contact with an inner surface of the second heat conduction panel.

9. The plurality of absorber fixing parts are a one-side absorber fixing portion protruding from the one-side thermal conduction panel toward the other-side thermal conduction panel; an other-side absorber fixing portion protruding from the other-side heat conduction panel toward the one-side heat conduction panel, the one-side absorbent body fixing portion passes through the one-side absorbent member to support the other-side absorbent member; The active heat dissipation device according to claim 7 , wherein the other-side absorbent body fixing portion passes through the other-side absorbent member to support the one-side absorbent member.

10. The active heat dissipation device according to claim 2 , wherein the absorber has a plurality of joint through-holes formed therein so that the plurality of joints interpenetrate and face each other.

11. The active heat dissipation device according to claim 2 , wherein the plurality of joints and the plurality of absorber fixing portions are arranged alternately and spaced apart in a certain linear direction of the heat conduction panel body.

12. When at least one end of the heat conduction panel body in a state where the one-side heat conduction panel and the other-side heat conduction panel are joined together forms a press-fit end that is disposed adjacent to a heat-generating element that is a heat dissipation target, The active heat dissipation device of claim 2 , wherein the absorber is at least partially aligned along the press-fit end.

13. When the portions of the one-side thermal conduction panel and the other-side thermal conduction panel excluding the press-fit ends are defined as heat sink portions, The active heat dissipation device according to claim 12 , wherein the remaining portion of the absorber is bent and extended in a straight line at a portion of the heat dissipation plate that is positioned relatively lower in the direction of gravity.

14. 2. The active heat dissipation device according to claim 1, wherein the one-side heat conduction panel and the other-side heat conduction panel are provided with at least one chamber partition that divides the refrigerant flow space into at least two or more after being joined and that is joined to each other when the panels are joined.

15. 15. The active heat dissipation device according to claim 14, wherein the absorbers are arranged in at least two or more of the refrigerant flow spaces defined by the chamber partition in a number corresponding to the number of the respective refrigerant flow spaces.

16. The active heat dissipation device of claim 12 , wherein the press-fit end is provided with a refrigerant fill port communicating with the refrigerant flow space for filling the refrigerant.

17. 17. The active heat dissipation device of claim 16, further comprising a caulking member that, after being filled with the refrigerant and inserted into the refrigerant fill port, seals the refrigerant flow space by crimping the refrigerant fill port.

18. 18. The active heat dissipation device of claim 17, wherein the refrigerant fill port including the caulking member is cut open to match the outer edge of the press-fit end after the caulking member is inserted into the refrigerant fill port.

19. When the end opposite to the press-fit end is defined as a heat dissipation end, 13. The active heat dissipation device of claim 12, wherein the heat dissipation end has stiffening ribs machined along the end to increase stiffness.

20. The rigid rib is a rigid rib groove formed on one side of the heat conduction panel by recessing the rigid rib groove toward an outer side of the refrigerant flow space; 20. The active heat dissipation device according to claim 19, further comprising: a second rigid rib groove recessed from the second heat conduction panel toward an outer side of the refrigerant flow space.

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