A heat dissipation module for a server

Abstract

This application relates to the field of server heat dissipation technology, and in particular to a server heat dissipation module, including a substrate, a heat-conducting plate, a first heat pipe, a first heat dissipation component, a second heat dissipation component, and a third heat dissipation component. Multiple first heat dissipation fins are formed at opposite ends of the substrate. The middle portion of the first heat pipe contacts the top end of the heat-conducting plate. The first heat dissipation component is mounted on a first support portion. The second heat dissipation component is mounted on a second support portion. The third heat dissipation component is mounted at the middle of the top end of the substrate, contacting the middle portion of the first heat pipe. The heat generated by the component to be cooled is first transferred to the middle portion of the heat pipe via the heat-conducting plate, and then to the opposite ends of the heat pipe. The heat in the middle of the heat pipe is conducted into the air via the third heat dissipation component, the heat at one end is conducted into the air via the first heat dissipation component, and the heat at the other end is conducted into the air via the second heat dissipation component. Overall, this significantly improves the heat dissipation effect and efficiency of the server heat dissipation module.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to a heat dissipation module for servers. Background Technology

[0002] With the explosive growth of cloud computing, big data, and artificial intelligence, servers are rapidly evolving towards higher density, higher power, and smaller size. The power consumption of core components such as the central processing unit or graphics processing unit in a single server has exceeded 300W, making heat dissipation an increasingly serious issue. Effective heat dissipation directly determines the server's operational stability, computing efficiency, and lifespan; therefore, the demand for efficient heat dissipation solutions is becoming increasingly urgent.

[0003] Currently, existing server cooling modules include heat pipes, heat spreaders, and heat sink fins. The heat spreader contacts the CPU / GPU. One end of the heat spreader contacts the heat spreader, and the other end contacts the heat sink fins. The heat generated by the CPU / GPU is transferred to the heat sink fins via the heat spreader and heat spreader, where it is dissipated.

[0004] The existing technical solutions mentioned above have the following drawbacks: the heat dissipation effect of existing server heat dissipation modules is still poor, and they cannot effectively dissipate heat for higher power processors. Summary of the Invention

[0005] To improve heat dissipation, this application provides a heat dissipation module for servers.

[0006] This application provides a heat dissipation module for a server, which adopts the following technical solution: A server heat dissipation module includes: The substrate has a clearance hole in the middle and multiple first heat dissipation fins formed at opposite ends; the multiple first heat dissipation fins at each end are evenly distributed along the width direction of the substrate. The heat-conducting plate is installed in the clearance hole at the top and contacts the heat-dissipating component of the server that is used with the server heat dissipation module at the bottom. The first heat pipe is located in the middle of the clearance hole and contacts the top of the heat-conducting plate. Its two ends are bent upwards to form the first support part and the second support part. The first heat dissipation component is installed on the first support and has a plurality of second heat dissipation fins evenly arranged in the vertical direction. The second heat dissipation component is installed on the second support and has multiple third heat dissipation fins evenly arranged in the vertical direction. The third heat dissipation component is installed at the top center of the substrate, in contact with the center of the first heat pipe, and has multiple fourth heat dissipation fins evenly arranged along the width of the substrate.

[0007] By adopting the above technical solution, the first heat dissipation fins located at both ends effectively increase the contact area between the substrate and the air, thereby effectively improving the heat dissipation effect and efficiency at the opposite ends of the substrate. The heat generated by the component to be cooled is first transferred to the middle of the heat pipe via the heat-conducting plate, and then to the opposite ends of the heat pipe. The heat in the middle of the heat pipe is conducted into the air through multiple fourth heat dissipation fins, forming a heat conduction path. The heat at one end of the heat pipe is conducted into the air through multiple second heat dissipation fins, also forming a heat conduction path. The heat at the other end of the heat pipe is conducted into the air through multiple third heat dissipation fins, forming yet another heat conduction path. Overall, the heat dissipation effect and efficiency of the server cooling module are significantly improved. Air can flow smoothly from one side of the server cooling module to the other side, further improving the heat dissipation effect and efficiency.

[0008] This application further specifies that each second heat sink fin includes: Inner thermally conductive core layer; An outer thermally conductive layer covers the outer surface of the inner thermally conductive core layer; A liquid thermally conductive layer is filled between the outer side of the inner thermally conductive core layer and the inner side of the outer thermally conductive blanket layer. The structure of each second heat dissipation fin is the same as that of each third heat dissipation fin and each fourth heat dissipation fin.

[0009] By adopting the above technical solution, the thermal conductivity of the inner heat-conducting core layer in its own plane is higher than that of the outer heat-conducting blanket layer in its own plane, thus serving as the primary heat-conducting layer and enabling rapid heat transfer. The outer heat-conducting blanket layer serves as an auxiliary heat-conducting layer. Simultaneously, the inner heat-conducting core layer facilitates directional heat transfer. The outer heat-conducting blanket layer protects the inner heat-conducting core layer, extending its service life. The liquid heat-conducting layer is formed from room-temperature liquid metal. Compared to the direct contact between the outer side of the inner heat-conducting core layer and the inner side of the outer heat-conducting blanket layer, this effectively reduces the thermal resistance at the contact interface, thereby improving heat transfer efficiency.

[0010] This application further specifies that the first heat dissipation component also includes: The first housing is formed on the outside of a plurality of second heat dissipation fins, and both the side near the second heat dissipation assembly and the side away from the second heat dissipation assembly are open structures; The second heat dissipation component also includes: The second housing is formed on the outside of multiple third heat dissipation fins, with an open structure on both the side near the first heat dissipation component and the side away from the first heat dissipation component; The third heat dissipation component also includes: The third housing is formed on the outside of multiple fourth heat dissipation fins, and has an open structure on both the side near the first heat dissipation component and the side near the second heat dissipation component.

[0011] The present application further provides that: a plurality of limiting protrusions are formed in the middle of the top of the substrate; the plurality of limiting protrusions cooperate to form a limiting groove for constraining the third heat dissipation component.

[0012] By adopting the above technical solution, the limiting groove plays a positioning role when assembling the substrate and the third heat dissipation component, ensuring assembly accuracy and efficiency. After the substrate and the third heat dissipation component are assembled, the limiting groove can prevent the third heat dissipation component from moving, ensuring the heat dissipation effect.

[0013] This application further includes: Connectors are mounted on the base plate.

[0014] This application further specifies that the connector includes: Connecting bolts are used to install the base plate. The spring is fitted onto the connecting bolt and abuts against the top of the base plate.

[0015] This application further includes: The liquid cooling plate is installed on top of the third heat dissipation component, with a liquid inlet at one end and a liquid outlet at the other end.

[0016] By adopting the above technical solution, the liquid cooling plate not only cools the third heat dissipation component, further improving the heat dissipation effect, but also serves to isolate the third heat dissipation component from the fourth heat dissipation component.

[0017] This application further includes: The fourth heat dissipation component is installed on the top of the liquid cooling plate, and multiple fifth heat dissipation fins are evenly arranged along the width of the substrate. The second heat pipe has a closed ring structure and passes through each of the fourth and fifth heat dissipation fins in sequence.

[0018] By adopting the above technical solution, the second heat pipe enables the heat to be quickly and directionally conducted to each of the fifth heat dissipation fins, allowing the heat on the fourth heat dissipation fins to migrate rapidly, thereby further improving the heat dissipation effect.

[0019] This application further includes: The conductive housing is installed at one end of the substrate and is located on the side of the first heat dissipation component away from the second heat dissipation component. Both the side close to the first heat dissipation component and the side away from the first heat dissipation component are open structures. A high-voltage pulse generator is installed at one end of the substrate and is connected to the conductive housing and the first heat dissipation assembly, respectively.

[0020] By adopting the above technical solution, when the high-voltage pulse generator powers the conductive housing and the first heat dissipation component, a directional airflow is generated in the first housing. The airflow flows toward the second and third heat dissipation components, further improving the heat dissipation effect and efficiency.

[0021] In summary, the beneficial technical effects of this application are as follows: 1. The first heat dissipation fins located at both ends effectively increase the contact area between the substrate and the air, thereby effectively improving the heat dissipation effect and efficiency at the opposite ends of the substrate. The heat generated by the component to be cooled is first transferred to the middle of the heat pipe via the heat-conducting plate, and then to the opposite ends of the heat pipe. The heat in the middle of the heat pipe is conducted into the air through multiple fourth heat dissipation fins, forming a heat conduction path. The heat at one end of the heat pipe is conducted into the air through multiple second heat dissipation fins, also forming a heat conduction path. The heat at the other end of the heat pipe is conducted into the air through multiple third heat dissipation fins, forming yet another heat conduction path. Overall, this significantly improves the heat dissipation effect and efficiency of the server cooling module. Air can flow smoothly from one side of the server cooling module to the other side, further improving the heat dissipation effect and efficiency.

[0022] 2. The inner heat-conducting core layer has a higher thermal conductivity in its own plane than the outer heat-conducting blanket layer, serving as the primary heat-conducting layer and enabling rapid heat transfer. The outer heat-conducting blanket layer acts as a secondary heat-conducting layer. Simultaneously, the inner heat-conducting core layer facilitates directional heat transfer. The outer heat-conducting blanket layer protects the inner heat-conducting core layer, extending its lifespan. The liquid heat-conducting layer is formed from room-temperature liquid metal. Compared to the direct contact between the outer side of the inner heat-conducting core layer and the inner side of the outer heat-conducting blanket layer, this effectively reduces the thermal resistance at the contact interface, thereby improving heat transfer efficiency.

[0023] 3. The liquid cooling plate not only cools the third heat dissipation component, further improving its heat dissipation effect, but also acts as a barrier between the third and fourth heat dissipation components. The second heat pipe facilitates rapid, directional heat transfer to each of the fifth heat dissipation fins, allowing heat to migrate quickly from the fourth heat dissipation fins and further improving heat dissipation.

[0024] 4. When the high-voltage pulse generator powers the conductive housing and the first heat dissipation component, a directional airflow is generated inside the first housing. The airflow flows toward the second and third heat dissipation components, further improving the heat dissipation effect and efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a server heat dissipation module according to one embodiment; Figure 2 yes Figure 1The diagram shows a structural schematic of a server heat dissipation module from another perspective. Figure 3 yes Figure 1 The diagram shows the combined structure of the base plate, heat-conducting plate and first heat pipe in the server heat dissipation module. Figure 4 This is a schematic diagram of the internal structure of the second heat sink fin; Figure 5 This is a schematic diagram of another embodiment of a server heat dissipation module; Figure 6 yes Figure 5 The diagram shows the structure of the second heat pipe in the server cooling module. Figure 7 This is a structural schematic diagram of another embodiment of a server heat dissipation module.

[0026] Reference numerals: 110, substrate; 111, clearance hole; 112, first heat dissipation fin; 113, limiting protrusion; 120, heat-conducting plate; 121, heat-conducting protrusion; 130, first heat pipe; 131, first support portion; 132, second support portion; 140, first heat dissipation assembly; 141, second heat dissipation fin; 1411, inner heat-conducting core layer; 1412, outer heat-conducting blanket layer; 1413, liquid heat-conducting layer; 142, first shell; 150, second heat dissipation assembly; 151. Third heat dissipation fin; 152. Second housing; 160. Third heat dissipation assembly; 161. Fourth heat dissipation fin; 162. Third housing; 170. Connector; 171. Connecting bolt; 172. Spring; 180. Liquid cooling plate; 181. Liquid inlet; 191. Fourth heat dissipation assembly; 1911. Fifth heat dissipation fin; 1912. Fourth housing; 192. Second heat pipe; 193. Conductive housing; 194. Insulating rod; 195. High-voltage pulse generator. Detailed Implementation

[0027] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.

[0028] Reference Figure 1 , Figure 2 and Figure 3This application discloses a server heat dissipation module, including a substrate 110, a heat-conducting plate 120, a first heat pipe 130, a first heat dissipation component 140, a second heat dissipation component 150, and a third heat dissipation component 160. A clearance hole 111 is formed in the middle of the substrate 110, and multiple first heat dissipation fins 112 are formed at opposite ends. The multiple first heat dissipation fins 112 at each end are evenly distributed along the width direction of the substrate 110. The first heat dissipation fins 112 at both ends effectively increase the contact area between the substrate 110 and the air, thereby effectively improving the heat dissipation effect and efficiency at opposite ends of the substrate 110. The top end of the heat-conducting plate 120 is installed in the clearance hole 111, and the bottom end contacts the component to be cooled in the server used with the server heat dissipation module. It should be noted that the component to be cooled is a central processing unit or graphics processing unit, or other components requiring heat dissipation. The first heat pipe 130 is disposed in the middle of the clearance hole 111, contacting the top end of the heat-conducting plate 120, and its opposite ends are bent upwards to form a first support portion 131 and a second support portion 132. A first heat dissipation assembly 140 is mounted on the first support portion 131, and a plurality of second heat dissipation fins 141 are evenly arranged vertically. Each second heat dissipation fin 141 is in contact with the first support portion 131. A second heat dissipation assembly 150 is mounted on the second support portion 132, and a plurality of third heat dissipation fins 151 are evenly arranged vertically. Each third heat dissipation fin 151 is in contact with the second support portion 132. A third heat dissipation assembly 160 is mounted in the middle of the top end of the substrate 110, contacting the middle of the first heat pipe 130, and a plurality of fourth heat dissipation fins 161 are evenly arranged along the width of the substrate 110. The heat generated by the heat-dissipating component is first transferred to the middle of the heat pipe via the heat-conducting plate 120, and then to the opposite ends of the heat pipe. Heat from the middle of the heat pipe is conducted into the air through multiple fourth heat dissipation fins 161, forming a heat conduction path. Heat from one end of the heat pipe is conducted into the air through multiple second heat dissipation fins 141, also forming a heat conduction path. Heat from the other end of the heat pipe is conducted into the air through multiple third heat dissipation fins 151, forming yet another heat conduction path. Overall, this significantly improves the heat dissipation effect and efficiency of the server cooling module. It should be noted that a first airflow channel is formed between every two adjacent second heat dissipation fins 141, a second airflow channel is formed between every two adjacent third heat dissipation fins 151, a third airflow channel is formed between every two adjacent fourth heat dissipation fins 161, and a fourth airflow channel is formed between every two adjacent first heat dissipation fins 112. The first, second, third, and fourth airflow channels are interconnected, allowing air to flow smoothly from one side of the server cooling module to the other, further improving the heat dissipation effect and efficiency.

[0029] Preferably, such as Figure 2As shown, there are 3-5 first heat pipes 130 to ensure heat dissipation efficiency. The middle part of each first heat pipe 130 is flat, which effectively increases the contact area between each first heat pipe 130 and the third heat dissipation component 160 / heat conduction plate 120, thus ensuring heat dissipation effect and efficiency.

[0030] Preferably, a raised ring is provided at the bottom of the substrate 110 to prevent the overall weight of the server heat dissipation module from being applied to the component to be cooled.

[0031] Preferably, such as Figure 3 As shown, a thermally conductive protrusion 121 is formed at the bottom of the heat-conducting plate 120. The thermally conductive protrusion 121 enables good contact between the heat-conducting plate 120 and the component to be cooled, ensuring the heat dissipation effect. It should be noted that, in order to reduce the thermal resistance at the contact interface between the thermally conductive protrusion 121 and the component to be cooled, a layer of thermally conductive silicone grease is provided between the thermally conductive protrusion 121 and the component to be cooled.

[0032] Reference Figure 4In one embodiment, each second heat dissipation fin 141 includes an inner thermally conductive core layer 1411, an outer thermally conductive blanket layer 1412, and a liquid thermally conductive layer 1413. The outer thermally conductive blanket layer 1412 covers the outer surface of the inner thermally conductive core layer 1411. The thermal conductivity of the inner thermally conductive core layer 1411 in its own plane is higher than that of the outer thermally conductive blanket layer 1412 in its own plane, serving as the primary thermally conductive layer, enabling rapid heat conduction. The outer thermally conductive blanket layer 1412 serves as an auxiliary thermally conductive layer. Simultaneously, the inner thermally conductive core layer 1411 facilitates directional heat conduction. The outer thermally conductive blanket layer 1412 protects the inner thermally conductive core layer 1411, extending its service life. The inner thermally conductive core layer 1411 is made of pyrolytic graphite thermally conductive material, while the outer thermally conductive blanket layer 1412 is made of aluminum, copper, or tungsten copper, etc. The thermal conductivity of the inner heat-conducting core layer 1411 in its own plane is much higher than that of the outer heat-conducting blanket layer 1412 in its own plane, and the thermal conductivity of the inner heat-conducting core layer 1411 in its thickness direction is much lower than that of the outer heat-conducting blanket layer 1412 in its thickness direction, allowing for faster and more directional heat conduction. Furthermore, the inner heat-conducting core layer 1411 is lighter than the outer heat-conducting blanket layer 1412, enabling a lightweight design for the heat sink fins. Simultaneously, the inner heat-conducting core layer 1411 undergoes negative expansion when heated, while the outer heat-conducting blanket layer 1412 undergoes positive expansion, canceling each other out and reducing the impact of thermal expansion. A liquid heat-conducting layer 1413 fills the space between the outer side of the inner heat-conducting core layer 1411 and the inner side of the outer heat-conducting blanket layer 1412. The liquid heat-conducting layer 1413 is formed from room-temperature liquid metal. Compared to the direct contact between the outer side of the inner thermally conductive core layer 1411 and the inner side of the outer thermally conductive blanket layer 1412, this effectively reduces the thermal resistance at the contact interface, thereby improving the heat transfer efficiency. The structure of each second heat dissipation fin 141 is the same as that of each third heat dissipation fin 151 and each fourth heat dissipation fin 161.

[0033] Reference Figure 1 In one embodiment, the first heat dissipation assembly 140 further includes a first housing 142. The first housing 142 is formed on the exterior of a plurality of second heat dissipation fins 141, and has an open structure on both the side near the second heat dissipation assembly 150 and the side away from the second heat dissipation assembly 150. The second heat dissipation assembly 150 also includes a second housing 152. The second housing 152 is formed on the exterior of a plurality of third heat dissipation fins 151, and has an open structure on both the side near the first heat dissipation assembly 140 and the side away from the first heat dissipation assembly 140. The third heat dissipation assembly 160 further includes a third housing 162. The third housing 162 is formed on the exterior of a plurality of fourth heat dissipation fins 161, and has an open structure on both the side near the first heat dissipation assembly 140 and the side near the second heat dissipation assembly 150. In this way, air can flow from one side of the server heat dissipation module to the other side of the server heat dissipation module.

[0034] Reference Figure 1 In one embodiment, a plurality of limiting protrusions 113 are formed at the center of the top end of the substrate 110. The plurality of limiting protrusions 113 cooperate to form a limiting groove that constrains the third heat dissipation component 160. When assembling the substrate 110 and the third heat dissipation component 160, the limiting groove plays a positioning role, ensuring assembly accuracy and assembly efficiency. After the substrate 110 and the third heat dissipation component 160 are assembled, the limiting groove can prevent the third heat dissipation component 160 from moving, ensuring the heat dissipation effect.

[0035] Reference Figure 1 In one embodiment, the server heat dissipation module further includes multiple connectors 170, which are respectively mounted on the substrate 110 for connecting the substrate 110 and the server. Each connector 170 includes a connecting bolt 171 and a spring 172. The connecting bolt 171 is mounted on the substrate 110 for connecting the substrate 110 and the server. The spring 172 is sleeved on the connecting bolt 171 and abuts against the top end of the substrate 110. When the bottom end of the connecting bolt 171 is connected to the server, the spring 172 causes the connecting bolt 171 to have an upward tendency to move, effectively improving the stability of the connection.

[0036] Reference Figure 5 and Figure 6 In one embodiment, the server heat dissipation module further includes a liquid cooling plate 180, a fourth heat dissipation component 191, and a second heat pipe 192. The liquid cooling plate 180 is mounted on the top of the third heat dissipation component 160, with an inlet 181 at one end and an outlet at the other. The fourth heat dissipation component 191 is mounted on the top of the liquid cooling plate 180, and a plurality of fifth heat dissipation fins 1911 are uniformly arranged along the width of the substrate 110. The second heat pipe 192 has a closed-loop structure and passes through each fourth heat dissipation fin 161 and each fifth heat dissipation fin 1911 in sequence. Coolant flows into the liquid cooling plate 180 through the inlet 181 and then flows out of the liquid cooling plate 180 through the outlet. On the one hand, the liquid cooling plate 180 cools the third heat dissipation component 160, further improving the heat dissipation effect. On the other hand, the liquid cooling plate 180 serves to isolate the third heat dissipation component 160 and the fourth heat dissipation component 191. The second heat pipe 192 is used to quickly and directionally conduct heat to each fifth heat dissipation fin 1911, so that the heat on the fourth heat dissipation fin 161 can be quickly transferred, further improving the heat dissipation effect.

[0037] Preferably, the fourth heat dissipation assembly 191 further includes a fourth housing 1912. The fourth housing 1912 is formed on the outside of the plurality of fifth heat dissipation fins 1911, and has an open structure on both the side near the first heat dissipation assembly 140 and the side near the second heat dissipation assembly 150. This facilitates airflow from one side of the server heat dissipation module to the other side of the server heat dissipation module.

[0038] Preferably, the number of second heat pipes 192 is 2-5.

[0039] Reference Figure 7 In one embodiment, the server heat dissipation module further includes a conductive housing 193 and a high-voltage pulse generator 195. The conductive housing 193 is mounted to one end of the substrate 110 via an insulating rod 194, and is located on the side of the first heat dissipation component 140 away from the second heat dissipation component 150. Both the side near and away from the first heat dissipation component 140 are open structures. The high-voltage pulse generator 195 is mounted to one end of the substrate 110 and is electrically connected to the conductive housing 193 and the first heat dissipation component 140, respectively. The high-voltage pulse generator 195 can generate high-voltage pulses, with a peak voltage reaching 100KV. It should be noted that the conductive housing 193 is made of metal, and the material of the conductive housing 193 is different from the material of the outer heat-conducting layer 1412. For example, the conductive housing 193 may be made of iron, while the outer heat-conducting layer 1412 and the first housing 142 may be made of copper. When the high-voltage pulse generator 195 energizes the conductive housing 193 and the first heat dissipation assembly 140, a directional airflow is generated within the first housing 142. Figure 7 The direction of the airflow (indicated by the middle arrow) is such that the airflow flows towards the second heat dissipation component 150 and the third heat dissipation component 160, further improving the heat dissipation effect and efficiency. It should be noted that the contact area between each second heat dissipation fin 141 and the first heat pipe 130 should be insulated, such as by applying thermally conductive insulating silicone grease.

[0040] The implementation principle of this embodiment is as follows: Multiple first heat dissipation fins 112 are formed at opposite ends of the substrate 110. These first heat dissipation fins 112 effectively increase the contact area between the substrate 110 and the air, thereby effectively improving the heat dissipation effect and efficiency at opposite ends of the substrate 110. The heat generated by the component to be cooled is first transferred to the middle of the heat pipe via the heat-conducting plate 120, and then to the opposite ends of the heat pipe. The heat from the middle of the heat pipe is conducted into the air via multiple fourth heat dissipation fins 161, forming a heat conduction path. The heat from one end of the heat pipe is conducted into the air via multiple second heat dissipation fins 141, also forming a heat conduction path. The heat from the other end of the heat pipe is conducted into the air via multiple third heat dissipation fins 151, forming yet another heat conduction path. Overall, the heat dissipation effect and efficiency of the server heat dissipation module are significantly improved. Air can flow smoothly from one side of the server heat dissipation module to the other side, further improving the heat dissipation effect and efficiency.

[0041] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation module for servers, characterized in that, include: The substrate (110) has a clearance hole (111) formed in the middle and multiple first heat dissipation fins (112) formed at opposite ends; the multiple first heat dissipation fins (112) at each end are evenly distributed along the width direction of the substrate (110). The heat-conducting plate (120) is installed at the top end in the clearance hole (111) and at the bottom end in contact with the heat dissipation component of the server used in conjunction with the server heat dissipation module. The first heat pipe (130) is disposed in the middle of the clearance hole (111) and contacts the top of the heat-conducting plate (120). The two ends are bent upward respectively to form the first support part (131) and the second support part (132). The first heat dissipation component (140) is installed on the first support part (131) and has a plurality of second heat dissipation fins (141) evenly arranged in the vertical direction; The second heat dissipation component (150) is installed on the second support part (132) and has a plurality of third heat dissipation fins (151) evenly arranged in the vertical direction; The third heat dissipation component (160) is installed at the middle of the top of the substrate (110) and is in contact with the middle of the first heat pipe (130). A plurality of fourth heat dissipation fins (161) are uniformly arranged along the width direction of the substrate (110).

2. The server heat dissipation module according to claim 1, characterized in that, Each of the second heat dissipation fins (141) includes: Inner thermally conductive core layer (1411); An outer thermally conductive layer (1412) covers the outer surface of the inner thermally conductive core layer (1411); A liquid thermally conductive layer (1413) is filled between the outer side of the inner thermally conductive core layer (1411) and the inner side of the outer thermally conductive blanket layer (1412); The structure of each of the second heat dissipation fins (141) is the same as that of each of the third heat dissipation fins (151) and each of the fourth heat dissipation fins (161).

3. The server heat dissipation module according to claim 1, characterized in that, The first heat dissipation assembly (140) further includes: The first housing (142) is formed on the outside of the plurality of second heat dissipation fins (141), and the side near the second heat dissipation assembly (150) and the side away from the second heat dissipation assembly (150) are both open structures; The second heat dissipation component (150) also includes: The second housing (152) is formed on the outside of the plurality of third heat dissipation fins (151), and the side near the first heat dissipation assembly (140) and the side away from the first heat dissipation assembly (140) are both open structures. The third heat dissipation component (160) also includes: The third housing (162) is formed outside the plurality of fourth heat dissipation fins (161), and has an open structure on the side near the first heat dissipation assembly (140) and the side near the second heat dissipation assembly (150).

4. The server heat dissipation module according to claim 1, characterized in that, A plurality of limiting protrusions (113) are formed at the center of the top of the substrate (110); the plurality of limiting protrusions (113) cooperate to form a limiting groove that constrains the third heat dissipation component (160).

5. The server heat dissipation module according to any one of claims 1 to 4, characterized in that, Also includes: A connector (170) is mounted on the substrate (110).

6. The server heat dissipation module according to claim 5, characterized in that, The connector (170) includes: A connecting bolt (171) is installed on the base plate (110); A spring (172) is fitted onto the connecting bolt (171) and abuts against the top of the base plate (110).

7. The server heat dissipation module according to any one of claims 1 to 4, characterized in that, Also includes: A liquid cooling plate (180) is installed on the top of the third heat dissipation assembly (160), with a liquid inlet (181) at one end and a liquid outlet at the other end.

8. The server heat dissipation module according to claim 7, characterized in that, Also includes: The fourth heat dissipation component (191) is installed on the top of the liquid cooling plate (180), and a plurality of fifth heat dissipation fins (1911) are uniformly arranged along the width direction of the substrate (110). The second heat pipe (192) has a closed ring structure and passes through each of the fourth heat dissipation fins (161) and each of the fifth heat dissipation fins (1911) in sequence.

9. The server heat dissipation module according to any one of claims 1 to 4, characterized in that, Also includes: The conductive housing (193) is installed at one end of the substrate (110) and is located on the side of the first heat dissipation component (140) away from the second heat dissipation component (150). Both the side close to the first heat dissipation component (140) and the side away from the first heat dissipation component (140) are open structures. A high-voltage pulse generator (195) is installed at one end of the substrate (110) and is connected to the conductive housing (193) and the first heat dissipation assembly (140) respectively.

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