Camera actuator and camera module including same

Abstract

An embodiment of the present invention discloses a camera module including: a first actuator, a second actuator, and a circuit board arranged sequentially along an optical axis direction, the circuit board including a first circuit board portion on which an image sensor is mounted; and a second circuit board portion connected to the first circuit board portion and extending along the optical axis direction, the second circuit board portion overlapping the first actuator and the second actuator in a direction perpendicular to the optical axis direction and connected to the first actuator.

Description

[Technical Field]

[0001] The present invention relates to a camera actuator and a camera module including the same. [Background technology]

[0002] A camera is a device that takes photos or videos of a subject and is attached to mobile devices, drones, vehicles, etc. To improve image quality, a camera module can have an image stabilization (IS) function that corrects or prevents image shake caused by user movement, an autofocus (AF) function that automatically adjusts the distance between the image sensor and lens to align the lens focal length, and a zooming function that increases or decreases the magnification of a distant subject through a zoom lens.

[0003] Due to the trend towards smaller camera devices, efficient electrical connections between circuit boards within the camera device are important.

[0004] There is also a need for a structure that reduces assembly and reliability problems within miniaturized camera modules. Summary of the Invention [Problem to be solved by the invention]

[0005] A technical problem that the embodiments of the present invention aim to solve is to provide a camera actuator and a camera module that have a long stroke but have improved assembly properties and reliability through a connector portion.

[0006] The embodiments of the present invention can provide a camera actuator and a camera module that eliminate assembly tolerances by adjusting the structure of the circuit board and suppressing the inflow of foreign matter.

[0007] Embodiments of the present invention can provide a camera actuator and a camera module that are applicable to ultra-slim, ultra-compact and high-resolution cameras.

[0008] Another technical problem to be solved by the present invention is to provide a camera actuator and a camera device that can efficiently connect a main board and a circuit board for the actuator in a camera device including an actuator.

[0009] Another technical problem that the present invention aims to solve is to provide a camera actuator that is applicable to ultra-slim, ultra-miniature and high-resolution cameras.

[0010] The problems to be solved by the examples are not limited to these, and may also include the objectives and effects that can be grasped from the means for solving the problems and embodiments described below. [Means for solving the problem]

[0011] A camera module according to an embodiment of the present invention includes a first actuator, a second actuator, and an image sensor sequentially arranged along an optical axis direction; and a circuit board arranged around the first actuator and the second actuator; the circuit board includes a first circuit board portion on which the image sensor is mounted; and a second circuit board portion connected to the first circuit board portion and extending along the optical axis direction; and the second circuit board portion overlaps the first actuator and the second actuator in a direction perpendicular to the optical axis direction and is connected to the first actuator.

[0012] The length of the first actuator in a direction perpendicular to the optical axis direction may be smaller than the length of the second actuator in a direction perpendicular to the optical axis direction.

[0013] The second circuit board portion may include a first region located at the outermost side and a second region located inside the first region.

[0014] The second circuit board unit may include a common board; a first individual board disposed in the first region; and a second individual board disposed in the second region.

[0015] The length of the first individual substrate in the optical axis direction may be 0.5 times or more the length of the common substrate in the optical axis direction in the first region.

[0016] The second individual substrate may have a length in the optical axis direction that is 0.5 times or less of the length in the optical axis direction of the common substrate in the second region.

[0017] The circuit board may include a third circuit board portion extending in a direction perpendicular to the optical axis direction in the second circuit board portion and including a first connector, and the second circuit board portion may include a second connector overlapping and connected to the first actuator in a direction perpendicular to the optical axis direction.

[0018] The first actuator may include a first substrate portion disposed on a side surface, and the second actuator may include a second substrate portion disposed on a side surface.

[0019] The first board portion may be electrically connected to the second connector by pin coupling.

[0020] The first actuator may include a first drive unit disposed on the first substrate portion; the first drive unit may be disposed apart from the second connector, and the first drive unit may be disposed offset from the second connector in a direction perpendicular to the optical axis direction.

[0021] The second connector may be disposed at an end of the second circuit board portion in the optical axis direction.

[0022] The second circuit board portion may include a terminal groove and a coupling groove disposed in the first region, and the first region may partially overlap with the first actuator in a direction perpendicular to the optical axis direction.

[0023] The second region may include a 2-1 region located at the innermost side; and a 2-2 region disposed between the first region and the 2-1 region in a direction perpendicular to the optical axis direction.

[0024] The 2-1 region can be in contact with the first actuator.

[0025] The cover may include a cover that surrounds the first actuator, the second actuator, and the circuit board, the cover being asymmetric with respect to the optical axis, and the cover may include a first cover hole disposed on an upper surface thereof, and a second cover hole adjacent to the second circuit board portion.

[0026] A camera device according to an embodiment of the present invention includes an image sensor; a first circuit board electrically connected to the image sensor; a first camera actuator; and a second circuit board electrically connected to the first camera actuator, wherein one end of the first circuit board includes a plurality of first pads extending in a first direction and spaced apart from each other in a second direction perpendicular to the first direction, and one end of the second circuit board includes a plurality of second pads extending in the first direction and spaced apart from each other in the second direction, the plurality of first pads and the plurality of second pads being in one-to-one correspondence, and at least partial regions of the plurality of first pads and at least partial regions of the plurality of second pads being arranged to overlap each other in a third direction perpendicular to the first and second directions, the plurality of first pads and the plurality of second pads being soldered, and a hole formed in each of the plurality of first pads and the hole being arranged above each of the plurality of second pads.

[0027] The sum of the lengths in the first direction of the first pads and second pads among the plurality of first pads and the plurality of second pads that are arranged to overlap each other in the third direction may be longer than the lengths in the first direction of the first pads and the second pads when they are overlapped each other.

[0028] One end of the first circuit board may be disposed above one end of the second circuit board.

[0029] Solder may be placed in the hole of the first pad.

[0030] Solder may be disposed in the holes, on the lower surfaces of the first pads and on the upper surfaces of the second pads.

[0031] The width of the hole may be 40 to 70% of the width of each of the first pads.

[0032] One end of the first circuit board may be a flexible printed circuit board (FPCB).

[0033] The first circuit board may include a flexible printed circuit board (FPCB), a first region of the FPCB may be arranged to overlap the second circuit board in the first direction, a second region of the FPCB may be arranged to overlap the second circuit board in the third direction, and the first pad may be arranged on the second region of the FPCB.

[0034] The first direction may be an optical axis direction.

[0035] The first camera actuator may be an OIS (optical image stabilization) actuator.

[0036] The first circuit board may include a 1-1 circuit board arranged to extend in a direction perpendicular to the first direction on the lower surface of the image sensor, and a 1-2 circuit board connected to the 1-1 circuit board and arranged to extend in the first direction, and the plurality of first pads may be arranged on the 1-2 circuit board.

[0037] The camera may further include a second camera actuator disposed between the image sensor and the first camera actuator, wherein the first-1 circuit board, the image sensor, the second camera actuator, and the first camera actuator are sequentially disposed along the first direction, and the first-2 circuit board is disposed on a side of the second camera actuator.

[0038] The first camera actuator may be an OIS (optical image stabilization) actuator, and the second camera actuator may be a zooming actuator or an AF (autofocusing) actuator. [Effects of the Invention]

[0039] The technical problem to be solved by the embodiments of the present invention is to realize a camera actuator and a camera module that have a long stroke but have improved assembly efficiency and reliability through a connector portion.

[0040] According to an embodiment of the present invention, a camera actuator and a camera module in which assembly tolerances are eliminated by adjusting the structure of a circuit board and in which intrusion of foreign matter is suppressed can be realized.

[0041] The embodiment of the present invention can prevent foreign matter from entering through the plate, thereby realizing a camera actuator and a camera module with improved reliability.

[0042] Furthermore, according to the embodiment of the present invention, it is possible to obtain a camera actuator and a camera device that can efficiently connect a main board and a circuit board for the actuator in a camera device including an actuator.

[0043] According to an embodiment of the present invention, a camera actuator applicable to ultra-slim, ultra-miniature and high-resolution cameras can be obtained.

[0044] The various beneficial advantages and effects of the present invention are not limited to the above, but will be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0045] [Figure 1] FIG. 1 is a perspective view of a camera module according to an embodiment.

[0046] [Figure 2] FIG. 1 is an exploded perspective view of a camera module according to an embodiment.

[0047] [Figure 3] FIG. 2 is a cross-sectional view taken along the line AA′ in FIG.

[0048] [Figure 4] FIG. 2 is a perspective view of a second camera actuator according to the embodiment.

[0049] [Figure 5] This is a view taken along the line DD' in Figure 4.

[0050] [Figure 6] FIG. 1 is a perspective view illustrating a circuit board according to an embodiment.

[0051] [Figure 7] FIG. 2 is a front view illustrating a circuit board according to the embodiment.

[0052] [Figure 8] FIG. 2 is a plan view illustrating a circuit board according to an embodiment.

[0053] [Figure 9] FIG. 2 is a perspective view of a cover according to an embodiment.

[0054] [Figure 10] FIG. 4 is a bottom view of the cover according to the embodiment.

[0055] [Figure 11] FIG. 2 is a plan view of a cover and a circuit board according to the embodiment.

[0056] [Figure 12] FIG. 2 is a perspective view of a cover and a circuit board according to the embodiment.

[0057] [Figure 13] FIG. 1 is a perspective view of a camera module according to an embodiment.

[0058] [Figure 14] FIG. 1 is a plan view of a camera module according to an embodiment.

[0059] [Figure 15] 2 is a perspective view of a first substrate unit, a second substrate unit, and a circuit board in the camera module according to the embodiment. FIG.

[0060] [Figure 16] FIG. 2 is a side view of the camera module according to the embodiment.

[0061] [Figure 17] This is a view taken along line II' in FIG.

[0062] [Figure 18] This is an enlarged view of part K in FIG.

[0063] [Figure 19] FIG. 1 is a perspective view of a camera device according to an embodiment.

[0064] [Figure 20] FIG. 1 is an exploded perspective view of a camera device according to an embodiment.

[0065] [Figure 21] This is a view from AA' in Figure 19.

[0066] [Figure 22] FIG. 2 is a perspective view of a first camera actuator according to the embodiment.

[0067] [Figure 23] FIG. 2 is an exploded perspective view of a first camera actuator according to the embodiment.

[0068] [Figure 24] FIG. 2 is a perspective view of a second camera actuator according to the embodiment.

[0069] [Figure 25] FIG. 2 is a perspective view of the camera device according to the embodiment with the cover removed.

[0070] [Figure 26] FIG. 2 is an exploded perspective view of the camera device according to the embodiment, with the cover removed.

[0071] [Figure 27] FIG. 2 is a perspective view of a circuit board of the camera device according to the embodiment.

[0072] [Figure 28] FIG. 1 is a front view of the circuit board connection structure according to the embodiment after soldering.

[0073] [Figure 29] FIG. 2 is a perspective view of the circuit board connection structure according to the embodiment after soldering.

[0074] [Figure 30] 1 is a cross-sectional view of the circuit board connection structure according to the embodiment after soldering.

[0075] [Figure 31] 1 is a front view of a circuit board connection structure according to an embodiment before soldering;

[0076] [Figure 32] 1 is a perspective view of a circuit board connection structure according to an embodiment before soldering;

[0077] [Figure 33]1 is a cross-sectional view of a circuit board connection structure according to an embodiment before soldering.

[0078] [Figure 34] 1 is an exploded view for explaining a circuit board connection structure according to an embodiment.

[0079] [Figure 35] FIG. 2 is a partially enlarged perspective view of the circuit board connection structure.

[0080] [Figure 36] 1 is a perspective view of a mobile terminal to which a camera module according to an embodiment is applied;

[0081] [Figure 37] 1 is a perspective view of a vehicle to which a camera module according to an embodiment is applied; DETAILED DESCRIPTION OF THE INVENTION

[0082] Although the present invention can be modified in various ways and has various embodiments, specific embodiments will be illustrated and described in the drawings. However, it is not intended to limit the present invention to the specific embodiments, and it should be understood that the present invention includes all modifications, equivalents, and alternatives that fall within the spirit and technical scope of the present invention.

[0083] Terms including ordinal numbers, such as "second," "first," etc., may be used to describe various components, but the components are not limited by the terms. Terms are used only to distinguish one component from another. For example, a second component may be designated as a "first component," and similarly, a first component may be designated as a "second component," without departing from the scope of the present invention. The term "and / or" includes a combination of multiple related listed items or any of multiple related listed items.

[0084] When a component is said to be "coupled" or "connected" to another component, it should be understood that it may be directly coupled or connected to the other component, but that there may be other components in between. Conversely, when a component is said to be "directly coupled" or "directly connected" to another component, it should be understood that there are no other components in between.

[0085] The terms used in this application are merely used to describe specific embodiments and are not intended to limit the present invention. The singular expressions include the plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprise" or "have" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0086] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

[0087] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding elements will be given the same reference numerals regardless of the drawing reference numerals, and redundant description thereof will be omitted.

[0088] In this specification, a camera actuator is a device that moves a lens, but it will be described as including all concepts, whether or not it includes a lens. Below, the first and second camera actuators will be described as each including a lens. Also, a camera actuator that moves a lens may be called a "lens moving device" or a "lens driving device."

[0089] FIG. 1 is a perspective view of a camera module according to an embodiment, FIG. 2 is an exploded perspective view of the camera module according to the embodiment, and FIG. 3 is a cross-sectional view taken along line AA′ in FIG.

[0090] 1 and 2, a camera module 1000 according to an embodiment may include a cover CV, a first camera actuator 1100, a second camera actuator 1200, and a circuit board 1300. Here, the first camera actuator 1100 may be used interchangeably as the first actuator, and the second camera actuator 1200 may be used interchangeably as the second actuator.

[0091] The cover CV can cover the first camera actuator 1100 and the second camera actuator 1200. The cover CV can improve the coupling force between the first camera actuator 1100 and the second camera actuator 1200.

[0092] Furthermore, the cover CV may be made of a material that blocks electromagnetic waves, thereby easily protecting the first camera actuator 1100 and the second camera actuator 1200 within the cover CV.

[0093] The first camera actuator 1100 may be an OIS (Optical Image Stabilizer) actuator. For example, the first camera actuator 1100 may move an optical member in a direction perpendicular to the optical axis (axis of incident light).

[0094] The first camera actuator 1100 may include a fixed focal length lens disposed in a predetermined lens barrel (not shown). A fixed focal length lens may also be referred to as a "single focal length lens" or "single lens."

[0095] The first camera actuator 1100 can change the path of light. As an example, the first camera actuator 1100 can change the path of light vertically through an internal optical member (e.g., a prism or mirror). For example, the optical member can change the light from a first direction (X-axis direction) to a third direction (Z-axis direction). With this configuration, even if the thickness of the mobile terminal is reduced, a lens configuration larger than the thickness of the mobile terminal can be disposed within the mobile terminal through the change in the path of light, thereby enabling magnification, autofocusing (AF), zoom, and OIS functions to be performed.

[0096] However, the present invention is not limited to this, and the first camera actuator 1100 can change the optical path vertically or at a predetermined angle multiple times.

[0097] The second camera actuator 1200 may be disposed at the rear end of the first camera actuator 1100. The second camera actuator 1200 may be coupled to the first camera actuator 1100. The coupling therebetween may be achieved in various ways.

[0098] The second camera actuator 1200 may be a zoom actuator or an auto focus (AF) actuator. For example, the second camera actuator 1200 may support one or more lenses and perform an auto focus function or a zoom function by moving the lenses in response to a control signal from a predetermined controller.

[0099] One or more lenses can be moved independently or individually along the optical axis.

[0100] The circuit board 1300 may be disposed at the rear end of the second camera actuator 1200. The circuit board 1300 may be electrically connected to the second camera actuator 1200 and the first camera actuator 1100. There may also be a plurality of circuit boards 1300.

[0101] The camera module according to the embodiment may be a single camera module or multiple camera modules, for example, multiple camera modules may include a first camera module and a second camera module.

[0102] A single camera module may include one or more actuators, for example, a single camera module may include a first camera actuator 1100 and a second camera actuator 1200. Furthermore, the term camera module may be used interchangeably with various terms such as a camera device or an imaging device.

[0103] The camera module may be disposed in a predetermined housing (not shown) and may include an actuator (not shown) capable of driving the lens unit. The actuator may be a voice coil motor, a microactuator, a silicon actuator, or the like, and may be variously applied, such as an electrostatic type, a thermal type, a bimorph type, or an electrostatic force type, but is not limited thereto. In addition, in this specification, a camera actuator may be referred to as an actuator, etc. Furthermore, a camera module consisting of a plurality of camera modules may be mounted in various electronic devices such as a mobile terminal. Furthermore, an actuator may be a device that moves or tilts a lens or an optical member. However, hereinafter, the actuator will be described as a concept including a lens or an optical member. Furthermore, an actuator may be referred to as a "lens moving device," a "lens moving device," an "optical member moving device," an "optical member moving device," etc.

[0104] Referring to FIG. 3, the camera module according to the embodiment may include a first camera actuator 1100 that performs an OIS function and a second camera actuator 1200 that performs a zooming function and an AF function.

[0105] Light may enter the camera module or the first camera actuator through an opening region located on the top surface of the first camera actuator 1100. That is, light enters the first camera actuator 1100 along the optical axis direction (e.g., the X-axis direction, based on the incident light), and the optical path may be changed vertically through an optical member. The light then passes through the second camera actuator 1200 and may be incident on the image sensor IS located at one end of the second camera actuator 1200 (PATH). In the following description, the Z-axis direction or the third direction will be referred to as the optical axis direction. In the present specification, the optical axis direction may correspond to the third direction, the vertical direction may correspond to the first direction, and the horizontal direction may correspond to the second direction.

[0106] In this specification, the bottom surface refers to one side in the first direction. The first direction is the X-axis direction in the drawing, and may be interchangeably referred to as the second-axis direction, etc. The second direction is the Y-axis direction in the drawing, and may be interchangeably referred to as the first-axis direction, etc. The second direction is a direction perpendicular to the first direction. The third direction is the Z-axis direction in the drawing, and may be interchangeably referred to as the third-axis direction, etc. The third direction is a direction perpendicular to both the first and second directions. Here, the third direction (Z-axis direction) corresponds to the direction of the optical axis, and the first direction (X-axis direction) and the second direction (Y-axis direction) are directions perpendicular to the optical axis. In the following description of the first camera actuator and the second camera actuator, the optical axis direction is the third direction (Z-axis direction), and the following description will be based on this.

[0107] Additionally, in this specification, the "inside" may be the direction from the cover CV toward the first camera actuator, and the "outside" may be the opposite direction to the inside. For example, the first camera actuator and the second camera actuator may be located inside the cover CV, and the cover CV may be located outside the first camera actuator or the second camera actuator.

[0108] The camera module according to the embodiment can improve the spatial limitations of the first and second camera actuators by changing the optical path. The camera module according to the embodiment can expand the optical path while minimizing the thickness of the camera module in response to the change in the optical path. Furthermore, it should be understood that the second camera actuator can provide a high range of magnification by controlling the focus, etc., in the expanded optical path.

[0109] In addition, the camera module according to the embodiment can implement OIS by controlling the optical path through the first camera actuator, thereby minimizing the occurrence of decentering and tilt phenomena and achieving the best optical characteristics.

[0110] Furthermore, the second camera actuator 1200 may include an optical system and a lens driving unit. For example, the second camera actuator 1200 may include at least one of a first lens assembly, a second lens assembly, and a third lens assembly.

[0111] Also, the second camera actuator 1200 includes a coil and a magnet, and can perform high magnification zooming and autofocus functions.

[0112] For example, the first and second lens assemblies may be moving lenses that move via coils, magnets, and guide pins, and the third lens assembly may be a fixed lens, but is not limited to this. For example, the third lens assembly may function as a condenser, focusing light at a specific position. The movement of the first lens assembly may significantly change the distance to the object or the image distance, resulting in a large change in magnification. The first lens assembly, which is a magnifier, may play an important role in changing the focal length or magnification of the optical system. Meanwhile, the image point focused by the first lens assembly, which is a magnifier, may vary slightly depending on the position. Therefore, the second lens assembly may perform a position compensation function for the image focused by the magnifier. For example, the second lens assembly may perform a compensator function, focusing the image point focused by the first lens assembly, which is a magnifier, accurately at the actual image sensor position.

[0113] The first and second lens assemblies can be driven by electromagnetic force due to the interaction between the coil and the magnet. The above content can be applied to the lens assemblies described below. The first and second lens assemblies can move along the optical axis direction, i.e., the third direction. The first and second lens assemblies can move in the third direction independently or dependently of each other.

[0114] Furthermore, the third lens assembly can be located in front of the first lens assembly or behind the second lens assembly, i.e., adjacent to the first camera actuator or adjacent to the image sensor, and can be fixed.

[0115] In an embodiment of the present invention, the first lens assembly and the second lens assembly can move along the optical axis direction. The third lens assembly can be located at the front end of the first lens assembly or the rear end of the second lens assembly. The third lens assembly can be fixed and the first and second lens assemblies can be movable.

[0116] Meanwhile, when an OIS actuator and an AF / Zoom actuator are arranged according to an embodiment of the present invention, magnetic field interference with the AF / Zoom magnet can be prevented when the OIS is driven. Since the magnet of the first camera actuator 1100 is arranged separately from the second camera actuator 1200, magnetic field interference between the first camera actuator 1100 and the second camera actuator 1200 can be prevented. In this specification, OIS may be used interchangeably with terms such as image stabilization, optical image stabilization, optical image correction, and shake correction.

[0117] FIG. 4 is a perspective view of the second camera actuator according to the embodiment, and FIG. 5 is a view taken along the line DD′ in FIG.

[0118] 4 and 5, the second camera actuator 1200 according to the embodiment can include single or multiple lenses LG1, LG2 (or multiple moving and fixed assemblies including lenses), as previously described.

[0119] The second camera actuator includes a driving unit that can move at least one of the lenses along the optical axis or the third direction (Z-axis direction) by the driving unit. The lenses LG1 and LG2 can be moved individually or together by driving forces F3A, F3B, F4A, and F4B from the driving unit. In one embodiment, the lenses (or moving assemblies) can be moved along the optical axis direction.

[0120] FIG. 6 is a perspective view illustrating a circuit board according to an embodiment, FIG. 7 is a front view illustrating a circuit board according to an embodiment, and FIG. 8 is a plan view illustrating a circuit board according to an embodiment.

[0121] Referring to FIG. 6, a circuit board 1300 according to the embodiment may include a first circuit board portion 1310, a second circuit board portion 1320, and a third circuit board portion 1330.

[0122] The first circuit board unit 1310 may be located at the rear end of the second camera actuator. An image sensor IS may be disposed on the first circuit board unit 1310. The first circuit board unit 1310 and the image sensor IS may be electrically connected to each other.

[0123] The first circuit board unit 1310 may be coupled to a sensor base (or base) SB. A filter F may be attached to the sensor base SB. The filter F may be coupled to the first circuit board unit 1310.

[0124] In this way, the image sensor and the circuit board (first circuit board portion) can be located at the rear end of the second camera actuator.

[0125] The first camera actuator, the second camera actuator, and the circuit board 1300 may be sequentially arranged along the optical axis direction. Furthermore, the first circuit board portion 1310 of the circuit board 1300 may be located at the rear end of the second camera actuator and overlap with the second camera actuator in the optical axis direction.

[0126] The second circuit board unit 1320 may be located on the side of the camera module. In particular, the second circuit board unit 1320 may be connected to the first circuit board unit 1310. The second circuit board unit 1320 may extend from the first circuit board unit 1310 along the optical axis direction.

[0127] Therefore, the second circuit board unit 1320 may be positioned adjacent to the second board unit of the second camera actuator positioned adjacent to the first side, thereby facilitating electrical connection between the second circuit board unit 1320 and the second camera actuator.

[0128] In addition, the second circuit board unit 1320 may be variously located on both sides or one side of the first and second camera actuators, and thus there may be at least one second circuit board unit 1320. In the following description, the second circuit board unit 1320 is described as being located on only one side.

[0129] The third circuit board unit 1330 may be connected to the second circuit board unit 1320 or the first circuit board unit 1310. The third circuit board unit 1330 may extend in a direction perpendicular to the optical axis direction (e.g., a second direction). For example, the third circuit board unit 1330 may extend outward from the second circuit board unit 1320. This allows the third circuit board unit 1330 to extend in a different direction from the second circuit board unit 1320.

[0130] In addition, the circuit board 1300 may further include a fixed substrate (not shown) located on a side thereof, so that even if the circuit board 1300 is made of a flexible material, it can be coupled to the base while maintaining rigidity due to the fixed substrate.

[0131] In addition, the second circuit board portion 1320 of the circuit board 1300 may be located on the side of the driver of the second camera actuator. The circuit board 1300 may be electrically connected to the driver of the first camera actuator and the driver of the second camera actuator. For example, the electrical connection may be made by an SMT or a connector, which will be described later.

[0132] In addition, the circuit board 1300 may include a circuit board having a wiring pattern that can be electrically connected, such as a rigid printed circuit board (Rigid PCB), a flexible printed circuit board (Flexible PCB), a rigid flexible printed circuit board (Rigid Flexible PCB), etc. However, it is not limited to these types.

[0133] In some embodiments, the circuit board 1300 may include a common board and individual boards, and may include a common board and individual boards arranged according to their positions on the common board.

[0134] For example, the first circuit board unit 1310 may include a common board FP and a third individual board RP3 disposed in a partial area of ​​the common board.

[0135] The third individual substrate RP3 may be located on at least one of both surfaces of the common substrate FP. This configuration may reinforce rigidity and facilitate electrical connection. For example, the third individual substrate RP3 may be located on both surfaces of the common substrate FP that face each other in the optical axis direction.

[0136] Furthermore, the first circuit board unit 1310 may further include a reinforcing plate ST located on the third individual board RP3. This allows the sensor base SB, the third individual board RP3, the common board FP, the third individual board RP3, and the reinforcing plate ST to be sequentially arranged along the optical axis direction. This improves the reliability of the circuit board 1300 and facilitates heat dissipation.

[0137] The second circuit board unit 1320 may include a common board, and a first individual board RP1 and a second individual board RP2 disposed on a partial area of ​​the common board.

[0138] The second circuit board part 1320 may include a first region RG1 located at the outermost side and a second region RG2 located inside the first region RG1.

[0139] Specifically, the second circuit board unit 1320 may include a common board FP, a first individual board RP1 disposed in the first region RG1, and a second individual board RP2 disposed in the second region RG2.

[0140] The first individual substrate RP1 and the second individual substrate RP2 may be spaced apart from each other along the optical axis direction, and may be offset from each other along the optical axis direction.

[0141] The first and second individual substrates RP1 and RP2 may be located on at least one of the inside and outside of the common substrate FP, which may enhance rigidity and facilitate electrical connection.

[0142] The first and second camera actuators may have different lengths or widths in the second direction (Y-axis direction). Correspondingly, the second circuit board unit 1320 may have a structure that extends along the optical axis direction and is bent inward or outward.

[0143] As an example, the second region RG2 may include a 2-1 region RG2a and a 2-2 region RG2b.

[0144] The 2-1 region RG2a may be located inside the 2-2 region RG2b. For example, the 2-1 region RG2a may be located closer to the first camera actuator than the 2-2 region RG2b. Furthermore, the 2-2 region RG2b may be located between the 2-1 region RG2a and the first region RG1 in the horizontal direction.

[0145] Furthermore, the circuit board 1300 may include a first connector CN1 and a second connector CN2. The first connector CN1 may be located on the third circuit board unit 1330. As described above, the third circuit board unit 1330 may have a structure extending in a different direction from the second circuit board unit 1320. This allows the circuit board 1300 to be easily electrically connected to other camera modules in the terminal or the terminal processor through the first connector CN1. In other words, ease of assembly may be ensured, and the reliability of the first connector CN1 may be improved. In addition, the camera actuator and the camera device including the same may transmit and receive various signals within the terminal.

[0146] The second connector CN2 may be located on the second circuit board unit 1320. The second connector CN2 may be located in the second region RG2 of the second circuit board unit 1320. The second circuit board unit 1320 may be electrically connected to the first board unit of the first camera actuator through the second connector CN2. The first board unit of the first camera actuator and the second circuit board unit 1320 may be connected, for example, by pins, via the second connector CN2. This configuration allows the first camera actuator to be controlled through the circuit board 1300. Furthermore, process defects such as solder defects, cold solder, and cracks due to side soldering may be reduced. This may improve the reliability of the camera actuator. In addition, the application of a protective material (e.g., epoxy) to protect the soldering may be unnecessary. This may simplify the process and reduce manufacturing costs.

[0147] As an example, the length L1 of the first region RG1 in the optical axis direction may be greater than the length L2 of the second region RG2. The length of the first individual substrate RP1 in the optical axis direction may be less than the length L1 of the first region RG1. The length of the second individual substrate RP2 may be less than the length L2 of the second region RG2. Here, the length L1 of the first region RG1 corresponds to the length of the common substrate FP in the first region RG1. The length L2 of the second region RG2 corresponds to the length of the common substrate FP in the second region RG2.

[0148] In the circuit board 1300 according to the embodiment of the present invention, the length of the first individual substrate RP1 in the optical axis direction may be 0.5 times or more the length L1 of the common substrate FP in the first region RG1. That is, the length of the first individual substrate RP1 in the optical axis direction may be slightly longer in the first region RG1. In contrast, the length of the second individual substrate RP2 in the optical axis direction may be 0.5 times or less the length L2 of the common substrate FP in the second region RG2.

[0149] Accordingly, since the second circuit board unit 1320 includes the second connector CN2, the size of the second individual board RP2 is reduced by the second connector, and the structural deformation of the second circuit board unit 1320 can be easily performed.

[0150] Furthermore, the second circuit board part 1320 may include a terminal groove RG1h1 and a coupling groove RG1h2 in the first region RG1. The terminal groove RG1h1 may correspond to a first terminal part, which will be described later.

[0151] There may be at least one terminal groove RG1h1. The terminal groove RG1h1 may be used to electrically connect the second camera actuator to the main board. Alternatively, the terminal groove RG1h1 may be used to control a drive test for the second camera actuator. Furthermore, the terminal groove RG1h1 may be used to facilitate soldering. This will be described in detail later.

[0152] The coupling groove RG1h2 may be a hole or a groove. The second circuit board unit 1320 and the second camera actuator may be coupled to each other through the coupling groove RG1h2. Also, the second circuit board unit 1320 and the second camera actuator may be aligned by the coupling groove RG1h2.

[0153] FIG. 9 is a perspective view of the cover according to the embodiment, FIG. 10 is a bottom view of the cover according to the embodiment, FIG. 11 is a plan view of the cover and the circuit board according to the embodiment, and FIG. 12 is a perspective view of the cover and the circuit board according to the embodiment.

[0154] 9 to 12, the cover CV according to the embodiment may enclose the first camera actuator, the second camera actuator, and the circuit board. However, a portion of the circuit board may be located outside the cover CV. For example, a third circuit board portion of the circuit board may be located outside the cover CV.

[0155] The cover CV can have a shape corresponding to the shapes of the first camera actuator, the second camera actuator and the circuit board in order to enclose the first camera actuator, the second camera actuator and the circuit board.

[0156] Thus, the cover CV may include a first cover hole CVh1 disposed on the upper surface US, through which light is provided to the optical member of the first camera actuator, and the first camera actuator may change the path of the light.

[0157] Additionally, the cover CV may include a second cover hole CVh2 and a third cover hole CVh3 disposed on the side surface SS.

[0158] The second cover hole CVh2 may be positioned adjacent to the second circuit board portion. The first terminal portion (or terminal groove) and the second terminal portion may be exposed through the second cover hole CVh2. This allows for easy testing after assembly of the cover CV.

[0159] Furthermore, the third cover hole CVh3 may be positioned adjacent to the second circuit board portion, and the third circuit board portion may be extended to the outside of the second circuit board portion through the third cover hole CVh3.

[0160] The cover CV may surround the first and second circuit board portions 1310 and 1320. For example, the first circuit board portion 1310 may overlap the cover CV in the optical axis direction or the second direction, and the cover CV may overlap the second circuit board portion 1320 in the optical axis direction or the second direction.

[0161] The third circuit board part 1330 may extend outward through the third cover hole CVh3 and be spaced apart from the cover CV in the second direction.

[0162] Furthermore, the side surface SS adjacent to the second circuit board portion of the cover CV may include a first side surface region SS1, a second side surface region SS2, and a third side surface region SS3.

[0163] The first side surface region SS1 may face the first region, i.e., the first side surface region SS1 may overlap the first region of the second circuit board portion in the second direction.

[0164] The second side region SS2 may face the 2-2 region of the second region, i.e., the second side region SS2 may overlap the 2-2 region of the second region in the second direction.

[0165] The third side region SS3 may face the region 2-1 of the second region, i.e., the third side region SS3 may overlap the region 2-1 of the second region in the second direction.

[0166] In this way, the side surface SS of the cover CV can have a shape corresponding to the shape of the second circuit board portion. That is, the area of ​​the cover CV that overlaps with the first camera actuator in the second direction (the second and third side surface areas) can be positioned more inward than the area that overlaps with the second camera actuator in the second direction (the first side surface area). This configuration can easily protect the components (e.g., circuit board) inside the cover CV.

[0167] Also, depending on the shape of the second circuit board portion, the cover CV may have an asymmetric structure with respect to the optical axis. Alternatively, the cover CV may have an opposing side surface corresponding to the side surface SS for the sake of rigidity and ease of manufacture. That is, the cover CV may have a symmetric structure with respect to the optical axis.

[0168] FIG. 13 is a perspective view of the camera module according to the embodiment, and FIG. 14 is a plan view of the camera module according to the embodiment.

[0169] 13 and 14, in the camera module according to this embodiment, the width W1 of the first camera actuator 1100 may be smaller than the width W2 of the second camera actuator 1200. Accordingly, as described above, the second circuit board unit 1320 may have a first region and a second region in an inwardly folded or bent structure.

[0170] For example, the ratio of the width W1 of the first camera actuator 1100 to the width W2 of the second camera actuator 1200 may be 1:1.1 to 1:1.5. Preferably, the ratio of the width W1 of the first camera actuator 1100 to the width W2 of the second camera actuator 1200 may be 1:1.2 to 1:1.3. With this configuration, it is possible to provide a camera module that is compact in some respects but provides a long stroke.

[0171] Furthermore, the length of the first camera actuator in the optical axis direction may be smaller than the length of the second camera actuator in the optical axis direction.

[0172] The second circuit board unit 1320 may overlap the first camera actuator 1100 and the second camera actuator 1200 in the second direction. Furthermore, the second camera actuator may overlap the first region of the second circuit board unit 1320 in the second direction. And the first camera actuator 1100 may overlap the second region of the second circuit board unit 1320 in the second direction. The second circuit board unit 1320 may be electrically connected to the first camera actuator through a second connector CN2 arranged in the second region.

[0173] Figure 15 is an oblique view of the first substrate portion, the second substrate portion, and the circuit board of a camera module according to an embodiment, Figure 16 is a side view of the camera module according to an embodiment, Figure 17 is a view taken along line II' in Figure 16, and Figure 18 is an enlarged view of part K in Figure 17.

[0174] 15 to 18, circuit board 1300 according to the embodiment may at least partially surround the side surface of the second camera actuator. For example, circuit board 1300 may at least partially overlap the side surface of the second camera actuator or the side surface of the first camera actuator in the horizontal direction (Y-axis direction, second direction).

[0175] The second substrate unit 1270 according to the embodiment may be disposed on a side of the second camera actuator. For example, the second substrate unit 1270 may contact a side of the main barrel at the second camera actuator.

[0176] In addition, the first substrate unit 1154 according to the embodiment may be disposed on a side of the first camera actuator. For example, the first substrate unit 1154 may contact a side of the housing of the first camera actuator.

[0177] The second circuit board unit 1320 according to the embodiment may extend along the optical axis direction to surround the first camera actuator. For example, as described above, the second circuit board unit 1320 may extend to at least partially overlap the first camera actuator in the horizontal direction or the second direction (Y-axis direction).

[0178] In addition, the second circuit board unit 1320 may be connected to an end of the first circuit board unit 1310 and extend in the optical axis direction or the third direction (Z-axis direction). That is, the second circuit board unit 1320 may be bent from the circuit board 1300 and extend in the third direction.

[0179] The first circuit board unit 1310 and the second circuit board unit 1320 may be an integrated or separate structure. In some embodiments, the first circuit board unit 1310 and the second circuit board unit 1320 (and the third circuit board unit) may be integrated. Furthermore, the first circuit board unit 1310 and the second circuit board unit 1320 may comprise an integrated common substrate (FP in FIG. 8). As described above, the first circuit board unit 1310 and the second circuit board unit 1320 may each comprise an individual substrate.

[0180] As an embodiment, the first circuit board unit 1310 and the second circuit board unit 1320 may be made up of multiple layers. Furthermore, the first circuit board unit 1310 and the second circuit board unit 1320 may have holes or multiple layers for circuit patterns therein. That is, the first circuit board unit 1310 may have a structure in which an individual substrate, a common substrate, and another individual substrate are stacked. The second circuit board unit 1320 may also have a structure in which an individual substrate, a common substrate, and another individual substrate are stacked. In this case, the individual substrate and the common substrate may have a circuit pattern therein and may be made up of a single layer or multiple layers.

[0181] For example, the first circuit board unit 1310 and the second circuit board unit 1320 may be configured with multiple layers of rigid printed circuit boards, asymmetrical or flexible printed circuit boards. Alternatively, the first circuit board unit 1310 may have a structure in which a flexible printed circuit board, a rigid printed circuit board, and a flexible printed circuit board are stacked in this order. Furthermore, a stiffener or stiffening plate may be additionally disposed in the areas of the first circuit board unit 1310 and the second circuit board unit 1320 where the flexible printed circuit boards are disposed.

[0182] In addition, in the camera module according to the embodiment, the first circuit board unit and the second circuit board unit may include a common substrate that is a flexible printed circuit board, and the rigid printed circuit boards in the first circuit board unit and the second circuit board unit may be disposed inside and / or outside the flexible printed circuit board.

[0183] The second substrate unit 1270 of the second camera actuator 1200 may include a first substrate 1271 and a second substrate 1272. At least one of the first substrate 1271 and the second substrate 1272 may face the second circuit substrate unit 1320 and overlap with the second circuit substrate unit 1320 in the horizontal direction.

[0184] In the second camera actuator 1200, the first substrate 1271 and the second substrate 1272 may be spaced apart from the first circuit substrate unit 1310 in the optical axis direction. This allows the size of a sensor base and the like disposed on the first circuit substrate unit 1310 to be secured. Furthermore, the sensor base is enlarged, so that elements mounted on the first circuit substrate unit 1310 are not exposed to the outside. That is, the reliability of the circuit elements may be improved. Furthermore, the size of the first substrate 1271 and the second substrate 1272 is reduced, so that the camera module can be made smaller and lighter.

[0185] The first substrate 1271 and the second substrate 1272 may be disposed symmetrically with respect to the optical axis or the optical axis direction. Furthermore, the first substrate 1271 and the second substrate 1272 may each be electrically connected to a driving unit (e.g., a coil) of the second camera actuator.

[0186] The first substrate portion 1154 of the first camera actuator may include a first sub-substrate 1154a arranged on the bottom surface of the first camera actuator and a second sub-substrate 1154b and a third sub-substrate 1154c arranged on the side surfaces of the first camera actuator, respectively.

[0187] As described above, the first sub-substrate 1154a is disposed below the first camera actuator and can at least partially overlap with the first camera actuator in the first direction (X-axis direction).

[0188] The second sub-substrate 1154b and the third sub-substrate 1154c may surround the side surfaces of the first camera actuator, and may at least partially contact the side surfaces of the first camera actuator.

[0189] The second sub-substrate 1154b and the third sub-substrate 1154c may be arranged symmetrically with respect to the optical axis or the optical axis direction. The second sub-substrate 1154b may be arranged adjacent to the first housing side portion described above. And the third sub-substrate 1154c may be arranged adjacent to the second housing side portion described above.

[0190] Also, the second sub-substrate 1154b may be disposed adjacent to the first substrate 1271. For example, the second sub-substrate 1154b may at least partially overlap the first substrate 1271 along the optical axis direction. Alternatively, the second sub-substrate 1154b may be positioned outside the first substrate 1271 around the optical axis.

[0191] The third sub-substrate 1154c may be disposed adjacent to the second substrate 1272. For example, the third sub-substrate 1154c may at least partially overlap the second substrate 1272 along the optical axis direction. Alternatively, the third sub-substrate 1154c may be positioned outside the second substrate 1272 with the optical axis as the center.

[0192] Furthermore, the second sub-substrate 1154b may be in at least partial contact with the second circuit board portion 1320. Furthermore, the second sub-substrate 1154b may be surrounded by the second circuit board portion 1320.

[0193] Additionally, the second camera actuator may include a first substrate 1271 having a second terminal portion SG2. The second terminal portion SG2 may be soldered to a first terminal portion SG1 of a second circuit substrate portion 1320 (described later). To this end, the second circuit substrate portion 1320 and the first substrate 1271 may overlap each other in a direction perpendicular to the optical axis (e.g., the second direction). At least a portion of the first terminal portion SG1 of the second circuit substrate portion 1320 may correspond to at least a portion of the pads (second terminal portions) of the first substrate 1271. Either the first substrate 1271 or the second substrate 1272 may include a second terminal portion SG2. The second terminal portion SG2 may be disposed on either or both of the first substrate 1271 and the second substrate 1272.

[0194] Furthermore, as disclosed herein, at least one of the first and / or second substrates may be soldered to the second substrate portion. That is, the second circuit board portion (including a plurality of terminals or a first terminal portion) may be soldered to one substrate (including a plurality of pads or a second terminal portion) of the second camera actuator. As an example, the first substrate 1271 of the second camera actuator may include a second terminal portion SG2. To this end, the first terminal portion SG1 may be positioned corresponding to the second terminal portion SG2.

[0195] Also, at least a portion of the first terminal SG1 may be soldered to at least a portion of the second terminal SG2, and the first terminal and the second terminal may be electrically connected.

[0196] The outer surface of the first terminal portion SG1 may be bulged inward or recessed outward, which allows the conductive material (e.g., solder) to be easily filled into the first terminal portion SG1.

[0197] For example, the second circuit board unit 1320 may be located on the first board 1271. Based on this, the second terminal unit SG2 may be located below the first terminal unit SG1. The first terminal unit SG1 may overlap the second terminal unit SG2 in the second direction (Y-axis direction).

[0198] The length of the first terminal portion SG1 in the first direction (X-axis direction) may be shorter than the length of the second terminal portion SG2 in the first direction (X-axis direction). With this configuration, when a conductive material is applied to the first terminal portion SG1 and the second terminal portion SG2, the conductive material does not run off inside the first substrate. Furthermore, the first terminal portion SG1 and the second terminal portion SG2 can be easily connected to each other by the conductive material.

[0199] Furthermore, the length Waa of the first terminal portion SG1 in the third direction or the optical axis direction may be smaller than the length Wab of the second terminal portion SG2 in the optical axis direction, thereby preventing the soldered conductive member from flowing down into the first substrate.

[0200] The area of ​​the first terminal portion SG1 may be smaller than the area of ​​the second terminal portion SG2. This allows for more accurate electrical connection. Also, soldering rigidity can be easily ensured. Furthermore, even if the first substrate 1271 shifts during active alignment of the first and second lens assemblies or active alignment of the sensor base SB, the soldering area can be easily secured. The first substrate 1271 may include an exposed area EPA that horizontally overlaps the hole of the first terminal portion SG1. The exposed area EPA may be an area separated from the second terminal portion SG2. This allows the conductive material to flow from the first terminal portion SG1 to the second terminal portion SG2. Alternatively, the electrical connection between the second circuit substrate portion and the second substrate portion 1270 of the second camera actuator 1200 may be pin-coupled.

[0201] The first camera actuator 1100 may also include a first driver disposed on the first substrate unit 1154. For example, the first driver may include a coil C1. In this case, the first driver may not overlap the second connector CN2 in the horizontal direction. That is, the first driver may be disposed apart from the second connector CN2. Alternatively, the first driver may be disposed offset from the second connector CN2 in a direction perpendicular to the optical axis direction. This configuration may easily ensure space for electrical connections or patterns between the coil C1, the Hall sensor, etc., and the first substrate unit 1154. Furthermore, the influence of magnetic fields from other elements such as the coil may be reduced. In addition, heat generated by the coil C1 may not be directly provided to the second connector CN2.

[0202] In addition, the first region RG1 of the second circuit board unit 1320 may overlap the second camera actuator 1200 in a direction (second direction) perpendicular to the optical axis direction. Also, a portion of the first region RG1 may overlap the first camera actuator 1100 in a direction (second direction) perpendicular to the optical axis direction (OV). This configuration can ensure the reliability of the first region RG1 relative to the first individual board. Furthermore, it is possible to ensure tolerance for the boundary between the second camera actuator and the first camera actuator. In other words, ease of assembly can be improved.

[0203] Furthermore, the common substrate FP of the second circuit board portion 1320 can be easily bent inward or toward the first camera actuator side.

[0204] Additionally, the 2-1 region RG2a may contact the first substrate unit 1154 of the first camera actuator 1100. In particular, the 2-1 region RG2a may be disposed adjacent to the first actuator or coil C1. For example, the 2-1 region RG2a may overlap the first actuator or coil C1 in the second direction. This configuration may allow absorption of heat generated by the first actuator. Alternatively, the 2-1 region RG2a may pressurize the first substrate unit 1154, thereby improving the structural reliability of the camera module.

[0205] Furthermore, the 2-2 region RG2b may overlap the second connector CN2 in the horizontal direction. The 2-2 region RG2b may be spaced apart from the first substrate unit 1154 in the horizontal direction to ensure space for the second connector CN2. Furthermore, the aforementioned 2-1 region RG2a may be positioned inside the 2-2 region RG2b, thereby reducing the space in the second direction between the second circuit substrate unit 1320 and the first camera actuator 1100. This may prevent foreign matter from entering the second connector CN2 located in the 2-2 region RG2b. Furthermore, the application of a protective material (e.g., epoxy) surrounding the second connector CN2 located in the 2-2 region RG2b may be facilitated. Furthermore, the common substrate FP extending from the 2-1 region RG2a may be bent in the region between the first region RG1 and the first substrate unit 1154, and the second connector CN2 and the first substrate unit 1154 may be easily connected or assembled. In other words, the second circuit board portion 1320 does not protrude outside the first region RG1, and alignment for improved assembly can be easily performed.

[0206] Furthermore, the 2-1 region RG2a may be disposed between the 2-2 region RG2b and the first region RG1 along the optical axis. That is, the 2-2 region RG2b may be disposed farther away from the first region RG1 than the 2-1 region RG2a. This configuration may ensure a greater connection tolerance for the second connector CN2 disposed in the 2-2 region RG2b. In other words, by displacing the 2-2 region RG2b far away from the 2-1 region RG2a and the first region RG1, tolerance problems occurring in regions other than the 2-2 region RG2b may be resolved.

[0207] A yoke YK may also be disposed between the first region RG1 and the second substrate portion of the second camera actuator 1200. That is, the camera actuator 1200 may include a yoke YK disposed outside the second substrate portion. The yoke YK may generate a force to maintain the position of the moving assembly within the second camera actuator 1200. Furthermore, it may also block magnetic force from entering from the outside.

[0208] The yoke YK may overlap the first region RG1 in the horizontal direction. However, a portion of the first region RG1 may not overlap the yoke YK in the horizontal direction. This can reduce the occurrence of cracks in the second circuit board portion due to the yoke YK.

[0209] A camera module according to an embodiment of the present invention includes a first actuator, a second actuator, and an image sensor sequentially arranged along an optical axis direction, and a circuit board arranged around the first actuator and the second actuator, the circuit board including a first circuit board portion on which the image sensor is mounted and a second circuit board portion connected to the first circuit board portion and extending along the optical axis direction, the second circuit board portion overlapping the first actuator and the second actuator in a direction perpendicular to the optical axis direction and connected to the first actuator.

[0210] The length of the first actuator in a direction perpendicular to the optical axis direction may be smaller than the length of the second actuator in a direction perpendicular to the optical axis direction.

[0211] The second circuit board unit may include a first region located at the outermost side and a second region located inside the first region.

[0212] The second circuit board unit may include a common board, a first individual board disposed in the first region, and a second individual board disposed in the second region.

[0213] The length of the first individual substrate in the optical axis direction may be 0.5 times or more the length of the common substrate in the optical axis direction in the first region.

[0214] The second individual substrate may have a length in the optical axis direction that is 0.5 times or less of the length in the optical axis direction of the common substrate in the second region.

[0215] The circuit board may include a third circuit board portion extending in a direction perpendicular to the optical axis direction in the second circuit board portion and including a first connector, and the second circuit board portion may include a second connector overlapping and connected to the first actuator in a direction perpendicular to the optical axis direction.

[0216] The first actuator may include a first substrate portion disposed laterally, and the second actuator may include a second substrate portion disposed laterally.

[0217] The first board portion may be electrically connected to the second connector by pin coupling.

[0218] The first actuator may include a first driving unit arranged on the first substrate portion, the first driving unit may be arranged apart from the second connector, and the first driving unit may be arranged offset from the second connector in a direction perpendicular to the optical axis direction.

[0219] The second connector may be disposed at an end of the second circuit board portion in the optical axis direction.

[0220] The second circuit board portion may include a terminal groove and a coupling groove disposed in the first region, and the first region may partially overlap with the first actuator in a direction perpendicular to the optical axis direction.

[0221] The second region may include a 2-1 region located at the innermost side and a 2-2 region disposed between the first region and the 2-1 region in a direction perpendicular to the optical axis direction.

[0222] The 2-1 region can be in contact with the first actuator.

[0223] The camera module may include a cover surrounding the first actuator, the second actuator, and the circuit board, the cover being asymmetric with respect to the optical axis, and the cover may include a first cover hole disposed on an upper surface and a second cover hole adjacent to the second circuit board portion.

[0224] 19 is a perspective view of the camera device according to the embodiment, FIG. 20 is an exploded perspective view of the camera device according to the embodiment, and FIG. 21 is a view seen from the line AA' in FIG.

[0225] Hereinafter, the views correspond to views taken along the relevant cutting plane.

[0226] 19 and 20, a camera device 100 according to the embodiment includes a cover CV, a first camera actuator 110, a second camera actuator 120, and a main board unit 130. In this specification, the first camera actuator 110 may be referred to as the first actuator, and the second camera actuator 120 may be referred to as the second actuator.

[0227] The cover CV can cover the first camera actuator 110 and the second camera actuator 120. The cover CV can improve the coupling force between the first camera actuator 110 and the second camera actuator 120.

[0228] Furthermore, the cover CV may be made of a material that blocks electromagnetic waves, thereby easily protecting the first camera actuator 110 and the second camera actuator 120 within the cover CV.

[0229] The first camera actuator 110 may be an OIS (Optical Image Stabilizer) actuator. For example, the first camera actuator 110 may move an optical member in a direction perpendicular to the optical axis (axis of incident light).

[0230] The first camera actuator 110 may include a fixed focal length lens (LS) disposed in a predetermined lens barrel (not shown). The fixed focal length lens (LS) may also be referred to as a "single focal length lens" or "single lens."

[0231] The first camera actuator 110 can change the path of light. As an example, the first camera actuator 110 can change the path of light vertically through an internal optical member (e.g., a prism or mirror). For example, the optical member can change the light from the X-axis direction to the Z-axis direction. Alternatively, the optical member can change the light from a first axis to a second axis. With this configuration, even if the thickness of the mobile terminal is reduced, a lens configuration larger than the thickness of the mobile terminal can be disposed within the mobile terminal through the change in the light path, allowing magnification, autofocusing (AF), zoom, and OIS functions to be performed.

[0232] However, the present invention is not limited to this, and the first camera actuator 110 can change the optical path vertically or at a predetermined angle multiple times.

[0233] The second camera actuator 120 may be disposed at the rear end of the first camera actuator 110. The second camera actuator 120 may be coupled to the first camera actuator 110. The coupling therebetween may be performed in various ways.

[0234] The second camera actuator 120 may be a zoom actuator or an auto focus (AF) actuator. For example, the second camera actuator 120 may support one or more lenses and perform an auto focus function or a zoom function by moving the lenses in response to a control signal from a predetermined controller.

[0235] One or more lenses can be moved independently or individually along the optical axis.

[0236] The main board unit 130 may be disposed at the rear end of the second camera actuator 120. The main board unit 130 may be electrically connected to the second camera actuator 120 and the first camera actuator 110. There may be a plurality of main board units 130.

[0237] In this specification, the first camera actuator 110 and the second camera actuator 120 may be a voice coil motor, a microactuator, a silicon actuator, etc., and may be variously applied, such as an electrostatic type, a thermal type, a bimorph type, an electrostatic force type, etc., but are not limited thereto. The first camera actuator 110 and the second camera actuator 120 may be devices that move or tilt a lens or an optical member, and in this specification, the first camera actuator 110 and the second camera actuator 120 will be described as a concept including a lens or an optical member. Furthermore, the first camera actuator 110 and the second camera actuator 120 may be referred to as a "lens moving device," a "lens moving device," an "optical member moving device," an "optical member moving device," etc.

[0238] Referring to FIG. 21, the camera device according to the embodiment may include a first camera actuator 110 that performs an OIS function and a second camera actuator 120 that performs a zooming function and an AF function.

[0239] Light may enter the camera device or the first camera actuator 110 through an opening region located on the top surface of the first camera actuator 110. That is, light enters the interior of the first camera actuator 110 along the X-axis direction, and the light path may be changed (e.g., changed from the X-axis direction to the Z-axis direction) through an optical member. The light then passes through the second camera actuator 120 and may enter the image sensor IS located at one end of the second camera actuator 120 (PATH). In the following description, the Z-axis direction will be described as the optical axis direction, and the X-axis and Y-axis directions will be described as being perpendicular to each other, and the X-axis and Y-axis directions will be described as being perpendicular to the Z-axis direction.

[0240] In addition, in this specification, the inside may be the direction from the cover CV toward the first camera actuator 110, and the outside may be the opposite direction to the inside. That is, the first camera actuator 110 and the second camera actuator 120 may be located inside the cover CV, and the cover CV may be located outside the first camera actuator 110 or the second camera actuator 120.

[0241] With this configuration, the camera device 100 according to the embodiment can change the optical path to improve the spatial limitations of the first camera actuator 110 and the second camera actuator 120. That is, the camera device 100 according to the embodiment can expand the optical path while minimizing the thickness of the camera device 100 in response to the change in the optical path. Furthermore, it should be understood that the second camera actuator 120 can provide a wide range of magnification by controlling the focus, etc., in the expanded optical path.

[0242] In addition, the camera device 100 according to the embodiment can implement OIS by controlling the optical path through the first camera actuator 110, thereby minimizing the occurrence of decentering and tilt phenomena and achieving the best optical characteristics.

[0243] Furthermore, the second camera actuator 120 may include an optical system and a lens driver, for example, the second camera actuator 120 may include at least one of a first lens assembly, a second lens assembly, and a third lens assembly sequentially arranged in a direction from the first camera actuator 110 toward the image sensor.

[0244] Also, the second camera actuator 120 includes a coil and a magnet, and can perform high magnification zooming and autofocus functions.

[0245] For example, the first and second lens assemblies may be moving lenses that move along the optical axis via coils, magnets, and guide pins, and the third lens assembly may be a fixed lens, but is not limited to this. For example, the third lens assembly may function as a condenser, focusing light at a specific position, and the first lens assembly may function as a variator, refocusing the image focused by the third lens assembly (the condenser) at another location. Meanwhile, the first lens assembly may experience significant changes in magnification due to significant changes in the distance to the subject or the image distance, and the first lens assembly (the variator) may play an important role in changing the focal length or magnification of the optical system. Meanwhile, the image point focused by the first lens assembly (the variator) may vary slightly depending on its position. In response, the second lens assembly may perform a position compensation function for the image focused by the variator. For example, the second lens assembly may function as a compensator, accurately focusing the image point focused by the first lens assembly (the variator) at the actual image sensor position. For example, the first and second lens assemblies may be driven by electromagnetic force due to the interaction between a coil and a magnet. The first and second lens assemblies may move independently or dependently. Here, the second camera actuator 120 includes first to third lens assemblies, the first and second lens assemblies being moving groups, and the third lens assembly being a fixed group, but this is not limiting. The second camera actuator 120 may include multiple lens assemblies, at least some of which may be moving groups.

[0246] Meanwhile, when an OIS actuator and an AF / Zoom actuator are arranged according to an embodiment of the present invention, magnetic field interference with the AF / Zoom magnet can be prevented when the OIS is driven. Since the first driving magnet of the first camera actuator 110 is arranged separately from the second camera actuator 120, magnetic field interference between the first camera actuator 110 and the second camera actuator 120 can be prevented. In this specification, OIS may be used interchangeably with terms such as image stabilization, optical image stabilization, optical image correction, and shake correction.

[0247] FIG. 22 is a perspective view of the first camera actuator according to the embodiment, and FIG. 23 is an exploded perspective view of the first camera actuator according to the embodiment.

[0248] 22 and 23, the first camera actuator 110 according to the embodiment may include a first housing 112, a mover 113, a rotating unit 114, a first driving unit 115, a first member 112-6, and a second member 113-11. Furthermore, the first camera actuator 110 may further include a plate CP.

[0249] The mover 113 may include a holder 113-1 and an optical member 113-2 mounted on the holder 113-1. The rotation unit 114 may include a tilting guide unit 114-1, a second magnetic body 114-2, and a first magnetic body 114-3 having the same or different polarities to apply pressure to the tilting guide unit 114-1. For example, the polarities of the opposing surfaces of the first magnetic body 114-3 and the second magnetic body 114-2 may be the same. The first driving unit 115 includes a driving magnet 115-1, a driving coil 115-2, a Hall sensor unit, a first substrate unit 115-4, and a yoke unit.

[0250] First, the first camera actuator 110 may include a shielding can (not shown). The shielding can (not shown) may be located at the outermost portion of the first camera actuator 110 to surround the rotating unit 114 and the first driving unit 115 (described later).

[0251] Such a shielding can (not shown) can block or reduce externally generated electromagnetic waves, i.e., the shielding can (not shown) can reduce the occurrence of malfunctions in the rotating unit 114 or the first driving unit 115. The shielding can (not shown) can be the cover member CV described above or a separate member disposed within the cover member CV.

[0252] The first housing 112 may be located inside a shielding can (not shown). If there is no shielding can, the first housing 112 may be located at the outermost side of the first camera actuator 110.

[0253] The first housing 112 may be positioned inside a first substrate unit 115-4, which will be described later. The first housing 112 may be fastened to a shielding can (not shown) by being inserted or fitted together.

[0254] The first housing 112 can include a first housing side, a second housing side, a third housing side, and a housing wall.

[0255] The first member 112-6 may be disposed in the first housing 112. A portion of the first member 112-6 may be penetrated by the second member 113-11. The first member 112-6 may be an integral part of the first housing 112 or may be a separate structure.

[0256] Furthermore, the first camera actuator 110 may further include a plate CP disposed outside the first member 112-6. The plate CP may prevent foreign matter from entering the second member 113-11, etc., which penetrates the first member 112-6. Furthermore, the plate CP may be made of a magnetic material. As a result, the plate CP has magnetic properties and may not generate magnetic force on the first magnetic body 114-3 and the second magnetic body 114-2, which have polarity for pressure application. In other words, the generation of magnetic force that interferes with the actuation (pressure application) of the first magnetic body 114-3 and the second magnetic body 114-2 may be reduced.

[0257] When such a plate CP is made of a magnetic material, it may be called a magnetic member, a magnetic material, a cover plate, a metal member, a metal plate, or the like.

[0258] The mover 113 includes a holder 113-1 and an optical member 113-2 attached to the holder 113-1.

[0259] The holder 113-1 can be attached to a receiving portion of the first housing 112. The holder 113-1 can include a first holder outer surface to a fourth holder outer surface that correspond to the first housing side, the second housing side, the third housing side, and the first member 112-6, respectively. For example, the first holder outer surface to the fourth holder outer surface can correspond to or face the inner surfaces of the first housing side, the second housing side, the third housing side, and the first member 112-6, respectively.

[0260] The holder 113-1 may also include a second member 113-11 disposed in the fourth mounting groove. The second member 113-11 may be coupled to the holder 113-1 by passing through the first member 112-6. The second member 113-11 and the holder 113-1 may be coupled to each other using various joining or connecting members.

[0261] The optical element 113-2 may be mounted on the holder 113-1. To this end, the holder 113-1 may have a mounting surface, which may be formed by a receiving groove.

[0262] It should be understood that optical element 113-2 can change the path of the reflected light to improve the spatial limitations of first camera actuator 110 and second camera actuator 120. This allows the camera device to extend the light path and provide a high range of magnification while minimizing thickness.

[0263] Additionally, the second member 113-11 may be coupled to the holder 113-1. The second member 113-11 may be disposed outside the holder 113-1 and inside the housing. The second member 113-11 may be mounted in an additional groove located on the outer surface of the fourth holder in an area other than the fourth mounting groove. Thus, the second member 113-11 may be coupled to the holder 113-1, and at least a portion of the first member 112-6 may be positioned between the second member 113-11 and the holder 113-1. For example, at least a portion of the first member 112-6 may be positioned in the space formed between the second member 113-11 and the holder 113-1. The second member 113-11 may pass through a hole formed in the first member 112-6.

[0264] Also, the second member 113-11 may be separated from the holder 113-1. This configuration facilitates assembly of the first camera actuator 110, as will be described later. Alternatively, the second member 113-11 may be formed integrally with the holder 113-1.

[0265] The rotating part 114 includes a tilting guide part 114-1, a second magnetic body 114-2 and a first magnetic body 114-3 having the same polarity so as to apply pressure to the tilting guide part 114-1.

[0266] The tilting guide portion 114-1 may be coupled to the mover 113 and the first housing 112. Specifically, the tilting guide portion 114-1 may be disposed between the holder 113-1 and the first member 112-6. As a result, the tilting guide portion 114-1 may be coupled to the mover 113 of the holder 113-1 and the first housing 112. However, in this embodiment, the tilting guide portion 114-1 may be disposed between the first member 112-6 and the holder 113-1. Specifically, the tilting guide portion 114-1 may be positioned between the first member 112-6 and the fourth mounting groove of the holder 113-1. For example, at least a portion of the tilting guide portion 114-1 may be positioned in the fourth mounting groove.

[0267] The second member 113-11, the first member 112-6, the tilting guide part 114-1, and the holder 113-1 may be sequentially arranged in the Z-axis direction. The second magnetic body 114-2 and the first magnetic body 114-3 may be mounted in a first groove formed in the second member 113-11 and a second groove formed in the first member 112-6, respectively. The first groove is located within the second member 113-11 and moves integrally with the holder and the second member 113-11, and the second groove is located on the first member 112-6 corresponding to the first groove and is coupled to the first housing 112.

[0268] In addition, the tilting guide unit 114-1 may be disposed adjacent to the optical axis, so that the actuator according to the embodiment can easily change the optical path by tilting along the first and second axes.

[0269] The tilting guide portion 114-1 may include a first protrusion spaced apart in the X-axis direction and a second protrusion spaced apart in the Y-axis direction, and the first protrusion and the second protrusion may protrude in opposite directions.

[0270] Also, the second magnetic body 114-2 may be located within the second member 113-11, and the first magnetic body 114-3 may be located within the first member 112-6.

[0271] The second magnetic body 114-2 and the first magnetic body 114-3 may have the same polarity. For example, the second magnetic body 114-2 may be a magnet with a north pole, and the first magnetic body 114-3 may be a magnet with a north pole. Or, conversely, the second magnetic body 114-2 may be a magnet with a south pole, and the first magnetic body 114-3 may be a magnet with a south pole. For example, as described above, the first pole surface of the first magnetic body 114-3 and the second pole surface of the second magnetic body 114-2 facing the first pole surface may have the same polarity.

[0272] The second magnetic body 114-2 and the first magnetic body 114-3 can generate a repulsive force between them due to the polarity. With this configuration, the repulsive force can be applied to the second member 113-11 or holder 113-1 coupled to the second magnetic body 114-2 and the first member 112-6 or first housing 112 coupled to the first magnetic body 114-3. At this time, the repulsive force applied to the second member 113-11 can be transmitted to the holder 113-1 coupled to the second member 113-11. As a result, the tilting guide unit 114-1 disposed between the second member 113-11 and the first member 112-6 can be compressed by the repulsive force. Furthermore, the repulsive force can also be transmitted to the housing and the mover. As a result, the housing and the mover can be compressed by the repulsive force. In other words, the repulsive force can correspond to a maintaining force that maintains the position between the housing and the mover. That is, the repulsive force can maintain the position of the tilting guide unit 114-1 between the holder 113-1 and the first housing 112 (or the first member 112-6). With this configuration, the position between the mover 113 and the first housing 112 can be maintained even during X-axis or Y-axis tilt. Also, the tilting guide unit can be closely attached to the first member 112-6 and the holder 113-1 due to the repulsive force between the first magnetic body 114-3 and the second magnetic body 114-2. In other words, the repulsive force between the first magnetic body 114-3 and the second magnetic body 114-2 can be a force that maintains the position between the holder 113-1 and the first housing 112.

[0273] The first driving section 115 includes a driving magnet 115-1, a driving coil 115-2, a Hall sensor section, a first substrate section 115-4, and a yoke section.

[0274] The drive magnet 115-1 may include a first magnet, a second magnet, and a third magnet that provide a driving force by electromagnetic force. The first magnet, the second magnet, and the third magnet may be located on the outer surface of the holder 113-1, respectively.

[0275] The drive coil 115-2 may include multiple coils. For example, the drive coil 115-2 may include a first coil, a second coil, and a third coil.

[0276] The first coil may be positioned to face the first magnet, and thus, the first coil may be positioned in a first housing hole on a side of the first housing. The second coil may be positioned to face the second magnet, and thus, the second coil may be positioned in a second housing hole on a side of the second housing.

[0277] The first camera actuator 110 according to the embodiment controls the rotation of the mover 113 in the X-axis direction or the Y-axis direction by the electromagnetic force between the driving magnet 115-1 and the driving coil 115-2, thereby minimizing the occurrence of decentering and tilting phenomena when implementing the OIS, and providing the best optical characteristics.

[0278] In addition, according to the embodiment, by implementing the OIS through the tilting guide part 114-1 of the rotating part 114 disposed between the first housing 112 and the mover 113, it is possible to eliminate the size limitation of the actuator and provide an ultra-slim and ultra-compact camera actuator and a camera device including the same.

[0279] The first substrate unit 115-4 may include a first sub-substrate 115-41, a second sub-substrate 115-42, and a third sub-substrate 115-43.

[0280] The second sub-substrate 115-42 and the third sub-substrate 115-43 may be disposed to face each other, and the first sub-substrate 115-41 may be located between the second sub-substrate 115-42 and the third sub-substrate 115-43.

[0281] The first sub-board 115-41 may be located between the first housing side and the shielding can, the second sub-board 115-42 may be located between the second housing side and the shielding can, and the third sub-board 115-43 may be located between the third housing side and the shielding can, and may be on the bottom surface of the first board unit 115-4.

[0282] The first sub-board 115-41 may be combined and electrically connected to the first coil and the first Hall sensor.

[0283] The second sub-board 115-42 may be coupled and electrically connected to the second coil. It should be understood that the second sub-board 115-42 may also be coupled and electrically connected to the first Hall sensor.

[0284] The third sub-board 115-43 may be coupled and electrically connected to the third coil and the second Hall sensor.

[0285] FIG. 24 is a perspective view of a second camera actuator according to the embodiment.

[0286] Referring to FIG. 24, the second camera actuator 120 according to an embodiment can include a single or multiple lens assemblies.

[0287] The second camera actuator 120 includes a driver that can move at least one of the lens assemblies along the Z-axis direction. The lens assemblies can move individually or together due to the driving force of the driver. In one embodiment, the lenses can move along the optical axis direction.

[0288] FIG. 25 is a perspective view of the camera device according to the embodiment with the cover removed, FIG. 26 is an exploded perspective view of the camera device according to the embodiment with the cover removed, and FIG. 27 is a perspective view of the circuit board of the camera device according to the embodiment.

[0289] 25 to 27, in the camera device according to the embodiment, the first camera actuator 110, the second camera actuator 120, and the main board unit 130 may be sequentially arranged in one direction or in the optical axis direction (Z-axis direction). Therefore, the second camera actuator 120 may be located at the rear end of the first camera actuator 110.

[0290] The first camera actuator 110 and the second camera actuator 120 may have surfaces facing each other. For example, a first surface of the first camera actuator 110 and a second surface of the second camera actuator 120 may face each other. Here, the first surface may be the rear surface of the first camera actuator 110, and the second surface may be the front surface of the second camera actuator 120. A bonding material or the like may be applied to the first and second surfaces. Alternatively, the first and second surfaces may be coupled to each other through a protrusion / groove structure. In this way, the first camera actuator 110 and the second camera actuator 120 may be coupled to each other. That is, the first camera actuator 110 and the second camera actuator 120 may be coupled directly or indirectly in various ways.

[0291] According to the embodiment, the main board unit 130 may be disposed on at least a portion of a side surface of the second camera actuator 120. For example, the main board unit 130 may overlap with at least a portion of a side surface of the second camera actuator 120 or the first camera actuator 110 in the horizontal direction (Y-axis direction).

[0292] The circuit board 115-42 for the first camera actuator 110 may be disposed on a side of the first camera actuator 110. For example, the circuit board 115-42 may contact the side of the first camera actuator 110.

[0293] The circuit board 127 for the second camera actuator 120 may be disposed on a side surface of the second camera actuator 120. For example, the circuit board 127 may contact the side surface of the second camera actuator 120.

[0294] An image sensor may be mounted on the main board unit 130. The main board unit 130 may include a first unit main board 131 overlapping the second camera actuator (or first camera actuator) along the optical axis direction (Z-axis direction) and a second unit main board 132 bent from the first unit main board 131 and extending to the side of the second camera actuator 120. Additionally, the main board unit 130 may further include a third unit main board (not shown) extending to both sides of the second camera actuator 120. The third unit main board (not shown) may be positioned to face the second unit main board 132 with respect to the optical axis.

[0295] First, the first unit main substrate 131 may have the image sensor IS and a sensor base disposed thereon.

[0296] At least one of the second unit main board 132 and the third unit main board (not shown) according to the embodiment may extend along the Z-axis direction to surround the second camera actuator 120. For example, the second unit main board 132 and the third unit main board (not shown) may overlap the second camera actuator 120 in the Y-axis direction. According to the embodiment, the second unit main board 132 and the third unit main board (not shown) may further extend in the Z-axis direction to overlap the first camera actuator 110 in the Y-axis direction.

[0297] Either the second unit main board 132 or the third unit main board (not shown) may be connected to the connector part CN.

[0298] The first unit main board 131 and the second unit main board 132 may have an integrated or separate structure. As an example, the first unit main board 131 and the second unit main board 132 may include an integrated common flexible printed circuit board (FPCB) or may include separate individual rigid printed circuit boards (RPCB). This allows the first unit main board 131 and the second unit main board 132 to be easily bent by an area consisting only of the FPCB. Accordingly, the first unit main board 131 may be disposed in a direction perpendicular to the Z-axis direction, and the first unit main board 131 and the second unit main board 132 may be bent by the FPCB between them, with the second unit main board 132 disposed in the Z-axis direction.

[0299] As an embodiment, the first unit main board 131 and the second unit main board 132 may be made up of multiple layers. Furthermore, the first unit main board 131 and the second unit main board 132 may have holes or multiple layers for circuit patterns therein. That is, the first unit main board 131 may have a structure in which an individual board, a common board, and another individual board are stacked. The second unit main board 132 may also have a structure in which an individual board, a common board, and another individual board are stacked. In this case, the individual board and the common board may have a circuit pattern therein and may be made up of a single layer or multiple layers.

[0300] The first substrate unit 115-4 included in the first camera actuator 110 may include a first sub-substrate 115-41 arranged on the bottom surface of the first camera actuator 110 and a second sub-substrate 115-42 and a third sub-substrate 115-43 arranged on the sides of the first camera actuator 110, respectively.

[0301] The first sub-substrate 115-41 is disposed below the first camera actuator and can at least partially overlap with the first camera actuator in the X-axis direction.

[0302] The second sub-substrate 115-42 and the third sub-substrate 115-43 may be disposed on the side of the first camera actuator 110. The second sub-substrate 115-42 and the third sub-substrate 115-43 may contact at least a portion of the side of the first camera actuator 110.

[0303] The second sub-substrate 115-42 and the third sub-substrate 115-43 may be disposed symmetrically with respect to the optical axis or the optical axis direction.

[0304] According to an embodiment of the present invention, the second unit main board 132 and the second sub-board 115-42 are connected by soldering. Hereinafter, the second unit main board 132 will be referred to as the first circuit board 132, and the second sub-board 115-42 will be referred to as the second circuit board 115-42.

[0305] Fig. 28 is a front view of the inter-circuit board connection structure according to the embodiment after soldering, Fig. 29 is a perspective view of the inter-circuit board connection structure according to the embodiment after soldering, and Fig. 30 is a cross-sectional view of the inter-circuit board connection structure according to the embodiment after soldering. Fig. 31 is a front view of the inter-circuit board connection structure according to the embodiment before soldering, Fig. 32 is a perspective view of the inter-circuit board connection structure according to the embodiment before soldering, and Fig. 33 is a cross-sectional view of the inter-circuit board connection structure according to the embodiment before soldering. Fig. 34 is an exploded view for explaining the inter-circuit board connection structure according to the embodiment, and Fig. 35 is a partially enlarged perspective view of the inter-circuit board connection structure.

[0306] 28 to 35, the plurality of first pads 132P of the first circuit board 132 and the plurality of second pads 115P-42 of the second circuit board 115-42 are electrically connected by soldering.

[0307] As described above, the first circuit board 132 may be the second unit main board 132 and may be a circuit board electrically connected to the image sensor IS. The second circuit board 115-42 may be the second sub-board 115-42 and may be a circuit board for the first camera actuator 110.

[0308] The first circuit board 132 of the second unit main board 132 is bent from the first unit main board 131 on which the image sensor IS is arranged and disposed on the side of the second camera actuator 120. The first circuit board 132 is a multi-layer PCB, and a partial area 132F includes only an FPCB (flexible printed circuit board), and the remaining partial area 132R includes an FPCB and an RPCB (rigid printed circuit board) stacked in the Y-axis direction. For example, the first circuit board 132 may include a common FPCB, and an RPCB may be disposed on at least one of both sides of the partial area of ​​the common FPCB.

[0309] According to the embodiment of the present invention, a plurality of first pads 132P are arranged in the area 132 of the first circuit board 132 that includes only the FPCB, and are bonded to a plurality of second pads 115P-42 of the second circuit board 115-42.

[0310] For this reason, one end of region 132F including only the FPCB is disposed on second circuit board 115-42 and extends to the remaining partial region 132R including the FPCB and RPCB. Accordingly, region 132F including only the FPCB of first circuit board 132 may include a first region 132F-1 disposed to overlap second circuit board 115-42 in the Z-axis direction and a second region 132F-2 disposed to overlap second circuit board 115-42 in the Y-axis direction, and multiple first pads 132P may be disposed in second region 132F-2. That is, second region 132F-2 may be disposed on second circuit board 115-42, and first region 132F-1 may extend from second region 132F-2 in a direction toward image sensor IS and be disposed on circuit board 127 for second camera actuator 120. According to this, the first circuit board 132 can be flexibly bent depending on the height of the second circuit board 115-42, so that a stable connection between the first circuit board 132 and the second circuit board 115-42 can be achieved.

[0311] Here, alignment holes 132A may be formed in the remaining partial region 132R including the FPCB and RPCB, and the position of the first circuit board 132 may be aligned through the alignment holes 132A.

[0312] According to an embodiment of the present invention, the first circuit board 132 includes a plurality of first pads 132P formed at one end of the first circuit board 132. Here, the one end of the first circuit board 132 may be a second region 132F-2 of the region 132F of the first circuit board 132 consisting only of the FPCB, which overlaps with the second circuit board 115-42 in the Y-axis direction. That is, the one end of the first circuit board 132 may be one of the ends of the first circuit board 132 along the Z-axis direction, opposite to the side connected to the first unit main board 131. That is, the one end of the first circuit board 132 may be one of the ends of the first circuit board 132 along the Z-axis direction, facing away from the image sensor IS. The plurality of first pads 132P may be arranged to be spaced apart from each other in the X-axis direction, perpendicular to the Z-axis direction. The plurality of first pads 132P may be exposed by notches formed in the outermost layer of the first circuit board 132. Here, the outermost layer of the first circuit board 132 may be an insulating layer.

[0313] The second circuit board 115-42 includes a plurality of second pads 115P-42 formed at one end of the second circuit board 115-42. That is, one end of the second circuit board 115-42 may include an area overlapping with the first circuit board 132 in the Y-axis direction. The one end of the second circuit board 115-42 may be a surface of the second circuit board 115-42 along the Z-axis direction that faces the image sensor IS. The plurality of second pads 115P-42 may be spaced apart from each other in the X-axis direction, which is perpendicular to the Z-axis direction. The plurality of second pads 115P-42 may be exposed by notches formed in the outermost layer of the second circuit board 115-42. Here, the outermost layer of the second circuit board 115-42 may be an insulating layer.

[0314] According to the embodiment, the plurality of first pads 132P and the plurality of second pads 115P-42 correspond one-to-one, and at least a portion of the plurality of first pads 132P and at least a portion of the plurality of second pads 115P-42 are arranged to overlap each other in the Y-axis direction perpendicular to the Z-axis direction and the X-axis direction, and the plurality of first pads 132P and the plurality of second pads 115P-42 are soldered.

[0315] This reduces the probability of soldering defects occurring as the distance between the end of the first circuit board 132 and the end of the second circuit board 115-42 increases during the soldering process compared to when the multiple first pads 132P and the multiple second pads 115P-42 are aligned in the Z-axis direction but do not overlap each other in the Y-axis direction, and minimizes the problem of the end of the first circuit board 132 and the end of the second circuit board 115-42 becoming separated from each other after soldering due to external influences such as vibration.

[0316] According to the embodiment, the sum of the lengths in the Z-axis direction (z1+z2) of the first pads 132P and the second pads 115P-42 that are arranged to overlap each other in the Y-axis direction may be longer than the length in the Z-axis direction (z3) of the first pads and the second pads when they overlap each other in the Y-axis direction. This can significantly reduce the amount of solder required compared to when the first pads 132P and the second pads 115P-42 are aligned in the Z-axis direction but do not overlap each other in the Y-axis direction.

[0317] According to the embodiment, a hole 132H penetrating each of the first pads 132P is formed in each of the first pads 132P, and each hole 132H is disposed on a corresponding one of the second pads 115P-42, with solder disposed in the hole 132H. Accordingly, during soldering of the first pads 132P and the second pads 115P-42, the solder S may flow through the hole 132H and be disposed between the lower surfaces of the first pads 132P and the upper surfaces of the second pads 115P-42. Accordingly, the contact area between the first pads 132P and the second pads 115P-42 is increased, which may improve the bonding strength between the first pads 132P and the second pads 115P-42 and reduce the electrical resistance between the first pads 132P and the second pads 115P-42.

[0318] In this case, the width W2 of the hole 132H may be 40 to 70% of the width W1 of each first pad 132P. If the width W2 of the hole 132H is less than 40% of the width W1 of each first pad 132P, not only is it difficult to process the hole 132H, but it may also be difficult for the solder S to penetrate into the hole 132H. If the width W2 of the hole 132H exceeds 70% of the width W1 of each first pad 132P, the effective area of ​​the first pad 132P is reduced, which may result in poor contact between the first circuit board 132 and the second circuit board 115-42.

[0319] According to the embodiment, the maximum height of the solder S in the Y-axis direction after soldering may be lower than the maximum height of the first circuit board 132 in the Y-axis direction or may be 1.2 times or less than the maximum height of the first circuit board 132 in the Y-axis direction. This is because the solder S flows through the holes 132H during soldering, minimizing excess solder. This prevents excess solder from overflowing onto adjacent first pads, which could result in electrical connection between multiple first pads 132P. Furthermore, when the height of the solder S is limited as in the embodiment, the likelihood of contact with the shielding can or cover member is reduced, minimizing the possibility of a short circuit occurring with the shielding can or cover member.

[0320] According to an embodiment, the second circuit board 115-42 may further include a plurality of test grooves 115A-42. The plurality of test grooves 115A-42 may be formed by exposing a conductive layer through holes formed in the outermost layer of the second circuit board 115-42. Each test groove 115A-42 is connected to a corresponding second pad 115P-42, and the electrical connection between each first pad 132P and second pad 115P-42 may be tested using each test groove 115A-42. Accordingly, the number of the plurality of first pads 132P, the plurality of second pads 115P-42, and the plurality of test grooves 115A-42 may all be the same.

[0321] FIG. 36 is a perspective view of a mobile terminal to which a camera module according to an embodiment is applied.

[0322] As shown in FIG. 36, the mobile terminal 1500 of the embodiment may include a camera module 1000 (or camera device 100), a flash module 1530, and an autofocus device 1510 provided on the rear surface.

[0323] The camera module 1000 may include an image capture function and an autofocus function, for example, the camera module 1000 may include an image-based autofocus function.

[0324] The camera module 1000 processes still or video image frames acquired by an image sensor in a photography mode or a video call mode.

[0325] The processed image frame can be displayed on a predetermined display unit or stored in a memory.A camera (not shown) can also be disposed on the front of the body of the mobile terminal.

[0326] For example, the camera module 1000 may include a first camera module 1000A and a second camera module 1000B, and the first camera module 1000A may be capable of implementing OIS along with AF or zoom functions.

[0327] The flash module 1530 may include a light emitting element for emitting light therein, and may be activated by the camera of the mobile terminal or by user control.

[0328] The autofocus device 1510 may include one of a surface emitting laser device package as a light emitting unit.

[0329] The autofocus device 1510 may include an autofocus function using a laser. The autofocus device 1510 may be used primarily in conditions where the image-based autofocus function of the camera module 1000 is degraded, such as in close proximity of less than 10 m or in dark environments.

[0330] The autofocus device 1510 may include a light emitting portion including a vertical cavity surface emitting laser (VCSEL) semiconductor device, and a light receiving portion such as a photodiode that converts optical energy into electrical energy.

[0331] A camera device according to an embodiment of the present invention includes an image sensor, a first circuit board electrically connected to the image sensor, a first camera actuator, and a second circuit board electrically connected to the first camera actuator, one end of the first circuit board including a plurality of first pads extending in a first direction and spaced apart from each other in a second direction perpendicular to the first direction, one end of the second circuit board including a plurality of second pads extending in the first direction and spaced apart from each other in the second direction, the plurality of first pads and the plurality of second pads corresponding to each other one-to-one, at least partial regions of the plurality of first pads and at least partial regions of the plurality of second pads being arranged to overlap each other in a third direction perpendicular to the first and second directions, the plurality of first pads and the plurality of second pads being soldered, and a hole being formed in each of the plurality of first pads and the hole being arranged on each of the plurality of second pads.

[0332] The sum of the lengths in the first direction of the first pads and second pads among the plurality of first pads and the plurality of second pads that are arranged to overlap each other in the third direction may be longer than the lengths in the first direction of the first pads and the second pads when they are overlapped each other.

[0333] One end of the first circuit board may be disposed above one end of the second circuit board.

[0334] Solder may be placed in the hole of the first pad.

[0335] Solder may be disposed in the holes, on the lower surfaces of the first pads and on the upper surfaces of the second pads.

[0336] The width of the hole may be 40 to 70% of the width of each of the first pads.

[0337] One end of the first circuit board may be a flexible printed circuit board (FPCB).

[0338] The first circuit board may include a flexible printed circuit board (FPCB), a first region of the FPCB may be arranged to overlap the second circuit board in the first direction, a second region of the FPCB may be arranged to overlap the second circuit board in the third direction, and the first pad may be arranged on the second region of the FPCB.

[0339] The first direction may be in the direction of the optical axis.

[0340] The first camera actuator may be an OIS (optical image stabilization) actuator.

[0341] The first circuit board may include a 1-1 circuit board arranged to extend in a direction perpendicular to the first direction on the lower surface of the image sensor, and a 1-2 circuit board connected to the 1-1 circuit board and arranged to extend in the first direction, and the plurality of first pads may be arranged on the 1-2 circuit board.

[0342] The camera may further include a second camera actuator disposed between the image sensor and the first camera actuator, wherein the first-1 circuit board, the image sensor, the second camera actuator, and the first camera actuator are sequentially disposed along the first direction, and the first-2 circuit board is disposed on a side of the second camera actuator.

[0343] The first camera actuator may be an OIS (optical image stabilization) actuator, and the second camera actuator may be a zooming actuator or an AF (autofocusing) actuator.

[0344] FIG. 37 is a perspective view of a vehicle to which a camera module according to an embodiment is applied.

[0345] For example, FIG. 37 is an external view of a vehicle equipped with a vehicle driving assistance device to which the camera module 1000 (or the camera device 100) according to the embodiment is applied.

[0346] 37, a vehicle 700 according to an embodiment may include wheels 13FL and 13FR that are rotated by a power source, and a predetermined sensor. The sensor may be, but is not limited to, a camera sensor 2000.

[0347] The camera sensor 2000 may be a camera sensor to which the camera module 1000 according to the embodiment is applied. The vehicle 700 according to the embodiment may acquire image information through the camera sensor 2000 capturing a front image or a surrounding image, and may determine an unidentified lane situation using the image information and generate a virtual lane when the lane is unidentified.

[0348] For example, the camera sensor 2000 may capture an image in front of the vehicle 700 to acquire a front image, and a processor (not shown) may analyze objects included in the front image to acquire image information.

[0349] For example, if an object such as a lane marking, an adjacent vehicle, an obstacle, or an indirect road marking, such as a median strip, a curb, or a roadside tree, is captured in the image captured by the camera sensor 2000, the processor can detect such an object and include it in the image information. At this time, the processor can obtain distance information from the detected object through the camera sensor 2000 to further complement the image information.

[0350] The image information may be information about an object captured in the image. The camera sensor 2000 may include an image sensor and an image processing module.

[0351] The camera sensor 2000 can process still or moving images obtained by an image sensor (eg, CMOS or CCD).

[0352] The image processing module processes still or moving images acquired through the image sensor to extract necessary information and transmit the extracted information to a processor.

[0353] In this case, the camera sensor 2000 may include, but is not limited to, a stereo camera to improve the accuracy of measuring the object and further secure information such as the distance between the vehicle 700 and the object.

[0354] The above description focuses on the embodiments, but these are merely examples and are not intended to limit the present invention. Those skilled in the art will recognize that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the present invention. For example, each component specifically illustrated in the embodiments can be modified and implemented. Differences related to such modifications and applications should be interpreted as being included within the scope of the present invention as defined in the appended claims.

Claims

1. a first actuator, a second actuator, and an image sensor arranged in sequence along the optical axis direction; and a circuit board disposed around the first actuator and the second actuator; The circuit board includes: a first circuit board portion on which the image sensor is mounted; and a second circuit board portion connected to the first circuit board portion and extending along the optical axis direction; the second circuit board portion overlaps with the first actuator and the second actuator in a direction perpendicular to the optical axis direction and is connected to the first actuator.

2. The camera module according to claim 1 , wherein the length of the first actuator in a direction perpendicular to the optical axis direction is smaller than the length of the second actuator in a direction perpendicular to the optical axis direction.

3. The second circuit board unit an outermost first region; and The camera module of claim 1 , further comprising: a second region located inside the first region.

4. The second circuit board unit a common substrate; and a first individual substrate disposed in the first region; The camera module of claim 3 , further comprising: a second individual substrate disposed in the second region.

5. The camera module according to claim 4 , wherein the length of the first individual substrate in the optical axis direction is at least 0.5 times the length of the common substrate in the optical axis direction in the first region.

6. The camera module according to claim 5 , wherein the length of the second individual substrate in the optical axis direction is 0.5 times or less the length of the common substrate in the optical axis direction in the second region.

7. the circuit board includes a third circuit board portion extending in a direction perpendicular to the optical axis direction in the second circuit board portion, the third circuit board portion including a first connector; The camera module according to claim 1 , wherein the second circuit board portion includes a second connector that overlaps and is coupled to the first actuator in a direction perpendicular to the optical axis direction.

8. the first actuator includes a first substrate portion disposed on a side surface, The camera module according to claim 7 , wherein the second actuator includes a second substrate portion disposed on a side surface.

9. The camera module of claim 8 , wherein the first substrate unit is electrically connected to the second connector by pin coupling.

10. the first actuator includes a first drive unit disposed on the first substrate unit, the first driving portion is disposed apart from the second connector, The camera module according to claim 8 , wherein the first drive unit is arranged offset from the second connector in a direction perpendicular to the optical axis direction.

Images