Devices and methods for measuring components, and lithography systems

Abstract

The present invention relates to an apparatus (1) for measuring a component (2), particularly an optical component (2) of a lithography system, comprising at least one vibration isolation device (3), a measuring system (4) attached to the at least one vibration isolation device (3), and a supply device (5) for supplying to the measuring system (4). At least one data connection (6) for transmitting data between the supply device (5) and the measurement system (4), and / or At least one current connection (7) for transmitting electrical energy between the supply device (5) and the measurement system (4), and / or At least one gas connection (8) for transmitting at least one gas between the supply device (5) and the measurement system (4), and / or At least one liquid connection (9) for transmitting at least one liquid between the supply device (5) and the measuring system (4), and / or At least one vacuum connection (10) for transmitting vacuum between the supply device (5) and the measurement system (4) The present invention relates to an apparatus (1) having a supply device (4) that provides supply via a decoupling device (5). According to the present invention, a decoupling device (11) is provided and configured to mechanically, at least partially, disconnect the measuring system (4) from the supply device (5) during the measurement of at least one component (2).

Description

Technical Field

[0001] This application claims the priority of German Patent Application Publication No. 10 2023 202 241.9, the content of which is incorporated herein by reference in its entirety.

[0002] The present invention relates to an apparatus for measuring components, particularly optical components of a lithography system, comprising at least one vibration isolation device, a measurement system attached to at least one vibration isolation device, and a supply device for supplying the measurement system, at least one data connection for transmitting data between the supply device and the measurement system, and / or at least one current connection for transmitting electrical energy between the supply device and the measurement system, and / or at least one gas connection for transmitting at least one gas between the supply device and the measurement system, and / or at least one liquid connection for transmitting at least one liquid between the supply device and the measurement system, and / or at least one vacuum connection for transmitting a vacuum between the supply device and the measurement system and performing the supply via the above, and having a supply device.

[0003] The present invention relates to a method for measuring components, particularly optical components, using a measurement system mounted to be vibration-damped, wherein the supply to the measurement system by the supply device is at least one data connection for transmitting data between the supply device and the measurement system, and / or at least one current connection for transmitting electrical energy between the supply device and the measurement system, and / or at least one gas connection for transmitting at least one gas between the supply device and the measurement system, and / or at least one liquid connection for transmitting at least one liquid between the supply device and the measurement system, and / or At least one vacuum connection that transmits vacuum between the supply device and the measurement system. This also concerns the methods used, which are carried out through [the means].

[0004] Furthermore, the present invention relates to a lithography system, particularly a projection exposure apparatus for semiconductor lithography, comprising an illumination system having a radiation source and an optical unit having at least one optical component. [Background technology]

[0005] In the prior art, measurement systems are used to measure components, particularly the optical components of lithography systems. These measurement systems, known from the prior art, require, for example, electrical energy (electric current), data and information, gases, and / or liquids such as water to operate.

[0006] It is known from the prior art that cables, hoses, and screw connections are used between environmental supply devices and vibration-damped mechanical components of measuring systems for the transmission of media, particularly for the supply of electric current and for the transmission of data, gases, and liquids.

[0007] Cables and hoses used in conventional technology often possess inherent rigidity to ensure static requirements, medium filling, and, in particular, mounting safety against buckling and crushing.

[0008] The known cross-sections and materials of cables and hoses from conventional technology are made to dimensions that exceed the resonant frequency of the vibration isolation device supporting the measurement system. [Overview of the project] [Problems that the invention aims to solve]

[0009] Therefore, in the case of conventional measurement systems, also known as measuring instruments, it is disadvantageous that destructive vibrations and forces can be transmitted to the measurement system by the supply device, potentially adversely affecting the measurement process of the measurement system. [Means for solving the problem]

[0010] The present invention aims to provide a device for measuring components that avoids the drawbacks of the prior art and, in particular, enables reliable measurement of components.

[0011] According to the present invention, this objective is achieved by an apparatus having the features described in claim 1.

[0012] The present invention also aims to provide a method for measuring components that avoids the shortcomings of the prior art and, in particular, enables reliable measurement of components.

[0013] According to the present invention, this objective is achieved by a method having the features described in claim 12.

[0014] The present invention is further based on the objective of avoiding the drawbacks of the prior art and providing a lithography system that has reliably measured components.

[0015] This objective is achieved in accordance with the present invention by a lithography system having the features described in claim 20.

[0016] The apparatus for measuring components, particularly optical components of a lithography system, according to the present invention comprises at least one vibration isolation device, a measuring system attached to at least one vibration isolation device, and a supply device for supplying to the measuring system. At least one data connection for transmitting data between the supply device and the measurement system, and / or At least one current connection for transmitting electrical energy between the supply device and the measurement system, and / or At least one gas connection for transmitting at least one gas between the supply device and the measurement system, and / or At least one liquid connection for transmitting at least one liquid between the supply device and the measurement system, and / or At least one vacuum connection for transmitting a vacuum between a supply device and a measurement system and a supply device that supplies through the connection.

[0017] According to the present invention, a decoupling device is provided and is configured to mechanically and at least partially disconnect the measurement system from the supply device, at least during measurement of the component.

[0018] The device according to the present invention can transmit a medium between the measurement system and the supply device, or between mechanical components, in a non-contact manner as much as possible, especially in the case of a highly sensitive measurement system.

[0019] Regarding the present invention, the term "medium" or "medium flow" is to be understood to mean one, two, or a plurality, or all of the following media, namely data, electrical energy, one gas or a plurality of different gases, one liquid or a plurality of different liquids, or a vacuum.

[0020] Regarding the present invention, the term "connection" between the measurement system and the supply device is to be understood to mean any of the following connections, namely a data connection, a current connection, a gas connection, a liquid connection, or a vacuum connection, if the description regarding the present invention does not explicitly relate to a specific connection. Therefore, the term "connection" is to be understood to mean one, two, a plurality, or all of the above connections.

[0021] The device according to the present invention is suitable for measuring components, especially optical components. The device according to the present invention is particularly suitable for measuring the optical components of a lithography system, especially a projection exposure device for manufacturing semiconductors.

[0022] In the case of the device according to the present invention, it is preferable to almost or completely eliminate cable, hose, and screw connections. This prevents the transmission of destructive vibrations to the measurement system side of the measurement system or the device.

[0023] In the case of the device according to the invention, structural solution means can be provided for transmitting a medium or a medium flow to a sensitive measurement system without contact or at least almost without contact. The structural solution means in the case of the device according to the invention is preferably intended to reduce or avoid a direct mechanical connection between the insulated side and the non-insulated side of the device for the transmission of the medium, at least during the measurement of the component.

[0024] Regarding the present invention, one, a plurality, or all of the media may be transmitted from the supply device to the measurement system without a direct mechanical connection, or the decoupling device may be configured such that one, a plurality, or all of the connections between the supply device and the measurement system are disconnected, at least during the measurement of the component.

[0025] Regarding the present invention, in particular, two or more than two connections between the measurement system and the supply device may be mechanically disconnected by the decoupling device during the measurement of the component.

[0026] Furthermore, two or more than two media may be transmitted without contact, i.e., without contact, during the measurement of the component, and / or the transmission between the measurement system and the supply device may be prevented during the measurement of the component, and / or the medium may be supplied to the measurement system by the internal storage unit of the measurement system.

[0027] Regarding the present invention, two or more than two structural solution means may be provided that enable the mechanical disconnection of the corresponding number of connections during the measurement of the component.

[0028] The decoupling device may be configured, in particular, to disconnect the direct mechanical connection between the measurement system and the supply device, at least during the measurement of the component (i.e., in the operating state of the measurement system).

[0029] A decoupling device may be configured to mechanically disconnect at least one, more, or all of the connections by active means, at least during the measurement of a component. However, with respect to the present invention, a decoupling device may also be configured to mechanically disconnect at least one, more, or all of the connections between the measuring system and the supply device, at least partially, preferably completely, continuously or permanently. A decoupling device may also be configured to mechanically connect one, more, or all of the connections between the measuring system and the supply device only when supply to the measuring system is required and the component is not being measured at that time, for example, the measuring system may have a storage unit for one, more, or all of the medium. A decoupling device may be configured to actively and mechanically disconnect at least one of the connections at least partially and / or permanently or continuously without contact with at least one of the connections and / or to temporarily mechanically connect at least one of the connections only when the component is not being measured, for example, to supply a storage unit.

[0030] Decoupling devices are preferably configured to completely mechanically disconnect the connection. However, with respect to the transmission of liquids, gases, or vacuums, for example, if the mechanical connection is at least partially disconnected, these measures are advantageous over the prior art because they also reduce the transmission of vibrations.

[0031] In relation to the present invention, the gas may be air or a noble gas in particular.

[0032] In relation to the present invention, the transmission of liquids may particularly relate to water.

[0033] With respect to the present invention, "transmission of vacuum between the supply device and the measurement system" should be understood to specifically mean that the supply device generates or maintains a vacuum within the measurement system.

[0034] Particularly advantageous configurations of means for enabling transmission of individual connections or individual media are shown below. These can be used in any combination.

[0035] By at least partial mechanical disconnection, the apparatus according to the present invention also allows for easier replacement of mechanical components of the measuring system or supply device, preferably without the need to remove cables, hoses, and screw connections.

[0036] The apparatus according to the present invention makes it possible to eliminate cables and hoses, which must have corresponding inherent rigidity to satisfy static requirements and for mounting safety (buckling, crushing, etc.).

[0037] The decoupling device may, in particular, be designed to be switchable for disconnecting and reconnecting connections, and / or may have non-contact connections, and / or have or form minimal contact connections. The decoupling device may, in particular, be configured to disconnect and reconnect plug connections so that the connection between the measuring system and the supply device for the transmission of one medium is disconnected or severed, at least during the measurement of a component.

[0038] In the case of known measuring instruments, the cross-section and material of cables and hoses are often sized so that the cables and hoses exceed the resonant frequency of the vibration isolation device supporting the measuring system. The resonant frequency, in this context, specifically refers to the first natural frequency. However, cable harnesses and / or conduits typically also have higher natural frequencies, potentially introducing vibrations into the measuring system precisely within these frequency ranges.

[0039] Therefore, in the case of the apparatus according to the present invention, it is advantageous if the resonant frequency, i.e., the first natural frequency and / or a higher natural frequency and / or further vibration modes are used as the design criterion for isolation.

[0040] In an advantageous development of the apparatus according to the present invention, the decoupling device may be configured to form a data connection in at least a partially wireless configuration.

[0041] Wireless or cableless data connection or data transmission may be performed in particular by WLAN, Bluetooth, and / or optical transmission methods.

[0042] The above data connection is suitable for efficient signal transmission between the supply device and the measurement system.

[0043] In this configuration, data for controlling the measurement system can be transmitted from the supply device to the measurement system, while preferably, the measurement data collected by the measurement system with respect to the components is transmitted to the supply device for storage and further processing.

[0044] In an advantageous development of the apparatus according to the present invention, the decoupling device may have an inductive device that can be used to inductively transmit electrical energy in a non-contact manner at at least one point of current connection.

[0045] Especially when the measurement system has low power consumption, power can be transmitted or supplied permanently, preferably non-contact, and particularly inductively. Inductive current transmission has the advantage of favorably avoiding the transmission of vibrations as a result of being able to supply current non-contact.

[0046] In an advantageous development of the apparatus according to the present invention, the decoupling device may have a gap seal and / or labyrinth seal positioned at at least one point of the gas connection and / or liquid connection and / or vacuum connection.

[0047] Labyrinth seals and / or gap seals enable non-contact medium feedthrough between the supply device and the measurement system.

[0048] The sealing effect of labyrinth seals and / or gap seals is preferably based on the extension of the flow path of gas and / or liquid and / or vacuum through the gap to be sealed, resulting in a significant increase in flow resistance. The aforementioned path extension is preferably achieved by the interlocking or interlocking of the fabricated elements.

[0049] Preferably, the labyrinth seal and / or gap seal are designed to prevent flow separation in the medium, which could lead to undesirable vibrations.

[0050] It has been found that gas and / or liquid connections are advantageous when they are made by sealing systems that operate with at least minimal, preferably non-contact, contact, thereby minimizing vibration at the connection compared to direct mechanical connections. Labyrinth seals and gap seals are particularly suitable for this purpose.

[0051] With respect to the present invention, a vacuum connection can be understood to specifically mean a connection that can create a vacuum environment in the region of the measurement system as a result of carrying residual gas from the measurement system to the supply device. The resulting gas flow is then guided accordingly from the measurement system to the supply device. In contrast, in the case of the gas connection described above, the gas flow is guided from the supply device to the measurement system.

[0052] In an advantageous development of the apparatus according to the present invention, the gap seal and / or labyrinth seal may have a sealing air device for enhancing the sealing effect.

[0053] The use of sealing air can further enhance the sealing effect of labyrinth seals or crevice seals. The use of sealing air is one means of sealing cavities formed by gas and / or vacuum connections using excessive air pressure and / or excessive gas pressure and / or sealing air suction removal and / or gas suction removal, thereby improving the non-contact sealing effect. The flow characteristics of the sealing air may be selected to avoid the generation of vibrations in the labyrinth seal and / or crevice seal region due to the sealing air.

[0054] In an advantageous development of the apparatus according to the present invention, the decoupling device may be located in the interface area between the supply device and the measurement system.

[0055] Placing the decoupling device in a single interface area, i.e., spatially concentrating individual connections within the interface area, has the advantage of allowing this area to be particularly securely mounted and / or isolated.

[0056] In an advantageous development of the apparatus according to the present invention, the decoupling device may have an actuated moving mechanism.

[0057] When the measuring system and the supply device are connected and / or disconnected by an actuated moving mechanism, it is advantageous that this can be done quickly. Rapid connection and / or rapid disconnection has the advantage of keeping the process time or handling time of the measuring process favorably short in the case of a measuring system.

[0058] In an advantageous development of the apparatus according to the present invention, the decoupling device may be configured to disconnect and / or connect data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections.

[0059] Temporary connections and / or temporary medium supplies during precise measurement processes have the advantage of eliminating complex contactless connections or transmission methods.

[0060] In particular, the decoupling device may disconnect the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection during or before the measurement operation of the measurement system. After the measurement process is completed, the decoupling device can supply power to the measurement system by reconnecting the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection to the supply device.

[0061] A decoupling device may be configured to disconnect and / or connect a mechanical connection, particularly between a supply device and a measuring system.

[0062] In an advantageous development of the apparatus according to the present invention, the decoupling device may have at least one data carrier and / or at least one charge storage unit and / or at least one gas storage unit and / or at least one liquid container and / or at least one vacuum accumulator device.

[0063] A storage unit such as an accumulator and / or capacitor can be provided as part of the measurement system and / or on the measurement system side. In particular, the accumulator or storage unit on the measurement system side may be configured to charge the required amount of electrical energy before the measurement process.

[0064] Therefore, the apparatus according to the present invention can have two operating modes, and these can be realized simultaneously in the exact same apparatus.

[0065] The first operating mode is a permanent mode in which a medium, electrical energy or current, and data are transmitted continuously but without contact.

[0066] The second operating mode is a temporary mode in which multiple storage systems (or just one storage system) of the device are stocked before the start of the measurement process, allowing the measurement system to operate autonomously during the measurement process.

[0067] Two operating modes, namely a temporary operating mode and a permanent operating mode, can be provided for different measurement tasks. In particular, the selection of the operating mode may be intentionally made in response to a decrease in the demands of the measurement system regarding the medium to be supplied and the medium or electrical energy to be supplied.

[0068] The above-described embodiments of the apparatus enable the realization of a measuring device for measuring components of a lithography apparatus, preferably optical components. In this apparatus, a medium such as electrical energy or data, e.g., an electromagnetic signal, is transmitted to the measuring system, preferably non-contact, i.e., without mechanical contact connections. The apparatus and its advantageous developments according to the present invention can, in particular, minimize vibrations to the operating measuring system during the measurement of optical components. In this apparatus, liquids and / or gases may be transmitted from a supply device to the measuring system by special seals, not entirely non-contact, but with at least minimal vibration, and / or filled into at least one storage unit incorporated into the measuring system, or into a storage system that supplies to the measuring system during the measurement of optical components.

[0069] In an advantageous development of the apparatus according to the present invention, the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection may have low rigidity such that the transmission of vibration from the supply device to the measurement system is at least significantly suppressed.

[0070] Instead of completely contactless transmission of the medium, it is also possible to provide a connection, such as a connecting wire, with selected rigidity such that vibrations are not transmitted or are transmitted only slightly.

[0071] For example, to transmit electrical energy, it is possible to use simple thin wire strands, preferably with an insulating coating, instead of insulated cables.

[0072] In an advantageous development of the apparatus according to the present invention, the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection may have a rigidity of 0.1 N / mm to 100 N / mm, preferably 0.1 N / mm to 50 N / mm, more preferably 0.2 N / mm to 10 N / mm, and particularly 0.2 N / mm to 2 N / mm.

[0073] The stiffness values ​​mentioned above should preferably be considered in relation to mass or isolated structures or measurement systems.

[0074] The isolated mass of an isolated structure or measuring system may be, for example, 10 kg. In that case, if the stiffness c = 0.1 N / mm, the first natural frequency or resonant frequency will be 0.5 Hz.

[0075] The isolated mass of an isolated structure or measuring system may be, for example, 10,000 kg. In that case, if the stiffness c = 100 N / mm, the first natural frequency or resonant frequency will be 0.5 Hz.

[0076] Correspondingly, larger or smaller machines can have greater or less rigidity and mass. Preferably, the first natural frequency ω is given by the formula JPEG2026509870000002.jpg69 This can be calculated by the following formula, where c represents stiffness and m represents isolated mass.

[0077] The inventors have found that with the stiffness values ​​described above, vibrations that would impair the measurement process are not transmitted through the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection.

[0078] The measurement system may also be placed inside an isolation box. In particular, the isolation box may be soundproof and / or vibration-damping. This makes it possible to reduce and / or minimize the transmission of airborne sound to the measurement system. In this case, the isolation box can be considered part of the decoupling device.

[0079] The decoupling device may be in the form of a plug-in module and / or a connection module.

[0080] The present invention also relates to a method having the features described in claim 12.

[0081] In the present invention, a method for measuring components, particularly optical components, using a measurement system mounted to be vibration-damped, the supply to the measurement system by the supply device is: At least one data connection for transmitting data between the supply device and the measurement system, and / or At least one current connection for transmitting electrical energy between the supply device and the measurement system, and / or At least one gas connection for transmitting at least one gas between the supply device and the measurement system, and / or At least one liquid connection for transmitting at least one liquid between the supply device and the measurement system, and / or At least one vacuum connection that transmits vacuum between the supply device and the measurement system. This is done via [a specific method]. According to the present invention, the measurement system is mechanically at least partially disconnected from the supply device, at least during the measurement of the component.

[0082] The direct mechanical connection between the measurement system and the supply device may be disconnected, at least during the measurement of the component.

[0083] At least partial mechanical disconnection may be achieved by complete mechanical disconnection or severance of one or all of the connections, namely data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections.

[0084] Alternatively or in addition, at least partial mechanical disconnection may be achieved by reducing the ability of one or all of the connections, i.e., data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections, to transmit mechanical excitation, in particular vibration.

[0085] The method according to the present invention has the advantage that the measurement system is protected from vibrations that would reduce measurement accuracy, at least during the measurement process, thus enabling particularly reliable measurement of components by the measurement system.

[0086] In an advantageous development of the method according to the present invention, the data may be transmitted wirelessly over a data connection.

[0087] Wireless data transmission can be achieved particularly reliably and simply using established systems such as WLAN and / or Bluetooth.

[0088] In an advantageous development of the method according to the present invention, electrical energy may be transmitted at least partially inductively through a current connection.

[0089] This method allows for contactless inductive transmission of electrical energy, which is particularly suitable for measurement processes where the measurement system requires only a small amount of power.

[0090] In an advantageous development of the method according to the present invention, at least one gas and / or at least one liquid and / or at least one vacuum may be transmitted through gap seals and / or labyrinth seals at at least one point of the gas connection and / or liquid connection and / or vacuum connection.

[0091] The use of gap seals and / or labyrinth seals in the transmission of gases, liquids, and / or vacuums has the advantage that labyrinth seals and / or gap seals enable non-contact sealing.

[0092] In particular, the use of gap seals and / or labyrinth seals is suitable when the operating pressure of the gas and / or liquid, or the negative pressure in the case of a vacuum, is limited. The specific values ​​of the operating pressure of the gas and / or liquid, or the negative pressure in the case of a vacuum, can be determined so as to avoid or at least significantly avoid the generation of turbulence.

[0093] In an advantageous development of the method according to the present invention, data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections may be disconnected before the measurement of the component and / or reconnected after the measurement of the component.

[0094] This method can be performed in a temporary operation mode (also referred to as a second operation mode in the present invention) and / or a permanent operation mode (also referred to as a first operation mode in the present invention).

[0095] In permanent operation mode, data, electrical energy, gas, liquid, and / or vacuum are permanently transmitted between the measurement system and the supply device even during the measurement process.

[0096] In temporary operation mode, the measurement system is temporarily connected to the supply device, and the connection between the measurement system and the supply device may be disconnected or interrupted, especially during component measurement.

[0097] In an advantageous development of the method according to the present invention, the measurement system may be configured to operate partially or fully autonomously during the measurement of the component.

[0098] If the measurement system operates partially or completely autonomously, each direct connection between the measurement system and the supply device can be partially or completely disconnected during component measurement.

[0099] For example, the measurement system may be evacuated from the start of measurement, and after complete disposal, the measurement system may be disconnected from the vacuum pump of the supply device and vacuum-sealed. The quality of the vacuum in operation may be within acceptable limits during the measurement time.

[0100] Similarly, the measurement system may be filled with gas, particularly a noble gas, from the start of the measurement, and the gas concentration may remain within a sufficiently acceptable range throughout the measurement period.

[0101] In an advantageous development of the method according to the present invention, before the measurement of the components, filling of at least one data carrier and / or at least one charge storage unit and / or at least one gas storage unit and / or at least one liquid container and / or at least one vacuum accumulator device may be performed via data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections.

[0102] Storage devices (also referred to in this invention as storage units / storage systems) are particularly advantageous for performing the method in temporary operating mode. For example, a charge storage unit may be charged at high power outside of measurement time via a cable connection. In this case, the measurement system utilizes the stored energy during measurement.

[0103] In an advantageous development of the method according to the present invention, during the measurement of a component, the measurement system may be at least partially supplied by a data carrier and / or charge storage nit and / or gas storage unit and / or liquid container and / or vacuum accumulator device.

[0104] The above-described storage device may be configured to assist the execution of the method in a permanent operating mode with a temporary operating mode during the operation of the measurement system or during the measurement of components. For example, electrical energy from a charge storage unit may also be used to supplement the transmission of electrical energy by induction, especially when there is a power peak.

[0105] Therefore, in some cases, both operating modes may be used for individual media only, or in combination or simultaneously.

[0106] For measurement operations that do not require gas or air, a relatively rigid gas connection may be disconnected by a decoupling device or at the interface surface or interface area. At the same time, a relatively low-rigidity cable connection may be permanently maintained. The interface area is preferably located between the supply device and the measurement system, or the interface surface is preferably formed between the supply device and the measurement system.

[0107] The present invention also relates to a lithography system having the features described in claim 20.

[0108] A lithography system according to the present invention, particularly a projection exposure apparatus for semiconductor lithography, comprises an illumination system having a radiation source and an optical unit having at least one optical component. According to the present invention, at least one of the optical components is at least partially measured by the apparatus and / or method described above according to the present invention.

[0109] The lithography system according to the present invention has the advantage that its components, particularly its optical components (also referred to as optical elements), are measured with particular reliability. Preferably, the optical components are mirrors, lens elements, or collectors. In this way, semiconductor products can be manufactured with particular reliability using the lithography system according to the present invention.

[0110] The apparatus according to the present invention is particularly suitable for use as a measuring instrument for measuring the projection optical unit of a lithography system.

[0111] Features described in relation to one of the subjects of the present invention, particularly as provided by the apparatus, method, or lithography system according to the present invention, are also advantageously implementable in other subjects of the present invention. Similarly, advantages described in relation to one of the subjects of the present invention can be understood in relation to other subjects of the present invention.

[0112] Furthermore, note that terms such as “equip,” “possess,” or “include” do not exclude other features or steps. Similarly, terms such as “are” or “it” indicating a single step or feature do not exclude multiple features or steps, and vice versa.

[0113] However, in the simpler embodiments of the present invention, features introduced to the invention using terms such as “equipped with,” “having,” or “including” can also be exhaustively enumerated. Therefore, one or more enumerations of features can be considered exhaustive within the scope of the invention, for example, when considered separately for each claim. For example, the present invention may consist only of the features described in claim 1.

[0114] Please note that designations such as "First" or "Second" are primarily used to distinguish between the features of each apparatus or method, and are not necessarily intended to indicate that the features are mutually necessary or related.

[0115] The vibration isolation device, supply device, and decoupling device provided by the present invention may also be provided and configured for use in the lithography system itself. This means that the apparatus according to the present invention can be used in the lithography system itself. This is an independent (second) invention, and for this purpose, the above and below configurations of the apparatus and method according to the present invention can be directly or similarly referenced.

[0116] The second invention can be characterized as follows:

[0117] Apparatus for a lithography system, comprising at least one vibration isolation device, a lithography system (or components of a lithography system, particularly a projection system or illumination optical unit or an exposure system or illumination system) attached to the at least one vibration isolation device, and a supply device for supplying to the lithography system (or components of a lithography system, particularly a projection system or exposure system), At least one data connection for transmitting data between a supply device and a lithography system (or components of a lithography system, particularly projection or exposure systems), and / or At least one current connection for transmitting electrical energy between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system), and / or At least one gas connection for transmitting at least one gas between a supply device and a lithography system (or components of a lithography system, particularly the projection system or exposure system), and / or At least one liquid connection for transmitting at least one liquid between a supply device and a lithography system (or components of a lithography system, particularly the projection system or exposure system), and / or At least one vacuum connection that transmits vacuum between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system). In an apparatus having a supply device that supplies via, An apparatus characterized in that a decoupling device is provided and configured to mechanically disconnect at least partially, preferably completely, the lithography system (or components of the lithography system, particularly the projection system or exposure system) from a supply device at least during a predetermined operation (e.g., during maintenance, operation, or adjustment).

[0118] The method according to the present invention, corresponding to the second invention, can be characterized as follows.

[0119] A method for a lithography system (or components of a lithography system, particularly a projection system or exposure system) attached to at least one vibration isolation device, wherein the supply to the lithography system (or components of a lithography system, particularly a projection system or exposure system) by a supply device is At least one data connection for transmitting data between a supply device and a lithography system (or components of a lithography system, particularly projection or exposure systems), and / or At least one current connection for transmitting electrical energy between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system), and / or At least one gas connection for transmitting at least one gas between a supply device and a lithography system (or components of a lithography system, particularly the projection system or exposure system), and / or At least one liquid connection for transmitting at least one liquid between a supply device and a lithography system (or components of a lithography system, particularly the projection system or exposure system), and / or At least one vacuum connection that transmits vacuum between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system). In a method carried out via, A method characterized in that a lithography system (or components of a lithography system, particularly the projection system or exposure system) is mechanically at least partially, preferably completely, disconnected from a supply device at least during a predetermined operation (e.g., during maintenance, operation, or adjustment).

[0120] By using this apparatus and method with the lithography system itself, the medium can be transmitted non-contact between the lithography system (or components of the lithography system, particularly the projection system or exposure system) and the supply device, at least during a predetermined operation. As a result, destructive vibrations and forces that could adversely affect the operation are avoided.

[0121] An independent claim, namely an apparatus for measuring a component having at least one vibration isolation device, a measuring system attached to at least one vibration isolation device, and a supply device for supplying to the measuring system, or a method for measuring a component using a measuring system mounted to be vibration-damped, wherein the method of supplying to the measuring system via a supply line can also be understood, in a particular embodiment, as a lithography system (or a component of a lithography system, in particular a projection system or illumination optical unit or an exposure system or illumination system) configured and provided for manufacturing semiconductors and operating accordingly for this purpose.

[0122] Exemplary embodiments of the present invention will be described in more detail below with reference to the drawings.

[0123] Each figure shows a preferred exemplary embodiment in which individual features of the present invention are combined with each other. Features of exemplary embodiments can be implemented independently of other features of the same embodiment, and those skilled in the art can easily combine them with features of other exemplary embodiments to form further executable combinations and subcombinations.

[0124] In the diagram, functionally identical elements are given the same reference numeral. [Brief explanation of the drawing]

[0125] [Figure 1] This shows a meridian cross-section of an EUV projection lithography system. [Figure 2] This shows a DUV projection exposure system. [Figure 3] A schematic diagram of a possible embodiment of the apparatus or method according to the present invention is shown. [Figure 4] A schematic diagram of a possible embodiment of the transmission device is shown. [Figure 5] A schematic diagram of yet another possible embodiment of the apparatus and method according to the present invention is shown. [Figure 6] A block diagram illustrating possible embodiments of the method according to the present invention is shown. [Modes for carrying out the invention]

[0126] Referring to Figure 1, the essential components of a microlithography EUV projection exposure apparatus 100, as an example of a lithography system, are first described illustratively below. The description of the basic structure of the EUV projection exposure apparatus 100 and its components should not be understood as limited here.

[0127] The illumination system 101 of the EUV projection exposure apparatus 100 includes, in addition to the radiation source 102, an illumination optical unit 103 that illuminates the object field of view 104 of the object surface 105. The object being exposed here is a reticle 106 positioned in the object field of view 104. The reticle 106 is held by a reticle holder 107. The reticle holder 107 is displaceable, particularly in the scanning direction, by a reticle displacement drive 108.

[0128] Figure 1 shows an orthogonal xyz coordinate system for illustrative purposes. The x-direction extends perpendicular to the plane of the figure. The y-direction extends horizontally, and the z-direction extends vertically. In Figure 1, the scanning direction extends in the y-direction. The z-direction extends perpendicular to the object plane 10°.

[0129] The EUV projection exposure apparatus 100 includes a projection optical unit 109. The projection optical unit 109 functions to image the object field of view 104 onto the image field of view 110 of the image plane 111. The image plane 111 extends parallel to the object plane 105. Alternatively, angles other than 0° are possible between the object plane 105 and the image plane 111.

[0130] The structure on the reticle 106 is imaged onto the photosensitive layer of the wafer 112, which is positioned in the image field 110 region of the image plane 111. The wafer 112 is held by a wafer holder 113. The wafer holder 113 is displaceable, particularly in the y-direction, by a wafer displacement drive 114. On the one hand, the displacement of the reticle 106 by the reticle displacement drive 108, and on the other hand, the displacement of the wafer 112 by the wafer displacement drive 114, can be synchronized with each other.

[0131] Radiation source 102 is an EUV radiation source. Radiation source 102 emits EUV radiation 115, which is also referred to below as the radiation used or illumination radiation. In particular, the radiation used 115 has a wavelength in the range of 5 nm to 30 nm. Radiation source 102 may be a plasma source, such as an LPP source ("laser-generated plasma") or a GDPP source ("gas discharge plasma"). It may also be a synchrotron-based radiation source. Radiation source 102 may be a free electron laser (FEL).

[0132] Illumination radiation 115 emitted from the radiation source 102 is focused by a collector 116. The collector 116 may be a collector having one or more elliptical and / or hyperbolic reflectors. Illumination radiation 115 may be incident on at least one reflector of the collector 116 at an oblique angle (GI), i.e., at an incident angle greater than 45°, or at a normal angle (NI), i.e., at an incident angle less than 45°. The collector 116 may be structured and / or coated to first optimize its reflectivity for the radiation used 115, and second to suppress external light.

[0133] Downstream of the collector 116, the illumination radiation 115 propagates through the intermediate focal plane 117. The intermediate focal plane 117 can be the separation point between the radiation source module, which includes the radiation source 102 and the collector 116, and the illumination optical unit 103.

[0134] The illumination optical unit 103 comprises a deflection mirror 118 and a first facet mirror 119 positioned downstream of it in the beam path. The deflection mirror 118 may be a planar deflection mirror or a mirror having a beam influence effect beyond a pure deflection effect. Alternatively or additionally, the deflection mirror 118 may be in the form of a spectral filter that separates the wavelength of light used by the illumination radiation 115 from external light of wavelengths outside of it. When the first facet mirror 119 is positioned on the plane of the illumination optical unit 103 that is optically conjugate to the object plane 105 as a field of view, it is also referred to as a field of view facet mirror. The first facet mirror 119 includes a plurality of individual first facets 120, which are also referred to below as field of view facets. Only some of these facets 120 are shown as examples in Figure 1.

[0135] The first facet 120 may take the form of a macroscopic facet, particularly a rectangular facet or a facet having an arc-shaped edge contour or a partially circular edge contour. The first facet 120 may take the form of a planar facet, or a facet that is curved in a convex or concave shape.

[0136] For example, as is known from German Patent Application Publication No. 10 2008 009 600, the first facet 120 itself can also be composed of multiple individual mirrors, particularly multiple micromirrors. The first facet mirror 119 can take the form of a micro-electromechanical system (MEMS system). See German Patent Application Publication No. 10 2008 009 600 for further details.

[0137] Between the collector 116 and the deflection mirror 118, the illumination radiation 115 travels horizontally, i.e., in the y-direction.

[0138] In the beam path of the illumination optical unit 103, the second facet mirror 121 is positioned downstream of the first facet mirror 119. When the second facet mirror 121 is positioned on the pupil plane of the illumination optical unit 103, it is also referred to as a pupil facet mirror. The second facet mirror 121 can also be positioned away from the pupil plane of the illumination optical unit 103. In this case, the combination of the first facet mirror 119 and the second facet mirror 121 is also referred to as a specular reflector. Specular reflectors are known from U.S. Patent Application Publication No. 2006 / 0132747, European Patent No. 1614008, and U.S. Patent No. 6,573,978.

[0139] The second facet mirror 121 includes multiple second facets 122. In the case of a pupil facet mirror, the second facets 122 are also referred to as pupil facets.

[0140] Similarly, the second facet 122 may be a macroscopic facet having, for example, a circular, rectangular, or hexagonal boundary, or it may be a facet composed of micromirrors. In this regard, see German Patent Application Publication No. 10 2008 009 600.

[0141] The second facet 122 may have a planar reflective surface or a curved reflective surface that is convex or concave.

[0142] Therefore, the illumination optical unit 103 forms a dual-facet system. This basic principle is also known as a fly-eye integrator.

[0143] It may be advantageous not to precisely position the second facet mirror 121 on a plane that is optically conjugate to the pupil plane of the projection optical unit 109.

[0144] The individual first facets 120 are imaged into the object field of view 104 using the second facet mirror 121. The second facet mirror 121 is the last beam shaping mirror or, in fact, the final mirror for the illumination radiation 115 in the beam path upstream of the object field of view 104.

[0145] In yet another embodiment (not shown) of the illumination optical unit 103, a transfer optical unit, which contributes particularly to imaging the first facet 120 onto the object field of view 104, can be positioned in the beam path between the second facet mirror 121 and the object field of view 104. The transfer optical unit may have exactly one mirror, or two or more mirrors positioned before and after the beam path of the illumination optical unit 103. The transfer optical unit may, in particular, include one or two perpendicular incidence mirrors (NI mirrors) and / or one or two oblique incidence mirrors (GI mirrors).

[0146] In the embodiment shown in Figure 1, the illumination optical unit 103 has exactly three mirrors downstream of the collector 116, specifically a deflection mirror 118, a field of view facet mirror 119, and a pupil facet mirror 121.

[0147] In yet another embodiment of the illumination optical unit 103, the deflection mirror 118 can be omitted, so the illumination optical unit 103 may have exactly two mirrors downstream of the collector 116, specifically a first facet mirror 119 and a second facet mirror 121.

[0148] The imaging of the first facet 120 onto the object surface 105 by the second facet 122, or by using the second facet 122 and the transfer optics unit, is generally only an approximate image.

[0149] The projection optical unit 109 includes a plurality of mirrors Mi, which are numbered sequentially according to their arrangement in the beam path of the EUV projection exposure apparatus 100.

[0150] In the example shown in Figure 1, the projection optical unit 109 includes six mirrors M1 to M6. Substitution with four, eight, ten, twelve, or any other number of mirrors Mi is equally possible. The second-to-last mirror M5 and the last mirror M6 each have a through aperture for illumination radiation 115. The projection optical unit 109 is a double-shielded optical unit. The projection optical unit 109 has an image-side numerical aperture greater than 0.5 and may be greater than 0.6, for example, 0.7 or 0.75.

[0151] The reflective surface of mirror Mi may be in the form of a free-form surface without an axis of rotational symmetry. Alternatively, the reflective surface of mirror Mi may be designed as an aspherical surface with exactly one axis of rotational symmetry of the reflective surface shape. Similar to the mirrors of illumination optical unit 103, mirror Mi may have a highly reflective coating for illumination radiation 115. These coatings may be designed in particular as multilayer coatings having alternating layers of molybdenum and silicon.

[0152] The projection optical unit 109 has a large object-image offset in the y-direction between the y-coordinate of the center of the object field of view 104 and the y-coordinate of the center of the image field of view 110. This object-image offset in the y-direction may be approximately the same magnitude as the z-distance between the object plane 105 and the image plane 111.

[0153] In particular, the projection optics unit 109 can have an anamorphic design. Specifically, it has different imaging scales βx and βy in the x and y directions. The two imaging scales βx and βy of the projection optics unit 10 are preferably (βx, βy) = (+ / -0.25, + / -0.125). A positive imaging scale β means imaging without image inversion. A negative sign for the imaging scale β means imaging with image inversion.

[0154] As a result, the projection optical unit 109 is reduced in size in the x-direction, i.e., in the direction perpendicular to the scanning direction, at a ratio of 4:1.

[0155] The projection optical unit 109 reduces its size in the y-direction, i.e., in the scanning direction, at a ratio of 8:1.

[0156] Other imaging scales are also possible. Imaging scales with the same sign and absolute value in the x and y directions, for example, 0.125 or 0.25 absolute value, are also possible.

[0157] The number of intermediate image planes in the x and y directions in the beam path between the object field of view 104 and the image field of view 110 may be the same or may differ depending on the embodiment of the projection optical unit 109. An example of a projection optical unit with a different number of such intermediate images in the x and y directions is known from U.S. Patent Application Publication No. 2018 / 0074303.

[0158] Each pupil facet 122 is assigned to exactly one of the field of view facets 120 to form an illumination channel that illuminates the object field of view 104. In particular, this allows illumination according to Köhler's principle. The distant field of view is decomposed into multiple object fields of view 104 using the field of view facets 120. The field of view facets 120 generate multiple images at intermediate focal points in each pupil facet 122 that is assigned to it.

[0159] The field of view facets 120 are each imaged onto the reticle 106, overlapping with the assigned pupil facets 122, to illuminate the object field of view 104. The illumination of the object field of view 104 is particularly uniform, preferably with a uniformity error of less than 2%. Field of view uniformity can be achieved by overlapping different illumination channels.

[0160] The illumination of the entrance pupil of the projection optical unit 109 can be geometrically defined by the arrangement of the pupil facets. By selecting the illumination channels to guide light, particularly a subset of the pupil facets, the intensity distribution in the entrance pupil of the projection optical unit 109 can be set. This intensity distribution is also referred to as the illumination setting.

[0161] Similarly desirable pupil uniformity in a defined illuminated area of ​​the illumination pupil of the illumination optical unit 103 can be achieved by redistributing the illumination channels.

[0162] Further aspects and details of the illumination of the object field of view 104, particularly the entrance pupil of the projection optical unit 109, will be described below.

[0163] The projection optics unit 109 may have a concentric entrance pupil, which can be made accessible or inaccessible.

[0164] The entrance pupil of the projection optical unit 109 cannot generally be accurately illuminated using the pupil facet mirror 121. When imaging is performed by the projection optical unit 109, which telecentrically images the center of the pupil facet mirror 121 onto the wafer 112, the aperture rays often do not intersect at a single point. However, it is possible to find a plane where the distance between pairs of aperture rays is minimized. This plane represents the entrance pupil or its conjugate plane in real space. In particular, this plane exhibits a finite curvature.

[0165] The projection optics unit 109 may have different entrance pupil positions for the tangential beam path and the sagittal beam path. In this case, an imaging element, particularly an optical component of the transfer optics unit, should be placed between the second facet mirror 121 and the reticle 106. This optical element can be used to account for the difference in positions between the tangential and sagittal entrance pupils.

[0166] In the arrangement of the components of the illumination optical unit 103 shown in Figure 1, the pupil facet mirror 121 is positioned on a plane conjugate to the entrance pupil of the projection optical unit 109. The field of view facet mirror 119 is positioned at an angle with respect to the object plane 105. The first facet mirror 119 is positioned at an angle with respect to the arrangement plane defined by the deflection mirror 118.

[0167] The first facet mirror 119 is positioned at an inclination with respect to the arrangement plane defined by the second facet mirror 121.

[0168] Figure 2 shows an exemplary DUV projection lithography apparatus 200. The DUV projection lithography apparatus 200 comprises an illumination system 201, a device known as a reticle stage 202 for housing and precisely positioning a reticle 203 that determines the subsequent structure on a wafer 204, a wafer holder 205 for holding, moving, and precisely positioning the wafer 204, and an imaging device having a plurality of optical components, in particular a lens element 207, specifically a projection optical unit 206, the lens element 207 being held by a mount 208 within a lens housing 209 of the projection optical unit 206.

[0169] Various refractive, diffracting, and / or reflective optical elements, including mirrors, prisms, end plates, etc., can be provided as alternatives to or in addition to the illustrated lens element 207.

[0170] The basic functional principle of the DUV projection exposure apparatus 200 is that the structure introduced into the reticle 203 is imaged onto the wafer 204.

[0171] The illumination system 201 supplies a projection beam 210 in the form of electromagnetic radiation necessary for imaging the reticle 203 onto the wafer 204. The source of this radiation may be a laser, a plasma source, or the like. The radiation is shaped by optical elements in the illumination system 201 so that the projection beam 210 has desired characteristics in terms of diameter, polarization, wavefront shape, etc., when incident on the reticle 203.

[0172] The projection beam 210 forms an image of the reticle 203, which is then transferred from the projection optical unit 206 to the wafer 204 in an appropriate reduced form. In this case, since the reticle 203 and the wafer 204 can be moved synchronously, the region of the reticle 203 is imaged onto the corresponding region of the wafer 204 virtually continuously during the so-called scanning operation.

[0173] The air gap between the last lens element 207 and the wafer 204 can be optionally replaced with a liquid medium having a refractive index greater than 1.0. The liquid medium can be, for example, high-purity water. Such a configuration is also called immersion lithography and has high photolithographic resolution.

[0174] The use of the present invention is not limited to use in projection exposure apparatuses 100 and 200, nor is it particularly limited to use in the configuration described. The present invention is suitable for any desired lithography system or microlithography system, but is particularly suitable for projection exposure apparatuses having the configuration described. The present invention is also suitable for EUV projection exposure apparatuses having a smaller image-side numerical aperture than that described with respect to Figure 1 and in which mirrors M5 and / or M6 are not obscured. In particular, the present invention is also suitable for EUV projection exposure apparatuses having an image-side numerical aperture of 0.25 to 0.5, preferably 0.3 to 0.4, and particularly preferably 0.33. The present invention and subsequent exemplary embodiments should not be understood as being limited to a particular design.

[0175] The following diagram illustrates the present invention in a very schematic form, merely as an example.

[0176] Figure 3 shows a schematic diagram of a possible embodiment of the apparatus 1 for measuring component 2, in particular the optical component 2 of a lithography system. The optical component 2 may be, in particular, a collector 116, or one of the mirrors, or one of the facets 118, 119, 120, 121, 122, Mi, or one of the lens elements 207. The apparatus 1 comprises at least one vibration isolation device 3, a measuring system 4 attached to at least one vibration isolation device 3, and a supply device 5 for supplying to the measuring system 4. In the case of apparatus 1, supply to the measurement system 4 is provided via at least one data connection 6 for transmitting data between the supply device 5 and the measurement system 4, and / or at least one current connection 7 for transmitting electrical energy between the supply device 5 and the measurement system 4, and / or at least one gas connection 8 for transmitting at least one gas between the supply device 5 and the measurement system 4, and / or at least one liquid connection 9 for transmitting at least one liquid between the supply device 5 and the measurement system 4, and / or at least one vacuum connection 10 for transmitting vacuum between the supply device 5 and the measurement system 4.

[0177] In the case of apparatus 1, a decoupling device 11 is provided and is configured to mechanically disconnect the measurement system 4 from the supply device 5, at least partially, during the measurement of component 2.

[0178] In the exemplary embodiment shown in Figure 3, the decoupling device 11 is preferably configured to form a data connection 6 in a wireless configuration, at least partially, and preferably entirely. In Figure 3, the wireless data connection 6 is represented by an antenna on the supply device 5 and / or the measurement system 4.

[0179] In the exemplary embodiment shown in Figure 3, the decoupling device 11 preferably has an inductive device 12 that can be used to inductively transmit electrical energy in a non-contact manner at at least one point of the current connection 7.

[0180] According to the exemplary embodiment shown in Figure 3, the decoupling device 11 is preferably located in the interface area 13 between the supply device 5 and the measurement system 4. In the schematic diagram shown in Figure 3, the interface area 13 is represented by a rectangle shown as a dashed line.

[0181] In the exemplary embodiment shown in Figure 3, it is even more preferable that the measurement system 4 is placed inside an isolation box 14 that protects the measurement system 4 from the effects of airborne sound. In Figure 3, the isolation box 14 is represented by a rectangle shown in dashed form.

[0182] In the exemplary embodiment shown in Figure 3, the decoupling device 11 has non-contact transmission devices 15 for gas connection 8 and / or liquid connection 9 and / or vacuum connection 10, respectively.

[0183] In particular, the transmission device 15 may be a non-contact seal, especially a gap seal 16a and / or a labyrinth seal 16b, as described below.

[0184] Figure 4 shows schematic diagrams of possible embodiments of the transmission device 15 for gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0185] In the exemplary embodiment shown in Figure 4, the transmission device 15 is in the form of a gas seal 16a or a labyrinth seal 16b. The labyrinth seal 16b has an interlocking array 17 to prevent the flow of the medium through connections 8, 9, and 10, which are shown as flow arrows 18 in Figure 4.

[0186] It is preferable that the media flow, represented by the flow arrow 18, be switched or interrupted during the measurement operation of the device 1. This prevents destructive flow noise, vibration, and structure-borne noise during measurement.

[0187] Therefore, in the exemplary embodiment shown in Figure 4, the decoupling device 11 has gap seals 16a and / or labyrinth seals 16b located at at least one point of the gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0188] In the exemplary embodiment shown in Figure 4, the gap seal 16a and / or labyrinth seal 16b also have a seal air device 19 for enhancing the sealing effect. In the exemplary embodiment shown in Figure 4, the seal air device 19 has at least one nozzle element to direct the seal air at an appropriate angle and with an appropriate flow profile to the gap and / or labyrinth of the gap seal 16a and / or labyrinth seal 16b.

[0189] In the exemplary embodiment shown in Figure 4, the seal air device 19 is preferably configured for seal air suction and removal.

[0190] Figure 5 shows a schematic diagram of yet another possible embodiment of the apparatus 1.

[0191] In the exemplary embodiment shown in Figure 5, the decoupling device 11 preferably has an actuated moving mechanism 20.

[0192] According to an exemplary embodiment of the apparatus 1 shown in Figure 5, the decoupling device 11 is configured to disconnect and / or connect the data connection 6 and / or the current connection 7 and / or the gas connection 8 and / or the liquid connection 9 and / or the vacuum connection 10.

[0193] In this particular exemplary embodiment of the apparatus shown in Figure 5, the moving mechanism 20 is configured to preferably quickly disconnect and / or connect the data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0194] Furthermore, according to an exemplary embodiment of the apparatus 1 shown in Figure 5, the decoupling device 11 includes at least one data carrier 21 and / or at least one charge storage unit 22 and / or at least one gas storage unit 23 and / or at least one liquid container 24 and / or at least one vacuum accumulator device 25. In this particular exemplary embodiment shown in Figure 5, the vacuum accumulator device 25 is realized by a vacuum-sealed housing of the measuring system 4 that is tight enough to maintain a vacuum environment at least during measurement.

[0195] In an exemplary embodiment of the apparatus 1 shown in Figure 5, it is preferable that the data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10 have low rigidity such that the transmission of vibration from the supply device 5 to the measurement system 4 is suppressed. This is particularly advantageous when the connections are not disconnected during measurement.

[0196] Preferably, in an exemplary embodiment of the apparatus 1 shown in Figure 5, the data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10 have a rigidity of 0.1 N / mm to 100 N / mm, preferably 0.1 N / mm to 50 N / mm, more preferably 0.2 N / mm to 10 N / mm, and particularly 0.2 N / mm to 2 N / mm.

[0197] Figures 3 and 5 show mechanical vibrations or tremors that may originate from or be transmitted by the supply device 5, the ground, and / or the air, as stylized waves.

[0198] Figure 6 shows a block diagram of a possible embodiment of a method for measuring component 2.

[0199] In the method for measuring component 2, particularly the optical component 2 of the lithography system, as shown in Figure 6, component 2 is measured in the measurement block 30 using a measurement system 4 mounted to be vibration-damped. In the supply block 31, the supply from the supply device 5 to the measurement system 4 is performed via at least one data connection 6 for transmitting data between the supply device 5 and the measurement system 4, and / or at least one current connection 7 for transmitting electrical energy between the supply device 5 and the measurement system 4, and / or at least one gas connection 8 for transmitting at least one gas between the supply device 5 and the measurement system 4, and / or at least one liquid connection 9 for transmitting at least one liquid between the supply device 5 and the measurement system 4, and / or at least one vacuum connection 10 for transmitting vacuum between the supply device 5 and the measurement system 4. In the disconnection block 32, the measurement system 4 is mechanically disconnected at least partially from the supply device 5 during the measurement of at least component 2.

[0200] In the exemplary embodiment shown in Figure 6, it is preferable that data is transmitted wirelessly via the data connection 6 with respect to the supply block 31 and / or the disconnection block 32.

[0201] Furthermore, with respect to the disconnection block 32 and / or the measurement block 30, it is preferable that electrical energy is transmitted at least partially non-contact, and particularly inductively, through the current connection 7.

[0202] With respect to the supply block 31 and / or the disconnection block 32, in the exemplary embodiment shown in Figure 6, it is preferable that at least one gas and / or at least one liquid and / or vacuum are transmitted, preferably at least substantially non-contact, and preferably non-contact, through gap seals 16a and / or labyrinth seals 16b at at least one point of the gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0203] With respect to the disconnection block 32 in an exemplary embodiment of the method shown in Figure 6, the data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10 may be disconnected before the measurement of component 2 and / or reconnected after the measurement of component 2.

[0204] In the exemplary embodiment shown in Figure 6, with respect to the measurement block 30, the measurement system 4 can preferably operate partially or fully autonomously during the measurement of component 2.

[0205] In the exemplary embodiment shown in Figure 6, with respect to the supply block 31 and / or the detachment block 32, before measuring component 2, preferably filling at least one data carrier 21 and / or at least one charge storage unit 22 and / or at least one gas storage unit 23 and / or at least one liquid container 24 and / or at least one vacuum accumulator device 25 can be performed via data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0206] In the exemplary embodiment shown in Figure 6, with respect to the supply block 31, it is preferable that during the measurement of component 2, the measurement system 4 is at least partially supplied by the data carrier 21 and / or the charge storage unit 22 and / or the gas storage unit 23 and / or the liquid container 24 and / or the vacuum accumulator device 25.

[0207] Figures 1 and 2 show lithography systems, particularly projection exposure apparatuses 100 and 200 for semiconductor lithography, comprising illumination systems 101 and 201, a radiation source 102, and optical units 103, 109, and 206 having at least one optical component 116, 118, 119, 120, 121, 122, Mi, and 207.

[0208] In the case of the projection exposure apparatuses 100 and 200 shown in Figures 1 and 2, at least one of the optical components 116, 118, 119, 120, 121, 122, Mi, and 207 is measured at least partially using apparatus 1 outlined in relation to Figures 3 to 5 and / or at least partially using the method outlined in relation to Figure 6.

[0209] Therefore, component 2 measured by the method described in relation to apparatus 1 and / or Figure 6 is preferably one of the optical components 116, 118, 119, 120, 121, 122, Mi, 207 in the case of projection exposure apparatuses 100, 200 shown in Figures 1 and 2.

[0210] The apparatus 1 and method according to the present invention are particularly suitable for mirror Mi.

[0211] The second invention will be described in principle below with reference to Figure 3. In the second invention, the apparatus 1 or the corresponding method is used as the lithography system itself. In the second method, the lithography system constitutes a measurement system 4 as shown in Figure 3. In the description of the second embodiment only, reference numeral 4 will be used below to refer to the lithography apparatus with reference to Figure 3. The following description also applies to methods for carrying out the second invention. According to the second method, the apparatus 1 is used as a lithography apparatus 4 having at least one vibration isolation device 3, or the lithography system is part of the apparatus 1. The lithography system 4 is attached to at least one vibration isolation device 3. Furthermore, a supply device 5 for supplying to the lithography system 4 is provided. Supply is provided via at least one data connection 6 for transmitting data between the supply device 5 and the lithography system 4, and / or at least one current connection 7 for transmitting electrical energy between the supply device 5 and the measurement system 4, and / or at least one gas connection 8 for transmitting at least one gas between the supply device 5 and the measurement system 4, and / or at least one liquid connection 9 for transmitting at least one liquid between the supply device 5 and the measurement system 4, and / or at least one vacuum connection 10 for transmitting vacuum between the supply device 5 and the measurement system 4. A decoupling device 11 is provided and configured to mechanically disconnect the lithography system 4 from the supply device 5 at least partially during a predetermined operation, for example, during maintenance, operation, or adjustment. The lithography system 4 may also relate only to the components of the lithography system 4, particularly to the projection system or illumination optical unit 103 or the exposure system or illumination system 101. The second invention is based on the concept that the apparatus and method according to the present invention for measuring components can be used not only for measuring components to be later inserted into the lithography system but also for the lithography system itself. [Explanation of Symbols]

[0212] 1 device 2 components 3. Vibration isolation device 4. Measurement System 5. Supply Devices 6. Data Connection 7 Current connection 8. Gas connection 9. Liquid connection 10 Vacuum connection 11 Decoupling Devices 12 Induction Devices 13 Interface Area 14 Isolation box 15 Transmission devices 16a Gap seal 16b Labyrinth Seal 17. Occlusal arrangement 18 Flowing arrow 19. Sealing Air Device 20 Moving mechanism 21 Data Carriers 22 Charge Storage Units 23 Gas storage units 24 Liquid containers 25 Vacuum Accumulator Devices 30 measuring blocks 31 Supply Block 32 Separation blocks 100 EUV projection exposure system 101 Lighting System 102 Radiation source 103 Illumination Optical Unit 104 Object field of view 105 Object plane 106 Reticle 107 Reticle Holder 108 Reticle Displacement Drive 109 Projection Optical Unit 110 Image field 111 Image plane 112 wafers 113 Wafer holder 114 Wafer Displacement Drive 115 EUV / use / illumination radiation 116 Collector 117 Intermediate focal plane 118 Polarizing mirror 119 First Facet Mirror / Field of View Facet Mirror 120 First Facet / Visual Field Facet 121 Second Facet Mirror / Pupil Facet Mirror 122 Second Facet / Pupil Facet 200 DUV Projection Lithography System 201 Lighting System 202 Reticle Stage 203 Reticle 204 wafers 205 Wafer Holder 206 Projection Optics Unit 207 Lens element 208 Mount 209 Lens Housing 210 Projection beam Mi Mirror

Claims

1. An apparatus (1) for measuring a component (2), particularly an optical component (2) of a lithography system, comprising at least one vibration isolation device (3), a measuring system (4) attached to the at least one vibration isolation device (3), and a supply device (5) for supplying to the measuring system (4), At least one data connection (6) for transmitting data between the supply device (5) and the measurement system (4), and / or At least one current connection (7) for transmitting electrical energy between the supply device (5) and the measurement system (4), and / or At least one gas connection (8) for transmitting at least one gas between the supply device (5) and the measurement system (4), and / or At least one liquid connection (9) for transmitting at least one liquid between the supply device (5) and the measurement system (4), and / or At least one vacuum connection (10) that transmits vacuum between the supply device (5) and the measurement system (5) In an apparatus (1) having a supply device (5) that supplies via, The apparatus is characterized in that a decoupling device (11) is provided and configured to mechanically disconnect the measuring system (4) from the supply device (5) at least partially during the measurement of the component (2).

2. In the apparatus (1) described in claim 1, The apparatus is characterized in that the decoupling device (11) is configured to form the data connection (6) in at least a partially wireless configuration.

3. In the apparatus (1) according to claim 1 or 2, The apparatus is characterized in that the decoupling device (11) has an inductive device (12) that can be used to inductively transmit the electrical energy in a non-contact manner at at least one point of the current connection (7).

4. In the apparatus (1) according to any one of claims 1 to 3, The apparatus is characterized in that the decoupling device (11) has gap seals (16a) and / or labyrinth seals (16b) disposed at at least one point of the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10).

5. In the apparatus (1) described in claim 4, The apparatus is characterized in that the gap seal (16a) and / or the labyrinth seal (16b) have a sealing air device (19) for enhancing the sealing effect.

6. In the apparatus (1) according to any one of claims 1 to 5, The apparatus is characterized in that the decoupling device (11) is located in the interface area (13) between the supply device (5) and the measurement system (4).

7. In the apparatus (1) according to any one of claims 1 to 6, The decoupling device (11) is characterized by having an operable moving mechanism (20).

8. In the apparatus (1) according to any one of claims 1 to 7, The apparatus is characterized in that the decoupling device (11) is configured to disconnect and / or connect the data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10).

9. In the apparatus (1) according to any one of claims 1 to 8, The decoupling device (11) is characterized by having at least one data carrier (21) and / or at least one charge storage unit (22) and / or at least one gas storage unit (23) and / or at least one liquid container (24) and / or at least one vacuum accumulator device (25).

10. In the apparatus (1) according to any one of claims 1 to 9, The apparatus is characterized in that the data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10) have low rigidity such that the transmission of vibration from the supply device (5) to the measurement system (4) is suppressed at least significantly.

11. In the apparatus (1) according to any one of claims 1 to 10, The apparatus is characterized in that the data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10) have a rigidity of 0.1 N / mm to 100 N / mm, preferably 0.1 N / mm to 50 N / mm, more preferably 0.2 N / mm to 10 N / mm, and particularly 0.2 N / mm to 2 N / mm.

12. A method for measuring a component (2), particularly an optical component (2) of a lithography system, using a measurement system (4) mounted to be vibration-damped, wherein the supply to the measurement system (4) by a supply device (5) is At least one data connection (6) for transmitting data between the supply device (5) and the measurement system (4), and / or At least one current connection (7) for transmitting electrical energy between the supply device (5) and the measurement system (4), and / or At least one gas connection (8) for transmitting at least one gas between the supply device (5) and the measurement system (4), and / or At least one liquid connection (9) for transmitting at least one liquid between the supply device (5) and the measurement system (4), and / or At least one vacuum connection (10) that transmits vacuum between the supply device (5) and the measurement system (4) In a method carried out via, The method is characterized in that the measurement system (4) is mechanically at least partially disconnected from the supply device (5) at least during the measurement of the component (2).

13. In the method according to claim 12, A method characterized in that data is transmitted wirelessly via the data connection (6).

14. In the method according to claim 12 or 13, A method characterized in that the electrical energy is transmitted at least partially inductively through the current connection (7).

15. In the method according to any one of claims 12 to 14, A method characterized in that the at least one gas and / or the at least one liquid and / or the at least one vacuum are transmitted through a gap seal (16a) and / or a labyrinth seal (16b) at at least one point of the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10).

16. In the method according to any one of claims 12 to 15, A method characterized in that the data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10) are disconnected before the measurement of the component (2) and / or reconnected after the measurement of the component (2).

17. In the method according to any one of claims 12 to 16, The method is characterized in that the measurement system (4) operates partially or completely autonomously during the measurement of the component (2).

18. In the method according to any one of claims 12 to 17, A method characterized in that, before measuring the component (2), filling of at least one data carrier (21) and / or at least one charge storage unit (22) and / or at least one gas storage unit (23) and / or at least one liquid container (24) and / or at least one vacuum accumulator device (25) is performed via the data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10).

19. In the method according to claim 18, A method characterized in that, during the measurement of the component (2), the measurement system (4) is at least partially supplied by the data carrier (21) and / or the at least one charge storage unit (22) and / or the at least one gas storage unit (23) and / or the at least one liquid container (24) and / or the at least one vacuum accumulator device (25).

20. A lithography system, particularly a projection exposure apparatus (100, 200) for semiconductor lithography, comprising an illumination system (101, 201) having a radiation source (102), and an optical unit (103, 109, 206) having at least one optical component (116, 118, 119, 120, 121, 122, Mi, 207), wherein At least one of the optical components (116, 118, 119, 120, 121, 122, Mi, 207) is The apparatus (1) and / or the apparatus according to any one of claims 1 to 11 Method according to any one of claims 12 to 19 A lithography system characterized by being measured at least partially by [a specific method / function].

Images