Photovoltaic encapsulation film composition with anti-PID properties

Abstract

This disclosure relates to a novel encapsulant film composition that provides anti-PID properties while maintaining good performance in terms of curing, adhesion, and volume resistivity. The composition comprises a) a polyolefin polymer, b) an organic peroxide, c) a silane adhesion promoter, and d) a crosslinking aid, and e) an anti-PID agent.

Description

[Technical Field]

[0001] This disclosure relates to polyolefin polymer compositions for photovoltaic (PV) encapsulation films. In one embodiment, this disclosure relates to a polyolefin polymer composition that is resistant to potential induced degradation (PID). In another embodiment, this disclosure relates to a PV encapsulation film comprising a polyolefin polymer composition, and an electronic device comprising the same. [Background technology]

[0002] The global demand for alternative energy has led to a significant increase in the production of solar panels and PV modules over the past decade. Solar cells (also called PV cells), which convert solar energy into electrical energy, are extremely fragile and must be surrounded by a durable encapsulation film. The two main functions of the encapsulation film are (1) to adhere the solar cells to the glass cover sheet and backsheet, and (2) to protect the PV module from environmental stresses (e.g., moisture, temperature, shock, vibration, electrical insulation, etc.). Ethylene vinyl acetate (EVA) exhibits a good balance of the properties required for encapsulation films, and therefore, current encapsulation films are mainly made from EVA. EVA is a type of ethylene / unsaturated carboxylic acid copolymer in which the unsaturated carboxylic acid ester comonomer is vinyl carboxylate.

[0003] Certain polyolefin polymers, such as polyolefin elastomers (POEs) that are not ethylene / unsaturated carboxylic acid copolymers, have been identified as alternatives to EVA for forming encapsulant films and offer advantages over EVA, for example, in electrical resistivity, wet and thermal stability, and weather resistance.

[0004] Because solar modules are used in a variety of environments, including high temperatures, high humidity, and high electrical stress conditions, the power efficiency of these PV cells made from EVA and POE-based compositions has been found to decrease over time. This efficiency decrease caused by electrical stress is known as voltage-induced degradation ("Potential Induced Degradation, PID"), and arises from leakage currents generated due to the difference in potential between the photovoltaic module frame and the solar cell. The PID effect can cause power losses of up to 30 percent.

[0005] The cause of PID is intertwined with factors affecting the power degradation of photovoltaic modules. However, there is no clear conclusion about the true cause of PID. Some speculate that the PID mechanism occurs in humid, high-temperature environments when water vapor enters the module through the end-seal silica gel or backing plate. The intrusion of water vapor causes condensation on the surface of the crystalline silicon solar cell module. This condensation releases sodium ions from the glass, creating a negative bias voltage. Under the action of a negative bias voltage, leakage current flows from the cell through the encapsulant adhesive, glass surface, frame and bracket, and finally to ground, thereby attenuating the output power and causing the PID phenomenon. Another potential cause of PID is the polarization of the dielectric layer of the solar cell under electrical stress. The higher electrical resistance, volume resistance ("VR") of the encapsulation film reduces the electric field applied to the dielectric layer and its polarization.

[0006] When using EVA encapsulants, it is presumed that a negative bias voltage is generated due to the hydrolysis of EVA, which produces acetic acid. This acetic acid reacts with alkali precipitated on the glass surface to produce freely mobile sodium ions. Furthermore, EVA has low electrical resistance. However, PID is also known to be a problem with POE encapsulants when their electrical resistance is not sufficiently high. Therefore, there is a recognized need in the art for novel encapsulant compositions that provide anti-PID properties while maintaining good performance with respect to curing and glass adhesion. [Overview of the Initiative]

[0007] At least the following, namely, a) Polyolefin polymer, b) organic peroxide, c) Silane adhesion promoter, d) Crosslinking aids, and e) Anti-PID agents A composition containing the following: [Brief explanation of the drawing]

[0008] [Figure 1] This is an exploded perspective view of an exemplary photovoltaic module. [Modes for carrying out the invention]

[0009] Currently, encapsulating films are primarily made from EVA. However, there is strong interest in replacing EVA-based compositions with polyolefin polymer compositions that do not contain EVA (e.g., polyolefin elastomers (POE) as defined herein) due to the specific advantages that POE can offer to encapsulating films, including but not limited to electrical resistivity, wet and thermal stability, and weather resistance.

[0010] Replacing EVA with POE-based encapsulant films is not without its own challenges. For example, POE-based encapsulant films require longer lamination times compared to EVA-based encapsulant films. In International Publication No. 2019 / 000744(A1), the inventors of this application reported a POE-based encapsulant film that showed a reduction in the time required to immerse POE with the cured package in the case of conventional crosslinking aids (e.g., triallyl isocyanurate ("TAIC")). The composition of International Publication No. 2019 / 000744(A1) replaces conventional crosslinking aids with formula (I):[R 1 ,R 2 SiO 2 / 2 ] n This is being replaced with monocyclic organosiloxanes. However, the inventors have found that switching the crosslinking agent from TAIC to these monocyclic organosiloxanes leads to unstable PID performance. In particular, in some solar cells, the power loss is greater than 5%.

[0011] Therefore, in the prior art, there is a need for a novel encapsulant film composition that provides anti-PID properties while maintaining good performance in terms of curing, adhesion, and volume resistivity. To this end, this disclosure provides a surprising and unexpected POE-based encapsulant film having anti-PID properties by introducing an anti-PID agent such as ethyl sorbate or butyl sorbate, or an acrylate compound such as TMTPA, TMPTMA, or other acrylate monomers described herein.

[0012] composition As described above, the present invention provides at least the following, namely, a) Polyolefin polymer, b) organic peroxide; c) Silane adhesion promoter, d) Crosslinking aids, and e) Anti-PID agents The present invention provides a composition containing the following:

[0013] The compositions of the present invention may include combinations of two or more embodiments as described herein.

[0014] Each component of the composition of the present invention may include a combination of two or more embodiments described herein.

[0015] (A) Polyolefin polymer This composition contains a polyolefin polymer. In certain embodiments, the composition contains 85% to 99.5% by weight of a polyolefin polymer (for example, 86% to 99.5% by weight, 87% to 99.5% by weight, 88% to 99.5% by weight, 89% to 99.5% by weight, 90% to 99.5% by weight, 95% to 99.5% by weight, 97% to 99.5% by weight, 97.50% to 98.50% by weight, 97.75% to 98.25% by weight, etc.), and the total weight percentage of the entire composition is 100% by weight. In other words, in certain embodiments, the composition comprises 85% by weight, or 88% by weight, or 90% by weight, or 95% by weight, or 97% by weight, or 97.50% by weight, or 97.75% to 98.25% by weight, or 98.5% by weight, or 99% by weight, or 99.5% by weight of a polyolefin polymer, with the total weight percentage of the entire composition being 100% by weight.

[0016] In certain embodiments, the polyolefin polymer is a polyolefin elastomer as defined herein. In further embodiments, the polyolefin polymer is a nonpolar polyolefin elastomer.

[0017] In some embodiments, the polyolefin polymer consists of 50-100% by weight of ethylene monomer units and 50-0% by weight of (C3-C3). 20)An olefin polymer comprising comonomer units derived from an alpha-olefin and optionally 20 to 0 weight % of diene comonomer units, wherein the total weight percentage is 100 weight % of the polyolefin polymer. The diene used to make the diene comonomer units can be 1,3-butadiene, 1,5-hexadiene, 1,7-octadiene, ethylidene norbornene, dicyclopentadiene, or vinyl norbornene.

[0018] In some embodiments, the polyolefin polymer comprises 50 to 100 weight % of propylene monomer units, 50 to 0 weight % of ethylene or (C4-C 20 )A propylene polymer comprising comonomer units derived from an alpha-olefin and optionally 20 to 0 weight % of diene comonomer units, wherein the total weight percentage is 100 weight % of the polyolefin polymer. The diene used to make the diene comonomer units can be 1,3-butadiene, 1,5-hexadiene, 1,7-octadiene, ethylidene norbornene, dicyclopentadiene, or vinyl norbornene.

[0019] In some embodiments, the polyolefin polymer comprises 99 to 100 weight % of (C3-C 20 )Poly((C3-C 20 )alpha-olefin) homopolymer containing alpha-olefin monomer units or 99 to 100 weight % of at least two different (C3-C 20 )Poly((C3-C 20 )alpha-olefin) copolymer containing alpha-olefin monomer / comonomer units.

[0020] In certain embodiments, the polyolefin polymer is an ethylene / alpha-olefin interpolymer. The ethylene / alpha-olefin interpolymer may be random or block interpolymers. Block interpolymers include multiblock copolymers and diblock copolymers. Non-limiting examples of suitable ethylene / alpha-olefin interpolymers include ethylene / propylene, ethylene / butene, ethylene / 1-hexene, ethylene / 1-octene, ethylene / propylene / 1-octene, ethylene / propylene / 1-butene, and ethylene / butene / 1-octene interpolymers. In some embodiments, the ethylene / alpha-olefin interpolymer is an ethylene / alpha-olefin copolymer. Non-limiting examples of suitable ethylene / alpha-olefin copolymers include ethylene / propylene copolymer, ethylene / butene copolymer, ethylene / 1-hexene copolymer, and ethylene / 1-octene copolymer.

[0021] In certain embodiments, the polyolefin polymer is a propylene / alpha-olefin interpolymer, where "alpha-olefin" includes ethylene. In some embodiments, the propylene / alpha-olefin interpolymer is a propylene / alpha-olefin copolymer.

[0022] In certain embodiments, the polyolefin polymer has a density of 0.850 g / cc to 0.900 g / cc (e.g., 0.855 g / cc to 0.900 g / cc, 0.860 g / cc to 0.900 g / cc, 0.865 g / cc to 0.900 g / cc, 0.870 g / cc to 0.890 g / cc, 0.875 g / cc to 0.890 g / cc, 0.875 g / cc to 0.885 g / cc, and / or 0.880 g / cc to 0.885 g / cc) according to ASTM D792. In other words, polyolefin polymers have densities of 0.850 g / cc, 0.855 g / cc, 0.860 g / cc, 0.865 g / cc, 0.870 g / cc, 0.875 g / cc, 0.880 g / cc to 0.885 g / cc, 0.890 g / cc, or 0.900 g / cc, according to ASTM D792.

[0023] In a particular embodiment, the polyolefin polymer has a melt index (MI) of 1 g / 10 min to 100 g / 10 min (e.g., 1 g / 10 min to 75 g / 10 min, 1 g / 10 min to 50 g / 10 min, 1 g / 10 min to 45 g / 10 min, 1 g / 10 min to 40 g / 10 min, 1 g / 10 min to 35 g / 10 min, 1 g / 10 min to 30 g / 10 min, 5 g / 10 min to 25 g / 10 min, 10 g / 10 min to 25 g / 10 min, 15 g / 10 min to 25 g / 10 min, 15 g / 10 min to 20 g / 10 min, and / or 18 g / 10 min to 20 g / 10 min) at 190 °C / 2.16 kg according to ASTM D1238. In other words, in certain embodiments, the polyolefin polymer has a melt index at 190°C / 2.16 kg, according to ASTM D1238, ranging from 1 g / 10 min, or 5 g / 10 min, or 10 g / 10 min, or 15 g / 10 min, or 18 g / 10 min, to 20 g / 10 min, or 25 g / 10 min, or 30 g / 10 min, or 35 g / 10 min, or 40 g / 10 min, or 45 g / 10 min, or 50 g / 10 min, or 75 g / 10 min, or 100 g / 10 min.

[0024] In some embodiments, the polyolefin polymer has a melting point of 40°C to 125°C. In other words, in some embodiments, the polyolefin polymer has a melting point ranging from 40°C, or 45°C, or 50°C, or 55°C to 60°C, or 65°C, or 70°C, or 80°C, or 90°C, or 95°C, or 100°C, or 110°C, or 120°C, or 125°C.

[0025] In some embodiments, the polyolefin polymer has a glass transition temperature (Tg) of -35°C to -100°C. In other words, in some embodiments, the glass transition temperature (Tg) of the polyolefin polymer is from -35°C, or -40°C, or -45°C, or -50°C to -80°C, or -85°C, or -90°C, or -95°C, or -100°C.

[0026] In some embodiments, the polyolefin polymer is 1.0 × 10 14 Ω-cm or larger, or 5.0 × 10⁻⁶ 15 Ω-cm, 1.0 × 10 16 Ω-cm or greater, or 2.0 × 10⁻⁶ 16 Ω-cm or larger, or 3.0 × 10⁻⁶ 16 Ω-cm or larger, or 4.0 × 10⁻⁶ 16 Ω-cm or larger, or 5.0 × 10⁻⁶ 16 It has a volume resistivity of Ω-cm or more.

[0027] In further embodiments, the polyolefin polymers of the present disclosure are ethylene / alpha-olefin interpolymers, excluding ethylene / propylene copolymers (e.g., ethylene-propylene rubber and / or ethylene-propylene terpolymers).

[0028] In certain embodiments, the polyolefin polymer is an ethylene / alpha-olefin interpolymer having one, some, or all of the following properties:

[0029] (i) Densities of 0.850 g / cc, 0.853 g / cc, or 0.855 g / cc, or 0.860 g / cc, or 0.863 g / cc, or 0.865 g / cc, or 0.870 g / cc, or 0.873 g / cc, or 0.875 g / cc, or 0.880 g / cc, or 0.883 g / cc, or 0.885 g / cc, or 0.890 g / cc, or 0.893 g / cc, or 0.895 g / cc, or 0.900 g / cc, and / or (ii) Melt index of 1g / 10 min, or 5g / 10 min, or 10g / 10 min, or 15g / 10 min, or 18g / 10 min to 20g / 10 min, or 25g / 10 min, or 30g / 10 min, or 35g / 10 min, or 40g / 10 min, or 45g / 10 min, or 50g / 10 min, or 75g / 10 min, or 100g / 10 min, and / or (iii) Melting point (Tm) up to 40°C, or 45°C, or 50°C, or 55°C to 60°C, or 65°C, or 70°C, or 80°C, or 90°C, or 95°C, or 100°C, or 110°C, or 120°C, or 125°C, (iv) 1.0 × 10 14 Ω-cm or larger, or 5.0 × 10⁻⁶ 15 Ω-cm or more, 1.0×10 16 Ω-cm or greater, or 2.0 × 10⁻⁶ 16 Ω-cm or larger, or 3.0 × 10⁻⁶ 16 Ω-cm or larger, or 4.0 × 10⁻⁶ 16 Ω-cm or larger, or 5.0 × 10⁻⁶ 16 Volume resistivity of Ω-cm or greater.

[0030] The polyolefin polymer may be a blend or combination of two or more of the embodiments described above. The polyolefin polymer may be blended with one or more other polymers, or diluted with polymers.

[0031] Polyolefin polymers can be produced by any suitable process known in the art. Any conventional or future-discovered production process for producing polyolefin polymers may be used to prepare the polyolefin polymers of this disclosure. Exemplary and non-limiting production processes include one or more polymerization reactions, such as high-pressure polymerization or coordination polymerization processes, using one or more polymerization catalysts, including but not limited to Ziegler-Natta, chromium oxide, metallocene, constrained geometry, and post-metallocene catalysts. Preferred temperatures are 0° to 250°C or 30° to 200°C. Preferred pressures are atmospheric pressure (101 kPa) to 10,000 atmospheres (approximately 1,013 megapascals ("MegaPascal, MPa")). In most polymerization reactions, the molar ratio of catalyst to polymerizable olefin (monomer / comonomer) used is 10 -12 :1~10 -1 :1 or 10 -9 :1~10 -5 :1.

[0032] Non-exclusive examples of polyolefin polymers include ENGAGE® Polyolefin Elastomers, AFFINITY® Polyolefin Plastomers, INFUSE® Olefin Block Copolymers, INTUNE® PP-based Olefin Block Copolymers from The Dow Chemical Company, EXACT® resins from Exxon Chemical Company, TAFMER® resins from Mitsui Chemicals, LUCENE® resins from LG Chemical, EASTOFLEX® resins from Eastman Chemical Company, and FLEXOMER® resins from The Dow Chemical Company.

[0033] (B) Organic peroxide This composition contains organic peroxides. In certain embodiments, the composition contains 0.01% to 2% by weight of organic peroxides (e.g., 0.01% to 2% by weight, 0.05% to 1.5% by weight, and / or 0.1% to 1.5% by weight, 0.2% to 1%, 0.3% to 0.8%, 0.4% to 0.6%), with a total weight percentage of 100% by weight of the entire composition. In other words, the composition contains organic peroxides ranging from 0.01% or 0.05% or 0.1% by weight to 0.2% or 0.3% or 0.4% or 0.5% or 0.6% or 1% or 2% by weight, with a total weight percentage of 100% by weight of the entire composition.

[0034] In certain embodiments, the organic peroxide is a molecule comprising a carbon atom, a hydrogen atom, and two or more oxygen atoms, and having at least one -OO- group, wherein if there are multiple -OO- groups, each -OO- group is indirectly bonded to another -OO- group via one or more carbon atoms or an assembly of such molecules.

[0035] The organic peroxide may also be a dialkyl peroxide. The organic peroxide is of formula R O -OOR O (In the formula, each R O (C1~C 20 ) Alkyl alkyl group or (C6~C 20 It may be a monoperoxide of an aryl group. Each (C1~C 20 ) Alkyl groups are independently unsubstituted or have one or two (C6~C) 12 ) Substituted with an aryl group. Each (C6~C 20 The aryl group is either unsubstituted or has 1 to 4 (C1 to C) 10 ) is substituted with an alkyl group. Alternatively, organic peroxides have formula R O -OOROOR O (In the formula, R is (C2~C 10 ) Alkilen, (C3~C 10) A divalent hydrocarbon group such as cycloalkylene or phenylene, and each R O It may be a diperoxide of (as defined above).

[0036] Non-limiting examples of suitable organic peroxides include dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butyl-peroxy)hexine-3, 2,5-di-methyl-2,5-di(t-butyl-peroxy)hexane, bis(1,1-dimethylethyl) peroxide, bis(1,1-dimethylpropyl) peroxide, 2,2-di(tert-butylperoxy)butane, di-tert-amyl peroxide ("di-tert-amyl peroxide, DTAP"), bis(alpha-t-butyl-peroxyisopropyl)benzene ("BIPB"), isopropylcumyl t-butyl peroxide, t-butylcumyl peroxide, butyl 4,4-di(tert-butylperoxy) valerate, and di(isopropylcumyl) peroxide.

[0037] The peroxide may be a peroxycarbonate containing at least one of the following structures.

[0038] [ka] Non-limiting examples of suitable peroxycarbonate-type peroxides include isopropyl percarbonate, t-butylperoxy-2-ethylhexyl carbonate, tert-amylperoxy-2-ethylhexyl carbonate, tert-butylperoxyisopropyl carbonate, and tert-butylperoxy-3,5,5-trimethylhexanoate.

[0039] The peroxide may be a diacyl peroxide containing at least one of the following structures.

[0040] [ka] Non-limiting examples of suitable acyl peroxide type peroxides include dilauroyl peroxide, benzoyl peroxide, and didecanoyl peroxide.

[0041] The peroxide may be a peroxyester comprising at least one of the following structures.

[0042] [ka] Non-limiting examples of preferred peroxyester-type peroxides include tert-butylperoxybenzoate, tert-butylperoxyacetate, tert-amylperoxybenzoate, tert-butylperoxy-3,5,5-trimethylhexanoate; tert-butylperoxyisobutyrate; tert-butylperoxydiethylacetate; tert-butylperoxy-2-ethylhexanoate; tert-amylperoxy-2-ethylhexanoate; 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate; and 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane.

[0043] The peroxide may be a peroxyketal containing at least one of the following structures.

[0044] [ka] Non-limiting examples of suitable peroxyketal-type peroxides include 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-di(tert-butylperoxy)cyclohexane, and 1,1-di(tert-amylperoxy)cyclohexane.

[0045] The peroxide may be a cyclic ketone peroxide comprising at least one of the following structures.

[0046] [ka] A non-limiting example of a suitable cyclic ketone peroxide is 3,6,9-triethyl-3,6,9-trimethyl-1,4,7-tripeloxonane.

[0047] Suitable commercially available organic peroxides, though not limited to specific examples, include TRIGONOX® from AkzoNobel and LUPEROX® from ARKEMA.

[0048] (C) Silane adhesion promoter The composition contains a silane coupling agent. In certain embodiments, the composition contains 0.01% to 1% by weight (e.g., 0.05% to 1% by weight, 0.10% to 1% by weight, 0.15% to 0.5% by weight, 0.2% to 0.4% by weight, and / or 0.25% to 0.3% by weight) of a silane adhesion promoter, with a total weight percentage of 100% by weight of the entire composition. In other words, the composition contains 0.01% or 0.05% or 0.10% or 0.15% or 0.20% or 0.25% by weight of a silane adhesion promoter, with a total weight percentage of 0.3% or 0.4% or 0.5% or 1% by weight of a silane adhesion promoter, with a total weight percentage of 100% by weight of the entire composition.

[0049] In some embodiments, the silane adhesion promoter comprises at least one alkoxy group. Non-limiting examples of suitable silane adhesion promoters include γ-chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyl-tris-(β-methoxy)silane, allyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-ethoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, and 3-(trimethoxysilyl)propyl methacrylate, 3-(trimethoxysilyl)propyl acrylate, tetraethyl orthosilicate, tetramethyl orthosilicate, and tetrapropyl orthosilicate. Examples include vinyltriisopropoxysilane, 3-(triethoxysilyl)propyl methacrylate, 3-(triisopropoxysilyl)propyl 2-methyl acrylate, vinyltriethoxysilane, and 3-[diethoxy(methyl)silyl]propyl methacrylate.

[0050] In some embodiments, the silane adhesion promoter is vinyltrimethoxysilane, 3-(trimethoxysilyl)propyl methacrylate, or 3-(trimethoxysilyl)propyl acrylate.

[0051] (D) Crosslinking agent This composition is of formula (I): [R 1 ,R 2 SiO 2 / 2 ] n (I), (In the formula, the subscript n is an integer greater than or equal to 3, and each R 1 These are independently (C2~C4) alkenyls, and each R 2 These are, independently, H, (C1~C 20 ) alkyl, phenyl, or R 1 It contains a crosslinking aid that includes a monocyclic organosiloxane.

[0052] In certain embodiments, the monocyclic organosiloxane of formula (I) is further described by any one of the following limitations: (i) the subscript n is 3, (ii) each R 1 However, they are independently (C2~C3) alkenyls, and each R 2 However, independently, each R is H, (C1-C2) alkyl, or (C2-C3) alkenyl, (iii) each R 1 However, it is vinyl, and each R 2 However, independently, (C1~C2) alkyl, (iv) each R 1 However, it is vinyl, and each R 2 However, it is methyl, (v) each R 1 However, each R is an allele, 2 However, independently, (C1~C2) alkyl, (vi) each R 1 However, each R is an allele, 2 However, it is methyl.

[0053] In certain embodiments, the monocyclic organosiloxane of formula (I) is further described by any one of the following limitations: (i) the subscript n is 4, (ii) each R 1 However, they are independently (C2~C3) alkenyls, and each R 2 However, independently, each R is H, (C1-C2) alkyl, or (C2-C3) alkenyl, (iii) each R 1 However, it is vinyl, and each R 2 However, independently, (C1~C2) alkyl, (iv) each R 1 However, it is vinyl, and each R 2 However, it is methyl, (v) each R 1 However, each R is an allele, 2 However, independently, (C1~C2) alkyl, (vi) each R 1 However, each R is an allele, 2 However, it is methyl.

[0054] In certain embodiments, the monocyclic organosiloxane of formula (I) is further described by any one of the following limitations: (i) the subscript n is 5 or 6, (ii) each R 1 However, they are independently (C2~C3) alkenyls, and each R2 However, independently, each R is H, (C1-C2) alkyl, or (C2-C3) alkenyl, (iii) each R 1 However, it is vinyl, and each R 2 However, independently, (C1~C2) alkyl, (iv) each R 1 However, it is vinyl, and each R 2 However, it is methyl, (v) each R 1 However, each R is an allele, 2 However, independently, (C1~C2) alkyl, (vi) each R 1 However, each R is an allele, 2 However, it is methyl.

[0055] In certain embodiments, the monocyclic organosiloxane of formula (I) is an alkenyl-functionalized monocyclic organosiloxane. In certain embodiments, the monocyclic organosiloxane of formula (I) is a cyclic molecule that does not contain carbon or nitrogen in its ring.

[0056] In certain embodiments, the monocyclic organosiloxane of formula (I) is a molecule or aggregate of such molecules comprising a single ring substructure composed of alternating silicon and oxygen atoms, as well as an unsaturated organic group, and optionally H, saturated, or aromatic substituents, wherein at least two unsaturated organic groups are present, each of the at least two silicon atoms in the ring substructure has at least one unsaturated organic group bonded to it, and after considering the unsaturated organic group and the oxygen atom, any remaining valence of the silicon atom is bonded to H, saturated, or aromatic substituents.

[0057] The monocyclic organosiloxane of formula (I) may consist of a 6-membered ring (n=3), an 8-membered ring (n=4), a 10-membered ring (n=5), or a 12-membered ring (n=6). The ring substructure is given by formula (I):[R 1 ,R 2 SiO 2 / 2 ] n (I) consists of units, in the formula the subscripts n and R 1 , and R 2 This is as previously defined. Each [R 1,R 2 SiO 2 / 2 n In units, the R 1 and R 2 groups are bonded to the silicon atom. The units may simply be denoted as D R1,R2 using the abbreviated notation of conventional organosiloxanes, and as a result, formula (I) becomes [D R1,R2 n . In this regard, the superscripted characters R1 and R2 can be exchanged with R 1 and R 2 respectively. In some embodiments, R 1 and R 2 are the same or different.

[0058] In certain embodiments of the monocyclic organosiloxane of formula (I), R 1 is vinyl, R[[ID=​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​R1 is vinyl, R2 is phenyl, and the monocyclic organosiloxane of formula (I) is D Vi,Ph (wherein the formula, Ph is phenyl) or R 1 is an allele, R 2 is phenyl, and the monocyclic organosiloxane of formula (I) is D アリル、Ph is or, R 1 It is butenyl (H2C=C(H)CH2CH2-), and R 2 is phenyl, and the monocyclic organosiloxane of formula (I) is D ブテニル、Ph That is. R 2 If it is methyl (CH3), the unit is more simply D R1 It may also be written as [D R1 ] n In some embodiments, R 1 It is vinyl, R 2 is methyl, and the monocyclic organosiloxane of formula (I) is D Vi is or, R 1 is an allele, R 2 is methyl, and the monocyclic organosiloxane of formula (I) is D アリル is or, R 1 It is butenyl (H2C=C(H)CH2CH2-), and R 2 is methyl, and the monocyclic organosiloxane of formula (I) is D ブテニル In some embodiments, the monocyclic organosiloxane of formula (I) is 2,4,6-trimethyl-2,4,6-trivinylcyclotrisiloxane, "(D Vi )3" (CAS number 3901-77-7), 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, "(D Vi )4" (CAS number 2554-06-5), or any combination thereof.

[0059] In certain embodiments, the crosslinking aid of the composition consists solely of a monocyclic organosiloxane of formula (I).

[0060] In certain embodiments, the compositions of the present disclosure include a crosslinking aid comprising a monocyclic organosiloxane of formula (I) in an amount of 0.01% to 5% by weight (e.g., 0.05% to 4.5% by weight, 0.1% to 4% by weight, 0.15% to 3.5% by weight, 0.2% to 3% by weight, 0.25% to 2.5% by weight, 0.3% to 2% by weight, 0.35% to 1.5% by weight, 0.4% to 1.25% by weight, 0.45% to 1% by weight, 0.5% to 1% by weight, 0.55% to 0.75% by weight, 0.6% to 0.7% by weight, etc.), with the total weight percentage of the entire composition being 100% by weight. In other words, the compositions of the present disclosure include crosslinking aids comprising monocyclic organosiloxane of formula (I) in amounts ranging from 0.01% by weight, or 0.05% by weight, or 0.1% by weight, or 0.15% by weight, or 0.2% by weight, or 0.25% by weight, or 0.3% by weight, or 0.35% by weight, or 0.4% by weight, or 0.45% by weight, or 0.5% by weight, or 0.55% by weight, or 0.6% by weight, to 0.7% by weight, 0.75% by weight, 1% by weight, or 1.25% by weight, or 1.5% by weight, or 2% by weight, or 2.5% by weight, or 3% by weight, or 3.5% by weight, or 4% by weight, or 4.5% by weight, or 5% by weight, with the total weight percentage of the entire composition being 100% by weight. In certain embodiments, the composition contains a crosslinking aid comprising a monocyclic organosiloxane of formula (I), provided that the composition does not contain (i.e., lacks) a phosphazene base. In certain embodiments, the composition contains no ring-opening catalyst at all. In further embodiments, if the polyolefin polymer is an ethylene-containing polymer and the subscript n (of the monocyclic organosiloxane of formula (I)) is 4, the composition contains no inorganic fillers selected from the group consisting of aluminum oxide, aluminum silicate, calcium silicate, magnesium silicate, silica, titanium dioxide, and mixtures thereof in amounts of 24% by weight or less, or 22% by weight or less, or 20.0% by weight or less, or 15% by weight or less, or 10% by weight or less, or none at all.In further embodiments, the composition contains no inorganic fillers selected from the group consisting of solids containing Al, solids containing Ca, solids containing Mg, solids containing Si, solids containing Ti, and mixtures thereof in amounts of 20% by weight or more, or 15% by weight or more, or 10% by weight or less, or none at all. In further embodiments, the composition does not contain silsesquioxane or any siloxane other than monocyclic organosiloxane of formula (I). In some embodiments, the composition does not contain silsesquioxane or any of the above-mentioned group of inorganic fillers.

[0061] In certain embodiments, the compositions of the Disclosure include conventional crosslinking agents such as triallyl isocyanurate, triallyl cyanurate, and high vinyl polybutadiene.

[0062] (E) Anti-PID agents This composition contains an anti-PID agent. In certain embodiments, the composition of this disclosure contains 0.001% to 1% by weight (e.g., 0.001% to 0.99% by weight, 0.001% to 0.96% by weight, 0.001% to 0.94% by weight, 0.001% to 0.90% by weight, 0.002% to 1.0% by weight, 0.005% to 1% by weight, 0.01% to 1% by weight, 0.02% to 1% by weight, 0 It contains anti-PID agents in amounts such as 0.03% to 1% by weight, 0.04% to 1% by weight, 0.05% to 1% by weight, 0.06% to 1% by weight, 0.07% to 1% by weight, 0.08% to 1% by weight, 0.09% to 1% by weight, 0.1% to 1% by weight, 0.25% to 1% by weight, 0.5% to 1% by weight, etc., and the total weight percentage of the entire composition is 100% by weight. In other words, the compositions of the present disclosure contain an anti-PID agent in amounts ranging from 0.001% by weight, or 0.003% by weight, or 0.005% by weight, or 0.01% by weight, or 0.02% by weight, or 0.03% by weight, or 0.04% by weight, or 0.05% by weight, or 0.06% by weight, or 0.07% by weight, or 0.08% by weight, or 0.09% by weight, or 0.10% by weight, or 0.20% by weight, or 0.30% by weight, or 0.40% by weight, or 0.45% by weight, or 0.50% by weight, up to 1% by weight, with the total weight percentage of the entire composition being 100% by weight.

[0063] In some embodiments, the anti-PID agent has at least one structure of formula (II):

[0064] [ka] (wherein R1, R2, and R3 each independently comprise H, methyl, alkyl, alkenyl, linear or branched alkyl or alkenyl, or cyclic or aromatic, or heteroalkyl or heteroalkenyl). In some embodiments, R2 further comprises a heteroatom such as Si, S, N, or O.

[0065] In some embodiments, R1 and R3 are each independently alkyl groups selected from the group consisting of methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl.

[0066] In some embodiments, R1 and R3 are each independently cyclic alkyl groups selected from the group consisting of cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl.

[0067] In some embodiments, R2 is given by the following equation (III):

[0068] [ka] [In the formula, R1 and R3 are each independently H, methyl, alkyl, alkenyl, linear or branched alkyl or alkenyl, or cyclic, heteroalkyl, or heteroalkenyl. R' is selected from C1-C30 alkylenes. Y is CR 4-n (In the formula, n=1~4), OR 2-n (in the formula, n=1~2), NR 3-n (in the formula, n=1~3), SR 2-n (In the formula, n=1 to 2), PR 3-n (In the formula, n=1~3), PR 5-n (in the formula, n=1~5), SiR 4-n The formula further comprises alkyl acrylates or alkyl multiacrylates such as (wherein n=1~4), selected from a bifunctional CC core, a phenyl core, an ester-substituted phenyl core, an amide-substituted phenyl core, a tris-isocyanurate core, or a melamine core, and combinations thereof.

[0069] In a particular embodiment, the bifunctional CC core is selected from the following structures, where each R' represents a divalent R' group in formula (III) above:

[0070] [ka]

[0071] In a particular embodiment, the phenyl core is selected from the following structures, where each R' represents the divalent R' group in formula (III) above:

[0072] [ka]

[0073] In certain embodiments, the ester-substituted phenyl core is selected from the following structures, where each R' represents the divalent R' group in formula (III) above:

[0074] [ka]

[0075] In certain embodiments, the amide-substituted phenyl core is selected from the following structures, where each R' represents the divalent R' group in formula (III) above:

[0076] [ka]

[0077] In a particular embodiment, the tris-isocyanurate core is as follows, where each R' represents the divalent R' group in formula (III):

[0078] [ka]

[0079] In a particular embodiment, the melamine core is as follows, where each R' represents a divalent R' group in formula (III) above,

[0080] [ka] Each R' group is independently selected from H, unsubstituted hydrocarbyl, substituted hydrocarbyl, unsubstituted heterohydrocarbyl, or substituted heterohydrocarbyl.

[0081] In some embodiments, the composition comprises an anti-PID agent containing esters of sorbic acid such as methyl sorbate, ethyl sorbate, propyl sorbate, butyl sorbate, and glycidyl sorbate.

[0082] Non-limiting examples of suitable anti-PID agents include methyl acrylate, ethyl acrylate, butyl acrylate, cyclopropyl acrylate, ethyl methacrylate, methyl methacrylate, bisphenol-A-glycidyl methacrylate, trimethylolethane trimethacrylate, trimethylolethane triacrylate, trimethylolpropane trimethylacrylate ("trimethylolpropane trimethylacrylate, TMPTMA"), trimethylolpropane triacrylate ("trimethylolpropane triacrylate, TMPTA"), glycerol triacrylate, pentaerythrityl triacrylate, methyl sorbate, ethyl sorbate, propyl sorbate, butyl sorbate, and glycidyl sorbate.Trimethylolpropane triacrylate; trimethylolpropane trimethyl acrylate; ethylene glycol dimethacrylate; ethylene glycol diacrylate; dimethylene glycol diacrylate; triethylene glycol diacrylate; tetra(ethylene glycol) diacrylate; 1,6-hexanediol diacrylate; 1,6-hexanediol dimethacrylate, neopentanediol dimethacrylate; neopentanediol diacrylate; octadecyl acrylate; butyl acrylate; ethyl acrylate; methyl acrylate; hydroxylethyl acrylate; methyl methacrylate; butyl methacrylate; ethyl methacrylate; glycidyl methacrylate; hydroxylethyl methacrylate; 2-ethyl hex Examples include syl acrylate; 2-ethylhexyl methacrylate; dodecyl acrylate; isodecyl acrylate; di(propylene glycol) diacrylate; tri(propylene glycol) diacrylate; lauryl acrylate; alkoxylated lauryl acrylate; cyclohexanedimethanol diacrylate; tridecyl methacrylate; tridecyl acrylate; pentaerythritol triacrylate; pentaerythritol tetraacrylate; dipentaerythritol hexaacrylate; tris(2-hydroxyethyl) isocyanurate triacrylate; dipentaerythritol pentaacrylate; propoxylated (3) glyceryl triacrylate; zinc diacrylate; zinc acrylate; and esters of sorbic acid.

[0083] In some embodiments, the anti-PID agent is formulated with formula (I):[R 1 ,R 2 SiO 2 / 2 ] n (I)[In the formula, the subscript n is an integer greater than or equal to 3, and each R 1 These are independent of H2C=C(R 1a )-C(=O)-O-(CH2) m -(In the formula, R 1a (where is H or methyl, and the subscript m is an integer from 1 to 4), and each R 2These are independently H, (C1-C20) alkyl, phenyl, or R 1 It includes monocyclic organosiloxanes. Non-limiting examples of suitable crosslinking aids include 2,4,6-trimethyl-2,4,6-trivinylcyclotrisiloxane, (D Vi )3" (CAS number 3901-77-7); 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, (D Vi )4" (CAS No. 2554-06-5); 2,4,6,8,10-pentavinyl-2,4,6,8,10-pentamethylcyclopentasiloxane (CAS No. 17704-22-2); 1,3,5,7,9-pentamethacrylate-1,3,5,7,9-pentamethylcyclopentasiloxane; or combinations thereof, but not limited to these.

[0084] Surprisingly, the inventors of this application have found that these anti-PID agents (such as TMPTMA and TMPTA) can effectively improve the anti-PID performance of the composition described in International Publication No. 2019 / 000744(A1). While not bound by theory, it is thought that the distribution of silane adhesion promoters (e.g., VMMS) in the film is determined by radical competition between different double bonds from different types of crosslinking aids. Switching the crosslinking aid from TAIC to the monocyclic organosiloxane (e.g., VD4) described in International Publication No. 2019 / 000744(A1) may result in higher local concentrations of silane adhesion promoters. These high-concentration regions are thought to be the root cause of power loss from PID in solar cells prepared using POE encapsulant films, due to their higher ability to transport ionic species, and thus reduce the VR of the encapsulant film. Additional anti-PID agents containing Michael acceptor groups, such as acrylates or sorbates, reduce the local concentrations of silane adhesion promoters by competing with them for radicals.

[0085] In some embodiments, the ratio of the silane adhesion promoter to the anti-PID agent is 1 or greater, 2.5 or greater, 5.0 or greater, 7.5 or greater, or 10 or greater. In some embodiments, the ratio of the silane adhesion promoter to the anti-PID agent is 50 or less, 25 or less, 15 or less, 10 or less, 5 or less, or 1 or less.

[0086] (F) Optional additives In certain embodiments, the composition may include one or more optional additives. Non-limiting examples of suitable additives include antioxidants, anti-blocking agents, stabilizers, colorants, ultraviolet (UV) absorbers or stabilizers, flame retardants, compatibilizers, fillers, hindered amine stabilizers, tree retarders, methyl radical scavengers, scorch retarders, nucleating agents, and processing aids.

[0087] In certain embodiments, the hindered amine has the following structure:

[0088] [ka] (In the formula, R1 is selected from the group consisting of hydrogen, methyl, alkyl, alkenyl, linear or branched alkyl or alkenyl, or cyclic, nitrogen-bonded oxygen alkoxyl, and R2 is selected from the group consisting of hydrogen, methyl, alkyl, alkenyl, linear or branched alkyl or alkenyl, or cyclic, and further includes heteroatoms such as Si, S, N, and O).

[0089] In certain embodiments, the hindered amine is selected from bis(2,2,6,6-tetramethyl-4-piperidyl) sebaceate, bis(2,2,6,6-tetramethyl-4-piperidyl) dibutyl ester, 4-acetyloxy-2,2,6,6-tetramethylpiperidine, 2,2,6,6-tetramethylpiperidine, 4-hydroxyl-2,2,6,6-tetramethylpiperidine, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester, bis(2,2,6,6-tetramethyl-1-(methoxyl)-4-piperidinyl) ester, and N,N'-bis(formyl)-N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,6-hexanediamine.

[0090] Optional additives are present in amounts greater than zero, or 0.01% by weight, or 0.02% by weight, or 0.04% by weight, or 0.06% by weight, or from 0.08% by weight to 0.1% by weight, or from 0.1% by weight to 1% by weight, or 2% by weight, or 3% by weight, or 5% by weight, based on the total weight of the composition.

[0091] Sealing film In certain embodiments, the disclosure relates to a encapsulant film comprising a curable composition comprising (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a silane adhesion promoter auxiliary comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent. In some embodiments, the curable composition forms the entirety of the encapsulant film.

[0092] In certain embodiments, the disclosure relates to a encapsulating film comprising a crosslinked polymer composition comprising the reaction product of (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent. In some embodiments, the crosslinked polymer composition forms the entirety of the encapsulating film.

[0093] In certain embodiments, the disclosure relates to a process for forming a encapsulant film comprising a curable composition or a crosslinked polymer composition. In certain embodiments, (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent, and any of any optional additives are premixed and the premix is ​​added to (A) the polyolefin polymer before or during further processing (e.g., compounding, extrusion, molding, etc.) by any method known in the art (e.g., dipping, compounding, etc.). In some embodiments, dry pellets of (A) the polyolefin polymer are dipped in the premix (i.e., a curing package comprising (B) an organic peroxide, (C) a silane adhesion promoter, (D) a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent, and any of any optional additives), and the dipped pellets are then further processed (e.g., compounding, extrusion, molding, etc.). In certain embodiments, the crosslinked polymer composition and encapsulant film of the present disclosure are formed by film extrusion or compression molding.

[0094] In some embodiments, the disclosure relates to a process for forming a sealing film, comprising (a) immersing a polyolefin polymer in a premix to form an immersed polyolefin polymer, wherein the premix comprises an organic peroxide, a silane adhesion promoter, a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and an anti-PID agent. In further embodiments, step (a) is carried out at a temperature of 0°C to 100°C (e.g., 5°C to 75°C, 10°C to 50°C, 15°C to 45°C, 20°C to 40°C, etc.). In further embodiments, step (a) is carried out for a duration (i.e., immersion time) of 0 minutes to 300 minutes (e.g., 0 minutes to 225 minutes, 25 minutes to 200 minutes, 50 minutes to 175 minutes, 60 minutes to 160 minutes, etc.).

[0095] In certain embodiments, (A) the immersed pellets of the polyolefin polymer are converted into a film during further processing (e.g., compounding, extrusion, casting, or molding). Thus, in certain embodiments, the process for forming a encapsulant film further includes (2) curing and further processing the immersed polyolefin polymer to form a encapsulant film. In this regard, the temperature during the further processing of the immersed polyolefin polymer is higher than the Tm of the polymer and at least 20°C lower than the lamination temperature determined by the type of peroxide, ranging from 80°C or 90°C to 100°C or 105°C or 110°C or 115°C or 120°C or 125°C or 130°C or 140°C or 150°C or 160°C or 170°C.

[0096] In further embodiments, it is desirable to avoid or limit curing until other steps, such as lamination of the solar cell and two cover sheets or one cover sheet and one back sheet, for preparing the PV module, as described below. Premature crosslinking and / or premature decomposition of the organic peroxide may result in a encapsulant film with reduced glass adhesion. In other words, the encapsulant film containing the curable composition remains reactive until lamination, at which point crosslinking is completed, and the crosslinked polymer composition of the encapsulant film becomes the reaction product of the polyolefin polymer, the organic peroxide, the silane adhesion promoter, the crosslinking aid containing the monocyclic organosiloxane of formula (I), and the anti-PID agent. Therefore, in further embodiments, the process for forming the encapsulant film includes further processing of the immersed polyolefin polymer to form a curable film. Subsequent steps may include, but are not limited to, curing the curable film to form a encapsulant film, or curing the curable film to form a encapsulant film during the lamination process.

[0097] Therefore, the temperature for further processing the immersed polyolefin polymer may be lower than the decomposition temperature of the organic peroxide. In this regard, in some embodiments, the temperature during further processing of the immersed polyolefin polymer is from 80°C or 90°C to 100°C, 110°C, or 120°C.

[0098] The curing discussed herein may be free radical curing by irradiation of the composition at a curing effective irradiation dose and / or heating of the composition at a curing effective temperature, thereby forming a crosslinking product. The irradiation source may be an electron beam, gamma rays, ultraviolet light, or any combination thereof. In further embodiments, crosslinking of the composition occurs without a platinum-based catalyst.

[0099] The sealing film of this disclosure may have any thickness.

[0100] In the embodiment, the sealing film is a single layer, and this single layer is composed of the present composition. In the embodiment, the sealing film has two or more layers, at least one of which is composed of the present composition.

[0101] Electronic devices The encapsulating films of this disclosure are used to construct electronic device modules. The encapsulating films are used as one or more “skins” of the electronic device. That is, the encapsulating films are applied to one or both sides of the electronic device, for example, as a front encapsulating film or a back encapsulating film, or as both a front encapsulating film and a back encapsulating film, so that, for example, the electronic device is completely sealed within the material.

[0102] In one embodiment, the electronic device module includes (i) at least one electronic device, a plurality of such devices typically arranged in a linear or planar pattern, (ii) at least one cover sheet, and (iii) at least one encapsulant film according to the present disclosure. The encapsulant film is located between the cover sheet and the electronic device, and the encapsulant film exhibits good adhesion to both the electronic device and the cover sheet.

[0103] In one embodiment, an electronic device module includes (i) at least one electronic device, typically a plurality of such devices arranged in a linear or planar pattern, (ii) a front cover sheet, (iii) a front sealing film, (iv) a back sealing film, and (v) a back sheet, wherein at least one of (iii) the front sealing film and (iv) the back sealing film is a sealing film of the present disclosure. The electronic device is sandwiched between the front sealing film and the back sealing film, and two cover sheets or one cover sheet and one back sheet seal the front sealing film / electronic device / back sealing film unit.

[0104] In some embodiments, the cover sheet is made of glass, acrylic resin, polycarbonate, polyester, or a fluorine-containing resin. In further embodiments, the cover sheet is made of glass.

[0105] In some embodiments, the backsheet is a single-layer or multi-layer film composed of glass, metal, or polymer resin. In further embodiments, the backsheet is a multi-layer film composed of a fluoropolymer layer and a polyethylene terephthalate layer.

[0106] In this embodiment, the electronic device is a solar cell or a photovoltaic (PV) battery.

[0107] In this embodiment, the electronic device module is a PV module.

[0108] Figure 1 illustrates an exemplary PV module. The rigid PV module 10 comprises a photovoltaic cell 11 (PV cell 11) surrounded or sealed by a front sealing film 12a and a back sealing film 12b. A glass cover sheet 13 covers the front of the portion of the front sealing film 12a that is positioned on the PV cell 11. A back sheet 14, for example, a second glass cover sheet or polymer substrate, supports the back of the portion of the back sealing film 12b that is positioned on the back of the PV cell 11. The back sheet 14 does not need to be transparent if the surface of the PV cell it faces does not react to sunlight. In this embodiment, the sealing films 12a and 12b completely seal the PV cell 11. In the embodiment shown in Figure 1, the front sealing film 12a is in direct contact with the glass cover sheet 13, and the back sealing film 12b is in direct contact with the back sheet 14. The PV battery 11 is sandwiched between the front sealing film 12a and the back sealing film 12b such that both the front sealing film 12a and the back sealing film 12b are in direct contact with the PV battery 11. The front sealing film 12a and the back sealing film 12b are in direct contact with each other in areas where the PV battery 11 is not present.

[0109] The sealing film of this disclosure may be a front sealing film, a back sealing film, or both a front sealing film and a back sealing film. In one embodiment, the sealing film of this disclosure is a front sealing film. In another embodiment, the sealing film of this disclosure is both a front sealing film and a back sealing film.

[0110] The sealing film of this disclosure may be a single-layer film comprising (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a silane adhesion promoter auxiliary comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent. Alternatively, a co-extruded film comprising at least one layer comprising (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a silane adhesion promoter auxiliary comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent.

[0111] In one embodiment, the sealing film(s) of the Disclosure are applied to an electronic device by one or more lamination techniques. Lamination brings a cover sheet into direct contact with a first outer surface of the sealing film and an electronic device into direct contact with a second outer surface of the sealing film. The cover sheet is in direct contact with the first outer surface of the front sealing film, the back sheet is in direct contact with the second outer surface of the back sealing film, and the electronic device(s) are fixed in direct contact between the second outer surface of the front sealing film and the first outer surface of the back sealing film.

[0112] In the embodiment, the lamination temperature is sufficient to activate the organic peroxide and crosslink the curable composition, namely, the polyolefin polymer, the organic peroxide, the silane adhesion promoter, the crosslinking aid, and the anti-PID agent. During crosslinking, silane bonds chemically bond between two or more of the molecular chains of the polyolefin polymer. The "silane bond" has the structure -Si-O-Si-. Each silane bond can connect two or more, or three or more, molecular chains of the polyolefin polymer. The silane adhesion promoter also interacts with the surface of the cover sheet to increase the adhesion between the sealant film and the cover sheet. After lamination, the composition is the reaction product of the polyolefin polymer, the organic peroxide, the silane adhesion promoter, the crosslinking aid, and the anti-PID agent.

[0113] In the embodiment, the lamination temperature for producing electronic devices ranges from 130°C, 135°C, 140°C, or 145°C to 150°C, 155°C, or 160°C. In the embodiment, the lamination time ranges from 8 minutes, 10 minutes, 12 minutes, or 15 minutes to 18 minutes, 20 minutes, 22 minutes, or 25 minutes.

[0114] definition Any reference to the periodic table refers to the periodic table (1990-1991) published by CRC Press, Inc. References to element groups in this table refer to a new notation for numbering groups.

[0115] For the purposes of U.S. patent practice, the content of any referenced patent, patent application, or publication is incorporated herein by reference in its entirety, particularly with respect to the disclosure of definitions and general knowledge in the art (to the extent that it does not contradict any definitions specifically provided herein) (or its equivalent U.S. version is incorporated by reference in the same way).

[0116] Numerical ranges disclosed herein include all values ​​from the lower limit to the upper limit (including the lower and upper limits). In the case of ranges containing explicit values ​​(e.g., 1 or 2, or 3 to 5, or 6 or 7), any subrange between any two explicit values ​​(e.g., 1 to 2, 2 to 6, 5 to 7, 3 to 7, 5 to 6, etc.) is included.

[0117] Unless otherwise stated, implied by the context, or customary in the art, all parts and percentages are based on weight, and all test methods are current as of the filing date of this disclosure.

[0118] Unless otherwise specified, all test methods are current as of the filing date of this disclosure.

[0119] The terms “blend,” “polymer blend,” and similar terms mean a composition of two or more polymers. Such a blend may or may not be miscible. Such a blend may or may not be phase-separated. Such a blend may or may not contain one or more domain configurations, as determined by transmission electron spectroscopy, light scattering, X-ray scattering, and any other method used to measure and / or identify domain configurations. A blend is not a laminate, but one or more layers of a laminate may contain a blend.

[0120] As used herein, “composition” includes mixtures of materials containing the composition, as well as reaction products and decomposition products formed from the materials of the composition.

[0121] The terms “comprising,” “including,” and “having,” and their derivatives, are not intended to exclude the presence of any additional components, processes, or procedures, whether or not they are specifically disclosed. To avoid any doubt, all compositions claimed through the use of the term “comprising” may, unless otherwise specified, include any additional additives, adjuvants, or compounds, whether polymeric or otherwise. In contrast, the term “consisting essentially of” excludes any other components, processes, or procedures from the scope of any subsequent description, except those not essential to operability. The term “consisting of” excludes any components, processes, or procedures not specifically enumerated. The term “or” refers to the enumerated members individually and in any combination, unless otherwise specified. The use of the singular includes the use of the plural, and vice versa.

[0122] The term "anti-PID" refers to a composition that resists voltage-induced power drop, or PID.

[0123] "Direct contact" refers to a layer configuration in which the first layer is directly adjacent to the second layer, and there are no intervening layers or structures between the first and second layers.

[0124] The term "auxiliary agent" refers to a compound that promotes crosslinking, i.e., a curing auxiliary agent. The terms "coagent," "co-agent," "crosslinking coagent," and "crosslinking co-agent" are used interchangeably herein. "Conventional auxiliary agents" are acyclic or cyclic compounds that promote crosslinking and contain carbon atoms in their respective skeletons or ring substructures. Thus, the skeletons or ring substructures of conventional auxiliary agents are carbon-based (carbon-based substructures). In contrast, silicon-based auxiliary agents refer to acyclic or cyclic compounds that promote crosslinking and contain silicon atoms in their respective skeletons or ring substructures. The monocyclic organosiloxane of formula (I) is a cyclic silicon-based auxiliary agent. The use of conventional auxiliary agents in POE-based compositions is representative of the latest technology.

[0125] The terms "curing" and "crosslinking" are used interchangeably herein and mean the formation of a crosslinked product (network polymer) without ring-opening polymerization.

[0126] As used herein, “polymer” refers to a polymer compound prepared by polymerizing the same or different types of monomers. Thus, the general term polymer encompasses the terms homopolymer (used to refer to a polymer prepared from a single type of monomer, with the understanding that trace amounts of impurities may be incorporated into the polymer structure) and interpolymer as defined herein. Trace amounts of impurities, such as catalyst residues, may be incorporated into and / or within the polymer.

[0127] As used herein, “interpolymer” refers to a polymer prepared by the polymerization of at least two different types of monomers. Thus, the general term interpolymer includes copolymers (used to refer to polymers prepared from two different types of monomers) and polymers prepared from three or more different types of monomers.

[0128] The terms "propylene-based," "propylene-based polymer," "polypropylene," and similar terms refer to polymers containing 50% by weight (wt%) to 100% by weight of polymerizable propylene monomer (based on the total amount of polymerizable monomers), and optionally, at least one comonomer. Such terms include propylene homopolymers and propylene interpolymers (meaning units derived from propylene and one or more comonomers, such as propylene / alpha-olefin interpolymers).

[0129] The terms "ethylene-based," "ethylene-based polymer," "polyethylene," and similar terms refer to polymers containing 50% to 100% by weight of polymerizable ethylene monomers (based on the total amount of polymerizable monomers), and optionally containing at least one comonomer. Such terms include ethylene homopolymers and ethylene interpolymers (meaning units derived from ethylene and one or more comonomers, such as ethylene / alpha-olefin interpolymers).

[0130] As used herein, "alpha-olefin" refers to a hydrocarbon molecule having ethylene unsaturation at the primary (alpha) position. For example, as used herein, "(C3~C 20 Alpha-olefins are hydrocarbon molecules comprising (i) an ethylene unsaturated atom located between the first and second carbon atoms, and (ii) at least three carbon atoms out of 3 to 20 carbon atoms. For example, (C3-C) used herein. 20Alpha-olefins are formed from H2C=C(H)-R (where R is a linear chain (C1~C)). 18 (This refers to an alkyl group.) (C1~C 18 Alkyl groups are monovalent, unsubstituted saturated hydrocarbons having 1 to 18 carbon atoms. Non-limiting examples of R include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, and octadecyl. (C3-C 20 Non-limiting examples of alpha-olefins include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-dodecene, and mixtures of two or more of these monomers. (C3-C 20 Alpha-olefins may have cyclic structures such as cyclohexane or cyclopentane, resulting in alpha-olefins such as 3-cyclohexyl-1-propene (allylcyclohexane) and vinylcyclohexane. (C3-C 20 Alpha-olefins can be used as comonomers with ethylene monomers.

[0131] The term "ethylene-containing polymer" refers to a polymer that contains repeating units derived from H2C=CH2.

[0132] "Polyolefin elastomer" or "POE" refers to an elastomer polymer containing 50% by weight or more of polymerized alpha-olefin monomers (including ethylene). "Polyolefin elastomer" includes, but is not limited to, the ethylene-based and propylene-based polymers described herein. As used herein, the term "polyolefin elastomer" excludes ethylene vinyl acetate (EVA) copolymers.

[0133] "Nonpolar polymers" and similar terms refer to polymers that do not have permanent dipoles. That is, polymers have no positive and negative ends and do not contain heteroatoms or functional groups. "Functional group" and similar terms refer to a part or group of atoms that is involved in giving a particular compound its characteristic reaction. Non-limiting examples of functional groups include heteroatom-containing parts, oxygen-containing parts (e.g., alcohols, aldehydes, esters, ethers, ketones, and peroxide groups), and nitrogen-containing parts (e.g., amides, amines, azos, imides, imines, nitrates, nitriles, and nitrite bases). A "heteroatom" is an atom other than carbon or hydrogen.

[0134] The terms “photovoltaic cell,” “PV cell,” and similar terms refer to a structure comprising one or more photovoltaic materials of any type, inorganic or organic, known in the art. For example, commonly used photovoltaic materials include, but are not limited to, one or more known photovoltaic materials, including crystalline silicon, polycrystalline silicon, amorphous silicon, copper indium gallium (di)selenide (CIGS), copper indium selenide (CIS), cadmium telluride, gallium arsenide, dye-sensitized materials, and organic solar cell materials. As shown in Figure 1, PV cells are typically used in a laminated structure and have at least one photoreactive surface that converts incident light into an electric current. Photovoltaic cells are well known to those skilled in the art and are generally packaged in a photovoltaic module that protects the cell and enables use in a variety of application environments, typically outdoor applications. PV batteries can be inherently flexible or rigid and include photovoltaic effect materials and any protective coating surface materials applied to their production, as well as appropriate wiring and electronic drive circuits.

[0135] The terms "photovoltaic module," "PV module," and similar terms refer to a structure that includes a PV cell. A PV module may also include a cover sheet, a front sealing film, a back sealing film, and a back sheet, with the PV cell sandwiched between the front sealing film and the back sealing film.

[0136] "Room temperature" refers to a temperature range of approximately 20 to 25°C.

[0137] The terms “further processing,” “further processing,” and similar terms refer to the manufacturing process steps of polyolefins, including but not limited to compounding, blending, melt blending, extrusion (e.g., film extrusion), kneading, absorption, injection, and molding (e.g., injection molding, compression molding, blow molding, etc.). Non-limiting examples of suitable compounding equipment include internal batch mixers (e.g., Banbury and Bolling internal mixers) and continuous single-screw or twin-screw mixers (e.g., Farrell continuous mixers, Brabender single-screw mixers, Werner and Pfleiderer twin-screw mixers, and Buss continuous kneading extruders). The type of mixer used and the operating conditions of the mixer may affect properties of the composition, such as viscosity, volume resistivity, and extruded surface smoothness.

[0138] Volume resistance is defined as the ratio of the DC voltage to the current passing through two electrodes (of a specific configuration) in contact with the opposite side of the material of the object under test. Volume resistance is reported in ohms.

[0139] Volume resistivity is defined as the ratio of the DC voltage drop per unit thickness to the current per unit area passing through a material. Volume resistivity indicates how easily a material conducts electricity through its bulk. Volume resistivity is expressed in ohms-centimeters (Ω-cm).

[0140] Next, some embodiments of the present disclosure will be described in detail in the following embodiments. [Examples]

[0141] Test method Density is measured according to ASTM D792. The result is expressed in grams per cubic centimeter (g) (g / cc or g / cm³). 3 ) is recorded.

[0142] The glass transition temperature (Tg) is measured according to ASTM D7028.

[0143] The melt index (MI) is measured at 190°C and 2.16 kg according to ASTM D1238 and reported as grams per 10 minutes (g / 10 min).

[0144] The melting point is measured according to ASTM D3418.

[0145] Module-level PID testing was performed according to the procedure described in IEC 62804-1.

[0146] The initial output of the module samples was recorded using a pulsed solar simulator (Burger PS8 / PSS8) according to the procedure described in IEC 60904. PID stress treatment was performed in an environmental chamber under 85°C / 85%RH conditions. The module samples were connected to a power supply to generate a typical negative bias voltage of 1500V. A standard test takes 96 hours. After stress treatment, all module samples were retested for output. The results were compared to the initial measurements to further calculate power losses.

[0147] The IEC standard for power loss after 96 hours of PID testing is less than 5% for both the front and back surfaces of the PV module.

[0148] material The following materials are used to prepare the examples of this disclosure.

[0149] POE: Ethylene / octene copolymer available from The Dow Chemical Company, with a density of 0.873 g / cc (ASTM D782) and a melt index of 14.0 g / 10 min (ASTM D1238, 190°C, 2.16 kg). Volume resistivity (VR) was measured.

[0150] TBEC: tert-butylperoxy-2-ethylhexyl carbonate, an organic peroxide available from J&K Scientific Ltd.

[0151] TAEC: tert-amylperoxy-2-ethylhexyl carbonate, Lanzhou Additives.

[0152] TAIC: Triallyl isocyanurate, available from Farida Chemicals Co., Ltd., has the following structure.

[0153] [ka]

[0154] TAC: Triallylcyanurate, available from Sinopharm.

[0155] Vinyl-D4:2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane is available from Alfa Aser and is an excipient having the following structure.

[0156] [ka]

[0157] VMMS: 3-(trimethoxysilyl)propyl methacrylate, a silane coupling agent available from Dow Chemical Company.

[0158] VTMS: Vinyltrimethoxysilane, a silane coupling agent available from Dow Chemical Company.

[0159] ATM: 3-(trimethoxysilyl)propyl acrylate, a silane coupling agent available from Dow Chemical Company.

[0160] TMPTA: Trimethylolpropane triacrylate, commercially available from Farida.

[0161] TMPTMA: Trimethylolpropane trimethyl acrylate, commercially available from Farida.

[0162] AMSD: Alpha-methylstyrene dimer (2,4-diphenyl-4-methyl-1-pentene), commercially available from Wuxi Zhiyuan Chemical Company.

[0163] Ethyl sorbate, commercially available from Sinopharm.

[0164] Butyl acrylate ("butyl acrylate, BA") is commercially available from Sinopharm.

[0165] Tinuvin 770 (T770), bis(2,2,6,6,-tetramethyl-4-piperidyl) sebacate, is commercially available from BASF.

[0166] The P-type bifacial PERC solar cell was a commercially available product.

[0167] Sample preparation Immersion: The compositions were prepared by first pre-mixing polymer pellets with curing additives (peroxides, crosslinking aids, and silane coupling agents) in fluoride HDPE bottles according to the formulations in Tables 1 and 2 below. The immersion process was carried out by shaking and absorbing the mixture at 50°C for 5 hours until no liquid residue was visible adhering to the bottles.

[0168] Compression molding: After immersion, the immersed pellets were compression molded using an embossed mold to prepare a 0.5 mm thick film. Compression molding was performed using a hydraulic press. The composition was preheated at 95°C for 3.5 minutes without applying pressure, followed by degassing. Then, the composition was pressed at 95°C for 2.5 minutes at 10 MPa. Finally, the temperature was cooled to room temperature within 3.5 minutes under a pressure of 10 MPa.

[0169] Lamination: Glass sheets were cut into 4 x 6 square inch test specimens, washed with water, and dried before use. Then, P-type double-sided PERC cells, two encapsulant films, and two glass test specimens were stacked together and laminated using a PENERGY L036 laminator. The specimens were laminated under the following conditions: 150°C for 20 minutes (4 minutes of vacuum process and 16 minutes of pressing to crosslink the encapsulant films). The laminated specimens were used for glass adhesion strength testing. Two identical single-cell module specimens were prepared for PID testing and the average value was obtained.

[0170] The PV glass and P-type PERC bifacial batteries used in these examples were obtained from the market.

[0171] compound

[0172] [Table 1]

[0173] [Table 2]

[0174] result

[0175] [Table 3]

[0176] As shown in Table 3, the comparison between CE-1 and IE-1 suggests that TMPTA significantly improved anti-PID performance, with power loss after 96 hours of PID testing decreasing from approximately 9% on the back side to less than 0.5% on the front side (from 3.2%).

[0177] Comparisons of CE-2 and CE-3 with IE-2 to IE-5 also suggest a significant improvement in anti-PID performance due to the presence of TMPTA. However, CE-4 suggests that, compared to VMMS, TMPTA cannot reduce power loss to less than 5% at low loads, e.g., VMMS / TMPTA = 10. Furthermore, IE-8 suggests that TMPTMA can also improve anti-PID performance compared to CE-2. CE-5 suggests that no anti-PID performance is demonstrated by AMSD.

[0178] [Table 4]

[0179] As shown in Table 4, ethyl sorbate also significantly reduces PID loss (e.g., CE-6 / CE-7 vs. IE-9). Furthermore, CE-9 in Table 4 suggests that VD4 itself does not cause PID loss in the absence of a silane adhesion promoter.

[0180] Finally, IE-15 and IE-16 suggest that very low PID loss was achieved with TMPTA in the presence of conventional adjuvants such as TAIC and TAC.

[0181] In summary, solvent and acrylate compounds reduce power loss after PID testing.

Claims

1. A curable composition for forming a sealing film, A) Polyolefin polymer, B) organic peroxide, C) Silane adhesion promoter, and D) Crosslinking aid formula (I): [R １ , R ２ SiO ２／２ ] ｎ (I) (subscript in the formula) The character n is an integer greater than or equal to 3, and each R １ (C ２ ~C ２０ ) Alkenil and Monocyclic organosiloxanes (combinations thereof), and E) At least one equation (II): 【Chemistry 1】 An anti-PID agent comprising the structure (wherein R1, R2, and R3 are each independently H, methyl, alkyl, alkenyl, linear or branched alkyl or alkenyl, or cyclic, or heteroalkyl, or heteroalkenyl), A curable composition containing the following:

2. The polyolefin polymer has a volume resistivity (VR) exceeding 1.0×10 １４ Ω·cm at 23°C, a density of 0.85 to 0.92 g / cm ３ and further contains an ethylene / α-olefin copolymer having an MI of 1 to 50 g / 10 min at 190°C. The curable composition according to claim 1.

3. The curable composition according to claim 1, wherein the peroxide is selected from the group consisting of isopropyl percarbonate, t-butylperoxy-2-ethylhexyl carbonate, tert-amylperoxy-2-ethylhexyl carbonate, tert-butylperoxyisopropyl carbonate, tert-butylperoxy-3,5,5-trimethylhexanenoate, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-di(tert-butylperoxy)cyclohexane, 1,1-di(tert-amylperoxy)cyclohexane, dicumyl peroxide, di-tert-amylperoxide ("DTAP"), bis(alpha-t-butylperoxyisopropyl)benzene, and combinations thereof.

4. The curable composition according to claim 1, wherein the crosslinking aid is selected from the group consisting of 2,4,6-trimethyl-2,4,6-trivinyl-cyclotrisiloxane, 2,4,6,8-tetramethyl-2,4,6,8-tetravinyl-cyclotetrasiloxane, 2,4,6,8,10-pentavinyl-2,4,6,8,10-pentamethylcyclopentasiloxane, 1,3,5,7,9-pentamethacrylate-1,3,5,7,9-pentamethylcyclopentasiloxane, or a combination thereof.

5. The aforementioned anti-PID agent is trimethylolethane trimethacrylate, trimethylolethane triacrylate, trimethylolpropane triacrylate; trimethylolpropane trimethyl acrylate; ethylene glycol dimethacrylate; ethylene glycol diacrylate; dimethylene glycol diacrylate; triethylene glycol diacrylate; tetra(ethylene glycol) diacrylate; 1,6-hexanediol diacrylate; 1,6-hexanediol dimethacrylate, neopentanediol dimethacrylate; neopentanediol diacrylate; octadecyl acrylate; butyl acrylate; ethyl acrylate; methyl acrylate; hydroxyl ethyl acrylate; methyl methacrylate; butyl methacrylate; ethyl methacrylate; glycidyl methacrylate; hydroxy Ethyl methacrylate; 2-ethylhexyl acrylate; 2-ethylhexyl methacrylate; dodecyl acrylate; isodecyl acrylate; di(propylene glycol) diacrylate; tri(propylene glycol) diacrylate; lauryl acrylate; alkoxylated lauryl acrylate; cyclohexanedimethanol diacrylate; tridecyl methacrylate; tridecyl acrylate; pentaerythritol triacrylate; pentaerythritol tetraacrylate; dipentaerythritol hexaacrylate; tris(2-hydroxyethyl) isocyanurate triacrylate; dipentaerythritol pentaacrylate; propoxylated (3) glyceryl triacrylate; zinc diacrylate; zinc dimethacrylate; sorbic acid esters such as ethyl sorbate; formula (I): [R １ , R ２ SiO ２／２ ] ｎ (I) [In the formula, the subscript n is an integer greater than or equal to 3, and each R １ H ２ C = C(R １ａ )-C(=O)-O-(CH ２ ) ｍ - (wherein, R １ａ (where is H or methyl, and the subscript m is an integer from 1 to 4), and each R ２ H, (C １ ~C20) alkyl, phenyl, or R １ A curable composition according to claim 1, selected from the group consisting of monocyclic organosiloxanes and combinations thereof.

6. The composition is A) 85% to 99.5% by weight of the polyolefin polymer, B) 0.01% to 2% by weight of the organic peroxide, C) 0.01% to 1% by weight of the silane adhesion promoter, D) 0.01% to 5% by weight of the silane crosslinking agent, E) 0.001% to 1% by weight of the anti-PID agent, The composition according to claim 1, further comprising:

7. The anti-PID agent of formula II contained in the anti-PID agent is further described by any one of (i) to (ii), i.e., (i) R1 is H, methyl, ethyl, propyl, or butyl, and (ii) R3 is H, methyl, ethyl, propyl, butyl, vinyl, or substituted vinyl, and R2 is of the following formula (III): 【Chemistry 2】 [In the formula, R1 and R3 are each independently H, methyl, alkyl, alkenyl, linear or branched alkyl or alkenyl, or cyclic, or heteroalkyl, or heteroalkenyl, R' is selected from C1 to C30 alkylenes, and Y is CR ４－ｎ (in the formula, n=1 to 4), OR ２－ｎ (in the formula, n=1 to 2), NR ３－ｎ (in the formula, n=1 to 3), SR ２－ｎ (in the formula, n=1-2), PR ３－ｎ (in the formula, n=1 to 3), PR ５－ｎ (in the formula, n=1 to 5), SiR ４－ｎ The composition according to claim 1, further comprising an alkyl acrylate or alkyl multiacrylate such as (wherein n = 1 to 4), selected from the group consisting of a bifunctional C-C core, a phenyl core, an ester-substituted phenyl core, an amide-substituted phenyl core, a tris-isocyanurate core, a melamine core, or a combination thereof.

8. The composition according to claim 1, wherein the anti-PID agent is selected from the group consisting of methyl acrylate, ethyl acrylate, butyl acrylate, cyclopropyl acrylate, ethyl methacrylate, methyl methacrylate, bisphenol-A-glycidyl methacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, trimethylolethane trimethacrylate, trimethylolethane triacrylate, trimethylolpropane trimethyl acrylate, trimethylolpropane triacrylate, glycerol triacrylate, pentaerythrityl triacrylate, and combinations thereof.

9. A sealing film, A) Polyolefin polymer and B) Organic peroxides and, C) Silane adhesion promoter, D) Crosslinking aid formula (I): [R １ , R ２ SiO ２／２ ] ｎ (I) (wherein the formula, the subscript n is an integer greater than or equal to 3, and each R １ (C ２ ~C ２０ Monocyclic organosiloxanes (which are alkenyls and combinations thereof), E) At least one equation (II): 【Transformation 3】 An anti-PID agent comprising the structure (wherein R1, R2, and R3 are each independently H, methyl, alkyl, alkenyl, linear or branched alkyl or alkenyl, or cyclic, or heteroalkyl, or heteroalkenyl), A sealing film comprising a crosslinked polymer composition containing the reaction product of the following.

10. A) 85% to 99.5% by weight of the polyolefin polymer, B) 0.01% to 2% by weight of the organic peroxide, C) 0.01% to 1% by weight of the silane adhesion promoter, D) 0.01% to 5% by weight of the crosslinking aid, E) 0.001% to 1% by weight of the anti-PID agent, The sealing film according to claim 9, comprising a crosslinked polymer composition containing the reaction product.

11. The sealing film according to claim 9, wherein the polyolefin polymer is an ethylene / alphaolefin copolymer having a density of 0.850 g / cc to 0.890 g / cc (ASTM D792) and a melt index of 1.0 g / 10 min to 50.0 g / 10 min (ASTM D1238, 190°C / 2.16 kg).

12. The sealing film according to claim 9, wherein the anti-PID agent is selected from the group consisting of methyl acrylate, ethyl acrylate, butyl acrylate, cyclopropyl acrylate, ethyl methacrylate, methyl methacrylate, bisphenol-A-glycidyl methacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, trimethylolethane trimethacrylate, trimethylolethane triacrylate, trimethylolpropane trimethyl acrylate, trimethylolpropane triacrylate, glycerol triacrylate, pentaerythrityl triacrylate, and combinations thereof.

13. A multilayer sealing film comprising at least one layer composed of the composition described in claims 1 to 8.

14. The sealing film according to any one of claims 9 to 12, wherein the power loss after PID on the front and back surfaces is less than 5%.

15. An electronic device module, A) Electronic devices and, B) Cover sheet and, C) A sealing film according to any one of claims 9 to 12, An electronic device module comprising the above features.

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