Chemical mechanical polishing pad conditioner with multiple discs

Abstract

Embodiments of the present disclosure provide a pad conditioner having multiple discs for chemical mechanical polishing. The pad conditioner includes a bearing ring connected to the bottom of a shaft, an outer disc assembly connected to the bottom of the shaft and including an outer disc deflector and a plurality of outer discs disposed on the bottom surface of the outer discs, and an inner disc assembly. Alternatively, the outer disc assembly includes a plurality of outer disc holders, an outer disc connector connecting the plurality of outer disc holders, and a plurality of outer discs disposed on the bottom surface of the outer disc holders. The pad conditioner includes the outer disc assembly, the inner disc assembly, and the deflector connected to the shaft. The pad conditioner may include a spherical bearing assembly connected to the bottom of the shaft.

Description

Technical Field

[0001]

[0001] Embodiments of the present invention generally relate to a polishing pad conditioner used for chemical mechanical polishing.

Background Art

[0002]

[0002] Integrated circuits are generally formed on a substrate, particularly a silicon wafer, by sequentially depositing conductive, semiconductive, or insulating layers. After each layer is deposited, the layer is etched to form features of the circuit configuration. As a series of layers are sequentially deposited and etched, the outer or top surface of the substrate, i.e., the exposed surface of the substrate, gradually becomes non-planar. This non-planar surface poses a problem in subsequent photolithography steps of the integrated circuit manufacturing process. Therefore, it is necessary to periodically planarize the substrate surface.

[0003]

[0003] Chemical mechanical polishing (CMP) is recognized as one method of planarization. In this planarization method, usually, the substrate needs to be attached to a carrier or a polishing head. The exposed surface of the substrate is pressed against a rotating polishing pad. The polishing pad may be a durable roughened "standard" pad with a rough surface, or a fixed polishing pad in which polishing particles are held in a containment medium. The carrier head applies a controllable load, i.e., pressure, to the substrate and presses the substrate against the polishing pad. A polishing slurry containing at least one chemical reactant and polishing particles is supplied to the polishing pad when using a standard pad.

[0004]

[0004] In a normal CMP process, the substrate is pressed against a rotating polishing pad through which the polishing slurry flows. The material formed along the substrate is removed through a combination of the chemical interaction of the polishing slurry and the mechanical interaction with the polishing pad. As the complexity of the process increases and the non-uniformity of material formation on the substrate increases, a standard chemical mechanical polishing system may not be able to properly respond to the material structure being polished.

[0005]

[0005] Therefore, there is a need for improved systems and methods that can be used to improve systems for improving polishing and removal accuracy. [Overview of the Initiative]

[0006]

[0006] Embodiments described herein generally relate to systems and methods used for conditioning pads during semiconductor processing. More specifically, embodiments herein provide a pad conditioner having a plurality of diamond discs for chemical mechanical polishing.

[0007]

[0007] In this embodiment, a pad conditioner is provided. The pad conditioner includes a shaft, a bearing ring connected to the lower part of the shaft and in contact with the rolling elements, an outer disc assembly connected to the lower part of the shaft and having an outer disc body, an outer disc deflection portion connected to the outer disc body and the lower part of the shaft, and a plurality of outer discs disposed on the bottom surface of the outer disc body, and an inner disc assembly connected to the lower part of the shaft concentrically with the outer disc assembly. The inner disc assembly includes an inner disc body, an inner disc deflection portion connected to the inner disc body, and a plurality of inner discs disposed on the bottom surface of the inner disc body.

[0008]

[0008] In another embodiment, a pad conditioner is provided. The pad conditioner includes a shaft, a bearing ring connected to the lower part of the shaft and in contact with the rolling elements, an outer disc assembly connected to the lower part of the shaft and having a plurality of outer disc holders, an outer disc connector connecting the plurality of outer disc holders, and a plurality of outer discs disposed on the bottom surface of the outer disc holders, and an inner disc assembly connected to the lower part concentrically with the outer disc assembly. The inner disc assembly includes a plurality of inner projections and a plurality of inner discs disposed on the bottom surface of the inner projections, and the pad conditioner further includes a flexure connected to the outer disc assembly, the inner disc assembly, and the shaft.

[0009]

[0009] In yet another embodiment, a pad conditioner is provided. The pad conditioner includes a shaft, a spherical bearing assembly connected to the lower part of the shaft, an outer disc assembly connected to the lower part of the shaft and having an outer disc body and a plurality of outer discs disposed on the bottom surface of the outer disc body, and an inner disc assembly connected concentrically to the lower part of the outer disc assembly. The inner disc assembly includes an inner disc body and a plurality of inner discs disposed on the bottom surface of the inner disc body, and the pad conditioner further includes a flexible portion connected to the outer disc assembly and the shaft.

[0010]

[0010] In order to understand the features of the present disclosure described above in detail, the present disclosure summarized above will be described more specifically with reference to embodiments illustrated in part in the accompanying drawings. However, it should be noted that the accompanying drawings are merely illustrative embodiments and should not be considered to limit the scope of the present disclosure, and that the present disclosure may also permit other equally valid embodiments. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic cross-sectional view showing an exemplary processing system according to several embodiments. [Figure 2A] These are schematic isometric views of pad conditioners according to several embodiments. [Figure 2B] Figure 2A is a schematic bottom view of a pad conditioner according to several embodiments. [Figure 2C] This is a schematic cross-sectional view showing a pad conditioner of Figure 2A according to several embodiments. [Figure 3A] These are schematic cross-sectional views of a pad conditioner according to several embodiments. [Figure 3B] Figure 3A is a schematic bottom view of a pad conditioner according to several embodiments. [Figure 4A] These are schematic cross-sectional views of a pad conditioner according to several embodiments. [Figure 4B] Figure 4A is a schematic bottom view of a pad conditioner according to several embodiments. [Figure 5A] These are schematic cross-sectional views of a pad conditioner according to several embodiments. [Figure 5B] Figure 5A is a schematic bottom view of a pad conditioner according to several embodiments. [Figure 6A] These are schematic cross-sectional views of a pad conditioner according to several embodiments. [Figure 6B] Figure 6A is a schematic top view of the first disk assembly of a pad conditioner shown in several embodiments. [Figure 6C] Figure 6A is a schematic top view of the second disk assembly of a pad conditioner shown in several embodiments. [Figure 7A] These are schematic cross-sectional views of a pad conditioner according to several embodiments. [Figure 7B] Figure 7A is a schematic bottom view of a pad conditioner according to several embodiments. [Figure 7C] Figure 7A is a schematic bottom view of the deflection portion of a pad conditioner according to several embodiments. [Figure 8A] These are schematic cross-sectional views of a pad conditioner according to several embodiments. [Figure 8B] Figure 8A is a schematic bottom view of a pad conditioner according to several embodiments. [Figure 8C] Figure 8A is a schematic cross-sectional bottom view of a pad conditioner according to several embodiments. [Figure 9A] These are schematic cross-sectional views of a pad conditioner according to several embodiments. [Figure 9B] Figure 9A is a schematic cross-sectional view of a spherical bearing assembly of a pad conditioner according to several embodiments. [Figure 9C] Figure 9B is a schematic cross-sectional view of the cam assembly of the spherical bearing assembly. [Modes for carrying out the invention]

[0012]

[0033] For ease of understanding, wherever possible, the same reference numbers are used to denote the same elements common to the drawings. It is contemplated that elements and features of one embodiment may be beneficially incorporated into other embodiments without further elaboration.

[0013]

[0034] The embodiments described herein generally relate to processing chambers, and more particularly, to systems and methods for conditioning a polishing pad during chemical mechanical polishing (CMP). More particularly, the embodiments provided herein include improved systems and methods for adjusting the pressure applied from a polishing pad conditioning assembly to a polishing pad based on the surface of the polishing pad.

[0014]

[0035] A polishing pad conditioner may include a plurality of small diamond disks to improve the uniformity of the polishing pad. Each diamond disk of the polishing pad conditioner has a gimbal for improving the compatibility between the individual small diamond disk and the surface of the polishing pad. However, due to the complexity of each individual gimbal, the reliability of the diamond disk, and thus the polishing pad conditioner, is reduced. Accordingly, the present disclosure provides a technical solution to the reliability problem of the individual gimbals on the diamond disk by providing a polishing pad conditioner comprising a concentric disk assembly and a gimbal assembly configured to adjust the concentric disk assembly.

[0015]

[0036] Specifically, the description includes a polishing pad conditioner comprising at least two concentric disk assemblies, for example, one inner disk assembly and one outer disk assembly, and at least one flexure. Each disk assembly may include a flexure, a body, and multiple diamond disks. Alternatively, the polishing pad conditioner may have only one flexure connected to the first disk assembly and the outer disk assembly. Each disk assembly may have any desired shape. For example, the inner disk assembly may have a substantially circular shape, and the outer disk shape may have a substantially toroidal or “donut” shape. An additional concentric disk assembly may be located between the inner and outer disk assemblies. Alternatively, the first and second disk assemblies may have a protruding shape such that the body has a projection extending radially from a central portion. For example, the first and second disk assemblies may each have three projections. In this configuration, the first disk assembly is placed on top of the second disk assembly such that the protrusions of the first disk assembly are equidistant radially from the protrusions of the second disk assembly.

[0016]

[0037] The flexure allows the concentric disc assembly to evenly distribute pressure on the diamond discs on each assembly by adjusting the orientation of the diamond discs and the disc assembly using the surface of the polishing pad. This improves the fit between the individual small diamond discs on each disc assembly and the surface of the polishing pad, thereby improving pad conditioning efficiency. It also reduces the extrusion conditioning time of the polishing pads, improving throughput and process stability.

[0017]

[0038] Figure 1 is a schematic cross-sectional view showing an exemplary polishing system 100 according to several embodiments of the present technology. The polishing system 100 includes a platen assembly 102 including a lower platen 104 and an upper platen 106. The lower platen 104 may define an internal region or cavity through which connections may be made, which may include endpoint detection equipment or other sensors or devices, such as eddy current sensors, optical sensors, or other components for monitoring the polishing process or components. For example, a fluid coupling may be formed by a line extending through the lower platen 104 and accessing the upper platen 106 through the back side of the upper platen, as will be further described below. The platen assembly 102 may include a polishing pad 110 mounted on a first surface of the upper platen 106. A substrate carrier 108, or carrier head, may be positioned above the polishing pad 110 and may face the polishing pad 110. The platen assembly 102 may be rotatable about axis A, and the substrate carrier 108 may be rotatable about axis B. The substrate carrier 108 may also be configured to reciprocate sweep along the platen assembly 102 from the inner radius to the outer radius, thereby partially reducing uneven wear on the surface of the polishing pad 110. The polishing system 100 may also include a fluid supply arm 118 positioned above the polishing pad 110 and used to supply polishing fluid, such as polishing slurry, onto the polishing pad 110. Furthermore, a pad conditioning assembly 120 may be positioned above the polishing pad 110 and may face the polishing pad 110.

[0018]

[0039] In some embodiments of the chemical mechanical polishing process, the rotation or sweeping of the substrate carrier 108 can apply a downforce to the substrate 112, indicated by a dotted line, which may be placed within or coupled to the substrate carrier 108. The applied downforce can cause the material surface of the substrate 112 to be pushed down relative to the polishing pad 110 as the polishing pad 110 rotates around axis A of the platen assembly 102. The interaction of the substrate 112 with respect to the polishing pad 110 can occur in the presence of one or more polishing fluids supplied by the fluid supply arm 118. Typical polishing fluids may include a slurry formed from an aqueous solution in which polishing particles can be suspended. Often, the polishing fluids may contain other chemically active components, such as pH adjusters and oxidizing agents, which can enable chemical mechanical polishing of the material surface of the substrate 112.

[0019]

[0040] The pad conditioning assembly 120 can be operated to bring the fixed polishing conditioning disc 122 into contact with the surface of the polishing pad 110, which can be rotated as described above. The conditioning disc can be operated on the pad before, after, or during polishing of the substrate 112. The polishing pad 110 can be maintained in a desired state by conditioning it using the conditioning disc 122 to polish, regenerate, and remove polishing by-products and other debris from the polishing surface of the polishing pad 110.

[0020]

[0041] The pad conditioning assembly 120 may include multiple small diamond discs, each attached to a concentric disc holder assembly that includes a flex portion, to improve pad conditioning efficiency, as shown in Figures 2A and 2B.

[0021]

[0042] Figure 2A is a schematic isometric view of a pad conditioner 200 (e.g., a pad conditioning assembly 120) according to an embodiment, and Figure 2B is a schematic bottom view of the pad conditioner 200 according to an embodiment. The pad conditioner 200 includes an outer disc assembly 210, an inner disc assembly 220, a shaft 202 along an axis 204, and a gimbal assembly 206 attached to the shaft 202. The outer disc assembly 210 and the inner disc assembly 220 are concentrically aligned along the axis 204. The outer disc assembly 210 includes an outer opening 216 that penetrates the top surface 218. The outer opening 216 allows slurry to enter and pass through the pad conditioner 200 during the polishing process. The outer disc assembly 210 includes a bottom surface 212 having a toroidal or “donut” shape and a plurality of outer discs 214 disposed thereon. The inner disc assembly 220 includes a bottom surface 222 having a circular shape and having a plurality of inner discs 224 positioned thereon. The bottom surface 222 also includes an inner opening 226 positioned through it. The inner opening 226, like the outer opening 216, allows the abrasive slurry to pass through the pad conditioner 200.

[0022]

[0043] Figure 2C is a schematic cross-sectional view showing the pad conditioner 200. As shown in Figure 2C, the pad conditioner 200 is attached to the arm 208a of the polishing system 100 (Figure 1) by inserting the proximal end of the shaft 202 into the arm 208a and securing it with a shaft clamp 208b which is tightened with a screw 208c. The distal end of the shaft 202 is attached to the gimbal assembly 206. The gimbal assembly 206 includes an upper part 230 and a lower part 240. The upper part 230 includes a concentric flex portion 232. The concentric flex portion 232 allows the gimbal assembly 206 to flex around the shaft 202. The lower part 240 is connected to a bearing ring 242 which contacts the rolling element 244 in the circumferential direction. The shaft 202 is connected to the rolling element 244. For example, the shaft 202 can be connected to the outer surface of the rolling element 244, or the shaft 202 can be inserted into the rolling element 244 as shown in the figure, or a combination of these. The rolling element 244 and the bearing ring 242 interact such that the bearing ring 242 can rotate around the rolling element 244. The rolling element 244 and the bearing ring 242 allow for angular correction from the forces applied to the inner disc 224 and outer disc 214 by the polishing pad 110 during conditioning, for example, alignment of the entire pad conditioner 200.

[0023]

[0044] The outer disk assembly 210 may be connected to the proximal end 240a of the lower part 240. The outer disk assembly 210 includes an outer disk deflection portion 250 located on the upper surface 218, concentric with the axis 204, and one end of which is directly connected to the lower part 240 of the gimbal assembly 206. The outer disk deflection portion 250 is connected to the outer disk body 210a of the outer disk assembly 210 at the end of the outer disk deflection portion 250 opposite to the lower part 240. A lateral gap 252 exists between the outer disk body 210a and the inner disk assembly 220. A longitudinal gap 254 also exists between the outer disk deflection portion 250 and the inner disk assembly 220. The lateral gap 252 and the longitudinal gap 254 allow the outer disk deflection portion 250 to deform relative to the inner disk assembly 220 and the gimbal assembly 206 when a force is applied to the outer disk 214.

[0024]

[0045] The inner disk assembly 220 may be connected at its central portion 220a to the distal end 240b of the lower portion 240. The inner disk assembly 220 includes an inner disk deflection portion 260 located on the bottom surface 222 of the inner disk assembly 220, between the central portion 220a and the inner disk body 220b. A lateral gap 264 exists between the central portion 220a and the inner disk body 220b of the inner disk assembly 220. A longitudinal gap 262 also exists between the inner disk deflection portion 260 and the lower portion 240 of the gimbal assembly 206. Due to the lateral gap 264 and the longitudinal gap 262, when a force is applied to the inner disk 224, the inner disk deflection portion 260 can deform relative to the inner disk assembly 220 and the gimbal assembly 206.

[0025]

[0046] The outer disc deflection portion 250 and the inner disc deflection portion 260 compensate for the displacement of the outer disc assembly 210 and the inner disc assembly 220, respectively, caused by forces generated by the uneven surface of the polishing pad during pad conditioning, thereby improving pad conditioning efficiency and the fit between the inner disc 224 and the outer disc 214 and the surface of the polishing pad 110.

[0026]

[0047] The arrangement of the inner disc deflection portion 260 relative to the inner disc body 220b of the inner disc assembly 220 shown on the bottom surface 222 in Figure 2C may be any desired position. For example, the inner disc deflection portion 260 may be located on a surface that does not come into contact with the polishing pad 110 during pad conditioning, as shown in Figures 3A and 3B.

[0027]

[0048] Figure 3A is a schematic cross-sectional view of a pad conditioner 300 (e.g., a pad conditioning assembly 120), and Figure 3B is a schematic bottom view of a pad conditioner 300 according to another embodiment. Figures 3A and 3B show a pad conditioner 300 having a concentric disk holder assembly. An outer disk assembly 310 and an inner disk assembly 320 are mounted concentrically on a shaft 302 along an axis 304. The outer disk assembly 310 includes an outer disk deflection portion 350 connected to the outer disk body 310b via an outer disk connector portion 310a. The outer disk body 310b has a bottom surface 312 containing a plurality of outer disks 314. The outer disk assembly 310 also includes a lateral gap 352 located between the outer disk body 310b and the inner disk assembly 320, and a longitudinal gap 354 located between the outer disk deflection portion 350 and the inner disk assembly 320.

[0028]

[0049] The inner disk assembly 320 is attached to the distal end of the shaft 302 at its central portion 320a. The inner disk assembly 320 includes an inner disk deflection portion 360 radially connected to the central portion 320a. The inner disk body 320b is connected to the inner disk deflection portion 360 via an inner disk connector 320c. The inner disk body 320b has a bottom surface 322 containing a plurality of inner disks 324. The inner disk assembly 320 also includes a radial gap 362 between the inner disk deflection portion 360 and the inner disk body 320b. The radial gap 362 also includes the width between the central portion 320a and the inner disk connector 320c.

[0029]

[0050] The radial gap 362 is configured to allow deformation of the inner disc deflection portion 360 in response to surface irregularities of the polishing pad 110 during pad conditioning. The inner disc body 320b is rigid so that shear adjustment is substantially achieved by the inner disc deflection portion 360.

[0030]

[0051] The outer disk assembly 310 and the inner disk assembly 320 have a uniform toroidal and circular shape, respectively, but the disk assembly, in particular the disk holder, may have any desired shape, such as the elliptical shape shown in Figures 4A to 4B, or the protrusions shown in Figures 5A to 6C.

[0031]

[0052] Figure 4A is a schematic cross-sectional view of a pad conditioner 400 (e.g., a pad conditioning assembly 120), and Figure 4B is a schematic bottom view of a pad conditioner 400 according to another embodiment. As shown in Figures 4A and 4B, the pad conditioner 400 includes an outer disk assembly 410 and an inner disk assembly 420. The outer disk assembly 410 includes an outer disk deflection section 450 mounted concentrically on a shaft 402 with respect to an axis 404. A plurality of outer disk holders 410a are radially attached to the outer disk deflection section 450 by outer disk deflection section connectors 410b. The plurality of outer disk holders 410a are connected to each other by outer disk connectors 410c. The plurality of outer disk holders 410a may have an elliptical shape with a bottom surface 412 containing a plurality of outer disks 414.

[0032]

[0053] The outer disk assembly 410 includes a first lateral gap 452a between a plurality of outer disk holders 410a and the inner disk assembly 420, and a second lateral gap 452b between the outer disk connector 410c and the inner disk assembly 420. The outer disk assembly 410 also includes a first longitudinal gap 454a between the outer disk flex portion 450 and the plurality of outer disk holders 410a, and a second longitudinal gap 454b between the outer disk flex portion 450 and the inner disk assembly 420.

[0033]

[0054] The inner disk assembly 420 includes a first inner disk flex portion 460a and a second inner disk flex portion 460b, which are radially connected around an inner disk central portion 420a. The inner disk central portion 420a is directly connected to the inner disk body 420b. The first inner disk flex portion 460a and the second inner disk flex portion 460b are radially connected to the inner disk body 420b via an inner flex portion connector 420c. The inner disk body 420b has a bottom surface 422 which includes a plurality of inner disks 424.

[0034]

[0055] The inner disk body 420b has a shape complementary to the shape of the outer disk holder 410a and the outer disk connector 410c. For example, the inner disk body 420b may have a circular shape with recesses for accommodating each outer disk holder 410a.

[0035]

[0056] The inner disk assembly 420 includes a first lateral gap 462 and a second lateral gap 464. The first lateral gap 462 is located between the inner disk central portion 420a and the inner flex connector 420c, close to the outer disk holder 410a. The second lateral gap 464 is located between the inner disk central portion 420a and the inner flex connector 420c, close to the outer disk connector 410c. The first lateral gap 462 and the second lateral gap 464 may have different widths to accommodate the shape of the inner disk body 420b. For example, the first lateral gap 462 may have a width such that the first lateral gap 452a is maintained between the inner disk assembly 420 and the outer disk holder 410a. The second lateral gap 464 may have a width such that the second lateral gap 452b is maintained between the inner disk assembly 420 and the outer disk connector 410c.

[0036]

[0057] Figure 5A is a schematic cross-sectional view of a pad conditioner 500 (e.g., a pad conditioning assembly 120), and Figure 5B is a schematic bottom view of a pad conditioner 500 according to another embodiment. The pad conditioner 500 has a first disk assembly 510 and a second disk assembly 520 that are concentric with respect to an axis 504. The first disk assembly 510 includes a first disk body 510a having a first bottom surface 512 on which a plurality of first disks 514 are connected. The first disk body 510a includes a plurality of first projections 510b that extend radially from a first central portion 510c. Each of the first projections 510b includes at least one of the plurality of first disks 514. A first flex portion 550 is radially mounted on the shaft 502 and connected to each of the first projections 510b. The first flexible portion 550 is planar and allows each of the first plurality of protrusions 510b to bend when a force is applied to the first bottom surface 512.

[0037]

[0058] The second disk assembly 520 includes a second disk body 520a having a second plurality of projections 520b extending radially from a second central portion 520c. The shaft 502 extends through the first central portion 510c and connects to the second central portion 520c. The second plurality of projections 520b include a second bottom surface 522 having a second plurality of disks 524. Each of the second plurality of projections 520b includes at least one of the second plurality of disks 524. Each of the first plurality of projections 510b is located at a radial distance 530 from each of the second plurality of projections 520b. The second deflection portion 560 extends radially from the shaft 502 and connects to each of the second plurality of projections 520b. The second flexible portion 560 is planar, allowing each of the second plurality of protrusions 520b to bend when a force is applied to the second bottom surface 522.

[0038]

[0059] The first and second flexures 550 and 560 may be configured to allow a desired level of deflection in response to pressure applied by the multiple disks 514, 524 or from the shaft 502. The first and second flexures 550 and 560 may have a thickness that allows deflection while preventing permanent deformation or breakage of the flexures, depending on the material of each flexure. The shape of the first and second flexures 550 and 560 can contribute to such properties, and for this reason, the first and second flexures 550 and 560 may be flat or have any desired shape, as shown in Figures 6A to 6C.

[0039]

[0060] Figure 6A is a schematic cross-sectional view of a pad conditioner 600 (e.g., a pad conditioning assembly 120) according to one embodiment. Figure 6B is a schematic top view of the first disk assembly 610 of the pad conditioner 600. Figure 6C is a schematic top view of the second disk assembly 620 of the pad conditioner 600. Figures 6A to 6C show a pad conditioner 600 configured similarly to the pad conditioner 500 shown in Figures 5A and 5B. The first disk assembly 610 and the second disk assembly 620 are connected concentrically to the shaft 602 with respect to the axis 604. The first disk assembly 610 includes a first flex portion 650, one end of which is connected to a first stop portion 652 on the shaft 602. The second disk assembly 620 includes a second flex portion 660, one end of which is attached to a second stop portion 662 on the shaft 602. The second stop 662 is located along the shaft 602 between a portion of the first disk assembly 610 and the second disk assembly 620, resulting in an offset of the second deflection portion 660 relative to the first deflection portion 650. The first stop 652 allows the first deflection portion 650 to deform when pressure is applied to a series of first disks 614 mounted on the first disk assembly 610, and the second stop 662 allows the second deflection portion 660 to deform when pressure is applied to a series of second disks 624 of the second disk assembly 620. The first deflection portion 650 and the second deflection portion 660 have an S-shape that assists deflection when force is applied to the first disk assembly 610 or the second disk assembly 620. The offset deflection, such as that of the first deflection portion 650 and the second deflection portion 660, increases the range of orthogonal displacement, resulting in better adjustment of each of the series of first disks 614 and the series of second disks 624.

[0040]

[0061] Figure 7A is a schematic cross-sectional view of a pad conditioner 700 according to several embodiments. Figure 7B is a schematic bottom view of the pad conditioner 700 shown in Figure 7A according to several embodiments. Figures 7A and 7B show a pad conditioner 700 comprising an outer disk assembly 710 and an inner disk assembly 720 connected concentrically around an axis 704. The outer disk assembly 710 and the inner disk assembly 720 are connected to the shaft 702 by a flexure 750 such that the outer disk assembly 710 and the inner disk assembly 720 are coplanar. Alternatively, the outer disk assembly 710 and the inner disk assembly 720 may be offset, as described with respect to Figures 6A to 6C. The outer disk assembly 710 is connected to the flexure 750 via a series of fasteners 752. The outer disk assembly 710 includes a plurality of outer disk holders 710a connected to each other via outer disk connectors 710b. Each of the multiple outer disk holders 710a has a bottom surface 712 having multiple outer disks 714. The multiple outer disks 714 are connected to the outer disk holders 710a using fasteners 752.

[0041]

[0062] The inner disk assembly 720 includes a plurality of inner projections 720a connected to the inner central portion 720b. Each inner projection 720a is connected to the flexible portion 750 via a fastener 752. Each of the plurality of inner projections 720a includes one of a plurality of inner disks 724 on the bottom surface 722 of the inner disk assembly 720. Each of the plurality of outer disks 714 is located at a radial distance 760 from each of the plurality of inner disks 724 such that the plurality of outer disks 714 and the plurality of inner disks 724 are equidistant from each other radially with respect to the axis 704.

[0042]

[0063] Figure 7C is a schematic bottom view of the flexure section 750 of the pad conditioner 700. Referring to Figure 7C, the flexure section 750 has a plurality of flexure projections 754 equal to the sum of the number of inner projections 720a and the number of outer disc holders 710a. The plurality of flexure projections 754 are arranged radially around the axis 704 and aligned with the inner projections 720a and the outer disc holders 710a. Each of the plurality of flexure projections 754 is connected to the outer disc connector 710b and includes a fastener 752. Each of the plurality of flexure projections 754 is deformable around the flexure section 750, and each of the plurality of inner projections 720a and each of the plurality of outer disc holders 710a can independently deform the flexure section 750. This arrangement allows each disc assembly to deform its flexure section without interfering with the diamond discs of other disc assemblies when a downward force is applied by the shaft during pad conditioning.

[0043]

[0064] A gimbal assembly (e.g., gimbal assembly 206) that interacts with the concentric disk assembly is also adjustable. In the above embodiment, the gimbal assembly as a whole adjusts the pad conditioners (200, 300, 400, 500, 600, 700), and the flex sections (250, 260, 350, 360, 450, 460a, 460b, 550, 560, 650, 660, 750) provide adjustment for the individual disk assemblies (210, 220, 310, 320, 410, 420, 510, 520, 610, 620, 710, 720). The gimbal assembly may be configured to adjust in conjunction with the flex sections and the individual disk assemblies, as described below.

[0044]

[0065] Figure 8A is a schematic cross-sectional view of a pad conditioner 800 according to several embodiments. Figure 8B is a schematic bottom view of the pad conditioner 800. Figure 8C is a schematic cross-sectional bottom view of the pad conditioner 800. Figures 8A to 8C show a pad conditioner 800 having a concentric disk assembly, for example, an outer disk assembly 810 and an inner disk assembly 820, connected to a shaft 802 that is concentric with respect to the axis 804, and a spherical bearing 840. The flexible portion 850 is radially connected to the shaft 802, with one end of the flexible portion 850 located at the distal end of the shaft 802, to a base 806. The other end of the flexible portion 850 is connected to the outer disk assembly 810. The spherical bearing 840 is connected to the base 806.

[0045]

[0066] The outer disk assembly 810 includes a plurality of outer disk holders 812 connected to each other by an outer disk connector 810a. The inner surfaces of the plurality of outer disk holders 812 are in contact with a spherical bearing 840 and function as bearing rings for the spherical bearing 840, thereby allowing the spherical bearing 840 to contact the plurality of outer disk holders 812 and allowing the plurality of outer disk holders 812 to rotate around the spherical bearing 840. Each outer disk holder 812 can be divided into an upper outer disk holder 812a and a lower outer disk holder 812b. The upper outer disk holder 812a is connected to a flexure 850. The lower outer disk holder 812b is connected to the upper outer disk holder 812a by a series of upper fasteners 852a. The outer disk holder 812 includes a plurality of outer disks 814 connected to the lower outer disk holder 812b by a series of lower fasteners 852b.

[0046]

[0067] The inner disk assembly 820 includes a plurality of inner disk holders 822 connected to each other by an outer disk connector 810a. The inner disk holders 822 have inner surfaces in contact with a spherical bearing 840 and function as bearing rings for the spherical bearing 840, similar to the outer disk holders 812. The spherical bearing 840 is configured to simultaneously contact the inner surfaces of the plurality of outer disk holders 812 and the plurality of inner disk holders 822. Each inner disk holder 822 can be divided into an upper inner disk holder 822a and a lower inner disk holder 822b. Similar to the upper outer disk holder 812a and lower outer disk holder 812b, the upper inner disk holder 822a and the lower inner disk holder 822b are connected to each other by an upper fastener 852a. The upper inner disk holder 822a is connected to a flexure 850. The lower inner disk holder 822b includes a plurality of inner disks 824 having a lower fastener 852b. The inner disk holders 822 are connected to each other by the central portion 820a of the inner disk assembly 820, which is located coaxially with respect to the axis 804.

[0047]

[0068] Although the spherical bearing 840 of the pad conditioner 800 is shown as a single unit, it is possible to use a spherical bearing assembly in which the spherical bearing is divided into multiple parts in order to further control the adjustment amount of each disc assembly. Such embodiments are shown in Figures 9A to 9C.

[0048]

[0069] Figure 9A is a schematic cross-sectional view of a pad conditioner 900 according to several embodiments. Figure 9B is a schematic cross-sectional view of a spherical bearing assembly 940 of a pad conditioner 900 according to several embodiments. Figure 9C is a schematic cross-sectional view of a cam assembly 960 of the spherical bearing assembly 940. Figures 9A to 9C show a pad conditioner 900 configured similarly to a pad conditioner 800. The pad conditioner 900 includes an outer disc assembly 910 and an inner disc assembly 920, which are concentrically arranged around a shaft 904 and connected to a shaft 902 by a flexible portion 950. The outer disc assembly 910 and the inner disc assembly 920 are directly connected to the flexible portion 950. The outer disk assembly 910 includes a plurality of outer disk holders 912 configured to contact the spherical bearing assembly 940 and each divided into an upper outer disk holder 912a and a lower outer disk holder 912b, an outer disk connector 910a, a plurality of outer disks 914, a series of upper fasteners 952a, a series of lower fasteners 952b, and a series of flexible portion fasteners 952c. The flexible portion fasteners 952c connect the flexible portion 950 to the outer disk assembly 910, for example, the upper outer disk holder 912a and the inner disk assembly 920.

[0049]

[0070] The inner disk assembly 920, similar to the inner disk assembly 820 shown in Figures 8A to 8C, is configured to contact the spherical bearing assembly 940 and includes a plurality of inner disk holders 922, each divided into an upper inner disk holder 922a and a lower inner disk holder 922b, connected to an outer disk connector 910a and a central portion 920a, and a plurality of inner disks 924.

[0050]

[0071] As shown in Figure 9B, the spherical bearing assembly 940 includes an outer spherical bearing 942 and an inner spherical bearing 944 that overlap concentrically with respect to the shaft 904. The outer spherical bearing 942 includes a curved bearing surface 942a configured to interact with the outer disk assembly 910, the inner disk assembly 920, or a combination thereof. The inner spherical bearing 944 includes a curved bearing surface 944a configured to interact with the outer disk assembly 910, the inner disk assembly 920, or a combination thereof.

[0051]

[0072] Referring to Figure 9C, the outer spherical bearing 942 and the inner spherical bearing 944 each include an outer bearing projection 942b and an inner bearing projection 944b, configured to interact with the shaft 902, the base 906, and each other or a combination thereof. The distal end of the shaft 902 houses a cam assembly 960. The cam assembly 960 includes a cam 962 attached to the shaft support 964 by a rod 966. The cam 962 is grooved and configured to rotate about the rod 966. The inner bearing projection 944b contacts one side of the grooved cam 962, and the outer bearing projection 942b contacts the opposite side of the grooved cam 962. When a downward force is applied to the shaft 902, the reaction force pushes the inner spherical bearing 944 and the outer spherical bearing 942 upward. The inner bearing projection 944b and the outer bearing projection 942b distribute the reaction force on the cam 962, causing the cam 962 to rotate. By adjusting the alignment of the entire pad conditioner through the rotation of the cam 962, the forces acting on the inner disc 924 and the outer disc 914, and the resulting pressure, can be evenly distributed.

[0052]

[0073] The subject of the disclosure is to enable the adjustment of the diamond discs in each assembly using the surface of the polishing pad so that the pressure each diamond disc applies to the polishing pad is uniform during pad conditioning, while also maintaining cost efficiency. Adjusting the diamond discs as part of a concentric assembly improves pad conditioning efficiency by improving the fit between the individual small diamond discs in each disc assembly and the surface of the polishing pad. Furthermore, pad extrusion conditioning time is reduced, improving throughput and process stability.

[0053]

[0074] Where the elements of this disclosure or exemplary aspects or embodiments thereof are described, the articles “a,” “an,” “the,” and “said” indicate that there is one or more of those elements.

[0054]

[0075] The terms "comprising," "including," and "having" are intended to be comprehensive, meaning that additional elements may exist beyond those listed.

[0055]

[0076] The term “joining” is used herein to refer to a direct or indirect connection between two objects. For example, if object A is in physical contact with object B, and object B is in contact with object C, then objects A and C can be considered joined to each other, even if they are not in direct physical contact with each other. For example, an object may be joined to a second object even if the first object is not in direct physical contact with the second object.

[0056]

[0077] While the foregoing applies to embodiments of the present disclosure, it is possible to devise other further embodiments of the present disclosure without departing from its basic scope as defined by the following claims.

Claims

1. It is a pad conditioner, The shaft and A bearing ring connected to the lower part of the shaft and in contact with the rolling element, An outer disk assembly connected to the lower part of the shaft, The outer disk body and The outer disk body and the outer disk bending portion connected to the lower part of the shaft, Multiple outer disks arranged on the bottom surface of the outer disk body The outer disk assembly, An inner disk assembly concentrically connected to the lower part of the shaft, The inner disk body, The inner disk bending portion connected to the inner disk body, Multiple inner disks arranged on the bottom surface of the inner disk body and Including the inner disk assembly and A pad conditioner equipped with [a specific feature].

2. The pad conditioner according to claim 1, wherein the outer disk body has a toroidal shape and the inner disk body has a circular shape.

3. The pad conditioner according to claim 1, wherein the outer disk body includes a plurality of outer disk holders connected to each other by an outer disk connector, and the inner disk body has a circular shape with a recess for accommodating each of the outer disk holders.

4. The pad conditioner according to claim 1, wherein the outer disk body includes a first plurality of protrusions, each of which includes at least one of the plurality of outer disks, and the inner disk body includes a second plurality of protrusions, each of which includes at least one of the plurality of inner disks.

5. The pad conditioner according to claim 4, wherein at least one of the plurality of outer disks and at least one of the plurality of inner disks are equidistant from each other.

6. The pad conditioner according to claim 1, wherein the outer disc deflection portion and the inner disc deflection portion have an S-shape.

7. The pad conditioner according to claim 1, wherein the outer disc deflection portion contacts a first stop portion on the shaft, the inner disc deflection portion contacts a second stop portion on the shaft, and the first stop portion and the second stop portion are offset from each other along the shaft.

8. It is a pad conditioner, The shaft and A bearing ring connected to the lower part of the shaft and in contact with the rolling element, An outer disk assembly connected to the lower part of the shaft, Multiple outer disk holders, An external disk connector for connecting the aforementioned multiple external disk holders, Multiple outer disks arranged on the bottom surface of the outer disk holder and The outer disk assembly, An inner disk assembly concentrically connected to the lower part of the outer disk assembly, Multiple medial projections, Multiple inner disks arranged on the bottom surface of the inner protrusion and The inner disk assembly, The outer disk assembly, the inner disk assembly, and the flexible portion connected to the shaft A pad conditioner equipped with [a specific feature].

9. The pad conditioner according to claim 8, wherein the inner disk assembly is directly connected to the deflection portion.

10. The pad conditioner according to claim 8, wherein the outer disk assembly and the inner disk assembly are configured to deform the flex portion independently of each other.

11. The pad conditioner according to claim 8, wherein the plurality of outer disks and the plurality of inner disks are equidistant from each other in the radial direction.

12. The pad conditioner according to claim 8, wherein the outer disk assembly and the inner disk assembly are coplanar.

13. The pad conditioner according to claim 8, wherein the flexible portion includes a flexible portion projection, and the flexible portion projection is connected to the plurality of outer disk holders and the plurality of inner projections.

14. The pad conditioner according to claim 13, wherein each of the flexible projections is connected to only one of the plurality of outer disc holders or the plurality of inner projections.

15. It is a pad conditioner, The shaft and A spherical bearing assembly connected to the lower part of the shaft, An outer disk assembly connected to the lower part of the shaft, The outer disk body and Multiple outer disks arranged on the bottom surface of the outer disk body The outer disk assembly, An inner disk assembly concentrically connected to the lower part of the outer disk assembly, The inner disk body, Multiple inner disks arranged on the bottom surface of the inner disk body and The inner disk assembly, The flexible portion connected to the outer disk assembly and the shaft A pad conditioner equipped with [a specific feature].

16. The pad conditioner according to claim 15, wherein the spherical bearing assembly includes a single spherical bearing configured to simultaneously contact the inner surface of the outer disk assembly and the inner surface of the inner disk assembly.

17. The pad conditioner according to claim 15, wherein the spherical bearing assembly includes an outer spherical bearing and an inner spherical bearing, the outer spherical bearing configured to contact the outer disk assembly, and the inner spherical bearing configured to contact the inner disk assembly.

18. The pad conditioner according to claim 17, wherein the flexible portion is directly connected to the inner disk assembly.

19. The pad conditioner according to claim 17, wherein the lower part of the shaft includes a cam assembly, the cam assembly includes a cam attached to a rod, and the rod is connected to a shaft support extending from the shaft.

20. The pad conditioner according to claim 19, wherein the outer spherical bearing includes an outer bearing projection, and the inner spherical bearing includes an inner bearing projection, and the outer bearing projection and the inner bearing projection are configured to interact with opposing sides of the cam so that the cam rotates around the rod.

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