Chip loading device and chip inspection system

Abstract

In the field of semiconductor inspection technology, the present invention relates to a chip loading device and a chip inspection system. A suction assembly is used to pick up the chip to be inspected on a transport assembly. The cantilever of the loading assembly has a first position for placing the chip to be inspected picked up by the suction assembly and a second position for placing the chip to be inspected on a chip inspection device. The cantilever is designed to rotate under control, thereby switching between the first and second positions. The rotation of the cantilever allows the chip to be transported to the chip inspection device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor inspection, and particularly to a chip loading device and a chip inspection system.

Background Art

[0002] In electronic products, it is required that electronic components have good performance and reliability. Therefore, it is necessary to perform electrical characteristic inspection on chips.

[0003] Conventional inspection devices mainly include a chip loading device, a chip inspection device, and a chip unloading device, thereby realizing automatic inspection of chips. After the chip to be inspected enters the chip loading device, it is necessary to transport the chip to be inspected from the chip loading device to the chip inspection device to perform performance inspection on the chip to be inspected. Therefore, it is necessary to provide a transport device on each of the chip loading device and the chip unloading device to realize the transport of the chip to be inspected. However, in the prior art, the transport device has a complex structure and a large required space. Therefore, it is urgent to design a transport device with a simple structure and a small required space.

[0004] In addition, after the wafer enters the chip loading device from the wafer case, in order to ensure its stability during the process of transporting the wafer, it is necessary to design a limiting assembly for limiting the wafer. In the prior art, the limiting assembly can generally only limit one size of wafer. Therefore, the chip loading device can generally only load one size of wafer and cannot load wafers of different sizes simultaneously, which has limitations.

Summary of the Invention

[0005] The first object of the first aspect of the present invention is to provide a chip loading device that solves the technical problems of the prior art, such as the complex structure and large space requirements of chip transport devices.

[0006] A second object of the first aspect of the present invention is to peel the chip to be inspected from the blue tape.

[0007] A third object of the first aspect of the present invention is to provide a chip inspection system having the above-described chip loading device.

[0008] The first object of a second aspect of the present invention is to provide a chip loading device that solves the technical problem of the prior art, in which the chip loading device can only load wafers of one size.

[0009] A second object of a second aspect of the present invention is to achieve wafer position adjustment.

[0010] In particular, according to the first aspect of the present invention, Mounting base and A transport assembly for transporting the chip to be inspected, which is attached to the aforementioned mounting base, A suction assembly attached to the mounting base for picking up the chip to be inspected on the transport assembly, A chip loading device is provided, comprising a loading assembly which includes a cantilever, the cantilever having a first position for receiving the chip to be inspected adsorbed by the adsorption assembly and a second position for placing the chip to be inspected on a chip inspection device, and the cantilever is provided to rotate under control, thereby switching between the first and second positions, thereby transporting the chip to be inspected adsorbed by the adsorption assembly to the chip inspection device.

[0011] Optionally, a gas channel for attracting the chip under inspection is provided inside the cantilever, and the gas channel is connected to a vacuum device, so that when the vacuum device performs vacuuming, the gas channel attracts the chip under inspection.

[0012] Optionally, the loading assembly is: The drive component is connected to the cantilever and is configured to be controlled to rotate the cantilever in conjunction with a first plane, wherein the first plane is perpendicular to the horizontal plane.

[0013] Optionally, the chip under test has a first surface, The cantilever is provided such that, in the process of switching from the first position to the second position, the first surface of the chip under inspection is switched from facing upward to facing downward.

[0014] Optionally, the chip loading device is The first sliding assembly is located at the top of the transport assembly and is connected to the suction assembly, and is used to move the suction assembly in conjunction with the transport assembly, thereby causing the suction assembly to pick up the chip to be inspected and transport the chip to the cantilever.

[0015] Optionally, the transport assembly is: A pair of slide rails attached to the mounting base and extending horizontally, A mounting platform for placing a wafer, wherein both ends are slidably connected to corresponding slide rails and are configured to slide in conjunction with the pair of slide rails, thereby transporting the wafer to a third position, the third position being located at the bottom of the suction assembly, and the wafer includes at least one of the chips to be inspected.

[0016] Optionally, the chip loading device is A tape peeling assembly to be attached to the mounting base, further comprising the tape peeling assembly configured to peel the chip to be inspected on the wafer from the blue tape when the mounting base slides to its uppermost position along the pair of slide rails.

[0017] Optionally, the tape release assembly is: A push-up needle cap having at least one through hole at its uppermost part, the push-up needle cap being provided to move along the longitudinal direction under control, The system includes at least one push-up needle located inside the push-up needle cap, each of which push-up needles corresponds to one of the through holes and is provided to protrude from the push-up needle cap out of the corresponding through hole as the push-up needle cap moves downward, thereby pushing up the chip under inspection and thereby peeling the chip under inspection from the blue tape.

[0018] Optionally, the chip loading device is The heating assembly is provided at the bottom of the mounting base, and further includes the heating assembly provided to heat the bottom of the wafer on the mounting base when the mounting base slides to a fourth position according to the pair of slide rails, thereby peeling the chip to be inspected from the blue tape of the wafer.

[0019] Optionally, the aforementioned stand is, Mounting plate and The system includes a limiting component that is detachably attached to the mounting plate for restricting the wafer.

[0020] Optionally, the chip loading device is A manipulator that is slidably attached to the mounting base, and is provided to grip the wafer in the wafer loading device, receive control, and slide, thereby transporting the wafer to the limiting component.

[0021] Particularly, according to the second aspect of the present invention, the present invention provides a chip loading device including a mounting base and a transport mechanism slidably attached to the mounting base. The transport mechanism includes a mounting plate, a placement assembly provided with at least one first cooperating component on the mounting plate, includes a bottom plate and an upper plate removably attached to the mounting plate. A limiting space for restricting the wafer is defined between the bottom plate and the upper plate. At least one second cooperating component is provided at the bottom of the bottom plate. Thus, a limiting assembly that removably attaches the bottom plate to the mounting plate by the cooperation of the second cooperating component and the first cooperating component is included.

[0022] Optionally, the bottom plate includes two support plates arranged at intervals. Each support plate has a support surface arranged along the horizontal direction and a contact surface arranged along the vertical direction. The support surfaces of the two support plates together support the steel ring of the wafer, and the two contact surfaces respectively contact two opposite side surfaces of the steel ring, thereby restricting the steel ring.

[0023] Optionally, the upper plate includes two pressing plates arranged at a first preset distance. Each pressing plate is attached to the top of one of the support plates and is at a second preset distance from the corresponding support surface. The wafer is located between the pressing plate and the support plate.

[0024] Optionally, the mounting plate has two mounting grooves. One of the support plates is attached to each mounting groove. The first cooperating component is provided in the mounting groove, and the second cooperating component is provided at the bottom of the support plate.

[0025] Optionally, the first cooperating component is a magnet and the second cooperating component is a magnetic plate.

[0026] Optionally, the chip loading device is a manipulator slidably attached to the mounting base, which grabs the steel ring of the wafer from the container, slides under control, and thereby slides the wafer in conjunction from the side of the limiting assembly between the support plate and the pressing plate on the mounting plate. The manipulator is further included.

[0027] Optionally, the first preset distance is greater than the width of the manipulator, whereby after the manipulator grabs the steel ring of the wafer, it moves between the two pressing plates, thereby moving the wafer in conjunction horizontally between the pressing plate and the support plate.

[0028] Optionally, the placing assembly is a first placing platform to which the mounting plate is rotatably connected, a second placing platform located below the first placing platform, a cross roller bearing attached to the second placing table, a synchronous belt pulley connected to the cross roller bearing and connected to the mounting plate by at least one guide shaft, a synchronous belt externally fitted to the synchronous belt pulley, and a driving component connected to the synchronous belt, which drives the synchronous belt to rotate the synchronous belt pulley in conjunction, thereby rotating the mounting plate in conjunction with the guide shaft relative to the first placing platform, thereby adjusting the position of the wafer. The driving component is further included.

[0029] Optionally, an annular groove is provided on the outer circumference of the mounting plate, and the above-described mounting assembly is The system further includes a plurality of driven wheels attached to the first mounting platform and located within the annular groove, thereby rolling in accordance with the rotation of the mounting plate.

[0030] In particular, the present invention further, The above chip loading device and, A chip inspection device provided on one side of the chip loading device, the chip inspection device receiving the chip to be inspected transported by the chip loading device and performing a performance test on the chip to be inspected, The present invention provides a chip inspection system comprising a chip unloading device provided on the side of the chip inspection device away from the chip loading device, for receiving and unloading the chip to be inspected that has been transported by the chip inspection device.

[0031] According to some embodiments of the present invention, a suction assembly is used to pick up a chip to be inspected on a transport assembly, and the cantilever of the loading assembly has a first position for placing the chip to be inspected picked up by the suction assembly and a second position for placing the chip to be inspected on a chip inspection device, and the cantilever is provided to rotate under control so as to switch between the first and second positions. The above technical solution allows the chip to be inspected to be transported to the chip inspection device by the rotation of the cantilever, and compared to the moving method used in the prior art, there is no need to provide multiple slide rails, thereby simplifying the structure and saving space.

[0032] Furthermore, the chip loading device of the present invention includes a tape peeling assembly attached to a mounting base, which is configured to peel the chip to be inspected on the wafer from the blue tape when the mounting base slides to its uppermost position along a pair of slide rails, thereby allowing the suction assembly to easily pick up the chip to be inspected.

[0033] According to some embodiments of the present invention, the mounting assembly is mounted on a mounting plate, the mounting plate is provided with at least one first cooperating component, and the limiting assembly includes a bottom plate and a top plate that are removablely attached to the mounting plate, with a limiting space between the bottom plate and the top plate for limiting the wafer, and at least one second cooperating component is provided at the bottom of the bottom plate, so that the cooperation of the second cooperating component and the first cooperating component allows the bottom plate to be removablely attached to the mounting plate and the top plate to be removablely attached to the mounting plate, thereby allowing the limiting assembly to be replaced for wafers of different sizes, thereby allowing the chip loading device to load wafers of different sizes simultaneously, thereby achieving versatility of the chip loading device.

[0034] Furthermore, the mounting assembly of the present invention further includes a first mounting platform rotatably connected to a mounting plate, a second mounting platform located below the first mounting platform, a cross roller bearing mounted on the second mounting platform, a synchronous belt pulley connected to the cross roller bearing and connected to the mounting plate by at least one guide shaft, a synchronous belt fitted onto the synchronous belt pulley, a drive component connected to the synchronous belt, the drive component drives the synchronous belt to rotate the synchronous belt pulley in conjunction, thereby causing the mounting plate to rotate in conjunction with the first mounting platform by the guide shaft, thereby adjusting the position of the wafer.

[0035] The above and other objects, advantages, and features of the present invention will become even clearer to those skilled in the art from the detailed description of specific embodiments of the present invention with reference to the following drawings. [Brief explanation of the drawing]

[0036] Some specific embodiments of the present invention are described in detail below in an illustrative and non-limiting manner with reference to the drawings. In the drawings, the same reference numerals represent the same or similar parts or components. It will be understood by those skilled in the art that these drawings are not necessarily drawn in dimensional relationships. Here, [Figure 1] Figure 1 is a schematic diagram of a chip loading device according to one embodiment of the present invention, viewed from a certain angle. [Figure 2] Figure 2 is a schematic diagram of a chip loading device according to one embodiment of the present invention, viewed from a different angle. [Figure 3] Figure 3 is a schematic diagram of a chip loading device according to one embodiment of the present invention, viewed from a certain angle, with the wafer loading apparatus and chip supply assembly removed. [Figure 4] Figure 4 is a schematic diagram of a chip loading device according to one embodiment of the present invention, viewed from a different angle, with the wafer loading apparatus and chip supply assembly removed. [Figure 5] Figure 5 is a schematic enlarged view of the adsorption assembly in a chip loading device according to one embodiment of the present invention. [Figure 6] Figure 6 is a schematic diagram of a loading assembly according to one embodiment of the present invention. [Figure 7] Figure 7 is a schematic diagram of a tape release assembly according to one embodiment of the present invention. [Figure 8] Figure 8 is a schematic cross-sectional view of a tape release assembly according to one embodiment of the present invention. [Figure 9] Figure 9 is a schematic enlarged view of the manipulator, tape release assembly, and cantilever in a chip loading device according to one embodiment of the present invention. [Figure 10] Figure 10 is a schematic enlarged view of the limiting component and mounting plate in a chip loading device according to one embodiment of the present invention. [Figure 11] Figure 11 is a schematic structural diagram of a chip loading device according to one embodiment of the present invention, viewed from a certain angle. [Figure 12]Figure 12 is a schematic diagram of a chip loading device according to one embodiment of the present invention, viewed from a different angle. [Figure 13] Figure 13 is a schematic diagram of a limiting assembly in a chip loading device according to one embodiment of the present invention. [Figure 14] Figure 14 is a schematic diagram of the mounting plate according to one embodiment of the present invention. [Figure 15] Figure 15 is a schematic diagram of a mounting assembly according to one embodiment of the present invention. [Figure 16] Figure 16 is a schematic block diagram of a chip inspection system according to one embodiment of the present invention. [Modes for carrying out the invention]

[0037] The embodiments of the present invention are described in detail below, with examples of embodiments shown in the figures. The same or similar reference numerals consistently represent the same or similar parts or parts having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and intended to clarify the present invention; they should not be considered limitations on the present invention.

[0038] In the description of this invention, the directions or positional relationships indicated by terms such as "up" and "down" are based on the directions or positional relationships shown in the drawings, and are used for the purpose of describing and simplifying the description of this invention. It should be understood that this does not indicate, or implicitly indicate, that the devices or components in question must be provided in a specific direction, or configured and operated in a specific direction, and therefore should not be considered a limitation on this invention.

[0039] The terms “first” and “second” are used solely for descriptive purposes and should not be interpreted as indicating or implicitly indicating relative importance or the number of technical features covered. Thus, features limited by “first” and “second” may explicitly or implicitly include at least one such feature, i.e., one or more such features. In the description of this invention, “multiple” means at least two, for example, two, three, etc., unless otherwise specifically defined. When a feature “includes” one or more features covered by it, unless otherwise specifically stated, this does not exclude other features and may further include other features.

[0040] Unless otherwise clearly defined and limited, terms such as “connect” and “attach” are to be understood in a broad sense. Unless otherwise clearly defined, for example, a connection may be fixed, detachably connected, or integrated; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediary; or it may be internal communication between two parts or interaction between two parts. Those skilled in the art will be able to understand the specific meaning of the terms in this invention from the specific context.

[0041] Unless otherwise specified, all terms used in this embodiment (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art.

[0042] Figure 1 is a schematic structural diagram of a chip loading device 100 according to one embodiment of the present invention, viewed from one angle; Figure 2 is a schematic structural diagram of a chip loading device 100 according to one embodiment of the present invention, viewed from another angle; Figure 3 is a schematic structural diagram of a chip loading device 100 according to one embodiment of the present invention, excluding the wafer loading device 70 and the chip supply assembly 26, viewed from one angle; Figure 4 is a schematic structural diagram of a chip loading device 100 according to one embodiment of the present invention, excluding the wafer loading device 70 and the chip supply assembly 26, viewed from another angle; Figure 5 is a schematic enlarged view of the suction assembly 40 in the chip loading device 100 according to one embodiment of the present invention; and Figure 6 is a schematic structural diagram of a loading assembly 30 according to one embodiment of the present invention. As shown in Figures 1 to 6, in this embodiment, the chip loading device 100 includes a mounting base 10, a transport assembly 20, a suction assembly 40, and a loading assembly 30. The transport assembly 20 is attached to the mounting base 10 and used to transport the chips to be inspected. The suction assembly 40 is mounted on the mounting base 10 and is used to pick up the chip to be inspected on the transport assembly 20. The loading assembly 30 includes a cantilever 31, which has a first position for receiving the chip to be inspected picked up by the suction assembly 40 and a second position for placing the chip to be inspected on a chip inspection device. The cantilever 31 is configured to rotate under control, thereby switching between the first and second positions, and thereby transporting the chip to be inspected picked up by the suction assembly 40 to the chip inspection device.

[0043] In this embodiment, the chip to be inspected can be transported to the chip inspection device by the rotation of the cantilever 31. Compared to the movement method used in the prior art, there is no need to provide multiple slide rails, which simplifies the structure and saves installation space.

[0044] In this embodiment, a gas channel for attracting the chip to be inspected is provided inside the cantilever 31, and the gas channel is connected to a vacuum device, so that when the vacuum device creates a vacuum, the chip to be inspected is attracted by the gas channel. Here, the gas channel has gas holes, and the adsorption assembly 40 simply places the attracted chip to be inspected into the gas holes.

[0045] In this embodiment, the loading assembly 30 further includes a drive component 32 connected to the cantilever 31, which is configured to rotate the cantilever 31 in conjunction with a first plane under control, the first plane being perpendicular to the horizontal plane. That is, the cantilever 31 rotates along a vertical plane, and therefore, it is necessary to attract the chip under inspection by a gas flow path to prevent the chip under inspection from falling off the cantilever 31 during the rotation of the cantilever 31. In some specific embodiments, as shown in Figure 6, the drive component 32 is a motor, and the cantilever 31 is connected to the output shaft of the motor, and the rotation of the output shaft of the motor rotates the cantilever 31 in conjunction with it.

[0046] In this embodiment, the chip under inspection has a first surface. The cantilever 31 is configured to switch the first surface of the chip under inspection from facing upward to facing downward during the process of switching from a first position to a second position. In other words, the cantilever 31 flips the chip under inspection over during the process of rotation. Here, the first surface is the functional surface of the chip under inspection, and when the cantilever 31 is in the first position, the functional surface of the chip under inspection faces upward, and when the cantilever 31 is in the second position, the functional surface of the chip under inspection faces downward. The functional surface of the chip under inspection is picked up by the suction assembly 40, and the chip under inspection is placed directly on the cantilever 31, thereby causing the functional surface of the chip under inspection to face upward. Here, the suction assembly 40 has a suction nozzle 41 for picking up the chip under inspection.

[0047] As shown in Figure 6, when the cantilever 31 is in the first position, it is positioned to extend horizontally, and as shown at point A in Figure 6, the gas holes of the gas channel face upward, thereby attracting the chip to be inspected, and the adsorption assembly 40 places the chip to be inspected into the gas holes from above the cantilever 31. The cantilever 31 then rotates 180° clockwise to the second position, and as shown at point B in Figure 6, at this time the gas holes of the gas channel face downward, and the chip to be inspected is flipped over by 180°. The chip inspection device has a receiving tray below point B, which holds the chip to be inspected that has been attracted by the cantilever 31.

[0048] In some specific embodiments, the chip loading device 100 further includes a first sliding assembly 50, which is located at the top of the transport assembly 20 and connected to a suction assembly 40, and is used to move the suction assembly 40 in conjunction with the transport assembly 20, thereby causing the suction assembly 40 to pick up the chip to be inspected and transport the chip to the cantilever 31. Here, the first sliding assembly 50 has a first slide rail extending along the X direction and a second slide rail extending along the Z direction, the second slide rail being connected to the first slide rail. The first and second slide rails are configured to slide the suction assembly 40 in conjunction along the X and Z directions, thereby sliding it above the cantilever 31 and placing the chip to be inspected on the cantilever 31.

[0049] In some specific embodiments, the first sliding assembly 50 further includes a third slide rail extending along the Z direction, the third slide rail being connected to the first slide rail and positioned alongside the second slide rail, and the third slide rail being connected to a drive component 32, thereby causing the cantilever 31 to slide in conjunction along the X and Z directions.

[0050] In some embodiments, the transport assembly 20 includes a pair of slide rails 21 and a mounting table 22, the pair of slide rails 21 being mounted on a mounting base 10 and extending horizontally. The mounting table 22 is used to place a wafer 200, and both ends of the mounting table 22 are slidably connected to the corresponding slide rails 21 and are configured to slide in conjunction with the pair of slide rails 21, thereby transporting the wafer 200 to a third position, which is located at the bottom of the suction assembly 40, and the wafer 200 includes at least one chip to be inspected. Here, the pair of slide rails 21 extend along the Y direction, thereby causing the mounting table 22 to slide in conjunction along the Y direction.

[0051] Figure 7 is a schematic structural diagram of a tape peeling assembly 60 according to one embodiment of the present invention, and Figure 8 is a schematic cross-sectional view of a tape peeling assembly 60 according to one embodiment of the present invention. As shown in Figures 7 and 8, and as referenced in Figures 1 to 4, in some specific embodiments, the chip loading device 100 further includes a tape peeling assembly 60, which is mounted on a mounting base 10, and is configured to peel the chip to be inspected on the wafer 200 from the blue tape when the mounting base 22 slides to its uppermost position along a pair of slide rails 21, thereby allowing the suction assembly 40 to easily pick up the chip to be inspected.

[0052] In some specific embodiments, the tape release assembly 60 includes a push-up needle cap 66 and at least one push-up needle 67, the uppermost part of the push-up needle cap 66 having at least one through hole 661, and the push-up needle cap 66 is configured to move along the longitudinal direction under control. The push-up needles 67 are located inside the push-up needle cap 66, each push-up needle 67 corresponding to one through hole 661, and the push-up needles 67 are configured to protrude from the push-up needle cap 66 through the corresponding through hole 661 as the push-up needle cap 66 moves downward, thereby pushing up the chip under test and thereby peeling the chip under test from the blue tape. Here, the tape release assembly 60 further includes a motor 62, an end cam 63, a roller 64, and a slide block 65, wherein the roller 64 is connected to an upward-pushing needle cap 66, the upward-pushing needle cap 66 is slidably connected to the slide block 65, the end cam 63 is connected to the motor 62 and has an inclined surface, the end cam 63 is driven by the motor 62 to rotate, thereby causing the roller 64 to roll along the inclined surface, thereby causing the upward-pushing needle cap 66 to move up and down along the slide block 65 in conjunction. In this embodiment, the upward-pushing needle cap 66 can move stably along the Z direction through the cooperation of the end cam 63 and the roller 64.

[0053] In some specific embodiments, a suction port for adsorbing a blue tape is provided at the top of the push-up needle cap 66. After the push-up needle cap 66 moves to a position where it is in contact with the blue tape, the suction port adsorbs the blue tape, and then the push-up needle cap 66 moves downward, causing the push-up needle 67 to protrude from the push-up needle cap 66, thereby pushing up the chip to be inspected.

[0054] As shown in Figures 4 and 7, in some specific embodiments, the chip loading device 100 further includes a second sliding assembly 61, which is mounted on the bottom of the mounting base 10 and connected to a tape peeling assembly 60, thereby moving the tape peeling assembly 60 in conjunction along the longitudinal direction, thereby causing the tape peeling assembly 60 to peel the chip to be inspected on the wafer 200 from the blue tape.

[0055] As shown in Figure 3, in some specific embodiments, the chip loading device 100 further includes a heating assembly 90 located at the bottom of the mounting base 10, which is configured to heat the bottom of the wafer 200 on the mounting base 22 when the mounting base 22 slides to a fourth position along a pair of slide rails 21, thereby peeling the chip under test from the blue tape on the wafer 200. Here, both the third and fourth positions are in the Y direction, and the fourth position is located upstream of the third position, meaning that the mounting base 22 first reaches the fourth position, heats at the fourth position, and then moves to the third position, where it peels off the tape. Here, the heating assembly 90 has an exhaust port 91 for discharging hot air.

[0056] In this embodiment, there are visual detection assemblies at both the third and fourth positions for detecting scratches or other defects on the chip being inspected.

[0057] Figure 9 is a schematic enlarged view of a manipulator 81, tape peeling assembly 60, and cantilever 31 in a chip loading device 100 according to one embodiment of the present invention. As shown in Figure 9, and also with reference to Figure 2, in this embodiment the chip loading device 100 further includes a manipulator 81 which is slidably mounted on a mounting base 10 and is configured to grasp and slide a wafer 200 in a wafer loading device 70 under controlled conditions, thereby transporting the wafer 200 to a limiting component 24. The chip loading device 100 further includes a third sliding assembly 82 which is mounted on the mounting base 10 and extends in a direction that coincides with the extending direction of a pair of slide rails 21, i.e., along the Y direction. The manipulator 81 is mounted on the third sliding assembly 82 and thereby moves along the Y direction. A wafer loading device 70 is attached to one side of the chip loading device 100, and the manipulator 81 moves along the Y direction to the wafer loading device 70 to grasp the wafer 200, and then moves again along the Y direction, thereby moving the wafer 200 in conjunction to the mounting stage 22, thereby completing the loading of the wafer 200.

[0058] In a preferred embodiment, the chip loading device 100 further includes a chip supply assembly 26 mounted on a mounting base 10, which is used to transport the chips to be inspected, thereby transporting the chips to be inspected near a suction assembly 40, which in turn allows the suction assembly 40 to pick up the chips to be inspected on the chip supply assembly 26 and transport the chips to the cantilever 31. In this embodiment, it may be understood that there are two loading methods, one of which is loading the wafer 200 and the other is loading the chips. The suction assembly 40 can pick up chips on the wafer 200, and can also pick up chips that have been transported directly from the chip supply assembly 26. Chips transported from the chip supply assembly 26 do not need to go through the heating assembly 90 and the tape peeling assembly 60, and the suction assembly 40 can pick them up directly. The suction assembly 40 cannot pick up chips on the wafer 200 until the wafer 200 transported from the wafer loading device 70 has undergone heating and tape peeling. Here, the chip supply assembly 26 is mounted to the side of a pair of slide rails 21. This embodiment allows for two loading methods to be performed simultaneously, making loading more convenient and versatile.

[0059] The wafer loading device 70 includes a mounting plate 71 on which containers are placed, and wafers 200 are stacked inside the containers. The mounting plate 71 is provided with two sets of limiting blocks, each set of limiting blocks includes multiple limiting blocks 72 for limiting the containers, and the mounting plate 71 can be driven to move along the vertical direction, thereby adjusting the height of the containers. The limiting blocks 72 in each set of limiting blocks are used to limit one size container, and containers of different sizes are used to place wafers 200 of different sizes, so that the wafer loading device 70 can handle containers of different sizes simultaneously and load two different sizes of wafers 200 without removing the wafer loading device 70. The manipulator 81 grasps the wafers 200 from inside the containers.

[0060] Figure 10 is a schematic enlarged view of the limiting component 24 and mounting plate 25 in a chip loading device 100 according to one embodiment of the present invention. As shown in Figure 10, in some specific embodiments, the mounting base 22 includes a mounting plate 25 and a limiting component 24, the mounting plate 25 having mounting grooves, and the limiting component 24 is removably mounted to the mounting plate 25 and used to limit the wafer 200. The limiting component 24 includes two support plates 242 and two retaining plates 241, the mounting plate 25 having two mounting grooves, each support plate 242 corresponding to one retaining plate 241 and mounted in one mounting groove, and each retaining plate 241 is mounted above the corresponding support plate 242. A limiting space for limiting the wafer 200 is formed between the support plate 242 and the corresponding retaining plate 241. The retaining plates 241 are semicircular, and the two retaining plates 241 are spaced apart and together form an annular shape.

[0061] In a preferred embodiment, at least one mounting hole for placing a magnet is provided in the mounting groove, and a magnetic plate that is attracted to the magnet is provided at the bottom of the support plate 242, thereby allowing the limiting component 24 to be detachably attached to the mounting plate 25 by attraction between the magnetic plate and the magnet. This embodiment makes the limiting component 24 detachable from the mounting plate 25, so that different sized limiting components 24 can be exchanged to limit wafers 200 of different sizes. Here, each size of limiting component 24 limits one size of wafer 200, that is, each limiting component 24 corresponds to one size of container.

[0062] As shown in Figure 10, in this embodiment, there is a preset distance between the two retaining plates 241, and this preset distance is greater than the width of the manipulator 81. This allows the manipulator 81 to grasp the steel ring 210 of the wafer 200 and then move along the Y direction, thereby moving the wafer 200 in conjunction with the support plate 242 and the retaining plates 241 directly from the side of the mounting table 22, thereby restricting the wafer 200. In this embodiment, since the wafer 200 can be restricted while being transported, the structure is simplified and the loading step is omitted. Here, the manipulator 81 grasps the steel ring 210 of the wafer 200. The retaining plate 241 is attached to the top of the mounting plate 25 by bolts. When removing the restricting component 24, first the retaining plate 241 is removed from the mounting plate 25, and then the support plate 242 is removed from the mounting plate 25. Since the support plate 242 is attached to the mounting plate 25 by magnetic attraction, replacement can be done conveniently and quickly.

[0063] In some specific embodiments, at least one waste tray 23 is attached to the side of the mounting table 22, and if the visual detection assembly detects that the chip under inspection is damaged or contaminated, the suction assembly 40 may move the damaged or contaminated chip under inspection into the waste tray 23, eliminating the need for inspection by the chip inspection device 300 and thus saving inspection resources.

[0064] Figure 11 is a schematic structural diagram of a chip loading device 100 according to one embodiment of the present invention viewed from one angle, Figure 12 is a schematic structural diagram of a chip loading device 100 according to one embodiment of the present invention viewed from another angle, Figure 13 is a schematic structural diagram of a limiting assembly in a chip loading device 100 according to one embodiment of the present invention, and Figure 14 is a schematic structural diagram of a mounting plate 11 according to one embodiment of the present invention. As shown in Figures 11 to 14, in this embodiment, the chip loading device 100 includes a mounting base 301 and a transport mechanism slidably mounted on the mounting base 301, the transport mechanism includes a mounting assembly 101 and a limiting assembly, the mounting assembly 101 includes a mounting plate 11, and the mounting plate 11 is provided with at least one first cooperative component. The limiting assembly includes a bottom plate 201 and a top plate 220 that are removably attached to the mounting plate 11, with a limiting space between the bottom plate 201 and the top plate 220 for limiting the wafer 200, and at least one second cooperating component 212 provided at the bottom of the bottom plate 201, so that the bottom plate 201 is removably attached to the mounting plate 11 by the cooperation of the second cooperating component 212 and the first cooperating component. The top plate 220 is attached to the mounting plate 11 by bolts.

[0065] In this embodiment, the bottom plate 201 and the top plate 220 are detachably attached to the mounting plate 11, and the top plate 220 is also detachably attached to the mounting plate 11, so that the corresponding limiting assembly can be exchanged for wafers 200 of different sizes, and the chip loading device 100 can load wafers 200 of different sizes simultaneously, thereby making the chip loading device 100 versatile.

[0066] It will be understood by those skilled in the art that, although not shown in Figure 11, in some embodiments the chip loading device 100 may further include at least one of the components shown in Figures 1 to 10, such as the loading assembly 30, the suction assembly 40, the first sliding assembly 50, the tape peeling assembly 60, the wafer loading device 70, the heating assembly 90, etc.

[0067] In this embodiment, the base plate 201 includes two spaced support plates 211, each support plate 211 having a support surface 214 oriented horizontally and a contact surface 213 oriented vertically, the support surfaces 214 of the two support plates 211 both supporting the steel ring 210 of the wafer 200, and the two contact surfaces 213 each contact two opposing sides of the steel ring 210, thereby restricting the steel ring 210. Referring to Figure 11, the support plates 211 may be understood as stepped. The contact surface 213 extends vertically, the support surface 214 extends horizontally, and the support surface 214 and the contact surface 213 are perpendicular to each other.

[0068] In this embodiment, as shown in Figures 12 and 13, the top plate 220 includes two retaining plates 221 positioned at a first predetermined distance apart, each retaining plate 221 mounted on top of a support plate 211 and at a second predetermined distance from the corresponding support surface 214, with the wafer 200 positioned between the retaining plates 221 and the support plate 211. In this embodiment, the cooperation of the retaining plates 221 and the support plate 211 restricts movement of the wafer 200 to any side, top, or bottom, preventing the wafer 200 from moving during transport.

[0069] In some specific embodiments, as shown in Figures 14 and 15, the mounting plate 11 has two mounting grooves 111, one support plate 211 is attached to each mounting groove 111, a first cooperating component is provided within the mounting groove 111, and a second cooperating component 212 is provided at the bottom of the support plate 211. Specifically, a mounting hole 112 for attaching the first cooperating component is provided on the bottom surface of the mounting groove 111.

[0070] In some specific embodiments, the first cooperating component is a magnet, and the second cooperating component 212 is a magnetic plate. The magnet is mounted in the mounting hole 112 of the mounting groove 111. When the support plate 211 is mounted in the corresponding mounting groove 111, the magnetic plate is attracted to the corresponding magnet, thereby mounting the support plate 211 in the mounting groove 111. In preferred embodiments, there are multiple first cooperating components and second cooperating components 212, with at least one first cooperating component installed in each second cooperating component 212, so that the first cooperating components are uniformly distributed in the mounting groove 111, thereby improving the stability of mounting the support plate 211. In another preferred embodiment, at least one guide post is provided in the mounting groove 111, and at least one guide hole is provided in the support plate 211, so that the support plate 211 is quickly mounted by the cooperation of the guide post and guide hole to guide the mounting process. Here, the retaining plate 221 is attached to the top of the mounting plate 11 by bolts, thereby creating a gap between it and the support plate 211.

[0071] In some specific embodiments, as shown in Figure 13, the retaining plate 221 is semicircular, and when two retaining plates 221 are joined together, an annular shape is formed.

[0072] When it is necessary to replace the limiting assembly, first loosen the bolts on the two retaining plates 221, remove the retaining plates 221 from the mounting plate 11, and since the support plate 211 is connected to the mounting plate 11 by magnetic attraction, after removing the retaining plates 221, the two support plates 211 can be directly removed, then the replacement support plate 211 is installed, and then the replacement retaining plates 221 is installed. This embodiment improves the efficiency of replacing the limiting assembly by connecting the support plate 211 and the mounting plate 11 using a magnetic attraction method.

[0073] In some specific embodiments, the chip loading device 100 further includes a manipulator 401 which is slidably mounted on a mounting base 301 and is configured to grasp the steel ring 210 of the wafer 200 from the container and slide under control, thereby causing the wafer 200 to slide in conjunction with the support plate 211 and the retaining plate 221 on the mounting plate 11 from the side of the limiting assembly. In other words, this embodiment can achieve limiting of the wafer 200 while loading the wafer 200, and since no other arrangement is required, the wafer loading step of the wafer 200 is simplified and inspection efficiency is improved.

[0074] In some specific embodiments, as shown in Figure 13, the first preset distance is greater than the width of the manipulator 401, so that after the manipulator 401 grasps the steel ring 210 of the wafer 200, it moves between the two retaining plates 221, thereby moving the wafer 200 in conjunction horizontally between the retaining plates 221 and the support plate 211. As the manipulator 401 pulls the steel ring 210 and moves it from the side of the limiting assembly to the limiting assembly, the steel ring 210 moves along the support surface 214 and contact surface 213 of the support plate 211 until it reaches the center position of the limiting assembly.

[0075] Figure 15 is a schematic structural diagram of a mounting assembly 101 according to one embodiment of the present invention. As shown in Figure 15, in some specific embodiments, the mounting assembly 101 further includes a first mounting platform 12, a second mounting platform 13, a cross roller bearing 14, a synchronous belt pulley 15, a synchronous belt 16, and a drive component 17. The mounting plate 11 is rotatably connected to the first mounting platform 12. The second mounting platform 13 is located below the first mounting platform 12. The cross roller bearing 14 is mounted on the second mounting base. The synchronous belt pulley 15 is connected to the cross roller bearing 14 and is also connected to the mounting plate 11 by at least one guide shaft 18. The synchronous belt 16 is fitted onto the synchronous belt pulley. The drive component 17 is connected to the synchronous belt 16, and the drive component 17 drives the synchronous belt 16 to rotate the synchronous belt pulley 15 in conjunction, thereby rotating the mounting plate 11 in conjunction with the guide shaft 18 relative to the first mounting platform 12, thereby adjusting the position of the wafer 200. In this embodiment, the component can meet the need for angled loading where the wafer 200 needs to be rotated at an angle such as 90° or 180°, and can adjust the position even after the wafer 200 has entered the chip loading device 100, making it smarter and meeting more needs in wafer inspection. Here, the component can rotate the wafer 200 in conjunction 360°.

[0076] In some specific embodiments, there are multiple guide shafts 18, which may be spaced apart along the circumferential direction of the mounting plate 11, thereby ensuring the stability of the mounting plate 11 as it rotates.

[0077] In this embodiment, as shown in Figures 13 and 15, the mounting plate 11 is circular, and an annular groove 113 is provided on the outer circumference of the mounting plate 11. The mounting assembly 101 further includes a plurality of driven wheels 122, which are mounted on a first mounting platform 12 and located within the annular groove 113, so as to roll along with the mounting plate 11 as it rotates. Here, a plurality of mounting components 121 are mounted on the first mounting platform 12, and one driven wheel 122 is mounted on each mounting component 121. In some specific embodiments, the number of driven wheels 122 is four, and the four driven wheels 122 are uniformly arranged on the outer circumference of the mounting plate 11.

[0078] Figure 16 is a schematic block diagram of a chip inspection system 1000 according to one embodiment of the present invention. As shown in Figure 16, the embodiment further provides a chip inspection system 1000 which includes a chip loading device 100 of any of the embodiments described above, a chip inspection device 300, and a chip unloading device 400. A detailed description of the chip loading device 100 is omitted here. The chip inspection device 300 is located on one side of the chip loading device 100 and is used to receive the chips to be inspected transported by the chip loading device 100 and to perform performance testing of the chips to be inspected. The chip unloading device 400 is located on the side of the chip inspection device 300 away from the chip loading device 100 and is used to receive and unload the chips to be inspected transported by the chip inspection device 300. In some embodiments, the chip inspection device 300 may be used to receive the chips to be inspected transported by the cantilever 31 of the chip loading device 100. In some embodiments, the chip inspection device 300 may also be used to receive the chip to be inspected, which has been transported by the transport mechanism of the chip loading device 100.

[0079] While this specification provides and describes in detail several exemplary embodiments of the present invention, those skilled in the art should understand that, without departing from the spirit and scope of the invention, many other variations or modifications that conform to the principles of the invention can still be directly determined or derived based on the content disclosed herein. Therefore, the scope of the present invention should be understood and determined to cover all such other variations or modifications. [Explanation of Symbols]

[0080] 1000 Chip Inspection System 100 Chip Loading Devices 200 wafers 210 Steel Ring 300 Chip Inspection Devices 400 Chip Unload Devices 10 Mounting base 20 Transport Assembly 30 Loading Assembly 40 Adsorption Assembly 50 First sliding assembly 60 Tape release assembly 70 Wafer Loading Equipment 90 Heating Assembly 21 Pair of slide rails 22 Mounting platform 23 Waste Tray 24 Restricted parts 241 Retaining plate 242 Support plate 25 Mounting plate 26 Chip supply assembly 31 Cantilever 32 Drive components 41 Suction nozzle 61. Second sliding assembly 62 motors 63 End Cam 64 rollers 65 Slide Blocks 66. Push-up needle cap 67. Upward thrusting needle 661 Through hole 71 Mounting plate 72 Restriction Blocks 81 Manipulator 82 Third sliding assembly 91 Exhaust vent 101 Mounting Assembly 11 Mounting plate 12. First mounting platform 13. Second mounting platform 14 Cross roller bearings 15 Synchronized belt pulley 16 Synchronized belt 17 Drive components 18 Guide axis 201 Bottom plate 220 Top plate 211 Support plate 221 Retaining plate 213 Contact surface 214 Support surface 301 Mounting base 121 Mounting parts 401 Manipulator 111 Mounting groove 112 mounting holes 212 Second collaborative component 122 Driven wheel 113 Ring groove

Claims

1. Mounting base and A transport assembly for transporting the chip to be inspected, which is attached to the aforementioned mounting base, A suction assembly attached to the mounting base for picking up the chip to be inspected on the transport assembly, A chip loading device comprising a loading assembly, which includes a cantilever, the cantilever having a first position for receiving the chip to be inspected held by the suction assembly and a second position for placing the chip to be inspected on a chip inspection device, and the cantilever being rotated under control to switch between the first and second positions, thereby transporting the chip to be inspected held by the suction assembly to the chip inspection device.

2. The chip loading device according to claim 1, wherein a gas passage for attracting the chip to be inspected is provided inside the cantilever, the gas passage is connected to a vacuum device, and the chip to be inspected is attracted by the gas passage when the vacuum device performs vacuuming.

3. The aforementioned loading assembly The chip loading device according to claim 2, further comprising a drive component connected to the cantilever, which is provided to be controlled to rotate the cantilever in conjunction with a first plane, the first plane being perpendicular to a horizontal plane.

4. The chip to be inspected has a first surface, The chip loading device according to claim 3, wherein the cantilever is provided to switch the first surface of the chip under inspection from upward to downward during the process of switching from the first position to the second position.

5. A chip loading device according to any one of claims 1 to 4, further comprising a first sliding assembly provided at the top of the transport assembly and connected to the suction assembly, used to move the suction assembly in conjunction with the transport assembly, thereby causing the suction assembly to pick up the chip to be inspected and transport the chip to the cantilever.

6. The aforementioned transport assembly A pair of slide rails attached to the mounting base and extending horizontally, A chip loading device according to any one of claims 1 to 4, comprising a mounting platform for mounting a wafer, the mounting platform having both ends slidably connected to corresponding slide rails and sliding in conjunction with the pair of slide rails to transport the wafer to a third position, the third position located at the bottom of the suction assembly, and the wafer including at least one of the chips to be inspected.

7. The chip loading device according to claim 6, further comprising a tape peeling assembly attached to the mounting base, wherein the tape peeling assembly is provided to peel the chip to be inspected on the wafer from the blue tape when the mounting base slides to its uppermost position along the pair of slide rails.

8. The tape release assembly, A push-up needle cap having at least one through hole at its uppermost part, the push-up needle cap being provided to move along the longitudinal direction under control, The chip loading device according to claim 7, comprising at least one push-up needle located inside the push-up needle cap, each of which push-up needles corresponds to one of the through holes and is provided to protrude from the push-up needle cap out of the corresponding through hole as the push-up needle cap moves downward, thereby pushing up the chip to be inspected and thereby separating the chip to be inspected from the blue tape.

9. The chip loading device according to claim 6, further comprising a heating assembly provided at the bottom of the mounting base, the heating assembly being provided to heat the bottom of the wafer on the mounting base when the mounting base slides to a fourth position according to the pair of slide rails, thereby causing the chip to be inspected to peel off the blue tape of the wafer.

10. The aforementioned mounting platform, Mounting plate and The chip loading device according to claim 6, further comprising a limiting component detachably mounted to the mounting plate for restricting the wafer.

11. The chip loading device according to claim 10, further comprising a manipulator slidably mounted to the mounting base, the manipulator being configured to grasp and control a wafer in the wafer loading device and slide it, thereby transporting the wafer to the limiting component.

12. It includes a mounting base and a transport mechanism slidably mounted to the mounting base, wherein the transport mechanism is A mounting assembly including a mounting plate, wherein at least one first cooperative component is provided on the mounting plate, A chip loading device comprising a bottom plate and a top plate that are removably attached to the mounting plate, wherein a limiting space for restricting a wafer is limited between the bottom plate and the top plate, and at least one second cooperative component is provided at the bottom of the bottom plate, thereby a limiting assembly that removably attaches the bottom plate to the mounting plate through the cooperation of the second cooperative component and the first cooperative component.

13. The chip loading device according to claim 12, wherein the bottom plate includes two support plates spaced apart, each support plate having a support surface positioned horizontally and a contact surface positioned vertically, the support surfaces of the two support plates together support the steel ring of the wafer, and the two contact surfaces each contact two opposing sides of the steel ring, thereby restricting the steel ring.

14. The chip loading device according to claim 13, wherein the upper plate includes two retaining plates positioned at a first predetermined distance apart, each retaining plate being mounted on the uppermost part of one support plate and positioned at a second predetermined distance from the corresponding support surface, with the wafer positioned between the retaining plate and the support plate.

15. The chip loading device according to claim 13, wherein the mounting plate has two mounting grooves, one support plate is attached to each mounting groove, the first cooperative component is provided in the mounting groove, and the second cooperative component is provided at the bottom of the support plate.

16. The chip loading device according to claim 12, wherein the first cooperating component is a magnet and the second cooperating component is a magnetic plate.

17. The chip loading device according to claim 14, further comprising a manipulator slidably mounted to the mounting base, the manipulator being provided to grasp the steel ring of the wafer from inside the container and slide under control, thereby causing the wafer to slide in conjunction with the support plate and the retaining plate on the mounting plate from the side of the limiting assembly.

18. The chip loading device according to claim 17, wherein the first preset distance is greater than the width of the manipulator, so that the manipulator, after grasping the steel ring of the wafer, moves between the two retaining plates, thereby moving the wafer in conjunction with the other horizontally between the retaining plates and the support plate.

19. The aforementioned mounting assembly, A first mounting platform, wherein the mounting plate is rotatably connected to the first mounting platform, A second mounting platform located below the first mounting platform, A cross roller bearing attached to the second mounting base, A synchronous belt pulley connected to the cross roller bearing and connected to the mounting plate by at least one guide shaft, The synchronous belt fitted onto the aforementioned synchronous belt pulley, The chip loading device according to any one of claims 12 to 18, further comprising a drive component connected to the synchronous belt, the drive component being provided to drive the synchronous belt to rotate the synchronous belt pulley in conjunction, thereby causing the mounting plate to rotate in conjunction with the guide shaft relative to the first mounting platform, thereby adjusting the position of the wafer.

20. An annular groove is provided on the outer circumference of the mounting plate, and the aforementioned mounting assembly is The chip loading device according to claim 19, further comprising a plurality of driven wheels attached to the first mounting platform and located within the annular groove, thereby rolling in accordance with the rotation of the mounting plate.

21. A chip loading device according to any one of claims 1 to 4, A chip inspection device provided on one side of the chip loading device, the chip inspection device receiving the chip to be inspected transported by the chip loading device and performing a performance test on the chip to be inspected, A chip inspection system comprising: a chip unloading device provided on the side of the chip inspection device away from the chip loading device, for receiving and unloading the chip to be inspected that has been transported by the chip inspection device.

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