Modular mass transfer packing system with integrated heat transfer

Modular mass transfer packing assemblies with integrated heat transfer capabilities address thermal inefficiencies in fluid contact operations by dynamically controlling temperature, improving efficiency and reducing costs.

JP2026520560APending Publication Date: 2026-06-23RES TRIANGLE INST
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
RES TRIANGLE INST
Filing Date
2024-06-05
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

Existing fluid contact operations face inefficiencies due to significant heat or endothermic effects that hinder mass transfer, requiring external cooling and thermal management, which complicates the operation and increases costs.

Method used

The integration of modular mass transfer packing assemblies with integrated heat transfer capabilities, utilizing heat transfer plates with internal passages and fluid flow circuits, allows for dynamic thermal control within fluid contact devices, enabling efficient heat removal or supply at exothermic or endothermic sites.

Benefits of technology

This solution enhances the efficiency of fluid contact processes by minimizing thermal effects, reducing vessel size, and lowering capital and operational costs through optimized thermal management.

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Abstract

This disclosure describes a heat and mass transfer assembly, which in various embodiments may be configured as a packing element comprising a plate array including heat transfer plates and mass transfer plates, the number of heat transfer plates and mass transfer plates may be changed to achieve a desired level of heat and mass transfer, and multiple packing elements may be assembled into a heat and mass transfer packing assembly to perform a wide variety of fluid contact processes.
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