Improved temperature-stable soft magnetic powder
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- BASF SE
- Filing Date
- 2024-05-29
- Publication Date
- 2026-06-23
Smart Images

Figure 2026520562000001 
Figure 2026520562000002 
Figure 2026520562000003
Abstract
Claims
1. A soft magnetic powder coated with a silicon coating, wherein the silicon coating is of formula (I) Si x B y O 2x+1.5y (I) (In the formula, x=0.5~1.5, y=1.0~1.5) A soft magnetic powder having a silicon coating is obtained after heat treatment at a temperature in the range of 350 to 700°C, with an average particle size D of 0.5 to 250 μm. 50 Having, Soft magnetic powder coated with a silicon coating.
2. A soft magnetic powder coated with a silicon coating according to claim 1, wherein the silicon coating has an average thickness of 2 to 100 nm as measured by transmission electron microscopy.
3. A soft magnetic powder coated with a silicon coating according to claim 1 or 2, wherein the silicon coating has a halogen content of less than 10.0 ppm, preferably less than 0.1 ppm.
4. The boron component of the coating is SiO 2 Embedded within the matrix, and / or SiO 2 A soft magnetic powder coated with a silicon coating according to any one of claims 1 to 3, which is bonded to the surface of the coating.
5. Particle size D is 1 to 50 μm, preferably 2 to 20 μm. 50 A soft magnetic powder coated with a silicon coating according to any one of claims 1 to 4, having the following characteristics.
6. A method for obtaining a soft magnetic powder coated with a silicon coating according to any one of claims 1 to 5, a) Soft magnetic powder, silicon precursor and formula II BX 3 (II) (wherein, X is H, OH, linear or branched C 1 ~C 6 alkyl, or linear or branched OC 1 ~C 6 selected from alkyl) A step of mixing with at least one boron compound, b) A step of subjecting the mixture from step a) to heat treatment at a temperature in the range of 350 to 700°C to obtain a soft magnetic powder coated with a silicon coating. Methods that include...
7. The method according to claim 6, wherein the heating in step b) is carried out for a period of 0.5 to 12 hours.
8. The method according to claim 6 or 7, wherein the silicon precursor is a silicon alkoxide, preferably selected from tetramethyl orthosilicate (TMOS), tetraethyl orthosilicate (TEOS), tetrapropyl orthosilicate, tetraisopropyl orthosilicate, or a mixture thereof.
9. The method according to any one of claims 6 to 8, wherein the boron compound is selected from trihydridoborane, boric acid, boronic acid, trimethyl borate, triethyl borate, triisopropyl borate, tributyl borate, tri-tert-butyl borate, or a mixture thereof.
10. The method according to any one of claims 6 to 9, wherein a soft magnetic powder is mixed with a silicon precursor, and a boron compound is added after the soft magnetic powder has been at least partially treated with the silicon precursor.
11. The method according to any one of claims 6 to 10, wherein the boron compound has a solubility in ethanol at 0°C of at least 15 wt%, preferably at least 20 wt%.
12. The method according to any one of claims 6 to 11, wherein the mixture in step a) has 0.01 to 1.5 moles of an organic borate compound per 1 kg of soft magnetic powder.
13. The method according to any one of claims 6 to 12, wherein the mixture in step a) has a molar ratio of the boron compound to the silicon precursor in the range of 1:5 to 5:
1.
14. A method for using a soft magnetic powder according to any one of claims 1 to 5 or a soft magnetic powder obtained from the method according to any one of claims 6 to 13 for the manufacture of electronic components.
15. An electronic component comprising a soft magnetic powder according to any one of claims 1 to 5 or a soft magnetic powder obtained by the method according to any one of claims 6 to 13.