Primer compositions, adhesive systems, and related processes

A primer composition using polyacrylate in an organic solvent with specific monomer ratios enhances adhesive properties by promoting strong bonding to substrates without heat or radiation, addressing the limitations of existing adhesive technologies.

JP2026521699APending Publication Date: 2026-07-013M INNOVATIVE PROPERTIES CO
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
3M INNOVATIVE PROPERTIES CO
Filing Date
2024-06-15
Publication Date
2026-07-01

AI Technical Summary

Technical Problem

Existing adhesive technologies often require heat, radiation, or reactive chemistry to achieve high bonding strength, and there is a need for primer compositions that provide improved adhesion to a variety of substrates without these additional steps.

Method used

A primer composition comprising polyacrylate dissolved in an organic solvent, containing specific percentages of methyl methacrylate, secondary amines, tertiary amines or tertiary amides, and acrylic monomer units with alkyl groups and carboxylic acid groups, which can be applied to substrates without requiring heat or radiation.

Benefits of technology

The primer composition enhances adhesive properties by providing strong bonding to various substrates without the need for heat or reactive chemistry, improving the adhesion of adhesive tapes to surfaces.

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Abstract

The primer composition comprises a polyacrylate dissolved in an organic solvent. The polyacrylate comprises at least 20% by weight of methyl methacrylate units, at least 15% by weight of monomer units comprising at least one of secondary amines, tertiary amines, or tertiary amides, at least 15% by weight of acrylic monomer units comprising an alkyl group having at least 4 carbon atoms, and 0.5 to 10% by weight of acrylic monomer units comprising a carboxylic acid group. The adhesive system comprises the primer composition and an adhesive tape. A method for producing the bonded article is also described.
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