A sound-conducting reverberation component driving rear-loaded speakers in wireless earphones

Abstract

To provide a wireless earphone rear-loaded speaker-driven sound conduction reverberation component that provides better sound quality, gives users a better experience, and allows the ear canal to be well ventilated, allowing external sounds to reach the ears. [Solution] A wireless earphone rear-loaded speaker-driven sound conduction reverberation component has a sound conduction reverberation component and a sound transmission path penetrating the entire housing at the front of the wireless earphone body, and a sealed cavity is provided below the rear of the motherboard, between the sound conduction reverberation component and the back shell, and the speaker is located within the sealed cavity. When worn, the annularly arranged sound outlets of the sound conduction reverberation component surround the ear canal, the sound transmission path faces the ear canal, and the speaker is located in the auricle above the ear canal. During operation, due to the sealed cavity, the original sound waves emitted from the speaker can only exit the sound outlet and are reflected and propagated multiple times within the sound transmission path, mixing with the air flowing within the sound transmission path. As a result, the original sound waves are superimposed multiple times to form reverberation sound waves.

Description

[Technical Field]

[0001] The present invention relates to a wireless earphone, and more particularly to a sound-transmitting reverberation component for driving a rear-load speaker in a wireless earphone. [Background technology]

[0002] Wireless earphones are very convenient small portable electronic devices that connect wirelessly to mobile phones and are used for audio input and output. When wearing wireless earphones, the forward position is when they are facing the ear canal, and the backward position is when they are facing above the ear canal or towards the outer pinna.

[0003] Currently available wireless earphones are equipped with a speaker and a motherboard, where the speaker is located in the front of the motherboard and electrically connected to it. This means that after wearing the wireless earphones, the speaker faces the user's ear canal, and the motherboard controls the sound emitted from the speaker, allowing the sound waves from the speaker to reach the ear canal directly, delivering the output audio to the user's ear. However, this front-speaker installation method has the following drawbacks: 1. When worn by a user, the speaker faces the ear canal, so a surface cover that completely covers the ear canal is necessary. However, this would allow the primary sound waves emitted from the speaker to directly reach the ear canal, preventing them from becoming reverberant sound waves. 2. The surface cover of wireless earphones completely covers the ear canal, providing excellent sound insulation from the outside world and allowing all sound waves to reach the ear canal. However, the ear canal does not allow air to pass through, and wearing the earphones for long periods of time can lead to bacterial growth in the ear canal, causing redness and swelling, and even inflammation of the ear membrane, which can cause tinnitus. 3. Currently, many users like to wear earphones while walking, but this poses a significant risk. For example, because earphones have a good sound insulation effect, when crossing the road, external sounds (such as vehicle speakers) cannot reach the ear canal through the earphones, which poses a significant safety risk. Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION The objective of the present invention is to provide a sound-transmitting reverberation component for driving a rear-loaded speaker in a wireless earphone to solve the deficiencies identified in the background art. [Means for solving the problem]

[0005] The present invention adopts the following technical solutions:

[0006] A wireless earphone rear-loaded speaker-driven sound-conducting reverberation component includes a wireless earphone main body, the wireless earphone main body housing of which includes a motherboard, a sound-conducting reverberation component, and a speaker. The sound-conducting reverberation component is attached to the front of the wireless earphone main body through a circular through-hole 1 at the front of the motherboard. The sound-conducting reverberation component has a hollow sound transmission path that passes through it. The sound transmission path located on the back shell side of the housing has sound output holes that are evenly arranged around the entire circumference. The sound-conducting reverberation component forms a sealed cavity with the space between it and the back shell below the rear of the motherboard. The speaker is located within the sealed cavity and electrically connected to the motherboard. When the earphone is worn, the sound output holes of the sound-conducting reverberation component located at the front of the wireless earphone main body surround the ear canal, the central sound transmission path faces the ear canal, and the speaker located at the rear of the wireless earphone main body is located in the auricle above the ear canal.

[0007] The sound conducting reverberation component includes an output sound conducting member, a sealing connecting member, and a sound conducting top cover.

[0008] The sound output conducting member is a hollow cylinder 1 with a hollow interior, the lower end surface of the hollow cylinder 1 being set in an arc-shaped opening 1, the back surface in close contact with the arc-shaped opening 1 being provided with a flat surface that protrudes around the entire circumference, the flat surface being provided with a plurality of sound output holes that penetrate the arc-shaped opening 1 and are evenly arranged in a ring shape, the outer end surfaces of the sound output holes being on the arc surface of the arc-shaped opening 1 and also being set in an arc shape. The upper end of the hollow cylinder 1 is provided with a locking portion 1 that is inclined inward.

[0009] The sealing connection member is a cylindrical connection groove with a hollow interior, a baffle provided at the lower end of the connection groove, a C-shaped opening provided on one side of the baffle, corresponding through holes provided on both sides of the C-shaped opening, and a step 1 protruding upward around the entire periphery of the inner wall of the connection groove.

[0010] The sound-conducting top cover is a hollow cylinder 2 with a hollow interior, the upper end surface of the hollow cylinder 2 is installed in the arc-shaped opening 2, the back surface that is in close contact with the arc-shaped opening 2 has a protruding locking edge around the entire circumference, and a downward-protruding step 2 is provided inside the cylinder at the lower end of the sound-conducting top cover.

[0011] The lower end of the hollow cylinder 2 of the sound-conducting top cover passes through the circular through-hole 1 at the front position of the motherboard and extends into the connecting groove of the seal connecting member, and the lower base of the sound-conducting top cover abuts on the step 1 on the inner wall of the connecting groove, where the charging post of the motherboard passes through the through-hole of the baffle of the seal connecting member. The upper end of the hollow cylinder 1 of the sound-outputting member is inserted into the connecting groove of the seal connecting member until the locking part 1 abuts on the step 2 of the sound-conducting top cover. A gap with a certain interval is provided between the baffle and the flat surface. The sound-outputting member, seal connecting member, and sound-conducting top cover are interconnected to form a sound-conducting reverberation component, where the hollow cylinder 1, the connecting groove, and the hollow interior of the hollow cylinder 2 are interconnected to form an audio transmission path.

[0012] The housing includes a front cover and a back shell, with corresponding circular through-holes 2 at the front of the front cover and back shell, facing the circular through-hole 1 at the front of the motherboard. The motherboard is attached to the back shell of the housing. The locking edge of the sound-conducting top cover abuts the inner edge of the circular through-hole 2 in the front cover, and the arc-shaped opening 2 is located in the circular through-hole 2 in the front cover. The outer edge of the lower end face of the flat surface of the sound-output conducting member abuts the inner edge of the circular through-hole 2 in the back shell, and the sound output hole on the arc-shaped opening 1 is located in the circular through-hole 2 in the back shell. The sound-conducting reverberation component forms a sealed cavity with the space between it and the back shell below the rear of the motherboard, and the speaker is located in the sealed cavity, with the edge of the speaker tightly fitting into the C-shaped opening of the sealing connecting member.

[0013] Preferably, the motherboard is provided with a predetermined operating program and electronic components.

[0014] Preferably, the back shell has two small through-holes facing the through-holes of the baffle, through which charging posts on the motherboard extend to contact the charging electrodes in the charging case for charging. The back shell has locking posts for fixing the motherboard when it is installed. The back shell and the front cover have corresponding locking portions for engaging and fixing the back shell and the front cover.

[0015] Preferably, the housing is connected to a battery end through a soft rubber ear hook, a battery is provided in the battery end, the battery is electrically connected to the motherboard through a connecting wire in the soft rubber ear hook, and the battery supplies power to the motherboard.

[0016] Preferably, the housing has an air intake hole on the front cover side and microphone pickup holes on both sides. [Effects of the Invention]

[0017] The present invention has the following advantageous effects: A sound-conducting reverberation component and a through-hole sound transmission path are provided at the front of the wireless earphone body, penetrating the entire housing. A sealed cavity is provided below the rear of the motherboard, between the sound-conducting reverberation component and the back shell, and a speaker is located within the sealed cavity. When worn, the annularly arranged sound outlets of the sound-conducting reverberation component surround the ear canal, the sound transmission path faces the ear canal, and the speaker is located in the auricle above the ear canal. During operation, due to the sealed cavity, the original sound waves emitted from the speaker can only exit the sound outlet and are reflected and propagated multiple times within the sound transmission path, mixing with the air flowing within the sound transmission path. This allows the original sound waves to overlap multiple times to form reverberation sound waves, improving sound quality and providing a better user experience. The through-hole sound transmission path allows excellent ventilation of the ear canal, allowing external sounds to reach the ear. The structure of the sound-transmitted reverberation component is simple, and all parts can be molded using a mold, allowing for mass production, and installation is also easy. [Brief explanation of the drawings]

[0018] [Figure 1] 2 is a schematic diagram of the back shell of the wireless earphone body of the present invention. [Figure 2] 1 is an exploded view of the wireless earphone body of the present invention; [Figure 3] 1 is a schematic diagram of the connection of the sound-transmitted reverberation component of the present invention; [Figure 4] FIG. 2 is a cross-sectional view of the present invention. [Figure 5] FIG. 2 is an exploded view of the sound-transmitted reverberation component of the present invention from another angle. [Figure 6] 2 is a diagram showing the correspondence between the sound-transmitted reverberation component and the housing of the present invention; FIG. [Figure 7] 2 is a schematic diagram of the front cover of the wireless earphone body of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Of course, the embodiments described here are not all the embodiments but only some of the embodiments of the present invention. All other embodiments that a person skilled in the art can obtain based on the embodiments of the present invention without any creative work are within the scope of protection of the present invention.

[0020] In addition, all directional indications in this invention (up, down, left, right, front, back, etc.) describe the relative positional relationships and movement conditions between each part in a specific posture (as shown in the drawings), and if that specific posture changes, the directional indications will also change accordingly.

[0021] Furthermore, the terms "first" and "second" are used to describe the present invention and are not understood to indicate or imply relative importance or the number of its technical features. Thus, the features qualifying "first" and "second" may explicitly or implicitly include one or more features. In describing the present invention, unless otherwise specified, "plurality" means two or more.

[0022] In the present invention, unless otherwise specified or limited, the terms "connection," "fixing," and "attachment" should be understood in a broad sense. For example, "fixing" may mean a fixed connection, a detachable connection, or an integral connection, a mechanical connection, an electrical connection, a direct connection, a connection via an intermediate, or an internal communication between two parts or an interactive relationship between two parts. Unless otherwise specified, a person skilled in the art can understand the specific meaning of the above terms in the present invention according to the actual situation.

[0023] As shown in Figures 1 to 7, a wireless earphone rear-load speaker-driven sound-conducting reverberation component includes a wireless earphone main body (100), and a motherboard (20), a sound-conducting reverberation component (30), and a speaker (40) are provided within the housing (10) of the wireless earphone main body (100). The sound-conducting reverberation component (30) is attached to the front position (100-1) of the wireless earphone main body (100) by passing through a circular through-hole (1(a)) at the front position (20-1) of the motherboard. The housing (10) has a hollow sound transmission path (34) that passes through the wireless earphone body (100), and the sound transmission path (34) located on the back shell (12) side of the housing (10) has sound output holes (314) that are evenly arranged around the entire circumference, and the sound conduction reverberation component (30) forms a sealed cavity (103) with the space between it and the back shell (12) below the rear position of the motherboard (20), and the speaker (40) is located within the sealed cavity (103) and is electrically connected to the motherboard (20). When wearing the earphone, the sound output hole (314) of the sound conduction reverberation component (30) at the front position (100-1) of the wireless earphone body (100) surrounds the ear canal, the central sound transmission path (34) faces the ear canal, and the speaker (40) at the rear position (100-2) of the wireless earphone body (100) is located in the auricle above the ear canal.

[0024] Connection of the sound-transmitted reverberation component (30) of the present invention

[0025] The sound conducting reverberation component (30) includes an output sound conducting member (31), a seal connecting member (32), and a sound conducting top cover (33).

[0026] The cylindrical body at the lower end of the sound conducting top cover 33 passes through the through-hole (a) at the front position (20-1) of the motherboard 20 and extends into the connecting groove (321) of the seal connecting member 32, and the lower base of the sound conducting top cover 33 abuts on the step 1 (3211) on the inner wall of the connecting groove (321). The charging post 23 on the motherboard 20 passes through the through-hole (b) of the baffle 322 of the seal connecting member 32. The upper end of the hollow cylindrical body 1 (311) of the sound output conducting member 31 is inserted into the connecting groove 321 of the seal connecting member 32 until the latch 1 (3111) abuts on the step 2 (3311) of the sound conducting top cover 33. This leaves a gap 323 with a predetermined distance between the baffle 322 and the flat surface 313. The sound output conductive member (31), the seal connecting member (32), and the sound conductive top cover (33) are interconnected to form a sound conductive reverberation component (30), wherein the hollow interiors of the hollow cylinder 1 (311) of the sound output conductive member (31), the connecting groove (321) of the seal connecting member (32), and the hollow cylinder 2 (331) of the sound conductive top cover (33) are interconnected to form a sound transmission path (34).

[0027] Formation of the closed cavity (103) of the present invention

[0028] The housing 10 includes a surface cover 11 and a back shell 12. The surface cover 11 and the back shell 12 have corresponding circular through-holes 1(c) at their front positions, facing the circular through-hole 2(a) located at the front position 20-1 of the motherboard 20. The motherboard 20 is mounted in the back shell 12 of the housing 10. The locking edge 333 of the sound-conducting top cover 33 abuts against the inner edge of the circular through-hole 2(11-c) of the surface cover 11, and its arc-shaped opening 2(332) is located in the circular through-hole 2(11-c) of the surface cover 11. The outer edge of the lower end surface of the flat surface 313 of the sound output conductive member 31 abuts against the inner edge of the circular through-hole 2 12-a of the backshell 12, and the sound output hole 314 on its arc-shaped opening 1 312 is located in the circular through-hole 2 12-a of the backshell 12. The charging posts 20 of the motherboard 20 extend through the through-holes 322 of the baffle 322 of the sealing connection member 32 and into the small through-holes 32 of the backshell 12. As a result, the upper side of the lower gap at the rear position 20-2 of the motherboard 20 is blocked by the motherboard 20, the right side is blocked by the sound-conducting reverberation component 30, the lower side is blocked by the backshell 12, and the left side is blocked by the left inner wall of the backshell 12, further forming a sealed cavity 103. The speaker is mounted below the rear position (20-2) of the motherboard (20) and is located within a sealed cavity (103).

[0029] The working principle of the present invention is as follows.

[0030] 1. Direction of the primordial sound waves emitted from the speaker

[0031] Once the information is received, the program on the motherboard controls the sound coming out of the speakers.

[0032] The speaker is located in a sealed cavity, so that the original sound waves emitted by the speaker can only propagate within the sealed cavity. First, they propagate directly in front of it, i.e., in the direction of the backshell, and are blocked by the backshell. Then, they propagate in the opposite direction toward the motherboard and baffle, and are similarly blocked by the motherboard and baffle. The right side is blocked by the sound-conducting reverberation component, and the left side is blocked by the inner wall of the backshell. Therefore, the sound waves can only propagate within the gap, and finally exit from the sound outlet on the flat surface below the gap.

[0033] 2. Formation of reverberation sound waves

[0034] When the wireless earphone body is worn, the sound output holes arranged in a ring shape at the front position are in the ear canal opening, and the sound transmission path faces the ear canal opening.

[0035] The original sound waves emitted from the speaker exit through the sound outlet. The outer end surface of the sound outlet and the arc-shaped opening of the sound conduction reverberation component are also arranged in an arc shape. The original sound waves emitted from the multiple sound outlets arranged in a circular pattern radiate and propagate in multiple directions around the surrounding area, and are reflected when they reach the corresponding symmetrical plane. The original sound waves can be reflected multiple times within the sound transmission path and mix with the air flowing through the sound transmission path. The original sound waves overlap multiple times in the air, forming reverberation sound waves, which reach the ear canal and reach the ear. In addition, the sound outlets arranged evenly in a circular pattern on the arc-shaped opening 1 allow the original sound waves to be emitted uniformly, which is beneficial to improving sound quality and hearing. The interior of the penetrating sound transmission path is hollow, which improves ventilation in the ear canal and allows external sounds to reach the ear, improving the user's ability to sense and judge external situations.

[0036] Why sound waves propagate through the air and overlap

[0037] This utilizes the superposition function of sound waves themselves. Two or more sound wave signals that do not interfere with each other can propagate through the air in the same medium, and the sound waves in each row can maintain their respective propagation rules so as not to interfere with each other. When the physical quantity of vibration at each point in the sound wave superposition area is equal to the vector sum of the physical quantities induced at that point by the sound waves in each row, a superposition of sound waves is formed, and a new waveform is generated. Multiple sound output holes arranged in a ring-like shape in the sound output conductive member generate multiple sound waves, which can mix and superpose with the air in the sound transmission path to form a mixed sound wave. This is a well-known physical principle and will not be described further here.

[0038] The above description is merely a preferred embodiment of the present invention and does not limit the present invention. Those skilled in the art can make various modifications and improvements to the present invention. Any modifications, alterations or equivalent replacements made without departing from the spirit of the present invention are intended to be protected by the present invention. [Explanation of symbols]

[0039] 100 - wireless earphone body, 100-1 - front position, 100-2 - rear position, 103 - sealed cavity, 10 - housing, 11 - surface cover, 111 - air intake hole, 112 - microphone pickup hole, 12 - back shell, c - circular through-hole 2, 11-c - circular through-hole 2 of surface cover, 12-c - circular through-hole 2 of back shell, d - small through-hole, 121 - locking post, 122 - locking part, 20 - motherboard, 20-1 - front position, 20-2 - rear position, a - circular through-hole 2, 23 - charging post, 30 - sound conduction reverberation component vent, 31—sound-conducting member, 311—hollow cylinder 1, 3111—locking portion 1, 312—arc-shaped opening 1, 313—flat surface, 314—sound-outlet hole, 32—sealing connecting member, 321—connecting groove, 3211—step 1, 322—baffle, 3221—C-shaped opening, c—through hole, 323—gap, 33—sound-conducting top cover, 331—hollow cylinder 2, 3311—step 2, 332—arc-shaped opening 2, 333—locking edge, 34—sound transmission path, 40—speaker, 50—soft rubber ear hook, 60—battery end, 61—battery, →sound wave transmission direction

Claims

1. 1. A wireless earphone rear-loaded speaker-driven sound-conducting reverberation component, comprising: A wireless earphone body (100) is included. The wireless earphone body (100) includes a housing (10) that includes a motherboard (20), a sound conduction reverberation component (30), and a speaker (40). The sound-transmitting reverberation component (30) is attached to the front portion (100-1) of the wireless earphone body (100) through the circular through-hole 1(a) at the front portion (20-1) of the motherboard (20), and The sound-conducting reverberation component (30) is provided with a hollow sound transmission path (34) therethrough; Here, the sound transmission path (34) located on the back shell (12) side of the housing (10) is provided with sound output holes (314) arranged evenly around the entire circumference in a ring shape, The sound-conducting reverberation component (30) forms a sealed cavity (103) between the backshell (12) and the space below the rear position (20-2) of the motherboard (20); The speaker (40) is located in the sealed cavity (103) and is electrically connected to the motherboard (20); When the earphone is worn, the sound outlet (314) of the sound conducting reverberation component (30) at the front position (100-1) of the wireless earphone body (100) surrounds the ear canal; The central sound transmission path (34) faces the ear canal, The speaker (40) at the rear position (100-2) of the wireless earphone body (100) is located in the pinna above the ear canal, The sound-conducting reverberation component (30) includes an output sound-conducting member (31), a sealing connection member (32), and a sound-conducting top cover (33); The sound output conductive member (31) is a hollow cylindrical body 1 (311) having a hollow interior, The lower end surface of the hollow cylindrical body 1 (311) is set in the arc-shaped opening 1 (312), The back surface of the circular arc opening 1 (312) is provided with a flat surface (313) that protrudes around the entire periphery. The flat surface (313) is provided with a plurality of sound output holes (314) that are evenly arranged in a ring shape and pass through the arc-shaped opening 1 (312), The outer end surface of the sound output hole (314) is on the arc surface of the arc-shaped opening 1 (312), which is also arranged in an arc shape; The hollow cylindrical body 1 (311) has an inwardly inclined locking portion 1 (3111) at the upper end thereof, The seal connection member (32) is a hollow cylindrical connection groove (321), A baffle (322) is provided at the lower end of the connecting groove (321), One side of the baffle (322) is provided with a C-shaped opening (3221), The C-shaped opening (3221) has corresponding through holes (b) on both sides thereof, The inner wall of the connecting groove (321) is provided with a step 1 (3211) that protrudes upward along the entire periphery, The sound-conducting top cover (33) is a hollow cylindrical body 2 (331) with a hollow interior, The upper end surface of the hollow cylindrical body 2 (331) is set in the arc-shaped opening 2 (332), A locking edge (333) is provided on the back surface that is in close contact with the arc-shaped opening 2 (332) and protrudes around the entire periphery. A step 2 (3311) protruding downward is provided in the cylindrical body at the lower end of the sound conducting top cover (33), The lower end of the hollow cylindrical body 2 (331) of the sound conducting top cover (33) passes through the circular through-hole 1 (a) at the front position (20-1) of the motherboard (20) and extends into the connecting groove (321) of the sealing connecting member (32); The lower base of the sound conducting top cover (33) abuts on the step 1 (3211) on the inner wall of the connecting groove (321), Here, the charging posts (23) of the motherboard (20) penetrate the through holes (b) of the baffles (322) of the seal connection member (32); The upper end of the hollow cylindrical body 1 (311) of the sound output conductive member (31) is inserted into the connecting groove (321) of the seal connecting member (32) until the locking portion 1 (3111) abuts against the step 2 (3311) of the sound conductive upper cover (33), A gap (323) having a fixed spacing is provided between the baffle (322) and the flat surface (313); The output sound conducting member (31), the sealing connection member (32) and the sound conducting top cover (33) are interconnected to form a sound conducting reverberation component (30); Here, the hollow interiors of the hollow cylinder 1 (311), the connecting groove (321), and the hollow cylinder 2 (331) communicate with each other to form an audio transmission path (34), The housing (10) includes a surface cover (11) and a back shell (12); The front cover (11) and the back shell (12) are provided with corresponding circular through holes 2(c) at their front positions, and Facing the circular through-hole 1(a) located at the front position (20-1) of the motherboard (20), The motherboard (20) is mounted in the backshell (12) of the housing (10); The locking edge (333) of the sound-conducting top cover (33) abuts against the inner edge of the circular through-hole 2 (11-c) of the surface cover (11); The arc-shaped opening 2 (332) is located in the circular through-hole 2 (11-c) of the surface cover (11); The outer edge of the lower end surface of the flat surface (313) of the sound output conductive member (31) abuts against the inner edge of the circular through-hole 2 (12-c) of the back shell (12), The sound output hole (314) on the circular arc-shaped opening 1 (312) is located in the circular through-hole 2 (12-c) of the back shell (12), The sound-conducting reverberation component (30) forms a sealed cavity (103) between the backshell (12) and the space below the rear position (20-2) of the motherboard (20); The speaker (40) is in a sealed cavity (103), The wireless earphone rear-load speaker-driven sound-conducting reverberation component is characterized in that the edge of the speaker (40) fits tightly into the C-shaped opening (3221) of the sealing connection member (32).

2. The wireless earphone rear-load speaker driven sound conduction reverberation component as claimed in claim 1, characterized in that the motherboard (20) is provided with a predetermined operating program and electronic components.

3. The back shell (12) is provided with two small through holes (d) facing the through holes (b) of the baffle, which are used for extending the charging posts (23) on the motherboard (20); The back shell (12) is provided with a locking post (121) which is used to fix the motherboard (20) when the motherboard (20) is installed; The wireless earphone rear-loaded speaker-driven sound-transmitting reverberation component according to claim 1, characterized in that the back shell (12) and the surface cover (11) are provided with corresponding locking portions (122), which are used to engage and fix the back shell (12) and the surface cover (11).

4. The housing (10) is connected to the battery terminal (60) via a soft rubber ear hook (50), A battery (61) is provided within the battery end (60), The wireless earphone rear-loaded speaker driven sound conduction reverberation component of claim 1, characterized in that the battery (61) is electrically connected to the motherboard (20) through a connecting wire in the soft rubber ear hook (50).

5. The wireless earphone rear-loaded speaker-driven sound conduction reverberation component according to claim 4, wherein the housing has an intake hole on the front cover side and a microphone pickup hole on both sides.

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