Irregularly shaped heat dissipation device
The irregularly shaped heat dissipation device with staggered columns and phase-change medium improves heat exchange efficiency, addressing the increased heat dissipation demands in 5G communication devices.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2023-07-19
- Publication Date
- 2026-03-17
AI Technical Summary
Existing heat dissipation technologies for communication devices, such as traditional radiators and heat pipes, are inadequate to meet the increasing heat dissipation demands due to model changes in today's 5G communication industry.
An irregularly shaped heat dissipation device with a substrate, cover plate, and fins, featuring a containment chamber, gas-liquid chamber, and staggered heat dissipation columns, utilizing phase-change working medium for enhanced heat exchange.
The device achieves higher heat exchange efficiency and capacity through turbulent flow and increased heat transfer area, addressing the heat dissipation challenges in electronic equipment due to model changes.
Smart Images
Figure 0003255131000001_ABST
Abstract
Description
Technical Field
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[0001] The present invention relates to the field of electronic heat dissipation technology, and more specifically, to a special-shaped heat dissipation device. This application claims the priority of a Chinese patent application filed with the China Patent Office on February 24, 2023, with an application number of 202320333514.3 and an invention-creation title of "Special-shaped Heat Dissipation Device", and all of its contents are incorporated herein by reference and combined with this application.
Background Art
[0002] Currently, the heat dissipation means of communication devices often adopt low-power radiators such as traditional two-piece members, aluminum extrusion (aluminum extrusion type heat dissipation members) + heat pipes, aluminum extrusion + VC (thermal equalization plates), etc. to achieve heat dissipation. In the process of realizing the present invention, the inventor found that there are at least the following problems in the prior art. That is, with the update of communication devices from generation to generation, the heat dissipation demand of the devices is also increasing. However, due to the short heat transport distance and low heat dissipation power of the above radiators, it is impossible to meet the heat dissipation demand of communication devices due to model changes, especially the heat dissipation demand of electronic devices used in today's 5G communication industry.
Summary of the Invention
Problems to be Solved by the Invention
[0003] As described above, how to solve the heat dissipation demand due to the model change of electronic devices in today's communication industry is an urgent problem that those skilled in the art should solve currently.
[0004] In view of this, the purpose of the present invention is to provide a special-shaped heat dissipation device that can improve the problem of heat dissipation demand due to the model change of electronic devices in today's communication industry.
Means for Solving the Problems
[0005] To achieve the above objectives, the present invention provides the following technical solution, namely, an irregularly shaped heat dissipation device comprising a substrate, a cover plate attached to the substrate, and fins provided on the cover plate, wherein the substrate and the cover plate are connected to form a containment chamber through which a phase change working medium flows, a heat source can be connected to the side of the substrate away from the cover plate, a slot is provided on the side of the cover plate away from the substrate, the fins are inserted into the slot, and a gas-liquid chamber communicating with the containment chamber is provided within the fins, and furthermore, at least two different sizes of heat dissipation columns are provided within the gas-liquid chamber, with multiple columns of each size provided, and the at least two different sizes of heat dissipation columns are distributed in a staggered manner as a whole.
[0006] Preferably, the heat dissipation columns of at least two different sizes are arranged such that the size of the heat dissipation columns gradually increases from the first side of the fin to the second side facing the first side, and the spacing between two heat dissipation columns of different rows is also gradually increasing from the first side of the fin to the second side facing the first side.
[0007] Preferably, a plurality of slots are provided on the side of the cover plate away from the substrate, and a plurality of fins are provided corresponding to these slots.
[0008] Preferably, grooves are provided in the substrate, and a plurality of reinforcing columns are provided within the grooves, arranged in a matrix.
[0009] Preferably, a barrier wall is formed within the substrate, a plurality of through holes are provided in the barrier wall, a first passage for the flow of a gaseous working medium and a second passage for the flow of a liquid working medium are formed in the slot of the cover plate, the first passage is provided corresponding to the first side of the barrier wall, the second passage is provided corresponding to the second side of the barrier wall, and passage openings are provided in the fin at positions corresponding to the first passage and the second passage, respectively.
[0010] Preferably, the substrate includes a first base and a second base, the cover plate includes a first cover member for the flow of a liquid working medium and a second cover member for the flow of a gaseous working medium, the first cover member is provided corresponding to the first base and the second cover member is provided corresponding to the second base, and the fins are provided with passage openings at positions corresponding to the first cover member and the second cover member, respectively.
[0011] Preferably, the first substrate and the second substrate are connected by a conduit.
[0012] Preferably, the system further includes a cover plate, and each of the fins is welded to the cover plate.
[0013] Preferably, the cover plate is provided with a plurality of openings, and the openings are square, pentagonal, hexagonal, or circular.
[0014] Preferably, the substrate, the cover plate, and the fins are integral brazed structural members, and the heat dissipation column is a cylinder, a regular triangular prism, a regular square prism, a regular pentagonal prism, or a regular hexagonal prism.
[0015] When using the irregularly shaped heat dissipation device provided by the present invention, when the heat source is activated, the phase-change working medium in the containment chamber absorbs the heat generated by the operation of the heat source, the working medium undergoes a phase change reaction and vaporizes, and the vaporized working medium enters the gas-liquid chamber of the fin from the containment chamber. Since the gas-liquid chamber has heat dissipation columns of different sizes and distributed in an offset manner, the working medium can realize a turbulent flow phenomenon inside the gas-liquid chamber, further reducing the vaporization resistance of the working medium and improving the liquefaction rate of the working medium. Furthermore, the heat dissipation columns are distributed in a staggered manner as a whole, making the formed flow paths more complex, allowing the working fluid to flow more sufficiently over the surface of the heat dissipation columns, increasing the heat exchange area, enabling more sufficient heat transfer and exchange of the working fluid, and further ensuring smoother exchange between the gaseous and liquid working fluids, thus guaranteeing more sufficient heat dissipation. In other words, the irregularly shaped heat dissipation device provided by the present invention, based on phase-change heat exchange, has heat dissipation columns of different sizes and distributed in a staggered manner within the fins, which enables the working fluid to realize a turbulent flow phenomenon on the fins, resulting in higher heat exchange efficiency, higher heat dissipation capacity than conventional heat sinks, and can further improve the heat dissipation demand due to model changes in electronic equipment in the telecommunications industry.
[0016] As described above, the irregularly shaped heat dissipation device provided by the present invention has a higher heat dissipation capacity and can improve the problem of heat dissipation demand due to model changes in electronic equipment in the current telecommunications industry. [Brief explanation of the drawing]
[0017] To more clearly explain the embodiments of the present invention or the technical concepts in the prior art, the following briefly introduces the drawings necessary for describing the embodiments or the prior art. Clearly, the drawings in the following description are merely embodiments of the present invention, and a person skilled in the art may obtain other drawings from the provided drawings, provided that they have not made efforts worthy of inventive step.
[0018] [Figure 1] This is a schematic diagram of the configuration of the irregularly shaped heat dissipation device provided by the present invention. [Figure 2] This is a schematic diagram of the fin configuration. [Figure 3] It is a schematic diagram of the structure of the substrate. [Figure 4] It is a schematic diagram of the operating principle of FIG. 1. [Figure 5] It is another schematic diagram of the structure of the irregular heat dissipation device. [Figure 6] It is a schematic diagram of the operating principle of FIG. 5. [Figure 7] It is another schematic diagram of the structure of the substrate. [Figure 8] It is yet another schematic diagram of the structure of the irregular heat dissipation device. [Figure 9] It is a schematic diagram of the operating principle of FIG. 8.
Embodiments for Carrying Out the Invention
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in connection with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained on the premise that those skilled in the art have not made inventive efforts all belong to the protection scope of the present invention.
[0020] The core of the present invention is to provide an irregular heat dissipation device that can improve the problem of heat dissipation demand due to model changes of electronic devices in the current communication industry.
[0021] Refer to FIGS. 1 to 9.
[0022] This specific embodiment provides an irregular heat dissipation device including a substrate 1, a cover plate 2 adhesively attached to the substrate 1, and fins 3 provided on the cover plate 2.
[0023] The substrate 1 and the cover plate 2 are connected to form an accommodation chamber that allows the working medium to flow. That is, the substrate 1 and the cover plate 2 form the accommodation chamber, which accommodates the working medium and allows the working medium to flow. The working medium accommodated in the accommodation chamber is a phase change working medium, and it can be understood that based on phase change heat exchange, the heat dissipation capacity of the heat dissipation device is improved.
[0024] A heat source 4 can be connected to the side of the substrate 1 that is away from (or separated from) the cover plate 2; that is, the heat source 4 can be attached to the side of the substrate 1 that is away from (or separated from) the cover plate 2, and a slot for housing the fins 3 is provided on the side of the cover plate 2 that is away from (or separated from) the substrate 1.
[0025] The fins 3 are inserted into slots, meaning they are attached to the cover plate 2 by a push-in connection. Inside the fins 3, there is a gas-liquid chamber that communicates with the containment chamber. Furthermore, three different sizes of heat dissipation columns 5 are provided inside the gas-liquid chamber, with multiple columns of each size, and these three different sizes of heat dissipation columns 5 are distributed in a staggered manner. The slots are connected to the containment chamber so that the gas-liquid chamber formed by the fins 3 can communicate with the containment chamber. That is, the fins 3 have openings, and the openings of the fins 3 communicate with the gas-liquid chamber and the containment chamber, respectively. The working medium that has absorbed heat in the containment chamber and undergone a phase change to a gas can enter the gas-liquid chamber through the openings of the fins 3. Furthermore, the working medium that has liquefied into a liquid in the gas-liquid chamber can circulate back into the containment chamber through the corresponding openings of the fins 3, thereby enabling the circulation of the working medium.
[0026] What needs to be explained is that, in order to facilitate processing, heat dissipation columns 5 of the same size are usually installed in the same area. Furthermore, in several other specific embodiments, it is possible to provide two different sizes of heat dissipation columns 5 in the gas-liquid chamber, with multiple columns of each size, and the two different sizes of heat dissipation columns 5 are distributed in a staggered manner overall. Although drawings of this configuration are not provided, those skilled in the art can clearly see how this solution is realized by referring to Figures 1 to 9. Alternatively, it is possible to provide four different sizes of heat dissipation columns 5 in the gas-liquid chamber, with multiple columns of each size, and the four different sizes of heat dissipation columns 5 are distributed in a staggered manner overall. Although drawings of this configuration are not provided, those skilled in the art can clearly see how this solution is realized by referring to Figures 1 to 9. Alternatively, it is possible to provide four or more different sizes of heat dissipation columns 5 in the gas-liquid chamber, without specifically describing or limiting them here. In other words, the irregularly shaped heat dissipation device provided by the present invention has at least two different sizes of heat dissipation columns 5 in the gas-liquid chamber of the fin 3, with multiple columns of each size, and the at least two different sizes of heat dissipation columns 5 are distributed in a staggered manner overall. Specifically, the arrangement of the heat dissipation columns 5 can be as follows, namely,
[0027] 1. Heat dissipation columns 5 of the same size are distributed in a matrix, and heat dissipation columns 5 of different sizes are distributed in a staggered manner, so that the at least two different sizes of heat dissipation columns 5 as a whole are distributed in a staggered manner.
[0028] 2. The heat dissipation columns 5 of the same size are distributed in a staggered manner, and the heat dissipation columns 5 of different sizes are also distributed in a staggered manner, so that the at least two different sizes of heat dissipation columns 5 as a whole are distributed in a staggered manner.
[0029] 3. The heat dissipation columns 5 of the same size are distributed in a staggered manner, and the heat dissipation columns 5 of different sizes are distributed in a matrix, so that the at least two different sizes of heat dissipation columns 5 as a whole are distributed in a staggered manner. The arrangement of the heat dissipation columns 5 is not particularly limited, as long as they are distributed in a staggered manner as a whole.
[0030] Preferably, multiple slots are provided on the side of the cover plate 2 that is away from (or separates from) the substrate 1, and multiple fins 3 are provided correspondingly to these slots, with each fin 3 being inserted and installed corresponding to one slot. Furthermore, the fins 3 are provided perpendicular to the cover plate 2. Of course, in some other specific embodiments, the fins 3 do not have to be perpendicular to the cover plate 2, that is, the angle between the fins 3 and the cover plate 2 is not a right angle. The present invention does not specifically limit how the fins 3 and the cover plate 2 are attached, as long as it satisfies the requirements.
[0031] What needs to be explained is that the number of fins 3 and the slots for housing the fins 3 can be flexibly adjusted as needed. The fins 3 are constructed by connecting two sheet metals, and a mature press process is used to press-form the sheet metals, creating multiple support column structures on the sheet metals. The two sheet metals and the support column structures formed on the two sheet metals are then welded together to form the fins 3. In other words, since the fins 3 are produced using a low-cost and mature press process, the manufacturing cost of the equipment can be reduced.
[0032] In actual operation, the shape, configuration, size, material, etc., of the substrate 1, cover plate 2, and fin 3 can be determined according to the actual situation and requirements.
[0033] Furthermore, the heat dissipation fins of the irregularly shaped heat dissipation device can be adjusted according to the actual situation and requirements. For example, in situations where the heat dissipation demand is lower, the irregularly shaped heat dissipation device can use some solid fins instead of some fins, thus meeting the heat dissipation demand while reducing costs.
[0034] The irregularly shaped heat dissipation device provided by the present invention is generally placed vertically, that is, mounted along the direction of gravity, or at a certain angle with respect to the vertical direction, for example, 5°. This angle must not be too large, otherwise it will affect the normal use of the heat dissipation device. In actual operation, the irregularly shaped heat dissipation device can be installed according to the actual situation and requirements. When using the irregularly shaped heat dissipation device provided by the present invention, the working medium in the containment chamber absorbs the heat from the operation of the heat source 4, the working medium undergoes a phase change reaction and vaporizes, and the vaporized working medium (i.e., steam) enters the gas-liquid chamber of the fins 3 from the containment chamber. Since the gas-liquid chamber has heat dissipation columns 5 of different sizes and distributed offset as a whole, the working medium can realize a turbulent flow phenomenon inside the gas-liquid chamber, further reducing the vaporization resistance of the working medium and improving the liquefaction rate of the working medium. Furthermore, because the heat dissipation columns 5 within the gas-liquid chamber are distributed in a staggered manner, the resulting flow paths become more complex, allowing the working fluid to flow more sufficiently over the surface of the heat dissipation columns 5. This increases the heat exchange area, enabling more efficient heat transfer and exchange of the working fluid. Moreover, it ensures smoother exchange between the gaseous and liquid working fluids, resulting in more sufficient heat dissipation. In other words, the irregularly shaped heat dissipation device provided by the present invention, based on phase-change heat exchange, features heat dissipation columns 5 of different sizes and distributed in a staggered manner within the fins 3, allowing the working fluid to achieve turbulent flow on the fins 3. This results in higher heat exchange efficiency, higher heat dissipation capacity than conventional heat sinks, and can also address the problem of heat dissipation demands due to model changes in electronic equipment in the communications industry.
[0035] As described above, the irregularly shaped heat dissipation device provided by the present invention has a higher heat dissipation capacity and can improve the problem of heat dissipation demand due to model changes in electronic equipment in the current telecommunications industry.
[0036] Based on the above embodiment, preferably, the substrate 1, cover plate 2, and fins 3 are integral brazed structural members. After the substrate 1 and cover plate 2 are bonded together and installed, the multiple fins 3 are inserted into their corresponding slots, and after assembling all the members, the entire structure is brazed in a tunnel furnace to form an integral brazed structural member.
[0037] Preferably, the heat source 4 is provided in the first portion of the substrate 1, and in this specific embodiment, the first portion of the substrate 1 is the lower region of the substrate 1, that is, the heat source 4 is provided in the lower region of the substrate 1.
[0038] Preferably, the heat dissipation columns 5 of different sizes described above gradually increase in size from the first side of the fin 3 to the second side opposite the first side, that is, the size of the heat dissipation columns 5 gradually increases from the first side of the fin 3 to the second side opposite the first side, and the spacing between two heat dissipation columns 5 in different rows gradually increases from the first side of the fin 3 to the second side opposite the first side. In this specific embodiment, the first side of the fin 3 is the upper side of the fin 3, and the second side is the lower side of the fin 3, that is, the heat dissipation columns 5 of different sizes described above gradually increase in size from the upper side of the fin 3 to the lower side, and the spacing between two heat dissipation columns 5 in different rows gradually increases from the upper side of the fin 3 to the lower side, that is, the heat dissipation columns 5 on the upper side of the fin 3 are small in size and densely distributed, and the heat dissipation columns 5 on the lower side of the fin 3 are large in size and sparsely distributed.
[0039] What needs to be explained is that when the heat source 4 starts operating, the working medium, which absorbs the heat from the heat source 4 and undergoes a phase change to vaporize, can enter the gas-liquid chamber of the fin 3 from the containment chamber. Since the gas-liquid chamber has heat dissipation columns 5 of different sizes and distributed in an offset manner, the working medium can generate turbulence within the gas-liquid chamber, which reduces the vaporization resistance of the working medium and increases the liquefaction rate. Furthermore, the heat dissipation columns 5 within the gas-liquid chamber are distributed in a staggered manner, making the flow paths formed within the gas-liquid chamber more complex. This allows the working medium to flow more sufficiently over the surface of the heat dissipation columns 5, resulting in sufficient heat transfer and exchange. As the gas working medium vaporizes upward, there is more gas and less liquid at the bottom, but the opposite is true at the top. This results in higher air pressure at the bottom of the fins 3 and lower air pressure at the top. The lower heat dissipation columns 5 are installed to be larger and have sparser flow paths, while the upper heat dissipation columns 5 are installed to be smaller and have denser flow paths. This achieves a balance in the phase change between the gas-liquid two phases, making gas-liquid exchange smoother and heat dissipation more efficient. In addition, the heat dissipation columns 5 not only increase the heat exchange area but also support the gas-liquid chambers of the fins 3, improving the strength of the fins 3 and preventing dents from forming in the positions corresponding to the gas-liquid chambers of the fins 3.
[0040] Preferably, the heat dissipation column 5 is a cylinder, a regular triangular prism, a regular square prism, a regular pentagonal prism, or a regular hexagonal prism. By employing columnar structures of different dimensions and arranging them within the chamber of the fins 3 so that they are offset from each other as a whole, the phase change heat exchange efficiency of the working medium in the fins 3 is increased, and the specific size, shape, number, position, etc. of the heat dissipation column 5 can be selected according to the actual heat dissipation requirements.
[0041] Preferably, a groove is provided in the substrate 1, and multiple reinforcing columns 6 are provided in the groove, arranged in a matrix. That is, in order to improve the strength of the structure, the inside of the substrate 1 can be reinforced with reinforcing columns 6 of similar dimensions, and there is only one chamber inside the substrate 1, in which a gaseous working medium and a liquid working medium are mixed, and after the substrate 1 and the cover plate 2 are connected, the chamber and the cover plate surround the above-mentioned containment chamber, and further, the flow path formed is surrounded between two adjacent reinforcing columns 6 inside this chamber.
[0042] Preferably, a barrier wall 7 is formed within the substrate 1, and the barrier wall 7 can divide the groove within the substrate 1 into two parts, and a plurality of through holes 8 are provided in the barrier wall 7 so that the two parts separated by the barrier wall 7 can communicate, and a first passage 9 for the flow of a gaseous working medium and a second passage 10 for the flow of a liquid working medium are formed in the slot of the cover plate 2, the first passage 9 is provided corresponding to the first side of the barrier wall 7, and the second passage 10 is provided corresponding to the second side of the barrier wall 7 In this specific embodiment, the first side of the barrier wall 7 is the lower side of the barrier wall 7, and the second side of the barrier wall 7 is the upper side of the barrier wall 7, that is, the first passage 9 is provided corresponding to the lower side of the barrier wall 7, and the second passage 10 is provided corresponding to the upper side of the barrier wall 7. The fin 3 is provided with passage openings 11 corresponding to the positions of the first passage 9 and the second passage 10, respectively. Its structure is shown in Figure 5, and the flow process of each type of working medium is shown in Figure 6, furthermore, the direction of the arrow indicates the flow direction of the working medium.
[0043] What needs to be explained is that by adding a barrier wall 7 to the substrate 1, the gaseous working medium generated by vaporization due to the phase change reaction within the containment chamber can enter the second passage 10 directly from the top of the substrate 1, preventing obstruction of liquid circulation. This allows for orderly gas-liquid phase change and minimizes the resistance that the vaporization of the working medium imposes on the liquefied fluid. The purpose of providing multiple through holes 8 in the barrier wall 7 is to allow the liquid generated by the liquefaction of the gaseous working medium within the fins 3 to enter the top of the substrate 1 through the second passage 10, and then to circulate to the bottom of the substrate 1 through the through holes 8, thereby achieving a gas-liquid phase change balance.
[0044] Furthermore, the slots in the cover plate 2 form a first passage 9 and a second passage 10 that are spaced apart from each other in order to achieve gas-liquid separation, allowing both the gaseous working medium and the liquid working medium to pass through separate passages. Additionally, the fins 3 are provided with two opening passages 11 at positions corresponding to the two passages in the slots of the cover plate 2. As a result, the barrier wall 7 divides the substrate 1 into two parts, and these two parts undergo a phase change in the circulation of the working medium through four through-holes 8, effectively preventing the gas from directly vaporizing from the lower part of the substrate 1 to the upper part, which would affect the thermal efficiency. After the heat source 4 is started, the working medium passes through the vapor path 19 - liquid path 20 - through-holes 8 - vapor path 19 in that order to achieve phase change heat exchange. Moreover, the upper part A of the fins is mainly where the liquid working medium circulates, and the lower part B of the fins is mainly where the gaseous working medium circulates.
[0045] Preferably, the substrate 1 includes a first base 12 and a second base 13, and the cover plate 2 includes a first cover member 14 for the flow of a liquid working medium and a second cover member 15 for the flow of a gaseous working medium, the first cover member 14 being provided corresponding to the first base 12 and the second cover member 15 being provided corresponding to the second base 13, and the fins 3 are provided with passage openings 11 at positions corresponding to the first cover member 14 and the second cover member 15, respectively, the structure is shown in Figure 8, the flow process of each type of working medium is shown in Figure 9, and furthermore, the direction of the arrows indicates the flow direction of the working medium.
[0046] What needs to be explained is that the substrate 1 is divided into two chambers, a first base 12 and a second base 13, and the lid plate 2 is divided into two components, a first lid member 14 and a second lid member 15. The vapor generated by the phase change reaction caused by the heat absorption of the working fluid in the first base enters the fins 3 through the second lid member 15, the condensed liquid passes through the first lid member 14 and enters the first base 12, and finally the liquid in the first base 12 can be circulated back to the second base 13, thus performing a cyclical back-and-forth heat exchange operation. Furthermore, the reason for dividing the substrate 1 into two independent chambers is to completely separate the gas and liquid due to the phase change of the working fluid, and to achieve the purpose of long-distance transport.
[0047] Preferably, the first base 12 and the second base 13 are connected by a conduit 16. That is, the chambers of the first base 12 and the second base 13 are separated from each other and connected by the conduit 16. The gaseous working medium and the liquid working medium can operate in different chambers, reducing the problem of self-heat transfer between the gaseous and liquid two phases in the same chamber. Since the heat source 4 is located below the substrate 1, the second base 13 mainly contains the gaseous working medium and the first base 12 mainly contains the liquid working medium. Therefore, there is a pressure difference between the first base 12 and the second base 13, allowing the working medium to achieve a good phase change balance. At the same time, the length and size of the conduit 16 can be adjusted according to the requirements of the equipment, achieving the purpose of far-end heat dissipation.
[0048] Preferably, the system further includes a cover plate 17, and each fin 3 is welded to the cover plate 17. That is, the cover plate 17 and all the fins 3 can be welded together, so that the heat from the fins 3 is directly transferred to the cover plate 17, the cover plate 17 acts as an auxiliary heat sink, the heat dissipation area of the working medium can be further increased, and the cover plate 17 can also serve to protect the fins 3.
[0049] Preferably, the cover plate 17 is provided with a plurality of openings 18, which are arranged to correspond to the spacing between two adjacent fins 3. Furthermore, the openings 18 of the cover plate 17 are square, pentagonal, hexagonal, or circular. It is understood that by providing a plurality of openings 18 in the cover plate 17, they form a chimney effect with the fins 3, thereby accelerating the convection velocity of the hot air.
[0050] It should be further explained that by using the uniquely shaped heat dissipation device provided by this invention, the need for far-end heat dissipation in large equipment can be solved, and the high power consumption demands during model changes of communication equipment can be met. Furthermore, as the product manufacturing process has matured and become reliable, and we are approaching bulk delivery, this device not only facilitates bulk processing and manufacturing, but also reduces the manufacturing cost of the device and guarantees product quality.
[0051] What needs to be explained is that, regarding the first passage 9 and the second passage 10 described in the documents of this application, the designation of "first" and "second" is solely to distinguish their location, and does not indicate any distinction in priority.
[0052] Furthermore, it should be explained that the directions or positional relationships indicated by "up," "down," etc. in this application are based on the directions or positional relationships shown in the drawings, and are merely for the purpose of simplifying the description and facilitating understanding. They do not indicate or imply that the shown device or element has a specific direction, or that it must be configured and operated in a specific direction, and therefore should not be understood as limiting the present invention.
[0053] Each example in this specification is described progressively, with each example emphasizing its differences from the others, and any identical or similar parts between the examples should be referenced to one another. Any combination of all the examples provided in this invention is within the scope of protection of this invention and will not be described further here.
[0054] The modified heat dissipation device provided by the present invention has been described in detail above. This text explains the principles and embodiments of the present invention using specific examples, and the above description of the examples is used solely to aid in understanding the methods and core ideas of the present invention. It should be noted that, provided that those skilled in the art do not depart from the principles of the present invention, several improvements and modifications are possible, and these improvements and modifications also fall within the scope of protection of the claims of the present invention. [Explanation of Symbols]
[0055] 1 ··· circuit board; 2...Lid plate; 3. Finn; 4...Heat source; 5...heat dissipation column; 6. Reinforcement columns; 7. Barrier wall; 8...Through hole; 9...The first aisle; 10...Second passage; 11...Aisle entrance; 12 ···First substrate; 13...Second substrate; 14. First lid member; 15...Second lid member; 16 ... conduit; 17 ···Cover plate; 18...hole; 19. Steam pathways; 20 ··· fluid pathways; A... upper fin; B...Fin bottom.
Claims
1. The apparatus includes a substrate (1), a cover plate (2) attached to the substrate (1), and fins (3) provided on the cover plate (2), wherein the substrate (1) and the cover plate (2) are connected to form a containment chamber through which a phase change working medium flows, a heat source (4) can be connected to the side of the substrate (1) away from the cover plate (2), a slot is provided on the side of the cover plate (2) away from the substrate (1), the fins (3) are inserted into the slot, and a gas-liquid chamber communicating with the containment chamber is provided within the fins (3). Furthermore, the irregularly shaped heat dissipation device is characterized in that at least two different sizes of heat dissipation columns (5) are provided in the gas-liquid chamber, multiple heat dissipation columns (5) of each size are provided, and the at least two different sizes of heat dissipation columns (5) are distributed in a staggered manner overall.
2. The irregularly shaped heat dissipation device according to claim 1, characterized in that the size of the heat dissipation columns (5) of at least two different sizes is gradually increased from the first side of the fins (3) toward the second side facing the first side, and the spacing between two heat dissipation columns (5) of different rows is gradually increased from the first side of the fins (3) toward the second side facing the first side.
3. The irregularly shaped heat dissipation device according to claim 1, characterized in that a plurality of slots are provided on the side of the cover plate (2) that is away from the substrate (1), and a plurality of fins (3) are provided corresponding to these slots.
4. The irregularly shaped heat dissipation device according to any one of claims 1 to 3, characterized in that a groove is provided in the substrate (1), and a plurality of reinforcing columns (6) are provided in the groove in a matrix-like manner.
5. The irregularly shaped heat dissipation device according to claim 4, characterized in that a barrier wall (7) is formed in the substrate (1), a plurality of through holes (8) are provided in the barrier wall (7), a first passage (9) for the flow of a gaseous working medium and a second passage (10) for the flow of a liquid working medium are formed in the slot of the cover plate (2), the first passage (9) is provided corresponding to the first side of the barrier wall (7), the second passage (10) is provided corresponding to the second side of the barrier wall (7), and the fin (3) is provided with passage openings (11) at positions corresponding to the first passage (9) and the second passage (10), respectively.
6. The irregularly shaped heat dissipation device according to any one of claims 1 to 3, characterized in that the substrate (1) includes a first base (12) and a second base (13), the cover plate (2) includes a first cover member (14) for the flow of a liquid working medium and a second cover member (15) for the flow of a gaseous working medium, the first cover member (14) is provided corresponding to the first base (12), the second cover member (15) is provided corresponding to the second base (13), and the fin (3) is provided with passage openings (11) at positions corresponding to the first cover member (14) and the second cover member (15), respectively.
7. The irregularly shaped heat dissipation device according to claim 6, characterized in that the first base (12) and the second base (13) are connected by a conduit (16).
8. The irregularly shaped heat dissipation device according to claim 1, further comprising a cover plate (17), wherein each of the fins (3) is welded and fixed to the cover plate (17).
9. The cover plate (17) is provided with a plurality of openings (18), The irregularly shaped heat dissipation device according to claim 8, characterized in that the opening (18) is a regular square hole, a regular pentagonal hole, a regular hexagonal hole, or a circular hole.
10. The substrate (1), the cover plate (2), and the fin (3) are integral brazed structural members. The irregularly shaped heat dissipation device according to claim 1, characterized in that the heat dissipation column (5) is a cylinder, a regular triangular prism, a regular square prism, a regular pentagonal prism, or a regular hexagonal prism.