Detachable plastic sheet layer and wood layer multi-layer composite dual-interface smart card

Abstract

This invention provides an environmentally friendly, multi-layer composite dual-interface smart card with a biodegradable plastic sheet layer and a wood layer, where the card substrate is primarily made of biodegradable wood and biodegradable plastic materials. [Solution] A multilayer composite dual-interface smart card comprising a disassemblable plastic sheet layer and a wood layer includes an INLAY layer, a top substrate layer and a bottom substrate layer laminated on the top and bottom surfaces of the INLAY layer, respectively. The INLAY layer includes at least one composite unit a formed by a wood layer sandwiching a disassemblable plastic sheet layer. A radio frequency coil and a dual-interface smart card chip are provided in at least one disassemblable plastic sheet layer of the INLAY layer. The top substrate layer and the bottom substrate layer are a top wood layer 70 and a bottom wood layer 80, respectively, and the top wood layer is provided with a second through-hole that exposes the contact surface of the dual-interface smart card chip. The INLAY layer of the dual-interface smart card is manufactured from the wood layer and the disassemblable plastic sheet layer, and the top wood layer and bottom wood layer are laminated to the top and bottom surfaces of the INLAY layer.

Description

Technical Field

[0001] The present invention relates to the technical field of smart cards, and particularly to a multilayer composite dual interface smart card with a decomposable plastic sheet layer and a wood layer.

Background Art

[0002] A smart card is a medium for identifying an individual and storing individual information, and has the characteristics of a large information storage capacity and high security. Various smart cards are widely applied in daily life, and examples thereof include, but are not limited to, various work permits, identity certificates, financial transaction cards, membership cards, transportation cards, access cards, etc. Conventional dual interface smart cards are usually composed of a plastic layer and a rigid material layer. An antenna is embedded in the plastic layer, and mounting holes are provided in the rigid material layer. By sealing an IC chip on a plastic plate with an embedded antenna, the IC chip is correctly mounted on the plastic layer, and the position and function of the antenna are ensured. Next, the plastic plate is milled to form an appropriate shape and structure, and it is ensured that the mounting positions of the IC chip and other components are accurate. Thereafter, the rigid material plate is adhered to one side of the plastic plate so that the IC chip is located within the mounting hole of the rigid material layer and the electrical contacts of the IC chip are exposed on the surface of the smart card. By this process, the stability of the card body and the accurate position of the IC chip are ensured. Conventional dual interface smart cards adopt a structure in which an intermediate INLAY layer is laminated with upper and lower plastic layers. The card base material of a smart card manufactured by a pure plastic layer is not environmentally friendly in the production and processing process, and a plastic smart card lacks texture, so it is necessary to further optimize and improve conventional smart cards.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In view of this, the present invention proposes a multilayer composite dual-interface smart card consisting of a detachable plastic sheet layer and a wood layer. By employing multiple layers of wood and multiple layers of detachable plastic sheet, the manufactured dual-interface smart card achieves environmental friendliness through the use of detachable materials and provides the card with a wood grain texture through the wood layer, thereby improving the consumer experience. [Means for solving the problem]

[0004] The technical solution disclosed in this invention is a multilayer composite dual-interface smart card comprising a disassemblable plastic sheet layer and a wood layer, including an INLAY layer, a top substrate layer and a bottom substrate layer laminated on the top and bottom surfaces of the INLAY layer, respectively. The INLAY layer includes at least one composite unit in which a wood layer sandwiches a decomposable plastic sheet layer, and at least one of the decomposable plastic sheet layers of the INLAY layer is provided with a radio frequency coil and a dual interface smart card chip, and the wood layer above the dual interface smart card chip, or the wood layer and the decomposable plastic sheet layer, is provided with a first through hole into which the dual interface smart card chip is fitted, and the top substrate layer and bottom substrate layer are a top wood layer and a bottom wood layer, respectively, and the top wood layer is provided with a second through hole that exposes the contact surface of the dual interface smart card chip.

[0005] Furthermore, the INLAY layer includes a first composite unit, the first composite unit includes a first disassemblable plastic sheet layer, a first wood layer and a second wood layer laminated on the upper and lower surfaces of the first disassemblable plastic sheet layer, the first disassemblable plastic sheet layer is provided with the radio frequency coil via an ultrasonic embedding device, and the first wood layer is provided with a first through-hole.

[0006] Preferably, the INLAY layer further includes a second composite unit laminated on the top or bottom surface of the first composite unit, the second composite unit including a second disassemblable plastic sheet layer, a third wood layer and a fourth wood layer laminated on the upper and lower surfaces of the second disassemblable plastic sheet layer, respectively.

[0007] Furthermore, the first and second composite units constitute an entire multilayer composite unit that is stacked. When the second composite unit is stacked on the bottom surface of the first composite unit, the second composite unit omits the third wood layer, and a second disassemblable plastic sheet layer and a fourth wood layer are laminated to the bottom surface of the first composite unit in that order. When the second composite unit is stacked on the top surface of the first composite unit, the second composite unit omits the fourth wood layer, and a second disassemblable plastic sheet layer and a third wood layer are laminated to the top surface of the first composite unit in that order.

[0008] Furthermore, a third and fourth disassemblable plastic sheet layer are laminated to the surfaces of the top and bottom wood layers, respectively, and a third through-hole is provided in the third disassemblable plastic sheet layer at a position corresponding to the second through-hole.

[0009] Furthermore, the thickness of the first, second, third, and fourth detachable plastic sheet layers is 0.05 mm to 0.06 mm, the thickness of the first, second, third, and fourth wood layers is 0.17 mm to 0.35 mm, and the thickness of the top and bottom wood layers is 0.3 mm to 0.35 mm.

[0010] Furthermore, the first, second, third, and fourth disassemblable plastic sheet layers are made of one of the following materials: a disassemblable PVC sheet, a disassemblable PET sheet, a disassemblable ABS sheet, and a disassemblable PC sheet. [Effects of the Invention]

[0011] The beneficial effects of the dual-interface smart card designed in this invention are as follows: The INLAY layer of the smart card is manufactured by sandwiching a biodegradable plastic sheet layer between multiple layers of wood, and the top and bottom surfaces of the INLAY layer are laminated with top and bottom wood layers, respectively. This realizes that the structure of the entire card base material of the smart card is manufactured by combining wood material and a biodegradable plastic sheet layer, making it more environmentally friendly when the smart card is disposed of or after card replacement and collection. The bending resistance standards are met by laminating and bonding the multiple layers of wood and biodegradable plastic sheet layers alternately. Furthermore, the top and bottom wood layer laminations of this invention, which sandwich the INLAY layer, give the wood layer of the entire card base material of the smart card a wood grain texture, improving the consumer user experience. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic diagram of the structure of the first composite unit of the INLAY layer of the present invention. [Figure 2] This is a schematic diagram of the structure of the second composite unit of the INLAY layer of the present invention. [Figure 3] This is a schematic exploded view of the structure of Example 1 of the first composite unit and second composite unit laminate structure of the INLAY layer of the present invention. [Figure 4] This is a schematic exploded view of the structure of Example 2 of the first composite unit and second composite unit laminate structure of the INLAY layer of the present invention. [Figure 5] This is a schematic diagram of the structure of the dual-interface smart card of the present invention. [Figure 6] This is a cross-sectional view of the structure of Embodiment 1 of the dual-interface smart card of the present invention. [Figure 7] This is a cross-sectional view of the structure of Embodiment 2 of the dual-interface smart card of the present invention. [Figure 8]This is a cross-sectional view of the structure of Embodiment 3 of the dual-interface smart card of the present invention. [Modes for carrying out the invention]

[0013] The following will clearly and completely describe the technical concepts in the embodiments of this disclosure with reference to the drawings, but obviously, the embodiments described are only a selection of the embodiments of this disclosure, not all of them. All other embodiments obtained by those skilled in the art without any creative work based on the embodiments of this disclosure are also within the scope of protection of this disclosure.

[0014] Please refer to Figures 1 to 8. The present invention provides a multilayer composite dual-interface smart card comprising a disassemblable plastic sheet layer and a wood layer, which includes an INLAY layer, a top substrate layer and a bottom substrate layer laminated on the top and bottom surfaces of the INLAY layer, respectively. The INLAY layer includes at least one composite unit formed by sandwiching a disassemblable plastic sheet layer between wood layers, and at least one disassemblable plastic sheet layer of the INLAY layer is provided with a radio frequency coil and a dual-interface smart card chip 200, and the wood layer above the dual-interface smart card chip 200, or the wood layer and the disassemblable plastic sheet layer, is provided with a first through-hole for fitting the dual-interface smart card chip 200, and the top substrate layer and bottom substrate layer are a top wood layer 70 and a bottom wood layer 80, respectively, and the top wood layer 70 is provided with a second through-hole that exposes the contact surface of the dual-interface smart card chip 200. In this solution, a wood layer is sandwiched between layers of biodegradable plastic sheets to create an INLAY layer, and the wood layer is sandwiched between layers of INLAY layers to create a dual-interface smart card. The overall card substrate is mainly made of alternating layers of wood and biodegradable plastic sheets, meeting the bending resistance standards. Furthermore, it is more environmentally friendly in terms of disposal of the smart card or processing after card replacement and collection. In addition, the wood grain of the wood layer can improve the texture of the smart card and enhance the consumer's card usage experience.

[0015] Refer to Figures 1, 5, and 6. This is Embodiment 1 of the dual-interface smart card of the present invention, wherein the INLAY layer includes a first composite unit a, the first composite unit a includes a first disassemblable plastic sheet layer 10, a first wood layer 20 laminated on the upper and lower surfaces of the first disassemblable plastic sheet layer 10, and a second wood layer 30, the first disassemblable plastic sheet layer 10 being provided with the radio frequency coil via an ultrasonic embedding device, and the first wood layer 20 being provided with a first through hole. The first composite unit a is laminated as an INLAY layer to a top wood layer 70 and a bottom wood layer 80, and a third disassemblable plastic sheet layer 90 and a fourth disassemblable plastic sheet layer 100 are laminated to the surfaces of the top wood layer 70 and the bottom wood layer 80, respectively.

[0016] Refer to Figure 2. The INLAY layer further includes a second composite unit b laminated on the top or bottom surface of the first composite unit a, the second composite unit b including a second disassemblable plastic sheet layer 40, a third wood layer 50 laminated on the top and bottom surfaces of the second disassemblable plastic sheet layer 40, and a fourth wood layer 60, respectively. The first composite unit a and the second composite unit b, as two separate units manufactured, require thinning of the corresponding third wood layer 50 and fourth wood layer 60 if a laminated combination is required. In addition, to meet the requirements for smart card thickness, the surfaces of the top wood layer 70 and bottom wood layer 80 are lightly polished before laminating the third disassemblable plastic sheet layer 90 and fourth disassemblable plastic sheet layer 100 to the top wood layer 70 and bottom wood layer 80, respectively.

[0017] Please refer to Figures 1-3, 5, and 7. This is Embodiment 2 of the dual-interface smart card of the present invention, in which the first composite unit a and the second composite unit b are INLAY layers formed by the entire stacked multilayer composite unit, and when the second composite unit b is stacked on the lower surface of the first composite unit a, the second composite unit b omits the third wood layer 50, and the bottom surface of the first composite unit a is laminated with a second disassemblable plastic sheet layer 40 and a fourth wood layer 60 in order. The top surface of the first wood layer 20 and the bottom surface of the fourth wood layer 60 are laminated with a top wood layer 70 and a bottom wood layer 80, respectively, and the surfaces of the top wood layer 70 and the bottom wood layer 80 are laminated with a third disassemblable plastic sheet layer 90 and a fourth disassemblable plastic sheet layer 100, respectively, and a third through hole is provided in the third disassemblable plastic sheet layer 90 at a position corresponding to the second through hole.

[0018] Please refer to Figures 1-2, 4-5, and 8. This is Embodiment 3 of the Dual Interface Smart of the present invention, in which the first composite unit a and the second composite unit b are INLAY layers formed by the entire stacked multilayer composite unit, and when the second composite unit b is stacked on the upper surface of the first composite unit a, the second composite unit b omits the fourth wood layer 60, and the top surface of the first composite unit a is laminated with a second disassemblable plastic sheet layer 40 and a third wood layer 50 in order. The top surface of the third wood layer 50 and the bottom surface of the second wood layer 30 are laminated with a top wood layer 70 and a bottom wood layer 80, respectively, and the surfaces of the top wood layer 70 and bottom wood layer 80 are laminated with a third disassemblable plastic sheet layer 90 and a fourth disassemblable plastic sheet layer 100, respectively, and a third through hole is provided in the third disassemblable plastic sheet layer 90 at a position corresponding to the second through hole.

[0019] Preferably, the thicknesses of the first decomposable plastic sheet layer 10, the second decomposable plastic sheet layer 40, the third decomposable plastic sheet layer 90, and the fourth decomposable plastic sheet layer 100 are all 0.05 mm to 0.06 mm, the thicknesses of the first wood layer 20, the second wood layer 30, the third wood layer 50, and the fourth wood layer 60 are all 0.17 mm to 0.35 mm, and the thicknesses of the top wood layer 70 and the bottom wood layer 80 are all 0.3 mm to 0.35 mm. The first decomposable plastic sheet layer 10, the second decomposable plastic sheet layer 40, the third decomposable plastic sheet layer 90, and the fourth decomposable plastic sheet layer 100 adopt any one of decomposable PVC sheets, decomposable PET sheets, decomposable ABS sheets, and decomposable PC sheets. In actual production, for the control of the overall thickness of the dual-interface smart card, it is necessary to polish the overall thickness to an appropriate thickness with the top wood layer 70 and the bottom wood layer 80.

[0020] As described above, each embodiment of the present disclosure has been described. However, the above description is exemplary, not comprehensive, and is not limited to each disclosed embodiment. Many modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The selection of the terms used in this specification is intended to best explain the principles of each embodiment, the actual use, or the improvement of the technology in the market, or to enable those skilled in the art to understand each embodiment disclosed in this specification.

Claims

1. A multilayer composite dual-interface smart card comprising a removable plastic sheet layer and a wood layer, including an INLAY layer, a top substrate layer and a bottom substrate layer laminated on the top and bottom surfaces of the INLAY layer, respectively, The INLAY layer comprises at least one composite unit formed by sandwiching a decomposable plastic sheet layer between two wood layers, the INLAY layer being provided with a radio frequency coil and a dual interface smart card chip (200), the wood layer above the dual interface smart card chip (200), or the wood layer and the decomposable plastic sheet layer being provided with a first through-hole for fitting the dual interface smart card chip (200), the top substrate layer and the bottom substrate layer being a top wood layer (70) and a bottom wood layer (80), respectively, and the top wood layer (70) being provided with a second through-hole for exposing the contact surface of the dual interface smart card chip (200), characterized in that a multilayer composite dual interface smart card of a decomposable plastic sheet layer and a wood layer.

2. The INLAY layer includes a first composite unit (a), the first composite unit (a) includes a first disassemblable plastic sheet layer (10), a first wood layer (20) and a second wood layer (30) laminated on the upper and lower surfaces of the first disassemblable plastic sheet layer (10), the first disassemblable plastic sheet layer (10) is provided with the radio frequency coil via an ultrasonic embedding device, and the first wood layer (20) is provided with a first through hole, characterized in that the multilayer composite dual interface smart card of a disassemblable plastic sheet layer and a wood layer according to claim 1.

3. The multilayer composite dual interface smart card of a disassemblable plastic sheet layer and a wood layer according to claim 2, wherein the INLAY layer further includes a second composite unit (b) laminated on the top or bottom surface of the first composite unit (a), and the second composite unit (b) includes a second disassemblable plastic sheet layer (40), a third wood layer (50), and a fourth wood layer (60) laminated on the upper and lower surfaces of the second disassemblable plastic sheet layer (40), respectively.

4. The first composite unit (a) and the second composite unit (b) constitute the entire stacked multilayer composite unit, When the second composite unit (b) is laminated on the lower surface of the first composite unit (a), the second composite unit (b) omits the third wood layer (50), and the bottom surface of the first composite unit (a) is laminated with a second detachable plastic sheet layer (40) and a fourth wood layer (60) in that order. The multilayer composite dual interface smart card of a disassemblable plastic sheet layer and a wood layer according to claim 3, characterized in that when the second composite unit (b) is laminated on the upper surface of the first composite unit (a), the second composite unit (b) omits the fourth wood layer (60), and a second disassemblable plastic sheet layer (40) and a third wood layer (50) are sequentially laminated on the top surface of the first composite unit (a).

5. The multilayer composite dual interface smart card of a disassemblable plastic sheet layer and a wood layer according to claim 4, characterized in that a third disassemblable plastic sheet layer (90) and a fourth disassemblable plastic sheet layer (100) are laminated to the surfaces of the top wood layer (70) and the bottom wood layer (80), respectively, and a third through hole is provided in the third disassemblable plastic sheet layer (90) at a position corresponding to the second through hole.

6. The multilayer composite dual interface smart card of disassemblable plastic sheet layers and wood layers according to claim 5, characterized in that the thickness of the first disassemblable plastic sheet layer (10), the second disassemblable plastic sheet layer (40), the third disassemblable plastic sheet layer (90), and the fourth disassemblable plastic sheet layer (100) is all 0.05 mm to 0.06 mm, the thickness of the first wood layer (20), the second wood layer (30), the third wood layer (50), and the fourth wood layer (60) is all 0.17 mm to 0.35 mm, and the thickness of the top wood layer (70) and the bottom wood layer (80) is all 0.3 mm to 0.35 mm.

7. The multilayer composite dual interface smart card of a disassemblable plastic sheet layer and a wood layer according to claim 6, characterized in that the first disassemblable plastic sheet layer (10), the second disassemblable plastic sheet layer (40), the third disassemblable plastic sheet layer (90), and the fourth disassemblable plastic sheet layer (100) are made of any of the following: a disassemblable PVC sheet, a disassemblable PET sheet, a disassemblable ABS sheet, and a disassemblable PC sheet.

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