Heat dissipation structure of mobile power supplies

Abstract

This provides a heat dissipation structure for mobile power supplies. [Solution] The heat dissipation structure of the mobile power supply comprises a heat equalization plate 1, a heat dissipation member, a fan 6, and an intake port 4 and an exhaust port 5 provided in the housing of the mobile power supply. The heat equalization plate 1 is thermally connected to the heat-generating components inside the mobile power supply, the heat dissipation member is heat-conductively connected to the heat equalization plate 1, the connection portion between the heat equalization plate 1 and the heat dissipation member constitutes a heat exchange region, the heat dissipation member is located in the heat exchange region and includes a heat dissipation extension portion 12 to increase the heat dissipation area, the configuration of the heat dissipation extension portion 12 forms an exhaust air passage 3, the fan 6 directs airflow in from the intake port 4, passes it through the exhaust air passage 3 in the heat exchange region, performs heat exchange with the heat dissipation member, and then discharges it from the exhaust port 5.

Description

Technical Field

[0001] The present invention relates to the field of power supply technology, and particularly to the heat dissipation structure of mobile power supplies.

Background Art

[0002] When a mobile power supply is in use, components such as internal coil members, battery members, and circuit board members generate a large amount of heat through energy conversion. The conventional heat dissipation structure mainly adopts natural convection or a simple passive heat dissipation method and relies only on heat dissipation through the contact between the housing and air. Therefore, there is a problem of low heat dissipation efficiency. As a result, heat is likely to accumulate inside, local high temperatures occur, which not only causes a decrease in charge and discharge efficiency, but also accelerates the deterioration of components, shortening the service life of the product, and may even cause safety problems. In addition, in the conventional structure, the air flow path is not reasonably designed, and it is difficult to release heat to the outside uniformly and quickly, and there is a problem that it cannot meet the heat dissipation requirements of high-power mobile power supplies.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In view of the above-mentioned drawbacks of the prior art, the purpose of the present invention is to provide a heat dissipation structure for mobile power supplies.

Means for Solving the Problems

[0004] In order to solve the above problems, the present invention adopts the following configuration.

[0005] The heat dissipation structure of the mobile power supply of the present invention includes a heat pipe, a heat dissipation member, a fan, an air intake and an air exhaust provided on the housing of the mobile power supply.

[0006] The heat pipe is thermally connected to the heat-generating components inside the mobile power supply.

[0007] The heat dissipation member is connected to the heat equalization plate in a heat conduction manner, and the connection portion between the heat equalization plate and the heat dissipation member jointly constitutes a heat exchange region. The heat dissipation member is located in the heat exchange region and includes a heat dissipation extension portion for increasing the heat dissipation area, and the configuration of the heat dissipation extension portion forms an exhaust air passage.

[0008] The fan directs airflow from the intake port, passes it through the exhaust air passage in the heat exchange region, performs heat exchange with the heat dissipation member, and then discharges it from the exhaust port.

[0009] Preferably, the housing of the mobile power supply includes a bottom case and a panel connected to the bottom case.

[0010] Preferably, the heat dissipation extension is a group of heat dissipation fins, and the gaps between the heat dissipation fins constitute a part of the exhaust air passage.

[0011] Preferably, the system further includes an intake air passage, the intake air passage being located between the intake port and the fan.

[0012] Preferably, the intake air passage is configured to be thermally conductively connected to the circuit board inside the mobile power supply.

[0013] Preferably, the heat dissipation member and the heat equalization plate are fixedly connected to form an integrated structure.

[0014] Preferably, the material of the heat-distributing plate includes, but is not limited to, VC heat-distributing plate, graphene, copper, and aluminum.

[0015] Preferably, the heat-generating component includes a coil member, a battery member, and a circuit board member. [Effects of the Invention]

[0016] This invention enables the rapid and uniform diffusion of localized heat generated from heat-generating components such as coil members, battery members, and circuit board members by thermally connecting the heat distribution plate to the heat-generating components inside the mobile power supply. This suppresses the generation of localized high temperatures and effectively prevents degradation of component performance and damage caused by localized heat accumulation.

[0017] Furthermore, by connecting the heat dissipation member to the heat equalization plate in a heat conduction manner to form a heat exchange area, increasing the heat dissipation area with the heat dissipation expansion section, and forming an exhaust air passage with the configuration of the heat dissipation expansion section, the airflow can come into sufficient contact with the heat dissipation member, thereby improving the heat exchange efficiency.

[0018] Furthermore, by using a fan to draw airflow in through the intake port, passing it through the exhaust air passage, and then expelling it through the exhaust port, a stable forced convection heat dissipation circulation can be formed. This airflow circulation allows for the rapid removal of heat from the heat dissipation components to the outside, significantly improving the heat dissipation rate. [Brief explanation of the drawing]

[0019] [Figure 1] This is a schematic diagram showing the general configuration of the heat dissipation structure of the mobile power supply according to the present invention. [Figure 2] This is a schematic diagram showing the heat dissipation structure of a mobile power supply according to the present invention, with the bottom case removed. [Figure 3] This is an exploded perspective view of the heat dissipation structure of the mobile power supply according to the present invention. [Figure 4] This is a schematic diagram showing the connection relationship between the heat dissipation plate and the circuit board member in the heat dissipation structure of the mobile power supply according to the present invention. [Figure 5] This is a schematic diagram showing the connection relationship between the heat dissipation plate and the coil member in the heat dissipation structure of the mobile power supply according to the present invention. [Figure 6] This is a schematic diagram showing the connection relationship between the heat distribution plate and the heat dissipation extension section in the heat dissipation structure of a mobile power supply according to the present invention. [Modes for carrying out the invention]

[0020] Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 6. This embodiment specifically describes the heat dissipation structure of the mobile power supply of the present invention.

[0021] The heat dissipation structure of the mobile power supply includes a heat pipe 1, a heat dissipation member, a fan 6, an air intake port 4 and an air exhaust port 5 provided on the housing of the mobile power supply. The housing of the mobile power supply includes a bottom case 7 and a panel 8 connected to the bottom case 7.

[0022] The material of the heat pipe 1 includes, but is not limited to, a VC heat pipe, graphene, copper and aluminum.

[0023] The heat pipe 1 is thermally connected to the heat generating components inside the mobile power supply, and the heat generating components include a coil member 9, a battery member 10 and a circuit board member 11.

[0024] The heat dissipation member is thermally conductively connected to the heat pipe 1, and the connection part between the heat pipe 1 and the heat dissipation member jointly constitutes a heat exchange area. The heat dissipation member is located in the heat exchange area and includes a heat dissipation expansion part 12 for increasing the heat dissipation area, and an exhaust air duct 3 is formed by the structure of the heat dissipation expansion part 12.

[0025] Furthermore, an intake air duct 2 is provided, and the intake air duct 2 is arranged between the intake port 4 and the fan 6. The fan 6 allows air flow to flow in from the intake port 4, passes through the exhaust air duct 3 in the heat exchange area, and after performing heat exchange with the heat dissipation member, discharges from the exhaust port 5.

[0026] The heat pipe 1 is directly thermally conductively connected to the heat generating components of the coil member 9, the battery member 10 and the circuit board member 11 inside the mobile power supply. When the heat generating components operate to generate heat, the heat pipe 1 uniformly diffuses local heat to prevent the occurrence of local high temperatures.

[0027] When the heat equalization plate 1 employs a VC heat equalization plate, the interior of the heat equalization plate 1 has a vacuum-sealed space, a capillary structure is formed on the inner wall, and a low-boiling-point working fluid is sealed inside. When heat is transferred to the space, the working fluid is heated and evaporates, absorbing heat and forming vapor. This vapor diffuses into the low-temperature region within the space under a vacuum environment, is then cooled and condenses, and releases heat. The condensed liquid flows back to the heating side due to capillary force, forming a heat conduction cycle due to phase change.

[0028] When the heat distribution plate 1 uses graphene material, its two-dimensional honeycomb lattice structure allows phonon conduction and electron conduction to work synergistically, rapidly diffusing heat in the in-plane direction and suppressing the generation of localized high temperatures.

[0029] If the heat equalization plate 1 is made of a metal material such as copper or aluminum, the high thermal conductivity of the metal material allows heat to be quickly transferred to the entire heat equalization plate, achieving a uniform heat distribution.

[0030] The heat dissipation member is connected to the heat equalization plate 1 in a heat-conductive and fixed manner, forming an integrated structure. The connection between the heat equalization plate 1 and the heat dissipation member jointly constitutes a heat exchange region. The heat dissipation extension 12 provided on the heat dissipation member is located within this heat exchange region. The heat dissipation extension 12 has the structure of a group of heat dissipation fins, and the gaps between each heat dissipation fin constitute part of the exhaust air passage 3. The heat dissipation fins improve the heat exchange efficiency through their heat dissipation surface, and the configuration of the heat dissipation extension 12 defines the flow path shape and flow space of the exhaust air passage 3, ensuring that the airflow makes sufficient contact with the heat dissipation member.

[0031] The housing of the mobile power supply consists of a bottom case 7 and a panel 8, and the housing is provided with an air intake 4 and an exhaust 5. The air intake passage 2 is located between the air intake 4 and the fan 6. The air intake passage 2 has the function of guiding the airflow and reducing flow rate loss, and is also connected to the circuit board member 11 inside the mobile power supply in a heat conduction manner, thereby further improving the overall heat dissipation performance by providing localized heat dissipation to the circuit board member 11.

[0032] When the fan 6 is activated, a pressure difference is created, and cold air from outside flows in through the intake port 4, is guided by the intake air passage 2, and passes through the fan 6. The cold air then flows into the exhaust air passage 3 of the heat exchange region, comes into contact with the heat dissipation fins within the exhaust air passage 3, absorbs the heat transferred to the heat dissipation member via the heat equalization plate 1, and performs heat exchange. After heat exchange, the air is heated and becomes warm air, which is then discharged to the outside of the housing through the exhaust port 5 by the action of the fan 6. As the temperature of the heat exchange region decreases, heat from the heat-generating components continues to be supplied to the heat exchange region via the heat equalization plate 1, thus forming a continuous heat dissipation circulation and effectively controlling the temperature inside the mobile power supply.

[0033] The heat dissipation extension section 12 is configured as a group of heat dissipation fins, and the gaps between each heat dissipation fin constitute part of the exhaust air passage 3.

[0034] The heat dissipation extension section 12 employs a group of heat dissipation fins to increase the heat dissipation area and improve heat exchange efficiency. It also utilizes the gaps between the fins to form part of the exhaust air passage 3, straightening the airflow as it passes through and ensuring sufficient contact with the heat dissipation surface, thereby achieving rapid heat transfer and dissipation. The heat dissipation fins are made of a metal material and uniformly distribute the heat transferred from the heat equalization plate 1 to the heat dissipation member across the entire fin. When the airflow driven by the fan 6 flows through the exhaust air passage 3 formed by the gaps between the fins, the airflow comes into contact with the surface of the heat dissipation fins, and heat exchange occurs as the heat from the fins is carried out.

[0035] The intake air passage 2 is configured to be thermally conductively connected to the circuit board member 11 inside the mobile power supply.

[0036] The intake air passage 2 is positioned between the intake port 4 and the fan 6, and by rectifying and introducing the airflow from the outside, it reduces flow loss and ensures that the airflow flows stably into the fan 6.

[0037] Furthermore, the intake air passage 2 receives localized heat generated in the circuit board member 11 by conduction and performs localized heat dissipation to the circuit board member 11, thereby suppressing performance degradation due to localized heat accumulation. The heat dissipation member is fixedly connected to the heat equalization plate 1, forming an integrated structure.

[0038] This integrated structure reduces contact thermal resistance during the heat conduction process, allowing for efficient and rapid heat transfer. The heat dissipation member and the heat equalization plate 1 are tightly connected by fixing means such as welding or snap-fitting, and are integrated together. The heat equalization plate 1 can directly and rapidly transfer heat received from heat-generating components such as the coil member 9, battery member 10, and circuit board member 11 to the heat dissipation member, thereby suppressing heat loss caused by gaps in the connection.

[0039] The above is merely a preferred embodiment of the present invention, and equivalent modifications and alterations within the scope of the utility model registration claims of the present invention all fall within the scope of the present invention. Furthermore, any person with ordinary skill in the art may make various changes, modifications, etc., without departing from the spirit of the present invention, and such changes, modifications, etc., shall also be included within the scope of the present invention. [Explanation of Symbols]

[0040] 1 Soaking plate 2 Intake air passage 3. Exhaust air passage 4. Air intake 5. Exhaust vent 6 Fans 7 Bottom case 8 panels 9. Coil component 10 Battery components 11 Circuit board components 12 Heat dissipation expansion section

Claims

1. It comprises a heat distribution plate (1), a heat dissipation member, a fan (6), and an air intake (4) and an exhaust port (5) provided in the casing of the mobile power supply, The heat distribution plate (1) is thermally connected to the heat-generating components inside the mobile power supply. The heat dissipation member is connected to the heat equalization plate (1) in a heat conduction manner, and the connection portion between the heat equalization plate (1) and the heat dissipation member constitutes a heat exchange region. The heat dissipation member is located in the heat exchange region and includes a heat dissipation extension (12) for increasing the heat dissipation area, and the configuration of the heat dissipation extension (12) forms an exhaust air passage (3). The fan (6) directs airflow from the intake port (4) through the exhaust air passage (3) of the heat exchange region, performs heat exchange with the heat dissipation member, and then discharges the air from the exhaust port (5). A heat dissipation structure for a mobile power supply, characterized by the following features.

2. The housing of the mobile power supply includes a bottom case (7) and a panel (8) connected to the bottom case (7). The heat dissipation structure for a mobile power supply according to feature 1.

3. The heat dissipation extension (12) is a group of heat dissipation fins, and the gaps between the heat dissipation fins constitute a part of the exhaust air passage (3). The heat dissipation structure for a mobile power supply according to feature 1.

4. Furthermore, it is provided with an intake air passage (2), the intake air passage (2) is located between the intake port (4) and the fan (6). The heat dissipation structure for a mobile power supply according to feature 1.

5. The intake air passage (2) is connected to the circuit board component inside the mobile power supply in a way that allows for thermal conductivity. The heat dissipation structure for a mobile power supply according to feature 4.

6. The heat dissipation member is fixedly connected to the heat equalization plate (1), forming an integrated structure. The heat dissipation structure for a mobile power supply according to feature 1.

7. The material of the heat-distributing plate (1) includes VC heat-distributing plate, graphene, copper, or aluminum. The heat dissipation structure for a mobile power supply according to feature 1.

8. The heat-generating component includes a coil member (9), a battery member (10), and a circuit board member (11). The heat dissipation structure for a mobile power supply according to feature 1.

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