Thermosetting resin composition for semiconductor packaging and prepreg using the same

Abstract

The present invention relates to a thermosetting resin composition for semiconductor packaging and a prepreg using the same, which has excellent flowability and rigidity. Specifically, the present invention provides a thermosetting resin composition for semiconductor packaging and a prepreg using the same, which ensures excellent flowability and rigidity even with a higher filler content than conventional resins by incorporating three specific fillers with different average particle sizes into a binder resin system containing an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin, and thereby contributes to the drivability of thinner electronic devices. The present invention also provides a prepreg using the same and a metal-clad laminate including the prepreg.

Description

Technical Field

[0001] Cross-reference to related application(s) This application claims the benefit of priority based on Korean Patent Application Nos. 10-2018-0018020 filed on Feb. 13, 2018 and 10-2019-0015097 filed on Feb. 8, 2019, and all the contents disclosed in the corresponding Korean patent applications are incorporated herein by reference.

[0002] The present invention relates to a thermosetting resin composition for a semiconductor package capable of ensuring high crosslinking density of a resin system and excellent stiffness, and exhibiting excellent metal foil adhesion and fluidity even when using a high content of a filler, and a prepreg using the same.

Background Art

[0003] A copper-clad laminate used for a printed circuit board becomes a prepreg when a base material of glass fabric is impregnated with a varnish of a thermosetting resin and then semi-cured, and is manufactured by heating and pressing it together with a copper foil again. A prepreg is reused for forming a circuit pattern on such a copper-clad laminate and for building-up thereon.

[0004] Recently, as high performance, thinning, and weight reduction of electronic devices, communication devices, smartphones, etc. have been accelerating, semiconductor packages are also required to be thinned, and at the same time, the necessity of thinning of printed circuit boards for semiconductor packages has been increasing.

[0005] In addition, in order to ensure the driving performance of a printed circuit board as the semiconductor substrate is thinned, products made of high-rigidity materials are required. Since stiffness is related to modulus, a material showing a high modulus must be developed.

[0006] One way to increase the modulus is to increase the content of fillers such as silica, but increasing the amount of silica reduces the adhesion strength to the copper foil and worsens the flowability. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] This invention provides a resin composition for semiconductor packaging that offers improved flowability and rigidity.

[0008] Furthermore, the present invention provides a prepreg using the thermosetting resin composition and a metal-clad laminate containing the prepreg. [Means for solving the problem]

[0009] This specification refers to 100 parts by weight of a binder resin comprising an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin; and It comprises at least 350 parts by weight of at least three types of fillers having different average particle sizes; The filler comprises a primary filler with an average particle size of 0.7 μm to 1 μm, a secondary filler with an average particle size of 90 nm to 0.3 μm, and a tertiary filler with an average particle size of 10 nm to 50 nm. The primary filler comprises 250 parts by weight or more relative to 100 parts by weight of the binder resin in the total content of the filler. The present invention provides a thermosetting resin composition for semiconductor packaging.

[0010] Furthermore, this specification provides a prepreg obtained by impregnating a fibrous substrate with the thermosetting resin composition.

[0011] Furthermore, this specification provides a metal-clad laminate comprising the prepreg and a metal foil integrated with the prepreg by heating and pressurizing. [Effects of the Invention]

[0012] The present invention can provide a resin composition for semiconductor packaging. Furthermore, by using a prepreg manufactured from the resin composition, the present invention can provide a metal-clad laminate that ensures excellent rigidity while maintaining excellent adhesive strength, thereby contributing to improved drivability of thin electronic devices (e.g., PCBs). [Modes for carrying out the invention]

[0013] The present invention will now be described in more detail. Terms and words used herein and in the claims should not be interpreted to be limited to their usual or lexicographical meanings, but rather to be interpreted as meanings and concepts consistent with the technical idea of ​​the present invention, based on the principle that inventors may appropriately define the concepts of terms in order to best describe their invention.

[0014] Furthermore, the meaning of "includes" as used in the specification of the present invention embodies specific characteristics, regions, integers, stages, operations, elements, and / or components, and does not exclude the presence or addition of other characteristics, regions, integers, stages, operations, elements, and / or components.

[0015] One embodiment of the present invention provides a thermosetting resin composition for semiconductor packaging comprising: 100 parts by weight of a binder resin comprising an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin; and 350 parts by weight or more of at least three types of fillers having different average particle sizes; wherein the fillers comprise a primary filler with an average particle size of 0.7 μm to 1 μm, a secondary filler with an average particle size of 90 nm to 0.3 μm, and a tertiary filler with an average particle size of 10 nm to 50 nm, and the primary filler is present in an amount of 250 parts by weight or more relative to 100 parts by weight of the binder resin in the total content of the fillers.

[0016] The thermosetting resin composition of the present invention constitutes a resin system containing a diaminodiphenylsulfone resin, and is characterized by the use of three specific fillers with different average particle sizes in the filler composition. Therefore, the present invention can provide a prepreg that can provide a highly rigid material product even when using a filler content of 350 parts by weight or more, which is even higher than conventional methods, and a metal-clad laminate containing the same. Furthermore, the resin composition of the present invention maintains excellent resin flowability even with a high filler content, and also has the effect of excellent metal foil adhesion.

[0017] The components of a thermosetting resin composition according to a preferred embodiment of the present invention and a prepreg using the resin composition will be described in more detail below.

[0018] First, the thermosetting resin composition of the present invention contains a binder comprising an epoxy resin and a special resin, and at least three types of fillers having different average particle sizes in specific proportions.

[0019] The binder resin composition is as follows:

[0020] The special resins include bismaleimide resin, diaminodiphenylsulfone resin, and benzooxazine resin.

[0021] In the binder component, the content of diaminodiphenylsulfone resin is preferably 5 to 20% by weight relative to the total weight of the binder. If the content of diaminodiphenylsulfone resin is less than 5% by weight, the reaction rate is slow and there is a problem of incomplete curing, and if it is 20% by weight or more, the crosslinking density decreases and there is a problem of weak stiffness.

[0022] The diaminodiphenylsulfone resin can be one having a weight-average molecular weight of 100 to 400.

[0023] In addition, the content of the benzoxazine resin can be 2 to 10% by weight based on the total weight of the binder. When included within the above range, sufficient curing of the bismaleimide resin contained in the binder can be induced. When the benzoxazine resin is contained in an excessive amount, the curing reaction rate may be delayed more than necessary during the production of the prepreg, resulting in a decrease in process efficiency. Therefore, the benzoxazine resin is preferably contained at 10% by weight or less based on the total weight of the binder. However, if the content is excessively low, the desired effect as a curing agent cannot be exhibited, and thus the chemical resistance and Tg cannot be improved. Therefore, it is advisable to use at least 2% by weight or more.

[0024] In addition, the contents of the epoxy resin and the bismaleimide resin components can be appropriately adjusted and used so that they total 100% by weight in consideration of the physical properties required for the thermosetting resin composition. For example, based on the total weight of the entire binder, it can contain 20 to 60% by weight of the epoxy resin and 20 to 70% by weight of the bismaleimide resin.

[0025] The following describes the remaining binder components.

[0026] As the epoxy resin, those commonly used in thermosetting resin compositions for prepregs can be used, and the type thereof is not limited.

[0027] For example, the epoxy resin can be one or more selected from the group consisting of bisphenol A type epoxy resin, phenol novolak epoxy resin, tetraphenyl ethane epoxy resin, naphthalene-based epoxy resin, biphenyl-based epoxy resin, dicyclopentadiene epoxy resin of the following Chemical Formula 1, and a mixture of dicyclopentadiene-based epoxy resin and naphthalene-based epoxy resin. [Chemical Formula 1] [Chemical Structure] (In the above formula, n is 0 or an integer from 1 to 50)

[0028] The epoxy resin can be used in an amount of 20 to 60% by weight based on the total weight of the binder. If the amount of epoxy resin used is less than 20% by weight, it is difficult to achieve a high Tg, and if it exceeds 60% by weight, it results in poor flowability.

[0029] The bismaleimide resin may be one or more compounds selected from the group consisting of compounds represented by the following chemical formula 2. [Chemical formula 2] [ka] (In the above formula, n is an integer from 0 to 50.)

[0030] A preferred example is that the bismaleimide resin may be one or more selected from the group consisting of diphenylmethane bismaleimide resin, phenylene bismaleimide resin, bisphenol A type diphenyl ether bismaleimide resin, and bismaleimide resin composed of oligomers of phenylmethane maleimide resin.

[0031] The bismaleimide resin can be used in an amount of 20 to 70% by weight based on the total weight of the binder. If the amount of bismaleimide resin used is less than 20% by weight, the desired physical properties may not be achieved, and if it exceeds 70% by weight, there may be many unreacted groups, which may adversely affect properties such as chemical resistance.

[0032] The present invention includes a benzoxazine resin in its binder composition, allowing for control of the reaction rate. Specifically, conventionally used phenol novolac curing agents generally contain hydroxyl groups in their structure and react with epoxy resins and the like from room temperature, resulting in a fast initial reaction rate. On the other hand, the benzoxazine resin used in the present invention acts as a curing agent and has the characteristic of generating hydroxyl groups at temperatures above 150°C. This allows the reaction to proceed gradually at room temperature or initially, but to participate in the reaction above a certain temperature, thereby adjusting the reaction rate.

[0033] Therefore, the benzoxazine resin used in this invention allows for reaction rate control, thereby ensuring the flowability of the prepreg. Furthermore, benzoxazine enables the curing of the aforementioned epoxy resin and bismaleimide resin.

[0034] In other words, the benzoxazine resin can be used as a curing agent for the epoxy resin and the bismaleimide resin. By using the benzoxazine resin as a curing agent for the bismaleimide resin, unlike existing phenol novolac resins, the curing reaction of the resin can proceed even at low temperatures such as the drying process, reducing the degree of curing of the prepreg and ensuring flowability. This also has the effect of minimizing appearance defects that occur not only when manufacturing metal laminates but also in the pressing process used in the build-up process.

[0035] Such benzoxazine resins may be one or more selected from the group consisting of bisphenol A type benzoxazine resins, bisphenol F type benzoxazine resins, phenolphthalein benzoxazine resins, and mixtures of these benzoxazine resins with a curing accelerator.

[0036] Filler In particular, the present invention does not use existing general fillers, but instead uses a mixture of at least three fillers with different average particle sizes in a specific ratio, thereby improving the rigidity properties of the resin composition and ensuring excellent flowability.

[0037] In the above composition, the total content of at least three types of fillers with different average particle sizes relative to 100 parts by weight of the binder may be 350 parts by weight or more. Furthermore, such fillers may be of slurry type.

[0038] The primary filler may be included in an amount of 250 parts by weight or more per 100 parts by weight of the binder, based on the total content of the filler.

[0039] Specifically, in this specification, when at least three types of fillers with different average particle sizes are included, they can be configured as a first filler with the largest average particle size, a second filler with an intermediate average particle size, and a third filler with the smallest average particle size. In this case, by using at least 250 parts by weight or more of the filler with the largest average particle size in the total filler content, based on 100 parts by weight of the binder resin, it is possible to provide not only rigidity but also excellent flowability.

[0040] Furthermore, the total content of the three types of fillers can be at least 350 parts by weight, based on 100 parts by weight of the binder. However, even when using 350 parts by weight or more of the three types of fillers, the flowability of the prepreg may decrease, so it is best to use them up to a level where the resin flowability does not decrease. Preferably, the total content of the three types of fillers can be 350 to 550 parts by weight, or 370 to 550 parts by weight.

[0041] Specifically, the present invention can increase packing density and thus improve filling efficiency by using both small nanoparticle sizes and large microparticle sizes. Furthermore, when using three types of fillers with different particle sizes in the present invention, none of which have a maximum size of 1 μm or more are included.Therefore, according to the present invention, the thermosetting resin composition is even more stable than when using only existing fillers with a single particle size, thereby improving compatibility with the resin.This results in optimal flowability of the prepreg and ensures excellent PCB processability.

[0042] As described above, the at least three types of fillers may include a primary filler with an average particle size of 0.7 μm to 1 μm, a secondary filler with an average particle size of 90 nm to 0.3 μm, and a tertiary filler with an average particle size of 10 nm to 50 nm.

[0043] The above-mentioned method for confirming (measuring) and determining the average particle size can be carried out according to the particle size analysis D50 method.

[0044] If the average particle size range of the primary filler is less than 0.7 μm, the packing size will not match the secondary filler, resulting in problems with moldability. If it exceeds 1 μm, in the case of thin substrates, the thinness of the CCL and PPG will cause problems with PCB processability due to large filler issues.

[0045] If the average particle size range of the secondary filler is less than 90 nm, the tertiary filler and packing size will not match, resulting in moldability problems. If it exceeds 0.3 μm, the primary filler and packing size will not match, resulting in moldability problems.

[0046] If the average particle size range of the tertiary filler is less than 10 nm, it cannot function as nanosilica, and if it exceeds 50 nm, the packing size does not match that of the secondary filler, resulting in problems with moldability.

[0047] At this time, the range of particle sizes for the primary to tertiary fillers, where the average particle size is limited, is as follows:

[0048] The particle size range of the primary filler may be 0.7 μm to 1.2 μm.

[0049] The particle size range of the secondary filler may be 90 nm to 0.3 μm.

[0050] The particle size range of the tertiary filler may be 10 nm to 50 nm.

[0051] Furthermore, the total content of the three types of fillers can be adjusted to a range of 350 parts by weight or more, or 350 to 550 parts by weight, or 370 to 550 parts by weight, based on 100 parts by weight of the binder resin. However, it is preferable to use the fillers so that the proportion of the primary filler is relatively the largest compared to the secondary and tertiary fillers, and to appropriately adjust the content range of the remaining secondary and tertiary fillers excluding the content of the primary filler. The reason for this is to increase the packing density of the resin composition, which increases the filling rate of the thermosetting resin composition and ensures optimized moldability and flowability.

[0052] In one embodiment, the primary filler can be used in an amount of approximately 77% to 85% by weight based on the total weight of the three types of fillers used. When converted based on the binder, the primary filler can be used in an amount of 250 parts by weight or more, or 250 to 400 parts by weight, or 280 to 400 parts by weight, per 100 parts by weight of the binder. More preferably, the three types of fillers may include 280 to 400 parts by weight of a primary filler with an average particle size of 0.7 μm to 1 μm, 30 to 90 parts by weight of a secondary filler with an average particle size of 90 nm to 0.3 μm, and 35 to 60 parts by weight of a tertiary filler with an average particle size of 10 nm to 50 nm, per 100 parts by weight of the binder.

[0053] In this case, if the content of the primary filler is less than 250 parts by weight, the amount of secondary and tertiary fillers will be too large, resulting in poor flowability. If it exceeds 400 parts by weight, the packing ratio will not be high enough, resulting in problems with moldability.

[0054] If the content of the secondary filler is less than 30 parts by weight, the packing ratio will not be correct and there will be problems with moldability. If it exceeds 90 parts by weight, the flowability will be poor and there will be problems with reduced copper foil adhesion.

[0055] If the content of the tertiary filler is less than 35 parts by weight, the packing ratio will not be correct and there will be problems with moldability. If it exceeds 60 parts by weight, the flowability will be poor and there will be problems with reduced copper foil adhesion.

[0056] Furthermore, each of the three types of fillers can be one or more selected from the group consisting of silica aluminum trihydroxylate, magnesium hydroxide, molybdenum oxide, zinc molybdate, zinc borate, zinc stanate, alumina, clay, kaolin, talc, calcined kaolin, calcined talc, mica, glass short fibers, glass fine powder, and hollow glass. In other words, one or more of the above-mentioned substances can be used for each of the primary to tertiary fillers with different average particle sizes.

[0057] Furthermore, it is preferable to use the three types of fillers in slurry form rather than in powder form. In other words, powder-type fillers have the problem of inferior dispersibility compared to slurry-type fillers. If the filler is not well dispersed, the flowability tends to decrease.

[0058] On the other hand, a thermosetting resin composition according to one embodiment of the present invention may further contain one or more additives selected from the group consisting of solvents, curing accelerators, flame retardants, lubricants, dispersants, plasticizers, and silane coupling agents.

[0059] Specifically, the present invention allows the resin composition to be used as a solution by adding a solvent as needed. The type of solvent is not particularly limited as long as it shows good solubility with respect to the resin components, and can be alcohol-based, ether-based, ketone-based, amide-based, aromatic hydrocarbon-based, ester-based, nitrile-based, etc., and these may be used individually or as a mixture of two or more solvents. Furthermore, the content of the solvent is not particularly limited as long as it is sufficient to impregnate the glass fibers with the resin composition during prepreg manufacturing.

[0060] The curing accelerator can be used to accelerate the curing of the aforementioned binder. The type and amount of curing accelerator are not particularly limited; for example, imidazole compounds, organophosphorus compounds, tertiary amines, quaternary ammonium salts, etc., can be used, and two or more may be used in combination. Preferably, the present invention uses an imidazole compound as the curing accelerator. When the imidazole curing accelerator is used, the content of the curing accelerator is about 0.1 to 1 part by weight per 100 parts by weight of the binder, which is even less than the aforementioned 5 to 15% by weight. Furthermore, examples of the imidazole-based curing accelerators include 1-methyl imidazole, 2-methyl imidazole, 2-ethyl 4-methyl imidazole, 2-phenyl imidazole, 2-cyclohexyl 4-methyl imidazole, 4-butyl 5-ethyl imidazole, 2-methyl 5-ethyl imidazole, 2-octyl 4-hexyl imidazole, 2,5-dichloro-4-ethyl imidazole, and 2-butoxy 4-allyl imidazole. Examples include imidazoles such as imidazole, and imidazole derivatives, with 2-methylimidazole or 2-phenylimidazole being particularly preferred due to their excellent reaction stability and low titer.

[0061] Furthermore, the thermosetting resin composition of the present invention may additionally contain one or more additives selected from the group consisting of flame retardants, lubricants, dispersants, plasticizers, and silane coupling agents, which are commonly added as needed. The resin composition of the present invention may also further contain other thermosetting resins, thermoplastic resins and a variety of copolymer compounds such as their oligomers and elastomers, other salt-resistant compounds, or additives, as long as they do not impair the properties inherent to the resin composition. These are not particularly limited as long as they are selected from those commonly used.

[0062] <Prepreg> According to another embodiment of the present invention, a prepreg is provided which is manufactured by impregnating a fibrous substrate with the thermosetting resin composition.

[0063] The term "prepreg" means that the thermosetting resin composition is impregnated into a fibrous substrate in a semi-cured state.

[0064] The type of fibrous substrate is not particularly limited, but it can be a synthetic fiber substrate made from woven or nonwoven fabrics mainly composed of glass fiber substrates, polyamide resin fibers such as polyamide resin fibers and aromatic polyamide resin fibers, polyester resin fibers such as polyester resin fibers, aromatic polyester resin fibers and all-aromatic polyester resin fibers, polyimide resin fibers, fluororesin fibers, etc., or a paper substrate mainly composed of kraft paper, cotton linter paper, or mixed paper of linter and kraft pulp. Preferably, a glass fiber substrate is used. The glass fiber substrate can improve the strength of the prepreg, reduce the absorption rate, and reduce the coefficient of thermal expansion. The glass fiber substrate used in the present invention can be selected from a variety of glass substrates used for printed circuit board materials. Examples of these include, but are not limited to, glass fibers such as E glass, D glass, S glass, T glass, and NE glass. The glass substrate material can be selected as needed depending on the intended application or performance. The glass substrate forms are typically woven fabric, nonwoven fabric, roving, chopped strand mat, or surfacing mat. The thickness of the glass fiber substrate is not particularly limited, but can be about 0.01 to 0.3 mm. Of the above materials, glass fiber materials are more preferable in terms of strength and water absorption properties.

[0065] Furthermore, the method for manufacturing the prepreg in the present invention is not particularly limited and can be manufactured by methods well known in this field. For example, the manufacturing method of the prepreg can be an impregnation method, a coating method using various coaters, a spray injection method, or the like.

[0066] In the impregnation method described above, a prepreg can be manufactured by impregnating the fiber substrate with the varnish after the varnish has been manufactured.

[0067] In other words, while the manufacturing conditions of the prepreg are not particularly limited, it is preferable to use the thermosetting resin composition in a varnish state with a solvent added. The solvent for the resin varnish is not particularly limited as long as it is miscible with the resin component and has good solubility. Specific examples of these include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; aromatic hydrocarbons such as benzene, toluene, and xylene; amides such as dimethylformamide and dimethylacetamide; and aliphatic alcohols such as methyl cellosolve and butyl cellosolve.

[0068] Furthermore, it is preferable that 80% or more of the solvent used during the manufacturing of the prepreg evaporates. For this reason, there are no restrictions on the manufacturing method or drying conditions, and there are no particular restrictions on the drying temperature, which is approximately 80°C to 180°C, and the drying time, which is balanced with the gelation time of the varnish. In addition, it is preferable that the amount of varnish impregnation is such that the resin solids of the varnish account for approximately 30 to 80% by weight of the total amount of resin solids of the varnish and the substrate.

[0069] <Metal-clad laminate> According to yet another embodiment of the present invention, a metal-clad laminate is provided comprising the prepreg; and a metal foil integrated with the prepreg by heating and pressurizing.

[0070] The aforementioned metal foils include copper foil; aluminum foil; a three-layer composite thin with nickel, nickel-phosphorus, nickel-tin alloy, nickel-iron alloy, lead, or lead-tin alloy as an intermediate layer, with copper layers of different thicknesses on both sides; or a two-layer composite thin with aluminum and copper foil.

[0071] In one preferred embodiment, the metal foil used in the present invention may be copper foil or aluminum foil, and may have a thickness of about 2 to 200 μm, but preferably about 2 to 35 μm. Preferably, copper foil is used as the metal foil. Furthermore, according to the present invention, a three-layer composite thin film may be used, in which nickel, nickel-phosphorus, nickel-tin alloy, nickel-iron alloy, lead, or lead-tin alloy is used as an intermediate layer, and a copper layer of 0.5 to 15 μm and a copper layer of 10 to 300 μm are placed on both sides thereof, or a two-layer composite thin film made of aluminum and copper foil may be used.

[0072] The metal laminate containing the prepreg manufactured in this manner can be used to manufacture double-sided or multilayer printed circuit boards after being laminated into one or more sheets. The present invention allows for the manufacture of double-sided or multilayer printed circuit boards by circuit processing the metal laminate, and the circuit processing can be performed using methods that are common in the manufacturing process of double-sided or multilayer printed circuit boards.

[0073] Furthermore, to evaluate the flowability of the prepreg, a 12μm copper foil with a high roughness and a 2μm copper foil with a low roughness can be used, respectively, to determine the degree of flow after lamination. The flowability can be evaluated by etching and removing the copper foil layer, observing and comparing the amount that flows out onto the outer surface with the naked eye, and then visually observing the surface of the hardened prepreg.

[0074] Thus, according to the present invention, by using the aforementioned thermosetting resin composition, it is applicable to printed circuit boards in a wide variety of fields, and is preferably usable in the manufacture of printed circuit boards for semiconductor packages.

[0075] The invention will be described in more detail by the following embodiments. However, the following embodiments are merely illustrative of the present invention, and the content of the present invention is not limited by the following embodiments. [Examples]

[0076] <Examples and Comparative Examples> After mixing the components according to the compositions shown in Tables 1 and 2 below, the mixture was stirred at a speed of 400 rpm using a high-speed stirrer to produce the resin compositions (resin varnishes) of Examples 1-3 and Comparative Examples 1-9, respectively.

[0077] Subsequently, each resin varnish was impregnated into 25 μm thick glass fibers (Nittobo 1039, T-glass), and then hot-air dried at a temperature of 100-140°C to produce 35 μm prepregs.

[0078] After laminating one sheet of the prepreg manufactured as described above, copper foil (12 μm thick, manufactured by Mitsui Co., Ltd.) was placed on both sides and laminated, and then pressed to produce a copper-clad laminate.

[0079] The content of the binder resin components is expressed in weight percent (total 100% by weight), and the silica content is based on 100 parts by weight of the aforementioned resin. [Table 1] [Table 2]

[0080] Note) Epoxy resin: Naphthalene-based epoxy resin (HP6000, DIC Corporation) BMI resin: Bismaleimide-based resin (BMI-2300, DAIWA Corporation) Cyanate ester resin: Novolac-type cyanate ester resin (PT-30S, Lonza) Benzooxazine resin: Phenolphthalein-based benzooxazine resin (XU8282, Hunstman) DDS resin: Diaminodiphenylsulfone resin (4'4-DDS, Sino Rich Chemical Co., Ltd.) Filler A: Slurry-type filler, average particle size 1 μm (SC4050MT0, Admatechs) Filler B: Slurry-type packing agent, average particle size 0.5 μm (SC2050MT0, Admatechs) Filler C: Slurry-type packing agent, average particle size 0.3 μm (SX-CM1, Admatechs) Filler D: Slurry-type packing agent, average particle size 100 nm (Optisol-SSKU9, Ranco) Filler E: Slurry-type packing agent, average particle size 50 nm (YA050C-MJE, Admatechs) Filler F: Powder-type filler, average particle size 1.5 μm (SO-C5, Admatechs)

[0081] <Example of experiment> The physical properties of the copper-clad laminates produced in the examples and comparative examples were measured using the following methods, and the results are shown in Tables 3 and 4.

[0082] (1) Resin flow properties (RF) RF was measured using a cover press in the prepreg state according to IPC-TM-650 (2.3.17).

[0083] (2) Formability (presence or absence of voids) Cross-sections of copper-clad laminates were prepared as observation specimens. The presence or absence of voids was investigated using a scanning electron microscope, and the moldability was evaluated.

[0084] (3) Glass transition temperature (Tg) After etching and removing the copper foil layer from the copper-clad laminate, the glass transition temperature was measured using DMA and TMA.

[0085] (4) Modulus After etching and removing the copper foil layer from the copper-clad laminate, measurements were taken using DMA.

[0086] (5) Coefficient of thermal expansion (CTE) After etching and removing the copper foil layer from the copper-clad laminate, measurements were taken using a TMA (Temperature Measuring Tape).

[0087] (6) Adhesion strength evaluation (peel strength): The adhesion strength of a 1 cm wide section of copper-clad laminate was evaluated using a texture analyzer. [Table 3] [Table 4]

[0088] As can be seen in Tables 3 and 4, Examples 1-3 of the present invention were generally superior in all physical properties compared to Comparative Examples 1-9. In particular, it can be confirmed that the present invention exhibits superior resin flowability and rigidity, as well as superior adhesion to copper foil.

[0089] On the other hand, Comparative Example 1, which used only two types of fillers, Comparative Example 2, which used three types of fillers but outside the ratio range of the present application, and Comparative Example 3, in which the size composition of the three types of fillers differed from that of the present application, all exhibited poor resin flowability. Furthermore, Comparative Example 4, in which the DDS resin ratio differed from that of the present application, had excellent resin flowability but poor moldability, and overall physical properties, including glass transition temperature, were poor. In addition, in Comparative Example 5, which had a low DDS content, and Comparative Example 8, which did not contain DDS, problems of fragility appeared in CTE and desmear due to uncured material. Moreover, in Comparative Examples 6 and 7, the average particle size of the filler contained components outside the range of the present application, resulting in relatively poorer CTE and peel strength compared to the present application. Furthermore, Comparative Example 6 contained a powder-type filler, which reduced CTE and peel strength.

[0090] Furthermore, in Comparative Example 9, even when using the first filler having an average particle size of 1 μm, its content was excessively high, resulting in poor resin flowability and moldability of the thermosetting resin composition, which led to a decrease in CTE and peel strength.

Claims

1. 100 parts by weight of a binder resin including an epoxy resin, a bismaleimide resin, a diaminodiphenyl sulfone resin, and a benzoxazine resin; and 350 parts by weight or more of at least three fillers having different average particle sizes; The filler includes a primary filler having an average particle size of 0.7 μm to 1 μm, a secondary filler having an average particle size of 90 nm to 0.3 μm, and a tertiary filler having an average particle size of 10 nm to 50 nm, The primary filler is contained in an amount of 250 parts by weight or more relative to 100 parts by weight of the binder resin in the total content of the filler, The content of the diaminodiphenyl sulfone resin is 5 to 20 wt % based on the total weight of the binder resin, The three fillers are contained in an amount of 350 to 550 parts by weight based on 100 parts by weight of the binder resin. A thermosetting resin composition for semiconductor packaging.

2. 100 parts by weight of a binder resin including an epoxy resin, a bismaleimide resin, a diaminodiphenyl sulfone resin, and a benzoxazine resin; and 350 parts by weight or more of at least three fillers having different average particle sizes; The filler includes a primary filler having an average particle size of 0.7 μm to 1 μm, a secondary filler having an average particle size of 90 nm to 0.3 μm, and a tertiary filler having an average particle size of 10 nm to 50 nm, The primary filler is contained in an amount of 250 parts by weight or more relative to 100 parts by weight of the binder resin in the total content of the filler, The content of the diaminodiphenyl sulfone resin is 5 to 20 wt % based on the total weight of the binder resin, The three fillers are used in an amount of: 280 to 400 parts by weight of a primary filler having an average particle size of 0.7 μm to 1 μm, 30 to 90 parts by weight of a secondary filler having an average particle size of 90 nm to 0.3 μm; A thermosetting resin composition for semiconductor packaging, comprising 35 to 60 parts by weight of a tertiary filler having an average particle size of 10 nm to 50 nm.

3. 3. The thermosetting resin composition for semiconductor packaging according to claim 1, wherein the diaminodiphenyl sulfone resin has a weight average molecular weight of 100 to 400.

4. 4. The thermosetting resin composition for semiconductor packaging according to claim 1, wherein the content of the benzoxazine resin is 2 to 10 wt % based on the total weight of the binder resin.

5. 5. The thermosetting resin composition for a semiconductor package according to claim 1, wherein the three types of fillers each independently comprise one or more selected from the group consisting of silica, aluminum trihydroxide, magnesium hydroxide, molybdenum oxide, zinc molybdate, zinc borate, zinc stannate, alumina, clay, kaolin, talc, calcined kaolin, calcined talc, mica, short glass fiber, fine glass powder, and hollow glass.

6. 6. The thermosetting resin composition for a semiconductor package according to claim 1, wherein the epoxy resin is at least one selected from the group consisting of bisphenol A-type epoxy resins, phenol novolac epoxy resins, tetraphenylethane epoxy resins, naphthalene-based epoxy resins, biphenyl-based epoxy resins, dicyclopentadiene epoxy resins, and mixtures of dicyclopentadiene-based epoxy resins and naphthalene-based epoxy resins.

7. 7. The thermosetting resin composition for semiconductor package according to claim 1, wherein the bismaleimide resin is at least one selected from the group consisting of compounds represented by the following Chemical Formula 2: [Chemical formula 2] 【Chemistry 1】 (In the above chemical formula 2, n is 0 or an integer of 1 to 50.)

8. 8. The thermosetting resin composition for a semiconductor package according to claim 1, further comprising one or more additives selected from the group consisting of a solvent, a curing accelerator, a flame retardant, a lubricant, a dispersant, a plasticizer, and a silane coupling agent.

9. A prepreg obtained by impregnating a fiber substrate with the thermosetting resin composition for a semiconductor package according to claim 1 .

10. The prepreg of claim 9; and Metal foil integrated with the prepreg by heating and pressing A metal-clad laminate comprising:

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