Resin laminate and mounting structure

Abstract

To provide a resin laminate which enables movement of an element to a desired mounting position with high positional accuracy and efficient arrangement of the element when used as the substrate for mounting the element, and enables accurate rotation in a desired direction and efficient arrangement of the element.SOLUTION: A resin laminate has a support and a resin layer laminated on the support, in which the resin layer has an uncured region composed of a resin composition cured with heat or light and a cured region composed of a cured product of the resin composition, the uncured region is surrounded by a cured product of the resin composition so that the uncured resin composition is not moved in a plane direction from the uncured region in the resin layer, a planar shape of the uncured region is a geometric shape, and the viscosity of the resin composition in the uncured region at any temperature within a temperature range of 60-150°C is 100 Pa s or less.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin laminate and a mounting structure, and more particularly to a resin laminate that can be suitably used for mounting elements (such as semiconductor elements) and a mounting structure obtained by using the same. [Background technology]

[0002] One of the main trends in recent technological developments in integrated circuit technology is to reduce the size of components. The miniaturization of semiconductor packages not only directly affects the performance of integrated circuits, but also has an important impact on the miniaturization, low cost, and reliability of the entire electronic system. As the size of semiconductor elements is gradually reduced and the integration density is improved, higher demands are being placed on semiconductor packages. Against this background, various methods have been proposed in recent years as methods for manufacturing semiconductor packages. For example, Japanese Patent Application Laid-Open No. 2008-021769 (Patent Document 1) proposes a method for mounting semiconductor elements with positional accuracy on the order of μm by controlling the viscosity of a resin layered on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-021769 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention aims to provide a resin laminate which, when used as a substrate for mounting an element, enables the element to be moved to a desired mounting position with high positional accuracy and efficiently positioned, and also enables the element to be rotated with high accuracy in a desired orientation and efficiently positioned, and a mounting structure obtained using the resin laminate. [Means for solving the problem]

[0005] As a result of intensive research by the inventors to achieve the above object, it has been found that in a resin laminate comprising a support and a resin layer laminated on the support, the resin layer has an uncured region made of a resin composition that is cured by heat or light, and a cured region made of a cured product of the resin composition, the uncured region is surrounded by the cured product of the resin composition so that the uncured resin composition does not move in a planar direction from the uncured region in the resin layer, the planar shape of the uncured region is a geometric shape, and the viscosity of the resin composition in the uncured region is 100 Pa s or less at any temperature within a temperature range of 60°C to 150°C, thereby making it possible to realize a resin laminate that can be mounted at a temperature (any temperature within a temperature range of 60°C to 150°C). The present inventors have found that it is possible to set the viscosity of the resin composition in the uncured region used as a mounting region to the above-mentioned specific range, and because the shape of the uncured region is a geometric shape (geometric pattern), the direction in which the surface tension of the uncured resin composition acts and the magnitude of that force can be adjusted within the uncured region due to its shape. Therefore, when used as a substrate for mounting an element, the surface tension of the uncured resin composition can be used to move the placed element to the desired mounting position (mounting position corresponding to the shape of the mounting region: mounting position intended by design) and efficiently place it with high positional accuracy, and that it can also be rotated with high accuracy in the desired orientation (orientation corresponding to the shape of the mounting region: orientation intended by design) and efficiently place it, thereby completing the present invention.

[0006] That is, the resin laminate of the present invention is a resin laminate including a support and a resin layer laminated on the support, The resin layer has an uncured region made of a resin composition that is cured by heat or light, and a cured region made of a cured product of the resin composition, In the resin layer, the uncured region is surrounded by a cured product of the resin composition so that the uncured resin composition does not move from the uncured region in a planar direction, The planar shape of the uncured region is a geometric shape. 、 The resin composition in the uncured region Viscosity within the temperature range of 80℃~110℃ It is 100 Pa s or less, The resin composition contains a compound having a fluorene skeleton, and The compound having a fluorene skeleton is a polymerizable unsaturated group-containing compound represented by the following general formula (1): The term "planar shape of the uncured region" used herein means the shape of the uncured region when viewed from the normal direction of the surface of the resin layer (the shape of the boundary between the cured region and the uncured region), and the term "planar direction" means the direction parallel to the surface of the resin layer (horizontal direction).

[0007] difference Furthermore, the above In the resin laminate of the present invention, the planar shape of the uncured region is a circle, an ellipse, or a polygon. group It is preferable that the shape is at least one selected from the following shapes (note that the "polygonal shape" used here includes not only normal polygonal shapes, but also shapes with rounded corners (so-called round corner shapes)).

[0008] Furthermore, in the resin laminate of the present invention, it is preferable that the uncured region is a region for mounting an element.

[0009] The present invention also provides a mounting structure, comprising: a cured resin laminate obtained by curing the resin layer of the resin laminate of the present invention; an element disposed in a region where the uncured region of the cured resin layer in the cured resin laminate had existed as a mounting region; It is equipped with the following. Effect of the Invention

[0010] According to the present invention, it is possible to provide a resin laminate which, when used as a substrate for mounting an element, enables the element to be moved to a desired mounting position with high positional accuracy and efficiently positioned, and enables the element to be rotated with high accuracy in a desired orientation and efficiently positioned, and a mounting structure obtained using the resin laminate. [Brief description of the drawings]

[0011] [Figure 1] 1 is a plan view that illustrates a schematic plan view of a surface of a resin layer in one embodiment of a resin laminate of the present invention. [Diagram 2] 1 is a cross-sectional view that typically illustrates a cross section of one embodiment of a resin laminate of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings where necessary. In the following description and drawings, the same or corresponding elements are designated by the same reference numerals, and duplicated explanations will be omitted.

[0013] [Resin laminate] The resin laminate of the present invention is a resin laminate comprising a support and a resin layer laminated on the support, The resin layer has an uncured region made of a resin composition that is cured by heat or light, and a cured region made of a cured product of the resin composition, In the resin layer, the uncured region is surrounded by a cured product of the resin composition so that the uncured resin composition does not move from the uncured region in a planar direction, The planar shape of the uncured region is a geometric shape, and The resin composition in the uncured region has a viscosity of 100 Pa s or less at any temperature within a temperature range of 60°C to 150°C. The present invention is characterized by the following:

[0014] The support provided in the resin laminate of the present invention is not particularly limited, and a known substrate may be appropriately used according to the purpose, and a transparent substrate may be appropriately used, or a substrate other than a transparent substrate may be appropriately used. As such a transparent substrate, for example, a glass substrate, a transparent film (e.g., polycarbonate, polyethylene terephthalate, polyethersulfone, etc.), a substrate having a transparent electrode such as ITO or gold vapor-deposited or patterned on the surface thereof, etc. may be appropriately used.

[0015] Moreover, the resin layer laminated on such a support has an uncured region made of a resin composition (uncured resin composition) that is cured by heat or light, and a cured region made of a cured product of the resin composition. The resin composition (uncured resin composition) that forms the uncured region of such a resin layer is cured by heat or light. Therefore, the resin composition (uncured) preferably contains a compound that is cured by heat or light (hereinafter, sometimes simply referred to as "component (A)").

[0016] The type of such a compound (component (A)) that polymerizes by heat or light is not particularly limited, and may be any of a monomer, oligomer, or resin. Such oligomers and resins may be any that undergo further polymerization by the action of heat or light, and known compounds may be used as appropriate. Examples of such compounds that polymerize by heat or light include epoxy compounds, silicone compounds, styrene compounds, polyimide compounds, polyamides, unsaturated polyester compounds, vinyl ester compounds, epoxy-modified (meth)acrylic compounds, and urethane-modified (meth)acrylic compounds.

[0017] In addition, as the compound (component (A)) polymerizable by heat or light contained in such a resin composition, a compound having a polymerizable unsaturated group in the molecule (hereinafter sometimes simply referred to as "polymerizable unsaturated group-containing compound") is more preferred from the viewpoint that when forming the cured region (hereinafter sometimes simply referred to as "cured portion") and the uncured region (hereinafter sometimes simply referred to as "uncured portion") in the resin layer, the shapes of the cured portion and the uncured portion are more easily controlled. Here, typical examples of the polymerizable unsaturated group include an acrylic group or a methacrylic group (collectively referred to as "(meth)acrylic group" below).

[0018] Examples of compounds that can be suitably used as such polymerizable unsaturated group-containing compounds include epoxy (meth)acrylate acid adducts obtained by reacting a compound having two or more epoxy groups with (meth)acrylic acid to obtain an epoxy (meth)acrylate compound having a hydroxy group, with a dicarboxylic acid or tricarboxylic acid or its monoanhydride, and a tetracarboxylic acid or its dianhydride. Examples of compounds having two or more epoxy groups that can be derived into epoxy (meth)acrylate acid adducts include bisphenol-type epoxy compounds and novolac-type epoxy compounds, and more preferably include bisphenol-type epoxy compounds and novolac-type epoxy compounds.

[0019] An example of such a bisphenol type epoxy compound is an epoxy compound having two glycidyl ether groups obtained by reacting bisphenols with epichlorohydrin. The reaction for obtaining such an epoxy compound having two glycidyl ether groups generally involves oligomerization of a diglycidyl ether compound, so that the bisphenol type epoxy compound obtained by the reaction generally includes an epoxy compound having two or more bisphenol skeletons.Examples of bisphenols used in such reactions include bis(4-hydroxyphenyl)ketone, bis(4-hydroxy-3,5-dimethylphenyl)ketone, bis(4-hydroxy-3,5-dichlorophenyl)ketone, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxy-3,5-dimethylphenyl)sulfone, bis(4-hydroxy-3,5-dichlorophenyl)sulfone, bis(4-hydroxyphenyl)hexafluoropropane, and bis(4-hydroxy-3,5-dimethylphenyl)hexafluoropropane. , bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane, bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3,5-dimethylphenyl)dimethylsilane, bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4-hydroxy-3,5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethyl phenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-hydroxy-3-chlorophenyl)propane, bis(4-hydroxyphenyl)ether, bis(4-hydroxy-3,5-dimethylphenyl)ether, bis(4-hydroxy-3,5-dichlorophenyl)ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hi 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9-bis(4-hydroxy-3-bromophenyl)fluorene, 9,9-bis(4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene, 4,4'-biphenol, 3,3'-biphenol, and the like.Among these, bisphenols having a fluorene-9,9-diyl group are particularly preferred.

[0020] In addition, such a resin composition preferably contains a compound having a fluorene skeleton from the viewpoint of controlling viscoelasticity in an uncured state and suppressing sinking of an element due to surface tension when the element is disposed in the uncured region. In addition, as a preferred embodiment of such a compound having a fluorene skeleton, for example, a polymerizable unsaturated group-containing compound represented by the following general formula (1) can be mentioned.

[0021] [ka]

[0022] In formula (1), each Ar is independently an aromatic hydrocarbon group having 6 to 14 carbon atoms, and a portion of the hydrogen atoms bonded to the carbon constituting the aromatic hydrocarbon group may be substituted with an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an arylalkyl group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a cycloalkylalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a halogen group. In formula (1), each R1 is independently an alkylene group having 2 to 4 carbon atoms, and each l is independently a number from 0 to 3. It is preferable that such l is a number selected so that the average value of l in one molecule is a number from 0 to 3 and the average value of l in the composition is a number from 0 to 3. In formula (1), each G is independently (Meth)acryloyl group is a substituent represented by the following general formula (2) or the following general formula (3), and Y is a tetravalent carboxylic acid residue. In formula (1), each Z is independently a hydrogen atom or the below described It is a substituent represented by general formula (4), and one or more of them are substituents represented by the following general formula (4). In formula (1), n ​​is a number having an average value of 1 to 20.

[0023] Here, the aromatic hydrocarbon group may be unsubstituted as long as it is within the above-mentioned range of carbon number, and examples thereof include o-, m-, or p-phenylene, toluylene, ethylphenylene, n-propylphenylene, isopropylphenylene, linear or branched butylphenylene, and pentylphenylene groups, and may be substituted with 2 to 4 substituents as long as the carbon number does not exceed the range.

[0024] [ka]

[0025] [ka]

[0026] In formulas (2) and (3), R2 is a hydrogen atom or a methyl group, R3 is a divalent alkylene group or alkylarylene group having 2 to 10 carbon atoms, R4 is a divalent saturated or unsaturated hydrocarbon group having 2 to 20 carbon atoms, and p is a number from 0 to 10. The average value of p in the resin composition is preferably a number from 0 to 5, and more preferably a number from 0 to 2. When the average value of p is within the above range, it is possible to prevent the distribution of the flexible structure, namely alkylene oxide, from becoming wide-ranging, and therefore, when cured, sufficient curability as a cured film can be imparted without deteriorating the resin performance.

[0027] Here, the alkylene group that can be selected as R3 may have either a linear or branched structure, and examples thereof include ethylene, ethylidene, vinylene, vinylidene, propylene, trimethylene, propenylene, isopropylidene, tetramethylene, etc. In addition, the alkylarylene group that can be selected as R3 may be an unsubstituted arylene group as long as it is within the above carbon number range, and examples thereof include o, m, p-phenylene, toluylene, ethylphenylene, n-propylphenylene, isopropylphenylene, linear or branched butylphenylene, pentylphenylene, etc.

[0028] [ka]

[0029] In formula (4), W is a divalent or trivalent carboxylic acid residue, and m is 1 or 2.

[0030] The polymerizable unsaturated group-containing compound represented by the above general formula (1) is obtained by utilizing an epoxy compound containing several oxyalkylene groups in one molecule as a raw material, and it is preferable to use a compound in which Ar in the general formula (1) is an aromatic hydrocarbon group having 6 to 14 carbon atoms.

[0031] As such an aromatic hydrocarbon group having 6 to 14 carbon atoms, a divalent naphthyl group and a phenylene group in which a part of hydrogen atoms may be substituted with an alkyl group or the like can be suitably used. Here, it is preferable that the polymerizable unsaturated group-containing compound is such that both of the two Ars bonded to the fluorene group in the general formula (1) are naphthyl groups (having a bisnaphtholfluorene skeleton) or both are phenylene groups (having a bisphenolfluorene skeleton). This is because the cured film (coating film) obtained by curing the polymerizable unsaturated group-containing compound generates a small amount of gas when heated.

[0032] Here, the method for producing the polymerizable unsaturated group-containing compound represented by the above general formula (1) will be described in more detail. In the method for producing the polymerizable unsaturated group-containing compound represented by the general formula (1), first, an epoxy compound (a-1) represented by the following general formula (5) is used as a compound having two or more epoxy groups (such an epoxy compound (a-1) may have several oxyalkylene groups in one molecule, and more preferably has a bisnaphtholfluorene skeleton or a bisphenolfluorene skeleton), and the epoxy compound (a-1) is reacted with either one or both of (meth)acrylic acid and (meth)acrylic acid derivatives represented by the following general formula (6) or the following general formula (7) to obtain an epoxy (meth)acrylate compound.

[0033] [ka]

[0034] In formula (5), each Ar is independently an aromatic hydrocarbon group having 6 to 14 carbon atoms, and a portion of the hydrogen atoms bonded to the carbon atoms constituting the aromatic hydrocarbon group may be substituted with an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an arylalkyl group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a cycloalkylalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a halogen group. Each R1 is independently an alkylene group having 2 to 4 carbon atoms, and each 1 is independently a number from 0 to 3.

[0035] [ka]

[0036] [ka]

[0037] In formulas (6) and (7), R2 is a hydrogen atom or a methyl group, R3 is a divalent alkylene group or alkylarylene group having 2 to 10 carbon atoms, R4 is a divalent saturated or unsaturated hydrocarbon group having 2 to 20 carbon atoms, and p is a number from 0 to 10.

[0038] The reaction between the epoxy compound (a-1) and the (meth)acrylic acid derivative can be carried out by a known method. For example, JP-A-4-355450 describes that a diol compound containing a polymerizable unsaturated group can be obtained by using about 2 moles of (meth)acrylic acid per mole of an epoxy compound having two epoxy groups. The epoxy (meth)acrylate compound obtained by such a reaction can be a diol (d) containing a polymerizable unsaturated group represented by the following formula (8) (hereinafter, also simply referred to as "diol (d) represented by general formula (8)").

[0039] [ka]

[0040] In formula (8), Ar are each independently an aromatic hydrocarbon group having 6 to 14 carbon atoms, and a portion of the hydrogen atoms bonded to the carbons constituting the aromatic hydrocarbon group may be substituted with an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an arylalkyl group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a cycloalkylalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a halogen group. G are each independently a (meth)acryloyl group or a substituent represented by the above general formula (2) or (3), R1 are each independently an alkylene group having 2 to 4 carbon atoms, and 1 are each independently a number from 0 to 3.

[0041] In the production of the polymerizable unsaturated group-containing compound represented by the general formula (1), the synthesis reaction of the diol (d) represented by the above general formula (8) and the reaction described below (the reaction of the diol (d) with a polycarboxylic acid or anhydride thereof following the synthesis of the diol (d)) are usually carried out in a solvent (using a catalyst as necessary).

[0042] Examples of such solvents include cellosolve-based solvents such as ethyl cellosolve acetate and butyl cellosolve acetate, high-boiling ether or ester-based solvents such as diglyme, ethyl carbitol acetate, butyl carbitol acetate, and propylene glycol monomethyl ether acetate, and ketone-based solvents such as cyclohexanone and diisobutyl ketone. There are no particular limitations on the reaction conditions such as the solvent and catalyst used, but it is preferable to use, for example, a solvent that does not have a hydroxyl group and has a boiling point higher than the reaction temperature as the reaction solvent.

[0043] In addition, it is preferable to use a catalyst for the reaction between an epoxy group and a carboxyl group or a hydroxyl group. Known catalysts can be appropriately used as such catalysts (for example, JP-A-9-325494 describes ammonium salts such as tetraethylammonium bromide and triethylbenzylammonium chloride, and phosphines such as triphenylphosphine and tris(2,6-dimethoxyphenyl)phosphine).

[0044] Next, in the method for producing such a polymerizable unsaturated group-containing compound represented by general formula (1), diol (d) represented by general formula (8) obtained by the reaction of the epoxy compound (a-1) with the (meth)acrylic acid derivative is reacted with a dicarboxylic acid or tricarboxylic acid or anhydride thereof (b), and a tetracarboxylic acid or anhydride thereof (c) to obtain a polymerizable unsaturated group-containing compound represented by general formula (1) (a compound having a carboxy group and a polymerizable unsaturated group in one molecule).

[0045] The acid component used to synthesize the polymerizable unsaturated group-containing compound represented by general formula (1) is a polyvalent acid component that can react with the hydroxyl group in the diol (d) molecule represented by general formula (8), and it is preferable to use a dicarboxylic acid or tricarboxylic acid or an acid monoanhydride thereof (b) in combination with a tetracarboxylic acid or an acid dianhydride thereof (c). The carboxylic acid residue of the acid component may be either a saturated hydrocarbon group or an unsaturated hydrocarbon group. In addition, these carboxylic acid residues may contain bonds containing heteroatoms such as -O-, -S-, and carbonyl groups.

[0046] Examples of the dicarboxylic acid or tricarboxylic acid or their monoanhydrides (b) include chain hydrocarbon dicarboxylic acids or tricarboxylic acids, alicyclic hydrocarbon dicarboxylic acids or tricarboxylic acids, aromatic hydrocarbon dicarboxylic acids or tricarboxylic acids or their monoanhydrides, and the like.

[0047] Examples of the acid monoanhydrides of the chain hydrocarbon dicarboxylic acid or tricarboxylic acid include acid monoanhydrides of succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citramalic acid, malonic acid, glutaric acid, citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, suberic acid, diglycolic acid, and the like, and acid monoanhydrides of dicarboxylic acids or tricarboxylic acids into which any substituent has been introduced.

[0048] Examples of the acid monoanhydrides of the alicyclic dicarboxylic acid or tricarboxylic acid include acid monoanhydrides of cyclobutanedicarboxylic acid, cyclopentanedicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, norbornanedicarboxylic acid, and acid monoanhydrides of dicarboxylic acids or tricarboxylic acids into which any substituent has been introduced.

[0049] Examples of the acid monoanhydrides of the aromatic dicarboxylic acid or tricarboxylic acid include acid monoanhydrides of phthalic acid, isophthalic acid, trimellitic acid, and the like, and acid monoanhydrides of dicarboxylic acids or tricarboxylic acids having any substituent introduced therein.

[0050] Among the above dicarboxylic acid or tricarboxylic acid monoanhydrides, succinic acid, itaconic acid, tetrahydrophthalic acid, hexahydrotrimellitic acid, phthalic acid, and trimellitic acid are preferred, and succinic acid, itaconic acid, and tetrahydrophthalic acid are more preferred.

[0051] In addition, in the case of dicarboxylic acids or tricarboxylic acids, it is preferable to use their acid monoanhydrides. The above-mentioned acid monoanhydrides of dicarboxylic acids or tricarboxylic acids may be used alone or in combination of two or more kinds.

[0052] Examples of the tetracarboxylic acid or its dianhydride (c) include chain hydrocarbon tetracarboxylic acid, alicyclic hydrocarbon tetracarboxylic acid, aromatic hydrocarbon tetracarboxylic acid, or their dianhydrides.

[0053] Examples of the chain hydrocarbon tetracarboxylic acid include butane tetracarboxylic acid, pentane tetracarboxylic acid, hexane tetracarboxylic acid, and chain hydrocarbon tetracarboxylic acids having a substituent such as an alicyclic hydrocarbon group or an unsaturated hydrocarbon group introduced therein.

[0054] Examples of the alicyclic tetracarboxylic acid include cyclobutane tetracarboxylic acid, cyclopentane tetracarboxylic acid, cyclohexane tetracarboxylic acid, cycloheptane tetracarboxylic acid, norbornane tetracarboxylic acid, and alicyclic tetracarboxylic acids having a substituent such as a chain hydrocarbon group or an unsaturated hydrocarbon group introduced therein.

[0055] Examples of aromatic tetracarboxylic acids include pyromellitic acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, diphenyl ether tetracarboxylic acid, diphenyl sulfone tetracarboxylic acid, naphthalene-1,4,5,8-tetracarboxylic acid, and naphthalene-2,3,6,7-tetracarboxylic acid.

[0056] In addition, as the tetracarboxylic acid or its dianhydride (c), bis(trimellitic anhydride) aryl esters can also be used. Here, examples of bis(trimellitic anhydride) aryl esters include compounds produced by the method described in International Publication No. 2010 / 074065, and are structurally dianhydrides in the form of ester bonds formed by reacting two hydroxyl groups of an aromatic diol (such as naphthalenediol, biphenol, terphenyldiol, etc.) with the carboxyl groups of two molecules of trimellitic anhydride (these compounds are hereinafter referred to as "bis(trimellitic anhydride) esters of aromatic diols").

[0057] Among the above tetracarboxylic acids or their dianhydrides, biphenyltetracarboxylic acid, benzophenonetetracarboxylic acid, and diphenylethertetracarboxylic acid are preferred, and biphenyltetracarboxylic acid and diphenylethertetracarboxylic acid are more preferred. In addition, it is preferred to use the above tetracarboxylic acid or its dianhydride. Furthermore, as the above tetracarboxylic acid or its dianhydride (c), bis(trimellitic anhydride) esters of naphthalene diols can also be preferably used. The above tetracarboxylic acids or their dianhydrides, and bis(trimellitic anhydride) esters of aromatic diols may be used alone or in combination of two or more.

[0058] The reaction of the diol (d) represented by the general formula (8) with the acid components (b) and (c) is not particularly limited, and a known method can be adopted. For example, JP-A-9-325494 describes a method of reacting an epoxy (meth)acrylate with a tetracarboxylic dianhydride at a reaction temperature of 90 to 140°C.

[0059] Here, it is preferable to react the compound so that the terminals of the compound become carboxy groups, and so that the molar ratio of the compound with the epoxy (meth)acrylate (d), dicarboxylic acid or tricarboxylic acid or their monoanhydrides (b), and tetracarboxylic dianhydride (c) is (d):(b):(c)=1.0:0.01-1.0:0.2-1.0.

[0060] For example, when an acid monoanhydride (b) and an acid dianhydride (c) are used, it is preferable to react them so that the molar ratio [(d) / [(b) / 2+(c)]] of the amount of the acid component to the diol (d) containing a polymerizable unsaturated group is 0.5 to 1.0. Here, when the molar ratio is 1.0 or less, the content of the diol containing an unreacted polymerizable unsaturated group is not increased, so the stability over time of the resin composition can be improved. On the other hand, when the molar ratio is 0.5 or more, the terminal of the polymerizable unsaturated group-containing compound represented by formula (2) does not become an acid anhydride, so that the content of the unreacted acid dianhydride can be suppressed from increasing, so the stability over time of the resin composition can be improved. In addition, in order to adjust the acid value and molecular weight of the polymerizable unsaturated group-containing compound, the molar ratios of each component (b), (c) and (d) can be arbitrarily changed within the above-mentioned range.

[0061] The weight average molecular weight (Mw) of the polymerizable unsaturated group-containing compound represented by the general formula (1) in terms of polystyrene as measured by gel permeation chromatography (GPC) (HLC-8220GPC, manufactured by Tosoh Corporation) is not particularly limited, but is usually preferably 1000 to 100000, more preferably 2000 to 20000, and even more preferably 2000 to 8000. When the weight average molecular weight is 1000 or more, it is possible to suppress a decrease in the adhesion of the pattern. In addition, when the weight average molecular weight is 100000 or less, it is easy to adjust the solution viscosity of the resin composition solution to a range suitable for coating.

[0062] Another example of a suitable compound of such a polymerizable unsaturated group-containing compound is a copolymer of (meth)acrylic acid, (meth)acrylic acid ester, etc., and a resin having a (meth)acrylic group and a carboxyl group. For example, a method for obtaining such a resin (copolymer) having a (meth)acrylic group and a carboxyl group includes a method in which, as a first step, a (meth)acrylic acid ester containing glycidyl (meth)acrylate is copolymerized in a solvent to obtain a copolymer, and as a second step, (meth)acrylic acid is reacted with the copolymer, and as a third step, an anhydride of a dicarboxylic acid or tricarboxylic acid is reacted with the copolymer. Another method for obtaining such a resin (copolymer) having a (meth)acrylic group and a carboxyl group includes a method in which, as a first step, a (meth)acrylic acid or a (meth)acrylic acid ester is copolymerized in a solvent to obtain a copolymer, and as a second step, glycidyl (meth)acrylate is reacted with the copolymer, and as a third step, an anhydride of a dicarboxylic acid or tricarboxylic acid is reacted with the copolymer.

[0063] Yet another example of a suitable compound for such a polymerizable unsaturated group-containing compound is a urethane compound obtained by reacting a polyol compound having an ethylenically unsaturated bond in the molecule as a first component, a diol compound having a carboxyl group in the molecule as a second component, and a diisocyanate compound as a third component.

[0064] In order to promote curing by heat or light, the resin composition preferably contains, together with the above-mentioned (A) component (preferably the polymerizable unsaturated group-containing compound), at least one alkylene oxide modified product of acrylate selected from (meth)acrylates or their oligomers (hereinafter, sometimes simply referred to as "(B) component"). Such (B) component may be an alkylene oxide modified product of (meth)acrylate, an alkylene oxide modified product of an oligomer of the (meth)acrylate, or both of these.

[0065] Examples of (meth)acrylates (meaning acrylates and / or methacrylates) used as raw materials for obtaining such alkylene oxide modified products (component (B)) include those having a hydroxyl group, such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, butanediol mono(meth)acrylate, and chlorohydroxypropyl (meth)acrylate. For example, allyl (meth)acrylate, butoxyethyl (meth)acrylate, butoxytriethylene glycol (meth)acrylate, t-butylaminoethyl (meth)acrylate, caprolactone (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, cyanoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylamino (meth)acrylate, ethoxyethyl (meth)acrylate, ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, isopropyl ... Ctyl (meth)acrylate, lauryl (meth)acrylate, octyl (meth)acrylate, stearyl (meth)acrylate, succinic acid (meth)acrylate, methacryloxypropyltrimethoxysilane, methoxyethyl (meth)acrylate, cyclodecatriene (meth)acrylate, glycerol (meth)acrylate, glycidyl (meth)acrylate, isocyanate ethyl (meth)acrylate, decafluoroheptyl (meth)acrylate, octafluoropentyl (meth)acrylate, tetrafluoropropyl (meth)acrylate aliphatic (meth)acrylates such as cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, morpholine (meth)acrylate, and other alicyclic modified (meth)acrylates; phenoxyethyl (meth)acrylate, phenoxyhydroxypropyl (meth)acrylate,Examples of the aromatic (meth)acrylates include nonylphenoxy polypropylene glycol (meth)acrylate, phenyl (meth)acrylate, phthalic acid (meth)acrylate, and benzyl (meth)acrylate; phosphorus-containing (meth)acrylates include phenoxylated phosphate (meth)acrylate, phosphate (meth)acrylate, butoxylated phosphate (meth)acrylate, and octoxylated phosphate (meth)acrylate; and water-soluble (meth)acrylates include sodium sulfonate (meth)acrylate.

[0066] Further examples of such (meth)acrylates include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, hexanediol (meth)acrylate, long-chain aliphatic di(meth)acrylate, neopentyl glycol di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, stearic acid modified pentaerythritol di(meth)acrylate, propylene di(meth)acrylate, glycerol (meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tetramethylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, acrylate, polyethylene glycol di(meth)acrylate, polypropylene di(meth)acrylate, triglycerol di(meth)acrylate, neopentyl glycol modified trimethylolpropane di(meth)acrylate, allylated cyclohexyl di(meth)acrylate, methoxylated cyclohexyl di(meth)acrylate, acrylated isocyanurate, bis(acryloxyneopentyl glycol) adipate, bisphenol A di(meth)acrylate, tetrabromobisphenol A di(meth)acrylate, bisphenol S di(meth)acrylate, butanediol di(meth)acrylate, phthalic acid di(meth)acrylate, phosphoric acid di(meth)acrylate, and bifunctional compounds such as zinc di(meth)acrylate.

[0067] Further examples of such (meth)acrylates include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerol tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, alkyl-modified dipentaerythritol tri(meth)acrylate, phosphate tri(meth)acrylate, tris(acryloxyethyl)isocyanurate, tris(methacryloxyethyl)isocyanurate, and pentaerythritol tetra(meth)acrylate. Examples of the compound having three or more functional groups include trifunctional or higher functional compounds such as dipentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetraacrylate, alkyl-modified dipentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, alkyl-modified dipentaerythritol penta(meth)acrylate, urethane tri(meth)acrylate, ester tri(meth)acrylate, urethane hexa(meth)acrylate, and ester hexa(meth)acrylate.

[0068] Examples of the (meth)acrylate oligomer that is the raw material of the alkylene oxide modified product (component (B)) include the above-mentioned (meth)acrylate oligomers. Of course, these monofunctional, bifunctional, and trifunctional or higher functional (meth)acrylates or their oligomers can be used alone or in combination of two or more kinds.

[0069] The alkylene oxide modified product (component (B)) can play a role in crosslinking molecules of component (A) (preferably the polymerizable unsaturated group-containing compound) with each other, and in order to exert this function, it is preferable to use one having three or more functionalities. In addition, the acrylic equivalent, which is the molecular weight of the monomer divided by the number of (meth)acrylic groups in one molecule, is preferably 50 to 300, and more preferably 80 to 200. Note that component (B) does not have a free carboxy group.

[0070] In addition, in the resin composition, the content of the (A) component is preferably 10 to 90% by mass based on the total mass of the solid content. In addition, in the resin composition, the content of the (B) component is preferably 5 to 200 parts by mass, more preferably 10 to 80 parts by mass, based on 100 parts by mass of the (A) component. When the content of the (B) component is 5 parts by mass or more based on 100 parts by mass of the (A) component, the resin contains a sufficient number of photoreactive functional groups, so that a sufficient crosslinking structure is formed. When the content of the (B) component is 200 parts by mass or less based on 100 parts by mass of the (A) component, a cured film having sufficient curability can be obtained, so that the pattern edge can be made sharper.

[0071] The resin composition may contain a compound having an epoxy group (hereinafter sometimes simply referred to as "component (C)") for the purpose of improving adhesion to the support. Examples of such component (C) include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol fluorene type epoxy compounds, phenol novolac type epoxy compounds, cresol novolac type epoxy compounds, phenol aralkyl type epoxy compounds, phenol novolac compounds containing a naphthalene skeleton, naphthol aralkyl type epoxy compounds, trisphenol methane type epoxy compounds, tetrakisphenol ethane type epoxy compounds, glycidyl ethers of polyhydric alcohols, glycidyl esters of polycarboxylic acids, copolymers of monomers having a (meth)acrylic group containing glycidyl (meth)acrylate as a unit, such as copolymers of methacrylic acid and glycidyl methacrylate, alicyclic epoxy compounds, such as 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate, polyfunctional epoxy compounds having a dicyclopentadiene skeleton, 1,2-epoxy-4-(2-oxiranyl)cyclohexane adducts of 2,2-bis(hydroxymethyl)-1-butanol, epoxidized polybutadiene, and epoxy compounds having a silicone skeleton. As these components, compounds with an epoxy equivalent of 50 to 500 g / eq are preferred. Furthermore, it is more preferred to use an epoxy compound having two or more epoxy groups in one molecule. The (C) component may be used alone or in combination of two or more types.

[0072] In addition, the resin composition may contain at least one other unsaturated compound selected from other photopolymerizable monomers and oligomers (hereinafter, sometimes simply referred to as "component (E)") in addition to the above-mentioned components (A), (B), and (C) (including a curing agent when used), as a resin or a component for forming a resin (hereinafter, both are collectively referred to as resin components). Examples of such component (E) include various vinyl monomers having one or more unsaturated groups (e.g., (meth)acrylic acid, (meth)acrylate, styrene); various oligomers thereof (e.g., unsaturated group-containing hydrocarbon resins); and the like. In addition, when the resin composition is required to have excellent photocurability, i.e., high sensitivity, depending on its application, it is preferable to blend an oligomer or monomer having two or more polymerizable double bonds (bifunctional), more preferably three or more polymerizable double bonds (trifunctional) in one molecule, as the component (E). Regarding the blending ratio of the above oligomers and monomers, generally, if the blending amount of the tri- or higher functional polyfunctional acrylate, etc. is small, the photocuring does not proceed sufficiently and the exposed parts tend to dissolve, and if the blending amount of the tri- or higher functional polyfunctional acrylate, etc. is too large, even the unexposed parts may not be developable, and the tack-free properties tend to decrease depending on the degree of polymerization and the structure of the acid anhydride.

[0073] The proportions of the (C) and (E) components relative to 100 parts by mass of the (A) component in such a resin component are preferably 0 to 50 parts by mass of the (C) component and 0 to 100 parts by mass of the (E) component, and more preferably 10 to 40 parts by mass of the (C) component and 0 to 40 parts by mass of the (E) component. In addition, the proportion of the (A) component in the resin component is preferably 30 to 80% by mass, the combined proportion of the (B) and (E) components is preferably 10 to 40% by mass, and the proportion of the (C) component is preferably about 5 to 50% by mass.

[0074] Furthermore, the resin composition preferably further contains at least one selected from the group consisting of photopolymerization initiators and sensitizers (hereinafter, sometimes simply referred to as "component (D)") in order to photopolymerize the components in the composition (for example, components that can be contained as components (A), (B), and (E)). As the photopolymerization initiator that can be used as component (D), known photopolymerization initiators, for example, radical-generating ones such as Michler's ketone, and cation-generating ones such as triarylsulfonium salts and diaryliodonium salts, can be appropriately used. Such photopolymerization initiators as component (D) can be used alone, or two or more types can be used in combination. Note that the photopolymerization initiator used as component (D) is not necessarily required when the resin composition is thermally polymerizable, but it is preferable to contain it when a pattern is formed by exposure to light, development, etc.

[0075] Examples of sensitizers that can be used as component (D) include known sensitizers (photosensitizers) such as N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, triethanolamine, triethylamine, etc., and these may be used alone or in combination of two or more. Note that it is preferable to use a combination of the photopolymerization initiator and the sensitizer (photosensitizer) as component (D).

[0076] The amount of the (D) component used (total amount of photopolymerization initiator and sensitizer) is preferably 0 to 10 parts by mass, more preferably 0.01 to 10 parts by mass, and particularly preferably 1 to 5 parts by mass, per 100 parts by mass of the (A) component. The amount of the (D) component used (total amount of photopolymerization initiator and sensitizer) per 100 parts by mass of the total amount of the resin components (total amount of the (A) component, the (B) component, the (C) component, and the (E) component) is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass. If the amount of the (D) component used exceeds 10 parts by mass, the light absorption rate increases, and light tends not to penetrate to the lower part.

[0077] In addition, the resin composition preferably contains a polymerizable unsaturated group-containing compound as component (A) (more preferably a compound represented by the above general formula (1)); component (B); component (C); component (D); and component (E).

[0078] In addition, as the resin composition for forming the uncured region of the resin layer, for example, an uncured resin composition (after solvent removal) obtained by dissolving a resin composition in a solvent, applying a solution (resin composition solution) onto a support or introducing it into a specific region (region to be the uncured region), and then evaporating and removing the solvent may be used. Examples of solvents that can be used to dissolve such resin compositions include alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, 3-methoxy-1-butanol, ethylene glycol monobutyl ether, 3-hydroxy-2-butanone, and diacetone alcohol; terpenes such as α- or β-terpineol; ketones such as acetone, methyl ethyl ketone, cyclohexanone, and N-methyl-2-pyrrolidone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; cellosolve, methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, diethylene glycol ethyl methyl ether, propylene glycol, and the like. Examples of the solvent include glycol ethers such as ethyl acetate, butyl acetate, ethyl lactate, 3-methoxybutyl acetate, 3-methoxy-3-butyl acetate, 3-methoxy-3-methyl-1-butyl acetate, cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate. By dissolving and mixing each component using such a solvent, a uniform solution-like composition can be obtained. Such a solvent may be appropriately used to obtain necessary properties such as coatability, and one type may be used alone, or two or more types may be used in combination.In addition, from the viewpoint of being able to adjust the solution viscosity of the resin composition solution more efficiently, it is preferable to use two or more kinds of solvents. In addition, by using two or more kinds of solvents in this way and appropriately adjusting the blending ratio thereof, the solution viscosity of the resin composition solution can be easily adjusted. Therefore, when two or more kinds of solvents are used, not only is it easy to control the increase or decrease in film thickness, but the spreading speed of the composition can also be adjusted (controlled) so that it spreads evenly on the support during application, so that it is possible to further suppress the occurrence of coating unevenness and striation. Furthermore, when two or more kinds of solvents with different vapor pressures are combined, it is possible to adjust (control) the drying speed of the composition so that only the coating film surface dries immediately after film formation, or conversely, to suppress the drying speed of the composition so that it becomes slow, and thus it is possible to heat the coating film more uniformly during baking. As a result, when two or more kinds of solvents with different vapor pressures are combined, it is also possible to further suppress the occurrence of unevenness in the film thickness. The content of such a solvent changes depending on the target solution viscosity, but it is preferable that it is 60 to 90 mass% with respect to the total amount of the mixture (solution) of the resin composition and the solvent.

[0079] Furthermore, the resin composition may contain a surfactant as necessary in order to adjust the surface tension of the resin composition. Examples of such surfactants include known surfactants such as silicone-based and fluorine-based. Examples of silicone-based surfactants include side chain modified polydimethylsiloxane, both end modified polydimethylsiloxane, one end modified polydimethylsiloxane, and both end modified polydimethylsiloxane of side chain. Examples of fluorine-based surfactants include perfluoroalkylsulfonic acid compounds, perfluoroalkyl carboxylic acid compounds, perfluoroalkyl phosphate compounds, perfluoroalkyl ethylene oxide adducts, and polyoxyalkylene ether polymer compounds having perfluoroalkyl ether groups in the side chain. In addition, such surfactants may be used alone or in combination of two or more. In addition, the amount of the surfactant added is preferably determined while measuring the surface tension of the resin composition so as to satisfy the condition (I) described below, and the range of the amount added is preferably 0.001 to 0.1 mass% in the resin composition. The suitable range of the amount of such surfactant to be added varies depending on the type of surfactant. For example, in the case of a silicone-based surfactant, the amount is preferably 0.001 to 0.005 mass %, and in the case of a fluorine-based surfactant, the amount is preferably 0.01 to 0.1 mass %.

[0080] In addition, by adjusting the blending amount of such a surfactant, it is possible to adjust the surface tension of the resin composition. When the surface tension of such a resin composition is σ and the surface tension of the resin composition excluding the surfactant is σ0, the surface tension of the resin composition can be adjusted by the following formula: 0.85≦σ / σ0≦1 It is preferable to adjust the amount of surfactant to satisfy the condition (I) represented by the following formula. By adjusting the amount of surfactant to satisfy the condition (I), when an element is placed in the uncured region (uncured portion), sinking of the element tends to be more effectively suppressed. Note that, in an experiment, σ0 is usually measured before adding the surfactant, and σ is measured after adding the surfactant. Note that, for example, the method of measuring the surface tension σ and the surface tension σ0 is to use a plate method automatic surface tensiometer (Model: CBVP-Z manufactured by Kyowa Interface Science Co., Ltd.) to measure the surface tension under conditions of an air temperature of 23°C and a humidity of 50%.

[0081] Furthermore, the resin composition may contain additives such as a curing agent, a curing accelerator, a thermal polymerization inhibitor, an antioxidant, a plasticizer, a filler, a leveling agent, an antifoaming agent, and a coupling agent, if necessary.

[0082] As the curing agent usable as such an additive, known compounds that are generally applied to epoxy compounds can be appropriately used. As such, as the curing agent, those used as curing agents for epoxy compounds can be suitably used, and examples thereof include amine compounds, polycarboxylic acid compounds, phenolic resins, amino resins, dicyandiamide, Lewis acid complex compounds, etc. In addition, examples of such polycarboxylic acid compounds include polycarboxylic acids, anhydrides of polycarboxylic acids, and thermally decomposable esters of polycarboxylic acids.

[0083] Furthermore, as the curing accelerator usable as the additive, known compounds known as curing accelerators for epoxy compounds, curing catalysts, latent curing agents, and the like can be appropriately used, and examples thereof include tertiary amines, quaternary ammonium salts, tertiary phosphines, quaternary phosphonium salts, boric acid esters, Lewis acids, organometallic compounds, and imidazoles.

[0084] Examples of the thermal polymerization inhibitor and the antioxidant that can be used as the additive include hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butylcatechol, phenothiazine, hindered phenol compounds, etc. Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, tricresyl phosphate, etc. Examples of the filler include nano-sized particles such as silica and titania that do not inhibit the transparency of the coating film and can be dispersed in an organic solvent. Examples of the leveling agent and the defoaming agent include silicone-based, fluorine-based, and acrylic-based compounds. Examples of the coupling agent that can be used as the additive include silane coupling agents. Examples of the silane coupling agents include 3-acryloxypropyltrimethoxysilane, 3-(glycidyloxy)propyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, etc.

[0085] The resin composition can also be used in the form of a dry film, and a fine pattern can be formed by exposure and development. It is also possible to form an uncured region made of an uncured resin composition (a resin composition that is cured by heat or light) and a cured region made of a cured product of the resin composition in the film.

[0086] The resin layer has an uncured region made of a resin composition that is cured by heat or light, and a cured region made of a cured product of the resin composition. The method for forming such a resin layer is not particularly limited, but for example, a solution of the resin composition obtained by dissolving in a solvent is applied to the surface of a support, and the solvent is removed from the formed coating film by drying (so-called pre-baking may be performed for such drying), and then a photomask is placed on the coating film after the solvent removal, and ultraviolet light is irradiated to cure (photopolymerize) the exposed part, thereby forming a cured region (cured part) made of a cured product of the resin composition and an uncured region (uncured part) made of an uncured resin composition, and a resin layer can be formed on the support. Such photopolymerization can more efficiently form a resin layer having a cured part and an uncured part on the support. In this case, the resin composition forming the uncured region of the resin layer is prepared by dissolving the resin composition in a solvent, and applying the solution (resin composition solution) onto a support, and then evaporating (drying) the solvent from the resulting coating film, and then using the resin composition that remains uncured in the unexposed area as it is. In this way, the resin layer can be easily formed by using the resin composition.

[0087] In addition, in the resin layer, the uncured region is surrounded by a cured product (cured region) of the resin composition so that the uncured resin composition does not move from the uncured region in a planar direction. The state of the cured region and the uncured region will be briefly described below with reference to a preferred embodiment of the resin laminate of the present invention shown in FIG. 1 and FIG. 2. FIG. 1 is a schematic plan view of the surface of a resin layer of a preferred embodiment of the resin laminate of the present invention, as viewed from a direction perpendicular to the surface (normal direction). As shown in FIG. 1, the resin layer 1 has a cured region 1A and an uncured region 1B, and when viewed from the normal direction of the surface of the resin layer 1, the uncured region 1B exists within a boundary line B between the cured region 1A and the uncured region 1B. That is, when viewed from the normal direction of the surface of the resin layer 1, the cured region 1A is formed so as to surround the periphery of the uncured region 1B. In this way, the uncured region 1B is surrounded by the cured product of the resin composition (constituting the cured region 1A), and the planar shape of the uncured region 1B (the shape drawn by the boundary line B) is a geometric shape (circular in this example). Also, FIG. 2 is a cross-sectional view that includes the A-A' line in FIG. 1 and is a cross-sectional view that is perpendicular to the plane shown in FIG. 1 (a plane parallel to the normal direction of the surface of the resin layer). As shown in FIG. 2, a resin layer 1 consisting of the cured region 1A and the uncured region 1B is laminated on a support 2, and the uncured region 1B exists in a region sandwiched between the wall surface (circumferential wall consisting of the cured product of the resin composition) W of the cured region 1A. In this way, the uncured resin composition in the uncured region 1B is surrounded by the cured product of the resin composition so as not to move in the planar direction (the direction as shown by the arrow D1). In other words, the wall surface W of the cured region 1A and the surface S of the support function as a container for containing the uncured resin composition, and are disposed on the support so that the uncured resin composition in the uncured region 1B does not move in the planar direction. In this way, the cured region 1A has a portion that functions as a peripheral wall (frame) surrounding the periphery of the uncured region 1B, and contains (holds) the uncured resin composition together with the surface of the support so that the uncured resin composition does not move from the uncured region 1B toward the surrounding region (in the direction as diagrammatically shown by the arrow D1).

[0088] Although the state of the uncured region has been described above with reference to FIG. 1 and FIG. 2, the embodiment of the resin laminate of the present invention (such as the shape of the resin layer) is not limited thereto. For example, the planar shape of the uncured region shown in FIG. 1 (planar shape of the periphery of the uncured region: the shape formed by the boundary line with the cured region) is circular, but the planar shape of the uncured region is not limited thereto and may be any so-called geometric shape. The "geometric shape" referred to here may be a circle, an ellipse, a polygon (more preferably a regular polygon: for example, an equilateral triangle, a square, a regular pentagon, a regular hexagon, a regular octagon, etc.), or various shapes modified from these. In addition, such a geometric shape (planar shape of the uncured region) is preferably at least one shape selected from the group consisting of a circle, an ellipse, and a polygon (note that the "polygon" referred to here includes not only a normal polygon, but also a shape with rounded corners (so-called round corner shape)). Among such geometric shapes, it is preferable that the shape is substantially the same as the shape of the element to be mounted in the uncured region in order to easily control the direction in which the surface tension acts and the magnitude of the force during mounting. For example, when a square or rectangular element is mounted, the planar shape of the uncured region is preferably a square or a rectangle, respectively. From the viewpoint of moving the element (self-alignment, etc.) in a shorter time, the planar size of the uncured region is preferably in the range of 1.2 to 2.0 times the size of the element to be mounted. Although only one uncured region is formed in the resin layer shown in Figures 1 and 2, the number of uncured regions is not particularly limited, and a plurality of uncured regions may be regularly or irregularly arranged to form a geometric pattern on the surface of the resin layer when viewed in plan.

[0089] The cured region formed in the resin layer has a structural portion formed so that the cured product of the resin composition constituting the region surrounds the uncured region (a portion that functions as a frame surrounding the uncured region: a structural portion formed so as to surround the uncured region so that the resin composition does not move in a planar direction from the uncured region). As described above, such cured and uncured regions can be easily formed by forming a coating film made of a resin composition, and then photocuring the coating film using a mask formed so that the uncured region has a desired shape, and thus a resin layer having the uncured and cured regions can be easily formed.

[0090] The thickness of the resin layer having such a cured region and an uncured region is not particularly limited and may be appropriately adjusted depending on the application, and is preferably within the range of 5 μm to 1000 μm when used for arranging an element, for example. If the thickness of such a resin layer is less than 5 μm, when an element is arranged on the uncured portion, the element tends to sink and the fluidity tends to decrease, while if it exceeds 1000 μm, the uniformity of the film tends to decrease.

[0091] Moreover, the resin composition in the uncured region of the resin layer (uncured resin composition) has a viscosity of 100 Pa·s or less (more preferably 0.5 to 50 Pa·s) at any temperature within the temperature range of 60°C to 150°C. Such a resin composition can be achieved by appropriately adjusting the type and amount of each component contained in the resin composition so that the viscosity at any temperature within the temperature range of 60°C to 150°C is 100 Pa·s or less. That is, by appropriately adjusting the type and amount of each component such as the (A) component and the (B) component, etc., to form a resin composition so that the desired viscosity is obtained in a specific temperature range, it is possible to make the viscosity of the resin composition 100 Pa·s or less at any temperature within the temperature range of 60°C to 150°C. Also, for example, by preparing a resin composition using a resin having a fluorene skeleton and a weight average molecular weight within the range of 1000 to 100000 as the (A) component, it is possible to obtain a resin composition having a viscosity of 100 Pa·s or less at any temperature within the temperature range of 60°C to 150°C.

[0092] Here, as a method for measuring the viscosity of the resin composition in such an uncured region, a method is adopted in which a rheometer is used as a measuring device and the measurement temperature is in the range of room temperature (23° C.) to 200° C. In this case, a film having a thickness of 200 μm made of an uncured resin composition similar to the resin composition in the uncured region (for example, a film obtained by drying a coating of a solution of the resin composition: the drying conditions in this case are not particularly limited and can be appropriately selected depending on the type of solvent, etc., and a condition of drying at 110° C. for 10 minutes may be adopted) is prepared as a sample for measurement, and the viscosity is measured at various temperatures using a rheometer at a temperature range of room temperature (23° C.) to 200° C., at a heating rate of 5° C. / min, and under a load of 7 N (frequency is 1 Hz). In addition, if the viscosity condition (100 Pa·s or less) is satisfied at any temperature within the temperature range of 60°C to 150°C, the fluidity of the resin composition in the uncured region used as the mounting region can be efficiently improved at the temperature during mounting of the element (temperature in the range of 60°C to 150°C), and the arranged element can be mounted at the desired mounting position with high positional accuracy, and the element can be rotated (self-aligned) precisely to the desired direction for mounting. Therefore, for example, even if the viscosity at 60°C exceeds 100 Pa·s, if the viscosity at other temperatures (e.g., 90°C, etc.) within the temperature range of 60°C to 150°C is 100 Pa·s or less, in the present invention, it is judged to be a resin composition having a viscosity of 100 Pa·s or less at any temperature within the temperature range of 60°C to 150°C. Thus, in the present invention, the resin composition in the uncured region may be any composition that satisfies the condition that the viscosity is 100 Pa·s or less at any temperature within the temperature range. It is more preferable to design a resin composition whose viscosity is 100 Pa s or less at a specific temperature, taking into consideration the heating pattern to be used when mounting is performed within a temperature range of 60° C. to 150° C. Furthermore, it is more preferable that the resin composition in such an uncured region is a resin composition whose viscosity is 100 Pa s or less within a temperature range of 80° C. to 110° C., as this allows for more efficient mounting.

[0093] In the present invention, since the viscosity of the resin composition (uncured resin composition) in the uncured region of the resin layer satisfies the above-mentioned condition, when mounting an element in that region, it is possible to set the viscosity of the uncured region to 100 Pa s or less when the resin layer is heated to a mounting temperature within the range of 60°C to 150°C (more preferably 80°C to 110°C). This increases the fluidity of the uncured region and makes it possible to utilize the self-alignment phenomenon caused by the surface tension of the liquid surface. As a result, the elements can be moved and positioned within the uncured region (if there are multiple uncured regions, it is also possible to self-align the elements in each region). The inventors presume that in the present invention, the elements can be rotated with precision to the desired position and orientation for efficient mounting.

[0094] Furthermore, the method for producing the resin laminate of the present invention comprising the support and the resin layer is not particularly limited, and a method can be used, for example, to obtain the resin laminate of the present invention by applying a solution of the resin composition to the surface of a support, pre-baking the formed coating film to remove the solvent, and then applying a photomask to the coating film after the solvent has been removed and irradiating (exposing) it to radiation to cure (photopolymerize) the exposed area to form a cured area (cured area) made of a cured product of the resin composition and an uncured area (uncured area) made of an uncured resin composition, and forming a resin layer having the cured area and the uncured area on the support.

[0095] The method of applying the solution of the resin composition to such a support is not particularly limited, and in addition to the known solution immersion method and spray method, a method using a roller coater, a land coater, a slit coater, or a spinner can be used. After applying to a desired thickness by such a method, the solvent is evaporated and removed by pre-baking to form a coating film (coating) made of the resin composition from which the solvent has been removed. It is preferable that such pre-baking is performed by heating with an oven, a hot plate, or the like. The heating temperature and heating time in the pre-baking are not particularly limited and may be appropriately selected according to the type of solvent contained in the resin composition. For example, pre-baking may be performed under conditions of a heating temperature of 60 to 110° C. and a heating time of 1 to 30 minutes.

[0096] The irradiation (exposure) of ultraviolet light performed after such pre-baking may be performed using a known exposure device. In addition, in such exposure, by exposing through a photomask, only the resin composition in the portion (exposed portion) corresponding to the pattern of the photomask can be exposed to light and cured. In addition, such an exposure device and radiation irradiation conditions may be appropriately selected depending on the type of resin composition, etc. In addition, as the light source, a light source such as an ultra-high pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, a far ultraviolet lamp, etc. can be appropriately used. By performing exposure using such a light source, the resin composition in the exposed portion in the coating film (coating) can be photocured.

[0097] The radiation used for the exposure can be, for example, visible light, ultraviolet light, far ultraviolet light, electron beams, X-rays, etc., and the wavelength of the radiation is preferably in the range of 250 to 450 nm. In this manner, a resin laminate can be obtained.

[0098] Furthermore, when the resin laminate is used to mount an element, the method for arranging (mounting) the element in the uncured region is not particularly limited, but it is preferable to adopt a mounting method in which the element is placed on the uncured region, and then the resin layer is heated to a mounting temperature within a range of 60°C to 150°C (more preferably 80°C to 110°C) to reduce the viscosity of the uncured region to 100 Pa s or less, and the element is arranged at the desired position and in the desired orientation.

[0099] In addition, when the resin laminate is used to mount an element, the element is placed (mounted) in the uncured region of the resin laminate, and then the uncured region is cured (post-cured). There is no particular limitation on the method of post-curing, but a method of irradiating the uncured region with radiation can be used. In this way, the method of irradiating the uncured region with radiation can be the same as the exposure after pre-bake used when obtaining the resin laminate, except that the uncured region is exposed to radiation.

[0100] After the uncured region is cured (post-cured) in this manner, a heat treatment (post-baking) may be performed at 180 to 250°C for 20 to 100 minutes, if necessary. However, when the heat resistance of the support on which the film is formed is low, the composition of the resin composition may be designed so that the post-baking conditions are 80 to 180°C and 30 to 100 minutes, and post-baking may be performed under such conditions. Such post-baking is a process performed for the purpose of increasing the adhesion between the patterned coating film and the support. This is preferably performed by heating with an oven, a hot plate, or the like, as in the pre-baking.

[0101] In this way, the element is disposed (mounted) in the uncured region of the resin laminate, and then the uncured region is cured, A mounting structure can be obtained, which includes a cured resin laminate obtained by curing the resin layer of the resin laminate; and an element disposed in the region where the uncured region of the cured resin layer in the cured resin laminate was present as a mounting region. When using such a mounting structure, the support and the cured film on which the element is mounted may be peeled off as necessary. Such an element will be described later.

[0102] (Implementation structure) The mounting structure of the present invention comprises a cured resin laminate obtained by curing the resin layer of the resin laminate of the present invention described above, and an element arranged in a mounting area in an area where the uncured area of ​​the cured resin layer in the cured resin laminate was previously present.

[0103] The elements implemented in such a mounting structure are, for example, light-emitting elements (light-emitting diodes, semiconductor lasers, electroluminescence (EL) elements, etc.), light-receiving elements (photodiodes, CCD sensors, MOS sensors, etc.), electronic elements (IC chips, etc.), etc. The elements include various elements such as semiconductor elements (light-emitting elements, light-receiving elements, electron transport elements, etc.), piezoelectric elements, pyroelectric elements, optical elements (second harmonic generating elements using nonlinear optical crystals, etc.), dielectric elements (including ferroelectric elements), and superconducting elements, and may be minute parts or elements used in various MEMS (Micro Electro Mechanical Systems) such as optical encoders. The size of the element (chip size) is not particularly limited, but is, for example, 1 mm or less, or, for example, 300 μm or less, or, for example, 100 μm or less. One or more objects are mounted on the board, and the number, type, arrangement, interval, etc. may be appropriately designed according to the purpose and function of the board.

[0104] Such a mounting structure can be obtained by arranging an element in the uncured region of the resin layer of the resin laminate of the present invention as a mounting region, and then curing the uncured region. Such a manufacturing method can be the same as the method described for the resin laminate of the present invention. In the present invention, the "cured resin laminate" refers to the resin layer of the resin laminate of the present invention that has been cured, and can be efficiently formed by curing the uncured region (post-curing: the resin layer may be cured by exposing the entire surface to light) (after curing, the entire resin layer may be post-baked if necessary). EXAMPLES

[0105] The present invention will be described in more detail below based on examples and comparative examples, but the present invention is not limited to the following examples.

[0106] (1) First, the abbreviations of the compounds used in Synthesis Example 1 are shown below. In the Synthesis Example, the compounds are represented by the following abbreviations. BPFE: bisphenol fluorene type epoxy compound (a compound represented by the above general formula (5) (wherein Ar is a benzene ring), epoxy equivalent 256) BPDA: 3,3',4,4'-biphenyltetracarboxylic dianhydride THPA: 1,2,3,6-Tetrahydrophthalic anhydride TPP: Triphenylphosphine AA: Acrylic acid PGMEA: propylene glycol monomethyl ether acetate.

[0107] (2) Next, the methods for evaluating the compounds used in Synthesis Example 1 and the polymerizable unsaturated group-containing compound obtained in Synthesis Example 1 are described below.

[0108] [Measurement of solid concentration] The solid content concentration was calculated by the following formula (I) by impregnating a glass filter (mass: W0(g)) with 1 g of the polymerizable unsaturated group-containing compound solution (A) or 1 g of the resin composition (B) solution obtained in Synthesis Example 1, weighing it (mass after impregnation: W1(g)), and then measuring the mass [W2(g)] after heating at 160°C for 2 hours.

[0109] [Solid content concentration (mass%)] = {(W2-W0) / (W1-W0)}×100 (I).

[0110] [Epoxy equivalent measurement] The epoxy equivalent of the BDPF used in Synthesis Example 1 was determined by dissolving the BDPF in dioxane, adding a solution of tetraethylammonium bromide in acetic acid, and titrating with a 1 / 10N perchloric acid solution using a potentiometric titrator "COM-1600" (manufactured by Hiranuma Sangyo Co., Ltd.).

[0111] [Acid value measurement] The acid value of the polymerizable unsaturated group-containing compound obtained in Synthesis Example 1 was determined by dissolving the polymerizable unsaturated group-containing compound solution (A) in dioxane and then titrating it with a 1 / 10N KOH aqueous solution using a potentiometric titrator “COM-1600” (manufactured by Hiranuma Sangyo Co., Ltd.).

[0112] [Measurement of weight average molecular weight (Mw)] The weight average molecular weight (Mw) of the polymerizable unsaturated group-containing compound obtained in Synthesis Example 1 was measured using gel permeation chromatography (GPC) "HLC-8220GPC" (manufactured by Tosoh Corporation, solvent: tetrahydrofuran, columns: TSKgelSuperH-2000 (2 columns) + TSKgelSuperH-3000 (1 column) + TSKgelSuperH-4000 (1 column) + TSKgelSuperH-5000 (1 column) (manufactured by Tosoh Corporation), temperature: 40°C, rate: 0.6 ml / min) and calculated as a value converted into standard polystyrene (manufactured by Tosoh Corporation, PS-oligomer kit).

[0113] [Reliability assessment] The evaluation substrate manufactured as described below was used as the measurement sample, and a thermal shock tester TSB-1L manufactured by Tabai Espec Corporation was used as the measurement device to carry out a liquid phase immersion test of 250 cycles from -65°C to 125°C (exposure time of 5 minutes each). The relationship between the number of cracks that occurred in the cured film laminated on the dumbbell-shaped patterns on the evaluation substrate and the number of dumbbell-shaped patterns was determined, and the reliability of the cured product of resin composition (B) was determined.

[0114] Reliability = [1-(number of cracks / total number of patterns)] x 100(%) Preparation of Evaluation Substrate A commercially available double-sided copper-clad FR-4 board (MCL-E-67 manufactured by Hitachi Chemical Co., Ltd., copper wiring thickness 18 μm) was used to prepare an evaluation pattern with 1350 × 4 dumbbell-shaped patterns, and the copper surface was roughened by Ebara Densan Co., Ltd.'s Neo Brown Process to obtain an evaluation board. Next, a solution of resin composition (B) was applied to the evaluation board to a thickness of 20 μm by spin coating. Next, the obtained coating film was heated at 110 ° C for 10 minutes to remove the solvent (drying), and then 200 mJ / cm was applied using a 500 W high-pressure mercury lamp. 2 The coating was exposed to light (i-line) and photocured, and then developed using a developer (product name V-2590D, manufactured by Nippon Steel Chemical & Material Co., Ltd.). After that, the coating was post-cured in an air atmosphere at 180°C for 90 minutes to harden the coating, thereby obtaining an evaluation substrate on which a cured film was formed.

[0115] [Resolution evaluation method] A coating film of 20 μm thickness made of a solution of resin composition (B) was formed, and the coating film was heated at 110° C. for 10 minutes to remove the solvent (drying), and then irradiated with 200 mJ / cm 2 using a 500 W high-pressure mercury lamp. 2 The film was exposed to light (i-line) and photocured, and developed using a developer (product name V-2590D, manufactured by Nippon Steel Chemical & Material Co., Ltd.), and then post-cured and cured at 180°C for 90 minutes in an air atmosphere to obtain a cured film. When attempting to form a circuit with a film thickness of 20 μm, the minimum line / space width that could be formed as a circuit was measured, and the measured value (line width) was used as the evaluation resolution.

[0116] [Heat resistance evaluation method] As a measurement sample, a coating film of 20 μm thickness was formed from a solution of resin composition (B), and the coating film was heated at 110° C. for 10 minutes to remove the solvent (dry) to obtain a film made of resin composition (B). After that, the glass transition temperature (Tg point) of resin composition (B) was measured using the film by a known dynamic viscoelasticity method.

[0117] [Viscosity measurement] As a measurement sample, a film of uncured resin composition (B) with a thickness of 200 μm was used, which was obtained by forming a coating film made of a solution of resin composition (B) and then heating it at 110 ° C for 10 minutes to remove the solvent (drying). A rheometer (manufactured by Anton Paar, product name "MCR302") was used as a measurement device, and the viscosity of the resin composition (B) was measured at various temperatures in the temperature range from room temperature (23 ° C) to 200 ° C under the conditions of a temperature rise rate of 5 ° C / min and a load of 7 N (frequency is 1 Hz). In addition, when the solution of resin composition (B) is heated at 110 ° C for 10 minutes or more, even if the heating time is changed (changed in the range of 10 minutes or more), it can be judged that the film obtained after drying is basically made of the same uncured resin composition (B) (because it can be judged that the solvent is sufficiently removed in both cases and the remaining material is the same), and therefore the resin composition (B) forming the uncured region in each example described later can be regarded as a composition equivalent to the composition forming the above measurement sample.

[0118] (Synthesis Example 1) <Preparation process of polymerizable unsaturated group-containing compound> In a 250 mL four-neck flask equipped with a reflux condenser, BPFE (46.64 g, 0.09 mol), AA (13.12 g, 0.18 mol), TPP (0.24 g) and PGMEA (40.00 g) were charged and stirred at 100 to 105° C. for 12 hours to obtain a reaction product. Then, PGMEA (20.00 g) was charged and adjusted so that the solid content was 50 mass%.

[0119] Next, BPDA (13.45 g, 0.05 mol) and THPA (6.96 g, 0.05 mol) were added to the obtained reaction product and stirred at 115 to 120 ° C for 6 hours to obtain a polymerizable unsaturated group-containing compound solution (A). The solid content concentration of the polymerizable unsaturated group-containing compound solution (A) thus obtained was 57.3 mass%, the acid value (solid content equivalent) was 96 mg KOH / g, and Mw by GPC analysis was 3600. In addition, it is clear that the polymerizable unsaturated group-containing compound in the solution (A) is a compound represented by the above general formula (1) from its raw materials, etc.

[0120] <Step of preparing a solution of resin composition (B)> 60 g of the polymerizable unsaturated group-containing compound solution (A) in terms of solid content, 26 g of trimethylolpropane triacrylate ethylene oxide 6 mole adduct (manufactured by Toagosei Co., Ltd., product name: Aronix M-360), 12 g of tetramethylbiphenyl type epoxy resin (manufactured by Yuka Shell Co., Ltd., product name: Epicoat YX-4000), 0.08 g of a sensitizer (Michler's ketone), 2 g of a photopolymerization initiator (manufactured by Ciba-Geigy Co., Ltd., product name: Irgacure 651), and 100 g of PGMEA were mixed and dispersed at room temperature (23° C.) to obtain a solution of resin composition (B) (solvent: PGMEA, solid content: approximately 50% by mass).

[0121] The resin composition (B) contained in the obtained solution was evaluated using the above-mentioned evaluation method, and as a result, the resin composition (B) had a reliability of 100%, a resolution of 20 μm, and a Tg of 200° C. The viscosities of the resin composition (B) measured at each temperature with a rheometer (the viscosities of the resin composition (B) measured at each temperature by the method explained in the above section "Viscosity measurement") are as follows:

[0122] <Viscosity of Resin Composition (B)> 40℃: 3000 Pa·s 50℃: 800 Pa·s 60℃: 300 Pa·s 70℃: 120 Pa·s 80℃: 50 Pa·s 90℃:20Pa·s 100℃: 10Pa·s 110℃:6 Pa·s 120℃: 4 Pa·s 130℃:2Pa·s 140℃:2Pa·s 150℃: 100 Pa·s 160℃: 1500 Pa·s 170℃: 30000 Pa·s 180℃: 80000 Pa·s 200℃: 80,000 Pa·s.

[0123] Example 1 <Implementation Experiment 1-1> A glass substrate was used as a support, and an aluminum base material having dimensions of 10 mm length×10 mm width×20 μm thickness was mounted as an object to be mounted in a mounting area provided on the glass substrate.

[0124] When mounting such a mounted object, first, a frame mold was formed on the glass substrate to resemble a non-mounted area. Such a frame mold was designed so that the planar shape inside the frame was a square with a length of 15 mm and a width of 15 mm, and the depth (height) of the frame was 750 μm. Then, the solution of the resin composition (B) obtained in Synthesis Example 1 was poured into the space inside such a frame mold (a space with a length of 15 mm, a width of 15 mm, and a height of 750 μm), and the solution was heated at 100° C. for 30 minutes to remove the solvent, forming an uncured area made of the uncured resin composition (B) and having a planar shape of a square (geometric shape) with a length of 15 mm and a width of 15 mm. Note that, when mounting the mounted object, such an uncured area was used as a mounting area. In addition, an aluminum base material with a length of 10 mm, a width of 10 mm, and a thickness of 20 μm was prepared as the mounted object.

[0125] Next, the mount (a 10 mm x 10 mm square aluminum substrate) was placed (mounted) so as to be embedded in the mounting area (the uncured area) of a 15 mm x 15 mm square (planar shape) formed on the glass substrate. Immediately after being placed in this manner, the center of the mount was shifted from the center of the square mounting area (frame type), and the sides of the mount were not parallel to the sides of the mounting area, so that the mount was placed at an angle.

[0126] Next, the glass substrate with the mount placed in the mounting area was heated to 80°C. By this heating, the viscosity of the resin composition in the mounting area was reduced to a value in the range of 100 to 1 Pa·s (the viscosity of the resin composition (B) at 80°C was 50 Pa·s), and the fluidity of the resin composition in the mounting area was significantly increased. By this heating to 80°C, the mount (square aluminum base material) placed in the mounting area started to rotate slowly and naturally while moving naturally toward the center of the mounting area. Then, after 1 minute had elapsed since the start of heating to 80°C, the mount was placed so that the center of the mount (square aluminum base material) was located at the center of the mounting area and the sides of the square mounting area and the mount (square aluminum base material) were aligned in parallel, and the movement of the mount stopped in this state. Then, the resin composition (B) in the mounting area was exposed to ultraviolet light over the entire surface, and the mounting area was sufficiently cured. In this manner, the mount (square aluminum base material) was firmly fixed onto the mounting area, and the mount was mounted in the mounting area on the glass substrate.

[0127] From the results of Mounting Experiment 1-1, it was found that by simply heating to the mounting temperature (80°C in this experiment), the viscosity of the resin composition in the mounting area can be reduced to 100 Pa s or less, and the placed mount can be moved to the desired mounting position (the center of the mounting area is assumed to be the mounting position in the design) and mounted efficiently with high positional accuracy, and furthermore, it is possible to rotate the mount naturally so that the orientation of the mount is aligned with the shape of the mounting area. In addition, since it is possible to rotate the mount naturally by heating alone, and to align the orientation of the mount to the shape of the mounting area, it is also possible to mount the mount by self-aligning (self-arranging) when multiple mounting areas are provided.

[0128] <Implementation Experiment 1-2> An experiment (Mounting Experiment 1-2) was conducted in the same manner as Mounting Experiment 1-1, except that the heating temperature was changed from 80°C, in the temperature range of 60 to 150°C, and changes in the movement of the mounted object due to differences in temperature (the length of time it takes for the mounted object to be placed in the desired mounting position and orientation) were confirmed. From such Mounting Experiment 1-2, it was confirmed that the mounted object (square aluminum base material) can be mounted with high positional accuracy in the temperature range of 80°C to 110°C, and can be precisely aligned in the orientation according to the shape of the mounting area. The viscosity of the resin composition (B) in the temperature range of 80°C to 110°C was 100 Pa·s or less in all cases, and the fluidity of the resin composition in the mounting area was sufficiently improved within the above temperature range.

[0129] Example 2 Implementation Experiment 2-1 A glass substrate was used as a support, and a silicon chip measuring 5 mm long x 5 mm wide x 0.1 mm thick was mounted as an object in a mounting area provided on the glass substrate.

[0130] When mounting such a mounted object, first, a glass substrate was used as a support, and the solution of resin composition (B) obtained in Synthesis Example 1 was applied onto this glass substrate to form a coating film having a thickness of 25 μm. The coating film was then heated at 110° C. for 15 minutes to remove the solvent (dry it). The coating film was exposed to light from the support side through a mask so that a square region of 10 mm in length and 10 mm in width on the surface of the coating film was not irradiated with light, thereby forming a cured region made of a cured product of resin composition (B) and an uncured region made of uncured resin composition (B) and having a square planar shape of 10 mm in length and 10 mm in width, surrounded by the cured region, and a resin layer having the cured region and the uncured region was formed on the glass substrate. In the resin layer on the glass substrate, the cured region made of the cured resin composition (B) was used as the non-mounting region of the mount, and the uncured region, which was a square with a planar shape of 10 mm length and 10 mm width, was used as the mounting region of the mount, and a square silicon chip with a length of 5 mm, width of 5 mm, and thickness of 0.1 mm was embedded in the mounting region (the uncured region) and placed (mounted). Immediately after being placed in this manner, the center of the silicon chip (square) was shifted from the center of the mounting region (square), and the sides of the silicon chip and the sides of the mounting region were not parallel, so that the mount was placed at an angle.

[0131] Next, the glass substrate with the mounted object placed in the mounting area was heated to 80°C. By this heating, the viscosity of the uncured resin composition (B) in the mounting area was reduced to a value of 100 Pa·s or less (the viscosity of the resin composition (B) at 80°C was 50 Pa·s), and the fluidity of the resin composition in the mounting area was significantly increased. By this heating to 80°C, the silicon chip placed in the mounting area started to rotate slowly and naturally while moving naturally toward the center of the mounting area. Then, after 1 minute had passed since the start of heating to 80°C, the center of the silicon chip (square) was located at the center of the mounting area (square) and the sides of the mounting area and the sides of the silicon chip were aligned in parallel, and the movement of the silicon chip stopped in this state. Then, the resin composition (B) in the mounting area was exposed to ultraviolet light over the entire surface, and the mounting area was sufficiently cured. In this manner, the silicon chip was firmly fixed onto the mounting area, and the mounted object was mounted onto the mounting area on the glass substrate.

[0132] From such mounting experiment 2-1, it was found that by simply heating to the mounting temperature (80°C), the viscosity of the resin composition in the mounting area can be made to be 100 Pa s or less, and the placed mounted object can be moved to the desired mounting position (the center of the mounting area) by itself, allowing for efficient mounting with high positional accuracy, and furthermore, it is possible to rotate the mounted object by itself so that the orientation of the mounted object is oriented in accordance with the shape of the mounting area. In addition, since it is possible to rotate the mounted object naturally by heating alone, and to align the orientation of the mounted object in accordance with the shape of the mounting area, it is also possible to mount the mounted object by self-aligning (self-arranging) when multiple mounting areas are provided.

[0133] Furthermore, from the results of Mounting Experiment 2-1 and Mounting Experiment 1-1 above, it was found that regardless of the type of mounted object, by setting the viscosity of the resin composition in the mounting area to 100 Pa s or less at the mounting temperature (80°C in this experiment), the mounted object can be moved naturally to the desired position and orientation, and the desired mounting structure can be efficiently manufactured.

[0134] Implementation Experiment 2-2 An experiment (Mounting Experiment 2-2) was conducted in the same manner as Mounting Experiment 2-1, except that the heating temperature was changed from 80°C, in the temperature range of 60 to 150°C, and changes in the movement of the mounted object (silicon chip) due to differences in temperature (the length of time it takes for the mounted object to be placed in the desired mounting position and orientation) were confirmed. From such Mounting Experiment 2-2, it was confirmed that the mounted object can be mounted with high positional accuracy in the temperature range of 80°C to 110°C, and can be precisely aligned in the orientation according to the shape of the mounting area. The viscosity of the resin composition (B) in the temperature range of 80°C to 110°C was 100 Pa s or less in all cases, and the fluidity of the resin composition in the mounting area was sufficiently improved within the temperature range. [Industrial Applicability]

[0135] As described above, according to the present invention, it is possible to provide a resin laminate that, when used as a substrate for mounting elements, allows the elements to be moved to a desired mounting position with high positional accuracy and efficiently positioned, and also allows the elements to be rotated accurately in a desired orientation and efficiently positioned, and a mounting structure obtained using the resin laminate. Therefore, the resin laminate of the present invention is useful as a substrate for mounting elements such as semiconductor elements. [Explanation of symbols]

[0136] 1...resin layer, 1A...cured region in resin layer, 1B...uncured region in resin layer, 2...support, B...boundary of uncured region, W...wall surface of cured region, S...surface of support.

Claims

1. A resin laminate comprising a support and a resin layer laminated on the support, The resin layer has an uncured region made of a resin composition that is cured by heat or light, and a cured region made of a cured product of the resin composition, In the resin layer, the uncured region is surrounded by a cured product of the resin composition so that the uncured resin composition does not move from the uncured region in a planar direction, The planar shape of the uncured region is a geometric shape, The resin composition in the uncured region has a viscosity of 100 Pa·s or less within a temperature range of 80° C. to 110° C., The resin composition contains a compound having a fluorene skeleton, and The compound having a fluorene skeleton is a polymerizable unsaturated group-containing compound represented by the following general formula (1): A resin laminate comprising: [Formula 1] [In formula (1), each Ar is independently an aromatic hydrocarbon group having 6 to 14 carbon atoms, and a portion of the hydrogen atoms bonded to the carbons constituting the aromatic hydrocarbon group may be substituted with an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an arylalkyl group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a cycloalkylalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a halogen group. Each R 1 is independently an alkylene group having 2 to 4 carbon atoms. Each l is independently a number from 0 to 3. Each G is independently a (meth)acryloyl group, a substituent represented by the following general formula (2), or a substituent represented by the following general formula (3). Y is a tetravalent carboxylic acid residue. Each Z is independently a hydrogen atom or a substituent represented by the following general formula (4), and at least one Z is a substituent represented by the following general formula (4). n is a number having an average value of 1 to 20.] [Case 2] [C3] [In formulas (2) and (3), R 2 is a hydrogen atom or a methyl group, R 3 is a divalent alkylene group or alkylarylene group having 2 to 10 carbon atoms, R 4 is a divalent saturated or unsaturated hydrocarbon group having 2 to 20 carbon atoms, and p is a number from 0 to 10.] [C4] [In formula (4), W is a divalent or trivalent carboxylic acid residue, and m is 1 or 2.]

2. 2. The resin laminate according to claim 1, wherein the uncured region is a region for mounting an element.

3. 3. The resin laminate according to claim 1, wherein the uncured region has a planar shape of at least one shape selected from the group consisting of a circle, an ellipse, and a polygon.

4. A cured resin laminate obtained by curing the resin layer of the resin laminate according to any one of claims 1 to 3; an element disposed in a region where the uncured region of the cured resin layer in the cured resin laminate had existed as a mounting region; A mounting structure comprising:

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