Additive Manufacturing Equipment

Abstract

To efficiently inspect a modeled object that has been layered and modeled, thereby shortening a time required for forming the modeled object by layered modeling.SOLUTION: A layered modeling apparatus supplies a powder material to a modeling surface of an object laminates and models a modeled object by irradiating the supplied powder material with a melting beam that melts the powdered material, and includes: a recoater for leveling the powder material on the modeling surface while moving in a first direction along the modeling surface; an irradiation target provided in the recoater for converting an electron beam to X-rays for irradiating the modeling surface with the X-rays for inspection; an electron beam source for irradiating the irradiation target with electron beam; and a detector provided in the recoater for detecting the X-rays scattered on the molding surface after being irradiated with the X-rays converted by the irradiation target.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to additive manufacturing apparatus. [Background technology]

[0002] For example, Patent Document 1 discloses a configuration equipped with a backscattered X-ray system for inspecting an object produced by additive manufacturing. In this configuration, the backscattered X-ray system has an emitter and a detector. The emitter radiates X-rays to the object. A portion of the X-rays radiated to the object passes through a portion of the object and is then scattered in a direction (backward) away from the surface of the object where the X-rays reached the object. The backscattered X-rays are received by a detector. The condition of the object produced by additive manufacturing is inspected based on the amount of X-rays (amount of photons) received by the detector. In the configuration disclosed in Patent Document 1, the emitter and the detector are provided movably relative to a build platform that supports an additively manufactured object. Inspection of the object using the emitter and the detector is performed by moving the emitter and the detector onto the build platform during the build process of additive manufacturing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-108730 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the configuration described in Patent Document 1, the process of inspecting the object by irradiating the object with X-rays using a backscattered X-ray system and the construction process of additive manufacturing are performed separately. In other words, the construction process of additive manufacturing is interrupted by inspecting the object. This poses the problem of a longer time required to form the object by additive manufacturing.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to provide an additive manufacturing device that can efficiently inspect objects produced by additive manufacturing and reduce the time required to form an object by additive manufacturing. [Means for solving the problem]

[0006] In order to solve the above problems, the additive manufacturing apparatus of the present disclosure is an additive manufacturing apparatus that supplies powder material to a modeling surface of an object, melts the powder material by irradiating a melting beam onto the supplied powder material, and additively manufactures the object, and is equipped with a recoater that smoothes the powder material on the modeling surface while moving in a first direction along the modeling surface, an X-ray source provided in the recoater that irradiates the modeling surface with inspection X-rays, and a detector provided in the recoater that detects the X-rays irradiated from the X-ray source and scattered on the modeling surface. The X-rays irradiated to the printing surface are generated by irradiating an irradiation target with an electron beam. The irradiation target is provided in the vicinity of the printing surface along the second direction, and the irradiation target is irradiated with the electron beam and scanned in the second direction to obtain X-rays scanned in the second direction. Effect of the Invention

[0007] According to the additive manufacturing device of the present disclosure, it is possible to efficiently inspect an object produced by additive manufacturing, and to shorten the time required to produce an object by additive manufacturing. [Brief description of the drawings]

[0008] [Figure 1] 1 is a side cross-sectional view showing a schematic configuration of an additive manufacturing apparatus according to a first embodiment of the present disclosure. [Diagram 2] 1 is a plan view showing a schematic configuration of an additive manufacturing apparatus according to an embodiment of the present disclosure. [Diagram 3] FIG. 2 is a side cross-sectional view showing a configuration of an inspection unit of the additive manufacturing apparatus according to an embodiment of the present disclosure. [Figure 4]11 is a diagram showing a displacement of an electron beam irradiation position when an X-ray irradiator moving in a first direction together with a recoater scans an electron beam in a second direction in an inspection unit according to an embodiment of the present disclosure. FIG. [Diagram 5] 2 is a plan view conceptually illustrating an X-ray irradiation region in an inspection unit according to an embodiment of the present disclosure. FIG. [Figure 6] 3 is a cross-sectional view of an X-ray irradiation region in an inspection unit according to an embodiment of the present disclosure viewed from a first direction. FIG. [Figure 7] 13 is a plan view conceptually illustrating an X-ray irradiation region in an inspection unit according to a first modified example of an embodiment of the present disclosure. FIG. [Figure 8] 11 is a cross-sectional view of an X-ray irradiated region in an inspection unit according to a first modified example of an embodiment of the present disclosure, viewed from a first direction. FIG. [Figure 9] 13 is a side cross-sectional view showing the configuration of an inspection unit of an additive manufacturing apparatus according to a second modified example of the embodiment of the present disclosure. FIG. [Figure 10] 13 is a plan view showing an irradiation area of ​​scattered X-rays in a detector in an inspection unit of an additive manufacturing apparatus according to a second modified example of an embodiment of the present disclosure. FIG. [Figure 11] FIG. 13 is a side cross-sectional view showing the configuration of an inspection unit of an additive manufacturing apparatus according to a third modified example of the embodiment of the present disclosure. [Figure 12] FIG. 13 is a plan view showing an example of a coded aperture provided in an inspection unit of an additive manufacturing device according to a third modified example of an embodiment of the present disclosure. [Figure 13] FIG. 11 is a diagram showing an example in which the scanning speed of X-rays is made different in the additive manufacturing apparatus according to the second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] First Embodiment (Configuration of additive manufacturing device) Hereinafter, an additive manufacturing apparatus according to an embodiment of the present disclosure will be described with reference to FIGS. 1 and 2, the layered manufacturing apparatus 1A mainly includes a modeling unit 2 and an inspection unit 10. The modeling unit 2 includes a modeling stage 3, a recoater 4, and a melting beam irradiation unit (not shown).

[0010] The modeling stage 3 has a horizontal object placement surface 3f on its upper surface. The modeling stage 3 is provided so as to be movable up and down in a vertical direction Dv. The modeling stage 3 sequentially descends by a predetermined distance.

[0011] The recoater 4 is disposed above the modeling stage 3. The recoater 4 supplies a powder material P made of metal or the like, which is supplied from a material supply unit (not shown), while uniformly distributing the powder material P onto the modeling object placement surface 3f or onto the modeling object 100 formed on the modeling object placement surface 3f. The recoater 4 is provided so as to be movable in a first direction Da along a horizontal plane perpendicular to the up-down direction Dv. The recoater 4 reciprocates along the first direction Da above the modeling object placement surface 3f of the modeling stage 3 by a recoater driving mechanism (not shown). The recoater 4 extends along the horizontal plane in a second direction Db perpendicular to the first direction Da. The recoater 4 is formed so as to cross the entire modeling object placement surface 3f in the second direction Db. The lower surface 4b of the recoater 4 is along the horizontal plane. In the recoater 4, an edge portion 4e is formed on a first side Da1 in the first direction Da. When viewed from the second direction Db, the edge portion 4e rises upward in the up-down direction Dv from the lower surface 4b. The edge portion 4e extends in the second direction Db. When supplying the powder material P, the recoater 4 moves from the second side Da2 to the first side Da1 in the first direction Da of the modeling stage 3. A material supply unit (not shown) that supplies the powder material P to the recoater 4 is provided on the second side Da2 in the first direction Da of the modeling stage 3. The recoater 4 moves from the second side Da2 to the first side Da1 in the first direction Da, and after reaching the edge of the model, moves back in the opposite direction, thereby supplying the powder material P supplied from the material supply unit while leveling it.

[0012] The melt beam irradiation unit (not shown) irradiates the powder material P supplied onto the object-mounting surface 3f with a melt beam such as a laser beam in a pattern that matches a preset shape of the object 100. The powder material P supplied onto the object-mounting surface 3f is melted by being irradiated with the melt beam. The powder material P melts on the object-mounting surface 3f to generate molten metal. When the molten metal solidifies, a metal layer 100m that forms the object 100 is formed on the object-mounting surface 3f.

[0013] By repeating the supply of the powder material P by the recoater 4, the irradiation of the melting beam by the melting beam irradiation unit (not shown), and the lowering of the modeling stage 3, metal layers 100m are sequentially laminated on the model mounting surface 3f.

[0014] 3, the inspection unit 10 includes an X-ray source 11, a detector 12, and a defect inspection unit 50. The X-ray source 11 and the detector 12 are provided on a first side Da1 in a first direction Da with respect to the recoater 4. The X-ray source 11 includes an electron beam source 13 and an irradiation target 14 .

[0015] The electron beam source 13 irradiates the X-rays converted by the irradiation target 14 onto the printing surface 100f of the object 100 formed on the printing stage 3. The printing surface 100f is the surface of each metal layer 100m that is sequentially stacked on the printing stage 3. The electron beam source 13 is a so-called electron gun, and is provided in a vacuum chamber 15. The vacuum chamber 15 is attached to the recoater 4 together with the detector 12. The vacuum chamber 15 extends from above to below in the vertical direction Dv, inclining toward the first side Da1 of the first direction Da. The vacuum chamber 15 extends so as to cover the entire printing stage 3 in the second direction Db. The vacuum chamber 15 has a hollow sealed structure, and the inside thereof is evacuated to a predetermined vacuum level. The electron beam B1 irradiated from the electron beam source 13 to the irradiation target 14 is deflected in the second direction Db by application of an electric field by a deflection electrode (not shown) or a magnetic field by an electromagnet (not shown) under the control of the electron beam control unit 16A. As shown in Fig. 4, the electron beam control unit 16A causes the electron beam B1 irradiated from the electron beam source 13 to repeatedly scan along the second direction Db within the vacuum chamber 15 while the recoater 4 is moving toward the first side Da1 in the first direction Da.

[0016] As shown in FIG. 3, the electron beam source 13 irradiates an electron beam B1 toward an irradiation target 14 provided in a vacuum chamber 15. The irradiation target 14 converts the electron beam B1 irradiated from the electron beam source 13 into X-rays and irradiates the X-rays X1 toward the printing surface 100f. The irradiation target 14 is provided in the lower part of the vacuum chamber 15. The irradiation target 14 is provided along a plane intersecting with the first direction Da. The irradiation target 14 is continuous along the second direction Db. The bottom of the vacuum chamber 15 is provided with a transmission window 15w through which the X-rays X1 irradiated from the electron beam source 13 and converted by the irradiation target 14 pass. The X-rays X1 converted by the irradiation target 14 and transmitted through the transmission window 15w proceed downwardly at an angle to the second side Da2 in the first direction Da, and are irradiated onto the printing surface 100f. The electron beam source 13 irradiates the irradiation target 14 with the electron beam B1, for example, in a rectangular range as viewed from the first direction Da. As a result, an irradiation area A1 on the printing surface 100f where the X-rays X1 converted by the irradiation target 14 are irradiated has a rectangular shape with rounded corners as viewed from above, as shown in Figures 3 and 5. In this embodiment, the irradiation area A1 on the printing surface 100f where the X-ray intensity is relatively strong is treated as a rectangular area with lengths La and Lb of 7 mm in the first direction Da and second direction Db, respectively.

[0017] 3, the detector 12 is hollow box-shaped and has a rectangular cross section when viewed from the second direction Db. The detector 12 extends in the second direction Db and is provided so as to cover the entire modeling stage 3 in the second direction Db. The detector 12 is supported by an end 4a of the recoater 4 on a first side Da1 in the first direction Da. A part of the detector 12 protrudes from the end 4a of the recoater 4 to the first side Da1 in the first direction Da.

[0018] A line sensor 17 is provided at the top of the detector 12. The line sensor 17 is provided along a plane perpendicular to the up-down direction Dv. The line sensor 17 has a predetermined width dimension in the first direction Da. The line sensor 17 extends continuously in the second direction Db. The line sensor 17 is disposed above the printing surface 100f with a gap therebetween. The line sensor 17 has a plurality of detection pixels (not shown) arranged in the first direction Da and the second direction Db, respectively. The line sensor 17 detects the amount of X-rays irradiated to the line sensor 17 (absorbed dose, number of photons) based on the amount of X-rays detected by each detection pixel (absorbed dose, number of photons).

[0019] An X-ray shielding member 30A is provided on the lower surface of the detector 12. The X-ray shielding member 30A is plate-shaped and provided along a plane perpendicular to the up-down direction Dv. The X-ray shielding member 30A is disposed between the detector 12 and the irradiation area A1 on the printing surface 100f. The X-ray shielding member 30A is disposed on the path of the scattered X-rays X2 backscattered in the irradiation area A1. The X-ray shielding member 30A shields the scattered X-rays X2 backscattered on the printing surface 100f and transmits a part of the scattered X-rays X2. The scattered X-rays X2 that have transmitted through the X-ray beam transmitting member 30A reach the line sensor 17.

[0020] The X-ray shielding member 30A has a plurality of pinholes 31. The pinholes 31 are smaller than the irradiation area A1 of the X-rays scattered on the printing surface 100f. The pinholes 31 are circular and have a diameter of, for example, about 0.4 mm. As shown in FIG. 5, a plurality of pinholes 31 are formed in the X-ray shielding member 30A at equal intervals in the second direction Db. When the minimum defect size to be detected is 0.1 mm, the diameter of the pinholes 31 is preferably 0.4 mm or less.

[0021] The scattered X-rays X2 are irradiated to the line sensor 17 through the pinhole 31. The irradiation area A2 of the scattered X-rays X2 on the line sensor 17 has a shape corresponding to the irradiation area A1 on the printing surface 100f. Here, in this embodiment, the X-ray shielding member 30A is disposed so that, for example, the distance Z in the vertical direction Dv to the printing surface 100f is the same as the distance D in the vertical direction Dv to the line sensor 17 (Z=D). As a result, the irradiation area A2 of the scattered X-rays X2 irradiated to the line sensor 17 through the pinhole 31 has the same area as the irradiation area A1 on the printing surface 100f.

[0022] Here, the interval Pb between the pinholes 31 in the second direction Db is preferably set to, for example, 1 / 2 the length Lb of the irradiation area A1 of the X-rays X1 on the printing surface 100f in the second direction Db (Pb=1 / 2×Lb). Then, as shown in Fig. 5 and Fig. 6, when the X-rays X1 are irradiated, the irradiation areas A2 of the scattered X-rays X2 irradiated to the line sensor 17 through each of the multiple pinholes 31 are formed on both sides of the second direction Db while suppressing interference with each other, when the X-rays X1 are irradiated, as shown in Fig. 5 and Fig. 6. By obtaining the sum of the X-ray doses of the scattered X-rays X2 in the multiple irradiation areas A2 by the line sensor 17, the detection resolution of the scattered X-rays X2 reaching the line sensor 17 is improved.

[0023] The line sensor 17 detects the amount of scattered X-rays (absorbed dose, number of photons) in the thus irradiated irradiation area A2. The line sensor 17 outputs information on the amount of X-rays in the irradiation area A2 to the defect inspection unit 50.

[0024] The defect inspection unit 50 acquires the amount of X-rays (absorbed dose, photon count) irradiated to the line sensor 17. The defect inspection unit 50 judges the presence or absence of defects and the shape of the defects on the printing surface 100f based on the acquired amount of X-rays. At this time, the amount of X-rays detected by the line sensor 17 is lower in the defective portion compared to the surrounding defect-free portions. The defect inspection unit 50 detects the portion where the amount of X-rays (absorbed dose, photon count) is lower, thereby detecting the portion where the defect has occurred on the printing surface 100f. For example, the defect inspection unit 50 judges that a defect exists when the difference in the amount of X-rays (absorbed dose, photon count) with respect to the surrounding defect-free portions is equal to or greater than a preset threshold value. (Action and effect)

[0025] In this embodiment, the additive manufacturing apparatus 1A is provided with the electron beam source 13 and the detector 12 in the recoater 4. Therefore, in parallel with the powder material P being leveled on the molding surface 100f by the recoater 4, the electron beam source 13 irradiates the molding surface 100f with X-rays, and the detector 12 detects the scattered X-rays. Therefore, it is not necessary to interrupt the process of forming the molded object 100 by additive manufacturing to inspect the molding surface 100f. As a result, the inspection of the additively manufactured molded object 100 can be efficiently performed, and the time required to form the molded object 100 by additive manufacturing can be shortened.

[0026] Furthermore, the additive manufacturing apparatus 1A moves the recoater 4 in the first direction Da while scanning the electron beam B1 emitted from the electron beam source 13 along the second direction Db. In this case, the irradiation energy of the electron beam B1 can be reduced compared to the case where the entire surface 100f to be manufactured in the second direction Db is irradiated with the X-rays X1 at once. This makes it possible to reduce the irradiation cost of the electron beam B1.

[0027] Furthermore, the additive manufacturing apparatus 1A does not mechanically move the electron beam source 13 in the second direction Db, but scans the electron beam source 13 in the second direction Db by applying an electric field or a magnetic field. This allows the electron beam B1 to scan in a short time.

[0028] Furthermore, the layered manufacturing apparatus 1A has the irradiation target 14 located closer to the detector 12 than the electron beam source 13. This makes it possible to prevent the X-rays X1 converted by the irradiation target 14 from diffusing before they are irradiated onto the printing surface 100f. This makes it possible to efficiently irradiate the X-rays in a concentrated manner onto the printing surface 100f. This makes it possible to reduce the output of the electron beam B1, making it possible to efficiently inspect the printing surface 100f.

[0029] Furthermore, the layered manufacturing apparatus 1A can inspect the modeling surface 100f with high accuracy by transmitting a portion of the X-rays X2 scattered from the modeling surface 100f through the pinhole 31 provided in the X-ray shielding member 30A.

[0030] Furthermore, the X-ray shielding member 30A has a plurality of pinholes 31. This allows a portion of the scattered X-rays X2 from the printing surface 100f to pass through the pinholes 31 of the X-ray shielding member 30A, thereby increasing the amount of X-rays that reach the detector 12. This improves the detection accuracy of defects on the printing surface 100f.

[0031] (First Modification of the First Embodiment) In the above embodiment, the arrangement interval Pb of the multiple pinholes 31 in the X-ray shielding member 30A is set to 1 / 2 the length Lb of the irradiation region A1 on the modeling surface 100f in the second direction Db, but is not limited to this. For example, as shown in FIGS. 7 and 8, the interval Pb between the pinholes 31 in the X-ray shielding member 30A may be set to ¼ the length Lb of the irradiation area A1 on the modeling surface 100f in the second direction Db. As a result, when the X-rays X1 are scanned in the second direction Db, the irradiation areas A2 of the scattered X-rays X2 irradiated to the line sensor 17 through each of the multiple pinholes 31 overlap each other by half in the second direction Db. Then, the scattered X-rays X2 that have passed through three adjacent pinholes 31 are incident on each detection pixel of the line sensor 17. Therefore, the amount of X-rays detected by the line sensor 17 can be doubled without reducing the amount of irradiation of the scattered X-rays X2 in the X-ray irradiation unit (not shown). Therefore, it is possible to detect the surface condition of the printing surface 100f with higher sensitivity.

[0032] (Second Modification of the First Embodiment) Furthermore, as shown in FIG. 9, the X-ray shielding member 30A may include a plurality of pinholes 31 arranged at equal intervals not only in the second direction Db but also in the first direction Da. When the intervals Pa, Pb between the pinholes 31 in the first direction Da and the second direction Db are set to ¼ of the lengths La, Lb of the irradiation area A1 on the surface to be formed 100f in the first direction Da and the second direction Db, as in the first modified example, the irradiation areas A2 of the scattered X-rays X2 irradiated to the line sensor 17 through the pinholes 31 overlap each other by half in the first direction Da and the second direction Db, as shown in Figs. 9 and 10. Then, the scattered X-rays X2 transmitted through three pinholes 31 adjacent to each other in the first direction Da and the second direction Db (total of nine) are incident on each detection pixel of the line sensor 17. Therefore, as shown in Fig. 10, the amount of the scattered X-rays X2 detected by the line sensor 17 can be increased compared to the first embodiment without increasing the irradiation amount of the electron beam B1 in the electron beam source 13. Therefore, it is possible to detect the surface state of the surface to be formed 100f with higher sensitivity.

[0033] (Third modified example of the first embodiment) In addition, in the above embodiment and each modified example, the X-ray shielding member 30A is provided with a plurality of pinholes 31, but this is not limiting. For example, as shown in FIG. 11 and FIG. 12, the coded aperture 33 may be provided in an X-ray shielding member 30B that shields and partially transmits the X-rays X2 scattered on the printing surface 100f. The coded aperture 33 has a plurality of apertures 33h arranged according to a predetermined rule (code). The scattered X-rays X2 backscattered in the irradiation area A1 of the printing surface 100f are irradiated to the line sensor 17 of the detector 12 through the plurality of apertures 33h of the coded aperture 33. The line sensor 17 can detect the surface state of the printing surface 100f in the irradiation area A1 of the printing surface 100f by inversely calculating the distribution of the amount of X-rays (absorbed dose, number of photons) in each detection pixel of the scattered X-rays X2. Here, as long as the autocorrelation function of the coded aperture 33 is close to a δ function, its type (layout of the plurality of apertures 33h) does not matter.

[0034] Furthermore, if the distance of the X-ray shielding member 30B in the vertical direction Dv relative to the printing surface 100f is Z, the distance of the X-ray shielding member 30B in the vertical direction Dv relative to the line sensor 17 is D, the pitch of the openings 33h in the second direction Db of the coded opening 33 is p (see Figure 12), and the size of the defect on the printing surface 100f to be detected in the second direction Db is Δx, it is preferable to satisfy the following equation (1). p = D / (D + Z) × Δx … (1) Based on the above equation (1), when the distance Z in the vertical direction Dv of the X-ray shielding member 30B relative to the printing surface 100f and the distance D in the vertical direction Dv relative to the line sensor 17 are the same (Z=D), the pitch p of the coded aperture 33 must be 1 / 2 the size Δx of the defect on the printing surface 100f to be detected.

[0035] In this way, the coded aperture 33 transmits a portion of the scattered X-rays X2 from the printing surface 100f, thereby increasing the amount of X-rays that reach the detector 12. Since the coded aperture 33 can have a larger opening area than the pinhole 31, the amount of X-rays that reach the detector 12 can be further increased.

[0036] Second Embodiment Next, a second embodiment of the present invention will be described with reference to Fig. 13. In the second embodiment, components similar to those in the first embodiment are given the same reference numerals and detailed description thereof will be omitted. (Configuration of additive manufacturing device) 3, an electron beam control unit 16B in an additive manufacturing apparatus 1B according to this embodiment controls the electron beam emitted from the electron beam source 13 of the X-ray source 11. The electron beam control unit 16B applies an electric field by a deflection electrode (not shown) or a magnetic field by an electromagnet (not shown) to cause the electron beam B to scan along the second direction Db within the vacuum chamber 15. The electron beam control unit 16B controls the scanning speed at which the electron beam B scans along the second direction Db.

[0037] The electron beam control unit 16B preferably controls the scanning speed of the electron beam B according to, for example, the shape of the printing surface 100f. Specifically, as shown in FIG. 13, it is preferable to slow down the scanning speed of the electron beam B in the portion K1 of the printing surface 100f where the shape is complex, compared to the portion K2 of the printing surface 100f where the shape is flat. Also, based on the shape of the model 100, the scanning of the electron beam B may not be performed in the portion K3 where the model 100 is not formed. The portion K1 of the printing surface 100f where the shape is complex, the portion K2 where the flat, and the portion K3 where the model 100 is not formed may be set, for example, by the operator of the additive manufacturing apparatus 1B or a programmer who creates the operation program of the additive manufacturing apparatus 1B. Also, the setting of the portion K1 of the printing surface 100f where the shape is complex, the portion K2 where the flat, and the portion K3 where the model 100 is not formed may be set based on the design data of the printing surface 100f.

[0038] The electron beam control unit 16B may also control the scanning speed of the electron beam B according to the irradiation conditions of the melt beam irradiated to the printing surface 100f. The melt beam is irradiated to the portion where the printing surface 100f is formed by the irradiation of the melt beam. In contrast, the melt beam is not irradiated to the portion where the printing surface 100f is not formed. In addition, the irradiation conditions, such as the moving speed of the melt beam, the output of the melt beam, and the beam diameter, may be made different between the portion where the printing surface 100f is flat and the portion where the shape of the printing surface 100f is complex. The electron beam control unit 16B may also make the scanning speed of the electron beam B different according to such irradiation conditions of the melt beam. (Action and effect)

[0039] In this embodiment, the additive manufacturing apparatus 1B includes an electron beam control unit 16B that controls the scanning speed at which the electron beam B scans along the second direction Db. This makes it possible to change the scanning speed of the electron beam B when irradiating X-rays to inspect the manufacturing surface 100f. Changing the scanning speed of the electron beam B makes it possible to vary the inspection accuracy of the manufacturing surface 100f.

[0040] Furthermore, the electron beam control unit 16B controls the scanning speed of the electron beam B in accordance with the shape of the printing surface 100f. As a result, for example, when the shape of the printing surface 100f is flat, the scanning speed of the electron beam B is increased, and when the shape of the printing surface 100f is complex, the scanning speed of the electron beam B is decreased, thereby making it possible to make the inspection accuracy and inspection efficiency appropriate in accordance with the shape of the printing surface 100f.

[0041] Furthermore, the electron beam control unit 16B controls the scanning speed of the electron beam B in accordance with the irradiation conditions of the melting beam. This makes it possible to control the scanning speed of the electron beam B according to irradiation conditions such as the moving speed, output, and beam diameter of the melt beam. The irradiation conditions of the melt beam are changed according to, for example, the complexity of the shape of the printing surface 100f. Therefore, by controlling the scanning speed of the electron beam B according to the irradiation conditions of the melt beam, it is possible to make the inspection accuracy and inspection efficiency appropriate according to the shape of the printing surface 100f.

[0042] Furthermore, similarly to the first embodiment, the layered manufacturing apparatus 1B can efficiently inspect the layered object 100, and can shorten the time required to form the object by layered manufacturing.

[0043] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are within the scope of the invention and its equivalents as described in the claims, as well as the scope and gist of the invention.

[0044] <Additional Notes> The layered manufacturing apparatuses 1A and 1B described in the respective embodiments can be understood, for example, as follows.

[0045] (1) The first aspect of the additive manufacturing apparatuses 1A and 1B is an additive manufacturing apparatus that supplies a powder material P to a modeling surface 100f of a model 100 and additively manufactures the model 100 by irradiating the supplied powder material P with a melting beam that melts the powder material P. The additive manufacturing apparatuses 1A and 1B include a recoater 4 that moves in a first direction Da along the modeling surface 100f and smooths the powder material P on the modeling surface 100f, an X-ray source 11 that is provided on the recoater 4 and irradiates the modeling surface 100f with inspection X-rays X1, and a detector 12 that is provided on the recoater 4 and detects X-rays X2 that are irradiated from the X-ray source 11 and scattered by the modeling surface 100f.

[0046] In the additive manufacturing apparatuses 1A and 1B, the electron beam source 13 and the detector 12 are provided in the recoater 4. Therefore, while the powder material P is leveled on the molded surface 100f by the recoater 4, the electron beam source 13 irradiates the molded surface 100f with X-rays X1, and the detector 12 detects the scattered X-rays X2. Therefore, it is not necessary to interrupt the process of forming the molded object 100 by additive manufacturing to inspect the molded surface 100f. As a result, the inspection of the molded object 100 produced by additive manufacturing can be performed efficiently, and the time required to form the object by additive manufacturing can be shortened.

[0047] (2) The second aspect of the additive manufacturing apparatuses 1A and 1B is the additive manufacturing apparatuses 1A and 1B of (1), in which the electron beam source 13 scans the electron beam B1 irradiated to the manufacturing surface 100f along the manufacturing surface 100f and along a second direction Db that intersects the first direction Da.

[0048] As a result, by scanning the electron beam B1 emitted from the electron beam source 13 along the second direction Db while moving the recoater 4 in the first direction Da, the irradiation energy of the electron beam B1 can be reduced compared to the case where the entire surface 100f in the second direction Db is irradiated with X-rays at once, thereby making it possible to reduce the irradiation cost of the electron beam B1.

[0049] (3) The third aspect of the additive manufacturing apparatuses 1A and 1B is the additive manufacturing apparatuses 1A and 1B of (2), in which the electron beam source 13 scans the electron beam B1 in the second direction Db by applying an electric field or a magnetic field to the electron beam B1.

[0050] In this way, by scanning the electron beam source 13 in the second direction Db by applying an electric or magnetic field, rather than mechanically moving the electron beam source 13 in the second direction Db, scanning of the electron beam B1 can be performed in a short time.

[0051] (4) The additive manufacturing apparatus 1B according to a fourth aspect is the additive manufacturing apparatus 1B of (2) or (3), further including an electron beam control unit 16B that controls the scanning speed at which the electron beam B1 is scanned along the second direction Db.

[0052] This allows the scanning speed of the electron beam B1 to be changed when inspecting the printing surface 100f by irradiating it with X-rays. By changing the scanning speed of the electron beam B1, the inspection accuracy of the printing surface 100f can be changed.

[0053] (5) The layered manufacturing apparatus 1B according to a fifth aspect is the layered manufacturing apparatus 1B of (4), in which the electron beam control unit 16B controls the scanning speed of the electron beam B1 in accordance with the shape of the manufacturing surface 100f.

[0054] As a result, for example, when the shape of the printing surface 100f is flat, the scanning speed of the electron beam B1 is increased, and when the shape of the printing surface 100f is complex, the scanning speed of the electron beam B1 is decreased, thereby making it possible to adjust the inspection accuracy and inspection efficiency to be appropriate according to the shape of the printing surface 100f.

[0055] (6) The sixth aspect of the additive manufacturing apparatus 1B is the additive manufacturing apparatus 1B of (4) or (5), wherein the electron beam control unit 16B controls the scanning speed of the electron beam B1 in accordance with the irradiation conditions of the melting beam irradiated to the manufacturing surface 100f.

[0056] This makes it possible to control the scanning speed of the electron beam B1 according to irradiation conditions such as the moving speed, output, and beam diameter of the melt beam. The irradiation conditions of the melt beam are changed according to, for example, the complexity of the shape of the printing surface 100f. Therefore, by controlling the scanning speed of the electron beam B1 according to the irradiation conditions of the melt beam, it is possible to make the inspection accuracy and inspection efficiency appropriate according to the shape of the printing surface 100f.

[0057] (7) The seventh aspect of the additive manufacturing apparatus 1A, 1B is any one of the additive manufacturing apparatuses 1A, 1B of (1) to (6), and further includes an irradiation target 14 that is arranged at a position closer to the detector 12 than the electron beam source 13, is irradiated with the electron beam B1 output from the electron beam source 13, and converts the electron beam B1 into X-rays on the manufacturing surface 100f.

[0058] As a result, by providing the irradiation target 14 at a position closer to the detector 12 than the electron beam source 13, it is possible to prevent the X-rays X1 converted by the irradiation target 14 from being diffused before being irradiated onto the printing surface 100f. This makes it possible to efficiently irradiate the printing surface 100f with the electron beam B1 in a concentrated manner. Therefore, it is possible to suppress the output of the electron beam B1, and it becomes possible to efficiently inspect the printing surface 100f.

[0059] (8) The eighth aspect of the additive manufacturing apparatus 1A, 1B is any one of the additive manufacturing apparatuses 1A, 1B of (1) to (7), and further includes an X-ray shielding member 30A, 30B that blocks the X-rays irradiated to the manufacturing surface 100f and allows some of the X-rays to pass through.

[0060] As a result, the X-ray shielding members 30A and 30B shield the X-rays X2 scattered from the printing surface 100f and allow a portion of the X-rays to pass through, thereby making it possible to inspect the printing surface 100f with high sensitivity.

[0061] (9) The layered manufacturing apparatuses 1A and 1B according to a ninth aspect are the layered manufacturing apparatuses 1A and 1B of (8), in which the X-ray shielding member 30A has a plurality of pinholes 31 that transmit a portion of the X-rays.

[0062] This allows a portion of the scattered X-rays from the printing surface 100f to pass through the multiple pinholes 31 in the X-ray shielding member 30A, thereby increasing the amount of X-rays that reach the detector 12. Adjusting the spacing between the multiple pinholes 31 improves the accuracy of detecting defects on the printing surface 100f.

[0063] (10) The layered manufacturing apparatuses 1A and 1B according to a tenth aspect are the layered manufacturing apparatuses 1A and 1B according to (8), in which the X-ray shielding member 30A has a coded opening 33.

[0064] This allows a portion of the scattered X-rays from the patterned surface 100f to pass through the coded opening 33 of the X-ray shielding member 30A, thereby increasing the amount of X-rays that reach the detector 12. Since the coded opening 33 can have a larger opening area than the pinhole 31, it is possible to further increase the amount of X-rays (absorbed dose, number of photons) that reach the detector 12. [Explanation of symbols]

[0065] 1A, 1B...Layered manufacturing equipment 2…Modeling section 3. Modeling stage 3F: Surface for placing sculptures 4. Recoater 4a...end 4b…Bottom surface 4e…Edge section 10. Inspection Department 11...X-ray source 12…Detector 13...Electron beam source 14…Irradiation target 15…Vacuum chamber 15w…Transparent window 16A, 16B...Electron beam control section 17...Line sensor 30A, 30B...X-ray shielding material 31...Pinhole 33…coded aperture 33h…Aperture 50…Defect Inspection Department 100...Sculpted object 100f…Modeling surface 100m…metal layer A1…irradiation area A2…irradiation area B1…Electron beam X1…X-ray X2…Scattered X-rays Da…First direction Da1…first side Da2…Second side Db…Second direction Dv…Vertical direction K1: Parts with complex shapes on the modeling surface K2: Flat area K3: Area where no object is formed P…Powder material Pa, Pb…Installation interval D: Distance between the X-ray shielding material and the detector Z: Distance between the X-ray shielding material and the modeling surface p...pitch Δx…Size

Claims

1. 1. An additive manufacturing apparatus that supplies a powder material to a modeling surface of a modeled object, and irradiates a melting beam onto the supplied powder material to melt the powder material, thereby additively manufacturing the modeled object, a recoater that moves in a first direction along the building surface while leveling the powder material on the building surface; an X-ray source provided in the recoater and configured to irradiate the molded surface with X-rays for inspection by converting the electron beam; a detector provided in the recoater for detecting the X-rays scattered on the modeling surface when the X-rays are emitted from the X-ray source; Equipped with The recoater, the X-ray source, and the detector move in the first direction together, so that the recoater uniformly distributes the powder material on the building surface, and in parallel, the X-ray source irradiates the building surface with X-rays, and the detector detects the scattered X-rays. Additive manufacturing equipment.

2. The X-ray source is composed of an electron beam source and an irradiation target, and the electron beam source scans the electron beam to be irradiated onto the fabrication surface along the fabrication surface and along a second direction intersecting the first direction, and the irradiation target is arranged along the second direction to scan the X-rays. The additive manufacturing apparatus according to claim 1 .

3. The electron beam source scans the electron beam in the second direction by applying an electric or magnetic field to the electron beam. The additive manufacturing apparatus according to claim 2 .

4. The electron beam control unit further includes: The additive manufacturing apparatus according to claim 2 or 3.

5. The electron beam control unit controls a scanning speed of the electron beam in accordance with a shape of the modeling surface. The additive manufacturing apparatus according to claim 4 .

6. The electron beam control unit controls a scanning speed of the electron beam in accordance with an irradiation condition of the melting beam irradiated onto the manufacturing surface. The additive manufacturing apparatus according to claim 4 or 5.

7. an irradiation target that is provided at a position closer to the detector than the X-ray source, is irradiated with the electron beam output from the electron beam source, and converts the electron beam into X-rays that are irradiated onto the object surface; The additive manufacturing apparatus according to claim 2 .

8. The X-ray shielding member further includes an X-ray shielding member that blocks the X-rays irradiated to the modeling surface and allows a portion of the X-rays to pass through. The additive manufacturing apparatus according to claim 1 .

9. The X-ray shielding member has a plurality of pinholes that transmit a portion of the X-rays. The additive manufacturing apparatus according to claim 8.

10. The X-ray shielding member has a coded aperture. The additive manufacturing apparatus according to claim 8.

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