Vehicle lighting device and vehicle lamp

Abstract

To provide a vehicular lighting device which can inhibit influence of heat generated in a circuit element, and to provide a vehicular lamp fitting.SOLUTION: A vehicular lighting device according to an embodiment includes: a socket containing a high heat conductive resin; a substrate which is provided at one end side of the socket and whose heat conductivity is 2 W / (m K) or higher; a light emitting element provided on a surface, which is opposite to the socket side, of the substrate; and a circuit element which is provided on the surface, which is opposite to the socket side, of the substrate and electrically connected to the light emitting element. The substrate has at least one of a hole which penetrates through the substrate in a thickness direction and a recessed part which is open on the surface, which is opposite to the socket side, of the substrate. The hole or the recessed part is provided at a position overlapping with the circuit element when viewed from a direction perpendicular to the surface, which is opposite to the socket side, of the substrate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] An embodiment of the present invention relates to a vehicle lighting device and a vehicle lamp. [Background technology]

[0002] From the viewpoints of energy saving and long life, vehicle lighting devices equipped with light emitting diodes are becoming more and more popular instead of vehicle lighting devices equipped with filaments. In recent years, in order to protect the vehicle lighting device and to provide multiple functions, a circuit element electrically connected to the light emitting diode may be further provided.

[0003] When a voltage is applied to a vehicle lighting device, light is emitted from the light-emitting diode and heat is generated in the light-emitting diode. If the temperature of the light-emitting diode increases due to the heat generated in the light-emitting diode, the total luminous flux of the light emitted from the light-emitting diode may decrease. Furthermore, if the temperature of the light-emitting diode exceeds the maximum junction temperature, the light-emitting diode may break down or its lifespan may be shortened. For this reason, a limit is set on the value of the current flowing through the light-emitting diode to prevent the temperature of the light-emitting diode from becoming too high.

[0004] However, when a voltage is applied to the vehicle lighting device, a current also flows through the circuit element. When a current flows through the circuit element, heat is also generated in the circuit element. In general, the circuit element is provided on a substrate on which the light-emitting diode is provided. Therefore, the heat generated in the circuit element may be transferred to the light-emitting diode through the substrate, causing the temperature of the light-emitting diode to rise.

[0005] In this case, if the value of the current flowing through the light-emitting diode is further reduced, it is possible to prevent the temperature of the light-emitting diode from increasing even if heat generated in the circuit element is transferred to the light-emitting diode. However, if this is done, it becomes impossible to increase the luminous flux of the vehicle lighting device. Therefore, there has been a demand for the development of a technique capable of suppressing the effects of heat generated in circuit elements. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2011-171277 A Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present invention is to provide a vehicle lighting device and a vehicle lamp capable of suppressing the effects of heat generated in a circuit element. [Means for solving the problem]

[0008] A vehicle lighting device according to an embodiment includes: a socket including a highly thermally conductive resin; a substrate provided on one end of the socket and having a thermal conductivity of 2 W / (m·K) or more; a light-emitting element provided on a surface of the substrate opposite to the socket side; and a circuit element provided on a surface of the substrate opposite to the socket side and electrically connected to the light-emitting element. a heat transfer section including a metal and provided between one end of the socket and the substrate; a first heat transfer body including a metal and provided inside the hole of the substrate, the first heat transfer body having one end in contact with the circuit element and the other end provided on the heat transfer section; The substrate has at least one of a hole penetrating the substrate in a thickness direction and a recess opening on a surface of the substrate opposite to the socket side. When viewed from a direction perpendicular to the surface of the substrate opposite to the socket side, the hole or the recess is provided at a position overlapping the circuit element. A gap is provided between a side surface of the first heat transfer body and an inner wall of the hole in the substrate. Effect of the Invention

[0009] According to the embodiments of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that are capable of suppressing the effects of heat generated in a circuit element. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic exploded view illustrating a vehicle lighting device according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the vehicle lighting device taken along line AA in FIG. 1. [Diagram 3] 2A and 2B are cross-sectional views of the light-emitting module taken along line BB in FIG. [Figure 4] 1A and 1B are schematic cross-sectional views illustrating heat dissipation of a circuit element. [Diagram 5] 1 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

[0012] (Vehicle lighting device) The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railcar. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0013] FIG. 1 is a schematic exploded view illustrating a vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG. As shown in FIGS. 1 and 2, a vehicle lighting device 1 includes a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40, for example.

[0014] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting part 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting part 11 may be columnar. The outer shape of the mounting part 11 is, for example, cylindrical. The mounting part 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

[0015] The bayonet 12 is provided, for example, on a side surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1, for example, to a housing 101 of a vehicle lamp 100 described later. The bayonet 12 may be used for a twist lock.

[0016] The flange 13 has, for example, a plate shape. The flange 13 has, for example, a substantially circular plate shape. A side surface of the flange 13 is located outward of the vehicle lighting device 1 with respect to a side surface of the bayonet 12.

[0017] The heat dissipating fin 14 is provided on the side of the flange 13 opposite to the mounting portion 11. At least one heat dissipating fin 14 can be provided. For example, as shown in FIG. 2, a plurality of heat dissipating fins 14 can be provided on the socket 10. The plurality of heat dissipating fins 14 can be arranged side by side in a predetermined direction. The heat dissipating fin 14 has, for example, a plate or cylinder shape.

[0018] The connector holder 15 is provided on the opposite side of the flange 13 to the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a therein is inserted into the connector holder 15.

[0019] The socket 10 has a function of holding the light-emitting module 20 and the power supply unit 30, and a function of transferring heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably made of a material with high thermal conductivity.

[0020] In recent years, it is desired that the socket 10 is capable of efficiently dissipating heat generated in the light-emitting module 20 and is lightweight. For this reason, the socket 10 can be formed of, for example, a highly thermally conductive resin. The highly thermally conductive resin includes, for example, a resin and a filler using an inorganic material. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon, aluminum oxide, or the like. The thermal conductivity of the highly thermally conductive resin can be, for example, about 8 W / (m·k) to 20 W / (m·k).

[0021] If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 molded integrally, the heat generated in the light-emitting module 20 can be efficiently dissipated. In addition, the weight of the socket 10 can be reduced. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be molded integrally using an injection molding method or the like. Also, the socket 10, power supply portion 30, and heat transfer portion 40 can be molded integrally using an insert molding method.

[0022] The light emitting module 20 (substrate 21) is provided on one end side of the socket 10. For example, the light emitting module 20 is provided on a heat transfer section 40. The light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, and a circuit element 25. The substrate 21 is bonded to, for example, the upper surface of the heat transfer section 40. In this case, it is preferable that the adhesive be an adhesive with high thermal conductivity. The thermal conductivity of the adhesive is, for example, 0.5 W / (m·K) or more and 10 W / (m·K) or less. For example, the adhesive may be an adhesive mixed with a filler using an inorganic material. In this case, an adhesive layer 41 containing a filler using an inorganic material is formed between the substrate 21 and the heat transfer section 40.

[0023] The substrate 21 has a plate shape. The planar shape of the substrate 21 is, for example, a rectangle. The substrate 21 may have a single-layer structure or a multi-layer structure.

[0024] When a voltage is applied to the vehicle lighting device 1, light is emitted from the light-emitting element 22 and heat is generated in the light-emitting element 22. If the temperature of the light-emitting element 22 increases due to the heat generated in the light-emitting element 22, the total luminous flux of the light emitted from the light-emitting element 22 may decrease. Furthermore, if the temperature of the light-emitting element 22 exceeds the maximum junction temperature, the light-emitting element 22 may break down or the life of the light-emitting element 22 may be shortened.

[0025] Therefore, it is preferable that the thermal conductivity of substrate 21 is equal to or higher than 2 W / (m K). For example, substrate 21 is made of ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resin, a metal core substrate, etc. A metal core substrate is a metal plate whose surface is covered with an insulating material.

[0026] Moreover, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is formed from, for example, a material containing silver as a main component or a material containing copper as a main component.

[0027] In addition, a covering portion may be provided to cover the wiring pattern 21a, a film resistor described later, etc. The covering portion may include, for example, a glass material.

[0028] The light emitting element 22 is provided on the surface of the substrate 21 opposite to the socket 10 side. The light emitting element 22 is electrically connected to the wiring pattern 21a. At least one light emitting element 22 can be provided. When a plurality of light emitting elements 22 are provided, the plurality of light emitting elements 22 can be connected in series with each other. The light emitting elements 22 may be, for example, light emitting diodes, organic light emitting diodes, laser diodes, or the like.

[0029] The light emitting element 22 may be a chip-shaped light emitting element, a surface mount type light emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, or a light emitting element having a lead wire such as a bullet type. The light emitting element 22 illustrated in Figs. 1 and 2 is a chip-shaped light emitting element. In this case, in consideration of the miniaturization of the light emitting module 20 and therefore the miniaturization of the vehicle lighting device 1, it is preferable to use a chip-shaped light emitting element. In the following, as an example, a case where the light emitting element 22 is a chip-shaped light emitting element will be described.

[0030] The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-shaped light-emitting element 22 can be, for example, an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, a flip chip type light-emitting element, etc. The chip-shaped light-emitting element 22 illustrated in Figs. 1 and 2 is an upper and lower electrode type light-emitting element. The electrode of the upper electrode type light-emitting element or the upper electrode of the upper and lower electrode type light-emitting element can be electrically connected to the wiring pattern 21a by wiring. In this case, the wiring can be connected by, for example, a wire bonding method. The flip chip type light-emitting element 22 can be directly mounted on the wiring pattern 21a.

[0031] The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those exemplified above, and can be changed as appropriate depending on the size, use, etc. of the vehicle lighting device 1.

[0032] The frame portion 23 is provided on the substrate 21. The frame portion 23 has a frame shape and is bonded to the substrate 21. The frame portion 23 surrounds the light emitting element 22. The frame portion 23 is formed of, for example, a resin. The resin may be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

[0033] Frame 23 can have a function of defining the formation range of sealing portion 24 and a function of a reflector. Therefore, frame 23 can contain titanium oxide particles or the like or a white resin in order to improve reflectance. Also, the frame portion 23 can be omitted. However, if the frame portion 23 is provided, it is possible to improve the efficiency of using the light irradiated from the light emitting element 22. Also, since the area in which the sealing portion 24 is formed can be reduced, it is possible to reduce the size of the light emitting module 20, and therefore the size of the vehicle lighting device 1.

[0034] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having light-transmitting properties. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, a silicone resin or the like. When the frame portion 23 is omitted, for example, a dome-shaped sealing portion 24 is formed on the substrate 21.

[0035] Furthermore, the sealing portion 24 may contain a phosphor. The phosphor may be, for example, a YAG phosphor (yttrium-aluminum-garnet phosphor). However, the type of phosphor may be appropriately changed so as to obtain a predetermined emission color depending on the application of the vehicle lighting device 1.

[0036] The circuit element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The circuit element 25 is provided, for example, on the periphery of the frame portion 23 and is electrically connected to the wiring pattern 21a. That is, the circuit element 25 is provided on the surface of the substrate 21 opposite to the socket 10 side and is electrically connected to the light-emitting element 22. At least one circuit element 25 can be provided.

[0037] The circuit element 25 may be, for example, a resistor 25a, a protection element 25b, and a control element 25c. However, the type of the circuit element 25 is not limited to the exemplified ones, and can be changed appropriately depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, the circuit element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, an integrated circuit, a computing element, etc., in addition to those mentioned above.

[0038] The resistor 25a is provided on the substrate 21. The resistor 25a is electrically connected to the wiring pattern 21a. The resistor 25a may be, for example, a surface mount resistor, a resistor having leads (metal oxide film resistor), or a film resistor formed by using a screen printing method or the like. The resistor 25a illustrated in FIG. 1 is a film resistor.

[0039] The material of the film resistor is, for example, ruthenium oxide (RuO2). The film resistor is formed, for example, by using a screen printing method and a baking method. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, so that the heat dissipation can be improved. In addition, a plurality of resistors 25a can be formed at once. Therefore, the productivity can be improved. In addition, the variation in the resistance value of the plurality of resistors 25a can be suppressed.

[0040] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the voltage applied between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is controlled to be within a predetermined range by the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

[0041] When the resistor 25a is a surface mount resistor or a resistor with leads, the resistor 25a is selected to have an appropriate resistance value according to the forward voltage characteristics of the light emitting element 22. When the resistor 25a is a film resistor, the resistance value can be increased by removing a part of the resistor 25a. For example, a part of the film resistor can be easily removed by irradiating the film resistor with laser light. The number and size of the resistors 25a are not limited to those exemplified, and can be appropriately changed according to the number and specifications of the light emitting elements 22.

[0042] The protective element 25b is provided on the substrate 21. The protective element 25b is electrically connected to the wiring pattern 21a. The protective element 25b is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The protective element 25b can be, for example, a diode. The protective element 25b illustrated in FIG. 1 is a surface-mounted diode.

[0043] The control element 25c is provided on the substrate 21. The control element 25c is electrically connected to the wiring pattern 21a. The control element 25c is provided, for example, to switch the voltage applied to the light-emitting element 22 or to switch among a plurality of light-emitting circuits having the light-emitting element 22. The control element 25c can be, for example, a transistor or an integrated circuit. The transistor is, for example, a FET or a bipolar transistor. The integrated circuit has a switching circuit, a constant current circuit, a lighting circuit, and the like. The control element 25c illustrated in FIG. 1 is a surface-mounted transistor.

[0044] Note that a heat sink 25d may be provided on the circuit element 25. For example, the control element 25c may have a large amount of heat generation (e.g., an integrated circuit having a transistor or a constant current circuit), and therefore the control element 25c may be provided with a heat sink 25d. In this case, the side of the circuit element 25 on which the heat sink 25d is provided is provided on the substrate 21. (See, for example, FIG. 3(a)).

[0045] Other optical elements may be provided as necessary. The optical elements may be provided, for example, on the sealing portion 24. The optical elements may be, for example, a convex lens, a concave lens, a light guide, or the like.

[0046] The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 . The power supply terminals 31 may be rod-shaped. The power supply terminals 31 are arranged, for example, in a predetermined direction. One end of each of the power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of each of the power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted into the power supply terminals 31 exposed inside the hole of the connector holder 15. The power supply terminals 31 are formed of a metal such as a copper alloy. The shape, arrangement, material, and the like of the power supply terminals 31 are not limited to those exemplified, and can be changed as appropriate.

[0047] As described above, it is preferable that the socket 10 is made of a material having high thermal conductivity. However, a material having high thermal conductivity may have electrical conductivity. For example, a highly thermally conductive resin containing a filler using carbon has electrical conductivity. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the socket 10 having electrical conductivity. The holding portion 32 also has a function of holding the multiple power supply terminals 31. When the socket 10 is made of a highly thermally conductive resin having insulating properties (for example, a highly thermally conductive resin containing a filler using aluminum oxide), the holding portion 32 can be omitted. In this case, the socket 10 holds the multiple power supply terminals 31. The holding portion 32 is made of, for example, a resin having insulating properties. The holding portion 32 can be, for example, pressed into a hole provided in the socket 10 or adhered to the inner wall of the hole.

[0048] The heat transfer section 40 has a plate shape and is provided between the socket 10 and the light emitting module 20 (substrate 21). The upper surface of the heat transfer section 40 is exposed from the end of the socket 10 on the side where the light emitting module 20 is provided. For example, as shown in FIG. 2, the heat transfer section 40 can be bonded to the bottom surface 11a1 of the recess 11a. The heat transfer section 40 may be bonded inside a recess provided in the bottom surface 11a1 of the recess 11a. The heat transfer section 40 may be bonded on a convex pedestal provided on the bottom surface 11a1 of the recess 11a. The adhesive for bonding the heat transfer section 40 and the socket 10 is preferably an adhesive with high thermal conductivity. For example, the adhesive may be the same as the adhesive for bonding the light emitting module 20 (substrate 21) and the heat transfer section 40 described above.

[0049] Also, the heat transfer unit 40 and the socket 10 can be molded integrally by insert molding. Also, the heat transfer unit 40 may be attached to the socket 10 via a layer containing thermally conductive grease (heat dissipating grease). The thermally conductive grease is, for example, a mixture of modified silicone and a filler using an inorganic material. The thermal conductivity of the thermally conductive grease is, for example, 1 W / (m·K) or more and 5 W / (m·K) or less.

[0050] The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, the heat transfer section 40 is made of a material with high thermal conductivity. For example, the heat transfer section 40 can be made of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy.

[0051] Furthermore, when a large amount of heat is generated in the light-emitting module 20, at least one heat transfer fin may be further provided. For example, the heat transfer fin may be plate-shaped or columnar, and one end of the heat transfer fin may be provided on the lower surface of the heat transfer section 40 inside the socket 10, and the other end of the heat transfer fin may be provided in the vicinity of the heat dissipation fin 14. The heat transfer section 40 and the heat transfer fin may be formed integrally.

[0052] Furthermore, for example, when the amount of heat generated in the light-emitting module 20 is relatively small, or when the vehicle lighting device 1 is to be made lighter, the heat transfer section 40 may be omitted. When the heat transfer section 40 is omitted, the light emitting module 20 (substrate 21) is adhered to an end of the socket 10. For example, the light emitting module 20 (substrate 21) can be adhered to the bottom surface 11a1 of the recess 11a, or the light emitting module 20 (substrate 21) can be adhered onto a convex pedestal provided on the bottom surface 11a1 of the recess 11a. For example, the adhesive can be the same as the adhesive that adheres the light emitting module 20 (substrate 21) and the heat transfer section 40 described above.

[0053] As described above, if the temperature of the light-emitting element 22 becomes too high when the light-emitting element 22 is turned on, the total luminous flux of the light irradiated from the light-emitting element 22 may decrease, the light-emitting element 22 may break down, or the life of the light-emitting element 22 may be shortened. Since the vehicle lighting device 1 according to this embodiment is provided with the substrate 21 having a thermal conductivity of 2 W / (m·K) or more, the heat generated in the light-emitting element 22 can be efficiently dissipated via the substrate 21.

[0054] Furthermore, when the light-emitting element 22 is turned on, a current also flows through the circuit element 25. When a current flows through the circuit element 25, heat is also generated in the circuit element 25. The heat generated in the circuit element 25 is dissipated through the substrate 21. In this case, if the thermal conductivity of the substrate 21 is high, the heat generated in the circuit element 25 can be efficiently dissipated. However, if the thermal conductivity of the substrate 21 is high, a part of the heat generated in the circuit element 25 is easily transferred to the light-emitting element 22. If a part of the heat generated in the circuit element 25 is transferred to the light-emitting element 22, the temperature of the light-emitting element 22 increases. In other words, if the thermal conductivity of the substrate 21 is 2 W / (m·K) or higher, the temperature of the light-emitting element 22 is easily affected not only by self-heating but also by the heat released from the circuit element 25.

[0055] In recent years, there has been a demand for a more compact vehicle lighting device 1, and the distance between the light emitting element 22 and the circuit element 25 tends to become shorter. In addition, there has been a demand for a higher luminous flux of the vehicle lighting device 1, and the value of the current flowing through the light emitting element 22 and the circuit element 25 tends to become larger. Therefore, the effect of the heat emitted from the circuit element 25 on the temperature of the light emitting element 22 becomes even greater.

[0056] Therefore, in the vehicle lighting device 1 according to this embodiment, by using a substrate 21 having a thermal conductivity of 2 W / (m·K) or more, the heat generated in the light-emitting element 22 is efficiently dissipated via the substrate 21, and the heat emitted from the circuit element 25 is prevented from being transmitted to the light-emitting element 22 via the substrate 21.

[0057] 3(a) and (b) are cross-sectional views of the light-emitting module 20 taken along line BB in FIG. 3(a), a substrate 21 provided in the light-emitting module 20 is provided with a hole 21b penetrating the substrate 21 in the thickness direction. When viewed from a direction perpendicular to the surface of the substrate 21 opposite to the socket 10 side, the hole 21b is provided at a position overlapping the circuit element 25. For example, the hole 21b can be provided between the mounting pads 21a1 on which the circuit element 25 is mounted.

[0058] There are no limitations on the circuit element 25 as long as it affects the temperature of the light-emitting element 22. For example, the circuit element 25 may be one that generates a large amount of heat or is provided near the light-emitting element 22. For example, a control element 25c such as a transistor or an integrated circuit having a constant current circuit generates a large amount of heat. Therefore, in FIG. 3(a), the hole 21b is provided at a position overlapping with the control element 25c.

[0059] If the hole 21b is provided at a position overlapping the circuit element 25, the heat generated in the circuit element 25 is less likely to be transmitted to the substrate 21. Therefore, it is possible to reduce the effect of the heat emitted from the circuit element 25 on the temperature of the light-emitting element 22. As a result, it is possible to prevent the total luminous flux of the light irradiated from the light-emitting element 22 from decreasing and the temperature of the light-emitting element 22 from exceeding the maximum junction temperature. In addition, it becomes easier to reduce the size and increase the luminous flux of the vehicle lighting device 1.

[0060] 3(b), a recess 21c opening to the surface of the substrate 21 opposite to the socket 10 side may be provided. When viewed from a direction perpendicular to the surface of the substrate 21 opposite to the socket 10 side, the recess 21c is provided at a position overlapping the circuit element 25. For example, the recess 21c may be provided between the mounting pads 21a1 on which the circuit element 25 is mounted.

[0061] Even in this way, heat generated in circuit element 25 is less likely to be transmitted to substrate 21. Therefore, the same effect as that of hole 21b described above can be obtained. However, by providing hole 21b, the effect of heat released from circuit element 25 on the temperature of light-emitting element 22 can be reduced more than in the case where recess 21c is provided.

[0062] Here, when the amount of heat generated by the circuit element 25 is large, providing the holes 21b may hinder the heat dissipation of the circuit element 25, causing the temperature of the circuit element 25 to become too high. If the temperature of the circuit element 25 becomes too high, the function of the circuit element 25 may deteriorate, the life of the circuit element 25 may be shortened, or the circuit element 25 may break down.

[0063] 4(a) and (b) are schematic cross-sectional views illustrating heat dissipation of the circuit element 25. FIG. Fig. 4(a) shows a case where a heat transfer section 40 is provided, and Fig. 4(b) shows a case where the heat transfer section 40 is omitted. As shown in FIG. 4(a), a heat conductor 42 (corresponding to an example of a first heat conductor) can be provided inside the hole 21b. For example, the heat conductor 42 has a columnar shape, one end of which is in contact with the circuit element 25, and the other end of which is provided in the heat transfer section 40. When the heat sink 25d is provided in the circuit element 25, the end of the heat conductor 42 can be brought into contact with the heat sink 25d. The heat conductor 42 can be made of a material with high thermal conductivity. For example, the material of the heat conductor 42 can be a metal. For example, the material of the heat conductor 42 can be the same as the material of the heat transfer section 40. If the heat conductor 42 is provided, the heat generated in the circuit element 25 can be transferred to the heat transfer section 40 via the heat conductor 42. Therefore, even if the hole 21b is provided in the substrate 21, the heat of the circuit element 25 can be dissipated, and the temperature of the circuit element 25 can be prevented from increasing.

[0064] Also, a gap is provided between the side surface of the heat transfer body 42 and the inner wall of the hole 21b. If a gap is provided between the side surface of the heat transfer body 42 and the inner wall of the hole 21b, it is possible to suppress the transfer of heat from the heat transfer body 42 to the substrate 21. Therefore, it is possible to suppress the reduction in the effect of the hole 21b described above. In this case, although a part of the side surface of the heat transfer body 42 may be in contact with the inner wall of the hole 21b, it is preferable that a gap is provided between the side surface of the heat transfer body 42 and the inner wall of the hole 21b over the entire area of ​​the side surface of the heat transfer body 42.

[0065] The heat transfer body 42 and the heat transfer section 40 can be formed integrally, or the heat transfer body 42 can be press-fitted into a hole provided in the heat transfer section 40, or the heat transfer body 42 can be joined to the heat transfer section 40 using solder or an adhesive with high thermal conductivity.

[0066] As shown in FIG. 4(b), a heat conductor 42a (corresponding to an example of a second heat conductor) can be provided inside the hole 21b. One end of the heat conductor 42a contacts the circuit element 25, and the other end is provided at one end of the socket 10. The heat conductor 42a can be made of a material with high thermal conductivity. For example, the material of the heat conductor 42a can be a metal. The heat conductor 42a can be pressed into a hole provided in the bottom surface 11a1 of the recess 11a of the socket 10, or can be bonded to the bottom surface 11a1 of the recess 11a using an adhesive with high thermal conductivity, or can be embedded in the bottom surface 11a1 of the recess 11a using an insert molding method or the like.

[0067] Also, the heat transfer body 42a and the socket 10 can be integrally molded using a method such as injection molding. In this case, the heat transfer body 42a can be formed from the same highly thermally conductive resin as the socket 10. Similarly to the heat transfer body 42 described above, a gap is provided between the side surface of the heat transfer body 42a and the inner wall of the hole 21b.

[0068] If heat transfer body 42a is provided, the same effect as that of heat transfer body 42 described above can be obtained. That is, even if hole 21b is provided in substrate 21, heat dissipation from circuit element 25 can be achieved, and thus an increase in the temperature of circuit element 25 can be suppressed. In addition, heat transfer from heat transfer body 42a to substrate 21 can be suppressed. Therefore, a decrease in the effect of hole 21b described above can be suppressed.

[0069] (Vehicle lighting fixtures) Next, the vehicle lamp 100 will be illustrated. In the following, as an example, a case where the vehicular lamp 100 is a front combination light installed in an automobile will be described. However, the vehicular lamp 100 is not limited to a front combination light installed in an automobile. The vehicular lamp 100 may be any vehicular lamp that is installed in an automobile, a railroad car, or the like.

[0070] FIG. 5 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 5, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0071] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end side open. The housing 101 is formed of, for example, a resin that does not transmit light. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that, although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided on the housing 101.

[0072] When mounting the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in a fitting portion provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.

[0073] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have a function such as a lens.

[0074] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in Fig. 5 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0075] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is made of an elastic material such as rubber or silicone resin.

[0076] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. In addition, the bayonet 12 is pressed against the housing 101 by the elastic force of the seal member 104. Therefore, it is possible to prevent the vehicle lighting device 1 from coming off the housing 101.

[0077] The connector 105 is fitted to ends of the multiple power supply terminals 31 exposed inside the connector holder 15. A power source (not shown) and the like are electrically connected to the connector 105. Therefore, by fitting the connector 105 to ends of the multiple power supply terminals 31, the power source (not shown) and the light-emitting element 22 can be electrically connected.

[0078] Furthermore, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the inside of the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0079] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other. [Explanation of symbols]

[0080] REFERENCE SIGNS LIST 1 vehicle lighting device, 10 socket, 11 mounting portion, 11a recess, 11a1 bottom surface, 20 light emitting module, 21 substrate, 21b hole, 21c recess, 22 light emitting element, 25 circuit element, 25c control element, 25d heat sink, 40 heat transfer portion, 42 heat transfer body, 42a heat transfer body, 100 vehicle lamp, 101 housing

Claims

1. A socket including a highly thermally conductive resin; a substrate provided on one end side of the socket and having a thermal conductivity of 2 W / (m·K) or more; a light emitting element provided on a surface of the substrate opposite to the socket; a circuit element provided on a surface of the substrate opposite to the socket side and electrically connected to the light emitting element; a heat transfer portion including a metal and provided between one end of the socket and the substrate; a first heat conductor provided inside the hole of the substrate, including a metal, one end of the first heat conductor being in contact with the circuit element and the other end of the first heat conductor being provided on the heat transfer portion; Equipped with the substrate has at least one of a hole penetrating the substrate in a thickness direction and a recess opening on a surface of the substrate opposite to the socket side, the hole or the recess is provided at a position overlapping with the circuit element when viewed from a direction perpendicular to a surface of the board opposite to the socket side, A vehicle lighting device, wherein a gap is provided between a side surface of the first heat transfer body and an inner wall of the hole of the substrate.

2. A socket including a highly thermally conductive resin; a substrate provided on one end side of the socket and having a thermal conductivity of 2 W / (m·K) or more; a light emitting element provided on a surface of the substrate opposite to the socket; a circuit element provided on a surface of the substrate opposite to the socket side and electrically connected to the light emitting element; a second heat conductor provided inside the hole of the substrate, including a metal or the highly thermally conductive resin, one end of the second heat conductor being in contact with the circuit element and the other end of the second heat conductor being provided at one end of the socket; Equipped with the substrate has at least one of a hole penetrating the substrate in a thickness direction and a recess opening on a surface of the substrate opposite to the socket side, the hole or the recess is provided at a position overlapping with the circuit element when viewed from a direction perpendicular to a surface of the board opposite to the socket side, A vehicle lighting device, wherein a gap is provided between a side surface of the second heat transfer body and an inner wall of the hole of the substrate.

3. the circuit element has a heat sink; 3. The vehicle lighting device according to claim 1, wherein the circuit element is provided on a side where the heat sink is provided on the substrate.

4. A vehicle lighting device according to any one of claims 1 to 3; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with:

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