Connectors and Cables

Abstract

To achieve both suppression an increase in impedance and prevention of short-circuiting.SOLUTION: A connector cable 100 connects a connector 10 and a shield cable 20 via a relay substrate 30. The shield cable 20 at least includes an inner conductor 21, a dielectric 22 covering the inner conductor 21, and a shield member 23 covering the dielectric 22. The inner conductor 21 exposed by removing the shield member 23 and the dielectric 22 is connected to a contact 11 of the connector 10. A GND conductor layer 32 on a surface of a relay substrate 30 is arranged right below the dielectric 22 exposed by removing at least the shield member 23. The GND conductor layer 32 on a surface of the relay substrate 30 arranged right below the part where the shield member 23 is removed is covered with an insulation member 31.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a connector cable. [Background technology]

[0002] Connector cables in which a connector and a shielded cable are connected via a relay board have been known for some time. For example, the following Patent Document 1 discloses a conventional example of a high-speed connector cable in which a contact (3) of an electric connector (1) and a coaxial cable (5) are connected via a relay board (4) as shown in Figs. 27 to 30. In the high-speed connector cable disclosed in Patent Document 1, the coaxial cable (5) is impedance-matched by a core wire (51), an intermediate insulator (52), and a braided shield (53), and the relay board (4) is impedance-matched by a front signal pattern (43), a front ground pattern (44), and a back ground pattern (45) sandwiching an insulating part (42).

[0003] In addition, the symbols used in the explanations of the prior art documents are placed in parentheses to distinguish them from the embodiments of the present invention. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 8-167457 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the portion where the braided shield (53) of the coaxial cable (5) is removed to expose the core wire (51) and intermediate insulator (52) (see FIG. 30) is far from both the front ground pattern (44) and the back ground pattern (45), which increases the impedance. One possible measure to suppress the increase in impedance would be to extend the front ground pattern (44) to just below the portion where the braided shield (53) is removed to expose the core wire (51) and intermediate insulator (52). However, this measure would be difficult to extend the front ground pattern 44, since there is a risk that the extended front ground pattern (44) will short-circuit with the core wire (51) soldered to the adjacent signal pattern (43). In other words, the conventional technology represented by the high-speed connector cable disclosed in Patent Document 1 had a problem in that it was not possible to simultaneously suppress the increase in impedance and prevent short circuits in the portion in which the braided shield (53: shielding material) of a coaxial cable (5: shielded cable) is removed to expose the core wire (51: inner conductor) and intermediate insulator (52: dielectric).

[0006] Therefore, an object of the present invention is to provide a connector cable in which a connector and a shielded cable are connected via a relay board, which achieves both suppression of impedance increases and prevention of short circuits. [Means for solving the problem]

[0007] The connector cable of the present invention is a connector cable in which a connector and a shielded cable are connected via a relay substrate, the shielded cable including at least an internal conductor, a dielectric covering the internal conductor, and a shielding member covering the dielectric, the internal conductor exposed by removing the shielding member and the dielectric is connected to a contact of the connector, a GND conductor layer on the surface of the relay substrate is disposed directly below the dielectric exposed by removing at least the shielding member, and the GND conductor layer on the surface of the relay substrate disposed directly below the portion from which the shielding member has been removed is covered with an insulating member. The connection between the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering, the GND conductor layer on the surface of the relay board is extended to just below the contact of the connector and the connection, and the GND conductor layer just below the connection is cut out.The present invention is characterized in that

[0008] That is, in the connector cable of the present invention, an insulating member and a GND conductor layer are present on the surface of the relay board directly below the portion where the shielding member of the shielded cable has been removed, so that an increase in impedance is effectively suppressed. Also, in the connector cable of the present invention, the connector contact and the inner conductor of the shielded cable are directly connected. Therefore, in the present invention, processing (forming) for bending the inner conductor to the board surface is not required, and the GND conductor layer on the surface of the wiring board located directly below the portion where the shielding member has been removed and the inner conductor of the shielded cable are vertically separated without being adjacent to each other, and an insulating member is interposed between them, so that short circuits are unlikely to occur.

[0009] Another connector cable of the present invention is a connector cable in which a connector and a shielded cable are connected via a relay substrate, the shielded cable including at least an internal conductor, a dielectric covering the internal conductor, and a shielding material covering the dielectric, the internal conductor exposed by removing the shielding material and the dielectric is connected to a contact of the connector, a GND conductor layer on the surface of the relay substrate is disposed directly below at least the dielectric exposed by removing the shielding material, the GND conductor layer on the surface of the relay substrate disposed directly below the portion from which the shielding material was removed is covered with an insulating material, the connection portion between the connector contact and the exposed internal conductor of the shielded cable is connected by soldering, and the relay substrate directly below the connector contact and the exposed internal conductor of the shielded cable is cut out.

[0010] Yet another connector cable of the present invention is a connector cable in which a connector and a shielded cable are connected via a relay substrate, the shielded cable including at least an internal conductor, a dielectric covering the internal conductor, and a shielding material covering the dielectric, the internal conductor exposed by removing the shielding material and the dielectric is connected to a contact of the connector, a GND conductor layer on the surface of the relay substrate is disposed directly below the dielectric exposed by removing at least the shielding material, the GND conductor layer on the surface of the relay substrate disposed directly below the portion from which the shielding material was removed is covered with an insulating material, the contacts of the connector are held by an insulating connector mold, the connection portion between the connector contacts and the exposed internal conductor of the shielded cable is connected by soldering, and the connector mold extends to directly below the contacts of the connector and the connection portion.

[0011] In other words, in the connector cable of the present invention, the connection between the connector contact and the exposed inner conductor of the shielded cable experiences a localized decrease in impedance due to soldering. However, in the present invention, a configuration is adopted in which there is no GND conductor layer directly below the connection, thereby achieving the advantage of suppressing local impedance reduction and enabling better impedance matching.

[0012] In the connector cable of the present invention, the insulating member may be a resist applied to a surface of the GND conductor layer.

[0014] In addition, in the connector cable of the present invention, an unshielded cable is connected to the connector, and at least one of the unshielded cables can be connected to a contact of the connector via a conductor of the relay board.

[0015] Furthermore, in the connector cable of the present invention, the relay substrate also has a GND conductor layer on its back side, and the connector contacts, the shielded cable, and the GND conductor layer can be arranged so as to be mirror-symmetric with the front side. Effect of the Invention

[0016] According to the present invention, it is possible to provide a connector cable in which a connector and a shielded cable are connected via a relay substrate, which achieves both suppression of an increase in impedance and prevention of short circuits. [Brief description of the drawings]

[0017] [Figure 1] FIG. 2 is a perspective view of the connector cable of the first embodiment as viewed from the upper left on the rear side. [Diagram 2] FIG. 2 is a top view of the connector cable of the first embodiment. [Diagram 3] FIG. 2 is a left side view of the connector cable of the first embodiment. [Figure 4] This is a vertical cross-sectional view showing a cross section taken along line AA in Fig. 2. In the upper left corner of this figure, a cross-sectional view is shown in which the range of two arrows indicated by the symbol BB in the figure is enlarged. [Diagram 5] FIG. 2 is an exploded perspective view of the connector cable of the first embodiment as viewed from the upper left rear side. [Figure 6] FIG. 11 is a perspective view of the connector cable of the second embodiment as viewed from the upper left on the back side. [Figure 7] FIG. 11 is a top view of the connector cable of the second embodiment. [Figure 8] FIG. 8 is a vertical cross-sectional view showing a cross section along line DD in FIG. [Figure 9] FIG. 11 is a perspective view of the connector cable of the third embodiment as viewed from the upper left on the rear side. [Figure 10] FIG. 13 is a top view of the connector cable of the third embodiment. [Figure 11] 11 is a vertical cross-sectional view showing a cross section along the line FF in FIG. 10. [Figure 12] FIG. 13 is a bottom view of the connector cable of the third embodiment. [Figure 13] FIG. 13 is a perspective view of the connector cable of the fourth embodiment as viewed from the upper left on the rear side. [Figure 14] FIG. 13 is a top view of the connector cable of the fourth embodiment. [Figure 15]15 is a longitudinal sectional view showing a cross section along line GG in FIG. 14. [Figure 16] FIG. 13 is a perspective view of the connector cable of the fifth embodiment as viewed from the upper left on the rear side. [Figure 17] FIG. 13 is a top view of the connector cable of the fifth embodiment. [Figure 18] 18 is a vertical cross-sectional view showing a cross section along line HH in FIG. 17. [Figure 19] 18 is a vertical cross-sectional view showing a cross section along line II in FIG. 17. [Figure 20] 18 is a vertical cross-sectional view showing a cross section along line JJ in FIG. 17. [Figure 21] FIG. 23 is a perspective view of the connector cable of the sixth embodiment as viewed from the upper left on the rear side. [Figure 22] FIG. 13 is a top view of the connector cable of the sixth embodiment. [Figure 23] FIG. 13 is a right side view of the connector cable of the sixth embodiment. [Figure 24] 23 is a longitudinal sectional view showing a cross section along line KK in FIG. 22. [Diagram 25] 1A to 1C are diagrams showing various specific embodiments that the connector cable of the present invention can take. [Figure 26] 1A to 1C are diagrams showing various other specific embodiments that the connector cable of the present invention can take. [Figure 27] FIG. 1 is an exploded perspective view of the high-speed connector cable according to the invention of Patent Document 1. [Figure 28] FIG. 1 is a perspective view showing a housing and a relay board that constitute the high-speed connector cable according to the invention of Patent Document 1. [Figure 29] FIG. 3A is a front view of a single board constituting a relay board of the high-speed connector cable according to the invention of Patent Document 1, and FIG. 3B is a cross-sectional view taken along line III-III in FIG. 3A. [Diagram 30] FIG. 1 is a perspective view showing a relay board and a coaxial cable of a high-speed connector cable according to the invention of Patent Document 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Preferred embodiments for carrying out the present invention will be described below with reference to the drawings. Note that the following embodiments do not limit the inventions according to the claims, and all of the combinations of features described in the embodiments are not necessarily essential to the solution of the invention.

[0019] [First embodiment] A first embodiment, which is one possible embodiment of a connector cable of the present invention, will be described with reference to Figs. 1 to 5.

[0020] As shown in Figures 1 to 5, the connector cable 100 of the first embodiment has a connector 10, a shielded cable 20, and a relay substrate 30, and is configured to connect the connector 10 and the shielded cable 20 via the relay substrate 30.

[0021] The connector 10 has a mating portion (not shown) on the front side, and contacts 11 made of conductive metal as a connection portion on the rear side. In the connector 10 of the first embodiment, a connection consisting of electrical communication or optical communication between the connector 10 and the mating connector can be established by fitting a mating connector into the mating portion (not shown). The connector 10 of the first embodiment is provided with four contacts 11. As shown in FIG. 2, of the four contacts 11, two contacts 111 arranged in the center are used as a connection portion for high-speed signals, and two contacts 112 arranged at both left and right ends are used as a connection portion for GND (ground).

[0022] The shielded cable 20 includes an inner conductor 21, a dielectric 22 that covers the inner conductor 21, and a shielding member 23 that covers the dielectric 22. The inner conductor 21 of the first embodiment is used as a conductor that transmits high-speed signals. The dielectric 22 of the first embodiment is made of an insulating material such as polyethylene, and covers the entire circumference of the inner conductor 21 to protect it. The shielding member 23 of the first embodiment is a member that further covers the entire circumference of the dielectric 22, and is formed of, for example, a braided wire formed of a meshed copper wire or aluminum flakes. The shielding member 23 serves as an electromagnetic shield to protect the inner conductor 21 that transmits high-speed signals from the effects of electromagnetic waves coming from the outside.

[0023] In the shielded cable 20 of the first embodiment shown in Figs. 1 to 5, a configuration is illustrated in which each of the two inner conductors 21 is covered with a dielectric 22, and the inner conductors 21 covered with the two dielectrics 22 are covered with one shielding member 23. However, the form of the shielded cable applicable to the present invention is not limited to that shown in Figs. 1 to 5. For example, the shielded cable of the present invention may be a coaxial cable in which one inner conductor is covered with a dielectric and a shielding member, a fine coaxial cable, or a high-speed signal cable in a form called an STP (shielded twisted pair) cable or an SPP (shielded parallel pair) cable. In addition, the shielded cable of the present invention may include a cable having a wire called a drain wire built in over the entire length of the cable, or a cable having no built-in wire.

[0024] 4, the relay substrate 30 has a substrate layer 33 formed by attaching two substrates to the bottom surface thereof, and a GND conductor layer 32 is formed on the surface of the substrate layer 33. Moreover, an insulating member 31 made of an insulating material is formed on the upper surface of the GND conductor layer 32 formed on the surface of the substrate layer 33.

[0025] For the substrate layer 33 of the first embodiment, any type of substrate material known in the art can be used, such as a phenolic resin-based resin material, an epoxy resin-based resin material, a glass nonwoven fabric impregnated with an epoxy resin, or an aluminum-based plate material. Also, the insulating member 31 of the first embodiment employs a resist applied to the surface of the GND conductor layer 32. The resist, which is the insulating member 31 of the first embodiment, is a paint material also called solder resist, and prevents solder from adhering to unnecessary parts when soldering, and at the same time, serves as a permanent protective film to protect the relay substrate 30 from dust, heat, moisture, etc., and maintain insulation.

[0026] The connector cable 100 of the first embodiment includes the connector 10, the shielded cable 20, and the relay board 30 described above, and is configured by connecting the connector 10 and the shielded cable 20 via the relay board 30. As shown in Figs. 1 to 4, the connector cable 100 of the first embodiment employs a configuration in which the shielding member 23 and the dielectric 22 are removed from the shielded cable 20 to expose the internal conductor 21, and the exposed internal conductor 21 is directly connected to the high-speed signal contact 111 of the connector 10. The connection between the internal conductor 21 and the high-speed signal contact 111 is performed by soldering. By directly connecting the internal conductor 21 and the high-speed signal contact 111, it is possible to eliminate board wiring loss compared to the conventional connection via a board.

[0027] As for the GND contact 112 provided in the connector 10, as shown in FIG. 5, a GND conductor layer exposed portion 34 is provided on a part of the GND conductor layer 32 on the surface of the relay substrate 30, where no insulating member 31 made of resist is applied, and the GND contact 112 is placed at the position of this GND conductor layer exposed portion 34 and soldered, thereby connecting the GND contact 112 and the GND conductor layer 32.

[0028] In the first embodiment, as shown in Fig. 4, the GND conductor layer 32 on the surface of the relay substrate 30 is disposed directly below the dielectric 22 exposed by removing the shielding member 23, and the GND conductor layer 32 on the surface of the relay substrate 30 disposed directly below the portion from which the shielding member 23 is removed is covered with an insulating member 31 made of resist. In the first embodiment, as shown in Fig. 4, the GND conductor layer 32 on the surface of the relay substrate 30 is extended to a position directly below the high-speed signal contact 111 of the connector 10 and the exposed internal conductor 21 of the shielded cable 20, and the GND conductor layer 32 on the surface of the relay substrate 30 extended to a position directly below the high-speed signal contact 111 of the connector 10 and the exposed internal conductor 21 of the shielded cable 20 is also covered with an insulating member 31 made of resist.

[0029] 4, the GND conductor layer 32 on the surface of the relay substrate 30 is exposed directly below the shielding member 23 of the shielded cable 20 and is not covered with the insulating member 31 made of resist. The shielding member 23 of the shielded cable 20 and the GND conductor layer 32 on the surface of the relay substrate 30 are fixedly connected by solder 41.

[0030] 4, the detailed structure of the connector cable 100 of the first embodiment will be described. The shielding member 23 of the shielded cable 20 is soldered to the GND conductor layer 32 on the surface of the relay substrate 30, thereby providing effects such as noise countermeasures. In other words, the GND conductor layer 32 on the surface of the relay substrate 30 is disposed directly below the shielding member 23 without being covered by the insulating member 31 made of resist.

[0031] On the other hand, where the shielding member 23 of the shielded cable 20 is removed to expose the dielectric 22, the impedance increases because the dielectric 22 is not covered. As a countermeasure to this, the GND conductor layer 32 on the surface of the relay board 30 is disposed in a state covered with an insulating member 31 made of resist at a position directly below the exposed dielectric 22, thereby obtaining the effect of lowering the impedance.

[0032] In other words, the GND conductor layer 32 on the surface of the relay substrate 30 is configured such that, with the position indicated by reference symbol C in Fig. 4 as the boundary, the insulating member 31 made of resist is applied on the connector 10 arrangement side, and the insulating member 31 made of resist is not applied on the side where the shielding member 23 of the shielded cable 20 exists. By taking these measures, impedance matching is achieved in the connector cable 100 of the first embodiment.

[0033] That is, in the connector cable 100 of the first embodiment, since the insulating member 31 and the GND conductor layer 32 are present on the surface of the relay substrate 30 directly below the portion where the shielding member 23 of the shielded cable 20 has been removed, an increase in impedance is effectively suppressed. In addition, in the connector cable 100 of the first embodiment, the contact 111 for high-speed signals of the connector 10 and the internal conductor 21 of the shielded cable 20 are directly connected by soldering, so that, for example, processing (forming) for bending the internal conductor 21 to the substrate surface is not required, and the GND conductor layer 32 on the surface of the relay substrate 30 arranged directly below the portion where the shielding member 23 has been removed and the internal conductor 21 of the shielded cable 20 are separated in the vertical direction without being adjacent to each other, and since the insulating member 31 is interposed between the two members, there is no short circuit. From the above, according to the connector cable 100 of the first embodiment, a connector cable that achieves both suppression of an increase in impedance and prevention of a short circuit can be provided.

[0034] The first embodiment, which is one possible embodiment of the connector cable of the present invention, has been described above using Figs. 1 to 5. However, the technical scope of the present invention is not limited to the scope described in the above first embodiment. Various modifications and improvements can be made to the above first embodiment. Therefore, various possible embodiments of the connector cable of the present invention will be described below. In each embodiment described below, the same reference numerals will be used to designate the same or similar members as those in the above first embodiment, and description thereof will be omitted.

[0035] [Second embodiment] A connector cable 200 according to the second embodiment will be described with reference to FIGS.

[0036] In the connector cable 200 of the second embodiment, as in the case of the first embodiment described above, the connection between the high-speed signal contact 111 of the connector 10 and the exposed inner conductor 21 of the shielded cable 20 is connected by soldering. Furthermore, in the connector cable 200 of the second embodiment, as shown in more detail in Fig. 8, the GND conductor layer 32 on the surface of the relay substrate 30 located directly below the connection between the high-speed signal contact 111 and the inner conductor 21 is cut out in the range indicated by the arrow E in Fig. 8, and the connector cable 200 has a structural feature in which a GND cutout region 321 where the GND conductor layer 32 does not exist is formed.

[0037] Here, since the connection portion between the contact 111 for high-speed signals and the internal conductor 21 is connected by soldering, a phenomenon occurs in which the impedance drops only at this portion. In order to eliminate this phenomenon, in the second embodiment, the GND conductor layer 32 on the surface of the relay substrate 30 is cut out immediately below the connection portion between the contact 111 for high-speed signals and the internal conductor 21, and a GND cutout region 321 where the GND conductor layer 32 does not exist is formed, thereby increasing the impedance. As a result, in the second embodiment, impedance matching can be achieved for the entire connector cable 200. In other words, according to the connector cable 200 of the second embodiment, it is possible to provide a connector cable that achieves both impedance increase suppression and short circuit prevention, and achieves more suitable impedance matching.

[0038] [Third embodiment] A connector cable 300 according to the third embodiment will be described with reference to FIGS.

[0039] In the connector cable 300 of the third embodiment, as in the case of the above-mentioned first embodiment, the connection portion between the high-speed signal contact 111 of the connector 10 and the exposed inner conductor 21 of the shielded cable 20 is connected by soldering. Furthermore, in the connector cable 300 of the third embodiment, as shown in Figures 9 to 12, the relay substrate 30 itself located directly below the connection portion between the high-speed signal contact 111 and the inner conductor 21 is cut out, and the connector cable 300 has a structural feature in which a substrate cutout region 35 where the relay substrate 30 itself is not present is formed.

[0040] Here, since the connection portion between the contact 111 for high-speed signals and the internal conductor 21 is connected by soldering, a phenomenon occurs in which the impedance only at this portion is reduced. In order to eliminate this phenomenon, in the third embodiment, the relay substrate 30 itself is cut out immediately below the connection portion between the contact 111 for high-speed signals and the internal conductor 21, and the substrate cutout region 35 in which the substrate including the GND conductor layer 32 does not exist is formed, thereby increasing the impedance. As a result, in the third embodiment, impedance matching of the entire connector cable 300 can be achieved. In other words, according to the connector cable 300 of the third embodiment, as in the above-mentioned second embodiment, it is possible to provide a connector cable that achieves both impedance increase suppression and short circuit prevention, and achieves more suitable impedance matching.

[0041] [Fourth embodiment] A connector cable 400 according to the fourth embodiment will be described with reference to FIGS.

[0042] In the connector cable 400 of the fourth embodiment, as in the case of the first embodiment described above, the connection portion between the contacts 111 for high-speed signals of the connector 10 and the exposed inner conductor 21 of the shielded cable 20 is connected by soldering. Furthermore, in the connector cable 400 of the fourth embodiment, as shown in Figures 13 to 15, the connector mold 14 constituting the connector 10 by installing the contacts 11 has a connector mold extension portion 15 that extends to just below the contacts 11 and connection portion of the connector 10.

[0043] Here, since the connection portion between the contact 111 for high-speed signals and the internal conductor 21 is connected by soldering, a phenomenon occurs in which the impedance drops only at this portion. In order to eliminate this phenomenon, in the fourth embodiment, the connector mold extension portion 15, which is a part of the connector mold 14, is formed up to a position directly below the connection portion between the contact 111 for high-speed signals and the internal conductor 21, and an area in which the substrate including the GND conductor layer 32 does not exist is formed, thereby increasing the impedance. As a result, in the fourth embodiment, impedance matching of the entire connector cable 400 can be achieved. That is, according to the connector cable 400 of the fourth embodiment, as in the second and third embodiments described above, it is possible to provide a connector cable that achieves both impedance increase suppression and short circuit prevention, and achieves more suitable impedance matching.

[0044] Therefore, the connector cable 200 of the second embodiment, the connector cable 300 of the third embodiment, and the connector cable 400 of the fourth embodiment have the advantage that local impedance reduction can be suppressed and more suitable impedance matching can be achieved.

[0045] [Fifth embodiment] A connector cable 500 according to the fifth embodiment will be described with reference to FIGS.

[0046] In the connector cable 500 of the fifth embodiment, in contrast to the first embodiment described above, a configuration example is shown in which the types of contacts 11 of the connector 10 are diverse and multiple types of contacts 11 are mixed.

[0047] That is, the connector 10 of the fifth embodiment is provided with five contacts 11. As shown in Fig. 17, the five contacts 11 are arranged in the following order from the left end to the right end: one GND (ground) contact 112, two high-speed signal contacts 111, one GND (ground) contact 112, and one power supply (or low-speed signal) contact 113.

[0048] On the other hand, the shielded cable 20 is installed in the same position as in the first to third embodiments, and appropriate impedance matching is achieved. However, the connector cable 500 of the fifth embodiment includes an unshielded cable 25, such as a power cable or a low-speed signal cable, and it is necessary to connect the unshielded cable 25 to the power (or low-speed signal) contacts 113. However, depending on the specifications and usage conditions of the connector cable 500, the unshielded cable 25 and the power (or low-speed signal) contacts 113 may be located apart from each other as shown in FIG. 17, etc.

[0049] As a countermeasure for this case, in the connector cable 500 of the fifth embodiment, two vias 36, 37 are formed in the relay substrate 30, and a substrate internal conductor 38 that connects these two vias 36, 37 is provided inside the relay substrate 30. By adopting such a configuration, the unshielded cable 25 can be connected to the power supply (or low-speed signal) contact 113 of the connector 10 via the substrate internal conductor 38 provided inside the relay substrate 30. In other words, according to the connector cable 500 of the fifth embodiment, the unshielded cable 25 can be connected to the power supply (or low-speed signal) contact 113 of the connector 10 without disturbing the impedance-matched connection state between the high-speed signal contact 111 and the exposed internal conductor 21 of the shielded cable 20. Therefore, according to the fifth embodiment, it is possible to provide a connector cable 500 that allows easy cable routing.

[0050] The vias 36, 37 and the board internal conductor 38 of the fifth embodiment constitute the conductor of the present invention provided inside the relay board 30. With regard to the vias 36, 37 which are the conductor of the present invention, any vias, such as through holes, blind holes, buried holes, etc., that connect different circuit layers are included within the scope of the present invention.

[0051] [Sixth embodiment] A connector cable 600 according to the sixth embodiment will be described with reference to FIGS.

[0052] The connector cable 600 of the sixth embodiment shown in Figures 21 to 24 is formed by preparing two connector cables 100 of the first embodiment described above, attaching the bottom surfaces of the relay substrate 30 of the two connector cables 100 to each other, and arranging the two connector cables 100 so that the connector cable 100 arranged on the back side and the connector cable 100 arranged on the front side are mirror images of each other.

[0053] That is, in the connector cable 600 of the sixth embodiment, the relay substrate 30 is configured to have a GND conductor layer 32 on the back side as well, and the contacts 11 of the connector 10, the shielded cable 20, and the GND conductor layer 32 are arranged so as to be mirror images on the back side and the front side. The connector cable 600 of the sixth embodiment having such an arrangement can also provide a connector cable that achieves both suppression of impedance increase and prevention of short circuits.

[0054] As described above, the connector cables 100, 200, 300, 400, 500, and 600 of the first to sixth embodiments have been described using Figs. 1 to 24 as examples of various forms that the present invention can take. The scope of application of the connector cable of the present invention can be expanded by combining these embodiments in various ways. Figs. 25 and 26 show such specific examples. Note that various electronic components may be mounted on the relay board of the present invention, and in that case, the unshielded cable and the contacts may be connected via the various electronic components.

[0055] [Example 1] The example shown in FIG. 25 is an example in which the connector cable 200 of the second embodiment and the connector cable 500 of the fifth embodiment are combined. With the connector cable of this example, even if the connector 10 has a variety of contacts 11 and a plurality of types of contacts 11 are mixed, the cable can be easily arranged. Therefore, a connector cable with high scalability can be realized. In addition, since the inner conductor 21 of the shielded cable 20 is directly connected to the contacts 111 for high-speed signals of the connector 10, the transmission loss in the relay board 30 can be reduced, and the relay board 30 can be made smaller in the depth direction, which can expand the range of application and reduce costs.

[0056] [Example 2] The embodiment shown in Fig. 26 is an embodiment in which the connector cable 300 of the third embodiment and the connector cable 500 of the fifth embodiment are combined. According to the connector cable of this embodiment, in addition to obtaining the same effect as the embodiment shown in Fig. 25, even if the contact 11 of the connector 10 is misaligned in the vertical direction, for example, the presence of the substrate cutout region 35 makes it easy to correct the positions of the high-speed signal contact 111 and the internal conductor 21, and thus provides an advantage of a high degree of freedom in connection. Furthermore, by adjusting the shapes of the high-speed signal contact 111 and the substrate cutout region 35, impedance matching can be adjusted. [Industrial Applicability]

[0057] The present invention relates to a connector cable in which a connector and a shielded cable are connected via a relay board, and is particularly useful as a connector cable for transmitting high-speed signals. [Explanation of symbols]

[0058] 100 (First embodiment) connector cable 200 (Second embodiment) connector cable 300 (third embodiment) connector cable 400 (fourth embodiment) connector cable 500 (Fifth embodiment) connector cable 600 (sixth embodiment) connector cable 10 Connectors 11 Contact 14 Connector mold 15 Connector mold extension 111 High speed signal contacts 112 GND contact 113 Power (or low-speed signal) contact 20 Shielded Cable 21 Inner conductor 22 Dielectrics 23 Shielding material 25 Unshielded Cable 30 Relay board 31 Insulating materials 32 GND conductor layer 321 GND notch area 33 Substrate Layer 34 GND conductor layer exposed 35 PCB cutout area 36,37 Via (conductor) 38 Internal conductor of board (conductor) 41 Solder

Claims

1. A connector cable in which a connector and a shielded cable are connected via a relay substrate, The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shielding member covering the dielectric, the inner conductor exposed by removing the shielding member and the dielectric is connected to a contact of the connector; a GND conductor layer on a surface of the relay substrate is disposed at least directly below the dielectric exposed by removing the shielding member; the GND conductor layer on the surface of the relay board located directly below the portion from which the shielding member has been removed is covered with an insulating member; a connection portion between the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering; the GND conductor layer on the surface of the relay board is extended to immediately below the contacts and the connection portions of the connector; A connector cable, wherein the GND conductor layer directly below the connection portion is cut out.

2. A connector cable in which a connector and a shielded cable are connected via a relay substrate, The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shielding member covering the dielectric, the inner conductor exposed by removing the shielding member and the dielectric is connected to a contact of the connector; a GND conductor layer on a surface of the relay substrate is disposed at least directly below the dielectric exposed by removing the shielding member; the GND conductor layer on the surface of the relay board located directly below the portion from which the shielding member has been removed is covered with an insulating member; a connection portion between the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering; A connector cable, characterized in that the relay substrate directly below the contact of the connector and the exposed inner conductor of the shielded cable is cut out.

3. A connector cable in which a connector and a shielded cable are connected via a relay substrate, The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shielding member covering the dielectric, the inner conductor exposed by removing the shielding member and the dielectric is connected to a contact of the connector; a GND conductor layer on a surface of the relay substrate is disposed at least directly below the dielectric exposed by removing the shielding member; the GND conductor layer on the surface of the relay board located directly below the portion from which the shielding member has been removed is covered with an insulating member; The contacts of the connector are held in an insulating connector mold; a connection portion between the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering; A connector cable, characterized in that the connector mold extends to immediately below the contacts and the connection portion of the connector.

4. The connector cable according to any one of claims 1 to 3, 4. A connector cable according to claim 1, wherein the insulating member is a resist applied to a surface of a GND conductor layer.

5. The connector cable according to any one of claims 1 to 4, an unshielded cable is connected to the connector; A connector cable, characterized in that at least one of the unshielded cables is connected to a contact of the connector via a conductor of the relay board.

6. The connector cable according to any one of claims 1 to 5, The relay substrate also has a GND conductor layer on the back side, A connector cable, characterized in that the contacts of the connector, the shielded cable, and the GND conductor layer are arranged so as to be mirror-symmetrical with respect to the front side.

Images