Electronic device

Abstract

To reduce the size of a package in which an electronic component such as an imaging element is encapsulated, and at the same time to enable stable fixation to an electronic device.SOLUTION: An electronic device has a substrate on which electronic components are mounted, a cover glass, and a frame for encapsulating a surface of the substrate on which the electronic components are mounted together with the cover glass. An area of at least a part of a surface where the frame and the cover glass are bonded is larger than an area of a surface where the frame and the substrate are bonded.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electronic device configured by sealing electronic components. [Background technology]

[0002] Conventionally, the general packaging configuration for imaging elements has been to mount the imaging element in a package with a concave cavity structure made of ceramic or plastic. However, in recent years, there has been a demand for lighter and smaller devices, so a structure has been proposed in which the imaging element is directly mounted on a printed circuit board made of glass epoxy or the like, as shown in Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-012211 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in Patent Document 1, screws are used to fix the image sensor to the camera, and holes are required for the screws to penetrate, so the frame material constituting the package becomes large, leading to an increase in the size of the camera. In order to make the package as small as possible, it is necessary to make the frame material constituting the package small, but if the frame material is made too small, the area for bonding the cover glass on the upper part of the image sensor becomes small. If the bonding area of ​​the cover glass becomes small, a problem occurs in that the cover glass peels off due to impact of the camera, etc. In addition, if the frame material is made small, a separate method for fixing it to the camera is required. For example, a metal plate or the like may be bonded to the glass epoxy board as a method for fixing it to the camera, but in that case, an excess area is required around the glass epoxy board, and the area of ​​the glass epoxy board on which the components are mounted becomes large, resulting in a large package.

[0005] The present invention has been made in consideration of the above problems, and has an object to reduce the size of a package that encapsulates an electronic component such as an imaging element, and to enable the package to be stably fixed to an electronic device.

[0006] Another object of the present invention is to improve the heat dissipation properties of an electronic component sealed in a package. [Means for solving the problem]

[0007] In order to achieve the above object, an electronic device of the present invention includes a substrate on which an electronic component is mounted, a cover glass, and a frame for sealing the surface of the substrate on which the electronic component is mounted together with the cover glass; A support member for supporting the frame; and an area of ​​at least a part of the surface for bonding the frame and the cover glass is larger than an area of ​​the surface for bonding the frame and the substrate. At least a portion of the surface has a shape extending outward, and the support member supports the frame with a surface of the portion of the frame having the shape extending outward, the surface being opposite to the surface bonded to the cover glass, and the frame and the support member are bonded and fixed together with an adhesive. It is characterized by: Effect of the Invention

[0008] According to the present invention, it is possible to reduce the size of a package in which an electronic component such as an imaging element is sealed, and to enable the package to be stably fixed to an electronic device.

[0009] In addition, the heat dissipation properties of the electronic components sealed in the package can be improved. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of an image sensor unit according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic diagram illustrating a configuration for holding an image sensor unit in an image pickup device according to the first embodiment. [Diagram 3] 5 is a cross-sectional view illustrating a schematic configuration for holding the image sensor unit in the image pickup device according to the first embodiment. FIG. [Figure 4] FIG. 1 is a cross-sectional view showing a schematic configuration of an imaging device according to first to fourth embodiments. [Diagram 5]FIG. 1 is an exploded perspective view showing a schematic configuration of an anti-shake device for an imaging device according to first to fourth embodiments. [Figure 6] FIG. 13 is a diagram showing a schematic configuration of an image sensor unit according to a modified example. [Figure 7] FIG. 13 is a diagram showing another example of the schematic configuration of the image sensor unit in the modified example. [Figure 8] FIG. 11 is a schematic diagram showing a schematic configuration of an electronic component and a support member for the electronic component according to a second embodiment. [Figure 9] FIG. 13 is a schematic diagram showing a schematic configuration of an electronic component according to a third embodiment. [Figure 10] FIG. 13 is a schematic diagram showing a schematic configuration of an electronic component and a support member for the electronic component according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] <First embodiment> A first embodiment of the present invention will now be described with reference to the drawings. Fig. 1 is a diagram showing a schematic configuration of an image sensor unit in the first embodiment. Fig. 1(a) is a schematic top view taken along line B-B' in Fig. 1(b), and Fig. 1(b) is a schematic cross-sectional view taken along line A-A' in Fig. 1(a). The image sensor unit 100 is mainly composed of an image sensor 101, a substrate 102, a frame 103, and a cover glass 104.

[0013] The imaging element 101 is, for example, a CCD image sensor, a CMOS image sensor, an organic thin-film imaging element, an infrared sensor such as a bolometer, or the like, but is not limited to these.

[0014] The substrate 102 is a printed circuit board having a flat plate shape, and is preferably a rigid substrate such as a glass epoxy substrate, a composite substrate, a glass composite substrate, a bakelite substrate, a metal core substrate, or a ceramic substrate.

[0015] The frame 103, together with the substrate 102 and the cover glass 104, serves to seal the imaging element 101. It is desirable for the frame 103 to be made of an elastic resin material, taking into consideration peeling or warping that may occur when the temperature changes due to differences in the linear expansion coefficient after the frame 103 is bonded to the substrate 102 or the cover glass 104. Examples of the resin that can be used include thermoplastic resins such as polyethylene resin, polypropylene resin, ethylene-vinyl acetate resin, polystyrene, AS resin, ABS resin, acrylic resin, polyvinyl chloride, cellulose-based resin, polyacetal, polyamide, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, modified polyphenylene ether, polyphenylene sulfide, liquid crystal polymer, polysulfone, polyether sulfone, polyarylate, polyamide-imide, polyether-imide, and polymethylpentene.

[0016] In order to stably maintain strength and shape over a wide temperature range from -40°C to 130°C, a thermosetting resin is preferred. As thermosetting resins, phenolic resin, urea resin, melamine resin, diallyl phthalate resin, unsaturated polyester resin, polyimide resin, urethane resin, etc. are possible, but those mainly composed of epoxy resin are preferred. In particular, those based on bisphenol A or novolac glycidyl ether type resin, to which an aromatic amine curing agent, a phenolic resin curing agent or an acid anhydride curing agent, and a filler are blended are preferred.

[0017] The cover glass 104 serves as a window that transmits light to the image sensor 101, and may be made of plastic, glass, quartz, or the like.

[0018] The substrate 102 and the frame 103 are bonded by an adhesive, such as a thermosetting epoxy resin, applied to a lower surface portion 105 of the frame 103. Similarly, the cover glass 104 and the frame 103 are bonded by an adhesive, such as an ultraviolet-curing epoxy resin, applied to an upper surface portion 106 of the frame 103. As shown in FIG. 1(b), by making the width of the upper surface of the frame 103 to which the cover glass 104 is bonded wider than the lower surface to which the substrate is bonded, it is possible to ensure a sufficient bonding area for bonding the cover glass 104. This is because the cover glass 104 is made of glass or the like as described above, and therefore has a smaller surface roughness than the substrate 102, and therefore requires a larger bonding area.

[0019] The imaging element 101 is bonded to the substrate 102 with a die bonding adhesive such as silicone resin. A terminal 107 of the imaging element 101 and a pad 108 formed of a plating layer such as gold plating on the surface of the substrate 102 to which the imaging element 101 is bonded are connected by wire bonding using a gold wire, an aluminum wire, a copper wire, or the like. However, the method of bonding the imaging element 101 and the substrate 102 is not limited to this method, and other methods such as a method using a TSV (through-silicon via) may also be used.

[0020] The internal wiring 109 of the substrate 102 is made of a conductor such as copper, and is connected to a group of external terminals on the surface opposite to the surface to which the imaging element 101 is attached. A plating layer suitable for soldering may be formed on the surface of the group of external terminals. For example, nickel plating or gold plating is suitable for the plating layer. Components such as a capacitor 110, a connector 111, and a power supply IC 112 are mounted on the external terminals, and they can be connected to other substrates through the connector 111 or the like.

[0021] Fig. 2 is a cross-sectional view showing a schematic configuration for holding the image sensor unit 100 in an electronic device such as an image pickup device in this embodiment. Fig. 2(a) is a top view schematic diagram taken along line B-B' in Fig. 2(b), and Fig. 2(b) is a cross-sectional schematic diagram taken along line A-A' in Fig. 2(a).

[0022] Reference numeral 201 denotes a support member that fixes the imaging element unit 100 to the imaging device. The support member 201 comes into contact with a contact surface 202 of the frame 103, and is connected and fixed to the imaging element unit 100 by an adhesive 203. Here, by making the area of ​​the contact surface 202 large, the imaging element unit 100 and the support member 201 can be stably connected.

[0023] Fig. 3 is a cross-sectional view showing an outline of another configuration for holding the image sensor unit 100 in an electronic device such as an image pickup device in this embodiment. Compared to Fig. 2(b), in Fig. 3, the adhesive 203 is adhered not next to the contact surface 202 but to the surface of the substrate 102 on which components such as an external terminal group are mounted.

[0024] In this way, the adhesive 203 may be placed at the location shown in Fig. 3 or at the location shown in Fig. 2(b). However, since it is necessary to avoid the adhesive 203 from the components on the substrate 102 at the location shown in Fig. 3, the form of Fig. 2(b) is advantageous from the viewpoint of providing a wide area on which components can be mounted.

[0025] As described above, in this embodiment, the shape of the frame 103 is such that the surface area on the cover glass 104 side is larger than the surface on the substrate 102 side, and the surface on the cover glass 104 side protrudes outward. This ensures a sufficient bonding area for the cover glass 104, stabilizes the connection to the support member 201, and also ensures a sufficient bonding area with the support member 201. This configuration also makes it possible to make the substrate 102 smaller, thereby realizing a smaller and lighter image sensor unit 100.

[0026] Next, an example in which the image sensor unit 100 is mounted on an image pickup device will be described. Fig. 4 is a central cross-sectional view showing a schematic example of an imaging device according to this embodiment. The imaging device in Fig. 4 is an interchangeable lens camera in which a lens unit 402 is attached to a device body 401, but the imaging device may be integrated with the lens unit. The imaging element unit 100 is bonded to a holding mechanism 403. The holding mechanism 403 includes the support member 201 described above as a part of its members. A shutter unit 404 is also provided on the lens unit 402 side relative to the imaging element unit 100.

[0027] In addition, on the opposite side of the holding mechanism 403 from the lens unit 402, there are arranged a main board 405 which controls the input / output signals of the image sensor unit 100 mounted on the holding mechanism 403, a display 406 which displays the captured image, and the like.

[0028] In imaging devices such as digital still cameras and digital video cameras, there is known an anti-shake mechanism that reduces camera shake by displacing the image sensor unit 100 arranged on the optical axis 407 in a plane perpendicular to the optical axis in response to shaking of the imaging device. As part of such an anti-shake mechanism, it is also possible to provide a holding mechanism 403.

[0029] Fig. 5 is an exploded perspective schematic diagram when the holding mechanism 403 in Fig. 4 is configured with a vibration isolation mechanism. The vibration isolation mechanism is mainly configured with a base part 501, a movable part 502, and a fixed part 503.

[0030] The base part 501 is a member made of a plate material such as a steel plate, which is substantially rectangular when viewed from the lens unit 402 side. Magnets 504a, 504b, and 504c are fixed to the periphery on the front surface of the base part 501. The magnet 504a has a long and narrow rectangular shape with the Y direction as the longitudinal direction, and its front surface is magnetized with different poles along the X direction. Note that the magnet 504a does not have to be made of a single member as long as it is arranged so that different magnetic poles are aligned along the X direction as described above, and may be, for example, a plurality of magnets arranged on the base part 501.

[0031] Magnets 504b and 504c both have an elongated rectangular shape with the X direction as the longitudinal direction, and their front surfaces are magnetized with opposite poles along the Y direction. Note that as long as magnets 504b and 504c are arranged with different magnetic poles aligned along the Y direction as described above, they do not have to be configured as a single member, and may be, for example, a plurality of magnets arranged on base portion 501.

[0032] An X-direction drive coil 506a and a Hall element 507a that detects magnetic force are disposed on the rear surface of the movable part 502 at a position facing the magnet 504a provided on the base part 501. The X-direction drive coil 506a is a coil in which a copper wire is wound around an axis parallel to the optical axis, and has a long and narrow rectangular shape with the Y direction as the longitudinal direction.

[0033] Furthermore, Y-direction drive coils 506b, 506c and Hall elements 507b, 507c for detecting magnetic force are disposed on the rear surface of movable portion 502 at positions facing magnets 504b, 504c provided on base portion 501. Y-direction drive coils 506b, 506c are coils in which copper wire is wound around an axis parallel to the optical axis, and have an elongated rectangular shape with the X direction as the longitudinal direction.

[0034] Furthermore, there is a ball receiver 505 containing a support ball, for example made of ceramic, on the rear surface and periphery of the movable part 502. By sandwiching this support ball between the base part 501 and the movable part 502, the movable part 502 is supported at three points on the base part 501 and can move freely within a plane perpendicular to the optical axis.

[0035] A magnetic stainless steel plate 508 is attached to the surface of the movable portion 502, and is magnetically attracted to the magnets 504a, 504b, and 504c in the base portion.

[0036] The fixed part 503 is made of a steel plate member, and is fitted and connected to the base part 501 so as to cover the magnets 504a, 504b, 504c, the X-direction drive coil 506a, the Y-direction drive coils 506b, 506c, and the stainless steel plate 508, and is fixed mechanically and magnetically.

[0037] The imaging element unit 100 is adhered to the movable part 502, and this movable part 502 corresponds to the support member 201 shown in Figures 2 and 3. In this way, it is possible to directly adhere the imaging element unit 100 to the vibration isolation mechanism as well, making it possible to realize a small and lightweight movable part 502.

[0038] Although the holding mechanism 403 configured with an anti-shake mechanism has been illustrated with reference to FIG. 5, the present invention is not limited to this configuration as long as the anti-shake mechanism moves the imaging element within a plane perpendicular to the photographing optical axis.

[0039] Furthermore, in the above-described first embodiment, a configuration for sealing the imaging element 101 has been described, but the present invention is not limited to the imaging element, and can be applied to a configuration for sealing other electronic components. <Modification> Next, a modified example of the first embodiment will be described. The shape of the frame 103 of the image sensor unit 100 is not limited to the shape shown in the first embodiment, so long as the area of ​​the face on the cover glass 104 side is larger than the face on the substrate 102 side, and the face on the cover glass 104 side is shaped to protrude outward.

[0040] Fig. 6 is a diagram showing a schematic configuration of an image sensor unit 100 in a modified example of the first embodiment. Fig. 6(a) is a schematic top view taken along line B-B' in Fig. 6(b), and Fig. 6(b) is a schematic cross-sectional view taken along line A-A' in Fig. 1(a). In the example shown in Fig. 6, the surface of the frame 103 on the cover glass 104 side protrudes not only outward but also inward with respect to the substrate 102 side.

[0041] Fig. 7 is a diagram showing another example of the schematic configuration of the image sensor unit in the modified example of the first embodiment. Fig. 7(a) is a schematic top view between CC' in Fig. 7(b), Fig. 7(b) is a schematic cross-sectional view between A-A' in Fig. 7(a), and Fig. 7(c) is a schematic cross-sectional view between B-B' in Fig. 7(a). In Fig. 7, the same reference numerals are used for the same configurations as Figs. 1 and 2, and the description thereof will be omitted.

[0042] 7, only on the short side of the image sensor unit 100, the surface area of ​​the frame 103 on the cover glass 104 side is made larger than the surface of the frame 103 on the substrate 102 side, and the frame 103 on the cover glass 104 side is shaped to protrude outward. On the long side, the surface of the frame 103 on the cover glass 104 side is made smaller than the short side at least by the amount that does not have a protruding shape for fixing to the support member 201. In this way, a configuration may be adopted in which at least a portion (short side) of the frame 103 is bonded to the support member 201, and the bonding area of ​​the cover glass 104 is made wider only in a portion.

[0043] <Second embodiment> Next, a second embodiment of the present invention will be described. When multiple electronic components and connectors are mounted on a substrate for an electronic component package, the area that can support the package is limited. In particular, when the thermal conductivity of the resin frame is lower than that of the substrate, there is a problem that when the package is supported by the resin frame, the heat dissipation from the package to the support member is poorer than when the package is supported by the substrate.

[0044] In this embodiment, therefore, a configuration for improving heat dissipation from the package to the support member will be described.

[0045] Fig. 8 is a schematic diagram showing a schematic configuration of an electronic component and a support member for the electronic component in the second embodiment. Fig. 8(a) is a schematic top view taken along line B-B' in Fig. 8(b), Fig. 8(b) is a schematic cross-sectional view taken along line A-A' in Fig. 8(a), and Fig. 8(c) is a schematic bottom view taken along lines 8(a) and 8(b).

[0046] In addition, the electronic components in this embodiment are, as an example, the image sensor unit 100 described in the first embodiment with reference to Fig. 1. Therefore, in Fig. 8, the same components as those shown in Fig. 1 and Fig. 2 are denoted by the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0047] The electronic components in the second embodiment are mainly composed of the image sensor unit 100 and a member 116. The member 116 has a thermal conductivity greater than that of the frame 103 in order to thermally connect the surface of the substrate 102 included in the image sensor unit 100 on which the image sensor 101 is not mounted and the support member 201.

[0048] The image sensor 101 generates heat in response to its power consumption. For example, CMOS image sensors generate more heat due to their increased functionality, and improving heat dissipation is an issue to be addressed due to issues such as the impact on image quality.

[0049] As described above, the imaging element 101 of this embodiment is bonded to the substrate 102 with a die bonding adhesive such as silicone resin. Furthermore, the terminals 107 of the imaging element and the pads 108 formed on the substrate 102 are connected by wire bonding using gold wire, aluminum wire, copper wire, or the like. Heat generated by the imaging element 101 is transferred to the substrate 102 through the contact surface between the imaging element 101 and the substrate 102 and the wires of the wire bonding. The thermal conductivity of the substrate 102 is preferably 0.1 W / m·k or more, and more preferably 10 W / m·k or more.

[0050] Frame 103 and substrate 102 are fixed and bonded with adhesive 203. In this embodiment, frame 103 made of a resin material is provided with recess 113, and member 116 is fitted into recess 113. By fitting member 116 into recess 113, member 116 does not protrude from frame 103 and the surface that contacts support member 201 becomes flat, preventing rattling when the electronic component and support member 201 are fitted together.

[0051] In this embodiment, as shown in FIG. 8(c), the substrate 102 is slightly smaller than the frame 103 in the bottom view of the electronic component. However, if the substrate 102 and the frame 103 are the same size in the bottom view of the electronic component, the substrate 102 may also be provided with a recess for fitting the member 116. If the frame 103 is made of a resin material, the recess 113 can be easily formed by a mold for molding the frame 103, so the material of the frame 103 is preferably a resin material. The thermal conductivity of the frame 103 molded from a resin material is, for example, 10 W / m·K or less, typically 1 W / m·K or less. Since the thermal conductivity of the frame 103 is smaller than that of the substrate 102, when the substrate 102 and the support member 201 are not in contact with each other, the heat dissipation from the substrate 102 to the support member 201 is poorer than when the substrate 102 and the support member 201 are in contact with each other.

[0052] Therefore, in this embodiment, the member 116 is made of a material having a higher thermal conductivity than the frame 103. The material of the member 116 is preferably a metal having a higher thermal conductivity, such as aluminum, an aluminum alloy, copper, a copper alloy, or an iron alloy. Stainless steel, as well as an iron alloy containing chromium or nickel-cobalt, may also be used. The thermal conductivity of the member 116 is preferably, for example, 1.0 W / m·K or more, and more preferably 10 W / m·K or more. The member 116 is bonded to the substrate 102 and the frame 103 with a bonding material such as an adhesive or solder. This configuration has the advantage that the frame 103 can be manufactured at low cost because the frame 103 can be manufactured without using insert molding.

[0053] In this way, by providing member 116 to the electronic component, a heat dissipation path from substrate 102 to support member 201 is formed when the electronic component and support member 201 are joined, and therefore, compared to the case where member 116 is not provided, heat dissipation from substrate 102 to support member 201 is improved. Note that, in order to improve heat dissipation from substrate 102 to member 116, thermal vias 114 may be provided at a position in contact with member 116. Furthermore, member 116 also has a heat dissipation effect from the portion in contact with air, in addition to dissipating heat to support member 201. Therefore, the area of ​​member 116 in contact with air may be increased in order to obtain a heat dissipation effect.

[0054] Furthermore, the material of the support member 201 is preferably a metal with high thermal conductivity, such as aluminum, copper, or stainless steel, but the material is not limited thereto. If the support member 201 is a material with high thermal conductivity, the heat of the member 116 can be released more effectively.

[0055] The electronic component is fixed to the support member 201 by adhesive 203, but the fixing position by adhesive 203 may be any position that can fix the electronic component to the support member 201. Also, fixing may be performed by a method that does not use adhesive, for example, fixing by clamping, etc. Also, the support member 201 may be a movable part of the vibration isolation mechanism as described above with reference to FIG. 5.

[0056] As described above, according to the second embodiment, the heat generated by the energization operation of the imaging element 101 is dissipated from the substrate 102 to the support member 201 via the member 116, thereby suppressing the temperature rise of the imaging element 101. This makes it possible to suppress deterioration of image quality due to the temperature rise of the imaging element 101. Furthermore, if the imaging device imposes operational restrictions on the operation of the imaging element 101 based on temperature, the temperature rise becomes gradual, which provides the effect of extending the imaging time of the imaging device.

[0057] As described above, according to the second embodiment, it is possible to provide a heat transfer path from the substrate to the support member of the electronic device, thereby providing an electronic component package with improved heat dissipation properties.

[0058] <Third embodiment> Next, a third embodiment of the present invention will be described. Fig. 9 is a diagram showing a schematic configuration of an image sensor unit as an electronic component in the third embodiment. Fig. 9(a) is a schematic top view between B-B' in Fig. 9(b), Fig. 9(b) is a schematic cross-sectional view between A-A' in Fig. 9(a), and Fig. 9(c) is a schematic bottom view of Figs. 9(a) and (b). In Fig. 9, the same components as those in Fig. 1 are given the same reference numerals and will not be described. The configuration of the image sensor unit in the third embodiment is different from the configuration of the image sensor unit described in the second embodiment with reference to Fig. 8 in that a frame 903 is different.

[0059] The frame 903 in the third embodiment is made up of a resin member 904 and a metal member 906, and the metal member 906 is made of a material having a higher thermal conductivity than the resin member 904. The material of the resin member 904 may be, for example, the same material as that of the frame 103 in the second embodiment. The material of the metal member 906 may be the same material as that of the member 116 in the second embodiment.

[0060] Frame 903, which is made up of resin member 904 and metal member 906, has a surface area on the cover glass side of frame 903 that is larger than the surface area of ​​the image sensor side of the board that contacts the frame, and has a shape in which the end of the cover glass side of the frame protrudes toward the outer periphery in a convex shape from the end of the board side of the frame. Also, when the electronic component of Fig. 9 is assembled to movable part 502 shown in Fig. 5 as a support member, metal member 906 contacts board 102, extends to the surface on the board side at the outer periphery of the frame, and contacts movable part 502.

[0061] At this time, since substrate 102 and movable part 502 are thermally connected by metal member 906, the heat dissipation effect from substrate 102 to movable part 502, which is a supporting member, can be improved compared to the case where frame 903 is composed only of resin member 904. In addition, by arranging thermal vias 914 in substrate 902 so as to be thermally connected to metal member 906, the heat dissipation effect can be further improved.

[0062] As described above, according to the third embodiment, it is possible to obtain the same effects as those of the second embodiment. Furthermore, in the third embodiment, by accommodating the heat dissipation path from the substrate 102 to the support member (movable part 502) in a frame, it is possible to prevent the heat transfer member from protruding from the substrate 102 or the frame 903. Therefore, it is possible to create an anti-vibration mechanism without considering the cushioning of the protruding heat transfer member with other structures, which can contribute to the miniaturization of the inside of the imaging device.

[0063] <Fourth embodiment> Next, a fourth embodiment of the present invention will be described. Fig. 10 is a schematic diagram showing a schematic configuration of an electronic component and a support member for the electronic component in the fourth embodiment. Fig. 10(a) is a schematic top view taken along line B-B' in Fig. 10(b), Fig. 10(b) is a schematic cross-sectional view taken along line A-A' in Fig. 10(a), and Fig. 10(c) is a schematic bottom view taken along lines 10(a) and 10(b).

[0064] In addition, the electronic components in this embodiment are, as an example, the image sensor unit 100 described in the first embodiment with reference to Fig. 1. Therefore, in Fig. 10, the same reference numerals are used for configurations similar to those shown in Fig. 1 and Fig. 2, and descriptions thereof will be omitted as appropriate.

[0065] The support member 201 in Fig. 10 may be configured as, for example, the movable part 502 in the vibration isolation mechanism in Fig. 5. The support member 201 is assembled in such a way that the outer peripheral convex part of the frame 103 is hooked onto the support member 201, and is fixed by a thermally conductive adhesive 1006 on the surface of the support member 201 opposite to the convex part of the frame 103.

[0066] The thermally conductive adhesive 1006 has a higher thermal conductivity than the frame 103 made of resin, and by thermally connecting the substrate 102 and the support member 201, the heat dissipation effect can be improved compared to the case of using an adhesive with a low thermal conductivity. The thermally conductive adhesive 1006 is preferably 1 W / m·k or more, and may contain metal particles. Types of adhesives include a dry-curing type that cures by evaporation of a solvent, a chemical reaction type that cures by polymerization of molecules due to light or heat, a heat melting type that solidifies by solidifying the molten adhesive, and a thermosetting resin that cures with heat. A typical adhesive is a photocuring resin that cures with ultraviolet light or visible light. The thermally conductive adhesive 1006 may be any adhesive that has a higher thermal conductivity than the frame 103 and can fix the electronic component and the support member 201, and may be, for example, solder.

[0067] In the fourth embodiment, unlike the second and third embodiments, a heat transfer path can be formed without the need to bond a metal member to an electronic component or to insert-molde a metal member in order to form a heat transfer path from a substrate to a holding member. Therefore, the number of steps and costs required to manufacture components can be reduced. In addition, by using a thermally conductive adhesive, two effects can be simultaneously obtained: the formation of a heat transfer path and the attachment of components to a holding member.

[0068] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0069] 100: imaging element unit, 101: imaging element, 102: substrate, 103, 903: frame, 104: cover glass, 116: member, 201: support member, 203: adhesive, 502: movable part, 904: resin member, 906: metal member, 1006: thermally conductive adhesive

Claims

1. A substrate equipped with electronic components; A cover glass and a frame for sealing the surface of the substrate on which the electronic components are mounted together with the cover glass; A support member for supporting the frame, an area of ​​at least a part of the surface for bonding the frame and the cover glass is larger than an area of ​​the surface for bonding the frame and the substrate; At least some of the faces have an outwardly extending shape; The electronic device is characterized in that the support member supports the frame on a surface of the portion of the frame having an outward extending shape opposite to the surface that is adhered to the cover glass, and the frame and the support member are adhered and fixed together with an adhesive.

2. A substrate carrying electronic components; A cover glass and a frame for sealing the surface of the substrate on which the electronic components are mounted together with the cover glass; A support member for supporting the frame, an area of ​​at least a part of the surface for bonding the frame and the cover glass is larger than an area of ​​the surface for bonding the frame and the substrate; At least some of the faces have an inwardly and outwardly extending shape; The electronic device is characterized in that the support member supports the frame on a surface of the portion of the frame having an outward extending shape opposite to the surface that is adhered to the cover glass, and the frame and the support member are adhered and fixed together with an adhesive.

3. A substrate carrying electronic components; A cover glass and a frame for sealing the surface of the substrate on which the electronic components are mounted together with the cover glass; A support member for supporting the frame, an area of ​​at least a part of the surface for bonding the frame and the cover glass is larger than an area of ​​the surface for bonding the frame and the substrate; At least some of the faces have an outwardly extending shape; The electronic device is characterized in that the support member supports the frame on a surface of the portion of the frame having an outwardly extending shape opposite to the surface that is bonded to the cover glass, and the substrate and the support member are bonded and fixed together using an adhesive.

4. A substrate carrying electronic components; A cover glass and a frame for sealing the surface of the substrate on which the electronic components are mounted together with the cover glass; A support member for supporting the frame, an area of ​​at least a part of the surface for bonding the frame and the cover glass is larger than an area of ​​the surface for bonding the frame and the substrate; At least some of the faces have an inwardly and outwardly extending shape; The electronic device is characterized in that the support member supports the frame on a surface of the portion of the frame having an outwardly extending shape opposite to the surface that is bonded to the cover glass, and the substrate and the support member are bonded and fixed together using an adhesive.

5. The substrate is thermally connected to the frame by a member having a higher thermal conductivity than the frame.

5. The electronic device according to claim 1, wherein the member is disposed between the frame and the support member.

6. 5. The electronic device according to claim 1, wherein the frame is composed of a first material having a first thermal conductivity and a second material having a second thermal conductivity higher than the first thermal conductivity, and when the frame is supported by the support member, the second material is in contact with the substrate and the support member.

7. 5. The electronic device according to claim 3, wherein the adhesive has a higher thermal conductivity than the frame.

8. 8. The electronic device according to claim 1, wherein the electronic component is an image sensor.

9. The electronic component is an image sensor, 8. The electronic device according to claim 1, wherein the support member constitutes an anti-shake unit that performs anti-shake by driving the image pickup element in a plane perpendicular to an optical axis.

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