Information processing device and program

Abstract

To enable grasping positions of components or wiring which cannot be confirmed visually and directly, when superimposing and displaying information relevant to designated components or wiring, on an image in which a printed wiring board constituted of a plurality of wiring layers is photographed.SOLUTION: A display control unit 34, when superimposing and displaying, overlapping on an image of a photographed printed wiring board, information relevant to a component or wiring pattern designated from among the plurality of components and wiring patterns arranged on the printed wiring board, if one part of the designated wiring pattern or the designated component is arranged on a layer other than a presently visible visually confirmed layer, displays information relevant to the one part of the designated wiring pattern or the designated component, on the presently visually confirmed layer.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to an information processing device and a program. [Background technology]

[0002] Patent Document 1 discloses a CAD (Computer Aided Design) output device that makes it easy to spatially recognize a circuit pattern by displaying the circuit patterns on the front and back of a circuit board on the front and back of a double-sided display. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 06-231206 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an information processing device and program that makes it possible to grasp the position of components or wiring that cannot be directly seen when information related to specified components or wiring is superimposed and displayed on an image of a printed wiring board composed of multiple wiring layers. [Means for solving the problem]

[0005] [Information processing device] The present invention according to claim 1 comprises a processor, The processor, Among a plurality of components and wirings arranged on the photographed printed wiring board, a component or wiring pointed to by a specific object on the photographed printed wiring board or a component or wiring for which a component number or wiring pattern number has been input is received from the user as a component or wiring designated to display related information on the image of the printed wiring board; On the photographed image of the printed circuit board To When displaying information related to a specified component or wiring in a superimposed manner, if a part of the specified wiring or a specified component is arranged on a wiring layer other than the currently visible wiring layer, the information related to the part of the specified wiring or the specified component is displayed on top of the currently visible wiring layer. Position of the wiring or part when viewed through Display in In addition, information related to components or wiring arranged on a visible wiring layer and information related to components or wiring arranged on an invisible wiring layer are displayed in different display modes. It is an information processing device.

[0006] The present invention according to claim 2 provides a method for processing a signal, comprising: If a part of the specified wiring or a specified component is placed on a wiring layer other than the currently visible wiring layer, The information processing device according to claim 1, wherein information indicating the shape and position of a specified portion of wiring or a specified component is displayed at a position when the wiring or component is viewed through a currently visible wiring layer.

[0007] The present invention according to claim 3 displays, when the processor receives from a user a designation of a component or wiring for which related information is to be displayed on a photographed image of a printed wiring board, whether to display information related to both the component or wiring arranged on a visible wiring layer and the component or wiring arranged on an invisible wiring layer, or to display only information related to the component or wiring arranged on an invisible wiring layer, in a selectable manner. 3. The information processing device according to claim 1 or 2, wherein a component or a wiring for displaying related information on a photographed image of a printed wiring board is switched in response to a user's selection.

[0009] Claim 4 The present invention relates to a method for displaying information related to components or wiring arranged on a visible wiring layer and information related to components or wiring arranged on an invisible wiring layer in different colors. 1 The information processing device described above is an

[0011] [program] Claim 5 The present invention relates to a step of accepting from a user a component or wiring pointed to by a specific object on the photographed printed wiring board, or a component or wiring for which a component number or wiring pattern number has been input, among a plurality of components and wirings arranged on the photographed printed wiring board, as a component or wiring designated by the user and displaying related information on the image of the printed wiring board; On the photographed image of the printed circuit board To When displaying information related to a specified component or wiring in a superimposed manner, if a part of the specified wiring or a specified component is arranged on a wiring layer other than the currently visible wiring layer, the information related to the part of the specified wiring or the specified component is displayed on top of the currently visible wiring layer. Position of the wiring or part when viewed through Display in In addition, information related to components or wiring arranged on a visible wiring layer and information related to components or wiring arranged on an invisible wiring layer are displayed in different display modes.It is a program for causing a computer to execute steps. Effect of the Invention

[0012] According to the present invention as defined in claim 1, it is possible to provide an information processing device that can grasp the position of components or wiring that cannot be directly seen when information related to specified components or wiring is superimposed and displayed on an image of a printed wiring board composed of multiple wiring layers. Furthermore, according to the present invention as defined in claim 1, it is possible to provide an information processing device that is capable of distinguishing and grasping information related to components or wiring arranged on a visible wiring layer from information related to components or wiring arranged on an invisible wiring layer. Furthermore, according to the present invention as set forth in claim 1, it is possible to provide an information processing device that is capable of distinguishing and grasping components or wiring arranged on different wiring layers.

[0013] According to the present invention as set forth in claim 2, it is possible to provide an information processing device that can grasp the shape and position of components or wiring that cannot be directly seen when information related to specified components or wiring is superimposed and displayed on an image captured of a printed wiring board composed of multiple wiring layers.

[0014] According to the present invention as defined in claim 3, it is possible to provide an information processing device that enables a user to select whether or not to superimpose information about components or wiring arranged on an invisible wiring layer on an image of a printed wiring board.

[0016] Claim 4 According to the present invention, it is possible to provide an information processing device that makes it possible to distinguish and grasp information related to components or wiring arranged on a visible wiring layer from information related to components or wiring arranged on an invisible wiring layer by using colors.

[0018] Claim 5 According to the present invention, it is possible to provide a program that can grasp the position of components or wiring that cannot be directly seen when information related to specified components or wiring is superimposed and displayed on an image of a printed wiring board composed of multiple wiring layers. Furthermore, according to the present invention as defined in claim 5, it is possible to provide a program that makes it possible to distinguish and grasp information related to components or wiring arranged on a visible wiring layer from information related to components or wiring arranged on an invisible wiring layer. Furthermore, according to the present invention as set forth in claim 5, it is possible to provide a program that makes it possible to distinguish and grasp components or wiring arranged on different wiring layers. [Brief description of the drawings]

[0019] [Figure 1] 1 is a diagram illustrating a system configuration of an information processing system according to an embodiment of the present invention. [Diagram 2] 2 is a diagram showing an example of the printed wiring board 30 shown in FIG. [Diagram 3] 2 is a diagram showing the details of the printed wiring board 30 shown in FIG. 1 as viewed from the front side. [Figure 4] 2 is a diagram showing the details of the printed wiring board 30 shown in FIG. 1 as viewed from the back side. [Diagram 5] 5 is a perspective view of the printed wiring board 30 shown in FIG. 3 and FIG. 4 as seen from the front surface side. [Figure 6] FIG. 13 is a diagram showing an example of a case where, when a printed wiring board 30 is photographed from the front side and AR display is performed, only a wiring pattern 64 arranged on the front side is displayed in AR. [Figure 7] 1 is a block diagram showing a hardware configuration of a terminal device 10 according to an embodiment of the present invention. [Figure 8] 1 is a block diagram showing a functional configuration of a terminal device 10 according to an embodiment of the present invention. [Figure 9] 11 is a diagram showing an example of arrangement information stored in an arrangement information storage unit 35. FIG. [Figure 10] 11A and 11B are diagrams showing an example of AR display performed on the terminal device 10 when a part is designated by a pointing device. [Figure 11] 11 is a diagram for explaining a state in which a component on a printed wiring board 30 is pointed to by a user's finger. [Figure 12] 11A to 11C are diagrams showing an example of AR display performed on the terminal device 10 when a part is designated by a user's finger. [Figure 13] 10 is a flowchart for explaining the operation of the terminal device 10 when an image of the printed wiring board 30 is captured by the camera 20 and AR display is performed. [Figure 14]11 is a diagram showing an example of a display screen of the terminal device 10 when a selection of a display method for a display object is accepted from a user. FIG. [Figure 15] This figure shows an example of AR display when the user selects a display method of "highlighting components and wiring patterns on both currently visible and invisible layers," as in the example display screen shown in FIG. [Figure 16] FIG. 13 is a diagram showing an example of AR display when both a wiring pattern P81 and a component IC102 are specified as display targets for AR display. [Figure 17] FIG. 13 is a diagram showing an example of a display screen when a user selects an option to "highlight only components and wiring patterns on layers that are not currently visible" as a method for displaying the display target. [Figure 18] FIG. 13 is a diagram showing an example of AR display when a user selects an option to "highlight only components and wiring patterns on layers that are not currently visible" as a method for displaying the display objects. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Next, an embodiment of the present invention will be described in detail with reference to the drawings.

[0021] FIG. 1 is a diagram showing the configuration of an information processing system according to an embodiment of the present invention.

[0022] The information processing system of this embodiment is composed of a camera 20 that photographs a printed wiring board 30 on which a marker 62 for identifying a reference position is provided, and a terminal device 10 in which layout information of components mounted on the printed wiring board 30 and wiring patterns connecting the components are stored.

[0023] In recent years, the area of ​​printed wiring boards built into electronic devices has tended to become smaller, while the density of mounted components has increased. Conventionally, information such as part numbers of mounted components was printed on printed wiring boards by silk screen printing, but the space for silk screen printing on printed wiring boards is running out. Even if it were possible to print information such as part numbers, it would be necessary to omit the information or make the characters smaller, making it difficult to obtain sufficient information directly from the printed wiring board.

[0024] Therefore, in the information processing system of this embodiment, the printed wiring board 30 is photographed by the camera 20, and information regarding a specified component or wiring pattern from among the multiple components and wiring patterns arranged on the printed wiring board 30 is superimposed and displayed on the photographed image of the printed wiring board 30 on the display of the terminal device 10.

[0025] Specifically, in the information processing system of this embodiment, an image of the printed wiring board 30 captured by the camera 20 is displayed on the display of the terminal device 10, and component information such as the component number and type, as well as wiring information showing which terminals of which components are connected by the wiring pattern, are displayed in AR (short for Augmented Reality) on the displayed image of the printed wiring board 30.

[0026] The terminal device 10 stores information on the distance from a reference position of the components and wiring patterns mounted on the printed wiring board 30 and information on each component and wiring pattern. The terminal device 10 also has a function of detecting the position of the marker 62 from the captured image of the printed wiring board 30 and executing a calculation process for superimposing and displaying information on the components and wiring patterns.

[0027] In this embodiment, the printed wiring board 30 is described as a so-called double-sided board having wiring layers (or conductor layers) on both sides of an insulating layer, but the present invention can also be applied to a multilayer board having three or more wiring layers.

[0028] An example of the printed wiring board 30 shown in FIG. 1 is shown in FIG. 2. Referring to FIG. 2, a component 65 is mounted on the printed wiring board 30, and a terminal of the component 65 and a via hole 63 are connected by a wiring pattern 64. Here, the via hole 63 is a through hole provided for electrically connecting a plurality of layers. In this embodiment, for the sake of simplicity, a case will be described in which only one component 65 and one wiring pattern 64 are arranged on the surface of the printed wiring board 30, but in reality, a large number of components and a large number of wiring patterns for connecting these components are mounted on the printed wiring board.

[0029] Referring to FIG. 2, a reference point 61, which is a reference position in design, is provided on printed wiring board 30, and the positions of via hole 63, component 65, and marker 62 are specified by the X-coordinate distance and the Y-coordinate distance from this reference point 61.

[0030] A detailed view of the front surface of the printed wiring board 30 shown in this figure is shown in Fig. 3. In this embodiment, the wiring layer of the printed wiring board 30 is composed of two layers, so the front layer is called the first layer and the back layer is called the second layer.

[0031] Referring to FIG. 3, a component 65 having the component number "IC101" is mounted on the surface, which is the first layer of printed wiring board 30, and a wiring pattern 64 having the wiring number "P81" and a via hole 63 are provided.

[0032] Further, the marker 62 is provided with identification information for identifying the type of the printed wiring board and the front / back side, and the marker 62 shown in Fig. 3 is provided with identification information "01234F". In this identification information, "01234" is information for identifying the type of board, and "F" is the initial letter of Front side, meaning the front side. The back side of the printed wiring board is provided with identification information in which "B", the initial letter of Back side, meaning the back side, is added to the information for identifying the type of board. In other words, a marker 66 with "01234B" is provided on the second layer, which is the back side of this printed wiring board 30, as shown in Fig. 4.

[0033] Then, referring to FIG. 4, on the back surface, which is the second layer of printed wiring board 30, a component 68 with component number "IC102" is mounted, and a wiring pattern 67 with wiring number "P81" and a via hole 63 are provided.

[0034] Here, for the wiring pattern with the wiring number "P81", the wiring pattern 64 on the front side is given the wiring number "P81(L1)", and the wiring pattern 67 on the back side is given the wiring number "P81(L2)".

[0035] In printed wiring boards such as double-sided boards and multi-layer boards in which multiple wiring layers are provided, the wiring patterns are wired across the front layer, back layer, or inner layer. Therefore, when a defect occurs in a product using such a printed wiring board and the cause of the defect is analyzed, it may be necessary to check the state of the wiring patterns and components across multiple layers. However, simply displaying information about the components and wiring patterns on the visible layers superimposed on an image of the printed wiring board makes it impossible to check which components on other layers the wiring patterns are connected to via holes. If one wishes to check the wiring patterns and components on the back layer, it is necessary to turn the printed wiring board over to check it. Furthermore, in the case of a multi-layer board having an inner layer, it is impossible to check the position of the wiring patterns on the inner layer and how they are connected.

[0036] For example, Fig. 5 shows a see-through state from the front surface side of the printed wiring board 30 shown in Fig. 3 and Fig. 4. Note that in Fig. 5, the markers 62 and 66 are omitted for ease of viewing.

[0037] As can be seen by referring to Fig. 5, when printed wiring board 30 is viewed from the front side, wiring pattern 67 and components 68 arranged on the back side cannot be seen, and their positions and shapes cannot be grasped. Therefore, as shown in Fig. 6, when photographing printed wiring board 30 from the front side and performing AR display, if only the wiring pattern with wiring number "P81(L1)" arranged on the front side is displayed in AR, the user cannot grasp what kind of connection is made beyond via hole 63.

[0038] Therefore, in the information processing system of this embodiment, by adopting the following configuration, when information related to specified components or wiring is superimposed and displayed on an image of a printed wiring board composed of multiple wiring layers, it is possible to grasp the positions of components or wiring that cannot be directly seen.

[0039] Next, the hardware configuration of the terminal device 10 in the information processing system of this embodiment is shown in FIG.

[0040] 7, the terminal device 10 has a CPU 11, a memory 12, a storage device 13 such as a hard disk drive, a communication interface (abbreviated as IF) 14 for transmitting and receiving data to and from external devices via a network, and a user interface (abbreviated as UI) device 15 including a touch panel or liquid crystal display and a keyboard. These components are connected to each other via a control bus 16.

[0041] The CPU 11 is a processor that executes a predetermined process based on a control program stored in the memory 12 or the storage device 13 to control the operation of the terminal device 10. Note that, in this embodiment, the CPU 11 is described as reading and executing the control program stored in the memory 12 or the storage device 13, but it is also possible to provide the program to the CPU 11 by storing it on a storage medium such as a CD-ROM.

[0042] FIG. 8 is a block diagram showing the functional configuration of the terminal device 10 realized by executing the above control program.

[0043] As shown in FIG. 8, the terminal device 10 of this embodiment includes an operation input unit 31, a display unit 32, a data transmission / reception unit 33, a display control unit 34, a layout information storage unit 35, and an image acquisition unit 36.

[0044] Various pieces of operational information performed by a user are inputted into the operation input unit 31. The display unit 32 is controlled by the display control unit 34 and displays various pieces of information to the user.

[0045] The data transmission / reception unit 33 transmits and receives data to and from external devices such as the camera 20. The image acquisition unit 36 ​​acquires, via the data transmission / reception unit 33, images of the printed wiring board 30 captured by the camera 20, and the like.

[0046] The layout information storage unit 35 stores layout information related to components mounted on the printed wiring board 30 and the layout locations of wiring patterns connecting terminals of each component. This layout information is generated by extracting only necessary information from a CAD (Computer-Aided Design) design information file generated when designing the printed wiring board. Alternatively, the CAD design information file itself may be stored in the layout information storage unit 35 as the layout information.

[0047] An example of the arrangement information stored in the arrangement information storage unit 35 is shown in FIG.

[0048] 8 is obtained by extracting only the minimum necessary information from the CAD design information file, and for each component, information on the position from the reference point 61, information on the component number, information on the length of each component in the X-axis direction, Y-axis direction, and Z-axis direction, a layer number indicating which layer (front / back / inner layer) of the printed wiring board the information is on, and information on the component name are stored. Also, in the arrangement information shown in Fig. 8, for the wiring pattern, the transfer pattern number, information on which terminal of which component is connected to which terminal of which component, the number of straight line patterns that constitute the wiring pattern, position information of the start point and end point of each straight line pattern, layer number, and line width information are stored for each wiring pattern.

[0049] In this way, since the layer number is included in the placement information of each component and each wiring pattern, the display control unit 34 can identify the layer on which each component and wiring pattern is placed. For example, if the layer number of a component with the component number "IC101" is "L1", it can be identified as being placed on the first layer, and if the layer number of a component with the component number "IC102" is "L2", it can be identified as being placed on the second layer.

[0050] Here, we will assume that a wiring pattern with wiring number "P81" is arranged across the front surface, which is the first layer, and the back surface, which is the second layer, and that this wiring pattern is composed of four straight line patterns, "P81-1," "P81-2," "P81-3," and "P81-4," with the straight line patterns "P81-1" and "P81-2" arranged on the front surface and the straight line patterns "P81-3" and "P81-4" arranged on the back surface.

[0051] In this case, if the layer number of the straight line patterns with wiring numbers "P81-1" and "P81-2" is "L1", they can be identified as being placed on the first layer, and if the layer number of the straight line patterns with wiring numbers "P81-3" and "P81-4" is "L2", they can be identified as being placed on the second layer.

[0052] The display control unit 34 performs AR display by highlighting the specified components and wiring patterns on the captured image of the printed wiring board 30 based on the placement information as shown in FIG. 9 and the relative position information of the marker 62 with respect to the reference point 61 of the printed wiring board 30 to improve the visibility of the specified components and wiring patterns, and by superimposing information on the specified components and wiring patterns, such as part numbers and wiring numbers that serve as substitutes for silk printing, and further connection information regarding the component names and the wiring patterns, on the image of the printed wiring board 30.

[0053] In addition, the part number and wiring pattern number may be input on the terminal device 10 to specify the part and wiring pattern to be displayed in AR.

[0054] FIG. 10 shows the case where a part with part number IC101 is specified with a pointing device such as a mouse. The part with part number IC101 is highlighted, for example, with a thick red dotted line, and information about the part number "IC101" and the part name "Logic IC" are displayed in a pop-up.

[0055] In this way, the display control unit 34 performs AR display in which information related to a specified component or wiring pattern from among the multiple components and wiring patterns arranged on the printed wiring board 30 is superimposed on the image of the printed wiring board 30 captured by the camera 20.

[0056] 11, a designation method can be used in which an object pointed to by a specific object such as a user's finger or a ballpoint pen on printed wiring board 30 photographed by camera 20 is identified by image processing, and the identified component or wiring pattern is displayed as the designated component or wiring pattern in AR. When identifying a component or the like designated by a user's finger or the like in this way, image processing is performed to detect the user's finger in the image photographed by camera 20, and the component or the like pointed to by the detected finger is determined.

[0057] An example of an AR display when a specified part is identified in this way is shown in Fig. 12. Fig. 12 shows a case where a part with part number IC101 is specified by the user's finger, just like Fig. 10.

[0058] In this way, when performing AR display in which information related to a specified component or wiring pattern from among the multiple components and wiring patterns arranged on a photographed printed wiring board is superimposed on the image of the printed wiring board, if a part of the specified wiring pattern or a specified component is arranged on a layer other than the currently visible layer, the display control unit 34 displays the information related to the part of the specified wiring pattern or the specified component on the currently visible layer.

[0059] Specifically, the display control unit 34 displays information indicating the shape and position of a specified portion of wiring or a specified component at a position that would appear when the wiring or component is viewed through a currently visible wiring layer.

[0060] For example, even if only the surface layer of the printed wiring board 30 is currently visible, the display control unit 34 displays information regarding the wiring patterns and components arranged on the back layer by superimposing it on the image of the surface of the printed wiring board 30.

[0061] Furthermore, when the printed wiring board to be photographed is a multilayer board, the display control unit 34 displays information such as the shape and layout position of the wiring pattern arranged on the inner layers of the multilayer board, superimposed on the currently visible wiring layer.

[0062] When the display control unit 34 receives from the user a specification of components or wiring patterns for which related information is to be displayed on the photographed image of the printed wiring board, the display control unit 34 may display a selectable display of whether to display information related to both components or wiring patterns arranged on visible wiring layers and components or wiring patterns arranged on invisible wiring layers, or to display only information related to components or wiring patterns arranged on invisible wiring layers, and may switch the components or wiring patterns for which related information is to be displayed on the photographed image of the printed wiring board depending on the user's selection at that time.

[0063] When the display control unit 34 superimposes and displays information related to components or wiring patterns arranged on a visible layer on the photographed image of the printed wiring board, the display control unit 34 displays the information in a display mode different from that used for information related to components or wiring patterns arranged on an invisible wiring layer.

[0064] Specifically, the display control unit 34 displays information related to components or wiring patterns arranged on a visible layer and information related to components or wiring patterns arranged on an invisible layer in different colors. Specifically, the display control unit 34 displays information related to components or wiring patterns arranged on a visible layer in blue, and displays information related to components or wiring patterns arranged on an invisible layer in red.

[0065] Furthermore, when the display control unit 34 superimposes and displays information related to components or wiring patterns arranged on an invisible layer on the photographed image of the printed wiring board, if the layers on which the components or wiring patterns are arranged are different, the display control unit 34 displays the information in a different manner.

[0066] For example, when performing AR display on an image of a multilayer board consisting of four wiring layers, the display control unit 34 displays information related to components or wiring patterns arranged on the first layer in black, information related to components or wiring patterns arranged on the second layer in red, information related to components or wiring patterns arranged on the third layer in blue, and information related to components or wiring patterns arranged on the fourth layer in yellow.

[0067] Next, the operation of the terminal device 10 in this embodiment will be described in detail with reference to the drawings.

[0068] First, the operation of the terminal device 10 when an image of the printed wiring board 30 is captured by the camera 20 and AR display is performed will be described with reference to the flowchart of FIG.

[0069] First, in step S101 , when the camera 20 captures an image of the printed wiring board 30 , the image acquisition unit 36 ​​acquires the image of the printed wiring board 30 via the data transmission / reception unit 33 .

[0070] Then, in step S102, the display control unit 34 determines whether the captured image is of the front side or the back side of the printed wiring board 30 based on the acquired markers of the printed wiring board 30.

[0071] Then, in step S103, the display control unit 34 receives from the user a selection of a component or wiring pattern to be highlighted.

[0072] Next, in step S105, the display control unit 34 determines whether the display target, which is the selected component or wiring pattern, is arranged on a layer that is not currently visible.

[0073] If it is determined in step S105 that the selected display object is placed only on the visible layer, the display control unit 34 in step S104 highlights the selected display object and displays related information of the display object, such as the part number or wiring number, on the image in AR.

[0074] Then, when it is determined in step S105 that the selected display object is also arranged on a layer that is not visible, the display control unit 34 accepts, from the user, a selection of a display method for the display object in step S106.

[0075] FIG. 14 shows an example of the display screen of the terminal device 10 when the selection of the display method of the display object is accepted from the user.

[0076] In the example display screen shown in FIG. 14, three options are presented to the user to select: "Highlight only components and wiring patterns on currently visible layers," "Highlight components and wiring patterns on both currently visible and invisible layers," and "Highlight only components and wiring patterns on currently invisible layers."

[0077] Then, in step S107, the display control unit 34 switches the highlighting of the components or wiring patterns arranged on the invisible layer based on the received display method.

[0078] For example, FIG. 15 shows an example of an AR display when the user selects the display method of "highlighting components and wiring patterns on both currently visible and invisible layers," as in the example display screen shown in FIG. 14.

[0079] In the AR display example shown in FIG. 15, the positions and shapes of both the wiring pattern P81(L1) arranged on the first layer, which is the visible layer, and the wiring pattern P81(L2) arranged on the second layer, which is the invisible layer, are highlighted, and related information of the two wiring patterns P81(L1) and P81(L2) is displayed in AR.

[0080] In FIG. 15, the wiring pattern P81(L1) arranged on the first layer, which is the visible layer, is highlighted in blue, and the wiring pattern P81(L2) arranged on the second layer, which is the invisible layer, is highlighted in red.

[0081] Here, FIG. 15 shows an example of a display screen in which only the wiring pattern P81 is specified as the display target for AR display, whereas FIG. 16 shows an example of AR display in which both the wiring pattern P81 and the component IC102 are specified as the display target for AR display.

[0082] 16, it can be seen that in addition to the AR display of the wiring pattern P81, AR display of the component IC102 is also performed. Specifically, it can be seen that the component IC102 is highlighted in red, and related information of the component IC102 such as the component number and component name is superimposed on the image of the printed wiring board 30.

[0083] Furthermore, FIG. 18 shows an example of AR display when the user selects the option of "highlight only components and wiring patterns on layers that are not currently visible" as the display method for the display objects, as shown in FIG.

[0084] In FIG. 18, it can be seen that the wiring pattern P81(L1) arranged on the first layer, which is the currently visible layer, is not highlighted, and only the wiring pattern P81(L2) arranged on the second layer, which is the currently invisible layer, is highlighted.

[0085] By selecting the display object for which AR display is desired on a display method selection screen such as that shown in Figures 14 and 17, the user can switch between AR display of only the display objects placed on the visible layer, AR display of only the display objects placed on the invisible layer, or AR display of both the display objects placed on the visible layer and the display objects placed on the invisible layer.

[0086] In each of the above embodiments, the term "processor" refers to a processor in a broad sense, including general-purpose processors (e.g., CPU: Central Processing Unit, etc.) and dedicated processors (e.g., GPU: Graphics Processing Unit, ASIC: Application Specific Integrated Circuit, FPGA: Field Programmable Gate Array, programmable logic device, etc.).

[0087] In addition, the operations of the processor in each of the above embodiments may be performed not only by one processor, but also by multiple processors located at physically separate locations working together. Furthermore, the order of the operations of the processor is not limited to the order described in each of the above embodiments, and may be changed as appropriate. [Explanation of symbols]

[0088] 10 Terminal Equipment 11 CPU 12. Memory 13 Storage device 14 Communication Interface 15 User Interface Device 16 Control Bus 20 Camera 30 Printed wiring board 31 Operation input section 32 Display section 33 Data transmission and reception unit 34 Display control section 35 Location information storage unit 36 Image acquisition section 61 Reference point 62 Marker 63 Beer Hall 64 Wiring Pattern 65 parts 66 Marker 67 Wiring Pattern 68 parts

Claims

1. A processor is provided. The processor, Among a plurality of components and wirings arranged on the photographed printed wiring board, a component or wiring pointed to by a specific object on the photographed printed wiring board or a component or wiring for which a component number or wiring pattern number has been input is received from the user as a component or wiring designated to display related information on the image of the printed wiring board; When information related to a specified component or wiring is displayed superimposed on an image of a photographed printed wiring board, if a part of the specified wiring or a specified component is arranged on a wiring layer other than a currently visible wiring layer, the information related to the part of the specified wiring or the specified component is displayed at a position on the currently visible wiring layer when the wiring or component is made transparent, and the information related to the component or wiring arranged on the visible wiring layer and the information related to the component or wiring arranged on an invisible wiring layer are displayed in different display modes. Information processing device.

2. 2. The information processing device of claim 1, wherein, when a specified part of a wiring or a specified component is placed on a wiring layer other than the currently visible wiring layer, the processor displays information indicating the shape and position of the specified part of a wiring or the specified component at a position when the wiring or component is made transparent on the currently visible wiring layer.

3. When receiving from a user a specification of a component or wiring for which related information is to be displayed on the photographed image of the printed wiring board, the processor displays in a selectable manner whether to display information related to both the component or wiring arranged on a visible wiring layer and the component or wiring arranged on an invisible wiring layer, or to display only information related to the component or wiring arranged on the invisible wiring layer. According to the user's selection, the component or wiring for which related information is displayed on the photographed image of the printed wiring board is switched.

3. The information processing device according to claim 1 or 2.

4. 2. The information processing device according to claim 1, wherein the processor displays information related to components or wiring arranged on a visible wiring layer and information related to components or wiring arranged on an invisible wiring layer in different colors.

5. A step of accepting from a user, among a plurality of components and wirings arranged on a photographed printed wiring board, a component or wiring pointed to by a specific object on the photographed printed wiring board, or a component or wiring for which a component number or wiring pattern number has been input, as a component or wiring designated to display related information on an image of the printed wiring board; A program for causing a computer to execute a step of superimposing and displaying information related to a specified component or wiring on an image of a photographed printed wiring board, and if a part of the specified wiring or a specified component is located on a wiring layer other than a currently visible wiring layer, displaying information related to the part of the specified wiring or the specified component at a position on the currently visible wiring layer when the wiring or component is made transparent, and displaying information related to the component or wiring located on the visible wiring layer and information related to the component or wiring located on an invisible wiring layer in different display modes.

Images