Vehicle controller and vehicle having same

Abstract

The vehicle controller includes a control box (100), an IGBT module (200), and a power module (300). The control box has a first outer surface (110) and a second outer surface (120) that are arranged opposite to each other in the thickness direction. A control cooling water channel is arranged on the first outer surface. The control cooling water channel includes an IGBT cooling layer (112), a power supply cooling layer (113), and a transition section (114). The IGBT cooling layer and the power supply cooling layer are arranged in a stacked manner in the thickness direction of the control box and communicate with each other through the transition section. The IGBT module is attached to the first outer surface, inserted into the IGBT cooling layer, and dissipates heat by the coolant in the IGBT cooling layer. The power supply module is attached to the second outer surface, adjacent to the power supply cooling layer, and dissipates heat by the coolant in the power supply cooling layer. The vehicle controller is arranged with two layers of control cooling water channels, and has advantages such as a large water channel space, high cooling efficiency, and high shielding effect. A vehicle is further disclosed.

Description

[Technical field]

[0001] This disclosure claims priority to a Chinese patent application filed with the China National Intellectual Property Office on June 18, 2021, bearing application number 202110679816.1 and entitled "Vehicle Controller and Vehicle Having the Same," the entire contents of which are incorporated herein by reference.

[0002] The present disclosure relates to the technical field of vehicles, and more particularly to a vehicle controller and a vehicle having the same. [Background technology]

[0003] A vehicle controller in the related art generally includes a control box, an IGBT (insulated gate bipolar transistor) module, and a power module. The vehicle controller dissipates heat from the IGBT module and the power module by installing a cooling water channel in the control box. However, the layout of the cooling water channel is not reasonable, the space of the cooling water channel is small, and the heat exchange area between the coolant and the IGBT module and the power module is small, so the IGBT module and the power module cannot effectively dissipate heat, and the heat dissipation effect is low. In addition, the distance between the IGBT module and the power module is close, and the electromagnetic compatibility is low. Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art. To this end, the present disclosure provides a vehicle controller and a vehicle having the same, and the vehicle controller has advantages such as a two-layer controlled cooling water channel, a large water channel space, high heat dissipation efficiency, and high shielding effect.

[0005] The present disclosure further provides a vehicle having the above vehicle controller. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, a vehicle controller according to an embodiment of a first aspect of the present disclosure includes a control box, an IGBT module, and a power supply module, the control box having a first outer surface and a second outer surface arranged opposite each other in a thickness direction, a control cooling water channel is arranged on the first outer surface, the control cooling water channel includes an IGBT cooling layer, a power supply cooling layer, and a transition section, the IGBT cooling layer and the power supply cooling layer are arranged in a stacked manner in the thickness direction of the control box and communicate with each other via the transition section, the IGBT module is attached to the first outer surface, inserted into the IGBT cooling layer, and dissipates heat by the coolant in the IGBT cooling layer, and the power supply module is attached to the second outer surface, adjacent to the power supply cooling layer, and dissipates heat by the coolant in the power supply cooling layer.

[0007] The vehicle controller according to the embodiment of the present disclosure is provided with two layers of control cooling water channels, which has the advantages of a large water channel space, high heat dissipation efficiency, and high shielding effect.

[0008] In some specific embodiments of the present disclosure, the control box includes a box body and a water channel cover plate, the power supply cooling layer is formed on the box body, the power supply module is attached to the box body, the water channel cover plate is attached to the box body, covers the power supply cooling layer, and defines the transition section together with the box body, the IGBT cooling layer is formed on the water channel cover plate, and the IGBT module is attached to the water channel cover plate. An insertion hole is provided on the water channel cover plate, the insertion hole is connected to the IGBT cooling layer, and the IGBT module is inserted into the IGBT cooling layer through the insertion hole. A mounting surface surrounding the insertion hole is provided on a surface of the water channel cover plate facing away from the box body, and the IGBT module is mounted on the mounting surface.

[0009] In some specific embodiments of the present disclosure, a sealing groove is provided on the mounting surface surrounding the insertion opening, and a sealing ring is provided within the sealing groove to seal the gap between the mounting surface and the IGBT module.

[0010] In some specific embodiments of the present disclosure, the waterway cover plate includes a cover portion and an insert portion, the cover portion is attached to the box body, covers the power supply cooling layer, and together with the box body defines the transition section, the insert portion is connected to a surface of the cover portion facing away from the box body, the IGBT module is attached to a surface of the insert portion facing away from the cover portion, and the insert portion and the cover portion define the IGBT cooling layer.

[0011] In some specific embodiments of the present disclosure, the controlled cooling water passage further includes a water supply section, the water supply section is connected to an end of the IGBT cooling layer away from the transition section, a water supply pipe is connected to the control box, and the water supply pipe is in communication with the water supply section. The water supply section includes a first section and a second section, the first section is in communication with the water supply pipe, both ends of the second section are connected to the first section and the IGBT cooling layer, respectively, and the first section is offset to the second outer surface with respect to the IGBT cooling layer in the thickness direction of the control box.

[0012] In some specific embodiments of the present disclosure, the control box includes a box body and a water channel cover plate, the power supply cooling layer is formed in the box body, the power supply module is attached to the box body, the water channel cover plate is attached to the box body, covers the power supply cooling layer and defines the transition section together with the box body, the IGBT cooling layer is formed in the water channel cover plate, the IGBT module is attached to the water channel cover plate, and the second section is partially formed in the box body and another partially formed in the water channel cover plate.

[0013] In some specific embodiments of the present disclosure, a plurality of shield cavities are defined in the second outer surface, and each of the shield cavities and the water passages of the power supply cooling layer share at least one sidewall.

[0014] In some specific embodiments of the present disclosure, the transition section includes a third section and a fourth section, the third section communicates with the power supply cooling layer, both ends of the fourth section communicate with the third section and the IGBT cooling layer respectively, and the third section is offset from the second outer surface relative to the IGBT cooling layer in the thickness direction of the control box.

[0015] In some specific embodiments of the present disclosure, the control box includes a box body and a water channel cover plate, the power supply cooling layer is formed on the box body, the power supply module is attached to the box body, the water channel cover plate is attached to the box body and covers the power supply cooling layer, and defines the transition section together with the box body, the IGBT cooling layer is formed on the water channel cover plate, the IGBT module is attached to the water channel cover plate, the fourth section is formed on the water channel cover plate, and the third section is formed on the box body and covered by the water channel cover plate, and the depth of the third section is smaller than the depth of the power supply cooling layer.

[0016] In some specific embodiments of the present disclosure, the power supply cooling layer includes a fifth section, a sixth section, a seventh section and a drainage section connected in sequence, the fifth section is connected to the transition section and is parallel to the seventh section, the sixth section is connected between the fifth section and the seventh section and is installed at an angle with respect to the fifth section and the seventh section, the drainage section has one end connected to the seventh section and a drainage hole installed at the other end, a water discharge section and a water discharge pipe installed in the box body, and the drainage hole communicates with the water discharge pipe through the water discharge section.

[0017] In some specific embodiments of the present disclosure, a first shielding rib and a second shielding rib are provided on the second outer surface, the first shielding rib is located on a side of the fifth section facing away from the seventh section, the second shielding rib is located on a side of the seventh section facing away from the fifth section, a first shielding cavity is surrounded by the first shielding rib and the fifth section, a second shielding cavity is surrounded by the second shielding rib and the seventh section, and the power supply module includes MOS transistors located in the first shielding cavity and the second shielding cavity.

[0018] In some specific embodiments of the present disclosure, a third shielding cavity is surrounded by the fifth section, the sixth section and the seventh section, the power supply module further includes a transformer and a transformer inductor, the transformer and the transformer inductor are located in the third shielding cavity, the MOS transistor, the transformer and the transformer inductor are integrated on a same circuit board, and the circuit board covers the first shielding cavity, the second shielding cavity and the third shielding cavity.

[0019] A vehicle according to an embodiment of the second aspect of the present disclosure includes a vehicle controller as described in the embodiment of the first aspect of the present disclosure, a power box, a motor, and a transmission, wherein the power box is attached to the vehicle controller, a motor cooling water passage communicating with the control cooling water passage is provided, the motor and the transmission are operably connected and attached to the power box, the motor is connected to the IGBT module, and the motor and the transmission dissipate heat by a coolant in the motor cooling water passage.

[0020] A vehicle according to an embodiment of the second aspect of the present disclosure has advantages such as a large water channel space, high cooling efficiency, and high shielding effect by using the vehicle controller described in the embodiment of the first aspect of the present disclosure.

[0021] Additional aspects and advantages of the disclosure will be set forth in part in the description that follows, and in part will be obvious from the description, or may be learned by practice of the disclosure.

[0022] The above and / or additional aspects and advantages of the present disclosure will become more apparent and easier to understand by describing examples with reference to the following drawings, in which: [Brief description of the drawings]

[0023] [Figure 1] FIG. 2 is a schematic configuration diagram of a vehicle controller according to an embodiment of the present disclosure. [Diagram 2] FIG. 1 is an exploded view of a box body and waterway cover plate of a vehicle controller according to an embodiment of the present disclosure. [Diagram 3] 1 is a schematic configuration diagram of a box body of a vehicle controller according to an embodiment of the present disclosure. FIG. [Figure 4] FIG. 2 is a cross-sectional view of a control box of a vehicle controller according to an embodiment of the present disclosure. [Diagram 5] FIG. 2 is an exploded cross-sectional view of a control box of a vehicle controller according to an embodiment of the present disclosure, with the arrows indicating the direction of coolant flow as a schematic diagram. [Figure 6] FIG. 2 is a cross-sectional view of a vehicle controller according to an embodiment of the present disclosure. [Figure 7] FIG. 2 is an exploded view of a box body and a power module of a vehicle controller according to an embodiment of the present disclosure. [Figure 8] FIG. 2 is an exploded view of a vehicle controller and power box according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Hereinafter, the embodiments of the present disclosure will be described in detail, and examples of the embodiments are shown in the drawings, in which the same or similar reference numerals throughout represent the same or similar elements, or elements having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and are merely for interpreting the present disclosure, and should not be understood as limiting the present disclosure.

[0025] In addition, in the description of the present disclosure, the orientations or positional relationships indicated by the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are based on the orientations or positional relationships shown in the drawings, and are merely intended to easily explain and simplify the description of the present disclosure, and do not indicate or suggest that the devices or elements shown must have a specific orientation and be configured and operate in a specific orientation, and therefore should not be understood as limiting the present disclosure.

[0026] In the description of this disclosure, a "first feature" or a "second feature" may include one or more of such features.

[0027] In the description of this disclosure, "plurality" means two or more, and "several" means one or more.

[0028] Hereinafter, a vehicle controller 1 according to an embodiment of the present disclosure will be described with reference to the drawings.

[0029] As shown in FIGS. 1 to 8, a vehicle controller 1 according to an embodiment of the present disclosure includes a control box 100, an IGBT module 200, and a power supply module 300.

[0030] The control box 100 has a first outer surface 110 and a second outer surface 120 arranged opposite to each other in the thickness direction. A control cooling water passage 111 is arranged on the first outer surface 110. The control cooling water passage 111 includes an IGBT cooling layer 112, a power supply cooling layer 113, and a transition section 114. The IGBT cooling layer 112 and the power supply cooling layer 113 are arranged in a stacked manner in the thickness direction of the control box 100 and communicate with each other through the transition section 114. The IGBT module 200 is attached to the first outer surface 110, inserted into the IGBT cooling layer 112, and dissipates heat by the coolant in the IGBT cooling layer 112. The power supply module 300 is attached to the second outer surface 120, adjacent to the power supply cooling layer 113, and dissipates heat by the coolant in the power supply cooling layer 113.

[0031] For example, cooling fluid may be introduced into controlled cooling passages 111 , and the cooling fluid may flow through IGBT cooling layer 112 , transition section 114 , and power supply cooling layer 113 .

[0032] In the vehicle controller 1 according to the embodiment of the present disclosure, the control box 100 has a first outer surface 110 and a second outer surface 120 that are arranged opposite to each other in the thickness direction, and the first outer surface 110 and the second outer surface 120 are arranged at an interval. The control box 100 can form a space capable of accommodating components on the first outer surface 110 and the second outer surface 120, and the control cooling water passage 111 is arranged on the first outer surface 110, and the control cooling water passage 111 and the second outer surface 120 are arranged at an interval, that is, the cooling liquid in the control cooling water passage 111 does not flow out from the second outer surface 120. This allows components that cannot come into direct contact with the cooling liquid to be arranged on the second outer surface 120, thus avoiding the cooling liquid from coming into direct contact with the components in the second outer surface 120, and the cooling liquid can dissipate heat from the components on the second outer surface 120.

[0033] The control cooling water passage 111 includes an IGBT cooling layer 112, a power supply cooling layer 113, and a transition section 114, and the IGBT cooling layer 112 and the power supply cooling layer 113 are stacked in the thickness direction of the control box 100 and communicate with each other via the transition section 114. The transition section 114 can be extended in the thickness direction of the control box 100, and the volume of the transition section 114 can be set small. The transition section 114 mainly communicates the IGBT cooling layer 112 and the power supply cooling layer 113 so that the coolant can flow through the IGBT cooling layer 112 and the power supply cooling layer 113.

[0034] The IGBT cooling layer 112 and the power supply cooling layer 113 are installed in a stacked manner, and thus the space and flow length of the control cooling water channel 111 can be increased, so that the control cooling water channel 111 can dissipate heat for more components, and the heat exchange area between the control cooling water channel 111 and the components in the control box 100 that need to dissipate heat is larger, and the heat dissipation effect is better.

[0035] In addition, the IGBT module 200 is attached to the first outer surface 110 and inserted into the IGBT cooling layer 112, and heat is dissipated by the cooling liquid in the IGBT cooling layer 112. In this way, the IGBT module 200 can be immersed in the cooling liquid in the IGBT cooling layer 112, and the heat exchange area between the IGBT module 200 and the cooling liquid is large, which contributes to improving the heat dissipation speed of the IGBT module 200, and the control box 100 can accommodate the IGBT module 200 with higher power density, thereby achieving the purpose of improving the power of the IGBT module 200.

[0036] At the same time, the power module 300 is mounted on the second outer surface 120, adjacent to the power supply cooling layer 113, and is dissipated by the cooling liquid in the power supply cooling layer 113. The power module 300 and the power supply cooling layer 113 are installed at a distance from each other, and the cooling liquid in the IGBT cooling layer 112 cools the IGBT module 200 and then flows into the power supply cooling layer 113 through the transition section 114, so that the cooling liquid in the power supply cooling layer 113 can cool the power supply module 300 and dissipate heat, thus realizing the control cooling water channel 111 to simultaneously dissipate heat for the IGBT cooling layer 112 and the power supply module 300, the utilization rate of the control cooling water channel 111 is increased, and the distance between the IGBT module 200 and the power supply module 300 is made greater, so that the electromagnetic interference between the IGBT module 200 and the power supply module 300 can be reduced, and the shielding effect is improved.

[0037] As can be seen from the above, since the IGBT cooling layer 112 and the power supply cooling layer 113 are stacked and installed in the thickness direction of the control box 100, the layer on which the IGBT cooling layer 112 is located can have a larger cross-sectional area so as to sufficiently dissipate heat from the IGBT module 200, and the layer on which the power supply cooling layer 113 is located can have a larger cross-sectional area so as to sufficiently dissipate heat from the power supply module 300, thereby greatly optimizing the operating performance of the vehicle controller 1.

[0038] As a result, the vehicle controller 1 according to the embodiment of the present disclosure has two layers of control cooling water channels 111, which has the advantages of a large water channel space, high heat dissipation efficiency, and high shielding effect.

[0039] In some specific embodiments of the present disclosure, as shown in FIGS. 2 to 6, the control box 100 includes a box body 130 and a water channel cover plate 140. As shown in FIG.

[0040] The power supply cooling layer 113 is formed in the box body 130, and the power supply module 300 is attached to the box body 130. The water channel cover plate 140 is attached to the box body 130 and covers the power supply cooling layer 113, for example, the water channel cover plate 140 may be located on the side of the first outer surface 110 facing away from the second outer surface 120, and defines a transition section 114 together with the box body 130, and the transition section 114 communicates the IGBT cooling layer 112 and the power supply cooling layer 113.

[0041] Since the control box 100 is installed separately as the box body 130 and the water channel cover plate 140, the power supply cooling layer 113 and the IGBT cooling layer 112 can be processed separately, and the side of the power supply cooling layer 113 facing the water channel cover plate 140 is open, that is, the power supply cooling layer 113 penetrates the first outer surface 110, which makes it easy to process the power supply cooling layer 113, and after the power supply cooling layer 113 is processed and shaped, the water channel cover plate 140 is attached to the box body 130 to complete the sealing of the power supply cooling layer 113. In this way, the sealing of the power supply cooling layer 113 can be realized while reducing the difficulty of processing the power supply cooling layer 113.

[0042] Also, the IGBT cooling layer 112 is formed on the water channel cover plate 140, and the IGBT module 200 is attached to the water channel cover plate 140. For example, the IGBT cooling layer 112 may be formed on the side of the water channel cover plate 140 facing away from the power supply cooling layer 113, and the IGBT module 200 may be located on the side of the water channel cover plate 140 facing away from the box body 130. In this way, the distance between the IGBT module 200 and the power supply module 300 becomes greater, and the electromagnetic interference between the IGBT module 200 and the power supply module 300 can be reduced.

[0043] In some embodiments of the present disclosure, as shown in FIG. 2 , an insertion opening 141 is provided on the water channel cover plate 140, the insertion opening 141 can be located on the side of the water channel cover plate 140 facing away from the box body 130, the side of the insertion opening 141 facing away from the box body 130 is open, the shape of the insertion opening 141 can be matched to the shape of one end of the IGBT module 200 facing the water channel cover plate 140, the insertion opening 141 is connected to the IGBT cooling layer 112, and the IGBT module 200 is inserted into the IGBT cooling layer 112 through the insertion opening 141.

[0044] By providing the insertion port 141, the cooling liquid in the IGBT cooling layer 112 can cover the IGBT module 200 along the circumferential direction of the IGBT module 200, thereby increasing the contact area between the cooling liquid in the IGBT cooling layer 112 and the IGBT module 200 and improving the heat dissipation effect.

[0045] In some embodiments of the present disclosure, as shown in FIG. 2 , a mounting surface 142 surrounding the insertion port 141 is provided on the surface of the water channel cover plate 140 facing away from the box body 130, and the IGBT module 200 is mounted on the mounting surface 142.

[0046] For example, one end of the IGBT module 200 facing away from the water channel cover plate 140 extends from the IGBT cooling layer 112 through an insertion opening 141, the cross-sectional area of ​​the end being larger than the cross-sectional area of ​​the insertion opening 141, and the end may be engaged with the mounting surface 142 by a screw fastener (e.g., a bolt), and the screw fastener may be multiple, and the multiple screw fasteners are spaced apart along the circumferential direction of the insertion opening 141.

[0047] In this way, the IGBT module 200 is fixed to the mounting surface 142 and a fixed connection is achieved between the IGBT module 200 and the water channel cover plate 140, while a portion of the IGBT module 200 extends from the insertion port 141, providing a large area that can be held by a human hand, making it easy to attach and detach the IGBT module 200.

[0048] 2 and 4, the mounting surface 142 is provided with a sealing groove 143 surrounding the insertion port 141, and a sealing ring 144 is provided in the sealing groove 143, which seals the gap between the mounting surface 142 and the IGBT module 200. That is, the sealing groove 143 is provided on the side of the water channel cover plate 140 facing away from the box body 130, and the sealing ring 144 is mounted in the sealing groove 143 and can protrude from the mounting surface 142. After the IGBT module 200 is inserted into the insertion port 141, it presses the sealing ring 144 together with the mounting surface 142 to elastically deform the sealing ring 144, thereby realizing the sealing between the mounting surface 142 and the IGBT module 200, effectively avoiding the coolant from flowing out of the insertion port 141, and the sealing is higher, which ensures the reliability of the vehicle controller 1.

[0049] In some exemplary embodiments of the present disclosure, as shown in FIG. 2, the flume cover plate 140 includes a cover portion 145 and an insert portion 146 .

[0050] The cover part 145 is attached to the box body 130 and covers the power supply cooling layer 113, the cover part 145 and the box body 130 define a transition section 114, the cooling liquid can flow within the power supply cooling layer 113 and not spill out, the transition section 114 connects the IGBT cooling layer 112 and the power supply cooling layer 113, and the cooling liquid can flow from the IGBT cooling layer 112 to the power supply cooling layer 113 via the transition section 114.

[0051] In addition, the insertion portion 146 is connected to the surface of the cover portion 145 facing away from the box body 130, the IGBT module 200 is attached to the surface of the insertion portion 146 facing away from the cover portion 145, and the insertion portion 146 and the cover portion 145 define the IGBT cooling layer 112.

[0052] Specifically, the insertion portion 146 protrudes from the side of the cover portion 145 facing away from the box body 130, the cover portion 145 forms the bottom wall of the IGBT cooling layer 112, and the insertion portion 146 forms the side wall of the IGBT cooling layer 112. In this way, not only can the IGBT module 200 be easily attached, but also two layers are realized in which the IGBT cooling layer 112 and the power supply cooling layer 113 are spaced apart along the thickness direction of the box body 130, so that the space of the IGBT cooling layer 112 is larger and the coolant can sufficiently cool the IGBT module 200.

[0053] In some specific embodiments of the present disclosure, the water channel cover plate 140 and the box body 130 are welded together, for example, the water channel cover plate 140 and the box body 130 are connected by friction welding. In this way, the connection between the water channel cover plate 140 and the box body 130 is more reliable, and the water channel cover plate 140 can be prevented from being displaced relative to the power source cooling layer 113 when the vehicle is shaking or running, the covering effect of the water channel cover plate 140 on the power source cooling layer 113 is improved, the sealing of the entire control cooling water channel 111 is guaranteed, and the coolant can flow normally through the control cooling water channel 111.

[0054] In some specific embodiments of the present disclosure, as shown in Figures 4 to 6, the controlled cooling water channel 111 further includes a water supply section 115, which is connected to one end of the IGBT cooling layer 112 away from the transition section 114, i.e., the water supply section 115 and the transition section 114 are located on opposite sides of the IGBT cooling layer 112. In this way, after the cooling liquid enters the IGBT cooling layer 112, in the process of flowing from the water supply section 115 to the transition section 114, the cooling liquid can be sufficiently diffused in the IGBT cooling layer 112, so that the IGBT module 200 can be sufficiently cooled and dissipated, and the heat dissipation efficiency is higher.

[0055] In addition, a water supply pipe 400 is connected to the control box 100, the water supply pipe 400 is connected to the water supply section 115, and the cooling liquid is supplied from the water supply pipe 400 through the water supply section 115 to the IGBT cooling layer 112. The water supply pipe 400 may be connected to the water supply section 115 and installed on a side adjacent to the water supply section 115 in the circumferential direction of the box body 130 so as to easily supply the cooling liquid.

[0056] In some specific embodiments of the present disclosure, as shown in Figures 4 to 6, the water supply section 115 includes a first section 115a and a second section 115b. The first section 115a communicates with the water supply pipe 400, and both ends of the second section 115b are connected to the first section 115a and the IGBT cooling layer 112, respectively, thus realizing communication between the water supply pipe 400 and the IGBT cooling layer 112, and the coolant may be transported from the water supply pipe 400 to the IGBT cooling layer 112 by passing through the first section 115a and the second section 115b in order.

[0057] The first section 115a is offset from the IGBT cooling layer 112 to the second outer surface 120 in the thickness direction of the control box 100, i.e., the first section 115a and the IGBT cooling layer 112 are parallel to each other. In this case, the water supply pipe 400 is located between the first outer surface 110 and the second outer surface 120, which contributes to a reduction in the volume of the box body 130.

[0058] For example, the second section 115b may be perpendicular to the IGBT cooling layer 112 and the first section 115a in the thickness direction of the control box 100. Alternatively, the second section 115b is installed at an angle to the thickness direction of the control box 100, and the included angle between the first section 115a and the second section 115b is not a right angle, and the included angle between the second section 115b and the IGBT cooling layer 112 is also not a right angle, and the orthogonal projections of the first section 115a and the IGBT cooling layer 112 on the first outer surface 110 do not overlap. By installing in this way, the water supply section 115 can be closer to the power supply module 300, and the cooling liquid in the water supply section 115 can dissipate heat from the power supply module 300 and fully utilize the cooling liquid, while the connection point between the water supply section 115 and the IGBT cooling layer 112 is not a right angle or acute angle, and the flow of the cooling liquid is smoother and gentler.

[0059] In some specific embodiments of the present disclosure, as shown in Figures 4 to 6, the control box 100 includes a box body 130 and a water channel cover plate 140. The power supply cooling layer 113 is formed in the box body 130, and the power supply module 300 is attached to the box body 130. The water channel cover plate 140 is attached to the box body 130, covers the power supply cooling layer 113, and defines a transition section 114 together with the box body 130, and the IGBT cooling layer 112 is formed in the water channel cover plate 140, and the IGBT module 200 is attached to the water channel cover plate 140.

[0060] Since the control box 100 is installed separately as the box body 130 and the water channel cover plate 140, the power supply cooling layer 113 and the IGBT cooling layer 112 can be processed separately, and the side of the power supply cooling layer 113 facing the water channel cover plate 140 is open, that is, the power supply cooling layer 113 penetrates the first outer surface 110, which makes it easy to process the power supply cooling layer 113, and after the power supply cooling layer 113 is processed and shaped, the water channel cover plate 140 is attached to the box body 130 to complete the sealing of the power supply cooling layer 113. In this way, the sealing of the power supply cooling layer 113 can be realized while reducing the difficulty of processing the power supply cooling layer 113.

[0061] A part of the second section 115b is formed in the box body 130, and another part is formed in the water channel cover plate 140. By installing the second section 115b separately from the box body 130 and the water channel cover plate 140, the angle of the included angle between the part of the second section 115b formed in the box body 130 and the first outer surface 110 may be the same as the angle of the included angle between the part of the second section 115b formed in the water channel cover plate 140 and the first outer surface 110. When the water channel cover plate 140 is attached to the box body 130, the two parts of the second section 115b can be better matched, thereby ensuring the communication of the water supply section 115 and smoothing the flow of the coolant.

[0062] In some specific embodiments of the present disclosure, as shown in FIG. 3 , a plurality of shield cavities 121 are formed on the second outer surface 120, and the plurality of shield cavities 121 accommodate the plurality of power modules of the power supply module 300 in a one-to-one correspondence, thereby preventing mutual interference between the plurality of power modules, preventing the plurality of power modules from interfering with other elements, and improving the electromagnetic compatibility (EMC) effect.

[0063] Furthermore, each shield cavity 121 and the water passage of the power supply cooling layer 113 share at least one sidewall. For example, one of the shield cavities 121 may be entirely composed of the sidewall of the water passage of the power supply cooling layer 113, or one sidewall of one of the shield cavities 121 is the sidewall of the water passage of the power supply cooling layer 113. This ensures that the power supply cooling layer 113 cools and dissipates heat from the elements in each shield cavity 121, and each shield cavity 121 has both a fixing function, a shielding function, and a cooling and heat dissipation function.

[0064] In some specific embodiments of the present disclosure, as shown in Figures 4 and 6, the transition section 114 includes a third section 114a and a fourth section 114b. The third section 114a communicates with the power supply cooling layer 113, and both ends of the fourth section 114b communicate with the third section 114a and the IGBT cooling layer 112, respectively. In this way, the communication between the IGBT cooling layer 112 and the power supply cooling layer 113 can be realized, and the coolant of the IGBT cooling layer 112 can flow from the fourth section 114b and the third section 114a to the power supply cooling layer 113 in sequence.

[0065] The third section 114a may be offset from the IGBT cooling layer 112 to the second outer surface 120 in the thickness direction of the control box 100, i.e., the third section 114a and the IGBT cooling layer 112 may be parallel to each other. For example, the fourth section 114b is connected to the bottom of the IGBT cooling layer 112, and gradually moves away from the IGBT cooling layer 112 as it moves away from the first outer surface 110. In this way, the transition section 114 is closer to the power module 300, i.e., the distance between the power supply cooling layer 113 and the power supply module 300 is closer, which contributes to the power supply cooling layer 113 dissipating heat to the power supply module 300, and because there is a height difference between the third section 114a and the IGBT cooling layer 112, the coolant in the IGBT cooling layer 112 flows more smoothly toward the third section 114a.

[0066] Preferably, the included angle between the fourth section 114b and the third section 114a is not a right angle, the included angle between the fourth section 114b and the IGBT cooling layer 112 is also not a right angle, and the orthogonal projections of the third section 114a and the IGBT cooling layer 112 onto the first outer surface 110 do not overlap, thereby making the flow of the cooling liquid gentler.

[0067] In some embodiments of the present disclosure, as shown in Figures 4 to 6, the control box 100 includes a box body 130 and a water channel cover plate 140. The power supply cooling layer 113 is formed in the box body 130, and the power supply module 300 is attached to the box body 130. The water channel cover plate 140 is attached to the box body 130, covers the power supply cooling layer 113, and defines a transition section 114 together with the box body 130, and the IGBT cooling layer 112 is formed in the water channel cover plate 140, and the IGBT module 200 is attached to the water channel cover plate 140.

[0068] Since the control box 100 is installed separately as the box body 130 and the water channel cover plate 140, the power supply cooling layer 113 and the IGBT cooling layer 112 can be processed separately, and the side of the power supply cooling layer 113 facing the water channel cover plate 140 is open, that is, the power supply cooling layer 113 penetrates the first outer surface 110, which makes it easy to process the power supply cooling layer 113, and after the power supply cooling layer 113 is processed and shaped, the water channel cover plate 140 is attached to the box body 130 to complete the sealing of the power supply cooling layer 113. In this way, the sealing of the power supply cooling layer 113 can be realized while reducing the difficulty of processing the power supply cooling layer 113.

[0069] The fourth section 114b is formed on the water channel cover plate 140, and the third section 114a is formed on the box body 130 and covered by the water channel cover plate 140. The water channel cover plate 140 covers the third section 114a, so that the coolant can be prevented from overflowing from the transition section 114 to the IGBT cooling layer. After the water channel cover plate 140 is attached to the box body 130, the third section 114a communicates with the fourth section 114b, and the coolant flows from the IGBT cooling layer 112 to the fourth section 114b and the third section 114a in order, and then flows to the power supply cooling layer 113, thereby dissipating heat from the power supply module 300. In addition, the cross-sectional area of ​​the third section 114a may be set large, thus slowing down the flow speed of the coolant, and the coolant can sufficiently dissipate heat from the power supply module 300.

[0070] Specifically, as shown in FIGS. 2 and 6, the depth of the third section 114a is less than the depth of the power supply cooling layer 113.

[0071] For example, the power supply cooling layer 113 is formed in a groove recessed from the first outer surface 110 toward the second outer surface 120, and the depth direction of the power supply cooling layer 113 is parallel to the thickness direction of the box body 130. The bottom wall of the third section 114a may be the bottom wall of at least one shield cavity 121, and reducing the depth of the third section 114a increases the volume of the at least one shield cavity 121, contributing to improving space utilization rate. In addition, in the thickness direction of the box body 130, the third section 114a is located between the bottom wall of the power supply cooling layer 113 and the IGBT cooling layer 112, and the third section 114a forms a height difference with the power supply cooling layer 113 and the IGBT cooling layer 112 respectively, so that the third section 114a plays a buffering effect and the coolant can flow more slowly from the IGBT cooling layer 112 through the transition section 114 to the power supply cooling layer 113, which not only allows the coolant to fully exert its cooling and heat dissipation effect, but also prevents the coolant from splashing.

[0072] In some specific embodiments of the present disclosure, as shown in Figures 2, 3 and 7, the power supply cooling layer 113 includes a fifth section 113a, a sixth section 113b, a seventh section 113c and a drainage section 113d connected in sequence.

[0073] The fifth section 113a is connected to the transition section 114 and is parallel to the seventh section 113c, and the sixth section 113b is connected between the fifth section 113a and the seventh section 113c and is installed at an angle with respect to the fifth section 113a and the seventh section 113c, for example, the sixth section 113b is perpendicular to the fifth section 113a and the seventh section 113c, respectively, that is, the fifth section 113a, the sixth section 113b and the seventh section 113c may be formed in a "box" shape.

[0074] By bending the power supply cooling layer 113 in multiple stages, the length of the power supply cooling layer 113 can be increased, and the power supply cooling layer 113 can more effectively dissipate heat from the power supply module 300, thereby increasing the contact area between the power supply cooling layer 113 and the power supply module 300 and improving the heat dissipation effect.

[0075] The drainage section 113d has one end connected to the seventh section 113c and the other end provided with a drainage hole 113e, so that the cooling liquid in the seventh section 113c can flow from the drainage section 113d to the drainage hole 113e. The depth of the drainage section 113d may be smaller than the depth of the seventh section 113c, and the bottom wall of the drainage section 113d serves to stop the cooling liquid and reduce the flow speed of the cooling liquid, thereby lengthening the time for the cooling liquid to flow into the power supply cooling layer 113, which contributes to the cooling liquid in the fifth section 113a, the sixth section 113b and the seventh section 113c to fully exchange heat with the power supply module 300, and the use efficiency of the cooling liquid is higher, so that the cooling liquid can effectively dissipate heat from the power supply module 300.

[0076] In addition, a water discharge section and a water discharge pipe 132 are installed in the box body 130, the drainage hole 113e is connected to the water discharge pipe 132 through the water discharge section, the water discharge section gradually moves away from the first outer surface 110 as it moves away from the drainage section 113d, and the water discharge pipe 132 may be located between the first outer surface 110 and the second outer surface 120, the structure of the box body 130 is more compact, and the cooling liquid sufficiently dissipates heat from the power supply module 300 in the power supply cooling layer 113, and then flows through the drainage hole 113e, the water discharge section and the water discharge pipe 132 in order, before being discharged outside the box body 130, which makes it easy to replace the cooling liquid in the power supply cooling layer 113 and ensures the heat dissipation effect of the power supply cooling layer 113.

[0077] In some specific embodiments of the present disclosure, as shown in FIG. 3 and FIG. 7, a first shielding rib 122 and a second shielding rib 123 are provided on the second outer surface 120 .

[0078] The first shield rib 122 is located on the side of the fifth section 113a facing away from the seventh section 113c, and the second shield rib 123 is located on the side of the seventh section 113c facing away from the fifth section 113a. The first shield cavity 124 is surrounded by the first shield rib 122 and the fifth section 113a, and the second shield cavity 125 is surrounded by the second shield rib 123 and the seventh section 113c. The power supply module 300 includes a MOS transistor 310 located in the first shield cavity 124 and the second shield cavity 125.

[0079] For example, the first shielding rib 122 may include a first parallel section and a plurality of spaced apart first closed sections, the first parallel section may be parallel to the fifth section 113a and spaced apart from the fifth section 113a, each first closed section is connected to the first parallel section and the fifth section 113a, respectively, and two adjacent first closed sections, the first parallel section and the fifth section 113a form a first shielding cavity 124, and the first shielding cavity 124 may be multiple. The second shielding rib 123 may include a second parallel section and a plurality of spaced apart second closed sections, the second parallel section may be parallel to the seventh section 113c and spaced apart from the seventh section 113c, each second closed section being connected to the second parallel section and the seventh section 113c, respectively, and two adjacent second closed sections, the second parallel section and the seventh section 113c form a second shielding cavity 125, and the second shielding cavity 125 may be multiple.

[0080] The power supply cooling layer 113 can simultaneously dissipate heat from the MOS transistor 310 in the first shield cavity 124 and the MOS transistor 310 in the second shield cavity 125. By installing multiple shield cavities 121, the power supply cooling layer 113 can not only sufficiently dissipate heat from the MOS transistor 310, but also accommodate the MOS transistor 310 and fix the relative position of the MOS transistor 310 and the control box 100. The first shield cavity 124 and the second shield cavity 125 shield the MOS transistor 310, preventing the MOS transistor 310 from interfering with other elements (e.g., a vehicle control panel), and improving the EMC effect.

[0081] In some embodiments of the present disclosure, as shown in Figures 3 and 7, the third shield cavity 126 is surrounded by the fifth section 113a, the sixth section 113b and the seventh section 113c, the third shield cavity 126 is U-shaped, and the power supply module 300 further includes a transformer 320 and a transformer inductor 330, and the transformer 320 and the transformer inductor 330 are located in the third shield cavity 126. For example, the sixth section 113b may be installed perpendicular to the fifth section 113a and the seventh section 113c. In this way, it contributes to increasing the volume of the third shield cavity 126 formed by the fifth section 113a, the sixth section 113b and the seventh section 113c, which is easier to accommodate the transformer 320 and the transformer inductor 330 and more convenient to install.

[0082] The fifth section 113a, the sixth section 113b and the seventh section 113c can all dissipate heat from the transformer 320 and the transformer inductor 330, and the temperature reduction effect on the elements in the third shield cavity 126 of the power supply cooling layer 113 is significant, realizing effective heat dissipation to the transformer 320 and the transformer inductor 330, so that the transformer 320 and the transformer inductor 330 are always in an efficient operating state. The third shield cavity 126 can fix the relative positions of the transformer 320, the transformer inductor 330 and the control box 100, shield the transformer 320 and the transformer inductor 330, and prevent the transformer 320 and the transformer inductor 330 from interfering with other elements (e.g., a vehicle control panel), thereby improving the EMC effect.

[0083] The first shield cavity 124, the second shield cavity 125 and the third shield cavity 126 are three mutually independent cavities, in this way the power elements in each cavity do not interfere with each other, the shielding effect is higher and the EMC can be optimized again.

[0084] In some specific embodiments of the present disclosure, as shown in FIG. 7 , the MOS transistor 310, the transformer 320 and the transformer inductor 330 are integrated on the same circuit board 340, which covers the first shield cavity 124, the second shield cavity 125 and the third shield cavity 126.

[0085] Specifically, the circuit board 340 is an integrated unit, and the above components are integrated and installed to reduce the volume of the power module 300, and the MOS transistor 310, the transformer 320, and the transformer inductor 330 can be simultaneously attached and detached to improve the assembly efficiency of the power module 300. The MOS transistor 310, the transformer 320, and the transformer inductor 330 are attached to the side of the circuit board 340 facing the second outer surface 120, and the circuit board 340 covers the multiple shield cavities 121, and can prevent the MOS transistor 310, the transformer 320, and the transformer inductor 330 from being separated from the corresponding shield cavities 121.

[0086] Hereinafter, a vehicle according to an embodiment of the present disclosure will be described with reference to the drawings.

[0087] As shown in FIG. 1 and FIG. 8, a vehicle according to an embodiment of the present disclosure includes a vehicle controller 1 according to the above embodiment of the present disclosure, a power box 500, a motor, and a transmission.

[0088] The power box 500 is attached to the vehicle controller 1, the motor and the above-mentioned transmission are connected in a transmissible manner and attached to the power box 500, and the motor is connected to the IGBT module 200. For example, the power box 500 is attached to the side facing away from the water channel cover plate 140 of the box body 130, and the power box 500 can fix and shield the motor and transmission to avoid damage to the motor and transmission.

[0089] A motor cooling water passage is installed in the power box 500, and the motor cooling water passage is connected to the control cooling water passage 111. As a result, after the cooling liquid in the control cooling water passage 111 cools the IGBT module 200 and the power supply module 300 and dissipates heat, the cooling liquid is discharged from the drain hole 113e and flows into the motor cooling water passage via the discharge pipe 132, and the motor and transmission dissipate heat by the cooling liquid in the motor cooling water passage.

[0090] As a result, the water passage space of the control cooling water passage 111 and the motor cooling water passage is large, the flow path of the coolant is long, the coolant can be fully utilized, and the heat dissipation efficiency of the entire vehicle controller 1 is higher.

[0091] A vehicle according to an embodiment of the present disclosure has advantages such as a large water channel space, high cooling effect, high efficiency, and high shielding effect by using the vehicle controller 1 described in the above embodiment of the present disclosure.

[0092] Hereinafter, the flow path of the coolant in the vehicle controller 1 will be described with reference to the drawings.

[0093] First, the cooling liquid is supplied from the water supply pipe 400, enters the IGBT cooling layer 112 through the water supply section 115, cools the IGBT module 200 in the IGBT cooling layer 112, and then flows into the transition section 114; Next, the cooling liquid flows into the power supply cooling layer 113 through the transition section 114, and in the power supply cooling layer 113, flows through the fifth section 113a, the sixth section 113b, and the seventh section 113c in order, dissipates heat from the power supply module 300, and then flows into the drain hole 113e through the drain section 113d. Finally, the cooling liquid is discharged from the drain hole 113e and discharged through the discharge section 131 to the discharge pipe 132, which is connected to the motor cooling water passage, and the cooling liquid flows into the motor cooling water passage to dissipate heat from the motor and transmission.

[0094] Other configurations and operations of the vehicle controller 1 and the vehicle having the same according to the embodiments of the present disclosure are known to those skilled in the art and will not be described in detail herein.

[0095] In the present specification, a description referring to the term "specific example", "specific example", etc. means that the specific feature, structure, material or characteristic described in combination with the example or example is included in at least one example or example of the present disclosure. In the present specification, an exemplary description for the above term is not necessarily limited to the same example or example.

[0096] Although embodiments of the present disclosure have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and objectives of the present disclosure, and that the scope of the present disclosure is limited by the claims and their equivalents. [Explanation of symbols]

[0097] 1 Vehicle Controller 100 Control Box 110 First outer surface 111 Controlled cooling channel 112 IGBT cooling layer 113 Power supply cooling layer 113a Section 5 113b Section 6 113c Section 7 113d Drainage Section 113e Drain hole 114 Transition Section 114a Section 3 114b Section 4 115 Water Supply Section 115a Section 1 115b Section 2 120 Second outer surface 121 Shield Cavity 122 First Shield Rib 123 Second Shield Rib 124 First Shield Cavity 125 Second Shield Cavity 126 3rd Shield Cavity 130 Box body 132 Water pipe 140 Waterway cover plate 141 Insertion port 142 Mounting surface 143 Sealing groove 144 Sealing Ring 145 Cover part 146 Insertion section 200 IGBT Modules 300 Power Supply Module 310 MOS Transistor 320 Transformer 330 Transformer Inductor 340 Circuit Board 400 Water supply pipe 500 Power Box

Claims

1. A control box, an IGBT module, and a power module, the control box has a first outer surface and a second outer surface arranged opposite to each other in a thickness direction, a controlled cooling water passage is arranged on the first outer surface, the controlled cooling water passage includes an IGBT cooling layer, a power supply cooling layer and a transition section, the IGBT cooling layer and the power supply cooling layer are arranged in a stacked manner in the thickness direction of the control box and communicate with each other via the transition section, the IGBT module is attached to the first outer surface, inserted into the IGBT cooling layer, and dissipates heat by a coolant in the IGBT cooling layer; the power supply module is attached to the second outer surface, adjacent to the power supply cooling layer, and dissipates heat by a cooling fluid in the power supply cooling layer; A plurality of shield cavities are formed in the second outer surface, and each of the shield cavities and the water passage of the power supply cooling layer share at least one side wall. A vehicle controller comprising:

2. The control box includes a box body and a waterway cover plate; The power supply cooling layer is formed on the box body, and the power supply module is attached to the box body; the waterway cover plate is attached to the box body, covers the power supply cooling layer, and defines the transition section together with the box body; the IGBT cooling layer is formed on the waterway cover plate; the IGBT module is attached to the waterway cover plate; An insertion hole is provided on the water channel cover plate, the insertion hole is connected to the IGBT cooling layer, and the IGBT module is inserted into the IGBT cooling layer through the insertion hole; 2. The vehicle controller according to claim 1, wherein a mounting surface surrounding the insertion opening is provided on a surface of the waterway cover plate facing away from the box body, and the IGBT module is mounted on the mounting surface.

3. 3. The vehicle controller according to claim 2, wherein the mounting surface has a sealing groove surrounding the insertion opening, and a sealing ring is installed in the sealing groove to seal a gap between the mounting surface and the IGBT module.

4. The waterway cover plate includes a cover portion and an insert portion; the cover portion is attached to the box body, covers the power supply cooling layer, and defines the transition section together with the box body; 3. The vehicle controller of claim 2, wherein the insertion portion is connected to a surface of the cover portion facing away from the box body, the IGBT module is attached to a surface of the insertion portion facing away from the cover portion, and the insertion portion and the cover portion define the IGBT cooling layer.

5. the controlled cooling water passage further includes a water supply section, the water supply section connected to an end of the IGBT cooling layer remote from the transition section; A water supply pipe is connected to the control box, and the water supply pipe is in communication with the water supply section; the water supply section includes a first section and a second section, the first section communicates with the water supply pipe, and both ends of the second section are connected to the first section and the IGBT cooling layer, respectively; 2 . The vehicle controller according to claim 1 , wherein the first section is disposed on the second outer surface side within the first outer surface in a thickness direction of the control box.

6. The control box includes a box body and a waterway cover plate; The power supply cooling layer is formed on the box body, and the power supply module is attached to the box body; the waterway cover plate is attached to the box body, covers the power supply cooling layer, and defines the transition section together with the box body; the IGBT cooling layer is formed on the waterway cover plate; the IGBT module is attached to the waterway cover plate; The vehicle controller according to claim 5 , wherein the second section is partially formed in the box body and another partially formed in the waterway cover plate.

7. the transition section includes a third section and a fourth section, the third section communicates with the power supply cooling layer, and both ends of the fourth section communicate with the third section and the IGBT cooling layer, respectively; The vehicle controller according to claim 1 , wherein the third section is disposed on the second outer surface side within the first outer surface in a thickness direction of the control box.

8. The control box includes a box body and a waterway cover plate; The power supply cooling layer is formed on the box body, and the power supply module is attached to the box body; the waterway cover plate is attached to the box body, covers the power supply cooling layer, and defines the transition section together with the box body; the IGBT cooling layer is formed on the waterway cover plate; the IGBT module is attached to the waterway cover plate; The fourth section is formed in the waterway cover plate, and the third section is formed in the box body and covered by the waterway cover plate; The vehicle controller of claim 7 , wherein the depth of the third section is less than a depth of the power supply cooling layer.

9. The power supply cooling layer includes a fifth section, a sixth section, a seventh section, and a drainage section connected in sequence, the fifth section is connected to the transition section and is parallel to the seventh section, the sixth section is connected between the fifth section and the seventh section, and is inclined with respect to the fifth section and the seventh section, the drainage section has one end connected to the seventh section and the other end provided with a drainage hole, 2. The vehicle controller according to claim 1, wherein a water discharge section and a water discharge pipe are provided in the box body, and the drain hole communicates with the water discharge pipe via the water discharge section.

10. a first shield rib and a second shield rib are provided on the second outer surface, the first shield rib is located on a side of the fifth section facing away from the seventh section, and the second shield rib is located on a side of the seventh section facing away from the fifth section; 10. The vehicle controller of claim 9, wherein a first shielding cavity is surrounded by the first shielding rib and the fifth section, a second shielding cavity is surrounded by the second shielding rib and the seventh section, and the power supply module includes MOS transistors located in the first shielding cavity and the second shielding cavity.

11. a third shielded cavity is surrounded by the fifth section, the sixth section and the seventh section, and the power module further includes a transformer and a transformer inductor, the transformer and the transformer inductor being located in the third shielded cavity; 11. The vehicle controller of claim 10, wherein the MOS transistor, the transformer and the transformer inductor are integrated on a same circuit board, the circuit board covering the first shielding cavity, the second shielding cavity and the third shielding cavity.

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