Mounting board

Abstract

To provide a mounting board made of a synthetic resin that can prevent cracks from being generated at a soldering point and prevent the synthetic resin near the soldering point from melting due to the heat of the solder, simply with a low cost.SOLUTION: In a mounting board 1 in which electronic components 10 are soldered to a synthetic resin board 1, a wiring line 6 is arbitrarily wired, and a part of a connection terminal 7 connected to the end of the wiring line 6 is inserted, and the connection terminal 7 includes a soldering point 7a that solders the electronic component 10 and a telescopic portion 7b that expands and contracts the connection terminal 7 in the longitudinal direction.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a mounting board made of synthetic resin to which electronic components are soldered. [Background technology]

[0002] Prior art for preventing cracks from occurring at soldered portions due to the difference in thermal expansion coefficient between a mounting board and an electronic component soldered to the mounting board is disclosed in, for example, Patent Documents 1 and 2 shown below.

[0003] The invention described in Patent Document 1 is said to prevent the occurrence of cracks due to temperature cycles in the solder joints of circuit elements mounted on a substrate by covering and sealing the circuit elements with a coating resin having a thermal expansion coefficient α that is substantially similar to the thermal expansion coefficient α of the substrate.

[0004] In addition, the invention described in Patent Document 2 provides a distortion suppression body 20 (ceramic sheet) made of ceramic, which is the main component of electronic component 13, on the surface and / or inner surface of printed wiring board 10 having metal electrode portion 10a on its surface, facing electronic component 13, thereby reducing the difference in expansion and contraction between electronic component 13 and printed wiring board 10 due to temperature changes in the vicinity of electronic component 13 and reducing the stress applied to solder fillet 11. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 5-102645 [Patent Document 2] JP 2010-87145 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the invention described in Patent Document 1, the process of covering and sealing the circuit elements with a coating resin must be performed individually for each electronic element, and when there are a large number of electronic elements, the cost of automating this process may become enormous.

[0007] Furthermore, the invention described in Patent Document 2 requires that a large number of distortion suppression bodies 20 (ceramic sheets) which are separate from the wiring board 10 be arranged on the surface and / or inner surface of the wiring board 10, which increases the number of parts and makes it difficult to reduce manufacturing costs.

[0008] Furthermore, when a mounting board needs to be made of a synthetic resin molded product with an extremely large coefficient of thermal expansion, a synthetic resin mounting board is used that is insert-molded by pouring molten resin into a mold in which conductive connection terminals have been set in advance. When soldering electronic components to the soldering points of the connection terminals provided on such a synthetic resin mounting board, there is a risk that the high-temperature solder will wet and spread, causing the synthetic resin near the soldering points to partially melt due to the heat. Therefore, in such cases, it is necessary to solder the synthetic resin located near the soldering points while protecting it in advance with a resist treatment or the like, which is one of the factors that leads to increased costs.

[0009] In order to solve the problems in the conventional technology described above, an object of the present invention is to create a mounting board made of synthetic resin that can simply and at low cost prevent the occurrence of cracks at soldering points and prevent the synthetic resin in the vicinity of the soldering points from melting due to the heat of the solder. [Means for solving the problem]

[0010] Among the means for solving the above problems, the present invention 1. The means are: Electronic components soldered onto a synthetic resin board Connects and fixes at multiple points A mounting board for mounting a semiconductor device, The wiring paths are arbitrarily wired on the board, and a part of the connection terminal provided at the end of the wiring path is inserted into the board. The connection terminals are When placed on top Soldering To be The soldered portion and a part of the connection terminal excluding the soldered portion are mutually Same top Bending in the direction Formed It has one inclined surface and the other inclined surface. The opposite Formed in a V shape and the distance between the one inclined surface and the other inclined surface can be expanded or contracted to be expandable or contractible. The present invention is characterized by having an expandable portion. The present invention 1. With this means, even if distortion (dimensional change) occurs in the synthetic resin board in response to temperature change, the expandable portion absorbs the distortion, and it is possible to prevent concentration of stress due to the distortion at the soldering points.

[0011] Ma The opposite By bending the expandable portion into a V-shape, it is possible to achieve the effect of restricting the spreading of the solder to only those areas that are required.

[0013] The present invention also The second means is a mounting board in which electronic components are connected and fixed at a plurality of points by soldering to a substrate made of synthetic resin, The substrate has wiring paths arbitrarily arranged thereon and a part of a connection terminal provided at an end of the wiring paths inserted therein; The connection terminal is characterized by having a soldering portion to which the electronic component is soldered with the electronic component placed thereon, and an expandable portion in which a portion of the connection terminal excluding the soldering portion is formed by a frame portion. In the above-described means, the frame deforms unevenly left and right (in the longitudinal direction) in response to the resonant vibration, and therefore the resonant vibration can be absorbed, and connection failures such as disconnection caused by concentrated stress can be suppressed.

[0014] Another aspect of the present invention is any one of the above aspects, further comprising forming a recess in a position on the board opposite the soldering location. The above-mentioned method makes it possible to increase the distance between the soldering points and the board, thereby making it possible to prevent the board from melting due to the heat of the solder generated when soldering an electronic component to the soldering points.

[0015] Further, another aspect of the present invention is the above 1st or 2nd The above-mentioned means is supplemented by the means in which a pair of connection terminals are arranged opposite each other at a predetermined distance on the substrate, and recesses are formed in the substrate at positions opposite both ends of the connection terminals. The above-mentioned means can prevent the substrate from melting due to the heat of the solder generated when soldering both electrode terminals of the electronic component, particularly at the soldering locations of a pair of connecting terminals arranged opposite to each other. Effect of the Invention

[0016] In the mounting board of the present invention, the simple and low-cost configuration of forming an expandable portion in the connection terminal makes it possible to absorb the distortion (dimensional change) that occurs in the synthetic resin board in response to temperature changes and prevent stress due to distortion from concentrating at the soldering point at the tip of the connection terminal, thereby preventing cracks from occurring in the solder fillet formed at the soldering point. In addition, the expandable portion suppresses the spreading of the solder and makes it difficult for heat to be conducted toward the base end, thereby preventing the resin in the portion of the synthetic resin board where the connection terminal is inserted from melting due to the heat of the solder. [Brief description of the drawings]

[0017] [Figure 1] 1 is a side view showing a portion of a mounting board according to a first embodiment of the present invention. [Diagram 2] 2 is a side view showing a state in which an electronic component is soldered to a connection terminal of the mounting board in FIG. [Diagram 3] FIG. 11 is a side view showing a part of a mounting board according to a second embodiment of the present invention. [Figure 4] 4 is a side view showing a state in which an electronic component is soldered to the connection terminal of the mounting board in FIG. 3. [Diagram 5] 10A and 10B show a part of a mounting board according to a third embodiment of the present invention, in which A is a longitudinal sectional view and B is a transverse sectional view taken along line VV of A. [Figure 6] 6A and 6B show a state in which electronic components are soldered to connection terminals of a mounting board in FIG. 5, where A is a longitudinal sectional view and B is a transverse sectional view taken along line VI-VI of A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing a part of a mounting board according to a first embodiment of the present invention, and FIG. 2 is a side view showing a state in which electronic components are soldered to connection terminals of the mounting board shown in FIG.

[0019] A wiring path 6 formed by arbitrarily wiring conductive foil is arranged on a substrate 1 which is the main component of the mounting board of the present invention, and a connection terminal 7 is provided at the end of the wiring path 6. Established The tips of the connection terminals 7 protrude from the substrate 1. The substrate 1 is formed by an insert molding method in which a molten synthetic resin material, such as glass epoxy resin, polyethylene resin (PE), polypropylene resin (PP), or the like, is poured into a predetermined mold in which the wiring paths 6 and the connection terminals 7 are set.

[0020] 1, a pair of stepped terminal forming portions 2 each having a protruding surface 3 and a mounting surface 4 are formed facing each other on both the left and right sides of a substrate 1, and a connection terminal 7 is provided on each of the left and right terminal forming portions 2. The connection terminals 7 are formed of a thin, long plate of conductive metal such as iron or copper, a part of which is inserted into the protruding surface 3 of the substrate 1, and the remaining part of which protrudes from the substrate 1 to the outside.

[0021] As shown in FIG. 2, the protruding connection terminal 7 has a soldering portion 7a at the tip end to which the electrode terminal 11 of the electronic component 10 is connected, and a base end 7c at the protruding surface 3 side. In this embodiment, an expandable portion 7b is formed between the soldering portion 7a at the tip end and the base end 7c. The expandable portion 7b shown in the first embodiment has a slope 7b1 on the soldering portion 7a side and a slope 7b2 on the base end 7c side, and is bent in an inverted V shape in side view. In the first embodiment, the soldering portion 7a of one opposing connection terminal 7 and the soldering portion 7a of the other opposing connection terminal 7 face each other with a predetermined distance ΔL between them. This predetermined distance ΔL can be set according to the distance between the electrode terminals 11 provided at both ends of the electronic component 10.

[0022] Next, the operation of soldering the electronic component 10 to the mounting board will be described. As shown in FIG. 2, the electronic component 10 is a chip component composed of passive elements such as resistors, capacitors, or coils, and has electrode terminals 11 insulated from each other at both the left and right ends. The electronic component 10 is soldered in a state in which both electrode terminals 11 of the electronic component 10 are placed on the soldering points 7a of one connection terminal 7 and the soldering points 7a of the other connection terminal 7, respectively. At this time, the solder tends to spread from the soldering points 7a to the entire connection terminal 7, but since it can be stopped by the stretchable parts 7b formed in an inverted V shape, it is possible to prevent the solder from spreading beyond the stretchable parts 7b to the base end 7c. Therefore, the base end 7c can be made lower in temperature than the soldering points 7a, and it is possible to prevent the protruding surface 3 and the mounting part 4 on the board 1 side located near the base end 7c from being partially melted by the heat of the solder. Furthermore, a solder fillet 20 having a desirable shape can be formed in the region sandwiched between the side surface 12 of the electrode terminal 11 of the electronic component 10, the soldering portion 7a, and the slope 7b1 of the expandable portion 7b.

[0023] In the first embodiment, a recess 5 is formed at a position opposite the soldering location 7a of the substrate 1, and a structure is created that prevents the soldering location 7a from coming into direct contact with the substrate 1, thereby making it possible to reliably prevent the substrate 1 from melting due to the heat of the solder.

[0024] During soldering, the heat of the solder tends to be conducted from the soldering portion 7a to the base end 7c, but the inverted V-shaped expandable portion 7b extends the distance over which the heat is conducted in comparison with a configuration without the expandable portion 7b, so that the base end 7c can be set to a temperature sufficiently lower than that of the soldering portion 7a, and as a result, melting of the base end 7a is unlikely to occur even if the base end 7a comes into contact with the mounting surface 4 of the substrate 1. The length in the longitudinal direction of the recess 5 formed between the left and right mounting surfaces 4 supporting the base end 7c can be set according to the distance L1 between the pair of expandable portions 7b, so that the base end 7c of the connection terminal 7 can be stably supported by the mounting portion 4 on the substrate 1 side.

[0025] Next, when a product having a synthetic resin mounting board with electronic components 10 soldered thereto is placed in a high-temperature or low-temperature environment, distortion (dimensional change) occurs in the board 1, causing a predetermined distance ΔL to be displaced. At this time, the expandable portion 7b expands and contracts in the longitudinal direction in response to this displacement, i.e., the distance L2 between one slant surface 7b1 and the other slant surface 7b1 of the inverted V-shaped expandable portion 7b expands or contracts in the longitudinal direction, absorbing the distortion (dimensional change) of the board 1 caused by temperature change and making it possible to keep constant the predetermined distance ΔL between the pair of soldering points 7a to which the electronic components 10 are soldered. This makes it possible to reduce the stress applied to the solder fillet 20, and as a result, to suppress the occurrence of cracks.

[0026] FIG. 3 is a side view showing a part of a mounting board according to a second embodiment of the present invention, and FIG. 4 is a side view showing a state in which electronic components are soldered to connection terminals of the mounting board shown in FIG. 3 and 4 as the second embodiment differs from the mounting board of the first embodiment mainly in the configurations of the terminal forming portion 2 and the connection terminals 7, while the other configurations and effects are the same as those of the first embodiment. Therefore, the following mainly describes the differences.

[0027] 3, the substrate 1 of the second embodiment has only a protruding surface 3, and the connection terminal 7 protrudes from this protruding surface 3. Between the base end 7c of the connection terminal 7 and the soldering point 7a at the tip, a crank-shaped expandable portion 7b consisting of a downwardly inclined surface 7b3 that extends from the base end 7c toward the soldering point 7a is formed, and the base end 7c and the soldering point 7a are formed approximately horizontally. In the second embodiment, too, the soldering point 7a of one connection terminal 7 protruding from one protruding surface 3 of the substrate 1 and the soldering point 7a of the other connection terminal 7 protruding from the other protruding surface 3 are arranged opposite each other in the recess 5 with a predetermined distance ΔL between them.

[0028] 4, both electrode terminals 11 of electronic component 10 are soldered in a state in which they are placed on the soldering spot 7a of one connection terminal 7 and the soldering spot 7a of the other connection terminal 7. At this time, a solder fillet 20 having a preferred shape (triangular in side view in this embodiment) is formed in the region sandwiched between the side surface 12 of electrode terminal 11 of electronic component 10, soldering spot 7a, and inclined surface 7b3 of expandable portion 7b. During soldering, the inclined surface 7b3 of the crank-shaped expandable portion 7b can stop the solder from spreading over the entire connection terminal 7. This prevents the solder from spreading beyond the expandable portion 7b to the base end 7c. Therefore, the expandable portion 7b extends the distance over which heat is substantially conducted compared to a configuration without the expandable portion 7b, and the base end 7c can be set to a temperature sufficiently lower than that of the soldering portion 7a. As a result, the protruding surface 3 of the substrate 1 located near the base end 7c can be prevented from being partially melted by the heat of the solder.

[0029] Next, when a product having a synthetic resin mounting board with electronic components 10 soldered thereto is placed in a high-temperature or low-temperature environment and distortion (dimensional change) occurs in the board 1, causing a predetermined distance ΔL to be displaced, the expandable portion 7b expands and deforms in the longitudinal direction in response to this displacement, i.e., the inclination angle of the downward inclined surface 7b3 forming the expandable portion 7b is displaced and the longitudinal length L3 (see FIG. 3) expands or contracts in the longitudinal direction, absorbing the distortion (dimensional change) of the board 1 caused by the temperature change and making it possible to keep the predetermined distance ΔL between the pair of soldering points 7a to which the electronic components 10 are soldered constant. Therefore, in this embodiment as well, it is possible to reduce the stress applied to the solder fillet 20, as in the above, and as a result, it is possible to suppress the occurrence of cracks.

[0030] FIG. 5 shows a part of a mounting board according to a third embodiment of the present invention, where A is a longitudinal sectional view and B is a transverse sectional view taken along line VV of A. FIG. 6 shows a state in which electronic components have been soldered to the connection terminals of the mounting board in FIG. 5, where A is a longitudinal sectional view and B is a transverse sectional view taken along line VI-VI of A. The mounting board shown in Figures 5 and 6 as the third embodiment differs from the mounting boards of the first and second embodiments mainly in the configurations of the terminal forming portion 2 and the connection terminals 7. The other configurations and effects are the same as those of the first embodiment, so the following description will mainly focus on the differences.

[0031] As shown in FIG. 5A and FIG. 5B, in the mounting board of the third embodiment, the soldering portion 7a, which is the tip of the connection terminal 7, protrudes linearly from the protruding surface 3 arranged opposite to the board 1 through the substantially rectangular recess 5. The stretchable portion 7b, which constitutes a part of the connection terminal 7, is inserted into the protruding surface 3. The stretchable portion 7b shown in this embodiment is formed as a rectangular frame portion in a plan view, having two horizontal line portions 7b4 arranged in parallel and two vertical line portions 7b5 arranged in parallel. The vertical line portions 7b5 arranged perpendicular to the stretching direction (longitudinal direction) are formed to have a narrower width dimension than the horizontal line portions 7b4 arranged along the stretching direction, so that they are easily deformed during stretching. Of the vertical line portions 7b5, the connection portion between the vertical line portions 7b5 and other wiring paths 6 is the base end portion 7c. The shape of the stretchable portion 7b is not limited to a rectangular frame portion, and may be a frame portion having other shapes such as a circular frame portion or an elliptical frame portion.

[0032] 6A and 6B, both electrode terminals 11 of electronic component 10 are soldered in a state in which they are placed on the soldering points 7a of one connection terminal 7 and the soldering points 7a of the other connection terminal 7, which are symmetrically arranged on a pair of protruding surfaces 3 of recess 5. At this time, in this embodiment, a solder fillet 20 having a preferred shape (triangular in side view in this embodiment) is formed in the region sandwiched between side surface 12 of electrode terminal 11 of electronic component 10 and soldering points 7a.

[0033] Next, when a product having a synthetic resin mounting board with electronic components 10 soldered thereto is placed in a high-temperature or low-temperature environment, and distortion (dimensional change) occurs in the board 1, causing a predetermined distance ΔL to be displaced, the expandable portion 7b expands and contracts in the longitudinal direction in response to the displacement. That is, as shown in FIG. 6B, the two vertical line portions 7b5 forming the expandable portion 7b are curved and deformed in a convex shape toward the electronic component 10 when distortion occurs in which the board 1 expands in the longitudinal direction, and are curved and deformed in a concave shape toward the electronic component 10 when distortion occurs in which the board 1 contracts in the longitudinal direction, thereby absorbing the distortion (dimensional change) of the board 1 caused by temperature change and making it possible to keep the predetermined distance ΔL between the pair of soldering points 7a to which the electronic components 10 are soldered constant. Therefore, in this embodiment as well, it is possible to reduce the stress applied to the solder fillet 20, as in the above, and as a result, it is possible to suppress the occurrence of cracks.

[0034] Furthermore, if the wiring path 6 is a lead wire, the vibration applied to the product equipped with the mounting board may cause the lead wire to resonate, and stress may be concentrated at the base end 7c, which is the connection part between the lead wire (wiring path 6) and the connection terminal 7, resulting in a connection failure such as a break in the wire. However, in the third embodiment, the two vertical line portions 7b5 deform unevenly left and right (longitudinal direction) in response to the resonant vibration, absorbing the resonant vibration and preventing stress concentration, thereby making it possible to suppress the occurrence of connection defects such as disconnections.

[0035] Although the configuration and the effects of the present invention have been described above based on the embodiments, the present invention is not limited to the above embodiments. For example, in the above first to third embodiments, a configuration has been shown and described in which a pair of connection terminals 7 are arranged opposite each other at a predetermined distance ΔL in one recess 5, but the present invention is not limited to this, and a configuration in which only one connection terminal 7 is arranged in one recess 5 may also be used.

[0036] In the above embodiment, the wiring path 6 made of conductive foil and the connection terminal 7 are inserted into the substrate 1, but if the wiring path 6 is a lead wire, only the connection terminal 7 may be partially inserted into the substrate 1, and the end of the lead wire wired in a floating state (air wiring) may be electrically connected to the base end 7c of the connection terminal 7. The electrical connection between the lead wire (wiring path 6) and the base end 7c of the connection terminal 7 may be by soldering, screwing, crimping, or any other method.

[0037] In the case of the third embodiment, when the wiring path 6 is a conductive foil, the wiring path 6 can be printed by etching, and the connection terminal 7 may be simultaneously formed at the end of the wiring path 6. In this case, the contracted portion 7b of the connection terminal 7 does not necessarily have to be insert molded, and may be configured to be exposed on the surface of the substrate 1. [Industrial Applicability]

[0038] The present invention can be used in a wider range of applications in the field of mounting boards in which electronic components are soldered to synthetic resin boards. [Explanation of symbols]

[0039] 1: Substrate 2 : Terminal forming part 3: Projection surface 4: Placement surface 5: Recess 6: Wireway 7: Connection terminal 7a: Soldering point 7b: Telescopic part 7b1: slope 7b2: Slope 7b3: Slope 7b4: Horizontal line section 7b5: Vertical line section 7c: Proximal end 10: Electronic components 11 : Electrode terminal 12: Side of electrode terminal 20 Fillet

Claims

1. A mounting board in which electronic components (10) are connected and fixed at multiple points by soldering to a substrate (1) made of synthetic resin, A wiring path (6) is arbitrarily wired on the substrate (1), and a part of a connection terminal (7) provided at the end of the wiring path (6) is inserted into the substrate (1); a mounting board characterized in that the connection terminal (7) has a soldering portion (7a) to which the electronic component (10) is placed thereon, and a portion of the connection terminal (7) excluding the soldering portion (7a) is formed into an inverted V-shape with one inclined surface (7b1) and the other inclined surface (7b2) formed by bending the same upward, and the distance (L2) between the one inclined surface (7b1) and the other inclined surface (7b1) expands or contracts to form an expansion / contraction portion (7b).

2. A mounting board in which electronic components (10) are connected and fixed at multiple points by soldering to a substrate (1) made of synthetic resin, A wiring path (6) is arbitrarily wired on the substrate (1), and a part of a connection terminal (7) provided at the end of the wiring path (6) is inserted into the substrate (1); The mounting board is characterized in that the connection terminal (7) has a soldering portion (7a) to which the electronic component (10) is soldered with the electronic component (10) placed thereon, and an expandable portion (7b) formed by a frame portion of a part of the connection terminal (7) excluding the soldering portion (7a).

3. 3. The mounting board according to claim 1, wherein a recess (5) is formed opposite the soldering location (7a) on the substrate (1).

4. 3. The mounting board according to claim 1 or 2, wherein a pair of connection terminals (7) are arranged opposite each other on the substrate (1) with a predetermined distance (ΔL) therebetween, and a recess (5) is formed at a position on the substrate (1) opposite both ends of the connection terminals (7).

Images