Reduced Kapitza Resistance Microwave Filters for Cryogenic Environments.

Abstract

Architectures and fabrication techniques for thermal decoupling devices are provided. In some embodiments, the thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can include a dielectric material and a conductive line. The dielectric material can include a first channel separated from a second channel by a wall of the dielectric material. The conductive line can include a first segment and a second segment separated by the wall. The wall can facilitate propagation of microwave signals between the first and second segments and can reduce heat flow between the first and second segments of the conductive line.

Description

[Technical field]

[0001] The present disclosure relates generally to microwave filter components with segmented or discontinuous signal conductors that exhibit reduced Kapitza resistance in extremely cold temperature cryogenic environments. [Background technology]

[0002] Quantum computing is generally the use of quantum mechanical phenomena to perform computational and information processing functions. Quantum computing can be contrasted with classical computing, which generally operates on binary values ​​using transistors. That is, while classical computers can operate on bit values ​​of either 0 or 1, quantum computers operate on qubits that contain superpositions of both 0 and 1, can entangle multiple qubits, and can use interference.

[0003] Thus, the fundamental element of quantum computing is the quantum bit (qubit). A qubit represents a quantum mechanical system in which information can be encoded and manipulated. An important aspect of a qubit is its coherence time, which describes how long the quantum state of the qubit can be maintained.

[0004] A successful implementation of quantum computing will likely exponentially scale the computational power of current computing systems and has the potential to revolutionize many areas of technology. Currently, many approaches to implementing quantum computing devices have been proposed. One of the most feasible implementation approaches of quantum computing architectures is based on superconducting devices, typically implemented in cryogenic environments. A cryogenic environment can be an environment having extremely low pressure (e.g., vacuum or quasi-vacuum) and extremely low temperatures. For example, a cryogenic environment can exhibit temperatures below about 100 degrees Kelvin (K) and can be as low as about 10 milliKelvin (mK) or lower, such as in a superconducting-based quantum computing environment.

[0005] The performance of superconducting-based quantum computing architectures depends critically on the quality of the superconducting quantum bits (i.e. qubits), which can be directly characterized by measurements of coherence time and qubit error, which in turn depend strongly on the performance of the microwave hardware (e.g. filter devices) at cryogenic temperatures.

[0006] Although there are some microwave filters commercially advertised as being compatible with cryogenic environments, existing microwave filters do not appear to have been designed or tested to operate at temperatures below 77 K, let alone temperatures that may be associated with superconducting-based quantum computing implementations (e.g., near 10 mK or lower).

[0007] Thus, in the field of quantum computing, a technical problem arises in that existing microwave frequency filters or attenuators may exhibit unexpected behavior at certain cryogenic temperatures (e.g., below about 77 K). For example, in cryogenic environments elements of the microwave filter or attenuator may become superconducting and may no longer function to pass, filter, or attenuate signals based on frequency. The inventors have identified that such technical problems arise at least in part due to two distinct technical issues.

[0008] The first technical problem arises because signal conductors, such as coaxial cables, or other hardware, typically cross many temperature zones, ranging from room temperature to cryogenic environments. Thus, elements of the signal conductor, which may include the conductive line propagating the signal, and the dielectric covering or substrate may have dramatic temperature differences. For example, a conductive line employed to propagate a signal from a room temperature environment to a cryogenic environment may vary in temperature by 300 K. The inventors have identified that such large temperature differences between different portions of the conductive line propagating the signal may give rise to thermal noise as a result of heat flow or exchange between one portion of the conductive line and another portion of the conductive line. This thermal noise may degrade the performance of the microwave hardware, which in turn may degrade the performance of the qubit.

[0009] While the first technical problem is related to the difficulties that arise due to heat flow within a single material (e.g., a conductive wire), a second distinct technical problem arises due to the difficulties associated with heat flow between different materials. This second technical problem arises due to a phenomenon called Kapitza resistance, which tends to be negligible at room temperature or above cryogenic temperatures, but can become quite significant at cryogenic temperatures. Kapitza resistance refers to the thermal resistance acting at the interface between different materials in the presence of a heat flux. In other words, Kapitza resistance can prevent various materials in a cryogenic environment from settling at a uniform temperature.

[0010] For example, consider an ambient temperature and / or temperature flux across an interface between two materials in a cryogenic cooler. The microwave hardware in that environment may include conductive lines formed within a dielectric, where the conductive lines may provide filtering, for example, by passing or attenuating microwave signals based on frequency. The dielectric may be cooled to 10 mK. However, the conductive lines, which may be a heat source during operation, may not effectively transfer heat from the conductive lines to the dielectric, due in part to the Kapitza resistance phenomenon. Thus, the conductive lines may remain at a significantly higher temperature than the ambient environment and / or the dielectric in which they are disposed. The inventors have identified that temperature differences between the dielectric and the conductive lines may cause a variety of problems, such as low frequency noise, unexpected behavior, any one of which may adversely affect the quality of qubits (e.g., coherence time and qubit errors) in quantum computing devices that rely on microwave hardware.

[0011] The third technical problem arises due to the inability to thermalize conductive lines that can be a heat source in the system. This third technical problem can arise due to the various materials used to implement microwave hardware exhibiting poor thermal conductivity between two different materials, such as between a conductive line and a dielectric. Traditionally, dielectric and conductive materials are selected based on electrical properties and cost with little or no consideration of thermal properties. Summary of the Invention

[0012] The following presents a summary to provide a basic understanding of one or more embodiments of the invention. This summary is not intended to identify key or critical elements or to delineate the scope of any particular embodiments or the scope of the claims. Its sole purpose is to present concepts in a simplified form as a prelude to the more detailed description that is presented later. In one or more embodiments described herein, systems, methods, devices, and / or products that facilitate at least one of reducing heat flow in a material and reducing Kapitza resistance at an interface between two different materials are described.

[0013] According to an embodiment of the present invention, a thermal decoupling device can be provided. The thermal decoupling device can include a dielectric material. The dielectric material can include a first channel separated from a second channel by a wall of the dielectric material. The thermal decoupling device can further include a conductive line. The conductive line can include a first segment and a second segment separated by a wall. The wall can facilitate propagation of microwave signals between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line. An advantage provided by the thermal decoupling device can be a reduction in thermal noise due to heat flow in the conductive line across multiple temperature zones. In some embodiments, the first channel and the second channel can be arranged in a pattern that facilitates filtering of microwave signals propagating in a cryogenic environment having a temperature below about 77 degrees Kelvin. An advantage of this configuration is that the thermal decoupling device can be incorporated into a filter device to provide a thermally decoupled filter device.

[0014] According to an embodiment of the present invention, a thermally decoupled cryogenic microwave filter device may be provided. The thermally decoupled cryogenic microwave filter device may include a dielectric having discontinuous channels in a pattern that facilitates filtering of microwave signals propagating in a cryogenic environment having a temperature below about 77 degrees Kelvin (K). The discontinuous channels may include a first channel separated from a second channel by a dielectric wall. The thermally decoupled cryogenic microwave filter device may further include a conductive line. The conductive line may include a first segment located in the first channel and a second segment located in the second channel. The first and second segments may be separated by a wall. The wall may facilitate propagation of microwave signals between the first and second segments and may reduce heat flow between the first and second segments of the conductive line. An advantage provided by the thermally decoupled cryogenic microwave filter device may be improved performance at extremely low temperatures, such as temperatures associated with cryogenic environments in which quantum computing architectures may be implemented. For example, heat flow in a conductive line can cause thermal noise, which can be mitigated by thermally decoupling various segments of the discontinuous conductive line. In some embodiments, the walls can have dimensions determined to propagate microwave signals based on microwave signals having frequencies greater than about 1 gigahertz (GHz). The advantage gained is that signals having sufficiently high frequencies can be propagated between discontinuous segments of the conductive line, even though the conductive line is discontinuous and therefore may not be suitable for DC applications.

[0015] According to an embodiment of the present invention, a method may be provided. The method may be, for example, a method of manufacturing a thermal decoupling device. The method may include forming, by a manufacturing device, a discontinuous channel in a dielectric. The discontinuous channel may have a pattern including a first channel separated from a second channel by a wall of a dielectric material. The method may further include forming, by a manufacturing device, a conductive line in the discontinuous channel of the dielectric material. The conductive line may include a first segment and a second segment. The first segment and the second segment may be separated by a wall that facilitates the propagation of microwave signals between the first segment and the second segment and reduces heat flow between the first segment and the second segment of the conductive line. An advantage provided by the method may be a reduction in thermal noise due to heat flow in the conductive line across multiple temperature zones. In some embodiments, forming the conductive line may include sintering the conductive material in the discontinuous channel. An advantage provided by sintering the conductive line may be a reduction in Kapitza resistance between the conductive line and the substrate due to an increase in surface contact area between the conductive line and the substrate.

[0016] According to an embodiment of the present invention, a method may be provided. The method may be, for example, a method for manufacturing a thermally decoupled cryogenic microwave filter. The method may include forming, by a manufacturing device, a dielectric that acts as an electrical insulator and a thermal conductor at cryogenic temperatures below about 77 degrees Kelvin (K). The dielectric may include a material having a thermal conductivity greater than about 200 Watts per meter Kelvin (W / mK) at 77K. The method may further include forming, by the manufacturing device, discontinuous channels in the dielectric. The discontinuous channels may be formed in a pattern that facilitates filtering of microwave signals propagating in a cryogenic environment. The discontinuous channels may include a first channel and a second channel separated by a dielectric wall. Still further, the method may further include sintering, by the manufacturing device, a conductive material in the discontinuous channels having the pattern. The result is a conductive line including a first segment and a second segment separated by a wall that facilitates propagation of microwave signals through the conductive line and reduces heat flow between the first segment and the second segment of the conductive line. An advantage provided by this method may be a reduction in thermal noise along the conductive lines. Another advantage may be a reduction in Kapitza resistance between the conductive lines and the dielectric. The reduction in thermal noise and the reduction in Kapitza resistance may lead to improved performance at extremely low temperatures, such as those associated with cryogenic environments where quantum computing architectures may be implemented. For example, the Kapitza resistance may be reduced by increasing the surface contact area between the conductive lines and the substrate. As a result of sintering of the conductive lines, the surface contact area between the conductive lines and the substrate may be increased.

[0017] According to an embodiment of the present invention, a thermal decoupling product formed by a process may be provided. The process may include forming, by a manufacturing device, a first channel separated from a second channel by a wall of a dielectric material. The process may further include forming, by the manufacturing device, a conductive line. The conductive line may include a first segment formed in the first channel and a second segment formed in the second channel. The first and second segments may be separated by a wall. The wall may allow microwave signal propagation between the first and second segments and reduce heat flow between the first and second segments of the conductive line. As a result of the advantages provided by the process, a thermal decoupling product may be obtained in which discontinuous segments of the conductive line may reduce heat flow between various discontinuous segments of the conductive line. As a result of the reduced heat flow, a reduced thermal noise associated with the conductive line may be achieved, which may result in an improved signal. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 illustrates a conductive line physically extending through multiple temperature environments in accordance with one or more embodiments. [Diagram 2] FIG. 1 is a block diagram of a thermal decoupling device that can reduce heat flow while still allowing signals to propagate, according to one or more embodiments. [Diagram 3] FIG. 1 is a block diagram of a thermally decoupled cryogenic microwave filter device that can reduce heat flow while allowing signals to propagate, according to one or more embodiments. [Figure 4] FIG. 2 illustrates a block diagram of a system and a superimposed temperature graph illustrating the effect of a Kapitza resistor, according to one or more embodiments. [Diagram 5] FIG. 1 is a block diagram of a cryogenic environment illustrating the problematic consequences of Kapitza resistance, in accordance with one or more embodiments. [Figure 6]FIG. 2 is a graphical representation of an exemplary non-limiting thermally decoupled cryogenic microwave filter with reduced Kapitza resistance, in accordance with one or more embodiments. [Figure 7] FIG. 2 is a block diagram of an example housing for a cryogenic microwave filter according to one or more embodiments. [Figure 8] FIG. 1 illustrates a process by which a thermally decoupled product or a suitable thermally decoupled cryogenic microwave filter product may be manufactured, according to one or more embodiments. [Figure 9] FIG. 1 illustrates a process by which a thermally decoupled product or a suitable thermally decoupled cryogenic microwave filter product may be manufactured, according to one or more embodiments. [Figure 10] FIG. 1 illustrates a process by which a thermally decoupled product or a suitable thermally decoupled cryogenic microwave filter product may be manufactured, according to one or more embodiments. [Figure 11] 1 is a flow diagram of an exemplary, non-limiting method of manufacturing a thermal decoupling device according to one or more embodiments. [Figure 12] 2 is a flow diagram of an exemplary, non-limiting method of manufacturing a thermally decoupled cryogenic microwave filter in accordance with one or more embodiments. [Figure 13] 1 is a flow diagram of an exemplary, non-limiting method of sintering a conductive material according to one or more embodiments. [Figure 14] 2 is a flow diagram of an exemplary, non-limiting method of manufacturing a housing for a cryogenic microwave filter, according to one or more embodiments. [Figure 15] FIG. 1 is a block diagram of an example non-limiting operating environment capable of facilitating one or more embodiments described herein. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] The following detailed description is illustrative only and is not intended to limit the embodiments or the application or uses of the embodiments, or combinations thereof, nor is it intended to be limited by any express or implied information presented in the Background or Summary sections above.

[0020] As discussed above, the subject matter disclosed herein can address distinct technical problems. For example, a first technical problem arises due to thermal noise resulting from heat flow within a single material across multiple temperature zones, as will be primarily described in conjunction with Figures 1-3 of this disclosure. A second technical problem arises due to Kapitza resistance acting at the interface between two different materials, as will be primarily described in conjunction with Figures 4-6 of this disclosure.

[0021] Referring now to the drawings, and initially to FIG. 1, a diagram of a conductive line 100 that physically extends through multiple temperature environments is shown, in accordance with one or more embodiments. The conductive line 100 is shown as a continuous line or wire that can be used to carry signals between a cryogenic environment 102 and a laboratory environment 104. Portions of the conductive line 100 can be realized as coaxial cables or other suitable configurations. The conductive line 100 can be employed in connection with superconducting quantum computing devices that are typically implemented in the cryogenic environment 102, where temperatures are extremely low.

[0022] The cryogenic environment 102 can be implemented inside a cryogenic refrigerator that can have multiple stages, with each stage exhibiting a different temperature. Thus, within the cryogenic environment 102, there can be a number of temperature zones, N, some positive integer. As shown, the core of the cryogenic environment 102, which corresponds to temperature zone 0, can be at a temperature very close to absolute zero, an example of which can be 10 millikelvin (mK). Other stages of the cryogenic environment 102 can exhibit different temperatures ranging from about 10 mK to about 100 K. Outside the cryogenic environment 102, such as outside the cryogenic refrigerator, the ambient temperature, shown as temperature zone R, can be room temperature, for example, around 300 K.

[0023] Thus, the conductive line 100 used to relay signals between the core of the cryogenic environment 102 and the laboratory environment 104 can act not only as a current path but also as a heat path. For example, a direct current path typically relies on a continuous conductive line (e.g., conductive line 100), which is also an effective heat path. As shown, heat tends to flow into conductive line 100 in the region of temperature zone R, while it tends to flow out of conductive line 100 in the region of temperature zones 0-N. In effect, heat tends to flow significantly toward temperature zone 0.

[0024] The inventors have observed that such heat flow can generate thermal noise that can adversely affect the quality of the signal carried by the conductive line 100 or that can adversely affect the device served by the conductive line 100. For example, thermal noise can degrade the performance of a filter device or degrade the quality of superconducting qubits in a quantum computing device. Thus, thermal noise represents a technical problem. Mitigating this thermal noise can improve the performance of filter devices, quantum computing devices, and other devices or systems. A technique for reducing or mitigating thermal noise resulting from heat flow in a conductive line can be seen with reference to FIG. 2.

[0025] 2, a block diagram of a thermal decoupling device 200 is shown that can reduce heat flow while still allowing signals to propagate, according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein will be omitted. This can be achieved by segmenting a conductive line into two or more discontinuous segments.

[0026] For example, the thermal decoupling device 200 may include a dielectric material 202, which may be a coating, a conduit, or a substrate depending on the implementation. The dielectric material 202 may be any suitable material, although certain materials or properties may be preferred, such as reduced Kapitza resistance properties, which are further detailed in connection with FIG. 6 . The dielectric material 202 may include a first channel separated from a second channel by a wall 204 of the dielectric material 202. These first and second channels may be filled or occupied by discontinuous segments of a conductive line 206, as described below. In some embodiments, the first and second channels may extend in substantially parallel directions. Alternatively, the first and second segments of the conductive line may extend in substantially parallel directions.

[0027] The walls 204 are illustrated in dark gray to indicate the separation between the first and second channels, while the remainder of the dielectric material 202 is illustrated in light gray. In some embodiments, the walls 204 can have substantially the same or substantially similar properties as the dielectric material 202. In some embodiments, the walls 204 can be made of a different material having different properties than the dielectric material 202.

[0028] The thermal decoupling device 200 may further include a conductive line 206. Rather than a continuous conductive line employed in other systems, the conductive line 206 may be discontinuous or segmented. For example, the conductive line 206 may include a first segment 206A and a second segment 206B that may occupy a first channel and a second channel of the dielectric material 202, respectively. Thus, the first segment 206A and the second segment 206B may be separated by a wall 204. The wall 204 may be configured to facilitate propagation of a signal 208 between the first segment 206A and the second segment 206B, while reducing heat flow between the first segment 206A and the second segment 206B.

[0029] According to the standard model, a signal (e.g., signal 208) can propagate through a conductor (e.g., conductive line 206) due to the flow of electrons. When these electrons are in a relatively low energy state, typical of direct current (DC) applications, the conductor's conduction is relied upon to carry signal 208. Thus, it is easy to see that signal 208 can be allowed to propagate through first segment 206A. Signal portion 208A shows signal 208 propagating through first segment 206A. However, for DC-type applications, signal 208 may not be able to flow to second segment 206B due to a discontinuity in conductive line 206 caused by wall 204.

[0030] However, at higher frequencies, such as those in the microwave spectrum, the signal 208 can cause the electrons in the conductive line 206 to become excited, thereby exhibiting a higher energy state. In this higher energy state, the electrons can jump from one conductor to another conductor that is sufficiently close. In other words, the wall 204 essentially acts as a capacitor, and the signal 208 can be conveyed from the first segment 206A to the second segment 206B, as shown by signal portion 208B. After passing through the wall 204, the signal 208 can be conveyed along the second segment 206B, as shown by signal portion 208C.

[0031] The microwave spectrum is generally considered to be from about 300 megahertz (MHz) to about 300 gigahertz (GHz). Lower frequencies may be sufficient to excite electrons to produce the above-mentioned effects, depending on various factors, including the dimensions of the wall 204. Thus, the signal 208 is not necessarily limited to the microwave spectrum or higher frequencies, although such frequencies are an appropriate threshold for many technology applications.

[0032] For typical quantum computing applications, or cryogenic frequency filters or other hardware, the signal 208 typically has a frequency greater than about 1 GHz. Thus, in some embodiments, the wall 204 may have dimensions determined to propagate the signal 208 having a frequency greater than about 1 GHz. While many dimensions are suitable, by way of example, the thickness of the wall 204 (e.g., the distance between the first segment 206A and the second segment 206B) may be approximately 0.6 millimeters. Such a thickness may allow the signal 208 to propagate between the first segment 206A and the second segment 206B, while reducing heat flow between the first segment 206A and the second segment 206B, as indicated by reference numeral 210. However, it should be understood that other dimensions may also be suitable and may vary based on the implementation. This is typically within a range bounded by the maximum thickness that a given signal 208 can pass through the wall 204, which depends largely on the frequency of the signal 208, and the minimum thickness that still sufficiently reduces heat flow between the first segment 206A and the second segment 206B, which depends largely on the material or thermal properties of the wall 204.

[0033] Recall that the conductive line 206 may extend through many different temperature zones, possibly ranging from about 300K to less than 1K. Thus, significant portions of the first segment 206A and the second segment 206B may be in different temperature zones, resulting in the two segments having significantly different temperatures. However, heat flow within the conductive line 206 may be confined within a given segment, thereby reducing thermal noise. In this example, the majority of the displayed portion of the first segment 206A is in temperature zone 1, while the entire displayed portion of the second segment 206B is in temperature zone 0. Thus, the first segment 206A may exhibit a first average temperature that is higher than the second average temperature of the second segment 206B. In some embodiments, the first segment 206A may remain stable at a different temperature than the second segment 206B, while the signal 208 may still propagate between the two segments.

[0034] In fact, the first segment 206A and the second segment 206B may be thermally decoupled by the thermal decoupling device 200. Heat may flow freely within a given segment, but the heat flow between two different segments may be reduced. One advantage is that, given that the heat flow can be reduced by the wall 204, the thermal noise resulting from such heat flow through the conductive line 206 may be significantly reduced. Another advantage is that the operation of the associated cryocooler device may be more efficient or effective, since the continuous flow path from the room temperature zone to the core of the cryogenic environment is eliminated by segmenting the conductive line 206.

[0035] Returning to FIG. 1, it can be seen that the thermal decoupling device 200 can be advantageously implemented at the boundaries between various temperature zones of the cryogenic environment 102, such as the boundaries between various stages of an associated cryogenic cooler. For example, consider one or more thermal decoupling devices 200 located at the boundary between temperature zone N (e.g., 100 K) and temperature zone R (e.g., 300 K). A first segment of the conductive line 100 located in temperature zone N does not need to be exposed to heat flow from a second segment of the conductive line 100 located in temperature zone R. Rather, the first segment can find some kind of thermal equilibrium at or near 100 K, while the second segment can find some kind of thermal equilibrium at or near 300 K. However, signals can still propagate between the first and second segments. Another advantage of the thermal decoupling device 200 is that it can be used in conjunction with a filter device, an example of which is detailed with reference to FIG. 3.

[0036] 3, a block diagram of a thermally decoupled cryogenic microwave filter device 300 capable of propagating signals and reducing heat flow is shown according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. For example, the thermally decoupled microwave filter device 300 may include one or more thermal decoupling devices 200.

[0037] In that regard, the thermally decoupled cryogenic microwave filter device 300 may include a dielectric 302. The dielectric 302 may have discontinuous channels in a pattern 306 that facilitates filtering microwave signals propagating in a cryogenic environment having a temperature below about 77 degrees Kelvin. The discontinuous channels may include a first channel separated from a second channel by a wall 308 of the dielectric 302, an example of which is shown in FIG.

[0038] The thermally decoupled cryogenic microwave filter device 300 may further include a conductive line 304 that may have multiple discontinuous segments. For example, the conductive line 304 may include a first segment 304A located in a first channel and a second segment 304B located in a second channel separated by a wall 308. The wall 308 may facilitate the propagation of microwave signals through the conductive line 304, such as propagation through multiple segments of the conductive line 304. The wall 308 may further reduce heat flow between the first segment 304A and the second segment 304B. Thus, the various segments of the conductive line 304 may be thermally decoupled, which may advantageously reduce or mitigate thermal noise. We can now begin to discuss techniques related to reducing the effect of Kapitza resistance with reference to FIG. 4.

[0039] Referring now to FIG. 4, a block diagram of a system 400 and a superimposed temperature graph illustrating the effect of a Kapitza resistor are shown, according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. The system 400 may include two different materials that share a boundary interface 402, where one material contacts the other material. Thus, in this example, material A contacts material B at the boundary interface 402. In this example, it is assumed that the materials, or the interface between the two materials, are exposed to a common temperature flux and / or that the ambient temperature of both materials is the same, and this temperature is referred to as T0. It is also assumed that material A has an initial temperature T1, and material B has an initial temperature T2 that is lower than T1.

[0040] At room temperatures, where the effect of Kapitza resistance tends to be negligible, materials A and B are likely to settle at a common temperature as heat flows from material A to material B through boundary interface 402. However, at cryogenic temperatures, where the effect of Kapitza resistance can be much more significant, the thermal boundary resistance R causes a temperature drop ΔT across boundary interface 402. In other words, the thermal boundary resistance prevents some heat exchange between materials A and B, so that materials A and B do not settle at a common temperature.

[0041] This temperature mismatch is believed to occur due to scattering of energy carriers, such as phonons or electrons, at the boundary interface 402. The probability that an energy carrier will scatter at the boundary interface 402 without transferring heat through the boundary is a function of the energy states of the materials on either side of the boundary interface 402. At cryogenic temperatures, these energy states are lower, making scattering much more likely. It has been observed that at low temperatures, such as cryogenic temperatures, a significant temperature drop ΔT occurs at the boundary interface 402, which acts as a boundary between two different materials, as a result of the phenomenon of Kapitza resistance, also known as thermal boundary resistance. It has also been observed that this temperature drop ΔT can lead to technical problems, which will be further detailed in connection with FIG. 5.

[0042] 5, a block diagram of a cryogenic environment 500 is shown that illustrates the problematic consequences of Kapitza resistance according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. The cryogenic environment 500 may exhibit extremely low pressure or may be a vacuum. The cryogenic environment 500 may be cooled to extremely low temperatures, such as below about 77K, and may in fact be below 4K, and in some cases below 10 millikelvin. Within the cryogenic environment 500, a portion of a quantum computing architecture 502 may reside.

[0043] The quantum computing architecture 502 may include various microwave hardware, such as, for example, microwave frequency filters or attenuators. For example, a microwave frequency filter may be employed to control the superconducting qubits of the quantum computing architecture 502. The internal structure of the microwave frequency filter may include conductive lines located within a dielectric. The conductive lines therefore share various instances of boundary interfaces 506 with the dielectric, which may be similar to those described in connection with material A and material B of FIG. 1. If the temperature flux across the boundary interface 506 is T0, the conductive lines are at T1, and the dielectric is at T2, then a temperature drop ΔT may occur across the boundary interface 506 due to Kapitza resistance. In other words, the conductive lines are not thermalized and maintain a temperature ΔT higher than the dielectric. It has been observed that the temperature difference between the conductive lines and the dielectric causes the microwave hardware 504 to behave in unexpected ways. For example, this temperature difference may result in low frequency noise or other performance degradation of the microwave hardware 504. This may result in reduced coherence times, increased qubit errors, or other performance degradation of quantum computing architecture 502. In some cases, elements of microwave hardware 504 (e.g., conductive wires) may become superconducting at extremely low temperatures, in which case microwave hardware 504 may not function as intended.

[0044] Possible solutions to the above technical problems caused by the Kapitza resistance at the boundary interface 506 may be provided by various techniques to reduce the Kapitza resistance at the boundary interface 506. Such reduction of the thermal boundary resistance may result in lower values ​​of ΔT, thereby preventing performance degradation of the microwave hardware 504 at extremely low temperatures.

[0045] 6 is a graphical illustration of an exemplary, non-limiting cryogenic microwave filter 600 having reduced Kapitza resistance in accordance with one or more embodiments. For purposes of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. In some embodiments, the cryogenic microwave filter 600 can be used to control qubits in a superconducting quantum computing architecture.

[0046] The cryogenic microwave filter 600 may include a substrate 602. The substrate 602 may be formed from a dielectric material determined to have desired thermal properties. For example, the material may be determined to have a thermal conductivity of greater than about 200 watts per meter Kelvin (W / mK) at a temperature of 77 degrees Kelvin (K). In some embodiments, the material may be a dielectric material that acts as an electrical insulator. It should be appreciated that conventional substrate materials or dielectrics tend to be selected based on some function of price and desired electrical properties, such as being electrically insulating. Without identifying the increased importance of Kapitza resistance at cryogenic temperatures and the technical problems it may cause in connection with filter devices, there is no clear reason for a filter designer to consider the thermal conductivity properties of a dielectric or substrate, especially when a given thermal conductivity property may increase the cost of the dielectric or substrate without providing improved electrical properties.

[0047] However, by selecting a material determined to have a high thermal conductivity, in this example greater than 200 W / mK at 77K, elements in contact with substrate 602 (e.g., conductive line 604) can be more efficiently thermalized, thereby reducing thermal noise. For example, hot electrons can be more effectively removed from conductive line 604. Because DC signals do not propagate between various segments of conductive line 604, noise associated with DC signals can be reduced or eliminated. As a result of reduced noise, the performance of associated elements or systems can be improved. For example, associated quantum computing systems can achieve improved coherence times and reduced qubit errors when relying on cryogenic microwave filter 600 rather than existing microwave filters.

[0048] In some embodiments, the material selected for the substrate 602 may be sapphire. In some embodiments, the material selected for the substrate 602 may be diamond. Other materials are possible as long as they exhibit sufficient thermal conductivity. Both sapphire and diamond have extremely high thermal conductivity compared to typical ceramic substrates such as alumina. For example, alumina, which is known to have high thermal conductivity but is one of the most commonly selected materials for ceramic substrates and / or dielectrics due to its low cost and low electrical conductivity, has a thermal conductivity of 157 W / mK at 77K. In contrast, other materials such as sapphire and diamond have significantly better conductivity at cryogenic temperatures, as shown in Table 1.

[0049] [Table 1]

[0050] Although alumina is known to have a high thermal conductivity compared to many other materials, this is generally not high enough for some applications. As shown in Table 1, sapphire and diamond have a thermal conductivity that is nearly 10 times (for sapphire) or more than 20 times (for diamond) higher at 77K. At even lower temperatures, such as 4K, sapphire and diamond may have a thermal conductivity that is more than two orders of magnitude higher than alumina. Thus, when the substrate is made of, for example, sapphire or diamond, at cryogenic temperatures, the boundary interface between the substrate and a different material can be expected to have a reduced Kapitza resistance and a lower ΔT than when made of a more common material such as alumina.

[0051] Cryogenic microwave filter 600 may further include conductive traces 604. Conductive traces 604 may be formed in a recess or recesses in substrate 602. Conductive traces 604 may facilitate filtering for microwave signals propagating in a cryogenic environment having a temperature below about 77 K.

[0052] In some embodiments, the filtering action facilitated by conductive lines 604 may depend on the geometry of the recesses in substrate 602. For example, conductive lines 604 may be formed within these recesses, or conductive lines 604 may fill a portion of the recesses, such that the pattern of the recesses may achieve or facilitate the desired filtering action. This example shows one example of a geometry that pattern 606 may conform to. In some embodiments, the filtering action facilitated by pattern 606 may be a bandpass filtering action, where frequencies of the microwave signal within a specified range may be passed by the bandpass filtering action, and other frequencies above the specified range may be filtered out or attenuated by the bandpass filtering action.

[0053] As an example, the pattern 606 may facilitate passing frequencies between 5.5 gigahertz (GHz) and 6.5 GHz, while filtering out or attenuating frequencies outside the band of allowed frequencies, such as frequencies below 5.5 GHz or above 6.5 GHz. It should be understood that the prescribed frequency range to pass may have a bandwidth of about 1 GHz, or some other value depending on the geometry of the pattern 606. This prescribed frequency band to pass, having a width of 1 GHz or some other width, may be located virtually anywhere within the microwave spectrum, which is typically between about 300 megahertz (MHz) and 300 GHz. However, for certain applications used with quantum computing architectures, it may be more important to filter out or attenuate frequencies within a range between about 1 GHz and about 10 GHz. For example, passing frequencies within a specified range (while attenuating frequencies outside this range), such as between about 4.5 GHz and about 5.5 GHz, between about 5.5 GHz and about 6.5 GHz, between about 6.5 GHz and about 7.5 GHz, etc., may represent a typical microwave filter.

[0054] As mentioned above, the cryogenic microwave filter 600 may have significant advantages over other filter devices, particularly with respect to reduced Kapitza resistance and improved thermalization. The inventors have determined that the Kapitza resistance may be reduced by increasing the surface contact area between the substrate 602 and the conductive lines 604, by techniques described below. The inventors have further determined that improved thermalization may be achieved by selecting a material for the cryogenic microwave filter 600 that has an extremely high thermal conductivity, which may improve the effectiveness of transporting hot electrons away from the conductive lines 604, for example. As detailed above, this may relate to the material selected for the substrate 602, where the selected material has a thermal conductivity greater than about 200 (or some other suitable value) W / mK, exemplified by materials such as sapphire and diamond. It should further be understood that the material of the conductive lines 604 may also be selected according to its high thermal conductivity properties, some examples of which are given below.

[0055] In addition to improving the thermalization of the conductive line 604, for example by increasing the thermal conductivity of the material used in the cryogenic microwave filter 600, the Kapitza resistance can also be reduced. For example, considering again the boundary interface 506 of FIG. 5, there may be one or more similar boundary interfaces between the substrate 602 and the conductive line 604. Although an interface between two different materials may be represented as a smooth interface on a microscopic scale, the two materials may not be flat across the interface, resulting in a reduced surface contact area between the two different materials at the boundary interface. This reduced surface contact area is a technical problem because it results in a higher Kapitza resistance or a higher ΔT.

[0056] The inventors have noted that both ΔT and Kapitza resistance can be reduced by increasing the surface contact area between conductive line 604 and substrate 602, and have further determined that this can be accomplished in a unique manner. For example, conductive line 604 can be constructed or formed such that the contact at the boundary interface is flatter. As another example, the pressure at the boundary interface can be increased, resulting in a larger surface contact area.

[0057] A technique that can be employed to take advantage of both techniques can be sintering the conductive lines 604. In other words, the conductive lines 604 can include conductive material sintered into recesses in the substrate 602. More information regarding sintering techniques can be found in FIG. 10. However, it should be understood that sintering the conductive lines 604 can increase the surface contact area at the boundary interface between the two materials, in part due to both creating a better "fit" with the surface of the substrate 602 and exhibiting increased pressure at the interface that helps to flatten out small imperfections where no contact would exist without the increased pressure.

[0058] As can be further seen from pattern 606, which represents a pattern of conductive lines 604, various operations of the filter can be performed by measuring radio frequency (RF) signals. Because conductive lines 604 are discontinuous or segmented, DC measurements may not be fully supported. This is not necessarily a drawback, since qubits typically operate at high frequencies (e.g., above 1 GHz) and DC measurements are not used very often in such applications. Also, given that DC signals can emit low frequency noise that can adversely affect qubits, blocking DC signals can be advantageous.

[0059] Referring now to FIG. 7, an exemplary housing 700 of the cryogenic microwave filter 600 according to one or more embodiments is shown. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. The housing 700 can house all or a portion of the other components of the cryogenic microwave filter 600. The housing 700 can include a housing material 702, which can have a variety of advantageous properties. For example, in some embodiments, the housing material 702 can be formed of an oxygen-free material. In some embodiments, the housing material 702 can be electrolytic copper or the like. In some embodiments, the housing material 702 can shield elements of the cryogenic microwave filter (e.g., the cryogenic microwave filter 600) from microwave noise, which can provide further performance improvements.

[0060] As indicated by groove 704, housing 700 can be configured to couple to a cooler plate or other cryogenic element that facilitates the transfer of thermal energy away from housing 700 or acts as a heat sink. In some embodiments, housing 700 can be coupled to an electrical ground as indicated by reference numeral 706. Still further, housing 700 can be integrated into a suitable quantum computing architecture, such as being incorporated into a qubit housing. Connectors 708 can be single pole or high density microwave connectors, such as SMP, SMA, Ardent, etc. In some embodiments, connectors 708 on both ends of housing 700 or cryogenic microwave filter 600 can have the same gender (e.g., both male or both female). Such a configuration can reduce the number of connections on the qubit control lines, resulting in fewer reflection points and therefore improved performance.

[0061] 8-10 illustrate a process by which a suitable thermal decoupling product may be manufactured according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. In some embodiments, the thermal decoupling product may correspond to the thermal decoupling device 200 of FIG. 2. In some embodiments, the thermal decoupling product may correspond to the thermally decoupled cryogenic microwave filter device 300 or a portion of the cryogenic microwave filter 600. In FIGS. 8-10, the thermal decoupling product is shown as a cross-section illustrated at various stages of the process shown.

[0062] In that regard, Figure 8 illustrates the formation of a dielectric 800 by, for example, a fabrication device. The fabrication device may be controlled by a computing device including a processor and memory storing executable instructions that, when executed by the processor, cause the performance of operations. Examples of such processors and memories, as well as other suitable computers or computing-based devices, can be seen in Figure 15.

[0063] In some embodiments, the dielectric material 800 can be a substrate, such as the substrate 602. For example, the dielectric material 800 can act as an electrical insulator and a thermal conductor at cryogenic temperatures below about 77K. The dielectric material 800 can include a material having a thermal conductivity of greater than about 200 W / mK at 77K. It should be understood that other thermal conductivity values ​​can be selected depending on the application or implementation, as the thermal conductivity selected to satisfy a particular application can be application dependent. For example, for different applications, the material of the dielectric material 800 can be selected to have a thermal conductivity that is, for example, greater than about 1000 W / mK at a temperature of 77K, greater than about 1000 W / mK at a temperature of 20K, greater than about 20 W / mK at a temperature of 10K, greater than about 10 W / mK at a temperature of 4K, or any suitable thermal conductivity value at any cryogenic temperature. Table 1 above shows that these exemplary thermal conductivity values ​​at various temperatures are easily distinguished from commonly used dielectrics, such as alumina. As mentioned above, by selecting a material with an appropriately high thermal conductivity, the Kapitza resistance at the boundary interface can be significantly reduced, and the temperature drop ΔT can be significantly reduced.

[0064] FIG. 9 illustrates the formation of channels in dielectric material 800, for example, by a fabrication device, according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. For example, the fabrication device can form channel 900A and channel 900B. Channel 900A can be separated from channel 900B by a wall 902 of dielectric material 800. In some embodiments, the pattern of channels can be configured according to a filter action for electromagnetic radiation having frequencies in the microwave spectrum, such as between 300 MHz and 300 GHz. A typical example of this pattern (shown in a top view) that can result in such behavior can be pattern 606. Thus, in addition to channel 900A and channel 900B being discontinuous and separated by wall 902, in some embodiments, channel 900A and channel 900B can represent a cross section of pattern 606. Channel 900A and channel 900B can be formed by pattern and etching techniques or any other suitable techniques.

[0065] FIG. 10 illustrates a conductive line 1000 formed in channel 900A and channel 900B according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. For example, a manufacturing device can form a conductive line including a first segment formed in channel 900A and a second segment formed in channel 900B. The first segment of the conductive line 1000 can be separated from the second segment by a wall 902. The wall 902 can be configured to allow the propagation of a microwave signal (or a signal having sufficiently excited electrons) between the first and second segments. The wall 902 can also reduce heat flow between the first and second segments of the conductive line 1000.

[0066] In some embodiments, the conductive line 1000 can be formed of a sintered conductive material. For example, the conductive line 1000 can be obtained by sintering the conductive material in the channels 900A and 900B, for example by a manufacturing device. Further details regarding sintering are described in relation to FIG.

[0067] It should be appreciated that there may be various boundary interfaces 1002 between the conductive line 1000 and the dielectric material 800. As previously mentioned, the dielectric material 800 may include a material selected to have extremely high thermal conductivity. Similarly, a conductive material having high thermal conductivity may be selected for the conductive line 1000. A material having high thermal conductivity may be used to improve thermalization of the conductive line, thereby improving the performance of the cryogenic microwave filter product. Sintering the conductive material may also increase the surface contact area at the boundary interface 1002, thereby reducing the Kapitza resistance and further improving performance in cryogenic environments.

[0068] 11-14 illustrate various methods according to the disclosed subject matter. For simplicity of explanation, the methods are shown and described as a series of operations, however, it should be understood and appreciated that the disclosed subject matter is not limited by the order of operations, as some operations can occur in a different order or simultaneously with other operations than those shown and described herein. For example, those skilled in the art will understand and appreciate that a method can alternatively be represented as a series of interrelated states or events, such as in a state diagram. Also, it should be understood that not all of the operations shown need be performed to implement a given method according to the disclosed subject matter. Additionally, it should be understood that the methods disclosed below and throughout this specification can be stored in an article of manufacture that facilitates the transport and transfer of such methods to a computer.

[0069] 11 illustrates a flow diagram 1100 of an exemplary, non-limiting method for fabricating a thermal decoupling device according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. At reference numeral 1102, a fabrication device can form discontinuous channels in a dielectric. The discontinuous channels can have a pattern that includes a first channel separated from a second channel by a wall of dielectric material.

[0070] At reference numeral 1104, the manufacturing device can form a conductive line in the discontinuous channel of the dielectric material. The conductive line can include a first segment and a second segment separated by a wall. The wall can facilitate propagation of microwave signals between the first and second segments of the conductive line and can reduce heat flow between the first and second segments of the conductive line. In some embodiments, forming the conductive line can include sintering the conductive material in the discontinuous channel.

[0071] FIG. 12 shows a flow diagram 1200 of an exemplary non-limiting method of manufacturing a thermally decoupled cryogenic microwave filter according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. At reference number 1202, a manufacturing device can form a dielectric that acts as an electrical insulator and a thermal conductor at cryogenic temperatures below about 77K. In this regard, the dielectric can include a material having a thermal conductivity higher than about 200 W / mK at 77K. By selecting a material to have a thermal conductivity higher than this predetermined threshold (in this case, higher than about 200 W / mK at 77K), the heat exchange between the conductive lines and the dielectric can be improved, thereby improving the performance of the cryogenic microwave filter when operating in an extremely low temperature environment. Examples of suitable materials can include sapphire materials, diamond materials, and the like.

[0072] At reference numeral 1204, the fabrication device can form discontinuous channels in the dielectric. The discontinuous channels can be formed in a pattern that facilitates filtering of microwave signals propagating in a cryogenic environment. The discontinuous channels can include a first channel and a second channel separated by a dielectric wall. Generally, microwave signals are characterized as signals having frequencies in a range between about 300 MHz and about 300 GHz. In some embodiments, the walls can have dimensions determined to propagate microwave signals based on microwave signals having frequencies greater than about 1 GHz.

[0073] At reference numeral 1206, the manufacturing device can form a conductive line in the discontinuous channel of the dielectric material. The conductive line can include a first segment and a second segment separated by a wall. The wall can facilitate propagation of a microwave signal between the first and second segments and can reduce heat flow between the first and second segments of the conductive line. By reducing heat flow between the first and second segments, thermal noise in the vicinity of the conductive line can be reduced, resulting in an improved signal.

[0074] As noted above, the conductive line can operate as a microwave filter based on the channel geometry. In some embodiments, forming the conductive line can include sintering the conductive material in the discontinuous channels. It is also noted that due to the sintering of the conductive material, the resulting sintered conductive line can have a reduced Kapitza resistance at the boundary interface between the conductive line and the dielectric. This reduced Kapitza resistance can be due in part to an increased surface contact area at the boundary interface as a result of the sintering process.

[0075] FIG. 13 shows a flow diagram 1300 of an exemplary non-limiting method of sintering a conductive material according to one or more embodiments. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. At reference number 1302, a manufacturing device can deposit a powdered conductive material into a recess in a substrate. The powdered conductive material can be a conductive material selected for its excellent thermal conductivity properties, which can improve the performance of the filter at low temperatures by reducing the temperature drop at the interface between the conductive line and the substrate, as detailed in connection with the substrate material. In some embodiments, the powdered conductive material can be one of powdered gold, powdered copper, powdered silver, and powdered aluminum.

[0076] At reference numeral 1304, the manufacturing device can expose the powdered conductive material to a sintering environment or conditions. The sintering environment or conditions can be characterized by a prescribed temperature and pressure selected to bond the powdered conductive material into a conductive wire without liquefying the conductive material. By employing sintering techniques in conjunction with the conductive wire, a larger surface contact area between the dielectric and the conductive wire can be achieved, which can act to reduce the Kapitza resistance at low temperatures, thus improving the performance of the cryogenic microwave filter at low temperatures.

[0077] 14, a flow diagram 1400 of an exemplary, non-limiting method of manufacturing a housing for a cryogenic microwave filter according to one or more embodiments is shown. For the sake of brevity, repeated descriptions of similar elements employed in other embodiments described herein are omitted. At reference numeral 1402, a manufacturing device can form or assemble a housing for a cryogenic microwave filter. The housing can be configured to couple to a cooler plate that acts as a heat sink.

[0078] At reference numeral 1404, the manufacturing device can form or assemble connectors. The connectors can be coupled to conductive lines at opposite ends of the cryogenic microwave filter. In some embodiments, the connectors can share a common gender. For example, the connectors at both ends of the filter can both be male connectors or both be female connectors. A possible advantage of such a configuration can be that the number of connections on the qubit control lines can be reduced, which can result in a reduced number of reflection points. Thus, cleaner microwave control pulses can be achieved, improving the performance of the filter.

[0079] At reference numeral 1406, a housing can be formed of a housing material selected to enhance thermalization and possibly shield the filter element from noise. In some embodiments, the housing material can be an oxygen-free material. In some embodiments, the housing material can be electrolytic copper.

[0080] The present invention may be in the form of a system, method, or product of a specified process, or any combination thereof. A particular technical application of the present invention may be provided by a computer program product at any possible level of technical detail of integration. The computer program product may include a computer-readable storage medium (or media) having computer-readable program instructions stored thereon for causing a processor to implement aspects of the present invention.

[0081] A computer readable storage medium may be a tangible device capable of holding and storing instructions for use by an instruction execution device. A computer readable storage medium may be, for example, but not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. A non-exhaustive list of more specific examples of computer readable storage media includes the following: a portable floppy disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanically encoded device such as a punch card or a ridge structure in a groove in which instructions are recorded, and any suitable combination thereof. A computer-readable storage medium as used herein should not be construed as a transitory signal per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission medium (e.g., light pulses through a fiber optic cable), or electrical signals transmitted over wires.

[0082] The computer readable program instructions described herein may be downloaded from a computer readable storage medium to the respective computing / processing device or to an external computer or storage device via a network, such as the Internet, a local area network, a wide area network, or a wireless network, or a combination thereof. The network may include copper transmission cables, optical transmission fiber, wireless transmission, routers, firewalls, switches, gateway computers, or edge servers, or a combination thereof. A network adapter card or network interface in each computing / processing device receives the computer readable program instructions from the network and transfers the computer readable program instructions to a computer readable storage medium within the respective computing / processing device for storage.

[0083] The computer readable program instructions for carrying out the operations of the present invention may be either assembler instructions, instruction set architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state setting data, configuration data for an integrated circuit, or source or object code written in any combination of one or more programming languages, including object oriented programming languages ​​such as Smalltalk, C++, and procedural programming languages ​​such as the "C" programming language, or similar programming languages. The computer readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or wide area network (WAN), or the connection may be made to an external computer (e.g., via the Internet using an Internet Service Provider). In some embodiments, electronic circuitry including, for example, a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may execute computer readable program instructions to carry out aspects of the invention by personalizing the electronic circuitry using state information of the computer readable program instructions.

[0084] The present invention is described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer readable program instructions.

[0085] These computer readable program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to implement a machine such that the instructions, executed by the processor of the computer or other programmable data processing apparatus, form a method for implementing the functions / operations specified in one or more blocks of the flowcharts and / or block diagrams. These computer readable program instructions may also be stored in a computer readable storage medium capable of instructing a computer, programmable data processing apparatus, or other device, or combination thereof, to function in a particular manner, such that the computer readable storage medium on which the instructions are stored comprises an article of manufacture including instructions that implement aspects of the functions / operations specified in one or more blocks of the flowcharts and / or block diagrams.

[0086] The computer readable program instructions may also be loaded into a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable apparatus, or other device to realize a computer-implemented process, such that the instructions, which execute on the computer, other programmable apparatus, or other device, implement the functions / operations specified in one or more blocks of the flowcharts and / or block diagrams.

[0087] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block of the flowcharts or block diagrams may represent a module, segment, or portion of instructions, including one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions described in the blocks may occur in a different order than that described in the figures. For example, two blocks shown in succession may in fact be executed substantially in parallel, depending on the functionality involved, or the blocks may be executed in reverse order as the case may be. It will also be appreciated that each block of the block diagrams and / or flowchart illustrations, and combinations of blocks in the block diagrams and / or flowchart illustrations, may be implemented by a dedicated hardware-based system that performs the specified functions or operations, or that implements a combination of dedicated hardware and computer instructions.

[0088] 15, the systems and processes described below may be implemented in hardware, such as a single integrated circuit (IC) chip, multiple ICs, application specific integrated circuits (ASICs), etc. Additionally, the order in which some or all of the process blocks are described within each process should not be considered limiting. Rather, it should be understood that some of the process blocks may be performed in various orders that may not all be explicitly set forth herein.

[0089] 15, an exemplary environment 1500 for implementing various aspects of the claimed subject matter includes a computer 1502. The computer 1502 includes a processing unit 1504, a system memory 1506, a codec 1535, and a system bus 1508. The system bus 1508 couples system components including, but not limited to, the system memory 1506 to the processing unit 1504. The processing unit 1504 can be any of a variety of available processors. Dual microprocessors and other multi-processor architectures can also be employed as the processing unit 1504.

[0090] The system bus 1508 may be any of several types of bus architectures, including a memory bus or memory controller, a peripheral or external bus, or a local bus using any of a variety of available bus architectures, including, but not limited to, Industry Standard Architecture (ISA), Micro Channel Architecture (MCA), Enhanced ISA (EISA), Intelligent Drive Electronics (IDE), VESA Local Bus (VLB), Peripheral Component Interconnect (PCI), Card Bus, Universal Serial Bus (USB), Advanced Graphics Port (AGP), Personal Computer Memory Card International Association Bus (PCMCIA), Firewire (IEEE 1394), and Small Computer System Interface (SCSI).

[0091] The system memory 1506 includes volatile memory 1510 and non-volatile memory 1512, which in various embodiments may employ one or more of the disclosed memory architectures. A basic input / output system (BIOS), containing the basic routines for transferring information between elements within the computer 1502, such as during start-up, is stored in the non-volatile memory 1512. Further in accordance with the present innovations, a codec 1535 may include at least one of an encoder or a decoder, which may be comprised of hardware, software, or a combination of hardware and software. Although the codec 1535 is illustrated as a separate component, the codec 1535 may be included within the non-volatile memory 1512. By way of example, and not by way of limitation, the non-volatile memory 1512 may include a read only memory (ROM), a programmable ROM (PROM), an electrically programmable ROM (EPROM), an electrically erasable programmable ROM (EEPROM), a flash memory, a 3D flash memory, or a resistive memory such as a resistive random access memory (RRAM). The non-volatile memory 1512 may employ one or more of the memory devices of the present disclosure in at least some embodiments. The non-volatile memory 1512 may also be a computer memory (e.g., physically embedded in the computer 1502 or its main board) or a removable memory. Examples of suitable removable memory in which the disclosed embodiments may be implemented may include a secure digital (SD) card, a compact flash (CF) card, a universal serial bus (USB) memory stick, and the like. The volatile memory 1510 may include a random access memory (RAM) that functions as an external cache memory, and may also employ one or more of the disclosed memory devices in various embodiments.By way of example, and not limitation, RAM is available in many forms, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), and Enhanced SDRAM (ESDRAM).

[0092] The computer 1502 may also include removable / non-removable, volatile / non-volatile computer storage media. FIG. 15 illustrates, for example, disk storage 1514. Disk storage 1514 includes, but is not limited to, devices such as a magnetic disk drive, a solid state disk (SSD), a flash memory card, or a memory stick. Additionally, disk storage 1514 may include storage media separately or in combination with other storage media including, but not limited to, optical disk drives such as compact disk ROM devices (CD-ROMs), CD recordable drives (CD-R drives), CD rewriteable drives (CD-RW drives), and digital versatile disk ROM drives (DVD-ROMs). To facilitate connection of the disk storage device 1514 to the system bus 1508, a removable or non-removable interface such as interface 1516 is typically used. It should be understood that the storage device 1514 may also store information related to a user. Such information may be stored on or provided to a server or to an application running on the user device. In one embodiment, the user may be informed (e.g., via one or more output devices 1536) of the type of information to be stored on disk storage 1514 or transmitted to a server or application. The user may be given the opportunity to opt-in or opt-out of having such information collected or shared with a server or application (e.g., via input from one or more input devices 1528).

[0093] It should be appreciated that FIG. 15 describes software that acts as an intermediary between users and the basic computer resources described in suitable operating environment 1500. Such software may also include an operating system 1518. The operating system 1518 may be stored on disk storage 1514 and is responsible for controlling and allocating resources of the computer 1502. Applications 1520 take advantage of the management of resources by the operating system 1518 through program modules 1524 and program data 1526, such as boot / shutdown transaction tables, that are stored either in system memory 1506 or on disk storage 1514. It should be appreciated that the claimed subject matter may be implemented with various operating systems or combinations of operating systems.

[0094] A user inputs commands or information into the computer 1502 through one or more input devices 1528. The input devices 1528 include, but are not limited to, pointing devices such as a mouse, track ball, stylus, touch pad, keyboard, microphone, joystick, game pad, satellite dish, scanner, TV tuner card, digital camera, digital video camera, web camera, and the like. These and other input devices connect to the processing unit 1504 by the system bus 1508 through one or more interface ports 1530. The one or more interface ports 1530 include, for example, serial ports, parallel ports, game ports, and universal serial bus (USB). The one or more output devices 1536 use some of the same types of ports as the one or more input devices 1528. Thus, for example, a USB port can be used to provide input to the computer 1502 and to output information from the computer 1502 to the output device 1536. Output adapter 1534 is shown to illustrate that there are some output devices 1536, such as monitors, speakers, and printers, among others, that require dedicated adapters. Output adapters 1534 include, by way of example and not limitation, video cards and sound cards, which provide a means of connection between output device 1536 and system bus 1508. It should be noted that other devices or systems of devices, such as one or more remote computers 1538, provide both input and output capabilities.

[0095] The computer 1502 can operate in a networked environment using logical connections to one or more remote computers, such as a remote computer 1538. The one or more remote computers 1538 can be a personal computer, a server, a router, a network PC, a workstation, a microprocessor-based device, a peer device, a smart phone, a tablet, or other network node, and typically include many of the elements described in connection with the computer 1502. For simplicity, only a memory storage device 1540 is illustrated along with the one or more remote computers 1538. The one or more remote computers 1538 are logically connected to the computer 1502 through a network interface 1542, which in turn is connected through one or more communication connections 1544. The network interface 1542 supports wired or wireless communication networks, such as local area networks (LANs), wide area networks (WANs), and cellular networks. LAN technologies include Fiber Distributed Data Interface (FDDI), Copper Distributed Data Interface (CDDI), Ethernet, Token Ring, and the like. WAN technologies include, but are not limited to, point-to-point links, Integrated Services Digital Networks (ISDN) and variations thereon, packet-switched networks, and circuit-switched networks such as Digital Subscriber Lines (DSL).

[0096] The one or more communications connections 1544 refer to the hardware / software employed to connect the network interface 1542 to the bus 1508. The communications connections 1544 are shown internal to the computer 1502 for illustrative clarity, but may be external to the computer 1502. The hardware / software necessary to connect to the network interface 1542 may include, by way of example only, internal and external technology such as modems, including ordinary telephone-class modems, cable modems, and DSL modems, ISDN adapters, and wired and wireless Ethernet cards, hubs, and routers.

[0097] Although the subject matter has been described above in the general context of computer-executable instructions for a computer program product running on one or more computers, those skilled in the art will appreciate that the disclosure may also be implemented in combination with other program modules. Generally, program modules include routines, programs, components, data structures, etc. that perform particular tasks and / or implement particular abstract data types. Those skilled in the art will also appreciate that the computer-implemented methods of the present invention may also be implemented in other computer system configurations, such as single-processor or multi-processor computer systems, minicomputing devices, mainframe computers, and computers, handheld computing devices (e.g., PDAs, phones), microprocessor-based or programmable consumer or industrial electronic devices, and the like. Exemplary aspects may also be implemented in distributed computing environments where tasks are performed by remote processing devices linked by a communications network. However, some, but not all aspects of the disclosure may be implemented on stand-alone computers. In a distributed computing environment, program modules may be located in both local and remote memory storage devices.

[0098] As used in this application, terms such as "component," "system," "platform," "interface," and the like, may refer to and / or include computer-related entities or entities related to an actual machine having one or more particular functions. The entities disclosed herein may be either hardware, a combination of hardware and software, software, or software in execution. For example, a component may be, but is not limited to, a process running on a processor, a processor, an object, an executable, a thread of execution, a program, or a computer, or combinations thereof. As an example, both an application running on a server and the server may be a component. One or more components may reside within a process and / or thread of execution, and a component may be locally on one computer or distributed across two or more computers, or both. In another embodiment, each component may execute from various computer readable media having various data structures stored thereon. A component may communicate via local and / or remote processes, such as by following a signal having one or more data packets (e.g., data from one component communicating via a signal within a local system, with another component in a distributed system, or with other systems over a network such as the Internet, or a combination thereof). As another example, a component may be a device with a particular function provided by mechanical parts operated by electrical or electronic circuits operated by a software or firmware application executed by a processor. In such a case, the processor may be a processor internal or external to the device and may execute at least a portion of the software or firmware application.As yet another example, a component may be a device that provides a particular function through electronic components without mechanical parts, and the electronic components may include a processor or other implementation that executes software or firmware that provides at least part of the functionality of the electronic component. In one aspect, a component may emulate an electronic component via a virtual machine, for example, in a cloud computing system.

[0099] Also, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". That is, unless otherwise specified or clear from the context, "X employs A or B" is intended to mean any of the natural inclusive permutations. That is, if X employs A, X employs B, or X employs both A and B, then "X employs A or B" is satisfied under any of the above cases. Also, unless otherwise specified or clear from the context to indicate the singular form, the articles "a" and "an" as used in this specification and the accompanying drawings should be construed broadly to mean "one or more". As used herein, the terms "example" and / or "exemplary" are used to mean serving as an example, an instance, or an illustration, and are intended to be non-limiting. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. Moreover, any aspect or design described herein as an "example" and / or "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects or designs, and is not meant to exclude equivalent exemplary structures and techniques known to those skilled in the art.

[0100] The term "processor" as employed herein may refer to substantially any computing processing unit or device, including, but not limited to, single-core processors, single processors with software multithreaded execution capabilities, multi-core processors, multi-core processors with software multithreaded execution capabilities, multi-core processors with hardware multithreading techniques, parallel platforms, and parallel platforms with distributed shared memory. A processor may also refer to an integrated circuit, an application specific integrated circuit (ASIC), a digital signal processor (DSP), a field programmable gate array (FPGA), a programmable logic controller (PLC), a complex programmable logic device (CPLD), discrete gate or transistor logic, discrete hardware components, or any combination thereof, designed to perform the functions described herein. A processor may also utilize nanoscale architectures, such as, but not limited to, molecular and quantum dot-based transistors, switches, and gates, to optimize space utilization or improve performance of user equipment. A processor may also be implemented as a combination of computing processing units. In this disclosure, terms such as "store," "storage," "data store," "data storage," "database," and substantially any other information storage component associated with the operation and functionality of a component are used to refer to a "memory component," an entity embodied in a "memory," or a component that includes a memory. It is understood that the memory and / or memory components described herein can be either volatile memory or nonvolatile memory, or can include both volatile and nonvolatile memory.By way of example, and not limitation, non-volatile memory may include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable ROM (EEPROM), flash memory, or non-volatile random access memory (RAM) (e.g., ferroelectric RAM (FeRAM)). Volatile memory may include RAM, which may function as external cache memory, for example. By way of example, and not limitation, RAM is available in many forms, such as synchronous RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), SyncLink DRAM (SLDRAM), direct Rambus RAM (DRRAM), direct Rambus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM). Additionally, the memory components of the system or computer-implemented method disclosures herein are intended to include, but are not limited to, the above and any other suitable types of memory.

[0101] The above description includes only examples of systems and computer-implemented methods. Of course, it is not possible to describe every conceivable combination of components or computer-implemented methods to describe the present disclosure, but those skilled in the art will recognize that many other combinations and permutations of the present disclosure are possible. Also, to the extent that terms such as "include," "has," and "possesses" are used in the detailed description, claims, appendices, and accompanying drawings, such terms are intended to be inclusive in the same manner as the term "comprising," as interpreted when "comprising" is employed as a transitional term in a claim. The description of various embodiments is provided for illustrative purposes and is not intended to be exhaustive or limited to the disclosed embodiments. Various modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terms used herein are selected to best explain the principles of the embodiments, practical applications, or technical improvements over the art found in the market, or to enable those skilled in the art to understand the embodiments disclosed herein.

Claims

1. 1. A method comprising: forming, with a manufacturing device, discontinuous channels in a dielectric having a pattern including a first channel separated from a second channel by a wall of the dielectric; forming, with the manufacturing device, a conductive line within the discontinuous channel of the dielectric material, the conductive line including a first segment and a second segment separated by the wall, the wall facilitating propagation of microwave signals between the first segment and the second segment and reducing heat flow between the first segment and the second segment of the conductive line; forming a housing made of a housing material with the manufacturing device; Including, the housing is configured to be coupled to a cooler plate that facilitates transfer of thermal energy away from the housing, the housing material being oxygen-free or electrolytic copper, the housing being coupled to an electrical ground; forming the conductive lines includes sintering a conductive material into the discontinuous channels; The sintering of the conductive material comprises: depositing the conductive material in powder form within the discontinuous channels with the manufacturing device; exposing, by said manufacturing device, said powdered conductive material to a sintering environment characterized by a predetermined temperature and a predetermined pressure selected to bond said powdered conductive material into said conductive wire without liquefying said conductive material; Including, method.

2. the depositing the conductive material in powder form includes depositing within the discontinuous channels one of the group including powdered gold, powdered copper, powdered silver, and powdered aluminum. The method of claim 1.

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