3D modeling device and display method

Abstract

To provide a three-dimensional object manufacturing apparatus capable of stereoscopically verifying a three-dimensional deposition modeling by a 3D model generated from a photographed image of the three-dimensional object manufactured by the three-dimensional deposition modeling.SOLUTION: A three-dimensional object manufacturing apparatus comprises: an acquisition processing unit for acquiring an image of a process completion body by photographing a three-dimensional object upon process completion by using a camera as the process completion body for each process of a three-dimensional deposition modeling; a first generation-processing unit for generating a 3D model of a modeled portion subjected to the three-dimensional deposition modeling by using the image for each process of the three-dimensional deposition modeling; a second generation-processing unit for generating a 3D model of the three-dimensional object by positioning the 3D model of the modeled portion on the basis of information related to the modeled portion included in three-dimensional information in a height direction; and a display processing unit for displaying the 3D model of the three-dimensional object on a display with a viewer capable of displaying a cross section of the 3D model of the three-dimensional object or move-displaying the 3D model of the modeled portion.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a three-dimensional object manufacturing apparatus that inspects a three-dimensional object using an image acquired by photographing with a camera. [Background technology]

[0002] Various techniques have been proposed for the above-mentioned three-dimensional object manufacturing apparatus. For example, the technique described in Patent Document 1 below is a modeling apparatus that models a preset object by repeating a laying step of laying material powder in layers and a heating and solidifying step of heating and solidifying the material powder laid in layers, and includes an imaging unit that images the surface of the material powder laid in layers after the laying step or the heating and solidifying step, and a success / failure determination unit that determines whether the modeling is normal or abnormal based on the image captured by the imaging unit.

[0003] According to the description in Patent Document 1 below, the modeling device has a success / failure determination unit that determines whether the modeling is normal or abnormal based on the image of the surface of the material powder laid in layers captured by the imaging unit. Therefore, it is possible to recognize the occurrence of a modeling defect without waiting for the completion of the modeling of the object, thereby reducing the processing time and waste of material powder. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-142101 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the captured image used in the judgment by the correct / incorrect judgment unit is an image of the surface of the material powder. Therefore, when the correct / incorrect judgment unit is applied to a 3D model manufacturing device that manufactures 3D models by 3D additive manufacturing, it is possible to judge whether the 3D additive manufacturing is normal or abnormal for the surface of the 3D model at the completion of each process of the 3D additive manufacturing, but it is difficult to verify the 3D additive manufacturing in three dimensions.

[0006] The present disclosure has been made in consideration of the above-mentioned points, and has an objective of providing a three-dimensional object manufacturing device that is capable of three-dimensionally verifying three-dimensional additive manufacturing using a 3D model generated from captured images of a three-dimensional object manufactured by 3D additive manufacturing. [Means for solving the problem]

[0007] This specification relates to a method for manufacturing a three-dimensional laminated electronic device consisting of a plurality of structures by three-dimensional additive manufacturing based on three-dimensional information. Multiple processes The apparatus includes a camera for photographing the three-dimensional laminated electronic device from above, a three-dimensional CG (computer graphics) processing unit for generating a 3D model of the three-dimensional laminated electronic device, and a display for displaying the 3D model of the three-dimensional laminated electronic device, and the three-dimensional CG processing unit: When 3D additive manufacturing of the same type of structure is performed, instead of taking a picture with a camera each time a layer is completed, The 3D additive manufacturing process for the same type of structure is completed. If Then, by photographing the 3D laminated electronic device at the completion of the 3D additive manufacturing process of the same type of structure with a camera, For each processThe system includes an acquisition processing unit that acquires an image of a process-completed body, a first generation processing unit that uses the image to generate a 3D model of a structure of the same type that is 3D additively manufactured each time a process of 3D additive manufacturing of the same type of structure is completed, a second generation processing unit that generates a 3D model of the three-dimensional laminated electronic device by arranging the 3D model of the structure based on information on the height direction of the structure included in the three-dimensional information, and a display processing unit that displays the 3D model of the three-dimensional laminated electronic device on the display as a viewer capable of displaying a cross section of the 3D model of the three-dimensional laminated electronic device or displaying the 3D model of the structure in a moving manner. the plurality of structures include a plurality of types of structures, each of the plurality of types of structures including a plurality of types of structures and electronic components made of a plurality of types of materials, the plurality of processes include a process of forming structures made of the same type of material and a process of mounting electronic components, and the same type of structures is formed by one of the plurality of processes, and the second generation processing unit generates a 3D model of the three-dimensional stacked electronic device by arranging 3D models of the plurality of types of structures generated for the plurality of processes. A three-dimensional object manufacturing device is disclosed. Effect of the Invention

[0008] According to the present disclosure, a three-dimensional object manufacturing device is capable of stereoscopically verifying three-dimensional additive manufacturing using a 3D model generated from captured images of a three-dimensional object manufactured by the three-dimensional additive manufacturing process. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a three-dimensional stacked electronic device manufacturing apparatus. [Diagram 2] FIG. 2 is a block diagram showing a control device. [Diagram 3] FIG. 2 is a block diagram showing a control device. [Figure 4] 1A to 1C are diagrams illustrating each process of a manufacturing method for a three-dimensional stacked electronic device. [Diagram 5] 1 is a flowchart showing a method for displaying a three-dimensional laminated electronic device as a 3D model. [Figure 6] FIG. 2 is a diagram illustrating a photographing unit when photographing is performed by a camera. [Figure 7] FIG. 11 shows images acquired for each process of 3D additive manufacturing, in which the 3D integrated electronic device is projected from above upon completion of each process. [Figure 8]FIG. 11 is a diagram showing images acquired for each process of 3D additive manufacturing, in which an area showing a modeled part in each process has been extracted. [Figure 9] FIG. 1 is a diagram showing 3D models of the molded parts for each process of 3D additive manufacturing. [Figure 10] FIG. 1 is a diagram showing an embodiment in which a 3D model of a three-dimensional laminated electronic device is displayed on a display. [Figure 11] 1 is a flowchart showing a method for displaying a three-dimensional laminated electronic device as a 3D model. [Figure 12] FIG. 2 is a diagram illustrating a photographing unit when photographing is performed by a camera. [Figure 13] FIG. 1 shows a 3D model of a three-dimensional laminated electronic device upon completion of each process of three-dimensional additive manufacturing. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. Note that in each drawing, some basic configurations are omitted, and the dimensional ratios of the various parts are not necessarily accurate.

[0011] 1 shows a three-dimensional stacked electronic device manufacturing apparatus 10. The three-dimensional stacked electronic device manufacturing apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, a heating unit 214, an imaging unit 218, and a control device (see FIG. 2) 27. The transport device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, the heating unit 214, and the imaging unit 218 are disposed on a base 28 of the three-dimensional stacked electronic device manufacturing apparatus 10. The base 28 is generally rectangular, and in the following description, the longitudinal direction of the base 28 is referred to as the X-axis direction, and the lateral direction of the base 28 is referred to as the Y-axis direction.

[0012] In addition, the direction perpendicular to both the X-axis direction and the Y-axis direction will be referred to as the Z-axis direction (see FIGS. 6 and 12). The Z-axis direction is the up-down direction of the base 28, and is perpendicular to the horizontal plane. Furthermore, the Z-axis direction is the up-down direction of the three-dimensional stacked electronic device 222 (see (i) of FIG. 4), that is, the height direction of the three-dimensional stacked electronic device 222.

[0013] The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to an arbitrary position in the X-axis direction by the drive of the electromagnetic motor 38. Furthermore, the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

[0014] The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a substrate (not shown) is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The substrate is fixedly held by clamping both edges in the X-axis direction of the substrate placed on the base 60 between the holding devices 62. The lifting device 64 is provided below the base 60, and lifts and lowers the base 60 in the Z-axis direction.

[0015] The substrate is made of a wax-based material (e.g., a brazing material) that melts with heat or a solvent. However, the substrate is not limited to this, and may be made of, for example, a peelable underlying material (e.g., a double-sided tape or film material with weak adhesive strength). However, when such a double-sided tape is used as the substrate, the substrate is fixedly held to the base 60 by its adhesive strength, and the holding device 62 is not necessary.

[0016] The first modeling unit 22 is a unit that models a circuit wiring layer on a substrate placed on the base 60 of the stage 52, and has a first printing unit 72 and a baking unit 74. The first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a linear shape onto the substrate placed on the base 60. The metal ink is a dispersion of metal particles in a solvent. The inkjet head 76 ejects the metal ink from multiple nozzles by, for example, a piezo method using a piezoelectric element.

[0017] The baking unit 74 has a laser irradiation device 78 (see FIG. 2). The laser irradiation device 78 is a device that irradiates a laser onto the metal ink discharged onto the base material, and the metal ink irradiated with the laser is baked to form a circuit wiring layer. Note that baking of metal ink is a phenomenon in which the application of energy causes the evaporation of the solvent and the decomposition of the metal particle protective film, and the metal particles come into contact or fuse together, thereby increasing the electrical conductivity. Then, the metal ink is baked to form a metal circuit wiring layer.

[0018] The second modeling unit 24 is a unit that models an insulating layer on the substrate placed on the base 60 of the stage 52, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and ejects ultraviolet curing resin onto the substrate placed on the base 60. The ultraviolet curing resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezoelectric type that ejects resin from multiple nozzles by deformation of a piezoelectric element, or a thermal type that heats resin to generate bubbles and ejects the resin from multiple nozzles.

[0019] The curing unit 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curing resin discharged onto the substrate by the inkjet head 88, for example, by leveling the surface of the ultraviolet curing resin while scraping off excess resin with a roller or blade, thereby making the thickness of the ultraviolet curing resin uniform. The irradiation device 92 is equipped with a mercury lamp or LED as a light source, and irradiates ultraviolet light onto the ultraviolet curing resin discharged onto the substrate. This causes the ultraviolet curing resin discharged onto the substrate to harden, forming an insulating layer.

[0020] The mounting unit 26 is a unit that mounts electronic components (see FIG. 4) 250 on a substrate placed on the base 60 of the stage 52, and has a supply section 100 and a mounting section 102. The supply section 100 has a plurality of tape feeders (see FIG. 2) 110 that feed the taped electronic components 250 one by one, and supplies the electronic components 250 at a supply position. The supply section 100 is not limited to the tape feeders 110, and may be a tray-type supply device that picks up and supplies the electronic components 250 from a tray. The supply section 100 may be configured to include both a tape-type and a tray-type supply device, or other types of supply devices.

[0021] The mounting unit 102 has a mounting head 112 (see FIG. 2) and a moving device 114 (see FIG. 2). The mounting head 112 has a suction nozzle (not shown) for suctioning and holding the electronic component 250. The suction nozzle suctions and holds the electronic component 250 by sucking air when negative pressure is supplied from a positive / negative pressure supplying device (not shown). Then, the positive / negative pressure supplying device supplies a slight positive pressure to the suction nozzle, thereby releasing the electronic component 250. The moving device 114 moves the mounting head 112 between the supply position of the electronic component 250 by the tape feeder 110 and the substrate placed on the base 60. As a result, in the mounting unit 102, the electronic component 250 supplied from the tape feeder 110 is held by the suction nozzle, and the electronic component 250 held by the suction nozzle is mounted on the substrate.

[0022] The transfer unit 200 is a unit that transfers the first conductive adhesive and the second conductive adhesive onto the base material placed on the base 60 of the stage 52. The first conductive adhesive and the second conductive adhesive are conductive pastes that are cured by heating. However, the first conductive adhesive is cured by ultraviolet light prior to the heating. The ultraviolet light is irradiated by the irradiation device 92 described above.

[0023] Further, the transfer unit 200 has a supply section 202 and a transfer section 204. The supply section 202 has a first adhesive supply device 206 (see FIG. 3) and a second adhesive supply device 208 (see FIG. 3). The first adhesive supply device 206 has a dip dish (not shown) onto which the first conductive adhesive is dispensed, and supplies the first conductive adhesive in a state in which the thickness is made uniform by being pushed and spread by a squeegee (not shown) on the dip dish. Similarly, the second adhesive supply device 208 has a dip dish (not shown) onto which the second conductive adhesive is dispensed, and supplies the second conductive adhesive in a state in which the thickness is made uniform by being pushed and spread by a squeegee (not shown) on the dip dish.

[0024] The transfer unit 204 has a transfer head 210 (see FIG. 3) and a moving device (see FIG. 3) 212. The transfer head 210 has a plurality of transfer needles (not shown) for transferring the first conductive adhesive or the second conductive adhesive. The transfer needles are dipped into the first conductive adhesive or the second conductive adhesive in each dip dish of the first adhesive supply device 206 or the second adhesive supply device 208. As a result, the first conductive adhesive or the second conductive adhesive is attached to the tip of the transfer needle. The transfer head 210 uses the plurality of transfer needles separately, one for attaching the first conductive adhesive and one for attaching the second conductive adhesive. In addition, the moving device 212 moves the transfer head 210 between each dip dish of the first adhesive supply device 206 or the second adhesive supply device 208 and the base material placed on the base 60. As a result, in the transfer unit 204, the first conductive adhesive or the second conductive adhesive attached to the tip of the transfer needle is transferred onto the base material.

[0025] The heating section 214 has an irradiation device (see FIG. 3) 216. The irradiation device 216 is equipped with an infrared lamp or an infrared heater, and irradiates infrared rays onto the substrate. As a result, the first conductive adhesive or the second conductive adhesive transferred onto the substrate is heated and cured. Note that the heating section 214 may be equipped with an electric furnace instead of the irradiation device 216.

[0026] The photographing section 218 has a camera 220 (see FIG. 3). The camera 220 is provided so as to be located directly above the substrate placed on the base 60 when the stage 52 moves below the photographing section 218. This allows the camera 220 to photograph the substrate from above.

[0027] 2 and 3, the control device 27 includes a controller 120 and a plurality of drive circuits 122. As shown in FIG. 2, the plurality of drive circuits 122 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the tape feeder 110, the mounting head 112, and the moving device 114. Furthermore, as shown in FIG. 3, the plurality of drive circuits 122 are connected to the first adhesive supply device 206, the second adhesive supply device 208, the transfer head 210, the moving device 212, the irradiation device 216, and the camera 220. The controller 120 includes a CPU 125, a ROM 126, a RAM 127, an EEPROM 128, and the like, and is mainly a computer, and is connected to the plurality of drive circuits 122. As a result, the operations of the conveying device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, the transfer unit 200, the heating unit 214, and the photographing unit 218 are controlled by the controller 120. Note that the EEPROM 128 stores manufacturing process data 129 for the three-dimensional laminated electronic device manufacturing apparatus 10 (hereinafter, referred to as process data 129).

[0028] The controller 120 also includes an image processing device 130. The image processing device 130 processes the imaging data obtained by the camera 220. As a result, the controller 120 acquires various information from the imaging data. Furthermore, the controller 120 can perform three-dimensional CG (computer graphics) using the image processing device 130.

[0029] 2, the control device 27 includes a communication circuit 124. The communication circuit 124 is connected to the controller 120 and a PC (Personal Computer) 134. The PC 134 includes a display 134 and the like. This enables the controller 120 to, for example, control the operation of the display 134 of the PC 134 or to obtain various information from the PC 134.

[0030] 4 shows a method for manufacturing a three-dimensional laminated electronic device 222 performed by the three-dimensional laminated electronic device manufacturing apparatus 10. In the method for manufacturing the three-dimensional laminated electronic device 222, each process (a) to (i) of three-dimensional additive manufacturing by the full additive method is performed based on three-dimensional information. As a result, after the process (i) is completed, the three-dimensional laminated electronic device 222 is manufactured. The three-dimensional information is the above-mentioned process data 129 created using three-dimensional CAD data of the three-dimensional laminated electronic device 222, and is stored in the EEPROM 128 of the controller 120 by being transmitted from the PC 134 to the control device 27 of the three-dimensional laminated electronic device manufacturing apparatus 10, for example.

[0031] In the insulating layer forming process of (a), a first insulating layer 228 is formed on the substrate. To this end, the stage 52 is moved below the second modeling unit 24. As a result, the substrate set on the base 60 of the stage 52 is moved below the second modeling unit 24. Furthermore, in the second printing unit 84, the inkjet head 88 ejects a thin film of ultraviolet curing resin onto the upper surface of the substrate. Next, in the curing unit 86, the flattening device 90 flattens the ejected ultraviolet curing resin so that the film thickness is uniform. After that, the irradiation device 92 irradiates the flattened ultraviolet curing resin with ultraviolet rays. As a result, the ultraviolet curing resin is cured. Thereafter, the above-mentioned steps in the second modeling unit 24 (i.e., the steps in the second printing unit 84 and the steps in the curing unit 86) are repeated, so that the first insulating layer 228 is formed on the substrate.

[0032] However, in the process in the second modeling unit 24, when the process in the second printing unit 84 and the process in the curing unit 86 are repeated, the inkjet head 88 ejects the ultraviolet curing resin so that a predetermined portion is exposed in a generally circular shape on the upper surface of the base material. As a result, two through holes 230 are formed along the Z-axis direction in the first insulating layer 228. Each through hole 230 has a shape that gradually widens from the upper surface to the lower surface of the first insulating layer 228.

[0033] In the process of forming the circuit wiring layer in (b), the first circuit wiring layer 232 is formed on the first insulating layer 228 and cured. To do so, the stage 52 is moved below the first modeling unit 22. Furthermore, in the first printing section 72, the inkjet head 76 ejects metal ink in a line shape according to the wiring circuit pattern onto the upper surface of the first insulating layer 228. As a result, two first circuit wiring layers 232 are formed on the upper surface of the first insulating layer 228. After that, in the baking section 74, the laser irradiation device 78 irradiates the metal ink ejected in a line shape with a laser. As a result, the metal ink is cured. In this manner, the first circuit wiring layers 232 are cured on the upper surface of the first insulating layer 228.

[0034] In the via formation process of (c), the stage 52 is moved below the transfer unit 200. In the transfer unit 200, the first conductive adhesive supplied by the first adhesive supply device 206 is attached to the tip of the transfer needle of the transfer head 210. The attached first conductive adhesive fills each through hole 230 of the first insulating layer 228 as the transfer head 210 moves by the moving device 212. As a result, in the first insulating layer 228, the first conductive adhesive is transferred to each through hole 230. Thereafter, the stage 52 is moved to the curing section 86 of the second modeling unit 24. In the curing section 86, the irradiation device 92 irradiates the transferred first conductive adhesive with ultraviolet light. As a result, in the first insulating layer 228, the first conductive adhesive in each through hole 230 is cured, and each via 234 of the first layer is formed in a structure electrically connected to each circuit wiring layer 232 of the first layer.

[0035] In the insulating layer formation process of (d), a second insulating layer 236 is formed on a first insulating layer 228. To achieve this, a process similar to that of the insulating layer formation of (a) above is performed. At this time, two through holes 238 are formed in the second insulating layer 236 along the Z-axis direction. In each through hole 238, a part of the first insulating layer 228 and a part of each circuit wiring layer 232 of the first layer are exposed. Each through hole 238 has a shape that gradually widens from the upper surface to the lower surface of the second insulating layer 236.

[0036] In the process of forming the circuit wiring layer (e), two second-layer circuit wiring layers 240 are formed and cured on the second insulating layer 236. To achieve this, a process similar to that of forming the circuit wiring layer (b) above is carried out.

[0037] In the via formation process of (f), a process similar to the via formation of (c) above is performed. As a result, in the second insulating layer 236, the first conductive adhesive in each through hole 238 is cured, and each via 242 in the second layer is formed in a structure in which it is electrically connected to each circuit wiring layer 232 in the first layer and each circuit wiring layer 240 in the second layer.

[0038] In the cavity layer formation process of (g), a third insulating layer 244 is formed on the second insulating layer 236. To achieve this, a process similar to that of the insulating layer formation of (a) above is performed. However, in the process in the second modeling unit 24, when the process of the second printing unit 84 and the process of the curing unit 86 are repeated, the inkjet head 88 ejects the ultraviolet curing resin onto the upper surface of the second insulating layer 236 so that a predetermined portion is exposed in a generally rectangular shape. As a result, a cavity 246 is formed in the third insulating layer 244. Furthermore, the third insulating layer 244 is divided into two by the cavity 246. Note that, in the cavity 246, a portion of each of the second circuit wiring layers 240 is exposed.

[0039] In the process of forming connection bumps (h), the stage 52 is moved below the transfer unit 200. In the transfer unit 200, the second conductive adhesive supplied by the second adhesive supply device 208 is attached to the tip of the transfer needle of the transfer head 210. As the transfer head 210 moves by the moving device 212, the attached second conductive adhesive is transferred to the upper surface of each of the second circuit wiring layers 240, a part of which is exposed in the cavity 246. As a result, each bump 248 is formed in the cavity 246 with a structure electrically connected to each of the second circuit wiring layers 240.

[0040] (i) In the component mounting process, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the electronic component 250 supplied by the tape feeder 110 is held by the suction nozzle of the mounting head 112. The held electronic component 250 is mounted in the cavity 246 as the mounting head 112 moves by the moving device 114. At this time, each electrode (not shown) of the electronic component 250 faces downward and is connected to the second circuit wiring layer 240 via the bumps 248. Two electronic components 250 are mounted in the cavity 246.

[0041] Thereafter, the stage 52 is moved below the heating unit 214. In the heating unit 214, the irradiation device 216 irradiates infrared rays onto the substrate. This causes the first conductive adhesive (the vias 234, 242 of the first and second layers) as well as the second conductive adhesive (the bumps 248) to harden, and the electronic component 250 is fixed. In this manner, the three-dimensional stacked electronic device 222 is manufactured.

[0042] In the three-dimensional laminated electronic device manufacturing apparatus 10, for example, a processing program for realizing a display method 12 shown in the flowchart of Fig. 5 is stored in the ROM 126 of the controller 120 and executed by the CPU 125 of the controller 120. As a result, a 3D model 258 (see Fig. 10) of the three-dimensional laminated electronic device 222 is generated based on the three-dimensional laminated electronic device 222 manufactured by the three-dimensional additive manufacturing shown in Fig. 4 above, and is displayed on the display 134 of the PC 132. The flowchart of the display method 12 will be described below.

[0043] First, the manufacturing process S10 and the imaging process S12 are repeated until the manufacturing of the three-dimensional stacked electronic device 222 is completed (S14: NO). At that time, each time the manufacturing process S10 is repeated, each process (a) to (i) of the three-dimensional stacked manufacturing is performed in sequence. Furthermore, each time the imaging process S12 is repeated, that is, each time each process (a) to (i) of the three-dimensional stacked manufacturing is completed, the stage 52 is moved below the photographing unit 218 and photographed by the camera 220. For example, when the process of forming the insulating layer (a) is completed, as shown in FIG. 6, in the photographing unit 218, the first insulating layer 228 having each through hole 230 is photographed from above by the camera 220, and an image I(a) is acquired.

[0044] Therefore, when the manufacture of the three-dimensional laminated electronic device 222 is completed (S14: YES), a plurality of images I(a) to I(i) are acquired, as shown in Fig. 7. In each of the images I(a) to I(i), the three-dimensional laminated electronic device 222 at the time when each of the processes (a) to (i) of the three-dimensional additive manufacturing is completed (hereinafter, referred to as a process-completed body) is projected from above.

[0045] Therefore, image I(a) shows a first insulating layer 228 having each of the through holes 230 as a process-completed body 252(a) when the process of forming the insulating layer in (a) is completed. Image I(b) shows a first insulating layer 228 and each of the first circuit wiring layers 232 formed on the first insulating layer 228 as a process-completed body 252(b) when the process of forming the circuit wiring layer in (b) is completed.

[0046] Image I(c) shows the first insulating layer 228 and the first circuit wiring layer 232 of the process completed body 252(c) when the via formation process of (c) is completed, and the first vias 234 formed in the first insulating layer 228. Image I(d) shows the first insulating layer 228 and the first circuit wiring layer 232 of the process completed body 252(d) when the insulating layer formation process of (d) is completed, and the second insulating layer 236 with the through holes 238. In image I(d), the first insulating layer 228 and the first circuit wiring layer 232 are shown inside the through holes 238.

[0047] Image I(e) shows the first insulating layer 228 and the second insulating layer 236 of the process completed body 252(e) when the process of forming the circuit wiring layer in (e) is completed, as well as the second circuit wiring layers 240 formed in the second insulating layer 236. Note that in image I(e), the first insulating layer 228 is shown inside each through hole 238. Image I(f) shows the second insulating layer 236 and the second circuit wiring layers 240 of the process completed body 252(f) when the process of forming the vias in (f) is completed, as well as the second vias 242 formed in the second insulating layer 236.

[0048] Image I(g) shows the second insulating layer 236 and the second circuit wiring layers 240, the third insulating layers 244 formed on the second insulating layer 236, and the cavities 246 formed between the third insulating layers 244 in the process completed body 252(g) when the process of forming the cavity layer in (g) is completed. Image I(h) shows the second insulating layer 236, the second circuit wiring layers 240, the third insulating layers 244, and the cavities 246 in the process completed body 252(h) when the process of forming the connection bumps in (h) is completed, and the bumps 248 formed on the second circuit wiring layers 240.

[0049] In the image I(i), the second insulating layer 236, the second circuit wiring layers 240, the third insulating layers 244, and the cavity 246 of the process-completed body 252(i) at the time when the component mounting process of (i) is completed are shown, along with the electronic components 250 mounted in the cavity 246. Note that FIG. 4 is also a perspective view showing the process-completed bodies 252(a)-252(i). In the following description, the images I(a)-I(i) are collectively referred to as image I when they are not differentiated from one another, and the process-completed bodies 252(a)-252(i) are collectively referred to as process-completed body 252 when they are not differentiated from one another.

[0050] 5, each time each of the processes (a) to (i) of the three-dimensional additive manufacturing is completed, the three-dimensional laminated electronic device 222 at the time of the completion of the process is photographed by the camera 220 as the process-completed body 252, thereby acquiring an image I of the process-completed body 252. Thereafter, when the manufacture of the three-dimensional laminated electronic device 222 is completed (S14: YES), the cutting process S16 is performed.

[0051] In the cutout process S16, the image processing device 130 extracts the modeling parts for each of the processes (a) to (i) of the 3D additive manufacturing from each of the images I(a) to I(i). The extraction is performed based on data related to each modeling part included in the process data 129. As shown in FIG. 8, in the image I(a), an image area showing the first insulating layer 228 is extracted as the modeling part 254(a) of the insulating layer formation process (a). In the image I(b), an image area showing each of the first circuit wiring layers 232 is extracted as the modeling part 254(b) of the circuit wiring layer formation process (b). In the image I(c), an image area showing each of the vias 234 of the first layer is extracted as the modeling part 254(c) of the via formation process (c).

[0052] In image I(d), an image region showing the second insulating layer 236 is extracted as a shaping portion 254(d) in the insulating layer formation process of (d). In image I(e), an image region showing each of the second circuit wiring layers 240 is extracted as a shaping portion 254(e) in the circuit wiring layer formation process of (e). In image I(f), an image region showing each of the second vias 242 is extracted as a shaping portion 254(f) in the via formation process of (f).

[0053] In image I(g), image regions showing each of the third insulating layers 244 are extracted as a shaping portion 254(g) in the cavity layer formation process of (g). In image I(h), image regions showing each of the bumps 248 are extracted as a shaping portion 254(h) in the connection bump formation process of (h). In image I(i), image regions showing each of the electronic components 250 are extracted as a shaping portion 254(i) in the component mounting process of (i). In the following description, when the shaping portions 254(a) to 254(i) are not distinguished from one another and are collectively referred to as shaping portions 254, they will be referred to as shaping portions 254.

[0054] 5, the image area of ​​the shaping portion 254 is extracted from the image I based on the data related to the shaping portion 254 included in the process data 129. After that, the extrusion process S18 is performed.

[0055] In the extrusion process S18, a 3D model of the portion to be formed 254 is generated by extruding the image area of ​​the portion to be formed 254 in a direction corresponding to the lower side of the three-dimensional stacked electronic device 222 in the height direction of the three-dimensional stacked electronic device 222. The image processing device 130 performs the extrusion based on data related to the portion to be formed 254 included in the process data 129. As a result, each of the 3D models 256(a) to 256(i) is generated as shown in FIG.

[0056] 3D model 256(a) is a 3D model of shaping portion 254(a) in the insulating layer formation process of (a), and is generated by extruding an image area representing first insulating layer 228 based on data related to shaping portion 254(a) included in process data 129. In other words, 3D model 256(a) is a 3D model of first insulating layer 228.

[0057] The 3D model 256(b) is a 3D model of the shaping portion 254(b) in the process of forming the circuit wiring layer of (b), and is generated by extruding an image area indicating each of the first circuit wiring layers 232 based on data related to the shaping portion 254(b) included in the process data 129. In other words, the 3D model 256(b) is a 3D model of each of the first circuit wiring layers 232.

[0058] The 3D model 256(c) is a 3D model of the shaping portion 254(c) in the via formation process of (c), and is generated by extruding an image area showing each via 234 of the first layer based on data on the shaping portion 254(c) included in the process data 129. In other words, the 3D model 256(c) is a 3D model of each via 234 of the first layer. However, in this case, data on each through hole 230 formed in the first insulating layer 228 is used for the data on the shaping portion 254(c) included in the process data 129. Therefore, when the 3D model 256(c) is generated, the image area showing each via 234 of the first layer is extruded so as to gradually widen as it proceeds in a direction corresponding to the lower side of the three-dimensional stacked electronic device 222.

[0059] The 3D model 256(d) is a 3D model of the shaping portion 254(d) in the insulating layer formation process of (d), and is generated by extruding an image area showing the second insulating layer 236 based on data related to the shaping portion 254(d) included in the process data 129. In other words, the 3D model 256(d) is a 3D model of the second insulating layer 236.

[0060] The 3D model 256(e) is a 3D model of the shaping portion 254(e) in the process of forming the circuit wiring layer (e), and is generated by extruding an image area indicating each of the second circuit wiring layers 240 based on data related to the shaping portion 254(e) included in the process data 129. In other words, the 3D model 256(e) is a 3D model of each of the second circuit wiring layers 240.

[0061] The 3D model 256(f) is a 3D model of the shaping portion 254(f) of the via formation process of (f), and is generated by extruding an image area showing each via 242 of the second layer based on data on the shaping portion 254(f) included in the process data 129. In other words, the 3D model 256(f) is a 3D model of each via 242 of the second layer. However, in this case, data on each through hole 238 formed in the second insulating layer 236 is used for the data on the shaping portion 254(f) included in the process data 129. Therefore, when the 3D model 256(f) is generated, the image area showing each via 242 of the second layer is extruded so as to gradually widen as it proceeds in a direction corresponding to the lower side of the three-dimensional stacked electronic device 222.

[0062] The 3D model 256(g) is a 3D model of the printing portion 254(g) in the process of forming the cavity layer (g), and is generated by extruding an image region representing each of the third insulating layers 244 based on data related to the printing portion 254(g) included in the process data 129. In other words, the 3D model 256(g) is a 3D model of each of the third insulating layers 244.

[0063] 3D model 256(h) is a 3D model of the shaping portion 254(h) of the connection bump formation process of (h), and is generated by extruding image regions representing each bump 248 based on data relating to shaping portion 254(h) contained in process data 129. In other words, 3D model 256(h) is a 3D model of each bump 248.

[0064] The 3D model 256(i) is a 3D model of the shaping portion 254(i) of the component mounting process (i), and is generated by extruding an image area indicating each electronic component 250 based on data related to the shaping portion 254(i) included in the process data 129. In other words, the 3D model 256(i) is a 3D model of each electronic component 250. In the following description, the 3D models 256(a) to 256(i) will be referred to collectively as the 3D model 256 when they are not distinguished from one another.

[0065] 5, the image area of ​​the portion to be formed 254 is extruded in a direction corresponding to the lower side of the three-dimensional stacked electronic device 222 based on the data related to the portion to be formed 254 included in the process data 129, thereby generating a 3D model 256 of the portion to be formed 254. Then, a determination process S20 is performed.

[0066] In the determination process S20, a modeling abnormality of the 3D additive manufacturing is determined. In this determination, the image processing device 130 compares and collates data representing the 3D model 256 of the modeling portion 254 with reference data. The reference data is prepared for each of the 3D models 256(a) to 256(i) and is stored in advance in the ROM 126 or the EEPROM 128. If the degree of agreement between the data representing the 3D model 256 of the modeling portion 254 and the reference data is less than a certain standard as a result of the comparison and collation, the 3D additive manufacturing is determined to be abnormal, and if the degree of agreement is equal to or greater than the certain standard, the 3D additive manufacturing is determined to be normal.

[0067] If the three-dimensional additive manufacturing is abnormal (S20: YES), abnormality processing S22 is performed. In the abnormality processing S22, the fact that the three-dimensional additive manufacturing is abnormal is notified, for example, by displaying the abnormality on the display 134 of the PC 132. In this case, an alarm sound may be output from the PC 132. After that, the display method 12 ends, but the arrangement processing S24 described later may be continued.

[0068] On the other hand, if the three-dimensional additive manufacturing is normal (S20: NO), the arrangement process S24 is performed. In the arrangement process S24, the 3D models 256 of the manufacturing portions 254 are combined to generate a 3D model 258 of the three-dimensional laminated electronic device 222. The combination is performed by the image processing device 130 by arranging each of the 3D models 256(a)-256(i) based on data related to the height direction of each of the manufacturing portions 254(a)-254(i) included in the process data 129, etc.

[0069] In the viewer process S26, the 3D model 258 of the three-dimensional stacked electronic device 222 is displayed on the display 134 of the PC 132 in a viewer that is capable of at least rotating or displaying a cross section of the 3D model 258 of the three-dimensional stacked electronic device 222, or moving or rotating the 3D model 256 of the molded portion 254. The application software of such a viewer is stored in the ROM 126 of the controller 120, and is executed by the CPU 125 of the controller 120. Furthermore, in the display, for example, as shown in FIG. 10, the 3D model 258 of the three-dimensional stacked electronic device 222 is in a transparent state, and the top surfaces of the first insulating layer 228, the first circuit wiring layer 232, the first vias 234, the second insulating layer 236, the second circuit wiring layer 240, the second vias 242, and the bumps 248 that cannot be seen from the outside of the three-dimensional stacked electronic device 222 are displayed. Display method 12 then ends.

[0070] Furthermore, in the three-dimensional laminated electronic device manufacturing apparatus 10, instead of the processing program for realizing the display method 12 shown in the flowchart of Fig. 5, a processing program for realizing the display method 12 shown in the flowchart of Fig. 11 may be stored in the ROM 126 of the controller 120 and executed by the CPU 125 of the controller 120. The flowchart of the display method 12 in such a case will be described below. However, in the following description, the same parts in the flowchart of Fig. 5 and the flowchart of Fig. 11 are denoted by the same reference numerals, and description thereof will be omitted.

[0071] In the imaging process S32, each time the imaging process S32 is repeated, that is, each time each of the processes (a) to (i) of the three-dimensional additive manufacturing is completed, the stage 52 is moved below the photographing unit 218 and photographed by the camera 220. For example, when the process of forming the insulating layer in (a) is completed, as shown in FIG. 12, the first insulating layer 228 having each of the through holes 230 is photographed from above by the camera 220 in the photographing unit 218. However, the camera 220 has two lens mechanisms and shutter mechanisms, and photographs from two different directions simultaneously. As a result, the image I1(a) and the image I2(a) are obtained. The process-completed body 252(a) is reflected in the image I1(a) and the image I2(a). This is the same for each of the processes (b) to (i) of the three-dimensional additive manufacturing. The photographing unit 218 may photograph from two different directions simultaneously by two cameras.

[0072] In the three-dimensional processing S36, the image processing device 130 generates a 3D model of the process-completed body 252 for each of the processes (a) to (i) of the three-dimensional additive manufacturing. In the case of the process of forming an insulating layer (a), the generation is performed based on the image I1(a) and the image I2(a). As a result, as shown in FIG. 13, a 3D model 260(a) is generated for the process-completed body 252(a) at the time of completing the process of forming an insulating layer (a). The same applies to each of the processes (b) to (i) of the three-dimensional additive manufacturing, and 3D models 260(b) to 260(i) are generated for the process-completed bodies 252(b) to 252(i) at the time of completing each of the processes (b) to (i). In the following description, when the 3D models 260(a) to 260(i) are collectively referred to without distinction, they are written as the 3D model 260.

[0073] In the difference processing S38, the image processing device 130 generates a 3D model 256 of the shaping portion 254. The generation is performed by extracting the difference between the 3D models 260 of two process-completed bodies 252 corresponding to the processes successive to each other in the three-dimensional additive manufacturing. For example, the generation of the 3D model 256(b) of the shaping portion 254(b) in the process of forming a circuit wiring layer in (b) is performed by extracting the difference between the 3D model 260(a) of the process-completed body 252(a) at the time of completing the process of forming an insulating layer in (a) and the 3D model 260(b) of the process-completed body 252(b) at the time of completing the process of forming a circuit wiring layer in (b). Such generation is similarly performed for the 3D models 256(b)-(i) of the shaping portions 254(c)-(i) in each process in (c)-(i).

[0074] However, for the 3D model 256(a) of the shaping portion 254(a) in the process of forming the insulating layer (a), a 3D model 260(a) of the process-completed body 252(a) at the completion of the process of forming the insulating layer (a) is used.

[0075] As described above in detail, in the three-dimensional laminated electronic device manufacturing apparatus 10 of this embodiment, a 3D model 258 of the three-dimensional laminated electronic device 222 is generated from an image I (including image I1(a) and image I2(a), etc.) taken by the camera 220 of the three-dimensional laminated electronic device 222 manufactured by three-dimensional additive manufacturing, and the 3D model 258 of the three-dimensional laminated electronic device 222 is displayed on the display 134, making it possible to verify the three-dimensional additive manufacturing in three dimensions.

[0076] Incidentally, in this embodiment, the three-dimensional stacked electronic device manufacturing apparatus 10 is an example of a three-dimensional object manufacturing apparatus. The controller 120 is an example of a three-dimensional CG processing unit. The process data 129 is an example of three-dimensional information. The PC 132 is an example of an alarm device. The three-dimensional stacked electronic device 222 is an example of a three-dimensional object. The 3D model 258 of the three-dimensional stacked electronic device 222 is an example of a 3D model of a three-dimensional object. The data on each of the molded portions 254(a)-254(i) is an example of information on the molded portions. The data on the height direction of each of the molded portions 254(a)-254(i) is an example of information on the height direction of the molded portions.

[0077] The controller 120 that executes the imaging process S12 is an example of an acquisition processing unit. The controller 120 that executes the cutting process S16 and the extrusion process S18 is an example of a first generation processing unit. The controller 120 that executes the determination process S20 and the abnormality process S22 is an example of an abnormality processing unit. The controller 120 that executes the arrangement process S24 is an example of a second generation processing unit. The controller 120 that executes the viewer process S26 is an example of a display processing unit. The controller 120 that executes the imaging process S32 is an example of an acquisition processing unit. The controller 120 that executes the three-dimensional process S36 and the difference process S38 is an example of a first generation processing unit. The controller 120 that executes the three-dimensional process S36 is an example of a third generation processing unit. The controller 120 that executes the difference process S38 is an example of a fourth generation processing unit.

[0078] The imaging process S12 is an example of an acquisition process. The cutting process S16 and the extrusion process S18 are an example of a first generation process. The placement process S24 is an example of a second generation process. The viewer process S26 is an example of a display process. The imaging process S32 is an example of an acquisition process. The three-dimensional process S36 and the difference process S38 are an example of a first generation process.

[0079] The present disclosure is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present disclosure. For example, three-dimensional CAD data of the three-dimensional stacked electronic device 222 may be used instead of the process data 129. Also, a see-through 3D model 258 of the three-dimensional stacked electronic device 222 may be displayed as a model sliced ​​at an arbitrary layer position.

[0080] Furthermore, the camera 220 may be provided in either one of the inkjet heads 76, 88 or the mounting head 112. In this case, the photographing unit 218 is not necessary. When each camera 220 is equipped with a lens mechanism and a shutter mechanism for one camera, photographing from two different directions in the imaging process S32 is performed by moving each of the inkjet heads 76, 88 or the mounting head 112 to two photographing positions.

[0081] In addition, the processing program for realizing the display method 12 shown in the flowchart of Figure 5 above and the processing program for realizing the display method 12 shown in the flowchart of Figure 11 above may be executed by the PC 132, or may be executed by a control device connected to the three-dimensional laminated electronic device manufacturing apparatus 10 via a communication network. [Explanation of symbols]

[0082] 10: 3D laminated electronic device manufacturing apparatus, 12: display method, 120: controller, 129: process data, 132: PC, 134: display, 220: camera, 222: 3D laminated electronic device, 252: process completed body, 254: (image area of) formed part, 256: 3D model of formed part, 258: 3D model of 3D laminated electronic device, 260: 3D model of process completed body, I: image of process completed body, S12: imaging process, S16: cutting process, S18: extrusion process, S20: judgment process, S22: abnormality process, S24: placement process, S26: viewer process, S32: imaging process, S36: 3D process, S38: difference process

Claims

1. A three-dimensional object manufacturing apparatus that manufactures a three-dimensional laminated electronic device composed of a plurality of structures by a plurality of processes of three-dimensional additive manufacturing based on three-dimensional information, comprising: a camera for photographing the three-dimensional stacked electronic device from above; a three-dimensional CG (computer graphics) processing unit that generates a 3D model of the three-dimensional stacked electronic device; a display for displaying a 3D model of the three-dimensional stacked electronic device; The three-dimensional CG processing unit includes: an acquisition processing unit that acquires an image of the process-completed body for each process by capturing an image of the three-dimensional laminated electronic device at the completion of the process of the three-dimensional additive manufacturing of the same type of structure with the camera as the process-completed body when the process of the three-dimensional additive manufacturing of the same type of structure is completed without capturing an image with the camera every time the modeling of one layer is completed during the three-dimensional additive manufacturing of the same type of structure; a first generation processing unit that generates a 3D model of the same type of structure to be three-dimensionally additively manufactured using the image each time a process of three-dimensional additive manufacturing of the same type of structure is completed; a second generation processing unit that generates a 3D model of the three-dimensional laminated electronic device by arranging a 3D model of the structure based on information regarding a height direction of the structure included in the three-dimensional information; a display processing unit that displays a 3D model of the three-dimensional multilayer electronic device on the display using a viewer that is capable of displaying a cross section of the 3D model of the three-dimensional multilayer electronic device or a movably displaying 3D model of the structure; the plurality of structures includes a plurality of types of structures, each of the plurality of types of structures including a plurality of types of structures and electronic components made of a plurality of types of materials; The plurality of processes include a process for forming a structure made of the same type of material and a process for mounting electronic components; the same type of structure is formed by one of the plurality of processes; The second generation processing unit generates a 3D model of the three-dimensional laminated electronic device by arranging 3D models of the plurality of types of structures generated for the plurality of processes.

2. The three-dimensional object manufacturing device according to claim 1, wherein the first generation processing unit generates a 3D model of the structure by extracting an image area of ​​the structure from the image and extruding it in a height direction of the three-dimensional stacked electronic device based on information about the structure included in the three-dimensional information.

3. The acquisition processing unit acquires at least two of the images each time a process for three-dimensional additive manufacturing of the same type of structure is completed by photographing the process-completed body with the camera from two different directions, The first generation processing unit is a third generation processing unit that generates a 3D model of the processed object from the two images each time the process of the three-dimensional additive manufacturing of the same type of structure is completed; and a fourth generation processing unit that generates a 3D model of the structure by extracting a difference between 3D models of two process-completed bodies corresponding to successive 3D additive manufacturing processes of the same type of structure in the 3D additive manufacturing process.

4. An alarm device is provided.

4. The three-dimensional object manufacturing apparatus according to claim 1, wherein the first generation processing unit includes an abnormality processing unit that notifies the notification device of a modeling abnormality in the three-dimensional laminated electronic device in accordance with a result obtained by comparing and matching data representing a 3D model of the structure with reference data.

5. A display method for displaying, as a 3D model, a three-dimensional laminated electronic device that is composed of a plurality of structures manufactured by a plurality of processes of three-dimensional additive manufacturing based on three-dimensional information in a three-dimensional object manufacturing device, comprising: an acquisition step of acquiring an image for each process by photographing the three-dimensional laminated electronic device with a camera when the process of the three-dimensional additive manufacturing of the same type of structure is completed without photographing with a camera every time modeling of one layer is completed during the three-dimensional additive manufacturing of the same type of structure; a first generation step of generating a 3D model of the same type of structure to be three-dimensionally additively manufactured using the image each time a process of three-dimensional additive manufacturing of the same type of structure is completed; a second generation step of generating a 3D model of the three-dimensional laminated electronic device by arranging a 3D model of the structure based on information regarding a height direction of the structure included in the three-dimensional information; a display step of displaying the 3D model of the three-dimensional laminated electronic device on a display using a viewer capable of displaying a cross section of the 3D model of the three-dimensional laminated electronic device or a movable display of the 3D model of the structure, the plurality of structures includes a plurality of types of structures, each of the plurality of types of structures including a plurality of types of structures and electronic components made of a plurality of types of materials; The plurality of processes include a process for forming a structure made of the same type of material and a process for mounting electronic components; the same type of structure is formed by one of the plurality of processes; The second generation step generates a 3D model of the three-dimensional stacked electronic device by arranging 3D models of the plurality of types of structures generated for the plurality of processes.

Images