controller

Abstract

To suppress plastic deformation and contact failure of a pin provided on a connector, and improve the heat dissipation property of a board in a controller that connects the board on which a heating element is arranged using the connector.SOLUTION: A controller 1 includes a drive circuit board 7 on which a heating element 10 is arranged, and a control circuit board 4 having a first connector 11 arranged on the drive circuit board 7 and a second connector 12 fitted in a first direction Z. The drive circuit board 7 is arranged perpendicular to the control circuit board 4. A heat radiating member 9 fixed to each drive circuit board 7 abuts on a receiving portion 87 provided on a board holder 8 in the first direction Z, which is the connector fitting direction, either directly or via a position adjusting member 16. Therefore, a large amount of heat can be radiated from the board holder 8. In addition, since it is possible to prevent excessive insertion of the first connector 11 and the second connector 12, it is possible to suppress plastic deformation and poor contact of the pin.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a controller having a substrate on which electronic elements and connectors that generate a large amount of heat are mounted. [Background technology]

[0002] Patent Document 1 describes a controller for controlling a robot, which includes a control circuit board and a plurality of drive circuit boards connected to the control circuit board. Each drive circuit board is arranged perpendicular to the control circuit board, and a connector provided at an end of the drive circuit board is fitted to a connector arranged on the surface of the control circuit board. A power module is arranged on the board surface of each drive circuit board, and a metal heat sink is attached to cover the power module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5803213 Summary of the Invention [Problem to be solved by the invention]

[0004] Connectors that input and output many signals have a large number of pins. To avoid increasing the size of the connector, it is necessary to use connectors with a narrow pin pitch. However, connectors with a narrow pin pitch have the problem that pins can undergo plastic deformation and poor contact if the positioning accuracy is low.

[0005] In addition, since electronic elements (heat generating elements) that generate a large amount of heat, such as power modules, are arranged on the drive circuit board, heat dissipation measures are necessary. In Patent Document 1, a metal heat sink (heat dissipation member) is arranged to cover the power module arranged on the board surface, and the air blown from the fan passes along the heat sink, but there is a demand for further improvement in heat dissipation.

[0006] In view of the above problems, the object of the present invention is to suppress plastic deformation and poor contact of the pins on the connector in a controller that connects a board on which a heat-generating element is placed via a connector, while improving the dissipation of heat generated on the board. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention provides a substrate having a first substrate on which a heat generating element and a first connector are arranged, a heat dissipation member fixed to the first substrate, a second substrate having a second connector that engages with the first connector and intersects with the first substrate, a substrate holder that supports the first substrate, and a support member that supports the second substrate and the substrate holder, wherein when the engaging direction of the first connector with the second connector is defined as a first direction, the substrate holder has a receiving portion against which the heat dissipation member abuts in the first direction directly or via a position adjustment member.

[0008] According to the present invention, the first board and the second board intersect, and the board holder supporting the first board is provided with a receiving portion supporting a heat dissipation member fixed to the first board. Therefore, heat from the heat dissipation member is easily transferred to the board holder, and can also be dissipated from the board holder. This improves the dissipation of heat generated in the first board. Also, since the abutment direction between the receiving portion and the heat dissipation member coincides with the connector fitting direction (first direction) of the first board and the second board, it is possible to prevent the connector from being inserted beyond the specified dimension (over-insertion). Therefore, the plastic deformation of the pins provided in the connector is prevented. This can prevent deformation and poor contact.

[0009] In the present invention, when a direction intersecting the first direction and along the surface direction of the first substrate is defined as a second direction, and a direction intersecting the first direction and intersecting the second direction is defined as a third direction, the substrate holder preferably includes a pair of first frames extending parallel to the third direction on both sides of the first substrate in the second direction, and the receiving portion protrudes from each of the pair of first frames toward the center of the substrate holder in the second direction. In this way, the first substrate and the heat dissipation member are supported from both sides in the second direction. Therefore, the first substrate can be positioned with high accuracy, and plastic deformation and poor contact of the pins provided in the connector can be suppressed. In addition, since a plurality of receiving portions contact the heat dissipation member, heat dissipation can be improved.

[0010] In the present invention, it is preferable that the substrate holder includes a pair of sliders extending in the first direction on both sides of the first substrate in the second direction, the sliders having grooves into which the ends of the first substrate are inserted, the substrate holder includes a pair of second frames extending parallel to the third direction at positions spaced apart in the first direction from the pair of first frames, and a connecting frame connecting the pair of first frames and the pair of second frames, and the sliders are fixed to the first frames and the second frames. In this way, the substrate holder is configured by assembling the frames and sliders in a lattice shape, thereby configuring the substrate holder with a structure having many gaps. Therefore, heat can be dissipated from the gaps in the frames, thereby improving heat dissipation.

[0011] In the present invention, it is preferable to provide a conductive member fixed to the pair of second frames, the conductive member contacting the heat dissipation member from the side opposite to the receiving portion. In this way, the heat dissipation member is prevented from floating from the receiving portion due to vibration or the like, and the heat dissipation member contacts the conductive member. Therefore, the first substrate and the substrate holder can be reliably electrically connected via the heat dissipation member.

[0012] In the present invention, it is preferable that the heat dissipation member includes a flat portion facing the first substrate and the heat generating element, and a fin protruding from the flat portion in the third direction and extending in the second direction, and the receiving portion abuts against the fin. In this way, the contact area between the receiving portion and the heat dissipation member can be increased. Therefore, more heat can be transferred from the heat dissipation member to the substrate holder, and heat dissipation can be improved.

[0013] In the present invention, it is preferable that the edge portion of the first board in the first direction includes a first portion where the first connector is disposed and a second portion protruding toward the second board side beyond the first portion, and the second portion abuts against the second board before the first connector is overinserted into the second connector. In this way, overinsertion of the connector can be more reliably prevented. Therefore, plastic deformation and poor contact of the pins provided in the connector can be suppressed. Effect of the Invention

[0014] According to the present invention, the first board and the second board intersect, and the board holder supporting the first board includes a receiving portion supporting a heat dissipation member fixed to the first board. Therefore, heat from the heat dissipation member is easily transferred to the board holder, and can also be dissipated from the board holder. This improves the dissipation of heat generated in the first board. In addition, the abutment direction between the receiving portion and the heat dissipation member coincides with the connector fitting direction (first direction) of the first board and the second board, so that the connector can be prevented from being inserted beyond a specified dimension (overinsertion). This can suppress plastic deformation and poor contact of the pins provided in the connector. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2 is a plan view in which a part of a controller to which the present invention is applied is omitted. [Diagram 2] 1 is a perspective view of a board unit assembled from a drive circuit board, a heat dissipation member, and a board holder. FIG. [Diagram 3] 2 is a partial cross-sectional view of the controller of FIG. 1 (a cross-sectional view taken along the line AA of FIG. 1). [Figure 4] 3 is a cross-sectional view of the substrate unit of FIG. 2 cut in the XZ plane (a cross-sectional view cut at position BB of FIG. 2). [Diagram 5] 3 is a cross-sectional view of the substrate unit of FIG. 2 cut in the XZ plane (a cross-sectional view cut at position CC of FIG. 2). [Figure 6] 3 is a cross-sectional view of the substrate unit of FIG. 2 cut along the YZ plane (a cross-sectional view cut along the DD position of FIG. 2). [Figure 7] 2 is an exploded perspective view of a substrate holder, a drive circuit substrate, and a first heat dissipation member. FIG. [Figure 8] 4 is an exploded perspective view of a substrate holder, a drive circuit substrate, and a second heat dissipation member. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a controller to which the present invention is applied will be described below with reference to the drawings. A controller 1 of this embodiment is a device that supplies power to a robot equipped with an actuator such as a motor.

[0017] FIG. 1 is a side view of a controller 1 to which the present invention is applied, with a portion thereof omitted. FIG. 2 is a perspective view of a board unit 5 assembled from a drive circuit board 7, a heat dissipation member 9, and a board holder 8. In this specification, the three directions XYZ are mutually orthogonal. In this specification, for convenience, the first direction Z is the up-down direction of the controller 1. The Z1 direction is upward, and the Z2 direction is downward. The second direction X is the front-rear direction of the controller 1. The X1 direction is forward, and the X2 direction is backward. The third direction Y is the width direction of the controller 1. The Y1 direction and the Y2 direction are one side and the other side of the third direction Y. Note that in an actual use mode of the controller 1, the first direction Z does not have to coincide with the up-down direction (vertical direction).

[0018] (Overall composition) As shown in Fig. 1, the controller 1 includes a metal housing 2. The housing 2 is a rectangular parallelepiped, and includes a front panel 2a facing in the X1 direction, a back panel 2b facing in the X2 direction, a side panel 2c facing in the Y1 direction, a side panel 2d facing in the Y2 direction, a bottom panel 2e facing in the Z2 direction, and a top panel 2f facing in the Z1 direction (see Fig. 3). Fig. 1 is a plan view of the controller 1 with the top panel 2f of the housing 2 removed.

[0019] As shown in Fig. 1, the controller 1 includes a housing 2, a communication board unit 3, a control circuit board 4, a board unit 5, and a fan 6, which are arranged inside the housing 2. In Fig. 1, components other than those described above are not shown in the internal structure of the controller 1. The board unit 5 includes a drive circuit board 7, a board holder 8, and a heat dissipation member 9. As shown in Fig. 2, the heat dissipation member 9 is fixed to each of the multiple drive circuit boards 7, and the board unit 5 is configured by assembling them to the board holder 8.

[0020] The controller 1 supplies power to multiple actuators. The drive circuit board 7 (first board) is a board that supplies power to the actuators, and is supported by a board holder 8. As shown in FIGS. 1 and 2, the board unit 5 includes multiple drive circuit boards 7. The control circuit board 4 (second board) is connected to the drive circuit board 7 via a connector. The board holder 8 and the control circuit board 4 are fixed to the bottom plate 2e of the housing 2. Therefore, the bottom plate 2e is a support member that supports the board holder 8 and the control circuit board 4.

[0021] The communication board unit 3 is disposed at the corner where the front plate 2a and the side plate 2d intersect. On the X1 side of b, two fans 6 are lined up in the third direction Y. On the X1 side of the two fans 6, a control circuit board 4 parallel to the bottom plate 2e and four drive circuit boards 7 perpendicular to the control circuit board 4 are arranged. The drive circuit boards 7 are arranged at regular intervals in the third direction Y in a posture parallel to the XZ plane in the Z1 direction (above) of the control circuit board 4. The two fans 6 face the four control circuit boards 4 in the second direction X. Therefore, when the fans 6 are driven, air is sent into the gaps between the drive circuit boards 7, and the drive circuit boards 7 and the heat dissipation member 9 fixed to the drive circuit boards 7 are cooled.

[0022] The electronic elements mounted on the drive circuit board 7 include a heat generating element 10 (see Figures 6 and 7). The heat generating element 10 is, for example, a power module such as an IGBT module. A heat dissipation member 9 is fixed to the drive circuit board 7. The heat dissipation member 9 has a planar portion 90 facing the heat generating element 10 and the drive circuit board 7 from the Y1 side, and fins 91 protruding from the planar portion 90 in the Y1 direction (the opposite side to the heat generating element 10). The heat dissipation member 9 has a plurality of fins 91 aligned at regular intervals in the first direction Z. The multiple fins 91 extend parallel to the second direction X.

[0023] In this embodiment, the heat dissipation member 9 includes a first heat dissipation member 9A fixed to two of the four drive circuit boards 7 arranged on the Y1 side, and a second heat dissipation member 9B fixed to two of the drive circuit boards 7 arranged on the Y2 side. The second heat dissipation member 9B is configured to dissipate heat more easily than the first heat dissipation member 9A. Specifically, the second heat dissipation member 9B has a larger number of fins 91 than the first heat dissipation member 9A, and the protruding dimension of each fin 91 in the third direction Y is larger.

[0024] The heating element 10 mounted on the drive circuit board 7 is either a heating element 10A (see FIG. 6) that controls the power supplied to the normal power motor or a heating element 10B (see FIG. 7) that controls the power supplied to the high power motor. Of the four drive circuit boards 7, the two drive circuit boards 7 arranged on the Y1 side are mounted with the heating element 10A. On the other hand, the two drive circuit boards 7 arranged on the Y2 side are mounted with the heating element 10B. Therefore, since the two drive circuit boards 7 arranged on the Y2 side generate more heat than the two drive circuit boards 7 arranged on the Y1 side, a first heat dissipation member 9A is fixed to the two drive circuit boards 7 arranged on the Y1 side, and a second heat dissipation member 9B is fixed to the two drive circuit boards 7 arranged on the Y2 side.

[0025] Fig. 3 is a partial cross-sectional view of the controller 1 in Fig. 1 (a cross-sectional view cut at the position AA in Fig. 1). As shown in Fig. 3, the housing 2 has a stepped pin 2g protruding from the bottom plate 2e to the Z1 side, and the control circuit board 4 is screwed to the tip of the stepped pin 2g. The housing 2 also has stepped pins 2h protruding from the bottom plate 2e on both sides of the control circuit board 4 in the second direction X, and the board holder 8 is screwed to the tip of the stepped pin 2h. Therefore, the control circuit board 4 and the board holder 8 are supported by the bottom plate 2e.

[0026] A first connector 11 is disposed on an edge 70 on the Z2 side of the drive circuit board 7. The first connector 11 fits in the first direction Z with a second connector 12 disposed on the control circuit board 4. A third connector 13 is disposed on the edge 70 of the drive circuit board 7 on the X1 side of the first connector 11. The third connector 13 fits in the first direction Z with a fourth connector 14 disposed on the control circuit board 4. For example, the third connector 13 and the fourth connector 14 are connectors for power supply, and the first connector 11 and the second connector 12 are connectors for communication.

[0027] On the control circuit board 4, the second connectors 12 are lined up at regular intervals in the third direction, and on the X1 side of the second connectors 12, the fourth connectors 14 are lined up at regular intervals in the third direction. The arrangement intervals of the four drive circuit boards 7 are the same as the arrangement intervals of the second connectors 12 and the fourth connectors 14. Therefore, after the board holder 8 is fixed to the bottom plate 2e, when the drive circuit board 7 is inserted from the Z1 side into the groove 80a (see FIG. 6) of the slider 80 fixed to the board holder 8, the drive circuit board 7 is inserted in a direction perpendicular to the control circuit board 4. As a result, the first connector 11 fits into the second connector 12, and the third connector 13 fits into the fourth connector 14.

[0028] An edge 70 on the Z2 side of the drive circuit board 7 includes a first portion 71 where the first connector 11 is disposed, and a second portion 72 that protrudes further toward the Z2 side (i.e., the side where the control circuit board 4 is disposed) than the first portion 71. The second portion 72 has a shape provided to prevent overinsertion of the connector. The protruding dimension of the second portion 72 toward the Z2 side is set so that when the drive circuit board 7 is inserted perpendicularly into the control circuit board 4 to fit the first connector 11 into the second connector 12, the second portion 72 abuts against the control circuit board 4 before the first connector 11 is inserted into the second connector 12 by a specified dimension or more.

[0029] In this embodiment, in addition to the second portion 72 (over-insertion prevention shape) of the drive circuit board 7, the board holder 8 is also provided with a structure for preventing over-insertion of the connector. As described below, when the drive circuit board 7 is inserted into the board holder 8, before the second portion 72 abuts against the control circuit board 4, the heat dissipation member 9 fixed to the drive circuit board 7 abuts against the board holder 8 from the Z1 side directly or via a position adjustment member 16 (see FIGS. 6 and 8), thereby restricting further insertion. Therefore, as shown in the partially enlarged view of FIG. 3, a predetermined gap is formed between the tip of the second portion 72 and the control circuit board 4.

[0030] (Substrate holder) 4 and 5 are cross-sectional views of the substrate unit 5 of FIG. 2 cut along the XZ plane. FIG. 4 is a cross-sectional view cut along the BB position of FIG. 2, and FIG. 5 is a cross-sectional view cut along the CC position of FIG. 2. FIG. 6 is a cross-sectional view of the substrate unit 5 of FIG. 2 cut along the YZ plane and a cross-sectional view cut along the DD position of FIG. 2. FIG. 7 is an exploded perspective view of the substrate holder 8, the drive circuit board 7, and the first heat dissipation member 9A. FIG. 8 is an exploded perspective view of the substrate holder 8, the drive circuit board 7, and the second heat dissipation member 9B.

[0031] As shown in FIG. 2 and FIG. 4 to FIG. 8, the substrate holder 8 is configured by assembling a plurality of metal frames into a frame shape. Specifically, the substrate holder 8 includes a pair of first frames 81 extending parallel to the third direction Y, and a pair of second frames 82 extending parallel to the third direction Y on the Z1 side (upper side) of the first frames 81. The substrate holder 8 also includes a third frame 83 connected to the ends of the first frame 81 on the X1 side and the second frame 82 on the X1 side and extending in the first direction Z, and a fourth frame 84 connected to the ends of the first frame 81 on the X2 side and the second frame 82 on the X2 side and extending in the first direction Z. The ends of the third frame 83 and the fourth frame 84 in the Z2 direction are fixed to the bottom plate 2e of the housing 2.

[0032] Further, the substrate holder 8 includes a fifth frame 85 fixed to the third frame 83 and the fourth frame 84 on the Y1 side, and a sixth frame 86 fixed to the third frame 83 and the fourth frame 84 on the Y2 side. The fifth frame 85 and the sixth frame 86 are connecting frames that connect the pair of first frames 81 via the third frame 83 and the fourth frame 84, and connect the pair of second frames 82 via the third frame 83 and the fourth frame 84. As shown in FIG. 2, the fifth frame 85 includes a pair of vertical frame portions extending parallel to the first direction Z, and a horizontal frame portion that connects the Z2-side ends of the pair of vertical frame portions and extends in the second direction X. The vertical frame portions on the X1 side are fixed to the third frame 83 at two points spaced apart in the first direction Z, and the vertical frame portions on the X2 side are fixed to the fourth frame 84 at two points spaced apart in the first direction Z. The fourth frame 84 has two protrusions protruding toward the X1 side spaced apart in the first direction Z, with the Z2 side protrusion connected to the first frame 81 and the Z1 side protrusion connected to the second frame 82. The vertical frame portion of the fifth frame 85 is fixed to these two protrusions. In this way, by joining the fifth frame 85 at four points, the rigidity of the substrate holder 8 can be increased.

[0033] (Drive circuit board 7 positioning structure) Four pairs of sliders 80 facing each other in the second direction X are fixed to the substrate holder 8. The four pairs of sliders are aligned at regular intervals in the third direction Y. Each slider 80 extends in the first direction Z and has a groove 80a that opens toward the center of the substrate holder 8 in the second direction X. The upper end of each slider 80 is fixed to the second frame 82, and the lower end is fixed to the first frame 81. Both ends of the drive circuit board 7 in the second direction X are inserted from the Z1 direction into the groove 80a of the opposing slider 80.

[0034] 7 and 8, the heat dissipation member 9 is fixed to the drive circuit board 7 via a spacer 15 with a screw hole. The heat generating element 10 contacts the flat portion 90 of the heat dissipation member 9 or faces the heat generating element 10 with a small gap therebetween.

[0035] The substrate holder 8 includes a receiving portion 87 that comes into contact with the heat dissipation member 9 fixed to the drive circuit substrate 7 from the Z2 side. As shown in Fig. 4 and Fig. 5, the receiving portion 87 is bent at a substantially right angle from the Z2 direction end of each of the pair of first frames 81 and protrudes toward the center of the substrate holder 8 in the second direction X. The receiving portion 87 protruding from the first frame 81 on the X1 side to the X2 side and the receiving portion 87 protruding from the first frame 81 on the X2 side to the X1 side are disposed at positions facing each other in the second direction X.

[0036] As shown in Fig. 6, pairs of receiving portions 87 protruding to the X2 side and receiving portions 87 protruding to the X1 side are arranged at regular intervals in the third direction Y. For the two drive circuit boards 7 arranged on the Y1 side, the fins 91 of the heat dissipation member 9 fixed to the drive circuit boards 7 abut against the receiving portions 87 from the Z1 side. Similarly, for the two drive circuit boards 7 arranged on the Y2 side, the fins 91 of the second heat dissipation member 9B fixed to the drive circuit boards 7 abut against the receiving portions 87 from the Z1 side via the metallic position adjustment member 16. As a result, each drive circuit board 7 is positioned at a position where the first connector 11 and the second connector 12, and the third connector 13 and the fourth connector 14 are fitted together without being over-inserted.

[0037] 6 and 8, the position adjustment member 16 is a plate-like member extending in the third direction Y, and includes a linear contact portion 16a that contacts the second heat dissipation member 9B, and a notch portion 16b that is formed by cutting out an edge opposite to the contact portion 16a. As shown in FIGS. 7 and 8, the position adjustment member 16 is fixed to the first frame 81 such that two adjacent receiving portions 87 are disposed in the notch portion 16b and the position adjustment member 16 contacts the two adjacent receiving portions 87 from the Z1 side. The two drive circuit boards 7 disposed on the Y2 side are supported from the Z2 side by the receiving portions 87 via the second heat dissipation member 9B and the position adjustment member 16.

[0038] (Conductive material) A conductive member 17 is fixed to the substrate holder, contacting the heat dissipation member 9 from the Z1 side. As shown in Figures 2, 7 and 8, the conductive member 17 is a metal member extending in the second direction X, and includes a stepped first bent portion 18 provided at a position close to the end on the X2 side, and a second bent portion 19 formed by bending the end on the X1 side toward the Z2 side at a substantially right angle. The first bent portion 18 has a stepped shape that is bent toward the Z1 side and then bent toward the X2 side at a substantially right angle.

[0039] The X1 side end of the conductive member 17 is fixed to the second frame 82 arranged on the X1 side, and the X2 side end of the conductive member 17 is fixed to the second frame 82 arranged on the X2 side. Here, the second frame 82 arranged on the X2 side has a first plate portion 821 along the YZ plane and a second plate portion 822 bent from the Z1 side edge of the first plate portion 821 to the X2 side, and the X2 side end of the conductive member 17 is screwed to the second plate portion 822 from the Z1 side. On the other hand, the second frame 82 on the X1 side has a third plate portion 823 along the XY plane and a fourth plate portion 824 bent at a substantially right angle from the X2 side edge of the third plate portion 823 and rising to the Z1 side. The X1 side end of the conductive member 17 is It passes through a notch 825 provided on the Z1 side edge of the fourth plate portion 824 and extends toward the X1 side of the fourth plate portion 824, and the lower end of the second bent portion 19 is fixed to the third plate portion 823 by welding or the like.

[0040] By attaching the conductive member 17 to the pair of second frames from the Z1 side, the heat dissipation member 9 and the drive circuit board 7 are prevented from slipping out to the Z1 side. In addition, since the conductive member 17 has the second bent portion 19, it functions as a leaf spring and is in elastic contact with the heat dissipation member 9. Therefore, the heat dissipation member 9 is prevented from floating from the receiving portion 87 due to vibration or the like, and even if it does float, the conductive member 17 reliably contacts the heat dissipation member 9. In this embodiment, since the first heat dissipation member 9A and the second heat dissipation member 9B are provided as the heat dissipation member 9, the conductive member 17 has the first conductive member 17A that contacts the first heat dissipation member 9A from the Z1 side and the second conductive member 17B that contacts the second heat dissipation member 9B from the Z1 side. First conductive member 17A and second conductive member 17B have first bent portions 18 with different heights in first direction Z to correspond to the dimensions (heights) in first direction Z of first heat dissipation member 9A and second heat dissipation member 9B.

[0041] (Main effects of this form) As described above, in the controller 1 of this embodiment, the drive circuit board 7 intersects with the control circuit board 4, and the board holder 8 includes a plurality of receiving portions 87 that support the drive circuit board 7 via the heat dissipation members 9 (first heat dissipation member 9A, second heat dissipation member 9B) fixed to the drive circuit board 7. In this embodiment, the board holder 8 supports the drive circuit board 7 to which the first heat dissipation member 9A is fixed, and the drive circuit board 7 to which the first heat dissipation member 9A is fixed, and some of the receiving portions 87 provided on the board holder 8 abut against the first heat dissipation member 9A in the first direction Z. In addition, the other receiving portions 87 abut against the second heat dissipation member 9B in the first direction Z via the metallic position adjustment member 16.

[0042] Since the board holder 8 is made of metal, the heat of the heat dissipation member 9 is easily transferred to the board holder 8, and a large amount of heat can be dissipated not only from the heat dissipation member 9 but also from the board holder 8. Therefore, the heat generated in the drive circuit board 7 is highly dissipated. In addition, since the abutting direction of the receiving portion 87 and the heat dissipation member 9 coincides with the connector fitting direction (first direction Z) of the first connector 11 and the second connector 12, the first connector 11 and the second connector 12 can be restricted from being inserted beyond a specified dimension, and over-insertion of the first connector 11 and the second connector 12 can be prevented. Similarly, over-insertion of the third connector 13 and the fourth connector 14 can be prevented. Therefore, plastic deformation and poor contact of the pins provided in the first connector 11 and the second connector 12, and the third connector 13 and the fourth connector 14 can be suppressed.

[0043] In this embodiment, the substrate holder 8 includes a pair of first frames 81 extending parallel to the third direction Y on both sides of the drive circuit substrate 7 in the second direction X, and a receiving portion 87 protrudes from each of the pair of first frames 81 toward the center of the substrate holder 8 in the second direction X. In this manner, the drive circuit substrate 7 can be supported by the receiving portions at two locations, so that the drive circuit substrate 7 can be positioned with high precision. This makes it possible to suppress plastic deformation of the pins and poor contact. In addition, since a plurality of receiving portions 87 contact the heat dissipation member 9, heat dissipation can be improved.

[0044] In this embodiment, four drive circuit boards 7 are attached to the board holder 8. The board holder 8 can be provided with a receiving portion 87 so as to accommodate changes in the number and arrangement of the drive circuit boards 7. For example, the frame and the receiving portion 87 can be separated, and the attachment position of the receiving portion 87 can be changed according to the number and arrangement of the drive circuit boards 7.

[0045] In this embodiment, the substrate holder 8 includes a pair of second frames 82 extending parallel to the third direction Y at positions spaced apart in the first direction Z from a pair of first frames 81, and a slider 80 extending in the first direction is fixed to the first frames 81 and the second frames 82. In this way, by assembling the frames in a lattice shape to form the substrate holder 8, a substrate holder 8 having a structure with many gaps can be constructed. Therefore, heat can be dissipated through the gaps in the frame, improving heat dissipation. When assembling the board unit 5, it is sufficient to simply insert both ends of the drive circuit board 7 into the grooves 80a of the slider 80 until the heat dissipation members 9 come into contact with the receiving portions 87. This makes it easy to assemble the board unit 5 and to position the drive circuit board 7 in the first direction Z.

[0046] In this embodiment, the conductive member 17, both ends of which are fixed to the pair of second frames 82, abuts against the heat dissipation member 9 from the Z1 side (the side opposite to the receiving portion 87), preventing the heat dissipation member 9 from floating above the receiving portion 87 due to vibration or the like, and at the same time, the heat dissipation member 9 comes into contact with the conductive member 17. Therefore, electrical continuity between the drive circuit board 7 and the board holder 8 can be reliably achieved via the heat dissipation member 9.

[0047] In this embodiment, the heat dissipation member 9 includes fins 91 that protrude in the third direction Y from a flat portion 90 facing the drive circuit board 7 and extend in the second direction X, and the fins 91 abut against the receiving portion 87 from the Z1 side. Therefore, since the contact area between the receiving portion 87 and the heat dissipation member 9 is large, a lot of heat can be transferred to the board holder 8. As a result, a lot of heat can be dissipated from the board holder 8, and heat dissipation performance can be improved.

[0048] In this embodiment, the edge 70 on the Z2 side of the drive circuit board 7 includes a first portion 71 where the first connector 11 is disposed, and a second portion 72 that protrudes toward the control circuit board 4 side beyond the first portion 71, and the second portion 72 is set to a dimension that allows it to abut against the control circuit board 4 before the first connector 11 is over-inserted into the second connector 12. This makes it possible to more reliably prevent over-insertion of the connector. Note that a configuration without the second portion 72 may be adopted. [Explanation of symbols]

[0049] 1...controller, 2...housing, 2a...front panel, 2b...rear panel, 2c...side panel, 2d...side panel, 2e...bottom panel, 2f...top panel, 2g...step pin, 2h...step pin, 3...communication board unit, 4...control circuit board, 5...board unit, 6...fan, 7...drive circuit board, 8...board holder, 9...heat dissipation member, 9A...first heat dissipation member, 9B...second heat dissipation member, 10...heat generating element, 10A...first heat generating element, 10B...second heat generating element, 11...first connector, 12...second connector, 13...third connector, 14...fourth connector, 15...spacer, 16...position Adjustment member, 16a...contact portion, 16b...notch portion, 17...conductive member, 17A...first conductive member, 17B...second conductive member, 18...first bent portion, 19...second bent portion, 70...edge portion, 71...first portion, 72...second portion, 80...slider, 80a...groove, 81...first frame, 82...second frame, 83...third frame, 84...fourth frame, 85...fifth frame, 86...sixth frame, 87...receiving portion, 90...flat portion, 91...fin, 821...first plate portion, 822...second plate portion, 823...third plate portion, 824...fourth plate portion, 825...notch portion

Claims

1. a first substrate on which the heat generating element and the first connector are disposed; a heat dissipation member fixed to the first substrate; a second board including a second connector that fits into the first connector and that intersects with the first board; a substrate holder for supporting the first substrate; a support member that supports the second substrate and the substrate holder, When a mating direction of the first connector with respect to the second connector is defined as a first direction, The controller, wherein the substrate holder has a receiving portion against which the heat dissipation member directly abuts in the first direction.

2. A first substrate on which a heating element and a first connector are arranged; a heat dissipation member fixed to the first substrate; a second board including a second connector that fits into the first connector and that intersects with the first board; a substrate holder for supporting the first substrate; a support member that supports the second substrate and the substrate holder, When a mating direction of the first connector with respect to the second connector is defined as a first direction, the substrate holder includes a receiving portion against which the heat dissipation member abuts in the first direction directly or via a position adjustment member, a second direction is a direction that intersects the first direction and is aligned along a surface direction of the first substrate; When a direction intersecting the first direction and the second direction is defined as a third direction, the substrate holder includes a pair of first frames extending parallel to the third direction on both sides of the first substrate in the second direction, The controller, characterized in that the receiving portion protrudes from each of the pair of first frames toward a center of the substrate holder in the second direction.

3. a pair of sliders extending in the first direction on both sides of the first substrate in the second direction, the sliders each having a groove into which an end of the first substrate is inserted; The substrate holder includes: a pair of second frames extending parallel to the third direction at positions spaced apart from the pair of first frames in the first direction; a connecting frame that connects the pair of first frames and connects the pair of second frames, The controller of claim 2 , wherein the slider is fixed to the first frame and the second frame.

4. a conductive member fixed to the pair of second frames, The controller according to claim 3 , wherein the conductive member abuts against the heat dissipation member from an opposite side to the receiving portion.

5. the heat dissipation member includes a planar portion facing the first substrate and the heat generating element, and a fin protruding from the planar portion in the third direction and extending in the second direction, The controller according to claim 2 , wherein the receiving portion abuts against the fin.

6. A first substrate on which a heating element and a first connector are arranged; a heat dissipation member fixed to the first substrate; a second board including a second connector that fits into the first connector and that intersects with the first board; a substrate holder for supporting the first substrate; a support member that supports the second substrate and the substrate holder, When a mating direction of the first connector with respect to the second connector is defined as a first direction, the substrate holder includes a receiving portion against which the heat dissipation member abuts in the first direction directly or via a position adjustment member, an edge portion of the first substrate in the first direction includes a first portion in which the first connector is disposed and a second portion protruding toward the second substrate side beyond the first portion; The second portion abuts against the second board before the first connector is over-inserted into the second connector.

7. A direction intersecting the first direction and along a surface direction of the first substrate is a second direction, When a direction intersecting the first direction and the second direction is defined as a third direction, the substrate holder includes a pair of first frames extending parallel to the third direction on both sides of the first substrate in the second direction, The controller according to claim 6 , wherein the receiving portion protrudes from each of the pair of first frames toward a center of the substrate holder in the second direction.

8. A pair of sliders extending in the first direction on both sides of the first substrate in the second direction, the sliders having grooves into which ends of the first substrate are inserted; The substrate holder includes: a pair of second frames extending parallel to the third direction at positions spaced apart from the pair of first frames in the first direction; a connecting frame that connects the pair of first frames and connects the pair of second frames, The controller of claim 7 , wherein the slider is fixed to the first frame and the second frame.

9. A conductive member fixed to the pair of second frames, The controller according to claim 8 , wherein the conductive member abuts against the heat dissipation member from an opposite side to the receiving portion.

10. The heat dissipation member includes a planar portion facing the first substrate and the heat generating element, and a fin protruding from the planar portion in the third direction and extending in the second direction; The controller according to claim 7 , wherein the receiving portion abuts against the fin.

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