Vehicle lighting device and vehicle lamp

Abstract

To provide a vehicular illuminating device that can be made multifunctional and multipurpose, and a vehicular lighting fixture.SOLUTION: A vehicular illuminating device according to an embodiment comprises a socket, and a light emitting module provided on the side of one end part of the socket. The light emitting module comprises: a light emitting element capable of applying light having a wavelength equal to or shorter than that of visible light; and at least one of a first element capable of applying infrared rays, and a second element capable of applying ultrasonic waves.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] An embodiment of the present invention relates to a vehicle lighting device and a vehicle lamp. [Background technology]

[0002] 2. Description of the Related Art From the standpoint of energy saving and life extension, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming more and more popular instead of vehicle lighting devices equipped with filaments. In this case, the vehicle lighting device equipped with the light-emitting element follows the functions and uses of the vehicle lighting device equipped with the filament. Therefore, in recent years, there has been a demand for adding new functions and uses to vehicle lighting devices equipped with light-emitting elements to make them multifunctional and multipurpose. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-247061 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a vehicle lighting device and a vehicle lamp that can be made multifunctional and multipurpose. [Means for solving the problem]

[0005] A vehicle lighting device according to an embodiment includes a socket and a light emitting module provided on one end side of the socket. The light emitting module includes a light emitting element capable of emitting light having a wavelength equal to or less than that of visible light. super Able to emit sound waves Basic child and ; has. When the light emitting element emits ultraviolet light, a phosphor is provided for converting the ultraviolet light into visible light. Effect of the Invention

[0006] According to the embodiments of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can be made multifunctional and multipurpose. [Brief description of the drawings]

[0007] [Figure 1] 1 is a schematic perspective view illustrating a vehicle lighting device according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the vehicle lighting device taken along line AA in FIG. 1. [Diagram 3] FIG. 2 is a schematic plan view of a light-emitting module. [Figure 4] 1A is a circuit diagram illustrating a case where a light-emitting element and a first element are provided in one circuit, and FIG. 1B is a circuit diagram illustrating a case where a light-emitting element and a first element are provided in separate circuits. [Diagram 5] 11 is a schematic plan view illustrating a light-emitting module using a second element. FIG. [Figure 6] 1A is a circuit diagram illustrating a case where a light-emitting element and a second element are provided in one circuit, and FIG. 1B is a circuit diagram illustrating a case where a light-emitting element and a second element are provided in separate circuits. [Figure 7] 1 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

[0009] (Vehicle lighting device) The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railcar. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0010] FIG. 1 is a schematic perspective view illustrating a vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG. FIG. 3 is a schematic plan view of the light-emitting module 20. As shown in FIG. As shown in FIGS. 1 and 2, a vehicle lighting device 1 may be provided with, for example, a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40.

[0011] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 may be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has a recess 11a that opens to the end face opposite to the flange 13 side.

[0012] The bayonet 12 is provided on the outer surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 are provided. The bayonet 12 can be used when mounting the vehicle lighting device 1 to the housing 101 of the vehicle lamp 100. The bayonet 12 can be used for a twist lock.

[0013] The flange 13 has a plate shape. The flange 13 has, for example, a disk shape. An outer surface of the flange 13 is located outward of the vehicle lighting device 1 with respect to an outer surface of the bayonet 12.

[0014] The heat dissipating fin 14 is provided on the side of the flange 13 opposite to the mounting portion 11. At least one heat dissipating fin 14 can be provided. The socket 10 illustrated in Figs. 1 and 2 is provided with a plurality of heat dissipating fins. The plurality of heat dissipating fins 14 can be arranged side by side in a predetermined direction. The heat dissipating fin 14 has, for example, a plate shape.

[0015] The connector holder 15 is provided on the side of the flange 13 opposite to the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 can be provided in the vicinity of the periphery of the flange 13. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a therein can be inserted therein.

[0016] The socket 10 has a function of holding the light-emitting module 20 and the power supply unit 30, and a function of transmitting heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably formed from a material with high thermal conductivity. For example, the socket 10 can be formed from a metal such as an aluminum alloy. In recent years, it is desired that the socket 10 can efficiently dissipate heat generated in the light-emitting module 20 and is lightweight. Therefore, the socket 10 is formed from, for example, a highly thermally conductive resin. The highly thermally conductive resin includes, for example, a resin and a filler using an inorganic material. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon, aluminum oxide, or the like.

[0017] If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 molded integrally, the heat generated in the light-emitting module 20 can be efficiently dissipated. In addition, the weight of the socket 10 can be reduced. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be molded integrally using a method such as injection molding. Also, the socket 10 and the power supply portion 30 can be molded integrally using a method such as insert molding.

[0018] The light emitting module 20 is provided on one end side of the socket 10 . As shown in FIGS. 1 and 3, the light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, an element 25, and a first element 26. The substrate 21 can be bonded onto the heat transfer section 40, for example. In this case, the adhesive is preferably an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The inorganic material is preferably a material with high thermal conductivity (for example, ceramics such as aluminum oxide or aluminum nitride). The thermal conductivity of the adhesive can be, for example, 0.5 W / (m·K) or more and 10 W / (m·K) or less.

[0019] The substrate 21 has a plate shape. The planar shape of the substrate 21 is, for example, a rectangle. The substrate 21 can be formed of, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is covered with an insulating material. When the light emitting element 22 generates a large amount of heat, it is preferable to form the substrate 21 using a material with high thermal conductivity from the viewpoint of heat dissipation. Examples of materials with high thermal conductivity include ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resin, and a metal core substrate. The substrate 21 may have a single-layer structure or a multi-layer structure.

[0020] Moreover, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a can be formed from, for example, a material containing silver as a main component or a material containing copper as a main component.

[0021] In addition, a covering portion may be provided to cover the wiring pattern 21a, a film resistor described later, etc. The covering portion may include, for example, a glass material.

[0022] The light emitting element 22 emits light having a wavelength equal to or shorter than that of visible light. The wavelength of visible light is, for example, 360 nm or more and 830 nm or less. For example, the light emitting element 22 may be a light emitting element that emits ultraviolet light or a light emitting element that emits visible light such as red light.

[0023] The light emitting element 22 is provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The light emitting element 22 is electrically connected to the wiring pattern 21a. At least one light emitting element 22 can be provided. When a plurality of light emitting elements 22 are provided, the plurality of light emitting elements 22 can be connected in series with each other. The light emitting elements 22 may be, for example, light emitting diodes, organic light emitting diodes, laser diodes, or the like.

[0024] The light emitting element 22 may be, for example, a chip-shaped light emitting element. The chip-shaped light emitting element 22 may be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-shaped light emitting element 22 may be, for example, an upper electrode type light emitting element, an upper and lower electrode type light emitting element, a flip chip type light emitting element, etc. The light emitting element 22 illustrated in Figs. 1 to 3 is an upper and lower electrode type light emitting element. An electrode of the upper electrode type light emitting element or an upper electrode of the upper and lower electrode type light emitting element may be electrically connected to the wiring pattern 21a by the wiring 21b. In this case, the wiring 21b may be connected by, for example, a wire bonding method. The flip chip type light emitting element 22 may be directly mounted on the wiring pattern 21a.

[0025] The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those exemplified above, and can be changed as appropriate depending on the size, use, etc. of the vehicle lighting device 1.

[0026] In addition, although the above describes an example in which the light-emitting element 22 is a chip-shaped light-emitting element, the light-emitting element 22 may be a surface-mount type light-emitting element such as a PLCC (Plastic Leaded Chip Carrier) type light-emitting element or a light-emitting element having a lead wire such as a bullet type light-emitting element. In the case of a surface-mount type light-emitting element or a light-emitting element having a lead wire, the frame portion 23 and the sealing portion 24 described later can be omitted.

[0027] However, if the light emitting elements 22 are chip-shaped, it is possible to provide many light emitting elements 22 in a small area, which allows the light emitting module 20 to be miniaturized, and therefore the vehicle lighting device 1 to be miniaturized.

[0028] The frame portion 23 is provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer portion 40 side). The frame portion 23 has a frame shape and is provided on the substrate 21 via an adhesive layer 27. The frame portion 23 surrounds the light emitting element 22. The frame portion 23 can be made of resin. The resin can be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

[0029] Frame 23 can have a function of defining the formation range of sealing portion 24 and a function of a reflector. Therefore, frame 23 can contain titanium oxide particles or the like or a white resin in order to improve reflectance.

[0030] The sealing portion 24 can be provided inside the frame portion 23. The sealing portion 24 can be provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 can be provided so as to cover the light-emitting element 22. The sealing portion 24 can contain a resin having light-transmitting properties. The sealing portion 24 can be formed, for example, by filling the inside of the frame portion 23 with a resin. The filling of the resin can be performed using, for example, a dispenser. The resin to be filled can be, for example, a silicone resin.

[0031] For example, when the light-emitting element 22 is a light-emitting element that irradiates ultraviolet light, a phosphor can be included in the sealing portion 24. If the sealing portion 24 contains a phosphor, the ultraviolet light irradiated from the light-emitting element 22 can be converted into visible light by the phosphor. The phosphor can be, for example, a YAG phosphor (yttrium-aluminum-garnet phosphor). However, the type of phosphor can be appropriately changed so as to obtain a predetermined emission color depending on the application of the vehicle lighting device 1, etc.

[0032] In addition, an optical element can be provided on the sealing portion 24 as necessary. The optical element can be, for example, a convex lens. The optical element, which is a convex lens, collects light so that a predetermined light distribution characteristic can be obtained. Note that the optical element is not limited to a convex lens, and may be, for example, a concave lens.

[0033] The element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The element 25 is provided, for example, on the periphery of the frame portion 23 and electrically connected to the wiring pattern 21a. At least one element 25 can be provided.

[0034] The element 25 may be, for example, a resistor 25a, a control element 25b, a capacitor 25c, and a pull-down resistor 25d. However, the type of element 25 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the above-mentioned ones, the element 25 may be a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor such as a FET or a bipolar transistor, an integrated circuit, a computing element, and the like.

[0035] The resistor 25a can be provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The resistor 25a is electrically connected to the wiring pattern 21a. The resistor 25a can be, for example, a surface mount resistor, a resistor having leads (metal oxide film resistor), or a film resistor formed by using a screen printing method or the like. The resistor 25a illustrated in Figs. 1 and 3 is a film resistor.

[0036] The material of the film resistor is, for example, ruthenium oxide (RuO2). The film resistor is formed, for example, by using a screen printing method and a baking method. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, so that the heat dissipation can be improved. In addition, a plurality of resistors 25a can be formed at once. Therefore, the productivity can be improved. In addition, the variation in the resistance value of the plurality of resistors 25a can be suppressed.

[0037] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the voltage applied between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is controlled to be within a predetermined range by the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

[0038] When the resistor 25a is a surface mount resistor or a resistor with leads, the resistor 25a is selected to have an appropriate resistance value according to the forward voltage characteristics of the light emitting element 22. When the resistor 25a is a film resistor, the resistance value can be increased by removing a part of the resistor 25a. For example, a part of the film resistor can be easily removed by irradiating the film resistor with laser light. The number and size of the resistors 25a are not limited to those exemplified, and can be appropriately changed according to the number and specifications of the light emitting elements 22.

[0039] The control element 25b can be provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The control element 25b is electrically connected to the wiring pattern 21a. The control element 25b can be provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from being applied to the light-emitting element 22 from the reverse direction. The control element 25b is, for example, a surface-mounted diode or a diode having a lead wire. The control element 25b illustrated in FIG. 1 and FIG. 3 is a surface-mounted diode.

[0040] The capacitor 25c can be provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The capacitor 25c is electrically connected to the wiring pattern 21a. The capacitor 25c can be provided, for example, to reduce noise or smooth out voltage. The capacitor 25c is, for example, a chip capacitor, a surface mount capacitor, or a capacitor having leads. The capacitor 25c illustrated in FIG. 3 is a surface mount capacitor.

[0041] The pull-down resistor 25d can be provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The pull-down resistor 25d is electrically connected to the wiring pattern 21a. The pull-down resistor 25d can be provided, for example, to detect continuity of the light-emitting element 22, prevent erroneous lighting, etc. The pull-down resistor 25d is, for example, a surface-mount resistor, a resistor having leads, or a chip resistor. The pull-down resistor 25d illustrated in FIG. 1 and FIG. 3 is a surface-mount resistor.

[0042] The first element 26 is provided to provide the vehicle lighting device 1 with multiple functions and multiple purposes. A typical vehicle lighting device has a function of emitting visible light and is used for applications that use visible light. Therefore, the first element 26 is provided separately from the light-emitting element 22 to add new functions and applications to the vehicle lighting device 1.

[0043] The first element 26 may be, for example, a light-emitting element that radiates infrared light. The first element 26 may be, for example, a light-emitting diode that radiates infrared light, or a laser diode that radiates infrared light.

[0044] The first element 26 is provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The first element 26 can be provided on at least one of the inside and outside of the frame section 23. The first element 26 is electrically connected to the wiring pattern 21a. At least one first element 26 can be provided. When a plurality of first elements 26 are provided, the plurality of first elements 26 can be connected in series with each other.

[0045] The first element 26 may be a surface-mount type first element 26, may be a bullet-type first element 26 having a lead wire, or may be a chip-type first element 26. The electrical connection between the chip-type first element 26 and the wiring pattern 21a may be the same as that of the light-emitting element 22 described above.

[0046] When the first element 26 is provided inside the frame portion 23, the first element 26 may be a chip-shaped first element 26. When the first element 26 is provided inside the frame portion 23, the light-emitting module 20 can be made smaller, and therefore the vehicle lighting device 1 can be made smaller.

[0047] When the first element 26 is provided outside the frame 23, the first element 26 may be any of a surface-mounted first element 26, a first element 26 having a lead wire, and a chip-shaped first element 26. If the first element 26 is provided outside the frame 23, the number of the first elements 26 can be increased, or a first element 26 having a large light-emitting surface can be provided. Therefore, the functions and applications can be further expanded. In addition, when the chip-shaped first element 26 is provided outside the frame 23, the chip-shaped first element 26 can be covered with a translucent resin, similar to the above-mentioned sealing part 24. The first element 26 illustrated in FIG. 1 and FIG. 3 is a surface-mounted element provided outside the frame 23.

[0048] Also, a resistor 26a may be provided that is connected in series to the first element 26. The resistor 26a may be a current limiting resistor that prevents an excessive current from flowing through the first element 26. The resistor 26a may be, for example, a surface mount resistor, a resistor having leads (metal oxide film resistor), or a film resistor formed using a screen printing method or the like. The resistor 26a illustrated in Figs. 1 and 3 is a film resistor.

[0049] FIG. 4(a) is a circuit diagram illustrating a case where the light emitting element 22 and the first element 26 are provided in one circuit. FIG. 4(b) is a circuit diagram illustrating a case where the light emitting element 22 and the first element 26 are provided in separate circuits. 4(a) and 4(b) show a case where one light emitting element 22 and one first element 26 are provided, and the element 25 and resistor 26a are omitted.

[0050] 4(a), when the light-emitting element 22 and the first element 26 are provided in one circuit, the light-emitting element 22 and the first element 26 can be connected in series. In this way, the light-emitting element 22 and the first element 26 can be lit by one lighting circuit. This makes it possible to reduce manufacturing costs.

[0051] 4(b), if the light-emitting element 22 and the first element 26 are provided in separate circuits, the first element 26 can be turned on even when the light-emitting element 22 is turned off. This allows for further expansion of functions and applications.

[0052] Next, the function and effect of the first element 26 will be described. In recent years, vehicles are equipped with around monitors, in-vehicle cameras, rear monitors, side monitors, etc. These monitors and cameras are equipped with an imaging device that receives infrared rays and an irradiation device that emits infrared rays. In general, infrared rays irradiated from the irradiation device provided on the monitor or camera and reflected by an object are received by the imaging device and converted into an optical image. In this case, if the amount of infrared light reflected by the object is increased, a clearer optical image can be obtained.

[0053] Since the vehicle lighting device 1 according to the present embodiment is provided with the first element 26, it is possible to increase the amount of infrared light irradiated onto an object. As a result, it is possible to increase the amount of infrared light reflected by the object, making it possible to obtain a clearer optical image.

[0054] In addition, since infrared rays are invisible, people inside and outside the vehicle do not feel uncomfortable even if infrared rays are emitted from the vehicle lighting device 1. Furthermore, the functionality of visible light emitted from the vehicle lighting device 1 is not impaired.

[0055] In recent years, vehicles may be provided with vibration sensors or the like as a crime prevention measure. Therefore, when the vibration sensor or the like is turned on, infrared rays can be emitted from the vehicle lighting device 1. In this way, an optical image can be captured more clearly when an abnormal situation occurs. In addition, when the vibration sensor or the like is turned on, visible light and infrared rays can be emitted from the vehicle lighting device 1. In this way, a clear optical image can be obtained by the irradiated infrared rays, and a warning can be issued by the irradiated visible light.

[0056] Next, returning to FIG. 1 and FIG. 2, the power supply unit 30 and the heat transfer unit 40 will be described. The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 . The power supply terminals 31 may be rod-shaped. The power supply terminals 31 may be arranged in a predetermined direction. One end of each of the power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the power supply terminals 31 is soldered to the wiring pattern 21a. The other end of each of the power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted to the power supply terminals 31 exposed inside the hole of the connector holder 15. The power supply terminals 31 are formed of a metal such as a copper alloy. The shape, arrangement, material, number, etc. of the power supply terminals 31 are not limited to those exemplified, and may be changed as appropriate.

[0057] As described above, it is preferable that the socket 10 is made of a material having high thermal conductivity. However, materials having high thermal conductivity may have electrical conductivity. For example, metals such as aluminum alloys and highly thermally conductive resins containing a filler made of carbon have electrical conductivity. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the socket 10 having electrical conductivity. The holding portion 32 also has a function of holding the multiple power supply terminals 31. When the socket 10 is made of a highly thermally conductive resin having electrical insulation (for example, a highly thermally conductive resin containing a filler made of aluminum oxide), the holding portion 32 can be omitted. In this case, the socket 10 holds the multiple power supply terminals 31. The holding portion 32 can be formed of a resin having electrical insulation. The holding portion 32 can be, for example, pressed into a hole 10a provided in the socket 10 or bonded to the inner wall of the hole 10a.

[0058] The heat transfer section 40 is provided between the socket 10 and the light emitting module 20 (substrate 21). The heat transfer section 40 has, for example, a plate shape. 2, the heat transfer section 40 can be embedded in the bottom surface 11a1 of the recess 11a by insert molding. The heat transfer section 40 can also be attached to the inside of the recess that opens to the bottom surface 11a1 of the recess 11a by using an adhesive with high thermal conductivity or by using a layer of thermally conductive grease (heat dissipating grease).

[0059] The heat transfer unit 40 can be attached to the bottom surface 11a1 of the recess 11a using, for example, an adhesive with high thermal conductivity. The heat transfer unit 40 can also be attached to the bottom surface 11a1 of the recess 11a via a layer of thermally conductive grease.

[0060] The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, the heat transfer section 40 is made of a material with high thermal conductivity. The heat transfer section 40 can be made of a metal such as an aluminum alloy, for example. In addition, if the socket 10 is made of a metal such as an aluminum alloy, or if the amount of heat generated in the light-emitting module 20 is small, the heat transfer section 40 can be omitted.

[0061] Next, the second element 126 will be described. The second element 126 is provided to provide the vehicle lighting device 1 with multiple functions and multiple purposes. A typical vehicle lighting device has a function of emitting visible light and is used for applications that use visible light. Therefore, the second element 126 is provided separately from the light-emitting element 22 to add new functions and applications to the vehicle lighting device 1.

[0062] FIG. 5 is a schematic plan view illustrating a light emitting module using the second element 126. As shown in FIG. The second element 126 may be an element that irradiates ultrasonic waves. The second element 126 may be, for example, an ultrasonic sensor. The frequency of the ultrasonic waves may be, for example, 40 kHz or more and 200 kHz or less.

[0063] The second element 126 is provided on the side of the substrate 21 opposite to the socket 10 side (the heat transfer section 40 side). The second element 126 can be provided outside the frame section 23. The second element 126 is electrically connected to the wiring pattern 21a. At least one second element 126 can be provided.

[0064] FIG. 6(a) is a circuit diagram illustrating a case where the light emitting element 22 and the second element 126 are provided in one circuit. FIG. 6(b) is a circuit diagram illustrating a case where the light emitting element 22 and the second element 126 are provided in separate circuits. 6(a) and 6(b) show a case where one light emitting element 22 and one second element 126 are provided, and the element 25 is omitted.

[0065] 6(a), when the light emitting element 22 and the second element 126 are provided in one circuit, the light emitting element 22 and the second element 126 can be connected in series. In this way, the light emitting element 22 can be lit and the second element 126 can be operated by one lighting circuit. This can reduce manufacturing costs.

[0066] 6(b), if the light emitting element 22 and the second element 126 are provided in separate circuits, the second element 126 can be operated even when the light emitting element 22 is turned off. This allows for further expansion of functions and applications.

[0067] Next, the function and effect of the second element 126 will be described. As described above, the vehicle is provided with an around monitor, an in-vehicle camera, a back monitor, a side monitor, etc. Therefore, it is possible to capture an optical image of an object using these monitors and cameras, and to detect the distance to the object using the second element 126. Therefore, it is possible to grasp the object in more detail.

[0068] In addition, since ultrasonic waves are inaudible, people inside and outside the vehicle do not feel uncomfortable even if ultrasonic waves are emitted from the vehicle lighting device 1. In addition, the function of visible light emitted from the vehicle lighting device 1 is not impaired.

[0069] As described above, a vehicle may be provided with a vibration sensor or the like as a crime prevention measure. Therefore, when the vibration sensor or the like is turned on, ultrasonic waves can be emitted from the vehicle lighting device 1. In this way, when an abnormality occurs, the optical image and the distance to the object can be known. Therefore, it is possible to grasp the abnormality in more detail.

[0070] In the above, the cases where the first element 26 and the light-emitting element 22 are provided and the case where the second element 126 and the light-emitting element 22 are provided have been exemplified, but the first element 26, the second element 126, and the light-emitting element 22 may be provided. That is, at least one of the first element 26 and the second element 126 and the light-emitting element 22 may be provided. For example, the light emitting module 20 may include a first circuit in which the light emitting element 22 and the first element 26 and / or the second element 126 are provided. For example, the light emitting module 20 can have a second circuit in which the light emitting element 22 is provided, and a third circuit in which at least one of the first element 26 and the second element 126 is provided.

[0071] (Vehicle lighting fixtures) Next, the vehicle lamp 100 will be illustrated. In the following, as an example, a case where the vehicular lamp 100 is a front combination light installed in an automobile will be described. However, the vehicular lamp 100 is not limited to a front combination light installed in an automobile. The vehicular lamp 100 may be any vehicular lamp that is installed in an automobile, a railroad car, or the like.

[0072] FIG. 7 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 7, a vehicle lamp 100 includes, for example, a vehicle lighting device 1, a housing 101, a cover 102, an optical element section 103, a seal member 104, and a connector 105.

[0073] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end side open. The housing 101 can be formed from, for example, a resin that does not transmit light. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided in the housing 101.

[0074] When mounting the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting part 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, the bayonet 12 is held in the fitting portion provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.

[0075] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 can be formed from a light-transmitting resin or the like. The cover 102 can also have a function such as a lens. The cover 102 can transmit visible light and infrared light emitted from the light-emitting module 20. In addition, the cover 102 can also be provided with a hole or the like for transmitting the ultrasonic wave emitted from the second element 126.

[0076] Visible light emitted from the light-emitting module 20 is mainly incident on the optical element unit 103. The optical element unit 103 reflects, diffuses, guides, and collects the visible light emitted from the light-emitting module 20, and forms a predetermined light distribution pattern. For example, the optical element unit 103 illustrated in Fig. 7 is a reflector. In this case, the optical element unit 103 reflects the visible light emitted from the light-emitting module 20 so that a predetermined light distribution pattern is formed.

[0077] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 may be annular. The seal member 104 may be made of an elastic material such as rubber or silicone resin.

[0078] The connector 105 is fitted to ends of the multiple power supply terminals 31 exposed inside the connector holder 15. The connector 105 is electrically connected to a power source or the like. The connector 105 is also provided with an annular seal member 105a. When the connector 105 is inserted into the connector holder 15, the seal member 105a seals the inside of the connector holder 15 watertightly.

[0079] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other. [Explanation of symbols]

[0080] REFERENCE SIGNS LIST 1 vehicle lighting device, 10 socket, 11 mounting portion, 20 light emitting module, 21 substrate, 22 light emitting element, 26 first element, 100 vehicle lamp, 101 housing, second 126 element

Claims

1. A socket; A light emitting module provided on one end side of the socket; Equipped with The light emitting module includes: A light-emitting element capable of emitting light having a wavelength equal to or shorter than that of visible light; An element capable of emitting ultrasonic waves; having When the light emitting element irradiates ultraviolet light, a fluorescent material is provided for converting the ultraviolet light into visible light.

2. The vehicle lighting device according to claim 1 , wherein the light-emitting module includes a first circuit provided with the light-emitting element and the element capable of emitting ultrasonic waves.

3. The vehicle lighting device according to claim 1 , wherein the light-emitting module includes a second circuit provided with the light-emitting element, and a third circuit provided with the element capable of emitting ultrasonic waves.

4. A vehicle lighting device according to any one of claims 1 to 3; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with:

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