Electronic device having a display structure including a dielectric layer - Patents.com

Abstract

An electronic device is provided having a display structure that includes a dielectric layer. [Solution] The display structure of the present invention comprises a cover glass forming an outer surface of the display structure, a display panel disposed under the cover glass, a first dielectric layer disposed under the display panel having a first edge at least partially formed outside the edge of the display panel, a second dielectric layer disposed on a first surface of the first dielectric layer adjacent to the display panel, and a third dielectric layer disposed on a second surface facing in an opposite direction to the first surface of the first dielectric layer, wherein a second edge of the second dielectric layer and a third edge of the third dielectric layer corresponding to the first edge of the first dielectric layer are formed inside the first edge, the first dielectric layer has a first dielectric constant, and the second dielectric layer and the third dielectric layer have dielectric constants greater than the first dielectric constant.

Description

[Technical field]

[0001] The present invention relates to electronic devices having display structures that include dielectric layers. [Background technology]

[0002] As the processing performance of electronic devices such as smartphones increases dramatically, larger displays are preferred to effectively provide various functions. At the same time, there is still a demand for miniaturization of electronic devices to improve portability. To meet this demand, foldable electronic devices are available on the market. Foldable electronic devices that can be folded and unfolded around a connecting part provide users with portability and convenience.

[0003] Meanwhile, with the development of mobile communication technology, electronic devices including antennas have become widespread, and the antennas can be used to transmit and / or receive RF (radio frequency) signals including audio signals or data (e.g., messages, photos, videos, music files, or games).

[0004] In addition, efforts are being made to increase the rigidity of electronic devices and to enhance and slim down their design aspects to satisfy consumer purchasing desires. As part of such efforts, electronic devices are utilized as at least one antenna device for communication of the electronic device by powering at least a portion of the housing of the electronic device.

[0005] A foldable electronic device that utilizes at least a portion of a frame or housing as an antenna radiator includes a metal layer for ensuring the rigidity of a flexible display and protecting the display structure. However, since such a metal layer accounts for more than 50% of the weight of the display structure, there is a demand for reducing the weight of the electronic device by changing the material of the metal layer to a lightweight material.

[0006] However, when such a lightweight material is used to form a metal layer, the lightweight material has a high dielectric constant, and forming a layer made of a material with a high dielectric constant at the outermost edge of the display structure may degrade the radiation performance of the antenna adjacent to such a layer. Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention has been made in consideration of the above-mentioned conventional problems, and an object of the present invention is to provide an electronic device having a display structure including a dielectric layer that can maintain antenna performance while containing a lightweight material. [Means for solving the problem]

[0008] In order to achieve the above object, an electronic device according to one aspect of the present invention includes a housing including a first side member forming a first side of the electronic device, a second side member forming a second side corresponding to the first side, and a hinge connecting the first side member and the second side member, the housing being switchable between a folded state and an unfolded state about the hinge, a rear cover forming a rear side of the electronic device, a wireless communication circuit disposed inside the housing and configured to transmit and receive signals of a predetermined frequency by supplying power to at least a portion of the housing, and a display structure coupled to the housing, the display structure including a cover glass forming at least a portion of a front surface of the electronic device. a first dielectric layer disposed under the display panel, the first edge being spaced a first distance from the first side; a second dielectric layer disposed on a first surface of the first dielectric layer adjacent to the display panel; and a third dielectric layer disposed on a second surface of the first dielectric layer adjacent to the rear cover, wherein a second edge of the second dielectric layer and a third edge of the third dielectric layer corresponding to the first edge of the first dielectric layer are spaced a second distance from the first side that is greater than the first distance, the first dielectric layer having a first dielectric constant, and the second dielectric layer and the third dielectric layer having dielectric constants greater than the first dielectric constant.

[0009] A display structure according to one embodiment comprises a cover glass forming an outer surface of the display structure, a display panel disposed under the cover glass, a first dielectric layer disposed under the display panel having a first edge at least partially formed outside an edge of the display panel, a second dielectric layer disposed on a first surface of the first dielectric layer adjacent to the display panel, and a third dielectric layer disposed on a second surface facing in a direction opposite to the first surface of the first dielectric layer, wherein a second edge of the second dielectric layer and a third edge of the third dielectric layer corresponding to the first edge of the first dielectric layer are formed inside the first edge, the first dielectric layer has a first dielectric constant, and the second dielectric layer and the third dielectric layer have dielectric constants greater than the first dielectric constant.

[0010] and a display structure coupled to the housing, the display structure including: a cover glass coupled to the housing and forming at least a portion of a front surface of the electronic device; a display panel disposed adjacent to one surface of the cover glass; and a first layer including a first region having a first edge at least a portion of which is formed outside an edge of the display panel and at least a portion of which is formed inward from the first edge and a second region extending outward from the first region to form the first edge, the first region having a first dielectric constant and the second region having a second dielectric constant smaller than the first dielectric constant. Effect of the Invention

[0011] According to the present invention, it is possible to improve (or reduce) the degradation of antenna performance caused by the application of a lightweight material to the metal layer, and also to reduce damage or deformation to the display structure by applying a lightweight material to the metal layer and forming a laminated structure.

[0012] In addition, various advantages are provided that are directly or indirectly grasped by this specification, and specific embodiments or other aspects, configurations, and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the drawings. [Brief description of the drawings]

[0013] [Figure 1] 1 is a block diagram of an electronic device in a network environment in accordance with various embodiments. [Figure 2A] FIG. 2 illustrates an electronic device in an unfolded state according to one embodiment. [Figure 2B] FIG. 1 illustrates an electronic device in a folded state according to one embodiment. [Diagram 3] FIG. 2B shows a cross-sectional view of the display taken along the B axis of FIG. 2A and a dielectric layer structure according to one embodiment. [Figure 4A] FIG. 4 illustrates a portion of a cross-sectional view of the display of FIG. 3 according to one embodiment. [Figure 4B] 4 shows a portion of a cross-sectional view of the display of FIG. 3 according to another embodiment. [Figure 5A] 13 illustrates an edge of a dielectric layer structure formed in an area corresponding to at least a portion of a housing according to one embodiment. [Figure 5B] FIG. 2 illustrates a display structure viewed perpendicular to the front of an electronic device according to one embodiment. [Figure 6A] 1 illustrates a dielectric layer structure formed of different materials in different regions according to an embodiment; [Figure 6B] 1 illustrates a cross-section of a display structure and an electronic device mounted to a bracket according to one embodiment. [Figure 7] FIG. 6C illustrates a cross-sectional view of the display structure taken along the C-axis of FIG. 6B and a dielectric layer structure according to one embodiment. [Figure 8] FIG. 2 illustrates a first state of an electronic device according to another embodiment. [Figure 9] FIG. 2 illustrates a second state of an electronic device according to another embodiment. [Figure 10] FIG. 11 is an exploded perspective view of an electronic device according to another embodiment. [Figure 11] FIG. 13 shows a cross-sectional view of a display and a dielectric layer structure according to another embodiment. [Figure 12] FIG. 13 shows a cross-sectional view of a display and a dielectric layer structure according to yet another embodiment. [Figure 13A] 2A and 2B are diagrams illustrating a dielectric layer structure formed in areas corresponding to corners of a display according to one embodiment. [Figure 13B] 4A and 4B are diagrams illustrating a dielectric layer structure formed in an area corresponding to a portion of a display according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific examples of the embodiments of the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same or similar reference numerals will be used to refer to the same or similar components.

[0015] However, it should be understood that this is not intended to limit the invention to the particular embodiments, but includes various modifications, equivalents, and / or alternatives to the embodiments of the invention.

[0016] FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 in accordance with various embodiments.

[0017] 1, in a network environment 100, an electronic device 101 communicates with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). In one embodiment, the electronic device 101 communicates with the electronic device 104 via the server 108. In this embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a haptics module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identity module 196, and an antenna module 197. In some embodiments, the electronic device 101 omits at least one of these components (e.g., a connection terminal 178) or adds one or more other components. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160).

[0018] The processor 120 executes software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120 and performs various data processing or calculations. In one embodiment, as at least a part of the data processing or calculations, the processor 120 stores instructions or data received from other components (e.g., sensor module 176 or communication module 190) in the volatile memory 132, processes the instructions or data stored in the volatile memory 132, and stores the result data in the non-volatile memory 134. In one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or in conjunction with the main processor 121. For example, if electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for certain functions. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0019] The auxiliary processor 123 controls at least a part of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), for example on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) is implemented as part of another functionally related component (e.g., the camera module 180 or the communication module 190). In one embodiment, the auxiliary processor 123 (e.g., a neural processing unit) includes a hardware structure specialized for processing the artificial intelligence model. The artificial intelligence model is generated by machine learning. Such learning is performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or by a separate server (e.g., the server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be one of, but is not limited to, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRRDNN), a deep Q-network, or a combination of two or more of the above.The artificial intelligence model may include a software structure in addition to or instead of a hardware structure.

[0020] The memory 130 stores a variety of data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The data includes, for example, input data or output data for software (e.g., the program 140) and its associated instructions. The memory 130 includes a volatile memory 132 and a non-volatile memory 134.

[0021] Programs 140 are stored as software in memory 130 and include, for example, an operating system 142 , middleware 144 , and applications 146 .

[0022] The input module 150 receives instructions or data from outside (e.g., a user) of the electronic device 101 for use by components (e.g., the processor 120) of the electronic device 101. The input module 150 includes, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0023] The audio output module 155 outputs audio signals outside the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording playback. The receiver is used to receive incoming phone calls. In one embodiment, the receiver is embodied as a separate or part of the speaker.

[0024] The display module 160 visually presents information to an external (e.g., user) of the electronic device 101. The display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling the device. In one embodiment, the display module 160 includes a touch sensor configured to sense a touch or a pressure sensor configured to measure the strength of a force generated by a touch.

[0025] Audio module 170 converts sound into electrical signals or vice versa. In one embodiment, audio module 170 captures sound via input module 150 or outputs sound via audio output module 155 or an external electronic device (e.g., electronic device 102) connected directly or wirelessly to electronic device 101 (e.g., speakers or headphones).

[0026] The sensor module 176 senses an operating state (e.g., power or temperature) of the electronic device 101 or an external environmental state (e.g., a user state) and generates an electrical signal or data value corresponding to the sensed state. In one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] The interface 177 supports one or more predefined protocols that are used for the electronic device 101 to directly or wirelessly connect to an external electronic device (e.g., the electronic device 102). In one embodiment, the interface 177 includes, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0028] The connection terminal 178 includes a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). In one embodiment, the connection terminal 178 includes, for example, an HDMI (registered trademark) connector, a USB connector, an SD card (registered trademark) connector, or an audio connector (e.g., a headphone connector).

[0029] Haptics module 179 converts the electrical signals into mechanical (e.g., vibration or movement) or electrical stimuli that can be perceived by the user haptically or kinesthetically. In one embodiment, haptics module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0030] Camera module 180 captures still and video images and, in one embodiment, includes one or more lenses, an image sensor, an image signal processor, or a flash.

[0031] The power management module 188 manages the power provided to the electronic device 101. In one embodiment, the power management module 188 is implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0032] The battery 189 provides power to at least one element of the electronic device 101. According to one embodiment, the battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module 190 supports the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and communication through the established communication channel. The communication module 190 includes one or more communication processors that operate independently of the processor 120 (e.g., an application processor) and support the direct (e.g., wired) or wireless communication. In one embodiment, the communication module 190 includes a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module, or a power line communication module). The corresponding one of these communication modules communicates with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various types of communication modules may be integrated in one component (e.g., a single chip) or implemented in different components (e.g., multiple chips). The wireless communication module 192 uses the subscriber information (e.g., International Mobile Subscriber Identity (IMSI)) stored in the subscriber identity module 196 to identify or authenticate the electronic device 101 in a communication network such as the first network 198 or the second network 199.

[0034] The wireless communication module 192 supports a 5G network after the 4G network and a next-generation communication technology, for example, a new radio access technology (NR). The NR connection technology supports high-capacity data high-speed transmission (eMBB (enhanced mobile broadband)), terminal power minimization and massive terminal connection (mMTC (massive machine type communications)), or ultra-reliable and low-latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports a high frequency band (e.g., mmWave band) for achieving a high data transmission rate. The wireless communication module 192 supports various technologies for ensuring performance in a high frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, large scale antenna, and the like. The wireless communication module 192 supports various requirements defined by the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 supports a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0035] The antenna module 197 transmits or receives signals or power to or from an external (e.g., external electronic device). In one embodiment, the antenna module 197 includes an antenna including a radiator made of a conductor or conductive pattern formed on a substrate (e.g., PCB). In one embodiment, the antenna module 197 includes multiple antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the multiple antennas by, for example, the communication module 190. The signal or power is transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. In one embodiment, other components (e.g., a radio frequency integrated circuit (RFIC)) are additionally formed as part of the antenna module 197 in addition to the radiator. In various embodiments, the antenna module 197 forms an mmWave antenna module. In one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and supporting a predetermined high frequency band (e.g., an mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board for transmitting or receiving signals in the predetermined high frequency band.

[0036] At least some of the components are connected to each other by a peripheral communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) to exchange signals (e.g., commands or data).

[0037] According to an embodiment, commands or data are sent or received between the electronic device 101 and the external electronic device 104 via a server 108 connected to the second network 199. Each of the electronic devices (102 or 104) may be the same or a different type of device as the electronic device 101. According to an embodiment, all or part of the operations performed by the electronic device 101 are performed by one or more external electronic devices, among the external electronic devices (102, 104) or the server 108. For example, if the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 requests one or more external electronic devices to perform the function or at least part of the service instead of or in addition to performing the function or service itself. The one or more external electronic devices receiving the request perform at least part of the requested function or service or an additional function or service associated with the request and communicate the result of the execution to the electronic device 101. The electronic device 101 processes the result as it is or additionally and provides it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology is used. The electronic device 101 provides ultra-low latency services, for example, using distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 includes an Internet of Things (IoT) device. The server 108 is an intelligent server using machine learning and / or neural network. According to this embodiment, the external electronic device 104 or the server 108 is included in a second network 199. The electronic device 101 is applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0038] The electronic devices according to various embodiments disclosed herein may take various forms, including, for example, a portable communication device (e.g., a smartphone), a computing device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronic device. The electronic devices according to embodiments of the present invention are not limited to the above-mentioned devices.

[0039] Various embodiments of the present invention and the terms used therein should not be understood to limit the technical features described herein to a specific embodiment, but should include various modifications, equivalents, or alternatives of the embodiment. With respect to the description of the drawings, similar reference numerals are used for similar or related components. The singular form of a noun corresponding to an item includes one or more of the item, unless the relevant context clearly indicates otherwise. In this specification, each of phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" includes any one of the items listed with the corresponding phrase in the phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" are used merely to distinguish the corresponding component from other components, and do not limit the corresponding component in other aspects (e.g., importance or order). When a (e.g., first) component is referred to as being "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively," it means that the component is connected to the other component directly (e.g., by wire), wirelessly, or through a third component.

[0040] The term "module" as used in various embodiments of the present invention includes a unit implemented in hardware, software, or firmware, and is used interchangeably with terms such as logic, logic block, component, or circuit. A module is an integrated component or the smallest unit or part thereof that performs one or more functions. For example, in one embodiment, a module is implemented in the form of an application-specific integrated circuit (ASIC).

[0041] Various embodiments of the present invention are implemented as software (e.g., program 140) including one or more instructions stored in a machine-readable (e.g., electronic device 101) storage medium (e.g., internal memory 136 or external memory 138). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) retrieves and executes at least one of the one or more instructions stored in the storage medium. This enables the machine to be operated to perform at least one function according to the retrieved at least one instruction. The one or more instructions include code generated by a compiler or code executed by an interpreter. The machine-readable storage medium is provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium does not include a signal (e.g., electromagnetic wave) in a tangible device, and the term does not distinguish between a case where data is stored semi-permanently and a case where data is stored temporarily in the storage medium.

[0042] According to one embodiment, the method according to the various embodiments disclosed herein is provided in a computer program product. The computer program product is traded between a seller and a buyer as a commodity. The computer program product is distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or is distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store®) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a part of the computer program product is at least temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0043] According to various embodiments, each of the above-mentioned components (e.g., modules or programs) includes one or more individuals, and some of the multiple individuals are arranged separately in other components. According to various embodiments, one or more of the above-mentioned components or operations are omitted, or one or more other components or operations are added. Additionally or alternatively, multiple components (e.g., modules or programs) are integrated into one component. In this case, the integrated component performs one or more functions of each of the multiple components in the same or similar manner as those performed by the multiple components before integration. According to various embodiments, the operations performed by the modules, programs, or other components may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the above operations may be performed in another order, omitted, or one or more other operations may be added.

[0044] 2A and 2B illustrate an electronic device in an unfolded state and a folded state, respectively, according to one embodiment.

[0045] 2A and 2B, in this embodiment, the electronic device 101 includes a foldable housing 200 (hereinafter, simply referred to as "housing" 200) and a flexible or foldable display 260 (hereinafter, simply referred to as "display" 260) disposed in a space formed by the housing 200. In this specification, the surface on which the display 260 is disposed is defined as a first surface or a front surface of the electronic device 101. The surface opposite the front surface is defined as a second surface or a rear surface of the electronic device 101. Also, the surface surrounding the space between the front surface and the rear surface is defined as a third surface or a side surface of the electronic device 101.

[0046] In this embodiment, the housing 200 has a substantially rectangular shape in the unfolded state of Fig. 2A. For example, the housing 200 has a predetermined width W and a predetermined length L1 that is longer than the predetermined width W. As another example, the housing 200 has a predetermined width W and a predetermined length L1 that is substantially the same as or shorter than the predetermined width W. For example, the predetermined width W is the width of the display 260. In this embodiment, the housing 200 of the electronic device 101 is folded or unfolded with reference to a folding axis A that is substantially parallel to a long edge of the rectangle (e.g., an edge of the housing 200 of the electronic device 101 facing the y-axis direction in Fig. 2A).

[0047] In this embodiment, the housing 200 includes a first housing 201, a second housing 202, and a coupling portion 203. The coupling portion 203 is disposed between the first housing 201 and the second housing 202. The coupling portion 203 is coupled to the first housing 201 and the second housing 202, and the first housing 201 and / or the second housing 202 rotate around the coupling portion 203 (or the folding axis A).

[0048] In this embodiment, the first housing 201 includes a first side member 2011 and a first rear cover 2013. In this embodiment, the second housing 202 includes a second side member 2021 and a second rear cover 2023.

[0049] In this embodiment, the first side member 2011 extends along an edge of the first housing 201 and forms at least a portion of a side of the electronic device 101. The first side member 2011 includes at least one conductive portion formed of a conductive material (e.g., metal). The conductive portion acts as an antenna radiator for transmitting and / or receiving RF signals. Similar to the first side member 2011, the second side member 2021 forms a portion of a side of the electronic device 101, and at least a portion of the second side member 2021 is formed of a conductive material and acts as an antenna radiator.

[0050] In this embodiment, the first side member 2011 and the second side member 2021 are disposed on either side of the folding axis A, and have shapes that are substantially symmetrical with respect to the folding axis A.

[0051] In this embodiment, the angle and distance between the first side surface member 2011 and the second side surface member 2021 differ depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state.

[0052] In one embodiment, the housing 200 is formed with a recess to accommodate the display 260. The recess corresponds to the shape of the display 260.

[0053] In various embodiments, the components include various types of sensors, such as a front camera, a receiver, and / or a proximity sensor.

[0054] In this embodiment, the first rear cover 2013 is disposed on the first housing 201 at the rear of the electronic device 101. The first rear cover 2013 has a substantially rectangular edge. Similar to the first rear cover 2013, the second rear cover 2023 is disposed on the second housing 202 at the rear of the electronic device 101.

[0055] In this embodiment, the first rear cover 2013 and the second rear cover 2023 have a substantially symmetrical shape centered on the folding axis A. However, the first rear cover 2013 and the second rear cover 2023 do not necessarily have a symmetrical shape to each other, and in other embodiments, the electronic device 101 includes the first rear cover 2013 and / or the second rear cover 2023 of various shapes. In other embodiments, the first rear cover 2013 is integrally formed with the first side member 2011, and the second rear cover 2023 is integrally formed with the second side member 2021.

[0056] In one embodiment, the first rear cover 2013, the second rear cover 2023, the first side member 2011, and the second side member 2021 form a space in which various components of the electronic device 101 (e.g., a printed circuit board, or a battery) can be placed.

[0057] In one embodiment, one or more components are disposed or visually exposed on the rear surface of the electronic device 101. For example, at least a portion of the sub-display 265 is visually exposed through at least one region of the first rear cover 2013. For example, the sub-display 265 is visually exposed through the entire region of the first rear cover 2013, but the region where the sub-display 265 is exposed is not limited to the above example. As another example, the rear camera 280 is visually exposed through at least one region of the second rear cover 2023. As yet another example, the rear camera 280 is disposed in one region of the rear surface of the electronic device 101.

[0058] The housing 200 of the electronic device 101 is not limited to the configurations and combinations shown in FIGS. 2A and 2B, but may be implemented with other shapes and combinations and / or combinations of parts.

[0059] Referring to FIG. 2B, the coupling portion 203 is mounted so that the first housing 201 and the second housing 202 can rotate relative to each other. For example, the coupling portion 203 includes a hinge coupled to the first housing 201 and the second housing 202. In this embodiment, the coupling portion 203 includes a hinge cover 230 disposed between the first side member 2011 and the second side member 2021 to hide internal components (e.g., hinge). In one embodiment, the hinge cover 230 is hidden by a part of the first side member 2011 and the second side member 2021 or exposed to the outside depending on the state (flat state or folded state) of the electronic device 101. For example, the size of the area of ​​the hinge cover 230 exposed to the outside is changed depending on the state (flat state or folded state) of the electronic device 101.

[0060] For example, as shown in FIG. 2A, when the electronic device 101 is in the unfolded state, at least a part of the hinge cover 230 is hidden by the first side member 2011 and the second side member 2021 and is not exposed. For example, as shown in FIG. 2B, when the electronic device 101 is in the folded state, the hinge cover 230 is exposed to the outside between the first side member 2011 and the second side member 2021. For example, in an intermediate state in which the first side member 2011 and the second side member 2021 are folded with a certain angle, a part of the hinge cover 230 is exposed to the outside from between the first side member 2011 and the second side member 2021. However, in this case, the area of ​​the hinge cover 230 exposed is smaller than that in the completely folded state of FIG. 2B.

[0061] In this embodiment, the display 260 is disposed in a space formed by the housing 200. For example, the display 260 is mounted on a recess formed by the housing 200 and forms most of the front surface of the electronic device 101. For example, the front surface of the electronic device 101 includes the display 260, a portion of the first side member 2011 adjacent to the display 260, and a portion of the second side member 2021. As yet another example, the rear surface of the electronic device 101 includes the first rear cover 2013, a portion of the first side member 2011 adjacent to the first rear cover 2013, the second rear cover 2023, and a portion of the second side member 2021 adjacent to the second rear cover 2023.

[0062] In one embodiment, the display 260 includes a flexible display in which at least a part of the area is deformed into a flat or curved surface. In this embodiment, the display 260 includes a folding area 263, a first area 261, and a second area 262. The folding area 263 extends along a folding axis A, and the first area 261 is disposed on one side (e.g., the left side of the folding area 263 shown in FIG. 2A) and the second area 262 is disposed on the other side (e.g., the right side of the folding area 263 shown in FIG. 2A) based on the folding area 263. As another example, the first area 261 is disposed in the first housing 201, and the second area 262 is disposed in the second housing 202. The folding area 263 is disposed in the connecting part 203.

[0063] The division of the regions of display 260 shown in Figures 2A and 2B is exemplary, and display 260 may be divided into multiple (e.g., four or more, or two) regions according to structure or function. As an example, in the embodiment shown in Figure 2A, the regions of display 260 are divided by folding region 263 or folding axis A, but in other embodiments, display 260 may be divided into regions based on other folding regions or other folding axes.

[0064] In this embodiment, the first region 261 and the second region 262 have an overall symmetrical shape with respect to the folding region 263. For example, the first region 261 and the second region 262 include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0065] The operation of the first side member 2011 and the second side member 2021 and each area of ​​the display 260 according to the state of the electronic device 101 (for example, the unfolded state and the folded state) will be described below.

[0066] In this embodiment, when the electronic device 101 is in the unfolded state (e.g., FIG. 2A), the first side member 2011 and the second side member 2021 are arranged to face substantially the same direction while forming an angle of about 180 degrees. The surfaces of the first region 261 and the second region 262 of the display 260 form an angle of about 180 degrees with each other and face substantially the same direction (e.g., toward the front of the electronic device). For example, the folding region 263 forms the same plane as the first region 261 and the second region 262.

[0067] In this embodiment, when the electronic device 101 is in a folded state (e.g., FIG. 2B), the first side member 2011 and the second side member 2021 are disposed to face each other. The surfaces of the first region 261 and the second region 262 of the display 260 face each other while forming a small angle (e.g., between 0 degrees and 10 degrees) with each other. At least a portion of the folding region 263 is made of a curved surface having a predetermined curvature.

[0068] In this embodiment, when the electronic device 101 is in the intermediate state, the first side member 2011 and the second side member 2021 are disposed at a certain angle to each other. The surfaces of the first region 261 and the second region 262 of the display 260 form an angle that is larger than that in the folded state and smaller than that in the unfolded state. At least a portion of the folding region 263 is made of a curved surface having a certain curvature, which is smaller than that in the folded state.

[0069] FIG. 3 illustrates a cross-sectional view of the display taken along the B axis of FIG. 2A and a dielectric layer structure according to one embodiment.

[0070] 3, a display 260 (or a display structure) according to the present embodiment includes a number of layers. According to the present embodiment, the display 260 includes a cover glass 340, a display panel 330 disposed adjacent to one side of the cover glass 340, a dielectric layer structure 311 disposed under the display panel 330, and a first layer 320 disposed under the dielectric layer structure 311. According to one embodiment (not shown), some of the above-mentioned components (e.g., thermoplastic member 390) may be omitted or other components may be added.

[0071] In one embodiment, display 260 includes an adhesive (e.g., a pressure sensitive adhesive (PSA)) to bond the layers described above. In other embodiments, the adhesive may be other than a PSA, including, but not limited to, an optically clear adhesive (OCA), a heat sensitive adhesive, or a double-sided tape.

[0072] According to the present embodiment, the cover glass 340 includes a film layer 342 and a transparent plate 341 (e.g., ultra-thin glass (UTG)) at least a portion of which is exposed or visible through the front surface of the electronic device 101. The film layer 342 and the transparent plate 341 according to the present embodiment are bonded together by an adhesive. The film layer 342 and the transparent plate 341 according to the present embodiment are flexible so that they can be folded or bent. For example, the film layer 342 is referred to as a polarization film, but is not limited thereto.

[0073] According to the present embodiment, the display panel 330 includes a panel 332, a plastic film 333 disposed under the panel 332, and a cover panel 331 disposed under the plastic film 333. According to one embodiment, the plastic film 333 includes an adhesive (e.g., PSA) to adhere the panel 332 and the cover panel 331. According to one embodiment, the plastic film 333 is referred to as a polarization film.

[0074] According to an embodiment, the panel 332 is implemented as a touch panel in which electrodes for receiving touch input, fingerprint recognition, or pen input are arranged. According to an embodiment, the panel 332 includes an organic light emitting diodes (OLED) panel, a liquid crystal display (LCD), or a quantum dot light-emitting diodes (QLED) panel. For example, the display panel 330 includes a plurality of pixels for displaying an image, and one pixel includes a plurality of sub-pixels. For example, one pixel includes three sub-pixels of red, green, and blue. As another example, one pixel is formed in an RGBG pentile manner including one red sub-pixel, two green sub-pixels, and one blue sub-pixel.

[0075] According to the present embodiment, the display 260 includes a dielectric layer structure 311 disposed under a display panel 330. According to the present embodiment, at least a portion of an edge of the dielectric layer structure 311 is formed outside an edge of the display panel 330. This will be described in detail later.

[0076] According to this embodiment, the dielectric layer structure 311 is attached under the display panel 330 by disposing an adhesive layer 381 between the display panel 330 and the dielectric layer structure 311. According to one embodiment, the adhesive layer 381 is disposed such that the shape of the adhesive layer 381 corresponds to the shape of the dielectric layer structure 311 or the edges of the adhesive layer 381 are formed inside the edges of the dielectric layer structure 311. According to another embodiment, the adhesive layer 381 is disposed such that at least a part of the edges of the adhesive layer 381 correspond to the edges of the dielectric layer structure 311.

[0077] According to the present embodiment, the dielectric layer structure 311 includes a lattice pattern 370 in at least some regions. For example, the dielectric layer structure 311 includes the lattice pattern 370 in a region adjacent to a folding axis (e.g., folding axis A in FIG. 2A). According to an embodiment, by the dielectric layer structure 311 including the lattice pattern 370 in a region adjacent to the folding axis, when the electronic device 101 is switched to a folded state (e.g., FIG. 2B) or an unfolded state (e.g., FIG. 2A), the dielectric layer structure 311 and the layers attached to the dielectric layer structure 311 are also folded or unfolded according to the respective states.

[0078] According to the present embodiment, the display 260 further includes a thermoplastic member 390 (e.g., TPU (thermoplastic polyurethane urethane)) disposed under the dielectric layer structure 311. According to the present embodiment, the display 260 includes the thermoplastic member 390, thereby preventing or reducing damage to the display panel 330, the dielectric layer structure 311, and / or the first layer 320. For example, the display 260 includes the thermoplastic member 390, thereby preventing or reducing air bubbles generated between the layers disposed in the display 260. Furthermore, the display 260 includes the thermoplastic member 390, thereby preventing or reducing the inflow of foreign matter between the layers disposed in the display 260.

[0079] According to this embodiment, the display 260 includes a first layer 320 disposed below the dielectric layer structure 311. According to one embodiment, the first layer 320 includes at least one of a digitizer 321 and a metal plate 322. For example, the first layer 320 includes the metal plate 322 disposed below the dielectric layer structure 311.

[0080] According to this embodiment, the digitizer 321 and the metal plate 322 are bonded together by an adhesive. For example, an adhesive is applied under the digitizer 321, and the metal plate 322 is attached under the digitizer 321 by an adhesive.

[0081] According to this embodiment, the first layer 320 is formed to be discontinuous in a region corresponding to the folding axis (e.g., folding axis A in FIG. 2A). According to this embodiment, the first layer 320 is formed to be discontinuous in a region corresponding to the folding axis (e.g., folding axis A in FIG. 2A), so that when the electronic device 101 is switched to a folded state (e.g., FIG. 2B) or an unfolded state (e.g., FIG. 2A), the first layer 320 is folded or unfolded according to each state. According to another embodiment (not shown), the first layer 320 is flexible and formed across the folding axis.

[0082] In one embodiment, the digitizer 321 is a device that senses input for an x-position and / or a y-position, and detects an input device (e.g., an electronic pen) that uses electromagnetic induction. For example, at least one processor (e.g., processor 120 in FIG. 1) provides a current to the digitizer 321, which generates an electromagnetic field. When the electronic pen approaches the electromagnetic field of the digitizer 321, an electromagnetic induction phenomenon occurs, and a resonant circuit of the electronic pen generates a current. The resonant circuit of the electronic pen uses the generated current to form a magnetic field. The at least one processor scans the strength of the magnetic field applied from the electronic pen to the digitizer 321 over the entire area to detect the position. The at least one processor performs an operation based on the detected position.

[0083] According to an embodiment, the metal plate 322 is referred to as a shielding layer. According to an embodiment, the metal plate 322 is formed by applying magnetic metal powder (MMP) to the lower portion of the digitizer 321. According to an embodiment, the metal plate 322 can reduce noise by shielding magnetic forces from surrounding electronic components in addition to signals input from the electronic pen.

[0084] According to an embodiment, the dielectric layer structure 311 includes a material for ensuring rigidity and a lightweight material. According to an embodiment, the dielectric layer structure 311 has a structure in which a layer for ensuring rigidity and a layer made of a lightweight material are stacked. According to an embodiment, the dielectric layer structure 311 has rigidity, thereby ensuring rigidity of the flexible display 260. According to an embodiment, at least a portion of the dielectric layer structure 311 is made of a lightweight material, thereby reducing the weight of the flexible display 260.

[0085] According to this embodiment, the dielectric layer structure 311 includes a first dielectric layer 3111, a second dielectric layer 3112 disposed on one side of the first dielectric layer 3111 adjacent to the display panel 330, and a third dielectric layer 3113 disposed under the first dielectric layer 3111. According to another embodiment (not shown), one of the second dielectric layer 3112 and the third dielectric layer 3113 is omitted.

[0086] According to an embodiment, the first dielectric layer 3111 is formed of a lightweight material. According to an embodiment, the first dielectric layer 3111 includes a dielectric material having a dielectric constant equal to or less than a predetermined value. For example, the first dielectric layer 3111 is formed of, but is not limited to, glass fiber reinforced plastic (GFRP) having a dielectric constant equal to or less than 6.

[0087] According to an embodiment, at least a portion of the second dielectric layer 3112 and / or the third dielectric layer 3113 is formed of a material having a rigidity equal to or greater than a predetermined value. For example, the second dielectric layer 3112 and the third dielectric layer 3113 have a rigidity greater than that of the first dielectric layer 3111. According to an embodiment, the second dielectric layer 3112 and the third dielectric layer 3113 are formed of carbon fiber reinforced plastic (CFRP) having high rigidity, thereby ensuring the rigidity of the flexible display 260.

[0088] According to an embodiment, at least a portion of the second dielectric layer 3112 and / or the third dielectric layer 3113 includes a dielectric material having a dielectric constant equal to or greater than a predetermined value. For example, the second dielectric layer 3112 and the third dielectric layer 3113 are formed of, but are not limited to, CFRP having a dielectric constant equal to or greater than 200. According to another example, the second dielectric layer 3112 and the third dielectric layer 3113 have different dielectric constants.

[0089] According to the present embodiment, the second edge 352 of the second dielectric layer 3112 and the third edge 353 of the third dielectric layer 3113 are formed inside the first edge 351 of the first dielectric layer 3111. According to the present embodiment, the second edge 352 of the second dielectric layer 3112 and the third edge 353 of the third dielectric layer 3113 are formed to correspond to each other. This will be described in detail later.

[0090] Figure 4A shows a portion of a cross-sectional view of the display of Figure 3 according to one embodiment, and Figure 4B shows a portion of a cross-sectional view of the display of Figure 3 according to another embodiment.

[0091] 4A and 4B, the display 260 according to this embodiment includes multiple layers, each of which is spaced a predetermined distance from a first side 401 of the electronic device 101 (e.g., a side of the electronic device 101 in FIG. 2A).

[0092] In this embodiment, the display 260 includes a cover glass 340 forming at least a portion of the front surface of the electronic device, a display panel 330 arranged adjacent to one side of the cover glass 340, a dielectric layer structure 311 arranged below the display panel 330, and a second layer 320 arranged below the dielectric layer structure 311.

[0093] According to the present embodiment, the dielectric layer structure 311 includes a first dielectric layer 3111, a second dielectric layer 3112 disposed on one side of the first dielectric layer 3111 facing the display panel 330, and a third dielectric layer 3113 disposed on one side of the first dielectric layer 3111 adjacent to the rear side of the electronic device (e.g., the rear side of the electronic device 101 in FIG. 2A). The same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions will be omitted.

[0094] In one embodiment, the first side 401 is referred to as the side of the electronic device that is formed by the first housing (e.g., the first housing 201 of FIG. 2A). In one embodiment, the first housing is referred to as the first side member.

[0095] According to the present embodiment, the first dielectric layer 3111 includes a first edge 351 that is spaced a first distance D1 from the first side 401. For example, the first edge 351 of the first dielectric layer 3111 is spaced a predetermined distance (e.g., about 0.2 mm) from the first side 401. According to the present embodiment, the first edge 351 is spaced a predetermined distance or more from at least a portion of the first housing 201 by being spaced a first distance D1 from the first side 401.

[0096] 4A, the second dielectric layer 3112 according to the present embodiment includes a second edge 352 that is spaced apart from the first side 401 by a second distance D2 that is greater than the first distance D1. For example, the second edge 352 of the second dielectric layer 3112 is spaced apart from the first side 401 by a predetermined distance (e.g., about 1 mm), but is not limited thereto.

[0097] According to the present embodiment, the third dielectric layer 3113 includes a third edge 353 that is spaced apart from the first side 401 by a second distance D2 that is greater than the first distance D1. For example, the third edge 353 of the third dielectric layer 3113 is spaced apart from the first side 401 by a predetermined distance (e.g., about 1 mm), but is not limited thereto. For example, the second edge 352 and the third edge 353 are spaced apart from the first side 401 by the second distance D2.

[0098] According to other embodiments, the second edge 352 and the third edge 353 are spaced apart from the first side 401 by a distance greater than the first distance D1. The distances at which the second edge 352 and the third edge 353 are spaced apart from the first side 401 may differ from each other.

[0099] According to the present embodiment, the display panel 330 includes an edge 360 ​​that is spaced from the first side 401 by a third distance D3 that is greater than the first distance D1 and less than the second distance D2. For example, but not limited to, the edge 360 ​​of the display panel 330 is spaced from the first side 401 by about 0.5 mm. According to another embodiment, the edge of the cover panel 331 is spaced from the first side 401 by a distance greater than the third distance D3, but is not limited to this.

[0100] According to this embodiment, at least a portion of the first edge 351 of the first dielectric layer 3111 is formed on an outer side of the edge 360 ​​of the display panel 330. According to this embodiment, at least a portion of the second edge 352 of the second dielectric layer 3112 and at least a portion of the third edge 353 of the third dielectric layer 3113 are formed on an inner side of the edge 360 ​​of the display panel 330.

[0101] In this embodiment, a first edge 351 of the first dielectric layer 3111 forms an outermost edge of the display 260. In this embodiment, a second edge 352 of the second dielectric layer 3112 and / or a third edge 353 of the third dielectric layer 3113 form an innermost edge of the display 260.

[0102] 4B , in this embodiment, the display 260 further includes a dielectric 470 extending outward from the second edge 352 of the second dielectric layer 3112 and / or the third edge 353 of the third dielectric layer 3113. According to this embodiment, the display 260 includes a dielectric 470 having an edge 354 extending from the second edge 352 of the second dielectric layer 3112 and / or the third edge 353 of the third dielectric layer 3113 and spaced a first distance D1 from the first side 401.

[0103] In one embodiment, the dielectric 470 is formed of a dielectric material having a dielectric constant equal to or less than a predetermined value. In one embodiment, the dielectric 470 is formed of a dielectric material having a dielectric constant equal to or less than about 6, but is not limited thereto. For example, the dielectric 470 includes a resin having a dielectric constant of 2.54.

[0104] According to the present embodiment, at least a portion of edge 354 of dielectric 470 is spaced a first distance D1 from first side 401. According to another embodiment (not shown), at least a portion of edge 354 of dielectric 470 is formed to be spaced a distance (e.g., a third distance D3) greater than first distance D1 from first side 401.

[0105] In this embodiment, the edge 354 of the dielectric 470 is formed outside the edge 360 ​​of the display panel 330. In another embodiment (not shown), at least a portion of the edge 354 of the dielectric 470 is formed to correspond to the edge 360 ​​of the display panel 330.

[0106] In this embodiment, the edge 354 of the dielectric 470 is formed to correspond to the first edge 351 of the first dielectric layer 3111. The edge 354 of the dielectric 470 in this embodiment forms the outermost edge of the display 260 together with the first edge 351 of the first dielectric layer 3111.

[0107] FIG. 5A is a diagram showing an edge of a dielectric layer structure formed in an area corresponding to at least a portion of a housing according to one embodiment, and FIG. 5B is a diagram showing a display structure viewed perpendicular to the front surface of an electronic device according to one embodiment.

[0108] 5A and 5B, the first dielectric layer 3111 according to the present embodiment includes a first edge 351 formed in an area corresponding to at least a portion of an edge of the housing 200. According to one embodiment, the second dielectric layer 3112 and the third dielectric layer 3112 include second edge 352 and third edge 353, respectively, corresponding to the first edge 351 of the first dielectric layer 3111.

[0109] According to an embodiment, the second dielectric layer 3112 and the third dielectric layer 3113 are arranged to at least partially overlap when viewed in a direction perpendicular to the front surface of the electronic device 101. According to an embodiment, the second edge 352 and the third edge 353 are arranged to at least partially overlap when viewed in a direction perpendicular to the front surface of the electronic device 101. For ease of explanation, hereinafter, descriptions of the second dielectric layer 3112 and the second edge 352 will be referred to as descriptions of the third dielectric layer 3113 and the third edge 353, respectively.

[0110] Referring to FIG. 5A, the first housing 201 (or first side member 2011) according to this embodiment includes a first portion 201A, a second portion 201B extending substantially perpendicularly from the first portion 201A, and a third portion 201C extending substantially perpendicularly from the second portion 201B and substantially parallel to the first portion 201A.

[0111] According to this embodiment, the second housing 202 (or the second side member 2021) includes a fourth portion 202A, a fifth portion 202B extending substantially perpendicularly from the fourth portion 202A, and a sixth portion 202C extending substantially perpendicularly from the fifth portion 202B and substantially parallel to the fourth portion 202A.

[0112] In one embodiment, the first edge 351 is formed in an area of ​​the first housing 201 and / or the second housing 202 that corresponds to a first area 501 that does not act as an antenna radiator.

[0113] According to an embodiment, the second edge 352 is formed in an area corresponding to at least a portion of the first portion 201A and / or the third portion 201C of the first housing 201.

[0114] According to an embodiment, the second edge 352 is formed in a region corresponding to the second region 502 powered by the wireless communication circuit 510 (e.g., wireless communication module 192 in FIG. 1) inside the first housing 201 and / or the second housing 202. According to an embodiment, the second edge 352 is formed in a region corresponding to the second region 502 that operates as an antenna radiator by being powered by the wireless communication circuit 510 inside the first housing 201 and / or the second housing 202. According to an embodiment, the second edge 352 is formed at a predetermined distance D2 (e.g., 1 mm) from the side of the electronic device 101 in a region corresponding to the second region 502 powered by the wireless communication circuit 510 inside the housing 200.

[0115] According to one embodiment, the second edge 352 is formed on the first portion 201A of the first housing 201 from a first point 511 spaced a predetermined distance d from the folding axis A to a second point 512 on the first portion 201A. According to one embodiment, the second edge 352 is formed on the third portion 201C of the first housing 201 from a third point 513 spaced a predetermined distance d from the folding axis A to a fourth point 514 on the third portion 201C.

[0116] According to one embodiment, the second edge 352 is formed in an area corresponding to an area excluding the corner where the first portion 201A and the second portion 201B of the first housing 201 meet, and the corner where the second portion 201B and the third portion 201C meet, and is spaced a predetermined distance D2 (e.g., about 1 mm) from the side of the electronic device 101.

[0117] According to an embodiment, the second edge 352 is formed in an area corresponding to a part of the fourth portion 202A, the fifth portion 202B, and / or the sixth portion 202C of the second housing 202. According to an embodiment, the second edge 352 is formed from a fifth point 515, which is a predetermined distance d away from the folding axis A on the fourth portion 202A of the second housing 202, to a sixth point 516 on the fourth portion 202A. According to an embodiment, the second edge 352 is formed from a seventh point 517, which is a predetermined distance d away from the folding axis A on the sixth portion 202C of the second housing 202, to an eighth point 518 on the sixth portion 202C. According to an embodiment, the second edge 352 is formed in an area corresponding to at least a part of the fifth portion 202B. According to one embodiment, the second edge 352 is formed in an area corresponding to an area excluding the corner where the fourth portion 202A and the fifth portion 202B of the second housing 202 meet, and the corner where the fifth portion 202B and the sixth portion 202C meet, and is spaced a predetermined distance D2 (e.g., about 1 mm) from the side of the electronic device 101.

[0118] 5B, according to an embodiment, a first edge 351 of a first dielectric layer 3111 and a second edge 352 of a second dielectric layer 3112 are formed to correspond to edges of a display 260. As shown in FIG.

[0119] In one embodiment, a second edge 352 of the second dielectric layer 3112 is disposed inside a first edge 351 of the first dielectric layer 3111 when viewed in a direction perpendicular to the front surface of the electronic device 101 .

[0120] According to an embodiment, the first dielectric layer 3111 and the second dielectric layer 3112 include a lattice pattern 370 in at least some areas. According to the present embodiment, the first dielectric layer 3111 and the second dielectric layer 3112 include a lattice pattern 370 in some areas adjacent to the folding axis A. According to an embodiment, the first dielectric layer 3111 and the second dielectric layer 3112 include a lattice pattern 370 in some areas adjacent to the folding axis A, so that the display 260 and the dielectric layer structure 311 are folded or unfolded when the electronic device 101 is switched to a folded state (e.g., FIG. 2B) or an unfolded state (e.g., FIG. 2A).

[0121] According to an embodiment, at least a portion of the first dielectric layer 3111 and the second dielectric layer 3112 have a shape corresponding to a front surface of the electronic device 101 and are formed across the folding axis A. According to another embodiment, the first dielectric layer 3111 is formed segmented based on the folding axis A. This will be described in detail later.

[0122] 6A is a diagram illustrating a dielectric layer structure formed with different materials in different regions according to an embodiment, and FIG 6B is a diagram illustrating a cross section of a display structure and an electronic device mounted on a bracket according to an embodiment.

[0123] 6A and 6B, the electronic device 101 according to the present embodiment includes a bracket 630 to which a display structure (e.g., display 260 of FIG. 3) is attached, and at least a portion of the display is disposed to correspond to the bracket 630. According to one embodiment, the display includes a plurality of dielectric layers (e.g., dielectric layer structure 311 of FIG. 3) formed of materials that are divided into regions when viewed in a direction perpendicular to the front surface of the electronic device 101.

[0124] According to one embodiment, electronic device 101 includes bracket 630 and a display structure attached to bracket 630. According to one embodiment, bracket 630 is formed by injection. According to one embodiment, bracket 630 is formed inside a housing (e.g., housing 200 of FIG. 2A) by injection.

[0125] According to one embodiment, the first dielectric layer (e.g., first dielectric layer 3111 in FIG. 3) includes a first region 611 formed inward from a first edge (e.g., first edge 351 in FIG. 3) and a second region 612 extending outward from the first region 611 to form the first edge. According to one embodiment, the first dielectric layer includes the second region 612 adjacent to a side of the electronic device 101 and the first region 611 formed inside the second region 612 and adjacent to a center of the electronic device 101.

[0126] According to an embodiment, the first region 611 is made of a material with high thermal conductivity. For example, the first region 611 is made of at least one of, but not limited to, soft graphite resin or a thermally conductive flexible composite resin. According to an embodiment, the first region 611 is made of a material with high thermal conductivity to transfer heat generated from electronic components inside the electronic device 101 to the housing or a separate space disposed inside the electronic device 101.

[0127] In one embodiment, the second region 612 is formed of a material having a dielectric constant less than or equal to a predetermined value, including, but not limited to, glass fiber reinforced plastic (GFRP) having a dielectric constant of 6 or less.

[0128] Referring to a cross-sectional view of the electronic device 101 according to the present embodiment taken along the C-axis, the second region 612 is disposed to be formed in a region corresponding to the bracket 630. According to an embodiment, at least a portion of the second region 612 of the first dielectric layer is disposed in a region corresponding to the bracket 630.

[0129] In one embodiment, a second dielectric layer (eg, second dielectric layer 3112 in FIG. 3) is disposed in a third region 613 spaced from the folding axis A by a predetermined distance d.

[0130] In one embodiment, the electronic device 101 includes a hinge 640 (e.g., the connector 203 in FIG. 2A ). In one embodiment, when viewed perpendicularly to the front surface of the electronic device 101, at least a portion of a third region 613 having a predetermined distance d from the folding axis A overlaps the region in which the hinge 640 is disposed. In one embodiment, at least a portion of the second dielectric layer and / or the third dielectric layer (e.g., the third dielectric layer 3113 in FIG. 3 ) is disposed in the third region 613.

[0131] For example, the width W of the area in which the hinge 640 is disposed H is less than or equal to twice the predetermined distance d from the folding axis A at which the third region 613 is formed.

[0132] [Number 1] WH<2d Formula 1

[0133] However, the width W of the area in which the hinge 640 is arranged H The relationship between the predetermined distance d at which the third region 613 is formed based on the folding axis A and the predetermined distance d is not limited to the above Equation 1. A detailed description of this will be given later.

[0134] FIG. 7 illustrates a cross-sectional view of the display structure taken along the C-axis of FIG. 6B and a dielectric layer structure according to one embodiment.

[0135] 7, a display 260 according to the present embodiment includes a cover glass 340 forming at least a part of the front surface of an electronic device, a display panel 330 disposed adjacent to one surface of the cover glass 340, a dielectric layer structure 311 disposed under the display panel 330, and a first layer 320 disposed under the dielectric layer structure 311. The same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions will be omitted.

[0136] According to the present embodiment, the dielectric layer structure 311 includes a lattice pattern 370 in at least a portion of the region. According to the present embodiment, the lattice pattern 370 is disposed adjacent to the folding axis A. According to the present embodiment, the lattice pattern 370 is disposed to have a third width W3. According to the present embodiment, the lattice pattern 370 is disposed adjacent to the folding axis A to have a third width W3.

[0137] According to this embodiment, the first dielectric layer 3111 is formed separated by a first width W1 around the lattice pattern 370 or folding axis A. According to this embodiment, the first dielectric layer 3111 is formed across at least a portion of the first region 611 and the second region 612. According to this embodiment, the first dielectric layer 3111 forms at least a portion of the first region 611 and the second region 612. For example, the first dielectric layer 3111 includes a GFRP having a dielectric constant equal to or less than a predetermined value (e.g., 6) and forms the first region 611 and the second region 612.

[0138] According to this embodiment, the second dielectric layer 3112 and / or the third dielectric layer 3113 form at least a portion of the first region 611 and the third region 613. For example, the second dielectric layer 3112 and the third dielectric layer 3112 have a dielectric constant of about 200 or more and form the third region 613.

[0139] According to the present embodiment, the second dielectric layer 3112 is disposed to at least partially overlap the first dielectric layer 3111 in the first region 611 when viewed in a direction perpendicular to the front surface of the electronic device 101. According to another embodiment, the second dielectric layer 3112 is disposed to at least partially overlap the first dielectric layer 3111 in the third region 613 when viewed in a direction perpendicular to the front surface of the electronic device 101.

[0140] According to this embodiment, the cover panel 331 and / or the thermoplastic member (TPU) includes a groove in at least a portion of the region. According to this embodiment, the cover panel 331 and / or the thermoplastic member (TPU) includes a groove having a second width W2 in at least a portion of the region. However, the widths of the grooves of the cover panel 331 and the thermoplastic member may not be the same.

[0141] In one embodiment, the cover panel 331 and / or the thermoplastic material (TPU) includes grooves in at least some areas, so that the cover panel 331 and / or the thermoplastic material (TPU) can be easily folded or unfolded when the electronic device 101 is switched to a folded state (e.g., FIG. 2B) or an unfolded state (e.g., FIG. 2A).

[0142] According to an embodiment, the relationship between the first width W1, the second width W2, and the third width W3 is referred to by the following formula:

[0143] [Number 2] W1>W2>W3 Formula 2

[0144] However, the relationship between the first width W1, the second width W2, and the third width W3 is not limited to the above formula 2, and at least two or more of the first width W1, the second width W2, and the third width W3 may be formed to be the same.

[0145] In another embodiment (not shown), where a thermoplastic material (TPU) is formed in the area adjacent to the folding area 263, W2 is formed to be greater than W1.

[0146] In one embodiment, the display 260 further includes a dielectric 470 extending outwardly from the second dielectric layer 3112 and / or the third dielectric layer 3113 .

[0147] In one embodiment, the dielectric 470 is formed of a dielectric material having a dielectric constant equal to or less than a predetermined value. In one embodiment, the dielectric 470 is formed of a dielectric material having a dielectric constant equal to or less than about 6, but is not limited thereto. For example, the dielectric 470 includes a resin having a dielectric constant of 2.54.

[0148] 8 and 9 are diagrams illustrating a first and second states of an electronic device according to another embodiment.

[0149] 8 and 9, in this embodiment, the electronic device 800 includes a housing 810, a hinge cover 930 that covers a foldable portion of the housing 810, and a flexible or foldable display 900 (hereinafter, abbreviated as "main display" 900) disposed in a space formed by the housing 810. In this specification, the surface on which the main display 900 is disposed is defined as a first surface or a front surface 801 of the electronic device 800. The surface opposite to the front surface is defined as a second surface or a rear surface 802 of the electronic device 800. In addition, the surface surrounding the space between the front surface 801 and the rear surface 802 is defined as a third surface or a side surface 803 of the electronic device 800.

[0150] According to the present embodiment, the housing 810 includes a foldable housing. In the present embodiment, the housing 810 includes a first housing 811, a second housing 812, a first rear cover 880, and a second rear cover 890. The housing 810 of the electronic device 800 is not limited to the shapes and combinations shown in Figs. 8 and 9, and may be implemented by other shapes and combinations and / or combinations of parts. For example, in another embodiment, the first housing 811 and the first rear cover 880 are integrally formed, and the second housing 812 and the second rear cover 890 are integrally formed.

[0151] According to the present embodiment, the state in which the electronic device 800 is unfolded corresponds to the unfolded state 800A or the first state 800A. For example, the state in which the first housing 811 and the second housing 812 are unfolded corresponds to the unfolded state 800A or the first state 800A. Also, the state in which the electronic device 800 is folded corresponds to the second state 800B. For example, the state in which the second housing 812 is rotated and folded with respect to the first housing 811 corresponds to the folded state 800B or the second state 800B.

[0152] According to this embodiment, the first housing 811 and the second housing 812 have different angles or distances with respect to each other depending on whether the electronic device 800 is in an unfolded state, a folded state, or an intermediate state.

[0153] In the illustrated embodiment, the first housing 811 and the second housing 812 are disposed on either side of a folding axis (hereinafter, "axis C") and have shapes that are generally symmetrical with respect to the axis C. However, the first housing 811 and the second housing 812 have asymmetric shapes in some areas. For example, unlike the first housing 811, the second housing 812 further includes a USB hole 851. In other words, the first housing 811 and the second housing 812 include portions that are symmetrical with each other and portions that are asymmetrical with each other.

[0154] According to this embodiment, the main display 900 is symmetrically disposed across the first housing 811 and the second housing 812 .

[0155] In an embodiment, at least a portion of the first housing 811 and the second housing 812 are formed of a metallic or non-metallic material having a selected amount of rigidity to support the main display 900 .

[0156] In this embodiment, the first rear cover 880 is disposed on one side of the C-axis on the rear surface of the electronic device. For example, the first rear cover 880 has a substantially rectangular periphery, and the periphery is covered by the first housing 811. Similarly, the second rear cover 890 is disposed on the other side of the C-axis on the rear surface of the electronic device, and the periphery is surrounded by the second housing 812.

[0157] In the illustrated embodiment, the first rear cover 880 and the second rear cover 890 have a substantially symmetric shape about the C axis. However, the first rear cover 880 and the second rear cover 890 do not necessarily have symmetric shapes, and in other embodiments, the electronic device 800 includes first rear covers 880 and second rear covers 890 with various shapes.

[0158] In one embodiment, the first rear cover 880, the second rear cover 890, the first housing 811, and the second housing 812 form a space in which various components of the electronic device 800 are disposed (e.g., a printed circuit board or a battery). In one embodiment, one or more components are disposed or visibly exposed on the rear of the electronic device 800. For example, the first rear area of ​​the first rear cover 880 may include a first rear area of ​​the first rear cover 880. 93 1, a portion of the sub-display 920 is visually exposed. According to another embodiment, the sub-display 920 is disposed over the entire first rear area 931 of the first rear cover 880.

[0159] In other embodiments, one or more components or sensors are visually exposed through the second rear region 932 of the second rear cover 890. In various embodiments, the sensor includes a proximity sensor and / or a rear camera.

[0160] The main display 900 is disposed in a space formed by the housing 810. For example, the main display 900 is mounted on a recess formed by the housing 810, which forms most of the front surface 801 of the electronic device 800.

[0161] Therefore, the front surface 801 of the electronic device 800 includes the main display 900, as well as a portion of the first housing 811 adjacent to the main display 900 and a portion of the second housing 812. The rear surface 802 of the electronic device 800 includes the first rear cover 880, a portion of the first housing 811 adjacent to the first rear cover 880, as well as the second rear cover 890 and a portion of the second housing 812 adjacent to the second rear cover 890.

[0162] The main display 900 refers to a display in which at least a portion of the area is transformed into a flat or curved surface. In this embodiment, the main display 900 includes a folding area 903, a first display area 901 disposed on one side (the left side of the folding area 903 shown in FIG. 8) of the folding area, and a second display area 902 disposed on the other side (the right side of the folding area 903 shown in FIG. 8).

[0163] The area division of the main display 900 shown in Fig. 8 is exemplary, and the main display 900 may be divided into a plurality of areas (e.g., four or more, or two) according to structure or function. As an example, in the embodiment shown in Fig. 8, the areas of the main display 900 are divided by the folding area 903 extending parallel to the y-axis or the C-axis (folding axis), but in other embodiments, the display 900 is divided into areas based on other folding areas (e.g., folding areas parallel to the x-axis) or other folding axes (e.g., folding axes parallel to the x-axis).

[0164] In this embodiment, the first display area 901 and the second display area 902 are generally symmetrical with respect to the folding area 903. However, unlike the first display area 901, the second display area 902 does not have a camera hole. 850, but the other areas have a symmetrical shape to first display area 901. In other words, first display area 901 and second display area 902 include parts having symmetrical shapes and parts having asymmetrical shapes.

[0165] According to this embodiment, the camera hole 85 0 is visually exposed to the exterior of the electronic device 800. According to another embodiment, a camera hole 85 0 is located at the bottom of the main display 900 and is not visually exposed.

[0166] The operation of the first housing 811 and the second housing 812 according to the state of the electronic device 800 (for example, the flat state 800A or the folded state 800B) and each area of ​​the main display 900 will be described below.

[0167] In this embodiment, when the electronic device 800 is in a flat state 800A (e.g., FIG. 8), the first housing 811 and the second housing 812 are arranged to face the same direction while forming an angle of 180 degrees. The surfaces of the first display area 901 and the second display area 902 of the main display 900 form an angle of 180 degrees with each other and face the same direction (e.g., toward the front of the electronic device). The folding area 903 forms the same plane as the first display area 901 and the second display area 902.

[0168] In this embodiment, when the electronic device 800 is in the folded state 800B (e.g., FIG. 9), the first housing 811 and the second housing 812 are disposed to face each other. The surfaces of the first display area 901 and the second display area 902 of the main display 900 face each other while forming a small angle (e.g., between 0 and 10 degrees) with each other. The folding area 903 is at least partially made of a curved surface having a predetermined curvature.

[0169] In this embodiment, when the electronic device 800 is in an intermediate state, the first housing 811 and the second housing 812 are disposed at a certain angle to each other. The surfaces of the first display area 901 and the second display area 902 of the main display 900 form an angle that is larger than that in the folded state and smaller than that in the unfolded state. At least a portion of the folding area 903 is made of a curved surface having a certain curvature, and the curvature at this time is smaller than that in the folded state.

[0170] FIG. 10 is an exploded perspective view of an electronic device according to another embodiment.

[0171] Referring to FIG. 10, in this embodiment, the electronic device 800 includes a display unit 90, a bracket assembly 30, a base unit 11 00, a first housing 811, a second housing 812, a first rear cover 880, and a second rear cover 890. In this specification, the display unit 90 is referred to as a display module or a display assembly.

[0172] The display unit 90 includes a main display 900 and one or more plates or layers (not shown) on which the main display 900 is attached. In one embodiment, a plate is disposed between the main display 900 and the bracket assembly 30. The main display 900 is disposed on at least a portion of one surface (e.g., the upper surface with reference to FIG. 12 ) of the plate. The plate is formed in a shape corresponding to the main display 900.

[0173] The bracket assembly 30 includes a bracket 1010 including a first bracket 1011 and a second bracket 1012, a hinge structure 1000 disposed between the first bracket 1011 and the second bracket 1012, and a hinge cover 1013 that covers the hinge structure 1000 when viewed from the outside. Cover (e.g. hinge cover in Figure 9) 930 ), and a wiring member 1043 (e.g., a flexible printed circuit (FPC)) that crosses the first bracket 1011 and the second bracket 1012.

[0174] Referring to FIG. 10, the hinge cover The hinge structure 930 is disposed between the first housing 811 and the second housing 812 and is configured to hide the internal components (e.g., the hinge structure 1000). cover Depending on the state of the electronic device 800 (flat state 800A or folded state 800B), the element 930 is either hidden by a portion of the first housing 811 and the second housing 812 or exposed to the outside.

[0175] As an example, as shown in FIG. 8, when the electronic device 800 is in a flat state 800A, the hinge cover 9, when the electronic device 800 is in a folded state 800B (e.g., a fully folded state), the hinge 930 is not exposed. cover 930 is exposed to the outside from between the first housing 811 and the second housing 812. For example, when the first housing 811 and the second housing 812 are in an intermediate state where they are folded with a certain angle, the hinge cover 930 is exposed to the outside from between the first housing 811 and the second housing 812. However, in this case, the exposed area is smaller than in the completely folded state. cover 930 includes a curved surface.

[0176] In one embodiment, the bracket assembly 30 is disposed between the main display 900 and the substrate unit 1100. As an example, a first bracket 1011 is disposed between a first display area 901 of the main display 900 and the first substrate 1101. A second bracket 1012 is disposed between a second display area 902 of the main display 900 and the second substrate 1101. 11 It is placed between 02.

[0177] In this embodiment, the wiring member 1043 and at least a part of the hinge structure 1000 are disposed inside the bracket assembly 30. The wiring member 1043 is disposed in a direction (e.g., x-axis direction) that crosses the first bracket 1011 and the second bracket 1012. The wiring member 1043 is disposed along a folding axis (e.g., y-axis or y-axis direction) of the folding region 903 of the electronic device 800. 10 The folding axis C of the 3D object is perpendicular to the 3D object (e.g., the x-axis direction).

[0178] As described above, the substrate unit 1100 includes a first substrate 1101 disposed on the first bracket 1011 side and a second substrate 1102 disposed on the second bracket 1012 side. 11 02. The first substrate 1101 and the second substrate 11 02 includes a bracket assembly 30, a first housing 811, a second housing 812, and a first rear cover 8 80, and the second rear cover 8 90. Components for implementing various functions of the electronic device 800 are mounted on the first substrate 1101 and the second substrate 1102.

[0179] According to an embodiment, the first substrate 1101 is formed of a plurality of substrates. According to an embodiment, the first substrate 1101 is formed in a form in which a plurality of substrates are separated. For example, the first substrate 1101 is formed by being separated into a first printed circuit board 1103 and a second printed circuit board 1104. The first housing 811 and the second housing 812 are combined with each other so as to be coupled to both sides of the bracket assembly 30 in a state in which the display unit 90 is coupled to the bracket assembly 30. As described below, the first housing 811 and the second housing 812 are slid from both sides of the bracket assembly 30 and coupled to the bracket assembly 30.

[0180] In this embodiment, the first housing 811 includes a first rotation support surface 813, and the second housing 812 includes a second rotation support surface 814 corresponding to the first rotation support surface 813. The first rotation support surface 813 and the second rotation support surface 814 are connected to each other by a hinge. cover It includes surfaces corresponding to the surfaces included in 930.

[0181] In one embodiment, the first rotational support surface 813 and the second rotational support surface 814 are hinged when the electronic device 800 is in a flat state 800A (e.g., the electronic device of FIG. 8). cover Covering the 930 hinge cover 930 is not exposed or is exposed only to a minimum on the rear surface of the electronic device 800. On the other hand, the first rotating support surface 813 and the second rotating support surface 814 are hinged when the electronic device 800 is in a folded state 800B (e.g., the electronic device in FIG. 9). cover Hinge that rotates along the curved surface included in 930 cover 930 is exposed to the full extent on the rear surface of the electronic device 800 .

[0182] According to this embodiment, the electronic device 800 further includes a first battery 1151 , a second battery 1152 , and a speaker module 1153 .

[0183] According to an embodiment, the first battery 1151 and the second battery 1152 are mounted inside the housing 810 of the electronic device 800 and are not exposed to the outside. For example, the first battery 1151 is mounted inside the first housing 811. Also, the second battery 1152 is mounted inside the second housing 812.

[0184] According to one embodiment, the first battery 1151 and the second battery 1152 are electrically connected by a wiring member 1043 (eg, a flexible printed circuit board) disposed between the first housing 811 and the second housing 812.

[0185] In one embodiment, the speaker module 1153 is disposed inside the first housing 811. For example, the speaker module 1153 is disposed in an area adjacent to the first battery 1151 inside the first housing 811. In one embodiment, the speaker module 1153 is not exposed to the outside of the electronic device 800. In one embodiment, the speaker module 1153 is mounted on the second printed circuit board 1104 of the first substrate 1101.

[0186] FIG. 11 shows a cross-sectional view of a display according to another embodiment and a dielectric layer structure.

[0187] With reference to Fig. 11, the display 900 (or display structure) of Fig. 11 will be referred to as the display 260 (or display structure) of Fig. 3. Also, each of the components (e.g., display panels 1030) forming the display 900 of Fig. 11 will be referred to as the components forming the display 260 of Fig. 3. Accordingly, redundant descriptions of substantially the same components will be omitted.

[0188] According to an embodiment, the dielectric layer structure 1110 includes a material for ensuring rigidity and a lightweight material. According to an embodiment, the dielectric layer structure 1110 has a structure in which a layer for ensuring rigidity and a layer made of a lightweight material are stacked. According to an embodiment, the dielectric layer structure 1110 has rigidity, thereby ensuring rigidity of the flexible display 900. According to an embodiment, at least a portion of the dielectric layer structure 1110 is made of a lightweight material, thereby reducing the weight of the flexible display 900.

[0189] According to this embodiment, the dielectric layer structure 1110 includes a first dielectric layer 1111, a second dielectric layer 1112 disposed on one side of the first dielectric layer 1111 adjacent to the display panel 1030, and a third dielectric layer 1113 disposed under the first dielectric layer 1111. According to another embodiment (not shown), one of the second dielectric layer 1112 and the third dielectric layer 1113 is omitted.

[0190] According to one embodiment, the first dielectric layer 1111 is formed of a lightweight material. According to one embodiment, the first dielectric layer 1111 includes a dielectric material having a dielectric constant less than or equal to a predetermined value. For example, the first dielectric layer 1111 is formed of, but is not limited to, glass fiber reinforced plastic (GFRP) having a dielectric constant of 6 or less.

[0191] According to an embodiment, at least a portion of the second dielectric layer 1112 and / or the third dielectric layer 1113 is formed of a material having a rigidity equal to or greater than a predetermined value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 have a rigidity greater than that of the first dielectric layer 1111. According to an embodiment, the second dielectric layer 1112 and the third dielectric layer 1113 are formed of carbon fiber reinforced plastic (CFRP) having high rigidity, thereby ensuring the rigidity of the flexible display 900.

[0192] According to an embodiment, at least a portion of the second dielectric layer 1112 and / or the third dielectric layer 1113 includes a dielectric material having a dielectric constant equal to or greater than a predetermined value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 are formed of, but are not limited to, CFRP having a dielectric constant equal to or greater than 200. According to another example, the second dielectric layer 1112 and the third dielectric layer 1113 have different dielectric constants.

[0193] According to the present embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 are formed inside the first edge of the first dielectric layer 1111. According to the present embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 are formed to correspond to each other.

[0194] According to this embodiment, the dielectric layer structure 1110 further includes a dielectric 1270 extending outward from a second edge of the second dielectric layer 1112 and / or a third edge of the third dielectric layer 1113. For example, the dielectric layer structure 1110 includes a dielectric 1270 extending from a second edge of the second dielectric layer 1112 and / or a third edge of the third dielectric layer 1113 and having an edge spaced a first distance (e.g., D1) from a first side of the housing 810 (e.g., first side 401 in FIG. 4B ).

[0195] According to the present embodiment, the first dielectric layer 1111 includes a plurality of sublayers. According to the present embodiment, the first dielectric layer 1111 includes a plurality of sublayers having structures oriented in different directions. For example, the first dielectric layer 1111 includes a plurality of sublayers having structures oriented in directions substantially perpendicular to each other between adjacent sublayers.

[0196] In this embodiment, the first dielectric layer 1111 includes a first sublayer 1111-1 arranged adjacent to the second dielectric layer 1112 and having a structure oriented in a first direction facing the rear cover (e.g., the first rear cover 880 or the second rear cover 890 in FIG. 8).

[0197] In this embodiment, the first dielectric layer 1111 includes a second sublayer 1111-2 disposed below the first sublayer 1111-1 and having structures oriented in a second direction substantially perpendicular to the first direction, where the second direction is referred to as a direction toward a side member (e.g., the first side member 2011 or the second side member 2021 in FIG. 2A) within the housing 810.

[0198] According to this embodiment, the first dielectric layer 1111 includes a third sublayer 1111-3 disposed below the second sublayer 1111-2 and having a structure oriented in a first direction.

[0199] According to this embodiment, the second dielectric layer 1112 and / or the third dielectric layer 1113 has a structure oriented in a second direction.

[0200] FIG. 12 shows a cross-sectional view of a display according to yet another embodiment and a dielectric layer structure.

[0201] 12, the display 900 (or display structure) of Fig. 12 according to the present embodiment will be referred to as the display 260 of Fig. 3 or the display 900 of Fig. 11. Also, each of the components (e.g., display panel 1030) forming the display 900 of Fig. 12 will be referred to as the components forming the display 260 of Fig. 3 or the display 900 of Fig. 11. Therefore, redundant descriptions of substantially the same components will be omitted.

[0202] According to this embodiment, the dielectric layer structure 1110 includes a first dielectric layer 1111, a second dielectric layer 1112 disposed on one side of the first dielectric layer 1111 adjacent to the display panel 1030, and a third dielectric layer 1113 disposed under the first dielectric layer 1111. According to another embodiment (not shown), one of the second dielectric layer 1112 and the third dielectric layer 1113 is omitted.

[0203] According to one embodiment, the first dielectric layer 1111 is formed of a lightweight material. According to one embodiment, the first dielectric layer 1111 includes a dielectric material having a dielectric constant less than or equal to a predetermined value. For example, the first dielectric layer 1111 is formed of, but is not limited to, glass fiber reinforced plastic (GFRP) having a dielectric constant of 6 or less.

[0204] According to an embodiment, at least a portion of the second dielectric layer 1112 and / or the third dielectric layer 1113 is formed of a material having a rigidity equal to or greater than a predetermined value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 have a rigidity greater than that of the first dielectric layer 1111. According to an embodiment, the second dielectric layer 1112 and the third dielectric layer 1113 are formed of carbon fiber reinforced plastic (CFRP) having high rigidity, thereby ensuring the rigidity of the flexible display 900.

[0205] According to an embodiment, at least a portion of the second dielectric layer 1112 and / or the third dielectric layer 1113 includes a dielectric material having a dielectric constant equal to or greater than a predetermined value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 are formed of, but are not limited to, CFRP having a dielectric constant equal to or greater than 200. According to another example, the second dielectric layer 1112 and the third dielectric layer 1113 have different dielectric constants.

[0206] According to the present embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 are formed inside the first edge of the first dielectric layer 1111. According to the present embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 are formed to correspond to each other.

[0207] According to this embodiment, the dielectric layer structure 1110 further includes a dielectric 1270 extending outward from a second edge of the second dielectric layer 1112 and / or a third edge of the third dielectric layer 1113. For example, the dielectric layer structure 1110 includes a dielectric 1270 extending from the second edge of the second dielectric layer 1112 and / or a third edge of the third dielectric layer 1113 and having an edge spaced a first distance (e.g., first distance D1 in FIG. 4B ) from a first side (e.g., first side 401 in FIG. 4B ) of the housing 810.

[0208] According to the present embodiment, the first dielectric layer 1111 has a woven structure 1210. According to an embodiment, at least a portion of the first dielectric layer 1111 has a woven structure 1210. According to an embodiment, the first dielectric layer 1111 is referred to as a dielectric layer in which dielectrics are woven together. For example, the first dielectric layer 1111 has a woven structure 1210 in which a plurality of dielectrics are crossed with each other. According to an embodiment, the first dielectric layer 1111 is formed of a single layer woven structure 1210, thereby minimizing or reducing the thickness and weight of the dielectric layer structure 1110.

[0209] According to this embodiment, the dielectric layer structure 1110 includes a coating layer 1220 disposed on one side of the second dielectric layer 1112 adjacent to the display panel 1030 and / or on one side of the third dielectric layer 1113 adjacent to the rear cover. According to this embodiment, the dielectric layer structure 1110 includes the coating layer 1220 disposed on one side of the second dielectric layer 1112 and / or on one side of the third dielectric layer 1113, thereby improving the surface quality of the dielectric layer structure 1110.

[0210] FIG. 13A is a diagram showing a dielectric layer structure formed in an area corresponding to a corner of a display according to one embodiment, and FIG. 13B is a diagram showing a dielectric layer structure formed in an area corresponding to a portion of a display according to one embodiment.

[0211] 13A and 13B, the second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment are formed to be spaced apart from the edge of the housing 810 by a predetermined distance (e.g., D1) in an area corresponding to at least a portion of the edge of the housing 810. The second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment are formed to be adjacent to the edge of the housing 810 in an area corresponding to at least a portion of the edge of the housing 810.

[0212] According to this embodiment, the first housing 811 (or the first side member 801) includes a first portion 1301A, a second portion 1301B extending substantially perpendicularly from the first portion 1301A, and a third portion 1301C extending substantially perpendicularly from the second portion 1301B and substantially parallel to the first portion 1301A.

[0213] According to this embodiment, the second housing 812 (or the second side member 802) includes a fourth portion 1302A, a fifth portion 1302B extending substantially perpendicularly from the fourth portion 1302A, and a sixth portion 1302C extending substantially perpendicularly from the fifth portion 1302B and substantially parallel to the fourth portion 1302A.

[0214] 13A, the second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment are formed adjacent to the edges of the housing 810 in areas corresponding to the corners of the housing 810. The second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment are formed to be spaced a predetermined distance (e.g., D1) from the corners of the housing 810 in areas other than the areas corresponding to the corners of the housing 810.

[0215] For example, the second dielectric layer 1112 and / or the third dielectric layer 1113 according to an embodiment is formed to be adjacent to an edge of the first housing 811 in an area corresponding to a corner where the first portion 1301A and the second portion 1301B of the first housing 811 meet. For example, the second dielectric layer 1112 and / or the third dielectric layer 1113 according to an embodiment is formed to be adjacent to an edge of the first housing 811 in an area corresponding to a corner where the second portion 1301B and the third portion 1301C of the first housing 811 meet. For example, the second dielectric layer 1112 and / or the third dielectric layer 1113 is formed to be spaced apart from the edge of the first housing 811 by a predetermined distance (e.g., D1) or more in an area other than the area corresponding to the corner where the first portion 1301A and the second portion 1301B of the first housing 811 meet. For example, the second dielectric layer 1112 and / or the third dielectric layer 1113 are formed to be spaced a predetermined distance (e.g., D1) or more from the edge of the first housing 811 in an area other than the area corresponding to the corner where the second portion 1301B and the third portion 1301C of the first housing 811 meet.

[0216] In one embodiment, the second dielectric layer 1112 and / or the third dielectric layer 1113 are formed on the second housing 812 to correspond to a shape formed on the first housing 811 .

[0217] 13B, the second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment are formed adjacent to the edge of the housing 810 in an area corresponding to at least a portion of the housing 810. The second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment are formed to be spaced apart from the corner of the housing 810 by a predetermined distance (e.g., D1) in an area other than the area corresponding to at least a portion of the housing 810.

[0218] For example, the second dielectric layer 1112 and / or the third dielectric layer 1113 are formed to be adjacent to the edge of the first housing 811 in a region corresponding to a region from a point separated by the first distance d1 from a corner where the second portion 1301B of the first housing 811 meets the first portion 1301A to a point separated by the first distance d1 from a corner where the third portion 1301C meets. For example, the second dielectric layer 1112 and / or the third dielectric layer 1113 are formed to be separated by a predetermined distance (e.g., D1) or more from the edge of the first housing 811 to a point separated by the first distance d1 from the corner where the second portion 1301B of the first housing 811 meets the first portion 1301A. For example, the second dielectric layer 1112 and / or the third dielectric layer 1113 are formed to be spaced a predetermined distance (e.g., D1) or more from the edge of the first housing 811 to a point spaced a first distance d1 from the corner where the second portion 1301B of the first housing 811 meets the third portion 1301C.

[0219] According to another example, the second dielectric layer 1112 and / or the third dielectric layer 1113 are formed adjacent to the edge of the second housing 812 in a region corresponding to a region from a point separated by the third distance d3 from a corner of the fifth portion 1302B of the second housing 812 that meets with the fourth portion 1302A to a point separated by the second distance d2 from a corner of the fifth portion 1302B of the second housing 812 that meets with the sixth portion 1302C. The second dielectric layer 1112 and / or the third dielectric layer 1113 are formed to be separated by a predetermined distance (e.g., D1) or more from the edge of the second housing 812 to a point separated by the second distance d2 from the corner of the fifth portion 1302B of the second housing 812 that meets with the sixth portion 1302C. The second dielectric layer 1112 and / or the third dielectric layer 1113 are formed to be spaced a predetermined distance (e.g., D1) or more from the edge of the second housing 812 to a point spaced a third distance d3 from the corner where the fifth portion 1302B of the second housing 812 meets the fourth portion 1302A.

[0220] According to an embodiment, an electronic device includes a housing including a first side 401 member forming a first side 401 of the electronic device, a second side member forming a second side corresponding to the first side 401, and a hinge connecting the first side 401 member and the second side member, the housing being switchable between a folding state and an unfolding state about the hinge; a rear cover forming a rear side of the electronic device 101; a wireless communication circuit disposed inside the housing and configured to transmit and receive signals of a predetermined frequency by supplying power to at least a portion of the housing; and a display structure coupled to the housing, the display structure including a cover glass 340 forming at least a portion of a front surface of the electronic device 101. the cover glass 340, a display panel 330 disposed adjacent to one side of the cover glass 340, a first dielectric layer 3111 disposed under the display panel 330, a first edge 351 being spaced a first distance D1 from a first side 401, a second dielectric layer 3112 disposed on a first surface of the first dielectric layer 3111 facing the display panel 330, and a third dielectric layer 3113 disposed on a second surface of the first dielectric layer 3111 adjacent to the rear cover, wherein a second edge 352 of the second dielectric layer 3112 and a third edge 353 of the third dielectric layer 3113 corresponding to the first edge 351 of the first dielectric layer 3111 are spaced a second distance D2 from the first side 401 that is greater than the first distance D1, and the first dielectric layer 3111 has a first dielectric constant, and the second dielectric layer 3112 and the third dielectric layer 3113 have dielectric constants greater than the first dielectric constant.

[0221] In one embodiment, the display structure further includes a dielectric 470 extending outward from the second edge 352 and / or the third edge 353, the edge of the dielectric 470 being spaced a first distance D1 from the first side 401.

[0222] In one embodiment, the first dielectric layer 3111 has a first dielectric constant of 6 or less, and the second dielectric layer 3112 and the third dielectric layer 3113 have a dielectric constant of 150 or more.

[0223] In one embodiment, the edge of the cover glass 340 and the display panel 330 are spaced from the first side 401 by a third distance D3 that is greater than the first distance D1 and less than the second distance D2.

[0224] According to one embodiment, the display structure further comprises a first layer 320 disposed below the third dielectric layer 3113, the first layer 320 comprising at least one of a digitizer or a metal plate.

[0225] In one embodiment, the first dielectric layer 3111 comprises glass fiber reinforced plastic (GFRP).

[0226] According to one embodiment, the second dielectric layer 3112 and / or the third dielectric layer 3113 comprise carbon fiber reinforced plastic (CFRP).

[0227] In one embodiment, an edge of the display panel 330 is disposed between the first edge 351 and the second edge 352 when viewed in a direction perpendicular to the front surface of the electronic device 101 .

[0228] In one embodiment, at least one of the first dielectric layer 3111, the second dielectric layer 3112, and the third dielectric layer 3113 has a lattice pattern in at least some areas adjacent the hinge.

[0229] In one embodiment, a first edge 351 of the first dielectric layer 3111, a second edge 352 of the second dielectric layer 3112, and a third edge 353 of the third dielectric layer 3113 are formed in areas corresponding to areas that act as antenna radiators by being powered from wireless communication circuitry inside the housing.

[0230] A display structure according to one embodiment comprises a cover glass 340 forming an outer surface of the display structure, a display panel 330 disposed under the cover glass 340, a first dielectric layer 3111 disposed under the display panel 330 with a first edge 351 at least partially formed outside the edge of the display panel 330, a second dielectric layer 3112 disposed on a first surface of the first dielectric layer 3111 adjacent to the display panel 330, and a third dielectric layer 3113 disposed on a second surface facing in a direction opposite to the first surface of the first dielectric layer 3111, wherein a second edge 352 of the second dielectric layer 3112 and a third edge 353 of the third dielectric layer 3113 corresponding to the first edge 351 of the first dielectric layer 3111 are formed inside the first edge 351, and the first dielectric layer 3111 has a first dielectric constant, and the second dielectric layer 3112 and the third dielectric layer 3113 have dielectric constants greater than the first dielectric constant.

[0231] In one embodiment, the display structure further includes a dielectric 470 extending outwardly from the second edge 352 and / or the third edge 353, the dielectric 470 having an edge corresponding to the first edge 351.

[0232] In one embodiment, the first dielectric layer 3111 comprises glass fiber reinforced plastic (GFRP), and the second dielectric layer 3112 and the third dielectric layer 3113 comprise carbon fiber reinforced plastic (CFRP).

[0233] In one embodiment, the display structure includes a first layer 320 disposed below the third dielectric layer 3113, the first layer 320 including at least one of a digitizer or a metal plate.

[0234] According to an embodiment, the edges of the cover glass 340 and the display panel 330 are formed on the inside of a first edge 351 and on the outside of a second edge 352 .

[0235] According to an embodiment, an electronic device 101 includes a first housing forming a first side 401 of the electronic device 101, a second housing forming a second side corresponding to the first side 401, a housing including a hinge connecting the first housing and the second housing and switchable between a folding state and an unfolding state around the hinge, a wireless communication circuit disposed inside the housing and transmitting / receiving a signal of a predetermined frequency by supplying power to at least a part of the housing, and a display structure coupled to the housing, the display structure including a cover glass 340 coupled to the housing and forming at least a part of a front surface of the electronic device 101. the first region having a first edge 351 at least a portion of which is formed outside an edge of the display panel 330 and at least a portion of which is formed inward from the first edge 351, and a second region extending outward from the first region to form the first edge 351, wherein the first region has a first dielectric constant and the second region has a second dielectric constant smaller than the first dielectric constant.

[0236] In one embodiment, the first region is formed of at least one of a soft graphite resin or a thermally conductive flexible composite resin.

[0237] According to one embodiment, the second region comprises glass fiber reinforced plastic (GFRP).

[0238] According to one embodiment, the electronic device 101 further includes a bracket to which the display structure is attached, and at least a portion of the second region is positioned to correspond to the bracket.

[0239] In one embodiment, the display structure includes a second layer disposed below the first layer 320, which may include at least one of a digitizer or a metal plate.

[0240] An electronic device 101 according to one embodiment includes a housing 810 including a first side member forming a first side of the electronic device 101, a second side member forming a second side corresponding to the first side, and a hinge structure connecting the first side member and the second side member and switchable between a folding state and an unfolding state around the hinge structure, a rear cover forming a rear side of the electronic device 101, a wireless communication circuit disposed inside the housing 810 and configured to transmit and receive signals of a predetermined frequency by supplying power to at least a portion of the housing 810, and a display structure coupled to the housing 810.

[0241] A display structure according to one embodiment includes a display panel, a first dielectric layer 1111 disposed under the display panel, with a first edge spaced a first distance from a first side and having a first dielectric constant, a second dielectric layer 1112 disposed on a first side of the first dielectric layer 1111 facing the display panel, and a third dielectric layer 1113 disposed on a second side of the first dielectric layer 1111 adjacent to a rear cover, the first dielectric layer 1111 being disposed adjacent to the second dielectric layer 1112 and facing the rear cover. The semiconductor device includes a first sublayer 111-1 having structures oriented in a first direction, a second sublayer 111-2 disposed below the first sublayer 111-1 and having structures oriented in a second direction substantially perpendicular to the first direction, and a third sublayer 111-3 disposed below the second sublayer 111-2 and having structures oriented in the first direction, wherein a second dielectric layer 1112 having a dielectric constant greater than the first dielectric constant, and a third dielectric layer 1113 having a dielectric constant greater than the first dielectric constant, have structures oriented in the second direction.

[0242] According to one embodiment, the display structure further includes a dielectric 1270 extending outward from a second edge of the second dielectric layer 1112 and / or a third edge of the third dielectric layer 1113, the edge of the dielectric 1270 being spaced a first distance from the first side.

[0243] The electronic device 101 according to one embodiment includes a housing 810 including a first side member forming a first side of the electronic device 101, a second side member forming a second side corresponding to the first side, and a hinge structure connecting the first side member and the second side member, and the housing 810 can be switched between a folded state and an unfolded state around the hinge structure; a rear cover forming a rear side of the electronic device 101; a wireless communication circuit disposed inside the housing 810 and configured to transmit and receive signals of a predetermined frequency by supplying power to at least a portion of the housing 810; and a display structure coupled to the back cover 810, the display structure including a display panel, a first dielectric layer 1111 disposed under the display panel and having a first edge spaced a first distance from the first side, a second dielectric layer 1112 disposed on a first surface of the first dielectric layer 1111 adjacent to the display panel and having a second edge corresponding to the first edge, and a third dielectric layer 1113 disposed on a second surface of the first dielectric layer 1111 facing the rear cover and having a third edge corresponding to the first edge, wherein the first dielectric layer 1111 has a woven structure 1210.

[0244] According to one embodiment, the display structure further includes a coating layer 1220 disposed on one side of the second dielectric layer 1112 adjacent to the display panel and / or on one side of the third dielectric layer 1113 facing the rear cover.

[0245] In one embodiment, the display structure further includes a dielectric 1270 extending outward from a second edge of the second dielectric layer and / or a third edge of the third dielectric layer, the edge of the dielectric 1270 being spaced a first distance from the first side.

[0246] While the present invention has been shown and described with reference to various exemplary embodiments, it will be understood that the various exemplary embodiments are intended to be illustrative and not restrictive. It will be further understood by those skilled in the art that various changes in form and detail may be made without departing from the true spirit and overall scope of the present invention, including the scope of the claims and equivalents thereof. It will also be understood that any embodiment described herein may be used in conjunction with any other embodiment described herein. [Explanation of symbols]

[0247] 30 Bracket Assembly 90 Display section 100 Network Environment 101, 102, 104, 800 Electronic equipment 108 Server 111-1~111-3 1st~3rd sublayer 120 processors 121 Main Processor 123 Auxiliary Processor 130 Memory 132 Volatile Memory 134 Non-volatile memory 136 Internal Memory 138 External Memory 140 Programs 142 Operating Systems 144 Middleware 146 Applications 150 Input Module 155 Acoustic Output Module 160 Display Module 170 Audio Module 176 Sensor Module 177 Interface 178 Connection terminal 179 Haptic Module 180 Camera Module 188 Power Management Module 189 Battery 190 Communication Module 192 Wireless communication module 194 Wired communication module 196 Subscriber Identity Module 197 Antenna Module 198, 199 1st and 2nd Networks 200, 810 (foldable) housing 201, 202 1st and 2nd housing 201A~201C, 202A~202C Parts 1~6 203 Connection (hinge) 230 Hinge cover 260 (Flexible) (Foldable) Display (Display Structure) 261, 262 1st and 2nd area 263 folding regions 265 Sub-display 280 、980 Rear Camera 311 Dielectric Layer Structure 320 1st Layer 321 Digitizer 322 Metal Plate 330 Display Panel 331 Cover Panel Panel 332 333 Plastic film (polarizing film) 340 Coverslip 341 Transparent plate 342 Film Layer 351~353 1st~3rd edge 354, 360 Edge 370 Lattice Pattern 381 Adhesive layer 390 Thermoplastic materials 401 1st aspect 470, 1270 Dielectric 501, 502 1st, 2nd area 510 Wireless communication circuits 511~518 1st~8th points 611~613 1st~3rd area 630 Bracket 640 Hinge 800A deployed state (first state) 800B Folded state (second state) 801 Front (first side) 802 Back side (2nd side) 811, 812 1st and 2nd housing 813, 814 First and second rotating support surfaces 850 Camera hole 851 USB hole 880, 890 1st and 2nd rear covers 900 (Flexible) (Main) Display (Display Structure) 901, 902 First and second display areas 903 Folding Region 920 Sub-display 930 Hinge cover 931, 932 1st and 2nd rear area 1000 Hinge Structure 1011, 1012 1st and 2nd brackets 1030 Display Panel 1043 Wiring materials 1100 Circuit Board 1101, 1102 First and second boards 1103, 1104 First and second printed circuit boards 1110 Dielectric layer structure 1111~1113 1st~3rd dielectric layers 1111-1~1111-3 1st~3rd sublayer 1151, 1152 1st and 2nd battery 1153 Speaker Module 1210 Textile structure 1220 Coating layer 1301A~1301C, 1302A~1302C Part 1~6 2011, 2021 1st and 2nd side members 2013, 2023 1st and 2nd rear covers 3111~3113 1st~3rd dielectric layers

Claims

1. 1. An electronic device comprising: a housing including a first side member forming a first side of the electronic device, a second side member forming a second side corresponding to the first side, and a hinge connecting the first side member and the second side member, the housing being switchable between a folding state and an unfolding state about the hinge; a rear cover forming a rear surface of the electronic device; a wireless communication circuit disposed inside the housing and configured to transmit and receive signals at a predetermined frequency by supplying power to at least a portion of the housing; a display structure coupled to the housing; The display structure comprises: a cover glass forming at least a portion of a front surface of the electronic device; a display panel disposed adjacent to one surface of the cover glass; a first dielectric layer disposed under the display panel, the first edge being spaced a first distance from the first side; a second dielectric layer disposed on a first surface of the first dielectric layer adjacent the display panel; a third dielectric layer disposed on a second surface of the first dielectric layer adjacent the rear cover; a second edge of the second dielectric layer and a third edge of the third dielectric layer corresponding to the first edge of the first dielectric layer are spaced apart from the first side by a second distance greater than the first distance; the first dielectric layer having a first dielectric constant; The electronic device, wherein the second dielectric layer and the third dielectric layer have a dielectric constant greater than the first dielectric constant.

2. the display structure further includes a dielectric extending outwardly from the second edge and / or the third edge; an edge of the dielectric body spaced from the first side by the first distance; The electronic device according to claim 1 , wherein the dielectric constant of the dielectric material is the first dielectric constant.

3. the first dielectric constant of the first dielectric layer is less than or equal to 6; The electronic device of claim 1 , wherein the second dielectric layer and the third dielectric layer have a dielectric constant of 150 or greater.

4. The electronic device of claim 1 , wherein the cover glass and an edge of the display panel are spaced from the first side by a third distance that is greater than the first distance and less than the second distance.

5. The display structure further includes a first layer disposed below the third dielectric layer; 10. The electronic device of claim 1, wherein the first layer includes at least one of a digitizer or a metal plate.

6. The electronic device of claim 1 , wherein the first dielectric layer comprises glass fiber reinforced plastic (GFRP).

7. The electronic device of claim 1 , wherein the second dielectric layer and / or the third dielectric layer comprises carbon fiber reinforced plastic (CFRP).

8. The electronic device according to claim 1 , wherein an edge of the display panel is disposed between the first edge and the second edge when viewed from a direction perpendicular to a front surface of the electronic device.

9. 2. The electronic device of claim 1, wherein at least one of the first dielectric layer, the second dielectric layer, and the third dielectric layer has a lattice pattern in at least a portion of an area adjacent to the hinge.

10. 2. The electronic device according to claim 1, wherein the first edge of the first dielectric layer, the second edge of the second dielectric layer, and the third edge of the third dielectric layer are formed in areas corresponding to areas that operate as antenna radiators by being powered from the wireless communication circuit inside the housing.

11. 1. An electronic device comprising: a housing including a first side member forming a first side of the electronic device, a second side member forming a second side corresponding to the first side, and a hinge connecting the first side member and the second side member, the housing being switchable between a folding state and an unfolding state about the hinge; a rear cover forming a rear surface of the electronic device; a wireless communication circuit disposed inside the housing and configured to transmit and receive signals at a predetermined frequency by supplying power to at least a portion of the housing; a display structure coupled to the housing; The display structure comprises: A display panel; a first dielectric layer disposed under the display panel, the first edge being spaced a first distance from the first side, the first dielectric layer having a first dielectric constant; a second dielectric layer disposed on a first surface of the first dielectric layer adjacent the display panel; a third dielectric layer disposed on a second surface of the first dielectric layer adjacent the rear cover; a second edge of the second dielectric layer and a third edge of the third dielectric layer are formed inside the first edge of the first dielectric layer, and the second edge of the second dielectric layer and the third edge of the third dielectric layer are formed to correspond to each other; The first dielectric layer is a first sublayer disposed adjacent to the second dielectric layer and having structures oriented in a first direction facing the rear cover; a second sublayer disposed below the first sublayer and having structures oriented in a second direction substantially perpendicular to the first direction; a third sublayer disposed below the second sublayer and having a structure oriented in the first direction; The electronic device, characterized in that the second dielectric layer having a dielectric constant greater than the first dielectric constant and the third dielectric layer having a dielectric constant greater than the first dielectric constant have a structure oriented in the second direction.

12. the display structure further includes a dielectric extending outwardly from a second edge of the second dielectric layer and / or a third edge of the third dielectric layer; an edge of the dielectric body spaced from the first side by the first distance; The electronic device of claim 11 , wherein the dielectric constant of the dielectric material is the first dielectric constant.

13. 1. An electronic device comprising: a housing including a first side member forming a first side of the electronic device, a second side member forming a second side corresponding to the first side, and a hinge connecting the first side member and the second side member, the housing being switchable between a folding state and an unfolding state about the hinge; a rear cover forming a rear surface of the electronic device; a wireless communication circuit disposed inside the housing and configured to transmit and receive signals at a predetermined frequency by supplying power to at least a portion of the housing; a display structure coupled to the housing; The display structure comprises: A display panel; a first dielectric layer disposed under the display panel, the first edge being spaced a first distance from the first side; a second dielectric layer disposed on a first surface of the first dielectric layer adjacent the display panel, the second dielectric layer having a second edge corresponding to the first edge; a third dielectric layer disposed on a second surface of the first dielectric layer facing the rear cover, the third dielectric layer having a third edge corresponding to the first edge; the first dielectric layer having a first dielectric constant; the second dielectric layer and the third dielectric layer have a dielectric constant greater than the first dielectric constant; a second edge of the second dielectric layer and a third edge of the third dielectric layer are formed inside the first edge of the first dielectric layer, and the second edge of the second dielectric layer and the third edge of the third dielectric layer are formed to correspond to each other; The electronic device, wherein the first dielectric layer has a woven structure.

14. 14. The electronic device of claim 13, wherein the display structure further comprises a coating layer disposed on one side of the second dielectric layer adjacent to the display panel and / or on one side of the third dielectric layer facing the rear cover.

15. the display structure further includes a dielectric extending outwardly from the second edge and / or the third edge; an edge of the dielectric body spaced from the first side by the first distance; The electronic device of claim 13 , wherein the dielectric constant of the dielectric material is the first dielectric constant.

Images