State detection device and state detection method

Abstract

To detect an open / close state of a chuck pin while suppressing a reduction in detection accuracy.SOLUTION: A state detection device includes at least one chuck pin for holding a substrate, an imaging unit for imaging the chuck pin and taking at least one image obtained as a target image, a matching coordinate calculation unit for performing matching processing between the target image and a reference image, which is at least one image showing the chuck pin, and calculating matching coordinates, which are coordinates indicating the location of the target image of the reference image when a matching score between the images is the highest, and a detection unit for detecting the open / close state of the chuck pin on the basis of the matching coordinates.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technology disclosed herein relates to image-based detection technology. [Background technology]

[0002] In a substrate processing apparatus, the open / closed state of a chuck pin for holding a substrate is detected using a sensor provided in a holding unit that holds the substrate and disposed at an edge of the substrate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-232523 A Summary of the Invention [Problem to be solved by the invention]

[0004] A sensor disposed at the edge of a substrate may have its detection section contaminated by the processing liquid supplied from a nozzle during substrate processing, or by the mist formed by the processing liquid, resulting in reduced detection accuracy.

[0005] The technology disclosed in the present specification has been made in consideration of the problems described above, and is a technology for detecting the open / closed state of the chuck pin while suppressing a decrease in detection accuracy. [Means for solving the problem]

[0006] A state detection method that is a first aspect of the technology disclosed in the present specification includes the steps of obtaining at least one image including a portion of at least one chuck pin for holding a substrate as a reference image, obtaining at least one image obtained by imaging at least a portion of the chuck pin as a target image, performing a matching process between the reference image and the target image, and calculating matching coordinates that are coordinates indicating the position of the reference image in the target image when the matching score between the images is highest, and detecting the open / closed state of the chuck pin based on the matching coordinates.

[0007] A state detection method according to a second aspect of the technology disclosed in the present specification is related to the state detection method according to the first aspect, and the range indicated by the reference image corresponds to a partial range in the target image.

[0008] A state detection method that is a third aspect of the technology disclosed in the present specification is related to the state detection method that is the first or second aspect, and the reference image is an image that does not include the substrate.

[0009] A state detection method which is a fourth aspect of the technology disclosed in the present specification is related to the state detection method which is any one of the first to third aspects, and the chuck pin in the reference image is either in an open state, a closed state in which the chuck pin is holding the substrate, or a closed state in which the chuck pin is not holding the substrate.

[0010] A condition detection method which is a fifth aspect of the technology disclosed in the present specification is related to the condition detection method which is any one of the first to fourth aspects, and the step of obtaining the reference image is a step of obtaining a plurality of the reference images respectively corresponding to a plurality of the chuck pins, and the step of obtaining the target image is a step of imaging the chuck pins shown in each of the reference images to obtain a plurality of the target images.

[0011] A state detection method which is a sixth aspect of the technology disclosed in the present specification is related to the state detection method which is any one of the first to fifth aspects, and further includes a step of detecting whether or not the substrate is held by the chuck pin, and the step of detecting the open / closed state of the chuck pin is a step of detecting the open / closed state of the chuck pin based on the matching coordinates which are included in a coordinate range which is limited depending on whether or not the substrate is held by the chuck pin.

[0012] A condition detection method which is a seventh aspect of the technology disclosed in the present specification is related to a condition detection method which is any one of the first to sixth aspects, and at least one of the ranges indicated by the reference image and the target image has a longitudinal direction that runs along the outer edge of the substrate held by the chuck pin.

[0013] A state detection method which is an eighth aspect of the technology disclosed in the present specification is related to the state detection method which is any one of the first to seventh aspects, and in the step of obtaining the reference image, coordinates of a predetermined pixel corresponding to the reference image are set as reference coordinates and a threshold value is set based on the reference coordinates, and in the step of detecting the open / closed state of the chuck pin, the open / closed state of the chuck pin is detected based on whether or not the matching coordinates are within the range of the threshold value when compared with the reference coordinates.

[0014] A state detection device that is a ninth aspect of the technology disclosed in the present specification includes at least one chuck pin for holding a substrate, an imaging unit that images at least a portion of the chuck pin and treats the obtained at least one image as a target image, a matching coordinate calculation unit that performs a matching process between the target image and a reference image that is at least one image including a portion of the chuck pin and calculates matching coordinates that are coordinates indicating the position of the reference image in the target image when the matching score between the images is highest, and a detection unit that detects the open / closed state of the chuck pin based on the matching coordinates. Effect of the Invention

[0015] According to at least the first and ninth aspects of the technique disclosed in the present specification, the open / closed state of the chuck pin can be detected based on matching coordinates calculated by performing matching processing using a target image obtained by capturing an image of the chuck pin. Therefore, even if a sensor or the like is not arranged on the edge of the substrate, a camera or the like that captures an image of the chuck pin is sufficient, and therefore the open / closed state of the chuck pin can be detected while suppressing a decrease in detection accuracy.

[0016] Furthermore, objects, features, aspects and advantages associated with the technology disclosed herein will become more apparent from the detailed description set forth below and the accompanying drawings. [Brief description of the drawings]

[0017] [Figure 1] 1 is a diagram showing an example of an overall configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] FIG. 2 is a plan view of a processing unit according to the embodiment. [Diagram 3] FIG. 2 is a cross-sectional view of a processing unit according to the embodiment. [Figure 4] FIG. 2 is a diagram conceptually illustrating an example of a function of a control unit. [Diagram 5] 5 is a diagram illustrating a schematic example of a hardware configuration when the control unit illustrated in FIG. 4 is actually operated. FIG. [Figure 6] 4 is a flowchart showing an operation of the substrate processing apparatus according to the embodiment. [Figure 7] FIG. 13 is a diagram showing an example of an overall image capturing the entire spin chuck for obtaining a reference image in a second state. [Figure 8] FIG. 2 shows a spin chuck for obtaining an image of the object. [Figure 9] FIG. 13 is a diagram illustrating an example of a distribution of matching coordinates. [Figure 10] FIG. 13 is a diagram illustrating an example of a distribution of matching coordinates. [Figure 11] FIG. 13 is a diagram showing an example of extraction of a target image. [Figure 12]FIG. 13 is a diagram showing an example of reference coordinates in a reference image. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, the embodiments will be described with reference to the accompanying drawings. In the following embodiments, detailed features are shown for the purpose of explaining the technology, but they are merely examples and are not necessarily essential features for enabling the embodiments to be implemented.

[0019] The drawings are schematic, and for the convenience of explanation, the configuration may be omitted or simplified as appropriate. The size and positional relationship of the configurations shown in different drawings are not necessarily described accurately, and may be changed as appropriate. Hatching may be added to drawings such as plan views that are not cross-sectional views, in order to make it easier to understand the contents of the embodiment.

[0020] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

[0021] Furthermore, in the description in this specification, when a certain component is described as "comprising," "including," or "having," unless otherwise specified, this is not an exclusive expression that excludes the presence of other components.

[0022] Furthermore, even if ordinal numbers such as "first" or "second" are used in the description of this specification, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and the contents of the embodiments are not limited to the orders that may result from these ordinal numbers.

[0023] In addition, in the explanations given in this specification, expressions indicating relative or absolute positional relationships, such as "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," or "coaxial," are intended to include cases in which the positional relationship is strictly indicated, as well as cases in which the angle or distance is displaced within a tolerance or a range in which equivalent functionality is obtained, unless otherwise specified.

[0024] Furthermore, although the descriptions in this specification may use terms indicating specific positions or directions, such as "top," "bottom," "left," "right," "side," "bottom," "front," or "back," these terms are used for convenience to facilitate understanding of the contents of the embodiments, and do not relate to the positions or directions in which the embodiments are actually implemented.

[0025] <Embodiment> The state detection device and the state detection method according to this embodiment will be described below.

[0026] <Configuration of the substrate processing apparatus> 1 is a plan view illustrating a schematic configuration example of a substrate processing apparatus 100 according to the present embodiment. The substrate processing apparatus 100 includes a load port 601, an indexer robot 602, a center robot 603, a controller 9, and at least one processing unit 1 (four processing units in FIG. 1).

[0027] The substrates to be processed include, for example, semiconductor wafers, glass substrates for liquid crystal displays, substrates for flat panel displays (FPDs) such as organic electroluminescence (EL) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, glass substrates for photomasks, ceramic substrates, substrates for field emission displays (i.e., FEDs), and substrates for solar cells.

[0028] The substrate processing apparatus 100 according to this embodiment performs a cleaning process on a substrate W, which is a circular, thin-plate-shaped silicon substrate, using a chemical solution and a rinse liquid such as pure water, and then performs a drying process.

[0029] As the chemical liquid, for example, a mixed solution of ammonia and hydrogen peroxide (SC1), a mixed aqueous solution of hydrochloric acid and hydrogen peroxide (SC2), or a DHF liquid (dilute hydrofluoric acid) is used.

[0030] In the following description, the chemical liquid and the rinsing liquid are collectively referred to as the "processing liquid." Note that the term "processing liquid" includes not only cleaning liquids, but also coating liquids such as photoresist liquids for film formation, chemical liquids for removing unnecessary films, and chemical liquids for etching.

[0031] The processing unit 1 is a single-wafer type apparatus that can be used for substrate processing, and specifically, is an apparatus that performs processing to remove organic matter adhering to the substrate W. The organic matter adhering to the substrate W is, for example, a used resist film. The resist film has been used, for example, as an implantation mask for an ion implantation process.

[0032] The processing unit 1 may have a chamber 10. In this case, the atmosphere within the chamber 10 may be controlled by the control unit 9, allowing the processing unit 1 to perform substrate processing in a desired atmosphere.

[0033] The control unit 9 can control the operation of each component in the substrate processing apparatus 100. The carrier C is a container that contains a substrate W. The load port 601 is a container holding mechanism that holds a plurality of carriers C. The indexer robot 602 can transport the substrate W between the load port 601 and the substrate placement unit 604. The center robot 603 can transport the substrate W between the substrate placement unit 604 and the processing unit 1.

[0034] With the above configuration, the indexer robot 602, the substrate platform 604, and the center robot 603 function as a transport mechanism for transporting the substrate W between each of the processing units 1 and the load port 601.

[0035] The unprocessed substrate W is taken out of the carrier C by the indexer robot 602. Then, the unprocessed substrate W is delivered to the center robot 603 via the substrate placement portion 604.

[0036] The center robot 603 carries the unprocessed substrate W into the processing unit 1. Then, the processing unit 1 processes the substrate W.

[0037] The substrate W that has been processed in the processing unit 1 is removed from the processing unit 1 by the center robot 603. Then, the processed substrate W passes through other processing units 1 as necessary, and is then transferred to the indexer robot 602 via the substrate placement part 604. The indexer robot 602 carries the processed substrate W into the carrier C. In this manner, the processing of the substrate W is completed.

[0038] Fig. 2 is a plan view of the processing unit 1 according to the present embodiment, and Fig. 3 is a cross-sectional view of the processing unit 1 according to the present embodiment.

[0039] FIG. 2 shows a state in which the substrate W is not held by the spin chuck 20, and FIG. 3 shows a state in which the substrate W is held by the spin chuck 20. As shown in FIG.

[0040] The processing unit 1 is provided with a spin chuck 20 within a chamber 10 for holding a substrate W in a horizontal position (i.e., a position in which the normal to the top surface of the substrate W is along the vertical direction), three nozzles 30, nozzle 60 and nozzle 65 for supplying a processing liquid to the top surface of the substrate W held on the spin chuck 20, a processing cup 40 surrounding the spin chuck 20, and a camera 70 for imaging the spin chuck 20.

[0041] Further, a partition plate 15 is provided around the processing cup 40 in the chamber 10 to separate the inner space of the chamber 10 into upper and lower spaces.

[0042] The chamber 10 includes a sidewall 11 that extends vertically and surrounds all four sides, a ceiling wall 12 that closes the upper side of the sidewall 11, and a floor wall 13 that closes the lower side of the sidewall 11. The space surrounded by the sidewall 11, the ceiling wall 12, and the floor wall 13 becomes a processing space for the substrate W.

[0043] Further, a part of the side wall 11 of the chamber 10 is provided with a loading / unloading entrance through which the center robot 603 loads / unloads the substrate W into / from the chamber 10, and a shutter for opening / closing the loading / unloading entrance (both are not shown).

[0044] A fan filter unit (FFU) 14 is attached to the ceiling wall 12 of the chamber 10 to further purify the air in a clean room in which the substrate processing apparatus 100 is installed and supply the purified air to the processing space in the chamber 10. The FFU 14 includes a fan and a filter (e.g., a high efficiency particulate air filter (HEPA) filter) for taking in air from the clean room and sending it out into the chamber 10.

[0045] The FFU 14 forms a downflow of clean air in the processing space inside the chamber 10. In order to uniformly distribute the clean air supplied from the FFU 14, a punching plate having a large number of blowing holes formed therein may be provided directly below the ceiling wall 12.

[0046] The spin chuck 20 includes a spin base 21, a spin motor 22, a cover member 23, and a rotating shaft 24. The spin base 21 has a disk shape, and is fixed in a horizontal position to the upper end of the rotating shaft 24 that extends along the vertical direction. The spin motor 22 is provided below the spin base 21, and rotates the rotating shaft 24. The spin motor 22 rotates the spin base 21 in a horizontal plane via the rotating shaft 24. The cover member 23 has a cylindrical shape that surrounds the periphery of the spin motor 22 and the rotating shaft 24.

[0047] The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. The spin base 21 has a holding surface 21a that faces the entire lower surface of the substrate W to be held.

[0048] A plurality of chuck pins 26 (four in this embodiment) are provided on the peripheral portion of the holding surface 21a of the spin base 21. The plurality of chuck pins 26 are arranged at equal intervals along a circumference that corresponds to the outer diameter of the peripheral circle of the circular substrate W. In this embodiment, four chuck pins 26 are provided at 90° intervals.

[0049] The multiple chuck pins 26 are driven in cooperation with each other by a link mechanism (not shown) housed in the spin base 21. The spin chuck 20 holds the substrate W in a horizontal position close to the holding surface 21a above the spin base 21 by bringing each of the multiple chuck pins 26 into contact with the outer circumferential edge of the substrate W to hold the substrate W (see FIG. 3). The spin chuck 20 also releases the grip of the substrate W by moving each of the multiple chuck pins 26 away from the outer circumferential edge of the substrate W.

[0050] At least one of the multiple chuck pins 26 is configured to be able to be held at the outer circumferential edge of the substrate W by a magnet, a spring, or the like, and can maintain an open state in which it is spaced apart from the outer circumferential edge of the substrate W, and a closed state in which it is in contact with the outer circumferential edge of the substrate W. The drive of the chuck pin 26 is controlled by the control unit 9.

[0051] When only some of the multiple chuck pins 26 are driven to grip the substrate W, the other chuck pins 26 may be support pins that support the lower surface of the substrate W.

[0052] The lower end of the cover member 23 that covers the spin motor 22 is fixed to the floor wall 13 of the chamber 10, and the upper end reaches just below the spin base 21. A flange-shaped member 25 is provided at the upper end of the cover member 23, which protrudes outward from the cover member 23 almost horizontally and then bends and extends downward.

[0053] With the spin chuck 20 holding the substrate W by gripping with the multiple chuck pins 26, the spin motor 22 rotates the rotation shaft 24 to rotate the substrate W about a rotation axis CX that runs along a vertical direction passing through the center of the substrate W. The drive of the spin motor 22 is controlled by the control unit 9.

[0054] The nozzle 30 is configured by attaching a discharge head 31 to the tip of a nozzle arm 32. The base end side of the nozzle arm 32 is fixedly connected to a nozzle base 33. The nozzle arm 32 is made rotatable about an axis along the vertical direction by a motor 332 (nozzle moving unit) provided on the nozzle base 33.

[0055] 2, the nozzle 30 moves in an arc along the horizontal direction between a position above the spin chuck 20 and a standby position outside the processing cup 40. The rotation of the nozzle base 33 causes the nozzle 30 to swing above the holding surface 21a of the spin base 21.

[0056] The processing unit 1 of this embodiment is provided with two nozzles, a nozzle 60 and a nozzle 65, in addition to the nozzle 30 described above. The nozzle 60 and the nozzle 65 of this embodiment have the same configuration as the nozzle 30 described above.

[0057] That is, the nozzle 60 is constructed by attaching an ejection head to the tip of a nozzle arm 62, and moves in an arc between a processing position above the spin chuck 20 and a waiting position outside the processing cup 40, as indicated by arrow AR64, by a nozzle base 63 connected to the base end side of the nozzle arm 62.

[0058] Similarly, the nozzle 65 is constructed by attaching an ejection head to the tip of a nozzle arm 67, and moves in an arc between a processing position above the spin chuck 20 and a waiting position outside the processing cup 40, as indicated by arrow AR69, by a nozzle base 68 connected to the base end side of the nozzle arm 67.

[0059] The nozzle 60 and the nozzle 65 are also configured to supply a plurality of types of processing liquid including at least pure water, and discharge the processing liquid onto the upper surface of the substrate W held by the spin chuck 20 at the processing position.

[0060] A lower processing liquid nozzle 28 is provided along the vertical direction so as to pass through the inside of the rotation shaft 24. The upper end opening of the lower processing liquid nozzle 28 is formed at a position facing the center of the lower surface of the substrate W held by the spin chuck 20. The lower processing liquid nozzle 28 is also configured to supply multiple types of processing liquid. The processing liquid ejected from the lower processing liquid nozzle 28 lands on the lower surface of the substrate W held by the spin chuck 20.

[0061] The nozzle 30, the nozzle 60, the nozzle 65, and the lower processing liquid nozzle 28 are driven under the control of the control unit 9.

[0062] The processing cup 40 surrounding the spin chuck 20 includes an inner cup 41, a middle cup 42, and an outer cup 43 that can be raised and lowered independently of each other. The inner cup 41 surrounds the periphery of the spin chuck 20 and has a shape that is almost rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The inner cup 41 integrally includes a bottom portion 44 that is annular in plan view, a cylindrical inner wall portion 45 that rises upward from the inner peripheral edge of the bottom portion 44, a cylindrical outer wall portion 46 that rises upward from the outer peripheral edge of the bottom portion 44, a first guide portion 47 that rises between the inner wall portion 45 and the outer wall portion 46 and extends obliquely upward toward the center (in the direction approaching the rotation axis CX of the substrate W held by the spin chuck 20) ​​while drawing a smooth arc, and a cylindrical middle wall portion 48 that rises upward from between the first guide portion 47 and the outer wall portion 46.

[0063] The inner wall portion 45 is formed to a length such that, when the inner cup 41 is in the most raised state, it can be accommodated between the cover member 23 and the flange-shaped member 25 with an appropriate gap maintained. The middle wall portion 48 is formed to a length such that, when the inner cup 41 and the inner cup 42 are in the closest state, it can be accommodated between a second guide portion 52 (described later) of the inner cup 42 and the treatment liquid separating wall 53 with an appropriate gap maintained.

[0064] The first guide portion 47 has an upper end portion 47b that extends obliquely upward toward the center (in the direction approaching the rotation axis CX of the substrate W) while describing a smooth arc. A disposal groove 49 for collecting and disposing of used processing liquid is provided between the inner wall portion 45 and the first guide portion 47. A circular inner recovery groove 50 for collecting and recovering used processing liquid is provided between the first guide portion 47 and the middle wall portion 48. A circular outer recovery groove 51 for collecting and recovering a different type of processing liquid from the inner recovery groove 50 is provided between the middle wall portion 48 and the outer wall portion 46.

[0065] The inner cup 42 surrounds the periphery of the spin chuck 20 and has a shape that is approximately rotationally symmetrical about the rotation axis CX that passes through the center of the substrate W held by the spin chuck 20. The inner cup 42 has a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.

[0066] The second guide portion 52 has a lower end portion 52a, which is cylindrical and coaxial with the lower end portion of the first guide portion 47, on the outside of the first guide portion 47 of the inner cup 41, an upper end portion 52b which extends obliquely upward toward the center (in the direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc from the upper end of the lower end portion 52a, and a folded portion 52c which is formed by folding back the tip of the upper end portion 52b downward. When the inner cup 41 and the middle cup 42 are in the closest position to each other, the lower end portion 52a is accommodated in the inner recovery groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48. The upper end portion 52b is provided so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and when the inner cup 41 and the middle cup 42 are in the closest position to each other, the upper end portion 52b is in close proximity to the upper end portion 47b of the first guide portion 47 with a very small gap therebetween. The folded portion 52c overlaps with the tip of the upper end portion 47b of the first guide portion 47 in the horizontal direction when the inner cup 41 and the intermediate cup 42 are in the closest position to each other.

[0067] The upper end 52b of the second guide portion 52 is formed so that its thickness increases downward. The processing liquid separation wall 53 has a cylindrical shape and is provided so as to extend downward from the outer peripheral edge of the lower end of the upper end 52b. The processing liquid separation wall 53 is accommodated in the outer recovery groove 51 with an appropriate gap maintained between the middle wall portion 48 and the outer cup 43 when the inner cup 41 and the middle cup 42 are in the closest position to each other.

[0068] The outer cup 43 has a shape that is approximately rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held on the spin chuck 20. The outer cup 43 surrounds the spin chuck 20 outside the second guide portion 52 of the inner cup 42. This outer cup 43 functions as a third guide portion. The outer cup 43 has a lower end portion 43a that is cylindrical and coaxial with the lower end portion 52a of the second guide portion 52, an upper end portion 43b that extends obliquely upward toward the center (in the direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc from the upper end of the lower end portion 43a, and a folded portion 43c that is formed by folding back the tip of the upper end portion 43b downward.

[0069] When the inner cup 41 and the outer cup 43 are in the closest position, the lower end 43a is accommodated in the outer recovery groove 51 with an appropriate gap maintained between the processing liquid separating wall 53 of the inner cup 42 and the outer wall portion 46 of the inner cup 41. The upper end 43b is provided so as to overlap with the second guide portion 52 of the inner cup 42 in the vertical direction, and when the inner cup 42 and the outer cup 43 are in the closest position, it is in close proximity to the upper end 52b of the second guide portion 52 with an extremely small gap maintained. When the inner cup 42 and the outer cup 43 are in the closest position, the folded portion 43c overlaps with the folded portion 52c of the second guide portion 52 in the horizontal direction.

[0070] The driving of the processing cup 40 is controlled by the control unit 9.

[0071] Partition plate 15 is provided around processing cup 40 to divide the inner space of chamber 10 into upper and lower portions.

[0072] The outer peripheral edge of partition plate 15 is connected to side wall 11 of chamber 10. In addition, the outer edge portion of partition plate 15 surrounding processing cup 40 is formed into a circular shape with a diameter larger than the outer diameter of outer cup 43.

[0073] An exhaust duct 18 is provided in a portion of the side wall 11 of the chamber 10 and in the vicinity of the floor wall 13. The exhaust duct 18 is connected in communication with an exhaust mechanism (not shown). Of the clean air supplied from the FFU 14 and flowing down inside the chamber 10, the air that passes between the processing cup 40 and the partition plate 15 is exhausted from the exhaust duct 18 to the outside of the apparatus.

[0074] Fig. 4 is a diagram conceptually illustrating an example of the functions of the control unit 9. As illustrated in the example of Fig. 4, the control unit 9 includes a matching coordinate calculation unit 91, a detection unit 92, and a drive control unit 93. The control unit 9 also functions as a state detection device.

[0075] The matching coordinate calculation unit 91 performs matching processing and calculates matching coordinates using the image of the chuck pin captured by the camera 70. The specific operation of the matching coordinate calculation unit 91 will be described later.

[0076] Based on the matching coordinates, the detection unit 92 detects the open / closed state of the chuck pin 26. The specific operation of the detection unit 92 will be described later.

[0077] The drive control unit 93 controls the drive of a drive unit 190 including the chuck pin 26, spin motor 22, nozzle 30, nozzle 60, nozzle 65, lower processing liquid nozzle 28, and processing cup 40 in the processing unit 1. Here, the drive unit 190 for the chuck pin 26 includes a motor (not shown) for moving a magnet or switching between energizing and deenergizing a spring. Note that the drive control unit 93 may control the drive unit 190 based on the detection result of the open / closed state of the chuck pin 26 by the detection unit 92.

[0078] FIG. 5 is a diagram illustrating a schematic example of a hardware configuration when the control unit 9 illustrated in FIG. 4 is actually operated.

[0079] FIG. 5 shows a processing circuit 1102A that performs calculations and a memory device 1103 that can store information as the hardware configuration for realizing the matching coordinate calculation unit 91, detection unit 92, and drive control unit 93 in FIG. 4.

[0080] The processing circuit 1102A is, for example, a CPU, etc. The storage device 1103 is, for example, a memory (storage medium) such as a hard disk drive (HDD), a RAM, a ROM, or a flash memory.

[0081] <Operation of the substrate processing apparatus> Normal processing of a substrate W in the substrate processing apparatus 100 includes, in order, a process in which the center robot 603 transports the substrate W to be processed received from the indexer robot 602 into each processing unit 1, a process in which the processing unit 1 performs substrate processing on the substrate W, and a process in which the center robot 603 transports the processed substrate W from the processing unit 1 and returns it to the indexer robot 602.

[0082] Next, a procedure of a cleaning process and a drying process in a typical substrate processing of a substrate W in each processing unit 1 will be described with reference to Fig. 6. Fig. 6 is a flow chart showing an operation of the substrate processing apparatus 100 according to the present embodiment. The following operation is mainly performed under the control of the control unit 9.

[0083] First, a chemical liquid is supplied onto the surface of the substrate W to perform a predetermined chemical liquid treatment (step ST01), and then pure water is supplied to perform a pure water rinsing treatment (step ST02).

[0084] Furthermore, the substrate W is rotated at high speed to shake off the pure water, thereby drying the substrate W (step ST03).

[0085] When the processing unit 1 performs substrate processing, the spin chuck 20 holds the substrate W, and the processing cup 40 moves up and down.

[0086] When the processing unit 1 performs chemical processing, for example, only the outer cup 43 rises, and an opening is formed between the upper end 43b of the outer cup 43 and the upper end 52b of the second guide portion 52 of the inner cup 42, surrounding the periphery of the substrate W held by the spin chuck 20. In this state, the substrate W is rotated together with the spin chuck 20, and the chemical liquid is supplied to the upper and lower surfaces of the substrate W from the nozzle 30 and the lower processing liquid nozzle 28. The supplied chemical liquid flows along the upper and lower surfaces of the substrate W due to the centrifugal force caused by the rotation of the substrate W, and is eventually scattered sideways from the outer edge of the substrate W. This allows the chemical processing of the substrate W to proceed. The chemical liquid scattered from the outer edge of the rotating substrate W is received by the upper end 43b of the outer cup 43, flows down along the inner surface of the outer cup 43, and is collected in the outer collection groove 51.

[0087] When the processing unit 1 performs a pure water rinsing process, for example, the inner cup 41, the middle cup 42, and the outer cup 43 are all raised, and the periphery of the substrate W held by the spin chuck 20 is surrounded by the first guide portion 47 of the inner cup 41. In this state, the substrate W is rotated together with the spin chuck 20, and pure water is supplied to the upper and lower surfaces of the substrate W from the nozzle 30 and the lower processing liquid nozzle 28. The supplied pure water flows along the upper and lower surfaces of the substrate W due to centrifugal force caused by the rotation of the substrate W, and is eventually splashed sideways from the outer edge of the substrate W. This progresses the pure water rinsing process of the substrate W. The pure water splashed from the outer edge of the rotating substrate W flows down along the inner wall of the first guide portion 47 and is discharged from the waste groove 49. In addition, when the pure water is recovered through a route separate from the chemical solution, the inner cup 42 and the outer cup 43 may be raised to form an opening surrounding the substrate W held by the spin chuck 20 between the upper end 52b of the second guiding portion 52 of the inner cup 42 and the upper end 47b of the first guiding portion 47 of the inner cup 41.

[0088] When the processing unit 1 performs a shake-off drying process, the inner cup 41, the middle cup 42 and the outer cup 43 all move down, and the upper end 47b of the first guide portion 47 of the inner cup 41, the upper end 52b of the second guide portion 52 of the middle cup 42 and the upper end 43b of the outer cup 43 are all positioned below the substrate W held by the spin chuck 20. In this state, the substrate W is rotated at high speed together with the spin chuck 20, and water droplets adhering to the substrate W are shaken off by centrifugal force, thereby performing a drying process.

[0089] <Detection of chuck pin open / close status> Next, detection of the open / closed state (state detection) of the chuck pin 26 performed by the control unit 9 will be described.

[0090] The drive of the chuck pin 26 is controlled by the drive control unit 93 of the control unit 9, but due to a malfunction of the chuck pin 26 itself or a malfunction of the substrate W held by the chuck pin 26 (for example, when the position where the substrate W is placed is deviated from a predetermined position), the chuck pin 26 may not operate as intended by the drive control unit 93. Thus, by detecting the open / closed state of the chuck pin 26, it is possible to confirm whether the chuck pin 26 operates as instructed by the drive control unit 93. Furthermore, depending on the result of the confirmation, the position of the substrate W can be corrected or a control signal can be output again from the drive control unit 93.

[0091] In this embodiment, a plurality of images showing the chuck pin 26 are prepared, and matching coordinates are calculated by performing a matching process (specifically, a pattern matching process) between the images. Here, the matching coordinates are coordinates that indicate the relative positional relationship between the images when the matching score between the images is the highest.

[0092] In this embodiment, first, three types of reference images are prepared according to the open / closed states of the chuck pins 26. Specifically, images showing the chuck pins 26 are prepared as reference images in a state where the chuck pins 26 are completely closed and not gripping the substrate W (first state), a state where the chuck pins 26 are gripping the substrate W (second state), and a state where the chuck pins 26 are open (third state).

[0093] Fig. 7 is a diagram showing an example of an overall image capturing the entire spin chuck 20 for obtaining a reference image in the first state. As shown in the example in Fig. 7, the image captured by a camera 70 or the like includes a plurality of chuck pins 26 (each of the chuck pins is also referred to as chuck pin 26a, chuck pin 26b, chuck pin 26c, and chuck pin 26d).

[0094] From the above-mentioned image, a reference image 201 for detecting the open / closed state of the chuck pin 26 is extracted. Specifically, for at least one of the multiple chuck pins 26, a range including at least a part of the chuck pin 26 (for example, an upper end of the chuck pin 26 that is displaced as the chuck pin 26 is opened or closed) is set as the reference image 201.

[0095] In this embodiment, three types of reference images 201 are prepared for each of the multiple chuck pins 26 according to the above-mentioned open / closed states, but it is sufficient that at least one type of reference image 201 is prepared for at least one chuck pin 26.

[0096] Furthermore, the reference image 201 may be extracted from an image obtained by actually capturing an image of the chuck pin 26 with the camera 70, or may be extracted from an image obtained by another method.

[0097] Furthermore, the image for obtaining the reference image 201 of the second state is not limited to the case where the chuck pin 26 is actually holding the substrate W, but may be realized by disabling the magnet or spring that enables the chuck pin 26 to hold the substrate W, and showing the chuck pin 26 in an image that maintains an opening and closing degree similar to the state where the chuck pin 26 is holding the substrate W.

[0098] Furthermore, it is preferable that the range of the reference image 201 in the second state does not include the substrate W. If the range of the reference image 201 does not include any portion other than the chuck pins 26, the accuracy of matching described below is improved.

[0099] Next, an image of the spin chuck 20 including the chuck pins 26 is taken using the camera 70. Then, a target image is prepared as an image for performing pattern matching processing with the reference image.

[0100] Fig. 8 is a diagram showing the spin chuck 20 for obtaining an image of the target. As shown in the example of Fig. 8, the entire image captured by the camera 70 or the like includes a plurality of chuck pins 26.

[0101] From the above-mentioned image, a target image 202 is extracted for performing a pattern matching process with the reference image 201. Specifically, for at least one of the multiple chuck pins 26, a range including at least a part of the chuck pin 26 is set as the target image 202.

[0102] Here, the range of the reference image 201 can correspond to a portion of the range of the target image 202. In other words, the range of the target image 202 can be set to be wider than the range of the reference image 201. By setting the range of the target image 202 in this manner, the reference image 201 can be sequentially shifted within the range of the target image 202 to perform pattern matching processing, and it is possible to search for matching coordinates that are calculated when the matching score is highest.

[0103] Specifically, first, the coordinates of a predetermined pixel in the reference image 201 of the chuck pin 26 in the first state are set as reference coordinates (X basis_pos1 ,Y basis_pos1 ), and similarly, the coordinates of a predetermined pixel in the reference image 201 in the second state of the chuck pin 26 are set as reference coordinates (X basis_pos2 ,Y basis_pos2 ), and the coordinates of a predetermined pixel in the reference image 201 of the chuck pin 26 in the third state are set as reference coordinates (X basis_pos3 ,Y basis_pos3 ) is set. FIG. 12 is a diagram showing an example of reference coordinates in reference image 201. As shown in the example in FIG. 12, the reference coordinates can be set to the lower left edge (origin Z) of the corresponding reference image. Note that the reference coordinates may be set to any point in the reference image (for example, the upper right edge of the reference image, or the center of the reference image, etc.).

[0104] The reference image 201 , together with the target image 202 , is shown in the coordinate system of the overall image of the chuck pin 26 and is located within the coordinate system of the target image 202 .

[0105] Next, assuming that the control unit 9 recognizes the current open / closed state of the chuck pin 26 as the first state, pattern matching is performed between the target image 202 and the reference image 201. Then, the coordinates of the origin Z of the reference image 201 when the matching score is the highest are searched for. The highest matching score is, for example, when SSD (Sum of Squared Difference), which is one of the methods for indicating the similarity between images, when R, which is the sum of squares of the differences in pixel values ​​indicating the similarity, is used. SSD The minimum value of the values ​​corresponds to the minimum value of the similarity between images. Note that, in pattern matching, other methods for indicating the similarity between images include SAD (Sum of Absolute Difference) and NCC (Normalized Cross-Correlation), but are not limited to these.

[0106] Here, the highest matching score is within a predefined threshold (e.g., R SSDIf the minimum value of the matching score is smaller than the threshold value, the coordinate of the origin Z of the reference image 201 when the matching score is the highest is defined as the matching coordinate (X target ,Y target The matching coordinates are calculated in the coordinate system of the target image 202.

[0107] On the other hand, if the highest matching score is not within a predefined threshold (e.g., R SSD If the minimum value of the matching score is greater than the threshold value, matching is deemed to be unsuccessful and the matching coordinates are not calculated. As a result, the open / closed state of the chuck pin 26 can be detected based on the matching coordinates when the matching score is high, improving the detection accuracy of the open / closed state of the chuck pin 26. Note that the matching coordinates may be calculated regardless of whether the matching score is within the threshold value or not.

[0108] Next, the detection unit 92 detects the open / closed state of the chuck pin 26 based on the matching coordinates. basis_pos1 ,Y basis_pos1 ) and the matching coordinates obtained above (X target ,Y target ) is within a predetermined threshold, the control unit 9 considers that the recognition that the chuck pin 26 is in the first state is correct (i.e., the open / close state of the chuck pin 26 is detected to be the first state). The similarity here is determined by, for example, calculating the Euclidean distance between the two coordinates and determining whether the value is within the above threshold.

[0109] On the other hand, if the similarity is not within the predetermined threshold value, the control unit 9 considers that the recognition that the chuck pin 26 is in the first state is incorrect, and then the reference coordinates (X basis_pos2 ,Y basis_pos2 ) and the above matching coordinates (X target ,Y target ) and calculate the similarity between the reference coordinates (X basis_pos2 ,Y basis_pos2) is not within a predetermined threshold, the reference coordinates (X basis_pos3 ,Y basis_pos3 ) and the above matching coordinates (X target ,Y target ) is calculated. By using this method, the open / closed state of the chuck pin 26 can be detected accurately.

[0110] Figures 9 and 10 are diagrams showing examples of the distribution of matching coordinates. Figure 9 shows the distribution of matching coordinates of chuck pin 26b in Figures 7 and 8. Figure 10 shows the distribution of matching coordinates of chuck pin 26d in Figures 7 and 8. In Figures 9 and 10, the vertical axis shows an example of the Y coordinate (the numerical values ​​are only an example) of the coordinate system provided in the target image, and the horizontal axis shows an example of the X coordinate (the numerical values ​​are only an example) of the coordinate system provided in the target image.

[0111] 9 and 10, different second states of the chuck pin 26 are used as reference images, and the results of pattern matching processing with a plurality of target images corresponding to each reference image are shown. In FIG. 9 and FIG. 10, ranges 301, 302, and 303 indicate predetermined ranges centered on the reference coordinates of the first state, the second state, and the third state, respectively. In the range 301, matching coordinates are located when the chuck pin 26 in the target image 202 is an image showing the first state (the range 301 corresponds to the threshold range when calculating the similarity of the first state described above). In the range 302, matching coordinates are located when the chuck pin 26 in the target image 202 is an image showing the second state (the range 302 corresponds to the threshold range when calculating the similarity of the second state described above). Moreover, in range 303, matching coordinates are located when the chuck pin 26 in the target image 202 is an image showing the third state (range 303 corresponds to the threshold range when calculating the similarity of the third state described above).

[0112] 9 and 10, the ranges in which the matching coordinates are located are clearly divided depending on the open / closed state (i.e., the first state, the second state, and the third state) of the chuck pin 26 in the target image 202. That is, the matching coordinates make it possible to clearly distinguish the open / closed state of the chuck pin 26 in the target image 202 (this also applies to chuck pins other than the chuck pins 26b and 26d shown in FIGS. 9 and 10). Thus, the detection unit 92 can detect the open / closed state of the chuck pin 26 by determining which range the calculated matching coordinates belong to.

[0113] Here, when the matching coordinates are not included in any of the ranges 301, 302, and 303, the detection unit 92 does not detect the open / closed state of the chuck pin 26. As a result, the open / closed state of the chuck pin 26 can be detected based on the matching coordinates included in an appropriate range, improving the detection accuracy of the open / closed state of the chuck pin 26. Note that when the chuck pin 26 is not in any of the first state, the second state, and the third state, that is, when the substrate W is on the chuck pin 26, or when the chuck pin 26 is in an empty grip state because it cannot grip the substrate W even though the substrate W is placed, the matching coordinates are located at coordinates not included in any of the ranges 301, 302, and 303.

[0114] In the above example, the second state of the chuck pin 26 was used as the reference image, but even if another state (i.e., the first state or the third state) is used as the reference image, the range in which the matching coordinates are located is clearly divided according to the open / closed state of the chuck pin 26 in the target image 202 (i.e., the first state, the second state, and the third state), so that, similarly to the above example, it is possible to detect the open / closed state of the chuck pin 26 in the target image 202 according to the matching coordinates.

[0115] Furthermore, the size or position of the ranges 301, 302, and 303 including the matching coordinates may be changed depending on the average value of the calculated matching coordinates. However, if the change in the size or position of the range exceeds a predetermined threshold range, there is a possibility that the chuck pin 26 is not operating properly due to aging or the like, so a warning or the like may be output as necessary.

[0116] <Detecting the presence or absence of a circuit board> 9 and 10 correspond to matching coordinates indicating different open / closed states of the chuck pin 26 (a state in which the chuck pin 26 is completely closed and does not grip the substrate W, a state in which the chuck pin 26 grips the substrate W, and a state in which the chuck pin 26 is open regardless of the presence or absence of the substrate W). Of the above three open / closed states, the state in which the chuck pin 26 is completely closed and does not grip the substrate W is excluded when the chuck pin 26 grips the substrate W, and the state in which the chuck pin 26 grips the substrate W is excluded when the chuck pin 26 does not grip the substrate W. Therefore, the range in which the matching coordinates can be included is limited depending on whether the chuck pin 26 grips the substrate W or not.

[0117] 8 (for example, luminance analysis at a position corresponding to the center of the spin base 21) to detect whether the chuck pins 26 grip the substrate W, the detection unit 92 can detect the open / closed state of the chuck pins 26 not only when the matching coordinates are limited to any one of the ranges 301, 302, and 303, but also within a range (coordinate range) limited depending on whether the chuck pins 26 grip the substrate W. As a result, the detection of the open / closed state of the chuck pins 26 based on the matching coordinates not included in the appropriate range is suppressed, and the detection accuracy of the open / closed state of the chuck pins 26 is improved.

[0118] <About the extraction range of the target image> If structures other than the chuck pin 26 (for example, the substrate W or water droplets adhering to the periphery of the spin chuck 20) ​​are included within the range of the target image 202, the matching accuracy may decrease.

[0119] Therefore, when extracting the target image 202, the extraction range is set to have a longitudinal direction along the outer edge 400 of the substrate W, thereby preventing structures other than the chuck pin 26 from being included in the image (at least reducing the range in which structures other than the chuck pin 26 are included in the image), thereby suppressing mismatching.

[0120] Fig. 11 is a diagram showing an example of extraction of a target image. As shown in the example in Fig. 11, the extraction range of the target image 202A is set so that the longitudinal direction is along the outer edge 400 of the substrate W. Therefore, it is possible to prevent structures other than the chuck pin 26 from being included in the target image 202A.

[0121] Although the extraction range of the target image 202 has been described above, the extraction range of the reference image 201A may also have a longitudinal direction along the outer edge 400 of the substrate W in the same manner.

[0122] <Modifications of the above-described embodiments> In the embodiments described above, the material, composition, dimensions, shape, relative positional relationship, or implementation conditions of each component may be described, but these are merely examples in all respects and are not limiting.

[0123] Thus, numerous variations and equivalents not shown are contemplated within the scope of the technology disclosed herein, including, for example, modifying, adding, or omitting at least one component.

[0124] In addition, in the embodiments described above, when a material name is mentioned without being specifically specified, it is understood that the material may contain other additives, such as an alloy, unless a contradiction arises. [Explanation of symbols]

[0125] 70 Camera 91 Matching coordinate calculation unit 92 Detection unit 93 Drive control unit 100 Substrate processing apparatus

Claims

1. obtaining at least one image including a portion of at least one chuck pin for holding a substrate as a reference image; obtaining at least one image obtained by imaging at least a portion of the chuck pin as a target image; performing a matching process between the reference image and the target image, and calculating matching coordinates which are coordinates indicating a position of the reference image in the target image when a matching score between the images is highest; and detecting an open / closed state of the chuck pin based on the matching coordinates. State detection method.

2. 2. A state detection method according to claim 1, The range indicated by the reference image corresponds to a part of the range of the target image. State detection method.

3. 3. A state detection method according to claim 1 or 2, The reference image is an image that does not include the substrate. State detection method.

4. A state detection method according to any one of claims 1 to 3, The chuck pins in the reference image are either in an open state, a closed state in which the chuck pins are holding the substrate, or a closed state in which the chuck pins are not holding the substrate. State detection method.

5. A state detection method according to any one of claims 1 to 4, the step of obtaining the reference image is a step of obtaining a plurality of the reference images corresponding to the plurality of the chuck pins, The step of obtaining the target image is a step of obtaining a plurality of the target images by capturing images of the chuck pins shown in the respective reference images. State detection method.

6. A state detection method according to any one of claims 1 to 5, detecting whether the substrate is held by the chuck pins; the step of detecting an open / closed state of the chuck pin is a step of detecting an open / closed state of the chuck pin based on the matching coordinates included in a coordinate range that is limited depending on whether the substrate is held by the chuck pin or not; State detection method.

7. A state detection method according to any one of claims 1 to 6, At least one of the ranges indicated by the reference image and the target image has a longitudinal direction along an outer edge of the substrate held by the chuck pins. State detection method.

8. A state detection method according to any one of claims 1 to 7, In the step of obtaining the reference image, coordinates of a predetermined pixel corresponding to the reference image are set as reference coordinates, and a threshold value is set based on the reference coordinates; the step of detecting an open / closed state of the chuck pin detects an open / closed state of the chuck pin based on whether the matching coordinates are within a range of the threshold value as compared with the reference coordinates; State detection method.

9. at least one chuck pin for holding a substrate; an imaging unit that images at least a part of the chuck pin and sets at least one of the images obtained as a target image; a matching coordinate calculation unit that performs a matching process between the target image and a reference image, which is at least one image including a part of the chuck pin, and calculates matching coordinates that are coordinates indicating a position of the reference image in the target image when a matching score between the images is highest; a detection unit that detects an open / closed state of the chuck pin based on the matching coordinates. Status detection device.

Images