Current control device

Abstract

To provide an energization control device that has heat dissipation properties and can suppress an increase in dimensions in the planar direction and the height direction.SOLUTION: An energization control device 1 includes a radiator 2, a pair of power modules 3A and 3B, and a control board 5. The pair of power modules 3A and 3B are adjacent to each other while being supported by the radiator 2. The control board 5 is arranged so as to straddle the adjacent direction of the pair of power modules 3A and 3B and is supported above the pair of power modules 3A and 3B. A board-related component 8 connected to the control board 5 is arranged in a housing space S surrounded by the control board 5 and each of the inner edge portions in the adjacent direction of the pair of power modules 3A and 3B.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an energization control device. [Background technology]

[0002] Conventionally, vehicles are equipped with a power source such as a battery and a wide variety of electronic devices that receive power from the power source. An electrical connection box configured by integrating electrical components such as relays is installed between the power source and the electronic device (see, for example, Patent Documents 1 and 2). Patent Document 1 discloses an electrical connection box including a pair of bus bars that form an electrical path between the power source and the electronic device, a cutoff unit that applies and cuts off current between the bus bars, and a control board that controls the cutoff unit. In this electrical connection box, the bus bars, the cutoff unit, and the control board are arranged on approximately the same plane within a box-shaped cover. Patent Document 2 discloses an electrical connection box including a radiator that is approximately rectangular in plan view, a pair of bus bars arranged on the upper surface of the radiator, a semiconductor module that applies and cuts off current between the bus bars, and a control board that controls the semiconductor module. In this electrical connection box, the bus bars and the semiconductor module are connected by terminals (connectors), and the control board is arranged in a layered manner above the semiconductor module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-220276 A [Patent Document 2] JP 2017-118672 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the electrical junction box described in Patent Document 1, the interrupter is a high heat generating body, while the heat dissipation path is limited to a pair of bus bars, so that heat may be trapped inside the cover if heat dissipation is insufficient. In this case, the semiconductor chip and other electronic components may be thermally affected. Therefore, it is necessary to enlarge the bus bar to improve heat dissipation, but as described above, the bus bar, the interrupter, and the control board are arranged on approximately the same plane, so the dimensions in the planar direction inside the cover are likely to be large. This results in the entire electrical junction box becoming wider, i.e., larger.

[0005] On the other hand, in the electrical junction box described in Patent Document 2, heat from the semiconductor module is released to the outside via a heat sink, improving the heat dissipation performance of the electrical junction box. However, in this electrical junction box, the control board is arranged in a layered manner above the semiconductor module, making it easier to make the box taller than the electrical junction box described in Patent Document 1. In particular, the control board may be provided with board-related components such as external signal terminals that extend upward, and the height of the entire control board including these components is approximately 1 / 3 of the entire electrical junction box. Therefore, it is difficult to avoid making the entire electrical junction box taller, i.e., larger.

[0006] An object of the present invention is to provide an energization control device that has heat dissipation properties and can suppress increases in dimensions in the planar and height directions. [Means for solving the problem]

[0007] In order to solve the above problems and achieve the object, the invention described in claim 1 is a current control device that controls current flow between a power source and a load, the current control device comprising: a heat sink; a pair of power modules supported by the heat sink and performing current flow or cut-off between the power source and the load; a first bus bar connected to one end of each of the pair of power modules; a second bus bar connected to the other end of each of the pair of power modules; and a control board that controls the pair of power modules, the pair of power modules being adjacent to each other with a gap therebetween while being supported by the heat sink, the control board being disposed so as to straddle the pair of power modules in an adjoining direction and supported above the pair of power modules, and board-related components connected to the control board being disposed in an accommodation space surrounded by the control board and each of the inner end edges of the pair of power modules in the adjoining direction. The board-related component includes at least one of a control unit that outputs a control signal to the pair of power modules and an external signal terminal that connects the control unit to an external device, and the accommodation space opens in a direction intersecting the direction in which the pair of power modules are adjacent to each other and in a direction intersecting the up-down direction, and the external signal terminal and other terminals are provided so as to be insertable and removable through the opening. It is characterized by: Effect of the Invention

[0008] According to the present invention, it is possible to provide an energization control device that has heat dissipation properties and can suppress increases in dimensions in the planar and height directions. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view showing an energization control device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view of the energization control device with its cover removed. [Diagram 3] FIG. 4 is a front view of the energization control device as viewed from the front side. [Figure 4] FIG. 4 is a perspective view showing the energization control device with a cover attached. [Diagram 5] FIG. 4 is a side view of the energization control device as viewed from the left side. [Figure 6] 3A is a perspective view showing the energization control device, and FIG. [Figure 7] 1A and 1B are a perspective view and a plan view, respectively, showing an energization control device as a comparative example. [Figure 8]4 is a graph showing the area (mm2) of the energization control device and an energization control device as a comparative example. [Figure 9] 4 is a graph showing a heat source temperature (Tjmax) of the energization control device and an energization control device as a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] An embodiment of the present invention will be described below with reference to Figs. 1 to 9. The current control device 1 is a device that controls current flow between a power source (not shown) and a load (not shown). As shown in Fig. 1, the current control device 1 includes a heat sink 2, a pair of power modules 3A and 3B supported by the heat sink 2, a first bus bar 4A and a second bus bar 4B connected to the pair of power modules 3A and 3B, respectively, a control board 5, and a cover 6.

[0011] In the drawings, the arrows X, Y, and Z are directions perpendicular to each other. The adjacent direction of the pair of power modules 3A, 3B from the power source side (or load side) toward the load side (or power source side) is indicated by the arrow X, and this arrow X is referred to as the "left-right direction X". The direction intersecting the adjacent direction of the pair of power modules 3A, 3B is indicated by the arrow Y, and this arrow Y is referred to as the "front-back direction Y". The height direction of the energization control device 1 is indicated by the arrow Z, and this arrow Z is referred to as the "up-down direction Z". In addition, in the left-right direction X, the left side may be referred to as the right side or power source side, and the right side may be referred to as the left side or load side.

[0012] The radiator 2 is a heat dissipation member that dissipates heat generated by the pair of power modules 3A and 3B to the outside, and also constitutes the bottom plate of the current control device 1 and is a support member that supports the pair of power modules 3A and 3B, the first bus bar 4A, and the second bus bar 4B. As shown in FIG. 2, the radiator 2 is configured to include a heat sink 20 and an insulating sheet 21 that is installed on the upper surface of the heat sink 20. The heat sink 20 has a heat sink main body 20a that is configured of a rectangular flat plate member in a plan view, and a plurality of fin parts 20b that are provided below the heat sink main body 20a and protrude in a plate shape. As shown in FIG. 6, in this embodiment, the heat sink main body 20a is formed so that the dimension L1 in the left-right direction X is 250 mm, and the dimension L2 in the front-rear direction Y is 99 mm.

[0013] The insulating sheet 21 is a member formed in a thin plate shape from an insulating heat-conducting member, and its dimensions in the left-right direction X and the front-rear direction Y are set so as to be approximately the same as the dimensions in the left-right direction X and the front-rear direction Y of the upper surface of the heat sink body 20a. Openings 21a, 21b for arranging a positive electrode side power module 3A and a negative electrode side power module 3B, which will be described later, are formed so as to penetrate the insulating sheet 21 in the up-down direction Z. The openings 21a, 21b are provided adjacent to each other with a gap in between in the left-right direction X, with the opening 21a located on the right side and the opening 21b located on the left side.

[0014] The pair of power modules 3A, 3B are for turning on and off the electric path between the power source and the load. In order to turn on and off the electric path on the positive side and the negative side, in this embodiment, the pair of power modules 3A, 3B is composed of a positive power module 3A and a negative power module 3B. As shown in FIG. 2, the positive power module 3A is fitted into an opening 21a of an insulating sheet 21 and supported by the heat sink 2. The negative power module 3B is fitted into an opening 21b of the insulating sheet 21 and supported by the heat sink 2. Therefore, the pair of power modules 3A, 3B are adjacent to each other with a gap in the left-right direction X while being supported by the heat sink 2. The positive power module 3A and the negative power module 3B have substantially the same configuration and are formed to be symmetrical with respect to the center line of the heat sink 2 extending in the front-rear direction Y. In this embodiment, the positive power module 3A will be mainly described, and as for the negative power module 3B, the same components are denoted by the same reference numerals, and description thereof will be omitted or simplified.

[0015] The positive power module 3A is configured by modularizing semiconductor relays (e.g., n-type MOSFETs) not shown. The positive power module 3A is configured to include a rectangular parallelepiped frame 30 that covers the semiconductor relays, a source terminal 31, a drain terminal 32, and a gate terminal 33. The frame 30 is formed in a box shape so as to cover the semiconductor relays with insulating resin. Recesses are formed at both ends in the left-right direction X on the upper surface of the frame 30. The source terminal 31 is arranged so as to be exposed in the right recess. The drain terminal 32 is arranged so as to be exposed in the left recess. The source terminal 31 and the drain terminal 32 are terminals that are electrically connected to one of the first bus bar 4A and the second bus bar 4B. In this embodiment, the source terminal 31 is arranged on the right side of the frame 30, and the drain terminal 32 is arranged on the left side, but the arrangement of the source terminal 31 and the drain terminal 32 may be reversed.

[0016] The gate terminal 33 is a pin-shaped terminal electrically connected to the control board 5. The gate terminal 33 is formed so as to protrude upward from the upper surface of the frame portion 30. The protruding end of this gate terminal 33 is adapted to be inserted into a through-hole 5a of the control board 5, which will be described later, and in a state in which the protruding end is inserted into the through-hole 5a, the control board 5 is fixed to the pair of power modules 3A and 3B.

[0017] The first bus bar 4A and the second bus bar 4B form an electrical path between a power source and a load, and are formed by combining plate members formed of a conductive metal such as a copper alloy. The first bus bar 4A is connected to one end of each of the pair of power modules 3A and 3B. In this embodiment, the first bus bar 4A is connected to each of the outer edge portions in the left-right direction X of the positive power module 3A and the negative power module 3B. The first bus bar 4A is configured to include a plate-shaped device connection portion 40 extending on the upper surface of the insulating sheet 21, and a module connection portion 41 continuing to one edge of the device connection portion 40 in the left-right direction X. One side of each device connection portion 40 is disposed at the right end of the insulating sheet 21 and directly fixed to the heat sink 2 by an insulating screw 7. The other side of each device connection portion 40 is disposed at the left end of the insulating sheet 21 and directly fixed to the heat sink 2 by an insulating screw 7. Each module connection portion 41 rises from one end of each device connection portion 40 and extends toward one or the other of the pair of power modules 3A, 3B. Specifically, in the first bus bar 4A connected to the positive power module 3A, the module connection portion 41 rises from the left edge of the device connection portion 40 in the left-right direction X, extends toward the positive power module 3A, and is fixed to the positive power module 3A by a screw 9. In the first bus bar 4A connected to the negative power module 3B, the module connection portion 41 rises from the right edge of the device connection portion 40 in the left-right direction X, extends toward the negative power module 3B, and is fixed to the negative power module 3B by a screw 9.

[0018] The second bus bar 4B is connected to the other end of each of the pair of power modules 3A and 3B. In this embodiment, the second bus bar 4B is connected to each of the inner end edges of the positive power module 3A and the negative power module 3B in the left-right direction X. Like the first bus bar 4A, each second bus bar 4B includes an equipment connection portion 40 and a module connection portion 41. The configuration of the module connection portion 41 is the same as that of the first bus bar 4A, but the configuration of the equipment connection portion 40 is different from that of the first bus bar 4A. Specifically, the equipment connection portion 40 of the second bus bar 4B connected to the positive power module 3A includes a first plate portion 40a extending from the lower end of the module connection portion 41 to the rear side in the front-rear direction Y, and a second plate portion 40b extending from the rear end of the first plate portion 40a in the left-right direction X along the rear edge portion of the insulating sheet 21. On the other hand, the device connection portion 40 of the second bus bar 4B connected to the negative power module 3B is configured to include a first plate portion 40a extending forward in the front-rear direction Y from the lower end of the module connection portion 41, and a second plate portion 40b extending in the left-right direction X from the front end of the first plate portion 40a along the front edge of the insulating sheet 21. The first plate portions 40a, 40a face each other in the left-right direction X and are arranged in an accommodation space S described later.

[0019] The control board 5 is a control device for controlling the pair of power modules 3A and 3B, and is formed of a transparent material in the shape of a rectangular plate elongated in the left-right direction X. The control board 5 includes a circuit pattern made of printed wiring (not shown) and a through hole 5a into which the protruding end of the gate terminal 33 is inserted. The through hole 5a is formed so as to penetrate in the up-down direction Z at a position corresponding to the gate terminal 33. When the protruding end of the gate terminal 33 is inserted into the through hole 5a, the printed wiring and the gate terminal 33 are electrically connected. The dimension of the control board 5 in the front-rear direction Y is set to be approximately the same as the dimension of the pair of power modules 3A and 3B in the front-rear direction Y. The dimension of the control board 5 in the left-right direction X is set to be large enough to straddle one of the pair of power modules 3A and 3B. Then, with the gate terminal 33 inserted into the through hole 5a, the control board 5 is placed on the upper surface of each frame portion 30 of the pair of power modules 3A and 3B, and is supported above the pair of power modules 3A and 3B.

[0020] In a state where the control board 5 is supported above the pair of power modules 3A, 3B, an accommodation space S is formed in a portion surrounded by the control board 5 and each of the inner end edges of the pair of power modules 3A, 3B in the left-right direction X. This accommodation space S is open in the front-rear direction Y. The first plate parts 40a, 40a are respectively arranged in this accommodation space S. Also, as shown in FIG. 3, in the accommodation space S, the board-related parts 8 installed on the control board 5 are arranged along the back surface of the control board 5. The board-related parts 8 include a control unit 80 and an external signal terminal 81. The control unit 80 is a part that outputs a control signal for controlling the pair of power modules 3A, 3B, and is composed of a microcomputer mainly composed of a CPU, a ROM, a RAM, and an I / O interface. This control unit 80 is formed in a rectangular plate shape so as to extend along the back surface of the control board 5.

[0021] The external signal terminal 81 is a terminal for electrically connecting the control unit 80 and an external device (such as an ECU) (not shown). The external signal terminal 81 is configured to include a connection portion 81a fixed to the control board 5 and a terminal portion 81b extending from the connection portion 81a toward the opening of the accommodation space S. The connection portion 81a is a rectangular plate-shaped member having a larger dimension in the left-right direction X than the control unit 80, and is disposed so as to extend along the front edge of the control unit 80. The terminal portion 81b is a rectangular plate-shaped member extending from the connection portion 81a to the front side in the front-rear direction Y, and its tip portion extends to the front edge of the control board 5. In this embodiment, four terminal portions 81b are arranged in the left-right direction X. Terminals (other terminals) on the external device side (not shown) are connected to these terminal portions 81b, and the terminal portion 81b and the other terminals are provided so as to be insertable and detachable through the opening of the accommodation space S.

[0022] The cover 6 is a box-shaped body provided so as to cover the upper part of the insulating sheet 21, and is made of an insulating and permeable synthetic resin or the like, and is formed so as to open downward. The cover 6 is formed to have substantially the same dimensions as the insulating sheet 21 in a plan view, and the opening edge abuts against the outer peripheral edge of the insulating sheet 21 when the cover 6 covers the pair of power modules 3A, 3B, the first bus bar 4A, the second bus bar 4B, and the control board 5. A notch 6a that opens in the left-right direction X is formed in the right wall of the cover 6 at a position corresponding to the right first bus bar 4A and the second bus bar 4B, and the device connection portion 40 of the right first bus bar 4A and the second bus bar 4B is connected to a power source via the notch 6a. A notch 6b opening in the left-right direction X is formed in the left wall of the cover 6 at a position corresponding to the first bus bar 4A and the second bus bar 4B on the left side, and an electronic device (load) is connected to the device connection portion 40 of the first bus bar 4A and the second bus bar 4B on the left side via the notch 6b. An opening 6c opening in the front-rear direction Y is formed in the front wall of the cover 6 at a position corresponding to the external signal terminal 81, and the external signal terminal 81 is connected to other terminals via the opening 6c.

[0023] The energization control device 1 is assembled in the following procedure. First, as shown in FIG. 2, an insulating sheet 21 is placed on the upper surface of a heat sink 20. Next, a positive power module 3A is fitted into an opening 21a of the insulating sheet 21, and a negative power module 3B is fitted into an opening 21b of the insulating sheet 21. Then, a first bus bar 4A and a second bus bar 4B are installed. At this time, an equipment connection part 40 of each bus bar 4A, 4B is directly fixed to the insulating sheet 21 and the heat sink 20 by an insulating screw 7. Also, a module connection part 41 of each bus bar 4A, 4B is connected to a source terminal 31 or a drain terminal 32 by a screw 9. Next, a board-related part 8 consisting of a control part 80 and an external signal terminal 81 is installed on the back surface of a control board 5, and in this state, the control board 5 is placed on a frame part 30 of a pair of power modules 3A, 3B. At this time, a protruding end part of a gate terminal 33 is inserted into a through hole 5a of the control board 5. Then, it is confirmed that the board-related components 8, which are constituted by the control unit 80 and the external signal terminals 81, and the first plate portions 40a, 40a of the second bus bar 4B are arranged in the accommodation space S. Then, the cover 6 is placed thereon.

[0024] According to the above-described embodiment, the present invention includes a heat sink 2, a pair of power modules 3A, 3B supported by the heat sink 2 and configured to pass or cut off current between a power source and a load, a first bus bar 4A connected to one end of each of the pair of power modules 3A, 3B, a second bus bar 4B connected to the other end of each of the pair of power modules 3A, 3B, and a control board 5 for controlling the pair of power modules 3A, 3B, in which the pair of power modules 3A, 3B are adjacent to each other with a gap therebetween while being supported by the heat sink 2, the control board 5 is disposed so as to straddle the pair of power modules in the left-right direction X (adjacent direction) and is supported above the pair of power modules 3A, 3B, and board-related components 8 connected to the control board 5 are disposed in an accommodation space S surrounded by the control board 5 and each of the inner end edges of the pair of power modules 3A, 3B in the left-right direction X.

[0025] According to this, the heat generated by the pair of power modules 3A, 3B can be released to the outside through the heat sink 2, the first bus bar 4A, and the second bus bar 4B, so that the energization control device 1 having heat dissipation properties can be obtained. In addition, the control board 5 is arranged so as to straddle the pair of power modules 3A, 3B in the left-right direction X, and is supported above the pair of power modules 3A, 3B. Therefore, it is not necessary to provide an installation space for the control board 5 so as to expand in the planar direction within the energization control device 1. Therefore, it is possible to suppress an increase in the planar dimension of the energization control device 1. In addition, the board-related parts 8 are installed in the accommodation space S surrounded by the control board 5 and each of the inner end edges of the pair of power modules 3A, 3B in the left-right direction X, so that the so-called dead space between the pair of power modules 3A, 3B can be effectively utilized. In addition, since the board-related parts 8 are installed in the accommodation space S, it is possible to suppress an increase in the height dimension of the energization control device 1 compared to a configuration in which the board-related parts 8 are installed so as to extend upward from the control board 5. Therefore, it is possible to provide an energization control device 1 that has heat dissipation properties and can suppress increases in dimensions in the planar and height directions.

[0026] In addition, the accommodation space S can be used as a space for accommodating at least one of the control unit 80 and the external signal terminal 81. Therefore, compared to a configuration without the accommodation space S, an increase in the planar and height dimensions of the energization control device 1 can be suppressed by the dimension of at least one of the control unit 80 and the external signal terminal 81.

[0027] Furthermore, the terminal portion 81b of the external signal terminal 81 is provided so as to extend toward the opening of the accommodation space S. Since the opening faces the front-rear direction Y, it is possible to suppress an increase in the height dimension of the energization control device 1 compared to a configuration in which the external signal terminal 81 is installed so as to extend upward from the control board 5. Furthermore, since the external signal terminal 81 and other terminals are provided so as to be insertable and detachable through the opening of the accommodation space S, the external signal terminal 81 can be easily connected to other terminals.

[0028] Furthermore, according to the above-described embodiment, the first plate portions 40a, 40a of each of the second busbars 4B can be accommodated in the accommodation space S, so that, compared to a configuration without the accommodation space S, the increase in the planar and heightwise dimensions of the energization control device 1 can be suppressed by the dimensions of the first plate portions 40a, 40a.

[0029] Furthermore, each of the first bus bar 4A and the second bus bar 4B has a plate-shaped device connection portion 40 extending onto the heat sink 2, which increases the contact area between the first bus bar 4A and the second bus bar 4B and the heat sink 2, thereby making it possible to efficiently dissipate heat generated by the pair of power modules 3A, 3B. Also, each of the first bus bar 4A and the second bus bar 4B and the pair of power modules 3A, 3B can be connected by screws 9 via the module connection portion 41, which makes it possible to provide a simpler and less costly configuration compared to a configuration in which the connection is made by terminals (connectors) as in a conventional electrical connection box.

[0030] Next, the inventor of the present invention created the energization control device 1 of this embodiment as the present invention product and the energization control device 100 (shown in Figs. 7(a) and (b)) as a comparative example described later, and compared their areas. Also, by supplying the same electric power, the inventor compared the heat source temperatures (Tjmax) of each. The results are shown in Figs. 8 and 9.

[0031] As shown in Figs. 7(a) and 7(b), the energization control device 100 as a comparative example includes a pair of power modules 30A and 30B that energize or cut off current between a power source (not shown) and a load (not shown). The energization control device 100 also includes two pairs of bus bars 40A and 40B that are connected to both ends of the pair of power modules 30A and 30B, and a control board 50 that controls the pair of power modules 30A and 30B. The energization control device 100 also includes a resin frame 60 that supports the pair of power modules 30A and 30B, the pair of bus bars 40A and 40B, and the control board 50. The energization control device 100 has a structure of a so-called conventional electrical connection box. The energization control device 100 mainly differs from the present invention in that the pair of power modules 30A and 30B, the pair of bus bars 40A and 40B, and the control board 50 are arranged on approximately the same plane. The energization control device 100 also differs from the present invention in that the energization control device 100 does not have a storage space S. Also, it differs from the product of the present invention in that it is provided with a resin frame 60 and that the external signal terminals 81 extend upward from the control board 50. As shown in Fig. 7(b), the energization control device 100 is formed so that the dimension L101 in the left-right direction X is 220 mm and the dimension L102 in the front-rear direction Y is 210 mm. Note that in the energization control device 100, parts having the same structure or function as the product of the present invention are given the same reference numerals and descriptions thereof will be omitted or simplified.

[0032] As shown in FIG. 8, the area of ​​the present invention is 24750 mm 2 The area of ​​the comparative example is 46200 mm 2 The size was reduced by approximately 46% compared to the conventional electrical connection box. Also, as shown in Fig. 9, the results of the thermal fluid simulation showed that the heat source temperature (Tjmax) of the present invention was 173°C, which was approximately 50% lower than the 345°C of the comparative example. Thus, it was found that the product of the present invention can reduce the heat source temperature despite its smaller area compared to the electrical connection box having the conventional structure.

[0033] In this embodiment, the control board 5 and the gate terminal 33 are connected by forming a through hole 5a in the control board 5 and inserting the gate terminal 33 into the through hole 5a, but the configuration of the connection is not limited to this. A connection terminal may be provided in the control board 5, and the terminal may be connected to the gate terminal 33. The control board 5 may be directly fixed to the upper surface of the pair of power modules 3A and 3B using an insulating screw 7. Furthermore, the control board 5 may be fixed to the pair of power modules 3A and 3B with an adhesive. In this case, the adhesive is preferably made of silicone or resin that has insulating properties and can withstand high temperatures of 100°C or more. In this embodiment, the board-related parts 8 installed on the control board 5 are configured to include both the control unit 80 and the external signal terminal 81, but the configuration of the board-related parts 8 is not limited to this. The control board 5 may be configured to include one of the control unit 80 and the external signal terminal 81, and the other may be directly incorporated into the control board 5.

[0034] In the present embodiment, the pair of power modules 3A and 3B are configured with a semiconductor relay made of a semiconductor element, but the present invention is not limited thereto. The pair of power modules 3A and 3B may be configured with a mechanical relay instead of the semiconductor relay. In the present embodiment, the accommodation space S is provided to open in the front-rear direction Y, but the direction of the opening is not limited thereto, and may be any direction intersecting the direction in which the power modules 3A and 3B are adjacent to each other and intersecting the up-down direction. In the heat sink 2 of the present embodiment, natural air cooling using the fin portion 20b is assumed as a heat dissipation mechanism, but the heat dissipation mechanism is not limited thereto. For example, a mechanism such as water cooling or forced air cooling may be used. In this case, the cooling capacity is improved compared to natural air cooling, so that the size of the energization control device 1 can be further reduced.

[0035] While one embodiment of the present invention has been described in detail above with reference to the drawings, the specific configuration is not limited to these embodiments, and the present invention also includes design changes and the like that do not deviate from the gist of the present invention. [Explanation of symbols]

[0036] 1. Power supply control device 2 Heatsink 3A, 3B Pair of power modules 4A 1st bus bar 4B 2nd bus bar 5 Control Board 8. Circuit board related parts S Storage space

Claims

1. A current control device that controls current flow between a power source and a load, A heat sink; a pair of power modules supported by the heat sink and configured to pass or cut off current between the power source and the load; a first bus bar connected to one end of each of the pair of power modules; a second bus bar connected to the other end of each of the pair of power modules; a control board for controlling the pair of power modules, the pair of power modules are adjacent to each other with a gap therebetween while being supported by the heat sink, the control board is disposed across the pair of power modules in an adjacent direction thereof and is supported above the pair of power modules; a board-related component connected to the control board is disposed in an accommodation space surrounded by the control board and each of the inner end edges of the pair of power modules in the adjacency direction; the board-related component includes at least one of a control unit that outputs a control signal to the pair of power modules and an external signal terminal that connects the control unit to an external device; The accommodating space opens in a direction intersecting the adjacent direction of the pair of power modules and in a direction intersecting the vertical direction, and the external signal terminal and other terminals are arranged to be insertable and removable through the opening.

2. The pair of power modules are adjacent to each other in a direction from a power source side to a load side, the first bus bar is connected to each of outer edge portions of the pair of power modules in an adjacent direction; the second bus bar is connected to each of inner end edge portions of the pair of power modules in an adjacency direction; each of the second bus bars includes a first plate portion extending in a direction intersecting an adjacent direction of the pair of power modules, and a second plate portion extending from one end of the first plate portion in the extending direction of the pair of power modules, 2. The method according to claim 1, wherein each of the first plate portions is disposed in the accommodation space. The energization control device described above.

3. each of the first bus bar and the second bus bar includes a plate-shaped device connection portion extending on the heat sink, and a module connection portion rising from one end of the device connection portion and extending toward one or the other of the pair of power modules; 3. The current control device according to claim 1, wherein each of the module connection parts is connected to one or the other of the pair of power modules by a screw.

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