Film-like adhesive composite sheet and method for manufacturing semiconductor device

Abstract

A film-like adhesive composite sheet having a curable film-like adhesive provided on a support sheet, the support sheet having a substrate, the curable film-like adhesive having a thickness of 1 to 60 μm, and the product of the Young's modulus of the support sheet and the thickness of the support sheet being 4 to 150 MPa·mm.

Description

[Technical field]

[0001] The present invention relates to a film-like adhesive composite sheet and a method for manufacturing a semiconductor device. This application claims priority based on Japanese Patent Application No. 2017-063654, filed on March 28, 2017, the contents of which are incorporated herein by reference.

[0002] In the manufacturing process of a semiconductor device, a semiconductor chip to which a film-like adhesive for use in die bonding is attached may be used. One method for obtaining such a semiconductor chip with a film-like adhesive is to attach a film-like adhesive to a plurality of individual semiconductor chips obtained by dicing a semiconductor wafer, and then cut the film-like adhesive at a position corresponding to the arrangement position of the semiconductor chip. In this method, the film-like adhesive is usually attached to a plurality of semiconductor chips using a film-like adhesive composite sheet in which a film-like adhesive is provided on a support sheet. The semiconductor chip is produced, for example, by forming a groove in a semiconductor wafer and then grinding the back side until the groove is reached, but this is only one example, and the semiconductor chip can also be produced by other methods. The semiconductor chip to which the film-like adhesive is attached after cutting is detached (picked up) from the support sheet together with the film-like adhesive and used for die bonding.

[0003] In the above method, the film-like adhesive is cut by, for example, irradiating the film-like adhesive with a laser and expanding the film-like adhesive. However, the laser irradiation method has the problem that a laser irradiation device is required and the film-like adhesive cannot be cut efficiently in a short time. The expanding method has the problem that an expanding device is required and the cut surface may become rough. Furthermore, since the force acts only in the same direction as the film-like adhesive in the expanding process, the film-like adhesive may simply stretch together with the support sheet and not be cut. Therefore, the film-like adhesive may be cooled to make it easier to cut before expanding, but in this case a cooling process is required, which is poor in productivity.

[0004] One method that can solve these problems is to use a film adhesive of a specific thickness and tensile breaking elongation, and just before picking up the semiconductor chip, the semiconductor chip together with the uncut film adhesive is lifted in the pick-up direction, and the shear force generated at this time is used to cut the film adhesive (see Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2013-179317 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, with the method disclosed in Patent Document 1, it is unclear whether the semiconductor chips to which the film-like adhesive is attached after cutting can be picked up from the support sheet while preventing process abnormalities.

[0007] The present invention has been made in consideration of the above circumstances, and has an objective of providing a film-type adhesive composite sheet in which a film-type adhesive is provided on a support sheet, which enables a semiconductor chip to which a film-type adhesive is attached to be separated from the support sheet in a simplified manner while suppressing the occurrence of process abnormalities during the manufacture of a semiconductor device, and a method for manufacturing a semiconductor device using this composite sheet. [Means for solving the problem]

[0008] In order to solve the above problems, the present invention provides a film-like adhesive composite sheet comprising a support sheet having a substrate and a curable film-like adhesive having a thickness of 1 to 60 μm provided thereon, wherein the product (A × B) of the Young's modulus A (MPa) of the support sheet and the thickness B (mm) of the support sheet is in the range of 4 to 150 MPa mm.

[0009] In the film-like adhesive composite sheet of the present invention, the film-like adhesive before curing is preferably laminated to a total thickness of 200 μm, and the breaking elongation C of the laminate is preferably 5 to 2000%. The present invention also provides a method for manufacturing a semiconductor device using the film-like adhesive composite sheet, comprising the steps of: attaching the film-like adhesive composite sheet to a plurality of divided semiconductor chips via the film-like adhesive; applying force to a support sheet of the film-like adhesive composite sheet attached to the semiconductor chips from the side opposite to the side on which the film-like adhesive is provided, thereby applying force to the film-like adhesive through the support sheet to cut the film-like adhesive; and peeling off the semiconductor chips and the cut film-like adhesive attached to the semiconductor chips from the support sheet.

[0010] That is, the present invention includes the following aspects. [1] A film-like adhesive composite sheet having a curable film-like adhesive provided on a support sheet, The support sheet has a substrate, The curable film-like adhesive has a thickness of 1 to 60 μm, The product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa mm. Film-type adhesive composite sheet. [2] The film-like adhesive has a property that, when the film-like adhesive before curing is laminated to form a laminate having a total thickness of 200 μm, the laminate has a breaking elongation of 1 to 2000%. The film-like adhesive composite sheet according to [1]. [3] A method for manufacturing a semiconductor device using the film-like adhesive composite sheet according to [1], attaching the film-like adhesive composite sheet to a plurality of separated semiconductor chips via the film-like adhesive; cutting the film-like adhesive by applying a force to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side where the film-like adhesive is provided; Separating the semiconductor chip and the film-like adhesive attached to the semiconductor chip after cutting from the support sheet; A method for manufacturing a semiconductor device comprising the steps of: Effect of the Invention

[0011] According to the present invention, there is provided a film-type adhesive composite sheet having a film-type adhesive provided on a support sheet, which enables a semiconductor chip to which a film-type adhesive is attached to be separated from the support sheet in a simplified manner while suppressing the occurrence of process abnormalities during the manufacture of a semiconductor device, and a method for manufacturing a semiconductor device using this composite sheet. [Brief description of the drawings]

[0012] [Figure 1] 1A to 1C are cross-sectional views that diagrammatically show one embodiment of a method for manufacturing a semiconductor device according to the present invention, from cutting the film adhesive to peeling off the semiconductor chip from the support sheet. [Diagram 2] 10 is a cross-sectional view for illustrating a schematic diagram of another embodiment in which a force is applied to the film-like adhesive to cut it in the method for manufacturing a semiconductor device of the present invention. FIG. [Diagram 3] FIG. 1 is a cross-sectional view showing a schematic view of one embodiment of a film-like adhesive composite sheet and a semiconductor chip in a process for manufacturing a semiconductor device when a conventional film-like adhesive composite sheet is used. [Figure 4] FIG. 11 is a cross-sectional view showing a schematic view of another embodiment of a film-like adhesive composite sheet and a semiconductor chip in the manufacturing process of a semiconductor device when a conventional film-like adhesive composite sheet is used. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] <<Film-type adhesive composite sheet>> The film-like adhesive composite sheet of the present invention is a film-like adhesive composite sheet having a curable film-like adhesive of 1 to 60 μm provided on a support sheet having a substrate, and the product of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet (i.e., representing the value of A × B) is in the range of 4 to 150 MPa mm.

[0014] The film-like adhesive composite sheet has a film-like adhesive provided on a support sheet, and is attached to one side of a semiconductor chip by the film-like adhesive during the manufacture of a semiconductor device. In a later process, the semiconductor chip is separated (picked up) from the support sheet with the film-like adhesive still attached. In this case, since the product (A×B) of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet in the film-like adhesive composite sheet is in the range of 4 to 150 MPa·mm, the semiconductor chip to which the film-like adhesive is attached can be separated from the support sheet while suppressing the occurrence of process abnormalities. In one aspect, the product (A×B) of the thickness (B) (mm) of the support sheet is preferably 13.6 to 112.5 MPa·mm. More specifically, it is as follows.

[0015] First, the film-like adhesive can be cut by performing a normal pick-up operation in which force is applied to the film-like adhesive through the support sheet. In other words, the film-like adhesive can be cut at the desired location at room temperature without a separate process whose main purpose is to cut the film-like adhesive. Therefore, failure to separate (lift) the semiconductor chip due to the film-like adhesive not being cut is suppressed. In addition, the phenomenon in which the portion of the film-like adhesive corresponding to the intended semiconductor chip peels off from the support sheet while the portion of the film-like adhesive corresponding to the unintended semiconductor chip peels off from the support sheet is suppressed. This suppresses the occurrence of so-called double die, in which not only the intended semiconductor chip but also the adjacent semiconductor chip is simultaneously peeled off from the support sheet together with the film-like adhesive, due to the intended portion of the film-like adhesive not peeling off from the support sheet. In this specification, "suppression of process abnormalities" refers to suppression of the above-mentioned semiconductor chip separation failure, the occurrence of double die, and the like.

[0016] If the product (A×B) of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet is less than 4 MPa·mm, the substrate will deform significantly, the force of the pick-up will not be transmitted to the film adhesive, and it is believed that cutting the film adhesive will be difficult. If the product (A×B) exceeds 150 MPa·mm, the substrate will be too hard and will lift up the area of ​​the film adhesive that is intended to correspond to the semiconductor chip, and the force of the pick-up will not be transmitted to the film adhesive, and it is believed that cutting the film adhesive will be difficult. In one aspect, when the product (A×B) of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet is within the range of 4 to 150 MPa·mm, the base material does not deform significantly and the force of the pick-up is easily transmitted to the film adhesive, making it easy to cut the film adhesive. In addition, the base material does not become too hard and lifting around the intended part of the film adhesive corresponding to the semiconductor chip can be suppressed, so the force during pick-up is easily transmitted to the film adhesive, making it easy to cut the film adhesive.

[0017] In this way, by using the film-like adhesive composite sheet, it is possible to suppress the occurrence of poor separation of the semiconductor chip and the occurrence of double die. Furthermore, since the above-mentioned process whose main purpose is to cut the film-like adhesive, such as the process of cutting the film-like adhesive by irradiating it with a laser or the process of cutting the film-like adhesive by expanding it, can be omitted, problems caused by carrying out these processes can be avoided, the film-like adhesive can be cut at room temperature, the number of processes can be reduced, and the semiconductor device can be manufactured by a simplified method.

[0018] In response to this, the above-mentioned "JP Patent Publication 2013-179317" (Patent Document 1) discloses a method in which, immediately before picking up the semiconductor chip, the semiconductor chip is lifted in the pick-up direction together with the uncut film-like adhesive, and the shear force generated at this time is used to cut the film-like adhesive. However, with this method, it is unclear whether the semiconductor chip to which the cut film-like adhesive is attached can be picked up from the support sheet while suppressing the occurrence of process abnormalities. For example, it is unclear whether the semiconductor chip can be separated from the support sheet while still having the cut film-like adhesive in a normal state. In the examples of this document, a film-like adhesive composite sheet in which a film-like adhesive is provided on a general dicing sheet (i.e., a support sheet having a base material and a pressure-sensitive adhesive layer) is specifically disclosed, but the effect of the present invention described above is not disclosed.

[0019] <Support sheet> The support sheet is a sheet having a substrate, and may be a sheet consisting of only the substrate (i.e., having only the substrate), or may be a sheet having the substrate and layers other than the substrate. An example of the support sheet having layers other than the substrate is a sheet having a pressure-sensitive adhesive layer on the substrate. The film-like adhesive described below is provided on the support sheet. Therefore, for example, when the support sheet is a sheet having a pressure-sensitive adhesive layer on a substrate, the film-like adhesive is provided on the pressure-sensitive adhesive layer. When the support sheet is a sheet consisting of only a substrate, the film-like adhesive is provided in direct contact with the substrate.

[0020] The thickness of the support sheet can be appropriately selected depending on the purpose within the range that satisfies the above-mentioned product (A×B) condition, but is preferably 20 μm to 200 μm, more preferably 25 μm to 150 μm, particularly preferably 30 μm to 100 μm, and extremely preferably 38 μm to 80 μm. Here, the "thickness of the support sheet" means the thickness of the entire support sheet, and for example, the thickness of a support sheet consisting of multiple layers means the total thickness of all layers constituting the support sheet. Note that, as a method for measuring the thickness of the support sheet, for example, a method of measuring the thickness at any five points with a contact thickness meter and calculating the average of the measured values ​​can be mentioned.

[0021] The Young's modulus of the support sheet can be appropriately selected depending on the purpose within a range that satisfies the product (A×B) condition, but is preferably 50 MPa to 5000 MPa, more preferably 100 MPa to 4000 MPa, particularly preferably 150 MPa to 3000 MPa, and extremely preferably 170 MPa to 2250 MPa. As described in the Examples below, the "Young's modulus" is a value measured using a universal testing machine based on JIS K7127:1999 under conditions of a gripping distance of 100 mm and a tensile speed of 200 mm / min. In one aspect, the support sheet according to the present invention preferably has a thickness (B) of 38 μm to 80 μm, a Young's modulus (A) of 170 MPa to 2250 MPa, and a product thereof (A×B) of 13.6 to 112.5 MPa·mm.

[0022] [Base material] The material constituting the substrate is preferably various resins, and specific examples thereof include polyethylene (e.g., low-density polyethylene (sometimes abbreviated as LDPE), linear low-density polyethylene (sometimes abbreviated as LLDPE), high-density polyethylene (sometimes abbreviated as HDPE, etc.)), polypropylene, polybutene, polybutadiene, polymethylpentene, styrene-ethylenebutylene-styrene block copolymer, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate (sometimes abbreviated as PET), polybutylene terephthalate, polyurethane, polyurethane acrylate, polyimide, ethylene-vinyl acetate copolymer, ionomer resin, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, polystyrene, polycarbonate, fluororesin, water additives, modified products, crosslinked products, or copolymers of any of these resins, and the like.

[0023] In this specification, the term "(meth)acrylic acid" is a concept that includes both "acrylic acid" and "methacrylic acid." The same applies to terms similar to (meth)acrylic acid. For example, "(meth)acrylate" is a concept that includes both "acrylate" and "methacrylate," and "(meth)acryloyl group" is a concept that includes both "acryloyl group" and "methacryloyl group."

[0024] The resin constituting the substrate may be one type only, or two or more types. When two or more types are used, the combination and ratio thereof can be selected arbitrarily.

[0025] The substrate may be made of one layer (i.e., a single layer) or may be made of two or more layers. When the substrate is made of multiple layers, these layers may be the same or different from each other. That is, all layers may be the same, all layers may be different, or only some layers may be the same. When the layers are different from each other, the combination of these layers is not particularly limited as long as it does not impair the effect of the present invention. Here, when the layers are different from each other, it means that at least one of the material and thickness of each layer is different from each other. In this specification, not only in the case of a base material, "multiple layers may be the same or different from one another" means "all layers may be the same, all layers may be different, or only some layers may be the same", and further, "multiple layers are different from one another" means "at least one of the constituent materials and thicknesses of each layer is different from one another".

[0026] The thickness of the substrate can be appropriately selected depending on the purpose within a range that satisfies the product (A×B) condition, but is preferably 20 μm to 200 μm, more preferably 25 μm to 150 μm, particularly preferably 30 μm to 100 μm, and extremely preferably 38 μm to 80 μm. Here, the "thickness of the substrate" means the thickness of the entire substrate, and for example, the thickness of a substrate consisting of multiple layers means the total thickness of all layers constituting the substrate. In addition, as a method for measuring the thickness of the substrate, for example, a method of measuring the thickness at any five points using a contact thickness meter and calculating the average of the measured values ​​can be mentioned.

[0027] The Young's modulus of the substrate can be appropriately selected depending on the purpose within a range that satisfies the product (A×B) condition, but is preferably 50 MPa to 5000 MPa, more preferably 100 MPa to 4000 MPa, particularly preferably 150 MPa to 3000 MPa, and extremely preferably 170 MPa to 2250 MPa. In one aspect, the substrate according to the present invention preferably has a thickness of 38 μm to 80 μm, a Young's modulus of 170 MPa to 2250 MPa, and a product thereof of 13.6 to 112.5 MPa·mm.

[0028] In order to improve adhesion to other layers, such as a pressure-sensitive adhesive layer, provided thereon, the substrate may be subjected to a surface treatment such as sandblasting, solvent treatment, etc. to form irregularities, or a corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone / ultraviolet light irradiation treatment, flame treatment, chromate treatment, hot air treatment, etc. The surface of the substrate may be treated with a primer. The substrate may also have an antistatic coating layer, a layer that prevents the substrate from adhering to other sheets or to an adsorption table when the film-like adhesive composite sheet is stacked and stored, and the like. Among these, the substrate is preferably one whose surface has been subjected to electron beam irradiation treatment, since this prevents the substrate from being fragmented due to friction with a blade during dicing of a semiconductor wafer.

[0029] [Adhesive layer] As the pressure-sensitive adhesive layer, a known pressure-sensitive adhesive layer can be appropriately used. The adhesive layer can be formed from an adhesive composition containing various components for constituting the adhesive layer. The ratio of the contents of the components that do not vaporize at room temperature in the adhesive composition is usually the same as the ratio of the contents of the components in the adhesive layer. In this specification, "room temperature" means a temperature that is not particularly cooled or heated, that is, a normal temperature, and examples of the temperature include a temperature of 15 to 25°C.

[0030] When the pressure-sensitive adhesive layer contains an energy ray-curable component, the pressure-sensitive adhesive layer can be irradiated with energy rays to reduce its adhesiveness, making it easier to pick up the semiconductor chip. The treatment of reducing the adhesiveness by irradiating the pressure-sensitive adhesive layer with energy rays may be performed after the film-like adhesive composite sheet is attached to the adherend, or may be performed in advance before the film-like adhesive composite sheet is attached to the adherend.

[0031] In the present invention, the term "energy ray" refers to electromagnetic waves or charged particle beams that have an energy quantum, and examples of such beams include ultraviolet rays and electron beams. The ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, etc. as an ultraviolet ray source. The electron beam can be generated by an electron beam accelerator or the like. In the present invention, "energy ray curable" means a property of being cured by irradiation with energy rays, and "non-energy ray curable" means a property of not being cured even when irradiated with energy rays.

[0032] As the pressure-sensitive adhesive composition, for example, a composition containing an acrylic polymer and an energy ray-polymerizable compound (pressure-sensitive adhesive composition (i)); a composition containing an acrylic polymer having a hydroxyl group and a polymerizable group on a side chain (for example, one having a hydroxyl group and a polymerizable group on a side chain via a urethane bond) and an isocyanate-based crosslinking agent (pressure-sensitive adhesive composition (ii)) is preferable, and a composition further containing a solvent is more preferable.

[0033] In addition to the above-mentioned components, the pressure-sensitive adhesive composition may further contain any of various additives such as a photopolymerization initiator, a colorant (pigment, dye), an antidegradant, an antistatic agent, a flame retardant, a silicone compound, and a chain transfer agent.

[0034] The pressure-sensitive adhesive composition may contain a reaction retarder for suppressing the progress of unintended crosslinking reactions during storage. Examples of the reaction retarder include those that inhibit the action of a component that acts as a catalyst to advance the crosslinking reaction. Preferred examples include those that form a chelate complex by chelating the catalyst. More specifically, preferred reaction retarders include those having two or more carbonyl groups (-C(=O)-) in the molecule, and examples of those having two carbonyl groups in the molecule include dicarboxylic acids, keto acids, diketones, etc.

[0035] When the support sheet has a pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer can be appropriately selected according to the purpose within the range that satisfies the condition of the product (A×B), but is preferably 1 to 100 μm, more preferably 1 to 60 μm, and particularly preferably 1 to 30 μm. Here, the "thickness of the pressure-sensitive adhesive layer" means the thickness of the entire pressure-sensitive adhesive layer, and for example, the thickness of a pressure-sensitive adhesive layer consisting of multiple layers means the total thickness of all layers that constitute the pressure-sensitive adhesive layer. In addition, as a method for measuring the thickness of the pressure-sensitive adhesive layer, for example, a method of measuring the thickness at any five points using a contact thickness meter and calculating the average of the measured values ​​can be mentioned.

[0036] The pressure-sensitive adhesive composition can be obtained by blending the various components for constituting the pressure-sensitive adhesive layer, such as an acrylic polymer, and can be obtained, for example, in a manner similar to that of the adhesive composition described below, except that the blended components are different.

[0037] The pressure-sensitive adhesive layer can be formed by applying a pressure-sensitive adhesive composition to the surface of the substrate and drying it. At this time, the applied pressure-sensitive adhesive composition may be heated as necessary to crosslink it. The heating conditions may be, for example, 100 to 130°C for 1 to 5 minutes, but are not limited thereto. Alternatively, the pressure-sensitive adhesive layer may be formed on the substrate by applying the pressure-sensitive adhesive composition to the release-treated surface of a release film, drying the composition, and laminating the resulting pressure-sensitive adhesive layer on the surface of the substrate, and removing the release film as necessary.

[0038] The pressure-sensitive adhesive composition may be applied to the surface of a substrate or to the surface of a release layer of a release material by a known method, such as a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, a screen coater, a Mayer bar coater, or a kiss coater.

[0039] <Film adhesive> The film-like adhesive has a curing property. The film-like adhesive is preferably one having a thermosetting property, and is preferably one having a pressure-sensitive adhesive property. A film-like adhesive having both a thermosetting property and a pressure-sensitive adhesive property can be applied to various adherends by lightly pressing it against the adherend in an uncured state. The film-like adhesive may also be one that can be applied to various adherends by being softened by heating. The film-like adhesive finally becomes a cured product having high impact resistance by curing, and this cured product can retain sufficient adhesive properties even under harsh conditions of high temperature and high humidity.

[0040] The thickness of the film-like adhesive is 1 μm to 60 μm, preferably 3 μm to 25 μm, and more preferably 5 μm to 15 μm. When the thickness of the film-like adhesive is equal to or greater than the lower limit, high adhesive strength to the adherend (i.e., semiconductor chip) can be obtained. Furthermore, when the thickness of the film-like adhesive is equal to or less than the upper limit, the film-like adhesive can be easily cut by applying force to the film-like adhesive through a support sheet, which is a common operation performed during the manufacture of semiconductor devices, using the shear force generated by this operation, and there is no need to provide a separate process whose main purpose is to cut the film-like adhesive. An example of a method for measuring the thickness of a film-like adhesive is to measure the thickness at any five points using a contact thickness meter and calculate the average of the measured values.

[0041] In the present invention, the breaking elongation C of the laminate obtained by laminating the film-like adhesive before curing to a total thickness of 200 μm is, for example, preferably 5 to 2000%, more preferably 30 to 1200%, even more preferably 40 to 1100%, and particularly preferably 45 to 1050%. When the breaking elongation (C) is equal to or less than the upper limit, the film-like adhesive can be cut more easily before picking up the semiconductor chip to which the film-like adhesive is attached. In other words, in one aspect, the film-like adhesive in the film-like adhesive composite sheet of the present invention is a film-like adhesive that, when the film-like adhesive before curing is laminated to a total thickness of 200 μm, has the property that the breaking elongation (C) of the laminate is 1 to 2000%, preferably 30 to 1200%, more preferably 40 to 1100%, and particularly preferably 45 to 1050%.

[0042] In yet another aspect, the breaking elongation (C) is preferably 2000% or less, more preferably 1500% or less, and particularly preferably 1000% or less, and may be, for example, any one of 30 to 1500%, 40 to 500%, and 45 to 1000%, etc. When the breaking elongation (C) is equal to or less than the upper limit, the film-like adhesive can be more easily cut by various methods before picking up the semiconductor chip to which the film-like adhesive is attached. That is, as a method for cutting a film-like adhesive, not only the most common pin push-up method but also other methods such as the slider push-up method can be suitably applied, which increases the versatility of the film-like adhesive composite sheet.

[0043] In this specification, the term "breaking elongation (C) (%)" refers to the breaking elongation of a laminate obtained by laminating the film-like adhesive before curing to a total thickness of 200 μm. In the present invention, the breaking elongation of the film-like adhesive before curing or the overall laminate obtained by laminating the same is a value determined in accordance with JIS K7161-1994 (ISO 527-1) or JIS K7127:1999 (ISO 527-3). When the measurement object (test piece) does not have a yield point, the tensile breaking strain is measured, and when it has a yield point, the nominal tensile breaking strain is measured, and the breaking elongation can be determined using these measured values.

[0044] The laminate for which the breaking elongation C is to be determined is a pre-cured film-like adhesive having a thickness of less than 200 μm, preferably a laminate obtained by laminating two or more sheets of a pre-cured film-like adhesive having a thickness of 1 to 60 μm to form the film-like adhesive composite sheet of the present invention, so as to have a total thickness of 200 μm.

[0045] The breaking elongation C is determined by cutting the laminate into a test piece having a width of 15 mm, a length of 100 mm, and a thickness of 200 μm, fixing the test piece at two points so that the distance between the fixing points (for example, the distance between the tips of a fixed gripping device when the test piece is fixed at two points by the fixed gripping device of a universal testing machine) is 75 mm, pulling the laminate between these fixing points at a tensile speed of 200 mm / min, and measuring the elongation of the test piece when the laminate breaks. In this specification, "the breaking elongation (C) is X% (wherein X is a positive number)" means that in the above-mentioned measurement method, when a test piece (a test piece prepared from a laminate) is pulled, the test piece elongates in the tensile direction by X% of its original length (the length when not pulled), that is, when the total length of the test piece in the tensile direction becomes [1+X / 100] times the length before pulling, the test piece breaks.

[0046] In the present invention, the breaking strength (D) of the laminate obtained by laminating the film-like adhesive before curing to a total thickness of 200 μm is preferably 0.1 to 17 MPa, more preferably 0.2 to 15 MPa, and particularly preferably 0.4 to 13 MPa. Here, the laminate is the same as the laminate that is the subject of the measurement of the breaking elongation (C) (%) described above. The breaking strength D is the tensile stress when the test piece breaks (destroys) during the measurement of the breaking elongation (C), that is, the tensile breaking stress, and can be measured simultaneously with the breaking elongation (C). In other words, in one aspect, the film-like adhesive in the film-like adhesive composite sheet of the present invention is a film-like adhesive that, when the film-like adhesive before curing is laminated to a total thickness of 200 μm, has the property that the breaking strength (D) of the laminate is preferably 0.1 to 17 MPa, more preferably 0.2 to 15 MPa, and particularly preferably 0.4 to 13 MPa.

[0047] The adhesive strength (E) of the film-like adhesive to the semiconductor wafer before curing is preferably 3N / 24mm or more, more preferably 4N / 24mm or more. The upper limit of the adhesive strength (E) can be, for example, any of 15N / 24mm, 11N / 24mm, and 10N / 24mm, but these are only examples. In one aspect, the film-like adhesive related to the film-like adhesive composite sheet of the present invention is a film-like adhesive having a characteristic that the adhesive strength (E) when the film-like adhesive before curing is adhered to a semiconductor wafer is preferably 3N / 24mm or more and 15N / 24mm or less, more preferably 3N / 24mm or more and 11N / 24mm or less, particularly preferably 4N / 24mm or more and 11N / 24mm or less, and extremely preferably 4N / 24mm or more and 10N / 24mm or less.

[0048] In this specification, the adhesive strength E (N / 24mm) of the film-like adhesive to the semiconductor wafer before curing can be measured by the following method. That is, a laminated sheet of the film-like adhesive and the adhesive tape with a width of 24 mm and an arbitrary length is prepared. This laminated sheet is a laminate in which the film-like adhesive is laminated on the adhesive surface of the adhesive tape, and the adhesive tape used is "Cellotape (registered trademark) No. 405" manufactured by Nichiban Co., Ltd. with a width of 24 mm. Next, this laminated sheet is attached to the semiconductor wafer by the film-like adhesive heated to 60°C to prepare a laminate in which the adhesive tape, the film-like adhesive, and the semiconductor wafer are laminated in this order. After this laminated body is immediately left for 30 minutes under the standard environment specified in JIS Z0237 2009, the laminated sheet of the film-like adhesive and the adhesive tape is peeled off from the semiconductor wafer at a peeling speed of 150 mm / min so that the surfaces of the film-like adhesive and the semiconductor wafer that were in contact with each other form an angle of 180°, that is, a so-called 180° peeling is performed. The peeling force at this time is measured, and the measured value is regarded as the adhesive force E (N / 24 mm). The length of the laminated sheet used for the measurement is not particularly limited as long as the peeling force can be stably measured. The length of the laminated sheet is preferably, for example, 120 to 250 mm.

[0049] The adhesive strength (E) of the film-like adhesive to the semiconductor wafer before curing can be appropriately adjusted by adjusting the type and amount of components contained in the film-like adhesive, the thickness of the film-like adhesive, the material constituting the surface of the support sheet on which the film-like adhesive is applied, and the condition of this surface (surface condition), etc. For example, in the case of a component of a film-like adhesive, the adhesive strength E of the film-like adhesive to a semiconductor wafer before curing can be easily adjusted by adjusting the type or amount of coupling agent (e) such as a silane coupling agent described below. In addition, for example, the surface condition of the support sheet can be adjusted by applying the surface treatments mentioned above for improving adhesion to other layers of the substrate, i.e., roughening treatments such as sandblasting and solvent treatment; oxidation treatments such as corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone / ultraviolet radiation treatment, flame treatment, chromic acid treatment and hot air treatment; primer treatment, etc. However, these adjustment methods are merely examples.

[0050] The breaking elongation (C) and breaking strength (D) of the film-like adhesive can be appropriately adjusted by adjusting the type and amount of the components contained in the film-like adhesive. For example, the breaking elongation (C) and breaking strength (D) of the film-like adhesive can be easily adjusted by adjusting the molecular weight and content of the polymer component (a) described below, the structure, softening point and content of the components constituting the epoxy thermosetting resin (b), and the content of the filler (c). However, these adjustment methods are merely examples.

[0051] In the present invention, the value of E / (C×D) calculated from the breaking elongation (C), the breaking strength (D), and the adhesive strength (E) is preferably 0.0005 or more, more preferably 0.0006 or more, and particularly preferably 0.0007 or more. The upper limit of E / (C×D) is not particularly limited, and can be, for example, 0.80 or less, 0.50 or less, or 0.10 or less, but these are just examples. The film-like adhesive relating to the film-like adhesive composite sheet of the present invention is, in one aspect, a film-like adhesive having the property that the value E / (C×D) calculated from the breaking elongation (C), the breaking strength (D), and the adhesive strength (E) is preferably 0.0005 or more and 0.80 or less, more preferably 0.0006 or more and 0.50 or less, and particularly preferably 0.0007 or more and 0.10 or less.

[0052] [Adhesive composition] The film-like adhesive can be formed from an adhesive composition containing its constituent materials. For example, the adhesive composition can be applied to the surface on which the film-like adhesive is to be formed, and then dried as necessary to form the film-like adhesive at the desired site. The ratio of the contents of the components that do not vaporize at room temperature in the adhesive composition is usually the same as the ratio of the contents of the components in the film-like adhesive. Here, "room temperature" is as described above.

[0053] The adhesive composition may be applied by a known method, for example, a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, a screen coater, a Mayer bar coater, or a kiss coater.

[0054] The drying conditions for the adhesive composition are not particularly limited. When the adhesive composition contains a solvent described below, it is preferable to heat-dry the adhesive composition. In this case, it is preferable to dry the adhesive composition under conditions of, for example, 70 to 130°C for 10 seconds to 5 minutes.

[0055] A preferred adhesive composition is, for example, a composition containing a polymer component (a) and an epoxy-based thermosetting resin (b). Each component will be described below.

[0056] (Polymer component (a)) The polymer component (a) is a component that can be regarded as being formed by a polymerization reaction of a polymerizable compound, and is a polymer compound that imparts film-forming properties, flexibility, etc. to the film-like adhesive and improves the adhesiveness (applicability) to an adhesion target such as a semiconductor chip. The polymer component (a) is also a component that does not fall under the category of the epoxy resin (b1) and the thermosetting agent (b2) described below.

[0057] The polymer component (a) may be used either alone or in combination of two or more kinds. When two or more kinds are used in combination, the combination and ratio thereof can be selected arbitrarily.

[0058] Examples of the polymer component (a) include acrylic resins (e.g., resins having a (meth)acryloyl group), polyester, urethane resins (e.g., resins having a urethane bond), acrylic urethane resins, silicone resins (e.g., resins having a siloxane bond), rubber resins (e.g., resins having a rubber structure), phenoxy resins, and thermosetting polyimides, with acrylic resins being preferred.

[0059] The acrylic resin in the polymer component (a) may be any known acrylic polymer. The weight average molecular weight (Mw) of the acrylic resin is preferably 10,000 to 2,000,000, and more preferably 100,000 to 1,500,000. When the weight average molecular weight of the acrylic resin is within such a range, it becomes easy to adjust the adhesive strength E of the film-like adhesive to the semiconductor wafer before curing to within the above-mentioned range. On the other hand, when the weight average molecular weight of the acrylic resin is equal to or greater than the lower limit, the shape stability (stability over time during storage) of the film-like adhesive is improved. Also, when the weight average molecular weight of the acrylic resin is equal to or less than the upper limit, the film-like adhesive is more likely to conform to the uneven surface of the adherend, and the occurrence of voids between the adherend and the film-like adhesive is further suppressed. In this specification, unless otherwise specified, the "weight average molecular weight" is a polystyrene-equivalent value measured by gel permeation chromatography (sometimes abbreviated as GPC).

[0060] The glass transition temperature (sometimes abbreviated as Tg) of the acrylic resin is preferably −60 to 70° C., and more preferably −30 to 50° C. When the Tg of the acrylic resin is equal to or higher than the lower limit, the adhesive strength between the film-like adhesive and the support sheet is suppressed, and the semiconductor chip provided with the film-like adhesive can be more easily detached from the support sheet during pick-up. Furthermore, when the Tg of the acrylic resin is equal to or lower than the upper limit, the adhesive strength E between the film-like adhesive and the semiconductor chip is improved.

[0061] Examples of the (meth)acrylic acid ester constituting the acrylic resin include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylic acid alkyl esters in which the alkyl group constituting the alkyl ester has a chain structure having 1 to 18 carbon atoms, such as sononyl, decyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate (also called lauryl (meth)acrylate), tridecyl (meth)acrylate, tetradecyl (meth)acrylate (also called myristyl (meth)acrylate), pentadecyl (meth)acrylate, hexadecyl (meth)acrylate (also called palmityl (meth)acrylate), heptadecyl (meth)acrylate, and octadecyl (meth)acrylate (also called stearyl (meth)acrylate); (meth)acrylic acid cycloalkyl esters such as isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate; (Meth)acrylic acid aralkyl esters such as benzyl (meth)acrylate; (Meth)acrylic acid cycloalkenyl esters such as (meth)acrylic acid dicyclopentenyl ester; (Meth)acrylic acid cycloalkenyloxyalkyl esters such as (meth)acrylic acid dicyclopentenyloxyethyl ester; (Meth)acrylic acid imide; glycidyl group-containing (meth)acrylic acid esters such as glycidyl (meth)acrylate; hydroxyl group-containing (meth)acrylic acid esters such as hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; Examples include substituted amino group-containing (meth)acrylic acid esters such as N-methylaminoethyl (meth)acrylate. Here, the term "substituted amino group" refers to a group in which one or two hydrogen atoms of an amino group are substituted with a group other than a hydrogen atom.

[0062] The acrylic resin may be, for example, a copolymer of one or more monomers selected from (meth)acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, N-methylolacrylamide, and the like, in addition to the (meth)acrylic acid ester.

[0063] The monomer constituting the acrylic resin may be one type only, or two or more types. When two or more types are used, the combination and ratio thereof can be selected arbitrarily.

[0064] The acrylic resin may have a functional group capable of bonding with other compounds, such as a vinyl group, a (meth)acryloyl group, an amino group, a hydroxyl group, a carboxyl group, an isocyanate group, etc. The functional group of the acrylic resin may be bonded with other compounds via a crosslinking agent (f) described later, or may be bonded directly with other compounds without the crosslinking agent (f). The acrylic resin is bonded with other compounds via the functional group, which tends to improve the reliability of the package obtained using the film-like adhesive composite sheet.

[0065] In the present invention, as the polymer component (a), a thermoplastic resin other than an acrylic resin (hereinafter sometimes simply abbreviated as "thermoplastic resin") may be used alone without using an acrylic resin, or may be used in combination with an acrylic resin. By using the thermoplastic resin, the semiconductor chip equipped with the film-like adhesive can be more easily detached from the support sheet during pick-up, and the film-like adhesive can be more easily adapted to the uneven surface of the adherend, and the occurrence of voids between the adherend and the film-like adhesive can be more effectively suppressed.

[0066] The weight average molecular weight of the thermoplastic resin is preferably 1,000 to 100,000, and more preferably 3,000 to 80,000.

[0067] The glass transition temperature (Tg) of the thermoplastic resin is preferably from -30 to 150°C, and more preferably from -20 to 120°C.

[0068] Examples of the thermoplastic resin include polyester, polyurethane, phenoxy resin, polybutene, polybutadiene, and polystyrene.

[0069] The adhesive composition and the film-like adhesive may contain only one type of thermoplastic resin, or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0070] In the adhesive composition, the content of the acrylic resin in the polymer component (a) relative to the total content (total mass) of all components other than the solvent (i.e., the content of the acrylic resin in the polymer component (a) relative to the total mass of the film-like adhesive) is preferably 5 to 40 mass%, more preferably 7 to 25 mass%.

[0071] In the adhesive composition, the content of polymer component (a) relative to the total content (mass) of all components other than the solvent (i.e., the content of polymer component (a) relative to the total mass of the film-like adhesive) is preferably 5 to 85 mass%, and more preferably 7 to 80 mass%, regardless of the type of polymer component (a).

[0072] While the use of the thermoplastic resin provides the above-mentioned effects, there is a concern that the hardness of the film-like adhesive before curing decreases when exposed to high temperatures, and the suitability of the film-like adhesive in an uncured or semi-cured state for wire bonding decreases. Therefore, it is preferable to set the content of the polymer component (a) in the adhesive composition taking such effects into consideration.

[0073] (Epoxy thermosetting resin (b)) The epoxy thermosetting resin (b) is composed of an epoxy resin (b1) and a thermosetting agent (b2). The epoxy thermosetting resin (b) contained in the adhesive composition and the film-like adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0074] Epoxy resin (b1) The epoxy resin (b1) may be any known substance, such as a polyfunctional epoxy resin, a biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, a dicyclopentadiene type epoxy resin, a biphenyl type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, or a phenylene skeleton type epoxy resin.

[0075] As the epoxy resin (b1), an epoxy resin having an unsaturated hydrocarbon group may be used. The epoxy resin having an unsaturated hydrocarbon group has a higher compatibility with acrylic resin than the epoxy resin not having an unsaturated hydrocarbon group. Therefore, by using the epoxy resin having an unsaturated hydrocarbon group, the reliability of the package obtained by using the film-like adhesive composite sheet is improved.

[0076] An example of an epoxy resin having an unsaturated hydrocarbon group is a compound in which a part of the epoxy group of a multifunctional epoxy resin is converted to a group having an unsaturated hydrocarbon group. Such a compound can be obtained, for example, by subjecting an epoxy group to an addition reaction with (meth)acrylic acid or a derivative thereof. In this specification, unless otherwise specified, the term "derivative" refers to a compound in which at least one group of the original compound is substituted with another group (substituent). Here, the term "group" includes not only an atomic group formed by bonding multiple atoms, but also a single atom.

[0077] Furthermore, examples of epoxy resins having an unsaturated hydrocarbon group include compounds in which a group having an unsaturated hydrocarbon group is directly bonded to an aromatic ring or the like constituting the epoxy resin. The unsaturated hydrocarbon group is a polymerizable unsaturated group, and specific examples thereof include an ethenyl group (also called a vinyl group), a 2-propenyl group (also called an allyl group), a (meth)acryloyl group, and a (meth)acrylamide group, with an acryloyl group being preferred.

[0078] The weight average molecular weight of the epoxy resin (b1) is not particularly limited, but is preferably 300 to 30,000 from the viewpoints of the curability of the film-like adhesive and the strength and heat resistance of the film-like adhesive after curing. The epoxy equivalent of the epoxy resin (b1) is preferably from 100 to 1000 g / eq, and more preferably from 150 to 800 g / eq. In this specification, the term "epoxy equivalent" means the number of grams (g / eq) of an epoxy compound containing 1 gram equivalent of epoxy groups, and can be measured according to the method of JIS K 7236:2001.

[0079] The epoxy resin (b1) may be used alone or in combination of two or more kinds. When two or more kinds are used in combination, the combination and ratio thereof can be selected arbitrarily.

[0080] ·Heat hardener (b2) The thermosetting agent (b2) functions as a curing agent for the epoxy resin (b1). The thermosetting agent (b2) may be, for example, a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an anhydride group of an acid group, and the like. The phenolic hydroxyl group, the amino group, or an anhydride group of an acid group is preferable, and the phenolic hydroxyl group or the amino group is more preferable.

[0081] Among the heat curing agents (b2), examples of phenolic curing agents having a phenolic hydroxyl group include polyfunctional phenolic resins, biphenols, novolac-type phenolic resins, dicyclopentadiene-type phenolic resins, biphenyl-type phenolic resins, and aralkyl-type phenolic resins. Among the heat curing agents (B2), examples of amine-based curing agents having an amino group include dicyandiamide (hereinafter sometimes abbreviated as "DICY").

[0082] The heat curing agent (b2) may have an unsaturated hydrocarbon group. Examples of the thermosetting agent (b2) having an unsaturated hydrocarbon group include a compound in which some of the hydroxyl groups of a phenol resin are substituted with a group having an unsaturated hydrocarbon group, and a compound in which a group having an unsaturated hydrocarbon group is directly bonded to an aromatic ring of a phenol resin. The unsaturated hydrocarbon group in the heat curing agent (b2) is the same as the unsaturated hydrocarbon group in the above-mentioned epoxy resin having an unsaturated hydrocarbon group.

[0083] When a phenol-based curing agent is used as the thermosetting agent (b2), it is preferable that the thermosetting agent (b2) has a high softening point or glass transition temperature, since this makes it easier to adjust the adhesive strength E of the film-like adhesive to the semiconductor wafer before curing to within the above-mentioned range.

[0084] The weight average molecular weight of the heat curing agent (b2) is preferably 60 to 30,000, for example.

[0085] The heat curing agent (b2) may be used alone or in combination of two or more kinds. When two or more kinds are used in combination, the combination and ratio thereof can be selected arbitrarily.

[0086] In the adhesive composition and the film-like adhesive, the content of the thermosetting agent (b2) is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass, per 100 parts by mass of the epoxy resin (b1). When the content of the thermosetting agent (b2) is equal to or greater than the lower limit, the curing of the film-like adhesive proceeds more easily. When the content of the thermosetting agent (b2) is equal to or less than the upper limit, the moisture absorption rate of the film-like adhesive is reduced, and the reliability of the package obtained using the film-like adhesive composite sheet is further improved.

[0087] In the adhesive composition and film-like adhesive, the content of the epoxy thermosetting resin (b) (i.e., the total content of the epoxy resin (b1) and the heat curing agent (b2)) is preferably 50 to 1000 parts by mass, more preferably 100 to 900 parts by mass, and particularly preferably 150 to 870 parts by mass, per 100 parts by mass of the polymer component (a). When the content of the epoxy thermosetting resin (b) is within this range, it becomes easier to separate the semiconductor chip provided with the film-like adhesive from the support sheet when picked up. In one aspect, the content of the epoxy thermosetting resin (b) is preferably 20 to 80 mass % based on the total mass of the adhesive composition and the film-like adhesive.

[0088] In order to improve various physical properties, the film-like adhesive may contain, in addition to the polymer component (a) and the epoxy thermosetting resin (b), other components not included in these components, as necessary. Preferred examples of other components contained in the film-like adhesive include a curing accelerator (c), a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray-curable resin (g), a photopolymerization initiator (h), and a general-purpose additive (i). That is, in one aspect, the film-like adhesive relating to the film-like adhesive composite sheet of the present invention comprises: a polymer component (a); an epoxy-based thermosetting resin (b); and at least one component selected from the group consisting of a curing accelerator (c), a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray-curable resin (g), a photopolymerization initiator (h), and a general-purpose additive (i).

[0089] (Cure accelerator (c)) The curing accelerator (c) is a component for adjusting the curing speed of the adhesive composition. Preferred examples of the curing accelerator (c) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole (for example, imidazole in which at least one hydrogen atom is substituted with a group other than a hydrogen atom); organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine (for example, phosphine in which at least one hydrogen atom is substituted with an organic group); and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate.

[0090] The adhesive composition and film-like adhesive may contain only one type of curing accelerator (c), or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0091] When the curing accelerator (c) is used, the content of the curing accelerator (c) in the adhesive composition and the film-like adhesive is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, relative to 100 parts by mass of the epoxy thermosetting resin (b). When the content of the curing accelerator (c) is equal to or greater than the lower limit, the effect of using the curing accelerator (c) is more pronounced. Also, when the content of the curing accelerator (c) is equal to or less than the upper limit, for example, the effect of suppressing the highly polar curing accelerator (c) from migrating to the adhesive interface with the adherend and segregating in the film-like adhesive under high temperature and high humidity conditions is enhanced, and the reliability of the package obtained using the film-like adhesive composite sheet is further improved.

[0092] (Filling material (d)) By including the filler (d), the thermal expansion coefficient of the film-like adhesive can be easily adjusted, and by optimizing this thermal expansion coefficient for the object to which the film-like adhesive is applied, the reliability of the package obtained using the film-like adhesive composite sheet is further improved. Furthermore, by including the filler (d), the film-like adhesive can reduce the moisture absorption rate of the film-like adhesive after curing and improve the heat dissipation properties.

[0093] The filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler. Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride, and the like; beads obtained by spheronizing these inorganic fillers; surface-modified products of these inorganic fillers; single crystal fibers of these inorganic fillers; glass fibers, and the like. Among these, the inorganic filler is preferably silica or alumina.

[0094] The adhesive composition and film-like adhesive may contain only one type of filler (d), or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0095] When the filler (d) is used, the content of the filler (d) in the adhesive composition relative to the total content (total mass) of all components other than the solvent (i.e., the content of the filler (d) relative to the total mass of the film-like adhesive) is preferably 5 to 80 mass%, more preferably 7 to 60 mass%. When the content of the filler (d) is within this range, it becomes easier to adjust the thermal expansion coefficient.

[0096] (Coupling Agent (e)) The film-like adhesive contains a coupling agent (e) to improve its adhesion and adhesion to the adherend. In addition, the film-like adhesive contains a coupling agent (e) to improve the water resistance of the cured product without impairing its heat resistance. The coupling agent (e) has a functional group capable of reacting with an inorganic compound or an organic compound.

[0097] The coupling agent (e) is preferably a compound having a functional group capable of reacting with a functional group possessed by the polymer component (a), the epoxy thermosetting resin (b) or the like, and is more preferably a silane coupling agent. Preferred examples of the silane coupling agent include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, and Examples of suitable silanes include bis(3-(triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazole silane, and epoxy group-containing oligomers.

[0098] The coupling agent (e) contained in the adhesive composition and the film-like adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0099] When a coupling agent (e) is used, the content of the coupling agent (e) in the adhesive composition and the film-like adhesive is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass, per 100 parts by mass of the total content of the polymer component (a) and the epoxy thermosetting resin (b). When the content of the coupling agent (e) is equal to or greater than the lower limit, the effects of using the coupling agent (e) such as improved dispersibility of the filler (d) in the resin and improved adhesion of the film-like adhesive to the adherend can be more significantly obtained. In addition, when the content of the coupling agent (e) is equal to or less than the upper limit, the generation of outgassing is further suppressed.

[0100] (Crosslinking agent (f)) When the polymer component (a) is one having a functional group such as a vinyl group, (meth)acryloyl group, amino group, hydroxyl group, carboxyl group, isocyanate group, etc., which can be bonded to other compounds, such as the above-mentioned acrylic resin, the adhesive composition and the film-like adhesive may contain a crosslinking agent (f) for bonding the functional group to other compounds to crosslink them. By crosslinking with the crosslinking agent (f), the initial adhesive strength and cohesive strength of the film-like adhesive can be adjusted.

[0101] Examples of the crosslinking agent (f) include organic polyvalent isocyanate compounds, organic polyvalent imine compounds, metal chelate crosslinking agents (i.e., crosslinking agents having a metal chelate structure), and aziridine crosslinking agents (i.e., crosslinking agents having an aziridinyl group).

[0102] Examples of the organic polyisocyanate compound include aromatic polyisocyanate compounds, aliphatic polyisocyanate compounds, and alicyclic polyisocyanate compounds (hereinafter, these compounds may be collectively referred to as "aromatic polyisocyanate compounds, etc."); trimers, isocyanurates, and adducts of the aromatic polyisocyanate compounds, etc.; and terminal isocyanate urethane prepolymers obtained by reacting the aromatic polyisocyanate compounds, etc. with polyol compounds. The "adduct" refers to a reaction product of the aromatic polyisocyanate compound, aliphatic polyisocyanate compound, or alicyclic polyisocyanate compound with a low molecular weight active hydrogen-containing compound such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, or castor oil, and examples thereof include a xylylene diisocyanate adduct of trimethylolpropane, as described below. Moreover, the term "isocyanate-terminated urethane prepolymer" refers to a prepolymer having a urethane bond and an isocyanate group at the terminal of the molecule.

[0103] More specific examples of the organic polyisocyanate compound include 2,4-tolylene diisocyanate; 2,6-tolylene diisocyanate; 1,3-xylylene diisocyanate; 1,4-xylylene diisocyanate; diphenylmethane-4,4'-diisocyanate; diphenylmethane-2,4'-diisocyanate; 3-methyldiphenylmethane diisocyanate; hexamethylene diisocyanate; isophorone diisocyanate; dicyclohexylmethane-4,4'-diisocyanate; dicyclohexylmethane-2,4'-diisocyanate; a compound in which one or more of tolylene diisocyanate, hexamethylene diisocyanate, and xylylene diisocyanate are added to all or a portion of the hydroxyl groups of a polyol such as trimethylolpropane; lysine diisocyanate, and the like.

[0104] Examples of the organic polyvalent imine compound include N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylolmethane-tri-β-aziridinylpropionate, N,N'-toluene-2,4-bis(1-aziridinecarboxamide)triethylenemelamine, and the like.

[0105] When an organic polyisocyanate compound is used as the crosslinking agent (f), it is preferable to use a hydroxyl group-containing polymer as the polymer component (a). When the crosslinking agent (f) has an isocyanate group and the polymer component (a) has a hydroxyl group, a crosslinked structure can be easily introduced into the film-like adhesive by the reaction between the crosslinking agent (f) and the polymer component (a).

[0106] The adhesive composition and film-like adhesive may contain only one type of crosslinking agent (f), or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0107] When the crosslinking agent (f) is used, the content of the crosslinking agent (f) in the adhesive composition is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass, per 100 parts by mass of the polymer component (a). When the content of the crosslinking agent (f) is equal to or greater than the lower limit, the effect of using the crosslinking agent (f) is more pronounced. Moreover, when the content of the crosslinking agent (f) is equal to or less than the upper limit, excessive use of the crosslinking agent (f) is suppressed.

[0108] (Energy ray curable resin (g)) The film adhesive contains the energy ray-curable resin (g) and thus the properties thereof can be changed by irradiation with energy rays.

[0109] The energy ray curable resin (g) has the property of being cured (polymerized) by irradiation with energy rays. The energy ray-curable compound includes, for example, a compound having at least one polymerizable double bond in the molecule, and is preferably an acrylate-based compound having a (meth)acryloyl group.

[0110] Examples of the acrylate-based compound include (meth)acrylates containing a chain aliphatic skeleton, such as trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate. ) acrylates; alicyclic skeleton-containing (meth)acrylates such as dicyclopentanyl di(meth)acrylate and tricyclodecane dimethylol diacrylate; polyalkylene glycol (meth)acrylates such as polyethylene glycol di(meth)acrylate; oligoester (meth)acrylates; urethane (meth)acrylate oligomers; epoxy-modified (meth)acrylates; polyether (meth)acrylates other than the above-mentioned polyalkylene glycol (meth)acrylates; and itaconic acid oligomers.

[0111] The energy ray curable resin (g) preferably has a weight average molecular weight of 100 to 30,000.

[0112] The adhesive composition may contain only one type of energy ray-curable resin (g), or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0113] The content of the energy ray curable resin (g) relative to the total mass of the adhesive composition is preferably from 1 to 95 mass%, more preferably from 3 to 90 mass%, and particularly preferably from 5 to 85 mass%.

[0114] (Photopolymerization initiator (h)) When the adhesive composition contains an energy ray-curable resin (g), it may contain a photopolymerization initiator (h) in order to efficiently promote the polymerization reaction of the energy ray-curable resin (g).

[0115] Examples of the photopolymerization initiator (h) in the adhesive composition include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal; acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, and 2,2-dimethoxy-1,2-diphenylethane-1-one; and acylphosphines such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide. Oxide compounds; sulfide compounds such as benzyl phenyl sulfide and tetramethylthiuram monosulfide; α-ketol compounds such as 1-hydroxycyclohexyl phenyl ketone; azo compounds such as azobisisobutyronitrile; titanocene compounds such as titanocene; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; benzyl; dibenzyl; benzophenone; 2,4-diethylthioxanthone; 1,2-diphenylmethane; 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone; quinone compounds such as 1-chloroanthraquinone and 2-chloroanthraquinone, etc. Examples of the photopolymerization initiator (h) include photosensitizers such as amines.

[0116] The adhesive composition may contain only one type of photopolymerization initiator (h), or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0117] In the adhesive composition, the content of the photopolymerization initiator (h) is preferably 0.1 to 20 parts by mass, more preferably 1 to 10 parts by mass, and particularly preferably 2 to 5 parts by mass, per 100 parts by mass of the energy ray-curable resin (g).

[0118] (General-purpose additives (i)) The general-purpose additive (I) may be a known one and may be arbitrarily selected depending on the purpose, and is not particularly limited. Preferred examples thereof include plasticizers, antistatic agents, antioxidants, colorants (dyes, pigments), gettering agents, and the like.

[0119] The adhesive composition and film-like adhesive may contain only one type of general-purpose additive (i), or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily. The contents of the adhesive composition and the film-like adhesive are not particularly limited and may be appropriately selected depending on the purpose.

[0120] (solvent) The adhesive composition preferably further contains a solvent. An adhesive composition containing a solvent has good handleability. The solvent is not particularly limited, but preferred examples include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (also known as 2-methylpropan-1-ol), and 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; and amides (i.e., compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone. The adhesive composition may contain one type of solvent, or two or more types. When two or more types are contained, the combination and ratio of the solvents can be selected arbitrarily.

[0121] The solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like, since this allows the components contained in the adhesive composition to be mixed more uniformly.

[0122] [Method of manufacturing adhesive composition] The adhesive composition can be obtained by blending the respective components constituting the adhesive composition. The order of addition of the components when blending is not particularly limited, and two or more components may be added simultaneously. When a solvent is used, the solvent may be used by mixing it with any of the other ingredients to pre-dilute the ingredients, or the solvent may be used by mixing it with any of the other ingredients without pre-diluting the ingredients.

[0123] The method for mixing the components during blending is not particularly limited, and may be appropriately selected from known methods such as a method of mixing by rotating a stirrer or stirring blade, a method of mixing using a mixer, a method of mixing by adding ultrasound, etc. The temperature and time during addition and mixing of each component are not particularly limited as long as the components do not deteriorate, and may be adjusted appropriately. A temperature of 15 to 30°C is preferred.

[0124] The film-like adhesive composite sheet of the present invention is preferably one in which the support sheet is made of only a substrate, and the film-like adhesive is provided in direct contact with the substrate. In this way, when the support sheet does not have an adhesive layer or the like, and the film-like adhesive is provided directly on the substrate, the interlayer movement of the components is suppressed, such as the components in the film-like adhesive migrating to other layers on the substrate, such as the adhesive layer, or conversely, the components in such other layers migrating to the film-like adhesive. Therefore, the occurrence of process abnormalities during the manufacture of semiconductor devices and the deterioration of the reliability of semiconductor packages are significantly suppressed. Normally, when a film-like adhesive composite sheet that does not have a pressure-sensitive adhesive layer is used, double die is likely to occur when the semiconductor chip is peeled off from the support sheet with the film-like adhesive still attached. However, with the film-like adhesive composite sheet of the present invention, the occurrence of double die is suppressed even when this composite sheet does not have a pressure-sensitive adhesive layer.

[0125] <<Manufacturing method for film-like adhesive composite sheet>> The film-like adhesive composite sheet of the present invention can be produced by laminating the above-mentioned layers in order so that they are in the corresponding positional relationship. The method for forming each layer is as described above. For example, when manufacturing a support sheet, if an adhesive layer is laminated on a substrate, the adhesive layer can be laminated by applying the above-mentioned adhesive composition onto the substrate and drying it as necessary.

[0126] For example, when a film-like adhesive is laminated on a pressure-sensitive adhesive layer laminated on a substrate, as one aspect, it is possible to coat an adhesive composition on the pressure-sensitive adhesive layer to form a film-like adhesive directly on the pressure-sensitive adhesive layer. That is, when a continuous two-layer laminate structure is formed using any composition, it is possible to directly coat another composition on the layer formed from the composition to form a new layer. As another aspect, the layer to be laminated later among these two layers is formed in advance using the composition on another release film, and the exposed surface of the formed layer opposite to the side in contact with the release film is bonded to the exposed surface of the remaining layer that has already been formed, thereby forming a continuous two-layer laminate structure. At this time, it is preferable that the composition is coated on the release-treated surface of the release film. The release film may be removed as necessary after the formation of the laminate structure.

[0127] For example, when producing a film-like adhesive composite sheet in which an adhesive layer is laminated on a substrate and a film-like adhesive is laminated on the adhesive layer (i.e., a film-like adhesive composite sheet in which a support sheet is a laminate of a substrate and an adhesive layer), an adhesive composition is applied to a substrate and dried as necessary to laminate the adhesive layer on the substrate, and separately, an adhesive composition is applied to a release film and dried as necessary to form a film-like adhesive on the release film, and the exposed surface of this film-like adhesive is bonded to the exposed surface of the adhesive layer laminated on the substrate, and the film-like adhesive is laminated on the adhesive layer to obtain a film-like adhesive composite sheet.

[0128] In addition, when laminating a pressure-sensitive adhesive layer on a substrate, instead of the method of applying a pressure-sensitive adhesive composition onto a substrate as described above, a pressure-sensitive adhesive composition may be applied onto a release film and dried as necessary to form a pressure-sensitive adhesive layer on the release film, and the exposed surface of this pressure-sensitive adhesive layer may be attached to one surface of the substrate to laminate the pressure-sensitive adhesive layer onto the substrate. In either method, the release film may be removed at any time after the desired laminate structure is formed.

[0129] In this way, all layers other than the substrate that make up the film-like adhesive composite sheet can be formed in advance on a release film and then laminated by bonding it to the surface of the desired layer, so the film-like adhesive composite sheet can be manufactured by appropriately selecting the layers that will undergo this process as necessary.

[0130] In addition, the film-like adhesive composite sheet is usually stored in a state where a release film is attached to the surface of the outermost layer (for example, the film-like adhesive) opposite the support sheet. Therefore, a composition (i.e., an adhesive composition, etc.) for forming a layer constituting the outermost layer opposite the support sheet side in the film-like adhesive composite sheet is applied onto this release film (preferably its release-treated surface), and dried as necessary to form a layer constituting the outermost layer on the release film, and the remaining layers are laminated by any of the above-mentioned methods on the exposed surface opposite the side in contact with the release film of this layer, and the film-like adhesive composite sheet can also be obtained by leaving the layer attached without removing the release film.

[0131] <<Method of manufacturing semiconductor device>> A manufacturing method of a semiconductor device which is one embodiment of the present invention is a manufacturing method of a semiconductor device using the film-like adhesive composite sheet, and includes the steps of attaching the film-like adhesive composite sheet to a plurality of divided semiconductor chips via the film-like adhesive (hereinafter sometimes abbreviated as the "attaching process"); cutting the film-like adhesive by applying force to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side on which the film-like adhesive is provided (hereinafter sometimes abbreviated as the "cutting process"); and separating the semiconductor chip and the cut film-like adhesive attached to it from the support sheet (hereinafter sometimes abbreviated as the "detaching process").

[0132] According to the manufacturing method, by using the film-like adhesive composite sheet, it is possible to separate a semiconductor chip to which a film-like adhesive is attached from a support sheet in a simplified manner during the manufacture of a semiconductor device, while suppressing the occurrence of process abnormalities.

[0133] <Attachment process> In the attaching step, the film-like adhesive composite sheet is attached to the divided semiconductor chips via the film-like adhesive. In this step, the film-like adhesive in one film-like adhesive composite sheet is attached to the backsides of the semiconductor chips.

[0134] The divided semiconductor chips can be produced, for example, by forming a groove on the surface of the semiconductor wafer opposite to the surface to which the film-like adhesive composite sheet is attached (sometimes called the back surface), and grinding the back surface until the groove is reached. Examples of the method for forming the groove include a method for forming a groove by cutting the semiconductor wafer with a blade (i.e., blade dicing), a method for forming a groove by cutting the semiconductor wafer by irradiating a laser (i.e., laser dicing), and a method for forming a groove by cutting the semiconductor wafer by spraying water containing an abrasive (i.e., water dicing).

[0135] In addition, the multiple separated semiconductor chips can also be produced by irradiating infrared laser light so that the laser light is focused at a focal point set inside the semiconductor wafer, forming a modified layer inside the semiconductor wafer, grinding the back surface of the semiconductor wafer, and further dividing the semiconductor wafer at the location where the modified layer was formed by applying a force to the semiconductor wafer after the back surface has been ground, or by applying a grinding force to the semiconductor wafer while the back surface is being ground.

[0136] <Cutting process> In the cutting step, after the attaching step, a force is applied to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side on which the film-like adhesive is provided, thereby cutting the film-like adhesive. Hereinafter, a method for manufacturing a semiconductor device according to one embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a cross-sectional view showing a schematic diagram of one embodiment of the manufacturing method of the present invention, from cutting the film-like adhesive to peeling it off from the semiconductor chip support sheet. In Fig. 1, only the configuration related to the film-like adhesive composite sheet is shown in cross section.

[0137] 1(a), by the bonding step, the film-like adhesive 12 of the film-like adhesive composite sheet 1 is bonded to the back surfaces 9b of the multiple semiconductor chips 9. In this step, a push-up portion 81 that pushes up the semiconductor chips in a semiconductor device manufacturing device (not shown in an overall view) is in contact with a surface 11b (sometimes called a back surface) of the support sheet 11 in the film-like adhesive composite sheet 1 opposite to a surface 11a (sometimes called a front surface) on which the film-like adhesive 12 is provided.

[0138] When the support sheet 11 consists only of a substrate, the film-like adhesive composite sheet 1 is a sheet in which the substrate and the film-like adhesive 12 are laminated, and the surface of the film-like adhesive 12 opposite the side in contact with the substrate is attached to the back surface 9b of the semiconductor chip 9. When the support sheet 11 is a sheet in which a base material and an adhesive layer are laminated, the film-like adhesive composite sheet 1 is formed by laminating a base material, an adhesive layer, and a film-like adhesive 12 in that order, and the surface of the film-like adhesive 12 opposite to the side in contact with the adhesive layer is attached to the back surface 9b of the semiconductor chip 9.

[0139] In this step, as shown in FIG. 1(b), a force is applied to the support sheet 11 in the film-like adhesive composite sheet 1 from the back surface 11b of the support sheet 11, so that the force is applied to the film-like adhesive 12 through the support sheet 11. Here, a protrusion (i.e., a pin) 811 protrudes from the push-up portion 81, and the tip of the protrusion 811 pushes up the support sheet 11 from its back surface 11b, so that a force is applied to the film-like adhesive 12 through the support sheet 11 in the protruding direction of the protrusion 811. At this time, the push-up conditions such as the protrusion amount (i.e., push-up amount) of the protrusion 811, the protrusion speed (i.e., push-up speed), and the time for which the protrusion state is maintained (i.e., lift-up waiting time) can be appropriately adjusted. Here, a case is shown in which the number of protrusions 811 pushing up the support sheet 11 is five, but the number may be one, two or more, and the number of protrusions 811 may be appropriately selected.

[0140] In this way, when force is applied to the film-like adhesive 12, the film-like adhesive composite sheet 1 is used, and the shear force generated by the pushing up of the protrusions 811 enables the film-like adhesive 12 to be cut while suppressing the occurrence of process abnormalities. More specifically, the film-like adhesive 12 can be cut at room temperature at the target location, that is, at a location that surrounds only the semiconductor chip 9 that is to be peeled off from the support sheet 11. Then, the film-like adhesive 12 can be cut without a separate process whose main purpose is to cut the film-like adhesive 12, such as a process of cutting the film-like adhesive 12 by irradiating it with a laser or a process of cutting the film-like adhesive 12 by expanding it.

[0141] <Peeling process> In the peeling step, after the cutting step, the semiconductor chip 9 and the cut film-like adhesive 12 attached thereto are peeled off (i.e., picked up) from the support sheet 11 as shown in FIG. 1(c). This step is usually performed immediately and continuously after the cutting step. Here, an example is shown in which the cut film-like adhesive 12 attached to the semiconductor chip 9 is peeled off from the support sheet 11 by lifting the semiconductor chip 9 with a lifting unit 82 of a semiconductor device manufacturing device. The method of lifting the semiconductor chip 9 in this manner may be a known method, and examples include a method of lifting the semiconductor chip 9 by suctioning the surface of the semiconductor chip 9 with a vacuum collet.

[0142] In this way, when the semiconductor chip 9 is pulled up, the film-like adhesive 12 can be peeled off from the support sheet 11 while suppressing the occurrence of process abnormalities because the film-like adhesive composite sheet 1 is used. More specifically, the phenomenon in which the portion of the film-like adhesive 12 corresponding to the intended semiconductor chip 9 peels off from the support sheet 11 and the portion of the film-like adhesive 12 corresponding to the unintended semiconductor chip 9 peels off from the support sheet 11 is suppressed. And, because the film-like adhesive 12 is cut at a predetermined location, the pulled-up semiconductor chip 9 is separated from the support sheet 11 together with the film-like adhesive 12.

[0143] In the manufacturing method of the present invention, a semiconductor device can be manufactured by using the semiconductor chip separated (i.e., picked up) together with the film-like adhesive in the same manner as in the conventional method, that is, by a step of die-bonding the semiconductor chip to the circuit surface of the substrate with the film-like adhesive. For example, the semiconductor chip is die-bonded to the circuit surface of the substrate with the film-like adhesive, and if necessary, one or more semiconductor chips are further stacked on this semiconductor chip, wire bonding is performed, and the whole is sealed with resin to form a semiconductor package. Then, the semiconductor package can be used to manufacture the desired semiconductor device. In one aspect, the method for manufacturing a semiconductor device of the present invention includes: attaching the film-like adhesive composite sheet to a plurality of separated semiconductor chips via the film-like adhesive; cutting the film-like adhesive by applying force to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side where the film-like adhesive is provided; Separating the semiconductor chip and the cut film-like adhesive attached thereto from the support sheet; die-bonding the semiconductor chip separated from the support sheet to the circuit surface of the substrate with the film-like adhesive; and If desired, one or more semiconductor chips are stacked on the semiconductor chip, wire bonding is performed, and then the whole is sealed with a resin to obtain a semiconductor package. Includes.

[0144] The method for manufacturing a semiconductor device of the present invention is not limited to the above-mentioned method described with reference to FIG. 1, and some components of the above-mentioned method may be changed, deleted, or added within a range that does not impair the effects of the present invention. For example, so far, the method of applying force to the film-like adhesive 12 through the support sheet 11 has been described as using protrusions 811 to push up the support sheet 11 to apply force to the film-like adhesive 12. Other methods include, for example, using a slider instead of protrusions 811 to push up the support sheet 11 to apply force to the film-like adhesive 12.

[0145] Fig. 2 is a cross-sectional view for explaining a schematic diagram of another embodiment in which the above-mentioned film-like adhesive is cut by applying a force. In Fig. 2, the same components as those shown in Fig. 1 are given the same reference numerals as in Fig. 1, and detailed explanations thereof are omitted. This also applies to Fig. 3 and subsequent figures. Shown here is an alternative method for cutting a film-like adhesive to that described with reference to FIG. 1(b).

[0146] When this embodiment is applied, first, the attachment step is performed in the same manner as in the case described with reference to FIG. Next, a force is applied to the film-like adhesive 12 through the back surface 11b of the support sheet 11 in the film-like adhesive composite sheet 1. However, in this embodiment, the support sheet 11 is pushed up from its back surface 11b by the movement of a slider 812 as shown in Figures 2(a) and 2(b), rather than by the protrusion of a protrusion 811 in a push-up portion 81 as shown in Figure 1(b).

[0147] In this embodiment, as shown in FIG. 2(a), the surface 812a of the slider 812 protruding from the push-up portion 81 is in contact with the back surface 11b of the support sheet 11. At this time, the surface 812a of the slider 812 is not parallel to the back surface 11b of the support sheet 11 before the cutting process as shown in FIG. 1(a). Therefore, by applying a force from the back surface 11b to the support sheet 11 in a direction perpendicular to the surface 812a of the slider 812, that is, in a diagonal direction rather than a vertical direction, a difference occurs in the push-up height of the film-like adhesive 12. However, the fact that the force is applied to the film-like adhesive 12 through the support sheet 11 is the same as in the case of FIG. 1(b). As a result, in the region where the push-up height of the film-like adhesive 12 is high, in the region where the semiconductor chip 9 is not attached (the first region 121 in FIG. 2(a)), the film-like adhesive 12 can be cut by the shear force generated by the push-up while suppressing the occurrence of process abnormalities.

[0148] When the slider 812 is pushed up, the push-up conditions, such as the amount of protrusion (ie, the amount of push-up), the inclination angle (ie, the push-up speed), and the movement speed (ie, the lifting waiting time) of the slider 812, can be adjusted as appropriate.

[0149] In this embodiment, next, as shown in Fig. 2(b), the slider 812 is moved in a direction parallel to the back surface 11b of the support sheet 11 that is not pushed up. This moves the pushed-up portion of the support sheet 11. Then, after this movement of the pushed-up portion, in the region where the pushed-up height of the film-like adhesive 12 is high and where the semiconductor chip 9 is not attached (second region 122 in Fig. 2(b)), the film-like adhesive 12 can be cut by the shear force generated by the pushing-up while suppressing the occurrence of process abnormalities.

[0150] The shear force generated by such movement of slider 812 cuts film-like adhesive 12 while suppressing the occurrence of process abnormalities, similar to the case described with reference to FIG. Thereafter, the separation step can be carried out in the same manner as described with reference to FIG. 1(a).

[0151] However, the pin thrust method as described with reference to Fig. 1 is usually more effective at cutting the film-like adhesive than the slider thrust method as described with reference to Fig. 2. Therefore, it is preferable to select which method to use, taking into consideration strength-related properties such as the Young's modulus (A) of the support sheet and the breaking elongation (C) of the film-like adhesive, for example.

[0152] As described above, according to the manufacturing method for a semiconductor device which is one embodiment of the present invention, in the cutting process, the film-like adhesive can be cut at the desired location, thereby suppressing failure to separate (lift) the semiconductor chip due to the film-like adhesive not being cut. According to the manufacturing method of a semiconductor device which is one embodiment of the present invention, in the peeling step, the intended portion of the film-like adhesive is peeled off from the support sheet, so that the occurrence of defective peeling (lifting) of the semiconductor chip is suppressed. Furthermore, because the peeling of the unintended portion of the film-like adhesive from the support sheet is suppressed, the occurrence of so-called double die, in which not only the intended semiconductor chip but also the adjacent semiconductor chip is simultaneously peeled off from the support sheet together with the film-like adhesive, is suppressed. In this manner, according to the present invention, a semiconductor device can be manufactured by a simplified method while suppressing the occurrence of process abnormalities.

[0153] If the film-like adhesive composite sheet of the present invention is not used, there is a possibility that the occurrence of process abnormalities such as those described below cannot be prevented during the manufacture of semiconductor devices.

[0154] FIG. 3 is a cross-sectional view that shows a schematic view of one embodiment of a film-like adhesive composite sheet and a semiconductor chip in the process of manufacturing a semiconductor device when a conventional film-like adhesive composite sheet is used. When the film-like adhesive composite sheet 7 shown here is used, as shown in Fig. 3(a), even if force is applied to the film-like adhesive 72 through the support sheet 71, the support sheet 71 is significantly deformed, the pick-up force is not transmitted to the film-like adhesive, and the film-like adhesive 72 is not cut, and further, when the semiconductor chip 9 is lifted up, the film-like adhesive 72 peels off from the semiconductor chip 9 and remains laminated on the support sheet 71. As a result, as shown in Fig. 3(b), a lifting failure of the semiconductor chip 9 occurs. Such process abnormalities are likely to occur, for example, when the Young's modulus (A) (MPa) of the support sheet in the film-like adhesive composite sheet 7 is small, or the thickness (B) (mm) of the support sheet is small, or both the Young's modulus (A) and the thickness (B) of the support sheet are small, resulting in the product (A × B) being less than 4 MPa mm.

[0155] FIG. 4 is a cross-sectional view that typically shows another embodiment of a film-like adhesive composite sheet and a semiconductor chip in the process of manufacturing a semiconductor device when a conventional film-like adhesive composite sheet is used. When the film-like adhesive composite sheet 7 shown here is used, as shown in FIG. 4(a), even if force is applied to the film-like adhesive 72 through the support sheet 71, the support sheet 71 is unlikely to deform. Therefore, the periphery of the target portion of the film-like adhesive corresponding to the semiconductor chip is also lifted, and the force during pick-up is not transmitted to the film-like adhesive, so that the film-like adhesive 72 is not cut. Furthermore, when the semiconductor chip 9 is lifted up, the film-like adhesive 72 peels off from the semiconductor chip 9 and remains laminated on the support sheet 71. As a result, as shown in FIG. 3(b), a lifting failure of the semiconductor chip 9 occurs. Such process abnormalities are likely to occur, for example, in the film-like adhesive composite sheet 7, when the Young's modulus (A) (MPa) of the support sheet is large, or the thickness (B) (mm) of the support sheet is large, or when both the Young's modulus (A) of the support sheet and the thickness (B) of the support sheet are large, resulting in the product (A × B) being greater than 150 MPa mm.

[0156] The process abnormality described with reference to FIGS. 3 and 4 is just one example, and other process abnormalities may occur depending on the circumstances. In contrast, when the film-like adhesive composite sheet of the present invention is used, the occurrence of such process abnormalities is suppressed, and as a result, semiconductor devices can be manufactured at low cost using a method that is simpler than in the past.

[0157] In one aspect, the film-like adhesive composite sheet according to one embodiment of the present invention comprises: A film-like adhesive composite sheet having a curable film-like adhesive provided on a support sheet, The support sheet has a substrate, The thickness of the support sheet is 20 μm to 200 μm, preferably 25 μm to 150 μm, more preferably 30 μm to 100 μm, and particularly preferably 38 μm to 80 μm; The thickness of the film-like adhesive is 1 μm to 60 μm, preferably 3 μm to 25 μm, and more preferably 5 μm to 15 μm; The Young's modulus of the support sheet is 50 MPa to 5000 MPa, preferably 100 MPa to 4000 MPa, more preferably 150 MPa to 3000 MPa, and particularly preferably 170 MPa to 2250 MPa; the product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa mm, preferably 13.6 to 112.5 MPa mm; When the curable film-like adhesive before curing is laminated to form a laminate having a total thickness of 200 μm, The laminate has a breaking elongation of 1 to 2000%, preferably 30 to 1200%, more preferably 40 to 1100%, and particularly preferably 45 to 1050%, The laminate has a breaking strength of 0.1 to 17 MPa, preferably 0.2 to 15 MPa, and more preferably 0.4 to 13 MPa; The curable film-like adhesive has a property that, when the film-like adhesive before curing is adhered to a semiconductor wafer, the adhesive strength is 3 N / 24 mm or more and 15 N / 24 mm or less, preferably 3 N / 24 mm or more and 11 N / 24 mm or less, more preferably 4 N / 24 mm or more and 11 N / 24 mm or less, and particularly preferably 4 N / 24 mm or more and 10 N / 24 mm or less; The curable film-like adhesive has a property such that the value of adhesive strength / (the breaking elongation×the breaking strength) is 0.0005 or more and 0.80 or less, preferably 0.0006 or more and 0.50 or less, and more preferably 0.0007 or more and 0.10 or less. This is a film-like adhesive composite sheet.

[0158] In another aspect, the film-like adhesive composite sheet according to one embodiment of the present invention is A film-like adhesive composite sheet having a curable film-like adhesive provided on a support sheet, The support sheet has a substrate, The thickness of the support sheet is 20 μm to 200 μm, preferably 25 μm to 150 μm, more preferably 30 μm to 100 μm, and particularly preferably 38 μm to 80 μm; The substrate is a substrate composed of polyethylene terephthalate; The thickness of the curable film-like adhesive is 1 to 60 μm, preferably 3 to 25 μm, and more preferably 5 to 15 μm; The curable film-like adhesive comprises a polymer component (a), an epoxy thermosetting resin (b), and at least one component selected from the group consisting of a curing accelerator (c), a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray curable resin (g), a photopolymerization initiator (h), and a general-purpose additive (i); The polymer component (a) is an acrylic resin; The epoxy thermosetting resin (b) comprises at least one resin selected from the group consisting of bisphenol A type epoxy resins, polyfunctional aromatic type epoxy resins, and dicyclopentadiene type epoxy resins; The content of the polymer component (a) is 5 to 85 mass %, preferably 7 to 80 mass %, based on the total mass of the curable film-like adhesive; The content of the epoxy thermosetting resin (b) is 50 to 1000 parts by mass, preferably 100 to 900 parts by mass, and more preferably 150 to 870 parts by mass, relative to 100 parts by mass of the polymer component (a); The product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa mm, preferably 13.6 to 112.5 MPa mm. This is a film-like adhesive composite sheet.

[0159] In yet another aspect, a method for manufacturing a semiconductor device according to an embodiment of the present invention includes: attaching the film-like adhesive composite sheet to a plurality of separated semiconductor chips via the film-like adhesive; cutting the film-like adhesive by applying force to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side where the film-like adhesive is provided; Separating the semiconductor chip and the film-like adhesive attached to the semiconductor chip after cutting from the support sheet; Including, A method for manufacturing a semiconductor device. The manufacturing method further includes die-bonding the semiconductor chip separated from the support sheet to a circuit surface of a substrate with the film-like adhesive; If desired, the method may include stacking one or more semiconductor chips on the semiconductor chip, performing wire bonding, and then sealing the whole with a resin to obtain a semiconductor package. EXAMPLES

[0160] The present invention will be described in more detail below with reference to specific examples, although the present invention is not limited to the following examples.

[0161] The components used in preparing the adhesive composition are listed below. Polymer components (a)-1: Acrylic resin ("Coponyl N-2359-6" manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) Epoxy resin (b1)-1: Liquid bisphenol A type epoxy resin ("JER834" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 250g / eq, weight average molecular weight 470) (b1)-2: Polyfunctional aromatic type (triphenylene type) epoxy resin (Nippon Kayaku Co., Ltd. "EPPN-502H", epoxy equivalent 167g / eq, softening point 54℃, weight average molecular weight 1200) (b1)-5: Dicyclopentadiene type epoxy resin (ADEKA Corporation "ADEKA Resin" EP-4088L, epoxy equivalent 165g / eq) Heat hardener (b2)-1 Biphenyl type phenolic resin ("MEH-7851-SS" manufactured by Meiwa Kasei Co., Ltd., softening point 67°C) · Hardening accelerator (c)-1: 2-phenyl-4,5-dihydroxymethylimidazole ("Curezol 2PHZ" manufactured by Shikoku Chemical Industry Co., Ltd.) ·Filling material (d)-1: Spherical silica ("SC2050" manufactured by Admatechs Co., Ltd.) Coupling Agent (e)-1: Silane coupling agent, 3-glycidoxypropylmethyldiethoxysilane ("KBE-402" manufactured by Shin-Etsu Silicone Co., Ltd.)

[0162] <Manufacture of Support Sheet> The support sheet used in producing the film-like adhesive composite sheet is shown below. Support sheet (1): 250 parts by mass of an acrylic resin (weight average molecular weight 400,000, glass transition temperature -28°C) ((a)-2) obtained by copolymerizing 2-ethylhexyl acrylate (hereinafter abbreviated as "2EHA") (65 parts by mass), methyl methacrylate (hereinafter abbreviated as "MMA") (25 parts by mass), and 2-hydroxyethyl acrylate (hereinafter abbreviated as "HEA") (10 parts by mass), and 50.27 parts by mass of a crosslinking agent ((f)-1: BHS-8515: product name, manufactured by Toyo Ink Mfg. Co., Ltd., tolylene diisocyanate compound) were dissolved in 175.13 parts of toluene to prepare a solution. A light release sheet manufactured by Lintec Corporation (product name "SP-PET38 The solution was applied to a sheet of polyester (1031) (thickness: 38 μm) so as to give a coating thickness of 20 μm. This was laminated four times, and then the substrate was peeled off to give a support sheet (1) with a thickness of 80 μm. Support sheet (2): A multi-layer plastic sheet with a total thickness of 80 μm, made of two types of three-layer base material: low-density PE / PP / low-density PE, with one side smooth and glossy, and the other side matte-finished to prevent blocking. Support sheet (3): Light release sheet manufactured by Lintec Corporation (product name "SP-PET38 1031", thickness 38 μm)

[0163] Support sheet (4): Light release sheet manufactured by Lintec Corporation (product name "SP-PET50 1031", thickness 50 μm) Support sheet (5): A mixture of 82 parts of 2-ethylhexyl acrylate, 3 parts of acrylic acid and 15 parts of acrylamide was solution polymerized in 100 parts of ethyl acetate to obtain an acrylic copolymer having a number average molecular weight of 700,000. Next, 20 parts of an ester-based plasticizer (dioctyl phthalate, manufactured by Dainippon Ink & Chemicals), 0.1 parts of a melamine-based crosslinking agent (J-820-60N, manufactured by Dainippon Ink & Chemicals), and 3 parts of an isocyanate crosslinking agent (Coronate HL, manufactured by Nippon Polyurethane Industry Co., Ltd.) were added to 100 parts of the obtained polymer, and the mixture was applied to a light release sheet manufactured by Lintec Corporation (product name "SP-PET38 1031" (thickness: 38 μm) so that the coating film had a thickness of 20 μm. After laminating this four times, the release film was removed, and a coating film having a thickness of 20 μm was formed using the same material as that used to prepare the support sheet (1), which was then laminated on both sides of the previously prepared 80 μm coating film to obtain a support sheet (5) with a total thickness of 120 μm. Support sheet (6): A solution was prepared by dissolving 250 parts by mass of the acrylic resin ((a)-2) and 50.27 parts by mass of the crosslinking agent ((f)-1) in 175.13 parts of toluene, and the solution was applied to a light release sheet (product name "SP-PET38 1031" (thickness: 38 μm) manufactured by Lintec Corporation as a substrate so that the coating film had a thickness of 20 μm. The substrate was peeled off to leave only the coating film, which was then used as a support sheet (6) having a thickness of 20 μm. Support sheet (7): Light release sheet manufactured by Lintec Corporation (product name "SP-PET75 1031", thickness 75 μm) Support sheet (8): Light release sheet manufactured by Lintec Corporation (product name "SP-PET100 1031", thickness 100 μm)

[0164] <Evaluation of the support sheet> Each of the support sheets obtained above was cut into a rectangle having a width of 15.0 mm and a length of approximately 150 mm to prepare a test specimen. Using a universal testing machine (Shimadzu Corporation: Autograph AG-IS 500N), Young's modulus was measured with a gripping distance of 100 mm and a tensile speed of 200 mm / min, in accordance with JIS K7127:1999.

[0165] <Production of film-like adhesive composite sheet> [Example 1] (Production of Adhesive Composition) Polymer component (a)-1 (10.30 parts by mass), epoxy resin (b1)-1 (26.46 parts by mass), epoxy resin (b1)-3 (16.45 parts by mass), heat curing agent (b2)-1 (36.21 parts by mass), curing accelerator (c)-1 (0.22 parts by mass), filler (d)-1 (9.36 parts by mass), and silane coupling agent (e)-1 (1.00 parts by mass) were dissolved or dispersed in methyl ethyl ketone and stirred at 23°C to obtain an adhesive composition having a solids concentration of 60% by mass.

[0166] (Production of film-like adhesive composite sheets) The adhesive composition obtained above was applied to the release-treated surface of a release film ("SP-PET38 1031" manufactured by Lintec Corporation, thickness 38 μm) made of polyethylene terephthalate film, one side of which had been release-treated, and dried at 110° C. for 3 minutes to form a film-like adhesive having a thickness of 10 μm. Next, one side of a support sheet (1) (thickness 38 μm) was attached to the exposed surface of this film-like adhesive to obtain a film-like adhesive composite sheet.

[0167] [Example 2] A film-like adhesive composite sheet was produced in the same manner as in Example 1, except that the support sheet (1) used in Example 1 was replaced with support sheet (2) and the glossy side of support sheet (2) was attached to the exposed surface of the film-like adhesive.

[0168] [Example 3] A film-like adhesive composite sheet was produced in the same manner as in Example 1, except that the support sheet (1) used in Example 1 was replaced with support sheet (3) and the release-treated side of support sheet (3) was attached to the exposed surface of the film-like adhesive.

[0169] [Example 4] A film-like adhesive composite sheet was produced in the same manner as in Example 3, except that the support sheet (3) used in Example 3 was replaced with the support sheet (4).

[0170] [Comparative Example 1] A film-like adhesive composite sheet was produced in the same manner as in Example 1, except that the support sheet (1) used in Example 1 was replaced with support sheet (5) and one side of the support sheet (5) was attached to the exposed surface of the film-like adhesive.

[0171] [Comparative Example 2] A film-like adhesive composite sheet was produced in the same manner as in Example 1, except that the support sheet (1) used in Example 1 was replaced with support sheet (6) and one side of the support sheet (6) was attached to the exposed surface of the film-like adhesive.

[0172] [Comparative Example 3] A film-like adhesive composite sheet was produced in the same manner as in Example 3, except that the support sheet (3) used in Example 3 was replaced with the support sheet (7).

[0173] [Comparative Example 4] A film-like adhesive composite sheet was produced in the same manner as in Example 3, except that the support sheet (3) used in Example 3 was replaced with the support sheet (8).

[0174] <Evaluation of film-like adhesive composite sheet> The film-like adhesive composite sheets of the respective Examples and Comparative Examples obtained above were evaluated for the following items.

[0175] (Evaluation of pick-up suitability by pushing up with a pin) An 8-inch silicon wafer was cut into individual chips measuring 2 mm x 2 mm and 50 μm thick. Then, using a laminator, the film adhesive of the film adhesive composite sheet was heated to 60°C, and the heated film adhesive was attached to the dry polished surface of the chip. Through the above operations, a test sheet was obtained in which one film adhesive composite sheet was attached to multiple silicon chips. Next, this test sheet was subjected to 27 pick-ups using a pick-up device (Canon Machinery's "BESTEM-D02") with a one-pin push-up method under the conditions of a push-up amount of 300 μm, a push-up speed of 20 mm / min, and a lift-up waiting time of 1 s. If the pick-up was successful 26 times or more, the pick-up suitability was judged to be good, and otherwise the pick-up suitability was judged to be poor. The results are shown in Table 1.

[0176] [Table 1]

[0177] (Measurement of breaking elongation (C)) Using a laminator, two sheets of film-like adhesive (thickness 20 μm) were heated to 60°C and bonded together, and the same film-like adhesive was then repeatedly bonded together in the same manner to produce a laminate of laminated film-like adhesives with a total thickness of 200 μm. Next, the obtained laminate was heated for 30 seconds using a hot plate heated to 80°C. Next, the heated laminate was cut within 10 seconds using a super cutter (Ogino Seiki Seisakusho "PH1-600") to prepare a test piece with a width of 15 mm, a length of 100 mm, and a thickness of 200 μm. When the cutting time exceeded 10 seconds, the cutting was stopped once, and the laminate being cut was heated again using a hot plate heated to 80°C, and then cut within 10 seconds to prepare a test piece. The laminate was cut after heating in this way in order to prevent the end of the test piece from having a defect that could cause breakage.

[0178] Next, the breaking elongation of the obtained test piece was measured in accordance with JIS K7161-1994. More specifically, the measurement was as follows. That is, a universal testing machine (Shimadzu Corporation "Autograph AG-IS 500N") was used, and the test piece was fixed at two points by the fixed gripping device. At this time, the distance between the tips of the fixed gripping device (the length of the exposed part of the test piece, the distance between the fixed points) was 75 mm. The test piece was then pulled between these fixed points at a tensile speed of 200 mm / min, and the breaking elongation of the test piece was determined and recorded as the breaking elongation (C) (%).

[0179] The film-like adhesives used in Examples 1 to 4 and Comparative Examples 1 to 4 all had the same breaking elongation (C) of 900%.

[0180] (Measurement of breaking strength (D)) When measuring the breaking elongation (C) above, the tensile stress when the test piece broke (destroyed), that is, the tensile breaking stress, was measured, and the measured value was taken as the breaking strength (D) (MPa).

[0181] The film-like adhesives used in Examples 1 to 4 and Comparative Examples 1 to 4 all had the same breaking strength (D) of 0.5 MPa.

[0182] (Measurement of adhesive strength (E) between film adhesive and semiconductor chip) The film-like adhesive composite sheet was cut to a size of 24 mm x 300 mm, the film-like adhesive was heated to 60°C, and the adhesive side of cellophane tape (Nichiban Co., Ltd.'s "Cellotape (registered trademark) No. 405", width 24 mm) was attached to this film-like adhesive. Next, the substrate was peeled off from the film-like adhesive, and the exposed film-like adhesive was attached to the dry polished surface of a 6-inch silicon wafer (thickness 350 μm) while still heated to 60°C, to obtain a laminate in which the cellophane tape, film-like adhesive, and silicon wafer were laminated in this order as a test piece. The obtained laminate was immediately left to stand for 30 minutes in an environment of 23°C and relative humidity of 50% (the standard environment specified in JIS Z0237 2009), and then the laminate sheet consisting of the film-like adhesive and cellophane tape was peeled off from the silicon wafer at a peel speed of 150 mm / min so that the surfaces of the film-like adhesive and the silicon wafer that had been in contact with each other made an angle of 180°, a so-called 180° peel was performed, and the peel force at this time was measured, and this measured value was regarded as the adhesive force E (N / 24 mm) between the film-like adhesive and the semiconductor chip.

[0183] The adhesive strength (E) between the film-like adhesive and the semiconductor chip used in Examples 1 to 4 and Comparative Examples 1 to 4 was the same, 10 N / 24 mm. Furthermore, from these measurement results, E / (C×D) was calculated to be 0.022 (N / 24 mm / (%·MPa)).

[0184] As is clear from the above results, the film-like adhesive composite sheets of Examples 1 to 4 have a product (A×B) of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet in the range of 4 to 150 MPa·mm, and in silicon chips to which the film-like adhesive of these sheets is attached, the film-like adhesive can be cut by the one-pin push-up method while suppressing the occurrence of process abnormalities, without the need for a separate process whose main purpose is to cut the film-like adhesive. Furthermore, the silicon chip to which the cut film-like adhesive is attached can be separated from the support sheet while suppressing the occurrence of process abnormalities. Thus, the film-like adhesive composite sheets of Examples 1 to 4 showed good pick-up suitability in the one-pin push-up method.

[0185] In contrast, the film-like adhesive composite sheets of Comparative Examples 1 to 4 had a product (A×B) of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet that was less than 4 MPa·mm or exceeded 150 MPa·mm, failing to satisfy the above range. Furthermore, in the silicon chips to which the film-like adhesive of these sheets was affixed, there were many process anomalies between the cutting of the film-like adhesive and the detachment of the silicon chip with the film-like adhesive from the support sheet, and the pick-up suitability was poor. [Industrial Applicability]

[0186] The present invention can be used in the manufacture of semiconductor devices and is therefore extremely useful industrially. [Explanation of symbols]

[0187] DESCRIPTION OF SYMBOLS 1 film-like adhesive composite sheet, 11 support sheet, 11a surface of support sheet, 11b back surface of support sheet, 12 film-like adhesive, 9 semiconductor chip, 9b back surface of semiconductor chip, 7 film-like adhesive composite sheet, 71 support sheet, 72 film-like adhesive, 81 push-up portion, 82 lift-up portion, 811 protrusion, 812 slider

Claims

1. A film-like adhesive composite sheet having a curable film-like adhesive provided on a support sheet, The support sheet has a base material and is a support sheet made of two or more layers, or a support sheet made of one layer containing polyethylene terephthalate, The curable film-like adhesive contains only one type of polymer component and has a thickness of 1 to 60 μm; The product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa mm; The Young's modulus is a value measured using a universal testing machine based on JIS K7127:1999, with a gripping distance of 100 mm and a tensile speed of 200 mm / min. The film-like adhesive composite sheet is attached to a plurality of separated semiconductor chips via the film-like adhesive; cutting the film-like adhesive by applying a force to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side where the film-like adhesive is provided; Separating the semiconductor chip and the film-like adhesive attached to the semiconductor chip after cutting from the support sheet; A film-like adhesive composite sheet for use in a method for manufacturing a semiconductor device, comprising:

2. A film-like adhesive composite sheet having a curable film-like adhesive provided on a support sheet, The support sheet has a base material and is a support sheet made of two or more layers, or a support sheet made of one layer containing polyethylene terephthalate, The curable film-like adhesive contains only one type of polymer component, has a thickness of 1 to 60 μm, and does not contain a photoreactive monomer; The product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa mm; The Young's modulus is a value measured using a universal testing machine based on JIS K7127:1999, with a gripping distance of 100 mm and a tensile speed of 200 mm / min. The film-like adhesive composite sheet is attached to a plurality of separated semiconductor chips via the film-like adhesive; cutting the film-like adhesive by applying a force to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side where the film-like adhesive is provided; Separating the semiconductor chip and the film-like adhesive attached to the semiconductor chip after cutting from the support sheet; A film-like adhesive composite sheet for use in a method for manufacturing a semiconductor device, comprising:

3. The film-like adhesive has a property that, when the film-like adhesive before curing is laminated to form a laminate having a total thickness of 200 μm, the laminate has a breaking elongation of 1 to 2000%.

3. The film-like adhesive composite sheet according to claim 1 or 2.

4. A method for producing a semiconductor device using the film-like adhesive composite sheet according to any one of claims 1 to 3, comprising the steps of: attaching the film-like adhesive composite sheet to a plurality of separated semiconductor chips via the film-like adhesive; cutting the film-like adhesive by applying a force to the film-like adhesive through the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip from the side opposite to the side where the film-like adhesive is provided; Separating the semiconductor chip and the film-like adhesive attached to the semiconductor chip after cutting from the support sheet; A method for manufacturing a semiconductor device comprising the steps of:

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