Encapsulating resin composition, rearrangement wafer, semiconductor package, and method for manufacturing semiconductor package

Abstract

An encapsulating resin composition that is at least one of the following (1) to (4): (1) comprising a curable resin component, an elastomer component, and a filler, and having a modulus of elasticity of 1.0 GPa or less at 260°C when cured; (2) comprising a curable resin component, an elastomer component, and a filler, with the elastomer component content being 1.0 to 8.0 mass% of the total; (3) comprising a curable resin component, a compound having a siloxane bond, and a filler, with the compound having a siloxane bond accounting for 20 mass% or more of the total of the curable resin component and the compound having a siloxane bond; or (4) comprising a curable resin component, a compound having a siloxane bond, and a filler, and being used for wafer-level packaging.

Description

[Technical field]

[0001] The present invention relates to an encapsulating resin composition, a rearrangement wafer, a semiconductor package, and a method for producing a semiconductor package. [Background technology]

[0002] In recent years, a technique called Wafer Level Package (WLP) has been considered as a semiconductor packaging technology using a resin encapsulant. Unlike flip-chip methods in which packaging is performed with the semiconductor chip and wiring board connected, this technique does not require a wiring board, making it possible to make thinner packages. In addition, since multiple semiconductor chips are placed on a support and encapsulated together before being separated into individual packages, this technique is attracting attention as a packaging technology with excellent productivity.

[0003] In WLP, one side of a relatively large support is sealed with a sealant, so warping is likely to occur due to differences in the thermal expansion coefficient, elastic modulus, contraction rate, etc. between the sealant and the support. Increasing the amount of filler has been considered as a means of suppressing warping of the support after sealing (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-10940 A Summary of the Invention [Problem to be solved by the invention]

[0005] Increasing the amount of filler in the encapsulant reduces the thermal expansion coefficient of the encapsulant, thereby reducing the difference between the thermal expansion coefficient of the encapsulant and the thermal expansion coefficient of the support, thereby suppressing warping of the support. However, when the area of ​​the support is large, the effect of suppressing warping may not be sufficient.

[0006] In recent years, the area of ​​the support in WLP has been increasing, for example, 12-inch wafers are being adopted instead of the conventional 8-inch size. Therefore, there has been a demand for an encapsulating resin composition that suppresses warping of the support after encapsulation even if the support has a large area, a rearrangement wafer and a semiconductor package obtained using the same, and a method for manufacturing a semiconductor package that suppresses warping of the support after encapsulation.

[0007] In view of the above circumstances, an object of the present invention is to provide an encapsulating resin composition that suppresses warping of a support after encapsulation, a rearrangement wafer and a semiconductor package obtained using the same, and a method for manufacturing a semiconductor package that suppresses warping of a support after encapsulation. [Means for solving the problem]

[0008] <1> An encapsulating resin composition comprising a curable resin component, an elastomer component, and a filler, the cured product having an elastic modulus of 1.0 GPa or less at 260°C. <2> 1. An encapsulating resin composition comprising a curable resin component, an elastomer component, and a filler, wherein the content of the elastomer component is 1.0% by mass to 8.0% by mass of the entire composition. <3> The elastomer component includes a compound having a siloxane bond. <1> or <2> The encapsulating resin composition according to claim 1 . <4> 1. An encapsulating resin composition comprising: a curable resin component; a compound having a siloxane bond; and a filler, wherein the proportion of the compound having a siloxane bond in the total of the curable resin component and the compound having a siloxane bond is 20 mass% or more. <5> An encapsulating resin composition for use in wafer-level packaging, comprising a curable resin component, a compound having a siloxane bond, and a filler. <6> The compound having a siloxane bond includes a compound having a structural unit represented by the following formula (1): <3> ~ <5> 13. The encapsulating resin composition according to claim 12.

[0009] [ka]

[0010] [In formula (1), R 1 and R 2 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a monovalent organic group having an epoxy group, a monovalent organic group having a carboxy group, and a polyalkylene ether group having 3 to 500 carbon atoms. <7> The compound having a structural unit represented by the formula (1) further has a structural unit represented by the following formula (2): <6> The encapsulating resin composition according to claim 1 .

[0011] [ka]

[0012] [In formula (2), R 3 is an alkylene group having 1 to 10 carbon atoms. <8> The compound having a structural unit represented by the formula (1) is a compound having a structure represented by the following formula (3): <6> or <7> The encapsulating resin composition according to claim 1 .

[0013] [ka]

[0014] [In formula (3), n is an integer of 1 to 200, m1 and m2 are each independently an integer of 1 to 200, and R 1 and R 2 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a monovalent organic group having an epoxy group, a monovalent organic group having a carboxy group, and a polyalkylene ether group having 3 to 500 carbon atoms; R 3 are each independently an alkylene group having 1 to 10 carbon atoms; R 4 are each independently a divalent hydrocarbon group having 1 to 10 carbon atoms.] <9> The curable resin component includes an epoxy resin and a curing agent. <1> ~ <8> 13. The encapsulating resin composition according to claim 12. <10> the curing agent comprises a phenolic curing agent; <9> The encapsulating resin composition according to claim 1 . <11> Used in wafer level packaging, <1> ~ <4> 13. The encapsulating resin composition according to claim 12. <12> Used in FO-WLP, <1> ~ <11> 13. The encapsulating resin composition according to claim 12. <13> Used for sealing by compression molding, <1> ~ <12> 13. The encapsulating resin composition according to claim 12. <14> It is in powder form; <1> ~ <13> 13. The encapsulating resin composition according to claim 12.

[0015] <15> A support, a plurality of semiconductor chips arranged on the support, and a semiconductor chip sealing <1> ~ <14> and a cured product of the encapsulating resin composition according to any one of claims 1 to 5. <16> A support, a semiconductor chip disposed on the support, and a semiconductor chip sealing <1> ~ <14> and a cured product of the encapsulating resin composition according to any one of claims 1 to 5. <17> A step of disposing a plurality of semiconductor chips on a support; and a step of disposing a semiconductor chip on the support. <1> ~ <14> arranging the encapsulating resin composition according to any one of claims 1 to 5; curing the encapsulating resin composition arranged on the support to encapsulate the semiconductor chip; and dividing the semiconductor chip into individual pieces. Effect of the Invention

[0016] According to the present invention, there are provided an encapsulating resin composition that suppresses warping of a support after encapsulation, a rearrangement wafer and a semiconductor package obtained using the same, and a method for producing a semiconductor package that suppresses warping of a support after encapsulation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, the embodiment for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiment. In the following embodiment, the components (including element steps, etc.) are not essential unless specifically stated. The same applies to the numerical values ​​and their ranges, and they do not limit the present invention.

[0018] In the present disclosure, the term "step" includes not only a step that is independent of other steps, but also a step that cannot be clearly distinguished from other steps as long as the purpose of the step is achieved. In the present disclosure, a numerical range indicated using "~" includes the numerical values ​​before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described in the present disclosure in stages, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. In addition, in the numerical ranges described in the present disclosure, the upper or lower limit value of the numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple types of the corresponding substance. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, the particles corresponding to each component may include multiple types. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0019] <Encapsulating resin composition (first embodiment)> The encapsulating resin composition of the present embodiment contains a curable resin component, an elastomer component, and a filler, and has an elastic modulus of 1.0 GPa or less at 260° C. when cured.

[0020] The inventors have found that the encapsulating resin composition having the above-mentioned structure suppresses warping of the support after encapsulation. Although the reason is not necessarily clear, it is presumed that the inclusion of the elastomer component reduces the thermal expansion coefficient of the cured product, thereby reducing the difference with the thermal expansion coefficient of the support, and also reduces the elastic modulus at 260°C of the cured product, thereby reducing warping. The reason for the reduction in the elastic modulus at 260°C is thought to be, for example, that the phase-separated elastomer component exists in the resin matrix formed by the curable resin component in the form of islands. Furthermore, by including the elastomer component in the encapsulating resin composition, the proportion of the curable resin component is relatively reduced, which is believed to result in an encapsulating resin composition that has low elasticity while suppressing an increase in the thermal expansion coefficient, and is excellent in the effect of suppressing warpage.

[0021] In the present disclosure, the elastic modulus at 260° C. when the encapsulating resin composition is cured is a value measured by the method described in the Examples. From the viewpoint of suppressing warping of the support, the elastic modulus is preferably 1.0 GPa or less, and more preferably 0.5 GPa or less.

[0022] The encapsulating resin composition may be solid or liquid. When the encapsulating resin composition is solid, the form may be powder, tablet, or the like. From the viewpoint of handling, the encapsulating resin composition is preferably solid when used, and more preferably powder.

[0023] (Elastomer component) The type of elastomer component is not particularly limited. Specific examples of the elastomer component include compounds having a siloxane bond (Si-O-Si) in the molecule (hereinafter also referred to as siloxane compounds), acrylic resin block copolymers, NBR rubber, butadiene rubber, core-shell particles, indene-styrene-coumarone copolymers, etc. The elastomer component may be used alone or in combination of two or more kinds.

[0024] In the present disclosure, when an elastomer component is a compound that also falls under the category of a curable resin component (for example, when the elastomer component has a functional group that causes a curing reaction, such as an epoxy group), the compound is classified as an elastomer component.

[0025] From the viewpoint of suppressing warping of the support, the elastomer component preferably contains a siloxane compound. When the elastomer component contains a siloxane compound, the ratio of the siloxane compound to the total of the curable resin component and the elastomer component is preferably 20 mass% or more, more preferably 30 mass% or more, and even more preferably 40 mass% or more.

[0026] The molecular weight of the siloxane compound is not particularly limited. From the viewpoint of suppressing the warping of the support, the number average molecular weight of the siloxane compound is preferably 10000 or more, more preferably 15000 or more. The upper limit of the number average molecular weight is not particularly limited, but from the viewpoint of handling, it is preferably 30000 or less, more preferably 20000 or less.

[0027] In the present disclosure, the number average molecular weight (Mn) of the siloxane compound is a value measured by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene.Specifically, for example, it is measured by using a pump (Hitachi, Ltd., L-6200 type), a column (TSKgel-G5000HXL and TSKgel-G2000HXL, both of which are Tosoh Corporation, trade names) and a detector (Hitachi, Ltd., L-3300RI type) for GPC, using tetrahydrofuran as an eluent, and under the conditions of a temperature of 30°C and a flow rate of 1.0 ml / min.

[0028] From the viewpoint of suppressing warping of the support, the siloxane compound is preferably a siloxane compound having a structural unit represented by the following formula (1).

[0029] [ka]

[0030] In formula (1), R 1 and R 2 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a monovalent organic group having an epoxy group, a monovalent organic group having a carboxy group, and a polyalkylene ether group having 3 to 500 carbon atoms.

[0031] From the viewpoint of suppressing the warping of the support, R 1 and R 2 are each independently preferably an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, more preferably a methyl group or a phenyl group, and further preferably a methyl group. When a plurality of structural units represented by formula (1) are present, a plurality of R 1 and multiple R 2 may be the same or different.

[0032] The siloxane compound is represented by the formula (1): 1 and R 2 At least one of the groups represented by the following formula (1) may be at least one selected from the group consisting of a monovalent organic group having an epoxy group and a polyalkylene ether group having 3 to 500 carbon atoms.

[0033] R 1 and R 2 Examples of the monovalent organic group having an epoxy group represented by the following formula include an alkyl group having 1 to 10 carbon atoms and an epoxy group. Examples of polyalkylene ether groups having 3 to 500 carbon atoms include monovalent groups having a structure in which multiple alkylene structures having 1 to 10 carbon atoms are linked by ether bonds, such as ethylene oxide structures (EO structures), propylene oxide structures (PO structures), and monovalent groups containing combinations thereof.

[0034] In the siloxane compound having the structural unit represented by formula (1), the number of the structural units represented by formula (1) is not particularly limited. For example, it can be selected from between 1 and 200, and more preferably between 5 and 150.

[0035] The siloxane compound having the structural unit represented by formula (1) preferably has an alkylene group having 1 to 10 carbon atoms forming a main chain together with the structural unit represented by formula (1). Examples of such siloxane compounds include siloxane compounds having the structural unit represented by formula (1) and the structural unit represented by the following formula (2).

[0036] [ka]

[0037] In formula (2), R 3 is an alkylene group having 1 to 10 carbon atoms, and preferably an alkylene group having 1 to 5 carbon atoms. When a plurality of structural units represented by formula (2) are present, a plurality of R 3 may be the same or different.

[0038] The present inventors have found through their research that an encapsulating resin composition containing a siloxane compound having a structural unit represented by formula (1) and a structural unit represented by formula (2) not only has the effect of suppressing warping of the support, but also tends to be less likely to cause poor appearance such as whitening of the cured surface. This is believed to be because, compared with a siloxane compound having only a structural unit represented by formula (1), a siloxane compound having a structural unit represented by formula (1) and a structural unit represented by formula (2) has better compatibility with the curable resin component, and the exudation of the siloxane compound from the encapsulating resin composition is more suppressed.

[0039] In the siloxane compound having the structural unit represented by formula (1) and the structural unit represented by formula (2), the number of the structural unit represented by formula (2) is not particularly limited. For example, it can be selected from between 2 and 400, and more preferably selected from between 3 and 300.

[0040] In a siloxane compound having a structural unit represented by formula (1) and a structural unit represented by formula (2), the mass ratio of the structural unit represented by formula (1) to the structural unit represented by formula (2) (formula (1) / formula (2)) is not particularly limited.

[0041] In the siloxane compound having the structural unit represented by formula (1) and the structural unit represented by formula (2), the arrangement state of the structural unit represented by formula (1) and the structural unit represented by formula (2) is not particularly limited, and may be block-shaped or random.From the viewpoint of the effect of suppressing the warping of the support, it is preferable that it is block-shaped, and it is more preferable that a block of the structural unit represented by formula (2), a block of the structural unit represented by formula (1), and a block of the structural unit represented by formula (2) are arranged in this order.

[0042] Examples of siloxane compounds having a structural unit represented by formula (1) and a structural unit represented by formula (2) include compounds having a structural unit represented by the following formula (3) (hereinafter also referred to as specific siloxane compounds).

[0043] [ka]

[0044] In formula (3), n is an integer of 1 to 200, m1 and m2 are each independently an integer of 1 to 200, and R 1 and R 2 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a monovalent organic group having an epoxy group, a monovalent organic group having a carboxy group, and a polyalkylene ether group having 3 to 500 carbon atoms; R 3 are each independently an alkylene group having 1 to 10 carbon atoms; R 4 are each independently a divalent hydrocarbon group having 1 to 10 carbon atoms.

[0045] In formula (3), n is preferably an integer of 5 to 200, and m1 and m2 are preferably each independently an integer of 3 to 200. R 1 ~R 3 Preferred examples of R in formula (1) and formula (2) are 1 ~R 3 The preferred examples are the same as those of the above. R 4 are preferably each independently an alkylene group having 1 to 10 carbon atoms.

[0046] The specific siloxane compound can be prepared by a known method, for example, by reacting a polysiloxane compound corresponding to the structural unit represented by formula (1) with a compound corresponding to the structural unit represented by formula (2) (for example, a cyclic ester compound such as ε-caprolactone or a polymer thereof).

[0047] When the specific siloxane compound is produced by the above method, a specific siloxane compound having a desired structure can be obtained by appropriately selecting the ratio of each compound.

[0048] The specific siloxane compound is a solid (powdered) at room temperature (25° C.), and therefore has the advantage that a larger amount can be added when preparing a solid encapsulating resin composition than when using a liquid siloxane compound.

[0049] The encapsulating resin composition may contain, as the siloxane compound, a specific siloxane compound and a siloxane compound different from the specific siloxane compound. In this case, the ratio of the two is not particularly limited.

[0050] When the specific siloxane compound and the siloxane compound different from the specific siloxane compound are used together as the siloxane compound, the type of the siloxane compound different from the specific siloxane compound is not particularly limited.For example, it may be selected from the siloxane compounds having the structural unit represented by formula (1).

[0051] (curable resin component) The type of the curable resin component contained in the encapsulating resin composition is not particularly limited. From the viewpoint of the balance of various properties as an encapsulating material, a combination of an epoxy resin and a curing agent is preferable.

[0052] The type of epoxy resin is not particularly limited and can be selected depending on the desired properties of the encapsulating resin composition. Specific examples of epoxy resins include novolac-type epoxy resins (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) obtained by epoxidizing novolac resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, etc., and naphthol compounds such as α-naphthol, β-naphthol, dihydroxynaphthalene, etc., with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc., under an acidic catalyst; triphenylmethane-type epoxy resins obtained by epoxidizing triphenylmethane-type phenolic resins obtained by condensing or co-condensing the above-mentioned phenolic compound with an aromatic aldehyde compound such as benzaldehyde, salicylaldehyde, etc., under an acidic catalyst; and novolac resins obtained by co-condensing the above-mentioned phenolic compound and naphthol compound with an aldehyde compound under an acidic catalyst. diphenylmethane type epoxy resins which are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl type epoxy resins which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene type epoxy resins which are diglycidyl ethers of stilbene-based phenolic compounds; sulfur-containing epoxy resins which are diglycidyl ethers of bisphenol S, etc.; epoxy resins which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester type epoxy resins which are glycidyl esters of polyvalent carboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine type epoxy resins in which active hydrogen bonded to nitrogen atoms of aniline, diaminodiphenylmethane, isocyanuric acid, etc. is substituted with a glycidyl group; dicyclopentadiene type epoxy resins which are epoxidized co-condensation resins of dicyclopentadiene and phenolic compounds;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which are epoxy-modified epoxy resins in which the olefin bonds in the molecule have been epoxidized; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenolic resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenolic resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenolic resins; and dicyclopentadiene-modified phenolic resins, which are glycidyl ethers of dicyclopentadiene-modified phenolic resins. Examples of the epoxy resin include pentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins, polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins, naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins, halogenated phenol novolac-type epoxy resins, hydroquinone-type epoxy resins, trimethylolpropane-type epoxy resins, linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid, and aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. These epoxy resins may be used alone or in combination of two or more.

[0053] The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited, but from the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.

[0054] The epoxy equivalent of the epoxy resin may be, for example, a value measured by a method in accordance with JIS K 7236:2009.

[0055] When the epoxy resin is a solid, its softening point or melting point is not particularly limited, but is preferably 50°C to 130°C from the viewpoint of ease of handling during preparation of the encapsulating resin composition.

[0056] The melting point or softening point of the epoxy resin is a value measured by differential scanning calorimetry (DSC) or a method in accordance with JIS K 7234:1986 (ring and ball method).

[0057] (hardening agent) The type of curing agent is not particularly limited and can be selected according to the desired properties of the encapsulating resin composition. When the resin used in combination is an epoxy resin, examples of the curing agent include a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent. From the viewpoint of heat resistance, it is preferable that the curing agent has a phenolic hydroxyl group in the molecule (phenol curing agent).

[0058] Specific examples of the phenolic curing agent include polyhydric phenolic compounds such as resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol; novolak-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, and propionaldehyde, under an acidic catalyst; and polyphenolic compounds synthesized from the above phenolic compounds and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, and the like. Examples of the phenol curing agent include aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins; phenolic resins modified with at least one of paraxylylene and metaxylylene; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above-mentioned phenolic compounds and dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensing or co-condensing the above-mentioned phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acid catalyst; and phenolic resins obtained by copolymerizing two or more of these. These phenolic curing agents may be used alone or in combination of two or more.

[0059] The functional group equivalent of the curing agent (hydroxyl group equivalent in the case of a phenolic curing agent) is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.

[0060] The functional group equivalent of the curing agent (hydroxyl group equivalent in the case of a phenolic curing agent) may be, for example, a value measured by a method in accordance with JIS K 0070:1992.

[0061] When the curing agent is a solid, its softening point or melting point is not particularly limited, but is preferably 40° C. to 180° C. from the viewpoints of moldability and reflow resistance, and more preferably 50° C. to 130° C. from the viewpoint of handleability during production of the encapsulating resin composition.

[0062] The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0063] The equivalent ratio of the curable resin to the curing agent, that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the curable resin (number of functional groups in the curing agent / number of functional groups in the curing resin) is not particularly limited. In terms of keeping the amount of unreacted components low, it is preferably set in the range of 0.5 to 2.0, and more preferably set in the range of 0.6 to 1.3. In terms of moldability and reflow resistance, it is even more preferably set in the range of 0.8 to 1.2.

[0064] (filling material) The type of filler is not particularly limited. Specific examples include inorganic materials such as silica (fused silica, crystalline silica, etc.), glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, titania, talc, clay, and mica. Fillers having a flame retardant effect may be used. Examples of fillers having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as composite hydroxides of magnesium and zinc, and zinc borate.

[0065] Among the above fillers, silica is preferred from the viewpoint of reducing the linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity. The fillers may be used alone or in combination of two or more. The state of the filler may include powder, beads obtained by sphering powder, fibers, etc.

[0066] The content of the filler contained in the encapsulating resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30% by volume to 90% by volume of the entire encapsulating resin composition, more preferably 35% by volume to 80% by volume, and even more preferably 40% by volume to 70% by volume. When the content of the filler is 30% by volume or more of the entire encapsulating resin composition, the properties such as the thermal expansion coefficient, thermal conductivity, and elastic modulus of the cured product tend to be further improved. When the content of the filler is 90% by volume or less of the entire encapsulating resin composition, the increase in the viscosity of the encapsulating resin composition is suppressed, the fluidity is further improved, and the moldability tends to be better.

[0067] When the filler is particulate, its average particle diameter is not particularly limited. For example, the volume average particle diameter is preferably 0.2 μm to 20 μm, and more preferably 0.5 μm to 15 μm. When the volume average particle diameter is 0.2 μm or more, the increase in viscosity of the encapsulating resin composition tends to be more suppressed. When the volume average particle diameter is 20 μm or less, the filling ability into narrow gaps tends to be more improved. The volume average particle diameter of the filler can be measured as the particle diameter (D50) when the cumulative volume from the small diameter side becomes 50% in the volume-based particle size distribution obtained by a laser scattering diffraction method particle size distribution measuring device.

[0068] (Cure accelerator) The encapsulating resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited and can be selected depending on the type of the curable resin, the desired properties of the encapsulating resin composition, and the like. Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; and combinations of these compounds with maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, and the like. quinone compounds such as quinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone; compounds with intramolecular polarization formed by adding compounds with π bonds such as diazophenylmethane; cyclic amidines such as tetraphenylborate salt of DBU, tetraphenylborate salt of DBN, tetraphenylborate salt of 2-ethyl-4-methylimidazole, and tetraphenylborate salt of N-methylmorpholine; ammonium compounds; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide; tertiary phosphines such as triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkylalkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, and alkyldiarylphosphine;Phosphine compounds such as complexes of the tertiary phosphines and organic borons; compounds having intramolecular polarization obtained by adding the tertiary phosphines or the phosphine compounds to maleic anhydride, quinone compounds such as 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone, and compounds having a π bond such as diazophenylmethane; compounds having intramolecular polarization obtained by adding the tertiary phosphines or the phosphine compounds to 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, and 3-iodophenol; Compounds having intramolecular polarization obtained by reacting halogenated phenol compounds such as phenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, and 4-bromo-4'-hydroxybiphenyl, followed by a dehydrohalogenation step; tetra-substituted phosphonium compounds such as tetraphenylphosphonium, tetra-substituted phosphonium compounds and tetra-substituted borates having no phenyl group bonded to the boron atom such as tetra-p-tolylborate, and salts of tetraphenylphosphonium compounds with phenol compounds;

[0069] When the encapsulating resin composition contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, relative to 100 parts by mass of the curable resin component.

[0070] [Various additives] In addition to the above-mentioned components, the encapsulating resin composition may contain various additives such as a coupling agent, a release agent, a colorant, etc., as exemplified below. The encapsulating resin composition may contain various additives known in the art, as necessary, in addition to the additives exemplified below.

[0071] (Coupling Agent) The encapsulating resin composition may contain a coupling agent to enhance adhesion between the resin component and the filler. Examples of the coupling agent include known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane, titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds. Among them, silane compounds are preferred from the viewpoint of handling. The coupling agent may be used alone or in combination of two or more.

[0072] When the encapsulating resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass, relative to 100 parts by mass of the filler.

[0073] (Release agent) The encapsulating resin composition may contain a mold release agent from the viewpoint of obtaining good releasability from the mold during molding. The mold release agent is not particularly limited, and a conventionally known one may be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene, etc. The mold release agent may be used alone or in combination of two or more kinds.

[0074] When the encapsulating resin composition contains a release agent, the amount thereof is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the total of the curable resin component and the elastomer component.

[0075] (Coloring agent) The encapsulating resin composition may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected depending on the purpose. The colorant may be used alone or in combination of two or more.

[0076] When the encapsulating resin composition contains a colorant, the amount thereof is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the total of the curable resin component and the elastomer component.

[0077] <Sealing resin composition (second embodiment)> The encapsulating resin composition of the present embodiment contains a curable resin component, an elastomer component, and a filler, and the content of the elastomer component is 1.0 mass % to 8.0 mass % of the total (entire encapsulating resin composition).

[0078] The inventors have found that the encapsulating resin composition having the above-mentioned structure suppresses warping of the support after encapsulation and has excellent strength. The reason why warping of the support is suppressed is not necessarily clear, but it is presumed that the inclusion of a specific amount of the elastomer component reduces the thermal expansion coefficient of the cured product, thereby reducing the difference with the thermal expansion coefficient of the support, and also reduces the elastic modulus, thereby reducing warping. The reason for the reduction in elastic modulus is thought to be, for example, the presence of island-like phase-separated elastomer components in the resin matrix formed by the curable resin component. Furthermore, by including the elastomer component in the encapsulating resin composition, the proportion of the curable resin component is relatively reduced, which is believed to result in an encapsulating resin composition that has low elasticity while suppressing an increase in the thermal expansion coefficient, and is excellent in the effect of suppressing warpage.

[0079] From the viewpoint of effectively suppressing warping of the support, the content of the elastomer component is preferably 1.5 mass% or more of the entire encapsulating resin composition, more preferably 1.7 mass% or more, and even more preferably 2.0 mass% or more.

[0080] From the viewpoint of handleability and strength after encapsulation, the content of the elastomer component is preferably 7.0 mass % or less of the total encapsulating resin composition, more preferably 6.0 mass % or less, and even more preferably 5.0 mass % or less.

[0081] Preferred examples of the elastomer component include those described as the elastomer component contained in the encapsulating resin composition of the first embodiment.

[0082] <Sealing resin composition (third embodiment)> The encapsulating resin composition of the present embodiment contains a curable resin component, a compound having a siloxane bond (siloxane compound), and a filler, and the proportion of the siloxane compound in the total of the curable resin component and the siloxane compound is 20 mass% or more.

[0083] The present inventors have found that an encapsulating resin composition containing 20% ​​by mass or more of a siloxane compound in the total of the curable resin component and the siloxane compound suppresses warping of the support after encapsulation. The reason for this is not necessarily clear, but it is speculated that the inclusion of the siloxane compound reduces the thermal expansion coefficient of the cured product, thereby reducing the difference with the thermal expansion coefficient of the support, and also reduces the elastic modulus, thereby reducing warping. The reason for the reduction in elastic modulus is thought to be, for example, that the phase-separated siloxane compound exists in an island shape in the resin matrix formed by the curable resin component. Furthermore, by including a siloxane compound in the encapsulating resin composition, the proportion of the curable resin component is relatively reduced, which is believed to result in an encapsulating resin composition having low elasticity while suppressing an increase in the thermal expansion coefficient, and excellent warpage suppression effect.

[0084] From the viewpoint of suppressing warping of the support, the proportion of the siloxane compound in the total of the curable resin component and the siloxane compound is more preferably 30% by mass or more, and even more preferably 40% by mass or more.

[0085] The upper limit of the proportion of the siloxane compound in the total of the curable resin component and the siloxane compound is not particularly limited, but from the viewpoint of handleability, it is preferably 70 mass % or less, more preferably 60 mass % or less, and even more preferably 50 mass % or less.

[0086] The siloxane compound contained in the encapsulating resin composition is not particularly limited as long as it is a compound having a siloxane bond (Si-O-Si), and may be one type or two or more types. When the siloxane compound also corresponds to the curable resin component (for example, when the siloxane compound has a functional group that causes a curing reaction such as an epoxy group), the compound is classified as a siloxane compound.

[0087] Preferred examples of the siloxane compound include those described as the siloxane compounds contained in the encapsulating resin composition of the first embodiment.

[0088] <Sealing resin composition (fourth embodiment)> The encapsulating resin composition of the present embodiment is an encapsulating resin composition for use in wafer-level packaging, comprising a curable resin component, a siloxane compound, and a filler. The encapsulating resin composition of the present embodiment is excellent in suppressing warpage of a support after encapsulation.

[0089] The siloxane compound contained in the encapsulating resin composition is not particularly limited as long as it is a compound having a siloxane bond (Si-O-Si), and may be one type or two or more types. When the siloxane compound also corresponds to the curable resin component (for example, when the siloxane compound has a functional group that causes a curing reaction such as an epoxy group), the compound is classified as a siloxane compound.

[0090] Preferred examples of the siloxane compound include those described as the siloxane compounds contained in the encapsulating resin composition of the first embodiment.

[0091] The details and preferred aspects of the encapsulating resin composition described in each of the first to fourth embodiments may be common to all the embodiments.

[0092] (Uses of encapsulating resin composition) The encapsulating resin composition of the embodiment described above can be used in various mounting techniques. The encapsulating resin composition of the embodiment has an excellent effect of suppressing warping of the support, and is therefore suitable for use in mounting techniques that encapsulate a relatively large area (for example, a sealing process is performed before the package is divided into individual pieces). Examples of such mounting techniques include wafer level packages such as FO-WLP (Fan Out Wafer Level Package) and FI-WLP (Fan In Wafer Level Package).

[0093] Methods for encapsulating a semiconductor chip with the encapsulating resin composition include compression molding, transfer molding, injection molding, and the like, and any of these can be used.

[0094] The material of the support when sealing using the encapsulating resin composition is not particularly limited. Examples include semiconductors such as silicon, glass, and ceramics. The shape of the support is not particularly limited, and may be a disk (wafer) or other shapes. The area of ​​the support is not particularly limited, but since the encapsulating resin composition of the present embodiment has an excellent effect of suppressing warping of the support, the support may have a relatively large area. For example, the support may be a wafer having a diameter of 12 inches or more.

[0095] The encapsulation thickness when encapsulating using the encapsulating resin composition is not particularly limited and can be selected according to the size of the semiconductor chip to be encapsulated, etc. The encapsulating resin composition of the present embodiment is excellent in the effect of suppressing warping of the support, and therefore can be suitably used even when the encapsulation thickness is large (for example, 200 μm to 1000 μm).

[0096] <Relocation wafers and semiconductor packages> The relocation wafer of this embodiment has a support, a plurality of semiconductor chips arranged on the support, and the cured product of the above-mentioned encapsulating resin composition that encapsulates the semiconductor chips. The semiconductor package of the present embodiment includes a support, a semiconductor chip disposed on the support, and a cured product of the above-mentioned encapsulating resin composition encapsulating the semiconductor chip. The semiconductor package can be obtained, for example, by dividing the above-mentioned rearrangement wafer into individual pieces.

[0097] The rearrangement wafer of this embodiment is suppressed from warping the support. Therefore, even if the support has a relatively large area, it can be suitably used for manufacturing semiconductor packages. For example, the support may be a wafer with a diameter of 12 inches or more.

[0098] The thickness of the cured product of the encapsulating resin composition that encapsulates the semiconductor chip is not particularly limited and can be selected according to the size of the semiconductor chip to be encapsulated, etc. The encapsulating resin composition of the present embodiment has an excellent effect of suppressing warping of the support, and is therefore suitable for use even when the encapsulating thickness is large (for example, 200 μm to 1000 μm).

[0099] The types of support and semiconductor chips used in the relocation wafer and semiconductor package are not particularly limited, and can be selected from those commonly used.

[0100] <Semiconductor package manufacturing method> The manufacturing method of a semiconductor package of this embodiment includes the steps of arranging a plurality of semiconductor chips on a support, arranging the above-mentioned encapsulating resin composition on the support on which the semiconductor chips are arranged, curing the encapsulating resin composition arranged on the support to encapsulate the semiconductor chips, and singulating the support.

[0101] In the method for producing a semiconductor package according to the present embodiment, warping of the support is suppressed after the encapsulating resin composition is cured to encapsulate the semiconductor chip, which reduces the occurrence of misalignment and the like in the process after encapsulation, resulting in a high product yield.

[0102] The method for disposing the encapsulating resin composition on the support on which the semiconductor chip is disposed is not particularly limited. For example, when the encapsulating resin composition is in a powder form, the encapsulating resin composition may be sprayed on the support.

[0103] The method of curing the encapsulating resin composition arranged on the support to encapsulate the semiconductor chip is not particularly limited. For example, it is preferably performed by compression molding. Compression molding can be performed, for example, using a compression molding machine under conditions of a predetermined pressure (for example, 2 MPa to 10 MPa), temperature (for example, 120°C to 150°C), and time (for example, 200 seconds to 600 seconds). EXAMPLES

[0104] The above embodiment will be specifically described below using examples, but the scope of the above embodiment is not limited to these examples.

[0105] <Example 1> (Preparation of Encapsulating Resin Composition) The components shown in Table 1 were mixed in the amounts (parts by mass) shown in Table 1 to prepare an encapsulating resin composition. For the preparation, a kneader, a planetary mixer, a three-roll mill, a twin-screw extruder, etc. are preferably used. In the present invention, after mixing the materials, the materials are kneaded by a twin-screw extruder in which the temperature inside the device is adjusted to 70°C to 100°C, and then cooled and pulverized to obtain an encapsulating resin composition. Details of each component are as follows.

[0106] Epoxy resin 1: Biphenylene aralkyl type epoxy resin, product name "NC-3000", Nippon Kayaku Co., Ltd. Epoxy resin 2: Multifunctional epoxy resin, product name "EPPN-501HY", Nippon Kayaku Co., Ltd.

[0107] Hardener 1: Biphenylene aralkyl type phenolic resin, product name "MEHC-7851SS", Meiwa Kasei Co., Ltd. Hardener 2: Multifunctional phenolic resin, product name "HE910-10", Air Water Inc. Hardener 3: Phenol novolac resin, product name "HP850N", Hitachi Chemical Co., Ltd. Curing accelerator 1: Reaction product of tetrabutylphosphonium and cyclohexanedicarboxylic acid

[0108] Elastomer component 1 (siloxane compound)...Dimethyl silicone modified with caprolactone at both ends, product name "DBL-C32", Gelest The elastomer component 1 is represented by the formula (3): 1 is a methyl group, R 2 is a methyl group, R 3 is a pentylene group, R 4 is undisclosed, n is 63 to 78, and m1 and m2 are each 7 to 10. Elastomer component 2 (siloxane compound): Dimethyl silicone with epoxy group-modified side chains, product name "KF-1001", Shin-Etsu Chemical Co., Ltd. Elastomer component 3: Indene-styrene-coumarone copolymer, product name "NH-100S", Nippon Paint Chemical Co., Ltd.

[0109] Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane, product name "KBM-573", Shin-Etsu Chemical Co., Ltd. Coupling agent 2...3-glycidoxypropyltrimethoxysilane, product name "KBM-403", Shin-Etsu Chemical Co., Ltd. Coupling agent 3...3-methacryloxypropyltrimethoxysilane, product name "KBM-503", Shin-Etsu Chemical Co., Ltd. Coupling agent 4: Diphenyldimethoxysilane, product name "KBM-202SS", Shin-Etsu Chemical Co., Ltd.

[0110] Colorant 1: Carbon black, product name "MA600", Mitsubishi Chemical Corporation Release agent 1…Hoechst wax, product name “HW-E”, Clariant Chemicals Co., Ltd. Filler 1: Spherical fused silica with an average particle size of 11 μm, product name "ST7010-2", Micron Inc. Filler 2: Spherical fused silica with an average particle size of 0.6 μm, product name "SO-25R", Admatechs Co., Ltd.

[0111] (Preparation of cured product) The prepared encapsulating resin composition was used to produce a cured product as follows. A mold consisting of an upper, middle, and lower mold was used for molding. As the middle mold, a mold cut to a size of 10 mm x 60 mm x 5 mm or 3 mm x 3 mm x 15 mm was used, and an amount of the encapsulating resin composition corresponding to the volume of the cut-out part of the middle mold placed on the lower mold was placed and sandwiched by the upper mold, and molding was performed in vacuum using a manual hydraulic vacuum heating press under the conditions of 130 ° C. for 10 minutes and 5 MPa. The obtained molded product was cured at 175 ° C. for 6 hours to obtain a cured product.

[0112] (Evaluation of thermal expansion coefficient) The thermal expansion coefficient of the cured material measuring 3 mm x 3 mm x 10 mm was measured using a TA Instruments "TMA2940." The measurement was performed at a temperature rise rate of 5°C / min from 0°C to 260°C. The thermal expansion coefficient (ppm / °C) between 10°C and 30°C was designated CTE1, and the thermal expansion coefficient (ppm / °C) between 200°C and 220°C was designated CTE2. The results are shown in Table 1.

[0113] (Evaluation of elastic modulus) The elastic modulus of the cured material measuring 10 mm x 50 mm x 3 mm was measured using an "RSAIII" from TA Instruments. The measurement was performed at a temperature increase rate of 10°C / min from 30°C to 300°C. The elastic modulus (GPa) measured at 40°C and 260°C is shown in Table 1 as the 40°C elastic modulus and the 260°C elastic modulus.

[0114] (Evaluation of the amount of warpage) A layer of the encapsulating resin composition was formed to a thickness of 250 μm or 500 μm on a silicon wafer having a thickness of 750 μm and a diameter of 300 mm, and then heated at 130° C. for 10 minutes to cure the layer, thereby preparing a sample. The cured product was cured at 175° C. for 6 hours to obtain an encapsulant sample with a silicon wafer. The amount of warping (μm) of the sample was evaluated at 30° C. using an Akrometrix 3D heating surface shape measuring device "AXP". The maximum amount of warping is shown in Table 1.

[0115] [Table 1]

[0116] As shown in Table 1, the samples formed using the encapsulating resin compositions of the examples, which contain a curable resin component, an elastomer component, and a filler and have an elastic modulus of 1.0 GPa or less at 260°C when cured, or which contain a siloxane compound as the elastomer component and the proportion of the siloxane compound in the total of the curable resin component and the siloxane compound is 20 mass% or more, had reduced warping of the substrate compared to samples formed using the encapsulating resin compositions of the comparative examples, which do not contain an elastomer component or which contain an elastomer component but have an elastic modulus of more than 1.0 GPa at 260°C when cured.

[0117] <Example 2> The components shown in Table 2 were mixed in the amounts (g) shown in Table 2 to prepare encapsulating resin compositions in the same manner as in Example 1. Details of the components used in preparing the encapsulating resin compositions are as follows.

[0118] Epoxy resin 1: Multifunctional epoxy resin, product name "EPPN-501HY", Nippon Kayaku Co., Ltd. Hardener 1: Multifunctional phenolic resin, product name "HE910-10", Air Water Inc. Curing accelerator 1...2-phenyl-4-methyl-5-hydroxymethylimidazole, Shikoku Chemicals Corporation

[0119] Elastomer component 1: Dimethyl silicone modified with caprolactone at both ends, product name "DBL-C32", Gelest The elastomer component 1 is represented by the formula (3): 1 is a methyl group, R 2 is a methyl group, R 3 is a pentylene group, R 4 is undisclosed, n is 63 to 78, and m1 and m2 are each 7 to 10. Elastomer component 2: Dimethyl silicone with side chains modified with epoxy and polyether groups, product name "Y-19268", Momentive Performance Materials, Inc. Elastomer component 3: Indene-styrene-coumarone copolymer, product name "NH-100S", Nippon Paint Chemical Co., Ltd.

[0120] Coupling agent 1...3-glycidoxypropyltrimethoxysilane, product name "KBM-403", Shin-Etsu Chemical Co., Ltd. Coupling agent 2...3-Methacryloxypropyltrimethoxysilane, product name "KBM-503", Shin-Etsu Chemical Co., Ltd. Coupling agent 3: Diphenyldimethoxysilane, product name "KBM-202SS", Shin-Etsu Chemical Co., Ltd.

[0121] Colorant 1: Carbon black, product name "MA600", Mitsubishi Chemical Corporation Release agent 1…Hoechst wax, product name “HW-E”, Clariant Chemicals Co., Ltd. Filler 1: Spherical fused silica with an average particle size of 11 μm, product name "ST7010-2", Micron Inc. Filler 2: Spherical fused silica with an average particle size of 0.6 μm, product name "SO-25R", Admatechs Co., Ltd.

[0122] The prepared encapsulating resin composition was evaluated for elastic modulus, thermal expansion coefficient, and warpage in the same manner as in Example 1. Furthermore, the encapsulating surface of the encapsulating material sample with silicon wafer prepared in the same manner as in Example 1 was visually observed, and those with streaks or unevenness or whitened surfaces were rated as poor, and those with a uniform surface without unevenness were rated as good. The results are shown in Table 2.

[0123] [Table 2]

[0124] As shown in Table 2, the samples formed using the encapsulating resin compositions of the Examples, which contained an elastomer component and had a content of 1.0 mass % to 8.0 mass % of the total encapsulating resin composition, had a suppressed amount of warping of the substrate compared to the samples formed using the encapsulating resin compositions of Comparative Examples 2-1 to 2-3, which did not contain an elastomer component or had an elastomer component content of less than 1.0 mass %. In addition, the encapsulating resin compositions of the Examples also had good results in terms of appearance evaluation.

[0125] The disclosures of Japanese Patent Applications Nos. 2017-127852, 2017-127855, and 2017-127856 are incorporated herein by reference in their entireties. All publications, patent applications, and technical standards mentioned in this specification are incorporated by reference into this specification to the same extent as if each individual publication, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. the composition comprises a curable resin component including an epoxy resin and a curing agent, a compound having a siloxane bond, a filler, and at least one of dimethyl silicone having an epoxy group-modified side chain and an indene-styrene-coumarone copolymer, and when cured, the composition has an elastic modulus of 1.0 GPa or less at 260°C; The encapsulating resin composition according to claim 1, wherein the compound having a siloxane bond has a structure consisting of 5 to 150 structural units represented by the following formula (1) and a structure consisting of 3 to 300 structural units represented by the following formula (2), and the number of structures consisting of 3 to 300 structural units represented by formula (2) in the compound having a siloxane bond is 2. 【Chemistry 1】 [In the formula, R １ and R ２ are each a methyl group, and R ３ is a pentylene group.

2. the composition comprises a curable resin component including an epoxy resin and a curing agent, a compound having a siloxane bond, a filler, and at least one of dimethyl silicone having an epoxy group-modified side chain and an indene-styrene-coumarone copolymer, wherein the total proportion of the compound having a siloxane bond and the dimethyl silicone having an epoxy group-modified side chain to the total of the curable resin component, the compound having a siloxane bond, and the dimethyl silicone having an epoxy group-modified side chain is 20 mass % or more and 70 mass % or less, The encapsulating resin composition according to claim 1, wherein the compound having a siloxane bond has a structure consisting of 5 to 150 structural units represented by the following formula (1) and a structure consisting of 3 to 300 structural units represented by the following formula (2), and the number of structures consisting of 3 to 300 structural units represented by formula (2) in the compound having a siloxane bond is 2. 【Chemistry 2】 [In the formula, R １ and R ２ are each a methyl group, and R ３ is a pentylene group.

3. The composition includes a curable resin component including an epoxy resin and a curing agent, a compound having a siloxane bond, a filler, and at least one of dimethyl silicone or indene-styrene-coumarone copolymer whose side chains are modified with epoxy groups, The compound having a siloxane bond has a structure consisting of 5 to 150 structural units represented by the following formula (1) and a structure consisting of 3 to 300 structural units represented by the following formula (2), and the number of structures consisting of 3 to 300 structural units represented by formula (2) in the compound having a siloxane bond is 2, and the encapsulating resin composition is used for a wafer-level package. 【Chemistry 3】 [In the formula, R １ and R ２ are each a methyl group, and R ３ is a pentylene group.

4. The encapsulating resin composition according to any one of claims 1 to 3, wherein the curing agent comprises a phenolic curing agent.

5. The encapsulating resin composition according to claim 1 or 2, which is used for a wafer-level package.

6. The encapsulating resin composition according to any one of claims 1 to 5, which is used for FO-WLP.

7. The encapsulating resin composition according to any one of claims 1 to 6, which is used for encapsulation by compression molding.

8. The encapsulating resin composition according to any one of claims 1 to 7, which is in a powder form.

9. A rearrangement wafer comprising: a support; a plurality of semiconductor chips arranged on the support; and a cured product of the encapsulating resin composition according to any one of claims 1 to 8, which encapsulates the semiconductor chips.

10. A semiconductor package comprising: a support; a semiconductor chip disposed on the support; and a cured product of the encapsulating resin composition according to any one of claims 1 to 8, encapsulating the semiconductor chip.

11. A method for manufacturing a semiconductor package, comprising the steps of: arranging a plurality of semiconductor chips on a support; arranging the encapsulating resin composition according to any one of claims 1 to 8 on the support on which the semiconductor chips are arranged; curing the encapsulating resin composition arranged on the support to encapsulate the semiconductor chips; and individualizing the semiconductor chips.

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