CURABLE COMPOSITION FOR PARTITION WALL, METHOD FOR REPAIRING PARTITION WALL, PARTITION WALL, AND OPTICAL ELEMENT

Abstract

The present invention relates to a curable composition for partition walls, said curable composition containing (A) a fluorine-containing silane compound that has a number average molecular weight of 700 or less, (B) a crosslinking agent and (C) a sensitizing agent, while having a solvent content of 20% by mass or less.

Description

[Technical field]

[0001] The present invention relates to a curable composition for a partition wall, a method for repairing a partition wall, a partition wall, and an optical element. [Background technology]

[0002] Recently, in the manufacture of optical elements such as organic electroluminescence (EL) elements, quantum dot displays, TFT (Thin Film Transistor) arrays, and batteries, a method of pattern printing using organic layers such as light-emitting layers as dots by the inkjet (IJ) method has been used. The inkjet (IJ) method is a printing method that does not use a plate, and has the advantages of reducing the cost of making plates and reducing material costs by using only the required amount of material for the required parts.

[0003] In this method, however, it is necessary to provide partitions along the contours of the dots to be formed. After providing the partitions, ink containing the material for the organic layer is injected into the compartments (hereinafter also referred to as "openings") surrounded by the partitions, and the ink is dried and / or heated to form dots in a desired pattern.

[0004] Conventionally, photolithography is generally used to form the partition walls. In this case, when printing a pattern by an inkjet (IJ) method, the upper surface of the partition wall needs to be liquid repellent in order to prevent ink from mixing between adjacent dots and to uniformly apply ink when forming dots. On the other hand, the openings for forming dots surrounded by the partition wall, including the side surfaces of the partition wall, need to be lyophilic. Therefore, in order to obtain partition walls having liquid repellency on the upper surface, partition walls corresponding to the dot pattern are formed by photolithography using a photosensitive resin composition containing a liquid repellent agent.

[0005] However, it is very difficult to form such partition walls on a substrate without defects such as formation failure, taking into consideration the narrowness of the partition wall width. In particular, in recent years, there has been a trend for the partition walls to be made finer and finer, making it difficult to form partition walls without defects. The occurrence of defects in the partition walls reduces the product yield, which in turn leads to an increase in manufacturing costs. For this reason, it has become important to repair defects that occur in the partition walls, and a technology for doing so is required. For example, Patent Document 1 describes a partition wall repair liquid that repairs pinhole defects that occur in partition walls. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2010 / 013654 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in recent years, in order to prevent damage to the TFT that controls the driving of the OLED, from the viewpoints of lowering the temperature of the heating process, reducing the number of heating processes, and reducing the amount of UV radiation, a curable composition for repairing partition walls that can reduce the amount of UV radiation during curing, or can be cured at a low temperature even if heating is involved, is required. Furthermore, if the partition walls contain a solvent, the solvent may volatilize or dissolve in the subsequent process, causing damage to the OLED element. In addition, there is a concern that the curing may be insufficient, and the liquid repellency of the cured film may be impaired. In contrast, the partition wall repair liquid described in Patent Document 1 contains 25% by mass or more of a solvent in the solution, so it is considered that curing by high irradiation of UV and accompanying heating is required. An object of the present invention is to provide a curable composition for partition walls which has a low solvent content, can be cured by UV light, can be cured at low temperatures even when heating is required, and can give a cured film having excellent liquid repellency. [Means for solving the problem]

[0008] The present invention relates to a curable composition for partition walls having the following configuration. [1] A curable composition for partition walls, comprising (A) a fluorine-containing silane compound having a number average molecular weight of 700 or less, (B) a crosslinking agent, and (C) a photosensitizer, and having a solvent content of 20 mass % or less. Effect of the Invention

[0009] The curable composition for partition walls of the present invention has a low solvent content, so there is no risk of the solvent remaining in the cured film. In addition, a cured film having excellent curability and excellent liquid repellency can be obtained. In addition, the composition can be cured by UV irradiation during curing, and even if heating is required, the temperature can be lowered, so that damage to devices due to excessive UV irradiation and high temperature heating can be avoided. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1(I) to (VI) are process diagrams illustrating a method for repairing partition walls according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In this specification, the following terms are used with the following meanings: A compound represented by formula (m1) is referred to as compound (m1). Compounds represented by other formulas are also referred to in the same manner. A group represented by formula (1) is also referred to as group (1). Groups represented by other formulas are also referred to in the same manner. "Liquid repellency" is a general term for water repellency and oil repellency. In this specification, "liquid repellency" is also referred to as "ink repellency." In other words, in this specification, "liquid repellency" and "ink repellency" are essentially synonymous. "Lyophilic" is a general term for hydrophilic and lipophilic. In this specification, "lyophilic" is also referred to as "ink-philic." That is, in this specification, "lyophilic" and "ink-philic" are essentially synonymous. "Ink" is a general term for liquid that has optical and / or electrical functionality after drying, curing, etc. In organic EL devices, quantum dot displays, TFT arrays, batteries, etc., dots as various components are sometimes pattern-printed by the inkjet (IJ) method using ink for forming the dots. "Ink" includes inks used for such purposes. A "dot" refers to the smallest area in an optical element that can modulate light. In organic EL elements, quantum dot displays, TFT arrays, and thin-film solar cells, 1 dot = 1 pixel in the case of black and white display, and for example, 3 dots (R (red), G (green), B (blue), etc.) = 1 pixel in the case of color display. The number average molecular weight (Mn) and weight average molecular weight (Mw) are polystyrene-equivalent molecular weights obtained by gel permeation chromatography using a calibration curve prepared using standard polystyrene samples of known molecular weight. The viscosity is a value measured at 25° C. using a TVE25L viscometer (manufactured by Toki Sangyo Co., Ltd.) calibrated with a standard fluid for calibrating viscometers, JS2.5 (trade name, manufactured by Nippon Grease Co., Ltd.). Hereinafter, an embodiment of the present invention will be described.

[0012] [Curable composition for partition walls] The curable composition for partition walls of the present invention (hereinafter also simply referred to as "the composition of the present invention") is a composition containing (A) a fluorine-containing silane compound having a number average molecular weight of 700 or less, (B) a crosslinking agent, and (C) a photosensitizer, and having a solvent content of 20 mass% or less.

[0013] ((A) Fluorine-containing silane compound) The fluorine-containing silane compound of the present invention (hereinafter, also simply referred to as "compound (A)") functions as a liquid repellent in the curable composition for partition walls of the present invention. The cured film obtained by curing the curable composition for partition walls of the present invention containing the compound (A), which is a liquid repellent, by UV irradiation has a surface having liquid repellency.

[0014] The compound (A) has a number average molecular weight (Mn) of 700 or less, preferably 600 or less, and more preferably 500 or less. When the molecular weight of the compound (A) is within the above range, the compound (A) itself has a low molecular weight and is therefore highly compatible with other compounds, making the partition wall curable composition substantially unnecessary to use a solvent. In addition, the high compatibility of the compound (A) makes it difficult for the fluorine-containing groups in the compound (A) to associate with each other, resulting in a cured film with good liquid repellency. The lower limit of the number average molecular weight (Mn) of the compound (A) is not particularly limited, but from the viewpoint of liquid repellency, it is preferably 300 or more.

[0015] Compound (A) has one or more fluorine-containing groups and hydrolyzable silyl groups in the molecule. The presence of fluorine-containing groups imparts liquid repellency to the cured film. The presence of hydrolyzable silyl groups produces silanol groups through hydrolysis, which then crosslink between molecules to form Si-O-Si bonds.

[0016] Furthermore, the compound (A) may be a monomer, oligomer, or polymer, but is preferably a monomer or oligomer from the viewpoint of compatibility with other components.

[0017] Specifically, the compound (A) is preferably a compound represented by the following formula (A1). (A 1 -R f1 ) a -Si(R 1 ) b (X 1 ) (4-a-b) (A1)

[0018] R f1 is a divalent organic group having 1 to 16 carbon atoms which contains at least one fluoroalkylene group and which may contain an etheric oxygen atom. R 1 is a monovalent hydrocarbon group having 1 to 6 carbon atoms. a is 1 or 2, b is 0 or 1, and a+b is 1 or 2. X 1 is a hydrolyzable group. A 1 is a fluorine atom or a group represented by the following formula (Ia): -Si(R 2 )c X 2 (3-c) (Ia) R 2 is a monovalent hydrocarbon group having 1 to 6 carbon atoms. c is 0 or 1. X 2 is a hydrolyzable group. The hydrolyzable group is a group that is converted into a hydroxyl group (silanol group) by a hydrolysis reaction, and examples of such a group include an alkoxy group having 1 to 4 carbon atoms, a halogen atom, an acyl group, an isocyanate group, an amino group, and an amino group in which at least one hydrogen atom is substituted with an alkyl group having 1 to 4 carbon atoms. X 1 , X 2 , A.R. f1 When there are a plurality of, they may be different or the same.

[0019] The compound (A1) is a fluorine-containing hydrolyzable silane compound having one or two di- or trifunctional hydrolyzable silyl groups.

[0020] The compound (A) is more preferably a compound represented by the following formula (A2). A 12 -R f12 -Q 11 -Si(X 11 )3(A2)

[0021] R f12 is a perfluoroalkylene group having 2 to 10 carbon atoms which may contain an etheric oxygen atom. Q 11 represents a divalent organic group having 1 to 10 carbon atoms and not containing a fluorine atom. X 11 is a hydrolyzable group. A 12 -Q12-SiX123 ... (Ib) is a fluorine atom or a group represented by the following formula (Ib). -Q 12 -Si(X 12 )3(Ib) Q 12represents a divalent organic group having 1 to 10 carbon atoms and not containing a fluorine atom. X 12 is a hydrolyzable group. Multiple X's 11 , X 12 may be different from each other or may be the same.

[0022] In compound (A2), A 12 is a fluorine atom, R f12 is preferably a perfluoroalkylene group having 4 to 10 carbon atoms, or a perfluoroalkylene group containing an etheric oxygen atom having 4 to 10 carbon atoms, more preferably a perfluoroalkylene group having 4 to 8 carbon atoms, and particularly preferably a perfluoroalkylene group having 6 carbon atoms. In compound (A2), A 12 is group (Ib), R f12 is preferably a perfluoroalkylene group having 3 to 8 carbon atoms, or a perfluoroalkylene group having 3 to 8 carbon atoms and containing an etheric oxygen atom, and particularly preferably a perfluoroalkylene group having 4 to 6 carbon atoms.

[0023] R f12 The alkyl group may have a straight-chain structure, a branched structure, a cyclic structure, or a structure partially having a ring, and the straight-chain structure is preferred. R f12 Specific examples of the group include the following groups. -(CF2)4-, -(CF2)6-, -(CF2)8-, -CF2CF2OCF2CF2OCF2-, -CF2CF2OCF2CF2OCF2CF2-, -CF2CF2OCF2CF2OCF2CF2OCF2CF2OCF2-, -CF2CF2OCF2CF2OCF2CF2OCF2CF2OCF2CF2-. -CF2CF2CF2OCF2-, -CF2CF2CF2OCF2CF2-, -CF2CF2CF2OCF(CF3)-, -CF2CF2CF2OCF(CF3)CF2-, -CF2CF2CF2OCF(CF3)CF2OCF2CF2-, -CF2CF2CF2OCF(CF3)CF2OCF(CF3)-, -CF2CF2CF2OCF(CF3)CF2OCF(CF3)CF2-, -CF2OCF(CF3)CF2OCF(CF3)-, -CF2CF2OCF(CF3)CF2OCF(CF3)-.

[0024] Q 11 and Q 12 The right bond is Si and the left bond is R. f12 When each is shown as a bond, specifically, -(CH2) i1 -(i1 is an integer from 1 to 5), -CH2O(CH2) i2 -(i2 is an integer between 1 and 4.), -SO2NR 1 -(CH2) i3 -(R1 is a hydrogen atom, a methyl group, or an ethyl group, i3 is an integer from 1 to 4, and R1 and (CH2) i3 The total number of carbon atoms is an integer of 4 or less. ) -(C=O)-NR1-(CH2) i4 -(R 1 is the same as above, i4 is an integer of 1 to 4, R 1 and (CH2) i4 The total number of carbon atoms of Q is an integer of 4 or less. 11 and Q 12 For -(CH2), i1 is an integer from 2 to 4. i1 - is more preferred, and -(CH2)2- is particularly preferred.

[0025] In addition, R f12 When Q is a perfluoroalkylene group containing no ethereal oxygen atom, 11 and Q 12 As an example, -(CH2) i1 A group represented by the formula - is preferred. i1 is more preferably an integer of 2 to 4, and particularly preferably 2. R f12When Q is a perfluoroalkylene group containing an ether oxygen atom, 11 and Q 12 As an example, -(CH2) i1 -, -CH2O(CH2) i2 -,-SO2NR 1 -(CH2) i3 - and -(C=O)-NR 1 -(CH2) i4 In this case, the group represented by -(CH2) is also preferred. i1 It is more preferable that i1 is an integer of 2 to 4, and it is particularly preferable that i1 is 2.

[0026] Specific examples of the compound (A2) include the following compounds. F(CF2)4CH2CH2Si(OCH3)3, F(CF2)6CH2CH2Si(OCH3)3, F(CF2)6CH2CH2CH2Si(OCH3)3, F(CF2)8CH2CH2Si(OCH3)3, F(CF2)3OCF(CF3)CF2O(CF2)2CH2CH2Si(OCH3)3, F(CF2)2O(CF2)2O(CF2)2CH2CH2Si(OCH3)3.

[0027] The compound (A) may be used alone or in combination of two or more kinds.

[0028] As the compound (A), a known fluorine-containing silane compound can be used.

[0029] The content of the fluorine-containing silane compound (A) in the partition wall curable composition of the present invention is such that the fluorine atom content in the partial hydrolysis condensate obtained from the composition is preferably 0.1 to 40 mass%, more preferably 0.2 to 30 mass%, further preferably 0.5 to 20 mass%, particularly preferably 1 to 10 mass%. When the content of the fluorine-containing silane compound (A) is equal to or more than the lower limit of the above range, good liquid repellency can be imparted to the upper surface of the cured film, and when it is equal to or less than the upper limit, compatibility with other silane compounds in the mixture is good.

[0030] ((B) Crosslinking Agent) The curable composition for partition walls in the present invention can form a cured film having high hardness by containing the crosslinking agent (B).

[0031] The crosslinking agent (B) has a crosslinkable functional group from the viewpoint of being capable of crosslinking between molecules, and the number of the crosslinkable functional groups is preferably 1 or more, more preferably 1 to 20, and particularly preferably 1 to 8. The crosslinkable functional groups of the crosslinking agent (B) react with each other at least to cause crosslinking or chain extension.

[0032] The crosslinking agent (B) is preferably at least one selected from the group consisting of compounds having a functional group capable of being polymerized by radicals, epoxy compounds, oxetane compounds, and melamine compounds. The crosslinking agent (B) preferably contains a compound having a functional group capable of being polymerized by radicals and at least one selected from an epoxy compound, an oxetane compound, and a melamine compound. By combining a compound having a functional group capable of being polymerized by radicals with these compounds, a cured film having high liquid repellency can be obtained even at a low exposure dose.

[0033] Here, the functional group polymerizable by a radical includes a carbon-carbon unsaturated double bond polymerizable by a radical, a carbon-carbon unsaturated triple bond, a ring that opens by a radical, and a group containing these. The unsaturated double bond and the unsaturated triple bond may be present inside the molecular chain (hereinafter also referred to as an internal olefin type), or may be present at the end of the molecule (hereinafter also referred to as a terminal olefin type), and the terminal olefin type is preferred from the viewpoint of high reactivity. The internal olefin type also includes the presence of an unsaturated double bond in a part of an aliphatic ring, such as cycloolefins. As the terminal olefin type functional group, an alkenyl group having 4 or less carbon atoms and an alkynyl group having 4 or less carbon atoms are preferred. Specific examples of functional groups that can be polymerized by radicals include vinyl(oxy) groups, allyl(oxy) groups, isopropenyl groups, 3-butenyl groups, (meth)acryloyl(oxy) groups, trifluorovinyl(oxy) groups, ethynyl groups, 1-oxocyclopenta-2,5-dien-3-yl groups, cyano groups, diallylhydroxymethyl groups, hydroxyfluorenyl groups, cyclobutalene rings, and oxirane rings. As the functional group polymerizable by a radical, one or more functional groups selected from the group consisting of a vinyl group, an allyl group, an ethynyl group, a vinyloxy group, an allyloxy group, and a (meth)acryloyl(oxy) group are preferred, in that they are highly reactive and tend to give a cured film with a high crosslinking density, and a (meth)acryloyl(oxy) group is particularly preferred.

[0034] Examples of compounds having a (meth)acryloyl(oxy) group, i.e., acrylic compounds, include polyfunctional acrylic compounds such as diethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethoxylated isocyanuric acid tri(meth)acrylate, and urethane acrylate, as well as acidic group-containing polyfunctional acrylic compounds. As the acidic group-containing polyfunctional acrylic compound, a compound having two or more hydroxyl groups, in which one or more of the hydroxyl groups are substituted with a (meth)acryloyloxy group, and the remaining hydroxyl group is bonded to a compound having an acidic group, thereby introducing an acidic group is preferred. Examples of the compound having two or more hydroxyl groups include compounds having a skeleton such as diethylene glycol, trimethylolpropane, pentaerythritol, ditrimethylolpropane, dipentaerythritol, ethoxylated isocyanuric acid, and urethane. Examples of the acidic group include a carboxy group, a phenolic hydroxyl group, a sulfo group, and a phosphate group.

[0035] Examples of the epoxy compound include glycidyl ethers such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, dicyclopentadiene type epoxy resins, naphthalene type epoxy resins, trisphenolmethane type epoxy resins, and brominated epoxy resins; alicyclic epoxy resins such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and bis(2,3-epoxycyclopentyl)ether; glycidyl esters such as diglycidyl hexahydrophthalate, diglycidyl tetrahydrophthalate, and diglycidyl phthalate; glycidyl amines such as tetraglycidyldiaminodiphenylmethane and triglycidyl paraaminophenol; and heterocyclic epoxy resins such as triglycidyl isocyanurate.

[0036] Examples of the oxetane compound include 3-ethyl-3-hydroxymethyloxetane, 2-ethylhexyloxetane, xylylenebisoxetane, and 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane.

[0037] The melamine compound is preferably a compound represented by the following formula (D1).

[0038] [ka]

[0039] R 11 ~R 16 R is independently a hydrogen atom, a hydroxymethyl group, or an alkoxymethyl group. 11 ~R 16 At least one of these is an alkoxymethyl group.

[0040] The crosslinking agent (B) is preferably liquid at 25° C. When the crosslinking agent itself has fluidity, a solvent for the curable composition for partition walls becomes substantially unnecessary.

[0041] The crosslinking agent (B) preferably has a viscosity of 5 to 20,000 mPa s, and more preferably 5 to 18,000 mPa s, at 25° C. When the viscosity of the crosslinking agent is within this range, application of the composition can be easily controlled, and there is no risk of clogging in an apparatus for discharging the composition.

[0042] In the curable composition for partition walls of the present invention, the content of the crosslinking agent (B) is preferably 50% by mass or more, more preferably 80% by mass or more, from the viewpoint of coating film formation, and is preferably 98% by mass or less, more preferably 96% by mass or less.

[0043] ((C) Photosensitizer) The curable composition for partition walls of the present invention is photocurable and therefore contains a photosensitizer, that is, a photopolymerization initiator. The photosensitizer is not particularly limited as long as it is a compound that functions as a photopolymerization initiator. For example, a compound that generates radicals by light, i.e., a photoradical initiator, and a compound that generates acid by light, i.e., a photoacid generator, can be mentioned. The curable composition for partition walls of the present invention preferably contains at least one of a photoradical initiator and a photoacid generator as the photosensitizer (C).

[0044] The photoradical initiator is preferably a compound that generates radicals when exposed to ultraviolet light of 200 to 500 nm, and more preferably a compound that generates radicals when exposed to ultraviolet light of 300 to 400 nm. Specific examples of the photoradical initiator include α-diketones such as methylphenyl glyoxylate and 9,10-phenanthrenequinone; acyloins such as benzoin; acyloin ethers such as benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; thioxanthones such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, and isopropylthioxanthone; benzophenone, and 4,4'-bis(dimethylamino)benzophenone. , 4,4'-bis(diethylamino)benzophenone and other benzophenones; acetophenone, 2-(4-toluenesulfonyloxy)-2-phenylacetophenone, p-dimethylaminoacetophenone, 2,2'-dimethoxy-2-phenylacetophenone, p-methoxyacetophenone, 2-methyl-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one and other acetophenones; anthraquinone, 2- Quinones such as ethyl anthraquinone, camphorquinone, 1,4-naphthoquinone, etc.; aminobenzoic acids such as ethyl 2-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate (n-butoxy)ethyl, etc.; halogen compounds such as phenacyl chloride and trihalomethylphenylsulfone, etc.; acylphosphine oxides; peroxides such as di-t-butyl peroxide, etc.; oxime esters such as 1,2-octanedione, 1-[4-(phenylthio)-, 2-(O-benzoyloxime), acetyloxime, etc.; triethanolamine aliphatic amines such as methyldiethanolamine, triisopropanolamine, n-butylamine, N-methyldiethanolamine, and diethylaminoethyl methacrylate; and thiol compounds such as 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 1,4-butanol bis(3-mercaptobutyrate), tris(2-mercaptopropanoyloxyethyl)isocyanurate, and pentaerythritol tetrakis(3-mercaptobutyrate).

[0045] The photoacid generator is preferably a compound that decomposes upon irradiation with actinic rays to generate an acid, and more preferably a compound that has absorbance at a wavelength of 350 to 450 nm.Specific examples of the photoacid generator include onium salt-based acid generators and nonionic acid generators. Examples of the onium salt-based acid generator include onium salts having a sulfonium ion or an iodonium ion as the cation moiety. Examples of nonionic acid generators include compounds having a naphthalimide skeleton, a nitrobenzene skeleton, a diazomethane skeleton, a phenylacetophenone skeleton, a thiochitosan skeleton, or a triazine skeleton, and having a structure to which a chlorine atom, an alkane sulfonic acid, an arylsulfonic acid, or the like is bonded.

[0046] The photosensitizer may be used alone or in combination of two or more kinds.

[0047] In the curable composition for partition walls of the present invention, the content of the photoradical initiator is preferably 1 mass % or more, more preferably 2 mass % or more, from the viewpoint of curability, and is preferably 1 mass % or less, more preferably 7 mass % or less, from the viewpoint of suppressing outgassing.

[0048] In the curable composition for partition walls of the present invention, the content of the photoacid generator is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, from the viewpoint of curability, and is preferably 10% by mass or less, more preferably 5% by mass or less, from the viewpoint of suppressing outgassing.

[0049] (Fluorine-free silane compound) The composition of the present invention preferably further contains a fluorine-free silane compound, which generates a siloxane bond (-Si-O-Si-) by a condensation reaction between the silane compound and the hydrolyzable group of the liquid repellent (A), and the bond is fixed on the coating surface, making it easier to exhibit liquid repellency. As the fluorine-free silane compound, a fluorine-free hydrolyzable silane compound is preferred. Examples of fluorine-free silane compounds include the hydrolyzable silane compounds (s2) to (s5) described in WO 2014 / 069478. In particular, alkoxysilanes, mercaptoalkoxysilanes, acrylalkoxysilanes, and the like are preferred.

[0050] The content of the fluorine-free silane compound in the composition of the present invention is preferably 1 to 5 mass %.

[0051] (Thiol compounds) The composition of the present invention may contain a thiol compound as necessary. The thiol compound is a compound having two or more mercapto groups in one molecule. If the negative photosensitive resin composition of the present invention contains a thiol compound, a radical of the thiol compound is generated by a radical generated from a photopolymerization initiator during exposure, and acts on a crosslinkable functional group such as an ethylenic double bond of the liquid repellent (A) or the crosslinking agent (B), thereby causing a so-called ene-thiol reaction. Unlike the usual radical polymerization of an ethylenic double bond, this ene-thiol reaction is not inhibited by oxygen, so it has high chain transferability, and further crosslinking is performed simultaneously with polymerization, so that the shrinkage rate when the cured product is formed is low, and a uniform network is easily obtained.

[0052] When the composition of the present invention contains a thiol compound, it can be sufficiently cured even with a low amount of light exposure as described above, and photocuring is sufficiently carried out even in the upper layer portion including the upper surface of the partition wall which is particularly susceptible to reaction inhibition by oxygen, so that it is possible to impart good liquid repellency to the upper surface of the partition wall.

[0053] The thiol compound preferably contains 2 to 10 mercapto groups in one molecule, more preferably 2 to 8, and even more preferably 2 to 5. From the viewpoint of storage stability of the composition, 3 mercapto groups is particularly preferable.

[0054] The molecular weight of the thiol compound is not particularly limited. The mercapto group equivalent weight, expressed as [molecular weight / number of mercapto groups] in the thiol compound, is preferably 40 to 1,000, more preferably 40 to 500, and particularly preferably 40 to 250, from the viewpoint of curability at a low exposure dose.

[0055] Specific examples of the thiol compound include tris(2-mercaptopropanoyloxyethyl)isocyanurate, pentaerythritol tetrakis(3-mercaptobutyrate), trimethylolpropane tristhioglycolate, pentaerythritol tristhioglycolate, pentaerythritol tetrakisthioglycolate, dipentaerythritol hexathioglycolate, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, dipentaerythritol hexa(3-mercaptopropionate), and the like. nate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), dipentaerythritol hexa(3-mercaptobutyrate), trimethylolpropane tris(2-mercaptoisobutyrate), 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, triphenolmethane tris(3-mercaptopropionate), triphenolmethane tris(3-mercaptobutyrate), trimethylolethane tris(3-mercaptobutyrate), 2,4,6-trimercapto-S-triazine, etc. The thiol compound (G) may be used alone or in combination of two or more.

[0056] (Phosphate Compounds) The composition of the present invention may optionally contain a phosphoric acid compound in order to improve the adhesion of the resulting cured film to a substrate, a transparent electrode material such as ITO, etc. The phosphoric acid compound is not particularly limited as long as it can improve the adhesion of the cured film to a substrate, a transparent electrode material, etc., but is preferably a phosphoric acid compound having an ethylenically unsaturated double bond in the molecule.

[0057] As the phosphoric acid compound having an ethylenically unsaturated double bond in the molecule, a phosphate (meth)acrylate compound, that is, a compound having at least an O=P structure derived from phosphoric acid and a (meth)acryloyl group, which is an ethylenically unsaturated double bond derived from a (meth)acrylic acid compound, in the molecule, or a vinyl phosphate compound is preferred. Examples of the (meth)acrylate phosphate compound include mono(2-(meth)acryloyloxyethyl) acid phosphate, di(2-(meth)acryloyloxyethyl) acid phosphate, di(2-acryloyloxyethyl) acid phosphate, tris((meth)acryloyloxyethyl) acid phosphate, and mono(2-methacryloyloxyethyl)caproate acid phosphate.

[0058] As the phosphoric acid compound, in addition to the phosphoric acid compound having an ethylenically unsaturated double bond in the molecule, phenylphosphonic acid and the like can also be used.

[0059] The phosphoric acid compound may be contained alone or in combination of two or more kinds.

[0060] (acid) The composition of the present invention preferably contains an acid, if necessary, from the viewpoint of promoting the hydrolysis of the silane compound. In particular, when the composition of the present invention contains a silane compound that does not contain fluorine, the effect is remarkable. In this case, the composition preferably contains 0.2 to 1 mass % of acid. As the acid, an inorganic acid such as nitric acid is preferable.

[0061] (Photoinitiator assistant, sensitizer) The composition of the present invention may further contain a photoinitiator or sensitizer as necessary. Examples of the photoinitiator or sensitizer include benzoin compounds, acetophenone compounds, anthraquinone compounds, thioxanthone compounds, ketal compounds, benzophenone compounds, tertiary amine compounds, and xanthone compounds.

[0062] (Coloring agent) The composition of the present invention may contain a colorant as necessary. As the colorant, light-shielding particles exemplified in WO 2010 / 013654 can be used.

[0063] (solvent) The composition of the present invention has a solvent content of 20% by mass or less. By suppressing the amount of the solvent, which is a volatile component, in the composition of the present invention to 20% by mass or less, there is little risk of the solvent remaining in the cured film. In addition, a cured film having good curability and excellent liquid repellency can be obtained. The solvent content is preferably 15% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less. The lower the solvent content, the less the heating step is required during curing, and even if a heating step is involved, the lower the temperature can be.

[0064] Examples of solvents that may be contained in the composition of the present invention include diethylene glycol ethyl methyl ether, diethylene glycol dimethyl ether, diethylene glycol isopropyl methyl ether, propylene glycol diacetate, propylene glycol n-butyl ether, 3-methoxybutyl acetate, 3-methoxy-3-methylbutyl acetate, dipropylene glycol dimethyl ether, ethyl 3-ethoxypropionate, 4-butyrolactone, cyclohexanol acetate, dipropylene glycol methyl-n-propyl ether, and ethylene glycol monobutyl ether acetate.

[0065] (Other additives) The composition of the present invention may further contain, as necessary, additives selected from various additives well known in the coating field, such as adhesion improvers (silane coupling agents, etc.), stabilizers (ultraviolet absorbers, antioxidants, thermal polymerization inhibitors, etc.), surfactants (leveling agents, defoamers, suspending agents, dispersants, dispersion aids, etc.), plasticizers, thickeners, antistatic agents, aminosilicon compounds, and phosphate compounds, within the range that does not impair the effects of the present invention.

[0066] The composition of the present invention can be obtained by mixing the above-mentioned components in given amounts by a known method.

[0067] The composition of the present invention preferably has a viscosity of 50 to 5000 mPa·s, more preferably 80 to 2000 mPa·s, still more preferably 100 to 1000 mPa·s, and particularly preferably 200 to 500 mPa·s at 25° C. It is believed that a viscosity within this range can stabilize the ejection of droplets.

[0068] The composition of the present invention is useful as a repair material for repairing defects occurring in partition walls of optical elements, such as organic EL elements, quantum dot displays, TFT arrays, batteries, and the like.

[0069] (Bulkheads and methods for repairing bulkheads) The partition wall of the present invention is a partition wall formed in a shape that divides a substrate surface into a plurality of compartments for forming dots, and is used in optical elements such as organic EL elements, quantum dot displays, TFT arrays, batteries, etc. Defects occurring in the partition wall can be repaired by using the composition of the present invention.

[0070] The method for repairing a partition wall of the present invention comprises applying the curable composition for partition walls of the present invention to a defect in the partition wall, and curing the composition by irradiating the composition with light to form a cured film having a shape corresponding to the partition wall. Fig. 1 is a process diagram including a method for repairing partition walls according to the present invention. In [I] to [V] of Fig. 1, the diagram on the left side of the paper is a schematic plan view seen from above, and the diagram on the right side of the paper is a schematic AB cross-sectional view of the diagram on the left side. FIG. 1[I] is a diagram showing a state in which partition walls 2 are formed on a substrate 1 and a defect portion 3 is present. FIG. 1[II] is a diagram showing a state in which a part of the partition wall located around the defect portion 3 in FIG. FIG. 1 [III] is a diagram showing a state in which a partition wall curable composition 4 is applied using a liquid supplying means 5. FIG. 1 [IV] is a diagram showing a state in which a curable composition for partition walls 4 has been cured to form a cured film 6. FIG. 1[V] is a diagram showing a state in which an unnecessary portion of the cured film 6 that protrudes onto the pixel region side has been removed. The repair method of the present invention will be specifically described below with reference to FIG.

[0071] (1) A step of forming liquid-repellent partition walls on a substrate A method for forming a partition wall having liquid repellency includes a method of forming the partition wall by photolithography using a photosensitive composition capable of forming a liquid repellent cured product (International Publication No. 2004 / 042474). As a photosensitive composition capable of forming a liquid repellent cured product, a negative photosensitive composition containing a fluorine-containing compound or a silicon-containing compound, an alkali-soluble resin, and a photopolymerization initiator is preferable. The material of the substrate 1 on which the partition wall and pixels are formed is not limited, but for example, various glass plates, thermoplastic plastic sheets such as polyester (polyethylene terephthalate, etc.), polyolefin (polyethylene, polypropylene, etc.), polycarbonate, polymethyl methacrylate, polysulfone, polyimide, poly(meth)acrylic resin, and cured sheets of thermosetting resins such as epoxy resin and unsaturated polyester are preferably used. It is also possible to use a substrate on which a transparent electrode such as indium tin oxide (ITO) or metal wiring such as chromium or molybdenum is formed. If there are no defects such as chips, the liquid-repellent partition wall can prevent the ink from spilling out of the pixel area when ink is applied to the pixel area surrounded by the partition wall. The average line width of the partition walls is preferably 100 μm or less, more preferably 40 μm or less, and particularly preferably 20 μm or less. The average height of the partition walls is preferably 0.05 to 10 μm, more preferably 0.2 to 5 μm, and particularly preferably 0.5 to 3 μm. The taper angle between the side wall and the bottom surface of the partition is preferably from 10 to 90 degrees, more preferably from 20 to 80 degrees, and particularly preferably from 30 to 70 degrees. If the taper angle is too small or too large, the contrast may decrease. The average width of the pixel regions partitioned by the partitions is preferably 300 μm or less, more preferably 100 μm or less. The size (area) of one dot is 5000 μm. 2 ~150000μm 2 is preferably 10,000 μm 2 ~120000μm 2 More preferably, 15,000 to 100,000 μm 2 is particularly preferred. In this manner, the partition walls 2 are formed so as to divide the substrate surface into a plurality of sections for forming dots.

[0072] (2) A process for detecting defects in the partition walls Methods for detecting defective portions 3 in the partition 2 include, for example, a method of imaging the partition 2 with a CCD camera and comparing it with a previously prepared reference pattern to identify defects; a method of imaging the partition 2 with a CCD camera and comparing an input signal with a signal delayed by a pattern interval to detect data other than regular patterns as defects; and the like.

[0073] (3) A process of removing a portion of the partition wall surrounding the defect The detected defective portion 3 of the partition wall 2 has a small area of ​​the exposed surface of the substrate 1, making it difficult to apply the partition wall curable composition 4. Therefore, it is preferable to remove a part of the partition wall 2 located around the defective portion 3 to increase the area of ​​the exposed surface of the substrate 1. To make it easy to apply the partition wall curable composition 4 in the next step, specifically, it is preferable to remove 50 μm of the partition wall 2 in the line length direction.

[0074] Methods for removing the partition 2 at the defective portion 3 include, for example, a method of scratching with a needle, a method of irradiating laser light, etc. The method of irradiating laser light is preferred because it allows finer processing. As the laser light, pulsed light of 532 nm or 355 nm is preferred.

[0075] (4) A process of applying a curable composition for partition walls to the defective portion and curing the composition. The method of applying the partition curable composition 4 is not particularly limited, but it is preferable to apply the partition curable composition 4 using a liquid supplying means 5 as shown in [III] of FIG. 1. Specifically, as disclosed in JP-A-8-182949, a method of attaching the partition correction liquid 4 to a needle-shaped member and then applying it to the area where the partition 2 has been removed; as disclosed in JP-A-2007-30144, a method of discharging the partition correction liquid 4 from a long and thin needle tube filled with the partition correction liquid 4 and applying it to the area where the partition 2 has been removed are preferable because they can be used to apply minute correction spots. When a needle-shaped member is used, the partition curable composition 4 may be repeatedly applied until a desired film thickness is obtained. When a needle-shaped member having a flat tip on the side where the partition wall curable composition 4 is applied is used as the needle-shaped member, damage to the partition wall 2 due to contact with the tip can be prevented. By changing the diameter of the tip of the needle-shaped member, defects in the partition wall 2 of various sizes can be accommodated.

[0076] The method for curing the partition wall curable composition 4 is not particularly limited as long as it is cured by light, but it is preferable to cure by ultraviolet irradiation. In particular, when a laser light source emitting continuous wave 355 nm ultraviolet light is used, the emission illuminance is high, so that sufficient energy can be irradiated to cure the correction fluid in a short time, and only the repaired area can be irradiated, resulting in high productivity.

[0077] The cured film may be dried as necessary when the curable composition contains a solvent, etc. Drying methods include air drying, heat drying, vacuum drying, and the like. In the case of heat drying, for example, an oven, a hot plate, or the like is used, and the temperature is preferably in the range of 50 to 200°C, more preferably 180°C or less, and particularly preferably 160°C or less. A method of heating and drying only the correction area using an infrared spot heater or the like is also preferred. The heating time is preferably 5 to 30 minutes, more preferably 5 to 15 minutes. Heat drying combines a means for drying the solvent and a means for promoting curing. By combining ultraviolet irradiation with a low-temperature heating process, the curing is promoted by heating even if the exposure amount during curing is small, so there is an advantage in that damage caused by light can be reduced.

[0078] When the curable composition for partition 4 is cured, as shown in [IV] of FIG. 1, the line width of the partition 2 may become wider than the originally required width, and the cured film 6 may protrude into the pixel region. In this case, it is preferable to remove the unnecessary part of the cured film 6 protruding into the pixel region. A method for removing the unnecessary part is preferably to irradiate the above-mentioned pulsed 532 nm or 355 nm laser light. In this way, a partition having a partition repair part can be manufactured as shown in [V] of FIG. 1.

[0079] The partition wall repaired portion thus formed has a liquid repellent upper surface, and therefore the ink will not mix at the partition wall repaired portion, nor will the uniformity of the ink application be impaired. Furthermore, the repair can be performed easily, economically, and with high accuracy.

[0080] [Optical elements] The optical element of the present invention, for example, an organic EL element, a quantum dot display, a TFT array, or a battery, is an optical element having a plurality of dots on a substrate surface and the above-mentioned partition wall of the present invention located between adjacent dots. In the optical element of the present invention, for example, an organic EL element, a quantum dot display, a TFT array, or a battery, the dots are preferably formed by an IJ method. An organic EL element has a structure in which an organic thin-film light-emitting layer is sandwiched between an anode and a cathode, and the partition wall of the present invention can be used as a partition wall separating organic light-emitting layers, a partition wall separating organic TFT layers, or a partition wall separating coated oxide semiconductors. EXAMPLES

[0081] The present invention will be specifically described with reference to the following Synthesis Examples and Examples, but the present invention is not limited thereto.

[0082] The number average molecular weight is a value measured by gel permeation chromatography using polystyrene as a standard substance.

[0083] The abbreviations for the compounds used in each example are shown below. C6F silane: C6F 13 CH2CH2Si(OCH3)3 TEOS: Tetraethoxysilane, Si(OC2H5)4 Acrylsilane: CH2=CHCOO(CH2)3Si(OCH3)3 MW-100LM: Nikalac MW-100LM (manufactured by Sanwa Chemical Co., Ltd.) MX-750M: Nikalac MX-750M (manufactured by Sanwa Chemical Co., Ltd.) ED-523-T:1,3-Bis(2,3-epoxypropoxy)-2,2-dimethylpropane ED-505:1,1,1-Trimethylolpropane triglycidyl ether DOX:3-Ethyl-3-[[(3-ethyloxetan-3-yl)methoxy]methyl]oxetane M520: Aronix M520 (manufactured by Toagosei) M510: Aronix M510 (manufactured by Toagosei) β-CEA: β-carboxyethyl acrylate DPHA: Dipentaerythritol hexaacrylate TMPTA: Trimethylolpropane triacrylate DPGDA: Dipropylene glycol diacrylate HDDA: 1,6-Hexanediol diacrylate A9300: Ethoxylated isocyanuric acid triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) EEEA: Viscoat #190 (Osaka Organic Chemical Industry, ethoxyethoxyethyl acrylate) BA: Butyl acrylate PAG103: Irgacure PAG103 (manufactured by BASF) CPI-210S: Triarylsulfonium special phosphorus anion salt (manufactured by San-Apro) OXE02: Ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyloxime) Omnirad 369:2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone DETX-S:2,4-Diethylthioxanthone,KAYACURE DETX-S Omnirad 907:2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one EAB:4,4'-Bis(diethylamino)benzophenone Mercaptosilane: HSC3H6Si(OCH3)3 Acrylic silane: CH2=CH=COOCH2CH2CH2Si(OCH3)3 Silicone oligomer: KR-515 (Shin-Etsu Silicone Co., Ltd.) CB: Carbon black dispersion (average secondary particle size = 120 nm, propylene glycol monomethyl ether acetate solution, CB content 20 mass%, solid content 25 mass%) KBM403: 3-glycidoxypropylmethyldimethoxysilane (Shin-Etsu Silicone Co., Ltd.) BHT: Dibutyl hydroxytoluene MBA: 3-Methoxybutyl acetate PGME: Propylene glycol monomethyl ether EDM: Diethylene glycol methyl ethyl ether

[0084] <Synthesis Example 1: Synthesis of fluorine-containing silane composition (A-1)> A fluorine-containing silane composition (A-1) was synthesized with reference to Example D1-1 of WO 2015 / 163379. CF silane (0.38 g), TEOS (2.35 g), and PGME (5.56 g) were added to prepare raw material solution A. 1.71 g of 1.0 mass of nitric acid aqueous solution was added dropwise to the obtained raw material solution while stirring at room temperature. After the dropwise addition, the mixture was further stirred for 5 hours to obtain a fluorine-containing silane composition (A-1) which is a PGME solution containing 10 mass% of raw material solution A. The fluorine content (mass% of fluorine atoms) of the fluorine-containing silane composition (A-1) excluding the solvent (PGME) was 20.0 mass%, and the number average molecular weight (Mn) was 773.

[0085] <Synthesis Example 2: Synthesis of fluorine-containing silane composition (A-2)> C6F silane (0.38g), TEOS (0.08g), acrylic silane (0.86g), and PGME (7.66g) were added to prepare raw material solution B. 0.54g of 1.0% by mass nitric acid aqueous solution was added dropwise to the obtained raw material solution while stirring at room temperature. After the dropwise addition, the mixture was further stirred for 5 hours to obtain a fluorine-containing silane composition (A-2) which is a PGME solution containing 10% by mass of raw material solution B. The fluorine content (mass% of fluorine atoms) of the fluorine-containing silane composition (A-2) excluding the solvent (PGME) was 21.1% by mass, and the number average molecular weight (Mn) was 660.

[0086] [Example 1-1~Example 1-15: Compositions (X1)~(X15)] <Preparation of curable composition for partition walls> The components (parts by mass) shown in Table 1 were placed in a stirring vessel and stirred for 3 hours to obtain curable compositions for partition walls. Examples 1-1 to 1-11 and 1-15 are working examples, and Examples 1-12 to 1-14 are comparative examples. The fluorine-containing silane composition (A-1) is composed of 10% by mass of solids and 90% by mass of solvent (PGME). The fluorine-containing silane composition (A-2) is composed of 10% by mass of solids and 90% by mass of solvent (PGME). Therefore, the PGME content is added to the total amount of solvent in the examples using these compositions.

[0087] <Volatile content measurement> The volatile content of the curable composition for partition walls prepared above was measured by a heat-dry weight measurement method (volatile solid content measurement device Mark 3 manufactured by Actac Corporation). A: 20% by mass or less C: More than 20% by mass

[0088] <Viscosity measurement> An E-type viscometer (TVE-25L, manufactured by Toki Sangyo Co., Ltd.) was calibrated with 1.2 mL of the standard calibration liquid, and then 1.2 mL of the curable composition for partition walls prepared above was weighed out and the viscosity was measured. A: 50~5000mPa·s C: Outside the above range

[0089] <Liquid repellency evaluation> [Examples 2-1, 2-2, 2-4 to 2-10, 2-12 to 2-16] 10cm square glass is exposed to UV / O for 5 minutes. 3 The curable composition for partition walls obtained above was applied to the washed glass substrate surface using a spinner, and then dried on a hot plate at 100° C. for 2 minutes to form a dry film with a thickness of 5 μm. The resulting dry film was exposed to light at 365 nm with an output of 20 mW / cm 2 The entire surface was irradiated with UV light at a dose of 50 mJ / cm. 2 , or 100 mJ / cm 2 In Examples 2-2 and 2-10, the exposure dose was 30 mJ / cm 2 , and two types of cured films were prepared by adjusting the exposure time so that the exposure dose was 30 mJ / cm 2 . 2 , 50mJ / cm 2 , or 100 mJ / cm 2 The irradiation time was adjusted so as to produce three types of cured films. [Examples 2-3, 2-11, 2-17] 10cm square glass is exposed to UV / O for 5 minutes. 3 The curable composition for partition walls obtained above was applied to the washed surface of the glass substrate using a spinner, and then dried on a hot plate at 100° C. for 2 minutes to form a dry film with a thickness of 5 μm. The resulting dry film was exposed to light at 365 nm with an output of 20 mW / cm 2 The entire surface was irradiated with UV light at a dose of 30 mJ / cm. 2 , 50mJ / cm 2 , or 100 mJ / cm 2 The irradiation time was adjusted so as to produce three types of cured films. The resulting cured film was heated at 160° C. for 10 minutes.

[0090] The PGMEA contact angle on the upper surface of each of the obtained cured films was measured by the following method to evaluate the liquid repellency. PGMEA droplets were placed on the top surface of the cured film in three places, and each droplet was measured. The droplet volume was 2 uL, and the measurement was performed at 23°C. The contact angle was calculated from the average value of the three measurements. A: Contact angle of 40 degrees or more B: Contact angle 35 degrees or more, less than 40 degrees C: Contact angle less than 35 degrees

[0091] <Solvent resistance evaluation> A 2 uL drop of PGMEA as a solvent was placed on each of the cured films obtained in the above liquid repellency evaluation, and the film was left for 10 seconds, and evaluated based on the following criteria. A: The cured film does not dissolve and no solvent traces remain. B: The cured film does not dissolve, but solvent marks remain. C: The cured film dissolves

[0092] The results of each of the above evaluations are shown in Table 2.

[0093] [Table 1]

[0094] [Table 2]

[0095] From the above results, compositions X1 to X11 of Examples 1-1 to 1-11 are homogeneous compositions without using a solvent and have a low volatile content. The cured films obtained from the compositions of Examples 1-1 to 1-11 and 1-15 have good liquid repellency and therefore excellent curability of the cured film surface. Furthermore, the cured films obtained from the compositions of Examples 1-1 to 1-11 and 1-15 have good solvent resistance and therefore excellent curability as the bulk of the entire cured film. From the above, excellent cured products were obtained from the compositions of Examples 1-1 to 1-11 and 1-15. In contrast, composition X12 in Example 1-12 required more than 20% by mass of solvent to obtain a uniform composition because the molecular weight of the fluorine-containing silane compound was high. Therefore, the volatile content was high, and the liquid repellency and solvent resistance of the cured product were low. Compared with composition X5 in Example 1-5, composition X13 in Example 1-13 had low liquid repellency at low exposure. This is thought to be because the molecular weight of the fluorine-containing silane composition used in Example 1-13 was high, so the compatibility was low and the fluorine-containing groups were likely to associate with each other. Compared with composition X5 in Example 1-5, composition X14 in Example 1-14 had low solvent resistance of the cured product. It is thought that the molecular weight of the fluorine-containing silane composition used in composition X14 was high, so it was not mixed uniformly with other components and a uniform composition was not obtained, causing phase separation and not expressing liquid repellency. On the other hand, composition X15 in Example 1-15 contains a solvent as a volatile component, but the cured film exhibits liquid repellency and solvent resistance. This is believed to be because the content of the solvent (volatile component) contained in composition X15 is low, at 20 mass% or less.

[0096] In addition, the comparison between Examples 2-2 and 2-3, the comparison between Examples 2-10 and 2-11, and the results of Example 2-17 show that by heating the cured film at a low temperature after exposure, the radiation energy of 30 mJ / cm 2 A coating film was obtained that exhibited its performance even at a low exposure dose of 1000 nm.

[0097] Although the present invention has been described in detail and with reference to specific embodiments, it is apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention. This application is based on a Japanese patent application (Patent Application No. 2020-104774) filed on June 17, 2020, the contents of which are incorporated herein by reference. [Industrial Applicability]

[0098] The curable composition for partition walls of the present invention is suitable as a curable composition for repairing partition walls in optical elements such as organic EL elements, quantum dot displays, TFT arrays, and batteries. The partition repaired by the present invention can be used as a partition (bank) for pattern printing an organic layer such as an emitting layer by the IJ method in an organic EL element, or as a partition (bank) for pattern printing a quantum dot layer, a hole transport layer, etc. by the IJ method in a quantum dot display. [Explanation of symbols]

[0099] 1: substrate, 2: partition wall, 3: defect, 4: curable composition for partition wall, 5: liquid supply means, 6: cured film

Claims

1. A curable composition for partition walls, comprising (A) a fluorine-containing silane compound having a number average molecular weight of 700 or less, (B) a crosslinking agent, and (C) a photosensitizer, wherein the solvent content is 20 mass% or less, and the content of the (B) crosslinking agent is 80 mass% or more.

2. The curable composition for partition walls according to claim 1 , wherein the fluorine-containing silane compound (A) is a fluorine-containing silane monomer.

3. 3. The curable composition for partition walls according to claim 1 or 2, wherein the (B) crosslinking agent comprises at least one selected from the group consisting of a compound having a functional group capable of being polymerized by a radical, an epoxy compound, an oxetane compound, and a melamine compound.

4. 3. The curable composition for partition walls according to claim 1 or 2, wherein the (B) crosslinking agent contains a compound having a functional group capable of being polymerized by a radical, and at least one compound selected from an epoxy compound, an oxetane compound, and a melamine compound.

5. The curable composition for partition walls according to any one of claims 1 to 4, wherein the (B) crosslinking agent is liquid at 25°C.

6. The curable composition for partition walls according to any one of claims 1 to 5, wherein the photosensitizer (C) contains at least one of a photoradical initiator and a photoacid generator.

7. The curable composition for partition walls according to any one of claims 1 to 6, wherein the (C) photosensitizer comprises a photoradical initiator and a photoacid generator.

8. The curable composition for partition walls according to any one of claims 1 to 7, having a viscosity of 50 to 5000 mPa·s.

9. The curable composition for partition walls according to any one of claims 1 to 8, which is used for repairing defects occurring in partition walls formed in a shape that divides a substrate surface into a plurality of compartments for forming dots.

10. A method for repairing defects occurring in partition walls formed in a shape that divides a substrate surface into a plurality of sections for forming dots, comprising the steps of: A method for repairing a partition wall, comprising: applying the partition wall curable composition according to any one of claims 1 to 9 to the defect, and curing the composition by light irradiation to form a cured film having a shape corresponding to the partition wall.

11. A partition wall formed in a shape that divides the surface of the substrate into a plurality of compartments for forming dots, A partition wall having a partition wall repaired portion comprising a cured film formed from the partition wall curable composition according to any one of claims 1 to 9.

12. An optical element having a plurality of dots on a substrate surface and partitions located between adjacent dots, An optical element, wherein the partition is formed of the partition according to claim 11.

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