tire

Abstract

Provided is a tire having excellent peeling resistance such that it is unsusceptible to having an electronic component peel off from the surface of the tire, even when a large impact is exerted on the tire during high-speed travel. An electronic component attachment member for embedding an electronic component is attached to a surface of a tire inner member disposed in a tire inner cavity. The electronic component attachment member comprises an electronic component storage part for storing an electronic component, and a bonding part having a bonding surface for attaching the electronic component attachment member to the surface of the tire inner member. A line that passes through the center point of the bonding surface of the electronic component attachment member with the tire inner cavity surface and that is perpendicular to the surface profile of a tread part does not pass through a circumferential-direction groove formed in the surface of the tread part, and the complex elastic modulus E* r (MPa) of the bonding part at 30°C and the complex elastic modulus E* t (MPa) of tread rubber constituting the tread part at 30°C satisfy E* r / E* t<1.

Description

[Technical field]

[0001] The present disclosure relates to a tire in which an electronic component mounting member incorporating an electronic component is provided on a surface of an inner tire member disposed in a tire cavity. [Background technology]

[0002] In order to ensure a vehicle's comfortable running, it is considered important that the air pressure in the tires be properly managed, and in recent years, it has become common to install a tire pressure monitoring system (TPMS) inside the vehicle (e.g., Patent Documents 1 to 4). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-016185 A [Patent Document 2] JP 2018-199396 A [Patent Document 3] JP 2019-023594 A [Patent Document 4] JP 2019-026218 A Summary of the Invention [Problem to be solved by the invention]

[0004] Sensors such as TPMS are generally made of metal electronic components, so if they are directly attached to rubber tires, there is a concern that they may peel off during rolling. In particular, if a large impact is applied, such as when running over a step while driving at high speed, there is a concern that the electronic component mounting material may peel off from the tire surface.

[0005] Therefore, an object of the present disclosure is to provide a tire having excellent peeling resistance that makes it difficult for electronic components to peel off from the tire surface even when a large impact is applied while traveling at high speed. [Means for solving the problem]

[0006] The present inventors have conducted intensive research into solving the above problems, and have found that the above problems can be solved by the disclosure described below, thereby completing the present disclosure.

[0007] The present disclosure relates to A tire in which an electronic component mounting member for incorporating an electronic component is attached to a surface of an inner tire member, the electronic component mounting member includes an electronic component storage portion that stores the electronic component, and a joining portion that includes a joining surface for mounting the electronic component mounting member to a surface of the tire inner member, A line passing through a center point of a joint surface of the electronic component mounting member with a tire cavity surface and perpendicular to a surface profile of the tread portion does not pass through a circumferential groove formed on the surface of the tread portion, The joint Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * r (MPa), and the tread rubber constituting the tread portion Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * t The tire is characterized in that the compressive strength (MPa) satisfies the following formula 1. E * r / E * t <1 ···········(Formula 1) Effect of the Invention

[0008] According to the present disclosure, it is possible to provide a tire having excellent peel resistance in which electronic component mounting members are unlikely to peel off from the tire surface even when a large impact is applied during high-speed traveling. [Brief description of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view showing a configuration of a tire according to an embodiment of the present disclosure. [Diagram 2] FIG. 2A is a diagram showing the shape of a surface of a tread of a tire according to another embodiment of the present disclosure, and FIG. 2B is a cross-sectional view showing the configuration of a tire according to another embodiment of the present disclosure. [Diagram 3] 1A is a perspective view of an electronic component mounting member according to an embodiment of the present disclosure, as viewed from the side opposite to a bonding surface, and FIG. 1B is a perspective view of the electronic component mounting member as viewed from the bonding surface side. [Figure 4] 13 is a perspective view of an electronic component mounting member according to another embodiment of the present disclosure, as viewed from the side opposite to the joining surface. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] [1] Characteristics of the tire according to the present disclosure First, the features of the tire according to the present disclosure will be described.

[0011] The tire according to the present disclosure is a tire in which an electronic component mounting member for incorporating electronic components is attached to the surface of a tire inner member disposed in the tire cavity. The electronic component mounting member includes an electronic component storage section for storing the electronic components, and a joint section having a joint surface for mounting the electronic component mounting member to the surface of the tire inner member. A line passing through the center point of the joint surface between the electronic component mounting member and the tire cavity surface and perpendicular to the surface profile of the tread portion does not pass through a circumferential groove formed on the surface of the tread portion. Furthermore, Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * r (MPa), and the tread rubber that makes up the tread Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * t (MPa) satisfies the following (Equation 1). E * r / E * t <1 ···········(Formula 1)

[0012] By making the tire as described above, it is possible to provide a tire having excellent peeling resistance in which the electronic component mounting members are unlikely to peel off from the tire surface even when a large impact is applied during high-speed running, as will be described later.

[0013] In the above description, the "circumferential groove formed on the surface of the tread portion" refers to a groove having a width of 2 mm or more that extends in the circumferential direction of the tire, and does not include grooves that are not continuous around the tire, such as sipes and decorative grooves. The shape of the circumferential groove is not limited as long as it extends in the circumferential direction, and it may be a curved groove or a zigzag groove.

[0014] In addition, when the tread portion is composed of multiple tread rubber layers, in the above description, the tread rubber refers to the rubber layer with the largest area among the rubber layers radially outer than a line that passes through the 95% position of the circumferential groove depth on both sides and is parallel to the tread profile, in the tread land portion where, in the tire cross section, a line passes through the center line of the joint surface of the electronic component mounting member and perpendicular to the surface profile of the tread portion, when the tread land portion is separated by two circumferential grooves, or when it is separated by the ground contact edge and the circumferential grooves, it refers to the rubber layer with the largest area among the rubber layers radially outer than a line that passes through the 95% position of the circumferential groove depth and is parallel to the tread profile.

[0015] In the above description, the circumferential groove depth is the shortest distance between a line connecting the tread surface ends of the groove and the groove bottom surface.

[0016] In addition, in the above description, E * t and E * r is a value measured using a viscoelasticity measuring device such as "IPLEXER (registered trademark)" manufactured by GABO Corporation under the conditions of measurement temperature: 30°C, initial strain: 5%, dynamic strain: ±1%, frequency: 10 Hz, and deformation mode: extension in accordance with the provisions of JIS K 6394.

[0017] In the present disclosure, when the joint portion and the electronic component storage portion of the electronic component mounting member are formed from the same rubber composition, the viscoelasticity of the electronic component storage portion may be substituted for the viscoelasticity of the joint portion.

[0018] 2. Mechanism of effect manifestation in the tire according to the present disclosure The mechanism by which the effects of the tire according to the present disclosure are manifested is believed to be as follows.

[0019] When the tire rolls, the tread portion deforms around the groove bottom of the circumferential groove, so the deformation of the tire cavity surface located further inside the groove bottom inevitably becomes large. If the center position of the electronic component mounting member, which is also the center point of the joint surface, is located in a place where this deformation is large, as described above, the movement (deformation) due to rolling is large and the cumulative number is also large, so there is a risk that the electronic component mounting member will peel off and become detached from the tire while driving.

[0020] Therefore, in the present disclosure, it is believed that by positioning the electronic component mounting member so that its center position (the center point of the bonding surface) is offset from the groove, it is possible to prevent large deformation caused by rolling from being transmitted to the electronic component mounting member.

[0021] And further, the joint Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * r (MPa), and the tread rubber that makes up the tread Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * t (MPa) is E * r / E * t <1 (Equation 1) is satisfied, that is, the electronic component mounting member is made softer than the rubber layer that has the greatest volume in the tread land portion, so that it can flexibly follow deformations that occur in the tread portion.

[0022] In addition, E * r / E* t is preferably less than 0.95, more preferably less than 0.90, still more preferably 0.80 or less, still more preferably less than 0.80, and still more preferably 0.67 or less. On the other hand, the lower limit is not particularly limited, but is preferably more than 0.30, more preferably 0.40 or more, more preferably more than 0.40, still more preferably 0.50, and still more preferably 0.60 or more. If it is 0.30 or less, the vibration of the electronic component mounting member due to the vibration received from the land portion becomes too large, and it is considered that the peeling resistance effect is reduced.

[0023] In addition, the complex elastic modulus E of the tread rubber * t is preferably 6 MPa or more, more preferably 8 MPa or more, even more preferably 8.5 MPa or more, and even more preferably 9 MPa or more. If the tire pressure is less than 6 MPa, the deformation in the tread portion becomes too large, and the deformation transmitted to the electronic component mounting member becomes large.

[0024] On the other hand, it is preferably 15 MPa or less, more preferably 12 MPa or less, and even more preferably 10 MPa or less, because if it exceeds 15 MPa, an impact generated in the land portion of the tread is easily transmitted to the inside, and the impact transmitted to the electronic component mounting member is also increased, which is thought to reduce the peeling resistance.

[0025] In addition, the complex elastic modulus E of the electronic component mounting material * r is preferably 2 MPa or more, more preferably 4 MPa or more, and even more preferably 5 MPa or more. If the pressure is less than 2 MPa, the electronic component mounting member is likely to vibrate due to the impact it receives, and peel resistance is thought to decrease.

[0026] On the other hand, it is preferably 12 MPa or less, more preferably 10 MPa or less, and even more preferably 8 MPa or less. By making it 12 MPa or less, it is believed that it becomes easier to follow the deformation transmitted from the tread portion, and the peeling resistance is improved.

[0027] As a result, even if a large impact is applied during high-speed driving causing significant deformation in the tread portion, it is believed that peeling of the electronic component mounting member from the tire can be sufficiently suppressed, thereby enabling excellent peeling resistance to be exhibited.

[0028] 3. Preferred embodiment of the tire according to the present disclosure The tire according to the present disclosure preferably has the following features.

[0029] (1) Loss tangent of tread rubber In the tire according to the present disclosure, the loss tangent at 0° C. (0° C. tan δ) of the tread rubber is preferably 0.30 or greater.

[0030] Loss tangent tan δ is a parameter that indicates energy absorption performance, and it is believed that the larger the value, the more energy can be absorbed, and when the input frequency is high, the loss tangent at a temperature lower than the actual temperature is effective in energy absorption performance. Therefore, by controlling the tan δ at 0°C (0°C tan δ) of the tread rubber to such a value, it is possible to absorb the energy applied to the tread part, particularly when an impact is applied during high-speed driving, and to further reduce the deformation transmitted to the electronic component mounting member, and to more fully suppress peeling of the electronic component mounting member.

[0031] The 0°C tan δ is more preferably 0.33 or more, and even more preferably 0.35 or more. The 0°C tan δ is measured under the conditions of a measurement temperature of 0°C, an initial strain of 10%, a dynamic strain of ±2.5%, a frequency of 10 Hz, and a deformation mode of tension.

[0032] On the other hand, the loss tangent is also a parameter that indicates the heat generation property of rubber, and there is concern that the deformation caused between the tire and the road surface during rolling may cause the temperature of the tread to rise. If the temperature of the tread rises excessively, the tread becomes more susceptible to deformation, and the peel resistance of the electronic component mounting member that comes into contact with the inner cavity is also reduced.

[0033] Considering this point, the loss tangent of the tread rubber at 30°C (30°C tan δ) is preferably 0.13 or less, more preferably 0.12 or less, even more preferably 0.11 or less, and even more preferably 0.1 or less. 30°C tan δ is measured under the following conditions: measurement temperature: 30°C, initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: tension.

[0034] The above-mentioned tan δ can be measured using a viscoelasticity measuring device such as "IPLEXER (registered trademark)" manufactured by GABO.

[0035] (2) Relationship between the thickness of the electronic component mounting parts and the thickness of the rubber layer in the tread In this disclosure, the thickness d of the electronic component mounting member r (mm) and the thickness d of the rubber layer in the tread part radially outward from the joint of the electronic component mounting part t (mm) is 0.25<(d r / d t )<1.25 (Equation 2) is preferably satisfied.

[0036] Thickness of the rubber layer in the tread d t For the thickness of the electronic component mounting member, d r If the thickness d of the tread rubber is too large, the vibration transmitted from the tread portion will cause the non-joint side of the electronic component mounting member to vibrate significantly, which is thought to reduce the peeling resistance. t For the thickness of the electronic component mounting member, d r If the thickness is too small, the deformation of the tread portion increases the strain on the electronic component mounting member, which reduces the peeling resistance.

[0037] In addition, (d r / d t ) is preferably 0.75 or more, more preferably 0.85 or more, and even more preferably 0.90 or more. On the other hand, it is preferably 1.15 or less, more preferably 1.10 or less, even more preferably 1.05 or less, and even more preferably 1 or less.

[0038] The above-mentioned "thickness of the rubber layer in the tread portion" refers to the thickness of the entire tread rubber layer at the center of the land portion in the area where the electronic component mounting member is attached, and in cases where a belt reinforcing layer and a belt layer are provided, refers to the thickness from the outermost tread surface to the radially outermost layer thereof, and the "thickness of the electronic component mounting member" refers to the total thickness of the electronic component mounting member.

[0039] (3) Relationship between the glass transition temperature of the electronic component mounting material and the glass transition temperature of the tread rubber In the present disclosure, the glass transition temperature Tg r (℃) and the glass transition temperature Tg of the tread rubber t (℃) means Tg t -Tg r It is preferable that the following condition is satisfied: >0 (Equation 3).

[0040] It is known that the physical properties of rubber and plastics, such as hardness, rigidity, and viscosity, change drastically at the glass transition point (Tg). At this point, the loss tangent of each rubber composition reaches a maximum value. Based on this knowledge, the glass transition point (Tg) of the joint of the electronic component mounting member r Therefore, the glass transition temperature Tg of the tread rubber t By increasing Tg t -Tg r >0) When an impact occurs, the tread portion is more likely to exhibit a higher loss tangent, which is believed to facilitate absorbing the impact within the tread rubber. At the same time, even in a low-temperature environment, the joint of the electronic component mounting member is softer than the tread rubber, and even when an impact is transmitted to the electronic component mounting member, the impact can be absorbed within the electronic component mounting member, which is believed to more reliably prevent peeling from the tire inner surface.

[0041] In addition, Tg t -Tg ris preferably 2° C. or higher, more preferably 4° C. or higher, and even more preferably 5° C. or higher. There is no particular upper limit, but it is preferably 100° C. or lower, more preferably 70° C. or lower, even more preferably 30° C. or lower, even more preferably 20° C. or lower, even more preferably 18° C. or lower, even more preferably 17° C. or lower, and even more preferably 16° C. or lower.

[0042] Glass transition temperature Tg of tread rubber t is not particularly limited, but is preferably -50°C or higher, more preferably -45°C or higher, even more preferably -40°C or higher, and even more preferably -35°C or higher. If it is less than -50°C, the mobility of the tread rubber will be too high, the amount of deformation when an impact is applied will be large, and the peel resistance will decrease. Also, it is preferably 0°C or lower, more preferably -10°C or lower, even more preferably -15°C or lower, even more preferably -17°C or lower, even more preferably -18°C or lower, and even more preferably -19°C or lower. If it is more than 0°C, the mobility of the tread rubber is low even during normal driving, and impact is easily transmitted to the inside, and the peel resistance will decrease.

[0043] In addition, the glass transition temperature (Tg) of the joint of the electronic component mounting member r is preferably -60°C or higher, more preferably -55°C or higher, even more preferably -45°C or higher, and even more preferably -35°C or higher. If the temperature is lower than -60°C, the mobility of the joint becomes too high, and when an impact is transmitted, it is likely to resonate, and the peel resistance decreases. On the other hand, the upper limit is preferably -10°C or lower, more preferably -20°C or lower, and even more preferably -25°C or lower. If the temperature is higher than -10°C, the mobility inside the joint becomes too low when an impact is applied, and it is not possible to follow the deformation of the tread portion, and the peel resistance decreases.

[0044] [2] Specific embodiments Next, a specific embodiment of the present disclosure will be described. Note that, although a rubber electronic component mounting member will be described as an example of the electronic component mounting member below, as long as the above-mentioned (Formula 1) is satisfied, the electronic component mounting member is not particularly limited, and may be a plastic electronic component mounting member.

[0045] 1. Tire composition Fig. 1 is a cross-sectional view showing a configuration of a tire according to an embodiment of the present disclosure. In Fig. 1, 1 is a tire, 2 is an electronic component mounting member, and 3 is a surface of a tread portion. Also, 11 is a tread, 12 is a belt, 13 is a sidewall, 14 is a carcass layer, 15 is a bead core, 16 is a bead apex, 17 is a chafer, 18 is a clinch, 19 is a tire inner member (inner liner), and 31 is a circumferential groove. Also, I is an inner cavity surface of the tire, and CL is a center line in the tire width direction.

[0046] As shown in FIG. 1, the electronic component mounting member 2 is first disposed on the inner cavity surface I of the tire, that is, on the surface of the inner liner 19. At this time, in order to reduce the impact applied to the electronic component mounting member, the electronic component mounting member is disposed so that a line passing through the center point of the joint surface with the tire inner cavity surface and perpendicular to the surface profile of the tread portion does not pass through the circumferential groove 31 formed on the surface 3 of the tread land. At this time, the deviation between the straight line passing through the center line of the joint surface of the electronic component mounting member and the center of the tread land portion is preferably within ±10 mm, more preferably within ±7 mm, even more preferably within ±5 mm, and even more preferably within ±2 mm. This is because if it exceeds 10 mm, it becomes closer to the end of the tread land portion, the impact transmitted from the tread portion becomes larger, and it is considered that the peeling resistance decreases.

[0047] Here, the surface profile of the tread is the surface shape formed by connecting the land surfaces that form the contact surface of the tread of a tire when it is mounted on a "standard rim," subjected to "standard internal pressure," and placed in an unloaded state; for example, it can be confirmed by fixing the bead portion of a section cut out to a width of about 2 cm in the radial direction of the tire to match the applicable rim width, and virtually connecting adjacent land portions together.

[0048] Then, by drawing an imaginary line that passes through the center point of the joint surface of the electronic component mounting member with the tire inner cavity surface and is perpendicular to the surface profile of the tread portion obtained by the above method, it is possible to confirm that this imaginary line does not pass through the circumferential grooves formed in the tread portion.To do this simply, it is possible to confirm this by fixing the bead portion of the section cut out to a width of about 2 cm as mentioned above to match the applicable rim width.

[0049] In order to obtain monitoring information stably and accurately, it is preferable that the center of the electronic component mounting member is located in the two central regions closest to the tire equatorial plane among the four regions in the tire cross section divided by lines extending parallel to the tire radial direction from a line dividing the tire cross section into four equal parts between both ground contact ends that form the tread width. As an example, FIG. 1 shows an example in which the electronic component mounting member 2 is mounted on the tire width direction center of the tire cavity surface, i.e., on the center line CL. Although not shown, electronic components are built into the electronic component mounting member 2.

[0050] FIG. 2 is a drawing of a tire according to another embodiment of the present disclosure, in which (A) is a diagram showing the shape of the surface of the tread, and (B) is a cross-sectional view showing the structure of the tire. In FIG. 2(A), VL is both ground contact ends forming the tread ground contact width and an imaginary line dividing both ground contact ends into four equal parts. Also, in FIG. 2(B), cl is the center line of the electronic component mounting member 2. And, 34 and 35 are regions divided into four equal parts by the imaginary line VL, 34 is the region closest to the tire equatorial plane, and 35 is the region on the outer side in the tire axial direction. In FIG. 2(A), 32d is a lateral groove in the center, and 32a is a lateral groove having a decorative groove at the outer end in the tire axial direction. Also, 33 is a sipe.

[0051] In the tire of this embodiment, one circumferential groove 31 is formed on the center line CL of the tire on the surface 3 of the tread portion, i.e., on the equator, and one on each side of the circumferential groove 31. In a tire in which the circumferential groove 31 is formed on the equator in this manner, it is preferable to position the center of the electronic component mounting member in two central regions 34 closest to the tire equatorial plane among the four regions divided by both ground contact ends and imaginary lines VL extending parallel to the tire radial direction from a line dividing the both ground contact ends into four equal parts, specifically, the four regions divided by the imaginary line VL extending perpendicularly to the profile from a position on the profile of the tire surface dividing the both ground contact ends into four equal parts.

[0052] Here, "both contact ends forming the tread contact width" refers to the ends that form the maximum linear distance in the axial direction of the tire at the contact surface with a flat plate when the tire is mounted on a "standard rim", pressurized to "standard internal pressure", placed stationary in a vertical position on a flat plate, and then loaded with a "standard load". Specifically, for example, this can be identified by applying a "standard load" to a tire with ink applied to the surface of the tread, pressing it against cardboard, and transferring the information.

[0053] Furthermore, whether the electronic component mounting parts are located within the two central regions closest to the tire equatorial plane out of the four regions defined by dividing the area between the two contact ends into four equal parts can be confirmed by, for example, tracing the contact end positions onto a section cut out to a width of approximately 2 cm and dividing the tire into four equal parts along the surface profile.

[0054] In addition, the term "genuine rim" refers to a rim that is specified for each tire by the standard system that includes the standard on which the tire is based, such as the standard rim for the applicable size listed in the "JATMA YEAR BOOK" for JATMA (Japan Automobile Tire Manufacturers Association), the "Measuring Rim" listed in the "STANDARDS MANUAL" for ETRTO (The European Tyre and Rim Technical Organisation), and the "Design Rim" listed in the "YEAR BOOK" for TRA (The Tire and Rim Association, Inc.). In the case of a tire not specified by a standard, it refers to a rim that can be assembled to a rim and can hold internal pressure, that is, a rim that does not leak air from between the rim and tire, and has the smallest rim diameter and the next narrowest rim width.

[0055] The "normal internal pressure" is the air pressure specified for each tire by the standard, and is the maximum air pressure for JATMA, the maximum value listed in the table "TIRE LOAD LIMITS AT VARIOUS COLD INFLATION PRESSURES" for TRA, and "INFLATION PRESSURE" for ETRTO. For tires not specified in the standard, it is 250kPa.

[0056] "Normal load" refers to the load specified for each tire by each of the above standards, and refers to the maximum mass that can be loaded onto the tire. In the case of JATMA, it is the maximum load capacity, in the case of TRA, it is the maximum value listed in the table "TIRE LOAD LIMITS AT VARIOUS COLD INFLATION PRESSURES", and in the case of ETRTO, it is the "LOAD CAPACITY".

[0057] For tires not specified in the standard, the normal load shall be calculated using the following formula. Normal load (kg) = 0.000011 x V + 175 V = ((Dt / 2) 2 -(Dt / 2-Ht) 2 )×π×Wt where V is the volume occupied by the tire (mm 3 ), Dt is the tire outer diameter (mm), Ht is the tire section height (mm), and Wt is the tire section width (mm), all of which are values ​​measured under normal conditions. Note that π is the circular constant.

[0058] In the above description, the outer diameter Dt of a tire is the outer diameter of the tire when the tire is mounted on a regular rim, the internal pressure is set to 250 kPa, and the tire section height Ht is the distance from the bottom of the bead of the tire to the top surface of the tread, and is calculated as half the difference between the outer diameter of the tire and the nominal rim diameter. Also, the section width Wt of a tire is the width obtained by excluding the patterns and letters on the sidewalls of the tire from the straight-line distance between the sidewalls (total tire width) including all patterns and letters on the sidewalls of the tire when the tire is mounted on a regular rim, the internal pressure is set to 250 kPa, and the tire is unloaded.

[0059] Next, the electronic component mounting member 2 includes an electronic component storage section for storing electronic components, and a joining section having a joining surface for mounting the electronic component mounting member 2 to the surface of the inner liner 19.

[0060] Fig. 3(A) is a perspective view of electronic component mounting member 2 in this embodiment as viewed from the side opposite to the joining surface, Fig. 3(B) is a perspective view of electronic component mounting member 2 in this embodiment as viewed from the side opposite to the joining surface, and Fig. 4 is a perspective view of electronic component mounting member 2 in another embodiment as viewed from the side opposite to the joining surface.

[0061] 3 and 4, 21 is an electronic component storage section, 22 is a joint section, A is a joint surface to be joined to the inner liner 19, E1 is an upper end portion of the electronic component storage section 21 on the side facing the joint surface, E2 is a lower end portion of the electronic component storage section on the joint surface side, and S is a storage space for electronic components.

[0062] 3 and 4, electronic component storage section 21 is formed in a cylindrical shape and has storage space S for electronic components inside. A flange-shaped joint 22 is formed at a lower end E2 of electronic component storage section 21, and joint surface A is formed on the lower surface of joint 22. By forming joint 22 in a flange shape, the size of joint surface A can be increased to ensure a sufficient adhesion area with the tire inner member, thereby increasing the bonding strength.

[0063] The cross-sectional shape, size and depth of the storage space S are appropriately determined according to the shape and size of the electronic components to be stored. The cross-sectional shape can be appropriately set to, for example, an ellipse, a polygon, or the like, in addition to the circle shown in the figure. It is preferable that the side wall of the tube is not perpendicular to the joint 22, but is formed in a truncated cone shape so that the cross-sectional size of the storage space S is larger on the lower end E2 side and smaller on the upper end E1 side.

[0064] The lower end E2 side of the electronic component storage section 21 is preferably formed as an opening, which allows, for example, a sensor to directly contact the tire inner member of the tire, thereby obtaining accurate information with higher sensitivity. On the other hand, if the upper end E1 side is open as shown in Fig. 3(A), the electronic components can be detachably attached and easily replaced. Note that, as shown in Fig. 4, the upper end E1 side may be closed, in which case the electronic components can be stored sealed in the storage space S, and placed in a stable environment.

[0065] The diameter of the lower end E2 of the storage space S is not particularly limited, but is preferably 50 mm or less, more preferably 40 mm or less, and even more preferably 25 mm or less, because if it exceeds 50 mm, the lower end of the storage space S is likely to be deformed by the circumferential groove of the tread portion, and the peeling resistance is thought to decrease.

[0066] The diameter is not particularly limited, but is preferably 10 mm or more, more preferably 15 mm or more. The combined weight of the electronic component and the electronic component mounting member is, for example, preferably 15 g or more, more preferably 20 g or more. On the other hand, it is preferably 500 g or less, more preferably 250 g or less, and even more preferably 100 g or less. If it exceeds 500 g, the kinetic energy of the electronic component and the electronic component mounting member will be high, and the impact transmitted through the tread portion during rolling will also be large, which is thought to reduce the peeling resistance.

[0067] 2. Tread rubber In this embodiment, the tread rubber can be obtained by extruding a rubber composition (tread rubber composition) prepared by kneading the various compounding materials described below into a predetermined shape.

[0068] (1) Tread rubber composition In this embodiment, the tread rubber composition can be obtained by appropriately adjusting the types and amounts of various compounding materials such as the rubber component, filler, softener, vulcanizing agent, and vulcanization accelerator described below, particularly the filler and softener.

[0069] (a) Rubber component In this embodiment, the rubber component may be a rubber (polymer) generally used in tire manufacturing, such as butadiene rubber (BR), styrene butadiene rubber (SBR), isoprene-based rubber, or nitrile rubber (NBR), but among these, it is preferable to use styrene butadiene rubber (SBR), butadiene rubber (BR), and isoprene-based rubber. These rubbers may be used alone or in combination, but from the viewpoint of preventing the propagation of impact by phase-separating each rubber phase and making them entangled with each other, it is preferable to use two types of rubber in combination, such as isoprene-based rubber and BR, BR and SBR, or isoprene-based rubber and SBR, or to use three types of rubber in combination, i.e., isoprene-based rubber, BR, and SBR.

[0070] (a) SBR The content of SBR in 100 parts by mass of the rubber component is, for example, preferably more than 20 parts by mass, more preferably more than 30 parts by mass, and even more preferably more than 40 parts by mass, while it is preferably less than 100 parts by mass, more preferably less than 70 parts by mass, and even more preferably less than 60 parts by mass.

[0071] The weight average molecular weight of SBR is, for example, more than 100,000 and less than 2,000,000. The styrene content of SBR is, for example, preferably more than 5 mass%, more preferably more than 10 mass%, and even more preferably more than 20 mass%. On the other hand, it is preferably less than 50 mass%, more preferably less than 40 mass%, and even more preferably less than 35 mass%. The vinyl bond amount (amount of 1,2-bonded butadiene units) of SBR is, for example, more than 5 mass% and less than 70 mass%. The structure of SBR (measurement of styrene content and vinyl bond amount) can be performed using, for example, a JNM-ECA series device manufactured by JEOL Ltd.

[0072] There are no particular limitations on the SBR, and for example, emulsion-polymerized styrene-butadiene rubber (E-SBR), solution-polymerized styrene-butadiene rubber (S-SBR), etc. may be used. The SBR may be either unmodified SBR or modified SBR.

[0073] The modified SBR may be any SBR having a functional group that interacts with a filler such as silica, and examples thereof include terminal-modified SBR in which at least one end of SBR has been modified with a compound (modifying agent) having the above-mentioned functional group (terminal-modified SBR having the above-mentioned functional group at the end), main-chain-modified SBR in which the main chain has the above-mentioned functional group, main-chain-terminal-modified SBR in which the main chain and at least one end are modified with the above-mentioned modifier, and terminal-modified SBR modified (coupled) with a polyfunctional compound having two or more epoxy groups in the molecule and having a hydroxyl group or epoxy group introduced therein.

[0074] Examples of the functional group include an amino group, an amide group, a silyl group, an alkoxysilyl group, an isocyanate group, an imino group, an imidazole group, a urea group, an ether group, a carbonyl group, an oxycarbonyl group, a mercapto group, a sulfide group, a disulfide group, a sulfonyl group, a sulfinyl group, a thiocarbonyl group, an ammonium group, an imide group, a hydrazo group, an azo group, a diazo group, a carboxyl group, a nitrile group, a pyridyl group, an alkoxy group, a hydroxyl group, an oxy group, an epoxy group, etc. These functional groups may have a substituent.

[0075] Furthermore, as the modified SBR, for example, SBR modified with a compound (modifying agent) represented by the following formula can be used.

[0076] [ka]

[0077] In the formula, R 1 , R 2 and R3 R may be the same or different and represents an alkyl group, an alkoxy group, a silyloxy group, an acetal group, a carboxyl group (-COOH), a mercapto group (-SH), or a derivative thereof. 4 and R 5 R may be the same or different and represents a hydrogen atom or an alkyl group. 4 and R 5 may bond to form a ring structure together with the nitrogen atom, and n represents an integer.

[0078] As the modified SBR modified with a compound (modifier) ​​represented by the above formula, SBR in which the polymerization terminals (active terminals) of solution-polymerized styrene-butadiene rubber (S-SBR) have been modified with a compound represented by the above formula (such as the modified SBR described in JP 2010-111753 A).

[0079] R 1 , R 2 and R 3 R is preferably an alkoxy group (preferably an alkoxy group having 1 to 8 carbon atoms, more preferably an alkoxy group having 1 to 4 carbon atoms). 4 and R 5 is preferably an alkyl group (preferably an alkyl group having 1 to 3 carbon atoms). n is preferably 1 to 5, more preferably 2 to 4, and further preferably 3. In addition, R 4 and R 5 When the nitrogen atom and the nitrogen atom are bonded to each other to form a ring structure, the ring is preferably a 4- to 8-membered ring. The alkoxy group also includes a cycloalkoxy group (such as a cyclohexyloxy group) and an aryloxy group (such as a phenoxy group and a benzyloxy group).

[0080] Specific examples of the modifying agent include 2-dimethylaminoethyltrimethoxysilane, 3-dimethylaminopropyltrimethoxysilane, 2-dimethylaminoethyltriethoxysilane, 3-dimethylaminopropyltriethoxysilane, 2-diethylaminoethyltrimethoxysilane, 3-diethylaminopropyltrimethoxysilane, 2-diethylaminoethyltriethoxysilane, 3-diethylaminopropyltriethoxysilane, etc. These may be used alone or in combination of two or more.

[0081] In addition, modified SBR modified with the following compounds (modifiers) can also be used as the modified SBR. Examples of the modifiers include polyglycidyl ethers of polyhydric alcohols such as ethylene glycol diglycidyl ether, glycerin triglycidyl ether, trimethylolethane triglycidyl ether, and trimethylolpropane triglycidyl ether; polyglycidyl ethers of aromatic compounds having two or more phenol groups such as diglycidylated bisphenol A; polyepoxy compounds such as 1,4-diglycidylbenzene, 1,3,5-triglycidylbenzene, and polyepoxidized liquid polybutadiene; epoxy group-containing tertiary amines such as 4,4'-diglycidyl-diphenylmethylamine and 4,4'-diglycidyl-dibenzylmethylamine; diglycidylaniline, N,N'-diglycidyl-4-glycidyloxyaniline, Diglycidyl amino compounds such as diglycidyl orthotoluidine, tetraglycidyl meta-xylylenediamine, tetraglycidyl aminodiphenylmethane, tetraglycidyl-p-phenylenediamine, diglycidyl aminomethylcyclohexane, and tetraglycidyl-1,3-bisaminomethylcyclohexane; amino group-containing acid chlorides such as bis-(1-methylpropyl)carbamic acid chloride, 4-morpholinecarbonyl chloride, 1-pyrrolidinecarbonyl chloride, N,N-dimethylcarbamic acid chloride, and N,N-diethylcarbamic acid chloride; epoxy group-containing silane compounds such as 1,3-bis-(glycidyloxypropyl)-tetramethyldisiloxane and (3-glycidyloxypropyl)-pentamethyldisiloxane;(Trimethylsilyl)[3-(trimethoxysilyl)propyl]sulfide, (trimethylsilyl)[3-(triethoxysilyl)propyl]sulfide, (trimethylsilyl)[3-(trippropoxysilyl)propyl]sulfide, (trimethylsilyl)[3-(tributoxysilyl)propyl]sulfide, (trimethylsilyl)[3-(methyldimethoxysilyl)propyl]sulfide, (trimethylsilyl)[3-(methyldiethoxysilyl)propyl]sulfide, (trimethylsilyl)[3-(methyldipropoxy sulfide group-containing silane compounds such as (trimethylsilyl)[3-(methyldibutoxysilyl)propyl]sulfide and (trimethylsilyl)[3-(methyldibutoxysilyl)propyl]sulfide; N-substituted aziridine compounds such as ethyleneimine and propyleneimine; methyltriethoxysilane, N,N-bis(trimethylsilyl)-3-aminopropyltrimethoxysilane, N,N-bis(trimethylsilyl)-3-aminopropyltriethoxysilane, N,N-bis(trimethylsilyl)aminoethyltrimethoxysilane, N,N-bis(trimethylsilyl)aminoethyltrimethoxysilane, Alkoxysilanes such as thyltriethoxysilane; (thio)benzophenone compounds having amino groups and / or substituted amino groups, such as 4-N,N-dimethylaminobenzophenone, 4-N,N-di-t-butylaminobenzophenone, 4-N,N-diphenylaminobenzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(diphenylamino)benzophenone, and N,N,N',N'-bis-(tetraethylamino)benzophenone; Benzaldehyde compounds having an amino group and / or a substituted amino group, such as dimethylaminobenzaldehyde, 4-N,N-diphenylaminobenzaldehyde, 4-N,N-divinylaminobenzaldehyde, etc.; N-substituted pyrrolidones, such as N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N-phenyl-2-pyrrolidone, Nt-butyl-2-pyrrolidone, N-methyl-5-methyl-2-pyrrolidone, etc.; N-substituted piperidones, such as N-methyl-2-piperidone, N-vinyl-2-piperidone, N-phenyl-2-piperidone, etc.;N-substituted lactams such as N-methyl-ε-caprolactam, N-phenyl-ε-caprolactam, N-methyl-ω-laurylolactam, N-vinyl-ω-laurylolactam, N-methyl-β-propiolactam, and N-phenyl-β-propiolactam; as well as N,N-bis-(2,3-epoxypropoxy)-aniline, 4,4-methylene-bis-(N,N-glycidylaniline), and tris-(2,3-epoxypropyl)-1,3,5-triazine-2,4,6-trione. , N,N-diethylacetamide, N-methylmaleimide, N,N-diethylurea, 1,3-dimethylethyleneurea, 1,3-divinylethyleneurea, 1,3-diethyl-2-imidazolidinone, 1-methyl-3-ethyl-2-imidazolidinone, 4-N,N-dimethylaminoacetophene, 4-N,N-diethylaminoacetophenone, 1,3-bis(diphenylamino)-2-propanone, 1,7-bis(methylethylamino)-4-heptanone, etc. Modification with the above compounds (modifiers) can be carried out by known methods.

[0082] As the SBR, for example, SBR manufactured and sold by Sumitomo Chemical Co., Ltd., JSR Corporation, Asahi Kasei Corporation, Nippon Zeon Co., Ltd., etc. may be used. The SBR may be used alone or in combination of two or more kinds.

[0083] (b) BR The tread rubber composition may further contain BR as necessary. In this case, the content of BR in 100 parts by mass of the rubber component is, for example, preferably more than 10 parts by mass, more preferably more than 20 parts by mass, and even more preferably more than 30 parts by mass. On the other hand, it is preferably less than 70 parts by mass, more preferably less than 60 parts by mass, and even more preferably less than 50 parts by mass.

[0084] The weight average molecular weight of the BR is, for example, more than 100,000 and less than 2,000,000. The vinyl bond amount of the BR is, for example, more than 1 mass% and less than 30 mass%. The cis amount of the BR is, for example, more than 1 mass% and less than 98 mass%. The trans amount of the BR is, for example, more than 1 mass% and less than 60 mass%.

[0085] The BR is not particularly limited, and BR with a high cis content (cis content of 90% or more), BR with a low cis content, BR containing syndiotactic polybutadiene crystals, etc. can be used. The BR may be either unmodified BR or modified BR, and the modified BR may be modified BR into which the above-mentioned functional groups have been introduced. These may be used alone or in combination of two or more. The cis content can be measured by infrared absorption spectroscopy.

[0086] As the BR, for example, products from Ube Industries, Ltd., JSR Corporation, Asahi Kasei Corporation, Zeon Corporation, etc. can be used.

[0087] (c) Isoprene rubber The tread rubber composition may further contain an isoprene-based rubber as required. In this case, the content of the isoprene-based rubber in 100 parts by mass of the rubber component is preferably, for example, more than 5 parts by mass and less than 20 parts by mass.

[0088] Examples of isoprene-based rubber include natural rubber (NR), isoprene rubber (IR), modified NR, modified NR, and modified IR.

[0089] As the NR, for example, SIR20, RSS♯3, TSR20, etc., which are common in the tire industry, can be used. As the IR, there is no particular limitation, and for example, IR2200, etc., which are common in the tire industry can be used. As the modified NR, deproteinized natural rubber (DPNR), highly purified natural rubber (UPNR), etc. can be used. As the modified NR, epoxidized natural rubber (ENR), hydrogenated natural rubber (HNR), grafted natural rubber, etc. can be used. As the modified IR, epoxidized isoprene rubber, hydrogenated isoprene rubber, grafted isoprene rubber, etc. can be used. These may be used alone or in combination of two or more kinds.

[0090] (D) Other rubber components The rubber composition may also contain, as another rubber component, a rubber (polymer) that is generally used in the manufacture of tires, such as nitrile rubber (NBR).

[0091] (b) Compounding materials other than rubber components (a) Filler In the present embodiment, the rubber composition preferably contains a filler. Specific examples of the filler include silica, carbon black, calcium carbonate, talc, alumina, clay, aluminum hydroxide, and mica. Among these, silica and carbon black are preferably used as reinforcing agents. When silica is used, it is preferable to use it in combination with a silane coupling agent.

[0092] (A-1) Silica The rubber composition preferably contains silica. The BET specific surface area of ​​the silica is preferably 140 m from the viewpoint of obtaining good durability. 2 / g or more is preferable, and 160m 2 On the other hand, from the viewpoint of obtaining good rolling resistance during high-speed driving, a tire having a rolling resistance of 250 m 2 / g or less is preferable, and 220m 2 / g or less. The BET specific surface area is the N2SA value measured by the BET method in accordance with ASTM D3037-93.

[0093] When silica is used as a reinforcing filler, the content of silica per 100 parts by mass of the rubber component is preferably more than 35 parts by mass, more preferably more than 40 parts by mass, from the viewpoint of obtaining good durability performance, while being preferably less than 150 parts by mass, more preferably less than 70 parts by mass, even more preferably less than 65 parts by mass, and particularly preferably less than 60 parts by mass, from the viewpoint of obtaining good rolling resistance during high-speed running.

[0094] Examples of silica include dry process silica (anhydrous silica), wet process silica (hydrated silica), etc. Among these, wet process silica is preferred because it has a large number of silanol groups.

[0095] As the silica, for example, products manufactured by Degussa, Rhodia, Tosoh Silica Co., Ltd., Solvay Japan Co., Ltd., Tokuyama Corporation, etc. can be used.

[0096] (A-2) Silane coupling agent The rubber composition preferably contains a silane coupling agent together with silica. The silane coupling agent is not particularly limited, and examples thereof include bis(3-triethoxysilylpropyl)tetrasulfide, bis(2-triethoxysilylethyl)tetrasulfide, bis(4-triethoxysilylbutyl)tetrasulfide, bis(3-trimethoxysilylpropyl)tetrasulfide, bis(2-trimethoxysilylethyl)tetrasulfide, bis(2-triethoxysilylethyl)trisulfide, bis(4-trimethoxysilylbutyl)trisulfide, bis(3-triethoxysilylpropyl)disulfide, bis(2-triethoxysilylethyl)disulfide, bis(4-triethoxysilylbutyl)disulfide, bis(3-trimethoxysilylpropyl)disulfide, bis(2-trimethoxysilylethyl)disulfide, bis(4-trimethoxysilylbutyl)disulfide, 3-trimethoxysilylpropyl-N,N-dimethylthiocarbamoyl silane, and the like. Examples of the silane include sulfide-based silanes such as rubamoyl tetrasulfide, 2-triethoxysilylethyl-N,N-dimethylthiocarbamoyl tetrasulfide, and 3-triethoxysilylpropyl methacrylate monosulfide, mercapto-based silanes such as 3-mercaptopropyl trimethoxysilane, 2-mercaptoethyl triethoxysilane, and NXT and NXT-Z manufactured by Momentive, vinyl-based silanes such as vinyl triethoxysilane and vinyl trimethoxysilane, amino-based silanes such as 3-aminopropyl triethoxysilane and 3-aminopropyl trimethoxysilane, glycidoxy-based silanes such as γ-glycidoxypropyl triethoxysilane and γ-glycidoxypropyl trimethoxysilane, nitro-based silanes such as 3-nitropropyl trimethoxysilane and 3-nitropropyl triethoxysilane, and chloro-based silanes such as 3-chloropropyl trimethoxysilane and 3-chloropropyl triethoxysilane. These may be used alone or in combination of two or more.

[0097] As the silane coupling agent, for example, products available from Degussa, Momentive, Shin-Etsu Silicones, Tokyo Chemical Industry, Azumax, Dow Corning Toray, etc. can be used.

[0098] The content of the silane coupling agent is, for example, more than 3 parts by mass and less than 25 parts by mass relative to 100 parts by mass of silica.

[0099] (A-3) Carbon black The rubber composition preferably contains carbon black. The content of carbon black is, for example, preferably more than 1 part by mass, more preferably more than 3 parts by mass, relative to 100 parts by mass of the rubber component. On the other hand, the upper limit is preferably less than 50 parts by mass, more preferably less than 20 parts by mass, even more preferably less than 10 parts by mass, and particularly preferably less than 6 parts by mass.

[0100] The carbon black is not particularly limited, and examples thereof include furnace black (furnace carbon black) such as SAF, ISAF, HAF, MAF, FEF, SRF, GPF, APF, FF, CF, SCF and ECF; acetylene black (acetylene carbon black); thermal black (thermal carbon black) such as FT and MT; channel black (channel carbon black) such as EPC, MPC and CC; graphite, etc. These may be used alone or in combination of two or more.

[0101] The nitrogen adsorption specific surface area (N2SA) of carbon black is, for example, 30m 2 / g over 250m 2 The carbon black has a dibutyl phthalate (DBP) absorption of, for example, more than 50 ml / 100 g and less than 250 ml / 100 g. The nitrogen adsorption specific surface area of ​​the carbon black is measured according to ASTM D4820-93, and the DBP absorption is measured according to ASTM D2414-93.

[0102] Specific carbon black is not particularly limited, and examples thereof include N134, N110, N220, N234, N219, N339, N330, N326, N351, N550, and N762. Commercially available products include those from Asahi Carbon Co., Ltd., Cabot Japan Co., Ltd., Tokai Carbon Co., Ltd., Mitsubishi Chemical Co., Ltd., Lion Co., Ltd., Shin-Nichika Carbon Co., Ltd., Columbia Carbon Co., Ltd., and the like. These may be used alone or in combination of two or more kinds.

[0103] (A-4) Other fillers In addition to the above-mentioned carbon black and silica, the rubber composition may further contain fillers commonly used in the tire industry, such as calcium carbonate, talc, alumina, clay, aluminum hydroxide, mica, etc. The content of these fillers is, for example, more than 0.1 parts by mass and less than 200 parts by mass per 100 parts by mass of the rubber component.

[0104] (b) Softener The rubber composition may contain oil (including extender oil), liquid rubber, resin components, etc. as softeners. The total content of these is preferably more than 5 parts by mass and less than 35 parts by mass, more preferably less than 30 parts by mass or less than 25 parts by mass, and even more preferably less than 20 parts by mass or less than 15 parts by mass, per 100 parts by mass of the rubber component. The oil content includes the amount of oil contained in the rubber (oil-extended rubber).

[0105] (Ro-1) Oil Examples of oils include mineral oils (generally called process oils), vegetable oils, and mixtures thereof. Examples of mineral oils (process oils) that can be used include paraffin-based process oils, aromatic process oils, and naphthenic process oils. Examples of vegetable oils include castor oil, cottonseed oil, linseed oil, rapeseed oil, soybean oil, palm oil, coconut oil, peanut oil, rosin, pine oil, pine tar, tall oil, corn oil, rice oil, safflower oil, sesame oil, olive oil, sunflower oil, palm kernel oil, camellia oil, jojoba oil, macadamia nut oil, and tung oil. These may be used alone or in combination of two or more.

[0106] Specific examples of process oils (mineral oils) that can be used include products from Idemitsu Kosan Co., Ltd., Sankyo Yuka Kogyo Co., Ltd., Japan Energy Co., Ltd., Orisoi Co., Ltd., H&R Co., Ltd., Toyokuni Oil Mills Co., Ltd., Showa Shell Sekiyu K.K., Fuji Kosan Co., Ltd., and the like.

[0107] (B-2) Liquid rubber The liquid rubbers mentioned as softeners are polymers that are in a liquid state at room temperature (25° C.) and contain the same monomers as solid rubbers. Examples of liquid rubbers include farnesene-based polymers, liquid diene-based polymers, and hydrogenated products thereof.

[0108] Farnesene polymers are polymers obtained by polymerizing farnesene and contain structural units based on farnesene. Farnesene has isomers such as α-farnesene ((3E,7E)-3,7,11-trimethyl-1,3,6,10-dodecatetraene) and β-farnesene (7,11-dimethyl-3-methylene-1,6,10-dodecatriene).

[0109] The farnesene-based polymer may be a homopolymer of farnesene (farnesene homopolymer) or a copolymer of farnesene and a vinyl monomer (farnesene-vinyl monomer copolymer).

[0110] Examples of liquid diene polymers include liquid styrene-butadiene copolymer (liquid SBR), liquid butadiene polymer (liquid BR), liquid isoprene polymer (liquid IR), and liquid styrene-isoprene copolymer (liquid SIR).

[0111] The liquid diene polymer has a weight average molecular weight (Mw) of, for example, 1.0×10 3 Super, 2.0×10 5 In this specification, the Mw of the liquid diene polymer is a polystyrene-equivalent value measured by gel permeation chromatography (GPC).

[0112] The amount of the liquid rubber (total amount of the liquid farnesene polymer, the liquid diene polymer, etc.) is, for example, more than 1 part by mass and less than 100 parts by mass per 100 parts by mass of the rubber component.

[0113] As the liquid rubber, for example, products of Kuraray Co., Ltd., Cray Valley Co., Ltd., etc. can be used.

[0114] (B-3) Resin component In addition, the rubber composition preferably contains a resin component as necessary. The resin component may be solid or liquid at room temperature, and specific examples of the resin component include styrene resin, coumarone resin, terpene resin, C5 resin, C9 resin, C5C9 resin, acrylic resin, etc., and two or more of them may be used in combination. The content of the resin component is preferably more than 2 parts by mass and less than 45 parts by mass, more preferably less than 30 parts by mass, based on 100 parts by mass of the rubber component.

[0115] The styrene resin is a polymer using a styrene monomer as a constituent monomer, and examples thereof include polymers polymerized with a styrene monomer as the main component (50% by mass or more).Specific examples thereof include homopolymers obtained by polymerizing each of the styrene monomers (styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, p-methoxystyrene, p-tert-butylstyrene, p-phenylstyrene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, etc.) alone, copolymers obtained by copolymerizing two or more kinds of styrene monomers, and copolymers of a styrene monomer and another monomer that can be copolymerized therewith.

[0116] Examples of the other monomer include acrylonitriles such as acrylonitrile and methacrylonitrile, unsaturated carboxylic acids such as acrylics and methacrylic acid, unsaturated carboxylic acid esters such as methyl acrylate and methyl methacrylate, dienes such as chloroprene and butadiene-isoprene, olefins such as 1-butene and 1-pentene, α,β-unsaturated carboxylic acids such as maleic anhydride or acid anhydrides thereof, and the like.

[0117] As the coumarone resin, coumarone-indene resin is preferably used. Coumarone-indene resin is a resin containing coumarone and indene as monomer components constituting the skeleton (main chain) of the resin. Other monomer components contained in the skeleton besides coumarone and indene include styrene, α-methylstyrene, methylindene, vinyltoluene, etc.

[0118] The amount of the coumarone-indene resin per 100 parts by mass of the rubber component is, for example, more than 1.0 part by mass and less than 50.0 parts by mass.

[0119] The hydroxyl value (OH value) of the coumarone-indene resin is, for example, more than 15 mgKOH / g and less than 150 mgKOH / g. The OH value is the amount of potassium hydroxide required to neutralize acetic acid bonded to hydroxyl groups when acetylating 1 g of the resin, expressed in milligrams, and is a value measured by potentiometric titration (JIS K 0070:1992).

[0120] The softening point of the coumarone-indene resin is, for example, more than 30° C. and less than 160° C. The softening point is the temperature at which the ball drops when the softening point specified in JIS K 6220-1:2001 is measured using a ring and ball softening point tester.

[0121] Terpene resins include polyterpene, terpene phenol, and aromatic modified terpene resins. Polyterpenes are resins obtained by polymerizing terpene compounds and their hydrogenated products. Terpene compounds are (C5H8) n The hydrocarbons and their oxygen-containing derivatives are represented by the following composition: Monoterpenes (C 10 H 16 ), sesquiterpenes (C 15 H 24 ), diterpenes (C 20 H 32 ), and examples thereof include α-pinene, β-pinene, dipentene, limonene, myrcene, alloocimene, ocimene, α-phellandrene, α-terpinene, γ-terpinene, terpinolene, 1,8-cineole, 1,4-cineole, α-terpineol, β-terpineol, and γ-terpineol.

[0122] Examples of polyterpenes include terpene resins such as α-pinene resin, β-pinene resin, limonene resin, dipentene resin, and β-pinene / limonene resin, which are made from the above-mentioned terpene compounds, as well as hydrogenated terpene resins obtained by hydrogenating the terpene resins. Examples of terpene phenols include resins obtained by copolymerizing the above-mentioned terpene compounds with phenolic compounds, and resins obtained by hydrogenating the above-mentioned resins, and specifically include resins obtained by condensing the above-mentioned terpene compounds, phenolic compounds, and formalin. Examples of phenolic compounds include, for example, phenol, bisphenol A, cresol, and xylenol. Examples of aromatic modified terpene resins include resins obtained by modifying terpene resins with aromatic compounds, and resins obtained by hydrogenating the above-mentioned resins. The aromatic compound is not particularly limited as long as it is a compound having an aromatic ring, and examples thereof include phenolic compounds such as phenol, alkylphenols, alkoxyphenols, and phenols containing an unsaturated hydrocarbon group; naphthol compounds such as naphthol, alkylnaphthols, alkoxynaphthols, and naphthols containing an unsaturated hydrocarbon group; styrene derivatives such as styrene, alkylstyrenes, alkoxystyrenes, and styrenes containing an unsaturated hydrocarbon group; coumarone, indene, and the like.

[0123] "C5 resin" refers to a resin obtained by polymerizing a C5 fraction. Examples of C5 fractions include petroleum fractions having 4 to 5 carbon atoms, such as cyclopentadiene, pentene, pentadiene, and isoprene. As a C5 petroleum resin, dicyclopentadiene resin (DCPD resin) is preferably used.

[0124] The term "C9 resin" refers to a resin obtained by polymerizing a C9 fraction, and may be a resin obtained by hydrogenating or modifying the resin. Examples of C9 fractions include petroleum fractions having 8 to 10 carbon atoms, such as vinyltoluene, alkylstyrene, indene, and methylindene. Specific examples of suitable resins include coumarone-indene resins, coumarone resins, indene resins, and aromatic vinyl resins. As aromatic vinyl resins, homopolymers of α-methylstyrene or styrene or copolymers of α-methylstyrene and styrene are preferred, and copolymers of α-methylstyrene and styrene are more preferred, because they are economical, easy to process, and have excellent heat generation properties. As aromatic vinyl resins, for example, those commercially available from Kraton, Eastman Chemical, etc. can be used.

[0125] The term "C5C9 resin" refers to a resin obtained by copolymerizing the C5 fraction and the C9 fraction, and may be a hydrogenated or modified resin. Examples of the C5 fraction and the C9 fraction include the petroleum fractions. As the C5C9 resin, for example, those commercially available from Tosoh Corporation, LUHUA, etc. can be used.

[0126] The acrylic resin is not particularly limited, but for example, a solventless acrylic resin can be used.

[0127] Examples of the solvent-free acrylic resin include (meth)acrylic resins (polymers) synthesized by high-temperature continuous polymerization (high-temperature continuous bulk polymerization) (methods described in U.S. Pat. No. 4,414,370, JP-A-59-6207, JP-B-5-58005, JP-A-1-313522, U.S. Pat. No. 5,010,166, and Toa Gosei Kenkyuu Nenpo TREND 2000 Vol. 3, p. 42-45, etc.) with minimal use of auxiliary raw materials such as polymerization initiators, chain transfer agents, and organic solvents. In this disclosure, (meth)acrylic means methacryl and acrylic.

[0128] Examples of monomer components constituting the acrylic resin include (meth)acrylic acid, (meth)acrylic acid esters (alkyl esters, aryl esters, aralkyl esters, etc.), (meth)acrylamide, and (meth)acrylic acid derivatives such as (meth)acrylamide derivatives.

[0129] In addition, aromatic vinyls such as styrene, α-methylstyrene, vinyltoluene, vinylnaphthalene, divinylbenzene, trivinylbenzene, and divinylnaphthalene may be used together with (meth)acrylic acid or a (meth)acrylic acid derivative as a monomer component constituting the acrylic resin.

[0130] The acrylic resin may be a resin composed only of a (meth)acrylic component, or a resin containing components other than the (meth)acrylic component as constituent elements. The acrylic resin may have a hydroxyl group, a carboxyl group, a silanol group, or the like.

[0131] Examples of the resin component that can be used include products from Maruzen Petrochemical Co., Ltd., Sumitomo Bakelite Co., Ltd., Yasuhara Chemical Co., Ltd., Tosoh Corporation, Rutgers Chemicals, BASF, Arizona Chemical Company, Nippon Paint Chemical Co., Ltd., Nippon Shokubai Co., Ltd., JX Energy Corporation, Arakawa Chemical Industries, Ltd., and Taoka Chemical Co., Ltd.

[0132] (C) Antioxidants The rubber composition preferably contains an antioxidant. The content of the antioxidant is, for example, more than 1 part by mass and less than 10 parts by mass per 100 parts by mass of the rubber component.

[0133] Examples of the antioxidant include naphthylamine-based antioxidants such as phenyl-α-naphthylamine; diphenylamine-based antioxidants such as octylated diphenylamine and 4,4'-bis(α,α'-dimethylbenzyl)diphenylamine; N-isopropyl-N'-phenyl-p-phenylenediamine, N-(1,3-dimethylbutyl)-N'-phenyl-p-phenylenediamine, and N,N'-di-2-naphthyl-p-phenylenediamine. p-phenylenediamine-based antioxidants such as quinolinone, quinoline-based antioxidants such as polymers of 2,2,4-trimethyl-1,2-dihydroquinoline, monophenol-based antioxidants such as 2,6-di-t-butyl-4-methylphenol and styrenated phenol, and bis-, tris-, and polyphenol-based antioxidants such as tetrakis-[methylene-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane. These may be used alone or in combination of two or more.

[0134] As the antioxidant, for example, products available from Seiko Chemical Co., Ltd., Sumitomo Chemical Co., Ltd., Ouchi Shinko Chemical Industry Co., Ltd., Flexis, etc. can be used.

[0135] (D) Stearic acid The rubber composition may contain stearic acid. The content of stearic acid is, for example, more than 0.5 parts by mass and less than 10.0 parts by mass with respect to 100 parts by mass of the rubber component. As the stearic acid, a conventionally known product can be used, for example, a product from NOF Corporation, NOF Corporation, Kao Corporation, FUJIFILM Wako Pure Chemical Industries, Ltd., Chiba Fatty Acid Co., Ltd., etc. can be used.

[0136] (e) Zinc oxide The rubber composition may contain zinc oxide. The content of zinc oxide is, for example, more than 0.5 parts by mass and less than 10 parts by mass with respect to 100 parts by mass of the rubber component. As the zinc oxide, a conventionally known product can be used, for example, a product of Mitsui Mining & Smelting Co., Ltd., Toho Zinc Co., Ltd., Hakusui Tech Co., Ltd., Seido Chemical Industry Co., Ltd., Sakai Chemical Industry Co., Ltd., etc. can be used.

[0137] (F) Wax The rubber composition preferably contains wax. The content of the wax per 100 parts by mass of the rubber component is, for example, 0.5 to 20 parts by mass, preferably 1.0 to 15 parts by mass, and more preferably 1.5 to 10 parts by mass.

[0138] The wax is not particularly limited, and examples thereof include petroleum waxes such as paraffin wax and microcrystalline wax, natural waxes such as vegetable wax and animal wax, synthetic waxes such as polymers of ethylene, propylene, etc. These may be used alone or in combination of two or more kinds.

[0139] As the wax, for example, products from Ouchi Shinko Chemical Industry Co., Ltd., Nippon Seiro Co., Ltd., Seiko Chemical Co., Ltd., etc. can be used.

[0140] (G) Crosslinking agents and vulcanization accelerators The rubber composition preferably contains a crosslinking agent such as sulfur, etc. The content of the crosslinking agent is, for example, more than 0.1 parts by mass and less than 10.0 parts by mass per 100 parts by mass of the rubber component.

[0141] Examples of sulfur include powdered sulfur, precipitated sulfur, colloidal sulfur, insoluble sulfur, highly dispersible sulfur, soluble sulfur, etc., which are commonly used in the rubber industry. These may be used alone or in combination of two or more kinds.

[0142] As sulfur, for example, products from Tsurumi Chemical Industry Co., Ltd., Karuizawa Sulfur Co., Ltd., Shikoku Chemical Industry Co., Ltd., Flexis Corporation, Nippon Kanritsu Kogyo Co., Ltd., Hosoi Chemical Industry Co., Ltd., etc. can be used.

[0143] Examples of crosslinking agents other than sulfur include vulcanizing agents containing sulfur atoms, such as TACKIROL V200 manufactured by Taoka Chemical Co., Ltd., DURALINK HTS (sodium 1,6-hexamethylenedithiosulfate dihydrate) manufactured by Flexsys, and KA9188 (1,6-bis(N,N'-dibenzylthiocarbamoyldithio)hexane) manufactured by LANXESS, as well as organic peroxides such as dicumyl peroxide.

[0144] The rubber composition preferably contains a vulcanization accelerator. The content of the vulcanization accelerator is, for example, more than 0.3 parts by mass and less than 10.0 parts by mass per 100 parts by mass of the rubber component.

[0145] Examples of the vulcanization accelerator include thiazole-based vulcanization accelerators such as 2-mercaptobenzothiazole, di-2-benzothiazolyl disulfide, and N-cyclohexyl-2-benzothiazyl sulfenamide; thiuram-based vulcanization accelerators such as tetramethylthiuram disulfide (TMTD), tetrabenzylthiuram disulfide (TBzTD), and tetrakis(2-ethylhexyl)thiuram disulfide (TOT-N); sulfenamide-based vulcanization accelerators such as N-cyclohexyl-2-benzothiazole sulfenamide, Nt-butyl-2-benzothiazolyl sulfenamide, N-oxyethylene-2-benzothiazole sulfenamide, N-oxyethylene-2-benzothiazole sulfenamide, and N,N'-diisopropyl-2-benzothiazole sulfenamide; and guanidine-based vulcanization accelerators such as diphenyl guanidine, di-orthotolyl guanidine, and orthotolyl biguanidine. These may be used alone or in combination of two or more kinds.

[0146] (H) Others In addition to the above components, the tread rubber composition may further contain additives commonly used in the tire industry, such as fatty acid metal salts, carboxylate metal salts, organic peroxides, etc. The content of these additives is, for example, more than 0.1 parts by mass and less than 200 parts by mass per 100 parts by mass of the rubber component.

[0147] (2) Preparation of tread rubber composition The tread rubber rubber composition is prepared by a general method, for example, a manufacturing method including a base kneading process in which a rubber component is kneaded with a filler such as silica or carbon black, and a finish kneading process in which the kneaded product obtained in the base kneading process is kneaded with a crosslinking agent.

[0148] The kneading can be carried out using a known (internal) kneading machine such as a Banbury mixer, a kneader, or an open roll.

[0149] The kneading temperature in the base kneading step is, for example, more than 50°C and less than 200°C, and the kneading time is, for example, more than 30 seconds and less than 30 minutes. In the base kneading step, in addition to the above components, compounding agents conventionally used in the rubber industry, such as softeners such as oil, stearic acid, zinc oxide, antioxidants, wax, vulcanization accelerators, etc., may be appropriately added and kneaded as necessary. In addition, from the viewpoint of obtaining the tread rubber properties of the present disclosure, silica and a coupling agent may be charged into a mixer and mixed, and then the rubber components may be added and mixed.

[0150] In the final kneading step, the kneaded product obtained in the base kneading step is kneaded with a crosslinking agent. The kneading temperature in the final kneading step is, for example, higher than room temperature and lower than 80° C., and the kneading time is, for example, longer than 1 minute and shorter than 15 minutes. In the final kneading step, in addition to the above components, a vulcanization accelerator, zinc oxide, etc. may be appropriately added and kneaded as necessary.

[0151] At this time, for example, by adjusting the amount of inorganic filler such as carbon black, or the amount of oil or resin components, the complex modulus E of the tread rubber can be adjusted. * t The glass transition temperature (Tg) of the tread rubber can be adjusted by adjusting the type and amount of the resin component. t ) can be adjusted.

[0152] (3) Preparation of tread rubber The obtained tread rubber composition is molded into a predetermined shape to obtain a tread rubber.

[0153] 3. Electronic component mounting materials Next, a rubber electronic component mounting member will be described as a specific example of the electronic component mounting member, but as described above, the electronic component mounting member is not limited to rubber.

[0154] (1) Rubber composition constituting an electronic component mounting member The rubber composition constituting the electronic component mounting member (rubber composition for electronic component mounting member) can be formed using the same compounded materials as in the tread rubber composition, except that the rubber components are different.

[0155] In the rubber composition for electronic component mounting members in this embodiment, for example, BR and NBR are used as the main rubber components, but other rubber components such as isoprene-based rubbers, SBR, SIBR, CR, etc., may be used as appropriate. The rubber components may be composed of a single rubber or a combination of multiple rubbers. In addition, each rubber component may be composed of a single rubber or multiple rubbers.

[0156] When BR and NBR are used as the rubber component, the content of BR in 100 parts by mass of the rubber component is, for example, 40 to 60 parts by mass, and the content of NBR is, for example, 40 to 60 parts by mass. The NBR is not particularly limited, and NBR with a corresponding bound acrylonitrile content can be used depending on the required properties.

[0157] (2) Preparation of rubber composition for electronic component mounting members The rubber composition for electronic component mounting members can be obtained in the same manner as the preparation of the tread rubber composition described above. At this time, in the same manner as the preparation of the tread rubber composition, for example, by adjusting the blending amount of inorganic filler such as carbon black, or the blending amount of oil or resin components, the complex elastic modulus E of the electronic component mounting member can be adjusted. * r can be adjusted to satisfy the above-mentioned conditions. In addition, for example, the glass transition temperature (Tg r ) can be adjusted.

[0158] (3) Manufacturing of mounting parts for electronic components Next, the obtained rubber composition for electronic component mounting members is heated and pressurized in a vulcanizer to a predetermined shape to produce an electronic component mounting member. The vulcanization step can be carried out by applying a known vulcanization method. The vulcanization temperature is, for example, more than 120°C and less than 200°C, and the vulcanization time is, for example, more than 5 minutes and less than 15 minutes. The housing part and the joint part of the electronic component mounting member may be made of different materials, but it is preferable that they are integrally molded from the same material.

[0159] 4. Tire manufacturing (1) Manufacturing of tires before installing electronic parts In the present disclosure, a tire before the electronic component mounting member is attached can be manufactured by a normal method. That is, tire components such as an inner liner (an inner tire component) are molded by a normal method on a tire building machine to produce an unvulcanized tire.

[0160] Specifically, on a forming drum, an inner liner is prepared as a member for ensuring airtightness of the tire, a carcass as a member for enduring the load, impact, and filling air pressure received by the tire, and a bead portion is arranged as a member for fixing both ends of the carcass to both side edges and fixing the tire to the rim, and the carcass portion is folded back to envelop the bead portion. Next, a bead reinforcing layer as a member for protecting the bead portion and the carcass and for enduring bending, a clinch portion, and a sidewall are bonded to the outside of the bead portion in the tire width direction, and then these are molded into a toroidal shape. After that, a belt or the like as a member for tightening the carcass and increasing the rigidity of the tread is wound around the center of the outer circumference, and a tread is further arranged on the outer circumference to produce an unvulcanized tire.

[0161] The unvulcanized tire thus produced is then heated and pressurized in a vulcanizer to obtain a tire without an electronic component mounting member. The vulcanization step can be carried out by applying a known vulcanization method. The vulcanization temperature is, for example, more than 120°C and less than 200°C, and the vulcanization time is, for example, more than 5 minutes and less than 15 minutes.

[0162] (2) Installation of electronic component mounting parts Next, a separately manufactured electronic component mounting member is attached to the center in the tire width direction of the surface (cavity surface) of the tire inner member of the manufactured tire using a specific adhesive, thereby completing the manufacture of the tire according to this embodiment. Note that electronic components are stored in the electronic component mounting member after the electronic component mounting member is manufactured. Also, instead of attaching the electronic component mounting member to the vulcanized tire with an adhesive in this manner, the unvulcanized tire and the electronic component mounting member may be vulcanized at the same time. However, since it becomes difficult to replace the electronic component mounting member, it is preferable to attach the electronic component mounting member to the vulcanized tire with an adhesive.

[0163] Specifically, since a release agent is generally applied to the surface of the tire inner member (cavity) in order to maintain releasability during vulcanization, it is preferable to attach the electronic component mounting member with an adhesive after removing the release agent. The following two methods can be considered for removing the release agent.

[0164] The first method is to scrape off the release agent using a polishing machine such as a buffing machine (buffing). By using a polishing machine, large irregularities can be eliminated and the surface can be roughened to ensure a sufficient contact area for adhesion.

[0165] The second method is to use a laser to remove the release agent (laser polishing). This method is thought to have excellent peel resistance because it allows for more precise polishing than a polishing machine and also makes it possible to smooth the contact surface with the electronic component mounting member.

[0166] The laser polishing method can be distinguished from other polishing methods by confirming that the step on the tire inner surface at the interface between the polished and unpolished areas is 200 μm or less. The unpolished areas also include the release agent layer during vulcanization.

[0167] As another method, when a release agent is applied to the inner cavity surface of an unvulcanized tire, the release agent may not be applied only to the area where the electronic component mounting member is to be attached, and the electronic component mounting member may be attached to that area after vulcanization.

[0168] The adhesive may be any adhesive that is normally used for bonding rubber members, etc. The adhesive is preferably a rubber-based adhesive that can maintain its softness even after curing.

[0169] 5.Applications The tire of the present disclosure may be a pneumatic tire or a non-pneumatic tire. It can be used for various purposes such as passenger car tires, large vehicle tires, two-wheeled vehicle tires, agricultural tires, mining tires, and aircraft tires, but it is most preferable to use it as a pneumatic passenger car tire. The passenger car tire referred to here is a tire that is mounted on a four-wheeled vehicle and has a maximum load capacity of 1000 kg or less.

[0170] The maximum load capacity is not particularly limited as long as it is 1000 kg or less, but since generally, as the maximum load capacity increases, the tire weight tends to increase and the impact transmitted to the tire tends to become greater, it is preferably 900 kg or less, more preferably 800 kg or less, and even more preferably 700 kg or less.

[0171] From the viewpoint of reducing the impact transmitted to the tire, the tire weight is preferably 20 kg or less, more preferably 15 kg or less, further preferably 12 kg or less, 10 kg or less, or 8 kg or less. The tire weight mentioned here includes the weight of the electronic components and electronic component mounting members described above, and if a sealant, sponge, or the like is provided in the inner cavity, the tire weight includes these. EXAMPLES

[0172] The present disclosure will now be described more specifically based on examples.

[0173] In the following examples, two types of tires (sizes: 205 / 55R16 and 235 / 55R18) were manufactured with the configuration shown in Fig. 1, and the peel resistance of the electronic part mounting member from the tire was evaluated. Note that here, the experiment was performed with only one type of electronic part mounting member, so that the effects of comparing the physical properties of the electronic part mounting member and the tread rubber could be clearly obtained.

[0174] 1.Mixed materials First, various compounding materials for the tread rubber composition and the rubber composition for electronic component mounting members were prepared.

[0175] (1) Rubber component (a) NR:TSR20 (b) SBR1: Europrene SOL R C2525 manufactured by Versalis (c) SBR2: HPR850 manufactured by JSR Corporation (d) BR: UBEPOL-BR150 manufactured by Ube Industries, Ltd. (e) NBR: Nipol DN401LL manufactured by Zeon Corporation

[0176] (2) Compounding materials other than rubber components (a) Reinforcement agent 1 (silica): Ultrasil VN3 manufactured by Evonik Degussa (N2SA:175m 2 / g) (b) Reinforcing agent 2 (carbon black): Diablack N220 manufactured by Mitsubishi Chemical Corporation (c) Silane coupling agent: Degussa Si266 (Bis(3-triethoxysilylpropyl) disulfide) (d) Oil: Process X-260 manufactured by Japan Energy Co., Ltd. (e) Resin: SYLVATRAXX 4401 manufactured by Arizona Chemical Company (α-methylstyrene resin) (f) Wax: Ozoace 0355 manufactured by Nippon Seiro Co., Ltd. (g) Antioxidant 1: Nocrac 6C manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (N-phenyl-N'-(1,3-dimethylbutyl)-p-phenylenediamine) (h) Antioxidant 2: Antage RD manufactured by Kawaguchi Chemical Industry Co., Ltd. (2,2,4-trimethyl-1,2-dihydroquinoline) (i) Zinc oxide: Two types of zinc oxide manufactured by Mitsui Mining & Smelting Co., Ltd. (j) Stearic acid: Tsubaki manufactured by NOF Corporation (k) Sulfur: HK-200-5 (containing 5% oil by mass) manufactured by Hosoi Chemical Co., Ltd. (l) Vulcanization accelerator 1: Noccela CZ-G (CBS) manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (N-cyclohexyl-2-benzothiazolyl sulfenamide) (m) Vulcanization accelerator 2: Noccela DPG manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (1,3-Diphenylguanidine)

[0177] 2. Manufacturing of tread rubber (1) Manufacturing of tread rubber composition First, a tread rubber composition was produced. Specifically, materials other than zinc oxide, sulfur, and a vulcanization accelerator were kneaded for 5 minutes under the condition of 150°C using a Banbury mixer according to the composition shown in Table 1 to obtain a kneaded product. Each compounding amount is in parts by mass.

[0178] [Table 1]

[0179] Next, zinc oxide, sulfur and a vulcanization accelerator were added to the obtained kneaded mixture, and the mixture was kneaded for 5 minutes at 80° C. using an open roll to obtain a tread rubber composition.

[0180] (2) Manufacturing of tread rubber The obtained tread rubber composition was molded into tread rubber having a thickness shown in Tables 3 to 6.

[0181] 3. Manufacturing of electronic component mounting parts Separately, an electronic component mounting member was manufactured.

[0182] (1) Manufacturing of rubber composition for electronic component mounting members First, materials other than zinc oxide, sulfur, and the vulcanization accelerator were kneaded for 5 minutes at 150°C using a Banbury mixer according to the composition shown in Table 2 to obtain a kneaded mixture. Note that the amounts of each ingredient are in parts by mass.

[0183] [Table 2]

[0184] Next, zinc oxide, sulfur and a vulcanization accelerator were added to the obtained kneaded mixture, and the mixture was kneaded for 5 minutes at 80° C. using an open roll to obtain a rubber composition for electronic component mounting members.

[0185] (2) Manufacturing of electronic component mounting parts Next, the obtained rubber composition for electronic component mounting members was vulcanized and molded into the shape shown in Fig. 3, i.e., into a shape having a storage space S with a circular cross section, to produce electronic component mounting members of two sizes, diameter: 4 cm, thickness dr: 8 mm, and diameter: 4 cm, thickness dr: 12 mm. The combined weights of the electronic component and electronic component mounting members were 25±0.5 g and 27±0.5 g for each size.

[0186] 4. Manufacturing of test tires (1) Manufacturing of tires before installing electronic parts First, a tire of size 205 / 55R16 was manufactured before the electronic component mounting members were attached.

[0187] Specifically, tread rubber having the composition and thickness shown in Tables 3 and 4 was laminated together with other tire components to form an unvulcanized tire, which was then press-vulcanized for 10 minutes under the condition of 170°C to obtain a tire before the electronic component mounting members were attached. The thickness dt of the tread rubber was 8 mm.

[0188] (2) Manufacturing of test tires Next, on the inner surface of the tire before mounting each electronic component mounting member, the mounting locations of the electronic component mounting members shown in Tables 3 and 4 were polished by the polishing methods shown in Tables 3 and 4 to remove the release agent, and then the electronic component mounting members in which predetermined electronic components were stored in the storage space were attached using an adhesive to manufacture each of the test tires of Examples 1 to 12 and Comparative Examples 1 to 6. The weight of the obtained tires was in the range of 7.6 ± 0.2 kg. A commercially available chloroprene rubber adhesive was used as the adhesive.

[0189] The laser polishing was performed by using a laser beam adjusted to a moving pitch of 60 μm and a moving speed of 4000 mm / s to move back and forth several times over the mounting location of the electronic component mounting member, thereby scraping off the release agent and rubber surface to leave a step of 95 μm.

[0190] In the "Mounting Locations of Electronic Component Mounting Parts" shown in Tables 3 and 4, "crown" indicates that the center of the joint surface of the electronic component mounting part is located in the two central regions closest to the tire equatorial plane, i.e., region 34 in FIG. 2, and the center line cl of the electronic component mounting part does not pass through the circumferential groove. "Middle" indicates that the center of the joint surface of the electronic component mounting part is located in the region outside the two central regions, i.e., region 35 in FIG. 2, and the center line cl of the electronic component mounting part does not pass through the circumferential groove. "Back of groove" indicates that the center line cl of the electronic component mounting part passes through the circumferential groove. "Distance between block and mounter" indicates the distance between the center of the block through which the center line cl of the electronic component mounting part passes and the center line cl of the electronic component mounting part among the blocks (land portions) of the tread pattern.

[0191] Next, for tires of size 235 / 55R18, test tires of Examples 13 to 24 (Table 5) and Comparative Examples 7 to 12 (Table 6) were manufactured in the same manner as above. The weight of the obtained tires was in the range of 13.6±0.3 kg.

[0192] 5. Calculation of parameters Rubber test pieces were then prepared from the tread rubber and electronic component mounting members of each test tire. A viscoelasticity measurement sample measuring 20 mm in length, 4 mm in width, and 1 mm in thickness was taken from the tread rubber with the long side in the tire circumferential direction, and a viscoelasticity measurement sample measuring 20 mm in length, 4 mm in width, and 1 mm in thickness was taken from the joint of the electronic component mounting members.

[0193] For each rubber test piece, a GABO Iplexer series was used to measure the loss tangent (0°C tanδ) of the viscoelasticity measurement sample taken from the tread rubber under the conditions of measurement temperature: 0°C, initial strain: 10%, dynamic strain: ±2.5%, frequency: 10Hz, and deformation mode: tension. In addition, the complex modulus of elasticity (E * t ) and the loss tangent (30°C tan δ) was measured in a tensile deformation mode.

[0194] The viscoelasticity measurement samples taken from the electronic component mounting parts were measured under the following conditions: measurement temperature: 30°C, initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension, complex modulus of elasticity (E * r ) was measured.

[0195] In addition, the Tg (°C) of the tread rubber and electronic component mounting member of each test tire, i.e., Tg t (℃) and Tg r (°C) was calculated by the following method.

[0196] Using an Iplexer series manufactured by GABO, the temperature distribution curve of tan δ was measured under the conditions of a frequency of 10 Hz, an initial strain of 10%, an amplitude of ±0.5%, and a heating rate of 2°C / min. The tan δ peak temperature corresponding to the largest tan δ value in the measured temperature distribution curve was determined as the glass transition point (Tg).

[0197] The results of each measurement are shown in Tables 3 to 6. The complex elastic modulus, loss tangent, and Tg (°C) were measured for each test tire produced, and the average values ​​were calculated for those using the same rubber composition.

[0198] Next, based on the above measurement results, the E * r / E * t , Tg r -Tg t The results are shown in Tables 3 to 6.

[0199] 6.Evaluation Test The evaluation was carried out with respect to peeling resistance during actual high speed running.

[0200] (1) Test method Each test tire was fitted to all wheels of a vehicle (a domestically produced FF vehicle with an engine displacement of 2000cc) and filled with air so that the internal pressure was 230 kPa. The vehicle was then driven on a test course with a dry surface at a speed of 80 km / h, running over protrusions on the road surface, and after the run, it was observed whether the electronic component mounting parts had peeled off from the inner surface of the tire.

[0201] If no peeling occurred, the traveling speed was increased to 100km / h, 110km / h, 120km / h, 130km / h, and 140km / h, and the same observation was carried out. The speed at which the electronic component mounting member peeled off was then obtained.

[0202] Next, the result of Example 1 was set as 100 and the peel resistance during actual high-speed running was relatively evaluated by indexing it according to the following formula. A larger value indicates better peel resistance during actual high-speed running and less likely to peel. Actual peeling resistance during high speed driving = [(Test tire results) / (Example 1 results)] x 100

[0203] (2) Evaluation results The evaluation results are shown in Tables 3 to 6.

[0204] [Table 3]

[0205] [Table 4]

[0206] [Table 5]

[0207] [Table 6]

[0208] From the comparison between the Examples and Comparative Examples in Tables 3 to 6, it can be seen that the center line cl of the electronic component mounting member, i.e., the line passing through the center point of the joint surface and perpendicular to the surface profile of the tread portion, does not pass through the circumferential groove formed on the surface of the tread portion, and * r / E * t It is understood that when the ratio is less than 1 (Example), a tire exhibiting excellent peeling resistance during actual high speed driving can be provided.

[0209] Furthermore, a comparison of the Examples shows that, in terms of peel resistance during high-speed running, Examples 6 to 12 and Examples 18 to 24, in which 0°C tan δ is 0.30 or more, are superior, Examples 7 to 10 and Examples 19 to 22, in which 30°C tan δ is 0.13 or less, are even superior, and Examples 8 to 10 and Examples 20 to 22, in which 0°C tan δ is 0.35 or more and 30°C tan δ is 0.10 or less, are even superior.

[0210] Also, d r / d t It can be seen that Examples 9, 10 and Examples 21 and 22, in which the value is smaller than 1.25, are even more excellent.

[0211] In addition, Tg t -Tg rIt can be seen that Examples 6 to 12 and Examples 18 to 24, in which the value is greater than 0, are superior.

[0212] It is also clear that Examples 10 and 22, which were subjected to laser polishing, are superior to the examples which were subjected to buff polishing.

[0213] Although the present disclosure has been described based on the embodiments, the present disclosure is not limited to the above-mentioned embodiments. Various modifications can be made to the above-mentioned embodiments within the same and equivalent scope as the present disclosure.

[0214] The present disclosure (1) is A tire in which an electronic component mounting member for incorporating an electronic component is attached to a surface of an inner tire member, the electronic component mounting member includes an electronic component storage portion that stores the electronic component, and a joining portion that includes a joining surface for mounting the electronic component mounting member to a surface of the tire inner member, A line passing through a center point of a joint surface of the electronic component mounting member with a tire cavity surface and perpendicular to a surface profile of the tread portion does not pass through a circumferential groove formed on the surface of the tread portion, The joint Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * r (MPa), and the tread rubber constituting the tread portion Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: extension Complex modulus E * t The tire is characterized in that the compressive strength (MPa) satisfies the following formula 1. E * r / E * t <1 ···········(Formula 1)

[0215] This disclosure (2) is The tread rubber Measurement temperature: 0℃ Measured under the following conditions: initial strain: 10%, dynamic strain: ±2.5%, frequency: 10Hz, deformation mode: tension The tire described in the present disclosure (1) is characterized in that the loss tangent (0° C. tan δ) is 0.30 or more.

[0216] This disclosure (3) is The tread rubber Measurement temperature: 30℃ Measured under the following conditions: initial strain: 5%, dynamic strain: ±1%, frequency: 10Hz, deformation mode: tension The tire is characterized in that the loss tangent (30° C. tan δ) is 0.13 or less, and is described in the present disclosure (1) or (2).

[0217] This disclosure (4) is The tire according to the present disclosure (3) is characterized in that the 30° C. tan δ is 0.11 or less.

[0218] This disclosure (5) is At the joint, the thickness d of the electronic component mounting member r (mm), and the thickness d of the rubber layer of the tread radially outward of the joint. t (mm) satisfies the following (Formula 2), and is an arbitrary combination with any of the present disclosure (1) to (4). 0.25<(d r / d t )<1.25 (Formula 2)

[0219] This disclosure (6) is The glass transition temperature Tg of the joint r (°C) and the glass transition temperature Tg t (° C.) satisfies the following (Formula 3), and is a tire in any combination with any of the present disclosure (1) to (5). Tg t -Tg r >0 ············(Formula 3)

[0220] This disclosure (7) is The electronic component mounting member is attached to a surface of an inner tire member that has been polished in advance, and the tire is any combination with any of the tire disclosed herein (1) to (6).

[0221] This disclosure (8) is The tire described in the present disclosure (7) is characterized in that the polishing treatment is a polishing treatment using a laser.

[0222] This disclosure (9) is The electronic component mounting member is attached to the surface of the tire inner member using an adhesive, and the tire is any combination with any of the present disclosure (1) to (8).

[0223] The present disclosure (10) relates to In the tire cross section, the tire has four regions defined by lines extending parallel to the tire radial direction from a line dividing the tread width between both contact ends into four equal parts. The center of the electronic component mounting member is located within the two central regions closest to the tire equatorial plane, and the tire can be arbitrarily combined with any of the tire disclosures (1) to (9).

[0224] The present disclosure (11) relates to The electronic section Product A tire characterized in that the deviation between a straight line passing through the center line of the joint surface of the mounting member and the center of the tread land portion is within ±10 mm, and which can be arbitrarily combined with any of the present disclosures (1) to (10).

[0225] The present disclosure (12) relates to The tire is a passenger car tire and is any combination with any of the tires disclosed herein (1) to (11). [Explanation of symbols]

[0226] 1 Tire 2 Electronic component mounting materials 3. Tread surface 11 Tread 12 Belt 13 Sidewall 14 Carcass layer 15 Bead core 16 Bead Apex 17 Chafer 18 Clinch 19 Tire inner liner 21 Electronic component storage section 22 Joint 31 Circumferential groove 32a, 32d Yokomizo 33 Sipe 34 Area closest to the equatorial plane 35 Axial outer area of ​​the tire dt Thickness of the rubber layer in the tread dr Thickness of electronic component mounting member A Joint surface CL Tire centerline cl Center line of electronic component mounting part E1 (top end of the electronic component storage area) E2 (bottom end of electronic component storage area) I Tire inner surface S Storage space VL Virtual Line

Claims

1. A tire in which an electronic component mounting member for incorporating an electronic component is attached to a surface of an inner tire member, the electronic component mounting member includes an electronic component storage portion that stores the electronic component, and a joining portion that includes a joining surface for mounting the electronic component mounting member to a surface of the tire inner member, A line passing through a center point of a joint surface of the electronic component mounting member with a tire cavity surface and perpendicular to a surface profile of the tread portion does not pass through a circumferential groove formed on the surface of the tread portion, The complex elastic modulus E measured under the conditions of the measurement temperature of the joint: 30° C., initial strain: 5%, dynamic strain: ±1%, frequency: 10 Hz, deformation mode: elongation ＊ ｒ (MPa), and the complex elastic modulus E of the tread rubber constituting the tread portion measured under the conditions of a measurement temperature of 30° C., an initial strain of 5%, a dynamic strain of ±1%, a frequency of 10 Hz, and a deformation mode of elongation. ＊ ｔ A tire characterized in that (MPa) satisfies the following (Equation 1). E ＊ ｒ / E ＊ ｔ <1 ・・・・・・・・・・・・(Formula 1)

2. 2. The tire according to claim 1, wherein the loss tangent (0° C. tan δ) of the tread rubber measured under the conditions of a measurement temperature of 0° C., an initial strain of 10%, a dynamic strain of ±2.5%, a frequency of 10 Hz, and a deformation mode of tension is 0.30 or more.

3. 3. The tire according to claim 1, wherein the loss tangent (30° C. tan δ) of the tread rubber measured under the conditions of a measurement temperature of 30° C., an initial strain of 5%, a dynamic strain of ±1%, a frequency of 10 Hz, and a deformation mode of tension is 0.13 or less.

4. 4. The tire according to claim 3, wherein the 30° C. tan δ is 0.11 or less.

5. At the joint, the thickness d of the electronic component mounting member ｒ (mm), and the thickness d of the rubber layer of the tread radially outward of the joint ｔ The tire according to any one of claims 1 to 4, characterized in that (mm) satisfies the following (Equation 2). 0.25<(d ｒ / d ｔ )<1.25……………………(Formula 2)

6. The glass transition temperature Tg of the joint ｒ (°C) and the glass transition temperature Tg of the tread rubber ｔ The tire according to any one of claims 1 to 5, characterized in that (°C) satisfies the following (Equation 3). Tg ｔ -Tg ｒ >0 ·················· (Equation 3)

7. 7. The tire according to claim 1, wherein the electronic part mounting member is attached to a surface of an inner tire member that has been polished in advance.

8. 8. The tire according to claim 7, wherein the polishing treatment is a polishing treatment using a laser.

9. 9. The tire according to claim 1, wherein the electronic component mounting member is attached to a surface of the tire inner member by using an adhesive.

10. 10. The tire according to claim 1, wherein the center of the electronic component mounting member is located within two central regions closest to the tire equatorial plane out of four regions defined in a tire cross section by lines extending parallel to the tire radial direction from a line dividing the tire cross section into four equal parts between both ground contact ends that define a tread contact width.

11. 11. The tire according to claim 1, wherein a deviation between a straight line passing through a center line of the joint surface of the electronic component mounting member and a center of the tread land portion is within ±10 mm.

12. 12. The tire according to claim 1, which is a passenger car tire.

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