SYSTEM AND METHOD FOR LIQUID AMOUNT MEASUREMENT IN AN IMMERSION COOLING DEVICE - Patent application

Abstract

To provide a level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device.SOLUTION: A level sensing module comprises a fluid level sensor, and a controller coupled to the fluid level sensor. The controller is configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in a device chassis 102, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis 102, and generate a map of the dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present invention relate generally to liquid-immersed electronic devices, and more specifically to monitoring the amount of liquid in which the device is immersed. [Background technology]

[0002] Many electronic devices generate heat during operation and require a cooling method to prevent the electronic device from overheating. One such method is liquid submersion cooling, which involves immersing the electronic device in a non-conductive dielectric fluid. A typical liquid submersion cooling method includes circulating the dielectric fluid through a device chassis that houses the electronic device and a heat exchanger that transfers heat generated by the electronic device. The transfer of device-generated heat through the dielectric fluid allows the electronic device to maintain a safe operating temperature. Summary of the Invention [Problem to be solved by the invention]

[0003] As discussed above, operating electronic devices can generate a large amount of heat. To maintain device functionality, the operating temperature of the device is often maintained at an acceptable or desired operating temperature using various cooling methods. Some embodiments can transfer heat via a heat sink and circulate air through or near the device. While these cooling methods have proven effective for some devices, for many devices, such methods are insufficient to maintain an acceptable temperature. Furthermore, such methods often require expensive cooling infrastructure (e.g., air cooling) that operates at high energy utilization rates.

[0004] As a result, there has been an increased demand for efficient, high performance cooling methods. One such method is known as liquid immersion cooling. Liquid immersion cooling methods involve immersing or submerging an electronic device in a non-conductive dielectric fluid. In a single phase embodiment, the dielectric fluid is circulated through a chassis housing the electronic device via a pump. The dielectric fluid then passes through a heat exchanger to transfer heat generated by the device. In a two phase embodiment, the dielectric fluid evaporates to transfer heat generated by the electronic device. The dielectric fluid in gas form is then cooled through a heat exchanger and returned in liquid form to the chassis housing the device. [Means for solving the problem]

[0005] At least one aspect of the present disclosure contemplates a level sensing module for use in a liquid submersion cooling system having a device chassis housing an electronic device, the level sensing module including a fluid level sensor and a controller coupled to the fluid level sensor, the controller configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid within the device chassis, receive a signal from a pump controller indicative of an amount of dielectric fluid delivered to the device chassis, and generate a map of the amount of dielectric fluid within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller. Equipped with.

[0006] In one embodiment, the level sensing module comprises a mounting bracket coupled to the controller and the fluid level sensor, the mounting bracket configured to mount to the device chassis, hi some embodiments, the controller is configured to selectively send a dielectric fluid loss alert based on a signal from the fluid level sensor.

[0007] In some embodiments, the controller is configured to receive a signal from a temperature sensor indicative of a temperature of the dielectric fluid within the device chassis. In some embodiments, the controller is configured to use the temperature of the dielectric fluid to determine a mass of the dielectric fluid within the device chassis. In various embodiments, the controller is configured to update the map of dielectric fluid volume to compensate for at least one of expansion or contraction of the dielectric fluid based on the temperature of the dielectric fluid.

[0008] Another aspect of the present disclosure contemplates a non-transitory computer-readable medium storing computer-executable sequences of instructions for monitoring a volume of dielectric fluid in a liquid submersion cooling system having a device chassis housing an electronic device, the computer-executable sequences of instructions including instructions to direct at least one processor to deliver a first portion of dielectric fluid into the device chassis and send at least one first command to measure a first height of the dielectric fluid in the device chassis, to deliver a second portion of dielectric fluid into the device chassis and measure a second height of the dielectric fluid in the device chassis, to generate a map of the volume of dielectric fluid in the device chassis based on the first and second portions and the first and second heights, to measure a total dielectric fluid height in the device chassis, and to selectively send an alert of dielectric fluid loss based on a comparison of the total dielectric fluid height to the map of dielectric fluid volume.

[0009] In one embodiment, the sequence of instructions includes instructions for at least one processor to generate a map of dielectric fluid volumes by determining delta height levels corresponding to the delivery of the first and second portions of dielectric fluid. In some embodiments, the first and second portions of dielectric fluid occupy first and second regions within the device chassis, respectively. In various embodiments, the delta height levels correspond to levels of displacement of dielectric fluid in the first and second regions.

[0010] In some embodiments, the sequences of instructions include instructions for causing at least one processor to identify which of the first and second regions are affected by the dielectric fluid loss based on a comparison of the total dielectric fluid height to a map of the dielectric fluid volume. In some embodiments, the sequences of instructions include instructions for causing at least one processor to send a dielectric fluid loss alert if the dielectric fluid loss is affecting the first region. In various embodiments, the sequences of instructions include instructions for causing at least one processor to measure a temperature of the dielectric fluid within the device chassis. In some embodiments, the sequences of instructions include instructions for causing at least one processor to determine a mass of the dielectric fluid within the device chassis using the temperature of the dielectric fluid.

[0011] Another aspect of the present disclosure contemplates a device chassis for use in a liquid submersion cooling system comprising an electronic device and a level sensing module having a fluid level sensor and a controller coupled to the fluid level sensor, the controller configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of an amount of dielectric fluid supplied to the device chassis, and generate a map of the amount of dielectric fluid in the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.

[0012] In one embodiment, the device chassis further comprises a mounting bracket coupled to the level sensing module. In some embodiments, the controller is configured to selectively send an alert of dielectric fluid loss based on a signal from the fluid level sensor. In some embodiments, the controller is configured to receive a signal from a temperature sensor indicative of a temperature of dielectric fluid within the device chassis. In various embodiments, the controller is further configured to use a temperature of the dielectric fluid to determine a mass of dielectric fluid within the device chassis. In some embodiments, the controller is configured to update the map of dielectric fluid volume to compensate for expansion and / or contraction of dielectric fluid based on a temperature of the dielectric fluid.

[0013] Various aspects of at least one embodiment are described below with reference to the accompanying drawings, which are not intended to be drawn to scale. The drawings are presented to explain and provide a better understanding of the various aspects and embodiments, and are incorporated and constitute a part of this specification, but are not intended to define the limits of the scope of the present disclosure. In the drawings, each individual or nearly individual component shown in the various figures may be indicated by a similar reference numeral. For purposes of simplicity, every component may not be labeled in every figure. [Brief description of the drawings]

[0014] [Figure 1A] FIG. 1 is a functional block diagram of an exemplary liquid submersion cooling system. [Figure 1B] FIG. 1 is a functional block diagram of an exemplary liquid submersion cooling system. [Diagram 2] FIG. 1 is a functional block diagram of a liquid submersion cooling system according to one embodiment. [Diagram 3] FIG. 1 is a schematic diagram illustrating an example of a liquid level assembly according to one embodiment. [Figure 4A]FIG. 1 illustrates an example of a device chassis filled with dielectric fluid according to one embodiment. [Figure 4B] 1 is a data table showing example dielectric fluid values ​​measured / calculated according to one embodiment. [Figure 4C] FIG. 13 is an example map of the amount of dielectric fluid according to one embodiment. [Figure 4D] 1 is a data table showing example dielectric fluid values ​​measured / calculated according to one embodiment. [Diagram 5] FIG. 1 illustrates a process for mapping and monitoring the amount of dielectric fluid within a device chassis according to one embodiment. [Figure 6] FIG. 1 illustrates a process for mapping and monitoring the amount of dielectric fluid within a device chassis according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The embodiments of the methods and systems described herein are not limited in application to the details of the construction and arrangement of components shown in the accompanying drawings described below. The methods and systems may be implemented in other embodiments and may be practiced or carried out in various ways. The particular implementations are presented for illustrative purposes only and are not intended to be limiting. In particular, acts, components, elements and features described with respect to any one or more embodiments are not intended to exclude a similar role in any other embodiments.

[0016] Additionally, the language and terminology used herein is for descriptive purposes and should not be considered limiting. Any reference herein to an example, embodiment, component, element, or act of the system and method referring to a single one can include, and any reference to a plurality of any embodiment, component, element, or act can also include an embodiment including only the single one. References in the singular or plural are not intended to limit the currently described system or method, its components, acts, or elements. As used herein, "including," "comprising," "having," "containing," "involving," and variations thereof are intended to include the items listed below and equivalents thereof as well as additional items. References to "or" can refer to any item described using "or" alone, one or more of, or all of the items described. Furthermore, in the event of a discrepancy in the use of terms between this specification and a document incorporated herein by reference, the use of the terms in the incorporated reference shall supplement the use of the terms in this specification, and to the extent of any conflicting discrepancy, the use of the terms in this specification shall control.

[0017] 1A illustrates an example of a liquid submersion cooling system 100 that includes a device chassis 102, a heat exchanger 104 within the device chassis 102, a fluid reservoir 106, and a pump assembly 108. The device chassis 102 is configured to store a dielectric fluid such that a device 101 within the device chassis 102 can be submerged in the dielectric fluid. The device can be a server or some other electronic device, such as a storage device, network appliance, or other type of high heat flux electronic device. In some embodiments, more than one device can be positioned within the device chassis 102 and submerged in the dielectric fluid.

[0018] The pump assembly 108 includes a pump 110 and a pump control module 112. The pump control module 112 operates the pump 110 to pump dielectric fluid from the fluid reservoir 106 to the device chassis 102. In some embodiments, the pump control module 112 can receive commands from a computer system, another control module, and / or a user.

[0019] The device chassis 102 can have at least one internal pump 103 that circulates the dielectric fluid through the heat exchanger 104. As shown in FIG. 1A, the dielectric fluid can be circulated through the heat exchanger 104 to transfer heat generated by the device 101. Water, or other liquid, can be circulated through the heat exchanger 104 to remove heat dissipated from the dielectric fluid and from the device chassis 102. FIG. 1B shows an example of a liquid submersion cooling system 150 that can circulate the dielectric fluid through the external heat exchanger 104, deliver it to the fluid reservoir 106, and return it to the device chassis 102. In some embodiments, the liquid submersion cooling system 150 can be a two-phase system.

[0020] The dielectric fluid can be one of many different types of non-conductive liquids. In this context, "non-conductive" means unable to conduct electricity at levels that could damage or be harmful to the immersed device 101. In some embodiments, the dielectric fluid can be an industrial fluid with properties optimized for heat transfer. In some embodiments, the type of dielectric fluid used can be selected based on the device 101 within the device chassis 102. In other embodiments, it can be selected based on the environment of the submersion cooling system 100. Examples of dielectric fluids that can be used can include industrial fluids, mineral oil, deionized water, etc.

[0021] During operation of the immersion cooling system 100, the device chassis 102 may experience dielectric fluid losses that, as an empirical example, reduce the amount of dielectric fluid in the device chassis 102. For example, the dielectric fluid may seep or leak from seals in the device chassis 102. In other examples, the device chassis 102 may experience leakage of the dielectric fluid in vapor form from seals that separate the dielectric fluid from other interfaces. In some embodiments, the device chassis 102 may be opened for servicing or maintenance, allowing the dielectric fluid to evaporate into the air.

[0022] In conventional systems, it can be difficult to accurately monitor the amount of fluid in the device chassis 102 because the device is immersed in the dielectric fluid, thereby offsetting or displacing the fluid. Furthermore, many devices have irregular geometries that can present additional challenges when attempting to monitor the amount of fluid, such as miscalculation of the fluid amount based solely on the fluid height. The inability to monitor the fluid amount can result in a failure to properly recognize and assess potential problems (e.g., fluid loss) and expose the immersed device 101 to risk exceeding acceptable operating temperatures. Furthermore, attempting to correct problems identified by inaccurate monitoring techniques can result in costly and wasteful use of dielectric fluid.

[0023] Presented herein are systems and methods for accurately monitoring the amount of dielectric fluid in a liquid submersion cooling system. In at least one embodiment, a high-resolution map of the amount of dielectric fluid in a chassis housing an electronic device is generated. More specifically, the amount of dielectric fluid is mapped with respect to the dielectric fluid height, allowing changes in amount to be accurately monitored, overall system performance to be evaluated, potential leaks to be identified, and operational costs to be reduced.

[0024] 2 illustrates an example of a liquid submersion cooling system 200. The liquid submersion cooling system 200 includes a level sensing module 202. In one embodiment, the level sensing module 202 is mounted within the device chassis 102, while in other embodiments, the level sensing module 202 can be mounted outside of the device chassis 102. In some embodiments, the level sensing module 202 can be shared among multiple device chassis and configured to provide similar functionality to each device chassis.

[0025] The level sensing module 202 can be in communication with a pump control module 112 of the pump assembly 108. In one embodiment, by communicating with the pump control module 112, the level sensing module 202 can control the operation of the pump 110. Similarly, the pump control module 112 can be in communication with the level sensing module 202 to provide information to the level sensing module 202. In some embodiments, the pump control module 112 can provide information to the level sensing module 112 such as pumping / flow rates and dielectric fluid parameters. In some embodiments, the level sensing module 202 can be configured to communicate with one or more pump control modules to control multiple pumps associated with different device chassis.

[0026] As described in more detail below, the level sensing module 202 controls the operation of the pump 110 and also obtains dielectric fluid height measurements from a level sensor to enable mapping and monitoring of the amount of dielectric fluid within the device chassis 102.

[0027] 3 illustrates a schematic of one embodiment of a liquid level assembly 300, which may be used, for example, as the level sensing module 202 in the liquid submersion cooling system 200 illustrated in FIG. 2. The liquid level assembly 300 includes a controller 302 and a fluid level sensor 304. In one embodiment, the fluid level sensor 304 is mounted to the controller 302, which is mounted to a mounting bracket 306 inside a device chassis (e.g., device chassis 102). In other embodiments, the fluid level sensor 304 may be mounted inside the device chassis 102 and the controller 302 may be located outside the device chassis 102.

[0028] In various embodiments, the controller 302 can include one or more general purpose computing processors, special purpose processors, or microcontrollers. The controller 302 can be specially programmed special purpose hardware, such as an application specific integrated circuit (ASIC), or more generally designed hardware, such as a field programmable gate array (FPGA) or general purpose processor. In some embodiments, the controller 302 can be connected to one or more memory devices, such as a disk drive, memory, flash memory, embedded or on-chip memory, or other devices for storing data. In some embodiments, the controller 302 can be one or more controllers that include one or more components, such as one or more processors.

[0029] The controller 302 can be configured to communicate with an external pump (e.g., pump 110) to deliver dielectric fluid to the device chassis 102. The controller 302 can store the volumetric flow rate of the pump 110 in memory and control the operation (e.g., starting and stopping) of the pump 110. The controller 302 can be configured to communicate with other devices and equipment, such as a user interface. In one embodiment, the controller 302 communicates with a user interface to allow a user to control the operation of the pump 110. In some examples, the controller 302 can be configured to communicate with an I 2 The controller 302 may be configured to communicate with devices and equipment using a communication protocol such as IEEE 802.11b, IEEE 802.11c, SPI, CANbus, or any other bidirectional protocol. In some embodiments, the controller 302 may communicate over a wired connection, including a wired network. In other embodiments, the controller 302 may communicate over a wireless connection, including a wireless network.

[0030] The controller 302 can be configured to communicate with the fluid level sensor 304 to receive measurements of the dielectric fluid height within the device chassis 102. In one embodiment, the fluid level sensor 304 includes a mechanical float and a strain gauge. A variable force is applied to the strain gauge attached to the float body that is immersed in the dielectric fluid, the magnitude of the variable force being dependent on the percentage of the float body that is immersed. In this manner, as the dielectric fluid flows into the device chassis 102, the fluid level increases around the stationary float and a buoyant force (i.e., a variable force) is applied to the strain gauge. The controller 302 can know the density of the dielectric fluid and can use this known density of the dielectric fluid to convert the buoyant force to a fluid height value. In one embodiment, the controller 302 can store the measured fluid height value in memory. In some embodiments, the controller 302 can send the measured fluid height value to another device or interface, such as a user interface.

[0031] In some embodiments, the liquid level assembly 300 can be configured to monitor the dielectric fluid level of a multi-device chassis housing multiple electronic devices. For example, the liquid level assembly 300 can be configured to monitor the dielectric fluid level of multiple device chassis disposed in an equipment rack (e.g., a server rack). Each device chassis in the equipment rack can have a fluid level sensor 304 connected to the controller 302, and the controller 302 can be configured to monitor the dielectric fluid level of each device chassis.

[0032] In some embodiments, the liquid level assembly 300 can include additional sensors. For example, the liquid level assembly 300 can include temperature sensors to measure the temperature of the dielectric fluid, the device chassis 102, and / or the device 101. In one embodiment, the controller 302 can know the thermophysical properties of the dielectric fluid and can combine the known thermophysical properties with the temperature sensor to improve the accuracy of the fluid level measurement. In some examples, the density of the dielectric fluid varies with temperature and the controller 302 can reduce or calibrate the value measured using the fluid level sensor 304. For example, a cooler, denser dielectric fluid can exert a greater buoyancy force on a strain gauge than a warmer, less dense dielectric fluid at the same fluid level.

[0033] In some embodiments, the liquid level assembly 300 can include a pressure sensor that measures the pressure of the dielectric fluid applied to the base of the device chassis 102. In some implementations, the controller 302 can use the pressure measurement to improve the accuracy of the fluid level measurement. In one embodiment, the pressure sensor can be an absolute pressure sensor, but in other embodiments the pressure sensor can be any other type of pressure sensor.

[0034] The embodiments described herein are not limited to any particular method of fluid level measurement, and the mechanical float-based approach described herein is presented merely as an example for illustrative purposes. For example, the fluid level sensor 304 may utilize a float, strain, light, ultrasonic, capacitive, or any other level sensing method. Various types of fluid level sensors and implementations of fluid level measurement may be used and are within the scope of the present invention.

[0035] In some embodiments, the fluid level can be acquired to generate a high-resolution map of the amount of dielectric fluid in a device chassis housing an electronic device. FIG. 4A is an illustration 400 of an example of a chassis (e.g., device chassis 102) housing a device (e.g., device 101) immersed in dielectric fluid. During initial filling, dielectric fluid can be delivered incrementally into device chassis 102, and the total fluid level can be measured after each successive delivery. For example, the fluid level of a first incremental amount of fluid 402 delivered into device chassis 102 can be measured, the combined fluid level of first incremental amount of fluid 402 and second incremental amount of fluid 404 delivered into device chassis 102 can be measured, and so on.

[0036] In one embodiment, each fluid increment can have a predetermined volume. In some embodiments, the volume of each fluid increment can be the same, while in other embodiments, the fluid increments can be different volumes. In one example, each fluid increment is delivered by running a pump (e.g., pump 110) for an amount of time corresponding to a predetermined volume and flow rate of the pump. In other examples, the fluid increment can be defined as a time interval, and the amount of fluid delivered during each interval can be determined from the flow rate of the pump. In some examples, the dielectric fluid can be pumped continuously into the device chassis 102, and the amount of fluid delivered into the device chassis 102 can be sampled continuously or at any time interval. The samples of the fluid volume can be used to define the fluid increment. For example, the fluid increment can be defined as the amount of fluid delivered into the device chassis 102 between two or more samples.

[0037] By measuring the total fluid level after each incremental delivery, the fluid height change (Δ h ) can be measured. h The value can be used to indicate the level of fluid displacement resulting from the device 101 being submerged within the device chassis 102. For example, Δ h The value corresponds to the fluid increment amount 404, Δ h Each fluid increment occupies a volumetric area within the device chassis 102, and each Δ h The values ​​can be used to determine each area proximate to the immersed device 101 .

[0038] 4B is an exemplary data table 420 of measurements and calculations from an initial fill of the device chassis 102. Column 422 shows each fluid increment shown in FIG. 4A. Column 424 shows the amount of each fluid increment delivered into the device chassis 102. Column 426 shows the fluid level measured after each fluid increment is delivered. Column 428 shows the fluid height change (Δ hIn one embodiment, the Δ h The value can be calculated by subtracting the total measured fluid level before delivery from the total measured fluid level after delivery. Column 430 shows the total amount of fluid in the device chassis 102 after delivery of each fluid increment. In some embodiments, the total amount of fluid can be calculated by cumulatively adding the amount delivered into the device chassis 102 for each corresponding fluid increment (i.e., the cumulative sum of column 424).

[0039] The calculated Δ shown in column 428 h The values ​​can be used to generate a high resolution map of the amount of dielectric fluid in the device chassis 102. FIG. 4C shows an example of a digital map 440 of the device chassis 102. The digital map 440 can provide an authentic representation of the amount of dielectric fluid in the device chassis 102, including the immersed device 101. The digital map 440 can map the amount of dielectric fluid against the dimensions (length, width, height) of the device chassis 102. In one embodiment, the Δ h The values ​​can be correlated to density levels within the device chassis 102 and can be represented by a digital map 440. The color gradation (or gray scale) of the digital map 440 indicates the density level per increment, with darker areas indicating higher density (high Δ h ), and the bright areas indicate low density (low Δ h ) A high density indicates that the fluid incremental volume area is partially occupied by the immersed device 101. Similarly, a low density indicates that the fluid incremental volume area is not immediately adjacent to the immersed device 101.

[0040] Alternatively, in some embodiments, the dielectric fluid can be delivered in predetermined height increments during the initial filling of the device chassis 102, and the amount of fluid for each increment can be determined by monitoring the timing and flow rate of the pump. In one example, the dielectric fluid height in the device chassis 102 is adjusted to a predetermined or expected fluid height change (Δ h) can be measured to detect the amount of fluid that has been added to the fluid height increment (column 428). FIG. 4D is an example data table 460 of values ​​measured and calculated from an initial fill of the device chassis 102 using a given fluid height increment (column 428). The calculated fluid volume increments shown in column 424 of data table 460 can be used to generate a high resolution map of the dielectric fluid volume within the device chassis 102 similar to digital map 440. In one embodiment, the increment values ​​in column 424 of data table 460 can be correlated to density levels within the device chassis 102 and shown by the digital map. For example, high density areas correspond to low increment values ​​and low density areas correspond to high increment values.

[0041] A visual representation of the digital map 440 is provided herein for illustrative purposes. In some embodiments, the digital map 440 can be stored in a memory device, such as a memory device of the controller 302. In some embodiments, a visual representation of the digital map 440 (e.g., FIG. 4C ) can be generated and provided to a user interface. Generating the digital map 440 of the amount of dielectric fluid can improve the accuracy of monitoring the dielectric fluid within the device chassis 102.

[0042] 5 is a flow chart illustrating a process 500 for monitoring a fluid volume in a liquid submersion cooling system, such as liquid submersion cooling system 200. In one embodiment, process 500 can utilize a level sensing module 202 to generate a digital map of the dielectric fluid volume and monitor the dielectric fluid. Level sensing module 202 can be, for example, liquid level assembly 300 (shown in FIG. 3).

[0043] In step 502, the controller 302 receives a command to start an initial fill of the dielectric fluid into the device chassis 102. In one embodiment, a user may start the initial fill process via a user interface. In other embodiments, the initial fill process may be started automatically using a sensor, a timer, etc. In step 504, after receiving the command to start the initial fill process, the controller 302 communicates with the pump assembly 108 via the pump control module 112 and controls the pump 110 to start.

[0044] In step 506, the pump 110 delivers a first incremental amount of dielectric fluid into the device chassis 102. The controller 302 monitors the pump 110 to determine when the first incremental amount of dielectric fluid has been delivered to the device chassis 102. In one embodiment, the controller 302 can be provided with a volumetric flow rate of the pump 110 and can use the volumetric flow rate to determine the amount of fluid delivered into the device chassis 102 based on the run time of the pump 110. In another embodiment, the controller 302 can be in communication with a flow rate sensor configured to measure the volumetric flow rate of the pump 110 to determine the amount of fluid delivered into the device chassis 102.

[0045] After the controller 302 determines that the first incremental amount of dielectric fluid has been delivered into the device chassis 102 in step 508, the controller 302 measures the dielectric fluid height in the device chassis 102 using the fluid level sensor 304. In step 510, the controller 302 stores the measured fluid height level and the amount of fluid delivered into the device chassis 102. In one embodiment, the controller 302 may maintain a database or data table (e.g., data table 420) of the stored measurements. The controller 302 then checks whether the measured fluid height level in step 512 is at a maximum fluid height level. In one embodiment, the maximum fluid height level may be determined based on the position of the fluid level sensor 304 in the device chassis 102. In some embodiments, the device chassis 102 may be entirely filled with dielectric fluid and the maximum fluid height level may be a dimension of the device chassis 102 (e.g., chassis height). In other embodiments, the maximum fluid height level may be provided to the controller 302 by a user. If the measured fluid height level is the maximum fluid height level, then in step 514 the pump 110 is controlled to stop, otherwise the controller 302 returns to step 506 and delivers a second incremental amount of dielectric fluid to the device chassis 102.

[0046] The steps of delivering each incremental amount of dielectric fluid to the device chassis 102 and measuring the corresponding fluid height level after each successive delivery are repeated until a maximum fluid height level is reached and the pump 110 is stopped at step 514. By storing the measured fluid height and total fluid volume in the device chassis 102 after each delivery of a predetermined amount, the controller 302 determines the fluid height change (Δ h The controller 302 can calculate the calculated Δ h The value can be used to generate a digital map (e.g., digital map 440) of the amount of dielectric fluid within the device chassis 102. In one embodiment, the calculated Δ hThe value can be correlated to a density level within the device chassis 102. For example, a low Δ h values ​​correspond to low density regions of the device chassis 102, i.e., regions not occupied by the immersed devices 101. Similarly, high Δ h The values ​​correspond to the dense area of ​​the device chassis 102, ie the area occupied by the immersed device 101.

[0047] After the device chassis 102 is filled and the controller 302 generates the digital map 440, the controller 302 monitors the dielectric fluid in the device chassis 102. In step 516, the controller 302 measures the height of the dielectric fluid in the device chassis 102 using the fluid level sensor 304. In step 518, the processor 302 records the measured fluid level and can use the digital map 440 to determine additional parameters. For example, the controller 302 can use the measured fluid level and the digital map 440 to determine the current amount of dielectric fluid in the device chassis 102. In some implementations, the controller 302 can use the measured fluid level, the digital map 440, and a property of the dielectric fluid (e.g., temperature) to determine additional parameters such as the current mass of dielectric fluid in the device chassis 102. In some embodiments, the controller 302 can provide the measured fluid level and / or additional fluid parameters to be displayed on a user interface.

[0048] In step 520, the controller 302 checks whether the measured fluid level is acceptable. In one embodiment, the controller 302 can use the digital map 440 to determine whether the measured fluid level is acceptable. For example, the controller 302 can identify that the measured fluid level indicates a loss of dielectric fluid. The controller 302 can use the digital map 440 of the device chassis 102 to assess the risk or urgency associated with the dielectric fluid loss. The digital map 440 can indicate that the dielectric fluid loss corresponds to a loss in a low density area, i.e., an area that is not in the immediate vicinity of the submerged device 101. In some embodiments, such an indication can be without requiring a response. However, the digital map 440 can indicate that the dielectric fluid loss corresponds to a loss in a high density area, i.e., an area near the submerged device 101, and this indication can be without requiring a response to prevent the submerged device 101 from exceeding an acceptable operating temperature. In step 522 , the controller 302 issues an alert in response to determining that the fluid level is unacceptable, otherwise returning to step 516 where the controller 302 continues monitoring the dielectric fluid within the device chassis 102 .

[0049] As discussed above, in additional embodiments, the dielectric fluid may be delivered in predetermined height increments during the initial filling of the device chassis 102, and the amount of fluid for each increment may be determined by monitoring the timing and flow rate of the pump. In this manner, the process 500 of FIG. 5 may be adapted accordingly. For example, in step 506, the pump 110 delivers the dielectric fluid to the device chassis 102. In step 508, the controller 302 may measure the height of the dielectric fluid in the device chassis 102 using the fluid level sensor 304 to determine when a first incremental amount of dielectric fluid has been delivered into the device chassis 102. After the controller 302 determines that the first incremental amount of dielectric fluid has been delivered into the device chassis 102, the controller 302 may calculate or measure the amount of the first incremental amount of dielectric fluid. In one embodiment, the controller 302 can provide a volumetric flow rate of the pump 110 and can use the volumetric flow rate to determine the amount of fluid pumped into the device chassis 102 based on the run time of the pump 110. In another embodiment, the controller 302 can be in communication with a flow rate sensor configured to measure the volumetric flow rate of the pump 110 to determine the amount of fluid pumped into the device chassis 102.

[0050] In step 510, the controller 302 may store the calculated / measured amount of dielectric fluid delivered into the device chassis 102 and the measured fluid height level. In one embodiment, the controller 302 may maintain a database or data table (data table 460) of the stored measurements. The controller 302 may then check whether the measured fluid height level is the maximum fluid height level in step 512. If the measured fluid height level is the maximum fluid height level, the controller 302 may control the pump 110 to stop in step 514, otherwise the controller 302 may return to step 506 and deliver a second incremental amount of dielectric fluid to the device chassis 102. The process of delivering incremental amounts of dielectric fluid to the device chassis 102 and calculating / measuring the corresponding fluid volume after each successive delivery repeats in step 514 until the maximum fluid height level is reached and the pump 110 is stopped. The controller 302 can use the calculated / measured quantity values ​​to generate a digital map (eg, digital map 440 ) of the dielectric fluid volume within the device chassis 102 .

[0051] 6 is a flow chart illustrating another exemplary embodiment for monitoring fluid volume in a liquid submersion cooling system (e.g., liquid submersion cooling system 200). In one embodiment, process 500 can utilize level sensing module 202 to generate a digital map of the dielectric fluid volume and monitor the dielectric fluid. Level sensing module 202 can be, for example, liquid level assembly 300 (shown in FIG. 3).

[0052] In step 602, the controller 302 receives a command to begin an initial fill of the dielectric fluid into the device chassis 102. In step 604, after receiving the command to begin the initial fill process, the controller 302 communicates with the pump assembly 108 via the pump control module 112 and controls the pump 110 to start. In step 606, the controller 302 measures the height of the dielectric fluid in the device chassis 102 using the fluid level sensor 304.

[0053] At step 610, the controller 302 stores the measured height level and amount of fluid delivered within the device chassis 102. The controller 302 uses the stored fluid height to generate and / or update a digital map (e.g., digital map 440) to represent the amount of dielectric fluid within the device chassis 102. At step 610, the controller 302 checks the digital map 440 to see if the level of dielectric fluid within the device chassis 102 is acceptable. At step 612, the controller 302 issues an alert in response to determining that the fluid level is unacceptable, otherwise returning to step 606 where the controller 302 continues measuring the dielectric fluid height within the device chassis 102.

[0054] Both processes 500 and 600 describe generating a digital map 440 to represent the amount of dielectric fluid and utilizing the digital map 440 to monitor the dielectric fluid within the device chassis 102. The digital map 440 provides a representation of the amount of dielectric fluid within the device chassis 102 that takes into account the amount of fluid displacement due to the immersed device 101. By utilizing the digital map 440 to monitor the dielectric fluid, fluid loss can be accurately detected and the need for any corrective action can be determined and initiated.

[0055] In some embodiments, the digital map 440 can be updated during dielectric fluid monitoring. The controller 302 can be configured to update the digital map 440 to account for expected variations in fluid volume based on known properties of the fluid. For example, the controller 302 can receive or detect a fluid temperature and adjust the digital map 440 to account for thermal expansion / contraction of the fluid within the device chassis 102. Such adjustments can improve the accuracy of the fluid monitoring and reduce the likelihood of performing unnecessary corrective actions that result in wasteful use of dielectric fluid. In some embodiments, the controller 302 can further account for environmental parameters, such as the temperature of the environment in which the liquid submersion cooling system 200 is located, during generation of the digital map 440.

[0056] Additionally, in various embodiments, the controller 302 can track the performance of the dielectric fluid over time. For example, the controller 302 can report performance metrics such as total fluid loss, fluid temperature, fluid volume fluctuations, etc. to other devices or interfaces, such as a user interface. In some embodiments, the controller 302 can log the occurrence of events, such as corrective actions, and can monitor the dielectric fluid performance to evaluate the impact or effectiveness of the corrective actions.

[0057] As mentioned above, systems and methods are described herein for accurately monitoring the volume of dielectric fluid within a liquid submersion cooling system. A high resolution map of the volume of dielectric fluid within a chassis housing an electronic device can be generated and utilized to monitor the dielectric fluid. By mapping the volume of dielectric fluid versus the height of the dielectric fluid, volume changes can be accurately monitored to assess overall system performance, identify potential leaks, and reduce operational costs.

[0058] Having described several aspects of at least one embodiment of the invention, it should be understood that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and to be within the spirit and scope of the invention. Accordingly, the foregoing description and drawings are merely illustrative. [Explanation of symbols]

[0059] 100 Liquid Immersion Cooling System 101 Devices 102 Device Chassis 103 Internal Pump 104 Heat exchanger 106 Fluid Reservoir 108 Pump Assembly 110 Pump 112 Pump Control Module 150 Liquid Immersion Cooling System 202 Level Sensing Module 302 Controller 304 Fluid Level Sensor 306 Mounting bracket

Claims

1. 1. A liquid submersion cooling system having a device chassis housing an electronic device, the liquid submersion cooling system comprising: A fluid level sensor; a controller coupled to the fluid level sensor, receiving a signal from a fluid level sensor indicative of a height of dielectric fluid within the device chassis; receiving a signal from a pump controller indicative of the amount of dielectric fluid being delivered to the device chassis; and generating a map of the amount of dielectric fluid within the device chassis based on a signal from the fluid level sensor and a signal from the pump controller; The controller configured to: a heat exchanger configured to receive a dielectric fluid from the device chassis, convert the dielectric fluid to a gaseous form, cool the dielectric fluid while it is in gaseous form, return the dielectric fluid to a liquid form after cooling, and supply the dielectric fluid to a pump, the pump being controlled by the pump controller; A liquid submersion cooling system comprising:

2. 10. The liquid submersion cooling system of claim 1, further comprising a mounting bracket coupled to the controller and the fluid level sensor, the mounting bracket configured to mount to the device chassis.

3. 10. The liquid submersion cooling system of claim 1, wherein the controller is configured to selectively send a dielectric fluid loss alert based on a signal from the fluid level sensor.

4. 10. The liquid submersion cooling system of claim 1, wherein the controller is configured to receive a signal from a temperature sensor indicative of a temperature of a dielectric fluid within the device chassis.

5. 10. The liquid submersion cooling system of claim 1, wherein the controller is configured to use a temperature of a dielectric fluid to determine a mass of a dielectric fluid within the device chassis.

6. 2. The liquid submersion cooling system of claim 1, wherein the controller is configured to update the map of dielectric fluid volume to compensate for at least one of expansion or contraction of the dielectric fluid based on a temperature of the dielectric fluid.

7. 1. A non-transitory computer readable medium storing a computer-executable sequence of instructions for monitoring a volume of a dielectric fluid in a liquid submersion cooling system having a device chassis housing an electronic device, the computer-executable sequence of instructions including: directing the device to transmit at least one first command to deliver a first quantity of dielectric fluid into the device chassis and to measure a first height of the dielectric fluid within the device chassis; directing the device to transmit at least one second command to deliver a second quantity of dielectric fluid into the device chassis and to measure a second height of the dielectric fluid within the device chassis; generating a map of the amount of dielectric fluid within the device chassis based on the first and second volumes and the first and second heights. commanding a measurement of the total dielectric fluid height within the device chassis; and commanding selectively transmitting an alert of dielectric fluid loss based on a comparison of the total dielectric fluid height to the map of dielectric fluid volume. converting the dielectric fluid to a gaseous form, cooling the dielectric fluid while it is in gaseous form, converting the dielectric fluid back to a liquid form after cooling, and sending a command to supply the dielectric fluid to a pump.

16. A non-transitory computer readable medium comprising instructions for:

8. 8. The non-transitory computer readable medium of claim 7, wherein the first and second quantities of dielectric fluid occupy first and second regions within the device chassis, respectively.

9. 9. A non-transitory computer-readable medium as described in claim 8, wherein the sequence of instructions includes instructions for causing at least one processor to recognize which of the first and second regions are affected by the dielectric fluid loss based on a comparison of the total dielectric fluid height to a map of the dielectric fluid volume.

10. 10. The non-transitory computer readable medium of claim 9, wherein the sequences of instructions include instructions for causing at least one processor to send a dielectric fluid loss alert if the dielectric fluid loss is affecting the first region.

11. The non-transitory computer readable medium of claim 7 , wherein the sequences of instructions include instructions for causing at least one processor to measure a temperature of the dielectric fluid within the device chassis.

12. 12. The non-transitory computer readable medium of claim 11, wherein the sequences of instructions include instructions for causing at least one processor to determine a mass of the dielectric fluid within the device chassis using a temperature of the dielectric fluid.

13. A device chassis for use in a liquid submersion cooling system, An electronic device; 1. A level sensing module having a fluid level sensor and a controller coupled to the fluid level sensor, the controller comprising: receiving a signal from a fluid level sensor indicative of a height of dielectric fluid within the device chassis; receiving a signal from a pump controller indicative of the amount of dielectric fluid being delivered to the device chassis; and generating a map of the amount of dielectric fluid within the device chassis based on a signal from the fluid level sensor and a signal from the pump controller; the level sensing module, a heat exchanger configured to receive a dielectric fluid from the device chassis, convert the dielectric fluid to a gaseous form, cool the dielectric fluid while it is in gaseous form, return the dielectric fluid to a liquid form after cooling, and supply the dielectric fluid to a pump, the pump being controlled by the pump controller; A device chassis comprising:

14. The device chassis of claim 13, further comprising a mounting bracket coupled to the level sensing module.

15. The device chassis of claim 13 , wherein the controller is further configured to selectively send a dielectric fluid loss alert based on a signal from the fluid level sensor.

16. The device chassis of claim 13 , wherein the controller is further configured to receive a signal from a temperature sensor indicative of a temperature of a dielectric fluid within the device chassis.

17. The device chassis of claim 16, wherein the controller is further configured to use a temperature of the dielectric fluid to determine a mass of the dielectric fluid within the device chassis.

18. 17. The device chassis of claim 16, wherein the controller is further configured to update the map of dielectric fluid volume to compensate for expansion and / or contraction of the dielectric fluid based on a temperature of the dielectric fluid.

Images