Packaging films, packaging bags and packaging products

Abstract

To provide: a packaging film capable of having excellent gas barrier properties while inhibiting the reduction in the ratio of a polyolefin-based resin in the entire packaging film; and a packaging bag and a packaging product.SOLUTION: The packaging film includes a gas barrier film, an adhesive layer and a sealant layer in this order. The gas barrier film has a substrate layer and a deposited layer, where the substrate layer has: a polyolefin-based substrate layer containing a polyolefin-based resin; and a heat-resistant layer. The heat-resistant layer includes a high-melting-point resin having a melting point equal to or higher than 180°C. The adhesive layer can be obtained by bonding an adhesive resin composition containing a polyolefin-based adhesive resin to a gas barrier film through melt extrusion. The sealant layer contains a polyolefin-based resin.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to packaging films, packaging bags, and packaging products. [Background technology]

[0002] In recent years, packaging films have been increasingly made of monomaterials to facilitate material recycling, but packaging films are also required to maintain their functionality, such as gas barrier properties. In response to this, a packaging film can be considered in which a gas barrier film, which is formed by providing a gas barrier layer by vapor deposition on a polyolefin-based base layer containing a polyolefin-based resin, and a polyolefin-based sealant layer containing a polyolefin-based resin are bonded together by dry lamination using an adhesive capable of forming a non-polyolefin-based resin. However, such packaging films use adhesives that can form non-polyolefin resins, which reduces the quality of the recycled resin obtained by material recycling of the packaging films. Therefore, in order to suppress deterioration in the quality of the recycled resin, a laminate is known in which an adhesive resin composition containing a polyolefin-based adhesive resin such as maleic anhydride graft-polymerized polypropylene is used as an adhesive layer instead of an adhesive that can form a non-polyolefin-based resin (see Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-049679 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, although the laminate described in Patent Document 1 can increase the proportion of polyolefin resin in the entire laminate, there is still room for improvement in terms of gas barrier properties.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide a packaging film, a packaging bag, and a packaging product that can have excellent gas barrier properties while suppressing a decrease in the ratio of polyolefin-based resin in the entire packaging film. [Means for solving the problem]

[0006] In order to solve the above problems, one aspect of the present disclosure provides a packaging film comprising a gas barrier film, an adhesive layer, and a sealant layer in this order, wherein the gas barrier film has a base layer and a deposition layer, the base layer has a polyolefin-based base layer containing a polyolefin-based resin, and a heat-resistant layer, the heat-resistant layer contains a high-melting point resin having a melting point of 180°C or higher, the adhesive layer is obtained by bonding an adhesive resin composition containing a polyolefin-based adhesive resin to the gas barrier film by melt extrusion, and the sealant layer contains a polyolefin-based resin. The packaging film described above can have excellent gas barrier properties while suppressing a decrease in the proportion of polyolefin resin in the entire packaging film.

[0007] The inventors of the present disclosure speculate that the reason why the above effects are obtained is as follows. That is, when an adhesive resin composition containing a polyolefin adhesive resin is laminated to a gas barrier film by melt extrusion, the heat of the adhesive resin composition is transferred to the base layer through the deposition layer. The polyolefin adhesive resin composition is at a high temperature when it contacts the gas barrier film, but is then cooled by a cooling roll to a low temperature. Accordingly, the polyolefin base layer tries to shrink after expanding. At this time, the heat-resistant layer containing a high-melting point resin having a melting point of 180°C or more contained in the base layer suppresses the expansion of the polyolefin base layer due to heat, and therefore the shrinkage due to cooling is also suppressed, and as a result, the expansion and contraction of the deposition layer, which is prone to cracking, is suppressed. As a result, it becomes possible for the packaging film to have excellent gas barrier properties. Furthermore, the base layer has a heat-resistant layer in addition to the polyolefin-based base layer, and the heat-resistant layer contains a high-melting point resin having a melting point of 180° C. or higher, so that even though the heat-resistant layer is thin, it can effectively suppress the expansion and contraction of the polyolefin-based base layer, thereby suppressing a decrease in the ratio of polyolefin-based resin in the entire packaging film.

[0008] In the packaging film, the heat-resistant layer is preferably provided on the vapor-deposited layer side of the polyolefin-based substrate layer. In this case, since a heat-resistant layer is disposed between the vapor deposition layer and the polyolefin-based substrate layer, even if the polyolefin-based substrate layer attempts to expand and contract after the adhesive resin composition is bonded to the gas barrier film by melt extrusion to form an adhesive layer, the expansion and contraction of the heat-resistant layer is sufficiently suppressed, so that the fragile vapor deposition layer is further prevented from expanding and contracting, enabling the packaging film to have better gas barrier properties.

[0009] In the packaging film, the polyolefin-based substrate layer is preferably a stretched film. In this case, the crystallinity of the polyolefin-based base layer and the heat-resistant layer contained in the base layer is improved, and the melting point can be increased, so that the melting point difference between the sealant layer and the base layer can be increased, making it easier to prevent the base layer from melting when the packaging film is heat-sealed.

[0010] In the packaging film, the high melting point resin of the heat-resistant layer preferably contains a polyamide resin. Because the polyamide resin has a high melting point, even if the polyolefin-based base layer attempts to expand and contract after the adhesive resin composition is bonded to the gas barrier film by melt extrusion, the expansion and contraction of the heat-resistant layer is more sufficiently suppressed, and the expansion and contraction of the fragile deposition layer is further suppressed, allowing the packaging film to have even better gas barrier properties.

[0011] In the packaging film, the heat-resistant layer preferably contains a high-melting point resin having a melting point of 185° C. or higher. In this case, even if the polyolefin-based base layer tries to expand and contract after the adhesive resin composition is laminated to the gas barrier film by melt extrusion, the expansion and contraction of the heat-resistant layer is more sufficiently suppressed, and the fragile deposition layer is further prevented from expanding and contracting, so that the packaging film can have even better gas barrier properties. In addition, according to the packaging film, since the heat-resistant layer contains a high-melting point resin having a melting point of 185°C or more, the deterioration of the gas barrier properties can be suppressed even after moist heat treatment such as retort treatment or boiling treatment.

[0012] In the packaging film, it is preferable that the ratio of the thickness of the heat-resistant layer to the thickness of the gas barrier film is 50% or less. In this case, the proportion of polyolefin resin in the entire packaging film can be increased, and the recycling suitability of the packaging film can be improved.

[0013] In the above packaging film, it is preferable that the gas barrier film further includes an anchor coat layer containing a polyurethane resin between the deposition layer and the base layer. In this case, even if the polyolefin-based base layer expands and contracts after the adhesive resin composition is bonded to the gas barrier film by melt extrusion, the anchor coat layer containing a polyurethane resin tends to alleviate the expansion stress and contraction stress transmitted from the base layer to the deposition layer, thereby further suppressing the expansion and contraction of the deposition layer, which is prone to cracking, and enabling the packaging film to have even better gas barrier properties.

[0014] In the packaging film, it is preferable that the gas barrier film further includes a coating layer between the deposition layer and the polyolefin-based adhesive resin layer, the coating layer coating the deposition layer. In this case, after the adhesive resin composition is bonded to the gas barrier film by melt extrusion, when the adhesive resin composition expands and contracts, the expansion stress and contraction stress are not transmitted directly to the vapor deposition layer, but are transmitted indirectly via the coating layer, thereby suppressing the expansion and contraction of the vapor deposition layer.

[0015] Another aspect of the present disclosure provides a packaging bag comprising the packaging film described above. The packaging bag includes the packaging film described above, and the packaging film makes it possible to have excellent gas barrier properties while suppressing a decrease in the ratio of polyolefin-based resin in the entire packaging film. Therefore, the packaging bag makes it possible to have excellent gas barrier properties while suppressing a decrease in the ratio of polyolefin-based resin in the entire packaging bag.

[0016] Yet another aspect of the present disclosure provides a packaging product including the packaging bag described above and contents contained within the packaging bag. The packaging product includes the packaging bag described above, and the packaging bag has excellent gas barrier properties while suppressing a decrease in the ratio of polyolefin resin in the entire packaging bag. Therefore, the packaging product can be easily recycled after opening and can also suppress deterioration of the quality of the contents. Effect of the Invention

[0017] According to the present disclosure, there are provided a packaging film, a packaging bag, and a packaged product that are capable of exhibiting excellent gas barrier properties while suppressing a decrease in the proportion of polyolefin-based resin in the entire packaging film. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 is a cross-sectional view showing one embodiment of a packaging film of the present disclosure. [Diagram 2] FIG. 1 is a cross-sectional view illustrating one embodiment of a packaging product of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, embodiments of the present disclosure will be described in detail. However, the present invention is not limited to the following embodiments.

[0020] <Packaging film> First, an embodiment of the packaging film of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view showing one embodiment of the packaging film of the present disclosure.

[0021] 1 includes, in this order, a gas barrier film 10, an adhesive layer 60, and a sealant layer 70. The gas barrier film 10 includes a base layer 20 and a deposition layer 40. The base layer 20 includes a polyolefin base layer 21 containing a polyolefin resin, and a heat-resistant layer 22. The heat-resistant layer 22 contains a high-melting-point resin having a melting point of 180° C. or higher. The adhesive layer 60 is obtained by laminating an adhesive resin composition containing a polyolefin-based adhesive resin to the gas barrier film 10 by melt extrusion. The sealant layer 70 includes a polyolefin resin. The packaging film 100 may further include an anchor coat layer 30 between the deposition layer 40 and the base layer 20. The packaging film 100 may further include a coating layer 50 between the deposition layer 40 and the adhesive layer 60, which coats the deposition layer 40.

[0022] According to the packaging film 100, it is possible to suppress a decrease in the ratio of the polyolefin resin in the entire packaging film 100, while at the same time providing excellent gas barrier properties.

[0023] The gas barrier film 10, the adhesive layer 60 and the sealant layer 70 will be described in detail below.

[0024] (1) Gas barrier film The gas barrier film 10 has a substrate layer 20 and a deposition layer 40, and the substrate layer 20 has a polyolefin substrate layer 21 containing a polyolefin resin, and a heat-resistant layer 22. The substrate layer 20 may further have an adhesive layer (hereinafter also referred to as a "substrate adhesive layer") between the polyolefin substrate layer 21 and the heat-resistant layer 22, as necessary. In addition, the gas barrier film 10 may further have a printed layer, as necessary.

[0025] (Polyolefin-based base layer) The polyolefin-based substrate layer 21 contains a polyolefin-based resin. Specific examples of the polyolefin-based resin include a polyethylene-based resin and a polypropylene-based resin. Examples of polyethylene resins include low-density polyethylene resin (LDPE), medium-density polyethylene resin (MDPE), linear low-density polyethylene resin (LLDPE), ethylene-vinyl acetate copolymer (EVA), ethylene-α-olefin copolymer, and ethylene-(meth)acrylic acid copolymer. Examples of polypropylene resins include homopolypropylene, block polypropylene, random polypropylene, and propylene-α-olefin copolymers, etc. Examples of α-olefins include ethylene, 1-butene, etc. Among these, polypropylene-based resins are preferred from the viewpoint of heat resistance. Among polypropylene-based resins, when emphasis is placed on the rigidity and heat resistance of the packaging bag obtained by using the packaging film 100, it is preferable to use a homopolymer. The polyolefin resin may be a biomass-derived polyolefin resin or a mechanically recycled or chemically recycled polyolefin resin.

[0026] The polyolefin-based substrate layer 21 may have a single-layer structure or a multi-layer structure. By providing the base layer 20 with the polyolefin-based base layer 21, the heat resistance and oil resistance of the packaging film 100 produced using the base layer 20 can be improved.

[0027] The polyolefin-based base layer 21 may be a stretched film or a non-stretched film, but is preferably a stretched film from the viewpoint of gas barrier properties. Examples of the stretched film include a uniaxially stretched film and a biaxially stretched film, and a biaxially stretched film is preferred because it improves the heat resistance of the packaging film 100.

[0028] The content of the polyolefin resin in the polyolefin base layer 21 is preferably 70% by mass or more, more preferably 80% by mass or more, and even more preferably 90% by mass or more.

[0029] The polyolefin-based base layer 21 may contain additives as necessary, such as crosslinking agents, antioxidants, antiblocking agents, slip agents, UV absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents, pigments, and modifying resins.

[0030] The thickness of the polyolefin-based base layer 21 is preferably 5 μm or more, and more preferably 10 μm or more. By making the thickness of the polyolefin-based base layer 21 5 μm or more, the strength and heat resistance of the base layer 20 can be further improved. The thickness of the polyolefin-based base layer 21 is preferably 40 μm or less, and more preferably 30 μm or less. By making the thickness of the polyolefin-based base layer 21 40 μm or less, the processability of the base layer 20 can be further improved, and flexibility can be imparted to the packaging film 100.

[0031] The polyolefin-based substrate layer 21 may be subjected to a surface treatment, which can improve adhesion to the heat-resistant layer 22. The method of the surface treatment is not particularly limited, and examples thereof include corona discharge treatment, ozone treatment, low-temperature plasma treatment, glow discharge treatment, and oxidation treatment using chemicals.

[0032] (Heat-resistant layer) The heat-resistant layer 22 contains a high-melting point resin having a melting point of 180° C. or higher. This makes it difficult for the adhesive resin composition to expand and contract even when the adhesive resin composition is bonded to the gas barrier film 10 by melt extrusion and the heat of the adhesive resin composition is transferred to the base layer 20 via the deposition layer 40 and the base layer 20 is then cooled. This makes it possible to suppress the expansion and contraction of the polyolefin-based base layer 21 and to suppress the expansion and contraction of the easily cracked deposition layer 40. As a result, the packaging film 100 can have excellent gas barrier properties. 1, the heat-resistant layer 22 may be provided on the deposition layer 40 side of the polyolefin-based substrate layer 21, or may be provided on the deposition layer 40 side of the polyolefin-based substrate layer 21, but is preferably provided on the deposition layer 40 side of the polyolefin-based substrate layer 21. In this case, since the heat-resistant layer 22 is disposed between the deposition layer 40 and the polyolefin-based substrate layer 21, even if the polyolefin-based substrate layer 21 tries to expand and contract after the adhesive resin composition is bonded to the gas barrier film 10 by melt extrusion to form the adhesive layer 60, the expansion and contraction of the heat-resistant layer 22 is sufficiently suppressed, so that the fragile deposition layer 40 is further suppressed from expanding and contracting, and the packaging film 100 can have better gas barrier properties.

[0033] The melting point of the high melting point resin is more preferably 185° C. or higher, further preferably 190° C. or higher, and particularly preferably 205° C. or higher. When the melting point of the high melting point resin is 185°C or higher, even if the polyolefin-based base layer 21 tries to expand and contract after the adhesive resin composition is bonded to the gas barrier film 10 by melt extrusion, the expansion and contraction of the heat-resistant layer 22 is more sufficiently suppressed, and the expansion and contraction of the fragile deposition layer 40 is further suppressed, enabling the packaging film 100 to have even better gas barrier properties. Furthermore, according to the packaging film 100, since the heat-resistant layer 22 contains a high melting point resin having a melting point of 185°C or higher, deterioration of the gas barrier properties can be suppressed even after moist heat treatment such as retort treatment or boiling treatment. From the viewpoint of film-forming properties of the heat-resistant layer 22, the melting point of the high-melting point resin is preferably 265° C. or lower, more preferably 260° C. or lower, and even more preferably 250° C. or lower.

[0034] The high melting point resin may be any resin having a melting point of 180° C. or higher, and examples of the high melting point resin include vinyl resins, polyamide resins, polyimide resins, polyester resins, cellulose resins, etc. These may be used alone or in combination of two or more.

[0035] Among these, polyester resin or polyamide resin is preferable. Since these resins have a polar group, the adhesion between the heat-resistant layer 22 and the vapor-deposited layer 40 can be significantly improved, and the gas barrier property of the vapor-deposited layer 40 can be effectively improved.

[0036] Examples of vinyl resins include ethylene vinyl alcohol (EVOH), etc. The ethylene content (mol%) in EVOH is preferably low, for example, 35 mol% or less, and preferably 32 mol% or less.

[0037] Examples of polyester resins include polyethylene terephthalate resin (PET) and polyethylene naphthalate resin (PEN).

[0038] Examples of polyamide resins include nylon 6, nylon 6,6, MXD nylon, and amorphous nylon.

[0039] The high melting point resin is preferably a polyamide resin. Since the melting point of the polyamide resin is high, even if the polyolefin-based base layer 21 expands and contracts after the adhesive resin composition is bonded to the gas barrier film 10 by melt extrusion, the expansion and contraction of the heat-resistant layer 22 is more sufficiently suppressed, and the fragile deposition layer 40 is further suppressed from expanding and contracting, so that the packaging film 100 can have even better gas barrier properties. In addition, even after the packaging film 100 is bent, the deterioration of the gas barrier properties of the packaging film 100 can be suppressed, and the heat resistance of the packaging film 100 can be improved. Furthermore, the deterioration of the gas barrier properties of the packaging film 100 can be suppressed even after the packaging film 100 is subjected to a moist heat treatment such as a retort treatment or a boiling treatment. As the high melting point resin, nylon 6 is more preferable.

[0040] The content of the high melting point resin in the heat-resistant layer 22 is preferably 70% by mass or more, more preferably 80% by mass or more, and even more preferably 90% by mass or more.

[0041] The thickness of the heat-resistant layer 22 is preferably 1 μm or more. When the thickness of the heat-resistant layer 22 is 1 μm or more, expansion or contraction of the polyolefin-based base layer 21 can be effectively suppressed when the base layer 20 is heated or cooled. The thickness of the heat-resistant layer 22 is preferably 10 μm or less, and more preferably 5 μm or less. By making the thickness of the heat-resistant layer 22 20 μm or less, the ratio of the polyolefin resin in the entire packaging film 100 can be increased, and the recyclability of the packaging film 100 can be improved.

[0042] In the packaging film 100, the ratio of the thickness of the heat-resistant layer 22 to the thickness of the gas barrier film 10 is preferably 50% or less, and more preferably 25% or less. When the ratio of the thickness of the heat-resistant layer 22 to the thickness of the gas barrier film 10 is 50% or less, the ratio of polyolefin-based resin in the entire packaging film 100 can be increased, and the recyclability of the packaging film 100 can be improved. In the packaging film 100, the ratio of the thickness of the heat-resistant layer 22 to the thickness of the gas barrier film 10 may be 2.5% or more, 3.0% or more, or 5.0% or more. When the ratio of the thickness of the heat-resistant layer 22 to the thickness of the gas barrier film 10 is 5.0% or more, expansion or contraction of the polyolefin-based base layer 21 can be effectively suppressed when the base layer 20 is heated or cooled.

[0043] (Base adhesive layer) The substrate adhesive layer contains a polyolefin-based adhesive resin. Examples of polyolefin adhesive resins include acid-modified polypropylene resins and acid-modified polyethylene resins.

[0044] An example of the acid-modified polypropylene resin is a maleic acid-modified polypropylene resin. The maleic acid modified polypropylene resin is a resin obtained by modifying a polypropylene resin with maleic acid.

[0045] Examples of polypropylene resins include homopolypropylene, block polypropylene, random polypropylene, and propylene-α-olefin copolymers, etc. Examples of α-olefins include ethylene, 1-butene, etc.

[0046] An example of the acid-modified polyethylene resin is a maleic acid-modified polyethylene resin. The maleic acid modified polyethylene resin is a polyethylene resin modified with maleic acid. Examples of the polyethylene resin include high density polyethylene, medium density polyethylene, low density polyethylene, and linear low density polyethylene obtained by copolymerizing ethylene with an α-olefin. Examples of the α-olefin include ethylene, 1-butene, and 1-hexane.

[0047] The thickness of the substrate adhesive layer is not particularly limited, but is preferably 1 μm or more. When the thickness of the substrate adhesive layer is 1 μm or more, the adhesion between the polyolefin substrate layer 21 and the heat-resistant layer 22 is effectively improved. The thickness of the substrate adhesion layer may be 10 μm or less.

[0048] (base material layer) The substrate layer 20 can be obtained by coextrusion or the like.

[0049] The thickness of the base layer 20 is not particularly limited, but is preferably 20 μm or more. When the thickness of the base layer 20 is 10 μm or more, the adhesion between the gas barrier film 10 and the sealant layer 70 is effectively improved. The thickness of the substrate layer 20 may be 50 μm or less, or 40 μm or less.

[0050] (Anchor coat layer) The anchor coat layer 30 is a layer for further improving the adhesion between the base material layer 20 and the vapor deposition layer 40, and is provided between the base material layer 20 and the vapor deposition layer 40.

[0051] The material constituting the anchor coat layer 30 is not particularly limited as long as it is capable of improving the adhesion between the base layer 20 and the vapor deposition layer 40, but preferably contains a polyurethane resin. In this case, even if the polyolefin-based base layer 21 attempts to expand and contract after the adhesive resin composition is bonded to the gas barrier film 10 by melt extrusion, not only is the expansion and contraction of the heat-resistant layer 22 sufficiently suppressed, but the anchor coat layer 30 containing a polyurethane resin tends to alleviate the expansion stress and contraction stress transmitted from the base layer 20 to the vapor deposition layer 40, so that the fragile vapor deposition layer 40 is further prevented from expanding and contracting, enabling the packaging film 100 to have even better gas barrier properties. Such a polyurethane resin is composed of, for example, a reaction product of an organosilane or organometallic compound, a polyol compound, and an isocyanate compound. The organosilane is, for example, a trifunctional organosilane or a hydrolysate of a trifunctional organosilane. The organometallic compound is, for example, a metal alkoxide or a hydrolysate of a metal alkoxide. The metal element contained in the organometallic compound is, for example, Al, Ti, Zr, etc. The organosilane hydrolysate and the metal alkoxide hydrolysate each only need to have at least one hydroxyl group. From the viewpoint of transparency, the polyol compound is preferably an acrylic polyol. The isocyanate compound mainly functions as a crosslinking agent or a curing agent. The polyol compound and the isocyanate compound may be a monomer or a polymer.

[0052] The thickness of the anchor coat layer 30 is not particularly limited as long as it can improve the adhesion between the base layer 20 and the deposition layer 40, but is preferably 20 nm or more, more preferably 50 nm or more, and even more preferably 100 nm or more. When the thickness of the anchor coat layer 30 is 20 nm or more, even if the polyolefin-based base layer 21 expands and contracts after the adhesive resin composition is bonded to the gas barrier film 10 by melt extrusion, the anchor coat layer 30 containing a polyurethane resin effectively relieves the expansion stress and contraction stress transmitted from the base layer 20 to the deposition layer 40, making it difficult for the deposition layer 40, which is prone to cracking, to expand and contract, and enabling the packaging film 100 to have even better gas barrier properties. From the viewpoint of suppressing a decrease in the ratio of polyolefin resin in the entire packaging film 100, the thickness of the anchor coat layer 30 is preferably 2,000 nm or less. In this case, the decrease in gas barrier properties can be suppressed more effectively even after moist heat treatment such as retort treatment or boiling treatment, compared with the case where the thickness of the anchor coat layer 30 exceeds 2,000 nm. The thickness of the anchor coat layer 30 is more preferably 1,000 nm or less.

[0053] (deposited layer) The deposition layer 40 is a layer formed by deposition, and is made of an inorganic material. Examples of the inorganic material include metals and metal oxides.

[0054] The metal constituting the metal or metal oxide includes at least one metal selected from the group consisting of Si, Al, Mg, Sn, Ti, and In. As the metal oxide, silicon oxide (SiOx), aluminum oxide (AlOx), or a mixture thereof is preferable. Both SiOx and AlOx have excellent water vapor barrier properties, and therefore can improve the water vapor barrier properties of the packaging film 100. Among them, as the metal oxide, SiOx is preferable. In this case, it becomes possible for the packaging film 100 to have more excellent water vapor barrier properties. The deposition layer 40 may be composed of a single layer or multiple layers.

[0055] The thickness of the deposition layer 40 is not particularly limited, but is preferably 5 nm or more. In this case, the deterioration of the gas barrier property of the packaging film 100 can be more sufficiently suppressed even after a moist heat treatment such as a retort treatment or a boiling treatment, compared with a case where the thickness of the deposition layer 40 is less than 5 nm. The thickness of the deposition layer 40 is more preferably 8 nm or more, and particularly preferably 10 nm or more.

[0056] In addition, the thickness of the vapor deposition layer 40 is preferably 300 nm or less. In this case, the deterioration of the gas barrier property of the packaging film 100 can be more suppressed even after the packaging film 100 is subjected to a moist heat treatment such as a retort treatment or a boiling treatment, compared with a case where the thickness of the vapor deposition layer 40 exceeds 300 nm. In addition, the ratio of the polyolefin resin in the entire packaging film 100 can be increased, and the recyclability of the packaging film 100 can be improved. The thickness of the vapor deposition layer 40 is more preferably 200 nm or less, and particularly preferably 100 nm or less.

[0057] (covering layer) The coating layer 50 is a layer that coats the deposition layer 40. When the gas barrier film 10 has the coating layer 50, when the adhesive resin composition expands and contracts after being bonded to the gas barrier film 10 by melt extrusion, the expansion stress and contraction stress are not directly transmitted to the deposition layer 40 but are indirectly transmitted via the coating layer 50, and therefore the expansion and contraction of the deposition layer 40 is suppressed.

[0058] The hardness measured by the nanoindentation method in the cross section of the coating layer 50 is not particularly limited, but is preferably 1.15 GPa or less. In this case, when the adhesive resin composition expands and contracts after being bonded to the gas barrier film 10 by melt extrusion, the expansion stress and contraction stress are effectively alleviated by the coating layer 50, so that the fragile deposition layer 40 is further prevented from expanding and contracting. The hardness of the cross section of the coating layer 50 is preferably 1.15 GPa or less, more preferably 1.0 GPa or less, and particularly preferably 0.7 GPa or less.

[0059] The hardness of the coating layer 50 in a cross section may be 0.15 GPa or more, or 0.20 GPa or more.

[0060] The hardness of the cross section of the coating layer 50 is measured by a nanoindentation method. The nanoindentation method is a measurement method in which a quasi-static indentation test is performed on a target measurement object to obtain the mechanical properties of the sample. A measurement sample is prepared and the hardness of the cross section of the coating layer 50 is measured for this measurement sample. The measurement sample (cross section sample) is prepared as follows. That is, after corona treatment is performed on both sides of the packaging film 100, it is embedded in a visible light curable resin (Aronix LCR D-800, manufactured by Toagosei Co., Ltd.). Then, the packaging film 100 is cut perpendicular to the lamination direction with a diamond knife Microstar LH using an ultramicrotome Leica EM UC7. The resulting cross section is finished under the conditions of a cutting thickness Feed of 100 nm and a cutting speed Speed ​​of 1 mm / s to obtain a measurement sample. For the measurement, a Hysitron TI-Premier (product name) manufactured by Bruker Japan Co., Ltd. is used as the measuring device, and a Berkovich type diamond indenter manufactured by Bruker Japan Co., Ltd. is used as the indenter. The measurement conditions are as follows. ·Temperature: Normal temperature (25℃) Mode: Load control mode · Pressing and unloading: Press the specimen up to a load of 15μN at a pressing speed of 1.5μN / sec, hold the specimen at the maximum load for 5 seconds, and then unload at a speed of 1.5μN / sec. Measurement points: A topographical image of the sample surface is obtained using the shape measurement function of a measuring device that scans the sample surface with an indenter, and 20 points are specified on the sample surface from the topographical image at intervals of 1 μm or more. When calculating the hardness, the relationship between the contact depth and the contact projection area between the indenter and the sample is calibrated in advance using fused quartz as a standard sample. After that, the unloading curve in the 60-95% range of the maximum load at the time of unloading is analyzed by the Oliver-Pharr method to calculate the hardness.

[0061] The coating layer 50 may be a gas barrier coating layer. In this case, the gas barrier property of the packaging film 100 is improved. Even if the deposition layer 40 is damaged, such as cracked, the gas barrier property of the packaging film 100 can be prevented from being deteriorated.

[0062] The gas barrier coating layer is formed of a cured product of a composition containing, for example, a water-soluble polymer and at least one of a metal alkoxide and a hydrolyzate thereof. The composition may further contain at least one of a silane coupling agent and a hydrolyzate thereof.

[0063] Examples of the water-soluble polymer include polyvinyl alcohol, polyvinylpyrrolidone, starch, methyl cellulose, carboxymethyl cellulose, sodium alginate, etc. Among these, polyvinyl alcohol (PVA) is particularly preferred because it is easy to improve the oxygen barrier property of the gas barrier film.

[0064] The metal alkoxide may be a compound represented by the following general formula (1). M(OR 11 ) m (R 12 ) n-m (1) In the above formula (1), R 11 is a monovalent organic group having 1 to 8 carbon atoms, and is an alkyl group such as a methyl group or an ethyl group (OR 11 R may be a hydrolyzable group. 12 is a monovalent organic group having 1 to 8 carbon atoms, and may be an alkyl group such as a methyl group or an ethyl group. M is an n-valent metal atom such as Si, Ti, Al, or Zr. m is an integer from 1 to n. 11 and R 12 If there are multiple, R 11 R12 They may be the same or different.

[0065] Specific examples of metal alkoxides include tetraethoxysilane [Si(OC2H5)4], triisopropoxyaluminum [Al(O-2'-C3H7)3], etc. Tetraethoxysilane (TEOS) and triisopropoxyaluminum are preferred because they are relatively stable in aqueous solvents after hydrolysis.

[0066] The silane coupling agent includes a compound represented by the following general formula (2). (R 2 Si(OR 3 )3) n ...(2) In the above general formula (2), R 2 represents a monovalent organic group, R 3 represents an alkyl group or -C2H4OCH3. In this case, it is possible to improve the adhesion between the gas barrier coating layer and the deposition layer 40, and delamination between layers in the packaging film 100 can be suppressed. In addition, R 2 and R 3 may be the same or different. 3 They may be the same or different from each other. R 2 Examples of the monovalent organic group represented by include a monovalent organic functional group containing a vinyl group, an epoxy group, a mercapto group, an amino group, or an isocyanate group. Among them, the monovalent organic functional group is preferably an isocyanate group. In this case, the composition can have better hot water resistance by curing, and it is possible to impart greater lamination strength to the packaging film 100 even after moist heat treatment such as retort treatment or boiling treatment. R 3 Examples of the alkyl group represented by the formula (1) include a methyl group and an ethyl group. Among them, a methyl group is preferable. In this case, hydrolysis is carried out quickly. n represents an integer of 1 or more. When n is 1, the silane coupling agent represents a monomer, whereas when n is 2 or more, the silane coupling agent represents a polymer. n is preferably 3. In this case, the hot water resistance of the gas barrier coating layer can be further improved, and it is possible to impart greater laminate strength to the gas barrier coating layer even after moist heat treatment such as retort treatment or boiling treatment.

[0067] Specific examples of the silane coupling agent include vinyltrimethoxysilane, γ-chloropropylmethyldimethoxysilane, γ-chloropropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, and 1,3,5-tris(3-methoxysilylpropyl)isocyanurate.

[0068] When the composition contains PVA as the water-soluble polymer, the amount of PVA in the composition may be 15% by mass or more, 20% by mass or more, or 25% by mass or more based on the total solid content of the composition, from the viewpoint of maintaining the flexibility of the gas barrier coating layer and facilitating the formation of the gas barrier coating layer. When the composition contains PVA as the water-soluble polymer, the amount of PVA in the composition may be 70% by mass or less, 60% by mass or less, or 50% by mass or less based on the total solid content of the composition, from the viewpoint of easily maintaining low oxygen permeability even after heat sterilization treatment.

[0069] When the composition contains TEOS (tetraethoxysilane) as a metal alkoxide, the amount of TEOS in the composition may be 30% by mass or more, 35% by mass or more, or 40% by mass or more based on the total solid content of the composition, from the viewpoint of easily maintaining low oxygen permeability even after heat sterilization treatment. When the composition contains TEOS as a metal alkoxide, the amount of TEOS in the composition may be 80% by mass or less, 75% by mass or less, or 70% by mass or less based on the total solid content of the composition, from the viewpoint of maintaining flexibility of the gas barrier coating layer and making it easy to form the gas barrier coating layer. In this specification, the amount of TEOS means a value calculated as SiO2.

[0070] When the composition contains isocyanurate silane as a silane coupling agent, the amount of isocyanurate silane in the composition may be 1% by mass or more, 3% by mass or more, or 5% by mass or more based on the total solid content of the composition, from the viewpoint of easily realizing hot water resistance and easily realizing excellent adhesion even after heat sterilization treatment. When the composition contains isocyanurate silane as a silane coupling agent, the amount of isocyanurate silane in the composition may be 20% by mass or less, 15% by mass or less, or 10% by mass or less based on the total solid content of the composition, from the viewpoint of easily maintaining low oxygen permeability even after heat sterilization treatment without reducing the amount of other components in the composition too much.

[0071] The gas barrier coating layer can be formed by coating the vapor deposition layer 40 with a composition for forming a gas barrier coating layer, followed by heating and drying. The composition for forming a gas barrier coating layer can be prepared by dissolving a water-soluble polymer in an aqueous solvent (water, a mixed solvent of water and alcohol, etc.) and mixing it with at least one of a metal alkoxide and a silane coupling agent, or a pre-hydrolyzed version of either of these. This composition (mixed solution) can also contain known additives such as an isocyanate compound, a dispersant, a stabilizer, a viscosity modifier, and a colorant.

[0072] The drying temperature when forming the gas barrier coating layer may be, for example, 40°C or more, 60°C or more, or 90°C or more, and may be 140°C or less, 130°C or less, or 120°C or less.

[0073] The thickness of the gas barrier coating layer may be 80 nm or more, 90 nm or more, or 100 nm or more. If the thickness of the gas barrier coating layer is 80 nm or more, the oxygen permeability is easily maintained low even after heat sterilization treatment. The thickness of the gas barrier coating layer may be 1000 nm or less, 700 nm or less, 500 nm or less, or 400 nm or less. If the thickness of the gas barrier coating layer is 1000 nm or less, the deterioration of the gas barrier property due to the occurrence of cracks in the gas barrier coating layer during coating can be suppressed. From this viewpoint, the thickness of the gas barrier coating layer may be 80 to 1000 nm.

[0074] (Printing layer) As described above, the gas barrier film 10 may further include a printed layer, if necessary. The printed layer may be provided on at least one of the base layer 20 and the covering layer 50. The printing layer is a layer formed using ink made of a binder resin such as a urethane-based, acrylic-based, nitrocellulose-based, or rubber-based resin to which various pigments, plasticizers, drying agents, stabilizers, etc. This printing layer can display characters, patterns, symbols, and combinations thereof.

[0075] The ink may be either water-based or oil-based, but is preferably water-based. Water-based inks use water or alcohol as a solvent, and therefore can reduce the environmental impact. The ink may be either biomass ink or not, but is preferably biomass ink from the viewpoint of reducing the environmental impact. Here, biomass ink refers to ink containing components obtained from biological resources (biomass) such as cotton, pulp, rice bran, vegetable oil, and angiosperm seeds. Examples of a method for forming the printed layer include conventionally known printing methods such as gravure printing, offset printing, and flexographic printing.

[0076] (2) Adhesive layer The adhesive layer 60 is a layer obtained by laminating an adhesive resin composition containing a polyolefin-based adhesive resin to the gas barrier film 10 by melt extrusion. Examples of polyolefin adhesive resins include acid-modified polypropylene resins and acid-modified polyethylene resins.

[0077] An example of the acid-modified polypropylene resin is a maleic anhydride graft-modified polypropylene resin. The maleic anhydride graft-modified polypropylene resin is a resin obtained by graft-modifying a polypropylene resin with maleic anhydride. The graft ratio of maleic anhydride is preferably 0.1 to 1 mass %. When the graft ratio of maleic anhydride is 0.1 mass % or more, the adhesiveness of the adhesive layer 60 is further improved. When the graft ratio of maleic anhydride is 1 mass % or less, moisture is hardly adsorbed and foaming is hardly generated. In addition, the processability of the adhesive resin composition is improved.

[0078] Examples of polypropylene resins include homopolypropylene, block polypropylene, random polypropylene, and propylene-α-olefin copolymers, etc. Examples of α-olefins include ethylene, 1-butene, etc.

[0079] An example of the acid-modified polyethylene resin is a maleic anhydride graft-modified polyethylene resin. The maleic anhydride graft-modified polyethylene resin is a resin obtained by graft-modifying a polyethylene resin with maleic anhydride. The graft ratio of maleic anhydride is preferably 0.1 to 1 mass %. When the graft ratio of maleic anhydride is 0.1 mass % or more, the adhesiveness of the adhesive layer 60 is further improved. When the graft ratio of maleic anhydride is 1 mass % or less, moisture is less likely to be adsorbed and foaming is less likely to occur. In addition, the processability of the adhesive resin composition is improved. Examples of the polyethylene resin include high density polyethylene, medium density polyethylene, low density polyethylene, and linear low density polyethylene obtained by copolymerizing ethylene with an α-olefin. Examples of the α-olefin include ethylene, 1-butene, and 1-hexane.

[0080] The adhesive layer 60 is obtained by laminating an adhesive resin composition to the gas barrier film 10 by melt extrusion. After the adhesive resin composition is brought into contact with the coating layer 50 of the gas barrier film 10, it is cooled by a cooling roll.

[0081] The thickness of the adhesive layer 60 is not particularly limited, but is preferably 1 μm or more, and more preferably 5 μm or more. When the thickness of the adhesive layer 60 is 1 μm or more, the adhesion between the gas barrier film 10 and the sealant layer 70 is effectively improved. The thickness of adhesive layer 60 may be 40 μm or less, or 15 μm or less.

[0082] The adhesive layer 60 is preferably obtained by heat-treating the adhesive resin composition. In this case, the adhesive strength of the adhesive layer 60 can be improved, and the heat sealability, impact resistance, and resistance to moist heat treatment such as retort treatment, boiling treatment, and humidity control treatment of the packaging film 100 can be improved. The heat treatment can be performed by forming a layer made of the adhesive resin composition and applying heat to this layer through a heater roll or oven. This heat treatment can be performed, for example, in a state where the gas barrier film 10 and the sealant layer 70 are bonded together via the adhesive resin composition.

[0083] (3) Sealant layer The sealant layer 70 includes a polyolefin resin. Examples of the polyolefin resin include polyethylene resin and polypropylene resin. Examples of polyethylene resins include low-density polyethylene resin (LDPE), medium-density polyethylene resin (MDPE), linear low-density polyethylene resin (LLDPE), ethylene-vinyl acetate copolymer (EVA), ethylene-α-olefin copolymer, and ethylene-(meth)acrylic acid copolymer. Examples of polypropylene resins include homopolypropylene, block polypropylene, random polypropylene, and propylene-α-olefin copolymers, etc. Examples of α-olefins include ethylene, 1-butene, etc. Among these, polypropylene-based resins are preferred from the viewpoint of heat resistance. Furthermore, among the polypropylene-based resins, when emphasis is placed on the rigidity and heat resistance of the packaging bag obtained by using the packaging film 100, it is preferable to use homopolypropylene. The polyolefin resin may be a biomass-derived polyolefin resin or a mechanically recycled or chemically recycled polyolefin resin. The sealant layer 70 may have a single layer structure or a multi-layer structure.

[0084] The sealant layer 70 may contain additives as necessary, such as crosslinking agents, antioxidants, antiblocking agents, slip agents, UV absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents, pigments, and modifying resins.

[0085] When the polyolefin resin contained in the polyolefin base layer 21 of the base layer 20 and the polyolefin adhesive resin contained in the adhesive layer 60 are polypropylene resins, the polyolefin resin contained in the sealant layer 70 is preferably a polypropylene resin. In this case, the ratio of a single material (polypropylene resin) contained in the packaging film 100 can be increased, and the recyclability of the packaging film 100 is further improved. Alternatively, when the polyolefin resin contained in the polyolefin base layer 21 of the base layer 20 and the polyolefin adhesive resin contained in the adhesive layer 60 are polyethylene resins, the polyolefin resin contained in the sealant layer 70 is preferably a polyethylene resin. In this case, the ratio of a single material (polyethylene resin) contained in the packaging film 100 can be increased, and the recyclability of the packaging film 100 is further improved.

[0086] The polyolefin resin contained in the sealant layer 70 may be a stretched film or a non-stretched film, but a non-stretched film (e.g., CPP) is preferable. In this case, the melting point of the sealant layer 70 can be lowered, and melting of the base layer 20 during heat sealing of the packaging film 100 can be easily suppressed.

[0087] The thickness of the sealant layer 70 is not particularly limited, but from the viewpoint of improving the heat sealability, it is preferably 40 μm or more, and more preferably 50 μm or more. From the viewpoint of improving the flexibility of the packaging film 100, the thickness of the sealant layer 70 is preferably 100 μm or less, and more preferably 80 μm or less.

[0088] The sealant layer 70 can be formed by bonding to the adhesive layer 60 by melt extrusion. In this case, the sealant layer 70 may be formed by melt extruding a resin composition for forming a sealant layer that forms the sealant layer 70 and bonding it to the adhesive layer 60, or by co-extruding an adhesive resin composition and a resin composition for forming a sealant layer that forms the sealant layer 70, and bonding the adhesive resin composition to the adhesive layer 60 in a state where the adhesive resin composition faces the adhesive layer 60 side. Alternatively, the sealant layer 70 may be formed simultaneously with the adhesive layer 60 by co-extruding an adhesive resin composition for forming the adhesive layer 60 and a resin composition for forming the sealant layer that forms the sealant layer 70.

[0089] <Packaging products> Next, an embodiment of the packaging product of the present disclosure will be described with reference to Fig. 2. Fig. 2 is a cross-sectional view showing one embodiment of the packaging product of the present disclosure. In Fig. 2, the same components as those in Fig. 1 are given the same reference numerals, and duplicated explanations will be omitted. As shown in Fig. 2, the packaged product 300 includes a packaging bag 200 and a content C contained in the packaging bag 200. The packaging bag 200 shown in Fig. 2 is obtained by using a pair of packaging films 100 and heat-sealing the peripheral portions of the packaging films 100 with the sealant layers 70 facing each other.

[0090] This packaging product 300 includes a packaging bag 200, which makes it possible to have excellent gas barrier properties while suppressing a decrease in the ratio of polyolefin resin in the entire packaging bag 200. Therefore, the packaging product 300 can be easily recycled after opening, and can also suppress deterioration in the quality of the content C.

[0091] The packaging bag 200 can also be obtained by folding one packaging film 100 and heat-sealing the peripheral edge of the packaging film 100 with the sealant layers 70 facing each other.

[0092] Examples of the packaging bag 200 include a three-sided pouch, a four-sided pouch, a standing pouch, a gusset pouch, a pillow package, etc. The packaging bag 200 may further have a spout or a zipper depending on the application.

[0093] The content C is not particularly limited, and examples of the content C include food, liquid, medicine, and electronic parts.

[0094] <Summary of this Disclosure> The outline of this disclosure is as follows. [1] A packaging film comprising, in this order, a gas barrier film, an adhesive layer, and a sealant layer, wherein the gas barrier film has a base layer and a deposition layer, the base layer has a polyolefin-based base layer and a heat-resistant layer containing a polyolefin-based resin, the heat-resistant layer contains a high-melting point resin having a melting point of 180°C or higher, the adhesive layer is obtained by bonding an adhesive resin composition containing a polyolefin-based adhesive resin to the gas barrier film by melt extrusion, and the sealant layer contains a polyolefin-based resin. [2] The packaging film according to [1], wherein the heat-resistant layer is provided on the vapor deposition layer side of the polyolefin-based substrate layer. [3] The packaging film according to [1] or [2], wherein the polyolefin-based base layer is a stretched film. [4] The packaging film according to any one of [1] to [3], wherein the high melting point resin of the heat-resistant layer contains a polyamide resin. [5] The packaging film according to any one of [1] to [4], wherein the heat-resistant layer contains a high-melting point resin having a melting point of 185°C or higher. [6] The packaging film according to any one of [1] to [5], wherein the ratio of the thickness of the heat-resistant layer to the thickness of the gas barrier film is 50% or less. [7] The packaging film according to any one of [1] to [6], wherein the gas barrier film further comprises an anchor coat layer containing a polyurethane resin between the deposition layer and the base layer. [8] The packaging film according to any one of [1] to [7], wherein the gas barrier film further comprises a coating layer between the deposition layer and the polyolefin-based adhesive resin layer that covers the deposition layer. [9] A packaging bag comprising the packaging film according to any one of [1] to [8].

[10] A packaging product comprising the packaging bag described in [9] and contents contained within the packaging bag. EXAMPLES

[0095] The present disclosure will be specifically described below with reference to examples, but the present disclosure is not limited to these examples.

[0096] <Preparation of coating solution> Coating solutions 1 and 2 serving as compositions for forming a gas barrier coating layer used in the examples and comparative examples were prepared as follows.

[0097] (Coating Liquid 1) The following solutions A to C were mixed to obtain coating solution 1. Coating solution 1 is composed of TEOS (SiO2 equivalent), PVA, and isocyanurate silane (R 2 The mass ratio of SiO2 to Si(OH)3 (calculated value) was adjusted to 68 / 27 / 5. Liquid A: Tetraethoxysilane (product name: KBE04, solid content: 100% by mass, manufactured by Shin-Etsu Chemical Co., Ltd., also referred to as "TEOS"), methanol (manufactured by Kanto Chemical Co., Ltd.), and 0.1 N hydrochloric acid (manufactured by Kanto Chemical Co., Ltd.) were mixed in a mass ratio of 17:10:73, and the resulting mixture was stirred for 30 minutes to hydrolyze TEOS (a solution containing 5% by mass (in terms of SiO2) of TEOS hydrolyzed solution). Liquid B: A 5% by mass aqueous solution of polyvinyl alcohol (product name: Kuraray Poval 60-98, manufactured by Kuraray Co., Ltd., also known as "PVA"). C liquid: 1,3,5-tris(3-methoxysilylpropyl)isocyanurate (product name: X-12-965P, manufactured by Shin-Etsu Chemical Co., Ltd.) as a silane coupling agent (SC agent) was dissolved in a mixed solution of water / IPA = 1 / 1 (mass ratio) with a solid content ratio of 5 mass% (R2 The solution is diluted to obtain Si(OH)3 equivalent. (Coating Liquid 2) The above-mentioned solutions A to C were mixed to obtain coating solution 2. Coating solution 2 is composed of TEOS (SiO2 equivalent value), PVA, and isocyanurate silane (R 2 The mass ratio of the SiO2 to Si(OH)3 (calculated value) was adjusted to 47.6 / 47.6 / 4.8. (Coating Liquid 3) The above-mentioned solutions A to C were mixed to obtain coating solution 3. Coating solution 3 is composed of TEOS (SiO2 equivalent value), PVA, and isocyanurate silane (R 2 The mass ratio of the SiO2 to Si(OH)3 (calculated value) was adjusted to 85 / 10.2 / 4.8.

[0098] <Preparation of anchor coat layer forming composition> The composition for forming the anchor coat layer was prepared as follows. Acrylic polyol and tolylene diisocyanate were mixed so that the number of NCO groups of tolylene diisocyanate was equal to the number of OH groups of the acrylic polyol, and diluted with ethyl acetate so that the solid content (total amount of acrylic polyol and tolylene diisocyanate) was 5 mass%. β-(3,4 epoxycyclohexyl)trimethoxysilane was further added to the diluted mixed solution so that it was 5 mass parts per 100 mass parts of the total amount of acrylic polyol and tolylene diisocyanate, and these were mixed to prepare a composition for forming an anchor coat layer (anchor coat agent).

[0099] <Preparation of packaging film> Example 1 First, homopolypropylene (hereinafter also referred to as "PP1") was used as a polyolefin-based base layer (PO-based base layer). Melting point: 162°C, density: 0.9g / cm 3 , MFR (230°C, load 2.16 kg): 3.0 g / 10 min), and maleic acid-modified polypropylene (hereinafter referred to as "PP1"; melting point: 165°C, density: 0.89 g / cm) as a substrate adhesive layer. 3, MFR (230°C, load 2.16 kg): 6.5 g / 10 min), and nylon 6 (hereinafter referred to as "Ny") as a heat-resistant layer. Melting point: 225°C, density: 1.1 g / cm 3 , MVR (at 275℃, load 5.0kg): 70cm 3 The substrates were formed by co-extrusion using a co-extrusion film molding machine and biaxial stretching to have thicknesses of 10 μm, 5 μm, and 5 μm, respectively, as shown in Table 1. The temperature at the junction of the layers was set to 260°C. Next, the surface of the substrate was subjected to a corona treatment as a surface treatment to obtain a substrate layer. Next, a SiO film having a thickness of 0.020 μm was deposited on the surface of the base layer using an electron beam heating vacuum deposition device. x The film was formed as a vapor deposited layer. Next, the coating liquid 3 was applied onto the deposition layer to form a coating film. The formed coating film was dried by heating at 80°C for 60 seconds to form a gas barrier coating layer having a thickness of 0.32 µm as a coating layer. Next, a white ink was solid-printed on the gas barrier coating layer to a thickness of 1 μm by gravure printing to form a printed layer, thereby obtaining a gas barrier film. Next, a maleic anhydride-modified PP (hereinafter also referred to as "PP2"; melting point: 106°C, density: 0.89 g / cm) was applied as an adhesive layer on the printed layer of the gas barrier film. 3 The laminate was laminated by melt extrusion at a molding temperature of 250°C so as to have a thickness of 20 µm. Next, block PP (melting point: 160°C, density: 0.90 g / cm3) was applied to the adhesive layer using the T-die casting method. 3 A sealant layer having a thickness of 40 μm and MFR (230° C., load 2.16 kg): 2.5 g / 10 min was discharged at a discharge temperature of 250° C. to obtain a laminate. Then, the laminate was subjected to heat and pressure bonding with a roll heated to 140° C. for 40 seconds. In this manner, a packaging film was obtained.

[0100] (Examples 2 to 3) A packaging film was obtained in the same manner as in Example 1, except that the substrate layer was formed so that the PO-based substrate layer, substrate adhesive layer and heat-resistant layer each had the thickness shown in Table 1.

[0101] Example 4 A packaging film was obtained in the same manner as in Example 1, except that the heat-resistant layer constituting the base layer was changed from Ny to EVOH (product name "F171B", manufactured by Kuraray Co., Ltd., melting point: 183°C, ethylene content: 32 mol%).

[0102] Comparative Example 1 A packaging film was obtained in the same manner as in Example 1, except that the substrate layer was composed only of a PO-based substrate layer having a thickness shown in Table 1.

[0103] Example 5 The deposition layer was made of AlO having the thickness shown in Table 2. x A gas barrier film was produced in the same manner as in Example 1, except that the gas barrier film was formed as a layer. Next, a maleic anhydride-modified PP film (melting point: 106°C, density: 0.89 g / cm3) was applied as an adhesive layer onto the printed layer of the gas barrier film. 3 , MFR (230°C, load 2.16 kg): 12 g / 10 min) were laminated by melt extrusion at a molding temperature of 250°C to the thickness shown in Table 2, and then a CPP film (product name "Torayfan ZK207", manufactured by Toray Advanced Film Co., Ltd., thickness: 40 μm) was laminated as a sealant layer on top of the adhesive layer using a T die casting method to obtain a laminate. Thereafter, the laminate was subjected to heat and pressure bonding with a roll heated to 140° C. for 15 seconds. In this manner, a packaging film was obtained.

[0104] Example 6 A gas barrier film was produced in the same manner as in Example 1, except that the gas barrier coating layer was formed using Coating Liquid 2 as shown in Table 2. Next, an adhesive layer and a sealant layer were formed on the printed layer of the above gas barrier film in the same manner as in Example 5 to obtain a packaging film.

[0105] (Examples 7 and 8) A substrate layer was produced in the same manner as in Example 1, except that the heat-resistant layer was not subjected to a surface treatment. The composition for forming an anchor coat layer prepared as described above was applied by gravure coating onto the heat-resistant layer of this base layer to form a coating film having a thickness after drying shown in Table 2. The coating film was then heated at 120°C for 10 seconds and dried to form an anchor coat layer containing a polyurethane resin (PU). Then, on the anchor coat layer, a deposition layer, a coating layer and a printing layer were formed in the same manner as in Example 6 to obtain a gas barrier film. Next, an adhesive layer and a sealant layer were formed on the printed layer of the above gas barrier film in the same manner as in Example 6 to obtain a packaging film.

[0106] Example 9 First, a gas barrier film was produced in the same manner as in Example 1. Next, on the printed layer of the gas barrier film, an adhesive layer made of PP2 and a block PP (melting point: 160°C, density: 0.90 g / cm3) were laminated by co-extrusion. 3 A sealant layer consisting of a resin having a viscosity of 100 psig (MFR: 230°C, load: 2.16 kg): 2.5 g / 10 min was extruded at a temperature of 250°C so that the thicknesses of each layer were 5 μm and 55 μm, and the layers were laminated so that the adhesive layer was in contact with the printed layer to obtain a laminate. Then, the laminate was subjected to heat and pressure bonding with a roll heated to 140° C. for 15 seconds. In this manner, a packaging film was obtained.

[0107] Example 10 When forming the base layer, polyethylene (melting point: 127°C, density: 0.938g / cm3) was used as the PO-based base layer. 3, MFR (190°C, load 2.16 kg): 3.8 g / 10 min) was used, and polyethylene (melting point: 120°C, density: 0.91 g / cm) was used as the substrate adhesive layer. 3 A gas barrier film was produced in the same manner as in Example 1, except that an adhesive resin (hereinafter also referred to as "PE1") having MFR (190°C, load 2.16 kg): 2.2 g / 10 min was used. Next, a modified polyethylene film (melting point: 120°C, density: 0.910 g / cm3) was applied as an adhesive layer on the printed layer of the gas barrier film. 3 An adhesive resin (hereinafter also referred to as "PE2") having a MFR (190°C, load 2.16 kg): 2.2 g / 10 min was laminated by melt extrusion at a molding temperature of 260°C to the thickness shown in Table 2, and then an LLDPE film (product name "SE625N", manufactured by Tamapoly Co., Ltd., thickness: 40 μm) was laminated on the adhesive layer as a sealant layer to obtain a laminate. Thereafter, the laminate was subjected to heat and pressure bonding using a roll heated to 140° C. for 40 seconds. In this manner, a packaging film was obtained.

[0108] (Examples 11 and 12) A packaging film was obtained in the same manner as in Example 10, except that the substrate layer was formed so that the PO-based substrate layer, substrate adhesive layer and heat-resistant layer each had the thickness shown in Table 3.

[0109] (Examples 13 and 14) A substrate layer was prepared in the same manner as in Example 10, except that the heat-resistant layer was not subjected to a surface treatment. The composition for forming an anchor coat layer prepared as described above was applied by gravure coating onto the heat-resistant layer of this base layer to form a coating film having a thickness after drying shown in Table 3. The coating film was then heated at 120°C for 10 seconds and dried to form an anchor coat layer containing a polyurethane resin (PU). Then, on the anchor coat layer, a deposition layer, a coating layer and a printing layer were formed in the same manner as in Example 10 to obtain a gas barrier film. Next, an adhesive layer and a sealant layer were formed on the printed layer of the above gas barrier film in the same manner as in Example 10 to obtain a packaging film.

[0110] Example 15 A gas barrier film was produced in the same manner as in Example 10. Next, on the printed layer of the gas barrier film, adhesive polyethylene (melting point: 120°C, density: 0.910 g / cm3) was co-extruded. 3 An adhesive layer made of MFR (190°C, load 2.16 kg): 2.2 g / 10 min) and a sealant layer made of LLDPE (product name "SE625N", manufactured by Tamapoly Co., Ltd.) were extruded at a temperature of 260°C so that the thicknesses of each layer were 5 μm and 55 μm, and the adhesive layer was in contact with the printed layer to obtain a laminate. Then, the laminate was subjected to heat and pressure bonding with a roll heated to 140° C. for 15 seconds. In this manner, a packaging film was obtained.

[0111] Example 16 A gas barrier film was produced in the same manner as in Example 1. Next, an adhesive layer and a sealant layer were formed on the printed layer of the above gas barrier film in the same manner as in Example 10 to obtain a packaging film.

[0112] <Cross-section hardness of coating layer> The hardness of the cross section of the coating layer of the packaging film obtained in the Examples or Comparative Examples was measured by the nanoindentation method as follows. The measurement sample (cross-sectional sample) was prepared as follows. That is, after corona treatment was performed on both sides of the packaging film, it was embedded in a visible light curable resin (Aronix LCR D-800, manufactured by Toagosei Co., Ltd.). Then, the packaging film was cut perpendicular to the lamination direction with a diamond knife Microstar LH using an ultramicrotome Leica EM UC7. The resulting cross section was finished under the conditions of a cutting thickness Feed of 200 nm and a cutting speed Speed ​​of 1 mm / s to prepare a measurement sample. For the measurement, a Hysitron TI-Premier (product name) manufactured by Bruker Japan Co., Ltd. was used as the measuring device, and a Berkovich type diamond indenter manufactured by Bruker Japan Co., Ltd. was used as the indenter. The measurement conditions were as follows. ·Temperature: Normal temperature (25℃) Mode: Load control mode Pressing and unloading: Press the specimen up to a load of 15μN at a pressing speed of 1.5μN / sec, hold the specimen at the maximum load for 5 seconds, and then unload at a speed of 1.5μN / sec. Measurement points: Using the shape measurement function of the measuring device that scans the sample surface with an indenter, a shape image of the coating layer cross section is obtained, and 20 points are specified on the coating layer cross section at intervals of 1 μm or more from the shape image. When calculating the hardness, the relationship between the contact depth between the indenter and the sample and the contact projected area was calibrated in advance using fused quartz as a standard sample. After that, the unloading curve in the 60-95% region of the maximum load at the time of unloading was analyzed by the Oliver-Pharr method, and the hardness of the cross section of the coating layer was calculated. The results are shown in Tables 1 to 3. In Tables 1 to 3, the hardness of the cross section of the coating layer is shown in parentheses under the coating liquid used to form the coating layer.

[0113] <Evaluation of packaging films> (1) Gas barrier properties (Before retort or boiling) First, test pieces of 100 mm x 100 mm were cut from the packaging films of Examples 1 to 16 and Comparative Example 1, and the oxygen permeability (unit: cc / m) of these test pieces was measured at a temperature of 30°C and a relative humidity of 70% using an oxygen permeability measuring device (product name "OX-TRAN2 / 20", manufactured by MOCON). 2 The measurements were performed in accordance with JIS K-7126-2. The results are shown in Tables 1 to 3.

[0114] (After retort processing) The packaging films of Examples 1 to 3, 5 to 9 and Comparative Example 1 were cut to 297 mm x 210 mm, and three-sided pouches with openings were prepared using the cut packaging films. The three-sided pouches were formed by folding the cut packaging films so that the sealant layers faced each other, and heat-sealing the peripheral edges of the sealant layers. Then, tap water (city water) was poured in through the opening to seal the opening of the three-sided pouch, thereby preparing a sealed pouch. Then, this sealed pouch was subjected to a retort treatment at 130° C. for 30 minutes in a hot water storage type retort apparatus. After that, a test piece of 100 mm x 100 mm was cut from the sealed body after retort treatment, and the oxygen permeability (unit: cc / m) of this test piece was measured in the same manner as before retort treatment. 2 The results are shown in Tables 1 and 2.

[0115] (After boiling) The packaging films of Examples 10 to 16 were cut to 297 mm x 210 mm, and three-sided pouches with openings were prepared using the cut packaging films. The three-sided pouches were formed by folding the cut packaging films so that the sealant layers faced each other, and heat-sealing the peripheral edges of the sealant layers. Then, tap water (city water) was poured in through the opening to seal the opening of the three-sided pouch, thereby preparing a sealed pouch. Then, this sealed pouch was subjected to a boiling treatment at 95° C. for 30 minutes in a boiling treatment device. After that, a test piece of 100 mm x 100 mm was cut from the sealed body after the boiling treatment, and the oxygen permeability (unit: cc / m) of this test piece was measured in the same manner as before the boiling treatment. 2 The results are shown in Tables 2 and 3.

[0116] (2) Ratio of polyolefin resins in the entire packaging film For the packaging films of Examples 1 to 16 and Comparative Example 1, the polyolefin resin ratio (mass %) in the entire packaging film was calculated by converting the weight of the packaging film into specific gravity. The results are shown in Tables 1 to 3.

[0117] [Table 1]

[0118] [Table 2]

[0119] [Table 3]

[0120] The results shown in Tables 1 to 3 show that the packaging films of the examples all had a high polyolefin resin ratio of 90 mass % or more in the overall packaging film, and had sufficiently low oxygen permeability before retort treatment. Therefore, it was confirmed that the packaging film of the present disclosure has excellent gas barrier properties while suppressing a decrease in the proportion of polyolefin-based resin in the entire packaging film. [Explanation of symbols]

[0121] Reference Signs List 10: gas barrier film, 20: substrate layer, 21: polyolefin substrate layer, 22: heat-resistant layer, 30: anchor coat layer, 40: deposition layer, 50: coating layer, 60: adhesive layer, 70: sealant layer, 100: packaging film, 200: packaging bag, 300: packaged product, C: contents.

Claims

1. A gas barrier film, an adhesive layer, and a sealant layer are provided in this order, the gas barrier film has a base layer and a deposition layer, the substrate layer has a polyolefin substrate layer containing a polyolefin resin and a heat-resistant layer, The polyolefin resin is a polyethylene resin, The heat-resistant layer contains a high-melting-point resin having a melting point of 180° C. or higher, the adhesive layer is obtained by bonding an adhesive resin composition containing a polyolefin-based adhesive resin to the gas barrier film by melt extrusion, a ratio of a thickness of the heat-resistant layer to a thickness of the gas barrier film is 21.4% or more and 50% or less; The packaging film, wherein the sealant layer comprises a polyolefin resin.

2. The packaging film according to claim 1 , wherein the heat-resistant layer is provided on the vapor-deposited layer side of the polyolefin-based substrate layer.

3. The packaging film according to claim 1 , wherein the polyolefin-based substrate layer is a stretched film.

4. The packaging film according to claim 1 , wherein the high melting point resin of the heat-resistant layer comprises a polyamide resin.

5. The packaging film according to claim 1 , wherein the heat-resistant layer comprises a high melting point resin having a melting point of 185° C. or higher.

6. A gas barrier film, an adhesive layer, and a sealant layer are provided in this order, the gas barrier film has a base layer and a deposition layer, the substrate layer has a polyolefin substrate layer containing a polyolefin resin and a heat-resistant layer, The heat-resistant layer contains a high-melting-point resin having a melting point of 180° C. or higher, the adhesive layer is obtained by bonding an adhesive resin composition containing a polyolefin-based adhesive resin to the gas barrier film by melt extrusion, The sealant layer contains a polyolefin resin, the heat-resistant layer is disposed on the deposition layer side of the polyolefin-based substrate layer, The packaging film, wherein the gas barrier film further comprises an anchor coat layer containing a polyurethane resin between the deposition layer and the base layer.

7. The packaging film according to claim 1 , wherein the gas barrier film further comprises a coating layer between the deposition layer and the adhesive layer, the coating layer coating the deposition layer.

8. A packaging bag comprising the packaging film according to any one of claims 1 to 7.

9. A packaging product comprising the packaging bag according to claim 8 and contents contained within the packaging bag.

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