Temperature adjustable multi-zone electrostatic chuck

Abstract

To provide a method for calibrating a temperature of a substrate support assembly which enables discrete tuning of the temperature profile of a substrate support assembly.SOLUTION: In a multi-chamber vacuum processing system, an RF environment 351 of a substrate support assembly includes a memory 302 including an application program, and a control board 250 disposed in the substrate support assembly. The control board includes a processor 304 having a wireless interface, a pulse width modification (PWM) heater controller 216 connected to the memory to access the memory when the processor is in operation and access the application program from the memory, and a heating element 311 connected to the PWM heater controller and including a plurality of spatially tunable heaters 212 and 214, the heater being individually tunable by the PWM heater controller.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] TECHNICAL FIELD Embodiments described herein relate generally to semiconductor manufacturing, and more particularly to temperature control or calibration of an electrostatic chuck and methods of using the same. [Background technology]

[0002] As feature sizes in device patterns become smaller, the requirement for critical dimension (CD) of the features becomes an increasingly important criterion for stable and repeatable device performance. Acceptable CD variation across a substrate processed in a processing chamber is difficult to achieve due to control of various chamber processing parameters such as chamber and substrate temperature deviations, fluid conductivity, and RF fields.

[0003] In processes utilizing electrostatic chucks, uniform temperature control across the surface of the substrate is further difficult due to the non-uniform structure of the chuck underlying the substrate. For example, some areas of the electrostatic chuck have gas holes while other areas have lift pin holes laterally offset from the gas holes. Still other areas have chuck electrodes while other areas have heater electrodes laterally offset from the chuck electrodes. Because the structure of the electrostatic chuck can vary both laterally and azimuthally, uniformity of heat transfer between the chuck and the substrate is complicated and very difficult to achieve, resulting in localized hot and cold spots across the chuck surface and non-uniform process results along the surface of the substrate.

[0004] In addition, during each chamber maintenance or service, the temperature profile of the electrostatic chuck may change, and thus the temperature profile distributed across the electrostatic chuck may be difficult to calibrate or control due to possible temperature variations across hot and cold spots on the chuck surface.

[0005] Therefore, there is a need for an improved substrate support assembly that can provide simple temperature calibration. Summary of the Invention

[0006] The embodiments described herein provide a method for calibrating the temperature of a substrate support assembly that allows for individual tuning of the temperature profile of the substrate support assembly. In one embodiment, a system includes: a memory containing an application program configured to perform operations on the substrate support assembly; a control board disposed within the board support assembly, A processor having a wireless interface; a pulse width modulated (PWM) heater controller, the processor being coupled to a memory for accessing the memory during operation and reading an application program from the memory; and A heating element connected to a pulse width modulated (PWM) heater controller, the heating element including a plurality of spatially tunable heaters, the plurality of spatially tunable heaters being individually tunable by the pulse width modulated (PWM) heater controller. Including the control board and Equipped with.

[0007] In another embodiment, a method of performing a process on a substrate support assembly includes: performing a predetermined process on a substrate support assembly to obtain an initial temperature profile for a substrate disposed on the substrate support assembly, the support assembly having a primary heater and a spatially tunable heater; determining a temperature deviation profile from the results of executing a predetermined process; determining turning parameters by a processor disposed within the substrate support assembly; adjusting an initial temperature profile relative to a target temperature profile at the substrate support assembly using turning parameters in response to the temperature deviation profile; Increasing the power delivered to one or more of the spatially tunable heaters adjusting an initial temperature profile, storing the turning parameters and the temperature deviation profile in a memory located within the substrate support assembly; Includes.

[0008] In yet another embodiment, a method of performing a process on a substrate support assembly includes: Measuring a first temperature profile of the substrate support assembly while performing a process on a substrate disposed on the substrate support assembly; determining a temperature offset map by comparing the first temperature profile to a target temperature profile by a processor disposed within the substrate support assembly; determining, by the processor, tuning parameters for calibrating the first temperature profile to a target temperature profile of the substrate support assembly; storing the tuning parameters in a memory disposed within the substrate support assembly; Includes.

[0009] So that the above-mentioned features of the invention may be understood in detail, a more particular description of the invention briefly summarized above will be obtained by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and therefore should not be considered as limiting the scope of the present disclosure, which may also admit of other equally effective embodiments. [Brief description of the drawings]

[0010] [Figure 1]FIG. 1 is a schematic top view of a multi-chamber vacuum processing system having at least one processing chamber. [Diagram 2] 1 is a schematic partial cross-sectional side view of a substrate support assembly having a spatially tunable heater; [Diagram 3] FIG. 1 is a block diagram of a control architecture of a system suitable for storing and executing software routines in which embodiments of the present disclosure may be implemented. [Figure 4] 1 is a top view of a substrate support assembly illustrating an exemplary layout of a spatially tunable heater. [Diagram 5] FIG. 13 is a flow diagram for performing a temperature calibration process for a spatially tunable heater according to one embodiment. [Figure 6A-B] 6 shows the substrate temperature profile before and after the temperature calibration process of FIG. 5. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] For ease of understanding, the same reference numbers have been used, where possible, to designate identical elements common to the figures, and it is contemplated that elements disclosed in one embodiment may be beneficially used on other embodiments without specific recitation.

[0012] The embodiments described herein provide a method for calibrating spatially tunable heaters that allows for separately adjusting a temperature profile of a substrate support assembly. The calibration process includes adjusting or calibrating heat transfer between an electrostatic chuck (ESC) and a substrate. The method includes processing a substrate placed on an ESC having multiple tunable heaters disposed therein to obtain a pre-calibrated temperature profile of the ESC. The substrate utilized to obtain the pre-calibrated temperature profile may be a dummy substrate or a calibration substrate. A temperature deviation profile is determined by comparing the results of processing the substrate (e.g., the results of the pre-calibrated temperature profile) with a target result profile. The power supplied to the heaters in the ESC is then calibrated and adjusted based on the temperature deviation profile such that the pre-calibrated temperature profile of the ESC matches the target result profile. Adjusting to the target result profile includes increasing the power to one or more tunable heaters at one or more discrete locations in response to the temperature deviation profile. The tuning parameters for the adjustment / calibration and the deviation profile are then stored in the ESC's embedded memory.

[0013] Although the substrate support assembly having a spatially tunable heater is described below in an etch processing chamber, the substrate support assembly can be utilized in other types of plasma processing chambers, such as physical vapor deposition chambers, chemical vapor deposition chambers, ion implantation chambers, among others, and in other systems in which azimuthal tuning of the lateral temperature profile is desirable. It is also contemplated that the spatially tunable heater can be utilized to control the temperature of other surfaces, including those not used in semiconductor processing.

[0014] As will be appreciated by those skilled in the art, aspects of the present disclosure may be embodied as a system, method, or computer program product. Correspondingly, implementations of the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, microcode, etc.), or an embodiment combining software and hardware aspects, which may be referred to herein as a "circuit," "module," or "system." Furthermore, implementations of the present disclosure may take the form of a computer program product embodied in one or more computer-readable medium(s) having computer-readable program code embodied therein.

[0015] Any combination of one or more computer readable media may be utilized to store a program product configured to perform the method of scheduling preventive maintenance events when executed. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. The computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination thereof. More specific examples (non-exhaustive enumerations) of computer readable storage media include portable floppy disks, hard disks, non-volatile memory, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disc read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In the context of this document, a computer-readable storage medium may be any tangible medium that is capable of containing or storing a program for use by or in connection with an instruction execution system, apparatus, or device.

[0016] A computer-readable signal medium may include a data signal in which computer-readable program code is embodied, for example, a data signal propagated in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, an electromagnetic signal, an optical signal, a radio signal, or any suitable combination thereof. A computer-readable signal medium may be any computer-readable medium, other than a computer-readable storage medium, capable of communicating, propagating, or transmitting a program for use by or in connection with an instruction execution system, apparatus, or device.

[0017] The program code embodied on the computer readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, fiber optic cable, RF, etc., or any suitable combination thereof.

[0018] Computer program code for carrying out operations for aspects of the present invention can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as JAVA, SMALLTALK, or C++, and conventional procedural programming languages ​​such as the "C" programming language or similar programming languages. The program code can run entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet Service Provider).

[0019] Also, computer program instructions can be loaded into a computer, other programmable data processing apparatus, or other device and a series of operational steps can be executed on the computer, other programmable apparatus, or other device to create a computer-implemented process, such that the instructions executing on the computer or other programmable apparatus provide a process for implementing the functions / acts identified in the flowcharts and / or block diagrams or blocks.

[0020] The embodiments of the present disclosure may be provided to end-user facilities via a cloud computing infrastructure. Cloud computing refers to providing scalable computing resources as a service over a network. More formally, cloud computing may be defined as a computing capability that provides an abstraction between the computing resources and their underlying technical structures (e.g., servers, storage, networks), allowing convenient on-demand network access to a shared pool of configurable computing resources that can be rapidly provisioned and released with minimal administrative effort or service provider interaction. Thus, cloud computing allows users to access virtual computing resources (e.g., storage, data, applications, and even fully virtualized computing systems) in the "cloud" regardless of the underlying physical system (or the location of the system) used to provide the computing resources.

[0021] Typically, cloud computing resources are provided to users on a pay-per-use basis where the user is charged only for the computing resources that the user actually uses (e.g., the amount of storage space used by the user, or the number of virtualized systems instantiated by the user). The user can access any resource present in the cloud at any time and from anywhere on the Internet. In the context of the present invention, the user can access software routines (e.g., a method for detecting a break in one or more grounding straps) or related data available in the cloud. For example, the software routines can be executed on a computing system in the cloud. In such a case, the software routines can maintain spatial and non-spatial data in a storage location in the cloud. Doing so allows the user to access this information from any computing system connected to a network (e.g., the Internet) connected to the cloud.

[0022] 1 is a schematic top view of a multi-chamber vacuum processing system 100 having at least one processing chamber 120. The multi-chamber vacuum processing system 100 also includes a system controller 160, a vacuum-tight processing platform 110, and a factory interface 140. The multi-chamber vacuum processing system 100 may additionally be attached to an advance process controller (APC) 180. The APC 180 may include a database 182 and a computing platform 184. The APC 180 may optionally be used in addition to the system controller 160 to coordinate multiple processing tools 102 in a manufacturing facility. The APC 180 may track operations and store index values ​​for substrates manufactured therein.

[0023] The factory interface (FI) 140 can include multiple front opening universal pods (FOUPs) 144 and at least one FI robot 142. The FI 140 can also include additional stations, such as a metrology station 150, which can alternatively be located next to the FOUP 144. The FI robot 142 can include rails and a movable end effector, which can be a blade, multiple fingers, a gripper, or other suitable device for transporting the substrate 118. The FI robot 142 can operate at atmospheric conditions and is configured to have a sufficient range of motion to transfer the substrate 118 disposed on the movable end effector between the FOUP 144, the metrology station 150, and one or more load lock chambers 134, 132 of the processing system 100. The FOUP 144 can hold multiple substrates 118 for transporting the substrates 118 to and from the multi-chamber vacuum processing system 100. For example, the FOUP 144 can move the substrates 118 that have been processed on the multi-chamber vacuum processing system 100 to a separate metrology station, chemical polishing station, or other apparatus for further processing.

[0024] The load lock chambers 134, 132 are disposed between the factory interface 140 and the vacuum-tight processing platform 110 to facilitate transfer of substrates 118 between the substantially ambient environment maintained within the factory interface 140 and the vacuum environment maintained within the vacuum-tight processing platform 110. The load lock chambers 134, 132 have one or more entry / exit slots (not shown) through which the substrates 118 can be transferred from the FI 140 to and from the load lock chambers 134, 132. Similarly, the load lock chambers 134, 132 have a like number of entry / exit slots through which the substrates 118 can be transferred between the interior of the load lock chambers 134, 132 and the vacuum-tight processing platform 110. Each of the inlet / outlet slots of the load lock chambers 134 , 132 is selectively sealed by a slit valve (not shown) to isolate the interior of the load lock chambers 134 , 132 from the interior of the FI 140 or the vacuum-sealed processing platform 110 .

[0025] The vacuum-tight processing platform 110 includes a number of attached chambers 120 arranged around a transfer chamber 130, in addition to the load lock chambers 134, 132. The transfer chamber 130 is coupled to a vacuum system (not shown) for providing reducing atmospheric conditions within the vacuum-tight processing platform 110. The transfer chamber 130 houses at least one transfer chamber robot 114. The transfer chamber robot 114 is capable of rotating to transfer the substrate 118 along with any of the chambers 120. One or more of the attached chambers 120 may include an etch chamber or a deposition chamber, such as a chemical vapor deposition chamber, a physical vapor deposition chamber, or an atomic layer deposition chamber, and includes a substrate support assembly 200 (shown in FIG. 2) for processing the substrate 118. Additionally, one of the attached chambers 120 may be a metrology chamber 152, which may include metrology equipment for measuring attributes of the substrate 118, an orientation chamber, a degassing chamber, or other suitable chamber for processing the substrate 118. In some embodiments, one chamber 120 can both etch and measure the substrate 118. For example, metrology equipment for measuring attributes of the substrate 118 can be incorporated into the chamber 120. Alternatively, metrology equipment for measuring attributes of the substrate 118 can be located in the transfer chamber 130, the FI 140, or another convenient location.

[0026] A system controller 160 is connected to and controls each chamber 120 and / or each module of the multi-chamber vacuum processing system 100. In general, the system controller 160 can control all aspects of the operation of the processing system 100 using direct control over the chambers and devices of the processing system 100 or, alternatively, by controlling computers associated with the chambers and devices. In addition, the system controller 160 can also be configured to communicate with the control units associated with the transfer chamber robot 114 and other controllers via the APC 180. For example, the movement of the transfer chamber robot 114, the movement of the substrate 118 to and from the processing chambers 120, and the execution of processing sequences and the coordination of the operation of the various components of the multi-chamber vacuum processing system 100 can be controlled by the system controller 160. In addition, the system controller 160 can control the process recipes in the processing chambers 120. For example, the system controller can control the vacuum, chamber temperature, temperature profile of the substrate support surface, gas flow rates, and various other process parameters of the process recipes. During operation, the system controller 160 allows feedback from each chamber and each tool to optimize substrate throughput.

[0027] The system controller 160 is described below with reference to Figure 4. The system controller 160 can modify a process recipe for the substrate 118 being processed in the chamber 120. The system controller 160 can determine changes to the process recipe using feedback from metrology tools. The metrology tools can measure critical dimensions across the substrate 118 and change process parameters, such as local temperature across the substrate support assembly, to modify the local process.

[0028] 2 is a schematic partial side view detailing portions of a substrate support assembly 200 configured to provide for regulation of a temperature profile across the substrate support assembly. Regulation of the temperature profile across the substrate support assembly 200 may be controlled by software routines executing on the controller 160. The substrate support assembly 200 may be located in any chamber 120 within the multi-chamber vacuum processing system 100. Or alternatively, the software routines may be stored and / or executed by a second controller (not shown) located remotely from the multi-chamber vacuum processing system 100, e.g., the processing chambers 120, or by the APC 180.

[0029] The substrate support assembly 200 generally includes at least one substrate support 210. The substrate support 210 may be a vacuum chuck, an electrostatic chuck, a susceptor, or other workpiece support surface. In one embodiment, the substrate support 210 is an electrostatic chuck, hereinafter referred to as an electrostatic chuck 210. The substrate support assembly 200 may also include a cooling base 260. The cooling base 260 may alternatively be separate from the substrate support assembly 200. The substrate support assembly 200 may be removably coupled to a support pedestal 205. The support pedestal 205 may include a pedestal base 244. The substrate support assembly 200 may be periodically removed from the support pedestal 205 to allow for the renewal of one or more components of the substrate support assembly 200.

[0030] The electrostatic chuck 210 has a mounting surface 203 and a workpiece support surface 202 opposite the mounting surface 203, where the substrate 118 is movably mounted on the workpiece support surface 202. The electrostatic chuck 210 generally includes a chuck electrode 207 embedded in a dielectric material 208. Although the chuck electrode 207 is shown near the mounting surface 203 of the electrostatic chuck 210, the chuck electrode 207 may be embedded in other portions of the electrostatic chuck 210, such as directly beneath the workpiece support surface 202. The chuck electrode 207 may be configured as a monopolar or bipolar electrode or in other suitable configurations. The chuck electrode 207 is connected through an RF filter 204 to a chuck power supply 206, which provides RF or DC power for electrostatically clamping the substrate 118 to the workpiece support surface 202 of the electrostatic chuck 210. The RF filter 204 prevents the RF power utilized to form the plasma within the processing chamber 120 from damaging or creating electrical hazards in electrical equipment outside the chamber.

[0031] The dielectric 208 of the electrostatic chuck 210 is made of AlN or Al 2 O 3The dielectric 208 may be fabricated from a ceramic material such as PTFE. Alternatively, the dielectric 208 may be made from a polymer such as polyimide, polyetheretherketone, polyaryletherketone, etc. A heater may be embedded in the dielectric 208. The dielectric 208 may include one or more primary resistive heaters 212 and / or multiple spatially tunable heaters 214. The primary resistive heater 212 may be provided to raise the temperature of the substrate support assembly 200 to a temperature for performing a chamber process, such as processing the substrate 118 and / or cleaning the interior of the processing chamber 120. The primary resistive heater 212 may be configured to provide any one or more laterally separated heating zones, for example, multiple zones in the shape of concentric rings. The spatially tunable heaters 214 are complementary to the primary resistive heater 212 and configured to adjust the local temperature of the electrostatic chuck 210 at multiple discrete locations in any one or more of the laterally separated heating zones defined by the primary resistive heater 212. For example, the spatially tunable heaters 214 may be arranged in a circular array, in a Cartesian lattice of columns and rows, in a hexagonal lattice, or in any other suitable matrix. The spatially tunable heaters 214 thus provide localized adjustments to the temperature profile of the substrate 118 mounted on the substrate support assembly 200. Thus, the primary resistive heaters 212 operate on a global, macro-scale to maintain the temperature profile of the workpiece support surface 202, and the spatially tunable heaters 214 operate on a local, micro-scale to adjust the temperature at discrete locations of the temperature profile of the workpiece support surface 202.

[0032] The main resistive heater 212 and the spatially tunable heaters 214 are connected to a heater power supply 222 via an RF filter 218. The heater power supply 222 can provide 900 watts or more of power to the individual heaters 212, 214. A controller 160 can control the operation of the heater power supply 222, which is typically configured to provide power to the individual heaters 212, 214 to heat the substrate 118 to a predetermined temperature profile. In one embodiment, the main resistive heater 212 includes laterally separated heating zones, and the controller 160 allows one zone of the main resistive heater 212, or even a single spatially tunable heater 214, to be preferentially heated relative to adjacent individual heaters 212, 214. In some embodiments, each spatially tunable heater 214 can be independently controlled to provide a different temperature than the other ones of the spatially tunable heaters 214. In some embodiments, multiple ones of the spatially tunable heaters 214, e.g., at least two and all of the spatially tunable heaters 214, are powered independently and / or simultaneously to provide a stable temperature profile, resulting in a stable and easily controlled temperature profile that is locally temperature set as desired, which contributes to improved uniformity and predictability of substrate processing results.

[0033] The electrostatic chuck 210 may include one or more temperature sensors 254. The temperature sensors 254 may measure the temperature at multiple discrete locations on the workpiece support surface 202. The temperature sensors 254 may provide temperature feedback information to the controller 160 for controlling the power applied by the heater power supply 222 to the main resistive heater 212 and the spatially tunable heater 214. Additionally, the feedback information may be used to control the operation of the cooling base 260.

[0034] The electrostatic chuck 210 may be disposed on a temperature controlled cooling base 260. The cooling base 260 is connected to a heat transfer fluid source 262. The heat transfer fluid source 262 provides a heat transfer fluid, such as a liquid, gas, or a combination thereof, that is circulated through one or more conduits 290 disposed within the cooling base 260. A controller 160 controls the fluid flowing through adjacent isolated conduits 290 to allow localized control of heat transfer between various regions of the electrostatic chuck 210 and the cooling base 260, which assists in controlling the lateral temperature file of the substrate 118.

[0035] A pedestal base 244 is disposed below the cooling base 260 and is configured to house a number of drive mechanisms configured to raise and lower the number of lifting pins. Additionally, the pedestal base 244 is configured to house a number of fluid connections from the electrostatic chuck 210 and the cooling base 260. The pedestal base 244 is also configured to house a number of electrical connections from the electrostatic chuck 210. A myriad of connections, e.g., fluids, electrical signals, data signals, may run externally or internally to the substrate support assembly 200.

[0036] The system controller 160 includes a control board 250 disposed within the pedestal base 244. Alternatively, the control board 250 may be disposed elsewhere within or outside the substrate support assembly 200. The control board 250 may include a pulse width modulated (PWM) heater controller 216. The control board 250 may also, optionally, include a temperature sensor controller 252.

[0037] The temperature sensor controller 252 may be communicatively connected to a temperature sensor 254 for measuring the temperature of the substrate 118. The temperature sensor controller 252 may convert signals from the temperature sensor 254 into actual temperature readings at discrete locations around the workpiece support surface 202. The actual temperature reading data is then sent to the PWM heater controller 216 and further sent to the system controller 160 for analysis and calculations.

[0038] The PWM heater controllers 216 can be directly or indirectly connected to the individual heaters 212, 214. The PWM heater controllers 216 can modify the power provided to the individual heaters 212, 214 by the heater power supplies 222. The PWM heater controllers 216 can be programmed and calibrated by measuring the temperature at each spatially tunable heater 214. That is, each spatially tunable heater 214 has its own independent PWM control. The PWM heater controllers 216 can control the temperature by adjusting the power parameters to the individual spatially tunable heaters 214. For example, 100% power to one of the spatially tunable heaters 214 provides approximately 5° C. of heat output to raise the temperature set by the main heater for a surface location above the spatially tunable heaters 214. Furthermore, 20% power to one or more of the spatially tunable heaters 214 provides approximately 1° C. of heat output to raise the temperature set by the main heater for a surface location above the spatially tunable heaters 214. The power can be reduced to 20% for some of the spatially tunable heaters 214 and maintained at that level throughout the processing operation. Additionally, the PWM heater controller 216 can operate one or more spatially tunable heaters 214 at a first power level, e.g., 80% and simultaneously operate one or more other spatially tunable heaters 214 at a second power level, e.g., about 20%. In one embodiment, the temperature can be adjusted by gradually increasing the power to the spatially tunable heaters 214. For example, an increase in temperature may be obtained by increasing the power supplied to the spatially tunable heaters 214 by a percentage during the course of the process, such as by 9%. In other embodiments, the temperature may be adjusted by cycling one or more spatially tunable heaters 214 on and off, either in phase or out of phase, while other tunable heaters 214 are also cycled on and off.In yet another embodiment, the temperature may be adjusted by a combination of adjusting the power level and gradually adjusting the power by cycling one or more spatially tunable heaters 214 on and off as needed to maintain a desired temperature profile. In yet another example, the temperature of the entire electrostatic chuck 210 may be increased simultaneously by powering all of the spatially tunable heaters 212, 214 while maintaining the same proportional power distribution between the spatially tunable heaters 214 throughout the electrostatic chuck 210. For example, an individual region controlled by one of the spatially tunable heaters 214 may have a temperature bias of about 0.5% higher than its neighboring individual region. Thus, the individual region of such an electrostatic chuck 210 is still maintained relative to its neighboring individual region while powering all of the spatially tunable heaters 212, 214 throughout the electrostatic chuck 210. Thus, by individually controlling each of the spatially tunable heaters 214 , such temperature bias can be controlled and adjusted to provide a relatively more uniform temperature distribution across the electrostatic chuck 210 .

[0039] A temperature profile (e.g., a temperature map) may be obtained by varying the heat output of each individual spatially tunable heater 214 over a single instance. The measured temperature profile may correlate the substrate temperature profile with the power distribution curve for each spatially tunable heater 214. Thus, the spatially tunable heaters 214 may be used to generate a temperature profile on the substrate based on a program that adjusts the power settings for the individual spatially tunable heaters 214. The logic may be located directly in the PWM heater controller 216, in the memory 302 (shown in FIG. 3), or in other memory elements (not shown) connected to the PWM heater controller 216 located in the pedestal base 244, or in an externally connected controller such as the controller 160. Thus, the PWM heater controller 216 is configured to independently and separately control the output of each of the plurality of spatially tunable heaters 214 with respect to each of the other plurality of spatially tunable heaters 214 and the main resistive heater 212.

[0040] The temperature of the surface of the substrate 118 in the process chamber 120 may be affected by pumping of process gases, slit valve door, plasma, and other factors. The controller 160 may have a temperature profile map for the substrate 118 to obtain high quality process results. The controller 160 may receive input from metrology or other processing equipment to correct deviations or adverse trends in the process results of the substrate 118. For example, one area of ​​the substrate 118 may be processed faster than other areas of the substrate 118. The controller 160 may send a signal to the spatially tunable heater 214 to adjust the surface temperature of the substrate 118 in the areas with deviations in process rates, such as by performing a calibration process. The controller 160 may adjust the spatially tunable heater 214 in a pattern similar to the shape of the areas with different process rates. The spatially tunable heater 214 may be adjusted to improve the temperature profile of the surface of the substrate 118 generated by the main resistive heater 212 by reducing the variation of the temperature profile to about + / - 0.3°C. The temperature profile can be made uniform or precisely altered in a predetermined manner across an area of ​​the substrate 118 to achieve a desired result through the use of the spatially tunable heaters 214. The use of the independently controllable spatially tunable heaters 214 to smooth or correct the temperature profile produced by the main resistive heaters 212 allows the local temperature uniformity to be controlled to very small tolerances across the substrate, thus allowing for precise processing across the electrostatic chuck 210 when processing the substrate 118. Additionally, the small size and high density of the spatially tunable heaters 214 relative to the main resistive heaters 212 allows for temperature control at specific locations on the electrostatic chuck 210 without substantially affecting the temperature of adjacent areas, thus compensating for localized hot and cold spots to achieve a desired temperature profile and improve localized temperature control.

[0041] It is contemplated that in a given embodiment of the substrate support assembly 200 configured for use with a 300 mm substrate, there may be from about 100 to about 400, or even more, spatially tunable heaters 214. For substrates of 450 mm or larger, even more spatially tunable heaters 214 are contemplated. An exemplary distribution of the spatially tunable heaters 214 is described below with reference to FIG. 4. In one example, there are from about 150 to about 300 spatially tunable heaters 214 in the example shown in FIGS. 1-2.

[0042] 3 shows a block diagram of the control board 250 located in the pedestal base 244 in an RF environment 351 as shown by the dashed line. As mentioned above, the PWM heater controller 216 is located in the control board 250. The PWM heater controller 216 is connected to a processor 304 that can be wirelessly controlled. The processor 304 can send commands or signals to the PWM heater controller 216. The commands or signals can be pre-set to control set points sent to the PWM heater controller 216 to further control the individual heaters 212, 214. The processor 304 can be wirelessly controlled or can communicate with the controller 160 directly or through an external controller 338 electrically connected to the processor 304. The external controller 338 can further communicate with the controller 160 in any suitable manner.

[0043] The PWM heater controller 216 is connected to an isolator 308. The isolator 308 receives a PWM signal from the PWM heater controller 216. The isolator 308 can be an optical isolator. The isolator 308 is further connected to a switching device 306. The PWM heater controller 216 can turn on or off one or more switching devices 306, which are further connected to a heating element 311. The heating element 311 is connected to the spatially tunable heater 214 and the main resistive heater 212 to provide individual control of the spatially tunable heater 214 and the main resistive heater 212 disposed within the electrostatic chuck 210. The PWM heater controller 216 can control at least one or more of a duty cycle, a voltage, a current, or a duration of the power applied to the heating element 311 via the switching device 306. In one embodiment, the PWM heater controller 216 receives commands from the controller 160 and / or the processor 304 to set the duty cycle of a pin or output. The PWM heater controller 216 then turns the switching device 306 on and off according to the set duty cycle. By raising or lowering the duty cycle, the PWM heater controller 216 can control the amount of time the switching device 306 is on versus the amount of time the switching device 306 is off. When turned on, the switching device 306 provides power and control to the heating element 311. By controlling the duty cycle of the switching device 306, the amount of power delivered to the heating element 311 can be precisely controlled. The PWM heater controller 216 can switch between on / off states or control the duty cycle for the individual spatially tunable heaters 214 and the main resistive heater 212 connected to the heating element 311. Alternatively, or in addition, the PWM heater controller 216 may control the amount of power delivered to the individual heaters 212 , 214 connected to the heating element 311 .It should be noted that the control board 250 may include multiple PWM heater controllers 216, each of which may control multiple switching devices 306 (e.g., transistors, thyristors, triacs, etc.) and elements connected to these switching devices 306.

[0044] The PWM heater controller 216 can control the temperature of the individual heaters 212, 214 by adjusting the parameters of the power supplied to the individual heaters 212, 214. Input commands input to the PWM heater controller 216 to control the temperature of the individual heaters 212, 214 can come from a user input from a processor 304, which the controller 160 can further control or communicate wirelessly with. In one embodiment, the temperature can be adjusted by gradually increasing the power to the individual heaters 212, 214. For example, an increase in temperature can be obtained by increasing the power supplied to the heating element by a certain percentage, for example by a 9% increase. In another embodiment, the temperature can be adjusted by cycling the heating element on and off. In yet another embodiment, the temperature can be adjusted by a combination of cycling each heating element on and off and gradually adjusting the power to each heating element. A temperature profile (e.g., a map) can be obtained using this method. The temperature profile can correlate the temperature with the power distribution curve for each individual heating element. Such temperature profile is then sent to the PWM heater controller 216 and further to the processor 304. Thus, individual heating elements may be used to generate a temperature profile on the substrate based on a program that adjusts the power settings for the individual heating elements from the PWM heater controller 216 and further to the processor 304. The logic may be located directly in the PWM heater controller 216, in the processor 304, or in another processing device such as the memory 302 included in the control board 250. It should be noted that the measured and calibrated temperature profile may be stored in the memory 302, which may be in communication with the processor 304 for repeated use or in communication with a database for future calibration.

[0045] In some examples, the processor 304 is operable to automatically execute instructions stored in the memory 302 when power is applied above a predetermined threshold, such that a temperature calibration process may be automatically triggered, if desired.

[0046] The control board 250 additionally includes one or more sensors, such as a first sensor 314 and a second sensor 316. The first sensor 314 and the second sensor 316 may be analog sensors and may be connected to an analog signal receiver 312 that may receive analog measurement signals from the first sensor 314 and the second sensor 316. The analog measurement signals received from the analog signal receiver 312 are then sent to the processor 304, which converts the analog measurement signals into digital measurement signals. The converted digital electrical measurement signals are then converted into digital optical measurement signals or other measurement signals and sent to a digital signal output 310, which may send such signals to the PWM heater controller 216 to control the heating element. Alternatively, the first sensor 314 and / or the second sensor 316 may be digital sensors that output digital measurement signals to the processor 304, which may further be sent to the PWM heater controller 216.

[0047] An external controller 338 is electrically connected to the processor 304. An RF filter 204 is disposed between the processor 304 and the external controller 338. The external controller 338 includes a first power supply 336 that provides power to the components of the external controller 338 and a second power supply 330 that provides power to the processor 304 disposed in the control board 250. The first power supply 336 is connected to a power supply 344, and the second power supply 330 is also connected to the power supply 344. The second power supply 330 is connected to the power supply 344 through an AC contactor 355. The first power supply 336 may include a current / voltage clamp, such as a single current / voltage clamp in the external controller 338 that can measure or monitor the voltage level of the first power supply 336. An RF filter 204 separates the second power supply 330 from the control board 250. As described above, the RF filter 204 protects the external controller 338 by filtering out RF noise introduced on the power line by the RF environment 351. In one example, the second power supply 330 provides voltage power to the processor 304 in the range of approximately 9 volts to 40 volts.

[0048] The external controller 338 further comprises a processing device 334 that can communicate with the controller 160. The processing device 334 can be powered by a first power source 336. The processing device 334 includes simple digital input, digital output, analog input and analog output interfaces that can receive signals from an ECAT (e.g., EtherCAT or Ether Control Automation Technology) input port 340 and an ECAT output port 342, or from an Ethernet TCP-IP. The processing device 334 communicates with the controller 160 that provides commands and signals to the processing device 334. The ECAT input port 340 and the ECAT output port 342, which are external to the RF environment 351 and the control board 250, can further transmit signals or commands to the processing device 334 as needed. The controller 160 generates commands according to user input and sends the commands to the processing device 334. For example, a user can provide input to select a process recipe and issue a command to execute the process recipe. The processing device 334 can generate one or more additional commands based on the command received from the controller 160. For example, the controller 160 can send commands to the processing unit 334 causing the processing unit 334 to generate instructions for the ECAT input port 340 and the ECAT output port 342, as well as other instructions for the control board 250, as necessary. The instructions can be analog or digital signals. Thus, the processing unit 334 can generate commands to control multiple different types of digital and analog devices that exist both within the RF environment 351 and outside of the RF environment 351.

[0049] Thus, the first power supply 336 and the second power supply 330 in the external controller 338 are mostly utilized to power the processing device 334 and the control board 250 to perform a temperature calibration process on the individual heaters 212, 214 in the electrostatic chuck 210. Thus, the relatively compact structure of the external controller 338 is utilized. A programmable logic controller (PCL) or programming processor often found in conventional controllers can be eliminated to save space and reduce the footprint of the external controller 338. A relatively predictable low level of power from the first power supply 336 and the second power supply 330 can be utilized to power the heating element 311 via the PWM heater controller 216. Thus, one single current clamp in the second power supply 330 (or the first power supply 336) is generally sufficient to control the voltage and current levels utilized in the external controller 338 to power the heating element 311 in the control board 250.

[0050] In embodiments where the electrostatic chuck is powered off, power can still be provided from the second power supply 330 to the memory 302 via the processor 304 to access information (e.g., data and temperature distribution maps) as needed. For example, by utilizing control of the second power supply 330 in the external controller 338, the temperature distribution map and / or the heater power adjustment distribution map can be accessed offline as needed. Thus, information stored in the electrostatic chuck memory 302 can be easily accessed even when the process chamber or electrostatic chuck is offline and not in operation.

[0051] 4 is a top view of the electrostatic chuck 210 and shows an example layout of cells 410, 412 having spatially tunable heaters 214 therein. The cells 410, 412 may have a material (or gap) that acts as a thermal choke 411 between adjacent cells 410, 412. The thermal choke 411 separates adjacent cells 410, 412 and reduces conduction between them. Thus, by individually and independently controlling the power supplied to each spatially tunable heater 214 in each cell 410, 412, a localized method of temperature control is achieved that allows specific points of the substrate 118 to be heated or cooled, thus allowing truly addressable tuning of the lateral temperature profile and control of the surface of the substrate 118.

[0052] A thermal choke 411 is disposed between each adjacent cell 410, 412. Each cell 410, 412 is associated with at least one spatially tunable heater 214. The number of cells 410, 412 shown is for illustrative purposes only, and any number of embodiments may have substantially more (or fewer) cells 410, 412. The number of spatially tunable heaters 214 may be at least an order of magnitude greater than the number of primary resistive heaters 212. The number of spatially tunable heaters 214 located throughout the substrate support assembly 200 may easily exceed 300, such as greater than 500.

[0053] The spatially tunable heaters 214 may be configured in a pattern to efficiently generate a thermal profile along the surface of the electrostatic chuck 210. The pattern may be symmetric or asymmetric about the center point 401 of the electrostatic chuck 210. Each spatially tunable heater 214 may be controlled by the controller 160 via a PWM heater controller 216 through wireless control from the processor 304. The PWM heater controller 216 may turn on a single spatially tunable heater 214 that defines a localized region, or multiple spatially tunable heaters 214 that are grouped to define various concentric zones, such as various concentric zones 402, 404, 406, 408, or a Cartesian grid, or other desired geometric configurations, including non-contiguous configurations to determine a desired temperature profile. In this manner, it is possible to precisely control the temperature at independent locations along the surface of the electrostatic chuck 210, such as but not limited to concentric rings, or other center-to-edge configurations known in the art.

[0054] 4, the spatially tunable heaters 214 are arranged in concentric channels defined within a plurality of concentric zones 402, 404, 406, 408, thus defining the polarity of the individual temperature controllable cells 410, 412. The plurality of concentric zones 402, 404, 406, 408 are defined about a center point 401 of the electrostatic chuck 210. The pattern of concentric channels of the spatially tunable heaters 214 within each concentric zone 402, 404, 406, 408 may be optionally separated by thermal chokes 411. It is contemplated that the spatially tunable heaters 214 and cells 410, 412 may be arranged in other orientations. As discussed above, it should be understood that the spatially tunable heaters 214 may be operated in groups or alone, including independent control within a zone.

[0055] The number and density of the spatially tunable heaters 214 contribute to the ability to control the temperature uniformity across the substrate to very small tolerances, which allows for precision when processing the substrate 118. Additionally, individual control of one of the spatially tunable heaters 214 relative to the other spatially tunable heaters 214 allows for temperature control at discrete locations along the surface of the substrate support assembly 200 without substantially affecting the temperature of adjacent or neighboring regions of the surface. This feature allows for compensation of locally hot and cold spots. The spatially tunable heaters 214 can have individual temperature ranges between about 0.0° C. and about 50.0° C., with the ability to control the temperature rise in increments of about 0.1° C. In one embodiment, the multiple spatially tunable heaters 214 in the substrate support assembly 200, together with the main resistive heater 212, have demonstrated the ability to control the temperature uniformity of the substrate 118 being processed thereon to less than about ±0.3° C. The spatially tunable heater 214 thus enables both lateral and azimuthal adjustment of the lateral temperature profile of the substrate 118 being processed on the substrate support assembly 200 .

[0056] The individual heaters 212, 214 may be controlled by a software routine. The software may incorporate a current substrate temperature profile map and calibration methods to adjust the temperature profile of the substrate 118 within the process chamber 120.

[0057] FIG. 5 illustrates a process 500 that may be utilized to calibrate the temperature of the substrate support utilizing the individual controllable individual heaters 212, 214. The process 500 may be stored in the controller 160 or in the memory 302 in the control board 250, such that the calibration process is easily accessible to perform calibration after preventative maintenance or other inspections at a customer site (or other locations other than the manufacturing site) as needed. The flow diagram may be implemented as a software routine on a computing device. The spatially tunable heaters are independently controllable to determine the temperature profile of the substrate being processed thereon. The heat generated by one spatially tunable heater may be altered relative to the other spatially tunable heaters by the controller controlling at least one or more of the duty cycle, voltage, current, and duration of the power applied separately to each individual spatially tunable heater relative to the other heaters. Additionally, the power supplied to the spatially tunable heaters may be supplied simultaneously between the heaters as described above, or alternatively, may be scanned continuously across the individual spatially tunable heaters. To aid in collecting and calibrating a temperature profile on the substrate support assembly 200, a workpiece such as a substrate 118 may be processed on the substrate support assembly. For example, the substrate may be processed in a vacuum chamber, for example, using a plasma process. Optionally, vacuum processes that may be performed in the presence of a plasma in the processing chamber may include etching, chemical vapor deposition, physical vapor deposition, ion implantation, plasma treatment, annealing, oxygen removal, abatement, or other plasma processes. It is contemplated that the workpiece may be processed on a temperature controlled surface in other environments, for example, at atmospheric conditions, for other applications.

[0058] The process 500 begins in step 502 by performing a predetermined process on a substrate, such as substrate 118, disposed on the substrate support assembly 200. Note that the substrate 118 may be a regular production wafer, a calibration wafer, or a dummy wafer, as desired. The predetermined process may be a process utilized to obtain a temperature profile distributed across the substrate support assembly 200.

[0059] In step 504, a pre-calibrated substrate temperature profile is obtained based on the predetermined process performed in step 502. The temperature profile may be measured by temperature sensor 254 (as shown in FIG. 2) and then transmitted to controller 160 for further processing and / or analysis.

[0060] In step 506, the pre-calibrated substrate temperature profile is analyzed and compared to the target temperature profile stored in the controller 160 and / or memory 302, and then a temperature offset (e.g., temperature deviation) map is determined. The temperature offset (e.g., temperature deviation) map may further determine temperature tuning parameters. The temperature offset is fed back to a temperature tuner, such as the PWM heater controller 216 or the processor 304, to determine a tuning map or tuning heating profile. For example, the tuning map may determine how much temperature increase or decrease is required for each cell 410, 412. Correspondingly, the power supplied to each of the spatially tunable heaters 214 and / or the main resistive heater 212 may be adjusted to provide different levels / amounts of voltage, which may affect the thermal energy generated by the spatially tunable heaters 214 and / or the main resistive heater 212. As a result, localized temperature adjustments and offsets may be adjusted based on the tuning map, thereby providing a desired uniform temperature profile across the ESC.

[0061] In step 508, the tuning map of the ESC is utilized to determine temperature tuning parameters to calibrate the predetermined distinct individual heaters 212, 214 located within the designated zone. Thus, a calibration process is performed based on the temperature tuning parameters determined from the tuning map based on the temperature offset (e.g., temperature deviation) map. The control of each spatially tunable heater 214 can be performed simultaneously within the electrostatic chuck 210, allowing any selection of the spatially tunable heaters 214 to quickly generate a specific temperature profile / map. The control / delivery of power from the second power supply 330 to the individual spatially tunable heaters 214 may be provided via an external controller 338. A PWM heater controller 216 adjusts the power provided to each individual spatially tunable heater 214, thereby providing different thermal energy from the spatially tunable heaters 214 to locally control the temperature setting of the ESC to achieve a desired temperature profile. While the power to one spatially tunable heater 214 is being adjusted, the other spatially tunable heaters 214 may be turned off or held at a given power. Alternatively, the power to multiple spatially tunable heaters 214 may be adjusted simultaneously, for example to two, more, or all of the spatially tunable heaters 214. There may be 150 or more spatially tunable heaters 214, with each spatially tunable heater 214 being individually controlled to obtain a customizable heat output. For example, the processor 304 may adjust the power to one spatially tunable heater, for example to two, more, or all of the spatially tunable heaters 214. x The processor 304 may simultaneously instruct the PWM heater controller 216 to provide 20 percent power to a spatially tunable heater, e.g., to achieve a temperature increase of approximately 1° C. at a first location adjacent the heater. yto provide 80 percent of the power to a second spatially tunable heater, such as a second heater, to achieve approximately 4° C. of heat at a second location adjacent the heater. In this manner, up to 100 percent of the spatially tunable heaters can be simultaneously and independently controlled to create unique temperature profiles.

[0062] Conventionally, some optical communication, such as fiber optic connections or optical feedthroughs, may be used to help transmit signals to determine tuning parameters for tuning the heater. However, such optical communication often requires additional optical devices disposed in the substrate support assembly 200, which may exacerbate manufacturing costs or measurement complexity. In contrast, in the present disclosure, the use of such optical devices can be eliminated by directional communication between the PWM heater controller 216, the processor 304, and the second power supply 330 after feedback control from the temperature sensor 254. Thus, a compact structure of the substrate support assembly 200 and a simple design of the control board 250 may be obtained, data communication may be enhanced, and control of the tuning process may be simplified. Furthermore, a wireless interface from the processor 304 may also help control the temperature adjustment in a more instantaneous, efficient, and dynamic manner. A second power supply 330 can supply power to one spatially tunable heater 214 via the PWM heater controller 216 while simultaneously cycling other spatially tunable heaters 214 on and off and cycling yet other spatially tunable heaters 214 on and off at different overlapping time intervals. In this manner, the spatially controllable heaters 214 can have a temperature profile across the substrate support created to match the temperature tuning parameters set from the tuning map.

[0063] In step 510, after the calibration process is completed, the tuning map and other information, such as the temperature deviation or offset map, the power supplied from the second power supply 330, the commands from the PWM heater controller 216, and the determined tuning parameters, may be stored in memory 302, which may be easily accessible and readable by the controller 160 and / or the processor 304. The tuning map stored in memory 302, as well as the temperature offset and temperature deviation profiles, and the determined tuning parameters, may be repeatedly referenced to calibrate the temperature profile of the substrate support assembly 200 after preventative checks have been performed or in any suitable situation requiring a calibration process.

[0064] 6A and 6B are temperature profiles of the substrate 118 before and after the temperature calibration process. After the temperature measurement in step 504, a pre-calibrated substrate temperature profile or map 602 is obtained, as shown in FIG. 6A. In the example of FIG. 6A, the pre-calibrated substrate temperature profile 602 may be an asymmetric configuration having approximately three different temperature zones 610, 612, 613. The first zone 612 is formed slightly off-center and has a higher temperature than the second zone 613 and the third zone 610. The relatively high temperature in the first zone 612 may adversely process the substrate at a different rate than the second zone 613 and the third zone 610. After the temperature calibration process in step 508 is completed, the temperatures in the second zone 613 and the third zone 610 may be increased by increasing the power supplied to the heaters 214 located in the second zone 613 and the third zone 610. Alternatively, the temperature in the first zone 612 may be reduced by decreasing the power supplied to the heater 214 located in that first zone 612. Thus, after temperature calibration, the calibrated temperature profile (e.g., temperature map) 650 is substantially more uniform across the substrate, as shown in Figure 6B, with a central zone 652 having a desired temperature range and a small edge zone 654 having a slightly lower or higher temperature than the central zone 652. In this manner, a uniform temperature profile is obtained across the substrate support assembly 200.

[0065] Advantageously, the calibration process can provide and control temperature uniformity across the substrate support assembly during the substrate processing process. Individual spatially tunable heaters can be used to facilitate localized temperature control and compensation and improve temperature uniformity across the substrate support assembly. The use of direct communication from the power supplied to the PWM heater controller 216 can be further utilized to adjust the heat generated from the spatially tunable heaters, providing efficient and simple control of the temperature profile without using conventional optical devices for measurement. Thus, the spatially tunable heaters adjust the temperature profile to compensate for variations over time.

[0066] While the forgoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, the scope of the invention being defined by the claims that follow. The present application also includes the aspects described below. (Aspect 1) 1. A system comprising: a substrate support assembly; a memory containing an application program configured to perform operations on the substrate support assembly; a control board disposed within the substrate support assembly, A processor having a wireless interface; a pulse width modulated (PWM) heater controller, the processor being coupled to the memory during operation to access the memory and read the application program from the memory; and a heating element connected to the pulse width modulated (PWM) heater controller, the heating element including a plurality of spatially tunable heaters, the plurality of spatially tunable heaters being individually tunable by the pulse width modulated (PWM) heater controller; Including the control board and A system comprising: (Aspect 2) 2. The system of claim 1, wherein the memory is located within the control board. (Aspect 3) 2. The system of embodiment 1, wherein the memory is located remotely from the control board within the substrate support assembly. (Aspect 4) an external controller electrically connected to the control board; 2. The system of embodiment 1, wherein the external controller further includes a first power source electrically connected to the processor, the first power source configured to supply power to the heating element. (Aspect 5) 5. The system of embodiment 4, wherein the external controller does not include a programming processor. (Aspect 6) 5. The system of embodiment 4, wherein the external controller further comprises a second power source. (Aspect 7) 2. The system of claim 1, wherein the processor is operable to automatically execute instructions stored in the memory upon application of power above a predetermined threshold. (Aspect 8) 1. A method of performing a process on a substrate support assembly, comprising: performing a process on a substrate support assembly to obtain an initial temperature profile for a substrate disposed on the substrate support assembly, the support assembly having a primary heater and a spatially tunable heater; determining a temperature deviation profile from the results of executing the predetermined process; determining turning parameters with a processor disposed within the substrate support assembly; adjusting the initial temperature profile relative to a target temperature profile of the substrate support assembly using the turning parameters in response to the temperature deviation profile; Increasing the power supplied to one or more of said spatially tunable heaters. adjusting the initial temperature profile, storing the turning parameters and the temperature deviation profile in a memory located within the substrate support assembly; A method comprising: (Aspect 9) 9. The method of embodiment 8, wherein the memory is located within a control board embedded in the substrate support assembly. (Aspect 10) 9. The method of embodiment 8, wherein the increased power is supplied from a power supply located in an external controller that is located outside the substrate support assembly. (Aspect 11) 11. The method of any one of aspects 4 or 10, wherein the external controller comprises a single current clamp. (Aspect 12) 9. The method of embodiment 8, wherein the processor is in communication with the memory to retrieve the turning parameters and the temperature deviation profile stored in the memory. (Aspect 13) 9. The method of embodiment 8, wherein the spatially tunable heaters are powered simultaneously and at least two of the spatially tunable heaters have different percentage power outputs. (Aspect 14) 1. A method of performing a process on a substrate support assembly, comprising: measuring a first temperature profile of a substrate support assembly while performing a process on a substrate disposed on the substrate support assembly; determining a temperature offset map by comparing the first temperature profile to a target temperature profile by a processor disposed within the substrate support assembly; determining, by the processor, tuning parameters for calibrating the first temperature profile to the target temperature profile of the substrate support assembly; storing the tuning parameters in a memory located within the substrate support assembly; A method comprising: (Aspect 15) The method of any one of aspects 1, 8, or 14, wherein the processor is wirelessly controllable.

Claims

1. 1. A system comprising: a substrate support assembly; a memory containing an application program configured to perform operations on the substrate support assembly; a control board disposed within the substrate support assembly, A processor having a wireless interface; a pulse width modulated (PWM) heater controller, the processor being coupled to the memory for accessing the memory during operation and reading the application program from the memory; a heating element connected to the pulse width modulated (PWM) heater controller, the heating element including a plurality of spatially tunable heaters, the plurality of spatially tunable heaters being individually tunable by the pulse width modulated (PWM) heater controller; and a control board including a temperature sensor controller communicatively connected to a temperature sensor for measuring a temperature of a substrate, the temperature sensor controller configured to convert a signal from the temperature sensor into a temperature reading and then transmit the temperature reading data to the pulse width modulated (PWM) heater controller; Equipped with the system further comprising an external controller electrically connected to the control board; the external controller further comprising a first power source electrically connected to the processor and a second power source electrically connected to components of the external controller, the first power source and the second power source configured to provide power to the heating element; the first power supply or the second power supply of the external controller includes a single current clamp; system.

2. The system of claim 1 , wherein the memory is located within the control board.

3. The system of claim 1 , wherein the memory is located remotely from the control board within the substrate support assembly.

4. The system of claim 1 , wherein the external controller does not include a programming processor.

5. The system of claim 1 , wherein the processor is operable to automatically execute instructions stored in the memory upon application of power above a predetermined threshold.

6. The system of claim 1 , wherein the processor is wirelessly controllable.

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