Impulse wire module and method for manufacturing an impulse wire module - Patents.com

Abstract

The impulse wire module (10) can be manufactured at low cost by connecting the winding wire (20) of the wire winding (16) to the contact device (22) via a material bonding joint (32). [Solution] The present invention relates to an impulse wire module (10) comprising a module housing (12) defining a housing chamber (14), a wire winding (16) formed by a winding wire (20) and at least partially disposed within the housing chamber (14), an impulse wire (18) extending at least partially within the wire winding (16), and a contact device (22) for an external electrical contact of the impulse wire module (10) attached to the module housing (12) and electrically connected to the wire winding (16), and a method for manufacturing the same.

Description

[Technical field]

[0001] The present invention is directed to an impulse wire module comprising a module housing defining a housing chamber, a wire winding formed by a winding and at least partially disposed within the housing chamber, an impulse wire extending at least partially within the wire winding, and a contact device for an external electrical contact of the impulse wire module, the contact device being attached to the module housing and electrically connected to the wire winding. The present invention also relates to a method for manufacturing such an impulse wire module. [Background technology]

[0002] Such impulse wire modules (also known as Wiegand modules) are used, for example, in magnet-based rotation angle measurement devices for detecting the excitation magnetic field generated by an excitation magnet.

[0003] Such an impulse wire module is known from DE 10 2020 100 732 A1, in which the contact device comprises a connection element on which a winding is wound in order to electrically connect the contact device with the wire winding. The disclosed impulse wire module is constructed from several parts, which allows for an automatic winding of the wire winding around the connection element. However, due to the complex multi-part structure, the manufacturing costs of the disclosed impulse wire module are relatively high. Summary of the Invention [Problem to be solved by the invention]

[0004] Against this background, the challenge is to enable a cost-effective production of impulse wire modules. [Means for solving the problem]

[0005] This problem is solved by an impulse wire module having the features of claim 1 as well as by a method for producing an impulse wire module having the features of claim 7.

[0006] The impulse wire module according to the invention comprises a module housing defining a housing chamber. Typically, the module housing is made of plastic and is an injection molded part. The module housing is typically designed to be substantially trough shaped, thereby defining a housing chamber that is open on one side (typically the bottom side of the module housing). Typically, the housing chamber comprises a cylindrical segment shaped portion for receiving the wire windings. The module housing may comprise special structures for aligning and positioning the module housing during assembly.

[0007] The impulse wire module according to the invention further comprises a wire winding and an impulse wire. The wire winding is formed by a winding wire and is at least partially arranged in the housing chamber. Preferably, the wire winding is designed as a so-called air-core coil, without a winding core. The impulse wire extends at least partially in the wire winding, which means that the wire winding at least partially radially surrounds the impulse wire. Preferably, the inner diameter of the coil is slightly larger than the outer diameter of the impulse wire, so that the impulse wire is positioned and supported by the wire winding in the radial direction. Typically, ferrite elements are arranged on both axial sides of the wire winding, whereby one end of the impulse wire is supported. The ferrite elements are attached to the module housing, which is preferably overmolded by the module housing. The impulse wire is adhesively attached to the two ferrite elements, preferably by means of a relatively soft adhesive, for example silicone, which hardens under UV light. The impulse wire is magnetically bistable and is also known as a Wiegand wire. Under the influence of an external magnetic field, the magnetization direction of the impulse wire suddenly reverses, producing a short voltage pulse in the wire windings.

[0008] The impulse wire module according to the invention further comprises at least one contact device for the external electrical contact of the impulse wire module. The contact device is attached to the module housing, which is preferably overmolded by the module housing. The contact device is electrically connected to the wire windings, and a voltage pulse occurring in the wire windings can be detected externally via the contact device. Typically, the contact device comprises several contact elements, also known as contact legs or contact pins, which are arranged at a predefined distance from each other to allow the impulse wire module to be mounted on a standardized circuit board. Preferably, the contact elements are arranged on the bottom side of the module housing and are designed to be mounted on the surface of a printed circuit board, so that the impulse wire module is designed as a so-called "surface mounted device" (SMD).

[0009] According to the invention, the winding is connected to the contact device via a material bond joint. The material bond joint can in particular be a welded connection or a soldered connection. However, the material bond joint can in principle be any type of material bond joint that provides an electrical connection between the winding and the contact device. The material bond joint can in principle be arranged in any area of ​​the contact device. However, preferably, the contact device comprises a specially configured connection area for forming a material bond joint with the winding. Preferably, the winding is connected with the contact device only via a material bond joint, and it is certainly conceivable that the material bond joint can be surrounded by a protective layer, for example a varnish or a potting compound, in order to protect it from environmental influences. However, the protective layer here does not make a significant contribution to the connection between the winding and the contact device, but only serves to protect the material bond joint. The material bond joint provides a reliable connection between the winding and the contact device, which can be produced relatively easily in an automated manner using suitable machines. This allows a particularly cost-effective production of the impulse wire module according to the invention.

[0010] Preferably, the contact device is tin-plated, i.e. coated with tin, at least in the connection area in which the material-bonding joint between the winding and the contact device is arranged, which allows a particularly simple and reliable production of the material-bonding joint, for example by thermocompression welding or soldering.

[0011] Advantageously, the material bond joint between the winding and the contact device is arranged in a housing chamber, which is filled with potting compound such that the material bond joint between the winding and the contact device is surrounded by the potting compound. The potting compound reliably protects the material bond joint against environmental influences, in particular moisture, and mechanical shocks. Furthermore, the potting compound reliably fixes the wire winding and the impulse wire in the housing chamber and also protects them against environmental influences. This provides a particularly durable impulse wire module. Preferably, the potting compound is cured under UV light in order to cure the potting compound relatively quickly and reliably.

[0012] Preferably, the contact device comprises a body embedded in the module housing and a connection element protruding from the module housing and on which the material-bonded joint with the winding is arranged. The connection element is preferably formed integrally with the body. The body embedded in the module housing provides a secure attachment of the contact device to the housing. Preferably, the body is completely or at least partially overmolded by the module housing. Typically, furthermore, several contact elements are formed on the body, which also protrude from the module housing and are used for the external electrical contacts of the impulse wire module. The connection element is preferably arranged on the side of the body facing the wire winding. The connection element protruding from the module housing is fully accessible and allows easy manufacture of the material-bonded joint with the winding.

[0013] Particularly preferably, the connection element is bent downwards so that it rests against a surface of the module housing. Since the connection element is bent downwards, a relatively large connection surface for producing a material bond joint is provided in a simple manner. Furthermore, the connection element and thus the material bond joint with the winding wire arranged thereon is arranged relatively close to the module housing and is therefore relatively well protected against external mechanical influences. Preferably, the surface of the module housing against which the connection element rests is formed within the housing chamber, such that the connection element and the material bond joint to the winding arranged thereon are arranged within the housing chamber.

[0014] Advantageously, the impulse wire module comprises a further contact device electrically connected with the wire winding, the winding being connected with the further contact device via a further material bonding joint. Typically, two contact devices are arranged on either side of the wire winding and connected to one end of each winding, so that the voltage pulses generated in the wire winding can be detected from the outside in a simple manner via the two separate contact devices. Preferably, the two contact devices are designed identically so that the same components can be used for both contact devices.

[0015] The method for producing an impulse wire module according to the present invention comprises the steps of: - Insert the wire windings into the module housing, - directing said winding to said contact device; - manufacturing a material bonded joint between said winding and said contact device.

[0016] The wire windings are manufactured on a suitable winding machine and provided with connections of sufficient length at both ends for connecting the wire windings to the contact devices, and the wire windings are inserted into the module housing as pre-manufactured parts.

[0017] The winding connections are then brought to the contact device, in particular to the connection area of ​​the contact device.

[0018] A material bond joint between the winding and the contact device is then made by a suitable process, e.g. a welding process or a soldering process, to conductively and permanently connect the winding to the contact device. Typically, the part of the winding wire that protrudes on the opposite side of the connection area of ​​the contact device from the wire winding is then cut off. Preferably, the winding is attached to the contact device only via the material bond joint after the material bond joint has been made.

[0019] Advantageously, the material bond joint between the winding and the contact device is performed in an automated manner by means of a suitably configured machine, which allows a particularly cost-effective production of the impulse wire module.

[0020] Preferably, the material-bonding joint between the winding and the contact device is performed by heat welding, particularly preferably by heat compression welding. Thermoforming machines are relatively inexpensive and allow the production of relatively small welds. This allows a cost-effective and reliable production of the impulse wire module.

[0021] Advantageously, after the material bond joint between the windings and the contact devices has been made, the housing chamber of the module housing is filled with potting compound such that the material bond joint between the windings and the contact devices is surrounded by potting compound, which provides a particularly durable impulse wire module.

[0022] Preferably, after filling the housing chamber, the potting compound is exposed to UV light to cure relatively quickly and reliably.

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an impulse wire module according to the present invention will now be described with reference to the accompanying drawings. [Brief description of the drawings]

[0024] [Figure 1] FIG. 2 is a plan view of the bottom of an impulse wire module according to the present invention. [Diagram 2]FIG. 2 is a cross-sectional view of the impulse wire module taken along line II-II in FIG. [Diagram 3] 2 is a contact device of the impulse wire module of FIG. 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Each figure illustrates an impulse wire module 10 having a module housing 12 defining a housing chamber 14. In this embodiment, the module housing 12 is a generally trough-shaped injection molded part made of plastic, with the housing chamber 14 opening to a bottom side of the module housing 12.

[0026] The impulse wire module 10 further comprises a wire winding 16 and an impulse wire 18 which axially passes through the wire winding 16. The impulse wire 18 is thus radially surrounded by the wire winding 16 in the central region. The wire winding 16 is formed by a winding wire 20 and is partially arranged in the housing chamber 14. In this embodiment, the wire winding 16 is designed as an air-core coil and has an inner diameter slightly larger than the outer diameter of the impulse wire 18, so that the impulse wire 18 is radially positioned and supported by the wire winding 16. At both axial ends of the wire winding 16, ferrite elements 21 are arranged, into which one axial end of the impulse wire 18 extends. In this embodiment, the two ferrite elements 21 are overmolded by the module housing 12, and the two ends of the impulse wire 18 are each attached to the respective ferrite element 21 via an adhesive connection 23. In this embodiment, the adhesive connection 23 consists of a relatively soft material, in particular silicone, which hardens under UV light.

[0027] In this embodiment, for the external electrical contacts of the impulse wire module 10, the impulse wire module 10 comprises two identical contact devices 22, each of which is designed as an integral part. In this embodiment, the two contact devices 22 are fully tinned, i.e. fully coated with tin. The two contact devices 22 are arranged on either side of the wire winding 16 and each comprises a body 24, a connection element 26 and, in this embodiment, four contact elements 28. In this embodiment, the two contact devices 22 are overmolded by the module housing 12 such that the bodies 24 of the two contact devices 22 are embedded in the side walls of the respective module housings 12 and the connection elements 26 and the contact elements 28 of the two contact devices 22 protrude from the bottom surface of the respective module housings 12.

[0028] In this embodiment, the connection elements 26 of the two contact devices 22 abut a surface 30 of the module housing 12 formed within the housing chamber 14 and are bent downwardly so that each is fully disposed within the housing chamber 14. The connection elements 26 are each electrically connected to one end of the winding wire 20 via a material bond joint 32, so that each of the two contact devices 22 is electrically connected to one side of the wire winding 16. The winding wire 20 is attached to the respective contact device 22 only via the material bond joint 32. The material bond joint 32 is each disposed on a connection area 34 of the connection element 26 defined by the surface 30 of the connection element 26 facing away from the surface 30 of the module housing 12.

[0029] In this embodiment, the housing chamber 14 is completely filled, i.e. up to the housing bottom end 36, with potting compound 38, so that the connection element 26 and the material bonding joint 32 arranged on the connection region 34 of the connection element 26 are respectively surrounded by potting compound 38. In this example, the potting compound 38 is cured under UV light.

[0030] During manufacture of the impulse wire module 10, the wire winding 16 is inserted as a pre-manufactured component into the housing chamber 14 of the module housing 12, and the two ends of the winding wire 20 forming the wire winding 16 are each brought to the connection area 34 of the connection element 26 of the respective contact device 22.

[0031] The material bonding joints 32 between the two ends of the winding wire 20 and the respective contact devices 22 are, in this embodiment, fully automated by thermocompression welding, and are made to electrically connect the winding wire 20 with the two contact devices 22.

[0032] After the wire windings 16 are inserted into the module housing 12 , the impulse wire 18 is inserted into the wire windings 16 and adhesively connected to the two ferrite elements 21 .

[0033] The housing chamber 14 is completely filled with liquid potting compound 38, so that the connection elements 26 and the material bond joints 32 disposed thereon are surrounded by potting compound 38. The potting compound 38 is cured in a controlled manner by irradiation with UV light. [Explanation of symbols]

[0034] 10 Impulse Wire Module 12 Module Housing 14 Housing chamber 16 Wire Winding 18 Impulse Wire 20 Winding Wire 21 Ferrite element 22 Contact device 23 Glued joint 24 Main Unit 26 Connection Elements 28 Contact elements 30 surface 32 Material bond joints 34 Connection Area 36 Housing bottom end 38 Potting compound

Claims

1. An impulse wire module (10), a module housing (12) defining a housing chamber (14); a wire winding (16) formed by a wound wire (20) and disposed at least partially within said housing chamber (14); an impulse wire (18) extending at least partially within the wire winding (16); a contact device (22) for external electrical contacts of the impulse wire module (10) mounted in the module housing (12) and electrically connected to the wire windings (16); The winding wire (20) is connected to the contact device (22) via a material bonded joint (32); The contact device (22) a body (24) at least partially overmolded onto the module housing (12); and a connecting element (26) formed integrally with the body (24), protruding from the module housing (12), and in which the material bonding joint (32) is disposed.

2. 2. The impulse wire module (10) of claim 1, wherein the contact device (22) is tin-plated at least in a connection area (34) where the material bond joint (32) is located.

3. The material bond joint (32) is disposed within the housing chamber (14); 3. The impulse wire module (10) of claim 1 or 2, wherein the housing chamber (14) is filled with potting compound (38) such that the material bond joint (32) is surrounded by the potting compound (38).

4. 2. The impulse wire module (10) of claim 1, wherein the connecting element (26) is bent to abut a surface (30) of the module housing (12).

5. a further contact device (22) electrically connected to the wire winding (16); 2. The impulse wire module (10) according to claim 1, wherein the winding wire (20) is connected to the further contact device (22) via a further material bond joint (32).

6. Inserting the wire windings (16) into the module housing (12); Leading the winding wire (20) to the contact device (22); producing a material bonded joint (32) between the winding wire (20) and the contact device (22); 2. The method for manufacturing an impulse wire module (10) as set forth in claim 1, wherein after the material bond joint (32) is formed, the housing chamber (14) is filled with potting compound (38) such that the material bond joint (32) is surrounded by the potting compound (38).

7. The method of claim 6, wherein the material bond joint (32) is created in an automated manner.

8. The method of claim 6, wherein the material bond joint (32) is formed by heat welding.

9. 7. The method of claim 6, wherein the potting compound (38) is cured by irradiation with UV light.

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