Display device and method for manufacturing the same

Abstract

The display device includes a plurality of display modules and a frame supporting the plurality of display modules, the plurality of display modules being arranged in an M*N matrix form on the frame, the frame including a frame panel having a first side and a second side opposite to the first side, the frame panel including a first opening formed on the first side and a second opening formed on the second side penetrating the frame panel, an insertion portion having a size of the first opening larger than a size of the second opening, and a stud provided on the insertion portion.

Description

[Technical field]

[0001] The present invention relates to a display device that displays an image by combining a module in which light emitting elements are mounted on a substrate, and a method for manufacturing the display device. [Background technology]

[0002] A display device is a type of output device that visually displays data information such as characters and figures, as well as images.

[0003] Generally, liquid crystal panels that require backlights and OLED (Organic Light-Emitting Diode) panels made of organic compound films that emit light in response to electric current are mainly used as display devices. However, liquid crystal panels have problems such as slow response time, high power consumption, and difficulty in compacting because they are not self-illuminating and require backlights. In addition, OLED panels do not require backlights because they are self-illuminating, and can be made thinner, but they are vulnerable to burn-in (deterioration) when the same screen is displayed for a long time, in which the sub-pixels reach the end of their lifespan and certain parts of the previous screen remain as they are even when the screen is changed.

[0004] As a result, research is being conducted into micro light-emitting diode (micro LED or μLED) display panels, which use inorganic light-emitting elements mounted on a substrate and use the inorganic light-emitting elements themselves as pixels, as a new panel to replace these.

[0005] A micro light emitting diode display panel (hereinafter referred to as a micro LED panel) is a type of flat display panel that is composed of multiple inorganic light emitting diodes (inorganic LEDs), each of which is less than 100 μm in size.

[0006] Although such LED panels are also self-emitting devices, they are inorganic light-emitting devices, so they do not suffer from the burn-in phenomenon of OLEDs and have excellent brightness, resolution, power consumption, and durability. Summary of the Invention [Problem to be solved by the invention]

[0007] Compared to liquid crystal display (LCD) panels that require backlighting, micro LED display panels offer better contrast, response time and energy efficiency. Both organic light emitting diodes (organic LEDs) and inorganic light emitting elements, micro LEDs, are energy efficient, but micro LEDs have higher brightness, luminous efficiency and a longer lifespan than OLEDs.

[0008] In addition, by arranging LEDs on a circuit board in pixel units, display modularization is possible for each board, and it is easy to manufacture various resolutions and screen sizes according to consumer orders. [Means for solving the problem]

[0009] A display device according to the concept of the present invention includes a plurality of display modules and a frame supporting the plurality of display modules, the plurality of display modules being arranged in an M*N matrix form on the frame, the frame including a frame panel having a first side and a second side opposite to the first side, the frame panel including a first opening formed on the first side and a second opening formed on the second side penetrating the frame panel, an insertion portion having a size of the first opening larger than a size of the second opening, and a stud provided on the insertion portion.

[0010] The insertion portion may be provided such that the first opening and the second opening form a step.

[0011] The insertion portion may be tapered from the first side to the second side.

[0012] The stud may include a coupling portion having an opening toward the second opening, and the coupling portion may include threads formed on an inner circumferential surface.

[0013] The display device may further include a bracket detachably coupled to the stud through the second opening, and the bracket may include at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

[0014] The frame may further include a reinforcing member attached to the first side of the frame panel and configured to cover the first opening.

[0015] The plurality of display modules may be attached to the stiffening member.

[0016] The frame panel may further include a first metal layer forming the first side of the frame panel, a second metal layer forming the second side of the frame panel, and a resin layer disposed between the first metal layer and the second metal layer.

[0017] A size of a portion of the insertion portion formed in the resin layer may be the same as a size of another portion of the insertion portion formed in the first metal layer.

[0018] Each of the surface formed on the first side and the surface formed on the second side may be flat.

[0019] In another aspect, a method for manufacturing a display device according to the concept of the present invention includes providing a frame panel having a first side and a second side opposite the first side, forming an insertion portion penetrating the frame panel, the insertion portion including a first opening formed on the first side and a second opening formed on the second side, the first opening being larger in size than the second opening, inserting a stud into the insertion portion through the first opening, and detachably coupling a bracket to the stud through the second opening.

[0020] Forming the insertion portion may include forming the insertion portion such that a step is formed between the first opening and the second opening.

[0021] Forming the insertion portion may include forming the insertion portion in a tapered shape from the first side to the second side.

[0022] The stud may include a coupling portion having an opening toward the second opening, the coupling portion including threads formed on an inner circumferential surface of the coupling portion.

[0023] The method of manufacturing the display device may further include attaching a reinforcing member to the first side of the frame panel after inserting the stud into the insertion portion.

[0024] The method of manufacturing the display device may further include attaching the reinforcing member to the first side of the frame panel, and then forming a module opening in the frame panel and the reinforcing member.

[0025] The method for manufacturing a display device may include forming the module openings and then attaching a plurality of display modules to the reinforcing member.

[0026] The bracket may include at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

[0027] Forming the inset may include forming the inset from the first side using at least one of a shaping tool, a water jet, and a laser.

[0028] Each of the surface formed on the first side and the surface formed on the second side may be flat. Effect of the Invention

[0029] According to various embodiments, a display device can improve the pull-out or torque resistance of a frame for multiple display modules.

[0030] According to various embodiments, the display device has a flat surface formed on the first side of the frame panel without any protruding parts, thereby ensuring a flat surface for tiling multiple display modules attached to the front surface of the frame. [Brief description of the drawings]

[0031] [Figure 1] 1 illustrates a display device according to an embodiment of the present invention.

[0032] [Diagram 2] The main components of the display device shown in FIG. 1 are shown in exploded view.

[0033] [Diagram 3] 2 shows an enlarged cross-sectional view of a portion of a display module of the display device shown in FIG. 1.

[0034] [Figure 4] 2 shows the rear face of one display module of the display device shown in FIG. 1.

[0035] [Diagram 5] 3 shows the frame shown in FIG. 2 and a bracket coupled to the rear side of the frame.

[0036] [Figure 6] The cross section taken along line A-A' shown in FIG. 5 is shown.

[0037] [Figure 7] The E part shown in FIG. 6 is shown in enlarged form.

[0038] [Figure 8] The cross section taken along line B-B' shown in FIG. 5 is shown.

[0039] [Figure 9] The cross section taken along line CC' shown in Figure 5 is shown.

[0040] [Figure 10] The cross section taken along line D-D' shown in FIG. 5 is shown.

[0041] [Figure 11] This shows a state in which the frame panel shown in Figure 5 is installed.

[0042] [Figure 12] 12 shows a state in which a stud is inserted into the insertion portion of the frame panel shown in FIG. 11.

[0043] [Figure 13] 13 shows another embodiment of the insert portion of the frame panel shown in FIG.

[0044] [Figure 14] This shows a state in which a reinforcing member is adhered to the frame panel shown in Figure 12.

[0045] [Figure 15] This shows a state in which a module opening is formed in the frame shown in FIG.

[0046] [Figure 16] 16 shows a state in which a bracket is attached to the frame shown in FIG. 15. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0047] Additional aspects of the present disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the present disclosure.

[0048] The embodiments described in this specification are merely the most preferred embodiments of the present invention and do not fully represent the technical ideas of the present invention. It should be understood that various equivalents or modifications that can replace these at the time of filing this application are also included in the scope of the present invention.

[0049] In the description, the singular expression may include the plural expression unless otherwise clearly indicated in the context. The shapes and sizes of elements in the drawings may be exaggerated for clarity.

[0050] In this specification, the terms "comprise" or "have" are intended to indicate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are to be understood as not precluding the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0051] In addition, in this specification, the meaning of "identical" includes things that have similar attributes or are similar within a certain range. Also, "identical" means "substantially the same." It should be understood that the meaning of "substantially the same" includes numerical values ​​that fall within the manufacturing error range or numerical values ​​that fall within a meaningless range of differences from a reference numerical value, and are included in the range of "being the same."

[0052] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0053] Fig. 1 shows a display device according to an embodiment of the present invention. Fig. 2 shows an exploded view of the main components of the display device shown in Fig. 1. Fig. 3 shows an enlarged cross-sectional view of a portion of a display module of the display device shown in Fig. 1. Fig. 4 shows the rear surface of one display module of the display device shown in Fig. 1.

[0054] The multiple inorganic light-emitting elements 50 and some components of the display device 1 shown in the drawings are micro-scale components having a size of several μm to several hundred μm, and for ease of explanation, the scale of some components (multiple inorganic light-emitting elements 50, black matrix 48, etc.) is exaggerated.

[0055] The display device 1 is a device that displays information, materials, data, etc. in the form of characters, figures, graphs, images, etc., and may be implemented as a TV, a PC, a mobile device, or a digital signage.

[0056] According to an embodiment of the present invention, as shown in Figures 1 and 2, the display device 1 may include a display panel 20 for displaying images, a power supply device (not shown) for supplying power to the display panel 20, a main board 25 for controlling the overall operation of the display panel 20, a frame 100 for supporting the display panel 20, and a rear cover 10 for covering the rear surface of the frame 100.

[0057] The display panel 20 may include a number of display modules 30A-30w, a driver board (not shown) that drives each of the display modules 30A-30w, and a Timing controller board (TOCN) that generates timing signals required to control each of the display modules 30A-30w.

[0058] The rear cover 10 can support a display panel 20. The rear cover 10 can be installed on the floor through a stand (not shown) or installed on a wall through a hanger (not shown) or the like.

[0059] The display modules 30A-30w may be arranged vertically and horizontally adjacent to each other. The display modules 30A-30w may be arranged in an M*N matrix. In this embodiment, the display modules 30A-30w are provided in a number of 16 and arranged in a 7*7 matrix, but the number and arrangement of the display modules 30A-30w are not limited.

[0060] The plurality of display modules 30A-30w may be mounted on the frame 100. The plurality of display modules 30A-30w may be mounted on the frame 100 by various known methods, such as magnetic force using a magnet, a mechanical clamping structure, or adhesion. A rear cover 10 is coupled to the rear of the frame 100, and the rear cover 10 may form the rear appearance of the display device 1.

[0061] The rear cover 10 may include a metal material, so that heat generated from the plurality of display modules 30A-30w and the frame 100 may be easily conducted to the rear cover 10, thereby improving the heat dissipation efficiency of the display device 1.

[0062] In this manner, the display device 1 according to the embodiment of the present invention can implement a large screen by tiling a plurality of display modules 30A-30w.

[0063] Unlike the embodiment of the present invention, each of the plurality of display modules 30A-30w may be applied to a display device, i.e., the display modules 30A-30w may be installed and applied as a single unit to a wearable device, a portable device, a handheld device, and various electronic products and electrical equipment requiring displays, and may be applied to display devices such as PC (personal computer) monitors, high-resolution TVs, signage, electronic displays, etc. through a matrix type of multiple assembly arrangement as in the embodiment of the present invention.

[0064] The display modules 30A-30w may have the same configuration as each other, so that the following description of any one of the display modules may be equally applied to all the other display modules.

[0065] Taking the first display module 30A among the plurality of display modules 30A-30w as an example, the first display module 30A may be formed in a quadrangle type. The first display module 30A may be provided in a rectangular type or a square type.

[0066] Therefore, the first display module 30A may include edges 31, 32, 33, and 34 formed in the up, down, left and right directions based on a first direction X, which is the front.

[0067] As shown in Fig. 3, each of the display modules 30A-30w may include a substrate 40 and a plurality of inorganic light-emitting elements 50 mounted on the substrate 40. The inorganic light-emitting elements 50 may be mounted on a mounting surface 41 of the substrate 40 facing a first direction X. In Fig. 3, for convenience of explanation, the thickness of the substrate 40 in the first direction X is exaggerated.

[0068] The substrate 40 may be formed in a quadrangle type. As described above, the display modules 30A-30w may each be provided in a quadrangle shape, and the substrate 40 may be formed in a quadrangle type corresponding thereto.

[0069] The substrate 40 may be provided in a rectangular or square type shape.

[0070] Therefore, taking the first display module 30A as an example, the substrate 40 may include four edges corresponding to the edges 31, 32, 33, and 34 of the first display module 30A formed in the up, down, left, and right directions based on the first direction X, which is the front.

[0071] The substrate 40 may include a base substrate 42, a mounting surface 41 that forms one side of the base substrate 42, a rear surface 43 that forms the other side of the base substrate 42 and is positioned opposite the mounting surface 41, and a side surface 45 that is positioned between the mounting surface 41 and the rear surface 43.

[0072] The substrate 40 may include a TFT layer (Thin Film Transistor, 44) formed on a base substrate 42 to drive the inorganic light emitting element 50. The base substrate 42 may include a glass substrate. That is, the substrate 40 may include a COG (Chip on Glass) type substrate. First and second pad electrodes 44a and 44b may be formed on the substrate 40 to electrically connect the inorganic light emitting element 50 to the TFT layer 44.

[0073] The TFTs (Thin Film Transistors) constituting the TFT layer 44 are not limited to a specific structure or type and may be configured in various embodiments. That is, the TFTs of the TFT layer 44 according to an embodiment of the present invention may be embodied as LTPS (Low Temperature Poly Silicon) TFTs, oxide TFTs, Si (polysilicon or a-silicon) TFTs, as well as organic TFTs, graphene TFTs, etc.

[0074] Also, the TFT layer 44 can be replaced by a CMOS (Complementary Metal-Oxide Semiconductor) type or an n-type MOSFET or p-type MOSFET transistor when the base substrate 42 of the substrate 40 is provided by a silicon wafer.

[0075] The inorganic light emitting devices 50 may be made of an inorganic material and may include inorganic light emitting devices having a width, length and height of several μm to several tens of μm. The micro inorganic light emitting device may have a short side of 100 μm or less among the width, length and height. That is, the inorganic light emitting devices 50 may be picked up from a wafer made of sapphire or silicon material and directly transferred onto the substrate 40. The inorganic light emitting devices 50 may be picked up and transferred by an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicone as a head.

[0076] The inorganic light emitting elements 50 may be a light emitting structure including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b.

[0077] Although not shown in the drawing, one of the first contact electrode 57a and the second contact electrode 57b may be electrically connected to the n-type semiconductor 58a, and the other may be electrically connected to the p-type semiconductor 58b.

[0078] The first contact electrode 57a and the second contact electrode 57b may be arranged horizontally in a flip chip manner in which they are arranged in the same direction (opposite to the light emission direction).

[0079] When mounted on the mounting surface 41, the inorganic light-emitting element 50 has a light-emitting surface 54 arranged toward the first direction X, a side surface 55, and a bottom surface 56 arranged on the opposite side of the light-emitting surface 54, and the first contact electrode 57a and the second contact electrode 57b can be formed on the bottom surface 56.

[0080] That is, the first and second contact electrodes 57a, 57b of the inorganic light emitting element 50 are disposed on opposite sides of the light emitting surface 54, and thus can be disposed on opposite sides of the direction in which light is irradiated.

[0081] The first and second contact electrodes 57a, 57b are arranged opposite the mounting surface 41 and are provided so as to be electrically connected to the TFT layer 44, and an emission surface 54 may be arranged to emit light in the opposite direction to the direction in which the first and second contact electrodes 57a, 57b are arranged.

[0082] Therefore, when light generated from the active layer 58c is emitted in the first direction X through the light emitting surface 54, the light can be emitted in the first direction X without interference from the first contact electrode 57a or the second contact electrode 57b.

[0083] That is, the first direction X may be defined as the direction in which the light-emitting surface 54 is disposed to emit light.

[0084] The first contact electrode 57a and the second contact electrode 57b can be electrically connected to a first pad electrode 44a and a second pad electrode 44b formed on the mounting surface 41 of the substrate 40, respectively.

[0085] The inorganic light emitting element 50 can be directly connected to the pad electrodes 44a, 44b through a bonding structure such as an anisotropic conductive layer 47 or solder.

[0086] An anisotropic conductive layer 47 may be formed on the substrate 40 to mediate electrical connection between the contact electrodes 57a, 57b and the pad electrodes 44a, 44b. The anisotropic conductive layer 47 may have a structure in which an anisotropic conductive adhesive is attached onto a protective film, and conductive balls 47a are dispersed in adhesive resin. The conductive balls 47a are conductive spheres surrounded by a thin insulating film, and the insulating film may be cracked by pressure to electrically connect the conductors to each other.

[0087] The anisotropic conductive layer 47 may include an anisotropic conductive film (ACF) in a film form and an anisotropic conductive paste (ACP) in a paste form.

[0088] Therefore, when multiple inorganic light-emitting elements 50 are mounted on the substrate 40, if pressure is applied to the anisotropic conductive layer 47, the insulating film of the conductive ball 47a may crack, electrically connecting the contact electrodes 57a, 57b of the inorganic light-emitting elements 50 to the pad electrodes 44a, 44b of the substrate 40.

[0089] Although not shown in the drawings, the inorganic light emitting elements 50 may be mounted on the substrate 40 through solder (not shown) instead of the anisotropic conductive layer 47. After the inorganic light emitting elements 50 are aligned on the substrate 40, the inorganic light emitting elements 50 may be bonded to the substrate 40 through a reflow process.

[0090] The inorganic light emitting elements 50 may include a red light emitting element 51, a green light emitting element 52, and a blue light emitting element 53, and the inorganic light emitting elements 50 may be mounted on the mounting surface 41 of the substrate 40 as a unit of a series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53. The series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53 may form one pixel. In this case, the red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53 may each form a subpixel.

[0091] The red light emitting element 51, the green light emitting element 52, and the blue light emitting element 53 may be arranged in a row at a predetermined interval as in the embodiment of the present invention, or may be arranged in a different shape, such as a triangular shape.

[0092] The substrate 40 may include a light absorbing layer 44c to absorb external light and improve contrast. The light absorbing layer 44c may be formed on the overall mounting surface 41 side of the substrate 40. The light absorbing layer 44c may be formed between the TFT layer 44 and the anisotropic conductive layer 47.

[0093] The display modules 30A-30w may further include a black matrix 48 formed between the inorganic light emitting elements 50.

[0094] The black matrix 48 may function to complement the light absorbing layer 44c formed over the entire mounting surface 41 of the substrate 40. That is, the black matrix 48 may improve the contrast of the screen by absorbing external light and making the substrate 40 appear black.

[0095] The black matrix 48 may have a black color.

[0096] In this embodiment, the black matrix 48 is formed to be disposed between pixels formed by a series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53. However, unlike this embodiment, the black matrix 48 may be formed more densely to separate the light emitting elements 51, 52, and 53, which are sub-pixels.

[0097] The black matrix 48 may be formed in a lattice shape having horizontal and vertical patterns so as to be disposed between pixels.

[0098] The black matrix 48 can be formed by applying a light-absorbing ink onto the anisotropic conductive layer 47 through an ink-jet process and then curing the ink, or by coating the anisotropic conductive layer 47 with a light-absorbing film.

[0099] That is, in the anisotropic conductive layer 47 formed on the entire mounting surface 41, a black matrix 48 may be formed between the inorganic light emitting elements 50 on which the inorganic light emitting elements 50 are not mounted.

[0100] The multiple display modules 30A-30w may each include a front cover 49 disposed on the mounting surface 41 in the first direction X to cover the mounting surface 41 of the multiple display modules 30A-30w.

[0101] The front cover 49 may be provided in a plurality of positions in the first direction X so as to be formed on the plurality of display modules 30A-30w, respectively.

[0102] The front cover 49 may include a film (not shown).

[0103] The film (not shown) of the front cover 49 may be provided with a functional film having optical properties.

[0104] The front cover 49 is provided to cover the substrate 40 and can protect the substrate 40 from external forces.

[0105] Typically, the adhesive layer (not shown) of the front cover 49 may be provided to have a height equal to or greater than a predetermined height in the first direction X in which the mounting surface 41 or the light-emitting surface 54 faces in order to sufficiently fill gaps that may be formed between the front cover 49 and the inorganic light-emitting elements 50 when the front cover 49 is disposed on the substrate 40.

[0106] Each of the display modules 30A-30w may include a heat dissipation member 60 provided on the rear surface 43 of the substrate 40 for dissipating heat generated from the substrate 40.

[0107] The heat generated from the substrate 40 may include heat generated from various components. The heat that occupies the largest proportion of the various heat generated from the substrate 40 and transferred to the rear surface 43 is heat generated when the inorganic light emitting elements 50 emit light. However, in addition to this, heat may be generated from multiple components disposed on the mounting surface 41 of the substrate 40, such as the TFT layer 44, and the heat generated from the multiple components may flow into the substrate 40.

[0108] In addition, heat may be transferred from the outside of the substrate 40 to the substrate 40 through an external structure of the substrate 40, and thus heat may be generated from the substrate 40.

[0109] The heat generated from the substrate 40 described below refers to heat generated from a plurality of components disposed on the substrate 40 including the plurality of inorganic light emitting devices 50 and flowing into the substrate 40 .

[0110] In particular, as described above, the heat generated from the inorganic light emitting elements 50 flows into the substrate 40 in the greatest amount, and the heat that occupies the greatest proportion of the heat generated from the substrate 40 is the heat generated from the inorganic light emitting elements 50. However, as described above, it can be expressed that the heat is generated from the substrate 40 due to various components other than the inorganic light emitting elements 50 and heat generated from the outside of the substrate 40. Also, each of the display modules 30A-30w may include an adhesive tape 70 disposed between the rear surface 43 of the substrate 40 and the heat dissipation member 60 to adhere the rear surface 43 of the substrate 40 to the heat dissipation member 60.

[0111] The inorganic light-emitting elements 50 may be electrically connected to pixel driving wiring (not shown) formed on the mounting surface 41 and an upper wiring layer (not shown) formed of the pixel driving wiring (not shown) extending through the side 45 of the substrate 40.

[0112] The upper wiring layer (not shown) may be electrically connected to a side wiring (not shown) formed on a side surface 45 of the substrate 40. The side wiring (not shown) may be provided in a thin film form.

[0113] The upper wiring layer (not shown) may be connected to the side wiring (not shown) by upper connection pads (not shown) formed on the edge side of the substrate 40 .

[0114] The side wiring (not shown) may extend along the side surface 45 of the substrate 40 and be connected to a rear wiring layer 43 b formed on the rear surface 43 .

[0115] An insulating layer 43c that covers the rear wiring layer 43b may be formed on the rear wiring layer 43b in the direction toward the rear surface of the substrate 40.

[0116] That is, the inorganic light emitting elements 50 may be electrically connected in sequence to an upper wiring layer (not shown), a side wiring (not shown), and a rear wiring layer 43b.

[0117] 4, the display module 30A may include a driving circuit board 80 provided to electrically control the inorganic light-emitting elements 50 mounted on the mounting surface 41. The driving circuit board 80 may be formed of a printed circuit board. The driving circuit board 80 may be disposed on the rear surface 43 of the substrate 40 in the first direction X. The driving circuit board 80 may be disposed on the heat dissipation member 60 adhered to the rear surface 43 of the substrate 40.

[0118] The display module 30A may include a flexible film 81 connecting the driving circuit board 80 and the rear wiring layer 43b so that the driving circuit board 80 is electrically connected to the inorganic light emitting elements 50.

[0119] One end of the flexible film 81 may be disposed on the rear surface 43 of the substrate 40 and connected to a rear connection pad 43 d that is electrically connected to the inorganic light emitting elements 50 .

[0120] The rear connection pads 43d may be electrically connected to the rear wiring layer 43b, so that the rear connection pads 43d may electrically connect the rear wiring layer 43b and the flexible film 81.

[0121] The flexible film 81 is electrically connected to the rear connection pad 43 d to transmit power and electrical signals from the driving circuit board 80 to the inorganic light emitting elements 50 .

[0122] The flexible film 81 may be formed of an FFC (Flexible Flat Cable) or a COF (Chip On Film), or the like.

[0123] The flexible film 81 may include a first flexible film 81a and a second flexible film 81b that are disposed in the upper and lower directions with respect to a first direction X that is the forward direction.

[0124] The first and second flexible films 81a, 81b are not limited thereto, and may be arranged in the left-right direction with respect to the first direction X, or may be arranged in at least two directions among the up, down, left, and right directions.

[0125] The second flexible film 81b may be provided in a plurality of pieces, but is not limited thereto, and the second flexible film 81b may be provided in a single piece, and the first flexible film 81a may also be provided in a plurality of pieces.

[0126] The first flexible film 81a can transmit data signals from the driving circuit board 80 to the substrate 40. The first flexible film 81a can be provided as a COF.

[0127] The second flexible film 81b can transmit power from the driving circuit board 80 to the substrate 40. The second flexible film 81b can be provided as an FFC.

[0128] However, without being limited thereto, the first and second flexible films 81a and 81b may be formed in an opposite manner.

[0129] Although not shown in the drawings, the driving circuit board 80 may be electrically connected to the main board 25 (see FIG. 2). The main board 25 may be disposed on the rear side of the frame 100, and the main board 25 may be connected to the driving circuit board 80 from the rear of the frame 100 through a cable (not shown).

[0130] As described above, the heat dissipation member 60 may be provided so as to be in contact with the substrate 40. The heat dissipation member 60 and the substrate 40 may be adhered to each other by an adhesive tape 70 disposed between the rear surface 43 of the substrate 40 and the heat dissipation member 60.

[0131] The heat dissipation member 60 may be made of a material having high thermal conductivity, and may be embodied in a configuration having high thermal conductivity. For example, the heat dissipation member 60 may be made of an aluminum material.

[0132] Heat generated from the inorganic light emitting elements 50 and the TFT layer 44 mounted on the substrate 40 can be transferred to the heat dissipation member 60 through the adhesive tape 70 along the rear surface 43 of the substrate 40 .

[0133] Therefore, the heat generated from the substrate 40 can be easily transferred to the heat dissipation member 60, and the substrate 40 can be prevented from rising above a certain temperature.

[0134] The plurality of display modules 30A-30w may be arranged in various positions in a matrix form of M*N. Each display module 30A-30w is provided to be individually movable. In this case, each display module 30A-30w includes a heat dissipation member 60, so that a certain level of heat dissipation performance can be maintained regardless of the position where each display module 30A-30w is arranged.

[0135] A plurality of display modules 30A-30w can be arranged in various M*N matrix forms to form various sized screens of the display device 1. As a result, rather than dissipating heat through a single heat dissipation member provided for heat dissipation, each display module 30A-30w includes an independent heat dissipation member 60 as in one embodiment of the present invention, and each display module 30A-30w dissipates heat individually, thereby improving the heat dissipation performance of the entire display device 1.

[0136] When a single heat dissipation member is arranged inside the display device 1, a portion of the heat dissipation member may not be arranged at a position corresponding to a position where some display modules are arranged based on the front-to-back direction, and the heat dissipation member may be arranged at a position where no display module is arranged, which may reduce the heat dissipation efficiency of the display device 1.

[0137] In other words, regardless of where each display module 30A-30w is positioned, all display modules 30A-30w can dissipate heat by themselves through their respective heat dissipation members 60, thereby improving the heat dissipation performance of the entire display device 1.

[0138] The heat dissipation member 60 may be provided in a rectangular shape that generally corresponds to the shape of the substrate 40 .

[0139] The area of ​​the substrate 40 may be at least equal to or greater than the area of ​​the heat dissipation member 60. When the substrate 40 and the heat dissipation member 60 are arranged side by side in the first direction X, the four edges of the rectangular substrate 40 may be formed to correspond to the four edges of the heat dissipation member 60 based on the center of the substrate 40 and the heat dissipation member 60, or may be disposed more outwardly than the four edges of the heat dissipation member 60 based on the center of the substrate 40 and the heat dissipation member 60.

[0140] The four edges of the substrate 40 may be disposed outside the four edges of the heat dissipation member 60. That is, the area of ​​the substrate 40 may be larger than the area of ​​the heat dissipation member 60.

[0141] This is because when heat is transferred to each display module 30A-30w, the substrate 40 and the heat dissipation member 60 may thermally expand, but since the heat dissipation member 60 has a higher thermal expansion coefficient than the substrate 40, the amount by which the heat dissipation member 60 expands is greater than the amount by which the substrate 40 expands.

[0142] In this case, when the four edges of the substrate 40 correspond to or are disposed more inward than the four edges of the heat dissipation member 60 , the edges of the heat dissipation member 60 may protrude outward from the substrate 40 .

[0143] As a result, the distance between the gaps formed between the display modules 30A-30w may become irregular due to thermal expansion of the heat dissipation members 60 of the display modules 30A-30w, which may increase the visibility of some seams and reduce the unity of the screen of the display panel 20.

[0144] However, when the four edges of the substrate 40 are positioned outside the four edges of the heat dissipation member 60, even if the substrate 40 and the heat dissipation member 60 thermally expand, the heat dissipation member 60 does not protrude outside the four edges of the substrate 40, and thus the distance between the gaps formed between each of the display modules 30A-30w can be maintained constant.

[0145] According to an embodiment of the present invention, the area of ​​the substrate 40 and the area of ​​the heat dissipation member 60 may be set to roughly correspond to each other, so that heat generated from the substrate 40 may be dissipated uniformly over the entire area of ​​the substrate 40, rather than being isolated to a certain area of ​​the substrate 40.

[0146] The heat dissipation member 60 can be provided so as to be adhered to the rear surface 43 of the substrate 40 by an adhesive tape 70 .

[0147] The adhesive tape 70 may be provided in a size corresponding to the heat dissipation member 60. That is, the area of ​​the adhesive tape 70 may be provided so as to correspond to the area of ​​the heat dissipation member 60. The heat dissipation member 60 may be provided in a roughly rectangular shape, and the adhesive tape 70 may be provided in a corresponding rectangular shape.

[0148] The edges of the rectangular heat dissipation member 60 and the adhesive tape 70 may be formed to correspond to each other based on the centers of the heat dissipation member 60 and the adhesive tape 70 .

[0149] Accordingly, the heat dissipation member 60 and the adhesive tape 70 can be easily manufactured in one combined structure, so that the manufacturing efficiency of the entire display device 1 can be increased.

[0150] In other words, when the heat dissipation members 60 are cut into unit pieces from one plate, the adhesive tape 70 is first adhered to one plate before the heat dissipation members 60 are cut, and the adhesive tape 70 and the heat dissipation members 60 are cut into unit pieces simultaneously, resulting in a reduction in the number of processes.

[0151] Heat generated from the substrate 40 may be transferred to the heat dissipation member 60 through the adhesive tape 70. Thus, the adhesive tape 70 may be provided to attach the heat dissipation member 60 to the substrate 40 and to transfer the heat generated from the substrate 40 to the heat dissipation member 60 at the same time.

[0152] This allows the adhesive tape 70 to contain a material with high heat dissipation performance.

[0153] The adhesive tape 70 may include a material having adhesive properties for bonding the substrate 40 and the heat dissipation member 60 together.

[0154] The adhesive tape 70 may include a material having a higher heat dissipation performance than a material having general adhesive properties, which allows the heat to be efficiently transferred between the substrate 40 and the heat dissipation member 60.

[0155] Furthermore, the adhesive material of the adhesive tape 70 can be made of a material that has higher heat dissipation performance than the adhesive material that constitutes a general adhesive.

[0156] A material with high heat dissipation performance means a material that has high thermal conductivity, high thermal transferability, and low specific heat, and thus can transfer heat effectively.

[0157] As an example, the adhesive tape 70 may include a graphite material, but is not limited thereto, and the adhesive tape 70 may generally be made of a material having high heat dissipation performance.

[0158] The flexibility of the adhesive tape 70 may be greater than the flexibility of the substrate 40 and the flexibility of the heat dissipation member 60. Thus, the adhesive tape 70 may be made of a material that has adhesiveness and heat dissipation properties as well as high flexibility. The adhesive tape 70 may be formed as an inorganic double-sided tape. The adhesive tape 70 may be formed as an inorganic double-sided tape, and may be formed as a single layer without a base material supporting one side and the other side between one side that is adhered to the substrate 40 and the other side that is adhered to the heat dissipation member 60.

[0159] Since the adhesive tape 70 does not include a base material, it does not include materials that hinder heat conduction, which can improve heat dissipation performance. However, the adhesive tape 70 is not limited to inorganic double-sided tape, and can be a heat dissipation tape that has better heat dissipation performance than a general double-sided tape.

[0160] The substrate 40 is made of a glass material and the heat dissipation member 60 is made of a metal material, and the material properties of the glass material and the metal material are different, so that the materials may be deformed to different degrees by the same heat. That is, when heat is generated from the substrate 40, the substrate 40 and the heat dissipation member 60 may thermally expand to different sizes due to the heat. This may cause a problem that the display module 30A may be damaged.

[0161] This is because when the substrate 40 and the heat dissipation member 60 are fixed to each other, the substrate 40 and the heat dissipation member 60 have different expansion values ​​at the same temperature, and therefore expand at different sizes, which can cause stress in each component.

[0162] Among the material properties, the thermal expansion coefficients of the materials of the substrate 40 and the heat dissipation member 60 are different, and the degree to which the materials are physically deformed by heat varies. In particular, since the thermal expansion coefficient of metal materials is generally greater than that of glass, when the same heat is transferred to the substrate 40 and the heat dissipation member 60, the heat dissipation member 60 may expand and deform more than the substrate 40.

[0163] Conversely, when heat generation in the substrate 40 is terminated and the substrate 40 and the heat dissipation member 60 are cooled, the heat dissipation member 60 may shrink and deform more than the substrate 40 .

[0164] Since the substrate 40 and the heat dissipation member 60 are adhered to each other by the adhesive tape 70 , when the heat dissipation member 60 is deformed more than the substrate 40 , an external force can be transmitted to the substrate 40 .

[0165] On the other hand, an external force may be transmitted to the heat dissipation member 60 through the substrate 40, but since the rigidity of the substrate 40 made of glass is less than the rigidity of the heat dissipation member 60 made of metal, the substrate 40 may be damaged.

[0166] The adhesive tape 70 may be provided between the substrate 40 and the heat dissipation member 60 to absorb external forces transmitted from different configurations as the substrate 40 and the heat dissipation member 60 expand in different sizes.

[0167] This makes it possible to prevent external forces from being transmitted to the substrate 40 and the heat dissipation member 60, and in particular to prevent the substrate 40 from being damaged.

[0168] The adhesive tape 70 may be made of a highly flexible material to absorb external forces transmitted to the substrate 40 and the heat dissipation member 60. More specifically, the flexibility of the adhesive tape 70 may be greater than the flexibility of the substrate 40 and the heat dissipation member 60.

[0169] As a result, when an external force generated by a change in size of the substrate 40 and the heat dissipation member 60 is transmitted to the adhesive tape 70, the adhesive tape 70 itself is deformed, thereby preventing the external force from being transmitted to different configurations.

[0170] The adhesive tape 70 may have a predetermined thickness in the first direction X. When heat is transferred to the heat dissipation member 60 and the heat expands or when the heat is cooled and contracts, the heat dissipation member 60 may expand or contract not only in the first direction X but also in a direction perpendicular to the first direction X, thereby transmitting an external force to the substrate 40.

[0171] As described above, the display panel 20 may display a screen using the plurality of display modules 30A-30w. At this time, the integrity of the screen may be reduced due to seams formed due to gaps formed between the plurality of display modules 30A-30w.

[0172] Thus, the multiple display modules 30A-30w may be arranged on the frame 100 to form a constant gap therebetween in order to minimize the perception of seams in the display panel 20. When the gaps formed by the multiple display modules 30A-30w are not constant, the perception of the seams due to some of the gaps may be amplified.

[0173] In the case of a conventional display device, a frame that supports a display panel is provided using a metal material, and a plurality of display modules can be tiled on the metal frame.

[0174] As the display device operates, heat generated from the display panel may cause the substrate forming the plurality of display modules 30A-30w to thermally expand. As described above, the plurality of display modules 30A-30w are supported by a frame made of a metal material, and the thermal expansion of the substrate and the frame may cause irregular gaps between the plurality of display modules 30A-30w, resulting in a problem of increased visibility of seams.

[0175] That is, the substrates of the display modules 30A-30w are all made of glass and each substrate may thermally expand at a constant value, but the width of the gaps between the display modules 30A-30w may be irregular due to thermal expansion of the metal frame supporting each substrate, because the physical properties of the metal material and the glass material are different.

[0176] The material properties of the materials may differ depending on the thermal expansion coefficient, specific heat, thermal conductivity, etc. In particular, the degree of thermal expansion of the substrate and the frame may differ depending on the difference between the thermal expansion coefficient of the metal material and the thermal expansion coefficient of the glass.

[0177] Due to thermal expansion of the substrates of the display modules 30A-30w, as well as thermal expansion of the frame to which the display modules 30A-30w are attached, the spacing between the display modules 30A-30w may vary irregularly.

[0178] In this manner, in order to prevent irregular gaps between the display modules 30A-30w due to thermal expansion caused by arraying the display modules 30A-30w on a frame made of a metal material, the frame 100 of the display device 1 according to one embodiment of the present invention may be made of a material to which the display modules 30A-30w are adhered and which has material properties similar to those of the substrates 40 of the display modules 30A-30w.

[0179] That is, the frame 100 may be provided to have similar material properties to the substrate 40 so that the distances of the gaps formed between the display modules 30A-30w are kept constant.

[0180] The above-mentioned meaning of being formed with similar material properties to those of the substrate 40 may include the meaning that the thermal expansion coefficient, specific heat, and thermal conductivity are similar to those of the substrate 40. In particular, according to one embodiment of the present invention, this may be interpreted as meaning that the thermal expansion coefficient of the substrate 40 corresponds to that of the frame 100.

[0181] The frame 100 may be generally formed of a material having similar material properties or a similar thermal expansion coefficient to the material of the substrate 40. The frame 100 may be formed of a material having the same thermal expansion coefficient as the substrate 40.

[0182] Without being limited thereto, the frame 100 may include a front layer (not shown) formed of a material having material properties corresponding to those of the substrate 40 .

[0183] The substrate 40 may be bonded to a front layer (not shown) in a first direction X, such that when the same heat is transferred to the substrate 40 and the front layer (not shown) in a second direction Y or a third direction Z perpendicular to the first direction X, the substrate 40 and the front layer (not shown) may be configured to expand by corresponding lengths.

[0184] That is, when the entire frame 100 is formed of a material having material properties corresponding to those of the substrate 40, or when only the front layer (not shown) constituting the front surface of the frame 100 is formed of a material having material properties corresponding to those of the substrate 40, in either embodiment, the front surface of the frame 100 to which the substrate 40 of the display modules 30A-30w is adhered can thermally expand by the same amount as the substrate 40 when the substrates 40 of the multiple display modules 30A-30w thermally expand due to heat generated while the display device 1 is operating.

[0185] The front surface of the frame 100, which is the base surface to which the multiple display modules 30A-30w are attached, thermally expands at the same rate as the substrates 40 of the multiple display modules 30A-30w, so that the gap spacing formed between the multiple display modules 30A-30w can be maintained constant.

[0186] As a result, the gaps formed between the multiple display modules 30A-30w can maintain the same gap distance as when the substrate 40 is not thermally expanded, thereby maintaining a certain level of seams and maintaining the integrity of the screen of the display panel 20.

[0187] Therefore, even if heat generated by the operation of the display device 1 is supplied to the substrates 40 of the multiple display modules 30A-30w, the gap distance between the multiple display modules 30A-30w is maintained constant, thereby preventing the phenomenon in which some seams are amplified and the integrity of the screen is reduced.

[0188] The frame 100 is configured to support the display panel 20 and may be provided to have a rigidity of a predetermined size or more. Accordingly, the frame 100 may be formed of a metal material having a rigidity of a certain level or more, and the front surface of the frame 100 may be formed of a glass material corresponding to the substrate 40. However, the present invention is not limited thereto, and the frame 100 may be formed of a material having a thermal expansion coefficient different from that of the substrate 40.

[0189] The frame 100 according to an embodiment of the present invention will now be described in detail.

[0190] FIG 5 shows the frame shown in FIG 2 and a bracket coupled to the rear side of the frame. FIG 6 shows a cross section taken along line A-A' in FIG 5. FIG 7 shows an enlarged view of part E in FIG 6. FIG 8 shows a cross section taken along line B-B' in FIG 5. FIG 9 shows a cross section taken along line C-C' in FIG 5. FIG 10 shows a cross section taken along line D-D' in FIG 5.

[0191] 5 to 10, a frame 100 according to an embodiment of the present invention may include a frame panel 110. The frame panel 110 may have a first side 110a facing the plurality of display modules 30A-30w and a second side 110b opposite to the first side 110a. The first side 110a may face forward, and the second side 110b may face backward.

[0192] 6 and 7, the frame panel 110 may include an insertion portion 111 formed to penetrate in the front-rear direction. The insertion portion 111 may be provided such that the stud 120 is inserted into the insertion portion 111. The insertion portions 111 may be provided at positions and in numbers corresponding to the brackets 160, 172, 180, and 190 coupled to the frame 100.

[0193] A first opening 111a may be formed in a first side 110a of the frame panel 110. A second opening 111b may be formed in a second side 110b of the frame panel 110. The first opening 111a may be formed to have a different size from the second opening 111b. The first opening 111a may be larger in size than the second opening 111b. The insertion portion 111 may be provided such that the first opening 111a and the second opening 111b form a step.

[0194] Since the second opening 111b is formed smaller than the first opening 111a, when the stud 120 is inserted into the insertion portion 111 and the brackets 160, 172, 180, 190 are coupled to the stud 120, a portion of the frame panel 110 forming the second opening 111b can support the stud 120, thereby improving the pull-out force or torque resistance applied to the frame 100.

[0195] In addition, by forming the second opening 111b smaller than the first opening 111a and pushing the stud 120 into the insertion portion 111, the surfaces formed on the first side 110a and the second side 110b of the frame panel 110 can be formed flat without any protruding parts.

[0196] In particular, since the surface formed on the first side 110a of the frame panel 110 is formed flat without any protruding parts, the display device 1 according to one embodiment of the present invention can secure a flat surface for tiling multiple display modules 30A-30w attached to the front surface of the frame 100.

[0197] In addition, since the surface formed on the second side 110b of the frame panel 110 is formed flat without any protruding portion, it is possible to prevent the thickness of the display device 1 from being unnecessarily increased.

[0198] 7, the frame panel 110 may include a first metal layer 116 forming the first side 110a, a second metal layer 117 forming the second side 110b, and a resin layer 118 disposed between the first metal layer 116 and the second metal layer 117. With this configuration, the frame panel 110 may have excellent flatness and improved rigidity relative to weight.

[0199] The size of a portion of the insertion portion 111 formed in the resin layer 118 may be approximately the same as the size of another portion of the insertion portion 111 formed in the first metal layer 116. In other words, the size of the portion of the insertion portion 111 formed in the resin layer 118 may be larger than the size of the other portion of the insertion portion 111 formed in the second metal layer 117.

[0200] The first opening 111 a may be formed in the first metal layer 116 and the second opening 111 b may be formed in the second metal layer 117 .

[0201] 7, the stud 120 may be inserted into the insertion portion 111 through the first opening 111a. The stud 120 may include a coupling portion 120a that opens toward the second opening 111b. A thread 121 may be formed on an inner peripheral surface of the coupling portion 120a. The coupling portion 120a may also open toward the first opening 111a. The stud 120 may be supported by a portion of the frame panel 110 that forms the second opening 111b.

[0202] The frame 100 can include a number of module openings 101 formed to accommodate a number of display modules 30A-30w.

[0203] Brackets 160, 172, 180, and 190 may be detachably attached to the rear surface of the frame panel 110. The brackets 160, 172, 180, and 190 may be detachably coupled to the studs 120. The brackets 160, 172, 180, and 190 may include at least one of a board bracket 160, a chassis bracket 172, a mounting bracket 180, and a reinforcing bracket 190.

[0204] 5 and 6, a circuit board (not shown) for driving the display device 1 may be attached to the board bracket 160. A plurality of board brackets 160 may be provided. The board bracket 160 may include a board bracket hole 161. The board bracket hole 161 may be formed to correspond to the second opening 111b of the frame panel 110. A fastening member (not shown) may pass through the board bracket hole 161 and be coupled to the thread 121 of the stud 120, thereby fixing the board bracket 160 to the frame 100.

[0205] 5 and 8, the chassis bracket 172 may be provided to fix the front chassis 171, which is provided to cover an edge of the frame 100, to the frame 100. A plurality of chassis brackets 172 may be provided. The chassis bracket 172 may include a chassis bracket hole 173. The chassis bracket hole 173 may be formed to correspond to the second opening 111b of the frame panel 110. A fastening member (not shown) may pass through the chassis bracket hole 173 and be coupled to the thread 121 of the stud 120, thereby fixing the chassis bracket 172 to the frame 100. The front chassis 171 may be fixed to the chassis bracket 172 fixed to the frame 100.

[0206] 5 and 9, the mounting bracket 180 may be provided to be coupled to a wall mount (not shown) when fixing the display device 1 to a wall. The mounting bracket 180 may include a mounting bracket hole 181. The mounting bracket hole 181 may be formed to correspond to the second opening 111b of the frame panel 110. The mounting bracket 180 may be fixed to the frame 100 by a fastener (not shown) passing through the mounting bracket hole 181 and coupled to the thread 121 of the stud 120.

[0207] 5 and 10, the reinforcing bracket 190 may be provided to reinforce the strength of the frame 100. The reinforcing bracket 190 may extend in a substantially horizontal direction. The reinforcing bracket 190 may include a reinforcing bracket hole 191. The reinforcing bracket hole 191 may be formed to correspond to the second opening 111b of the frame panel 110. A fastening member (not shown) may pass through the reinforcing bracket hole 191 and be coupled to the thread 121 of the stud 120, thereby fixing the reinforcing bracket 190 to the frame 100.

[0208] Although not shown, the display device 1 may include a stand. An insertion portion 111 may be formed in the frame 100 into which a stud 120 for a bracket to be coupled to the stand may be inserted.

[0209] The frame 100 may include a reinforcing member 130 attached to the first side 110a of the frame panel 110. The reinforcing member 130 may be provided to cover the first opening 111a. The multiple display modules 30A-30w may be mounted on the reinforcing member 130. The reinforcing member 130 may be configured to include carbon fiber reinforced plastics (CFRP).

[0210] Fig. 11 shows the frame panel shown in Fig. 5 in place. Fig. 12 shows a stud being inserted into the insertion portion of the frame panel shown in Fig. 11. Fig. 13 shows another embodiment of the insertion portion of the frame panel shown in Fig. 12. Fig. 14 shows a reinforcing member bonded to the frame panel shown in Fig. 12. Fig. 15 shows a module opening formed in the frame shown in Fig. 14. Fig. 16 shows a bracket being attached to the frame shown in Fig. 15.

[0211] A process for manufacturing a display device 1 according to an embodiment of the present invention will be described with reference to FIGS.

[0212] 11, a frame panel 110 having a first metal layer 116, a second metal layer 117, and a resin layer 118 may be provided. An insert portion 111 may be formed in the frame panel 110. The insert portion 111 may be formed on a first side 110a of the frame panel 110. The insert portion 111 may be formed penetrating from the first side 110a to the second side 110b of the frame panel 110. The insert portion 111 may be formed in various positions in consideration of the types of brackets 160, 172, 180, and 190 to be attached to the frame 100.

[0213] The insert 111 may be formed in various ways, for example, by forming the insert 111 on the first side 110a of the frame panel 110 using at least one of a shape processing device, a water jet, and a laser.

[0214] The insert 111 may be formed using a shape processing device (not shown). The shape processing device may include a router. When the insert 111 is formed using the shape processing device, the insert 111 may be formed such that the first opening 111a and the second opening 111b have a stepped shape, as shown in FIG.

[0215] The insert 211 may be formed using a water jet and / or a laser. When the insert 211 is formed using a water jet and / or a laser, the insert 211 may be provided in a tapered shape from the first opening 211a to the second opening 211b as shown in Fig. 13. The insert 211 may be formed to decrease in size from the first metal layer 116 to the second metal layer 117.

[0216] 12, a stud 120 may be inserted into the frame panel 110 having the insertion portion 111 formed therein. The stud 120 may be pressed into the first side 110a. The stud 120 may be inserted into the insertion portion 111 in a direction facing the second opening 111b through the first opening 111a. Thus, when the stud 120 is inserted into the insertion portion 111, it may be supported by a portion of the frame panel 110 that forms the second opening 111b.

[0217] 14, after the stud 120 is inserted into the insertion portion 111 of the frame panel 110, the reinforcing member 130 can be attached to the first side 110a of the frame panel 110. In this way, the first opening 111a of the insertion portion 111 can be covered by the reinforcing member 130.

[0218] 15, after the reinforcing member 130 is attached to the frame panel 110, the module opening 101 may be formed in the frame panel 110 and the reinforcing member 130. By forming the module opening 101 after the reinforcing member 130 is attached to the frame panel 110, the manufacturing process may be simplified.

[0219] Referring to FIG. 16, brackets 160, 172, 180, and 190 may be attached to the frame 100 having the module opening 101 formed therein. Specifically, the board bracket 160 may be attached to the frame 100 by being coupled to a first stud at the second side 110b of the frame panel 110. The chassis bracket 172 may be attached to the frame 100 by being coupled to a second stud at the second side 110b of the frame panel 110. The mounting bracket 180 may be attached to the frame 100 by being coupled to a third stud at the second side 110b of the frame panel 110. The reinforcing bracket 190 may be attached to the frame 100 by being coupled to a fourth stud at the second side 110b of the frame panel 110. The brackets 160, 172, 180, and 190 may be detachably coupled to the first to fourth studs through the second opening 111b of the frame panel 110. Each of the first to fourth studs may have a shape corresponding to the shape of the stud 120.

[0220] After mounting the brackets 160 , 172 , 180 , 190 to the frame 100 , multiple display modules 30 A- 30 w can be placed in front of the frame 100 .

[0221] According to the concept of the present invention, in the display device and the manufacturing method of the display device, the insertion portion of the frame, into which the stud to which the bracket is detachably connected is inserted, has a first opening formed on a first side and a second opening formed on a second side, the size of which are different from each other, thereby improving the pull-out force or torque resistance of the frame supporting multiple display modules.

[0222] The disclosed embodiments have been described above with reference to the accompanying drawings. Those skilled in the art will understand that the disclosed embodiments may be embodied in different forms without changing the technical ideas or essential features of the disclosed embodiments. The disclosed embodiments are illustrative and should not be construed as being limiting.

Claims

1. A plurality of display modules; and a frame supporting the plurality of display modules, the plurality of display modules being arranged in a matrix form of M*N on the frame; the frame includes a frame panel having a first side and a second side opposite the first side; The frame panel comprises: an insert portion that passes through the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, the first opening being larger in size than the second opening; and a stud provided in the insertion portion; The insertion portion is provided in a tapered shape from the first side to the second side.

2. A plurality of display modules; and a frame supporting the plurality of display modules, the plurality of display modules being arranged in a matrix form of M*N on the frame; the frame includes a frame panel having a first side and a second side opposite the first side; The frame panel comprises: an insert portion that passes through the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, the first opening being larger in size than the second opening; and a stud provided in the insertion portion; The frame further includes a reinforcing member attached to the first side of the frame panel and configured to cover the first opening.

3. The display device according to claim 2 , wherein the insertion portion is provided such that the first opening and the second opening form a step.

4. The display device of claim 2 , wherein the insertion portion is tapered from the first side to the second side.

5. the stud includes a coupling portion having an opening toward the second opening; The display device according to claim 1 , wherein the coupling portion includes a screw thread formed on an inner circumferential surface.

6. a bracket releasably coupled to the stud through the second opening; The display device according to claim 1 or 2, wherein the bracket comprises at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

7. The display device of claim 1 , wherein the frame further comprises a reinforcing member attached to the first side of the frame panel and configured to cover the first opening.

8. The display device of claim 7 , wherein the plurality of display modules are attached to the stiffening member.

9. The frame panel comprises: a first metal layer forming the first side of the frame panel; a second metal layer forming the second side of the frame panel; and The display device according to claim 1 , further comprising: a resin layer disposed between the first metal layer and the second metal layer.

10. The display device of claim 9 , wherein a size of a portion of the insertion portion formed in the resin layer is the same as a size of another portion of the insertion portion formed in the first metal layer.

11. providing a frame panel having a first side and a second side opposite the first side; an insertion portion is formed through the frame panel, the insertion portion including a first opening formed on the first side and a second opening formed on the second side, the first opening being larger in size than the second opening; Inserting a stud into the insertion portion through the first opening; a bracket releasably coupled to the stud through the second opening; and attaching a reinforcing member to the first side of the frame panel after inserting the stud into the insertion portion.

12. The method of claim 11 , further comprising forming a module opening in the frame panel and the reinforcing member after attaching the reinforcing member to the first side of the frame panel.

13. The method of claim 12, further comprising attaching a plurality of display modules to the reinforcing member after the module openings are formed.

14. The method of claim 11, wherein the bracket comprises at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

15. The method of claim 14, wherein forming the inset comprises forming the inset from the first side using at least one of a shaping tool, a water jet, and a laser.

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