Method for manufacturing an intermediate connector, intermediate connector, method for manufacturing an electronic module, electronic module, and electronic device

Abstract

To obtain an intermediate connection member in which wiring parts are accurately arranged.SOLUTION: An intermediate connection member 300 comprises: an insulating substrate part 321; an insulating substrate part 322; and an insulating layer part 323 that is arranged between the insulating substrate part 321 and the insulating substrate part 322 and is of a material different from that of the insulating substrate part 321 and the insulating substrate part 322. The intermediate connection member 300 includes a plurality of wiring parts 311 that are arranged to extend in a Z-direction between the insulating substrate part 321 and the insulating layer part 323, wherein both end faces in the Z-direction are exposed to the outside, and a plurality of wiring parts 312 that are arranged to extend in the Z-direction between the insulating substrate part 322 and the insulating layer part 323, wherein both end faces in the Z-direction are exposed to the outside.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an intermediate connection member for electrically connecting two circuit units to each other.

Background Art

[0002] Imaging devices such as digital cameras, which are examples of electronic devices, and smartphones with built-in cameras include an imaging module, which is an example of an electronic module. The imaging module has a plurality of electronic components. In the case of an imaging module, one of the plurality of electronic components is an image sensor. Each electronic component is mounted on a rigid substrate such as a printed wiring board, but in the imaging module, due to the requirement for miniaturization of electronic devices, high-density mounting has been required.

[0003] As one of the structures for realizing high-density mounting, a three-dimensional mounting structure configured by stacking a plurality of circuit units in multiple stages is known. In the three-dimensional mounting structure, there are known methods of connecting two circuit units facing each other using solder balls and methods of connecting two circuit units facing each other using an intermediate connection member having wiring. When electronic components are arranged between two rigid substrates of two circuit units, a method of connecting the two circuit units with an intermediate connection member is used.

[0004] Patent Document 1 discloses an intermediate connection member configured by forming a plurality of through holes in an insulating substrate and filling each through hole of the insulating substrate with a conductor.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Due to the demand for further miniaturization of electronic devices, further miniaturization of a three-dimensional mounting structure using an intermediate connection member is required. In the intermediate connection member, narrowing of the wiring pitch has been demanded. In the method of forming wiring in through-holes, it is common to drill holes in an insulating substrate using a mechanical drill. When trying to narrow the pitch between through-holes, the insulating material portion between the through-holes becomes thin, and it has been difficult to maintain high-precision processing in response to the demand for narrowing the wiring pitch, such as the thin portion peeling off or deforming during the drilling process.

[0007] Therefore, an object of the present invention is to obtain an intermediate connection member in which wiring portions are arranged with high precision.

Means for Solving the Problems

[0008] A method for manufacturing an intermediate connection member of the present invention is a method for manufacturing an intermediate connection member used to electrically connect a first circuit unit and a second circuit unit arranged opposite to each other, the method comprising: forming a first insulating substrate having a first main surface with a plurality of first grooves; forming a second insulating substrate having a second main surface with a plurality of second grooves; arranging a plurality of first conductive members in the plurality of first grooves; arranging a plurality of second conductive members in the plurality of second grooves; forming a structure by bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate via an insulating member so that the directions in which the plurality of first conductive members extend and the directions in which the plurality of second conductive members extend are aligned; and cutting the structure in a second direction intersecting a first direction in which the plurality of first conductive members and the plurality of second conductive members extend.

[0009] Further, the intermediate connection member of the present invention is an intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged to face each other, and includes a first insulating substrate portion, a second insulating substrate portion, an insulating layer portion disposed between the first insulating substrate portion and the second insulating substrate portion and made of a material different from those of the first insulating substrate portion and the second insulating substrate portion, a plurality of first wiring portions disposed so as to extend in a first direction between the first insulating substrate portion and the insulating layer portion and having both end faces in the first direction exposed to the outside, and a plurality of second wiring portions disposed so as to extend in the first direction between the second insulating substrate portion and the insulating layer portion and having both end faces in the first direction exposed to the outside.

[0010] Further, the intermediate connection member of the present invention is an intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged to face each other, and includes a plurality of first wiring portions arranged at intervals in a second direction intersecting the first direction. Each of the plurality of first wiring portions is arranged to extend in the first direction such that both end faces in the first direction are exposed to the outside. At least one of the plurality of first wiring portions has a first width, and at least one of the plurality of first wiring portions has a second width wider than the first width.

[0011] Further, the intermediate connection member of the present invention is an intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged to face each other, and includes a plurality of first wiring portions arranged at intervals in a second direction intersecting the first direction. Each of the plurality of first wiring portions is arranged to extend in the first direction such that both end faces in the first direction are exposed to the outside. At least one of the plurality of first wiring portions has a first thickness, and at least one of the plurality of first wiring portions has a second thickness thicker than the first thickness.

[0012] The intermediate connection member of the present invention is an intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged to face each other, and includes a first insulating substrate portion, and a plurality of first wiring portions that are arranged on the first insulating substrate portion at intervals in a second direction intersecting the first direction. Each of the plurality of first wiring portions extends and is arranged in the first direction such that both end faces in the first direction are exposed to the outside. The first insulating substrate portion includes a first groove portion that is wider than the width of one of the plurality of first wiring portions and / or deeper than the thickness of one of the plurality of first wiring portions.

Effect of the Invention

[0013] According to the present invention, an intermediate connection member in which wiring portions are arranged with high precision can be obtained.

Brief Description of the Drawings

[0014]

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BEST MODE FOR CARRYING OUT THE INVENTION

[0015] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

[0016] [First Embodiment] FIG. 1 is an explanatory diagram of a digital camera 100 which is an example of an electronic device according to the first embodiment. The digital camera 100 is an interchangeable-lens digital camera and includes a camera body 101. A lens barrel 102 including a lens is detachable from the camera body 101. The lens barrel 102 is an interchangeable lens, that is, a lens unit.

[0017] The camera body 101 includes a housing 111, and an imaging module 200 and a processing module 400 provided inside the housing 111. The imaging module 200 and the processing module 400 are electrically connected to each other communicably by a cable (not shown).

[0018] The imaging module 200 is an example of an electronic module and has a three-dimensional mounting structure. The imaging module 200 includes circuit units 201 and 202, and a plurality of intermediate connection members 300. In the present embodiment, the circuit unit 201 is a first circuit unit, and the circuit unit 202 is a second circuit unit. The circuit unit 201 is a printed wiring board, a printed circuit board, or a semiconductor package, and is a semiconductor package in the present embodiment. The circuit unit 202 is a printed wiring board, a printed circuit board, or a semiconductor package, and is a printed circuit board in the present embodiment. The circuit unit 201 and the circuit unit 202 are arranged at intervals in the Z direction which is the stacking direction, and are electrically and mechanically connected by a plurality of intermediate connection members 300. That is, each intermediate connection member 300 is used to electrically and mechanically connect the circuit units 201 and 202 arranged to face each other in the Z direction.

[0019] The circuit unit 201 includes a wiring board 211 and an image sensor 212 which is an example of a first electronic component mounted on the wiring board 211. The wiring board 211 is a package substrate. The wiring board 211 is a rigid substrate. The image sensor 212 is a semiconductor element and an imaging element.

[0020] The circuit unit 202 includes a wiring board 221 and a plurality of memory elements 222 which are an example of the second electronic components mounted on the wiring board 221. The wiring board 221 is a printed wiring board. Also, the wiring board 221 is a rigid substrate. The memory element 222 is a semiconductor element and can store image data in this embodiment. An electronic component, specifically, the memory element 222 mounted on the wiring board 221 in this embodiment, is arranged between the wiring board 211 and the wiring board 221. Therefore, in this embodiment, the wiring board 211 and the wiring board 221 are electrically and mechanically connected by a plurality of intermediate connection members 300 so that the memory element 222 does not interfere with the wiring board 211.

[0021] The image sensor 212 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 212 has a function of converting the light incident through the lens barrel 102 into an electrical signal.

[0022] The processing module 400 includes a printed wiring board 401 and an image processing device 402 which is a semiconductor device mounted on the printed wiring board 401. The image processing device 402 is, for example, a digital signal processor. The image processing device 402 has a function of acquiring an electrical signal from the image sensor 212, performing a process of correcting the acquired electrical signal, and generating image data.

[0023] FIG. 2(a) is a plan view of the imaging module 200, and FIG. 2(b) is a cross-sectional view of the imaging module 200. In FIG. 2(a), for the sake of explanation, the illustration of the circuit unit 201 is omitted. FIG. 2(b) is a cross-sectional view of the imaging module 200 along the line IIB-IIB shown in FIG. 2(a). The circuit unit 201 of the imaging module 200 includes a frame 213 provided on the wiring board 211 and a LID 214 provided on the frame 213. For the LID 214, a substrate made of, for example, glass is used.

[0024] A plurality of intermediate connection members 300 are arranged so as to surround a plurality of memory elements 222. In the present embodiment, the number of intermediate connection members 300 is five, and the number of memory elements 222 is two.

[0025] On the main surface 2112 of the wiring board 211, which is opposite to the main surface 2111 on the side where the image sensor 212 is mounted, a plurality of pads 215 are arranged. A solder resist film (not shown) may be provided on the main surface 2112. In that case, it is preferable that an opening is formed in the solder resist film at a position corresponding to each pad 215. The shape of each pad 215 is not particularly limited, and for example, it may be circular or polygonal in plan view. Also, the relationship between the solder resist film and the pad may be either SMD or NSMD. A resin with a low coefficient of thermal expansion is used as the insulating material of the insulating substrate of the wiring board 211.

[0026] On the main surface 2211 of the wiring board 221, on the side where the memory element 222 is mounted, a plurality of pads 225 and a plurality of pads 226 are arranged. The plurality of memory elements 222 are joined to the plurality of pads 226 with solder 230. A solder resist film (not shown) may be provided on the main surface 2211. In that case, it is preferable that an opening is formed in the solder resist film at a position corresponding to each of the pads 225 and 226. The shape of each of the pads 225 and 226 is not particularly limited, and for example, it may be circular or polygonal in plan view. Also, the relationship between the solder resist film and the pad may be either SMD or NSMD. A resin such as FR-4 is used as the insulating material of the insulating substrate of the wiring board 221.

[0027] Each intermediate connection member 300 has a plurality of wiring portions 310 extending in the Z direction. Both end faces 3101 and 3102 of each wiring portion 310 in the Z direction are exposed to the outside. The end face 3101 and the pad 215 are electrically and mechanically connected with solder 240, and the end face 3102 and the pad 225 are electrically and mechanically connected with solder 250.

[0028] Each of the pads 215, 225, and 226 is an electrode formed of a conductive member, such as a metal like copper. Each of the pads 215, 225, and 226 is, for example, a signal electrode, a power supply electrode, a ground electrode, or a dummy electrode.

[0029] FIG. 3(a) is a perspective view of the intermediate connection member 300 according to the first embodiment. FIG. 3(b) is an enlarged view of a part of the intermediate connection member 300 shown in FIG. 3(a).

[0030] The intermediate connection member 300 is a rectangular parallelepiped rigid substrate, and each of a pair of end faces 301 and 302 in the Z direction is a surface used for bonding. Here, the longitudinal direction of the intermediate connection member 300 is the X direction, the width direction of the intermediate connection member 300 is the Y direction, and the height direction of the intermediate connection member 300 is the Z direction. The Z direction is the first direction, the X direction is the second direction, and the Y direction is the third direction. The X direction, the Y direction, and the Z direction intersect each other. In this embodiment, the X direction, the Y direction, and the Z direction are orthogonal to each other.

[0031] The intermediate connection member 300 has a plurality of wiring portions 311 that are a plurality of first wiring portions and a plurality of wiring portions 312 that are a plurality of second wiring portions. The plurality of wiring portions 311 and the plurality of wiring portions 312 constitute the plurality of wiring portions 310 in FIGS. 2(a) and 2(b).

[0032] The intermediate connection member 300 has an insulating substrate portion 321 that is a first insulating substrate portion and an insulating substrate portion 322 that is a second insulating substrate portion. Further, the intermediate connection member 300 has an insulating layer portion 323 that is disposed between the insulating substrate portion 321 and the insulating substrate portion 322 and is made of a material different from those of the insulating substrate portion 321 and the insulating substrate portion 322.

[0033] The plurality of wiring portions 311 are disposed between the insulating substrate portion 321 and the insulating layer portion 323. Also, the plurality of wiring portions 311 are spaced apart in the X direction. Further, the plurality of wiring portions 311 are arranged to extend in the Z direction. As a result, both end faces 3111, 3112 in the Z direction of each of the plurality of wiring portions 311 are externally exposed at both end faces 301, 302 of the intermediate connection member 300 so as to be solder-bondable to the wiring boards 211, 221.

[0034] The plurality of wiring portions 312 are disposed between the insulating substrate portion 322 and the insulating layer portion 323. Also, the plurality of wiring portions 312 are spaced apart in the X direction. Further, the plurality of wiring portions 312 are arranged to extend in the Z direction. As a result, both end faces 3121, 3122 in the Z direction of each of the plurality of wiring portions 312 are externally exposed at both end faces 301, 302 of the intermediate connection member 300 so as to be solder-bondable to the wiring boards 211, 221.

[0035] Also, the plurality of wiring portions 311 and the plurality of wiring portions 312 are alternately arranged in the X direction. An insulating layer portion 323 is disposed between the plurality of wiring portions 311 and the plurality of wiring portions 312. That is, the plurality of wiring portions 311 and the plurality of wiring portions 312 are spaced apart in the Y direction. Thus, the plurality of wiring portions 311 and the plurality of wiring portions 312 are arranged in a staggered pattern in the X direction. By arranging the plurality of wiring portions 311 and the plurality of wiring portions 312 in a staggered pattern in this way, further high-density wiring can be realized, and miniaturization of the imaging module 200 can be realized. However, when it is not necessary to increase the density of the wiring, the plurality of wiring portions 311 and the plurality of wiring portions 312 may be arranged so as to face each other instead of in a staggered pattern.

[0036] The insulating layer portion 323 is formed by curing, that is, hardening, an adhesive. That is, the intermediate connection member 300 is formed by integrating the insulating substrate portion 321, the insulating substrate portion 322, the plurality of wiring portions 311, and the plurality of wiring portions 312 with the insulating layer portion 323.

[0037] The insulating substrate portion 321 and the insulating substrate portion 322 are formed of the same insulating material. The insulating material of the insulating substrate portion 321 and the insulating substrate portion 322 is glass epoxy. Glass epoxy is, for example, a material obtained by impregnating a glass woven fabric in which glass fibers are woven in a cloth shape with a liquid epoxy resin and thermosetting it, and is also called epoxy glass or epoxy glass resin. The insulating layer portion 323 is formed by solidifying an adhesive mainly composed of, for example, an epoxy resin or a silicone resin. Each wiring portion 311, 312 is formed of a conductive material, for example, copper.

[0038] The plurality of wiring portions 311 are formed to have the same thickness. Therefore, among the plurality of wiring portions 311, in a wiring through which a large current flows, for example, a wiring portion that becomes a ground wiring, a material different from other wiring portions, that is, a material having a low electrical resistance, may be used. The same applies to the plurality of wiring portions 312.

[0039] The length L of the intermediate connection member 300 in the X direction is shorter than the lengths of the wiring boards 211, 221. The width W of the intermediate connection member 300 in the Y direction depends on the areas of the main surfaces 2112, 2211 of the respective wiring boards 211, 221 and the method of manufacturing the imaging module 200.

[0040] When the intermediate connection member 300 is made independent with respect to the wiring board 221 and the intermediate connection member 300 is soldered to the wiring board 221 during the manufacturing process, the width W of the intermediate connection member 300 is preferably 1 mm or more. Also, considering high-density mounting, the width W of the intermediate connection member 300 is preferably 5 mm or less.

[0041] Also, among the electronic components mounted on the side of the main surface 2211 of the wiring board 221, the highest one is the memory element 222. The height H of the intermediate connection member 300 in the Z direction is preferably higher than that of the memory element 222. For example, when the height of the memory element 222 in the Z direction is 1.6 mm, the height H of the intermediate connection member 300 is preferably higher than 1.6 mm.

[0042] Among the plurality of wiring portions 311 and the plurality of wiring portions 312, the pitch P between the two closest wiring portions 311 and 312 is preferably 0.36 mm or more and 0.44 mm or less. Thereby, while realizing a narrow pitch of the wiring portions 311 and 312, the intermediate connection member 300 can be manufactured with high precision.

[0043] A method for manufacturing the intermediate connection member 300 will be described. FIGS. 4(a), 4(b), 5(a), 5(b), 5(c), 6(a), 6(b), 6(c), 7(a), 7(b), 7(c), 8(a), and 8(b) are diagrams for explaining the steps of the method for manufacturing the intermediate connection member 300.

[0044] In the steps shown in FIGS. 4(a) and 4(b), a plate-shaped base material 500 is prepared. FIG. 4(a) shows a plan view of the base material 500, and FIG. 4(b) shows a cross-sectional view of the base material 500 along line IV-IV of FIG. 4(a). Although illustration is omitted, two base materials 500 are prepared. The base material 500 is formed of an insulating material such as glass epoxy, for example, FR-4. The thickness W of the intermediate connection member 300 shown in FIG. 3(a) is preferably 5 mm or less. Therefore, the thickness of the base material 500 is preferably 2.5 mm or less.

[0045] Next, a process of forming a plurality of grooves on the main surfaces 501 of the two base materials 500 is performed. Thereby, in the steps shown in FIGS. 5(a) and 5(b), an insulating substrate 601 having a main surface 611 with a plurality of grooves 621 is formed. FIG. 5(a) shows a plan view of the insulating substrate 601, and FIG. 5(b) shows a cross-sectional view of the insulating substrate 601 along line V-V of FIG. 5(a). The groove 621 is a first groove. The main surface 611 is a first main surface. The insulating substrate 601 is a first insulating substrate.

[0046] Similarly, in the step shown in FIG. 5(c), an insulating substrate 602 having a main surface 612 with a plurality of grooves 622 is formed. FIG. 5(c) shows a cross-sectional view of the insulating substrate 602. The groove 622 is a second groove. The main surface 612 is a second main surface. The insulating substrate 602 is a second insulating substrate.

[0047] The plurality of grooves 621 are formed to extend in the Z direction with intervals in the X direction. The plurality of grooves 622 are formed to extend in the Z direction with intervals in the X direction, similar to the plurality of grooves 621. In this embodiment, the plurality of grooves 621 and the plurality of grooves 622 are formed linearly, but they may be formed in a curved shape.

[0048] The widths and depths of the grooves 621 and 622 are set according to the thicknesses of the wiring portions 311 and 312 to be formed. For example, if the thickness of the wire to be described later is φ0.2 mm, it is preferable that the widths and depths of the respective grooves 621 and 622 be about 0.2 mm, the same as the thickness of the wire. Also, it is preferable that the pitch of the plurality of grooves 621 and the pitch of the plurality of grooves 622 be set to be the same. For example, each pitch is set to about 0.57 mm.

[0049] In this embodiment, the cross-sectional shapes of the grooves 621 and 622 are rectangular, but the present invention is not limited thereto, and for example, they may be semi-circular. The processing for forming the grooves 621 and 622 is preferably machining with a dicing device or a slicing device, but the base materials 500 may be masked with a resist or the like and physically processed with a milling device. Further, the insulating substrates 601 and 602 may be molded using a mold having a shape for forming the grooves. Forming an insulating substrate having a plurality of grooves adjacent to each other is easier than forming an insulating substrate having a plurality of through holes adjacent to each other. Therefore, it is possible to accurately form the insulating substrate 601 having the plurality of grooves 621 and the insulating substrate 602 having the plurality of grooves 622.

[0050] Next, in the steps shown in FIGS. 6(a) and 6(b), a plurality of conductive members 701 are arranged in a plurality of grooves 621. FIG. 6(a) shows a plan view of an insulating substrate 601 on which a plurality of conductive members 701 are arranged, and FIG. 6(b) shows a cross-sectional view of the insulating substrate 601 on which a plurality of conductive members 701 are arranged along line VI-VI of FIG. 6(a). The conductive member 701 is a first conductive member. Similarly, in the step shown in FIG. 6(c), a plurality of conductive members 702 are arranged in a plurality of grooves 622. FIG. 6(c) shows a cross-sectional view of an insulating substrate 602 on which a plurality of conductive members 702 are arranged. The conductive member 702 is a second conductive member.

[0051] Each of the plurality of conductive members 701 and each of the plurality of conductive members 702 is a wire formed of a metal, such as copper. The diameter of each conductive member 701 is set to be the same in this embodiment. The diameter of each conductive member 702 is also set to be the same in this embodiment. Also, the diameter of the conductive member 701 and the diameter of the conductive member 702 are set to be the same in this embodiment.

[0052] The cross-sectional shape of the wire is circular in this embodiment, but is not limited thereto, and may be polygonal, for example, quadrangular. In the steps shown in FIGS. 6(a) and 6(b), a plurality of conductive members 701 are fitted into a plurality of grooves 621. In the step shown in FIG. 6(c), a plurality of conductive members 702 are fitted into a plurality of grooves 622. Thereby, in a later step, it is possible to prevent each conductive member 701 from falling out of each groove 621 of the insulating substrate 601, and it is possible to prevent each conductive member 702 from falling out of each groove 622 of the insulating substrate 602.

[0053] When fitting each conductive member 701 into each groove 621, an adhesive (not shown) may be applied to each groove 621. Similarly, when fitting each conductive member 702 into each groove 622, an adhesive (not shown) may be applied to each groove 622. As this adhesive, it is preferable to select one that cures at around room temperature. Thereby, it is possible to effectively prevent each conductive member 701 from falling out of each groove 621 of the insulating substrate 601, and it is possible to effectively prevent each conductive member 702 from falling out of each groove 622 of the insulating substrate 602.

[0054] Note that as a method of arranging the conductive members 701 and 702 in the grooves 621 and 622, it is preferable to fit a wire into the groove, but it is not limited thereto. For example, a conductive paste may be applied to the groove with a dispenser or the like and fired to form a conductive member. The material of the conductive members 701 and 702 may be any material having conductivity. For example, it may be an inorganic material such as copper, silver, or aluminum, or an organic material such as a rubber having conductivity.

[0055] Considering the solder joint properties with the pads of the wiring boards 211 and 221, as well as the handleability and deformation of the conductive members 701 and 702 when arranging them in the grooves 621 and 622, the thickness and width of the conductive members 701 and 702 are preferably 0.05 mm or more and 2 mm or less. Considering the high density of wiring, the thickness and width of the conductive members 701 and 702 are more preferably 0.5 mm or less.

[0056] Next, the process of forming the structure 800 shown in FIGS. 7(a) to 7(c) will be described. In this series of processes, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded via the insulating member 651 so that the directions in which the plurality of conductive members 701 extend and the directions in which the plurality of conductive members 702 extend are aligned, thereby forming the structure 800. In this series of processes, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded to form the structure 800 such that the plurality of conductive members 701 and the plurality of conductive members 702 are alternately arranged in the X direction.

[0057] Hereinafter, the process of forming the structure 800 shown in FIGS. 7(a) to 7(c) will be described in detail. First, in the process shown in FIG. 7(a), an adhesive 650 is applied onto the main surface 611 of the insulating substrate 601. The adhesive 650 is an insulating adhesive mainly composed of, for example, an epoxy resin or a silicone resin. The adhesive 650 can be selected, for example, to thermally cure at about 100°C.

[0058] Next, in the process shown in FIG. 7(b), before the adhesive 650 cures, the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650, and the adhesive 650 is sandwiched between the main surface 611 and the main surface 612. The insulating substrate 601 and the insulating substrate 602 are aligned by an alignment device (not shown). Thereby, while controlling the thickness of the adhesive 650, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are adhered with a plurality of conductive members 701 and a plurality of conductive members 702 interposed therebetween. The alignment of the insulating substrate 601 and the insulating substrate 602 may be performed by abutting the end faces of the respective insulating substrates 601, 602 against a butting member (not shown), or may be performed using alignment marks (not shown) formed in advance. Also, for the purpose of controlling the thickness of the adhesive 650, an insulating spacer (thickness regulating material) may be contained in the adhesive.

[0059] Then, in the process shown in FIG. 7(c), by curing the adhesive 650, an insulating member 651 is formed. In this way, by adhering the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 with the adhesive 650, an insulating member 651 in which the adhesive 650 is solidified is formed.

[0060] In this embodiment, an intermediate connection member 300 is formed by processing a structure 800. The insulating substrate 601 in the structure 800 corresponds to the insulating substrate portion 321 in the intermediate connection member 300. The insulating substrate 602 in the structure 800 corresponds to the insulating substrate portion 322 in the intermediate connection member 300. The insulating member 651 in the structure 800 corresponds to the insulating layer portion 323 in the intermediate connection member 300. The conductive member 701 in the structure 800 corresponds to the wiring portion 311 in the intermediate connection member 300. The conductive member 702 in the structure 800 corresponds to the wiring portion 312 in the intermediate connection member 300.

[0061] The thickness of the insulating member 651 that becomes the insulating layer portion 323 in the Y direction is preferably 10 μm or more from the viewpoint of suppressing the peeling between the insulating substrate portions 321 and 322 in FIG. 3(a) in a subsequent reflow process. If it is less than 10 μm, there is a risk that the insulating substrate portions 321 and 322 may peel off, or that the conductive members 701 and 702 may short-circuit when the conductive members 701 and 702 are arranged to face each other. Also, the thickness of the insulating member 651 that becomes the insulating layer portion 323 in the Y direction is preferably 300 μm or less in consideration of deformation of the conductive member. If it exceeds 300 μm, there is a risk that the conductive member may be deformed or that the insulating layer portion 323 may not obtain sufficient mechanical strength due to moisture absorption. That is, the thickness of the insulating member 651 that becomes the insulating layer portion 323 in the Y direction is preferably 10 μm or more and 300 μm or less. Therefore, the thickness of the insulating layer portion 323 in the Y direction is preferably 10 μm or more and 300 μm or less.

[0062] Next, in the steps shown in FIGS. 8(a) and 8(b), the structure 800 is cut in the X direction. FIG. 8(a) shows a plan view of the structure 800, and FIG. 8(b) shows a cross-sectional view of the structure 800 along line VIII-VIII of FIG. 8(a). By cutting the structure 800 in the X direction at intervals of H in the Z direction, the end faces 3111, 3112, 3121, and 3122 of the wiring portions 311 and 312 shown in FIG. 3(a) can be exposed. In the present embodiment, by cutting the structure 800 in the X direction and the Z direction, an intermediate connection member 300 having a predetermined size, that is, a length L, a height H, and a width W, is formed. For example, an intermediate connection member 300 is formed in which the thickness in the Y direction of each insulating substrate portion 321 and 322 is 0.5 mm, the thickness in the Y direction of the insulating layer portion 323 is 0.085 mm, the length L is 41.0 mm, the height H is 2.0 mm, and the width W is 1.085 mm. For cutting the structure 800, a dicing device, a wire saw device, or the like is used. In this step, one intermediate connection member 300 may be formed from one structure 800, or a plurality of intermediate connection members 300 may be formed from one structure 800. When forming a plurality of intermediate connection members 300 from one structure 800, one structure 800 may be cut at equal intervals along the X direction at a pitch of H in the Z direction. Alternatively, one structure 800 may be cut at equal intervals along the Z direction at a pitch of L in the X direction.

[0063] Note that the direction in which the structure 800 is cut may be an oblique direction with respect to the conductive members 701 and 702. In this case, the end face of the formed wiring portion is elliptical, and the cross-sectional area is larger than in the case of a circle, so the bonding area with solder can be increased.

[0064] Through the manufacturing process as described above, an intermediate connection member 300 in which the wiring portions 311 and 312 are arranged with high precision as shown in FIG. 3(a) can be obtained. Further, an intermediate connection member 300 with high precision that includes the wiring portions 311 and 312 arranged at high density and with a narrow pitch can be obtained.

[0065] Here, among the plurality of wiring portions 311 and the plurality of wiring portions 312, let the pitch between the two closest wiring portions be P. The ratio H / P of the height H in the Z direction of the intermediate connection member 300 to the pitch P is preferably 4 or more. For example, if the pitch P is 0.4 mm and the height H is 2.0 mm, the ratio H / P is 5. In this way, while forming the wiring portions 311 and 312 at high density, it is possible to form the intermediate connection member 300 with a high height H.

[0066] Next, a method for manufacturing the imaging module 200 will be described. FIGS. 9(a), 9(b), 9(c), 10(a), 10(b), and 10(c) are diagrams for explaining each step of the method for manufacturing the imaging module 200 according to the first embodiment.

[0067] As shown in FIG. 9(a), a wiring board 221 is prepared. Next, as shown in FIG. 9(b), a solder paste P1 containing solder powder and flux is supplied onto each pad 225, 226 of the wiring board 221. For the solder powder, for example, Sn - Ag - Cu solder powder is used. The solder paste P1 can be supplied, for example, by screen printing or dispenser.

[0068] The solder paste P1 may be supplied so as to cover the entire surface of each pad 225, 226, or may be supplied so as to partially cover each pad 225, 226 as in so - called offset printing.

[0069] Next, as shown in FIG. 9(c), a memory element 222, an intermediate connection member 300, and chip components (not shown) are placed on the wiring board 211. The chip components (not shown) are, for example, capacitors or resistors. The memory element 222, the intermediate connection member 300, and the chip components (not shown) are placed on corresponding pads using a mounter or the like. That is, the memory element 222 is placed on the pad 226, and the intermediate connection member 300 is placed on the pad 225. At this time, the intermediate connection member 300 is mounted on the wiring board 221 such that the solder paste P1 contacts the end face 3102 of the wiring portion 310 of the intermediate connection member 300. It is preferable that the intermediate connection member 300 can stand on its own without a support mechanism after being mounted on the wiring board 221.

[0070] Next, in a reflow furnace (not shown), a reflow process is performed in which the solder paste P1 is heated to a temperature equal to or higher than the melting point of the solder powder, the solder powder is melted and aggregated, and then cooled to a temperature lower than the melting point of the solder powder to solidify it. When the solder solidifies, as shown in FIG. 10(a), the memory element 222, the intermediate connection member 300, the chip components (not shown), and the wiring board 221 are electrically and mechanically joined. That is, a structure in which the intermediate connection member 300 and the circuit unit 202 are joined by solder is manufactured. The wiring portion 310 of the intermediate connection member 300 and the pad 225 are electrically connected by the solder 250.

[0071] Next, as shown in FIG. 10(b), a solder paste P2 containing solder powder and flux is supplied onto each pad 215 of the wiring board 211. For example, Sn-Ag-Cu solder powder is used as the solder powder. The solder paste P2 can be supplied, for example, by screen printing or dispenser. The solder paste P2 may be supplied so as to cover the entire surface of each pad 215, or may be supplied so as to partially cover each pad 215 as in so-called offset printing.

[0072] Then, as shown in FIG. 10(c), the circuit unit 201 is mounted on the intermediate connection member 300 on the circuit unit 202. The circuit unit 201 is placed on the intermediate connection member 300 using a mounter or the like. At this time, the circuit unit 201 is mounted on the intermediate connection member 300 such that the solder paste P2 contacts the end face 3101 of the wiring portion 310 of the intermediate connection member 300.

[0073] Next, in a reflow furnace (not shown), a reflow process is performed in which the solder paste P2 is heated to a temperature equal to or higher than the melting point of the solder powder, the solder powder is melted and aggregated, and then cooled to a temperature lower than the melting point of the solder powder to solidify it. When the solder solidifies, the intermediate connection member 300 and the circuit unit 201 are joined by solder, and the imaging module 200 shown in FIG. 2(b) is manufactured.

[0074] The imaging module 200 manufactured in this way has no solder joint defect between the intermediate connection member 300 and the circuit units 201 and 202, and can sufficiently guarantee the optical performance of the image sensor 212 incorporated in the circuit unit 201.

[0075] [Second Embodiment] Next, the intermediate connection member of the second embodiment will be described. FIG. 11(a) is a perspective view of an intermediate connection member 300A according to the second embodiment. FIG. 11(b) is an enlarged view of a part of the intermediate connection member 300A shown in FIG. 11(a). In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof is omitted.

[0076] The intermediate connection member 300A is a rectangular parallelepiped rigid substrate, and each of a pair of end faces 301 and 302 in the Z direction is a joint surface. The intermediate connection member 300A has a plurality of wiring portions 311 and a plurality of wiring portions 312.

[0077] The intermediate connection member 300A has an insulating substrate portion 321 and an insulating substrate portion 322. Further, the intermediate connection member 300A is disposed between the insulating substrate portion 321 and the insulating substrate portion 322, and has an insulating layer portion 323A made of a material different from those of the insulating substrate portion 321 and the insulating substrate portion 322.

[0078] The plurality of wiring portions 311 are disposed between the insulating substrate portion 321 and the insulating layer portion 323A. The plurality of wiring portions 312 are disposed between the insulating substrate portion 322 and the insulating layer portion 323A.

[0079] The insulating layer portion 323A includes three insulating layers 323A-1, 323A-2, and 323A-3. The insulating layer 323A-1 is the first insulating layer. The insulating layer 323A-2 is the second insulating layer. The insulating layer 323A-3 is the third insulating layer. The insulating layers 323A-1 and 323A-2 are formed by curing an adhesive of the same material. The insulating layer 323A-3 is disposed between the insulating layer 323A-1 and the insulating layer 323A-2. The insulating layer 323A-3 is made of a material different from those of the insulating layers 323A-1 and 323A-2. The insulating layers 323A-1 and 323A-2 are formed by curing an adhesive mainly composed of, for example, an epoxy resin or a silicone resin. The insulating layer 323A-3 is formed of, for example, polyimide.

[0080] Preferably, the thickness W in the Y direction of the insulating layer portion 323A is 10 μm or more and 300 μm or less, similar to the first embodiment.

[0081] Next, a method for manufacturing the intermediate connection member 300A in the second embodiment will be described. Hereinafter, with reference to FIGS. 12(a) to 12(d), the steps of the manufacturing method of the intermediate connection member 300A according to the second embodiment will be described. The manufacturing method of the intermediate connection member 300A in the second embodiment is different from the manufacturing method of the intermediate connection member 300 in the first embodiment only in the step of forming the structure shown in FIGS. 7(a) to 7(c). That is, the structure 800A formed in the steps shown in FIGS. 12(a) to 12(d) is different from the structure 800 formed in the first embodiment. Therefore, only the steps of forming the structure 800A shown in FIGS. 12(a) to 12(d) will be described. In this series of steps, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded via the insulating member 651A so that the directions in which the plurality of conductive members 701 extend and the directions in which the plurality of conductive members 702 extend are aligned, thereby forming the structure 800A. In this series of steps, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded to form the structure 800A such that the plurality of conductive members 701 and the plurality of conductive members 702 are alternately arranged in the X direction.

[0082] In the steps of forming the structure 800A shown in FIGS. 12(a) to 12(d), the insulating member 651A is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 with an adhesive with the insulating sheet 650A-3 interposed therebetween. Hereinafter, the steps of forming the structure 800A will be described in detail. First, in the step shown in FIG. 12(a), an adhesive 650A-1 is applied onto the main surface 611 of the insulating substrate 601. The adhesive 650A-1 is an insulating adhesive mainly composed of, for example, an epoxy resin or a silicone resin.

[0083] Next, in the step shown in FIG. 12(b), before the adhesive 650A-1 cures, an insulating sheet 650A-3 is placed on the adhesive 650A-1, and an adhesive 650A-2 having the same component as the adhesive 650A-1 is applied onto the insulating sheet 650A-3. The insulating sheet 650A-3 is a film-like sheet such as polyimide.

[0084] Next, in the process shown in FIG. 12(c), the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650A-1. The insulating substrate 601 and the insulating substrate 602 are aligned by an alignment device (not shown). The insulating sheet 650A-3 defines the thickness of each of the adhesives 650A-1 and 650A-2 in the Y direction and makes the thicknesses of the adhesives 650A-1 and 650A-2 in the Y direction uniform. Thereby, while controlling the thicknesses of the adhesives 650A-1 and 650A-2, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded with a plurality of conductive members 701 and a plurality of conductive members 702 interposed therebetween. The alignment of the insulating substrate 601 and the insulating substrate 602 may be performed by abutting the end surfaces of the respective insulating substrates 601 and 602 against a butting member (not shown), or may be performed using alignment marks (not shown) formed in advance.

[0085] Then, by curing the adhesives 650A-1 and 650A-2, an insulating member 651A shown in FIG. 12(d) is formed. The insulating member 651A is composed of an insulating layer 651A-1 obtained by curing the adhesive 650A-1, an insulating layer 651A-2 obtained by curing the adhesive 650A-2, and the insulating sheet 650A-3.

[0086] In the present embodiment, an intermediate connection member 300A is formed by cutting the structure 800A. The cutting method is the same as that of the first embodiment. The insulating substrate 601 in the structure 800A corresponds to the insulating substrate portion 321 in the intermediate connection member 300A. The insulating substrate 602 in the structure 800A corresponds to the insulating substrate portion 322 in the intermediate connection member 300A. The insulating member 651A in the structure 800A corresponds to the insulating layer portion 323A in the intermediate connection member 300A. The conductive member 701 in the structure 800A corresponds to the wiring portion 311 in the intermediate connection member 300A. The conductive member 702 in the structure 800A corresponds to the wiring portion 312 in the intermediate connection member 300A.

[0087] Also, the insulating layer 651A-1 in the structure 800A corresponds to the insulating layer 323A-1 in the intermediate connection member 300A. The insulating layer 651A-2 in the structure 800A corresponds to the insulating layer 323A-2 in the intermediate connection member 300A. The insulating sheet 650A-3 in the structure 800A corresponds to the insulating layer 323A-3 in the intermediate connection member 300A.

[0088] Also in the second embodiment, similar to the first embodiment, an intermediate connection member 300A in which the wiring portions 311 and 312 are arranged with high precision can be obtained. Also, a highly accurate intermediate connection member 300A that encloses the wiring portions 311 and 312 arranged at a high density and with a narrow pitch can be obtained. Note that in the second embodiment, since the manufacturing method of the imaging module is the same as that of the first embodiment, the description thereof is omitted.

[0089] [Third Embodiment] An intermediate connection member according to the third embodiment will be described. FIG. 13 is a perspective view of an intermediate connection member 300B according to the third embodiment. Note that in the third embodiment, for the same configurations as those in the first embodiment, the same reference numerals are given in the drawings and the description thereof is omitted. Also, since the manufacturing method of the intermediate connection member 300B is the same as that of the first embodiment, the description thereof is omitted.

[0090] The intermediate connection member 300B includes an insulating substrate portion 321, an insulating substrate portion 322, and an insulating layer portion 323. The intermediate connection member 300B also includes a wiring portion group 311B composed of a plurality of first wiring portions and a wiring portion group 312B composed of a plurality of second wiring portions. The wiring portion groups 311B and 312B are formed of a metal such as copper.

[0091] The wiring portion group 311B includes a wiring portion 311B-1 and a wiring portion 311B-2 that is thicker than the wiring portion 311B-1. The wiring portion group 312B includes a wiring portion 312B-1 and a wiring portion 312B-2 that is thicker than the wiring portion 312B-1.

[0092] As a result, larger currents can flow through wiring portions 311B-2 and 312B-2 than through wiring portions 311B-1 and 312B-1. Therefore, wiring portions 311B-2 and 312B-2 can be used, for example, as ground wiring. When manufacturing intermediate connection member 300B, wires that will become wiring portions 311B-2 and 312B-2 may be made thicker than the wires that will become wiring portions 311B-1 and 312B-1. For example, if the diameter of wiring portions 311B-1 and 312B-1 is φ0.2 mm, the diameter of wiring portions 311B-2 and 312B-2, which are ground wiring, may be made thicker to φ0.3 mm.

[0093] Wiring portion groups 311B and 312B only need to include a wiring portion of a first thickness and a wiring portion of a second thickness that is thicker than the first thickness. In the present embodiment, the wiring portion of the first thickness is wiring portions 311B-1 and 312B-1, and the wiring portion of the second thickness is wiring portions 311B-2 and 312B-2. Note that only wiring portion group 311B may include a wiring portion 311B-2 that is thicker than wiring portion 311B-1, or only wiring portion group 312B may include a wiring portion 312B-2 that is thicker than wiring portion 312B-1. That is, at least one of wiring portion groups 311B and 312B only needs to have a wiring portion that is thicker than the remaining wiring portions. Also, insulating layer portion 323 may be configured like insulating layer portion 323A of the second embodiment.

[0094] [Fourth Embodiment] The intermediate connection member according to the fourth embodiment will be described. FIG. 14 is a perspective view of the intermediate connection member 300C according to the fourth embodiment. In the fourth embodiment, for the same configurations as those in the first embodiment, the same reference numerals are given in the drawings and the description thereof is omitted. Also, since the manufacturing method of the intermediate connection member 300C is the same as that in the first embodiment, the description thereof is omitted. In the intermediate connection member 300 of the first embodiment, the case where it has a laminated structure of two insulating substrate portions 321 and 322 and a plurality of wiring portions 311 and a plurality of wiring portions 312 are arranged at the connection portion between the two insulating substrate portions has been described, but the present invention is not limited thereto. The intermediate connection member may have three or more insulating substrate portions, and a plurality of first wiring portions and a plurality of second wiring portions may be arranged at the connection portion between two adjacent insulating substrate portions.

[0095] The intermediate connection member 300C of the fourth embodiment has three insulating substrate portions 321C-1, 322C, and 321C-2. If the insulating substrate portion 321C-1 is the first insulating substrate portion, the insulating substrate portion 322C is the second insulating substrate portion. Also, if the insulating substrate portion 321C-2 is the first insulating substrate portion, the insulating substrate portion 322C is the second insulating substrate portion. The insulating material constituting the insulating substrate portions 321C-1, 322C, and 321C-2 is, for example, FR-4.

[0096] An insulating layer portion 323C-1 is arranged between the insulating substrate portion 321C-1 and the insulating substrate portion 322C, and an insulating layer portion 323C-2 is arranged between the insulating substrate portion 321C-2 and the insulating substrate portion 322C. The insulating layer portions 323C-1 and 323C-2 are made of an insulating material different from the insulating material constituting the insulating substrate portions 321C-1, 322C, and 321C-2. The insulating layer portions 323C-1 and 323C-2 are formed, for example, by curing an insulating adhesive mainly composed of an epoxy resin or a silicone resin.

[0097] The intermediate connection member 300C of the fourth embodiment has a plurality of wiring portions 311-1 as a plurality of first wiring portions and a plurality of wiring portions 312-1 as a plurality of second wiring portions. The plurality of wiring portions 311-1 are arranged to extend in the Z direction between the insulating substrate portion 321C-1 and the insulating layer portion 323C-1, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 312-1 are arranged to extend in the Z direction between the insulating substrate portion 322C and the insulating layer portion 323C-1, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 311-1 and the plurality of wiring portions 312-1 are alternately arranged in the X direction.

[0098] Further, the intermediate connection member 300C has a plurality of wiring portions 311-2 as a plurality of first wiring portions and a plurality of wiring portions 312-2 as a plurality of second wiring portions. The plurality of wiring portions 311-2 are arranged to extend in the Z direction between the insulating substrate portion 321C-2 and the insulating layer portion 323C-2, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 312-2 are arranged to extend in the Z direction between the insulating substrate portion 322C and the insulating layer portion 323C-2, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 311-2 and the plurality of wiring portions 312-2 are alternately arranged in the X direction.

[0099] As described above, also in the fourth embodiment, similar to the first embodiment, the intermediate connection member 300C in which the wiring portions 311-1, 312-1, 311-2, and 312-2 are arranged with high precision can be obtained. Also in the fourth embodiment, similar to the first embodiment, the intermediate connection member 300C can be manufactured with high precision while realizing a narrow pitch wiring structure. Note that the insulating layer portions 323C-1 and 323C-2 have the same configuration as the insulating layer portion 323 of the first embodiment, but may have the same configuration as the insulating layer portion 323A of the second embodiment.

[0100] [Fifth Embodiment] Next, the intermediate connection member of the fifth embodiment will be described. FIG. 15(a) is a perspective view of the intermediate connection member 300D according to the fifth embodiment. Note that the configuration of the intermediate connection member 300D of the fifth embodiment and its manufacturing method are the same as those of the intermediate connection member 300B of the third embodiment. That is, the manufacturing method of the intermediate connection member 300D of the fifth embodiment is the same as that of the intermediate connection member 300 of the first embodiment.

[0101] The intermediate connection member 300D includes a wiring group 311D having the same configuration as the wiring group 311B of the third embodiment, and a wiring group 312D having the same configuration as the wiring group 312B of the third embodiment. Further, the intermediate connection member 300D includes an insulating substrate portion 321D having the same configuration as the insulating substrate portion 321 of the third embodiment, an insulating substrate portion 322D having the same configuration as the insulating substrate portion 322 of the third embodiment, and an insulating layer portion 323D having the same configuration as the insulating layer portion 323 of the third embodiment. The insulating substrate portion 321D is the first insulating substrate portion, and the insulating substrate portion 322D is the second insulating substrate portion. The insulating substrate portion 321D and the insulating substrate portion 322D face each other with the insulating layer portion 323D interposed therebetween. The insulating substrate portions 321D and 322D are made of the same material as the insulating substrate portions 321 and 322 described in the first embodiment, for example, glass epoxy. The insulating layer portion 323D is made of a material different from that of the insulating substrate portion 321D and the insulating substrate portion 322D, and is formed of a solidified adhesive mainly composed of the same material as the insulating layer portion 323 described in the first embodiment, for example, epoxy resin or silicone resin.

[0102] In the fifth embodiment, the wiring section group 311D has a plurality, for example, seven wiring sections 311D-0 as a plurality of first wiring sections. The plurality of wiring sections 311D-0 are arranged at intervals in the X direction. Each wiring section 311D-0 extends in the Z direction so that both end faces in the Z direction are exposed to the outside. The material of each wiring section 311D-0 is a conductive material, for example, copper. The plurality of wiring sections 311D-0 include, for example, six wiring sections 311D-1 as at least one first wiring section and, for example, one wiring section 311D-2 as at least one first wiring section having a size and / or shape different from that of the wiring section 311D-1. The number of the wiring sections 311D-1 is preferably two or more, and is six in the fifth embodiment. The number of the wiring sections 311D-2 is preferably less than the number of the wiring sections 311D-1, and is one in the fifth embodiment.

[0103] The wiring section group 312D is arranged at an interval from the wiring section group 311D in the Y direction. The wiring section group 312D has a plurality, for example, seven wiring sections 312D-0 as a plurality of second wiring sections. The plurality of wiring sections 312D-0 are arranged at intervals in the X direction. Each wiring section 312D-0 extends in the Z direction so that both end faces in the Z direction are exposed to the outside. The material of each wiring section 312D-0 is a conductive material, for example, copper. The plurality of wiring sections 312D-0 include, for example, six wiring sections 312D-1 as at least one second wiring section and, for example, one wiring section 312D-2 as at least one second wiring section having a size and / or shape different from that of the wiring section 312D-1. The number of the wiring sections 312D-1 is preferably two or more, and is six in the fifth embodiment. The number of the wiring sections 312D-2 is preferably less than the number of the wiring sections 312D-1, and is one in the fifth embodiment.

[0104] In the manufacturing process of the imaging module according to the fifth embodiment, in order to improve the alignment accuracy between the intermediate connection member 300D and the wiring board 221 shown in FIG. 9(c), it is preferable to provide alignment marks on the intermediate connection member 300D. By providing alignment marks on the intermediate connection member 300D, the wiring portions can be arranged with high precision in the imaging module.

[0105] Also, in the manufacturing process of the intermediate connection member 300 according to the first embodiment, as shown in FIG. 7(c), the bonding of the insulating substrate 601 and the insulating substrate 602 with an adhesive was described. Also in the fifth embodiment, in the manufacturing process of the intermediate connection member 300D, the insulating substrate corresponding to the insulating substrate portion 321D and the insulating substrate corresponding to the insulating substrate portion 322D are bonded with an adhesive. In order to improve the alignment accuracy at that time, it is preferable to provide alignment marks on at least one of the two insulating substrates. By providing alignment marks on the insulating substrate, the wiring portions can be arranged with high precision in the intermediate connection member 300.

[0106] Therefore, in the fifth embodiment, the wiring portion 311D-2 among the plurality of wiring portions 311D-0 and the wiring portion 312D-2 among the plurality of wiring portions 312D-0 are used as alignment marks. Among the plurality of wiring portions 311D-0, the wiring portion located at the end in the X direction is the wiring portion 311D-2. Among the plurality of wiring portions 312D-0, the wiring portion located at the end in the X direction is the wiring portion 312D-2.

[0107] The width of each wiring portion 311D-1 in the X direction is the width W11D. The width W11D is the first width. The width of the wiring portion 311D-2 in the X direction is a width W12D that is wider than the width W11D. The width W12D is the second width. Thus, since the width W12D of the wiring portion 311D-2 is wider than the width W11D of the wiring portion 311D-1, the wiring portion 311D-2 can be used as an alignment mark.

[0108] Also, the thickness of each wiring portion 311D-1 in the Y direction is a thickness T1D. The thickness T1D is the first thickness. The thickness of the wiring portion 311D-2 in the Y direction is a thickness T2D that is thicker than the thickness T1D. The thickness T2D is the second thickness. Thus, since the thickness T2D of the wiring portion 311D-2 is thicker than the thickness T1D of the wiring portion 311D-1, the wiring portion 311D-2 can be used as an alignment mark.

[0109] Each of the wiring portions 311D-1 and 311D-2 is formed of, for example, a wire, and the diameter of the wiring portion 311D-2 is larger than the diameter of the wiring portion 311D-1. As a result, the width W12D of the wiring portion 311D-2 is wider than the width W11D of the wiring portion 311D-1, and the thickness T2D of the wiring portion 311D-2 is thicker than the thickness T1D of the wiring portion 311D-1.

[0110] The width of each wiring portion 312D-1 in the X direction is a width W13D. The width W13D is the third width. The width of the wiring portion 312D-2 in the X direction is a width W14D that is wider than the width W13D. The width W14D is the fourth width. Thus, since the width W14D of the wiring portion 312D-2 is wider than the width W13D of the wiring portion 312D-1, the wiring portion 312D-2 can be used as an alignment mark.

[0111] Also, the thickness of each wiring portion 312D-1 in the Y direction is a thickness T3D. The thickness T3D is the third thickness. The thickness of the wiring portion 312D-2 in the Y direction is a thickness T4D that is thicker than the thickness T3D. The thickness T4D is the fourth thickness. Thus, since the thickness T4D of the wiring portion 312D-2 is thicker than the thickness T3D of the wiring portion 312D-1, the wiring portion 312D-2 can be used as an alignment mark.

[0112] Each of the wiring portions 312D-1 and 312D-2 is formed of, for example, a wire, and the diameter of the wiring portion 312D-2 is larger than the diameter of the wiring portion 312D-1. As a result, the width W14D of the wiring portion 312D-2 is wider than the width W13D of the wiring portion 312D-1, and the thickness T4D of the wiring portion 312D-2 is thicker than the thickness T3D of the wiring portion 312D-1.

[0113] In the fifth embodiment, the plurality of wiring portions 311D-0 are arranged on the insulating substrate portion 321D, and the plurality of wiring portions 312D-0 are arranged on the insulating substrate portion 322D. Hereinafter, the configurations of the insulating substrate portion 321D on which the wiring portion 311D-0 is arranged and the insulating substrate portion 322D on which the wiring portion 312D-0 is arranged will be specifically described. FIG. 15(b) is an explanatory diagram of two insulating substrate portions 321D and 322D according to the fifth embodiment. FIG. 15(b) shows a plan view of the insulating substrate portions 321D and 322D viewed in the Z direction.

[0114] The insulating substrate portion 321D has a surface 3211D and a surface 3212D opposite to the surface 3211D in the Y direction. The insulating substrate portion 322D has a surface 3221D and a surface 3222D opposite to the surface 3221D in the Y direction. An insulating layer portion 323D of FIG. 15(a) is arranged between the surface 3212D and the surface 3222D. That is, the surface 3212D and the surface 3222D face each other with the insulating layer portion 323D interposed therebetween.

[0115] The plurality of wiring portions 311D-0 are arranged on the surface 3212D, and the plurality of wiring portions 312D-0 are arranged on the surface 3222D. That is, the plurality of wiring portions 311D-0 are arranged between the insulating substrate portion 321D and the insulating layer portion 323D, and the plurality of wiring portions 312D-0 are arranged between the insulating substrate portion 322D and the insulating layer portion 323D.

[0116] On the surface 3212D, a plurality of groove portions 31D-0 corresponding to the plurality of wiring portions 311D-0 are formed. The plurality of groove portions 31D-0 are formed at intervals from each other in the X direction. Each groove portion 31D-0 extends in the Z direction. The plurality of groove portions 31D-0 include a plurality of groove portions 31D-1 corresponding to the plurality of wiring portions 311D-1 and a groove portion 31D-2 corresponding to the wiring portion 311D-2. The groove portion 31D-2 is the first groove portion.

[0117] Each wiring portion 311D-1 is disposed in each groove portion 31D-1. The wiring portion 311D-2 is disposed in the groove portion 31D-2. Therefore, the width W22D in the X direction of the groove portion 31D-2 is wider than the width W21D in the X direction of each groove portion 31D-1, that is, the width W11D in the X direction of each wiring portion 311D-1. Also, the depth D2D in the Y direction of the groove portion 31D-2 is deeper than the depth D1D in the Y direction of each groove portion 31D-1, that is, the thickness T1D in the Y direction of each wiring portion 311D-1.

[0118] Preferably, the width W21D of each groove portion 31D-1 is wider than the width W11D of each wiring portion 311D-1. That is, preferably, the width W21D of each groove portion 31D-1 is wider than 1.0 times the width W11D of each wiring portion 311D-1. For example, the width W21D of each groove portion 31D-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W11D of each wiring portion 311D-1. Also, preferably, the width W21D of each groove portion 31D-1 is 20 times or less the width W11D of each wiring portion 311D-1.

[0119] Preferably, the width W22D of the groove portion 31D-2 is wider than the width W12D of the wiring portion 311D-2. That is, preferably, the width W22D of the groove portion 31D-2 is wider than 1.0 times the width W12D of the wiring portion 311D-2. For example, the width W22D of the groove portion 31D-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W12D of the wiring portion 311D-2. Also, preferably, the width W22D of the groove portion 31D-2 is 20 times or less the width W12D of the wiring portion 311D-2.

[0120] Preferably, the depth D1D of each groove portion 31D-1 is deeper than the thickness T1D of each wiring portion 311D-1. That is, preferably, the depth D1D of each groove portion 31D-1 is deeper than 1.0 times the thickness T1D of each wiring portion 311D-1. For example, the depth D1D of each groove portion 31D-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T1D of each wiring portion 311D-1. Also, preferably, the depth D1D of each groove portion 31D-1 is 20 times or less the thickness T1D of each wiring portion 311D-1.

[0121] The depth D2D of the groove portion 31D-2 is preferably deeper than the thickness T2D of the wiring portion 311D-2. That is, the depth D2D of the groove portion 31D-2 is preferably deeper than 1.0 times the thickness T2D of the wiring portion 311D-2. For example, the depth D2D of the groove portion 31D-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T2D of the wiring portion 311D-2. Further, the depth D2D of the groove portion 31D-2 is preferably 20 times or less the thickness T2D of the wiring portion 311D-2.

[0122] A plurality of groove portions 32D-0 corresponding to the plurality of wiring portions 312D-0 are formed on the surface 3222D. The plurality of groove portions 32D-0 are formed at intervals in the X direction. Each groove portion 32D-0 extends in the Z direction. The plurality of groove portions 32D-0 include a plurality of groove portions 32D-1 corresponding to the plurality of wiring portions 312D-1 and a groove portion 32D-2 corresponding to the wiring portion 312D-2. The groove portion 32D-2 is a second groove portion.

[0123] Each wiring portion 312D-1 is disposed in each groove portion 32D-1. The wiring portion 312D-2 is disposed in the groove portion 32D-2. For this reason, the width W24D in the X direction of the groove portion 32D-2 is wider than the width W23D in the X direction of each groove portion 32D-1, that is, the width W13D in the X direction of each wiring portion 312D-1. Further, the depth D4D in the Y direction of the groove portion 32D-2 is deeper than the depth D3D in the Y direction of each groove portion 32D-1, that is, the thickness T3D in the Y direction of each wiring portion 312D-1.

[0124] The width W23D of each groove portion 32D-1 is preferably wider than the width W13D of each wiring portion 312D-1. That is, the width W23D of each groove portion 32D-1 is preferably wider than 1.0 times the width W13D of each wiring portion 312D-1. For example, the width W23D of each groove portion 32D-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W13D of each wiring portion 312D-1. Further, the width W23D of each groove portion 32D-1 is preferably 20 times or less the width W13D of each wiring portion 312D-1.

[0125] The width W24D of the groove portion 32D-2 is preferably wider than the width W14D of the wiring portion 312D-2. That is, the width W24D of the groove portion 32D-2 is preferably more than 1.0 times the width W14D of the wiring portion 312D-2. For example, the width W24D of the groove portion 32D-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W14D of the wiring portion 312D-2. Also, the width W24D of the groove portion 32D-2 is preferably 20 times or less the width W14D of the wiring portion 312D-2.

[0126] The depth D3D of each groove portion 32D-1 is preferably deeper than the thickness T3D of each wiring portion 312D-1. That is, the depth D3D of each groove portion 32D-1 is preferably more than 1.0 times the thickness T3D of each wiring portion 312D-1. For example, the depth D3D of each groove portion 32D-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T3D of each wiring portion 312D-1. Also, the depth D3D of each groove portion 32D-1 is preferably 20 times or less the thickness T3D of each wiring portion 312D-1.

[0127] The depth D4D of the groove portion 32D-2 is preferably deeper than the thickness T4D of the wiring portion 312D-2. That is, the depth D4D of the groove portion 32D-2 is preferably more than 1.0 times the thickness T4D of the wiring portion 312D-2. For example, the depth D4D of the groove portion 32D-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T4D of the wiring portion 312D-2. Also, the depth D4D of the groove portion 32D-2 is preferably 20 times or less the thickness T4D of the wiring portion 312D-2.

[0128] Thus, when viewed in the Z direction, the area of the wiring portion 311D-2 becomes larger than the area of the wiring portion 311D-1, and the area of the wiring portion 312D-2 becomes larger than the area of the wiring portion 312D-1. As a result, by using each of the wiring portions 311D-2 and 312D-2 as an alignment mark, the alignment accuracy of the intermediate connection member 300D with respect to the wiring board 221 shown in FIG. 9(c) is improved. Further, when viewed in the Z direction, since the areas of the wiring portions 311D-2 and 312D-2 are large, the self-alignment effect of the intermediate connection member 300D with respect to the wiring board 221 is enhanced when the wiring board 221 and the intermediate connection member 300D are joined by soldering.

[0129] In the fifth embodiment, the wiring portion 311D-2 having the width W12D and the thickness T2D included in the plurality of wiring portions 311D-0 and the wiring portion 312D-2 having the width W14D and the thickness T4D included in the plurality of wiring portions 312D-0 are displaced in the X direction. That is, among the plurality of wiring portions 311D-0 and the plurality of wiring portions 312D-0, the separation distance between the wiring portion 311D-2 and the wiring portion 312D-2 is longer than the separation distance between the other two wiring portions. As a result, in the manufacturing process of the imaging module in the fifth embodiment, the alignment accuracy of the intermediate connection member 300D with respect to the wiring board 221 is further improved. Further, when the wiring board 221 and the intermediate connection member 300D are joined by soldering, the self-alignment effect of the intermediate connection member 300D with respect to the wiring board 221 is further enhanced. Further, in the manufacturing process of the intermediate connection member 300D, the alignment accuracy when joining the insulating substrate corresponding to the insulating substrate portion 321D and the insulating substrate corresponding to the insulating substrate portion 322D with an adhesive is further improved.

[0130] Although the case where the wiring portions 311D-2 and 312D-2 are used as alignment marks has been described, the present invention is not limited thereto. For example, the wiring portion 312D-2 and the groove portion 32D-2 may be omitted, and the wiring portion 311D-2 may be used as an alignment mark. Further, in the intermediate connection member 300D, the wiring portion group 312D, that is, the plurality of wiring portions 312D-0 may be omitted. Also in this case, the wiring portion 311D-2 may be used as an alignment mark.

[0131] Also, it is preferable that the width W12D of the wiring portion 311D-2 is wider than the width W11D of each wiring portion 311D-1 and the thickness T2D of the wiring portion 311D-2 is thicker than the thickness T1D of each wiring portion 311D-1, but it is not limited thereto. For example, when the width W12D of the wiring portion 311D-2 is wider than the width W11D of each wiring portion 311D-1, the thickness T2D of the wiring portion 311D-2 may be equal to or less than the thickness T1D of each wiring portion 311D-1. At this time, it is preferable that the width W22D of the groove portion 31D-2 is wider than the width W21D of each groove portion 31D-1 and the depth D2D of the groove portion 31D-2 is equal to or less than the depth D1D of each groove portion 31D-1. Similarly, when the thickness T2D of the wiring portion 311D-2 is thicker than the thickness T1D of each wiring portion 311D-1, the width W12D of the wiring portion 311D-2 may be equal to or less than the width W11D of each wiring portion 311D-1. At this time, it is preferable that the depth D2D of the groove portion 31D-2 is deeper than the depth D1D of each groove portion 31D-1 and the width W22D of the groove portion 31D-2 is equal to or less than the width W21D of each groove portion 31D-1. That is, the groove portion 31D-2 may be a groove portion that is wider than the width of each groove portion 31D-1, that is, each wiring portion 311D-1, and / or deeper than the thickness of each groove portion 31D-1, that is, each wiring portion 311D-1. Even in these cases, the wiring portion 311D-2 can be used as an alignment mark.

[0132] Similarly, it is preferable that the width W14D of the wiring portion 312D-2 is wider than the width W13D of each wiring portion 312D-1 and the thickness T4D of the wiring portion 312D-2 is thicker than the thickness T3D of each wiring portion 312D-1, but it is not limited thereto. For example, when the width W14D of the wiring portion 312D-2 is wider than the width W13D of each wiring portion 312D-1, the thickness T4D of the wiring portion 312D-2 may be equal to or less than the thickness T3D of each wiring portion 312D-1. At that time, it is preferable that the width W24D of the groove portion 32D-2 is wider than the width W23D of each groove portion 32D-1 and the depth D4D of the groove portion 32D-2 is equal to or less than the depth D3D of each groove portion 32D-1. Similarly, when the thickness T4D of the wiring portion 312D-2 is thicker than the thickness T3D of each wiring portion 312D-1, the width W14D of the wiring portion 312D-2 may be equal to or less than the width W13D of each wiring portion 312D-1. At that time, it is preferable that the depth D4D of the groove portion 32D-2 is deeper than the depth D3D of each groove portion 32D-1 and the width W24D of the groove portion 32D-2 is equal to or less than the width W23D of each groove portion 32D-1. That is, the groove portion 32D-2 may be a groove portion that is wider than the width of each groove portion 32D-1, that is, each wiring portion 312D-1, and / or deeper than the thickness of each groove portion 32D-1, that is, each wiring portion 312D-1. Even in these cases, the wiring portion 312D-2 can be used as an alignment mark.

[0133] In addition, although the case where the wiring portion group 311D, that is, a plurality of wiring portions 311D-0 includes one wiring portion 311D-2 has been described, it is not limited thereto, and two or more wiring portions 311D-2 may be included. At that time, it is preferable that each of the two wiring portions located at both ends in the X direction among the plurality of wiring portions 311D-0 is the wiring portion 311D-2.

[0134] Similarly, although the case where the wiring portion group 312D, that is, a plurality of wiring portions 312D-0 includes one wiring portion 312D-2 has been described, it is not limited thereto, and two or more wiring portions 312D-2 may be included. At that time, it is preferable that each of the two wiring portions located at both ends in the X direction among the plurality of wiring portions 312D-0 is the wiring portion 312D-2.

[0135] Also, although each of the plurality of wiring portions 311D-0 has been described as being a wire, the present invention is not limited thereto. Each of the plurality of wiring portions 311D-0 may be a conductor. Therefore, any one or all of the plurality of wiring portions 311D-0 may be, for example, a conductor pattern.

[0136] Similarly, although each of the plurality of wiring portions 312D-0 has been described as being a wire, the present invention is not limited thereto. Each of the plurality of wiring portions 312D-0 may be a conductor. Therefore, any one or all of the plurality of wiring portions 312D-0 may be, for example, a conductor pattern.

[0137] Also, although the case where each of the wiring portions 311D-2 and 312D-2 is disposed in each of the groove portions 31D-2 and 32D-2 has been described, the present invention is not limited thereto, and one or both of the wiring portions 311D-2 and 312D-2 may be omitted. In this case, the groove portion without a wiring portion can be used as an alignment mark. Note that a part of the insulating layer portion 323D is filled in the groove portion without a wiring portion.

[0138] [Sixth Embodiment] Next, the intermediate connection member of the sixth embodiment will be described. FIG. 16(a) is a perspective view of an intermediate connection member 300E according to the sixth embodiment. Note that the configuration and manufacturing method of the intermediate connection member 300E of the sixth embodiment are substantially the same as the configuration and manufacturing method of the intermediate connection member 300B of the third embodiment. That is, the manufacturing method of the intermediate connection member 300E of the sixth embodiment is substantially the same as the manufacturing method of the intermediate connection member 300 of the first embodiment.

[0139] The intermediate connection member 300E has a wiring portion group 311E and a wiring portion group 312E. The intermediate connection member 300E also has an insulating substrate portion 321E, an insulating substrate portion 322E, and an insulating layer portion 323E. The insulating substrate portion 321E is a first insulating substrate portion, and the insulating substrate portion 322E is a second insulating substrate portion. The insulating substrate portion 321E and the insulating substrate portion 322E face each other with the insulating layer portion 323E interposed therebetween. The insulating substrate portions 321E and 322E are made of the same material as the insulating substrate portions 321 and 322 described in the first embodiment, for example, glass epoxy. The insulating layer portion 323E is made of a material different from that of the insulating substrate portion 321E and the insulating substrate portion 322E, and is formed of a cured adhesive mainly composed of the same material as the insulating layer portion 323 described in the first embodiment, for example, epoxy resin or silicone resin.

[0140] In the sixth embodiment, the wiring portion group 311E has a plurality of first wiring portions, for example, seven wiring portions 311E-0. The plurality of wiring portions 311E-0 are arranged at intervals in the X direction. Each wiring portion 311E-0 extends in the Z direction so that both end faces in the Z direction are exposed to the outside. The material of each wiring portion 311E-0 is a conductive material, for example, copper. The plurality of wiring portions 311E-0 include, as at least one first wiring portion, for example, six wiring portions 311E-1, and, as at least one first wiring portion having a size and / or shape different from that of the wiring portion 311E-1, for example, one wiring portion 311E-2. The number of the wiring portions 311E-1 is preferably two or more, and is six in the sixth embodiment. The number of the wiring portions 311E-2 is preferably less than the number of the wiring portions 311E-1, and is one in the sixth embodiment.

[0141] The wiring section group 312E is arranged at an interval from the wiring section group 311E in the Y direction. The wiring section group 312E has a plurality of, for example, seven wiring sections 312E-0 as a plurality of second wiring sections. The plurality of wiring sections 312E-0 are arranged at intervals from each other in the X direction. Each wiring section 312E-0 is arranged to extend in the Z direction such that both end faces in the Z direction are exposed to the outside. The material of each wiring section 312E-0 is a conductive material, such as copper. The plurality of wiring sections 312E-0 include, for example, six wiring sections 312E-1 as at least one second wiring section, and, for example, one wiring section 312E-2 as at least one second wiring section having a size and / or shape different from that of the wiring section 312E-1. The number of the wiring sections 312E-1 is preferably two or more, and is six in the sixth embodiment. The number of the wiring sections 312E-2 is preferably less than the number of the wiring sections 312E-1, and is one in the sixth embodiment.

[0142] Here, in the manufacturing process of the electronic module, the intermediate connection member needs to be aligned with high precision with respect to the wiring board to be joined. Therefore, in the manufacturing process of the imaging module in the sixth embodiment, in order to improve the alignment accuracy between the intermediate connection member 300E and the wiring board 221 shown in FIG. 9(c), it is preferable to provide an alignment mark on the intermediate connection member 300E. By providing an alignment mark on the intermediate connection member 300E, the wiring sections can be arranged with high precision in the imaging module.

[0143] Further, in the manufacturing process of the intermediate connection member 300E in the sixth embodiment, an insulating substrate corresponding to the insulating substrate portion 321E and an insulating substrate corresponding to the insulating substrate portion 322E are joined with an adhesive. In order to improve the alignment accuracy at that time, it is preferable to provide an alignment mark on at least one of the two insulating substrates. By providing an alignment mark on the insulating substrate, the wiring sections can be arranged with high precision in the intermediate connection member 300E.

[0144] Therefore, in the sixth embodiment, the wiring portion 311E-2 among the plurality of wiring portions 311E-0 and the wiring portion 312E-2 among the plurality of wiring portions 312E-0 are used as alignment marks. Among the plurality of wiring portions 311E-0, the wiring portion located at the end in the X direction is the wiring portion 311E-2. Among the plurality of wiring portions 312E-0, the wiring portion located at the end in the X direction is the wiring portion 312E-2.

[0145] The width of each wiring portion 311E-1 in the X direction is the width W11E. The width W11E is the first width. The width of the wiring portion 311E-2 in the X direction is a width W12E that is wider than the width W11E. The width W12E is the second width. Thus, since the width W12E of the wiring portion 311E-2 is wider than the width W11E of the wiring portion 311E-1, the wiring portion 311E-2 can be used as an alignment mark.

[0146] Also, the thickness of each wiring portion 311E-1 in the Y direction is the thickness T1E. The thickness T1E is the first thickness. The thickness of the wiring portion 311E-2 in the Y direction is a thickness T2E that is thicker than the thickness T1E. The thickness T2E is the second thickness. Thus, since the thickness T2E of the wiring portion 311E-2 is thicker than the thickness T1E of the wiring portion 311E-1, the wiring portion 311E-2 can be used as an alignment mark.

[0147] Each of the wiring portions 311E-1 and 311E-2 is composed of, for example, a wire, and the diameter of the wiring portion 311E-2 is larger than the diameter of the wiring portion 311E-1. As a result, the width W12E of the wiring portion 311E-2 is wider than the width W11E of the wiring portion 311E-1, and the thickness T2E of the wiring portion 311E-2 is thicker than the thickness T1E of the wiring portion 311E-1.

[0148] The width of each wiring portion 312E-1 in the X direction is the width W13E. The width W13E is the third width. The width of the wiring portion 312E-2 in the X direction is a width W14E that is wider than the width W13E. The width W14E is the fourth width. Thus, since the width W14E of the wiring portion 312E-2 is wider than the width W13E of the wiring portion 312E-1, the wiring portion 312E-2 can be used as an alignment mark.

[0149] Also, the thickness of each wiring portion 312E-1 in the Y direction is the thickness T3E. The thickness T3E is the third thickness. The thickness of the wiring portion 312E-2 in the Y direction is a thickness T4E that is thicker than the thickness T3E. The thickness T4E is the fourth thickness. Thus, since the thickness T4E of the wiring portion 312E-2 is thicker than the thickness T3E of the wiring portion 312E-1, the wiring portion 312E-2 can be used as an alignment mark.

[0150] Each of the wiring portions 312E-1 and 312E-2 is composed of, for example, a wire, and the diameter of the wiring portion 312E-2 is larger than the diameter of the wiring portion 312E-1. As a result, the width W14E of the wiring portion 312E-2 is wider than the width W13E of the wiring portion 312E-1, and the thickness T4E of the wiring portion 312E-2 is thicker than the thickness T3E of the wiring portion 312E-1.

[0151] In the sixth embodiment, a plurality of wiring portions 311E-0 are arranged on the insulating substrate portion 321E, and a plurality of wiring portions 312E-0 are arranged on the insulating substrate portion 322E. Hereinafter, the configurations of the insulating substrate portion 321E on which the wiring portion 311E-0 is arranged and the insulating substrate portion 321E on which the wiring portion 312E-0 is arranged will be specifically described. FIG. 16(b) is an explanatory diagram of two insulating substrate portions 321E and 322E according to the sixth embodiment. FIG. 16(b) shows a plan view of the insulating substrate portions 321E and 322E viewed in the Z direction.

[0152] The insulating substrate portion 321E has a surface 3211E and a surface 3212E opposite to the surface 3211E. The insulating substrate portion 322E has a surface 3221E and a surface 3222E opposite to the surface 3221E. An insulating layer portion 323E of FIG. 16(a) is arranged between the surface 3212E and the surface 3222E. That is, the surface 3212E and the surface 3222E face each other with the insulating layer portion 323E interposed therebetween.

[0153] The plurality of wiring portions 311E-0 are arranged on the surface 3211E, and the plurality of wiring portions 312E-0 are arranged on the surface 3221E. That is, the plurality of wiring portions 311E-0 are arranged on the outer surface 3211E of the insulating substrate portion 321E, and the plurality of wiring portions 312E-0 are arranged on the outer surface 3221E of the insulating substrate portion 321E. Note that an insulating layer (not shown) may be provided on each of the surfaces 3211E and 3221E.

[0154] On the surface 3211E, a plurality of groove portions 31E-0 corresponding to the plurality of wiring portions 311E-0 are formed. The plurality of groove portions 31E-0 are formed at intervals in the X direction. Each groove portion 31E-0 extends in the Z direction. The plurality of groove portions 31E-0 include a plurality of groove portions 31E-1 corresponding to the plurality of wiring portions 311E-1 and a groove portion 31E-2 corresponding to the wiring portion 311E-2. The groove portion 31E-2 is the first groove portion.

[0155] Each wiring portion 311E-1 is arranged in each groove portion 31E-1. The wiring portion 311E-2 is arranged in the groove portion 31E-2. Therefore, the width W22E in the X direction of the groove portion 31E-2 is wider than the width W21E in the X direction of each groove portion 31E-1, that is, the width W11E in the X direction of each wiring portion 311E-1. Also, the depth D2E in the Y direction of the groove portion 31E-2 is deeper than the depth D1E in the Y direction of each groove portion 31E-1, that is, the thickness T1E in the Y direction of each wiring portion 311E-1.

[0156] Preferably, the width W21E of each groove portion 31E-1 is wider than the width W11E of each wiring portion 311E-1. That is, preferably, the width W21E of each groove portion 31E-1 is wider than 1.0 times the width W11E of each wiring portion 311E-1. For example, the width W21E of each groove portion 31E-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W11E of each wiring portion 311E-1. Also, preferably, the width W21E of each groove portion 31E-1 is 20 times or less the width W11E of each wiring portion 311E-1.

[0157] The width W22E of the groove portion 31E-2 is preferably wider than the width W12E of the wiring portion 311E-2. That is, the width W22E of the groove portion 31E-2 is preferably wider than 1.0 times the width W12E of the wiring portion 311E-2. For example, the width W22E of the groove portion 31E-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W12E of the wiring portion 311E-2. Also, the width W22E of the groove portion 31E-2 is preferably 20 times or less the width W12E of the wiring portion 311E-2.

[0158] The depth D1E of each groove portion 31E-1 is preferably deeper than the thickness T1E of each wiring portion 311E-1. That is, the depth D1E of each groove portion 31E-1 is preferably deeper than 1.0 times the thickness T1E of each wiring portion 311E-1. For example, the depth D1E of each groove portion 31E-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T1E of each wiring portion 311E-1. Also, the depth D1E of each groove portion 31E-1 is preferably 20 times or less the thickness T1E of each wiring portion 311E-1.

[0159] The depth D2E of the groove portion 31E-2 is preferably deeper than the thickness T2E of the wiring portion 311E-2. That is, the depth D2E of the groove portion 31E-2 is preferably deeper than 1.0 times the thickness T2E of the wiring portion 311E-2. For example, the depth D2E of the groove portion 31E-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T2E of the wiring portion 311E-2. Also, the depth D2E of the groove portion 31E-2 is preferably 20 times or less the thickness T2E of the wiring portion 311E-2.

[0160] On the surface 3221E, a plurality of groove portions 32E-0 corresponding to the plurality of wiring portions 312E-0 are formed. The plurality of groove portions 32E-0 are formed at intervals in the X direction. Each groove portion 32E-0 extends in the Z direction. The plurality of groove portions 32E-0 include a plurality of groove portions 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove portion 32E-2 corresponding to the wiring portion 312E-2. The groove portion 32E-2 is the second groove portion.

[0161] Each wiring part 312E-1 is disposed in each groove part 32E-1. The wiring part 312E-2 is disposed in the groove part 32E-2. Therefore, the width W24E in the X direction of the groove part 32E-2 is wider than the width W23E in the X direction of each groove part 32E-1, that is, the width W13E in the X direction of each wiring part 312E-1. Also, the depth D4E in the Y direction of the groove part 32E-2 is deeper than the depth D3E in the Y direction of each groove part 32E-1, that is, the thickness T3E in the Y direction of each wiring part 312E-1.

[0162] Preferably, the width W23E of each groove part 32E-1 is wider than the width W13E of each wiring part 312E-1. That is, preferably, the width W23E of each groove part 32E-1 is wider than 1.0 times the width W13E of each wiring part 312E-1. For example, the width W23E of each groove part 32E-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W13E of each wiring part 312E-1. Also, preferably, the width W23E of each groove part 32E-1 is 20 times or less the width W13E of each wiring part 312E-1.

[0163] Preferably, the width W24E of the groove part 32E-2 is wider than the width W14E of the wiring part 312E-2. That is, preferably, the width W24E of the groove part 32E-2 is wider than 1.0 times the width W14E of the wiring part 312E-2. For example, the width W24E of the groove part 32E-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the width W14E of the wiring part 312E-2. Also, preferably, the width W24E of the groove part 32E-2 is 20 times or less the width W14E of the wiring part 312E-2.

[0164] Preferably, the depth D3E of each groove part 32E-1 is deeper than the thickness T3E of each wiring part 312E-1. That is, preferably, the depth D3E of each groove part 32E-1 is deeper than 1.0 times the thickness T3E of each wiring part 312E-1. For example, the depth D3E of each groove part 32E-1 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T3E of each wiring part 312E-1. Also, preferably, the depth D3E of each groove part 32E-1 is 20 times or less the thickness T3E of each wiring part 312E-1.

[0165] The depth D4E of the groove portion 32E-2 is preferably deeper than the thickness T4E of the wiring portion 312E-2. That is, the depth D4E of the groove portion 32E-2 is preferably deeper than 1.0 times the thickness T4E of the wiring portion 312E-2. For example, the depth D4E of the groove portion 32E-2 may be 1.1 times or more, 1.5 times or more, or 2 times or more the thickness T4E of the wiring portion 312E-2. Also, the depth D4E of the groove portion 32E-2 is preferably 20 times or less the thickness T4E of the wiring portion 312E-2.

[0166] Thus, when viewed in the Z direction, the area of the wiring portion 311E-2 becomes wider than the area of the wiring portion 311E-1, and the area of the wiring portion 312E-2 becomes wider than the area of the wiring portion 312E-1. Thereby, by using each of the wiring portions 311E-2 and 312E-2 as an alignment mark, the alignment accuracy of the intermediate connection member 300E with respect to the wiring board 221 shown in FIG. 9(c) is improved. Also, when viewed in the Z direction, since the areas of the respective wiring portions 311E-2 and 312E-2 are wide, the self-alignment effect of the intermediate connection member 300E with respect to the wiring board 221 is enhanced when the wiring board 221 and the intermediate connection member 300E are joined by solder.

[0167] In the sixth embodiment, the wiring portion 311E-2 having a width W12E and a thickness T2E included in the plurality of wiring portions 311E-0 and the wiring portion 312E-2 having a width W14E and a thickness T4E included in the plurality of wiring portions 312E-0 are displaced in the X direction. That is, among the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0, the separation distance between the wiring portion 311E-2 and the wiring portion 312E-2 is longer than the separation distance between the other two wiring portions. Thereby, in the manufacturing process of the imaging module in the sixth embodiment, the alignment accuracy of the intermediate connection member 300E with respect to the wiring board 221 is further improved. Further, when the wiring board 221 and the intermediate connection member 300E are joined by solder, the self-alignment effect of the intermediate connection member 300E with respect to the wiring board 221 is further enhanced. Further, in the manufacturing process of the intermediate connection member 300E, the alignment accuracy when joining the insulating substrate corresponding to the insulating substrate portion 321E and the insulating substrate corresponding to the insulating substrate portion 322E with an adhesive is further improved.

[0168] Although the case where the wiring portion 311E-2 and the wiring portion 312E-2 are used as alignment marks has been described, the present invention is not limited thereto. For example, the wiring portion 312E-2 and the groove portion 32E-2 may be omitted, and the wiring portion 311E-2 may be used as an alignment mark. Further, in the intermediate connection member 300E, the wiring portion group 312E, that is, the plurality of wiring portions 312-E may be omitted. Also in this case, the wiring portion 311E-2 may be used as an alignment mark.

[0169] Also, it is preferable that the width W12E of the wiring portion 311E-2 is wider than the width W11E of each wiring portion 311E-1 and the thickness T2E of the wiring portion 311E-2 is thicker than the thickness T1E of each wiring portion 311E-1, but it is not limited thereto. For example, when the width W12E of the wiring portion 311E-2 is wider than the width W11E of each wiring portion 311E-1, the thickness T2E of the wiring portion 311E-2 may be equal to or less than the thickness T1E of each wiring portion 311E-1. At that time, it is preferable that the width W22E of the groove portion 31E-2 is wider than the width W21E of each groove portion 31E-1 and the depth D2E of the groove portion 31E-2 is equal to or less than the depth D1E of each groove portion 31D-1. Similarly, when the thickness T2E of the wiring portion 311E-2 is thicker than the thickness T1E of each wiring portion 311E-1, the width W12E of the wiring portion 311E-2 may be equal to or less than the width W11E of each wiring portion 311E-1. At that time, it is preferable that the depth D2E of the groove portion 31E-2 is deeper than the depth D1E of each groove portion 31E-1 and the width W22E of the groove portion 31E-2 is equal to or less than the width W21E of each groove portion 31E-1. That is, the groove portion 31E-2 may be a groove portion that is wider than the width of each groove portion 31E-1, that is, each wiring portion 311E-1, and / or deeper than the thickness of each groove portion 31E-1, that is, each wiring portion 311E-1. Even in these cases, the wiring portion 311E-2 can be used as an alignment mark.

[0170] Similarly, it is preferable that the width W14E of the wiring portion 312E-2 is wider than the width W13E of each wiring portion 312E-1 and the thickness T4E of the wiring portion 312E-2 is thicker than the thickness T3E of each wiring portion 312E-1, but it is not limited thereto. For example, when the width W14E of the wiring portion 312E-2 is wider than the width W13E of each wiring portion 312E-1, the thickness T4E of the wiring portion 312E-2 may be equal to or less than the thickness T3E of each wiring portion 312E-1. At this time, it is preferable that the width W24E of the groove portion 32E-2 is wider than the width W23E of each groove portion 32E-1 and the depth D4E of the groove portion 32E-2 is equal to or less than the depth D3E of each groove portion 32E-1. Similarly, when the thickness T4E of the wiring portion 312E-2 is thicker than the thickness T3E of each wiring portion 312E-1, the width W14E of the wiring portion 312E-2 may be equal to or less than the width W13E of each wiring portion 312E-1. At this time, it is preferable that the depth D4E of the groove portion 32E-2 is deeper than the depth D3E of each groove portion 32E-1 and the width W24E of the groove portion 32E-2 is equal to or less than the width W23E of each groove portion 32E-1. That is, the groove portion 32E-2 may be a groove portion that is wider than the width of each groove portion 32E-1, that is, each wiring portion 312E-1, and / or deeper than the thickness of each groove portion 32E-1, that is, each wiring portion 312E-1. Even in these cases, the wiring portion 312E-2 can be used as an alignment mark.

[0171] In addition, although the case where the wiring portion group 311E, that is, a plurality of wiring portions 311E-0 includes one wiring portion 311E-2 has been described, it is not limited thereto, and two or more wiring portions 311E-2 may be included. At this time, among the plurality of wiring portions 311E-0, it is preferable that each of the two wiring portions located at both ends in the X direction is the wiring portion 311E-2.

[0172] Similarly, although the case where the wiring portion group 312E, that is, a plurality of wiring portions 312E-0 includes one wiring portion 312E-2 has been described, it is not limited thereto, and two or more wiring portions 312E-2 may be included. At this time, among the plurality of wiring portions 312E-0, it is preferable that each of the two wiring portions located at both ends in the X direction is the wiring portion 312E-2.

[0173] Also, although each of the plurality of wiring portions 311E-0 has been described as being a wire, the present invention is not limited thereto. Each of the plurality of wiring portions 311E-0 may be a conductor. Thus, any one or all of the plurality of wiring portions 311E-0 may be, for example, a conductor pattern.

[0174] Similarly, although each of the plurality of wiring portions 312E-0 has been described as being a wire, the present invention is not limited thereto. Each of the plurality of wiring portions 312E-0 may be a conductor. Thus, any one or all of the plurality of wiring portions 312E-0 may be, for example, a conductor pattern.

[0175] FIGS. 17(a) and 17(b) are explanatory views of the intermediate connection members 300E-1 and 300E-2 of the modification. In the sixth embodiment, the case where each of the wiring portions 311E-2 and 312E-2 is disposed in each of the groove portions 31E-2 and 32E-2 has been described, but the present invention is not limited thereto. One or both of the wiring portions 311E-2 and 312E-2 in FIG. 16(a) may be omitted. In the modification shown in FIGS. 17(a) and 17(b), both of the wiring portions 311E-2 and 312E-2 are omitted. In each of the groove portions 31E-2 and 32E-2 of the intermediate connection member 300E-1 shown in FIG. 17(a), nothing is filled, and each of the groove portions 31E-2 and 32E-2 is used as an alignment mark.

[0176] Also, in each of the groove portions 31E-2 and 32E-2 of the intermediate connection member 300E-2 shown in FIG. 17(b), each of the insulators 324E and 325E is disposed. Each of the insulators 324E and 325E is an insulator (not shown) of a material or color different from that of the insulating substrate portions 321E and 322E, and each of the insulators 324E and 325E is used as an alignment mark.

[0177] [Seventh Embodiment] Next, the intermediate connection member of the seventh embodiment will be described. FIG. 18(a) is a perspective view of the intermediate connection member 300F according to the seventh embodiment. Note that the intermediate connection member 300F of the seventh embodiment is obtained by using an insulating substrate portion 321F instead of the insulating substrate portions 321E, 322E, and the insulating layer portion 323E in the intermediate connection member 300E of the sixth embodiment. The manufacturing method of the intermediate connection member 300F in the seventh embodiment is obtained by omitting the step of bonding the insulating substrate portion 321E and the insulating substrate portion 322E in the manufacturing method of the intermediate connection member 300E of the sixth embodiment.

[0178] Similar to the sixth embodiment, the intermediate connection member 300F has a wiring portion group 311E and a wiring portion group 312E. Further, the intermediate connection member 300F has an insulating substrate portion 321F. The insulating substrate portion 321F is a first insulating substrate portion. The insulating substrate portion 321F is made of the same material as the insulating substrate portions 321 and 322 described in the first embodiment, for example, glass epoxy.

[0179] In the seventh embodiment, the wiring portion group 311E has, as a plurality of first wiring portions, for example, seven wiring portions 311E-0. The material of each wiring portion 311E-0 is a conductive material, for example, copper. The plurality of wiring portions 311E-0 includes at least one, for example, six wiring portions 311E-1, and at least one, for example, one wiring portion 311E-2. The wiring portion group 312E is arranged at an interval in the Y direction from the wiring portion group 311E. The wiring portion group 312E has, as a plurality of second wiring portions, for example, seven wiring portions 312E-0. The plurality of wiring portions 312E-0 includes at least one, for example, six wiring portions 312E-1, and at least one, for example, one wiring portion 312E-2.

[0180] In the manufacturing process of the imaging module in the seventh embodiment, in order to improve the alignment accuracy between the intermediate connection member 300F and the wiring board 221 shown in FIG. 9(c), it is preferable to provide an alignment mark on the intermediate connection member 300F. By providing an alignment mark on the intermediate connection member 300F, the wiring portions can be arranged with high precision in the imaging module.

[0181] Therefore, in the seventh embodiment, the wiring portion 311E-2 among the plurality of wiring portions 311E-0 and the wiring portion 312E-2 among the plurality of wiring portions 312E-0 are used as alignment marks. Among the plurality of wiring portions 311E-0, the wiring portion located at the end in the X direction is the wiring portion 311E-2. Among the plurality of wiring portions 312E-0, the wiring portion located at the end in the X direction is the wiring portion 312E-2. The widths and thicknesses of each wiring portion 311E-1, the wiring portion 311E-2, each wiring portion 312E-1, and the wiring portion 312E-2 are as described in the sixth embodiment.

[0182] Each of the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0 is composed of, for example, wires. In the seventh embodiment, the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0 are arranged on the same insulating substrate portion 321F. Hereinafter, the configuration of the insulating substrate portion 321F on which the wiring portions 311E-0 and 312E-0 are arranged will be specifically described. FIG. 18(b) is an explanatory diagram of the insulating substrate portion 321F according to the seventh embodiment. FIG. 18(b) shows a plan view of the insulating substrate portion 321F viewed in the Z direction. The insulating substrate portion 321F has a surface 3211F and a surface 3212F that is opposite to the surface 3211F in the Y direction.

[0183] The plurality of wiring portions 311E-0 are arranged on the surface 3211F, and the plurality of wiring portions 312E-0 are arranged on the surface 3212F. That is, the plurality of wiring portions 311E-0 are arranged on the outer surface 3211F of the insulating substrate portion 321F, and the plurality of wiring portions 312E-0 are arranged on the outer surface 3212F of the insulating substrate portion 321F. Note that an insulating layer (not shown) may be provided on each of the surfaces 3211F and 3212F.

[0184] On surface 3211F, a plurality of groove portions 31E-0 corresponding to a plurality of wiring portions 311E-0 having the same configuration as in the sixth embodiment are formed. The plurality of groove portions 31E-0 are formed at intervals in the X direction. Each groove portion 31E-0 extends in the Z direction. The plurality of groove portions 31E-0 include a plurality of groove portions 31E-1 corresponding to the plurality of wiring portions 311E-1 and a groove portion 31E-2 corresponding to the wiring portion 311E-2. The groove portion 31E-2 is the first groove portion. Each wiring portion 311E-1 is disposed in each groove portion 31E-1. The wiring portion 311E-2 is disposed in the groove portion 31E-2.

[0185] On surface 3212F, a plurality of groove portions 32E-0 corresponding to a plurality of wiring portions 312E-0 having the same configuration as in the sixth embodiment are formed. The plurality of groove portions 32E-0 are formed at intervals in the X direction. Each groove portion 32E-0 extends in the Z direction. The plurality of groove portions 32E-0 include a plurality of groove portions 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove portion 32E-2 corresponding to the wiring portion 312E-2. The groove portion 32E-2 is the second groove portion. Each wiring portion 312E-1 is disposed in each groove portion 32E-1. The wiring portion 312E-2 is disposed in the groove portion 32E-2.

[0186] In the seventh embodiment, the widths and depths of each groove portion 31E-1, the groove portion 31E-2, each groove portion 32E-1, and the groove portion 32E-2 are as described in the sixth embodiment.

[0187] Thus, when viewed in the Z direction, the area of the wiring portion 311E-2 becomes wider than the area of the wiring portion 311E-1, and the area of the wiring portion 312E-2 becomes wider than the area of the wiring portion 312E-1. Thereby, by using each of the wiring portions 311E-2 and 312E-2 as an alignment mark, the alignment accuracy of the intermediate connection member 300F with respect to the wiring board 221 shown in FIG. 9(c) is improved. Further, when viewed in the Z direction, since the areas of each of the wiring portions 311E-2 and 312E-2 are wide, the self-alignment effect of the intermediate connection member 300F with respect to the wiring board 221 is enhanced when the wiring board 221 and the intermediate connection member 300F are joined by soldering.

[0188] In the seventh embodiment, the wiring part 311E-2 included in the plurality of wiring parts 311E-0 and the wiring part 312E-2 included in the plurality of wiring parts 312E-0 are displaced in the X direction. That is, among the plurality of wiring parts 311E-0 and the plurality of wiring parts 312E-0, the separation distance between the wiring part 311E-2 and the wiring part 312E-2 is longer than the separation distance between the other two wiring parts. Thereby, in the manufacturing process of the imaging module in the seventh embodiment, the alignment accuracy of the intermediate connection member 300F with respect to the wiring board 221 is further improved.

[0189] Note that, also in the seventh embodiment, the same modifications as those in the modification example of the sixth embodiment are possible.

[0190] [Eighth Embodiment] Next, the intermediate connection member of the eighth embodiment will be described. FIG. 19 is a perspective view of an intermediate connection member 300G according to the eighth embodiment.

[0191] The intermediate connection member 300G has a wiring part group 311G and a wiring part group 312G. The intermediate connection member 300G also has an insulating substrate part 321G which is a first insulating substrate part. The insulating substrate part 321G is made of the same material as the insulating substrate parts 321 and 322 described in the first embodiment, for example, glass epoxy.

[0192] In the eighth embodiment, the wiring part group 311G has, as a plurality of first wiring parts, for example, seven wiring parts 311G-0. The material of each wiring part 311G-0 is a conductive material, for example, copper. The plurality of wiring parts 311G-0 include at least one, for example, six wiring parts 311G-1, and at least one, for example, one wiring part 311G-2. The wiring part group 312G is arranged at an interval in the Y direction from the wiring part group 311G. The wiring part group 312G has, as a plurality of second wiring parts, for example, seven wiring parts 312G-0. The plurality of wiring parts 312G-0 include at least one, for example, six wiring parts 312G-1, and at least one, for example, one wiring part 312G-2.

[0193] In the manufacturing process of the imaging module according to the eighth embodiment, in order to improve the alignment accuracy between the intermediate connection member 300G and the wiring board 221 shown in FIG. 9(c), it is preferable to provide alignment marks on the intermediate connection member 300G. By providing alignment marks on the intermediate connection member 300G, the wiring portions can be arranged with high precision in the imaging module.

[0194] Therefore, in the eighth embodiment, the wiring portion 311G-2 among the plurality of wiring portions 311G-0 and the wiring portion 312G-2 among the plurality of wiring portions 312G-0 are used as alignment marks. Among the plurality of wiring portions 311G-0, the wiring portion located at the end in the X direction is the wiring portion 311G-2. Among the plurality of wiring portions 312G-0, the wiring portion located at the end in the X direction is the wiring portion 312G-2. The widths and thicknesses of each wiring portion 311G-1, wiring portion 311G-2, each wiring portion 312G-1, and wiring portion 312G-2 are as described in the sixth embodiment.

[0195] Each of the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0 is formed of, for example, a conductor pattern. In the eighth embodiment, the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0 are arranged on the same insulating substrate portion 321G.

[0196] The insulating substrate portion 321G has a surface 3211G and a surface 3212G opposite to the surface 3211G in the Y direction. The plurality of wiring portions 311G-0 are arranged on the surface 3211G, and the plurality of wiring portions 312G-0 are arranged on the surface 3212G. That is, the plurality of wiring portions 311G-0 are arranged on the outer surface 3211G of the insulating substrate portion 321G, and the plurality of wiring portions 312G-0 are arranged on the outer surface 3212G of the insulating substrate portion 321G. Note that an insulating layer (not shown) may be provided on each of the surfaces 3211G and 3212G.

[0197] Thus, when viewed in the Z direction, the area of the wiring portion 311G-2 becomes larger than the area of the wiring portion 311G-1, and the area of the wiring portion 312G-2 becomes larger than the area of the wiring portion 312G-1. As a result, by using each of the wiring portions 311G-2 and 312G-2 as an alignment mark, the alignment accuracy of the intermediate connection member 300G with respect to the wiring board 221 shown in FIG. 9(c) is improved. Further, when viewed in the Z direction, since the areas of the respective wiring portions 311G-2 and 312G-2 are large, the self-alignment effect of the intermediate connection member 300G with respect to the wiring board 221 is enhanced when the wiring board 221 and the intermediate connection member 300G are joined by soldering.

[0198] In the eighth embodiment, the wiring portion 311G-2 included in the plurality of wiring portions 311G-0 and the wiring portion 312G-2 included in the plurality of wiring portions 312G-0 are displaced in the X direction. That is, among the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0, the separation distance between the wiring portion 311G-2 and the wiring portion 312G-2 is longer than the separation distance between the other two wiring portions. Thereby, in the manufacturing process of the imaging module in the eighth embodiment, the alignment accuracy of the intermediate connection member 300G with respect to the wiring board 221 is further improved.

[0199] In the eighth embodiment, the case where the wiring portions 311G-2 and 312G-2 are used as alignment marks has been described, but the present invention is not limited thereto. For example, the wiring portion 312G-2 may be omitted and the wiring portion 311G-2 may be used as an alignment mark. Further, in the intermediate connection member 300G, the wiring portion group 312G, that is, the plurality of wiring portions 312G-0 may be omitted. Also in this case, the wiring portion 311G-2 may be used as an alignment mark.

[0200] Also, regarding the width and / or thickness of each of the wiring portions 311G-2 and 312G-2 in the eighth embodiment, the same deformations as the deformation examples of the width and / or thickness of each of the wiring portions 311D-2 and 312D-2 in the fifth embodiment are possible.

[0201] In addition, although the case where the wiring section group 311G, that is, a plurality of wiring sections 311G-0 includes one wiring section 311G-2 has been described, the present invention is not limited thereto, and two or more wiring sections 311G-2 may be included. In that case, it is preferable that each of the two wiring sections located at both ends in the X direction among the plurality of wiring sections 311G-0 is the wiring section 311G-2.

[0202] Similarly, although the case where the wiring section group 312G, that is, a plurality of wiring sections 312G-0 includes one wiring section 312G-2 has been described, the present invention is not limited thereto, and two or more wiring sections 312G-2 may be included. In that case, it is preferable that each of the two wiring sections located at both ends in the X direction among the plurality of wiring sections 312G-0 is the wiring section 312G-2.

[0203] FIGS. 20(a) and 20(b) are explanatory views of the intermediate connection members 300G-1 and 300G-2 of the modified example. First, the intermediate connection member 300G-1 of the modified example shown in FIG. 20(a) will be described. The intermediate connection member 300G-1 includes an insulating substrate portion 321G-1, a plurality of wiring sections 311G-1, and a plurality of wiring sections 312G-1. The insulating substrate portion 321G-1 has a surface 3211G-1 including a groove portion 31G-2 and a surface 3212G-1 including a groove portion 32G-2. The surface 3212G-1 is a surface opposite to the surface 3211G-1 in the Y direction. The groove portion 31G-2 is a first groove portion, and the groove portion 32G-2 is a second groove portion.

[0204] The groove portion 31G-2 is preferably a groove that is wider than the width W11G of each wiring section 311G-1 and / or deeper than the thickness T1G of each wiring section 311G-1. In the intermediate connection member 300G-1 of the modified example shown in FIG. 20(a), the width W22G in the X direction of the groove portion 31G-2 is wider than the width W11G in the X direction of the wiring section 311G-1. Also, the depth D2G in the Y direction of the groove portion 31G-2 is deeper than the thickness T1G in the Y direction of the wiring section 311G-1.

[0205] The groove portion 32G-2 is preferably a groove portion that is wider than the width W13G of each wiring portion 312G-1 and / or deeper than the thickness T3G of each wiring portion 312G-1. In the intermediate connection member 300G-1 of the modified example shown in Fig. 20(a), the width W24G in the X direction of the groove portion 32G-2 is wider than the width W13G in the X direction of the wiring portion 312G-1. Also, the depth D4G in the Y direction of the groove portion 32G-2 is deeper than the thickness T3G in the Y direction of the wiring portion 312G-1.

[0206] With the above configuration, by using each of the groove portions 31G-2 and 32G-2 as an alignment mark, the alignment accuracy of the intermediate connection member 300G-1 with respect to the wiring board 221 shown in Fig. 9(c) is improved.

[0207] The groove portion 31G-2 and the groove portion 32G-2 are preferably displaced in the X direction. Note that in the intermediate connection member 300G-1, the groove portion 32G-2 can be omitted. Also, the insulating substrate portion 321G-1 may have a plurality of groove portions 31G-2 or may have a plurality of groove portions 32G-2.

[0208] The intermediate connection member 300G-2 of the modified example shown in Fig. 20(b) will be described. The intermediate connection member 300G-2 has an insulating substrate portion 321G-1, a plurality of wiring portions 311G-1, and a plurality of wiring portions 312G-1, similar to the intermediate connection member 300G-1. Each of the groove portions 31G-2 and 32G-2 of the intermediate connection member 300G-2 shown in Fig. 20(b) has respective insulators 324G and 325G disposed therein. Each of the insulators 324G and 325G is an insulator (not shown) of a material or color different from that of the insulating substrate portion 321G-1, and each of the insulators 324G and 325G is used as an alignment mark.

[0209] With the above configuration, by using each of the insulators 324G and 325G as an alignment mark, the alignment accuracy of the intermediate connection member 300G-2 with respect to the wiring board 221 shown in Fig. 9(c) is improved.

[0210] The groove portion 31G-2 and the groove portion 32G-2 are preferably offset in the X direction. In the intermediate connecting member 300G-2, the groove portion 32G-2 and the insulator 325G can be omitted. Further, the insulating substrate portion 321G-1 may have a plurality of groove portions 31G-2 or may have a plurality of groove portions 32G-2.

[0211] The present invention is not limited to the embodiments described above, and many modifications are possible within the technical idea of the present invention. For example, a plurality of embodiments can be combined. Also, at least one part of the matters of at least one embodiment can be deleted or replaced. Further, new matters can be added to at least one embodiment. For example, in the sixth to eighth embodiments, at least a part other than both end faces in the Z direction of the plurality of wiring portions 312 may be covered with an insulating film such as a solder resist film provided on the insulating substrate portion 321. The insulating film can suppress short circuits and corrosion of the plurality of wiring portions 312. Also, the effects described in the embodiments are merely an enumeration of the most suitable effects resulting from the present invention, and the effects according to the present invention are not limited to those described in the embodiments. Note that the disclosure content of this specification includes not only what is explicitly described in this specification but also all matters that can be grasped from this specification and the drawings attached to this specification. Also, the disclosure content of this specification includes the complement of the individual concepts described in this specification. That is, if this specification describes, for example, that "A is B", even if the description that "A is not B" is omitted, it can be said that this specification discloses that "A is not B". This is because when the description that "A is B" is made, it is premised that the case where "A is not B" is considered.

[0212] In the above-described embodiments, the case where the electronic component is an image sensor or a memory element has been described as an example, but the present invention is not limited thereto. For example, the electronic component may be a semiconductor device for image processing or a power supply IC. For example, the electronic component may be a semiconductor device for communication or a control IC. Further, the case where the electronic module is an imaging module has been described as an example, but the present invention is not limited thereto. For example, the electronic module may be a memory module, a signal processing module, a power supply module, a communication module, or a control module.

[0213] Also, the case where the electronic device is a digital camera has been described as an example, but the present invention is not limited thereto. For example, the electronic device may be a mobile communication device. For example, the electronic device may be an information device such as a smartphone or a personal computer, or a communication device such as a modem or a router. Alternatively, the electronic device may be an office device such as a printer or a copier, a medical device such as a radiation imaging device, a magnetic imaging device, an ultrasonic imaging device, or an endoscope, an industrial device such as a robot or a semiconductor manufacturing device, or a transportation device such as a vehicle, an airplane, or a ship. When wiring is provided in a limited space inside the housing of the electronic device, the use of the intermediate connection member 300 enables miniaturization and high density of the electronic device. The electronic module of the present invention is applicable to all electronic devices.

Description of Reference Numerals

[0214] 100... Digital camera (electronic device), 200... Imaging module (electronic module), 201... Circuit unit (first circuit unit), 202... Circuit unit (second circuit unit), 300... Intermediate connection member, 311... Wiring portion (first wiring portion), 312... Wiring portion (second wiring portion), 321... Insulating substrate portion (first insulating substrate portion), 322... Insulating substrate portion (second insulating substrate portion), 323... Insulating layer portion, 601... Insulating substrate (first insulating substrate), 602... Insulating substrate (second insulating substrate), 621... Groove (first groove), 622... Groove (second groove), 701... Conductive member (first conductive member), 702... Conductive member (second conductive member)

Claims

1. A method for manufacturing an intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite to each other, comprising the steps of: forming a first insulating substrate having a first major surface with a plurality of first grooves; providing a second insulating substrate having a second major surface with a plurality of second grooves; disposing a plurality of first conductive members in the plurality of first grooves; disposing a plurality of second conductive members in the plurality of second grooves; forming a structure by bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate via an insulating member such that a direction in which the plurality of first conductive members extend and a direction in which the plurality of second conductive members extend are aligned; cutting the structure in a second direction intersecting a first direction in which the plurality of first conductive members and the plurality of second conductive members extend, A method for manufacturing an intermediate connector comprising the steps of:

2. In the step of forming the structure, the first main surface of the first insulating substrate and the second main surface of the second insulating substrate are bonded together such that the first conductive members and the second conductive members are alternately arranged in the second direction. The method for manufacturing an intermediate connector according to claim 1 .

3. each of the first conductive members and each of the second conductive members is a wire; In the step of disposing the first conductive members in the first grooves, the first conductive members are fitted into the first grooves; In the step of arranging the second conductive members in the second grooves, the second conductive members are fitted into the second grooves.

3. The method for manufacturing an intermediate connector according to claim 1 or 2.

4. In the step of disposing the first conductive members in the first grooves, an adhesive is applied to the first grooves; In the step of disposing the second conductive members in the second grooves, an adhesive is applied to the second grooves. The method for manufacturing an intermediate connector according to claim 3 .

5. In the step of forming the structure, the first main surface of the first insulating substrate and the second main surface of the second insulating substrate are bonded together with an adhesive to form the insulating member. The method for manufacturing an intermediate connector according to any one of claims 1 to 4.

6. In the step of forming the structure, the first main surface of the first insulating substrate and the second main surface of the second insulating substrate are bonded to each other with an insulating sheet interposed therebetween by an adhesive to form the insulating member. The method for manufacturing an intermediate connector according to any one of claims 1 to 4.

7. The thickness of the insulating member formed in the step of forming the structure is 10 μm or more and 300 μm or less. The method for manufacturing an intermediate connector according to any one of claims 1 to 6.

8. An intermediate connection member used to electrically connect a first circuit unit and a second circuit unit that are arranged opposite each other, A first insulating substrate portion; A second insulating substrate portion; an insulating layer portion disposed between the first insulating substrate portion and the second insulating substrate portion and made of a material different from that of the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions disposed between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction, both end faces of which in the first direction are exposed to the outside; a plurality of second wiring portions disposed between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction, and both end faces in the first direction are exposed to the outside; An intermediate connecting member characterized by:

9. the plurality of first wiring portions and the plurality of second wiring portions are alternately arranged in a second direction intersecting the first direction; 9. An intermediate connector according to claim 8.

10. The insulating layer portion includes a first insulating layer, a second insulating layer made of the same material as the first insulating layer, and a third insulating layer disposed between the first insulating layer and the second insulating layer and made of a different material from the first insulating layer and the second insulating layer.

10. An intermediate connector according to claim 8 or 9.

11. The thickness of the insulating layer is 10 μm or more and 300 μm or less.

11. An intermediate connector according to any one of claims 8 to 10.

12. a ratio of a height of the intermediate connection member in the first direction to a pitch between two wiring portions that are closest to each other among the plurality of first wiring portions and the plurality of second wiring portions is 4 or more; 12. An intermediate connector according to any one of claims 8 to 11.

13. Providing an intermediate connector according to any one of claims 8 to 12; The intermediate connection member and the first circuit unit are joined by soldering; the intermediate connection member and the second circuit unit are joined by soldering; A method for manufacturing an electronic module comprising the steps of:

14. the first circuit unit having a first electronic component; the second circuit unit having a second electronic component arranged opposite to the first circuit unit; and an intermediate connection member according to any one of claims 8 to 12, which electrically connects the first circuit unit and the second circuit unit.

1. An electronic module comprising:

15. The first electronic component is an image sensor.

15. Electronic module according to claim 14.

16. A housing and and an electronic module according to claim 14 or 15 provided inside the housing.

1. An electronic device comprising:

Images