Board Work Equipment

Abstract

To provide a substrate work device capable of preventing malfunctions caused by condensation on a control substrate.SOLUTION: A substrate work device 100 has a substrate work section 3 (4, 5), a drive section 32 (42, 53) including a control substrate 32b (42b, 53b) that controls the substrate work section 3 (4, 5), and a condensation sensor 13 that detects condensation. The control substrate 32b (42b, 53b) includes a control section 132b (91, 142b, 153b) that controls the notification of the occurrence of condensation to the operator U based on the detection of condensation by the condensation sensor 13.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a board working device, and more particularly to a board working device equipped with a drive unit including a control board. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there has been known a circuit board that can be used as a control board in a drive unit of a board processing device (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a circuit board applicable as a control board in a drive unit of a circuit board processing device. This circuit board includes a substrate and a moisture-proof material. Electronic components are mounted on the substrate. The moisture-proof material is applied to the substrate after the electronic components are mounted on the substrate, thereby ensuring moisture resistance of the circuit board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-121747 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the circuit board (control board) of Patent Document 1, if a gap is formed between the moisture-proof material and the board when the moisture-proof material is applied to the application area, condensation may occur due to moisture contained in the air in the gap, even though the moisture-proof material is applied to the application area. In this case, the circuit board (control board) of Patent Document 1 has a problem that it may not be possible to prevent failures due to condensation on the board (control board) because power is supplied to the board.

[0006] The present invention has been made to solve the above problems, and one object of the present invention is to , conclusionThe present invention provides a substrate working device capable of preventing breakdowns caused by dew. [Means for solving the problem]

[0007] In order to achieve the above object, according to one aspect of the present invention, there is provided a board working device for manufacturing a production board on which components are arranged. The purpose of the project is to transport Do the work The manufacturing apparatus includes at least one of a substrate transport unit, a support unit that performs an operation of moving a head unit that mounts components on a substrate for manufacturing, and a pair of rail units that performs an operation of moving a head unit that mounts components on a substrate for manufacturing. The apparatus includes a substrate working unit, a drive unit including a control board for controlling the substrate working unit, and a dew condensation sensor for detecting dew condensation, the control board including a control unit for controlling a worker to be notified of the occurrence of dew condensation based on the detection of dew condensation by the dew condensation sensor. The drive unit further includes a motor, the control board has a motor drive board that controls the motor, and further includes a heater that increases the temperature of the air near the motor drive board and a cooling fan that cools the area near the motor drive board, and the control unit is configured to prevent the motor from being powered on based on detection of condensation by the condensation sensor, and to perform at least one of heating the air near the motor drive board with the heater and supplying air to the area near the motor drive board with the cooling fan. .

[0008] In a board working device according to one aspect of the present invention, as described above, a condensation sensor is provided to detect condensation occurring on the control board. The control board also includes a control unit that performs control to notify an operator of the occurrence of condensation based on the detection of condensation by the condensation sensor. This allows the control by the control board to be stopped based on the occurrence of condensation on the control board, thereby preventing failures caused by condensation on the control board. Furthermore, by notifying the operator of the occurrence of condensation, the operator can return the control board, whose control has been stopped, to a condensation-free state, thereby preventing prolonged stagnation of work. In addition, by preventing the motor from being powered on based on the detection of condensation by the condensation sensor, it is possible to prevent a short circuit caused by turning on the motor power, and therefore to prevent a failure of the drive unit caused by condensation. In addition, since the vicinity of the motor drive board can be dried by heating with a heater and blowing air using a cooling fan, it is possible to make it difficult for condensation to occur on the motor drive board, to prevent the occurrence of condensation on the motor drive board from being promoted, and even if condensation does occur on the motor drive board, it can be eliminated early.

[0009] In the circuit board working device according to the above aspect, as described above, the control unit is configured to control the control to notify the operator of the occurrence of condensation based on the detection value of the condensation sensor being equal to or greater than the threshold value. With this configuration, the operator can be notified only of condensation occurrence situations that are likely to cause a breakdown in the control board, and therefore the number of times the operator must perform work to return to a condensation-free state due to the condensation occurrence notification can be reduced. As a result, the burden on the operator can be reduced.

[0010] In the board working device according to the above aspect, preferably, a display unit is further provided, and the control unit is configured to control the display unit to notify the operator of the occurrence of condensation based on the detection of condensation by the condensation sensor. With this configuration, the operator can visually confirm the occurrence of condensation from the display unit, and therefore the operator can more easily grasp the occurrence of condensation.

[0011] In this case, preferably, the device further includes a storage unit that records a history of condensation information including the detection value of the condensation sensor, and the control unit is configured to acquire the history of condensation information from the storage unit and control the display unit to display the history of condensation information. With this configuration, the operator can determine the state of condensation over time on the control board from the history of condensation information displayed on the display unit, and therefore can predict the occurrence of condensation on the control board.

[0013] In the board working device according to the above aspect, the control unit preferably has a drive-side control unit that controls the drive unit and a main body-side control unit that can communicate with an external air conditioner, and the main body-side control unit is configured to control the adjustment of the external air conditioner based on condensation information including the detection value of the condensation sensor. With this configuration, the temperature and humidity in the facility can be adjusted by the external air conditioner based on the condensation information, making it possible to prevent condensation from occurring on the control board. Furthermore, since the temperature and humidity in the facility can be adjusted by the external air conditioner based on the condensation information, it is possible to prevent condensation from occurring on the control board. Furthermore, since the temperature and humidity in the facility can be adjusted by the external air conditioner based on the condensation information, it is possible to prevent condensation from occurring on the control board early.

[0014] In the circuit board working device according to the above aspect, the condensation sensor preferably includes a water droplet detection pad capable of detecting adhesion of water droplets, and a capacitance-type touch sensor that detects the presence or absence of water droplets on the water droplet detection pad. With this configuration, condensation can be directly detected by the water droplet detection pad, so that the occurrence of condensation on the control circuit board can be accurately detected.

[0015] In this case, it is preferable that both the water droplet detection pad and the touch sensor are mounted on the control board. With this configuration, condensation formed on the control board can be detected, so that failure of the control board can be more reliably prevented.

[0016] In the board working device equipped with the dew condensation sensor using the water droplet detection pad and the touch sensor, preferably, the touch sensor is attached to the control board, and the water droplet detection pad is provided on a deformable flexible board and is attached to at least one of the heat sink arranged on the control board and the housing covering the control board. With this configuration, it is considered that condensation occurs due to the heat sink not warming up and the temperature being low, since a heat sink with a relatively large thermal conductivity and heat capacity is difficult to warm up after cooling. Therefore, by attaching the water droplet detection pad to the heat sink, it is possible to detect condensation more reliably. Also, since a housing with a relatively large thermal capacity due to its size to accommodate the control board is difficult to warm up after cooling, it is considered that condensation occurs due to the housing not warming up and the temperature being low. Therefore, by attaching the water droplet detection pad to the housing, it is possible to detect condensation more reliably. Effect of the Invention

[0017] According to the present invention, as described above, it is possible to prevent failures caused by condensation on the control board. [Brief description of the drawings]

[0018] [Figure 1]FIG. 1 is a diagram showing a schematic diagram of a facility in which a component mounting apparatus according to a first embodiment is installed. [Diagram 2] FIG. 1 is a plan view showing a component mounting apparatus according to a first embodiment. [Diagram 3] 4 is a block diagram showing a configuration for driving a board transport unit of the component mounting apparatus according to the first embodiment. FIG. [Figure 4] 4 is a block diagram showing a configuration for driving a support portion of the component mounting apparatus according to the first embodiment. FIG. [Diagram 5] 4 is a block diagram showing a configuration for driving a rail portion of the component mounting apparatus according to the first embodiment. FIG. [Figure 6] 1 is a perspective view showing a motor drive board of a component mounting device according to a first embodiment. FIG. [Figure 7] 5A and 5B are diagrams showing a state in which condensation is detected in the component mounting device according to the first embodiment. [Figure 8] 5 is a diagram showing the detection amount of a dew condensation sensor and a warning message displayed on a screen of a display unit of the component mounting device according to the first embodiment. FIG. [Figure 9] FIG. 2 is a diagram showing a state in which an air conditioner is adjusted by the component mounting device according to the first embodiment. [Figure 10] 5 is a flowchart showing a dew condensation detection process in the component mounting apparatus according to the first embodiment. [Figure 11] 5 is a flowchart showing an air conditioning adjustment process in the component mounting apparatus according to the first embodiment. [Figure 12] FIG. 11 is a perspective view showing a motor drive board of a component mounting device according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0020] [First embodiment] The configuration of a component mounting apparatus 100 according to a first embodiment will be described with reference to Figures 1 to 9. Note that the component mounting apparatus 100 is an example of a "board working apparatus" in the claims.

[0021] (Facility where component mounting equipment is installed) 1, a component mounting apparatus 100 according to an embodiment of the present invention is installed in a facility 1000 such as a factory. The facility 1000 is equipped with the component mounting apparatus 100, an air conditioner 101, a sprayer 102, and the like. The air conditioner 101 is an example of an "external air conditioner" in the claims.

[0022] The component mounting apparatus 100 is an apparatus that mounts components on a manufacturing substrate Su that is manufactured by arranging electronic components E. A detailed configuration of the component mounting apparatus 100 will be described later. The air conditioner 101 is an air conditioner that can adjust the temperature and humidity in the facility 1000. The air conditioner 101 is configured so that the temperature and humidity can be manually adjusted by an operator U. The air conditioner 101 is also configured so that it can communicate with the component mounting apparatus 100. As a result, the air conditioner 101 is configured so that the temperature and humidity can be automatically adjusted by the component mounting apparatus 100. The sprayer 102 is configured so that it can adjust the humidity in the facility 1000. The sprayer 102 is configured so that it can suppress the generation of static electricity in the manufacturing substrate Su by humidifying the facility 1000 in winter or the like. The electronic components E are an example of a "component" in the claims.

[0023] (Component mounting equipment) The configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0024] As shown in FIG. 2, the component mounting apparatus 100 is configured to mount electronic components E, such as ICs, transistors, capacitors, and resistors, on a production board Su, such as a printed circuit board, arranged at a board work position.

[0025] Here, in the component mounting apparatus 100, the transport direction in which the manufacturing substrate Su is transported is the X1 direction, the opposite direction to the transport direction in which the manufacturing substrate Su is transported is the X2 direction, and the combined direction of the X1 direction and the X2 direction is the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. The up-down direction perpendicular to the X direction and the Y direction is the Z direction (up-down direction), one side of the Z direction is the Z1 direction (upward direction), and the other side of the Z direction is the Z2 direction (downward direction).

[0026] The component mounting apparatus 100 includes a base 1, a feeder arrangement unit 2, a board transport unit 3, a support unit 4, a pair of rail units 5, a head unit 6, a component recognition camera 7, a board recognition camera 8, a control device 9, a display unit 10, a cooling fan 11, and a heater 12. Each of the board transport unit 3, the support unit 4, and the pair of rail units 5 is an example of a "board working unit" in the claims.

[0027] (Base) The base 1 is a base on which each component is arranged in the component mounting apparatus 100. On the base 1, a board transport section 3, a rail section 5, and a component recognition camera 7 are provided as components. A control device 9 is also provided inside the base 1. The base 1 is also provided with feeder arrangement sections 2 on both sides in the Y direction (the Y1 direction side and the Y2 direction side) on which a plurality of tape feeders 2a can be arranged.

[0028] (Tape feeder) The tape feeder 2a is a component supplying device that supplies electronic components E to be mounted on a production board Su. The tape feeder 2a holds a reel (not shown) around which a component supply tape is wound, the component supply tape holding a plurality of electronic components E at predetermined intervals.

[0029] (Substrate transport section) 2 and 3, the substrate transport unit 3 is configured to carry in a manufacturing substrate Su from outside the component mounting apparatus 100 and transport the manufacturing substrate Su in a transport direction (X1 direction). Here, transporting the manufacturing substrate Su in the transport direction in the substrate transport unit 3 is a predetermined operation performed on the manufacturing substrate Su.

[0030] The substrate transport section 3 includes a pair of conveyors 31 and a drive section 32. Each of the pair of conveyors 31 has a pulley (not shown) and a loop-shaped transport belt looped around the pulley.

[0031] As shown in FIG. 3, the drive unit 32 is configured to drive the board transport unit 3. The drive unit 32 has a motor 32a, a motor drive board 32b, and a memory unit 32c. The motor 32a rotates and drives the pair of conveyors 31. The motor drive board 32b is configured to control the board transport unit 3. Specifically, the motor drive board 32b is a motor driver for controlling the motor 32a. The motor drive board 32b has a drive side control unit 132b. The drive side control unit 132b is a CPU (Central Processing Unit). The memory unit 32c is a storage device having memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The motor drive board 32b is an example of a "control board" in the claims. The drive side control unit 132b is an example of a "control unit" in the claims.

[0032] The substrate transport unit 3 is electrically connected to the control device 9. As a result, the motor drive substrate 32b is configured to control the motor 32a based on a control signal from the control device 9, thereby controlling the transport speed of the production substrate Su placed on the pair of conveyors 31.

[0033] (Support part) 2 and 4, the support unit 4 is configured to support the head unit 6, which moves in order to mount electronic components E on the production substrate Su, so as to be movable in the X direction. Here, moving the head unit 6 in the X direction in the support unit 4 is a predetermined operation performed on the production substrate Su.

[0034] The support portion 4 includes a ball screw shaft 41 and a drive portion 42. The ball screw shaft 41 extends in the X direction.

[0035] As shown in FIG. 4, the drive unit 42 is configured to drive the support unit 4. The drive unit 42 has a motor 42a, a motor drive board 42b, and a memory unit 42c. The motor 42a rotates the ball screw shaft 41. The motor drive board 42b is configured to control the support unit 4. Specifically, the motor drive board 42b is a motor driver for controlling the motor 42a. The motor drive board 42b has a drive side control unit 142b. The drive side control unit 142b is a CPU. The memory unit 42c is a storage device having memories such as ROM and RAM. The motor drive board 42b is an example of a "control board" in the claims. The drive side control unit 142b is an example of a "control unit" in the claims.

[0036] The support portion 4 is electrically connected to the control device 9. As a result, the motor drive board 42b is configured to control the motor 42a based on a control signal from the control device 9, thereby performing control to move the head unit 6 attached to a ball nut engaging with the ball screw shaft 41 in the X direction.

[0037] (Rail section) The pair of rail portions 5 are configured to support the support portion 4 so as to be movable in the Y direction. Here, in the support portion 4, moving the head unit 6 in the Y direction by moving the support portion 4 in the Y direction is a predetermined operation performed on the production substrate Su.

[0038] The rail portion 5 includes a ball screw shaft 51, a guide rail 52, and a drive portion 53. The ball screw shaft 51 extends in the Y direction. The guide rail 52 extends in the Y direction.

[0039] As shown in FIG. 5, the drive unit 53 is configured to drive the rail unit 5. The drive unit 53 has a motor 53a, a motor drive board 53b, and a memory unit 53c. The motor 53a rotates the ball screw shaft 51. The motor drive board 53b is configured to control the rail unit 5. Specifically, the motor drive board 53b is a motor driver for controlling the motor 53a. The motor drive board 53b has a drive side control unit 153b. The drive side control unit 153b is a CPU. The memory unit 53c is a storage device having memories such as ROM and RAM. The motor drive board 53b is an example of a "control board" in the claims. The drive side control unit 153b is an example of a "control unit" in the claims.

[0040] The rail portion 5 is electrically connected to the control device 9. As a result, the motor drive board 53b is configured to control the motor 53a based on a control signal from the control device 9, thereby performing control to move the support portion 4 attached to a ball nut engaged with the ball screw shaft 51 in the Y direction.

[0041] With this configuration, the head unit 6 is movable on the base 1 within a horizontal plane (in the X and Y directions).

[0042] (Head unit) 2, the head unit 6 is a head unit for mounting components, and is configured to move in the Z1 direction (upward) of the manufacturing substrate Su and perform a predetermined operation (mounting operation) on the manufacturing substrate Su. In other words, the head unit 6 is configured to mount an electronic component E on the manufacturing substrate Su fixed at a work position.

[0043] Specifically, the head unit 6 includes a mounting head 61, a Z-axis motor (not shown), and an R-axis motor (not shown). The mounting head 61 is configured to hold an electronic component E and to mount the electronic component E at a target mounting position (not shown) on the board B. A plurality of mounting heads 61 (five heads) are arranged in a row in the X direction.

[0044] Each of the multiple mounting heads 61 is connected to a pressure generator (not shown) and configured to be able to hold (suck) an electronic component E to a nozzle attached (mounted) at the tip by the negative pressure generated by the pressure generator. Also, each of the multiple mounting heads 61 is configured to be able to mount (mount) the electronic component E on the board B by switching the negative pressure generated by the pressure generator to positive pressure.

[0045] Each of the multiple mounting heads 61 is configured to be movable in the Z direction (up and down direction) by a Z-axis motor, and each of the multiple mounting heads 61 is configured to be rotatable about a rotation axis by an R-axis motor.

[0046] (Parts recognition camera) The component recognition camera 7 is a component imaging camera that images the electronic component E held (sucked) by the nozzle prior to mounting the electronic component E on the production board Su. The component recognition camera 7 is fixed on the base 1, and configured to image the electronic component E held (sucked) by the nozzle from below the electronic component E (Z2 direction).

[0047] (Board recognition camera) The board recognition camera 8 is attached to the head unit 6, and is a mark imaging camera that images an FI mark (Fiducial Mark: not shown) affixed to the upper surface of the production board Su prior to mounting the electronic components E on the production board Su. The FI mark is a mark for confirming the position of the production board Su.

[0048] (Control device) As shown in Figs. 2 to 5, the control device 9 is configured to perform control for sucking electronic components E from the tape feeder 2a by the nozzle and mounting them on a production board Su. Specifically, the control device 9 includes a main body side control unit 91 as a CPU, a storage unit 92, etc., and controls the operation of the component mounting apparatus 100. The control device 9 is electrically connected to the tape feeder 2a, the board transport unit 3, the support unit 4, the rail unit 5, the head unit 6, the component recognition camera 7, and the board recognition camera 8. The main body side control unit 91 is an example of the "control unit" in the claims.

[0049] The storage unit 92 is a storage device having memories such as a ROM and a RAM. A component mounting program is stored in the storage unit 92. The component mounting program is a program for performing a mounting process of an electronic component E to be mounted on a production board Su.

[0050] (Display, cooling fan and heater) As shown in FIG. 2, the display unit 10 is composed of a liquid crystal display or the like. The display unit 10 is configured to display information transmitted from the control device 9 on a screen. The cooling fan 11 is configured to cool by supplying air to the vicinity of the motor drive board 32b, the motor drive board 42b, and the motor drive board 53b. The heater 12 is configured to increase the temperature of the air near the motor drive board 32b, the motor drive board 42b, and the motor drive board 53b by heating. This dries the air near the motor drive board 32b, the motor drive board 42b, and the motor drive board 53b.

[0051] (Prevention of breakdowns using dew sensors) As shown in FIG. 6, the component mounting apparatus 100 of the first embodiment includes a dew condensation sensor 13 to prevent the motor drive board 32b, the motor drive board 42b, and the motor drive board 53b from failing due to dew condensation. That is, when the component mounting apparatus 100 is in operation, the inside of the component mounting apparatus 100 is warm and dew condensation is unlikely to occur, but when the component mounting apparatus 100 is stopped for a while and then restarted, the temperature inside the component mounting apparatus 100 has dropped to the environmental temperature in the facility 1000. As a result, dew condensation may occur due to condensation of moisture in the air near the motor drive board 32b, the motor drive board 42b, and the motor drive board 53b. The dew condensation sensor 13 is a sensor for detecting the above-mentioned dew condensation.

[0052] The dew condensation sensor 13 is provided on each of the motor drive boards 32b, 42b, and 53b. The dew condensation sensor 13 provided on the motor drive board 32b will be described below as an example. Note that the dew condensation sensor 13 provided on the motor drive boards 42b and 53b has the same configuration, so a description thereof will be omitted.

[0053] The dew condensation sensor 13 is configured to detect dew condensation that occurs on the motor drive board 32b. Here, the motor drive board 32b is disposed inside the housing 15. The dew condensation sensor 13 includes a water droplet detection pad 13a and a touch sensor 13b.

[0054] The water droplet detection pad 13a is configured to be able to detect the adhesion of water droplets. The water droplet detection pad 13a is configured such that the capacitance changes when water droplets are attached. The water droplet detection pad 13a has a resist (not shown) and an electrode (not shown). The resist is a protective film that covers the electrode. The electrode is a rectangular copper plate. A plurality of water droplet detection pads 13a (three in number) are arranged.

[0055] The touch sensor 13b is configured to detect the presence or absence of water droplets on the water droplet detection pad 13a. The touch sensor 13b is configured to detect the capacitance that changes when water droplets adhere to the water droplet detection pad 13a. The touch sensor 13b is a capacitance-type touch sensor.

[0056] Here, both the water droplet detection pad 13a and the touch sensor 13b are attached to the motor drive board 32b. In addition, the heat sink 14 is attached to the motor drive board 32b. In this manner, the dew sensor 13 is configured to detect dew on the motor drive board 32b, not on the heat sink 14 and the housing 15.

[0057] 7 and 8, the drive-side control unit 132b is configured to perform control to notify the operator U of the occurrence of condensation based on the detection of condensation by the condensation sensor 13. Specifically, the drive-side control unit 132b is configured to perform control to notify the operator U of the occurrence of condensation based on the detection value of the condensation sensor 13 being equal to or greater than the threshold value Th. In this way, condensation on the motor drive board 32b is detected using the drive-side control unit 132b that controls the driving of the motor 32a.

[0058] FIG. 7 shows, as an example, a state in which water droplets are attached to the water droplet detection pads 13a at one end of the multiple (three) water droplet detection pads 13a. The multiple (three) water droplet detection pads 13a in FIG. 7 correspond to CH1 (channel 1), CH2 (channel 2), and CH3 (channel 3) in order from one end. Also, in FIG. 8, as an example, based on the detection of condensation by the water droplet detection pads 13a at one end of the multiple (three) water droplet detection pads 13a, the fact that condensation has been detected by the condensation sensor 13 is notified via the display unit 10. Here, the worker U is not only notified via the display unit 10 that condensation has been detected by the condensation sensor 13, but also notified via the mobile terminal 103 (see FIG. 1) that condensation has been detected by the condensation sensor 13. Note that the screen displayed on the display unit 10 and the screen displayed on the mobile terminal 103 are the same.

[0059] The process from the detection of condensation in FIG. 7 to the notification by the display unit 10 in FIG. 8 will be described in detail below.

[0060] As shown in FIG. 7 and FIG. 8, the driving side control unit 132b is configured to control the recording of condensation information in the storage unit 32c at predetermined intervals. That is, the driving side control unit 132b is configured to control the recording of a history (log) of condensation information in the storage unit 32c. The driving side control unit 132b is configured to control the recording of a trigger value indicating the occurrence of condensation in the condensation information based on the detection value of the condensation sensor 13 being equal to or greater than the threshold value Th. In this way, the driving side control unit 132b is configured to control the recording of condensation information in the storage unit 32c based on the detection value of the condensation sensor 13 being equal to or greater than the threshold value Th. Here, the condensation information is information having the elapsed time when the condensation information is recorded, the temperature when the condensation information is recorded, the humidity when the condensation information is recorded, the detection value when the condensation information is recorded, and the trigger value indicating whether condensation has occurred or not.

[0061] The main body control unit 91 is configured to acquire condensation information from the storage unit 32c at predetermined intervals. The main body control unit 91 is configured to control the display unit 10 to display the condensation information from the storage unit 32c acquired at predetermined intervals, for example, as a graph. In this manner, the main body control unit 91 is configured to acquire the history of condensation information from the storage unit 32c, and to control the display unit 10 to display the history of condensation information.

[0062] The main body side control unit 91 is configured to perform control to notify the operator U of the occurrence of condensation based on the trigger value recorded in the condensation information. The main body side control unit 91 is configured to perform control to notify the operator U of the occurrence of condensation by notifying the display unit 10 of the occurrence of condensation based on the detection of condensation by the condensation sensor 13. The main body side control unit 91 is configured to perform control to notify the operator U of the occurrence of condensation by notifying the mobile terminal 103 of the occurrence of condensation based on the detection of condensation by the condensation sensor 13.

[0063] In addition, when the processes from the detection of condensation in FIG. 7 to the notification by the display unit 10 in FIG. 8 are carried out, the following process is carried out in parallel.

[0064] That is, the drive-side control unit 132b is configured to control the motor 32a not to be powered on based on the detection of condensation by the condensation sensor 13 in order to prevent the motor drive board 32b from failing due to condensation. This causes an emergency stop of the control of the motor 32a by the drive-side control unit 132b. Furthermore, the main body-side control unit 91 is configured to both heat the air near the motor drive board 32b by the heater 12 and supply air to the vicinity of the motor drive board 32b by the cooling fan 11 in order to dry the inside of the board transport unit 3.

[0065] 9, the air conditioner 101 of the facility 1000 is controlled based on the condensation information to dry the inside of the board transport section 3. That is, the main body side control section 91 is configured to control the adjustment of the air conditioner 101 based on the condensation information including the detection value of the condensation sensor 13. As a result, the air blown out from the air conditioner 101 is sent into the component mounting device 100 and into the board transport section 3, thereby further drying the inside of the board transport section 3. Also, the main body side control section 91 is configured to control the instruction to the operator U to adjust the sprayer 102 based on the condensation information including the detection value of the condensation sensor 13. As a result, the sprayer 102 is adjusted by the operator U so that condensation does not occur, which can contribute to preventing condensation from occurring in the board transport section 3.

[0066] (Condensation detection process) 10, a condensation detection process in which the main body control unit 91 detects condensation on the board transport unit 3 will be described below. Note that, as an example, the detection of condensation on the board transport unit 3 by the condensation detection process is shown, but condensation can also be detected in the same manner for the support units 4 and rail units 5 other than the board transport unit 3.

[0067] In step S1, the main body control unit 91 acquires condensation information from the memory unit 32c of the board transport unit 3 based on the fact that the power supply of the component mounting apparatus 100 is turned on. In step S2, the main body control unit 91 launches an application for operating the component mounting apparatus 100. After the launch of the application is completed in step S3, in step S4, the main body control unit 91 determines based on the condensation information whether or not a trigger signal at which condensation was detected has been recorded. If a trigger signal has been recorded, the process proceeds to step S7, where the condensation information is recorded in the memory unit 92, and the condensation detection process is terminated. If a trigger signal has not been recorded, the process proceeds to step S5.

[0068] In step S5, the main body side control unit 91 determines whether or not production of the manufacturing substrate Su has started. If production of the manufacturing substrate Su has started, the process proceeds to step S7 and then ends the condensation detection process. If production of the manufacturing substrate Su has not started, the process proceeds to step S6. In step S6, the main body side control unit 91 determines whether or not a predetermined time (e.g., about 10 minutes) has elapsed. If the predetermined time has elapsed, the process proceeds to step S7 and then ends the condensation detection process. If the predetermined time has not elapsed, the process returns to step S4.

[0069] (Air conditioning adjustment process) 11, the air conditioning adjustment process for adjusting the air conditioner 101 by the main body side control unit 91 will be described below. Note that, as an example, a case where condensation is detected in the board transport unit 3 is shown, but the same process is also performed for the support unit 4 and the rail unit 5 other than the board transport unit 3.

[0070] In step S101, the main body side control unit 91 determines whether or not a trigger signal in which condensation has been detected has been recorded based on the condensation information in the memory unit 32c of the board transport unit 3 acquired based on the power supply of the component mounting apparatus 100 being turned on. If a trigger signal has been recorded, the process proceeds to step S103, and if a trigger signal has not been recorded, the process proceeds to step S102. In step S102, the main body side control unit 91 determines whether or not a predetermined time (about 10 minutes) has elapsed. If the predetermined time has elapsed, the condensation information is stored in the memory unit 92 in step S107, and the air conditioning adjustment process is then terminated. If the predetermined time has not elapsed, the process returns to step S101.

[0071] In step S103, the main body side control unit 91 displays a warning on the display unit 10. In step S104, the main body side control unit 91 sets the control of the motor 32a in the drive side control unit 132b to be disabled. That is, the main body side control unit 91 sets the power not to be turned on so that the drive side control unit 132b does not control the motor 32a. In step S105, the main body side control unit 19 starts drying by the cooling fan 11 and the heater 12. In step S106, the main body side control unit 19 adjusts the air conditioner 101, and then ends the air conditioning adjustment process via step S107.

[0072] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0073] In the first embodiment, as described above, the component mounting apparatus 100 includes the dew condensation sensor 13 that detects dew condensation. The motor drive board 32b (42b, 53b) includes a drive-side control unit 132b (142b, 153b) that performs control to notify the operator U of the occurrence of dew condensation based on the detection of dew condensation by the dew condensation sensor 13. This allows the control by the motor drive board 32b (42b, 53b) to be stopped based on the occurrence of dew condensation on the motor drive board 32b (42b, 53b), so that a failure caused by dew condensation on the motor drive board 32b (42b, 53b) can be prevented. In addition, by notifying the operator U of the occurrence of dew condensation, the operator U can return the motor drive board 32b (42b, 53b) in a state in which control has been stopped to a state without dew condensation, so that prolonged stagnation of work can be suppressed.

[0074] Also, in the first embodiment, as described above, the drive-side control section 132b (142b, 153b) is configured to control to notify the operator U of the occurrence of condensation based on the detection value of the condensation sensor 13 being equal to or greater than the threshold value Th. This allows the operator U to be notified only of condensation occurrence situations that are likely to cause a breakdown in the motor drive board 32b (42b, 53b), thereby preventing an increase in the number of times the operator U must perform work to return to a condensation-free state due to the condensation occurrence notification. As a result, an increase in the burden on the operator U can be prevented.

[0075] Furthermore, in the first embodiment, as described above, the component mounting apparatus 100 includes the display unit 10. The drive-side control unit 132b (142b, 153b) is configured to perform control to notify the operator U of the occurrence of condensation by notifying the operator U of the occurrence of condensation on the display unit 10, based on the detection of condensation by the condensation sensor 13. This allows the operator U to visually confirm the occurrence of condensation on the display unit 10, and therefore the operator U can more easily grasp the occurrence of condensation.

[0076] In the first embodiment, as described above, the component mounting apparatus 100 includes a storage unit 32c (42c, 53c) that records the history of condensation information including the detection value of the condensation sensor 13. The main body control unit 91 is configured to acquire the history of condensation information from the storage unit 32c (42c, 53c) and control the display unit 10 to display the history of condensation information. This allows the worker U to determine the state of condensation over time on the motor drive board 32b (42b, 53b) from the history of condensation information displayed on the display unit 10, and therefore the occurrence of condensation on the motor drive board 32b (42b, 53b) can be predicted.

[0077] In the first embodiment, as described above, the drive unit 32 (42, 53) includes the motor 32a (42a, 53a). The component mounting device 100 includes a heater 12 that increases the temperature of the air near the motor drive board 32b (42b, 53b) and a cooling fan 11 that cools the area near the motor drive board 32b (42b, 53b). The drive-side control unit 132b (142b, 153b) is configured to prevent the motor 32a (42a, 53a) from being powered on based on the detection of condensation by the condensation sensor 13, and to perform at least one of heating the air near the motor drive board 32b (42b, 53b) by the heater 12 and supplying air to the area near the motor drive board 32b (42b, 53b) by the cooling fan 11. As a result, by preventing the power supply to the motor 32a (42a, 53a) from being turned on based on the detection of condensation by the condensation sensor 13, it is possible to prevent a short circuit caused by turning on the power supply to the motor 32a (42a, 53a), and therefore to prevent a failure of the drive unit 32 (42, 53) caused by condensation. In addition, since the vicinity of the motor drive board 32b (42b, 53b) can be dried by the heating of the heater 12 and the air blowing using the cooling fan 11, it is possible to make it difficult for condensation to occur on the motor drive board 32b (42b, 53b), to prevent the condensation from being promoted on the motor drive board 32b (42b, 53b), and even if condensation occurs on the motor drive board 32b (42b, 53b), it is possible to eliminate the condensation early.

[0078] In the first embodiment, as described above, the main body side control unit 91 is configured to control the adjustment of the air conditioner 101 based on the condensation information including the detection value of the condensation sensor 13. This allows the air conditioner 101 to adjust the temperature and humidity in the facility 1000 based on the condensation information, making it possible to prevent condensation from occurring on the motor drive board 32b (42b, 53b). In addition, since the air conditioner 101 can adjust the temperature and humidity in the facility 1000 based on the condensation information, it is ... eliminate condensation early even if condensation occurs on the motor drive board 32b (42b, 53b).

[0079] In the first embodiment, as described above, the dew sensor 13 includes the water drop detection pad 13a capable of detecting adhesion of water drop, and the capacitance type touch sensor 13b that detects the presence or absence of adhesion of water drop on the water drop detection pad 13a. As a result, dew can be directly detected by the water drop detection pad 13a, so that it is possible to accurately detect the occurrence of dew on the motor drive board 32b (42b, 53b). In addition, the dew sensor 13 using the water drop detection pad 13a and the touch sensor 13b is smaller than a dedicated dew detection meter, so that it is possible to prevent the motor drive board 32b (42b, 53b) from becoming larger in size, compared to the case where a dedicated dew detection meter is attached to the motor drive board 32b (42b, 53b).

[0080] In the first embodiment, as described above, both the water droplet detection pad 13a and the touch sensor 13b are attached to the motor drive board 32b (42b, 53b). This makes it possible to detect condensation on the motor drive board 32b (42b, 53b), thereby more reliably preventing failure of the motor drive board 32b (42b, 53b).

[0081] [Second embodiment] Next, a component mounting apparatus 200 of a second embodiment will be described with reference to Fig. 12. In detail, unlike the component mounting apparatus 100 of the first embodiment in which the water droplet detection pad 13a is attached on the motor drive board 32b, the component mounting apparatus 100 of the second embodiment has a water droplet detection pad 213a attached to a heat sink 14. In the second embodiment, the same components as those of the first embodiment are denoted by the same reference numerals and will not be described.

[0082] The component mounting apparatus 200 of the second embodiment includes a base 1, a feeder arrangement unit 2, a board transport unit 3, a support unit 4, a pair of rail units 5, a head unit 6, a component recognition camera 7, a board recognition camera 8, a control device 9, a display unit 10, a cooling fan 11, a heater 12, and a dew sensor 213. The board transport unit 3, the support unit 4, and the pair of rail units 5 are an example of a "board working unit" in the claims.

[0083] (Condensation sensor) The dew sensor 213 is provided on each of the motor drive boards 32b, 42b, and 53b. The dew sensor 213 provided on the motor drive board 32b will be described below as an example. Note that the dew sensor 213 provided on the motor drive board 42b and the dew sensor 13 provided on the motor drive board 53b have the same configuration, so a description thereof will be omitted.

[0084] The dew condensation sensor 213 is configured to detect dew condensation that occurs on the motor drive board 32b. Here, the motor drive board 32b is disposed inside the housing 15. The dew condensation sensor 213 includes a water droplet detection pad 213a and a touch sensor 13b.

[0085] The water droplet detection pad 213a is provided on a deformable flexible substrate. The water droplet detection pad 213a is attached to a heat sink 14 arranged on the motor drive substrate 32b. The touch sensor 13b is attached to the motor drive substrate 32b. The other configurations of the second embodiment are similar to those of the first embodiment, so the description will be omitted.

[0086] (Effects of the second embodiment) The effects of the second embodiment will be described.

[0087] In the second embodiment, as described above, the component mounting apparatus 200 includes the dew condensation sensor 213 that detects dew condensation. The motor drive board 32b (42b, 53b) includes a drive-side control unit 132b (142b, 153b) that performs control to notify the operator U of the occurrence of dew condensation based on the detection of dew condensation by the dew condensation sensor 213. This makes it possible to prevent failure of the motor drive board 32b (42b, 53b) due to dew condensation.

[0088] In the second embodiment, the touch sensor 13b is attached to the motor drive board 32b (42b, 53b) as described above. The water droplet detection pad 213a is provided on a deformable flexible board and is attached to the heat sink 14 arranged on the motor drive board 32b (42b, 53b). As a result, the heat sink 14, which has a relatively large thermal conductivity and heat capacity, is difficult to warm up after cooling, and it is considered that condensation occurs due to the heat sink 14 not warming up and having a low temperature. Therefore, by attaching the water droplet detection pad 213a to the heat sink 14, condensation can be detected more reliably. Other effects of the second embodiment are the same as those of the first embodiment.

[0089] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

[0090] For example, in the above first and second embodiments, the board working device in the claims is the component mounting device 100 (200), but the present invention is not limited to this. In the present invention, the board working device may be a loader, a printer, a print inspection machine, a dispenser device, an appearance inspection device, a reflow device, an unloader, or the like.

[0091] In the above first and second embodiments, the water droplet detection pad 13a (213a) has an electrode (not shown) which is a rectangular copper plate, but the present invention is not limited to this. In the present invention, the water droplet detection pad may have a comb-shaped electrode.

[0092] In the above first and second embodiments, the water droplet detection pad 13a (213a) has a resist (not shown), but the present invention is not limited to this. In the present invention, the water droplet detection pad does not need to have a resist.

[0093] In the above first and second embodiments, an example has been shown in which the screen displayed on the display unit 10 and the screen displayed on the mobile terminal 103 are the same, but the present invention is not limited to this. In the present invention, the screen displayed on the display unit and the screen displayed on the mobile terminal may be different.

[0094] In the above first and second embodiments, an example has been shown in which the main body control unit 91 is configured to both heat the air near the motor drive board 32b with the heater 12 and supply air to the vicinity of the motor drive board 32b with the cooling fan 11 in order to dry the inside of the board transport unit 3, but the present invention is not limited to this. In the present invention, the main body control unit 91 may be configured so that drying is performed by at least one of the heater 12 and the cooling fan 11.

[0095] In the above first and second embodiments, the water droplet detection pad 213a is attached to the heat sink 14 arranged on the motor drive board 32b, but the present invention is not limited to this. The water droplet detection pad may be attached to the ceiling of the housing. As a result, since the housing has a relatively large heat capacity due to its size to accommodate the motor drive board, it is difficult to warm up after cooling, and it is considered that condensation occurs due to the low temperature of the housing that does not warm up. Therefore, by attaching the water droplet detection pad to the housing, condensation can be detected more reliably.

[0096] In the above first and second embodiments, the driving-side control unit 132b (142b, 153b) is configured to constantly notify the operator U of the occurrence of condensation based on the detection of condensation by the condensation sensor 13, but the present invention is not limited to this. Here, an application for detecting condensation by the condensation sensor may be stored in the storage unit of the control device. That is, the main body-side control unit is configured to control the display unit to display a check box for turning on / off the condensation detection function based on the processing result of the application. The check box displayed on the display unit is configured to be able to accept an operation by the operator. In the present invention, the driving-side control unit may control the stop / start of the condensation detection function by the condensation sensor 13 based on the result of the operation of the check box by the operator.

[0097] In the above first and second embodiments, the dew sensor 13 (213) is configured to detect dew condensation on the motor drive board 32b, the motor drive board 42b, and the motor drive board 53b (control board), but the present invention is not limited to this. In the present invention, the dew sensor may be attached to the outer surface of the housing that houses the control board, the ball screw shaft, the guide rail, the shaft, etc., instead of the control board, so as to detect dew condensation on the outer surface of the housing that houses the control board, the ball screw shaft, the guide rail, the shaft, etc.

[0098] In the above first and second embodiments, for convenience of explanation, an example is shown in which the control process of the main body side control unit 91 (control unit) is explained using a flow-driven flowchart in which the process is performed in order according to the process flow, but the present invention is not limited to this. In the present invention, the control process of the control unit may be performed by an event-driven process in which the process is executed on an event-by-event basis. In this case, the control process may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven. [Explanation of symbols]

[0099] 3 Board transport section (board work section) 4 Support section (substrate work section) 5 Rail section (board working section) 10 Display 11 Cooling fan 12 Heater 13, 213 Condensation sensor 13a, 213a Water drop detection pad 13b Touch Sensor 14 Heat sink 15. Cabinet 32, 42, 53 Drive unit 32a, 42a, 53a motor 32b, 42b, 53b Motor drive board (control board) 32c, 42c, 43c storage section 91 Main unit control section (control section) 100, 200 Component mounting device (substrate work device) 101 Air conditioning equipment (external air conditioning equipment) 132b, 142b, 153b Drive side control section (control section) E Electronic parts (components) Su manufacturing substrate Th Threshold U Worker

Claims

1. a substrate working unit including at least one of a substrate transport unit that transports a substrate for manufacturing on which components are arranged, a support unit that moves a head unit that mounts the components onto the substrate for manufacturing, and a pair of rail units that move the head unit that mounts the components onto the substrate for manufacturing; A drive unit including a control board for controlling the board working unit; A dew condensation sensor for detecting dew condensation, The control board includes a control unit that performs control to notify an operator of the occurrence of condensation based on the detection of the condensation by the condensation sensor, The drive unit further includes a motor, the control board has a motor drive board that controls the motor, a heater for increasing the temperature of air in the vicinity of the motor drive board; a cooling fan for cooling the vicinity of the motor drive board, The control unit is configured to, based on the detection of condensation by the condensation sensor, prevent the motor from being powered on, and to at least one of heat the air near the motor drive board using the heater and supply air to the area near the motor drive board using the cooling fan.

2. The board working apparatus according to claim 1 , wherein the control unit is configured to perform control to notify an operator of the occurrence of condensation based on the detection value of the condensation sensor being equal to or greater than a threshold value.

3. Further comprising a display unit, 3. The board working device according to claim 1, wherein the control unit is configured to control the display unit to notify an operator of the occurrence of condensation based on the detection of the condensation by the condensation sensor.

4. A storage unit that records a history of condensation information including a detection value of the condensation sensor, The board working apparatus according to claim 3 , wherein the control unit is configured to obtain the history of the condensation information from the storage unit and to perform control to cause the display unit to display the history of the condensation information.

5. The control unit is A drive side control unit that controls the drive unit; A main body side control unit capable of communicating with an external air conditioning device, The substrate working device according to any one of claims 1 to 4, wherein the main body side control unit is configured to control adjustment of the external air conditioning device based on condensation information including a detection value of the condensation sensor.

6. The dew sensor includes: A water droplet detection pad capable of detecting adhesion of water droplets; The board working device according to any one of claims 1 to 5, further comprising a capacitive touch sensor that detects the presence or absence of water droplets on the water droplet detection pad.

7. 7. The board processing device according to claim 6, wherein both the water droplet detection pad and the touch sensor are mounted on the control board.

8. The touch sensor is mounted on the control board, 7. The board processing device according to claim 6, wherein the water droplet detection pad is provided on a deformable flexible board and attached to at least one of a heat sink arranged on the control board and a housing covering the control board.

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