Image sensor unit and image pickup device

Abstract

To provide an imaging element unit capable of dissipating drive heat of an imaging element more efficiently.SOLUTION: An imaging element unit 15 built in a housing of an imaging device comprises an imaging element 16 which has an imaging surface for imaging a subject and a rear surface opposed to the imaging surface, a vibration insulating function which moves the imaging element in a surface direction of the imaging surface, and a first heat conduction member 100 to which drive heat of the imaging element is conducted from the rear surface and which can deform to follow up the movement of the imaging element by the vibration insulating function. The first heat conduction member is a pantograph-shaped member formed by bending a sheet-like material, and a bent part which protrudes outward or a bent part which is hollow inward can deform to follow up the movement of the imaging element by the vibration insulating function.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The technology of the present disclosure relates to an imaging element unit and an imaging device. [Background technology]

[0002] Patent No. 5168047 describes a camera equipped with a heat dissipation structure for an image sensor mounted in an image stabilization unit, characterized in that a heat dissipation member is provided near the image stabilization unit and a metal member located near the image sensor in the image stabilization unit and the heat dissipation member are connected by a thermally conductive flexible member, wherein the heat dissipation member is ring-shaped surrounding the metal member and has multiple extensions formed on its outer periphery, and these multiple extensions are fixed to the camera barrel or frame.

[0003] JP 2020-067632 A describes an imaging device that includes an image sensor, a sensor board on which the image sensor is mounted, and a metal holder having an outer shape larger than the image sensor, in which the sensor board has an opening that exposes an exposed portion that is a part of the main surface of the image sensor, and the metal holder is configured to directly abut against the exposed portion through the opening. Summary of the Invention

[0004] One embodiment of the technique of the present disclosure provides an imaging element unit and an imaging device capable of more efficiently dissipating heat generated by driving an imaging element. [Means for solving the problem]

[0005] The imaging element unit of the present disclosure is an imaging element unit built into the housing of an imaging device, and includes an imaging element having an imaging surface for imaging a subject and a back surface facing the imaging surface, an anti-vibration function for moving the imaging element in the planar direction of the imaging surface, and a first thermally conductive member to which drive heat of the imaging element is conducted from the back surface, the first thermally conductive member deforming so as to be able to follow the movement of the imaging element due to the anti-vibration function, the first thermally conductive member having an outer layer and at least one inner layer connected to the outer layer and arranged in a space surrounded by the outer layer, and each of the outer layer and the inner layer has a bent portion that allows deformation.

[0006] The first thermally conductive member is preferably formed by folding a single sheet-like material.

[0007] The outer layer portion and the inner layer portion are preferably composed of a first sheet portion, a second sheet portion opposing the first sheet portion, and a connecting portion connecting the first sheet portion and the second sheet portion.

[0008] It is preferable that the bent portions of the outer layer portion and the inner layer portion protrude outward.

[0009] The first thermally conductive member preferably has a reinforcing layer in a portion other than the bent portion, and the portion having the reinforcing layer is preferably thicker than the bent portion by the amount of the reinforcing layer.

[0010] It is preferable that the first thermally conductive member is connected to the imaging element via the second thermally conductive member and is connected to the housing via the third thermally conductive member, and that the second thermally conductive member and the third thermally conductive member are sandwiched between the outer layer and the inner layer.

[0011] It is preferable that the first thermal conductive member is formed of a graphite sheet, and the second thermal conductive member and the third thermal conductive member are formed of metal.

[0012] A fourth thermally conductive member formed of a graphite sheet is connected between the third thermally conductive member and the housing, and the fourth thermally conductive member is preferably thicker than the first thermally conductive member.

[0013] It is preferable that the fifth thermal conduction member is arranged in a position facing the side of the imaging element connecting the imaging surface and the back surface, and that the driving heat is conducted from the side, and that the fifth thermal conduction member has a bent portion that deforms so as to be able to follow the movement of the imaging element due to the vibration isolation function.

[0014] The first thermal conduction member and the fifth thermal conduction member are composed of a first sheet portion, a second sheet portion opposite the first sheet portion, and a connection portion connecting the first sheet portion and the second sheet portion and having a bent portion, and it is preferable that the angle formed by the bent portion of the fifth thermal conduction member is acuter than the angle formed by the bent portion of the first thermal conduction member.

[0015] The fifth thermal conductive member is preferably formed of a graphite sheet.

[0016] The imaging device of the present disclosure includes a housing and an imaging element unit according to any one of the above, which is built into the housing. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a diagram showing a digital camera. [Diagram 2] FIG. 2 is an exploded front perspective view of the imaging element unit. [Diagram 3] FIG. 2 is an exploded rear perspective view of the imaging element unit. [Figure 4] FIG. 2 is an exploded rear perspective view of a main part of the image sensor unit. [Diagram 5] 2 is a perspective view of a first heat conducting member, a second heat conducting member, and a third heat conducting member. FIG. [Figure 6] 2 is a plan view of a first thermally conductive member, a second thermally conductive member, and a third thermally conductive member. FIG. [Figure 7] FIG. 2 is a cross-sectional view of a main part of an image sensor unit. [Figure 8] 13 is a perspective view of a third heat conducting member, a fourth heat conducting member, and a connecting member. FIG. [Figure 9] FIG. 4 is a simplified plan view of a first thermal conductive member. [Figure 10]4A and 4B are diagrams illustrating a first heat conductive member before and after being folded. [Figure 11] 6A to 6C are diagrams illustrating a state in which a first thermal conductive member is deformed. [Figure 12] 6A to 6C are diagrams illustrating a state in which a first thermal conductive member is deformed. [Figure 13] FIG. 2 is a diagram showing a conduction path of heat generated when driving an imaging element. [Figure 14] FIG. 4 is a diagram showing a first thermally conductive member having a triple structure. [Figure 15] FIG. 2 is a diagram showing an octagonal first thermal conductive member. [Figure 16] 13 is a diagram showing a first thermally conductive member in which the corners of the connection portions of the outer layer and the inner layer are recessed inward. FIG. [Figure 17] 13 is a diagram showing an imaging element unit having a fifth thermal conductive member. FIG. [Figure 18] 13 is a diagram showing an imaging element unit having a fifth thermal conductive member. FIG. [Figure 19] FIG. 13 is a simplified plan view of a fifth thermal conductive member. [Figure 20] 13 is a diagram showing an example in which a second thermal conductive member is connected to a central region of the rear surface of a circuit board that does not have an opening. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an example of an embodiment of the technology of the present disclosure will be described with reference to the drawings.

[0019] [First embodiment] As an example, as shown in Fig. 1, a digital camera 2 includes a camera body 10. A lens mount 11 is provided on the front of the camera body 10. The lens mount 11 has a circular imaging opening 12. An interchangeable imaging lens (not shown) is detachably attached to the lens mount 11. The digital camera 2 is an example of an "imaging device" according to the technology of the present disclosure. The camera body 10 is also an example of a "housing" according to the technology of the present disclosure.

[0020] The camera body 10 has an imaging element unit 15 built in. The imaging element unit 15 has an imaging element 16 in the shape of a rectangular plate mounted thereon. The imaging element 16 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The imaging element 16 has a rectangular imaging surface 17 that captures an image of a subject. The imaging surface 17 receives subject light that indicates the subject. As is well known, the imaging surface 17 has pixels arranged two-dimensionally that photoelectrically convert the received subject light and output an electrical signal. The entire imaging surface 17 is exposed to the outside through the imaging opening 12.

[0021] A CPU (Central Processing Unit) 18 is connected to the imaging element unit 15. The CPU 18 controls the operation of the imaging element unit 15. Although not shown, a memory such as a ROM (Read Only Memory) and / or a RAM (Random Access Memory) is connected to the CPU 18 via a bus line. The CPU 18, the memory, and the bus line constitute a computer.

[0022] The image sensor unit 15 has an anti-shake function. The anti-shake function is a function for suppressing positional deviation caused by vibrations applied to the camera body 10, that is, a relative positional deviation between the subject light incident on the imaging surface 17 and the digital camera 2. The vibrations applied to the camera body 10 include hand shake of a user holding the camera body 10 to photograph a subject.

[0023] Under the control of the CPU 18, the image sensor 16 is moved by the vibration-proof function in a direction that cancels the positional deviation by an amount that cancels the positional deviation. More specifically, the image sensor 16 is moved by the vibration-proof function in an X-axis direction parallel to the side 19 of the imaging surface 17 of the image sensor 16 and / or in a Y-axis direction that is perpendicular to the side 19, i.e., parallel to the side 20 that intersects with the side 19 at an angle of 90°. The X-axis direction and the Y-axis direction are examples of the "surface direction" according to the technology of the present disclosure. In this specification, the terms "orthogonal" and "90°" include the meanings of almost orthogonal and almost 90° including tolerances allowed in design and manufacturing, in addition to the meanings of completely perpendicular and 90°. In this specification, the term "parallel" includes the meanings of almost parallel including tolerances allowed in design and manufacturing, in addition to the meanings of completely parallel. Hereinafter, the side of the side 19 is referred to as "lower", and the side opposite the side 19 in the Y-axis direction is referred to as "upper". Moreover, the side of side 20 is expressed as the "left", and the side opposite side 20 in the X-axis direction is expressed as the "right".

[0024] Here, in this specification, "positional deviation" refers to a phenomenon that occurs when the optical axis OA varies with respect to the subject due to vibration. The "optical axis OA" refers to the optical axis of the subject light that is incident on the imaging surface 17 through the imaging lens. Variation of the optical axis OA means that the optical axis OA is tilted due to the positional deviation with respect to a reference axis (for example, the optical axis OA before the positional deviation occurs). In this specification, "canceling the positional deviation" includes the meaning of reducing the positional deviation in addition to eliminating the positional deviation.

[0025] 2 and 3, the imaging element unit 15 includes a fixed member 30, a movable member 31, and a yoke 32. The fixed member 30 is disposed on the rear side of the camera body 10, and the yoke 32 is disposed on the front side of the camera body 10. The fixed member 30 is fixed to the camera body 10. The fixed member 30 and the yoke 32 are fixed at an interval in the Z-axis direction perpendicular to the X-axis and the Y-axis. The movable member 31 is disposed between the fixed member 30 and the yoke 32 via three balls 35, 36, and 37 of the same size. The balls 35 to 37 enable the movable member 31 to move in the X-axis direction and the Y-axis direction (rotate around the Z-axis) relative to the fixed member 30 and the yoke 32. The Z-axis is parallel to the optical axis OA before the positional deviation occurs.

[0026] The fixed member 30 holds magnets 40, 41, and 42. The magnets 40 to 42 are attached to the front of the fixed member 30 facing the movable member 31. Each of the magnets 40 to 42 is a set of a plate-shaped magnet with its N pole facing the movable member 31 side and a plate-shaped magnet with its S pole facing the movable member 31 side. The magnet 40 is disposed in the center of the lower part of the fixed member 30 with its long side aligned along the X-axis direction. The magnets 41 and 42 are arranged along the Y-axis direction. The magnet 41 is disposed in the upper left corner of the fixed member 30 with its long side aligned along the Y-axis direction. The magnet 42 is disposed in the lower left corner of the fixed member 30 with its long side aligned along the Y-axis direction.

[0027] In addition to the magnets 40 to 42, plates 45, 46, and 47 are attached to the front surface of the fixed member 30. Plate 45 is disposed at the lower right corner of the fixed member 30, above magnet 40. Plate 46 is disposed at the left side of the fixed member 30, between magnets 41 and 42. Plate 47 is disposed at the upper right corner of the fixed member 30. Plate 45 supports ball 35 so that it can roll, plate 46 supports ball 36 so that it can roll, and plate 47 supports ball 37 so that it can roll.

[0028] The fixed member 30 is formed with square-shaped restricting openings 50 and 51 that restrict the movement range of the movable member 31 in the XY plane. The restricting openings 50 and 51 have approximately the same size when viewed in a plan view from the Z-axis direction. The restricting opening 50 is formed between the magnet 42 and the plate 45 at the lower left corner of the fixed member 30. The restricting opening 51 is formed to the left of the plate 47 at the upper right corner of the fixed member 30. In other words, the restricting openings 50 and 51 are disposed at approximately diagonal positions in the fixed member 30.

[0029] The fixing member 30 is provided with female threads 55, 56, 57, and 58 via spacers. The female thread 55 is provided in the lower right corner of the fixing member 30. The female thread 56 is provided in the upper left corner of the fixing member 30. The female thread 57 is provided in the lower left corner of the fixing member 30. The female thread 58 is provided in the upper right corner of the fixing member 30.

[0030] A relatively large rectangular access opening 59 is formed in the center of the fixed member 30. The access opening 59 is provided to allow access to the rear surface of the movable member 31 from the rear surface of the fixed member 30.

[0031] The movable member 31 holds the imaging element 16, and also holds the coil 60, the coil 61, and the coil 62. The imaging element 16 is disposed in the center of the movable member 31. The coil 60 is disposed in the center of the lower part of the movable member 31, facing the magnet 40 in the Z-axis direction. The coil 61 is disposed in the upper left corner of the movable member 31, facing the magnet 41 in the Z-axis direction. The coil 62 is disposed in the lower left corner of the movable member 31, facing the magnet 42 in the Z-axis direction. The coil 60 is disposed so that its long side is aligned along the X-axis direction. The coils 61 and 62 are arranged along the Y-axis direction. The coils 61 and 62 are disposed so that their long sides are aligned along the Y-axis direction.

[0032] A magnet 65 is held by the yoke 32. A magnetic body 66 is attached to the coil 61, and a magnetic body 67 is attached to the coil 62. The magnet 65 is, for example, a neodymium magnet. The magnetic bodies 66 and 67 are, for example, thin iron plates. The magnet 65 is disposed so as to cover the coil 60, and increases the driving force of the coil 60. The magnetic bodies 66 and 67 are aligned along the Y-axis direction. The magnetic body 66 is disposed on the upper end side of the coil 61, and the magnetic body 67 is disposed on the lower end side of the coil 62.

[0033] As described above, the coil 60 is disposed in a position facing the magnet 40 in the Z-axis direction, and therefore the magnet 65 is also disposed in a position facing the magnet 40 in the Z-axis direction. Therefore, the magnet 65 is attracted to the magnet 40 while being fixed to the yoke 32.

[0034] Similarly, since the coil 61 is disposed in a position facing the magnet 41 in the Z-axis direction as described above, the magnetic body 66 is also disposed in a position facing the magnet 41 in the Z-axis direction. Therefore, the magnetic body 66 is attracted to the magnet 41. Moreover, since the coil 62 is disposed in a position facing the magnet 42 in the Z-axis direction as described above, the magnetic body 67 is also disposed in a position facing the magnet 42 in the Z-axis direction. Therefore, the magnetic body 67 is attracted to the magnet 42.

[0035] The rear surface of the movable member 31 facing the fixed member 30 is formed with a recess 70, a recess 71, and a recess 72. The recess 70 is disposed at the lower right corner of the movable member 31, facing the plate 45 in the Z-axis direction. The recess 71 is disposed between the coils 61 and 62 on the left side of the movable member 31, facing the plate 46 in the Z-axis direction. The recess 72 is disposed at the upper right corner of the movable member 31, facing the plate 47 in the Z-axis direction. The recess 70 accommodates the ball 35 in a rollable manner, the recess 71 accommodates the ball 36 in a rollable manner, and the recess 72 accommodates the ball 37 in a rollable manner. The size of the recesses 70 to 72 when viewed from above in the Z-axis direction is slightly larger than the diameter of the balls 35 to 37. The depth of the recesses 70 to 72 in the Z-axis direction is slightly smaller than the diameter of the balls 35 to 37.

[0036] A cylindrical protrusion 80 protruding toward the fixed member 30 is provided on the rear surface of the movable member 31 at a position opposing the restricting opening 50 in the Z-axis direction. In addition, a cylindrical protrusion 81 protruding toward the fixed member 30 is provided on the rear surface of the movable member 31 at a position opposing the restricting opening 51 in the Z-axis direction. The protrusion 80 is inserted into the restricting opening 50. In addition, the protrusion 81 is inserted into the restricting opening 51. Therefore, the protrusions 80 and 81 act as restricting pins that restrict the movement of the movable member 31 in the XY plane.

[0037] The yoke 32 is made of a magnetic material such as a thin iron plate and is generally C-shaped. The yoke 32 forms a magnetic circuit between the magnets 40-42 and increases the magnetic flux received by the coils 60-62.

[0038] Male screws 85, 86, 87, and 88 are attached to yoke 32. Male screws 85-88 are fastened to female screws 55-58 of fixed member 30. In this way, fixed member 30 and yoke 32 are fixed, and movable member 31 is held between fixed member 30 and yoke 32 so as to be able to move.

[0039] The imaging element unit 15 includes a pair of voice coil motors (VCMs). The pair of VCMs is a first VCM and a second VCM. The first VCM includes a pair of a magnet 40 and a coil 60, and a yoke 32, and generates power to move the movable member 31 in the Y-axis direction. On the other hand, the second VCM includes a pair of a magnet 41 and a coil 61, a pair of a magnet 42 and a coil 62, and a yoke 32, and generates power to move the movable member 31 in the X-axis direction. More specifically, the first VCM generates power to move the movable member 31 in the Y-axis direction by the magnetic force of the magnet 40 and a current flowing through the coil 60. Also, the second VCM generates power to move the movable member 31 in the X-axis direction by the magnetic force of the magnet 41 and a current flowing through the coil 61, and the magnetic force of the magnet 42 and a current flowing through the coil 62.

[0040] Although not shown in the figure, the movable member 31 is provided with a Hall element that detects the position of the movable member 31, a temperature sensor that measures the temperature around the Hall element, and the like. The CPU 18 calculates the difference between the position of the movable member 31 detected by the Hall element and a target position of the movable member 31 for correcting positional deviation, and performs feedback control to drive the VCM so as to eliminate the difference. If the difference is large, the power generated by the VCM becomes relatively large, and conversely, if the difference is small, the power generated by the VCM becomes relatively small. The CPU 18 also corrects the temperature drift of the Hall element using the temperature measured by the temperature sensor.

[0041] As shown in FIG. 4, a rectangular circuit board 90 having approximately the same size as the imaging element 16 is attached to a back surface 89 of the imaging element 16 facing the imaging surface 17. The circuit board 90 is formed of a resin such as epoxy. A rectangular opening 91 is formed in the circuit board 90. The opening 91 is formed in the center of the circuit board 90 and exposes a central area 92 of the back surface 89 of the imaging element 16. The central area 92 is an area of ​​a preset size that is centered on a center point C of the back surface 89 of the imaging element 16 and surrounds the center point C. Identification information 98 of the imaging element 16 is written in the central area 92. The opening 91 is formed to visually recognize the identification information 98. The identification information 98 is, for example, a two-dimensional barcode for moving to an Internet page on which a management number or management information is written.

[0042] Electric circuits such as a control circuit, a drive circuit, and a power supply circuit for the image sensor 16 are mounted on the circuit board 90. Connectors 93 and 94 are provided at the lower end of the back surface of the circuit board 90. In addition, a connector 95 is provided at the left end of the back surface of the circuit board 90.

[0043] One end of a flexible substrate 96 is connected to the connector 93 and the connector 94. The other end of the flexible substrate 96 is drawn out to the rear side of the fixed member 30 through the access opening 59 (see FIG. 7). The other end of the flexible substrate 96 is connected to the CPU 18, a power supply circuit (not shown) that supplies power from a battery, and the like. Also, one end of a flexible substrate 97 (see FIG. 1) is connected to the connector 95. The other end of the flexible substrate 97 wraps around the front of the movable member 31 and is connected to the imaging element 16. In summary, the other end of the flexible substrate 97 is connected to the imaging element 16, and one end of the flexible substrate 97 is connected to the connector 95. Then, one end of the flexible substrate 96 is connected to the connector 93 and the connector 94, and the CPU 18 and the like are connected to the other end of the flexible substrate 96. Therefore, the imaging element 16, the circuit substrate 90, the CPU 18 and the like are connected via the flexible substrate 97, the connector 95, the connectors 93 and 94, and the flexible substrate 96.

[0044] The imaging element unit 15 further includes a first thermally conductive member 100, a second thermally conductive member 101, and a third thermally conductive member 102 to which the driving heat of the imaging element 16 is conducted.

[0045] A second thermally conductive member 101 and a third thermally conductive member 102 are connected to the first thermally conductive member 100. Driving heat is conducted from the second thermally conductive member 101 to the first thermally conductive member 100. The first thermally conductive member 100 also conducts the driving heat to the third thermally conductive member 102. The second thermally conductive member 101 is connected to a central region 92 of a rear surface 89 of the image sensor 16 exposed by the opening 91. Driving heat is conducted from the central region 92 to the second thermally conductive member 101.

[0046] First thermal conductive member 100 and second thermal conductive member 101 are fixed with an adhesive. A female screw 68 is formed in fixing member 30. An insertion hole 103 is formed in first thermal conductive member 100. A male screw 104 is attached to third thermal conductive member 102. Male screw 104 is passed through insertion hole 103 in first thermal conductive member 100 and fastened and fixed to female screw 68 of fixing member 30. In this way, first thermal conductive member 100 and third thermal conductive member 102 are fixed.

[0047] First thermal conductive member 100 is formed of a graphite sheet. The graphite sheet is configured by pouching a graphite sheet body with a resin film such as a PET (Polyethylene Terephthalate) film. The graphite sheet body has a thickness of, for example, 70 μm, and the resin film has a thickness of, for example, 5 μm.

[0048] Second heat conducting member 101 and third heat conducting member 102 are metal plates, for example, copper plates. Therefore, second heat conducting member 101 and third heat conducting member 102 have higher rigidity than first heat conducting member 100 formed from a graphite sheet. In other words, first heat conducting member 100 has higher elasticity than second heat conducting member 101 and third heat conducting member 102.

[0049] 5 and 6, as an example, first thermal conductive member 100 has a double structure having an outer layer portion 110 and an inner layer portion 111. Inner layer portion 111 is connected to outer layer portion 110 via connection portion 112 (see also FIG. 9, etc.) and is disposed in a space surrounded by outer layer portion 110. An attachment portion 113 having an insertion hole 103 formed therein is provided at the upper portion of outer layer portion 110.

[0050] The outer layer portion 110 and the inner layer portion 111 are both hexagonal. The outer layer portion 110 is composed of a first sheet portion 115, a second sheet portion 116 having the same length as the first sheet portion 115 and facing the first sheet portion 115, and a pair of V-shaped connecting portions 117 connecting the first sheet portion 115 and the second sheet portion 116. Similarly, the inner layer portion 111 is composed of a first sheet portion 118, a second sheet portion 119 having the same length as the first sheet portion 118 and facing the first sheet portion 118, and a pair of V-shaped connecting portions 120 connecting the first sheet portion 118 and the second sheet portion 119. The first sheet portion 115 and the second sheet portion 116, and the first sheet portion 118 and the second sheet portion 119 are planar.

[0051] The second thermally conductive member 101 has a first piece 125 and a second piece 126. The first piece 125 is parallel to the imaging surface 17 and the back surface 89 of the imaging element 16, and faces the back surface 89 of the imaging element 16. The first piece 125 is connected to a central region 92 of the back surface 89. The second piece 126 is bent 90° from the first piece 125 and extends in a normal direction to the imaging surface 17 and the back surface 89 of the imaging element 16. The normal direction to the imaging surface 17 and the back surface 89 of the imaging element 16 is, in other words, the Z-axis direction (the direction of the optical axis OA before the positional deviation occurs). The second piece 126 has approximately the same size as the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111.

[0052] The second thermally conductive member 101 is connected to the first thermally conductive member 100 through the second piece 126. More specifically, the second piece 126 is inserted into the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111, and is held in a state sandwiched between the first sheet portion 115 and the first sheet portion 118. Double-sided tape is attached to the portions of the first sheet portion 115 and the first sheet portion 118 that contact the second piece 126. The adhesive of this double-sided tape fixes the first sheet portion 115, the first sheet portion 118, and the second piece 126, and thus the first thermally conductive member 100 and the second thermally conductive member 101.

[0053] The third thermally conductive member 102 has a first piece 127 and a second piece 128. Similar to the first piece 125 of the second thermally conductive member 101, the first piece 127 is parallel to the imaging surface 17 and back surface 89 of the imaging element 16 and has a wing shape that is long in the X-axis direction. Similar to the second piece 126 of the second thermally conductive member 101, the second piece 128 is bent 90° from the first piece 127 and extends in the normal direction of the imaging surface 17 and back surface 89 of the imaging element 16.

[0054] The third thermally conductive member 102 is connected to the first thermally conductive member 100 through the second piece 128. More specifically, the second piece 128 is inserted into the space between the second sheet portion 116 of the outer layer portion 110 and the second sheet portion 119 of the inner layer portion 111, and is held in a sandwiched state between the second sheet portion 116 and the second sheet portion 119. The second piece 128 is provided with a claw 129 that is hooked onto the edge of the second sheet portion 119.

[0055] A thickness TH2 of second thermal conductive member 101 is thicker than a thickness TH1 of first thermal conductive member 100. Thickness TH1 of first thermal conductive member 100 is, for example, 80 μm, and a thickness of second thermal conductive member 101 is, for example, 1 mm. Although not shown, a thickness of third thermal conductive member 102 is also thicker than thickness TH1 of first thermal conductive member 100, and is, for example, 1 mm.

[0056] As an example, as shown in FIG. 7, flexible substrate 96 drawn out through access opening 59 is disposed on the opposite side to first thermal conductive member 100 with second piece 126 of second thermal conductive member 101 interposed therebetween.

[0057] 8, fourth thermal conductive member 135 is attached to third thermal conductive member 102 with an adhesive. Similar to first thermal conductive member 100, fourth thermal conductive member 135 is formed of a graphite sheet. A thickness TH4 of fourth thermal conductive member 135 is thicker than a thickness TH1 (see FIG. 6) of first thermal conductive member 100. Thickness TH4 of fourth thermal conductive member 135 is, for example, 500 μm.

[0058] A connecting member 136 is further attached to the fourth thermal conductive member 135 by an adhesive. The connecting member 136 is a metal plate, such as a copper plate, like the second thermal conductive member 101 and the third thermal conductive member 102. The connecting member 136 is connected to a top plate 137 of the camera body 10. The top plate 137 of the camera body 10 is, for example, a magnesium plate or an aluminum plate.

[0059] As an example, as shown in FIG. 9, the outer layer portion 110 of the first heat conducting member 100 is hexagonal as described above, and therefore has six corners 140, 141, 142, 143, 144, and 145. The inner layer portion 111 is also hexagonal, and therefore has six corners 146, 147, 148, 149, 150, and 151. The corners 140 to 145 and the corners 146 to 151 function as bending portions that enable deformation following the movement of the imaging element 16 due to the vibration isolation function. The corners 140 to 145 protrude outward. Similarly, the corners 146 to 151 also protrude outward. In other words, the first heat conducting member 100 has a shape like a pantograph. In FIG. 9, the first heat conducting member 100 is simplified by omitting the illustration of the mounting portion 113, for example. The same applies to Figures 11 and 12, etc.

[0060] 10, first thermally conductive member 100 is formed by folding the dashed line portion of one sheet-like material 160. Specifically, first, the portion of connection portion 112 is folded so that the portion that will become outer layer portion 110 faces the portion that will become inner layer portion 111. Then, corners 146-151 are folded to form inner layer portion 111, and then corners 140-145 are folded to form outer layer portion 110. Finally, the portion that will become attachment portion 113 is folded to complete first thermally conductive member 100.

[0061] The first heat conducting member 100 has a reinforcing layer 161. The reinforcing layer 161 is a resin film, for example, a PET film having a thickness of 40 μm. The reinforcing layer 161 is provided on two sides constituting the connecting portion 117 and the connecting portion 120, and is not provided on the corners 144, 145, 150, and 151 that function as bending portions. Naturally, the two sides constituting the connecting portion 117 and the connecting portion 120 are thicker than the corners 144, 145, 150, and 151 that function as bending portions by the amount of the reinforcing layer 161. The two sides constituting the connecting portion 117 and the connecting portion 120 are an example of a "portion having a reinforcing layer" according to the technology of the present disclosure.

[0062] 11 and 12, as an example, the first thermally conductive member 100 deforms to be able to follow the movement of the imaging element 16 due to the vibration isolation function. Fig. 11 shows how the first thermally conductive member 100 deforms by expanding and contracting in the up-down direction in response to the movement of the imaging element 16 along the Y-axis direction due to the vibration isolation function. Fig. 12 shows how the first thermally conductive member 100 deforms by tilting in the left-right direction in response to the movement of the imaging element 16 along the X-axis direction due to the vibration isolation function.

[0063] Next, the operation of the above configuration will be described. When the digital camera 2 is used for shooting a video at 120 frames per second (4K / 120p) with a resolution equivalent to 4K, for example, which places a relatively large load on the image sensor 16, the image sensor 16 generates non-negligible driving heat.

[0064] In the image sensor unit 15 of this example, the drive heat of the image sensor 16 follows a conduction path as shown in Fig. 13. That is, the drive heat of the image sensor 16 is first conducted from the rear surface 89 of the image sensor 16 to the second heat conductive member 101 connected to the central region 92 of the rear surface 89. Next, the drive heat is conducted from the second heat conductive member 101 to the first heat conductive member 100 connected through the second piece 126 of the second heat conductive member 101.

[0065] The drive heat conducted to the first heat conductive member 100 is conducted to the third heat conductive member 102 connected through the second piece 128. The drive heat is further conducted from the third heat conductive member 102 to the fourth heat conductive member 135, and from the fourth heat conductive member 135 to the connecting member 136. The drive heat is then conducted through the connecting member 136 to the top plate 137 of the camera body 10, and is dissipated through the top plate 137 to the outside.

[0066] In the imaging element unit 15, the movable member 31 is movable relative to the fixed member 30 and the yoke 32. The movable member 31 holds the imaging element 16. Therefore, the imaging element 16 also moves with the movement of the movable member 31. When the position of the subject light incident on the imaging surface 17 is shifted due to the user's shaking or the like, the movable member 31 and therefore the imaging element 16 are moved under the control of the CPU 18 in a direction that cancels the positional shift and by an amount that cancels the positional shift. Following the movement of the imaging element 16 due to this vibration isolation function, the first thermal conductive member 100 is deformed as shown in FIGS. 11 and 12.

[0067] As described above, the imaging element unit 15 includes the imaging element 16 having the imaging surface 17 for imaging an object and the back surface 89 facing the imaging surface 17, the circuit board 90 attached to the back surface 89, and the first heat conductive member 100 and the second heat conductive member 101 through which the driving heat of the imaging element 16 is conducted. The circuit board 90 has an opening 91 that exposes the central region 92 of the back surface 89 of the imaging element 16. The first heat conductive member 100 is connected to the second heat conductive member 101 and has higher elasticity than the second heat conductive member 101. The second heat conductive member 101 is connected to the back surface 89 through the opening 91. Since the second heat conductive member 101, which is relatively highly rigid and difficult to deform, is directly connected to the imaging element 16, the heat conductive member is less likely to peel off from the imaging element 16 than when the first heat conductive member 100, which is relatively highly elastic and easy to deform, is directly connected to the imaging element 16.

[0068] The imaging element unit 15 has an anti-vibration function that moves the imaging element 16 in the planar direction. As shown in Fig. 11 and Fig. 12, the first thermal conductive member 100 deforms to be able to follow the movement of the imaging element 16 due to the anti-vibration function. Therefore, the effect that the thermal conductive member is not easily peeled off, which is achieved by directly connecting the second thermal conductive member 101, which has a relatively high rigidity and is not easily deformed, to the imaging element 16, can be more effectively achieved.

[0069] Furthermore, when the first thermally conductive member 100 is directly connected to the imaging element 16, it is necessary to increase the thickness TH1 of the first thermally conductive member 100 in order to improve the conduction efficiency. If the thickness TH1 is large, the repulsive force of the first thermally conductive member 100 increases accordingly, and it becomes difficult for the first thermally conductive member 100 to deform in accordance with the movement of the imaging element 16 due to the vibration isolation function. However, in this example, it is not necessary to increase the thickness TH1 of the first thermally conductive member 100 so much. Therefore, the first thermally conductive member 100 can deform without much resistance in accordance with the movement of the imaging element 16 due to the vibration isolation function, compared to when the first thermally conductive member 100 is directly connected to the imaging element 16.

[0070] As shown in FIG. 5 and other drawings, second thermally conductive member 101 has a first piece 125 connected to central region 92 and facing rear surface 89, and a second piece 126 bent from first piece 125. First thermally conductive member 100 is connected to second piece 126. Therefore, first thermally conductive member 100 deforms to be able to follow the movement of second piece 126, not the movement of imaging element 16 itself. If first thermally conductive member 100 were to deform to be able to follow the movement of imaging element 16 itself, it would be necessary for first thermally conductive member 100 to have a complex configuration. However, since first thermally conductive member 100 is deformed to be able to follow the movement of second piece 126, first thermally conductive member 100 can have a simple configuration.

[0071] Moreover, second piece 126 extends in the normal direction of imaging surface 17 and back surface 89. This allows for a simpler configuration of first thermally conductive member 100. The angle at which second piece 126 is bent from first piece 125 may be less than 90° or greater than 90°.

[0072] The imaging element unit 15 includes a flexible substrate 96 attached to the circuit board 90. As shown in Fig. 7, the flexible substrate 96 is disposed on the opposite side to the first thermally conductive member 100 across the second piece 126 of the second thermally conductive member 101. Therefore, there is no risk of the flexible substrate 96 and the first thermally conductive member 100 coming into contact with each other, causing a disruption in signals to and / or from the imaging element 16.

[0073] 6, thickness TH2 of second thermal conductive member 101 is greater than thickness TH1 of first thermal conductive member 100. Therefore, the thermal conduction efficiency of second thermal conductive member 101 can be improved.

[0074] The thermal conductivity of the graphite sheet forming the first thermal conductive member 100 is 1600 W / m·K. On the other hand, the thermal conductivity of copper forming the second thermal conductive member 101 is 390 W / m·K, which is lower than that of the graphite sheet. However, as described above, if the thickness TH2 of the second thermal conductive member 101 is made thicker than the thickness TH1 of the first thermal conductive member 100, the low thermal conductivity can be compensated for. This makes it possible to make the thermal conduction efficiency of the second thermal conductive member 101 higher than that of the first thermal conductive member 100. If the thermal conductivity of the second thermal conductive member 101 is higher than that of the first thermal conductive member 100, the driving heat can be smoothly conducted from the second thermal conductive member 101 to the first thermal conductive member 100.

[0075] Note that, by increasing the thickness TH2 of second thermal conductive member 101, the thermal conductivity of second thermal conductive member 101 is made higher than that of first thermal conductive member 100, but this is not limited to the above. Instead of or in addition to increasing the thickness TH2 of second thermal conductive member 101, second thermal conductive member 101 may be made of a material having a higher thermal conductivity than first thermal conductive member 100, thereby making the thermal conductivity of second thermal conductive member 101 higher than that of first thermal conductive member 100.

[0076] 4 and other drawings, an opening 91 in a circuit board 90 exposes a central region 92 of a rear surface 89 of the imaging element 16. The central region 92 is a portion of the rear surface 89 of the imaging element 16 where the driving heat of the imaging element 16 is the highest. Therefore, the driving heat of the imaging element 16 can be dissipated more effectively.

[0077] Moreover, the central region 92 is a region in which identification information 98 of the image sensor 16 is written. Therefore, the opening 91 formed for visually recognizing the identification information 98 can be effectively used for dissipating the driving heat of the image sensor 16.

[0078] 2, first thermal conductive member 100 is made of a graphite sheet, and second thermal conductive member 101 and third thermal conductive member 102 are made of metal. Therefore, first thermal conductive member 100 can have an appropriate elasticity, and second thermal conductive member 101 and third thermal conductive member 102 can have an appropriate rigidity.

[0079] As shown in FIG. 9 and other drawings, the first thermally conductive member 100 has an outer layer 110 and an inner layer 111 connected to the outer layer 110 and disposed in a space surrounded by the outer layer 110. Each of the outer layer 110 and the inner layer 111 has bent portions (corners 140-145 and corners 146-151) that allow deformation following the movement of the imaging element 16 due to the vibration isolation function. Therefore, compared with the case where only the outer layer 110 is provided, it is possible to dissipate the driving heat of the imaging element 16 more efficiently. As a result, it is possible to perform shooting that places a relatively large load on the imaging element 16, such as shooting a 4K / 120p video, for a longer period of time than before. In addition, by making the first thermally conductive member 100 a double structure, it is possible to save the installation space of the thermally conductive member.

[0080] 10, first thermally conductive member 100 is formed by folding a single sheet-like material 160. For this reason, first thermally conductive member 100 can be formed more easily than when outer layer portion 110 and inner layer portion 111 are formed from separate materials and then joined together.

[0081] 5 etc., first thermally conductive member 100 is composed of first sheet portions 115 and 118, second sheet portions 116 and 119 opposing first sheet portions 115 and 118, connection portion 117 connecting first sheet portion 115 and second sheet portion 116, and connection portion 120 connecting first sheet portion 118 and second sheet portion 119. For this reason, first thermally conductive member 100 can naturally deform in response to movement of imaging element 16 due to the vibration isolation function.

[0082] 9 and other drawings, outer layer portion 110 and inner layer portion 111 have corners 140-145 and corners 146-151 that function as bent portions and protrude outward. This allows a large space to be surrounded by outer layer portion 110, making it easy to form inner layer portion 111.

[0083] As shown in FIG. 10, the first thermally conductive member 100 has a reinforcing layer 161 on two sides constituting the connecting portion 117 and the connecting portion 120, which are portions other than the corners 144, 145, 150, and 151 that function as bending portions. The two sides constituting the connecting portion 117 and the connecting portion 120 are thicker than the corners 140-145 and the corners 146-151 that function as bending portions by the amount of the reinforcing layer 161. This makes it possible to prevent unintended deformation of the two sides constituting the connecting portion 117 and the connecting portion 120. In addition, since the reinforcing layer 161 is not provided on the corners 140-145 and the corners 146-151 that function as bending portions, the first thermally conductive member 100 can deform without a large resistance by following the movement of the imaging element 16 due to the vibration isolation function. Note that a reinforcing layer 161 may be provided on first sheet portion 115, first sheet portion 118, and second sheet portion 116, second sheet portion 119.

[0084] The first thermally conductive member 100 is connected to the image sensor 16 via the second thermally conductive member 101, and is connected to the camera body 10 via the third thermally conductive member 102. As shown in FIG. 5 and other figures, the second thermally conductive member 101 and the third thermally conductive member 102 are sandwiched between the outer layer 110 and the inner layer 111. This improves the efficiency of the conduction of the driving heat from the second thermally conductive member 101 to the first thermally conductive member 100, and the efficiency of the conduction of the driving heat from the first thermally conductive member 100 to the third thermally conductive member 102. This also improves the holding power of the second thermally conductive member 101 and the third thermally conductive member 102 by the first thermally conductive member 100. The third thermally conductive member 102 may constitute a part of the camera body 10.

[0085] As shown in FIG. 8, a fourth thermally conductive member 135 formed of a graphite sheet is connected between the third thermally conductive member 102 and a top plate 137 of the camera body 10. A thickness TH4 of the fourth thermally conductive member 135 is thicker than a thickness TH1 of the first thermally conductive member 100. Unlike the first thermally conductive member 100, the fourth thermally conductive member 135 does not deform to follow the movement of the image sensor 16 due to the vibration isolation function. For this reason, unlike the first thermally conductive member 100, it is not necessary to make the thickness TH1 relatively thin in order to realize a smooth deformation at the expense of some degree of the conductivity efficiency of the driving heat, and it is possible to ensure sufficient conductivity efficiency by making the thickness TH4 thick.

[0086] The number of inner layer portions 111 is not limited to one. As an example, as shown in FIG. 14, a triple structure may be used, which has one outer layer portion 171 and two inner layer portions 172 and 173 arranged in a space surrounded by the outer layer portion 171. The shape of the first thermally conductive member is not limited to a hexagon. As shown in FIG. 15, an outer layer portion 181 and an inner layer portion 182 may be octagonal. As shown in FIG. 16, a first thermally conductive member 190 may have corners 195 and 196 of a connection portion 193 of an outer layer portion 191 and corners 197 and 198 of a connection portion 194 of an inner layer portion 192 recessed inward. The first thermally conductive member 190 has a shape that is, so to speak, a combination of "Σ" and its mirror image.

[0087] [Second embodiment] As an example, as shown in FIG. 17 and FIG. 18, the imaging element unit 200 of the second embodiment has a fifth heat conductive member 201. The fifth heat conductive member 201 is disposed in a space formed by a flexible substrate 97 that is connected to the imaging element 16 and wraps around the front surface of the movable member 31, at a position facing a side surface 202 of the imaging element 16 that connects the imaging surface 17 and the back surface 89. Driving heat of the imaging element 16 is conducted from the side surface 202 to the fifth heat conductive member 201. A sixth heat conductive member 203 formed of a metal plate is also connected to the fifth heat conductive member 201. The sixth heat conductive member 203 is connected to a side plate of the camera body 10 or the like. Driving heat from the fifth heat conductive member 201 is conducted to the camera body 10 through the sixth heat conductive member 203.

[0088] The fifth thermally conductive member 201 is formed of a graphite sheet, similar to the first thermally conductive member 100, etc., and has high elasticity. The fifth thermally conductive member 201, similar to the first thermally conductive member 100, etc., deforms to be able to follow the movement of the imaging element 16 due to the vibration isolation function. However, unlike the first thermally conductive member 100, etc., the fifth thermally conductive member 201 has a structure without an inner layer portion.

[0089] 19, the fifth heat conducting member 201 is a hexagon having six corners 205, 206, 207, 208, 209, and 210, similar to the first heat conducting member 100. The corners 205 to 210 function as bending parts that allow deformation following the movement of the imaging element 16 due to the vibration isolation function. Similarly to the first heat conducting member 100, the fifth heat conducting member 201 is composed of a first sheet portion 211, a second sheet portion 212 that has the same length as the first sheet portion 211 and faces the first sheet portion 211, and a pair of V-shaped connecting parts 213 that connect the first sheet portion 211 and the second sheet portion 212. Angle θ5 of corners 209 and 210, which function as bends of connection portion 213, is acuter than angle θ1 (see Figure 9) of corners 144 and 145, and corners 150 and 151, which function as bends of connection portion 117 and connection portion 120 of first thermal conduction member 100.

[0090] In this way, the imaging element unit 200 of the second embodiment includes the fifth heat conductive member 201. The fifth heat conductive member 201 is disposed at a position facing the side surface 202 of the imaging element 16 that connects the imaging surface 17 and the back surface 89. Driving heat is conducted to the fifth heat conductive member 201 from the side surface 202. The fifth heat conductive member 201 is deformed so as to follow the movement of the imaging element 16 due to the vibration isolation function. The fifth heat conductive member 201 has a bent portion that allows deformation following the movement of the imaging element 16 due to the vibration isolation function. Therefore, the driving heat can be dissipated more effectively without impeding the movement of the imaging element 16 due to the vibration isolation function.

[0091] The fifth thermally conductive member 201 is composed of a first sheet portion 211, a second sheet portion 212 opposing the first sheet portion 211, and a connection portion 213 connecting the first sheet portion 211 and the second sheet portion 212. For this reason, the fifth thermally conductive member 201 can smoothly deform in response to the movement of the imaging element 16 due to the vibration isolation function, while ensuring connection portions with the sixth thermally conductive member 203 and the like.

[0092] In addition, the angle θ5 of the bent portion of the connection portion 213 of the fifth thermal conduction member is more acute than the angle θ1 of the bent portion of the connection portion 117 and the connection portion 120 of the first thermal conduction member 100. Therefore, the repulsive force of the fifth thermal conduction member 201 can be reduced, and the fifth thermal conduction member 201 can deform without a large resistance by following the movement of the imaging element 16 due to the vibration isolation function. In addition, the distance between the first sheet portion 211 and the second sheet portion 212 is reduced, and the fifth thermal conduction member 201 becomes more compact than the first thermal conduction member 100. Therefore, the fifth thermal conduction member 201 can be disposed in a relatively narrow space, such as a space formed by the flexible substrate 97 at a position facing the side surface 202 of the imaging element 16.

[0093] Fifth heat conducting member 201 is formed of a graphite sheet, which allows fifth heat conducting member 201 to have appropriate elasticity.

[0094] Similarly to first thermal conductive member 100, fifth thermal conductive member 201 may have a multi-layer structure. Also, as in the example shown in Fig. 15, fifth thermal conductive member 201 may have an octagonal shape. Furthermore, as in the example shown in Fig. 16, fifth thermal conductive member 201 may have a structure in which corners of the connection parts are recessed inward.

[0095] In the above first embodiment, an example has been shown in which an opening 91 exposing a central region 92 of a rear surface 89 of the imaging element 16 is formed in the circuit board 90, and a first piece 125 of a second thermally conductive member 101 is connected to the central region 92 via the opening 91, but this is not limiting. As an example, as shown in Fig. 20, the second thermally conductive member 101 may be connected to a central region 222 of a rear surface 221 of a circuit board 220 that does not have an opening 91.

[0096] Although not shown, a circuit board that does not have openings 91 and second thermal conductive member 101 may be connected via a thermally conductive gel or the like.

[0097] Although the CPU 18 has been exemplified as a processor that controls the operation of the image sensor unit 15, this is not limiting. Instead of or in addition to the CPU 18, a programmable logic device (PLD) that is a processor whose circuit configuration can be changed after manufacture, such as an FPGA (Field Programmable Gate Array), and / or a dedicated electric circuit having a circuit configuration designed exclusively for executing a specific process, such as an ASIC (Application Specific Integrated Circuit), may be used.

[0098] In the first embodiment, the plates 45-47 are provided on the fixed member 30, and the recesses 70-72 are provided on the movable member 31, but this is not limited thereto. The plates 45-47 may be provided on the movable member 31, and the recesses 70-72 may be provided on the fixed member 30. Also, in the first embodiment, the magnets 40-42 are provided on the fixed member 30, and the coils 60-62 are provided on the movable member 31, but this is not limited thereto. The magnets 40-42 may be provided on the movable member 31, and the coils 60-62 may be provided on the fixed member 30.

[0099] The number of sets of the balls 35-37, the plates 45-47, and the recesses 70-72 is not limited to three, and may be four or more.

[0100] The imaging element unit of the present disclosure can be applied to imaging devices other than the exemplified digital camera 2, such as smartphones, tablet terminals, or surveillance cameras.

[0101] The technology of the present disclosure can be appropriately combined with the above-mentioned various embodiments and / or various modified examples. In addition, it is needless to say that the technology is not limited to the above-mentioned embodiments, and various configurations can be adopted without departing from the gist of the technology.

[0102] The above description and illustrations are detailed descriptions of the parts related to the technology of the present disclosure, and are merely an example of the technology of the present disclosure. For example, the above description of the configuration, function, action, and effect is an example of the configuration, function, action, and effect of the parts related to the technology of the present disclosure. Therefore, it goes without saying that unnecessary parts may be deleted, new elements may be added, or replaced with respect to the description and illustrations shown above, within the scope of the gist of the technology of the present disclosure. In addition, in order to avoid confusion and to facilitate understanding of the parts related to the technology of the present disclosure, the description and illustrations shown above omit explanations of technical common sense that do not require explanation in order to enable the implementation of the technology of the present disclosure.

[0103] In this specification, "A and / or B" is synonymous with "at least one of A and B." In other words, "A and / or B" means that it may be only A, only B, or a combination of A and B. In addition, in this specification, the same idea as "A and / or B" is also applied when three or more things are expressed by connecting them with "and / or."

[0104] All publications, patent applications, and standards mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, and standard was specifically and individually indicated to be incorporated by reference.

Claims

1. An imaging element unit that is built into a housing of an imaging device, an imaging element having an imaging surface for imaging an object and a back surface opposed to the imaging surface; an anti-shake function for moving the image sensor in a planar direction of the image pickup surface; a first heat conducting member through which heat generated by driving the image sensor is conducted from the rear surface, the first heat conducting member being deformed so as to be capable of following a movement of the image sensor due to the vibration isolation function; a fifth thermal conduction member disposed at a position facing a side surface of the imaging element connecting the imaging surface and the back surface, and through which the driving heat is conducted from the side surface; Equipped with The first thermal conductive member is A pantograph-shaped component formed by folding a sheet of material. The bent portion protruding outward or the bent portion retracting inward is deformed so as to be able to follow the movement of the image sensor due to the vibration isolation function, the fifth thermal conductive member has a bent portion that is deformed so as to follow the movement of the imaging element due to the vibration isolation function; Image sensor unit.

2. An imaging element unit that is built into a housing of an imaging device, an imaging element having an imaging surface for imaging an object and a back surface opposed to the imaging surface; an anti-shake function for moving the image sensor in a planar direction of the image pickup surface; a first heat conducting member through which heat generated by driving the image sensor is conducted from the rear surface, the first heat conducting member being deformed so as to be capable of following a movement of the image sensor due to the vibration isolation function; a fifth thermal conduction member disposed at a position facing a side surface of the imaging element connecting the imaging surface and the back surface, and through which the driving heat is conducted from the side surface; Equipped with The first thermal conductive member is It is a hexagonal-shaped component formed by folding a sheet of material. The bent portion protruding outward or the bent portion retracting inward is deformed so as to be able to follow the movement of the image sensor due to the vibration isolation function, the fifth thermal conductive member has a bent portion that is deformed so as to follow the movement of the imaging element due to the vibration isolation function; Image sensor unit.

3. 3. The image sensor unit according to claim 1, wherein the first thermal conductive member is a folded sheet-like material having both ends spaced apart from each other.

4. the first thermal conductive member has a reinforcing layer in a portion other than the bent portion, 4 . The image sensor unit according to claim 1 , wherein the portion having the reinforcing layer is thicker than the bent portion by an amount corresponding to the reinforcing layer.

5. The first thermal conductive member and the fifth thermal conductive member are A first sheet portion; a second sheet portion opposed to the first sheet portion; a connection portion that connects the first sheet portion and the second sheet portion and has a bent portion; 5 . The image sensor unit according to claim 1 , wherein an angle formed by the bent portion of the fifth thermal conductive member is more acute than an angle formed by the bent portion of the first thermal conductive member.

6. The image pickup element unit according to claim 1 , wherein the fifth heat conducting member is formed of a graphite sheet.

7. A housing and The imaging element unit according to claim 1 , which is built into the housing; An imaging device comprising:

Images