LED dedicated control board and motherboard

Abstract

To easily connect various kinds of LEDs.SOLUTION: A pair of pads DE+, DE- for power supply are aligned at edge parts along a side of a substrate body 100 to which a microcomputer 11 is mounted, and plural pads 10 functioning as an anode pad and a cathode pad for driving an LED are aligned in line along two sides not opposed to the side of the substrate body, so that the same set of pads are adjacent to each other and polarity allocated to each pad is aligned in an order according to a constant rule. The substrate body 100 is provided with a circuit for connecting the pads DE+, DE- for power supply to a power terminal of the microcomputer 11 with opposite polarity, a circuit for connecting the anode pad for driving the LED to an output terminal of the microcomputer 11, and a circuit for applying a ground voltage to the cathode pad for driving the LED. The microcomputer 11 outputs a driving pulse for lighting the LED from at least one output terminal according to a predetermined sequence.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a control board that includes electrodes (pads) for connecting LEDs and controls the LEDs connected to the pads so that they turn on and off according to a predetermined sequence. [Background technology]

[0002] As an example of the above-mentioned control board, Patent Document 1 discloses a flexible board in which a pair of legs and a pull-out part are connected to a head part on which a plurality of LED mounting patterns (electrodes) are formed, and a conductor pattern for supplying electricity to the mounting patterns is formed on the legs and pull-out parts. Patent Document 1 further describes that by connecting the above-mentioned flexible board to a control circuit equipped with a driving battery, it is possible to control the LEDs to emit light in sequence, or to light up the next LED while keeping the currently emitting LED dark.

[0003] As an example of a device with a configuration similar to a control board, Patent Document 2 discloses a device in which a pair of input terminal sections connected to an AC power source and multiple pairs of output terminal sections connected to LEDs that serve as lighting loads are arranged on the edge portions of the top surface of a housing, inside which a power supply circuit section is incorporated that converts AC power input from the input terminal sections into DC power and outputs it to the lighting loads via each output terminal section. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2008-109030 A [Patent Document 2] JP 2005-285369 A Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, as various types of LEDs have become available at reasonable prices, more and more people are trying to create their own indoor and outdoor illuminations, or to create models that include lights that emit light in a way that is close to the real thing and gorgeous electric lighting equipment. However, designing circuits to energize LEDs and programs to control them is impossible unless you have a considerable amount of knowledge about these subjects.

[0006] Furthermore, even if the type of substrate described in Patent Document 1 is designed specifically for LEDs, the types of LEDs that can be mounted are limited, and the range in which they can be introduced is also limited, making it difficult to accommodate a variety of purposes.

[0007] The present invention has been made in response to the above-mentioned problems, and has as its object to provide a control board that makes it possible to light up LEDs in a predetermined sequence simply by soldering the LEDs, and to which various types of LEDs can be easily connected.

[0008] A second object of the present invention is to provide a motherboard dedicated to LEDs that extends the functions of the control board to connect more LEDs and control their lighting operations. [Means for solving the problem]

[0009] The control board according to the present invention includes a rectangular board body on which a circuit pattern including a plurality of pads is formed, and a control microcomputer mounted on the board body with the arrangement direction of a terminal group aligned with the direction of the side of the board body. On the main surface on which the microcontroller is mounted, On the edge along one side, Only two of the pads Anode and cathode pads for power supply and are arranged side by side in the direction of the side in question. At least one of the other three sides of the board is disposed on an edge portion of the board that faces the terminal group of the microcontroller. The number of pads is equivalent to a number of pairs of anode and cathode pads for driving the LEDs. In the direction of the edge Side by side Line upThe pads are arranged in a row along that edge so that the polarities assigned to each pad follow a certain order (+--+, +-+-, etc.).

[0010] The circuit pattern includes a circuit that connects the anode pad and cathode pad for power supply to power supply terminals of corresponding polarity on the microcontroller, a circuit that connects one of the anode pads and cathode pads for driving the LEDs to an output terminal for outputting drive pulses from the microcontroller, and a circuit that applies a voltage suitable for the polarity to the pad for driving the LED of the polarity not connected to the microcontroller.

[0011] Furthermore, the microcomputer stores a program for processing to output drive pulses for lighting the LEDs in accordance with a predetermined sequence from at least one of the output terminals to which the LED drive pads are connected.

[0012] According to the above configuration, by connecting a pair of pads for power supply to a DC power source such as a battery and connecting an LED between an anode pad and a cathode pad combined for driving the LED, a microcomputer can be operated to control the lighting operation of the LED based on a program stored in the microcomputer. The pair of anode and cathode pads are arranged next to each other, and a set of pads for power supply and an array of multiple sets of pads for driving the LED are arranged at the edge portions along different sides, and the polarities assigned to the pads for driving the LED are arranged in an order according to a certain rule, so that even a user with little knowledge of electrical circuits can easily distinguish the pads corresponding to each terminal of the power supply and the LED and perform the connection work (soldering).

[0013] In addition, all the pads are lined up in a row on the edge of the board body, making soldering easier and making it easier to install LEDs with wires or large LEDs such as bullet-shaped LEDs. It also reduces the possibility of damaging other circuit patterns and components on the board.

[0014] A typical microcontroller has multiple output terminals, so multiple sets of LED driving pads can be provided within the number of these output terminals. By writing a program into this microcontroller that outputs driving pulses based on independent sequences from each output terminal connected to the LED driving pads, the LEDs connected to each set of pads can be made to light up with different lighting timing and lighting duration.

[0015] However, it is not always necessary to output drive pulses from all of the output terminals to which LED drive pads are connected. For example, when a complex sequence is written and the program size becomes large, the microcontroller stores a program that represents an algorithm for outputting drive pulses according to that sequence from only some of the output terminals.

[0016] Even if a program written to output drive pulses from multiple output terminals is stored in the microcontroller, there is no need to connect LEDs to all of the pads connected to those output terminals; the user can freely select the pads to which the LEDs are connected.

[0017] In the control board according to the first embodiment of the present invention, Within the main surface on which the microcontroller is mounted, A plurality of pairs of anode and cathode pads for driving the LEDs are provided on the edge portions along each of two sides that face the terminal group of the microcomputer but do not face the edge portions along which the anode and cathode pads for power supply are arranged, and the pads of the same pair are arranged. In the direction of the edge Side by side Line up , and are aligned along that edge such that the polarities assigned to each pad are in a common order between each edge.

[0018] In the control board according to the second embodiment of the present invention, a microcomputer is mounted on the board body, and a plurality of terminals are protruding from two opposing sides of the component body, and no terminals are provided on the other two sides. Within the main surface on which the microcomputer is mounted,A pair of power supply pads are provided on the edge of one of the two sides of the board that does not face the terminal group of the microcomputer. Within the main surface on which the microcomputer is mounted, On each of the two edge portions along the two sides facing the terminal group of the microcontroller, there are provided pads in a number equivalent to twice the number of output terminals for driving LEDs in the terminal group facing the edge portion of the microcontroller, In the direction of the edge Adjacent two pads are paired as anode and cathode pads for driving LEDs, and the polarity assigned to each pad is arranged in a common order between each edge. Along the edge The LEDs are arranged in a row. In each set of LED driving pads, each pad of one polarity is connected to an output terminal of the microcomputer that faces the corresponding pad in the terminal group.

[0019] According to the first and second embodiments described above, a user can easily distinguish between the two types of pads; for example, the pads arranged in a row along two opposing sides are for driving LEDs, and a pair of pads arranged next to each other along one of the remaining two sides are for supplying power. This prevents the user from proceeding with soldering to the wrong location.

[0020] The microcomputer of the control board of the present invention including the above two embodiments can store any one of a plurality of pre-developed programs as a program for outputting control signals based on independent sequences from one or more output terminals connected to the LED driving pads. In other words, by changing the microcomputer program with the same hardware configuration, a plurality of control boards with different lighting control modes can be produced.

[0021] Furthermore, the present invention provides a motherboard mainly made of a printed circuit board on which one or more of the above-mentioned control boards can be mounted and electrically connected as daughter boards. The printed circuit board of this motherboard has a plurality of contact pads provided at locations corresponding to the pads of the daughter board, a circuit for applying a voltage suitable for the polarity to each of the contact pads corresponding to a pair of power supply pads of the daughter board, and a circuit for applying a voltage suitable for the polarity to each of the contact pads of the daughter board. Each Alternatively, a plurality of extension pads are provided, and a current amplifier circuit is provided between the extension pad corresponding to the anode pad for driving the LED on the child board and the extension pad corresponding to the cathode pad for driving the LED that is paired with the anode pad, for passing a current larger than that which flows between the pair of pads for driving the LED.

[0022] The current amplifier circuit receives a drive pulse from a microcomputer to an LED drive pad corresponding to the expansion pad targeted by the circuit, and the drive pulse is transmitted to the LED drive pad via a connection pad to the LED drive pad. The current amplifier circuit is turned on by the drive pulse.

[0023] According to the above configuration, the expansion pads of the motherboard also become LED driving pads having the same polarity as the corresponding pads of the daughter board, and can be grouped based on the corresponding relationship with the pads of the daughter board. Therefore, when an LED is connected between an LED driving pad capable of receiving a driving pulse from a microcomputer on the daughter board and two expansion pads corresponding to the LED driving pad that is paired with the LED driving pad, a current from a current amplifier circuit that is turned on by the driving pulse flows through the LED, and the LED can be turned on.

[0024] Therefore, the LEDs connected to the expansion pads can be lit according to a sequence based on the microcontroller's program. Also, because the current amplifier circuit functions to allow a larger current to flow between a pair of expansion pads than between the corresponding pads on the daughter board, it is possible to connect multiple LEDs to the expansion pads and control their lighting operations collectively using drive pulses from the microcontroller.

[0025] Furthermore, if the above-mentioned expansion pads are arranged along the edge of one or more sides of the printed circuit board in a state where the expansion pads corresponding to the LED driving pads of the same group are lined up in a row based on the grouping of the pads on the daughter board and the polarities of the expansion pads are arranged in the same order as the daughter board, the correspondence between each expansion pad and each LED connecting pad on the daughter board becomes clear. Therefore, even if the number of pads increases, the user can easily distinguish which pad is the target of soldering.

[0026] Furthermore, by forming each pad on the daughter board in a range extending from the top surface of the board body through the end face forming the thick portion to the edge on the bottom surface side, the edge of each pad on the daughter board can be placed on the corresponding contact pad on the mother board and the end face and the contact pad can be soldered, making the soldering work easier. Effect of the Invention

[0027] According to the control board of the present invention, even a person without knowledge of electrical circuits or programming can easily manufacture a desired lighting device by simply soldering the LEDs to the LED drive pads, and the LEDs can be turned on in a predetermined sequence. Also, by providing the LED drive pads on the edge of the board body, various types of LEDs can be easily connected, making it possible to accommodate a wide range of applications.

[0028] In addition, by simply changing the program built into the microcomputer, it is possible to produce multiple types of control boards with different LED lighting sequences, making it easy to increase the variety of products available to general users.

[0029] Furthermore, the motherboard of the present invention can connect a number of LEDs that cannot be connected to a single control board, and control the lighting of these LEDs using the microcomputer of the control board. This makes it easy to create decorative lighting devices that use a large number of LEDs. [Brief description of the drawings]

[0030] [Figure 1] 1 is a plan view illustrating an example of a configuration of an LED control board to which the present invention is applied. [Diagram 2] FIG. 4 is a circuit diagram of the LED control board. [Diagram 3] 4A to 4C are diagrams illustrating an example of mounting LEDs on the LED control board. [Figure 4] FIG. 11 is a perspective view illustrating a modified example of the LED control board. [Diagram 5] 13 is a plan view illustrating another example of the configuration of the LED control board. FIG. [Figure 6] 1 is a plan view illustrating an example of a configuration of a motherboard to which the present invention is applied; [Figure 7] 2 is a plan view showing a state in which a daughter board is mounted on the motherboard. FIG. [Figure 8] FIG. 2 is a circuit diagram for one of the daughter boards on the motherboard. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Fig. 1 is a plan view showing the appearance of one embodiment of a control board 1 dedicated to LEDs to which the present invention is applied, and Fig. 2 is a circuit diagram showing the electrical configuration of the control board. The configuration of the control board 1 of this embodiment will be described below with reference to these figures.

[0032] The control board 1 of this embodiment is configured by mounting a control microcomputer 11, resistors R1 to R5, and a capacitor C0 on a board body 100 made of a rectangular printed wiring board on which a circuit pattern including ten pads 10 is formed. Each of the pads 10 is arranged on an edge portion of the board body 100, with adjacent two pads 10 paired together. One of each pair of pads 10, 10 is an anode pad, and the other is a cathode pad.

[0033] Microcomputer 11 is an IC chip with three terminals protruding in each of two directions. Specifically, as shown in Fig. 2, two output terminals T1 and T2 are provided on one edge of the main body of microcomputer 11, sandwiching a cathode (ground potential) terminal GND therebetween, and an output terminal T3 and a reset terminal RES are provided on the opposite edge, sandwiching an anode terminal VCC therebetween. In this embodiment, the reset terminal RES can be caused to function as an output terminal by the program settings of the microcomputer 11, and therefore will be described below as an output terminal.

[0034] One set of the five combinations of pads 10 is provided on the edge portion of the substrate body 100 on the side not facing the terminal group of the microcomputer 11. One of the pads 10, 10 in this set is an anode pad D for power supply. E + is connected to the power supply terminal VCC of the microcontroller 11, and the other is the cathode pad D for power supply E - is connected to the power supply terminal GND of the microcomputer 11.

[0035] The other four sets of pads 10, 10 function as anode pads and cathode pads for driving LEDs, and are arranged in two sets along the edge portions along the two sides of the board body 100 that face the terminal group of the microcomputer 11. Hereinafter, when referring to these pads 10 individually, the anode pads will be referred to as D1+, D2+, D3+, D4+, and the cathode pads 10 will be referred to as D1-, D2-, D3-, D4-.

[0036] The set of pads D1+, D1- and the set of pads D2+, D2- are arranged so that the cathode pads D1-, D2- are adjacent to each other and are arranged in the order of D1+, D1-, D2-, D2+. The set of pads D3+, D3- and the set of pads D4+, D4- are also arranged so that the cathode pads D3-, D4- are adjacent to each other and are arranged in the order of D4+, D4-, D3-, D3+.

[0037] In terms of electrical connection, the anode pads D1+, D2+, D3+, and D4+ are connected to the output terminals T1, T2, T3, and RES of the microcomputer 11 via the resistors R1, R2, R3, and R4 for current limiting, respectively. The cathode pads D1-, D2-, D3-, and D4- are connected to the cathode pads D E - is connected to.

[0038] In this embodiment, between the adjacent cathode pads D1- and D2-, and between the cathode pads D3- and D4-, conductive patterns 12 and 13 are formed to connect the two cathode pads, respectively, and through holes h1 and h2 are formed at one end of the conductive patterns 12 and 13, respectively. E A through hole h3 is also formed at one end of the conductive pattern 14 connected to -.

[0039] Although not shown in the drawings, a conductive pattern is also formed on the back surface of the substrate body 100 in an area including the through holes h1, h2, and h3 and the area corresponding to the microcomputer 11. The cathode pads D1-, D2-, D3-, and D4- for driving the LEDs and the cathode pad D for power supply are E The electrical connection between the microcomputer 11 and the cathode terminal GND is made via the conductive patterns 12 to 14 on the back side and the conductive patterns 12 to 14 on the front side, and the through holes h1, h2, and h3 that connect them. The cathode terminal GND of the microcomputer 11 also penetrates to the back side, and is connected to the cathode terminal D for power supply via the conductive patterns on the back side, the through hole h3, the conductive pattern 14, etc. E - is electrically connected to

[0040] The capacitor C0 is connected to the anode pad D E + and the connection line between the anode terminal VCC and the cathode pad D E - and the cathode terminal GND as a bypass capacitor. Also, as shown in Figure 2, the connection line between the terminal RES and the LED driving pad D4+ and the anode pad D E + is connected, and resistor R5 is inserted in that wiring.

[0041] One of a number of predesigned programs is stored in the microcomputer 11. These programs are designed to output a pulse signal for driving the LEDs (hereinafter referred to as a "driving pulse") according to a predetermined sequence from at least one of the output terminals T1, T2, T3, and RES connected to the anode pads D1+, D2+, D3+, and D4+ for driving the four LEDs.

[0042] All of these programs are designed to light up the LEDs that receive the drive pulses in interesting ways by varying the pulse width and interval of the drive pulses. Also, there are many different programs: some are designed to output perfectly synchronized drive pulses from two or more output terminals, some are designed to output the same drive pulse sequence but with different output timing from each output terminal, and some are designed to output drive pulses according to different sequences for each output terminal. Therefore, even if the hardware configuration of the control board 1 is the same, the manner in which the drive pulses are output from each output terminal can be changed in various ways depending on the program installed in the microcomputer 11.

[0043] The program can be designed so that drive pulses are output from all four output terminals T1, T2, T3, and RES, so long as the sequence does not become so complicated that the amount of data exceeds the memory capacity of the microcomputer 11. When drive pulses are to be output from only some of the output terminals, the terminals to which the pulses are to be output are defined in the program.

[0044] When it is desired to enable the reset function of the terminal RES, a program that does not include an algorithm for outputting a drive pulse from this terminal RES is written into the microcomputer 11. Note that a signal for resetting the microcomputer 11 is generated by applying a ground voltage to the pad D4+ and outputting a drive pulse from the power supply pad D E + to terminal RES.

[0045] In the above configuration, the anode pad D for power supply E A cable 6a is soldered to + for connecting to the anode of a lithium battery (not shown) supported in an external battery holder, and a cathode pad D for power supply is soldered to +. E A cable 6c for connecting to the cathode of the lithium battery is soldered to the cathode pads D1-, D2-, D3-, and D4 (see FIG. 3 described later). This soldering provides a DC power source for driving the microcomputer 11, and also applies a ground voltage to the cathode pads D1-, D2-, D3-, and D4.

[0046] After the above connections are completed, the anode electrode terminal of the LED is connected to the anode pad (one or more of D1+, D2+, D3+, D4+) which is connected to the terminal to which the drive pulse is output from the microcomputer 11 of the control board 1, and the cathode electrode terminal of the LED is connected to the cathode pad (one or more of D1-, D2-, D3-, D4-) which pairs with this anode pad, thereby making the LED conductive with the drive pulse and lighting it up.

[0047] Although not shown in Fig. 1, the top surface of the board body 100 is provided with markings (letters such as D1+, D2+, etc.) for distinguishing between the pads 10. In addition, the user is provided with separate paper or electronic instructions instructing them on the positions of pads to which LEDs can be connected (anode pads to which drive pulses are supplied from the microcomputer 11 and their corresponding cathode pads) and the patterns in which the LEDs will light up. By referring to these markings and instructions, the user can solder the LEDs in the appropriate positions.

[0048] 3 shows three parallel examples of LEDs connected to and lit up on the control board 100 configured as above. In each example, a program designed to output drive pulses from terminals T1, T2, and T3 is stored in the microcomputer 11, and LEDs are connected between the three corresponding pairs of anode and cathode pads (between D1+ and D1-, between D2+ and D2-, and between D3+ and D3-). Each example in FIG. 3 shows a state in which driving pulses are output simultaneously from terminals T1 and T3.

[0049] In the example of FIG. 3(A), the anode and cathode electrode terminals of a surface-mount type chip LED 3A are soldered to pads 10 of the corresponding polarities. The LED 3B in the example of FIG. 3B is also a chip type, but flexible wires 4a, 4c are integrally provided with the anode and cathode electrode terminals, and the wires 4a, 4c are soldered to pads 10 of the corresponding polarities. In the example of FIG. 3(C), the anode and cathode electrode pins 5a, 5c of a bullet-shaped LED 3C are soldered to pads 10 of the corresponding polarities.

[0050] The LEDs 3A, 3B, and 3C can be selected to emit a color of their choice, regardless of the color of the light emitted. The LEDs can also be changed for each pair of pads 10. It is also possible to connect multiple types of LEDs to the same control board 1. For example, it is possible to connect LED3A between pads D1+ and D1-, LED3B between pads D2+ and D2-, and LED3C between pads D3+ and D3-.

[0051] In the control board 1 of this embodiment, a power supply pad D E +,D E Since all pads 10 including the pads 11 are arranged on the edge of the board body 100, even when soldering long wires 4a and 4c as shown in FIG. 3(B) or a large LED 3C as shown in the example of FIG. 3(C), the soldering work can be easily performed. Furthermore, by arranging each pad 10 on the edge of the board body 100, the possibility of solder falling onto places other than the pads during the soldering work is reduced, so damage such as short circuits and breakage of components is less likely to occur. Therefore, even beginners can easily perform the soldering work.

[0052] Therefore, if a system were established in which multiple types of control boards 1 with different program contents written into the microcontroller 11 could be manufactured and provided to users, the user could select a control board 1 that can realize a lighting pattern suited to their purpose, and then connect an LED suited to their purpose to that control board 1 to achieve that purpose.

[0053] Figures 4 and 5 show modified examples of the above-mentioned control board 1. Below, these modified examples will be explained in order, but in each example, the components corresponding to those in Figures 1 and 2 are denoted by the same reference numerals, and detailed explanations of the components will be omitted.

[0054] 4 has the same number of components and circuit configuration as the previous control board 1, but is characterized in that the pads 10 are formed in a range extending from the area where the LEDs are mounted on the top surface of the board body 100, through the top edge and end surface, to the bottom edge. This configuration makes it easy to connect the control board 1 to the motherboard 2, which will be described later, as a daughter board.

[0055] In the above-mentioned control board 1A, the inner cathode pads (D1- and D2-, and D3- and D4-) of the four LED driving pads 10 arranged on the same edge of the board body 100 are connected via conductor patterns 12 and 13, and through holes h1 and h2 are formed at one end of the conductor patterns 12 and 13. E A conductive pattern 14 including a through hole h3 is also connected to the back side of the substrate body 100, and a conductive pattern is also formed on the back side of the substrate body 100. The cathode pads D1-, D2-, D3-, and D4- are connected to the cathode terminals D1-, D2-, D3-, and D4- for power supply via these conductive patterns and through holes h1, h2, and h3. E The cathode terminal GND of the microcomputer 11 is also electrically connected to the cathode terminal D for power supply via the conductive pattern on the back surface of the board, the through hole h3, the conductive pattern 14, etc. E - is electrically connected to

[0056] In the control board 1B of the example shown in FIG. 5, the power supply pad D E +,DE The shapes and positions of the anode pads D1+, D2+, D3+, and D4+ for driving the LEDs are the same as those in the example of FIG. 1, but the cathode pads D1-, D2-, D3-, and D4- for driving the LEDs are integrated with each other in a neighboring relationship, and the two cathode pads D COM 1-,D COM Specifically, between the anode pads D1+ and D2+, there is a cathode pad D COM Between the anode pads D3+ and D4+, a cathode pad D COM 2- is provided.

[0057] According to the configuration of FIG. 5, the cathode pad D COM The cathodes of the LEDs whose anodes are connected to the anode pads D1+ and D2+, which are arranged on either side of the cathode pad D1-, are connected to the cathode pad D COM Connected to 1-. Cathode pad D COM The cathodes of the LEDs whose anodes are connected to the two anode pads D3+ and D4+ arranged on either side of 2- are both connected to the cathode pad D COM 2-. Therefore, the circuit configuration is almost the same as in Figure 2.

[0058] In the control board 1B of the example of FIG. 5, each cathode pad D COM 1-,D COM 2- are the conductive patterns 12, 13 extending from each of them, and the cathode pad D for power supply E -, the conductive pattern 14 extending from the through holes h1, h2, h3, the conductive pattern on the back surface of the substrate body 100, etc., are connected to the cathode pad D E The cathode terminal GND of the microcomputer 11 is also electrically connected to the cathode pad D for power supply via the conductive pattern on the back surface, the through hole h3, the conductive pattern 14, etc. E - is electrically connected to

[0059] Below, modifications other than those described above will be briefly described. In the control boards 1 and 1A shown in Fig. 1 and Fig. 4, in order to simplify the wiring on the cathode side, the cathode pads (D1- and D2-, or D3- and D4-) connected to the ground voltage among the four LED driving pads 10 arranged on the edge part on the same side of the board body 100 are arranged next to each other in the order of +, -, -, +. However, for each of the cathode pads D1-, D2-, D3-, D4-, a connection path such as a through hole is individually secured to the cathode pad D for power supply. E If connecting to -, the order of arrangement of the pads 10 is not limited to the above, and may be -, +, +, -. Or, to reduce the possibility that a beginner user will mistake the polarity of the pads 10, they may be arranged in a regular order such as +, -, +, -.

[0060] The number and arrangement of the pads 10 are not limited to the above example. For example, when the microcomputer 11 has five or more output terminals, the number of LED driving pads can be arranged in a row, which is twice the number of output terminals arranged on one side of the microcomputer 11. When the microcomputer 11 has many output terminals, or when a microcomputer with terminals protruding from all four sides of the component body is used, the power supply terminal D of the board body 100 can be arranged in a row. E +,D E Pads for driving LEDs may be arranged along the three sides excluding the areas where - is arranged.

[0061] 1, etc., when the terminal RES is not used as an output terminal, one side of the board body 100 may be made slightly longer, and three pairs of LED drive pads (D1+ and D1-, D2+ and D2-, D3+ and D3-) may be arranged in a row on one edge of the longer side. Similar arrangements are possible in the configuration examples of FIGS. 4 and 5.

[0062] In either case, the size and shape of the substrate body 100 are changed according to the number of LED driving pads 10 arranged in a row. E +,D EBy arranging the pads D- for power supply on a different edge from the arrangement of the pads for driving LEDs, the user can easily distinguish the type of each pad 10 by the number of pads lined up in a row. However, if the shape and size of the pads 10 are changed according to the type, the pads D- for power supply can be easily distinguished from the pads D- for driving LEDs. E +,D E - can also be placed in the same row as the pads for driving LEDs.

[0063] Up to this point, the explanation has been given on the assumption that multiple LEDs are connected in a common cathode relationship. However, when each LED is connected in a common anode relationship, the arrangement of the anode pads and cathode pads for driving the LEDs is reversed, and the cathode pads D1-, D2-, D3-, and D4- are connected to the output terminals T1, T2, T3, and RES of the microcontroller 11, and the anode pads D1+, D2+, D3+, and D4+ are connected to the anode pads D E +. The LEDs connected to these pads are turned on by negative drive pulses from the microcomputer 11 to the output terminals T1, T2, T3, and RES.

[0064] In the control board of the present invention including various modifications, the number of LEDs that can be connected between a pair of anode and cathode pads for driving the LEDs is not limited to one, and several LEDs can be connected in parallel. However, with only the current capacity that the microcomputer 11 can output, it is not possible to connect many LEDs and pass the current required to light them. However, this problem can be solved by the motherboard described below.

[0065] Fig. 6 shows an example of the configuration of a motherboard 2 on which the control board 1A shown in Fig. 4 can be mounted as a sub-board. Fig. 7 shows an example in which the control board 1A is mounted on the motherboard 2. Note that the control board that can be mounted on this motherboard 2 is not limited to 1A, and the control board 1 shown in Fig. 1 can also be mounted.

[0066] The motherboard 2 of this embodiment is configured such that a conductive pattern including a plurality of pads is formed on a rectangular board body 200 large enough to mount two control boards 1A (hereinafter referred to as "child boards 1A"), and a plurality of resistors, capacitors, and transistors are mounted on the board body 200. Although not shown, the motherboard 2 may include accessories such as legs for supporting the board body 200.

[0067] At one end of the board body 200, a power supply box 21 including a USB-standard power connector and an operation box 22 including a switch circuit are provided. Near these boxes 21, 22 (the range indicated by the dashed line frame in FIG. 6), there are disposed conductive patterns and components (resistors and capacitors) that constitute a protection circuit for protecting the power supply circuit connected to the power connector and external devices. The remaining configuration relates to the mounting of the daughter board 1A, and includes a board mounting pad P0 having a large area on which the part of the board body 100 of the daughter board 1A excluding the edge portion can be placed, and an anode pad P1 disposed near the board mounting pad P0. A A circuit including a total of eight connection pads, four on each side of the board mounting pad P0, and 16 extension pads is provided on each daughter board 1A. In addition, the anode pad P A The board mounting pad P0 is also connected to the power supply pad D on the daughter board 1A. E +,D E - Serves as a communication pad.

[0068] The eight contact pads are intended to connect the LED driving pads of the daughter board 1A, and are arranged in the same positional relationship as the LED driving pads. In Fig. 6, the contact pads to which the anode pads D1+, D2+, D3+, and D4+ of the daughter board 1A are connected are indicated by the symbols P1+, P2+, P3+, and P4+, respectively, and the contact pads to which the cathode pads D1-, D2-, D3-, and D4- of the daughter board 1A are connected are indicated by the symbols P1-, P2-, P3-, and P4-, respectively. The cathode side contact pads P1-, P2-, P3-, and P4- are connected to the board mounting pad P0.

[0069] Two sets of extension pads are provided for each pair of anode and cathode pads for driving the LEDs on daughter board 1A. If the pairs of LED driving pads on daughter board 1A are designated Dn+ and Dn- (same for n=1 to 4 below), the corresponding relationships between the pads will be described in detail below. The combination of the anode pad Dn+ and cathode pad Dn- on daughter board 1A corresponds to the combination of extension pads Ln1+ and Ln1-, and the combination of extension pads Ln2+ and Ln2-.

[0070] The extension pads Ln1+ and Ln2+ are set as anode pads, and the extension pads Ln1- and Ln2- are set as cathode pads. These four pads are arranged in the order of Ln1+, Ln1-, Ln2-, and Ln2+ in accordance with the arrangement of the LED driving pads on the daughter board 1A, and are disposed on the edge portion of the board body 200.

[0071] Furthermore, a circuit (see FIG. 8) including a current amplifying transistor TRn and a current limiting resistor (reference numerals omitted) is provided between the connection pad Pn+ and the corresponding extension pads Ln1+, Ln1-, Ln2-, Ln2+.

[0072] In the motherboard 2 of the example of Fig. 6, due to the size of the board body 200, the shape of the board mounting pad P0 and the arrangement of each expansion pad between the areas corresponding to the two daughter boards 1A, 1A to be mounted are different, but the circuit configuration is the same. E +,D E By placing the daughter board 1A on the board mounting pad P0 with the LED driving pads Dn+, Dn- facing the power supply circuit, the edge portions of the LED driving pads Dn+, Dn- of the daughter board 1A are placed on the corresponding connection pads Pn+, Pn-, and the cathode power supply pads D E The edge of the positive electrode is placed on one end of the board mounting pad P0, and the positive electrode power supply pad D E + is the anode pad P AIn this state, daughter board 1A can be electrically connected to motherboard 2 by soldering the exposed portion of each pad 10 on the edge side of board body 100 to the pad on motherboard 2 on which that pad 10 is placed.

[0073] FIG. 8 is a circuit diagram showing the electrical configuration within an area of ​​the motherboard 2 corresponding to one daughter board 1A. The board mounting pad P0 and the cathode side connection pad Pn- are connected to the cathode (ground voltage) of the power supply circuit, and the anode pad P A is connected to the anode of the power supply circuit (voltage +V). The anode side connection pad Pn+ is connected to the base of the current amplifying transistor TRn.

[0074] Of the four extension pads Ln1+, Ln1-, Ln2+, Ln2- corresponding to the LED driving pads Dn+, Dn- like the connection pads Pn+, Pn-, the anode extension pads Ln1+, Ln2+ are connected to the anode of the power supply circuit via current limiting resistors (symbols omitted), while the cathode pads Ln1-, Ln2- are connected to the collector of the transistor TRn.

[0075] According to the above circuit configuration and the above-mentioned pad correspondence, the conductive pattern on the back surface of the board body 100 of the daughter board 1A in the position shown in FIG. 7 and the cathode pad D E - is soldered to the board mounting pad P0, and the anode pad D for power supply E + anode pad P A By soldering the LED drive pads Dn+, Dn- to the corresponding connection pads Pn+, Pn-, the microcomputer 11 on the daughter board 1A can be made conductive and drive pulses can be output according to the sequence indicated by the program.

[0076] Therefore, when an LED is connected between the extension pads Ln1+, Ln2+ corresponding to the LED driving pad Dn+ that can receive a driving pulse from the microcontroller 11 and the corresponding extension pads Ln1-, Ln2-, a driving pulse that arrives at the base of the transistor TRn from the microcontroller 11 via the LED driving pad Dn+ and the connection pad Pn+ causes a base current to flow in the transistor TRn, and a collector current amplified from this current flows in the LED, turning on the LED.

[0077] According to the above configuration, a drive pulse from one output terminal of microcomputer 11 can cause a current much larger than that flowing between two pairs of expansion pads (Ln1+ and Ln1-, and Ln2+ and Ln2-) than between the corresponding pads Dn+ and Dn- on daughter board 1A. Therefore, a large number of LEDs can be connected in parallel to these expansion pads and turned on simultaneously by the same drive pulse.

[0078] Therefore, for example, multiple LEDs can be connected with a cable or flexible wire, and the cable or wire can be curved or bent to form a desired shape, and a lighting pattern that reflects the shape can be created by lighting up each LED. It is also possible to connect multiple LEDs that emit different colors, and create a lighting pattern based on a combination of those colors. Therefore, lighting devices of various shapes can be created based on the user's ingenuity.

[0079] In the above embodiment, a current amplifier circuit is formed using transistor TRn and multiple resistors, which is turned on by a drive pulse from microcomputer 11 to pass a large current between the anode expansion pads Ln1+, Ln2+ and the cathode expansion pads Ln1-, Ln2-. However, the configuration of the current amplifier circuit is not limited to this, and circuits of various configurations having similar functions can be applied. Furthermore, the locations where an LED can be connected are not limited to the expansion pads. An LED can also be connected between the connection pads Pn+ and Pn-, and this LED can be lit by a drive pulse from the microcomputer.

[0080] When multiple LEDs are connected between the expansion pads Ln1+ and Ln1- or between the expansion pads Ln2+ and Ln2-, the timing of turning on and off these LEDs is completely synchronized, but the light color of each LED does not necessarily have to be the same. In other words, the light color of multiple LEDs connected in a series may be the same, or multiple colors may be used. The shape of the LEDs does not need to be the same, and for example, a chip-type LED may be connected between the expansion pads Ln1+ and Ln1-, and a bullet-type LED may be connected between the expansion pads Ln2+ and Ln2-.

[0081] 6, lighting control can be performed simultaneously in up to eight different sequences by a program embedded in each of the microcomputers 11, 11 of the two daughter boards 1A, 1A mounted on the motherboard 2. Therefore, a wide variety of illuminations can be achieved by combining these sequences with shapes of multiple LEDs.

[0082] As with the daughter boards 1A, 1A, various types of LEDs can be connected to the motherboard 2. The expansion pads Ln1+, Ln1-, Ln2+, Ln2- are all located on the edge of the motherboard 2, so as with the daughter boards 1A, 1A, they can be easily soldered and the possibility of defects such as short circuits can be reduced.

[0083] In the unlikely event that a user makes a mistake in their work and a short circuit occurs on the motherboard 2 or on the daughter board 1A, or if more LEDs than the allowable number are connected or components other than LEDs are connected, causing a current that exceeds the allowable amount to flow through the motherboard 2, the protection circuit of the motherboard 2 will activate and cut off the power circuit from external power. This mechanism prevents accidents such as the motherboard 2 catching fire, allowing you to use it with peace of mind.

[0084] Although the motherboard 2 in the above embodiment can accommodate up to two daughter boards 1A (or 1), it is also possible to provide a motherboard that can accommodate more daughter boards. Conversely, it is also possible to provide a small motherboard that can accommodate only one daughter board 1A (or 1).

[0085] The number of expansion pads corresponding to each LED driving pad may be one or more. When the number of expansion pads is small, they may be arranged only on one edge of the board body 200 of the motherboard 2.

[0086] In addition, by adding a circuit that switches between energized and non-energized states for each set of expansion pads and a circuit that adjusts the current flowing to the expansion pads to the basic circuit shown in Figure 8, and by performing these switching and adjustments by operating switches, more precise control can be achieved.

[0087] Furthermore, the motherboard 2 may be provided with pads on which the microcomputer 11 can be directly mounted, and conductive patterns for connecting the output terminals T1, T2, T3, and RES of the microcomputer 11 mounted on these pads to the connection pads P1+, P2+, P3, and P4+. With this configuration, even by mounting the microcomputer 11 instead of the sub-boards 1A and 1, it is possible to connect LEDs to the paired extension pads (T1n+ and T1n-, T2n+ and T2n-) and light these LEDs with drive pulses from the microcomputer 11. Therefore, if a user has programming skills, they can create an illumination device that operates according to a program they have created by mounting the microcomputer 11, in which a program they have created, and a required number of LEDs on the motherboard 2 without using the sub-boards 1A and 1.

[0088] The control board 1B of the alternative example shown in FIG. 5 also includes a power supply circuit, a cathode pad D for driving an LED, COM 1- and D COMIt is possible to provide a motherboard having contact pads corresponding to the eight pads 10 including Pn+2-, extension pads corresponding to the six pads for driving LEDs, and a circuit including a current amplifying transistor TRn that receives a driving pulse from an anode pad Dn+ (n=1 to 4) for driving LEDs via a contact pad Pn+. The circuit configuration may be the same as that of FIG. 8, except that the cathode contact pads P1- and P2-, and P3- and P4- are integrated. [Explanation of symbols]

[0089] 1,1A,1B Control board (sub board) 2 Motherboard 3A, 3B, 3C LEDs 10 Pads 11 Microcomputer 100,200 Board body D E +,D E - Power supply pad D1+, D2+, D3+, D4+ Anode pads for driving LEDs D1-, D2-, D3-, D4- Cathode pads for driving LEDs P1+, P2+, P3+, P4+ LED driver contact pads (anodes) P1-, P2-, P3-, P4- LED drive contact pads (cathode) P0 PCB mounting pad P A Anode Pad L11+, L12+, L21+, L22+ expansion pad (anode) L31+, L32+, L41+, L42+ expansion pad (anode) L11-, L12-, L21-, L22- Extension pad (cathode) L31-, L32-, L41-, L42- Extension pad (cathode) TR1, TR2, TR3, TR4 Current amplification transistors

Claims

1. The device includes a rectangular substrate body on which a circuit pattern including a plurality of pads is formed, and a control microcomputer mounted on the substrate body with a terminal group aligned in a direction parallel to the side of the substrate body, Within a main surface of the substrate body on which the microcomputer is mounted, only two of the plurality of pads are arranged adjacent to each other along one edge of the substrate body as anode and cathode pads for power supply, and, along an edge of at least one of the remaining three sides that faces a group of terminals of the microcomputer, a number of pads equivalent to multiple sets of combinations of pairs of pads serving as anode and cathode pads for driving LEDs are arranged in a row along the side, with pads of the same set arranged adjacent to each other along the side, and with the polarities assigned to each pad arranged in an order that follows a certain rule; the circuit pattern includes a circuit for connecting the anode pad and the cathode pad for power supply to a power supply terminal of a corresponding polarity of the microcomputer, a circuit for connecting one of the anode pad and the cathode pad for driving the LED to an output terminal for outputting a driving pulse of the microcomputer, and a circuit for applying a voltage suitable for the polarity to the LED driving pad of the polarity not connected to the microcomputer; The microcomputer stores a program for processing to output a drive pulse for lighting an LED from at least one of the output terminals to which the LED drive pad is connected in accordance with a predetermined sequence. A control board dedicated to LEDs.

2. within a main surface of the board body on which the microcomputer is mounted, a plurality of pairs of anode and cathode pads for driving the LEDs are arranged in a row along each of two edges along two sides that face the terminal group of the microcomputer but do not face the edge along which the anode and cathode pads for power supply are arranged, with the pads of the same pair being arranged next to each other in the direction of the edge, and with the polarities assigned to each pad being arranged in an order according to a common rule between the edge portions; A control board dedicated to the LED according to claim 1.

3. A device comprising: a rectangular substrate body on which a circuit pattern including a plurality of pads is formed; and a control microcomputer mounted on the substrate body with the arrangement direction of a terminal group aligned with the direction of the side of the substrate body; Within a main surface of the substrate body on which the microcomputer is mounted, only two of the plurality of pads are arranged adjacent to each other along one edge of the substrate body as anode and cathode pads for power supply, and, along an edge of at least one of the remaining three sides that faces a group of terminals of the microcomputer, a number of pads equivalent to multiple sets of combinations of pairs of pads serving as anode and cathode pads for driving LEDs are arranged in a row along the side, with pads of the same set arranged adjacent to each other along the side, and with the polarities assigned to each pad arranged in an order that follows a certain rule; The circuit pattern includes a circuit for connecting the anode pad and the cathode pad for power supply to a power supply terminal of the microcomputer having a corresponding polarity, a circuit for connecting one of the anode pad and the cathode pad for driving the LED to an output terminal for outputting a driving pulse of the microcomputer, and a circuit for applying a voltage suitable for the polarity to the LED driving pad of the polarity not connected to the microcomputer. A control board dedicated to LEDs.

4. A motherboard mainly made of a printed circuit board capable of mounting and electrically connecting one or more daughter boards each including a rectangular board body on which a circuit pattern including a plurality of pads is formed and a control microcomputer mounted on the board body with the arrangement direction of a terminal group aligned with the direction of the side of the board body, The daughter board is provided with, within a main surface of the board body on which the microcomputer is mounted, an edge portion along one side of the board body, in which only two of the plurality of pads are arranged side by side in the direction of the side as anode and cathode pads for power supply, and an edge portion along at least one of the other three sides that faces a terminal group of the microcomputer, with pads of the same set arranged side by side in the direction of the side and with the polarities assigned to each pad arranged in a certain order. the circuit pattern includes a circuit for connecting the anode pads and cathode pads for power supply to power supply terminals of corresponding polarities of the microcomputer, a circuit for connecting one of the anode pads and cathode pads for driving the LEDs to an output terminal for outputting a driving pulse of the microcomputer, and a circuit for applying a voltage suitable for the polarity to the LED driving pad of the polarity not connected to the microcomputer, and a program for processing is stored in the microcomputer to output a driving pulse for lighting an LED from at least one of the output terminals to which the LED driving pads are connected in accordance with a predetermined sequence, the printed circuit board comprises a plurality of connection pads provided at locations corresponding to the pads of the daughter board, a circuit for applying voltages of suitable polarity to each of the connection pads corresponding to a pair of power supply pads of the daughter board, one or more extension pads provided for each LED drive pad of the daughter board, and a current amplifier circuit for passing a larger current between the extension pad corresponding to the anode pad for driving the LED of the daughter board and the extension pad corresponding to the cathode pad for driving the LED paired with the anode pad, than the current passing between the pair of pads for driving the LED; A drive pulse received from the microcomputer by an LED drive pad corresponding to the expansion pad targeted by the current amplifier circuit is transmitted to the LED drive pad via a connection pad to the LED drive pad, and the current amplifier circuit is turned on by the drive pulse. A motherboard exclusively for LEDs.

5. The expansion pads are arranged on the edge portions along one or more sides of the printed circuit board in such a manner that the expansion pads corresponding to the LED driving pads of the same group are aligned in a row based on the grouping of the pads on the daughter board, and the polarities of the expansion pads are arranged in an order following the same rule as the daughter board.

5. A motherboard dedicated to LEDs according to claim 4.

Images