Photosensitive composition, cured product, display device, and method for producing the cured product

Abstract

A photosensitive composition according to the present invention contains a binder resin (A) and a photosensitizer (C). The photosensitizer (C) contains a naphthoquinone diazide compound (C1). The photosensitive composition also contains methanol and / or ethanol and satisfies condition (7). (7) The total methanol and ethanol content of the photosensitive composition is 0.0010–30,000 mass ppm. The photosensitive composition has excellent sensitivity during exposure, suppresses post-development residues, and has excellent storage stability. This display device, which comprises a cured product produced by curing the photosensitive composition, has excellent light emission intensity.

Description

[Technical field]

[0001] The present invention relates to a photosensitive composition, a cured product, a display device, and a method for producing the cured product. [Background technology]

[0002] In recent years, technologies related to organic electroluminescence (hereinafter, "OLED") displays, quantum dot displays, or micro light-emitting diode (hereinafter, "LED") displays have been actively researched for thin displays such as smartphones. For example, the pixel division layer of an OLED display is formed by photolithography. In order to reduce the process time in the manufacture of an OLED display, the materials used are required to have high sensitivity during exposure. Furthermore, it is necessary to simultaneously suppress development residues during positive or negative pattern formation by photolithography. For example, foreign matter may be generated after storage of a photosensitive composition at room temperature, and the foreign matter may remain in the opening of the pixel division layer. Such foreign matter may lead to the generation of dark spots in the pixel area and a shortened lifespan of the light-emitting element. Therefore, the materials used are also required to have excellent storage stability that does not generate foreign matter.

[0003] Micro LED displays are expected to be used not only for televisions and smartphones, but also for new applications such as signage, AR (Augmented Reality), VR (Virtual Reality), and transparent displays. In micro LED displays, light is emitted from the LED light source in all directions, so if the light is absorbed by the insulating layer, protective layer, or partitions of the surrounding materials, the light extraction efficiency will decrease. Therefore, there is a demand for improving brightness by changing the configuration of the insulating layer, protective layer, or partitions, and the physical properties of the materials used.

[0004] Examples of photosensitive compositions include positive-type photosensitive compositions containing polyimide as a resin (see, for example, Patent Document 1) and positive-type photosensitive compositions containing polysiloxane as a resin (see Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2002-091343 A [Patent Document 2] JP 2006-178436 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the compositions described in Patent Document 1 and Patent Document 2 have problems in terms of achieving sensitivity during exposure, suppression of residues after development, storage stability, and luminance at the same time, and therefore further improvements in the properties of photosensitive compositions have been desired.

[0007] An object of the present invention is to provide a photosensitive composition that combines excellent sensitivity during exposure, suppression of residues after development, and excellent storage stability, a cured product obtained by curing the photosensitive composition, a method for producing the cured product, and a display device that includes the cured product and has excellent luminance. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems, the present invention has the following configurations [1] to

[17] . [1] A photosensitive composition comprising (A) a binder resin and (C) a photosensitizer, the (C) photosensitizer contains (C1) a naphthoquinone diazide compound, Further, it contains methanol and / or ethanol, And the photosensitive composition satisfies the following condition (7): (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass. [2] Further, the composition contains one or more selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether; The photosensitive composition according to item [1] above, which satisfies the following condition (8): (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 ppm by mass. [3] Further, the composition contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether; The photosensitive composition according to the above [1] or [2], which satisfies the following condition (9): (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass. [4] The photosensitive composition according to any one of the above [1] to [3], further comprising water and satisfying the following condition (3): (3) The content of water in the photosensitive composition is 0.010 to 3.0% by mass. [5] The electrolyte solution contains one or more ions selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions, and satisfies the following condition (4): and / or The photosensitive composition according to any one of the above [1] to [4], which contains one or more compounds selected from the group consisting of phosphoric acid esters, phosphonic acid, phosphonic acid esters, phosphorous acid esters, phosphinic acid, and hypophosphite esters, and satisfies the following condition (5): (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass. (5) The total content of phosphoric acid esters, phosphonic acid esters, phosphonic acid esters, phosphorous acid esters, phosphinic acid, and hypophosphite esters in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass. [6] The photosensitive composition according to any one of the above [1] to [5], further comprising a tertiary amine compound and / or a quaternary ammonium ion, and satisfying the following condition (6): (6) The total content of a tertiary amine compound and a quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 ppm by mass. [7] The photosensitive composition according to any one of [1] to [6] above, wherein the binder resin (A) satisfies the following condition (P1a): (P1a) The content of fluorine element in the structure of the (A) binder resin is 10,000 mass ppm or less. [8] The photosensitive composition according to any one of [1] to [7] above, which satisfies the following condition (1a): (1a) The content of fluorine element in the total solid content of the photosensitive composition is 1,000 ppm by mass or less. [9] The (A) binder resin contains (A1) a weakly acidic group-containing resin, The photosensitive composition according to any one of the above [1] to [8], wherein the (A1) weakly acidic group-containing resin has, as the (WA) weakly acidic group, one or more types of groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group.

[10] The photosensitive composition according to [9] above, wherein the (A1) weakly acidic group-containing resin comprises (A1x-1) resin: polysiloxane.

[11] The photosensitive composition according to

[10] above, wherein when the photosensitive composition is diluted with water to prepare a diluted solution and the solids concentration of the diluted solution is 1 / 100 times that of the solids concentration of the photosensitive composition, the hydrogen ion exponent of the diluted solution is 5.5 to 7.0.

[12] The photosensitive composition according to

[10] or

[11] above, wherein the (A1x-1) resin has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10). [ka] In the general formula (9) and the general formula (10), R 61 represents a hydrogen atom or a monovalent organic group. 1 ~* 3 each independently represents a bonding point in the resin.

[13] The photosensitive composition according to any one of [1] to

[12] above, wherein the photosensitizer (C) further contains a photoacid generator (C3) and / or a photobase generator (C4).

[14] A cured product obtained by curing the photosensitive composition according to any one of [1] to

[13] above.

[15] A display device comprising the cured product according to

[14] above.

[16] A method for producing a cured product, comprising: (1) a step of forming a coating film of the photosensitive composition according to any one of the above [1] to

[13] on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) a step of developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition.

[17] A display device having a substrate, a redistribution layer, an interlayer insulating layer for the redistribution layer, and a semiconductor chip, and further having a partition layer and / or a planarization layer, the semiconductor chip is a light emitting element, In a plan view, the area of ​​the redistribution layer is larger than the area of ​​the semiconductor chip; the partition layer is formed between adjacent semiconductor chips, the planarization layer is formed to cover at least a portion of the semiconductor chip; The display device, wherein the partition layer and / or the planarizing layer contain methanol and / or ethanol and satisfy the following condition (X1a) and / or (X1b): (X1a) The total content of methanol and ethanol in the partition layer is 0.0010 to 30,000 ppm by mass. (X1b) The total content of methanol and ethanol in the planarizing layer is 0.0010 to 30,000 ppm by mass. Effect of the Invention

[0009] The photosensitive composition of the present invention can provide excellent sensitivity during exposure, suppression of residue after development, and excellent storage stability. In addition, it is possible to provide a cured product that is equipped in a display device having excellent luminance. Furthermore, the display device of the present invention can provide a display device having excellent luminance. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic cross-sectional view of a micro LED display having a barrier layer and a planarization layer. [Diagram 2] FIG. 2 is a schematic cross-sectional view of another form of a micro LED display having a barrier layer and a planarization layer. [Diagram 3] FIG. 2 is a plan view showing a manufacturing process of steps 1 to 4 for a substrate of an organic EL display used in an evaluation of light-emitting characteristics. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The photosensitive composition of the present invention will be described in detail below together with the embodiments. However, the present invention is not limited to the following embodiments, and various modifications are possible within the scope of the invention, as long as the object of the invention can be achieved and the gist of the invention is not deviated from. In the following description, the main chain of the resin refers to the longest chain among the chains constituting the resin containing structural units. The side chain of the resin refers to the chains branched from the main chain or bonded to the main chain, which are shorter than the main chain, among the chains constituting the resin containing structural units. The end of the resin refers to the structure that seals the main chain, for example, a structure derived from an end-capping agent.

[0012] <Photosensitive composition> The photosensitive composition of the present invention has the above-mentioned configuration [1]. By adopting the above-mentioned configuration [1], the photosensitive composition of the present invention can have excellent sensitivity during exposure, suppression of residue after development, and excellent storage stability. In addition, it is possible to provide a cured product that is equipped in a display device with excellent luminance. This is thought to be because the photosensitive composition contains a small amount of the above-mentioned methanol and / or ethanol, which promotes dissolution in a developer due to the hydrophilicity of the compound, thereby achieving excellent sensitivity during exposure and suppression of residue after development. In addition, since the surface of the substrate is modified by the compound, it is also thought to achieve the effect of suppressing residue after development by preventing adhesion of residue at the opening.

[0013] In addition, it is believed that intentionally containing a small amount of the above-mentioned methanol and / or ethanol stabilizes the polar group of the resin in the photosensitive composition by the interaction through hydrogen bonds caused by the hydroxyl group in the compound. In particular, when the photosensitive composition contains polysiloxane, it is suitable for stabilizing the silanol group in the polysiloxane. In addition, it is believed that the hydroxyl group in the compound controls the polar structure and charge balance in the photosensitive composition. As a result, it is presumed that the effect of excellent storage stability is achieved. Furthermore, when a pattern of the photosensitive composition is formed on wiring such as metal, it is presumed that the above-mentioned compound in the photosensitive composition modifies the surface of the wiring that becomes an opening or the wiring surface that contacts the pattern by the compound. In addition, it is believed that the hydroxyl group in the compound contained in the cured product captures a small amount of metal impurities and ion impurities in the cured product, and these impurities migrate to the wiring surface, thereby acting as a carrier in the wiring. As a result, it is believed that the conductivity of the wiring such as metal is controlled, and low voltage driving is possible, thereby achieving the effect of high luminous brightness.

[0014] <(A) Binder resin> The photosensitive composition of the present invention contains (A) a binder resin. (A) Binder resin is a resin having heat resistance, at least a part of which remains in a cured product obtained by curing the composition. The (A) binder resin in the composition may remain in a cured product obtained by curing the composition. (A) Binder resin is preferably a resin that is cured by forming a crosslinked structure by reaction. The reaction is not particularly limited and may be by heating or by irradiation with energy rays, and a crosslinked structure may be formed by a (F) crosslinking agent described later. (A) Binder resin is preferably a thermosetting resin.

[0015] The (A) binder resin is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. The (A) binder resin is preferably a resin that has a solubility capable of forming a positive or negative pattern by imparting positive or negative photosensitivity to the composition by the (C) photosensitizer described below.

[0016] The (A) binder resin preferably has an acidic group in its structural unit. From the viewpoint of pattern processability in an alkaline developer, the acidic group is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, a mercapto group, a carboxy group, a carboxylic anhydride group, or a sulfonic acid group, and from the viewpoint of improving sensitivity during exposure and suppressing residues after development, a carboxy group, a carboxylic anhydride group, or a sulfonic acid group is more preferable.

[0017] (A) binder resin preferably has a radical polymerizable group, and more preferably has a radical polymerizable group in the structural unit of the resin. The radical polymerizable group preferably has an ethylenically unsaturated double bond group, and more preferably is a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, or an alkynyl group having 2 to 5 carbon atoms. The photoreactive group is preferably a styryl group, a cinnamoyl group, a maleimide group, a nadimide group, or a (meth)acryloyl group, and from the viewpoint of improving the sensitivity during exposure, a (meth)acryloyl group is more preferable. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, a 2-methyl-2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group, and from the viewpoint of improving the sensitivity during exposure, a vinyl group or an allyl group is more preferable.

[0018] <(A1) Resin and (A2) Resin> The (A) binder resin preferably contains (A1) a weakly acidic group-containing resin and / or (A2) a resin having no weakly acidic groups.

[0019] From the viewpoint of improving the sensitivity during exposure, the (A) binder resin contains a (A1) weakly acidic group-containing resin, and the (A1) weakly acidic group-containing resin preferably has one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)methylol group, and a mercapto group as the (WA) weakly acidic group, and more preferably has a (WA) weakly acidic group in the structural unit of the resin. Hereinafter, these groups may be collectively referred to as "(WA) weakly acidic group". From the viewpoint of improving the sensitivity during exposure and suppressing residues after development, the (WA) weakly acidic group is preferably a phenolic hydroxyl group, a silanol group, or a 1,1-bis(trifluoromethyl)methylol group (hereinafter, "specific (WA) weakly acidic group"). In addition, when the (A) binder resin satisfies the conditions (P1a) and / or (P2a) described below, or when the photosensitive composition of the present invention satisfies the conditions (1a) and / or (2a) described below, the acidic group of the (A) binder resin is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a mercapto group, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group, and the (WA) weak acidic group is preferably one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, and a mercapto group. The (A1) weak acidic group-containing resin improves the solubility of the exposed area due to the moderate acidity of the (WA) weak acidic group and the interaction with the (C) photosensitizer described below, so that the effect of improving the sensitivity during exposure is remarkable. A specific (WA) weak acidic group among the (WA) weak acidic groups has a remarkable effect of suppressing residue after development due to its alkaline dissolution promoting effect. In addition, when the composition has positive photosensitivity, a specific one of the (WA) weak acidic groups can increase the dissolution contrast between exposed and unexposed areas due to strong interaction with the (C) photosensitizer, and also improve the dissolution promotion effect in the exposed areas, resulting in a significant effect of improving sensitivity during exposure and suppressing residues after development.

[0020] From the viewpoint of suppressing residues after development, the binder resin (A) preferably contains a resin (A2) that does not have a weak acidic group. The resin (A2) that does not have a weak acidic group preferably has an acidic group different from the weak acidic group (WA), and more preferably has an acidic group different from the weak acidic group (WA) in the structural unit of the resin. From the viewpoint of improving sensitivity during exposure and suppressing residues after development, the acidic group different from the weak acidic group (WA) is more preferably a carboxy group, a carboxylic anhydride group, or a sulfonic acid group.

[0021] From the viewpoint of improving the sensitivity during exposure, the binder resin (A) preferably contains a weakly acidic group-containing resin (A1), and the weakly acidic group-containing resin (A1) preferably has a radical polymerizable group. Examples and preferred descriptions regarding the radical polymerizable group are as described above for the binder resin (A).

[0022] It is preferable that the (A) binder resin contains (A1) a weakly acidic group-containing resin and / or (A2) a resin not having a weakly acidic group, the (A1) weakly acidic group-containing resin contains (A1x) resin: a resin having one or more structures selected from the group consisting of imide structures, amide structures, oxazole structures, and siloxane structures (hereinafter, "imide structures, etc.") in the structural units of the resin, and / or (A1y) resin: a resin having a phenolic hydroxyl group in the structural units of the resin, and the (A2) resin not having a weakly acidic group contains (A2x) resin: a resin having a radical polymerizable group and / or (A2y) resin: a resin not having a radical polymerizable group.

[0023] From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the binder resin (A) preferably contains a weakly acidic group-containing resin (A1) and a resin (A2) that does not have a weakly acidic group.

[0024] In addition, when the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin each have a structure or group that constitutes a different resin, they shall be classified into one of the classification methods shown in Table 1-1 below. When a certain resin can be classified into two or more of the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin, the classification method shall determine which resin it belongs to.

[0025] [Table 1-1]

[0026] The (A) binder resin preferably contains (A1x) resin and / or (A1y) resin, more preferably contains (A1x) resin, and even more preferably contains (A1x) resin and (A1y) resin. The (A) binder resin preferably contains (A1x) resin and / or (A1y) resin and further contains (A2x) resin, and more preferably contains (A1x) resin, (A1y) resin, and (A2x) resin. The (A) binder resin also preferably contains (A1x) resin, (A1y) resin, or (A2x) resin and further contains (A2y) resin. From the viewpoint of improving the properties of each resin, the (A) binder resin also preferably contains two or more types selected from the group consisting of (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin.

[0027] <(A1x) resin> When the binder resin (A) contains a weakly acidic group-containing resin (A1), the weakly acidic group-containing resin (A1) preferably contains a resin (A1x) from the viewpoints of improving sensitivity during exposure, improving the reliability of the light-emitting device, and improving the luminance of emitted light. From the viewpoints of improving sensitivity during exposure, improving the reliability of the light-emitting device, and improving the luminance of emitted light, the resin (A1x) is preferably a polysiloxane (A1x-1) resin, a polyimide (A1x-2) resin, a polyimide (A1x-3) resin, a polyimide precursor (A1x-4) resin, a polybenzoxazole (A1x-5) resin, a polybenzoxazole precursor (A1x-6) resin, a polyamideimide (A1x-7) resin, a polyamideimide precursor (A1x-8) resin, a polyamide, a maleimide resin, a maleimide-styrene resin, or a combination thereof. It is preferable that the resin (A1x) contains one or more selected from the group consisting of a tetraphenylene resin, a maleimide-triazine resin, a maleimide-oxazine resin, and copolymers thereof, and it is more preferable that the resin (A1x-1) contains one or more selected from the group consisting of a (A1x-2) resin, a (A1x-3) resin, a (A1x-4) resin, a (A1x-5) resin, a (A1x-6) resin, a (A1x-7) resin, a (A1x-8) resin, and copolymers thereof, and it is even more preferable that the resin (A1x-1) contains the resin. The resin (A1x) may be either a single resin or a copolymer thereof.

[0028] When the binder resin (A) contains a weakly acidic group-containing resin (A1), the weakly acidic group-containing resin (A1) preferably contains a polysiloxane resin (A1x-1) from the viewpoints of improving the sensitivity during exposure, improving the reliability of the light-emitting device, and improving the luminance of the light-emitting device.

[0029] The (A1x) resin has an imide structure, an amide structure, an oxazole structure, or a siloxane structure in the structural unit of the resin, and these structures capture metal impurities and ion impurities that adversely affect electrical insulation, thereby suppressing ion migration and electromigration, and improving the reliability of the light-emitting device. In addition, these structures control the conductivity of wiring such as metal, and thus improving the luminance.

[0030] On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residues after development, and improving the reliability of the light-emitting device, it is preferable that the (A2x) resin and the (A2y) resin contain one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof.

[0031] From the viewpoint of improving the sensitivity during exposure and the reliability of the light-emitting device, it is preferable that the (A1x) resin has a radical polymerizable group. Examples and preferred descriptions regarding the radical polymerizable group are as described above for the (A) binder resin. The radical polymerizable group is preferably obtained by reacting a part of the phenolic hydroxyl group and / or carboxyl group of the resin with a compound having a radical polymerizable group.

[0032] From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, improving the reliability of the light-emitting element, and improving the luminance of light emitted, it is preferable that the (A1x) resin contains an (A1x) resin that does not have a radical polymerizable group and an (A1x) resin that has a radical polymerizable group. With the above-mentioned configuration, the (A1x) resin that does not have a radical polymerizable group suppresses residues after development due to the acidic group or organic solvent-soluble structure, and has the ability to capture metal impurities and ion impurities, and controls the conductivity of wiring such as metal, while the (A1x) resin that has a radical polymerizable group is considered to improve the sensitivity during exposure and improve the degree of crosslinking of the film by promoting radical polymerization. As a result, outgassing is suppressed and the effect of improving the reliability of the light-emitting element is remarkable. The effect of improving multiple properties is remarkable due to the functional separation in such (A1x) resin.

[0033] The acid equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of improving the sensitivity during exposure. On the other hand, the acid equivalent of the (A1x) resin is preferably 600 g / mol or less from the viewpoint of suppressing residues after development. The exposure here refers to irradiation with active actinic rays (radiation), and examples of such irradiation include visible light, ultraviolet light, electron beams, and X-rays. Hereinafter, exposure refers to irradiation with active actinic rays (radiation). The double bond equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of suppressing residues after development. On the other hand, the double bond equivalent of the (A1x) resin is preferably 3,000 g / mol or less from the viewpoint of improving the sensitivity during exposure.

[0034] <Polysiloxane> (A1x-1) resin: Polysiloxane has a silanol group and contains a siloxane structure in the structural unit of the resin, and is therefore an (A1x) resin. Examples of (A1x-1) resin include resins obtained by hydrolyzing and dehydrating condensation of one or more selected from the group consisting of trifunctional organosilanes, tetrafunctional organosilanes, bifunctional organosilanes, and monofunctional organosilanes.

[0035] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving the reliability of the light-emitting device, and improving the luminance, the (A1x-1) resin preferably has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10).

[0036] [ka]

[0037] In the general formula (9) and the general formula (10), R 61 represents a hydrogen atom or a monovalent organic group. 1 ~* 3 each independently represents a bonding point in the resin.

[0038] In the general formula (9) and the general formula (10), R 61is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogenated alkyl group having 1 to 10 carbon atoms, a halogenated cycloalkyl group having 4 to 10 carbon atoms, or a halogenated aryl group having 6 to 15 carbon atoms. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0039] From the viewpoint of improving sensitivity during exposure, the content of the trifunctional organosilane unit represented by general formula (9) in the (A1x-1) resin is preferably 50 to 100 mol %, more preferably 60 to 100 mol %, and even more preferably 70 to 100 mol %, in terms of Si atom molar ratio.

[0040] The content ratio of the tetrafunctional organosilane unit represented by general formula (10) in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more in terms of Si atom molar ratio from the viewpoint of suppressing residues after development. On the other hand, the content ratio of the tetrafunctional organosilane unit represented by general formula (10) is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less in terms of Si atom molar ratio from the viewpoint of improving the reliability of the light-emitting device.

[0041] The content ratio of the bifunctional organosilane unit in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more in terms of Si atom molar ratio from the viewpoints of improving storage stability, reducing taper of the pattern shape, and improving mechanical properties. On the other hand, the content ratio of the bifunctional organosilane unit is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less in terms of Si atom molar ratio from the viewpoints of improving reliability of the light-emitting device.

[0042] The content ratio of the monofunctional organosilane unit in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more in terms of Si atom molar ratio from the viewpoint of improving storage stability. On the other hand, the content ratio of the monofunctional organosilane unit is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less in terms of Si atom molar ratio from the viewpoint of improving reliability of the light-emitting device.

[0043] From the viewpoint of pattern processability in an alkaline developer, the (A1x-1) resin preferably has an organosilane unit containing an acidic group, and from the viewpoint of improving sensitivity during exposure, it is more preferable to have an organosilane unit containing a weakly acidic group (WA). From the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving chemical resistance, and improving the reliability of the light-emitting device, the (A1x-1) resin preferably has an organosilane unit containing a weakly acidic group (WA) and a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, and more preferably has an organosilane unit containing a 1,1-bis(trifluoromethyl)-1-hydroxymethylphenyl group or a phenolic hydroxyl group. In addition, from the viewpoints of improving sensitivity during exposure and suppressing residue after development, it is also preferable for the (A1x-1) resin to have an organosilane unit containing a carboxy group, a carboxylic anhydride group, or a sulfonic acid group. Examples and preferred descriptions regarding the acidic group and the (WA) weakly acidic group are as described above in the binder resin (A). From the viewpoint of improving the above-mentioned characteristics, the content ratio of the organosilane unit containing an acidic group in the (A1x-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more, in terms of the Si atom molar ratio. On the other hand, from the viewpoint of pattern processability in an alkaline developer, the content ratio of the organosilane unit containing an acidic group is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, in terms of the Si atom molar ratio.

[0044] From the viewpoints of improving the sensitivity during exposure, improving chemical resistance, and improving the reliability of the light-emitting element, the (A1x-1) resin preferably has an organosilane unit containing a radical polymerizable group, and more preferably has an organosilane unit containing a styryl group, a (meth)acryloyl group, a vinyl group, or an allyl group. Examples and preferred descriptions regarding the radical polymerizable group are as described above in the (A) binder resin.

[0045] From the viewpoints of suppressing residues after development, improving chemical resistance, and improving the reliability of the light-emitting device, the (A1x-1) resin preferably has an organosilane unit containing an epoxy group or an oxetanyl group, and more preferably has an organosilane unit containing a cyclohexylepoxy group, a glycidyl group, or an oxetanyl group.

[0046] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving chemical resistance, and improving the reliability of the light-emitting device, the (A1x-1) resin preferably has an organosilane unit containing a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, more preferably has an organosilane unit containing a naphthyl group, an anthracenyl group, a biphenyl group, a phenyl group, a tolyl group, or a methoxyphenyl group, and further preferably has an organosilane unit containing a naphthyl group or an anthracenyl group.

[0047] From the viewpoints of suppressing residues after development, improving the reliability of the light-emitting device, and improving the luminance of light emitted, the (A1x-1) resin preferably has an organosilane unit to which the (G) inorganic particles are bonded, as described below. The (A1x-1) resin having the organosilane unit may hereinafter be collectively referred to as "polysiloxane containing inorganic particles". The polysiloxane containing inorganic particles is preferably a resin obtained by hydrolyzing and dehydrating condensation one or more selected from the group consisting of trifunctional organosilanes, tetrafunctional organosilanes, bifunctional organosilanes, and monofunctional organosilanes in the presence of the (G) inorganic particles. The (G) inorganic particles are preferably silica particles. Examples and preferred descriptions of the (G) inorganic particles are as described in the (G) inorganic particles below.

[0048] <Polyimide resins and other resins> Hereinafter, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof, which are (A1x) resin, (A2x) resin, or (A2y) resin, will be described collectively. These resins may be collectively referred to as polyimide-based resins. Examples of polyimide precursors include polyamic acid, polyamic acid ester, polyamic acid amide, and polyisoimide. Examples of polyimides include resins obtained by dehydrating and ring-closing polyimide precursors. Examples of polybenzoxazole precursors include polyhydroxyamides. Examples of polybenzoxazoles include resins obtained by dehydrating and ring-closing polybenzoxazole precursors. Examples of polyamideimide precursors include resins obtained by reacting tricarboxylic anhydrides or the like with diamines or the like. Examples of polyamideimides include resins obtained by dehydrating and ring-closing polyamideimide precursors. Examples of polyamides include resins obtained by reacting dicarboxylic acid chlorides or the like with diamines or the like.

[0049] From the viewpoint of improving the sensitivity during exposure, the polyimide precursor preferably has an amic acid ester structural unit and / or an amic acid amide structural unit. The polyimide precursor may have an imide ring-closed structural unit in which a part of the amic acid structural unit, the amic acid ester structural unit, or the amic acid amide structural unit is ring-closed into an imide ring. The above polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, and polyamideimide precursor may be copolymerized with polyamide.

[0050] From the viewpoint of improving sensitivity during exposure, the polyimide resin preferably has a carboxylic acid residue having a fluorine atom and / or an amine residue having a fluorine atom. The total content ratio of the carboxylic acid residue having a fluorine atom and the amine residue having a fluorine atom in the total carboxylic acid residues and the total amine residues of each resin is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and even more preferably 50 to 100 mol%. The preferred ranges for the total content ratio of the amine residues having a fluorine atom in the total amine residues and the total content ratio of the carboxylic acid residues having a fluorine atom in the total carboxylic acid residues are the same as those described above.

[0051] From the viewpoint of improving storage stability, the polyimide resin preferably has a structure in which the terminal of the resin is sealed with a monoamine, a dicarboxylic anhydride, or a monocarboxylic acid derivative. From the viewpoint of improving sensitivity during exposure and reliability of the light-emitting device, the polyimide resin preferably has a radical polymerizable group or a crosslinkable group capable of reacting with a resin, etc., at the terminal of the resin, and more preferably has a maleimide group or a nadic anhydride. Examples of acid monomers having these groups include maleic anhydride and nadic anhydride.

[0052] <(A) Fluorine content in the binder resin structure> From the viewpoints of suppressing residues after development, improving the reliability of the light-emitting device, and improving luminance, it is also preferable that the (A) binder resin satisfies the following condition (P1a). It is more preferable that the (A) binder resin further satisfies the following condition (P2a). Similarly, when the (A) binder resin is a polyimide-based resin, it is also preferable that the (A) binder resin further satisfies the following condition (P1a), and it is more preferable that the (A) binder resin further satisfies the following condition (P2a), from the viewpoints of suppressing residues after development, improving the reliability of the light-emitting device, and improving luminance. (P1a)(A) The content of fluorine element in the structure of the binder resin is 10,000 mass ppm or less (P2a)(A) The content of fluoride ions in the structure of the binder resin is 10,000 ppm by mass or less.

[0053] From the viewpoint of the above-mentioned effects of the invention, the content of fluorine element in the structure of the (A) binder resin is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, even more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the above-mentioned effects of the invention, the content of fluorine element is preferably 10,000 mass ppm or less, more preferably 5,000 mass ppm or less, even more preferably 1,000 mass ppm or less, even more preferably 500 mass ppm or less, particularly preferably 300 mass ppm or less, and most preferably 100 mass ppm or less. Furthermore, the content of fluorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0054] The preferred range of the content of fluoride ions in the structure of the binder resin (A) is the same as the preferred range of the content of elemental fluorine in the structure of the binder resin (A) described above.

[0055] The content of fluorine element in the structure of the (A) binder resin may be 0 ppm by mass, and the content of fluoride ions in the structure of the (A) binder resin may be 0 ppm by mass.

[0056] By including a binder resin (A) having a fluorine content of a specific value or less in the photosensitive composition, the content of fluorine element, fluoride ion, or anion containing fluorine element derived from these resins is a specific value or less, so that it is presumed that protons in the photosensitive composition are locally activated by interactions such as hydrogen bonds of each component in the photosensitive composition. Therefore, it is considered that the effect of suppressing residue after development is remarkable due to the dissolution promotion action in the developer. In addition, it is considered that the content of the above-mentioned components in the resin is intentionally set to a specific value or less, and the content of the above-mentioned components in the cured product of the photosensitive composition is also reduced, and the polarization structure and charge balance in the cured product are controlled. As a result, it is presumed that the reliability and luminous brightness of the light-emitting element are improved by suppressing ion migration and electromigration caused by metal impurities and ion impurities that adversely affect the light-emitting properties or electrical insulation. It is also presumed that the reliability of the display device is improved by suppressing migration and aggregation of metals in the electrodes or metal wiring.

[0057] A maleimide resin is a resin having at least two maleimide groups. A maleimide-styrene resin is a resin having a maleimide group and a unit derived from a styrene derivative. A maleimide-triazine resin is a resin having a maleimide group and a unit containing a triazine structure. A maleimide-oxazine resin is a resin having a maleimide group and a unit containing an oxazine structure. These resins are different from polyimide-based resins.

[0058] <(A1y) resin> From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the (A1) weakly acidic group-containing resin preferably contains an (A1y) resin. From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the (A1y) resin preferably contains one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins. The (A1y) resin may be either a single resin or a copolymer thereof.

[0059] The phenol resin is preferably a novolak resin, a resol resin, or a phenol aralkyl resin.The phenol resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic structure, or a heterocyclic structure.

[0060] The polyhydroxystyrene preferably has a unit derived from a (meth)acrylic acid ester derivative containing a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative.

[0061] The phenol group-containing epoxy resin may be, for example, a resin obtained by reacting a polyfunctional epoxy compound with a phenol compound having an epoxy-reactive group, and is preferably a phenol group-containing cardo resin or a phenol group-containing epoxy-modified resin. The phenol group-containing epoxy-modified resin is preferably a phenol group-containing epoxy ester resin. The phenol group-containing cardo resin preferably has a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. The phenol group-containing epoxy resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure.

[0062] Examples of the phenol group-containing acrylic resin include a resin obtained by reacting an acrylic resin described later with a phenol compound having an addition reactive group. Also included are resins obtained by radical copolymerization of a copolymerization component having a phenolic hydroxyl group with other copolymerization components such as a (meth)acrylic acid derivative. The phenol group-containing acrylic resin is a resin different from polyhydroxystyrene. The phenol group-containing acrylic resin preferably has a unit derived from a (meth)acrylic acid ester derivative having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative.

[0063] The condensed polycyclic structure, condensed polycyclic heterocyclic structure, aromatic structure, or heterocyclic structure in these resins is a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0 2,6] A decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, a benzene structure, a bisphenol A structure, a bisphenol F structure, a bisphenol AF structure, an isocyanuric acid structure, or a triazine structure is preferred.

[0064] <(A2x) resin and (A2y) resin> From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the (A2) resin not having a weak acidic group preferably contains a (A2x) resin, and more preferably contains a (A2y) resin. From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the (A2x) resin and / or the (A2y) resin preferably contains one or more resins selected from the group consisting of polycyclic side chain-containing resins, acid-modified epoxy resins, and acrylic resins. The (A2x) resin and the (A2y) resin may be either a single resin or a copolymer thereof.

[0065] From the viewpoint of improving the reliability of the light-emitting device, the polycyclic side chain-containing resin is preferably a cardo-based resin having a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. From the viewpoint of improving the reliability of the light-emitting device, the acid-modified epoxy resin is preferably an epoxy (meth)acrylate resin having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure. From the viewpoint of improving the reliability of the light-emitting device, the acrylic resin preferably has a unit derived from a (meth)acrylic acid ester derivative containing a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative. It is also preferable to have a unit derived from a (meth)acrylic acid ester derivative having an epoxy group. The condensed polycyclic structure, the condensed polycyclic heterocyclic structure, or the aromatic structure in these resins is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0 2,6 ] A decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, or a benzene structure is preferred.

[0066] The total content ratio of the (A1x) resins in the total 100% by mass of the (A) binder resins is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, and particularly preferably 70% by mass or more, from the viewpoint of improving the sensitivity during exposure, reducing the taper of the pattern shape, and improving the reliability of the light-emitting element. On the other hand, the total content ratio of the (A1x) resins is preferably 100% by mass or less, more preferably 90% by mass or less, and even more preferably 80% by mass or less, from the viewpoint of suppressing the residue after development. Also, the total content ratio of the (A1y) resins is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, from the viewpoint of improving the sensitivity during exposure, reducing the residue after development, and reducing the taper of the pattern shape. On the other hand, the total content ratio of the (A1y) resins is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, from the viewpoint of improving the reliability of the light-emitting element. From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, and reducing the taper of the pattern shape, the total content of the (A2x) resin and the (A2x) resin is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting device, the total content of the (A2x) resin and the (A2y) resin is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less.

[0067] The content ratio of the (A) binder resin in the total solid content of the photosensitive composition of the present invention is preferably 10% by mass or more from the viewpoint of improving the properties of each resin. On the other hand, the content ratio of the (A) binder resin is preferably 75% by mass or less from the viewpoint of improving the properties of each resin. The total solid content of the composition refers to the total mass of all components in the composition except the solvent. The solid content concentration can be calculated by heating 1 g of the composition at 150°C for 30 minutes to evaporate and dry, measuring the mass remaining after heating, and calculating the solid content concentration from the mass before and after heating.

[0068] <(B) Radical Polymerizable Compound> The photosensitive composition of the present invention preferably further contains (B) a radical polymerizable compound (hereinafter, "(B) compound") and / or (F) a crosslinking agent. The (B) compound refers to a compound having a radical polymerizable group. Examples and preferred descriptions regarding the radical polymerizable group are as described in the above (A) binder resin. The radical polymerizable group is preferably a (meth)acryloyl group from the viewpoints of promoting radical polymerization, improving sensitivity during exposure, and improving the reliability of the light-emitting element. The number of radical polymerizable groups possessed by the (B) compound is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more, from the viewpoints of improving sensitivity during exposure and improving the reliability of the light-emitting element. On the other hand, the number of radical polymerizable groups is preferably 12 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 6 or less, from the viewpoint of improving the reliability of the light-emitting element.

[0069] When the photosensitive composition of the present invention contains the binder resin (A) and the compound (B), the content of the binder resin (A) is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and even more preferably 45 parts by mass or more, when the total of the binder resin (A) and the compound (B) is 100 parts by mass, from the viewpoint of reducing the taper of the pattern shape and improving the reliability of the light-emitting element. On the other hand, the content of the binder resin (A) is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and even more preferably 75 parts by mass or less, from the viewpoint of improving the sensitivity during exposure and suppressing the residue after development. In addition, the content of the compound (B) is preferably 15 parts by mass or more, when the total of the binder resin (A) and the compound (B) is 100 parts by mass, from the viewpoint of improving the above-mentioned characteristics. On the other hand, the content of the compound (B) is preferably 75 parts by mass or less, from the viewpoint of improving the above-mentioned characteristics.

[0070] <(C) Photosensitizer> The photosensitive composition of the present invention contains (C) a photosensitizer. The (C) photosensitizer refers to a compound that imparts positive or negative photosensitivity to the composition by generating another compound through bond cleavage, reaction, or structural change upon exposure to light. Examples of the (C) photosensitizer include (C1) naphthoquinone diazide compound (hereinafter, "(C1) compound"), (C2) photopolymerization initiator (hereinafter, "(C2) compound"), (C3) photoacid generator (hereinafter, "(C3) compound"), and (C4) photobase generator (hereinafter, "(C4) compound"). When imparting positive photosensitivity to the composition, it is preferable to contain (C1) compound and / or (C3) compound, and it is also preferable to further contain (C2) compound or (C4) compound.

[0071] When negative photosensitivity is imparted to the composition, it is preferable that the composition contains the compound (C2) and / or the compound (C3), and it is also preferable that the composition contains the compound (C1) or the compound (C4).

[0072] The photosensitive composition of the present invention contains a photosensitizer (C), and the photosensitizer (C) contains a naphthoquinone diazide compound (C1). Therefore, the photosensitive resin composition of the present invention is excellent in improving sensitivity during exposure and suppressing residues after development. From the same viewpoint, it is preferable that the photosensitive resin composition contains a naphthoquinone diazide compound (C1) and further contains a photoacid generator (C3) and / or a photobase generator (C4).

[0073] The content of the (C) photosensitizer is preferably 1.0 part by mass or more from the viewpoint of improving sensitivity during exposure, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass, while the content of the (C) photosensitizer is preferably 30 parts by mass or less from the viewpoint of suppressing residues after development.

[0074] <(C1) Naphthoquinone diazide compounds> The (C1) compound refers to a compound that undergoes a structural change upon exposure to generate an indene carboxylic acid and / or a sulfoindene carboxylic acid. The inclusion of the (C1) compound is suitable for forming a positive pattern. During exposure, the exposed portion of the film of the composition is selectively solubilized in an alkaline developer by the acidic compound resulting from the structural change of the (C1) compound, resulting in a significant effect of improving the resolution after development.

[0075] The (C1) compound is preferably a 1,2-naphthoquinone diazide-5-sulfonic acid ester (hereinafter, "5-ester") or a 1,2-naphthoquinone diazide-4-sulfonic acid ester (hereinafter, "4-ester") of a compound having a phenolic hydroxyl group. The (C1) compound preferably contains a 5-ester from the viewpoint of improving the resolution after development, and preferably contains a 4-ester from the viewpoint of improving the sensitivity during exposure. The (C1) compound more preferably contains a 5-ester or a 4-ester from the viewpoints of improving the sensitivity during exposure, suppressing residues after development, and improving the resolution after development.

[0076] The total content ratio of 5-ester groups and 4-ester groups in the total number of moles of phenolic hydroxyl groups, 1,2-naphthoquinone diazide-5-sulfonic acid ester groups (hereinafter, "5-ester groups"), and 1,2-naphthoquinone diazide-4-sulfonic acid ester groups (hereinafter, "4-ester groups") in the (C1) compound (hereinafter, "esterification rate") is preferably 50 mol% or more, more preferably 55 mol% or more, and even more preferably 60 mol% or more, from the viewpoint of improving the resolution after development. On the other hand, the esterification rate is preferably 100 mol% or less, more preferably 90 mol% or less, even more preferably 80 mol% or less, and particularly preferably 70 mol% or less, from the viewpoint of improving the sensitivity during exposure. It is also preferable to mix two or more (C1) compounds having different esterification rates to obtain the above esterification rate.

[0077] The total content ratio of the compound having one 5-ester group or 4-ester group in the molecule and the compound having two 5-ester groups or 4-ester groups in the molecule (hereinafter, "low ester substitution ratio") in the total 100 mol% of the (C1) compound is preferably 60 mol% or more, more preferably 70 mol% or more, and even more preferably 80 mol% or more from the viewpoint of improving the sensitivity during exposure. On the other hand, the low ester substitution ratio is preferably 100 mol% or less, more preferably 95 mol% or less, and even more preferably 90 mol% or less from the viewpoint of improving the resolution after development.

[0078] From the viewpoint of improving sensitivity during exposure, the low ester substitution ratio in the total 100 mol% of the (C1) compound is preferably 0 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more. On the other hand, from the viewpoint of suppressing residues after development, the low ester substitution ratio is preferably less than 60 mol%, more preferably 50 mol% or less, and even more preferably 40 mol% or less.

[0079] Examples of the method for producing the compound (C1) include a method of esterifying a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid, and a method of esterifying a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid chloride. The naphthoquinone diazide sulfonic acid chloride is preferably 1,2-naphthoquinone diazide-5-sulfonic acid chloride or 1,2-naphthoquinone diazide-4-sulfonic acid chloride.

[0080] <(C2) Photopolymerization initiator> The (C2) compound refers to a compound that generates radicals by bond cleavage and / or reaction upon exposure. The inclusion of the (C2) compound is suitable for forming a negative pattern. Even if the amount of radicals generated from the (C2) compound during exposure is small, the radical polymerization of the (B) compound and the like proceeds in a chain reaction, resulting in a significant effect of improving the sensitivity during exposure.

[0081] The (C2) compound is preferably a benzyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, a biimidazole compound, a phosphine oxide compound, an oxime ester compound, an acridine compound, a titanocene compound, a benzophenone compound, an acetophenone compound, an aromatic ketoester compound, or a benzoic acid ester compound, and from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element, an α-hydroxyketone compound, an α-aminoketone compound, a biimidazole compound, a phosphine oxide compound, or an oxime ester compound is more preferable, and an oxime ester compound is even more preferable.

[0082] The above-mentioned α-hydroxyketone compounds, α-aminoketone compounds, biimidazole compounds, phosphine oxide compounds, and oxime ester compounds have the effect of improving the degree of crosslinking of the cured product and promoting the ring-closing reaction of the resin due to the generation of radicals when heated and the interaction of the hydroxy group, amino group, imidazole structure, phosphine oxide structure, or oxime ester structure, and therefore have a significant effect of improving the reliability of the light-emitting element.

[0083] <(C3) Photoacid generator> The (C3) compound refers to a compound that generates an acid by bond cleavage and / or reaction upon exposure. The inclusion of the (C3) compound is suitable for negative pattern formation from the viewpoint of promoting cationic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by an acid-dissociable group, it is suitable for positive pattern formation from the viewpoint of liberating the acidic group upon exposure, and the effect of improving the sensitivity upon exposure is remarkable.

[0084] The (C3) compound may be, for example, an ionic compound or a non-ionic compound. The ionic compound is preferably a triorganosulfonium salt compound. The non-ionic compound is preferably a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonate compound, a carboxylate compound, a sulfonimide compound, a phosphoric acid ester compound, or a sulfonebenzotriazole compound.

[0085] <(C4) Photobase Generator> The (C4) compound refers to a compound that generates a base by bond cleavage and / or reaction upon exposure. The inclusion of the (C4) compound is suitable for negative pattern formation from the viewpoint of promoting anionic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by a base dissociable group, it is suitable for positive pattern formation from the viewpoint of liberating the acidic group upon exposure, and the effect of improving the sensitivity upon exposure is remarkable.

[0086] Examples of the (C4) compound include ionic compounds and nonionic compounds. The ionic compound is preferably a diazabicycloalkene salt compound, a triazabicycloalkene salt compound, an α-keto quaternary ammonium salt compound, a benzyl quaternary ammonium salt compound, a guanidine salt compound, or a biguanide salt compound. The ionic compound is preferably a ketoprofen structure, an oxoxanthene structure, a benzofuran structure, or a naphthalene structure. The nonionic compound is preferably a nitrobenzyl carbamate compound, an anthracenyl carbamate compound, a benzoin carbamate compound, an anthraquinone carbamate compound, a hydroxycinnamamide compound, or a coumarinamide compound.

[0087] <(D) Coloring agent> The photosensitive composition of the present invention preferably further contains a (D) colorant. The (D) colorant refers to a compound that absorbs light of a visible light wavelength (380 to 780 nm) to color the composition. The (D) colorant is preferably a pigment or a dye. From the viewpoint of suppressing external light reflection, the (D) colorant preferably contains a black agent or a mixture of two or more colorants. The black agent preferably contains an organic black pigment and / or an inorganic black pigment. The black color in the (D) colorant is as described in paragraphs

[0284] to

[0285] of International Publication No. 2019 / 087985.

[0088] From the viewpoints of suppressing external light reflection and improving the reliability of the device, the content ratio of the (D) colorant in the total solid content of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, and still more preferably 20% by mass or more. On the other hand, from the viewpoints of improving the sensitivity during exposure and suppressing residues after development, the content ratio of the (D) colorant is preferably 70% by mass or less, and more preferably 50% by mass or less.

[0089] From the viewpoints of suppressing residues after development, reducing the taper of the pattern shape, and improving the reliability of the light-emitting element, the organic black pigment preferably contains one or more selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, and azomethine-based black pigments. Further, from the viewpoint of improving the sensitivity during exposure, it is more preferable to contain a benzofuranone-based black pigment. The organic black pigment is also preferably an anthraquinone-based black pigment, aniline-based black pigment, azo-based black pigment, or carbon black. Carbon black is preferably surface-modified with a resin coating, dye coating, oxidation treatment, an organic group having an ionic group, or a sulfonic acid group.

[0090] From the viewpoints of suppressing residues after development and reducing the taper of the pattern shape, the two-color or more colorant mixture preferably contains a two-color or more colored pigment mixture and / or a two-color or more colored dye mixture. The two colors or more include blue and / or purple, and include red and orange. The colored pigment is more preferably an anthraquinone-based pigment, diketopyrrolopyrrole-based pigment, perylene-based pigment, isoindoline-based pigment, isoindolinone-based pigment, imidazolone-based pigment, quinacridone-based pigment, pyranthrone-based pigment, phthalocyanine-based pigment, indanthrone-based pigment, or dioxazine-based pigment, and the colored dye is more preferably a squarylium-based dye, xanthene-based dye, triarylmethane-based dye, or phthalocyanine-based dye.

[0091] From the viewpoints of suppressing residues after development and reducing the taper of the pattern shape, the inorganic black pigment contains one or more types selected from the group consisting of nitrides containing a metal element, carbides containing a metal element, and oxynitrides containing a metal element, and the metal element is preferably one or more types selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum, and more preferably contains one or more types selected from the group consisting of nitrides, carbides, and oxynitrides of zirconium, vanadium, niobium, hafnium, or tantalum, and furthermore from the viewpoint of improving sensitivity during exposure, it is even more preferable for the inorganic black pigment to contain one or more types selected from the group consisting of zirconium nitrides, zirconium carbides, and zirconium oxynitrides.

[0092] <(E) Dispersant> The photosensitive composition of the present invention preferably further contains a dispersant (E). The dispersant (E) refers to a compound having a structure that interacts with the pigment surface and a structure that inhibits the approach of pigments to each other. From the viewpoint of improving the dispersion stability of the pigment, the dispersant (E) preferably has a basic group, an acidic group, or a salt structure thereof, and more preferably has a basic group or a salt structure thereof.

[0093] <(F) Crosslinking agent> The photosensitive composition of the present invention preferably further contains a (B) compound and / or a (F) crosslinking agent. The (F) crosslinking agent refers to a compound having a crosslinkable group, a cationic polymerizable group, or an anionic polymerizable group capable of reacting with a resin or the like. From the viewpoint of improving the sensitivity during exposure and the reliability of the light-emitting element, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group (hereinafter, "specific crosslinkable group"). The alkoxyalkyl group is preferably an alkoxymethyl group or an alkoxyethyl group, and more preferably a methoxymethyl group or a methoxyethyl group. The hydroxyalkyl group is preferably a methylol group or an ethylol group. From the viewpoint of improving the sensitivity during exposure and the reliability of the light-emitting element, the number of specific crosslinkable groups possessed by the (F) crosslinking agent is preferably 2 or more, more preferably 3 or more, even more preferably 4 or more, and particularly preferably 6 or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the number of specific crosslinkable groups is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less.

[0094] The content of the (F) crosslinking agent is preferably 1.0 part by mass or more from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting device, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass, whereas the content of the (F) crosslinking agent is preferably 30 parts by mass or less from the viewpoint of suppressing residues after development and improving the reliability of the light-emitting device.

[0095] From the viewpoint of suppressing residues after development and improving the reliability of the light-emitting device, it is preferable that the (F) crosslinking agent contains a (F1) compound: a compound having at least two phenolic hydroxyl groups and at least two specific crosslinkable groups and / or a (F2) compound: a compound having a structure containing a heterocyclic structure and at least two specific crosslinkable groups. The preferred contents of these (F) crosslinking agents are the same as those described above.

[0096] From the viewpoint of improving the reliability of the light-emitting device, the compound (F1) preferably has at least two structures in which a phenolic hydroxyl group and a specific crosslinkable group are bonded to one aromatic structure, and more preferably has at least two structures in which a phenolic hydroxyl group and at least two specific crosslinkable groups are bonded to one aromatic structure. From the viewpoint of improving the reliability of the light-emitting device, the heterocyclic structure in the compound (F2) is preferably a nitrogen-containing cyclic structure, more preferably a cyclic structure having at least two nitrogen atoms, and even more preferably an isocyanuric acid structure, a triazine structure, a glycoluril structure, an imidazolidone structure, a pyrazole structure, an imidazole structure, a triazole structure, a tetrazole structure, or a purine structure. The number of nitrogen atoms in the heterocyclic structure in the compound (F2) is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more. On the other hand, the number of nitrogen atoms is preferably 6 or less, more preferably 4 or less.

[0097] <(G) Inorganic particles> From the viewpoint of improving the reliability and luminance of the light-emitting device, the photosensitive composition of the present invention preferably further contains (G) inorganic particles. The photosensitive composition of the present invention may contain (G) inorganic particles in the above-mentioned inorganic particle-containing polysiloxane or may contain (G) inorganic particles added to the photosensitive composition. The photosensitive composition of the present invention preferably contains the above-mentioned inorganic particle-containing polysiloxane and further contains (G) inorganic particles, or it is also preferable that the photosensitive composition does not contain the above-mentioned inorganic particle-containing polysiloxane and further contains (G) inorganic particles. The (G) inorganic particles refer to particles containing an element selected from the group consisting of a metal element, a metalloid element, and a semiconductor element as a main component. The main component refers to a component that is contained in the largest amount based on mass in the constituent components. From the viewpoint of improving the reliability of the light-emitting device, the (G) inorganic particles preferably have a hydroxyl group and / or a silanol group on the particle surface.

[0098] From the viewpoint of improving the reliability and luminance of the light-emitting device, the (G) inorganic particles preferably contain one or more particles selected from the group consisting of silica particles, alumina particles, titania particles, vanadium oxide particles, chromium oxide particles, iron oxide particles, cobalt oxide particles, copper oxide particles, zinc oxide particles, zirconium oxide particles, niobium oxide particles, tin oxide particles, and cerium oxide particles, and from the viewpoint of suppressing external light reflection, the inorganic particles more preferably contain silica particles.

[0099] The above-mentioned silica particles are believed to capture metal impurities and ion impurities that adversely affect electrical insulation due to the acidity and negative charge of the hydroxyl and / or silanol groups on the particle surface. In addition, the robust structure of the particles allows the captured impurities to be retained even after heat treatment or voltage application, which is presumed to improve the reliability of the light-emitting device. In addition, the silica particles unevenly distributed on the surface of the cured product are believed to reduce the reflection and scattering of incident external light. As a result, the effect of optical interference with incident external light is suppressed, resulting in a significant effect of improving luminance.

[0100] The content ratio of the (G) inorganic particles in the total solid content of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, from the viewpoint of improving the reliability and luminance of the light-emitting element. On the other hand, the content ratio of the (G) inorganic particles is preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, from the viewpoint of suppressing residues after development. The content ratio of the (G) inorganic particles refers to the sum of the (G) inorganic particles in the above-mentioned inorganic particle-containing polysiloxane and the (G) inorganic particles added to the photosensitive composition.

[0101] <Other additives and solvents> The photosensitive composition of the present invention preferably further contains a thermal color former, an oxidative color former, a dissolution promoter, an ink repellent, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, or a surfactant. These additives may be known. The photosensitive composition of the present invention preferably further contains a solvent. When the photosensitive composition of the present invention contains a pigment and further contains a dispersant, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond from the viewpoint of improving the dispersion stability of the pigment.

[0102] <Content of chlorine element, bromine element, chloride ion, and bromide ion> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, it is preferred that the photosensitive composition of the present invention further contains one or more components selected from the group consisting of a component containing a chlorine element, a component containing a bromine element, a component containing a chloride ion, and a component containing a bromide ion (hereinafter referred to as "specific halogen components") and satisfies the following condition (1): (1) The total content of chlorine and bromine elements in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass, and / or the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0103] The chlorine element-containing component and the bromine element-containing component are preferably alkyl chloride compounds, cycloalkyl chloride compounds, aryl chloride compounds, alkyl bromide compounds, cycloalkyl bromide compounds, or aryl bromide compounds. The chloride ion-containing component and the bromide ion-containing component preferably contain ammonium ions, primary ammonium ions, secondary ammonium ions, tertiary ammonium ions, or quaternary ammonium ions as cationic species. The quaternary ammonium ions are preferably specific quaternary ammonium ions described below, and more preferably satisfy the condition (6) described below.

[0104] The total content of chlorine and bromine elements in the total solid content of the photosensitive composition, and the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition are preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting element, and improving luminance. On the other hand, the total content of chlorine and bromine elements, and the total content of chloride ions and bromide ions are preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, improving reliability of the light-emitting element, and improving luminance. Furthermore, it is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0105] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, it is preferable that the photosensitive composition of the present invention further satisfies the following condition (2). (2) The total content of chlorine and bromine elements in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass, and the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0106] When the above condition (2) is satisfied, it is preferable that the photosensitive composition of the present invention contains a component containing a chlorine element and / or a component containing a bromine element, and further contains a component containing a chloride ion and / or a component containing a bromide ion.

[0107] By including a trace amount of the specific halogen component in the photosensitive composition, protons are activated by these anions or anions derived from these components, and the effect of improving sensitivity during exposure and suppressing residue after development is remarkable due to the dissolution promotion action in the developer and the prevention of residue adhesion at the opening. Furthermore, it is estimated that the reliability of the light-emitting device is improved by suppressing metal migration and aggregation by controlling the polarization structure and charge balance in the cured product. In addition, it is estimated that the luminance of light is improved by controlling the conductivity by surface modification of the wiring surface. It is also considered that the polar group of the resin in the photosensitive composition is stabilized by interaction with the specific halogen component. In particular, when polysiloxane is included in the photosensitive composition, it is suitable for stabilizing the silanol group in the polysiloxane. In addition, it is considered that the polarization structure and charge balance in the photosensitive composition are controlled by interaction with the resin in the photosensitive composition via the unshared electron pair or the 3d orbital, which is an empty atomic orbital. As a result, the effect of improving storage stability is remarkable.

[0108] <Fluorine content> From the viewpoints of suppressing residues after development, improving the reliability of the light-emitting device, and improving the luminance of the light-emitting device, the photosensitive composition of the present invention preferably satisfies the following condition (1a). It is more preferable that the photosensitive composition of the present invention further satisfies the following condition (2a). (1a) The content of fluorine element in the total solid content of the photosensitive composition is 1,000 ppm by mass or less. (2a) The fluoride ion content of the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

[0109] From the viewpoint of the above-mentioned effects of the invention, the content of fluorine element in the total solid content of the photosensitive composition is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, even more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the above-mentioned effects of the invention, the content of fluorine element is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. Furthermore, the content of fluorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0110] The preferred range of the content of fluoride ions in the total solid content of the photosensitive composition is the same as the preferred range of the content of elemental fluorine in the total solid content of the photosensitive composition described above.

[0111] The content of elemental fluorine in the total solid content of the photosensitive composition may be 0 ppm by mass. The content of fluoride ions in the total solid content of the photosensitive composition may also be 0 ppm by mass. When the content of elemental fluorine and / or the content of fluoride ions in the total solid content of the photosensitive composition exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably contains a fluorine atom or a fluoride ion in the structure of the (A) binder resin, the (C) photosensitizer, the (B) compound, or the (F) crosslinking agent, or further contains a component containing elemental fluorine and / or a component containing fluoride ions.

[0112] The component containing elemental fluorine is preferably a phenol compound, an alkyl fluoride compound, a cycloalkyl fluoride compound, or an aryl fluoride compound having a substituent containing an alkyl fluoride group. The component containing fluoride ions preferably contains an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cationic species. The quaternary ammonium ion preferably has a linear or branched hydrocarbon group. The hydrocarbon group is preferably an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms.

[0113] By making the content of compounds containing fluorine atoms in the structure or components containing fluorine elements in the photosensitive composition below a specific value, the content of fluorine elements, fluoride ions, or anions containing fluorine elements derived from these components is below a specific value, so that it is presumed that protons in the photosensitive composition are locally activated by interactions such as hydrogen bonds between the components in the photosensitive composition. Therefore, it is considered that the effect of suppressing residues after development becomes significant due to the dissolution promotion action in the developer. In addition, it is considered that the polarization structure and charge balance in the cured product are controlled by intentionally making the content of the above components below a specific value. As a result, it is presumed that the reliability and luminous brightness of the light-emitting element are improved by suppressing ion migration and electromigration caused by metal impurities and ion impurities that adversely affect the light-emitting properties or electrical insulation. It is also presumed that the reliability of the display device is improved by suppressing migration and aggregation of metals in the electrodes or metal wiring.

[0114] <Water content> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving the reliability of the light-emitting device, it is preferred that the photosensitive composition of the present invention further contains water and satisfies the following condition (3): (3) The content of water in the photosensitive composition is 0.010 to 3.0% by mass.

[0115] The content of water in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, even more preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving reliability of the light-emitting element. On the other hand, the content of water is preferably 2.5% by mass or less, more preferably 2.2% by mass or less, and even more preferably 2.0% by mass or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving reliability of the light-emitting element. Furthermore, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.2% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0116] By setting the content of water in the photosensitive composition within the above range, the protons are activated by the improved stability of the anions in the photosensitive composition due to the hydrogen bonds of the water molecules, and the effect of improving the sensitivity during exposure and suppressing the residue after development is remarkable due to the dissolution promotion action in the developer and the prevention of residue adhesion at the opening. In addition, it is considered that the polar group of the resin in the photosensitive composition is stabilized by the dipole moment of the water molecules, hydrogen bonds, and other interactions. In particular, when the photosensitive composition contains polysiloxane, it is suitable for stabilizing the silanol group in the polysiloxane. As a result, the effect of improving storage stability is remarkable. Furthermore, the above water captures metal impurities and ion impurities that have an adverse effect on electrical insulation due to the dipole moment of the water molecules, hydrogen bonds, and other interactions, so that ion migration and electromigration are suppressed, and it is presumed that the reliability of the light-emitting element is improved.

[0117] <Content of specific anions and specific phosphorus compounds> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, the photosensitive composition of the present invention preferably contains one or more anions selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions (hereinafter referred to as "specific anions") and satisfies the following condition (4); and / or contains one or more anions selected from the group consisting of phosphoric acid esters, phosphonic acid, phosphonic acid esters, phosphorous acid esters, phosphinic acid, and hypophosphite esters (hereinafter referred to as "specific phosphorus compounds") and satisfies the following condition (5).

[0118] (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0119] (5) The total content of phosphoric acid ester, phosphonic acid, phosphonic acid ester, phosphorous acid ester, phosphinic acid, and hypophosphite ester in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0120] When the above condition (4) is satisfied, the photosensitive composition of the present invention preferably contains a component containing a specific anion. The component containing a specific anion preferably contains an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cationic species. The quaternary ammonium ion is preferably a specific quaternary ammonium ion described later, and more preferably satisfies the condition (6) described later.

[0121] The specific phosphorus compound is preferably a compound having a substituent containing a carbon element and an acidic group containing a phosphorus element. The substituent containing a carbon element is preferably a mono- or divalent aliphatic group having 1 to 18 carbon atoms, a mono- or divalent alicyclic group having 4 to 18 carbon atoms, a mono- or divalent aromatic group having 6 to 15 carbon atoms, a mono- or divalent fluorine-containing aliphatic group having 1 to 18 carbon atoms, a mono- or divalent fluorine-containing alicyclic group having 4 to 18 carbon atoms, or a mono- or divalent fluorine-containing aromatic group having 6 to 15 carbon atoms. The specific phosphorus compound is preferably a phosphoric acid monoester, a phosphoric acid diester, a phosphonic acid, a phosphonic acid monoester, a phosphorous acid monoester, a phosphorous acid diester, a phosphinic acid, or a hypophosphite monoester.

[0122] The total content of the specific anion in the total solid content of the photosensitive composition and the total content of the specific phosphorus compound in the total solid content of the photosensitive composition are preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving the luminance. On the other hand, the total content of the specific anion and the total content of the specific phosphorus compound are preferably 25,000 mass ppm or less, more preferably 20,000 mass ppm or less, and even more preferably 15,000 mass ppm or less, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving the luminance. Further, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, even more preferably 7,000 mass ppm or less, even more preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, and most preferably 1,000 mass ppm or less. Furthermore, from the viewpoint of improving the above-mentioned characteristics, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less. Further, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0123] By containing a trace amount of the specific anion or the specific phosphorus compound in the photosensitive composition, the effect of improving the sensitivity during exposure and suppressing the residue after development is remarkable due to the dissolution promotion action in the developer and the prevention of residue adhesion at the opening. In addition, the effect of improving storage stability is remarkable due to the stabilization of the polar group of the resin in the photosensitive composition and the control of the polarization structure and charge balance in the photosensitive composition. Furthermore, it is estimated that the reliability of the light-emitting element is improved by suppressing metal migration and aggregation by controlling the polarization structure and charge balance in the cured product. In addition, it is estimated that the luminance is improved by controlling the conductivity by surface modification of the wiring surface.

[0124] <Content of tertiary amine compounds and quaternary ammonium ions> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, improving reliability of the light-emitting device, and improving luminance, it is preferred that the photosensitive composition of the present invention further contains a tertiary amine compound and / or a quaternary ammonium ion and satisfies the following condition (6): (6) The total content of a tertiary amine compound and a quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 ppm by mass.

[0125] When the photosensitive composition of the present invention satisfies the above condition (6) and contains a quaternary ammonium ion, it is preferable that the photosensitive composition of the present invention contains a component containing a quaternary ammonium ion. The component containing a quaternary ammonium ion preferably contains an anion species. The anion species is preferably the above chloride ion, the above bromide ion, or the above specific anion, and more preferably satisfies the above condition (1), condition (2), or condition (4).

[0126] The tertiary amine compound preferably contains a compound represented by general formula (18) (hereinafter, "specific tertiary amine compound"), and the quaternary ammonium ion preferably contains a compound represented by general formula (19) (hereinafter, "specific quaternary ammonium ion").

[0127] [ka]

[0128] In the general formula (18) and the general formula (19), R 31 ~R 37 each independently represents an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. 31 ~R 37 are each independently preferably an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0129] The total content of the tertiary amine compound and the quaternary ammonium ion in the total solid content of the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving the luminance. On the other hand, the total content of the tertiary amine compound and the quaternary ammonium ion is preferably 30,000 mass ppm or less, more preferably 25,000 mass ppm or less, even more preferably 20,000 mass ppm or less, and particularly preferably 15,000 mass ppm or less, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, improving the reliability of the light-emitting element, and improving the luminance. Further, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, even more preferably 7,000 mass ppm or less, even more preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, and most preferably 1,000 mass ppm or less. Furthermore, from the viewpoint of improving the above-mentioned characteristics, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less. Further, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0130] By containing a small amount of the above-mentioned tertiary amine compound or the above-mentioned quaternary ammonium ion in the photosensitive composition, the effect of improving the sensitivity during exposure and suppressing the residue after development is remarkable due to the dissolution promotion action in the developer and the prevention of the adhesion of residue at the opening. In addition, the effect of improving storage stability is remarkable due to the stabilization of the polar group of the resin in the photosensitive composition and the control of the polarization structure and charge balance in the photosensitive composition. Furthermore, it is estimated that the reliability of the light-emitting element is improved by the suppression of metal migration and aggregation by the control of the polarization structure and charge balance in the cured product. In addition, it is estimated that the luminescence brightness is improved by the control of the conductivity by the surface modification of the wiring surface.

[0131] <Methanol and ethanol content> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance, the photosensitive composition of the present invention further contains methanol and / or ethanol and satisfies the following condition (7). (7) The total content of methanol and ethanol in the photosensitive composition is 0.0010 to 30,000 ppm by mass.

[0132] The total content of methanol and ethanol in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. On the other hand, the total content of methanol and ethanol is preferably 25,000 mass ppm or less, more preferably 20,000 mass ppm or less, and even more preferably 15,000 mass ppm or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. Further, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, even more preferably 7,000 mass ppm or less, even more preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, and most preferably 1,000 mass ppm or less. Furthermore, from the viewpoint of improving the above-mentioned characteristics, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less. Further, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0133] By adding a small amount of the above-mentioned methanol or ethanol to the photosensitive composition, the hydrophilicity of the compound promotes dissolution in the developer, which significantly improves the sensitivity during exposure and reduces residues after development. In addition, the compound modifies the surface of the substrate, preventing adhesion of residues at the openings, which significantly reduces residues after development.

[0134] In addition, it is believed that intentionally containing a small amount of the above compound stabilizes the polar group of the resin in the photosensitive composition by the interaction through hydrogen bonds caused by the hydroxyl group in the compound. In particular, when the photosensitive composition contains polysiloxane, it is suitable for stabilizing the silanol group in the polysiloxane. In addition, it is believed that the hydroxyl group in the compound controls the polarization structure and charge balance in the photosensitive composition. As a result, the effect of improving storage stability is remarkable. Furthermore, when a pattern of the photosensitive composition is formed on wiring such as metal, it is presumed that the above compound in the photosensitive composition modifies the surface of the wiring that becomes an opening or the wiring surface that contacts the pattern by the compound. It is also believed that the hydroxyl group in the compound contained in the cured product captures a small amount of metal impurities and ion impurities in the cured product, and these impurities migrate to the wiring surface, thereby acting as a carrier in the wiring. As a result, it is presumed that the conductivity of the wiring such as metal is controlled, and low voltage driving is possible, thereby improving the luminance.

[0135] <Content of first specific compound (alcohol compound, ester compound, and ether compound)> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance, it is preferred that the photosensitive composition of the present invention further contains one or more compounds selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether (hereinafter referred to as the "first specific compound") and satisfies the following condition (8). (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 mass ppm.

[0136] From the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving the storage stability, and improving the emission luminance, the total content of the first specific compound in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, still more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving the storage stability, and improving the emission luminance, the total content of the first specific compound is preferably 25,000 mass ppm or less, more preferably 20,000 mass ppm or less, further preferably 15,000 mass ppm or less. Further, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, further preferably 7,000 mass ppm or less, still more preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, and most preferably 1,000 mass ppm or less. Further, from the viewpoints of improving the above characteristics, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, further preferably 100 mass ppm or less. Further, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, still more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0137] Similarly, by incorporating a trace amount of the first specific compound in the photosensitive composition, the effect of improving sensitivity during exposure and suppressing residue after development is remarkable due to the dissolution promotion action in the developer and the prevention of residue adhesion at the opening. In addition, the effect of improving storage stability is remarkable due to the stabilization of the polar group of the resin in the photosensitive composition and the control of the polarization structure and charge balance in the photosensitive composition. Furthermore, it is presumed that the luminescence brightness is improved by the surface modification of the wiring surface and the control of conductivity by the transition of metal impurities and ion impurities to the wiring surface.

[0138] <Content of second specific compounds (alcohol compounds, ester compounds, and ether compounds)> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance, it is preferred that the photosensitive composition of the present invention further contains one or more compounds selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether (hereinafter referred to as the "second specific compound") and satisfies the following condition (9). (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0139] The total content of the second specific compound in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, and improving the luminance. On the other hand, the total content of the second specific compound is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, and improving the luminance. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0140] By incorporating a trace amount of the above-mentioned second specific compound in the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance are significant, similar to those of the first specific compound.

[0141] <Specific ketone compounds> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance, it is preferred that the photosensitive composition of the present invention further contains 4-methyl-3-penten-2-one and / or 4-methyl-4-penten-2-one (hereinafter referred to as "specific ketone compounds") and satisfies the following condition (10). (10) The total content of 4-methyl-3-penten-2-one and 4-methyl-4-penten-2-one in the photosensitive composition is 0.010 to 10.0 mass %.

[0142] The total content of the specific ketone compounds in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, even more preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. On the other hand, the total content of the specific ketone compounds is preferably 7.0% by mass or less, more preferably 5.0% by mass or less, even more preferably 3.0% by mass or less, even more preferably 2.5% by mass or less, particularly preferably 2.2% by mass or less, and most preferably 2.0% by mass or less, from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving storage stability, and improving luminance. Furthermore, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.2% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0143] By incorporating a trace amount of the above-mentioned specific ketone compound in the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance can be significantly achieved, similar to the first specific compound.

[0144] <Specific heterocyclic compounds> From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance, it is preferred that the photosensitive composition of the present invention further contains one or more compounds selected from the group consisting of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran (hereinafter, "specific heterocyclic compounds") and satisfies the following condition (11). (11) The total content of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

[0145] The total content of the specific heterocyclic compounds in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, and improving the luminance. On the other hand, the total content of the second specific compound is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and even more preferably 100 mass ppm or less, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving storage stability, and improving the luminance. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0146] By incorporating a trace amount of the above-mentioned specific heterocyclic compound in the photosensitive composition, the effects of improving sensitivity during exposure, suppressing residues after development, improving storage stability, and improving luminance can be significantly achieved, similar to the first specific compound.

[0147] <Hydrogen ion exponent of dilute solution> When the photosensitive composition of the present invention is diluted with water to prepare a diluted solution, and the solid content concentration of the diluted solution is 1 / 100 times that of the photosensitive composition, the hydrogen ion exponent of the diluted solution is preferably 5.5 or more, more preferably 5.7 or more, even more preferably 6.0 or more, even more preferably 6.2 or more, and particularly preferably 6.5 or more, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, and improving the storage stability. On the other hand, the hydrogen ion exponent of the diluted solution is preferably 7.0 or less, more preferably 6.9 or less, and even more preferably 6.8 or less, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, and improving the storage stability. When the photosensitive composition of the present invention contains the (A1x-1) resin, the photosensitive composition is diluted with water to prepare a diluted solution, and the solids concentration of the diluted solution is 1 / 100 times that of the photosensitive composition, the hydrogen ion exponent of the diluted solution is preferably 5.5 or more, more preferably 5.7 or more, even more preferably 6.0 or more, even more preferably 6.2 or more, and particularly preferably 6.5 or more, from the viewpoint of the above-mentioned effects of the invention. On the other hand, the hydrogen ion exponent of the diluted solution is preferably 7.0 or less, more preferably 6.9 or less, and even more preferably 6.8 or less, from the viewpoint of the above-mentioned effects of the invention.

[0148] The hydrogen ion exponent of the diluted solution of the photosensitive composition can be measured using a commercially available pH meter. First, the photosensitive composition is diluted with water to prepare a diluted solution so that the solids concentration of the diluted solution is 1 / 100 times that of the solids concentration of the photosensitive composition. Next, the prepared diluted solution is stirred for 10 minutes or more so that the components in the photosensitive composition reach distribution equilibrium. After stirring, the hydrogen ion exponent of the diluted solution is measured using a pH meter. If the diluted solution is separated into an organic layer and an aqueous layer after stirring, the hydrogen ion exponent of the aqueous layer is measured.

[0149] <Photosensitive film of the present invention> The photosensitive film of the present invention is a semi-cured state (B stage) obtained by forming a film from the photosensitive composition of the present invention. The semi-cured state refers to a state in which the film has fluidity even though no crosslinked structure is formed or a crosslinked structure is formed by a partial reaction. For example, the semi-cured state refers to a state in which the coating film is dried under reduced pressure to remove the solvent after being applied to a substrate or the like, or a state in which the coating film is heated to 40 to 150°C and dried, and refers to a state in which the film is soluble in an alkaline solution or an organic solvent. The photosensitive film refers to a film that has positive or negative photosensitivity and can form a free-standing film as a single film. The term "free-standing film as a single film" refers to a film that can be formed without a support and has a width of 1.5 cm or more, a length of 5.0 cm or more, and a thickness of 5.0 μm or more. The photosensitive film is preferably a laminate disposed on a support. The support is preferably a flexible substrate, but may be a rigid substrate.

[0150] <Cured Product of the Photosensitive Composition of the Present Invention> The cured product of the present invention is obtained by curing the photosensitive composition of the present invention. Curing refers to the formation of a crosslinked structure by a reaction and the loss of fluidity of the film, or the state in which it is formed. The reaction is not particularly limited, and may be by heating or by irradiation with energy rays, but is preferably by heating. The state in which a crosslinked structure is formed by heating and the film loses fluidity is called thermal curing. The heating conditions are, for example, heating at 150 to 500°C for 5 to 300 minutes. The cured product of the present invention may be obtained by curing the photosensitive film of the present invention.

[0151] The optical density of the cured product of the present invention at the wavelength of visible light per 1 μm of film thickness is preferably 0.20 or more, more preferably 0.50 or more, and even more preferably 1.0 or more, from the viewpoint of suppressing external light reflection and improving the reliability of the element. On the other hand, the optical density is preferably 3.0 or less, more preferably 2.0 or less, and even more preferably 1.5 or less, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the element. The optical density is preferably the optical density of the cured product obtained by heating and curing the composition. By having the optical density in the above range, the incident external light can be blocked, so that the effect of suppressing external light reflection is remarkable. In addition, the photodegradation of the cured product itself and the layers inside it is suppressed, so that the effect of improving the reliability of the element is remarkable.

[0152] <Elements and articles having the cured product> The element of the present invention comprises the cured product of the present invention. The article of the present invention comprises the cured product of the present invention. Examples of the article include electronic components, electronic devices, mobile objects, buildings, or windows. Examples of the electronic components include semiconductor devices, antennas, display devices, metal-clad laminates, wiring boards, semiconductor packages, active components including semiconductor devices, or passive components. The photosensitive composition of the present invention is preferably used for forming electronic components. Examples of the semiconductor devices include semiconductor devices having a fan-out wafer-level package structure, a fan-out panel-level package structure, or an antenna-in-package structure. Examples of the antenna include a microstrip line antenna or a strip line antenna. Examples of the display devices include an organic EL display, a quantum dot display, a micro LED display, a mini LED display, or a liquid crystal display. Examples of the metal-clad laminate include a printed circuit board.

[0153] The electronic component of the present invention comprises the cured product of the present invention. The display device of the present invention comprises the cured product of the present invention. The display device comprising the cured product of the present invention is excellent in high luminance. Therefore, the photosensitive composition of the present invention is preferably used for forming a pixel dividing layer, a TFT planarization layer, a TFT protection layer, a TFT interlayer insulating layer, or a gate insulating layer in an organic EL display, a quantum dot display, or a micro LED display. The photosensitive composition of the present invention is also preferably used for forming a partition layer or a planarization layer in a micro LED display or a mini LED display. The partition layer is preferably formed between adjacent light emitting elements, and the planarization layer is preferably formed so as to cover at least a part of the light emitting element. The light emitting element is preferably a semiconductor chip. That is, the photosensitive composition of the present invention is particularly preferably used for forming a partition layer formed between adjacent light emitting elements or a planarization layer formed so as to cover at least a part of the light emitting element.

[0154] <Hollow structure> The hollow structure of the present invention comprises the cured product of the present invention. The electronic component of the present invention preferably has the hollow structure of the present invention. The hollow structure of the present invention has a hollow structure support material and a hollow structure roof material. The photosensitive film of the present invention is suitable for forming a hollow structure. Examples of electronic components having a hollow structure include MEMS (Micro Electro Mechanical Systems).

[0155] <Display device> The display device of the present invention will be described below. However, the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the invention without departing from the gist of the invention.

[0156] The display device of the present invention has the above-mentioned configuration

[15] . By adopting the above-mentioned configuration, the display device of the present invention can provide a display device excellent in luminance. It is presumed that by intentionally containing a small amount of the above-mentioned methanol or ethanol in the partition layer and / or the planarizing layer, the hydroxyl group in the compound contained in the cured product captures a small amount of metal impurities or ion impurities in the cured product. It is considered that these impurities migrate to the wiring surface and act as carriers in the wiring. As a result, the conductivity of the metal wiring or the like is controlled, and low-voltage driving is possible, which is considered to have the effect of high luminance.

[0157] <Resins and compounds in the partition layer and the flattening layer> The display device of the present invention includes a partition layer and / or a planarizing layer. The partition layer and planarizing layer in the display device of the present invention are preferably a cured product of a photosensitive composition, and more preferably contain a resin. The resin in the partition layer and planarizing layer preferably contains a (XA1) weakly acidic group-containing resin and / or (XA2) a resin not having a weakly acidic group. The (XA1) weakly acidic group-containing resin in the partition layer and planarizing layer is preferably the above (A1) weakly acidic group-containing resin or a resin having a structure derived from the resin. The (XA2) resin not having a weakly acidic group is preferably the above (A2) resin not having a weakly acidic group or a resin having a structure derived from the resin. Examples and preferred descriptions of the resin in the partition layer and planarizing layer are the same as the examples and preferred descriptions of the binder resin (A) above. The resin in the partition layer and planarizing layer may be either the (A) binder resin in the composition or a resin having a structure derived from the resin.

[0158] <Contents of methanol and ethanol in the partition layer and the flattening layer> In the display device of the present invention, the partition layer and / or the planarizing layer contain methanol and / or ethanol. From the viewpoint of improving the luminance of emitted light, the display device of the present invention preferably further satisfies the following conditions (X1a) and / or (X1b). (X1a) The total content of methanol and ethanol in the partition layer is 0.0010 to 30,000 ppm by mass. (X1b) The total content of methanol and ethanol in the flattening layer is 0.0010 to 30,000 ppm by mass.

[0159] The display device of the present invention is preferably a micro LED display or a mini LED display. Since the area of ​​the redistribution layer is larger than the area of ​​the light-emitting element, which is a semiconductor chip, in a plan view, the display device of the present invention has a fan-out wafer-level package structure or a fan-out panel-level package structure. The substrate, the redistribution layer, the interlayer insulating layer of the redistribution layer, the light-emitting element, the semiconductor chip, the partition layer, and the planarization layer may be made of known materials.

[0160] The display device of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view of a micro LED display having a barrier layer and a planarizing layer. The display device 1a comprises a plurality of light emitting elements 2 and a plurality of barrier layers 15 on an opposing substrate 5, a planarizing layer 21 is provided on the light emitting elements 2, and an interlayer insulating layer 3 is provided on the planarizing layer 21. The light emitting elements 2 are preferably semiconductor chips. On the light emitting elements 2 may be on the surface of the light emitting elements 2, or on the upper side of the support substrate or the light emitting elements 2. In the embodiment shown in FIG. 1, the barrier layer 15 is provided between adjacent light emitting elements 2, the planarizing layer 21 is formed so as to cover the light emitting elements 2, and a configuration in which a plurality of interlayer insulating layers 3 are laminated on the planarizing layer 21 is illustrated, but the interlayer insulating layer 3 may be a single layer.

[0161] The light emitting element 2 has a pair of electrode terminals 6 on the surface opposite to the surface in contact with the counter substrate 5, and each electrode terminal 6 is electrically connected to the metal wiring 4 extending in the planarization layer 21 and the interlayer insulating layer 3. If the plurality of metal wirings 4 are covered by the planarization layer 21 or the interlayer insulating layer 3, these layers function as insulating films, and thus the structure maintains electrical insulation. The metal wiring is configured to maintain electrical insulation when the part of the metal wiring that requires electrical insulation is covered by a cured product obtained by curing a composition containing a resin. Furthermore, the light emitting element 2 is electrically connected to the driving element 8 provided on the light emitting element driving substrate 7 provided at a position opposite to the counter substrate 5 through the metal wiring 4 and the metal wiring 4c, so that the light emission of the light emitting element 2 can be controlled. Furthermore, the light emitting element driving substrate 7 is electrically connected to the metal wiring 4 through the solder bump 10. Furthermore, in order to prevent the diffusion of metals such as the metal wiring 4, a barrier metal 9 is provided. The metal wiring 4c may be electrically connected to the driving element 8 by penetrating the light emitting element driving substrate 7. In the display device 1a, the side of the light-emitting element 2 that contacts the counter substrate 5 (the lower side in FIG. 1) is the light extraction side. The micro LED display in FIG. 1 is preferably manufactured in a chip-first (RDL (Redistribution layer)-last) structure in which the light-emitting element 2, which is a semiconductor chip, is arranged on a support substrate or the like, and then the metal wiring 4 and the interlayer insulating layer 3 are formed. Thereafter, the light-emitting element drive substrate is preferably bonded, and then the support substrate and the like are peeled off, and then the counter substrate 5 is attached.

[0162] Fig. 2 is a schematic cross-sectional view of another type of micro LED display having a partition layer and a planarizing layer. The side of the light emitting element 2 in the display device 1b that contacts the counter substrate 5 (upper side in Fig. 2) is the light extraction side. The micro LED display in Fig. 2 is preferably manufactured in an RDL-first (Chip-last) structure in which metal wiring 4 and an interlayer insulating layer 3 are formed on a support substrate, and then the light emitting element 2, which is a semiconductor chip, is arranged. Then, after the support substrate, etc. are peeled off, the counter substrate 5 is attached, and then the light emitting element driving substrate 7 is preferably joined.

[0163] The light emitting element 2 is preferably a PN junction diode in which a P-type semiconductor and an N-type semiconductor are joined. The light emitting element 2 preferably has a side length of 5 to 700 μm, more preferably 5 to 100 μm. The interlayer insulating layer 3, the partition layer 15, and the planarizing layer 21 are preferably a cured product of a patterned photosensitive composition. A configuration in which the thickness of the planarizing layer 21 is greater than the thickness of the partition layer 15 is also preferred. A configuration in which the planarizing layer 21 covers a part of the surface of the partition layer 15 opposite to the surface that contacts the opposing substrate 5 is also preferred, and a configuration in which the planarizing layer 21 covers the entire surface of the partition layer 15 opposite to the surface that contacts the opposing substrate 5 is more preferred. From the viewpoint of improving mechanical properties, the interlayer insulating layer 3 more preferably contains the above-mentioned polyimide-based resin. By containing the above-mentioned polyimide-based resin, warping of the wafer or substrate is suppressed, and the effect of improving the accuracy and yield of the exposure process and the wafer or substrate transport process is remarkable. From the viewpoint of improving the luminance of emitted light, the partition layer 15 and the planarizing layer 21 are preferably the cured product of the present invention. From the viewpoint of improving the reliability of the light-emitting device and the luminance of emitted light, the partition layer 15 preferably contains the above-mentioned (G) inorganic particles. From the viewpoint of improving the reliability of the light-emitting device and the suppression of external light reflection, the partition layer 15 preferably contains the above-mentioned (D) colorant. The meanings of the remaining symbols in Fig. 2 are as in Fig. 1.

[0164] <Method of manufacturing the cured product> The method for producing the cured product of the present invention includes (1) a step of forming a coating film of the photosensitive composition of the present invention on a substrate, (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask, (3) a step of developing the coating film using a developer to form a pattern of the photosensitive composition, and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition. In these steps, each method described in paragraphs

[0453] to

[0481] of International Publication No. 2019 / 087985 may be applied. The step of forming a coating film is preferably performed by applying the coating film and then pre-baking the coating film. The step of obtaining a cured pattern is preferably performed by heating the pattern to thermally cure it. EXAMPLES

[0165] The present invention will be described in more detail below with reference to Examples, Reference Examples, and Comparative Examples, but the present invention is not limited to these. In addition, for compounds used in the following explanations or tables that use abbreviations, the names corresponding to the abbreviations are summarized in Table 1-2.

[0166] [Table 1-2]

[0167] <Synthesis examples of each resin> The compositions of the resins obtained in Synthesis Examples 1 to 27 as the (A) binder resin are summarized in Tables 1-3 to 1-5. Each resin was synthesized by a known method based on the method described in a known document, by appropriately changing the monomer compound to be the monomer and the copolymerization ratio. The copolymerization ratio of the monomer is as shown in Tables 1-3 to 1-5.

[0168] The hydroxyl-containing diamine (HA) having the following structure used in Synthesis Example 16 was synthesized by a known method based on the synthesis method described in Synthesis Example 1 in paragraphs

[0374] to

[0376] of WO 2016 / 056451. The resin obtained in Synthesis Example 16 using the hydroxyl-containing diamine (HA) having the following structure is a polyimide precursor having an amic acid ester structural unit, an amic acid structural unit, and an imide ring-closed structure.

[0169] [ka]

[0170] In Synthesis Examples 16 and 17, the amic acid structural units in the resin were reacted with the esterifying agent DFA to convert the structure to an amic acid ester structural unit having a methyl group.

[0171] In Synthesis Example 23, GMA having an epoxy group was reacted with the carboxy group derived from MAA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0172] In Synthesis Example 26, the epoxy groups derived from GMA in the resin were reacted with DHBA having a carboxyl group, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0173] In Synthesis Example 27, GMA having an epoxy group was reacted with the phenolic hydroxyl group derived from HPMA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0174] [Table 1-3]

[0175] [Table 1-4]

[0176] [Table 1-5]

[0177] The structural units and structures of the resins obtained in each synthesis example and the resins used in each example, reference example, and comparative example are summarized in Table 2-1. The fluorine element content in the resin structure of polysiloxane (PS-5), polyimide (PI-1), polyimide precursor (PIP-1), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamideimide (PAI-1) exceeded 10,000 mass ppm. The fluorine element content in the resin structure of polysiloxane (PS-1) to (PS-4), (PS-6) to (PS-11), polyimides (PI-2) to (PI-4), polyimide precursor (PIP-2), and other synthesis examples was 0 mass ppm.

[0178] [Table 2-1]

[0179] <Preparation examples of each pigment dispersion> The compositions of the pigment dispersions obtained in Preparation Examples Bk-1 to Bk-3 are summarized in Table 2-2. In Preparation Examples Bk-1 to Bk-3, each pigment dispersion was prepared by the following method. Table 2-2 also lists and describes the (D) colorant and (E) dispersant used in each Example, Reference Example, and Comparative Example.

[0180] Preparation examples Bk-1 to Bk-3, preparation of pigment dispersions (Bk-1) to (Bk-3) Based on the method described in paragraphs

[0138] to

[0140] of International Publication No. 2022 / 196261 and Preparation Example 1, the colorant described in Table 2-2 and ADP, a polyalkyleneamine-polyoxyalkylene ether dispersant, were used as a dispersant, and a wet media dispersion process was performed in a circulation system so that the average primary particle diameter of the pigment was the value described in Table 2-2. Thereafter, filtration was performed with a 0.80 μmφ filter to obtain pigment dispersions (Bk-1) to (Bk-3) with a solid content concentration of 15 mass% and a colorant / dispersant ratio of 100 / 35 (mass ratio). The average primary particle diameter of the pigment in the obtained pigment dispersion is shown in Table 2-2. The average primary particle diameter of the pigment in the cured film, the crystallite size of the pigment in the pigment dispersion, and the crystallite size of the pigment in the cured film are also shown in Table 2-2.

[0181] [Table 2-2]

[0182] <Synthesis example of silica particle dispersion> Synthesis Example 28: Synthesis of silica particle (SP-1) dispersion Based on the method described in paragraphs

[0132] to

[0134] of International Publication No. 2022 / 196261 and Synthesis Example 3, a dispersion of silica particles (SP-1) was obtained using MEK-ST-40 as a silica particle dispersion, KBM-503 as a surface modifier, and MOP as a polymerization inhibitor. The inorganic silica particles (SP-1) have a methacryloyl functional group on the particle surface, a primary particle size distribution range of 10 to 16 nm, an average primary particle size of 12 nm, an aspect ratio range of 1.0 to 1.1, an average aspect ratio of 1.1, and a sodium element content of 100 ppm by mass.

[0183] <Evaluation methods for each of the Examples, Reference Examples, and Comparative Examples> The evaluation methods for each of the Examples, Reference Examples, and Comparative Examples are described below. A glass substrate (manufactured by Geomatec Co., Ltd.; hereafter referred to as "ITO / Ag substrate") was prepared by sputtering a 100 nm film of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) on glass, and then sputtering a 10 nm film of ITO on the top layer of the APC layer. The substrate was subjected to UV-O3 cleaning treatment for 100 seconds using a tabletop optical surface treatment device (PL16-110; manufactured by Sen Special Light Sources Co., Ltd.). Tempax glass substrates (manufactured by AGC Technoglass Co., Ltd.) and other substrates were used without pretreatment.

[0184] The film thickness was measured using a surface roughness / contour shape measuring instrument (SURFCOM1400D; Tokyo Seimitsu Co., Ltd.) at a measurement magnification of 10,000 times, a measurement length of 1.0 mm, and a measurement speed of 0.30 mm / s.

[0185] (1) Weight average molecular weight of resin The above polyimides (PI-1) to (PI-4), polyimide precursors (PIP-1) and (PIP-2), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamideimide (PAI-1) were each prepared as a 0.10 mass% N-methyl-2-pyrrolidone solution. Using a GPC analyzer (Waters 2690; manufactured by Waters Corporation), the weight-average molecular weight in terms of polystyrene was measured and determined using N-methyl-2-pyrrolidone in which lithium chloride and phosphoric acid were each dissolved at 0.050 mol / L as the mobile phase. For the other resins, using a GPC analyzer (HLC-8220; manufactured by Tosoh Corporation), the weight-average molecular weight in terms of polystyrene was measured and determined by a method near room temperature based on "JIS K7252-3 (2008)" using tetrahydrofuran or N-methyl-2-pyrrolidone as the mobile phase.

[0186] (2) Content of chlorine element, bromine element, and fluorine element in resin, composition, or cured film The content of chlorine element, bromine element, and fluorine element in resin, composition, or cured film was measured by combustion ion chromatography under the following measurement conditions. Each of the above resins was used after being separated by GPC fractionation. Even when the resin consists of resins having different structural units constituting the resin, it was used after being separated by GPC fractionation. Also, for the resin in the composition, in any case where the composition contains a single resin or resins having different structural units constituting the resin, the composition was subjected to dichloromethane extraction, and after ultracentrifugation, each resin was separated from the dichloromethane-insoluble matter by GPC fractionation and then used. The resin, composition, or cured film was burned and decomposed in the combustion tube of the analyzer, and the generated gas was absorbed by the absorption liquid. Then, a part of the absorption liquid was analyzed by ion chromatography. Absence of description of the element content indicates that the element was not detected. The content in the total solid content of the composition was calculated from the obtained measurement value and the following formula. (Content of chlorine element and bromine element in total solid content of composition) = (Content of chlorine element and bromine element in composition) × 100 / (Solid content concentration of composition [mass%])

[0187] <Combustion and absorption conditions> System: AQF-2100H, GA-210 (Mitsubishi Chemical) Electric furnace temperature: Inlet 900℃, Outlet 1000℃ Gas: Ar / O 2 200mL / min, O 2 400mL / min Absorbing liquid: H 2 O 2 0.1% by mass Absorbed liquid volume: 5mL

[0188] <Ion chromatography - anion analysis conditions> System: ICS1600 (DIONEX) Mobile phase: 2.7mmol / L Na 2 CO 3 , 0.3mmol / L NaHCO 3 Flow rate: 1.50mL / min Detector: Electrical conductivity detector Injection volume: 100μL.

[0189] (3) Content of anions and cations in the composition or cured film The contents of chloride ions, bromide ions, fluoride ions, specific anions, and quaternary ammonium ions in the composition or cured film were measured by ion chromatography under the following measurement conditions. The composition or cured film was added to ultrapure water and shaken at room temperature to extract ion components. The extract was treated with a solid-phase extraction cartridge, and then the cationic and anionic components were analyzed by ion chromatography. When the anionic components could not be measured using the following ion chromatography analysis condition 1, they were measured using the following ion chromatography analysis condition 2. The absence of a description of the ion content indicates that the ion was not detected. The content in the total solid content of the composition was calculated from the obtained measured value and the following formula. (Content of anion or cation in the total solid content of the composition)=(Content of anion or cation in the composition)×100 / (Solid content concentration of the composition [mass%])

[0190] <Ion Chromatography Analysis Condition 1 (Anion Components)> Equipment: IC-2010 (Tosoh Corporation) Separation column: 4.6mmφ×100mm, TSKgel Super IC-Anion HS Eluent: Sodium bicarbonate Column temperature: 40℃ Detector: Electrical conductivity meter Sample injection volume: 250 μL

[0191] <Ion Chromatography Analysis Conditions 2 (Anion Components)> Equipment: IC-2010 (Tosoh Corporation) Separation column: 4.6mmφ×100mm, TSKgel Super IC-Anion HS Eluent: Sodium carbonate / sodium bicarbonate Column temperature: 40℃ Detector: Electrical conductivity meter Sample injection volume: 250 μL

[0192] <Ion Chromatography Analysis Condition 3 (Cationic Components)> Equipment: INTEGRION (Thermo Fisher Scientific) Separation column: 2mmφ×250mm, IonPac CS19-4μm Eluent: methanesulfonic acid Detector: Electrical conductivity meter Sample injection volume: 100 μL.

[0193] (4) Content of specific compound in composition or cured film The contents of specific phosphorus compounds, tertiary amine compounds, methanol, ethanol, first specific compounds, second specific compounds, specific ketone compounds, and specific heterocyclic compounds in the composition or cured film are measured by gas chromatography mass spectrometry and liquid chromatography mass spectrometry using calibration curves of standard substances.The contents of the total solid content of the composition are calculated from the measured values ​​obtained and the following formula. (Content of specific compound in the total solid content of the composition)=(Content of specific compound in the composition)×100 / (solid content concentration of the composition [mass %]).

[0194] (5) Water content in the composition The water content in the composition was measured by volumetric titration based on JIS K0113 (2005) using a Karl Fischer moisture meter (MKS-520; manufactured by Kyoto Electronics Manufacturing Co., Ltd.) and a Karl Fischer reagent as the titration reagent.

[0195] (6) Sensitivity The resolution pattern of the developed film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation). When a composition having positive photosensitivity was used, the optimum exposure dose (value of an i-line illuminometer) at which a space pattern corresponding to an opening in a 20 μm line-and-space pattern with a dimensional width of 20 μm was determined as an index of sensitivity. On the other hand, when a composition having negative photosensitivity was used, the exposure dose (value of an i-line illuminometer) at which a space pattern corresponding to an opening in a 20 μm line-and-space pattern with a dimensional width of 18 μm was determined as an index of sensitivity. The sensitivity was judged as follows, and a value of 90 mJ / cm was obtained. 2 The following grades were deemed passing: A+, A, B+, B, C+, and C. A+: Sensitivity is 30mJ / cm 2 below A: Sensitivity is 30mJ / cm 2 and exceeds 40 mJ / cm 2 below B+: Sensitivity is 40mJ / cm 2 and 50 mJ / cm 2 below B: Sensitivity is 50mJ / cm 2 and 60 mJ / cm 2 below C+: Sensitivity is 60mJ / cm 2 and 75 mJ / cm 2 below C: Sensitivity is 75mJ / cm 2 and exceeds 90 mJ / cm 2 below D: Sensitivity is 90mJ / cm 2 and 150 mJ / cm 2 below E: Sensitivity is 150mJ / cm 2 Exceeded.

[0196] (7) Development residue The resolution pattern of the developed film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; Nikon Corporation). As an index of development residue, the presence or absence of residue in a 20 μm line and space pattern was observed, and the area of ​​the residue in the opening was calculated. The results were judged as follows, and A+, A, B+, B, C+, and C, which are areas where the residue exists that are 20% or less, were considered to be pass. A+: No residue A: Residue area is 3% or less B+: Residue area exceeds 3% and is 6% or less B: Residue presence area is more than 6% and less than 10% C+: Residue area is more than 10% and less than 15% C: Residue area is more than 15% and less than 20% D: Residue area is more than 20% and less than 50% E: The area of ​​residue is more than 50% and less than 100%.

[0197] (8) Light-blocking property (optical density value (hereinafter, "OD value")) A cured film of the composition was prepared on a Tempax glass substrate (manufactured by AGC Technoglass Co., Ltd.) by the method described in Example 1 below. The incident light intensity (I0 ) and transmitted light intensity (I) were measured. As an index of light-shielding property, the OD value per 1 μm of film thickness was calculated by the following formula, and the average value of the OD values ​​at three points in the plane was calculated. OD value=log 10 (I 0 / I).

[0198] (9) Reliability of light-emitting elements An organic EL display prepared by the method described in Example 1 below was subjected to 10 mA / cm 2 The device was driven with a direct current and observed for non-light emitting areas, uneven brightness, and other light emitting defects. As a durability test, the device was heated to 80°C with the light extraction side facing up, and the wavelength was 365 nm and the illuminance was 0.6 mW / cm. 2 After 500 hours, the organic EL display was exposed to light at 10 mA / cm 2 The light-emitting devices were driven with a direct current at 1000 V and observed for any change in light-emitting characteristics. As an index of the reliability of the light-emitting devices, the light-emitting area after the durability test was measured with the light-emitting area before the durability test taken as 100%. The results were judged as follows, with A+, A, B+, B, C+, and C being 80% or more of the light-emitting area, deemed to be pass. A+: Light-emitting area is 100% A: The light-emitting area is 97% or more and less than 100% B+: The light-emitting area is 94% or more and less than 97% B: The light-emitting area is 90% or more and less than 94% C+: The light-emitting area is 85% or more and less than 90% C: The light-emitting area is 80% or more and less than 85% D: The light-emitting area is 60% or more and less than 80% E: The light-emitting area is less than 60%.

[0199] (10) Luminous brightness The micro LED display prepared by the method described in Example 1 below was made to emit light, and the light extraction efficiency was measured as an index of luminance using an external quantum efficiency measuring device (Hamamatsu Photonics; C9920). The light extraction efficiency of the micro LED display described in Example 1 was set as 1.00, and the relative value to that value was calculated. The evaluation was performed as follows, and A+, A, B+, B, C+, and C, which have a relative value of 1.00 for the light extraction efficiency, were considered to be acceptable. A+: Relative light extraction efficiency of 1.30 or more A: The relative value of the light extraction efficiency is 1.20 or more and less than 1.30. B+: The relative value of the light extraction efficiency is 1.10 or more and less than 1.20 B: The relative value of the light extraction efficiency is 1.00 or more and less than 1.10. C+: The relative value of the light extraction efficiency is 0.95 or more and less than 1.00 C: The relative value of the light extraction efficiency is 0.90 or more and less than 0.95 D: The relative value of the light extraction efficiency is 0.70 or more and less than 0.90 E: The relative value of the light extraction efficiency is less than 0.70.

[0200] (11) Storage stability Each composition prepared as described below was stored at 25°C for one week. After storage, a pre-baked film of each composition was formed on a 6-inch diameter Si wafer by the method described in Example 1 below. As an index of storage stability, the presence or absence and number of foreign matter on the pre-baked film was visually observed. The results were judged as follows, and A+, A, B+, B, C+, and C, which indicate that the number of foreign matter was 20 or less, were considered to be acceptable. A+: No foreign matter A: The number of foreign objects is 3 or less. B+: More than 3 foreign objects and 6 or less B: The number of foreign objects is more than 6 and less than 10 C+: The number of foreign objects is more than 10 and less than 15. C: The number of foreign objects is more than 15 and less than 20 D: The number of foreign objects is more than 20 and less than 50 E: The number of foreign objects exceeds 50.

[0201] <Compounds used in each Example, Reference Example, and Comparative Example> The structures of the compounds used in the Examples, Reference Examples, and Comparative Examples are shown below.

[0202] [ka]

[0203] [ka]

[0204] In addition, the compounds corresponding to the following compounds used in each of the Examples, Reference Examples, and Comparative Examples, namely, compounds containing a chlorine element, a bromine element, a chloride ion, or a bromide ion (hereinafter, "specific halogen compounds"); compounds containing a specific anion; specific phosphorus compounds; tertiary amine compounds; compounds containing a quaternary ammonium ion (hereinafter, "quaternary cation compounds"); specific heterocyclic compounds; a first specific compound; a second specific compound; a specific ketone compound; and compounds containing a fluorine element or a fluoride ion (hereinafter, "specific fluorine compounds"), are summarized in Table 2-3.

[0205] [Table 2-3]

[0206] <Preparation of Photosensitive Composition> Compositions 1 to 120 were prepared according to the compositions shown in Tables 3-1 to 3-10. In Tables 3-1 to 3-10, the values ​​in parentheses indicate the mass parts of the solid content of each component. In the tables, the content of quaternary ammonium ions is shown as the content of quaternary cations. When the composition contains a pigment, a preparation not containing a pigment dispersion was first prepared, and then the pigment dispersion and the preparation were mixed to prepare the composition. A solvent was used in a ratio of PGMEA / EL / GBL=50 / 40 / 10 (mass ratio) so that the solid content concentration of the composition was 30 mass%. The obtained solution of the composition was used after filtering with a 0.45 μmφ filter. In addition, compositions S1 to S7 were prepared according to the compositions shown in Table 2-4 by the same method.

[0207] [Table 2-4]

[0208] <Example 1> Composition 1 was applied onto an ITO / Ag substrate using a spin coater (MS-A100; manufactured by Mikasa Co., Ltd.), and then prebaked at 120°C for 120 seconds using a buzzer hot plate (HPD-3000BZN; manufactured by AS ONE Co., Ltd.) to produce a prebaked film with a thickness of approximately 1.8 μm. The prebaked film thus produced was spray-developed with a 2.38% by mass TMAH aqueous solution or cyclopentanone using a small photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.), and the time (Breaking Point; hereinafter, "BP") until the prebaked film (unexposed area) was completely dissolved was measured.

[0209] A prebaked film was prepared in the same manner, and the prepared prebaked film was patterned and exposed to the i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultra-high pressure mercury lamp through a grayscale mask for sensitivity measurement (MDRM MODEL 4000-5-FS; manufactured by Opto-Line International) using a double-sided alignment single-sided exposure device (Mask Aligner PEM-6M; manufactured by Union Optical Co., Ltd.). After exposure, the film was developed with a 2.38 mass% TMAH aqueous solution using a small photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) and rinsed with water for 30 seconds to prepare a developed film. The development time was 60 seconds, 90 seconds, or 120 seconds.

[0210] In the case where a pattern could not be formed after development in a 2.38% by mass TMAH aqueous solution for any of the development times of 60, 90, and 120 seconds, a film exposed in the same manner as above was prepared, and after exposure, the film was developed in cyclopentanone using a small photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) and rinsed with water for 30 seconds to prepare a developed film. Similarly, the development time was 60, 90, or 120 seconds. The developed patterns were observed for all films with development times of 60, 90, and 120 seconds, and the optimal exposure amount (value of i-line illuminometer) that could form a space pattern equivalent to an opening with a dimensional width of 20 μm in a 20 μm line-and-space pattern was determined from these results. The optimal development time (60, 90, or 120 seconds) and the optimal exposure amount for that development time were determined. After exposure at the optimum exposure dose and development for the optimum development time, the pattern was thermally cured at 200°C for 60 minutes using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) to produce a cured film with a film thickness of approximately 1.2 μm. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heat treatment was performed at 200°C for 60 minutes, and then cooling to 50°C.

[0211] The cured film was analyzed by methods such as nuclear magnetic resonance spectroscopy, infrared spectroscopy, gas chromatography mass spectrometry, liquid chromatography mass spectrometry, and time-of-flight secondary ion mass spectrometry, and the structural units of the resin contained in the cured film and the structures of the compounds contained in the cured film were analyzed. The cured film of composition 1 contains the following resins and compounds, and contains a resin having a structure derived from the resin contained in composition 1 and a compound having a structure derived from the compound contained in composition 1. (XA1) Resin: A resin having a silanol group and a siloxane structure in the structural unit; a phenolic resin having a phenolic hydroxyl group in the structural unit.

[0212] <Fabrication of organic EL displays> Next, the method of fabricating the organic EL display will be described. Figure 3 shows a schematic diagram of the substrate used. First, a 100 nm thick film of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) was sputtered onto a 38 x 46 mm alkali-free glass substrate 47 as a non-transparent conductive metal layer, and then etched to form a patterned APC layer. Furthermore, a 10 nm thick film of amorphous ITO was sputtered onto the upper layer of the APC layer as a transparent conductive oxide film layer, and then etched to form a reflective electrode as a first electrode section 48. An auxiliary electrode section 49 was also formed at the same time to extract the second electrode (Figure 3 (1)).

[0213] The obtained substrate was ultrasonically cleaned with "Semicoclean" (registered trademark) 56 (manufactured by Furuuchi Chemical Co., Ltd.) for 10 minutes and washed with ultrapure water. Next, composition 1 was applied and prebaked on this substrate by the above method, patterning exposure was performed through a photomask having a predetermined pattern, development was performed, and the substrate was then heated and thermally cured. The development time was set to 60 seconds, 90 seconds, or 120 seconds, and the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure amount at that development time were determined in advance. After exposure at the optimal exposure amount and development at the optimal development time, the pattern was thermally cured at 200°C for 60 minutes. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heat treatment was performed at 200°C for 60 minutes, and then cooling to 50°C. Using the above method, a pixel division layer 50 was formed in the effective substrate area (Figure 3 (2)), in which rectangular openings 70 μm wide and 70 μm long were arranged at a pitch of 175 μm in the width direction and at a pitch of 175 μm in the length direction, with each opening exposing the first electrode. These openings will ultimately become the light-emitting pixels of the organic EL display. The effective substrate area was 16 mm square, and the pixel division layer 50 was formed to a thickness of approximately 1.5 μm.

[0214] Next, an organic EL display was fabricated using the substrate on which the first electrode section 48, the auxiliary electrode section 49, and the pixel division layer section 50 were formed. After performing nitrogen plasma treatment as a pretreatment, an organic EL layer section 51 including a light-emitting layer was formed by vacuum deposition (FIG. 3 (3)). The degree of vacuum during deposition was 1×10 -3Pa or less, and the substrate was rotated relative to the deposition source during deposition. First, 10 nm of compound (HT-1) was deposited as a hole injection layer, and 50 nm of compound (HT-2) was deposited as a hole transport layer. Next, compound (GH-1) as a host material and compound (GD-1) as a dopant material were deposited in the light-emitting layer to a thickness of 40 nm so that the doping concentration was 10 volume %. Then, compound (ET-1) and compound (LiQ) were laminated as electron transport materials to a thickness of 40 nm in a volume ratio of 1:1. The compounds used in the organic EL layer (compound (HT-1), compound (HT-2), compound (GH-1), compound (GD-1), compound (ET-1), and compound (LiQ)) were the same compounds as those described in paragraphs

[0599] to

[0600] of International Publication No. 2017 / 057281.

[0215] Next, after depositing a compound (LiQ) to a thickness of 2 nm, MgAg (magnesium / silver = 10 / 1 (volume ratio)) was deposited to a thickness of 10 nm to form the second electrode part 52, forming a transparent electrode (Figure 3 (4)). After that, in a low-humidity nitrogen atmosphere, a cap-shaped glass plate was attached using an epoxy resin adhesive to seal the device, and four top-emission type organic EL displays, each 5 mm square, were fabricated on one substrate. Note that the film thickness referred to here is the value displayed on a quartz crystal oscillator film thickness monitor.

[0216] <Fabrication of Micro LED Display> A non-alkali glass substrate was used as a support substrate, a temporary adhesive material containing polyimide was placed on the support substrate, and an LED, a light-emitting element, was placed on the support substrate. The LED had a thickness of 2 μm, a side length of 10 μm, and a second side length of 20 μm. Next, the composition S1 was applied and pre-baked on the support substrate and the LED by the above method, and patterned through a photomask having a predetermined pattern, exposed, developed, and rinsed to form a matrix pattern having a plurality of openings that expose the LED and its surroundings. The openings were rectangular in shape, with one side length of 15 μm and the other side length of 25 μm. In the matrix pattern, the pattern dimension between the openings with one side length of 15 μm and the openings with the other side length of 25 μm was also 5 μm. After that, a partition layer with a film thickness of about 4 μm was formed by heating and thermal curing. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heat treatment was carried out at 200°C for 60 minutes, and then cooling to 50°C.

[0217] Next, composition 1 was applied and pre-baked on the support substrate and the LED by the above method, and patterning exposure, development and rinsing were performed through a photomask having a predetermined pattern to form a plurality of opening patterns penetrating in the thickness direction up to the LED. The opening pattern had a circular shape, and the diameter of the bottom of the smallest pattern was 2 μm. Then, the film was heated and thermally cured to form a planarizing layer with a film thickness of about 4 μm. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, and heat treatment was performed at 200°C for 60 minutes, followed by cooling to 50°C.

[0218] Next, a titanium barrier metal was formed on the planarization layer and the partition layer by sputtering, and a copper seed layer was further formed on the barrier metal by sputtering. Next, a photoresist layer was formed, and copper metal wiring electrically connected to the LED was formed on the opening pattern of the planarization layer and on a part of the surface of the planarization layer by plating. After that, the photoresist layer, the seed layer, and the barrier metal were removed from the places where the metal wiring was not to be formed. The thickness of the metal wiring formed on the part of the surface of the planarization layer was 5 μm.

[0219] Next, a positive photosensitive composition containing polyimide and a polybenzoxazole precursor was applied and prebaked on the planarization layer and the partition layer by the above method, patterned and exposed through a photomask having a predetermined pattern, developed and rinsed, and then heated and thermally cured to form an interlayer insulating layer with a thickness of about 10 μm. The thermal curing conditions were a nitrogen atmosphere with an oxygen concentration of 100 mass ppm or less, heat treatment at 110 ° C for 30 minutes, and then heat treatment at 230 ° C for 60 minutes. Next, a titanium barrier metal was formed on the interlayer insulating layer by sputtering, and a copper seed layer was further formed on the barrier metal by sputtering. Next, a photoresist layer was formed, and a copper metal wiring electrically connected to the LED was formed on the opening pattern part of the interlayer insulating layer and on a part of the surface of the interlayer insulating layer by plating. Then, the photoresist layer, the seed layer, and the barrier metal in the part where the metal wiring was not formed were removed. The thickness of the metal wiring formed on the part of the surface of the interlayer insulating layer was 5 μm. Thereafter, the above-mentioned formation of the interlayer insulating layer and the formation of the metal wiring were repeated twice to form three interlayer insulating layers, the total thickness of which was 30 μm.

[0220] Next, a barrier metal was formed by sputtering on the metal wiring of the opening pattern of the interlayer insulating layer, and solder bumps were formed. After that, the solder was reflowed by heating at 260°C for 1 minute, and the light-emitting element drive substrate having the driver IC, which is the drive element, was electrically connected via the solder bump. Next, the support substrate was peeled off, and the opposing substrate was attached with an adhesive layer, etc., to produce a micro LED display equipped with multiple LEDs, which are light-emitting elements.

[0221] <Examples 2 to 122 and Comparative Examples 1 to 6> Using each composition shown in Tables 3-1 to 3-10, the same operation and evaluation as in Example 1 were performed. In Examples 1 to 116 and Comparative Examples 1 to 6, each composition was used as the pixel division layer forming composition or the flattening layer forming composition, and composition S1 was used as the partition layer forming composition. On the other hand, in Examples 117 to 122, composition 1 was used as the pixel division layer forming composition or the flattening layer forming composition, and compositions S2 to S7 were used as the partition layer forming composition. These evaluation results are shown in Tables 3-1 to 3-10. In Examples 84, 90 to 94, 102, and 103, the content of fluorine element in the total solid content of the pixel division layer forming composition exceeded 1,000 ppm by mass. The content of elemental fluorine in the total solid content of the composition for forming a pixel division layer in Examples 1 to 83, 85 to 89, 95 to 101, 104 to 106, 114 to 116, and Comparative Examples 1 to 6 was 0 ppm by mass. The content of elemental fluorine in the total solid content of the composition for forming a partition layer in Compositions S1 to S7 was 0 ppm by mass. The content of elemental fluorine in the total solid content of the composition for forming a pixel division layer in Examples 107 to 113 was as shown in Table 3-7.

[0222] Tables 3-6 show the hydrogen ion exponents of the compositions prepared in Example 1 and Example 81 to Example 89. In each example, when a composition having positive photosensitivity was used, the development time was 60 seconds, 90 seconds, or 120 seconds. From these results, the optimum development time (60 seconds, 90 seconds, or 120 seconds) and the optimum exposure dose at that development time were determined. After exposure at the optimum exposure dose and development at the optimum development time, the pattern was thermally cured at 200°C for 60 minutes. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, and heat treatment was performed at 200°C for 60 minutes, followed by cooling to 50°C. On the other hand, when a composition having negative photosensitivity was used, a photomask in which the light-transmitting portion and the light-shielding portion were inverted was used, and the development time was 1.3 times the measured BP. After exposure at the optimum exposure dose, the developed pattern was thermally cured for 60 minutes at 220° C. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 220° C. at a heating rate of 3.5° C. / min, heat treatment was performed at 220° C. for 60 minutes, and then cooling to 50° C.

[0223] [Table 3-1]

[0224] [Table 3-2]

[0225] [Table 3-3]

[0226] [Table 3-4]

[0227] [Table 3-5]

[0228] [Table 3-6]

[0229] [Table 3-7]

[0230] [Table 3-8]

[0231] [Table 3-9]

[0232] [Table 3-10]

[0233] Comparative Example 1 and Comparative Example 2 do not contain methanol or ethanol. Comparative Example 3 does not satisfy the specific requirements of the present invention in terms of the content of methanol. Comparative Example 4 contains only alcohol compounds other than methanol and ethanol. Therefore, Comparative Examples 1 to 4 are inferior in various properties. Comparative Example 5 does not contain methanol or ethanol, and the content of chlorine element and the content of chloride ions exceed 1,000 ppm by mass. Comparative Example 6 does not contain methanol or ethanol, and the content of a specific anion exceeds 30,000 ppm by mass (=3.0% by mass), and the content of a quaternary cation exceeds 50,000 ppm by mass (=5.0% by mass). Therefore, Comparative Examples 5 and 6 are inferior in various properties. [Explanation of symbols]

[0234] 1a,1b Display device 2 Light emitting element 3 Interlayer insulation layer 4,4c metal wiring 5 Opposing substrate 6 electrode terminal 7 Light emitting element driving board 8 Driving element 9. Barrier Metal 10 Solder Bumps 15 Partition layer 21 Planarization layer 47 Alkaline-free glass substrate 48 1st electrode section 49 Auxiliary electrode section 50 Pixel division layer 51 Organic EL layer including light-emitting layer 52 2nd electrode part

Claims

1. A photosensitive composition comprising (A) a binder resin and (C) a photosensitizer, the (C) photosensitizer contains (C1) a naphthoquinone diazide compound, The binder resin (A) contains polysiloxane, Further, the solvent contains methanol and / or ethanol, and also contains one or more selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether; The photosensitive composition satisfies the following conditions (7) and (8): (7) The total content of methanol and ethanol in the photosensitive composition is 1,000 to 30,000 ppm by mass. (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isoallyl methyl ether, and isoallyl ethyl ether in the photosensitive composition is 1,000 to 30,000 ppm by mass.

2. Further, the composition contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether; The photosensitive composition according to claim 1 , which satisfies the following condition (9): (9) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, 2-methoxy-1-propyl acetate, 2-ethoxy-1-propyl acetate, methallyl methyl ether, and methallyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 ppm by mass.

3. The photosensitive composition according to claim 1 , further comprising water and satisfying the following condition (3): (3) The content of water in the photosensitive composition is 0.010 to 3.0% by mass.

4. The electrolyte solution contains one or more ions selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions, and satisfies the following condition (4): and / or 2. The photosensitive composition according to claim 1, which contains one or more compounds selected from the group consisting of phosphoric acid esters, phosphonic acid, phosphonic acid esters, phosphorous acid esters, phosphinic acid, and hypophosphite esters, and satisfies the following condition (5): (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass. (5) The total content of phosphoric acid ester, phosphonic acid, phosphonic acid ester, phosphorous acid ester, phosphinic acid, and hypophosphite ester in the total solid content of the photosensitive composition is 0.0010 to 30,000 ppm by mass.

5. The photosensitive composition according to claim 1, further comprising a tertiary amine compound and / or a quaternary ammonium ion, and satisfying the following condition (6): (6) The total content of a tertiary amine compound and a quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 ppm by mass.

6. The photosensitive composition according to claim 1 , wherein the binder resin (A) satisfies the following condition (P1a): (P1a) The content of fluorine element in the structure of the (A) binder resin is 10,000 mass ppm or less.

7. The photosensitive composition according to claim 1 , which satisfies the following condition (1a): (1a) The content of elemental fluorine in the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

8. 2. The photosensitive composition according to claim 1, wherein the photosensitive composition is diluted with water to prepare a diluted solution, and when the solids concentration of the diluted solution is 1 / 100 times that of the solids concentration of the photosensitive composition, the hydrogen ion exponent of the diluted solution is 5.5 to 7.

0.

9. 2. The photosensitive composition according to claim 1, wherein the polysiloxane has a trifunctional organosilane unit represented by general formula (9) and a tetrafunctional organosilane unit represented by general formula (10). 【Chemistry 1】 (In the general formula (9) and the general formula (10), R ６１ represents a hydrogen atom or a monovalent organic group. １ ~* ３ each independently represents a bonding point in the resin.)

10. The photosensitive composition according to claim 1 , wherein the photosensitizer (C) further contains a photoacid generator (C3) and / or a photobase generator (C4).

11. A method for producing a cured product, comprising the steps of: (1) forming a coating film of the photosensitive composition according to any one of claims 1 to 10 on a substrate; (2) irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) heating the pattern to obtain a cured pattern of the photosensitive composition.

Images